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NCP1248AD065R2G

NCP1248AD065R2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC8_150MIL_7引线

  • 描述:

    Converter Offline Flyback Topology 65kHz 7-SOIC

  • 数据手册
  • 价格&库存
NCP1248AD065R2G 数据手册
NCP1248 Fixed Frequency Current Mode Controller for Flyback Converters The NCP1248 is a new fixed-frequency current-mode controller featuring the Dynamic Self-Supply. This function greatly simplifies the design of the auxiliary supply and the VCC capacitor by activating the internal startup current source to supply the controller during start-up, transients, latch, stand-by etc. This device contains a special HV detector which detect the application unplug from the AC input line and triggers the X2 discharge current. This HV structure allows the brown-out detection as well. It features a timer-based fault detection that ensures the detection of overload and an adjustable compensation to help keep the maximum power independent of the input voltage. Due to frequency foldback, the controller exhibits excellent efficiency in light load condition while still achieving very low standby power consumption. Internal frequency jittering, ramp compensation, and a versatile latch input make this controller an excellent candidate for the robust power supply designs. A dedicated Off mode allows to reach the extremely low no load input power consumption via “sleeping” whole device and thus minimize the power consumption of the control circuitry. Features • Fixed-Frequency Current-Mode Operation using 65 kHz/100 kHz • • • • • • • • • • • • • http://onsemi.com SOIC−7 CASE 751U MARKING DIAGRAM 8 48Axxx ALYWX G 1 48Axxx = xxx = = A = L = Y = W = G = Specific Device Code 065 for 65 kHz 100 for 100 kHz Assembly Location Wafer Lot Year Work Week Pb-Free Package Switching Frequency PIN CONNECTIONS Frequency Foldback then Skip Mode for Maximized Performance in Light Load and Standby Conditions 1 8 Latch HV Timer-Based Overload Protection with Latched (Option A) 2 FB Operation 3 6 High-voltage Current Source with Brown-Out Detection and VCC CS 4 5 Dynamic Self-Supply, Simplifying the Design of the VCC GND DRV Circuitry (Top View) Frequency Modulation for Softened EMI Signature Adjustable Overpower Protection Dependant on the Bulk Voltage ORDERING INFORMATION Latch-off Input Combined with the Overpower Protection See detailed ordering and shipping information on page 35 of Sensing Input this data sheet. VCC Operation up to 28 V, With Overvoltage Detection Typical Applications 500/800 mA Source/Sink Drive Peak Current Capability • AC-DC Adapters for Notebooks, LCD, and Printers 10 ms Soft-Start • Offline Battery Chargers Internal Thermal Shutdown • Consumer Electronic Power Supplies No-Load Standby Power < 30 mW • Auxiliary/Housekeeping Power Supplies X2 Capacitor in EMI Filter Discharging Feature • Offline Adapters for Notebooks These Devices are Pb-Free and Halogen Free/BFR Free © Semiconductor Components Industries, LLC, 2014 December, 2014 − Rev. 0 1 Publication Order Number: NCP1248/D NCP1248 TYPICAL APPLICATION EXAMPLE C4 NTC GND GND 3 CS 4 GND HV 8 VCC 6 5 C1 4 GND 6 Q1 GND GND DRV 5 GND NCP1248 GND ROPP GND OK1 4 3 C2 2 PC817 GND 1 GND C3 IC2 R1 1 LATCH 2 FB R2 4 D5 3 D4 4 COUT R4 IC1 D10 3 D3 W2 CX1 W3 CX2 RLOAD D8 ac input dc output D1 3 2 + GND R3 RHV W1 D9 L1 2 RSENSE 1 RCLAMP L2 2 TR 1 D2 1 D7 D6 + CBULK CCLAMP NCP431 GND GND Figure 1. Flyback Converter Application Using the NCP1248 PIN FUNCTION DESCRIPTION Pin No Pin Name Function Pin Description 1 LATCH Latch−Off Input Pull the pin up or down to latch−off the controller. An internal current source allows the direct connection of an NTC for over temperature detection. 2 FB Feedback + Shutdown pin An optocoupler collector to ground controls the output regulation. The part goes to the low consumption Off mode if the FB input pin is pulled to GND. 3 CS Current Sense 4 GND − 5 DRV Drive output 6 VCC VCC input 8 HV High−voltage pin This Input senses the Primary Current for current−mode operation, and offers an overpower compensation adjustment. The controller ground Drives external MOSFET This supply pin accepts up to 28 Vdc, with overvoltage detection. The pin is connected to an external auxiliary voltage. It is not allowed to connect another circuit to this pin to keep low input power consumption. Connects to the rectified AC line to perform the functions of Start−up Current Source, Self−Supply, brown−out detection and X2 capacitor discharge function and the HV sensing for the overpower protection purposes. It is not allowed to connect this pin to DC voltage. http://onsemi.com 2 NCP1248 SIMPLIFIED INTERNAL BLOCK SCHEMATIC Intc Intc Vdd Vhv DC sample HV Brown_Out OVP_CMP 2.5V SG & X2 & Vcc ON_CMP Brown_Out Reset Qb Vcc regulator Vdd reg 10.8V 9.5V VccOFF SS_end Latch VCC ICstartB UVLO_CMP Q current source Vcc_Int UVLO Set control PowerOnReset_CMP RESET Vdd VccON 5V VccON RESET 12V Vcc(reg) 26V 0.8V Votp 1.2V 1k 300 us OTP Filter TSD VccRESET OTP_CMP 8 mA VccOVP_CMP VccOVP 10 us Filter VccOVP Vovp LATCH Vclamp Rclamp AC_Off OVP 55 us Filter STOP_CMP VccMIN 10.5V Off_mode_CMP1 2.2V Set Von VccMIN 5uA VCC Q ICstart Reset Qb Off_mode_CMP2 FM input jittering 0.4V Voff GoToOffMode timer 550ms Square output OSC 65kHz Internal resitance 20k ton_max output 3.0V PFM input CSref Saw output Ramp_OTA 4uMho FBbuffer Skip_CMP 1.4V FB freq folback Vramp_offset Rfb1 Vfb(reg) VCC Clamp 0.5V MAX_ton DRV PWM_CMP Set IC stopB PWM Iopc = 0.5u*(Vhv−125) Soft Start timer 1uA Vdd Ilimit_CMP Enable SS_end MAX_ton Ilimit 0.7V Vilim CS Set Reset Fault timer Q Qb Fault Autorecovery timer CSstop_CMP Brown_Out 1.05V VCSstop LEB 120ns GND TSD Figure 2. Simplified Internal Block Schematic http://onsemi.com 3 Qb LatchB Brown_OutB V to I FaultB Reset Q TSD Latch management Division ratio 5 Rfb3 Rfb2 2.35V Vfb(opc) Vhv DC sample Vskip SkipB RESET IC stop Latch NCP1248 MAXIMUM RATINGS Rating Symbol Value Unit –0.3 to 20 ±1000 (peak) V mA VCC Power Supply voltage, VCC pin, continuous voltage Power Supply voltage, VCC pin, continuous voltage (Note 1) –0.3 to 28 ±30 (peak) V mA