NCP5382MNR2G

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NCP5382 2/3/4/5/6 Phase Buck Controller for VR10 and VR11 Pentium IV Processor Applications The NCP5382 is a two−, three−, four−, five−, or six−phase buck controller which combines differential voltage and current sensing, and adaptive voltage positioning to power Intel’s most demanding Pentium ® IV Processors and low voltage, high current power supplies. Dual−edge pulse−width modulation (PWM) combined with inductor current sensing reduces system cost by providing the fastest initial response to transient loads thereby requiring less bulk and ceramic output capacitors to satisfy transient load−line requirements. A high performance operational error amplifier is provided, which allows easy compensation of the system. The proprietary method of Dynamic Reference Injection (patented) makes the error amplifier compensation virtually independent of the system response to VID changes, eliminating the need for tradeoffs between load transients and Dynamic VID performance. Features • • • • • • • • • • • • • • • • • • • • • • Meets Intel’s VR 10.0, 10.1, 10.2, and 11.0 Specifications Dual−Edge PWM for Fastest Initial Response to Transient Loading High Performance Operational Error Amplifier Supports both VR11 and Legacy VR10 Soft−Start Modes Dynamic Reference Injection (Patent# 7057381) 8−Bit DAC per Intel’s VR11 Specifications DAC Range from 0.5 V to 1.6 V "0.5% System Voltage Accuracy Remote Temperature Sensing per VR11 2, 3, 4, 5 or 6−Phase Operation True Differential Remote Voltage Sensing Amplifier Phase−to−Phase Current Balancing “Lossless” Differential Inductor Current Sensing Differential Current Sense Amplifiers for each Phase Adaptive Voltage Positioning (AVP) Fixed No−Load Voltage Positioning at –19 mV Frequency Range: 100 kHz–1.0 MHz Threshold Sensitive Enable Pin for VTT Sensing Power Good Output with Internal Delays Programmable Soft−Start Time Operates from 12 V This is a Pb−Free Device* http://onsemi.com MARKING DIAGRAM 1 1 48 NCP5382 AWLYYWWG 48 PIN QFN, 7x7 MN SUFFIX CASE 485K A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *Pin 49 is the thermal pad on the bottom of the device. ORDERING INFORMATION Device NCP5382MNR2G Package Shipping† QFN−48 2500 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Applications • • • • Pentium IV Processors VRM Modules Graphics Cards Low Voltage, High Current Power Supplies © Semiconductor Components Industries, LLC, 2008 October, 2008 − Rev. 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1 Publication Order Number: NCP5382/D NCP5382 37 DRVON 38 39 G2 40 G3 41 G4 42 G5 43 G6 44 DGND 45 VCC 46 N/C 47 VR_RDY G1 CS4N NCP5382 Pinout 2/3/4/5/6−Phase Buck Controller (48 Pin QFN) VID2 VID3 CS3 CS3N (Top View) Figure 1. Pinout http://onsemi.com 2 24 23 22 21 VS− 20 19 VID7 VDRP CS1 VFB VID6 COMP CS2N DIFFOUT VID5 VS+ CS2 AGND VID4 18 12 VID1 AGND 11 CS4 ILIM 9 10 VID0 17 8 CS5N 16 7 VR10/11 ROSC 6 CS5 15 5 VREF SS 4 CS6 CS6N EN 3 ROSC2 14 2 OSC2_OUT 13 1 OSC2_IN 48 PIN CONNECTIONS CS1N 36 35 34 33 32 31 30 29 28 27 26 25 NCP5382 VREF VR10/11 VID0 VID1 VID2 VID3 VID4 VID5 VID6 VID7 NCP5382 VRM10/11 DAC OSC2_IN SOFTSTART Alternate Oscillator DAC VS− − VS+ + DIFFOUT OSC2_OUT Diff Amp Fault 1.3 V Error Amp + VFB − AGND VCOMP DGND Droop Amplifier VDROOP 1.3 V CS1 CS1N + − + ENB + − + G1 Gain = 6 CS2 + CS2N − CS3 CS3N CS4 CS4N Gain = 6 + Gain = 6 + ENB G3 ENB + − + − G2 + − + − ENB + − + G4 Gain = 6 CS5 CS5N CS6 CS6N + − Gain = 6 + G5 ENB + − + − ENB + − + Gain = 6 OVP G6 5OFF 6OFF Oscillator Fault ROSC2 ROSC VS− + ILIM Fault Logic Phase Detect − and ILimit Monitor EN VCC Circuits + − POR Figure 2. Simplified Block Diagram http://onsemi.com 3 DRVON VR_RDY NCP5382 +12 V VTT D1 BAT54HT1 12 V_FILTER 680  PULLUPS CVCC1 3 U20 2 VCC VID0 VID0 DGND VID1 VID1 VID2 VID2 AGND OSC2_IN VID3 VID3 VREF VID4 VID4 OSC2_OUT VID5 VID5 VID6 VID6 VID7 VID7 VR10/11 VR_RDY VR_RDY 8 DRVH NTD60N02RT4 7 SW 5 OD DRVL IN PGND 6 R2 L1 RS1 C2 NCP3418B NTD85N02RT4 12 V_FILTER G1 CS1 CS1N 3 2 CS2 CS2N VCC CS1 12 V_FILTER BST 4 G2 EN VR_EN C1 VCC C4 1 BST 4 VID_SEL 12 V_FILTER C3 RVCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 G3 VS− CS3 CS3N VS+ RISO1 RT2 CFB1 RISO2 12 V_FILTER 12 V_FILTER G4 NCP5382 RFB1 DIFFOUT RFB BST CS4 CS4N 4 G5 3 CS5 CS5N 2 VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 VFB G6 RDRP CS6 CS6N VDRP CD1 RD1 ROSC2 RF ILIM 4 ROSC SS 3 CH 12 V_FILTER BST DRVON COMP CF 12 V_FILTER 2 RLIM1 VCC DRVH SW OD DRVL IN PGND CSS 1 8 