Maximum voltage on HV pin (Dc−Current self−limited if operated within the allowed range) –0.3 to 500 ±20 V mA Vmax Maximum voltage on low power pins (except pin 5, pin 6 and pin 8) (Dc−Current self−limited if operated within the allowed range) (Note 1) –0.3 to 10 ±10 (peak) V mA RqJ−A Thermal Resistance SOIC−7 Junction-to-Air, low conductivity PCB (Note 2) Junction-to-Air, medium conductivity PCB (Note 3) Junction-to-Air, high conductivity PCB (Note 4) 162 147 115 RqJ−C Thermal Resistance Junction−to−Case 73 °C/W TJMAX Operating Junction Temperature −40 to +150 °C Storage Temperature Range DRV (pin 5) Maximum voltage on DRV pin (Dc−Current self−limited if operated within the allowed range) (Note 1) VCC (pin 6) HV (pin 8) TSTRGMAX °C/W −60 to +150 °C ESD Capability, HBM model (All pins except HV) per JEDEC Standard JESD22, Method A114E > 2000 V ESD Capability, Machine Model per JEDEC Standard JESD22, Method A115A > 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device contains latch-up protection and exceeds 100 mA per JEDEC Standard JESD78. 2. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51-1 conductivity test PCB. Test conditions were under natural convection or zero air flow. 3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51-2 conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51-3 conductivity test PCB. Test conditions were under natural convection or zero air flow. http://onsemi.com 4 NCP1248 ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit VHV(min) − 30 40 V VCC = 0 V VCC = VCC(on) − 0.5 V Istart1 Istart2 0.2 5 0.5 8 0.8 11 mA Off−state leakage current VHV = 500 V, VCC = 15 V Istart(off) 10 25 50 mA Off−mode HV supply current VHV = 141 V, VHV = 325 V, VCC loaded by 4.7 mF cap IHV(off) − − 45 50 60 70 mA HV current source regulation threshold VCC(reg) 8 11 − V Turn−on threshold level, VCC going up HV current source stop threshold VCC(on) 11.0 12.0 13.0 V HV current source restart threshold VCC(min) 9.5 10.5 11.5 V Turn−off threshold VCC(off) 8.5 8.9 9.3 V HIGH VOLTAGE CURRENT SOURCE Minimum voltage for current source operation Current flowing out of VCC pin SUPPLY Overvoltage threshold VCC(ovp) 25 26.5 28 V Blanking duration on VCC(off) and VCC(ovp) detection tVCC(blank) − 10 − ms VCC decreasing level at which the internal logic resets VCC(reset) 4.8 7.0 7.7 V VCC level for ISTART1 to ISTART2 transition VCC(inhibit) 0.2 0.8 1.25 V DRV open, VFB = 3 V, 65 kHz DRV open, VFB = 3 V, 100 kHz ICC1 ICC1 1.3 1.3 1.85 1.85 2.2 2.2 Cdrv = 1 nF, VFB = 3 V, 65 kHz Cdrv = 1 nF, VFB = 3 V, 100 kHz ICC2 ICC2 1.8 2.3 2.6 2.9 3.0 3.5 Off mode (skip or before start−up) ICC3 0.67 0.9 1.13 Fault mode (fault or latch) ICC4 0.3 0.6 0.9 VHV going up VHV going down VHV(start) VHV(stop) 92 84 101 93 110 102 V tHV 43 − 86 ms VHV(hyst) 1.5 3.5 5 V Tsample − 1.0 − ms Timer duration for no line detection tDET 21 32 43 ms Discharge timer duration tDIS 21 32 43 ms 65 kHz 100 kHz fOSC 58 87 65 100 72 109 kHz fOSC = 65 kHz fOSC = 100 kHz tONmax(65kHz) tONmax(100kHz) 11.5 7.5 12.3 8.0 13.1 8.5 ms Internal current consumption (Note 5) mA BROWN−OUT Brown−Out thresholds Timer duration for line cycle drop−out X2 DISCHARGE Comparator hysteresis observed at HV pin HV signal sampling period OSCILLATOR Oscillator frequency Maximum on time (TJ = 25°C to +125°C) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). 6. Guaranteed by design. 7. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. http://onsemi.com 5 NCP1248 ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit fOSC = 65 kHz fOSC = 100 kHz tONmax(65kHz) tONmax(100kHz) 11.3 7.4 12.3 8.0 13.1 8.5 ms fOSC = 65 kHz fOSC = 100 kHz DMAX − 80 − % Frequency jittering amplitude, in percentage of FOSC Ajitter ±4 ±6 ±8 % Frequency jittering modulation frequency Fjitter 85 125 165 Hz Feedback voltage threshold below which frequency foldback starts VFB(foldS) 1.8 2.0 2.2 V Feedback voltage threshold below which frequency foldback is complete VFB(foldE) 0.8 0.9 1.0 V VFB = Vskip(in) + 0.1 fOSC(min) 21 27 32 kHz Rise time, 10 to 90% of VCC VCC = VCC(min) + 0.2 V, CDRV = 1 nF trise − 40 70 ns Fall time, 90 to 10% of VCC VCC = VCC(min) + 0.2 V, CDRV = 1 nF tfall − 40 70 ns Current capability VCC = VCC(min) + 0.2 V, CDRV = 1 nF DRV high, VDRV = 0 V DRV low, VDRV = VCC OSCILLATOR Maximum on time Maximum duty cycle (corresponding to maximum on time at maximum switching frequency) FREQUENCY FOLDBACK Minimum switching frequency OUTPUT DRIVER mA IDRV(source) IDRV(sink) − − 500 800 − − VCC = VCCmax – 0.2 V, DRV high, RDRV = 33 kW, Cload = 220 pF VDRV(clamp) 11 13.5 16 V VCC = VCC(min) + 0.2 V, RDRV = 33 kW, DRV high VDRV(drop) − − 1 V Input Pull−up Current VCS = 0.7 V Ibias − 1 − mA Maximum internal current setpoint VFB > 3.5 V VILIM 0.66 0.70 0.74 V Propagation delay from VIlimit detection to DRV off VCS = VILIM tdelay − 80 110 ns tLEB 200 250 320 ns VCS(stop) 0.95 1.05 1.15 V tBCS 90 120 150 ns tSSTART 2.8 4.0 5.2 ms Scomp(65kHz) Scomp(100kHz) − − −32.5 −50 − − mV / ms RFB(up) 17 22 27 kW Clamping voltage (maximum gate voltage) High−state voltage drop CURRENT SENSE Leading Edge Blanking Duration for VILIM Threshold for immediate fault protection activation Leading Edge Blanking Duration for VCS(stop) (Note 6) Soft−start duration From 1st pulse to VCS = VILIM INTERNAL SLOPE COMPENSATION Slope of the compensation ramp FEEDBACK Internal pull−up resistor TJ = 25°C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). 6. Guaranteed by design. 7. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. http://onsemi.com 6 NCP1248 ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, VHV = 125 V, VCC = 11 V unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit KFB 4.7 5 5.3 − VFB(ref) 4.5 5 5.5 V VFB going down VFB going up Vskip(in) Vskip(out) 0.45 0.54 0.50 0.60 0.55 0.66 V The voltage above which the part enters the on mode VCC > VCC(off), VHV = 60 V VON − 2.2 − V The voltage below which the part enters the off mode VCC > VCC(off) VOFF 0.35 0.40 0.45 V VCC > VCC(off), VHV = 60 V VHYST 500 − − mV Pull−up current in off mode VCC > VCC(off) IOFF − 5 − mA Go To Off mode timer VCC > VCC(off) tGTOM 400 550 700 ms tfault 108 128 178 ms KOPC − 0.54 − mA / V FEEDBACK VFB to internal current setpoint division ratio Internal pull−up voltage on the FB pin SKIP CYCLE MODE Feedback voltage thresholds for skip mode REMOTE CONTROL ON FB PIN Minimum hysteresis between the VON and VOFF OVERLOAD PROTECTION Fault timer duration OVERPOWER PROTECTION VHV to IOPC conversion ratio Current flowing out of CS pin (Note 7) VHV = 125 V VHV = 162 V VHV = 325 V VHV = 365 V IOPC(125) IOPC(162) IOPC(325) IOPC(365) − − − 105 0 20 110 130 − − − 150 mA FB voltage above which IOPC is applied VHV = 365 V VFB(OPCF) 2.12 2.35 2.58 V FB voltage below which is no IOPC applied VHV = 365 V VFB(OPCE) − 2.15 − V High threshold VLatch going up VOVP 2.35 2.5 2.65 V Low threshold VLatch going down VOTP 0.76 0.8 0.84 V INTC INTC(SSTART) 65 130 95 190 105 210 Blanking duration on high latch detection tLatch(OVP) 20 35 50 ms Blanking duration on low latch detection tLatch(OTP) − 350 − ms ILatch = 0 mA ILatch = 1 mA Vclamp0(Latch) Vclamp1(Latch) 1.0 1.8 1.2 2.4 1.4 3.0 V TJ going up TTSD − 150 − °C TJ going down TTSD(HYS) − 30 − °C LATCH−OFF INPUT Current source for direct NTC connection During normal operation During soft−start Clamping voltage mA VLatch = 0 V TEMPERATURE SHUTDOWN Temperature shutdown Temperature shutdown hysteresis Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Internal supply current only, currents sourced via FB pin is not included (current is flowing in GND pin only). 6. Guaranteed by design. 7. CS pin source current is a sum of Ibias and IOPC, thus at VHV = 125 V is observed the Ibias only, because IOPC is switched off. http://onsemi.com 7 NCP1248 TYPICAL CHARACTERISTIC 32 40 38 30 36 Istart(off) (mA) VHV(min) (V) 34 32 30 28 26 24 28 26 24 22 22 20 −50 −25 0 25 50 75 100 20 −50 125 0 25 50 75 100 125 TEMPERATURE (°C) Figure 3. Minimum Current Source Operation VHV(min) Figure 4. Off−State Leakage Current Istart(off) 50 8.8 45 8.7 IHV(off) @ VHV = 325 V 8.6 35 Istart2 (mA) 40 IHV(off) (mA) −25 TEMPERATURE (°C) IHV(off) @ VHV = 141 V 8.5 8.4 30 8.3 25 8.2 −25 0 25 50 75 100 8.1 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 5. Off−Mode HV Supply Current IHV(off) Figure 6. High Voltage Startup Current Flowing Out of VCC Pin Istart2 110 110 108 108 106 106 104 104 VHV(stop) (V) VHV(start) (V) 20 −50 102 100 98 102 100 98 96 96 94 94 92 92 90 −50 −25 0 25 50 75 100 125 125 90 −50 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 7. Brown−out Device Start Threshold VHV(start) Figure 8. Brown−out Device Stop Threshold VHV(stop) http://onsemi.com 8 NCP1248 0.75 310 0.74 308 0.73 306 0.72 304 VI(freeze) (mV) VILIM (V) TYPICAL CHARACTERISTIC 0.71 0.70 0.69 302 300 298 0.68 296 0.67 294 0.66 292 0.65 −50 −25 0 25 50 75 100 290 −50 125 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 9. Maximum Internal Current Setpoint VILIM Figure 10. Frozen Current Setpoint VI(freeze) for the Light Load Operation 110 1.15 1.13 100 1.11 90 1.07 tdelay (ns) VCS(stop) (V) 1.09 1.05 1.03 1.01 80 70 60 0.99 50 0.97 0.95 −50 −25 0 25 50 75 100 40 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 11. Threshold for Immediate Fault Protection Activation VCS(stop) Figure 12. Propagation Delay tdelay 125 130 300 290 125 280 IOPC(365) (mA) tLEB (ns) 270 260 250 240 230 220 120 115 110 105 210 200 −50 −25 0 25 50 75 100 100 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 13. Leading Edge Blanking Duaration tLEB Figure 14. Maximum Overpower Compensating Current IOPC(365) Flowing Out of CS Pin http://onsemi.com 9 125 NCP1248 24 5.20 23 5.15 22 5.10 5.05 21 VFB(ref) (V) RFB(up) (kW) TYPICAL CHARACTERISTIC 20 19 18 5.00 4.95 4.90 4.85 17 4.80 16 4.75 15 −50 −25 0 25 50 75 100 4.70 −50 125 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 15. FB Pin Internal Pull−up Resistor RFB(up) Figure 16. FB Pin Open Voltage VFB(ref) 125 0.85 2.65 0.84 2.60 0.83 0.82 VOTP (V) VOVP (V) 2.55 2.50 2.45 0.81 0.80 0.79 0.78 0.77 2.40 0.76 −25 0 25 50 75 100 0.75 −50 125 0 25 50 75 100 TEMPERATURE (°C) Figure 17. Latch Pin High Threshold VOVP Figure 18. Latch Pin Low Threshold VOTP 110 220 105 210 100 200 95 90 85 180 170 160 75 150 −25 0 25 50 75 100 125 125 190 80 70 −50 −25 TEMPERATURE (°C) INTC(SSTART) (mA) INTC (mA) 2.35 −50 140 −50 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 19. Current INTC Sourced from the Latch Pin, Allowing Direct NTC Connection Figure 20. Current INTC(SSTART) Sourced from the Latch Pin, During Soft−Start http://onsemi.com 10 NCP1248 100 85 99 84 98 83 97 82 96 81 DMAX (%) fOSC (kHz) TYPICAL CHARACTERISTIC 95 94 80 79 93 78 92 77 91 76 90 −50 −25 0 25 50 75 100 75 −50 125 −25 TEMPERATURE (°C) Figure 21. Oscillator fOSC for the 100 kHz Version 0 25 50 75 TEMPERATURE (°C) 100 125 Figure 22. Maximum Duty Ratio DMAX 30 8.4 29 8.3 fOSC(min) (ms) 28 tONmax (ms) 8.2 8.1 8.0 27 26 25 24 7.9 7.8 −50 23 −25 0 25 50 75 100 22 −50 125 TEMPERATURE (°C) Figure 23. Maximum ON Time tONmax for the 100 kHz Version −25 0 25 50 75 TEMPERATURE (°C) 100 Figure 24. Minimum Switching Frequency fOSC(min) http://onsemi.com 11 125 NCP1248 TYPICAL CHARACTERISTIC 2.20 1.00 2.15 0.98 0.96 0.94 VFB(foldE) (V) VFB(foldS) (V) 2.10 2.05 2.00 1.95 0.90 0.88 0.86 1.90 0.84 1.85 1.80 −50 0.92 0.82 −25 0 25 50 75 100 125 0.80 −50 −25 0 25 TEMPERATURE (°C) Figure 25. FB Pin Voltage Below Which Frequency Foldback Starts VFB(foldS) 0.88 0.75 0.86 Vskip(on) (V) Vskip(in) (V) 0.71 0.69 0.67 125 0.82 0.80 0.78 0.76 0.65 0.74 −25 0 25 50 75 100 125 0.72 −50 −25 TEMPERATURE (°C) 2.35 2.50 2.30 2.45 2.25 VFB(OPCE) (V) 2.40 2.55 2.40 2.35 2.30 100 125 2.10 2.20 2.00 2.15 1.95 50 75 2.15 2.05 25 50 2.20 2.25 0 25 Figure 28. FB Pin Skip−Out Level Vskip(out) 2.60 −25 0 TEMPERATURE (°C) Figure 27. FB Pin Skip−In Level Vskip(in) VFB(OPCF) (V) 100 0.84 0.73 2.10 −50 75 Figure 26. FB Pin Voltage Below Which Frequency Foldback Complete VFB(foldE) 0.77 0.63 −50 50 TEMPERATURE (°C) 75 100 125 1.90 −50 TEMPERATURE (°C) −25 0 25 50 75 100 TEMPERATURE (°C) Figure 29. FB Pin Level VFB(OPCF) Above Which is the Overpower Compensation Applied Figure 30. FB Pin Level VFB(OPCE) Below Which is