7 5 6 12 V_FILTER RLIM2 12 V_FILTER BST 4 3 2 VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 12 V_FILTER 12 V_FILTER BST 4 3 2 RT2 LOCATED NEAR OUTPUT INDUCTORS VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 VCCP + VSSP CPU GND Figure 3. Application Schematic for Six Phases http://onsemi.com 4 NCP5382 +12 V VTT D1 BAT54HT1 12 V_FILTER 680  PULLUPS CVCC1 3 U20 2 VCC VID0 VID0 DGND VID1 VID1 VID2 VID2 AGND OSC2_IN VID3 VID3 VREF VID4 VID4 OSC2_OUT VID5 VID5 VID6 VID6 VID7 VID7 VR10/11 VR_RDY VR_RDY 8 DRVH NTD60N02RT4 7 SW 5 OD DRVL IN PGND 6 R2 L1 RS1 C2 NCP3418B NTD85N02RT4 12 V_FILTER G1 CS1 CS1N 3 2 CS2 CS2N VCC CS1 12 V_FILTER BST 4 G2 EN VR_EN C1 VCC C4 1 BST 4 VID_SEL 12 V_FILTER C3 RVCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 G3 VS− CS3 CS3N VS+ RISO1 RT2 CFB1 RISO2 12 V_FILTER 12 V_FILTER G4 NCP5382 RFB1 DIFFOUT RFB BST CS4 CS4N 4 G5 3 CS5 CS5N 2 VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 VFB G6 RDRP CS6 CS6N VDRP CD1 RD1 ROSC2 RF ILIM 4 ROSC SS 3 CH 12 V_FILTER BST DRVON COMP CF 12 V_FILTER 2 RLIM1 VCC DRVH SW OD DRVL IN PGND CSS 1 8 7 5 6 12 V_FILTER RLIM2 12 V_FILTER BST 4 3 2 VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 RT2 LOCATED NEAR OUTPUT INDUCTORS VCCP + VSSP CPU GND Figure 4. Application Schematic for Five Phases http://onsemi.com 5 NCP5382 +12 V VTT D1 BAT54HT1 12 V_FILTER 680  PULLUPS CVCC1 3 U20 2 VCC VID0 VID0 DGND VID1 VID1 VID2 VID2 AGND OSC2_IN VID3 VID3 VREF VID4 VID4 OSC2_OUT VID5 VID5 VID6 VID6 VID7 VID7 VR10/11 VR_RDY VR_RDY 8 DRVH NTD60N02RT4 7 SW 5 OD DRVL IN PGND 6 R2 L1 RS1 C2 NCP3418B NTD85N02RT4 12 V_FILTER G1 CS1 CS1N 3 2 CS2 CS2N VCC CS1 12 V_FILTER BST 4 G2 EN VR_EN C1 VCC C4 1 BST 4 VID_SEL 12 V_FILTER C3 RVCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 G3 VS− CS3 CS3N VS+ RISO1 RT2 CFB1 RISO2 12 V_FILTER 12 V_FILTER G4 NCP5382 RFB1 DIFFOUT RFB BST CS4 CS4N 4 G5 3 CS5 CS5N 2 VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 VFB G6 RDRP CS6 CS6N VDRP CD1 RD1 ROSC2 RF ILIM 4 ROSC SS 3 CH 12 V_FILTER BST DRVON COMP CF 12 V_FILTER 2 RLIM1 CSS VCC DRVH SW OD DRVL IN PGND 1 8 7 5 6 RLIM2 RT2 LOCATED NEAR OUTPUT INDUCTORS VCCP + VSSP CPU GND Figure 5. Application Schematic for Four Phases http://onsemi.com 6 NCP5382 PIN DESCRIPTIONS Pin No. Symbol Description 1 OSC2_OUT 2 ROSC2 3 VREF 4 VR10/VR11 VR select bit. Connect this pin to VTT (1.25 V) to select the VR11 DAC table. Ground this pin to select the VR10 DAC table with VR11 type startup. Connect this pin to VREF (4 V) to select VR10 DAC table with legacy VR10 type startup. 5 – 12 VID0–VID7 Voltage ID DAC inputs. 13 EN Pull this pin high to enable controller. Pull this pin low to disable controller. Either an open−collector output (with a pull−up resistor) or a logic gate (CMOS or totem−pole output) may be used to drive this pin. A Low to High transition on this pin will initiate a soft start. If the Enable function is not required, this pin should be tied directly to VREF. 14 SS A capacitor from this pin to ground programs the soft−start time. 15 ROSC A resistance from this pin to ground programs the oscillator frequency. Also, this pin supplies a regulated 2.0 V which may be used with a voltage divider to the ILIM pin to set the over current shutdown threshold as shown in the Applications Schematics. 16 ILIM Over current shutdown threshold. To program the shutdown threshold, connect this pin to the ROSC pin via a resistor divider as shown in the Applications Schematics. To disable the over current feature connect this pin directly to the ROSC pin. To guarantee correct operation, this pin should only be connected to the voltage generated by the ROSC pin – do not connect this pin to any externally generated voltages. 17, 18 AGND 19 VS+ Non−inverting input to the internal differential remote VCORE sense amplifier. 20 VS− Inverting input to the internal differential remote VCORE sense amplifier. 21 DIFFOUT 22 COMP 23 VFB 24 VDRP Current signal output for Adaptive Voltage Positioning (AVP). The voltage of this pin minus 1.3 V is proportional to the output current. Connect a resistor from this pin to VFB to set the amount of AVP current into the feedback resistor (RFB) to produce an output voltage droop. Leave this pin open for no AVP. 25, 27, 29, 31, 33, 35 CSxN Inverting input to current sense amplifier #x, x = 1, 2, 3, 4, 5, 6. 26, 28, 30, 32, 34, 36 CSx 37 DRVON Gate Driver enable output. This pin produces a logic HIGH to enable gate drivers and a logic LOW to disable gate drivers and has an internal 70 k to ground. 