No Overpower Compensation Applied http://onsemi.com 12 125 NCP1248 13.0 11.5 12.8 11.3 12.6 11.1 12.4 10.9 VCC(min) (V) VCC(on) (V) TYPICAL CHARACTERISTIC 12.2 12.0 11.8 10.7 10.5 10.3 11.6 10.1 11.4 9.9 11.2 9.7 11.0 −50 −25 0 25 50 75 100 9.5 −50 125 −25 TEMPERATURE (°C) 0 25 50 75 100 125 TEMPERATURE (°C) Figure 31. VCC Turn−on Threshold Level, VCC Going Up HV Current Source Stop Threshold VCC(on) Figure 32. HV Current Source Restart Threshold VCC(min) 9.4 7.3 7.2 9.2 7.1 VCC(reset) (V) VCC(off) (V) 9.0 8.8 8.6 7.0 6.9 6.8 6.7 8.4 6.6 8.2 6.5 8.0 −50 −25 0 25 50 75 100 6.4 −50 125 −25 TEMPERATURE (°C) 0 25 50 75 100 125 TEMPERATURE (°C) Figure 33. VCC Turn−off Threshold (UVLO) VCC(off) Figure 34. VCC Decreasing Level at Which the Internal Logic Resets VCC(reset) 2.0 3.2 3.0 1.9 ICC2 (mA) ICC1 (mA) 2.8 1.9 1.8 2.6 2.4 1.8 2.2 1.7 −50 −25 0 25 50 TEMPERATURE (°C) 75 100 125 Figure 35. Internal Current Consumption when DRV Pin is Unloaded 2.0 −50 −25 0 25 50 75 TEMPERATURE (°C) 100 125 Figure 36. Internal Current Consumption when DRV Pin is Loaded by 1 nF http://onsemi.com 13 NCP1248 TYPICAL CHARACTERISTIC 4.0 1.10 3.9 1.08 1.06 3.8 Tsample (ms) VHV(hyst) (V) 1.04 3.7 3.6 3.5 1.02 1.00 0.98 0.96 3.4 0.94 3.3 0.92 3.2 −50 −25 0 25 50 75 100 0.90 −50 125 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 37. X2 Discharge Comparator Hysteresis Observed at HV Pin VHV(hyst) Figure 38. HV Signal Sampling Period Tsample 2.6 0.45 2.6 0.44 0.43 2.5 0.42 VOFF (V) 2.5 VON (V) −25 2.4 2.4 0.41 0.40 0.39 0.38 2.3 0.37 2.3 0.36 2.2 −50 −25 0 25 50 75 100 0.35 −50 125 −25 0 25 50 75 100 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 39. FB Pin Voltage Level Above Which is Entered On Mode VON Figure 40. FB Pin Voltage Level Below Which is Entered Off Mode VOFF 300 150 280 145 260 240 tGTOM (ms) tfault (ms) 140 135 130 220 200 180 160 140 125 120 120 −50 −25 0 25 50 75 100 125 100 −50 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 41. Fault Timer Duration tfault Figure 42. Go To Off Mode Timer Duration tGTOM http://onsemi.com 14 125 NCP1248 APPLICATION INFORMATION Functional Description For loads that are between approximately 32% and 10% of full rated power, the converter operates in frequency foldback mode (FFM). If the feedback pin voltage is lower than 1.5 V the peak switch current is kept constant and the output voltage is regulated by modulating the switching frequency for a given and fixed input voltage VHV. Effectively, operation in FFM results in the application of constant volt−seconds to the flyback transformer each switching cycle. Voltage regulation in FFM is achieved by varying the switching frequency in the range from 65 kHz (or 100 kHz) to 27 kHz. For extremely light loads (below approximately 6% full rated power), the converter is controlled using bursts of 27 kHz pulses. This mode is called as skip mode. The FFM, keeping constant peak current and skip mode allows design of the power supplies with increased efficiency under the light loading conditions. Keep in mind that the aforementioned boundaries of steady−state operation are approximate because they are subject to converter design parameters. The NCP1248 includes all necessary features to build a safe and efficient power supply based on a fixed−frequency flyback converter. The NCP1248 is a multimode controller as illustrated in Figure 43. The mode of operation depends upon line and load condition. Under all modes of operation, the NCP1248 terminates the DRV signal based on the switch current. Thus, the NCP1248 always operates in current mode control so that the power MOSFET current is always limited. Under normal operating conditions, the FB pin commands the operating mode of the NCP1248 at the voltage thresholds shown in Figure 43. At normal rated operating loads (from 100% to approximately 33% full rated power) the NCP1248 controls the converter in fixed frequency PWM mode. It can operate in the continuous conduction mode (CCM) or discontinuous conduction mode (DCM) depending upon the input voltage and loading conditions. If the controller is used in CCM with a wide input voltage range, the duty−ratio may increase up to 50%. The build−in slope compensation prevents the appearance of sub−harmonic oscillations in this operating area. Low consumption off mode ON OFF 0V PWM at fOSC FFM Skip mode 0.4 V 0.5 V 0.9 V 0.6 V 2.0 V 2.2 V 3.5 V VFB Figure 43. Mode Control with FB pin voltage decreases below the 0.4 V the controller will enter the low consumption off mode. The controller can start if the FB pin voltage increases above the 2.2 V level. See the detailed status diagrams for the both versions fully latched A and the autorecovery B on the following figures. The basic status of the device after wake–up by the VCC is the off mode and mode is used for the overheating protection mode if the thermal shutdown protection is activated. There was implemented the low consumption off mode allowing to reach extremely low no load input power. This mode is controlled by the FB pin and allows the remote control (or secondary side control) of the power supply shut−down. Most of the device internal circuitry is unbiased in the low consumption off mode. Only the FB pin control circuitry and X2 cap discharging circuitry is operating in the low consumption off mode. If the voltage at feedback pin http://onsemi.com 15 NCP1248 VHV > VHV(NOAC) < VOFF) * GTOMtimer*(VCC > VCCoff) BO+TSD Reset Latch=0 VCC fault Soft Start (VCC < VCCoff (VCC > VCCon)*BO Efficient operating mode BO+TSD Stop VCC > VCCoff SSend Skip in Running Skip mode Dynamic Self−Supply Skip out (if not enoughgh auxiliary voltage is present) http://onsemi.com Extra Low Consumption (VFB (VFB > VON)*Latch BO Latch Latch=1 (VCC < VCCoff 16 Off Mode Latch=X (VFB > VON)*Latch No AC AC present + discharged BO OVP+OTP+VCCovp+VCSstop (VILIM +MaxDC)*tfault X2 cap Discharge Latch=0 VCC > VCCreset Power On Reset Latch=0 Regulated Self−Supply VCC > VCCreset Figure 44. Operating Status Diagram for the Fully Latched Version A of the Device NCP1248 Even though the Dynamic Self−Supply is able to maintain the VCC voltage between