38 – 43 G1 – G6 PWM control signal outputs to gate drivers. 44 DGND 45 VCC 47 VR_RDY Voltage Regulator Ready (PowerGood) output. Open drain type output with internal delays that will transition High when VCORE is higher than 300 mV below DAC, Low when VCORE is lower than 380 mV below DAC, and Low when VCORE is higher than DAC+185 mV. This output is latched Low if VCORE exceeds DAC+185 mV until VCC is removed. 48 OSC2_IN Alternative Oscillator Input 49 THPAD Alternate Oscillator Output Use for enhanced performance. Voltage reference pin. This pin may be used to implement remote NTC temperature sensing as shown in the Applications Schematic. Power supply return for the analog circuits that control output voltage. Output of the differential remote sense amplifier. Output of the error amplifier. Error amplifier inverting input. Connect a resistor from this pin to DIFFOUT. The value of this resistor and the amount of current from the droop resistor (RDRP) will set the amount of output voltage droop (AVP) during load. Non−inverting input to current sense amplifier #x, x = 1, 2, 3, 4, 5, 6. Power supply return for the digital circuits. Connect to AGND. Power for the internal control circuits. Copper pad on the bottom of the IC for heatsinking. This pin should be connected to the ground plane under the IC. http://onsemi.com 7 NCP5382 MAXIMUM RATINGS Rating Value Unit Operating Ambient Temperature Range 0 to 70 °C Operating Junction Temperature Range 0 to 85 °C −55 to 150 °C Lead Temperature Soldering, Reflow (60 to 120 seconds minimum above 237°C): 260 °C Thermal Resistance, Junction−to−Ambient (RθJA) on a thermally conductive PCB in free air 29.7 °C/W JEDEC Moisture Sensitivity Level ≤1 MSL Maximum Voltage – VCC pin with respect to AGND 15 V Maximum Voltage – all other pins with respect to AGND 5.5 V Minimum Voltage – all pins with respect to AGND −0.3 V Maximum Current into pins: COMP, VDRP, DIFFOUT, VREF 3.0 mA Maximum Current into pins: VR_RDY, G1, G2, G3, G4, SS, DRVON 20 mA Maximum Current out of pins: COMP, VDRP, DIFFOUT, ROSC, VREF 3.0 mA Maximum Current out of pins: G1, G2, G3, G4, G5, G6 20 mA Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: ESD Sensitive Device. http://onsemi.com 8 NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 85°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, FSW = 400 kHz, unless otherwise stated) Parameter Test Conditions Min Typ Max Units −200 −50 −10 nA − 1.3 − V −1.0 − 1.0 mV Error Amplifier Input Bias Current Inverting Input Voltage 1.0 k between VFB and COMP Pins Input Offset Voltage (Note 1) Open Loop DC Gain (Note 1) CL = 60 pF to GND, RL = 10 k to GND − 78 − dB Open Loop Unity Gain Bandwidth (Note 1) CL = 60 pF to GND, RL = 10 k to GND − 15 − MHz Open Loop Phase Margin (Note 1) CL = 60 pF to GND, RL = 10 k to GND − 65 − ° Slew Rate (Note 1) Vin = 100 mV, G = −1.0 V/V, 1.2 V < Vout < 2.2 V, CL = 60 pF, DC Load = ±125 A − 5.0 − V/s Maximum Output Voltage ISOURCE = 1.0 mA 3.0 4.3 − V Minimum Output Voltage ISINK = 1.0 mA − 0.9 1.0 V Output Source Current (Note 1) Vout = 3.0 V − 2.0 − mA Output Sink Current (Note 1) Vout = 1.0 V − 2.0 − mA Remote Sense Differential Amplifier VS+ Input Resistance (Note 1) DRVON = High DRVON = Low − − 17 0.5 − − k VS+ Input Open Circuit Voltage (Note 1) DRVON = High DRVON = Low − − 0.67 0.05 − − V VS− Input Resistance (Note 1) VS+ = DAC Voltage DRVON = High − 10 − k VS− Input Open Circuit Voltage (Note 1) DRVON = High VS+ = DAC Voltage = 0.333*DAC + 0.433 Input Voltage Range −0.3 Input Offset Voltage (Note 1) V − 3.0 V −1.0 − 1.0 mV − 12 − MHz 0.982 1.000 1.018 V/V − 10 − V/s 3.0 − − V − 0.5 V −3dB Bandwidth (Note 1) CL = 80 pF to GND, RL = 10 k to GND DC Gain IDIFFOUT = 100 A Slew Rate (Note 1) Vin = 1.0 V, Vout = 1.0 V to 2.0 V, CL = 80 pF to GND, Load = ±125 A Maximum Output Voltage ISOURCE = 1.0 mA Minimum Output Voltage ISINK = 1.0 mA − Output Source Current (Note 1) Vout = 2.1 V − 25 − mA Output Sink Current (Note 1) Vout = 1.0 V − 1.4 − mA 1. Guaranteed by design. Not tested in production. http://onsemi.com 9 NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 85°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, FSW = 400 kHz, unless otherwise stated) Parameter Test Conditions Min Typ Max Units 5.7 6.0 6.3 V/V VDRP Adaptive Voltage Positioning Amplifier Current Sense Input to VDRP Gain −60 mV < (CSx−CSxN) < +60 mV, TA = 25°C Current Sense Input to VDRP Output −3dB Bandwidth (Note 1) CL = 330 pF to GND, RL = 10 k