VCC(on) and VCC(min) by turning the HV start−up current source on and off, it can only be used in light load condition, otherwise the power dissipation on the die would be too much. As a result, an auxiliary voltage source is needed to supply VCC during normal operation. The Dynamic Self−Supply is useful to keep the controller alive when no switching pulses are delivered, e.g. in brown−out condition, or to prevent the controller from stopping during load transients when the VCC might drop. The NCP1248 accepts a supply voltage as high as 28 V, with an overvoltage threshold VCC(ovp) that latches the controller off. The information about the fault (permanent Latch or Autorecovery) is kept during the low consumption off mode due the safety reason. The reason is not to allow unlatch the device by the remote control being in off mode. Start−up of the Controller At start−up, the current source turns on when the voltage on the HV pin is higher than VHV(min), and turns off when VCC reaches VCC(on), then turns on again when VCC reaches VCC(min), until the input voltage is high enough to ensure a proper start−up, i.e. when VHV reaches VHV(start). The controller actually starts the next time VCC reaches VCC(on). The controller then delivers pulses, starting with a soft−start period tSSTART during which the peak current linearly increases before the current−mode control takes over. VHV V HV(start) V HV(min) Waits next VCC(on) before starting time VCC V CC(on) V CC(min) HV current source = I start1 HV current source = Istart2 V CC(inhibit) time DRV Figure 45. VCC Start−up Timing Diagram http://onsemi.com 17 time NCP1248 For safety reasons, the start−up current is lowered when VCC is below VCC(inhibit), to reduce the power dissipation in case the VCC pin is shorted to GND (in case of VCC capacitor failure, or external pull−down on VCC to disable the controller). There is only one condition for which the current source doesn’t turn on when VCC reaches VCC(inhibit): the voltage on HV pin is too low (below VHV(min)). threshold and an autorecovery brown−out protection; both of them independent of the ripple on the input voltage. It is allowed only to work with an unfiltered, rectified ac input to ensure the X2 capacitor discharge function as well, which is described in following. The brown−out protection thresholds are fixed, but they are designed to fit most of the standard ac−dc conversion applications. When the input voltage goes below VHV(stop), a brown−out condition is detected, and the controller stops. The HV current source maintains VCC at VCC(min) level until the input voltage is back above VHV(start). HV Sensing of Rectified AC Voltage The NCP1248 features on its HV pin a true ac line monitoring circuitry. It includes a minimum start−up HV timer elapsed VHV VHV(start) VHV(stop) time HV stop tHV Brown-out detected Waits next VccON before starting VCC time VCC(on) VCC(min) Brown-out condition resets the Internal Latch DRV time time Figure 46. Ac Line Drop−out Timing Diagram When VHV crosses the VHV(start) threshold, the controller can start immediately. When it crosses VHV(stop), it triggers a timer of duration tHV, this ensures that the controller doesn’t stop in case of line cycle drop−out. http://onsemi.com 18 NCP1248 X2 Cap Discharge Feature In case of the dc signal presence on the high voltage input, the direct sample of the high voltage obtained via the high voltage sensing structure and the delayed sample of the high voltage are equivalent and the comparator produces the low level signal during the presence of this signal. No edges are present at the output of the comparator, that’s why the detection timer is not reset and dc detect signal appears. The minimum detectable slope by this ac detector is given by the ration between the maximum hysteresis observed at HV pin VHV(hyst),max and the sampling time: The X2 capacitor discharging feature is offered by usage of the NCP1248. This feature save approx. 16 mW − 25 mW input power depending on the EMI filter X2 capacitors volume and it saves the external components count as well. The discharge feature is ensured via the start−up current source with a dedicated control circuitry for this function. The X2 capacitors are being discharged by current defined as Istart2 when this need is detected. There is used a dedicated structure called ac line unplug detector inside the X2 capacitor discharge control circuitry. See the Figure 47 for the block diagram for this structure and Figures 48, 49, 50 and 51 for the timing diagrams. The basic idea of ac line unplug detector lies in comparison of the direct sample of the high voltage obtained via the high voltage sensing structure with the delayed sample of the high voltage. The delayed signal is created by the sample & hold structure. The comparator used for the comparison of these signals is without hysteresis inside. The resolution between the slopes of the ac signal and dc signal is defined by the sampling time TSAMPLE and additional internal offset NOS. These parameters ensure the noise immunity as well. The additional offset is added to the picture of the sampled HV signal and its analog sum is stored in the C1 storage capacitor. If the voltage level of the HV sensing structure output crosses this level the comparator CMP output signal resets the detection timer and no dc signal is detected. The additional offset NOS can be measured as the VHV(hyst) on the HV pin. If the comparator output produces pulses it means that the slope of input signal is higher than set resolution level and the slope is positive. If the comparator output produces the low level it means that the slope of input signal is lower than set resolution level or the slope is negative. There is used the detection timer which is reset by any edge of the comparator output. It means if no edge comes before the timer elapses there is present only dc signal or signal with the small ac ripple at the HV pin. This type of the ac detector detects only the positive slope, which fulfils the requirements for the ac line presence detection. S min + V HV(hyst),max (eq. 1) T sample Than