to GND − 7.2 − MHz Current Sense Input to VDRP Output Slew Rate (Note 1) V(CSx−CSxN) = 25 mV (all phases), 1.3 V < Vout < 1.9 V, CL = 330 pF to GND, Load = ±400 A − 3.7 − V/s Current Summing Amp Output Offset Voltage CSx – CSxN = 0, CSx =1.0 V −15 − +15 mV Maximum VDRP Output Voltage CSx − CSxN = 0.12 V (all phases), ISOURCE = 1.0 mA 3.02 − − V Minimum VDRP Output Voltage CSx − CSxN = −0.12 V (all phases), ISINK = 1.0 mA − − 0.5 V Output Source Current (Note 1) VDRP = 2.9 V − 9.0 − mA Output Sink Current (Note 1) VDRP = 1.0 V − 2.0 − mA −200 −50 −10 nA Common Mode Input Voltage Range −0.3 − 2.0 V Differential Mode Input Voltage Range −120 − 120 mV Current Sense Amplifiers Input Bias Current CSx = CSxN = 1.4 V Input Offset Voltage (Note 1) CSx = CSxN = 1.0 V −3.0 − 3.0 mV Current Sense Input to PWM Comparator Input Gain 0 mV < (CSx−CSxN) < 25 mV TA = 25°C 5.75 6.0 6.35 V/V 100 − 1000 kHz Oscillator Switching Frequency Range Switching Frequency Accuracy ROSC = 10 k, 6−phase 836 880 968 kHz Switching Frequency Accuracy ROSC = 24.9 k, 6−phase 380 400 420 kHz Switching Frequency Accuracy ROSC = 49.9 k, 6−phase 200 210 220 kHz Switching Frequency Accuracy ROSC = 100 k, 6−phase Switching Frequency Accuracy ROSC = 10 k, 5−phase 849 894 983 kHz Switching Frequency Accuracy ROSC = 24.9 k, 5−phase 379 399 419 kHz Switching Frequency Accuracy ROSC = 49.9 k, 5−phase 198 208 228 kHz Switching Frequency Accuracy ROSC = 100 k, 5−phase Switching Frequency Accuracy ROSC = 10 k, 5−phase 863 908 999 kHz Switching Frequency Accuracy ROSC = 24.9 k, 4−phase 377 397 417 kHz Switching Frequency Accuracy ROSC = 49.9 k, 4−phase 185 206 227 kHz Switching Frequency Accuracy ROSC = 100 k, 4−phase 1. Guaranteed by design. Not tested in production. http://onsemi.com 10 104 kHz 100 104 kHz kHz NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 85°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, FSW = 400 kHz, unless otherwise stated) Parameter Test Conditions Min Typ Max Units − 30 40 ns − 1.0 − V Modulators (PWM Comparators) Minimum Pulse Width Fs = 400 kHz Magnitude of the PWM Ramp 0% Duty Cycle COMP voltage when the PWM outputs remain LO − 1.2 − V 100% Duty Cycle COMP voltage when the PWM outputs remain HI − 2.3 − V Minimum PWM Linear Duty Cycle (Note 1) FS = 400 kHz − 90 − % PWM Comparator Offset Mismatch (Note 1) Between any 2 phases, FS = 400 kHz − − 40 mV Phase Angle Error Between adjacent phases, FS = 400 kHz −15 − 15 ° Propagation Delay (Note 1) Ramp/Comp crossing to Gx high − 20 − ns Propagation Delay (Note 1) Ramp/Comp crossing to Gx low − 20 − ns 3.3 4.0 4.7 V PWM Outputs Output High Voltage Sourcing 500 A Output Low Voltage Sinking 500 A − 25 100 mV Rise Time CL = 20 pF, Vo = 0.3 to 2.0 V − 10 − ns Fall Time CL = 20 pF, Vo = Vmax to 0.7 V − 10 − ns Output Impedance – LO State Resistance to GND (Gx = LO) − 50 −  G5 or G6 Gate Pin Source Current during Phase Detect − 70 − A Phase Detection Period − 50 − s G5 or G6 Phase Detect Threshold Resistance − − 1.0 k 4.0 5.3 5.5 V Gate Driver Enable (DRVON) Output High Voltage Sourcing 500 A Output Low Voltage Sinking 500 A − 50 200 mV Rise Time CL (PCB) = 20 pF, Vo = 10% to 90% − 25 − ns Fall Time CL (PCB) = 20 pF, Vo = 10% to 90% − 25 − ns Internal Pulldown Resistance VCC < UVLO Threshold − 70 140 k OSC2_IN Voltage Threshold − 2.5 − V OSC2_IN Decreasing Hysterisis − 1.0 − V OSC2_OUT Voltage Output HIGH @ 1.0 mA 3.0 − − V OSC2_OUT Voltage Output LOW @ 1.0 mA − − 1.0 V OSC2 1. Guaranteed by design. Not tested in production. http://onsemi.com 11 NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 85°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, FSW = 400 kHz, unless otherwise stated) Parameter Test Conditions Min Typ Max Units VR_RDY (Power Good) Output Saturation Voltage ISINK = 10 mA − − 0.4 V Rise Time External pullup of 1.0 k to 1.25 V, CLOAD = 20 pF, Vo = 10% to 90% − − 150 ns Output Voltage at Power−up (Note 1) External VR_RDY pullup resistor of 2.0 k to 5.0 V, tR_VCC ≤ 3 x tR_5V, − − 1.0 V 100 s ≤ tR_VCC ≤ 20 ms High – Output Leakage Current VR_RDY = 5.5 V via 1.0 K − − 1.0 A Upper Threshold Voltage VCORE increasing, DAC = 1.3 V − 300 − mV below DAC Rising Delay VCORE increasing 0.3 1.40 2.0 ms Falling Delay VCORE decreasing − 5.0 − s Soft−Start SS Pin Source Current ENABLE = HI, VSS PIN < 1.1 V − 5.3 − A SS Pin Source Current ENABLE = HI, VSS PIN > 1.15 V, VR11 SS mode only 125 − − A Soft−Start Ramp Time CSS = 0.01 F, DRVON = HI to VSS PIN = 1.1 V 1.5 2.2 3.0 ms SS Pin Discharge Voltage ENABLE = LO − − 50 mV Soft−Start Discharge Time From ENABLE = LO to VSS PIN < max Discharge Voltage, CSS = 0.01 F − 5.0 − s VR11 VBOOT Threshold Voltage − 1.081 − V VR11 Dwell Time at VBOOT (Note 1) 50 225 900 s − − 10 A V Enable Input Enable High Input Leakage Current EN = 3.0 V Upper Threshold VUPPER 0.80 0.85 0.90 Lower Threshold VLOWER 0.67 0.75 0.83 V Total Hysteresis VUPPER – VLOWER 70 100 130 mV Enable Delay Time Enable transitioning HI to start of SS voltage rise 0.5 1.5 3.0 ms Disable Delay Time Enable transitioning Low to DRVON = Low − − 200 ns 5.7 6.0 6.3 V/V − 0.1 1.0 A ILIM Pin Working Voltage Range (Note 1) 0.3 − 2.0 V ILIM Input Offset Voltage (Note 1) −50 − 50 mV Current Limit Current Sense Inputs to ILIM Gain (Note 1) 20 mV < (CSx−CSxN) < 60 mV TA = 25°C (all CS channels together) ILIM Pin Input Bias Current VILIM = 2.0 V http://onsemi.com 12 NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 85°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, FSW = 400 kHz, unless otherwise stated) Parameter Test Conditions Min Typ Max Units DAC+160 DAC+180 DAC+200 mV UVLO Start Threshold 8.2 9.0 9.5 V UVLO Stop Threshold 7.2 8.0 8.5 V − 1.0 − V Overvoltage Protection Overvoltage Threshold (Note 1) Undervoltage Protection UVLO Hysteresis VID Inputs Upper Threshold VUPPER − − 800 mV Lower Threshold VLOWER 400 − − mV Input Bias Current VVIDX = 1.25 V Delay before Latching VID Change (VID De−Skewing) Measured from the 1st edge of a VID change − 100 500 nA 400 − 1000 ns VR10/VR11 DAC Table Threshold 0.4 − 0.775 V VR10 w/ Legacy SS/VR11 Threshold 2.7 − 3.1 V VR10/VR11 Select Internal DAC Slew Rate Limiter Positive Slew Rate Limit VID step range of +10mV to +500mV − 6.1 − mV/s Negative Slew Rate Limit VID step range of −10mV to −500mV − 6.2 − mV/s 3.92 4.00 4.08 V − 20 − mA Voltage Reference (VREF) VREF Output Voltage 0 < IVREF < 250 A Input Supply Current VCC Operating Current FSW = 400 kHz 1. Guaranteed by design. Not tested in production. http://onsemi.com 13 NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 125°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, unless otherwise stated) Parameter Test Conditions Min Typ Max Units − − ±0.5 ±5.0 ±8.0 % mV mV VR10 DAC System Voltage Accuracy 1.0 V < DAC < 1.6 V 0.8 V < DAC < 1.0 V 0.5 V < DAC < 0.8 V No−Load Offset Voltage from Nominal DAC Specification With CS Input Vin = 0 V −19 mV VR10 VID Codes VID4 400 mV VID3 200 mV VID2 100 mV VID1 50 mV VID0 25 mV VID5 12.5 mV VID6 6.25 mV Nominal DAC Voltage (V) 0 1 0 1 0 1 1 1.60000 0 1 0 1 0 1 0 1.59375 0 1 0 1 1 0 1 1.58750 0 1 0 1 1 0 0 1.58125 0 1 0 1 1 1 1 1.57500 0 1 0 1 1 1 0 1.56875 0 1 1 0 0 0 1 1.56250 0 1 1 0 0 0 0 1.55625 0 1 1 0 0 1 1 1.55000 0 1 1 0 0 1 0 1.54375 0 1 1 0 1 0 1 1.53750 0 1 1 0 1 0 0 1.53125 0 1 1 0 1 1 1 1.52500 0 1 1 0 1 1 0 1.51875 0 1 1 1 0 0 1 1.51250 0 1 1 1 0 0 0 1.50625 0 1 1 1 0 1 1 1.50000 0 1 1 1 0 1 0 1.49375 0 1 1 1 1 0 1 1.48750 0 1 1 1 1 0 0 1.48125 0 1 1 1 1 1 1 1.47500 0 1 1 1 1 1 0 1.46875 1 0 0 0 0 0 1 1.46250 1 0 0 0 0 0 0 1.45625 1 0 0 0 0 1 1 1.45000 1 0 0 0 0 1 0 1.44375 1 0 0 0 1 0 1 1.43750 1 0 0 0 1 0 0 1.43125 1 0 0 0 1 1 1 1.42500 1 0 0 0 1 1 0 1.41875 1 0 0 1 0 0 1 1.41250 1 0 0 1 0 0 0 1.40625 1 0 0 1 0 1 1 1.40000 1 0 0 1 0 1 0 1.39375 1 0 0 1 1 0 1 1.38750 1 0 0 1 1 0 0 1.38125 1 0 0 1 1 1 1 1.37500 http://onsemi.com 14 NCP5382 VR10 VID Codes VID4 400 mV VID3 200 mV VID2 100 mV VID1 50 mV VID0 25 mV VID5 12.5 mV VID6 6.25 mV Nominal DAC Voltage (V) 1 0 0 1 1 1 0 1.36875 1 0 1 0 0 0 1 1.36250 1 0 1 0 0 0 0 1.35625 1 0 1 0 0 1 1 1.35000 1 0 1 0 0 1 0 1.34375 1 0 1 0 1 0 1 1.33750 1 0 1 0 1 0 0 1.33125 1 0 1 0 1 1 1 1.32500 1 0 1 0 1 1 0 1.31875 1 0 1 1 0 0 1 1.31250 1 0 1 1 0 0 0 1.30625 1 0 1 1 0 1 1 1.30000 1 0 1 1 0 1 0 1.29375 1 0 1 1 1 0 1 1.28750 1 0 1 1 1 0 0 1.28125 1 0 1 1 1 1 1 1.27500 1 0 1 1 1 1 0 1.26875 1 1 0 0 0 0 1 1.26250 1 1 0 0 0 0 0 1.25625 1 1 0 0 0 1 1 1.25000 1 1 0 0 0 1 0 1.24375 1 1 0 0 1 0 1 1.23750 1 1 0 0 1 0 0 1.23125 1 1 0 0 1 1 1 1.22500 1 1 0 0 1 1 0 1.21875 1 1 0 1 0 0 1 1.21250 1 1 0 1 0 0 0 1.20625 1 1 0 1 0 1 1 1.20000 1 1 0 1 0 1 0 1.19375 1 1 0 1 1 0 1 1.18750 1 1 0 1 1 0 0 1.18125 1 1 0 1 1 1 1 1.17500 1 1 0 1 1 1 0 1.16875 1 1 1 0 0 0 1 1.16250 1 1 1 0 0 0 0 1.15625 1 1 1 0 0 1 1 1.15000 1 1 1 0 0 1 0 1.14375 1 1 1 0 1 0 1 1.13750 1 1 1 0 1 0 0 1.13125 1 1 1 0 1 1 1 1.12500 1 1 1 0 1 1 0 1.11875 1 1 1 1 0 0 1 1.11250 1 1 1 1 0 0 0 1.10625 1 1 1 1 0 1 1 1.10000 1 1 1 1 0 1 0 1.09375 1 1 1 1 1 0 1 OFF 1 1 1 1 1 0 0 OFF http://onsemi.com 