it can be derived the relationship between the minimum detectable slope and the amplitude and frequency of the sinusoidal input voltage: V max + V HV(hyst),max 2 @ p @ f @ T sample + 5 2 @ p @ 35 @ 1 @ 10 −3 (eq. 2) + 22.7 V The minimum detectable AC RMS voltage is 16 V at frequency 35 Hz, if the maximum hysteresis is 5 V and sampling time is 1 ms. The X2 capacitor discharge feature is available in any controller operation mode to ensure this safety feature. The detection timer is reused for the time limiting of the discharge phase, to protect the device against overheating. The discharging process is cyclic and continues until the ac line is detected again or the voltage across the X2 capacitor is lower than VHV(min). This feature ensures to discharge quite big X2 capacitors used in the input line filter to the safe level. It is important to note that it is not allowed to connect HV pin to any dc voltage due this feature. e.g. directly to bulk capacitor. During the HV sensing or X2 cap discharging the VCC net is kept above the VCC(off) voltage by the Self−Supply in any mode of device operation to supply the control circuitry. During the discharge sequence is not allowed to start−up the device. http://onsemi.com 19 NCP1248 Figure 47. The ac Line Unplug Detector Structure Used for X2 Capacitor Discharge System Figure 48. The ac Line Unplug Detector Timing Diagram http://onsemi.com 20 NCP1248 Figure 49. The ac Line Unplug Detector Timing Diagram Detail with Noise Effects http://onsemi.com 21 NCP1248 Figure 50. HV Pin ac Input Timing Diagram with X2 Capacitor Discharge Sequence When the Application is Unplugged Under Extremely Low Line Condition Figure 51. HV Pin ac Input Timing Diagram with X2 Capacitor Discharge Sequence When the Application is Unplugged Under High Line Condition http://onsemi.com 22 NCP1248 The Low Consumption Off Mode Only the X2 cap discharge and Self−Supply features is enabled in the low consumption off mode. The X2 cap discharging feature is enable due the safety reasons and the Self−Supply is enabled to keep the VCC supply, but only very low VCC consumption appears in this mode. Any other features are disabled in this mode. The information about the latch status of the device is kept in the low consumption off mode and this mode is used for the TSD protection as well. The protection timer GoToOffMode tGTOM is used to protect the application against the false activation of the low consumption off mode by the fast drop outs of the FB pin voltage below the 0.4 V level. E.g. in case when is present high FB pin voltage ripple during the skip mode. There was implemented the low consumption off mode allowing to reach extremely low no load input power as described in previous chapters. If the voltage at feedback pin decreases below the 0.4 V the controller enters the off mode. The internal VCC is turned−off, the IC consumes extremely low VCC current and only the voltage at external VCC capacitor is maintained by the Self−Supply circuit. The Self−Supply circuit keeps the VCC voltage at the VCC(reg) level. The supply for the FB pin watch dog circuitry and FB pin bias is provided via the low consumption current sources from the external VCC capacitor. The controller can only start, if the FB pin voltage increases above the 2.2 V level. See Figure 52 for timing diagrams. Figure 52. Start−up, Shutdown and AC Line Unplug Time Diagram http://onsemi.com 23 NCP1248 Figure 53. Start−up, Shutdown and AC Line Unplug Time Diagram Oscillator with Maximum On Time and Frequency Jittering The NCP1248 includes an oscillator that sets the switching frequency 100 kHz. The maximum on time is 8 ms with an accuracy of ±7%. The maximum on time corresponds to maximum duty cycle of the DRV pin is 80% at full switching frequency. In order to improve the EMI signature, the switching frequency jitters ±6 % around its nominal value, with a triangle−wave shape and at a frequency of 125 Hz. This frequency jittering is active even when the frequency is decreased to improve the efficiency in light load condition. Figure 54. Frequency Modulation of the Maximum Switching Frequency http://onsemi.com 24 NCP1248 Low Load Operation Modes: Frequency Foldback Mode (FFM) and Skip Mode frequency foldback mode to provide the natural transformer core anti−saturation protection. The frequency jittering is still active while the oscillator frequency decreases as well. The current setpoint is fixed to 300 mV in the frequency foldback mode if the feedback voltage decreases below the VFB(freeze) level. This feature increases efficiency under the light loads conditions as well. In order to improve the efficiency in light load conditions, the frequency of the internal oscillator is linearly reduced from its nominal value down to fOSC(min). This frequency foldback starts when the voltage on FB pin goes below VFB(foldS), and is complete when VFB reaches VFB(foldE). The maximum on−time duration control is kept during the Figure 55. Frequency Foldback Mode Characteristic When the FB voltage reaches Vskip(in) while decreasing, skip mode is activated: the driver stops, and the internal consumption of the controller is decreased. While VFB is below Vskip(out), the controller remains in this state; but as soon as VFB crosses the skip out threshold, the DRV pin starts to pulse again. Figure 56. Skip Mode Timing Diagram http://onsemi.com 25 NCP1248 Clamped Driver resulting voltage is applied to the CS pin. It is applied to one input of the PWM comparator through a 250 ns LEB block. On the other input the FB voltage divided by 5 sets the threshold: when the voltage ramp reaches this threshold, the output driver is turned off. The maximum value for the current sense is 0.7 V, and it is set by a dedicated comparator. Each time the controller is starting, i.e. the controller was off and starts – or restarts – when VCC reaches VCC(on), a soft−start is applied: the current sense setpoint is increased by 15 discrete steps from 0 (the minimum level can be higher than 0 because of the LEB and propagation delay) until it reaches VILIM (after a duration of tSSTART), or until the FB