15 NCP5382 VR10 VID Codes VID4 400 mV VID3 200 mV VID2 100 mV VID1 50 mV VID0 25 mV VID5 12.5 mV VID6 6.25 mV Nominal DAC Voltage (V) 1 1 1 1 1 1 1 OFF 1 1 1 1 1 1 0 OFF 0 0 0 0 0 0 1 1.08750 0 0 0 0 0 0 0 1.08125 0 0 0 0 0 1 1 1.07500 0 0 0 0 0 1 0 1.06875 0 0 0 0 1 0 1 1.06250 0 0 0 0 1 0 0 1.05625 0 0 0 0 1 1 1 1.05000 0 0 0 0 1 1 0 1.04375 0 0 0 1 0 0 1 1.03750 0 0 0 1 0 0 0 1.03125 0 0 0 1 0 1 1 1.02500 0 0 0 1 0 1 0 1.01875 0 0 0 1 1 0 1 1.01250 0 0 0 1 1 0 0 1.00625 0 0 0 1 1 1 1 1.00000 0 0 0 1 1 1 0 0.99375 0 0 1 0 0 0 1 0.98750 0 0 1 0 0 0 0 0.98125 0 0 1 0 0 1 1 0.97500 0 0 1 0 0 1 0 0.96875 0 0 1 0 1 0 1 0.96250 0 0 1 0 1 0 0 0.95625 0 0 1 0 1 1 1 0.95000 0 0 1 0 1 1 0 0.94375 0 0 1 1 0 0 1 0.93750 0 0 1 1 0 0 0 0.93125 0 0 1 1 0 1 1 0.92500 0 0 1 1 0 1 0 0.91875 0 0 1 1 1 0 1 0.91250 0 0 1 1 1 0 0 0.90625 0 0 1 1 1 1 1 0.90000 0 0 1 1 1 1 0 0.89375 0 1 0 0 0 0 1 0.88750 0 1 0 0 0 0 0 0.88125 0 1 0 0 0 1 1 0.87500 0 1 0 0 0 1 0 0.86875 0 1 0 0 1 0 1 0.86250 0 1 0 0 1 0 0 0.85625 0 1 0 0 1 1 1 0.85000 0 1 0 0 1 1 0 0.84375 0 1 0 1 0 0 1 0.83750 0 1 0 1 0 0 0 0.83125 http://onsemi.com 16 NCP5382 ELECTRICAL CHARACTERISTICS (0°C < TA < 70°C; 0°C < TJ < 125°C; 10.8 V < VCC < 13.2 V; All DAC Codes; CVCC = 0.1 F, unless otherwise stated) Parameter Test Conditions Min Typ Max Units − − ±0.5 ±5.0 ±8.0 % mV mV VR 11 DAC System Voltage Accuracy 1.0 V < DAC < 1.6 V 0.8 V < DAC < 1.0 V 0.5 V < DAC < 0.8 V No−Load Offset Voltage from Nominal DAC Specification With CS Input Vin = 0 V −19 mV Table 2: VR11 VID Codes VID7 800 mV VID6 400 mV VID5 200 mV VID4 100 mV VID3 50 mV VID2 25 mV VID1 12.5 mV VID0 6.25 mV Nominal DAC Voltage (V) HEX 0 0 0 0 0 0 0 0 OFF 00 0 0 0 0 0 0 0 1 OFF 01 0 0 0 0 0 0 1 0 1.60000 02 0 0 0 0 0 0 1 1 1.59375 03 0 0 0 0 0 1 0 0 1.58750 04 0 0 0 0 0 1 0 1 1.58125 05 0 0 0 0 0 1 1 0 1.57500 06 0 0 0 0 0 1 1 1 1.56875 07 0 0 0 0 1 0 0 0 1.56250 08 0 0 0 0 1 0 0 1 1.55625 09 0 0 0 0 1 0 1 0 1.55000 0A 0 0 0 0 1 0 1 1 1.54375 0B 0 0 0 0 1 1 0 0 1.53750 0C 0 0 0 0 1 1 0 1 1.53125 0D 0 0 0 0 1 1 1 0 1.52500 0E 0 0 0 0 1 1 1 1 1.51875 0F 0 0 0 1 0 0 0 0 1.51250 10 0 0 0 1 0 0 0 1 1.50625 11 0 0 0 1 0 0 1 0 1.50000 12 0 0 0 1 0 0 1 1 1.49375 13 0 0 0 1 0 1 0 0 1.48750 14 0 0 0 1 0 1 0 1 1.48125 15 0 0 0 1 0 1 1 0 1.47500 16 0 0 0 1 0 1 1 1 1.46875 17 0 0 0 1 1 0 0 0 1.46250 18 0 0 0 1 1 0 0 1 1.45625 19 0 0 0 1 1 0 1 0 1.45000 1A 0 0 0 1 1 0 1 1 1.44375 1B 0 0 0 1 1 1 0 0 1.43750 1C 0 0 0 1 1 1 0 1 1.43125 1D 0 0 0 1 1 1 1 0 1.42500 1E 0 0 0 1 1 1 1 1 1.41875 1F 0 0 1 0 0 0 0 0 1.41250 20 0 0 1 0 0 0 0 1 1.40625 21 0 0 1 0 0 0 1 0 1.40000 22 0 0 1 0 0 0 1 1 1.39375 23 0 0 1 0 0 1 0 0 1.38750 24 http://onsemi.com 17 NCP5382 Table 2: VR11 VID Codes VID7 800 mV VID6 400 mV VID5 200 mV VID4 100 mV VID3 50 mV VID2 25 mV VID1 12.5 mV VID0 6.25 mV Nominal DAC Voltage (V) HEX 0 0 1 0 0 1 0 1 1.38125 25 0 0 1 0 0 1 1 0 1.37500 26 0 0 1 0 0 1 1 1 1.36875 27 0 0 1 0 1 0 0 0 1.36250 28 0 0 1 0 1 0 0 1 1.35625 29 0 0 1 0 1 0 1 0 1.35000 2A 0 0 1 0 1 0 1 1 1.34375 2B 0 0 1 0 1 1 0 0 1.33750 2C 0 0 1 0 1 1 0 1 1.33125 2D 0 0 1 0 1 1 1 0 1.32500 2E 0 0 1 0 1 1 1 1 1.31875 2F 0 0 1 1 0 0 0 0 1.31250 30 0 0 1 1 0 0 0 1 1.30625 31 0 0 1 1 0 0 1 0 1.30000 32 0 0 1 1 0 0 1 1 1.29375 33 0 0 1 1 0 1 0 0 1.28750 34 0 0 1 1 0 1 0 1 1.28125 35 0 0 1 1 0 1 1 0 1.27500 36 0 0 1 1 0 1 1 1 1.26875 37 0 0 1 1 1 0 0 0 1.26250 38 0 0 1 1 1 0 0 1 1.25625 39 0 0 1 1 1 0 1 0 1.25000 3A 0 0 1 1 1 0 1 1 1.24375 3B 0 0 1 1 1 1 0 0 1.23750 3C 0 0 1 1 1 1 0 1 1.23125 3D 0 0 1 1 1 1 1 0 1.22500 3E 0 0 1 1 1 1 1 1 1.21875 3F 0 1 0 0 0 0 0 0 1.21250 40 0 1 0 0 0 0 0 1 1.20625 41 0 1 0 0 0 0 1 0 1.20000 42 0 1 0 0 0 0 1 1 1.19375 43 0 1 0 0 0 1 0 0 1.18750 44 0 1 0 0 0 1 0 1 1.18125 45 0 1 0 0 0 1 1 0 1.17500 46 0 1 0 0 0 1 1 1 1.16875 47 0 1 0 0 1 0 0 0 1.16250 48 0 1 0 0 1 0 0 1 1.15625 49 0 1 0 0 1 0 1 0 1.15000 4A 0 1 0 0 1 0 1 1 1.14375 4B 0 1 0 0 1 1 0 0 1.13750 4C 0 1 0 0 1 1 0 1 1.13125 4D 0 1 0 0 1 1 1 0 1.12500 4E 0 1 0 0 1 1 1 1 1.11875 4F 0 1 0 1 0 0 0 0 1.11250 50 0 1 0 1 0 0 0 1 1.10625 51 0 1 0 1 0 0 1 0 1.10000 52 http://onsemi.com 18 NCP5382 Table 2: VR11 VID Codes VID7 800 mV VID6 400 mV VID5 200 mV VID4 100 mV VID3 50 mV VID2 25 mV VID1 12.5 mV VID0 6.25 mV Nominal DAC Voltage (V) HEX 0 1 0 1 0 0 1 1 1.09375 53 0 1 0 1 0 1 0 0 1.08750 54 0 1 0 1 0 1 0 1 1.08125 55 0 1 0 1 0 1 1 0 1.07500 56 0 1 0 1 0 1 1 1 1.06875 57 0 1 0 1 1 0 0 0 1.06250 58 0 1 0 1 1 0 0 1 1.05625 59 0 1 0 1 1 0 1 0 1.05000 5A 0 1 0 1 1 0 1 1 1.04375 5B 0 1 0 1 1 1 0 0 1.03750 5C 0 1 0 1 1 1 0 1 1.03125 5D 0 1 0 1 1 1 1 0 1.02500 5E 0 1 0 1 1 1 1 1 1.01875 5F 0 1 1 0 0 0 0 0 1.01250 60 0 1 1 0 0 0 0 1 1.00625 61 0 1 1 0 0 0 1 0 1.00000 62 0 1 1 0 0 0 1 1 0.99375 63 0 1 1 0 0 1 0 0 0.98750 64 0 1 1 0 0 1 0 1 0.98125 65 0 1 1 0 0 1 1 0 0.97500 66 0 1 1 0 0 1 1 1 0.96875 67 0 1 1 0 1 0 0 0 0.96250 68 0 1 1 0 1 0 0 1 0.95625 69 0 1 1 0 1 0 1 0 0.95000 6A 0 1 1 0 1 0 1 1 0.94375 6B 0 1 1 0 1 1 0 0 0.93750 6C 0 1 1 0 1 1 0 1 0.93125 6D 0 1 1 0 1 1 1 0 0.92500 6E 0 1 1 0 1 1 1 1 0.91875 6F 0 1 1 1 0 0 0 0 0.91250 70 0 1 1 1 0 0 0 1 0.90625 71 0 1 1 1 0 0 1 0 0.90000 72 0 1 1 1 0 0 1 1 0.89375 73 0 1 1 1 0 1 0 0 0.88750 74 0 1 1 1 0 1 0 1 0.88125 75 0 1 1 1 0 1 1 0 0.87500 76 0 1 1 1 0 1 1 1 0.86875 77 0 1 1 1 1 0 0 0 0.86250 78 0 1 1 1 1 0 0 1 0.85625 79 0 1 1 1 1 0 1 0 0.85000 7A 0 1 1 1 1 0 1 1 0.84375 7B 0 1 1 1 1 1 0 0 0.83750 7C 0 1 1 1 1 1 0 1 0.83125 7D 0 1 1 1 1 1 1 0 0.82500 7E 0 1 1 1 1 1 1 1 0.81875 7F 1 0 0 0 0 0 0 0 0.81250 80 http://onsemi.com 19 NCP5382 Table 2: VR11 VID Codes VID7 800 mV VID6 400 mV VID5 200 mV VID4 100 mV VID3 50 mV VID2 25 mV VID1 12.5 mV VID0 6.25 mV Nominal DAC Voltage (V) HEX 1 0 0 0 0 0 0 1 0.80625 81 1 0 0 0 0 0 1 0 0.80000 82 1 0 0 0 0 0 1 1 0.79375 83 1 0 0 0 0 1 0 0 0.78750 84 1 0 0 0 0 1 0 1 0.78125 85 1 0 0 0 0 1 1 0 0.77500 86 1 0 0 0 0 1 1 1 0.76875 87 1 0 0 0 1 0 0 0 0.76250 88 1 0 0 0 1 0 0 1 0.75625 89 1 0 0 0 1 0 1 0 0.75000 8A 1 0 0 0 1 0 1 1 0.74375 8B 1 0 0 0 1 1 0 0 0.73750 8C 1 0 0 0 1 1 0 1 0.73125 8D 1 0 0 0 1 1 1 0 0.72500 8E 1 0 0 0 1 1 1 1 0.71875 8F 1 0 0 1 0 0 0 0 0.71250 90 1 0 0 1 0 0 0 1 0.70625 91 1 0 0 1 0 0 1 0 0.70000 92 1 0 0 1 0 0 1 1 0.69375 93 1 0 0 1 0 1 0 0 0.68750 94 1 0 0 1 0 1 0 1 0.68125 95 1 0 0 1 0 1 1 0 0.67500 96 1 0 0 1 0 1 1 1 0.66875 97 1 0 0 1 1 0 0 0 0.66250 98 1 0 0 1 1 0 0 1 0.65625 99 1 0 0 1 1 0 1 0 0.65000 9A 1 0 0 1 1 0 1 1 0.64375 9B 1 0 0 1 1 1 0 0 0.63750 9C 1 0 0 1 1 1 0 1 0.63125 9D 1 0 0 1 1 1 1 0 0.62500 9E 1 0 0 1 1 1 1 1 0.61875 9F 1 0 1 0 0 0 0 0 0.61250 A0 1 0 1 0 0 0 0 1 0.60625 A1 1 0 1 0 0 0 1 0 0.60000 A2 1 0 1 0 0 0 1 1 0.59375 A3 1 0 1 0 0 1 0 0 0.58750 A4 1 0 1 0 0 1 0 1 0.58125 A5 1 0 1 0 0 1 1 0 0.57500 A6 1 0 1 0 0 1 1 1 0.56875 A7 1 0 1 0 1 0 0 0 0.56250 A8 1 0 1 0 1 0 0 1 0.55625 A9 1 0 1 0 1 0 1 0 0.55000 AA 1 0 1 0 1 0 1 1 0.54375 AB 1 0 1 0 1 1 0 0 0.53750 AC 1 0 1 0 1 1 0 1 0.53125 AD 1 0 1 0 1 1 1 0 0.52500 AE http://onsemi.com 20 NCP5382 Table 2: VR11 VID Codes VID7 800 mV VID6 400 mV VID5 200 mV VID4 100 mV VID3 50 mV VID2 25 mV VID1 12.5 mV VID0 6.25 mV Nominal DAC Voltage (V) HEX 1 0 1 0 1 1 1 1 0.51875 AF 1 0 1 1 0 0 0 0 0.51250 B0 1 0 1 1 0 0 0 1 0.50625 B1 1 0 1 1 0 0 1 0 0.50000 B2 1 1 1 1 1 1 1 0 OFF FE 1 1 1 1 1 1 1 1 OFF FF OFF B3 to FD http://onsemi.com 21 NCP5382 TYPICAL CHARACTERISTICS 13.6 VCC, UNDERVOLTAGE LOCKOUT THRESHOLD VOLTAGE (V) ICC, IC QUIESCENT CURRENT (mA) 10 13.4 13.2 13.0 12.8 0 10 20 30 40 50 60 VCC Increasing Voltage 8 VCC Decreasing Voltage 7 70 0 10 20 30 40 50 60 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 6. IC Quiescent Current vs. Ambient Temperature Figure 7. VCC Undervoltage Lockout Threshold Voltage vs. Ambient Temperature 0.0198 0.0196 25°C 0.0194 DAC OFFSET 12.6 9 0.0192 0.0190 0.0188 0°C 0.0186 0.0184 70°C 0.0182 0.0180 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 VID Figure 8. Typical DAC Voltage Offset vs. Temperature http://onsemi.com 22 70 NCP5382 FUNCTIONAL DESCRIPTION Mode G5 G6 General 4−Phase GND GND The NCP5382 dual edge modulated multiphase PWM controller is specifically designed with the necessary features for a high current VR10 or VR11 CPU power system. The IC consists of the following blocks: Precision Programmable DAC, Differential Remote Voltage Sense Amplifier, High Performance Voltage Error Amplifier, Differential Current Feedback Amplifiers, Precision Oscillator and Triangle Wave Generators, and PWM Comparators. Protection features include Undervoltage Lockout, Soft−Start, Overcurrent Protection, Overvoltage Protection, and Power Good Monitor. 