loop imposes a setpoint lower than the one imposed by the soft−start (the two comparators outputs are OR’ed). The supply voltage for the NCP1248 can be as high as 28 V, but most of the MOSFETs that will be connected to the DRV pin cannot accept more than 20 V on their gate. The driver pin is therefore clamped safely below 16 V. This driver has a typical capability of 500 mA for source current and 800 mA for sink current. Current−Mode Control With Slope Compensation and Soft−Start NCP1248 is a current−mode controller, which means that the FB voltage sets the peak current flowing in the inductance and the MOSFET. This is done through a PWM comparator: the current is sensed across a resistor and the Figure 57. Soft−Start Feature Under some conditions, like a winding short−circuit for instance, not all the energy stored during the on time is transferred to the output during the off time, even if the on time duration is at its minimum (imposed by the propagation delay of the detector added to the LEB duration). As a result, the current sense voltage keeps on increasing above VILIM, because the controller is blind during the LEB blanking time. Dangerously high current can grow in the system if nothing is done to stop the controller. That’s what the additional comparator, that senses when the current sense http://onsemi.com 26 NCP1248 voltage on CS pin reaches VCS(stop) ( = 1.5 x VILIM ), does: as soon as this comparator toggles, the controller immediately enters the protection mode. In order to allow the NCP1248 to operate in CCM with a duty cycle above 50%, the fixed slope compensation is internally applied to the current−mode control. The slope appearing on −50 mV/ms. The slope compensation can be observable as a value of the peak current at CS pin. The internal slope compensation circuitry uses a sawtooth signal synchronized with the internal oscillator is subtracted from the FB voltage divided by KFB. Figure 58. Slope Compensation Block Diagram Figure 59. Slope Compensation Timing Diagram Internal Overpower Protection P OUT + The power delivered by a flyback power supply is proportional to the square of the peak current in discontinuous conduction mode: http://onsemi.com 27 1 @ h @ L P @ F SW @ I P 2 2 (eq. 3) NCP1248 Unfortunately, due to the inherent propagation delay of the logic, the actual peak current is higher at high input voltage than at low input voltage, leading to a significant difference in the maximum output power delivered by the power supply. Figure 60. Needs for Line Compensation For True Overpower Protection would be in the same order of magnitude. Therefore the compensation current is only added when the FB voltage is higher than VFB(OPCE). However, because the HV pin is being connected to ac voltage, there is needed an additional circuitry to read or at least closely estimate the actual voltage on the bulk capacitor. To compensate this and have an accurate overpower protection, an offset proportional to the input voltage is added on the CS signal by turning on an internal current source: by adding an external resistor in series between the sense resistor and the CS pin, a voltage offset is created across it by the current. The compensation can be adjusted by changing the value of the resistor. But this offset is unwanted to appear when the current sense signal is small, i.e. in light load conditions, where it Figure 61. Overpower Protection Current Relation to Feedback Voltage http://onsemi.com 28 NCP1248 Figure 62. Overpower Protection Current Relation to Peak of Rectified Input Line AC voltage Figure 63. Block Schematic of Overpower Protection Circuit line unplug detector. The sensed HV pin voltage peak value is validated when no HV edges from comparator are present after last falling edge during two sample clocks. See Figure 64 for details. A 3 bit A/D converter with the peak detector senses the ac input, and its output is periodically sampled and reset, in order to follow closely the input voltage variations. The sample and reset events are given by the output from the ac http://onsemi.com 29 NCP1248 Overcurrent Protection with Fault timer tries to restart after tautorec. Other possibilities of the latch release are the brown−out condition or the VCC power on reset. The timer is reset when the CS setpoint goes back below VILIM before the timer elapses. The fault timer is also started if the driver signal is reset by the maximum on time. The controller also enters the same protection mode if the voltage on the CS pin reaches 1.5 times the maximum internal setpoint VCS(stop) (allows to detect winding short−circuits) or there appears low VCC supply. See Figures 65 for the timing diagram. The overload protection depends only on the current sensing signal, making it able to work with any transformer, even with very poor coupling or high leakage inductance. When an overcurrent occurs on the output of the power supply, the FB loop asks for more power than the controller can deliver, and the CS setpoint reaches VILIM. When this event occurs, an internal tfault timer is started: once the timer times out, DRV pulses are stopped and the controller is either latched off (latched protection, option A) or this latch can be released in autorecovery mode (option B), the controller http://onsemi.com 30 NCP1248 VHVSAMPLE TSAMPLE VHV(hyst) time 1st HV edge resets the watch dog and starts the peak detection of HV pin signal Comparator Output time Sample clock time Watch dog signal 2nd sample clock pulse after last HV edge initiates the watch dog signal 2nd sample clock pulse after last HV edge initiates the watch dog signal time Peak detector Reset Reset Sample Sample time IOPC time Figure 64. Overpower Compensation Timing Diagram http://onsemi.com 31 NCP1248 PROTECTION MODES AND THE LATCH MODE RELEASES Event Timer Protection Next Device Status Release to Normal Operation Mode Overcurrent VILIM > 0.7 V Fault timer Latch Autorecovery – B version Brown−out VCC < VCC(reset) Maximum on time Fault timer Latch Autorecovery – B version Brown−out VCC < VCC(reset) Winding short Vsense > VCS(stop) Immediate reaction Latch Autorecovery – B version Brown−out VCC < VCC(reset) Low supply VCC < VCC(off) 10 ms timer Latch Autorecovery – B version Brown−out VCC < VCC(reset) External OTP, OVP 55 ms (35 ms at 100 kHz) Latch Brown−out VCC < VCC(reset) High supply VCC > VCC(ovp) 10 ms timer Latch Brown−out VCC < VCC(reset) Brown−out VHV < VHV(stop) HV timer Device stops (VHV > VHV(start))&( VCC > VCC(on)) Internal TSD 10 ms timer Device stops, HV start−up current source stops (VHV > VHV(start)) & ( VCC > VCC(on)) & TSDb Off mode VFB < VOFF 550 ms timer Device stops and internal VCC is turned off (VHV > VHV(start)) & ( VCC > VCC(on)) & ( VFB > VON) http://onsemi.com 32 NCP1248 VCC(on) VCC(min) Figure 65. Latched Timer−Based Overcurrent Protection (Option A) http://onsemi.com 33 NCP1248 Latch−Off Input Figure 66. Latch Detection Schematic application can only happen if the power supply is unplugged from the ac line. Upon startup, the internal references take some time before being at their nominal values; so one of the comparators could toggle even if it should not. Therefore the internal logic does not take the latch signal into account before the controller is ready to start: once VCC reaches VCC(on), the latch pin High latch state is taken into account and the DRV switching starts only if it is allowed; whereas the Low latch (typically sensing an over temperature) is taken into account only after the soft−start is finished. In addition, the NTC current is doubled to INTC(SSTART) during the soft−start period, to speed up the charging of the Latch pin capacitor. The maximum value of Latch pin capacitor is given by the following formula (The standard start−up condition is considered and the NTC current is neglected): The Latch pin is dedicated to the latch−off function: it includes two levels of detection that define a working window, between a high latch and a low latch: within these two thresholds, the controller is allowed to run, but as soon as either the low or the high threshold is crossed, the controller is latched off. The lower threshold is intended to be used with an NTC thermistor, thanks to an internal current source INTC. An active clamp prevents the voltage from reaching the high threshold if it is only pulled up by the INTC current. To reach the high threshold, the pull−up current has to be higher than the pull−down capability of the clamp (typically 1.5 mA at VOVP). To avoid any false triggering, spikes shorter than 50 ms (for the high latch) or 350 ms (for the low latch) are blanked and only longer signals can actually latch the controller. Reset occurs when a brown−out condition is detected or the VCC is cycled down to a reset voltage, which in a real C LATCH max + t SSTART min @ I NTC(SSTART) min V clamp0 min + 8.0 @ 10 −3 @ 130 @ 10 −6 F + 1.04 mF (eq. 4) 1.0 http://onsemi.com 34 NCP1248 VCC(on) VCC(min) Figure 67. Latch Timing Diagram Temperature Shutdown low power consumption. There is kept the VCC supply to keep the TSD information. When the temperature falls below the low threshold, the start−up of the device is enabled again, and a regular start−up sequence takes place. See the status diagrams at the Figures 44. The NCP1248 includes a temperature shutdown protection with a trip point typically at 150°C and the typical hysteresis of 30°C. When the temperature rises above the high threshold, the controller stops switching instantaneously, and goes to the off mode with extremely ORDERING INFORMATION 5 Overload Protection Switching Frequency Package Shipping† NCP1248AD065R2G Latched 65 kHz SOIC−7 (Pb−Free) 2500 / Tape & Reel NCP1248AD100R2G Latched 100 kHz SOIC−7 (Pb−Free) 2500 / Tape & Reel Ordering Part No. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 35 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−7 CASE 751U−01 ISSUE E DATE 20 OCT 2009 SCALE 1:1 −A− 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B ARE DATUMS AND T IS A DATUM SURFACE. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 5. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5 −B− S 0.25 (0.010) B M M 1 4 G C R X 45 _ J −T− SEATING PLANE H 0.25 (0.010) K M D 7 PL M T B S A DIM A B C D G H J K M N S INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 S GENERIC MARKING DIAGRAM SOLDERING FOOTPRINT* 8 1.52 0.060 7.0 0.275 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 1 XXX A L Y W G 4.0 0.155 0.6 0.024 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 1.270 0.050 SCALE 6:1 XXXXX ALYWX G mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. STYLES ON PAGE 2 DOCUMENT NUMBER: 98AON12199D DESCRIPTION: 7−LEAD SOIC Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOIC−7 CASE 751U−01 ISSUE E STYLE 1: PIN 1. EMITTER 2. COLLECTOR 3. COLLECTOR 4. EMITTER 5. EMITTER 6. 7. NOT USED 8. EMITTER DATE 20 OCT 2009 STYLE 2: PIN 1. COLLECTOR, DIE, #1 2. COLLECTOR, #1 3. COLLECTOR, #2 4. COLLECTOR, #2 5. BASE, #2 6. EMITTER, #2 7. NOT USED 8. EMITTER, #1 STYLE 3: PIN 1. DRAIN, DIE #1 2. DRAIN, #1 3. DRAIN, #2 4. DRAIN, #2 5. GATE, #2 6. SOURCE, #2 7. NOT USED 8. SOURCE, #1 STYLE 5: PIN 1. DRAIN 2. DRAIN 3. DRAIN 4. DRAIN 5. 6. 7. NOT USED 8. SOURCE STYLE 6: PIN 1. SOURCE 2. DRAIN 3. DRAIN 4. SOURCE 5. SOURCE 6. 7. NOT USED 8. SOURCE STYLE 7: PIN 1. INPUT 2. EXTERNAL BYPASS 3. THIRD STAGE SOURCE 4. GROUND 5. DRAIN 6. GATE 3 7. NOT USED 8. FIRST STAGE Vd STYLE 8: PIN 1. COLLECTOR (DIE 1) 2. BASE (DIE 1) 3. BASE (DIE 2) 4. COLLECTOR (DIE 2) 5. COLLECTOR (DIE 2) 6. EMITTER (DIE 2) 7. NOT USED 8. COLLECTOR (DIE 1) STYLE 9: PIN 1. EMITTER (COMMON) 2. COLLECTOR (DIE 1) 3. COLLECTOR (DIE 2) 4. EMITTER (COMMON) 5. EMITTER (COMMON) 6. BASE (DIE 2) 7. NOT USED 8. EMITTER (COMMON) STYLE 10: PIN 1. GROUND 2. BIAS 1 3. OUTPUT 4. GROUND 5. GROUND 6. BIAS 2 7. NOT USED 8. GROUND STYLE 11: PIN 1. SOURCE (DIE 1) 2. GATE (DIE 1) 3. SOURCE (DIE 2) 4. GATE (DIE 2) 5. DRAIN (DIE 2) 6. DRAIN (DIE 2) 7. NOT USED 8. DRAIN (DIE 1) STYLE 4: PIN 1. ANODE 2. ANODE 3. ANODE 4. ANODE 5. ANODE 6. ANODE 7. NOT USED 8. COMMON CATHODE DOCUMENT NUMBER: 98AON12199D DESCRIPTION: 7−LEAD SOIC Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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