5−Phase Normal GND 6−Phase Normal Normal The NCP5382 can be used as a two phase or three phase controller by configuring the controller for six phases, and only using the appropriate gate signals. Two and Three phase operation is shown in the following table: Remote Output Sensing Amplifier (RSA) A true differential amplifier allows the NCP5382 to measure Vcore voltage feedback with respect to the Vcore ground reference point by connecting the Vcore reference point to VS+, and the Vcore ground reference point to VS−. This configuration keeps ground potential differences between the local controller ground and the Vcore ground reference point from affecting regulation of Vcore between Vcore and Vcore ground reference points. The RSA also subtracts the DAC (minus VID offset) voltage, thereby producing an unamplified output error voltage at the DIFFOUT pin. This output also has a 1.3 V bias voltage to allow both positive and negative error voltages. Mode G1 G2 G3 G4 2−Phase Normal 3−Phase Normal G5 G6 Open Open Open Normal Normal Open Open Open Normal Open Differential Current Sense Amplifiers Six differential amplifiers are provided to sense the output current of each phase. The inputs of each current sense amplifier must be connected across the current sensing element of the phase controlled by the corresponding gate output (G1, G2, G3, G4, G5, or G6) in order for the phase to phase current balancing to work. If a phase is unused, the differential inputs to that phase’s current sense amplifier must be shorted together and connected to VCCP as shown in the Application Schematic. A voltage is generated across the current sense element (such as the inductor esr or dedicated current sense resistor) by the current flowing in that phase. The output of the current sense amplifiers are used to control three functions. First, the output controls the adaptive voltage positioning, where the output voltage is actively controlled according to the output current. In this function, all of the current sense outputs are summed so that the total output current is used for output voltage positioning. Second, the output signal is fed to the current limit circuit. This again is the summed current of all phases in operation. Finally, the individual phase current is connected to the PWM comparator. In this way current balance is accomplished. Precision Programmable DAC A precision programmable DAC is provided. This DAC has 0.5% accuracy over the entire operating temperature range of the part. The DAC can be programmed to support either VR10 or VR11 specifications. A program selection pin is provided to accomplish this. This pin also sets the startup mode of operation. Connect this pin to 1.25 V to select the VR11 DAC table, and the VR11 startup mode. Connect this pin to ground to select the VR10 DAC table and the VR11 startup mode. Connect this pin to VREF to select the VR10 DAC table and the VR10 startup mode. High Performance Voltage Error Amplifier The error amplifier is designed to provide high slew rate and bandwidth. Although not required when operating as a voltage regulator for VR10 or VR11, a capacitor from COMP to VFB is required for stable unity gain test configurations. Oscillator and Triangle Wave Generator A programmable precision oscillator is provided. The oscillator ’s frequency is programmed by the resistance connected from the ROSC pin to ground. The user will usually form this resistance from two resistors in order to create a voltage divider that uses the ROSC output voltage as the reference for creating the current limit setpoint voltage. The oscillator frequency range is 100 kHz/phase to 1.0 MHz/phase. The oscillator generates up to 6 triangle waveforms (symmetrical rising and falling slopes) between 1.3 V and 2.3 V. The triangle waves have a phase delay between them such that the phase angles are evenly distributed about 360 degrees. Gate Driver Outputs and 2/3/4/5/6 Phase Operation The NCP5382 can be configured to operate in four, five or six phase mode. The operating mode is determined by sensing the impedance of the G5 and G6 pins during startup. If the output pins G5 or G6 are shorted to ground, then the operating mode will change according to following table: http://onsemi.com 23 NCP5382 PWM Comparators with Hysteresis information exceeds the voltage at the ILIM pin. The outputs are immediately disabled, the VR_RDY and DRVON pins are pulled low, and the soft−start is pulled low. The outputs will remain disabled until the VCC voltage is removed and re−applied, or the ENABLE input is brought low and then high. Four PWM comparators receive the error amplifier output signal at their noninverting input. Each comparator receives one of the triangle waves offset by 1.3 V at it’s inverting input. The output of the comparator generates the PWM outputs G1, G2, G3, G4, G5 and G6. During steady state operation, the duty cycle will center on the valley of the triangle waveform, with steady state duty cycle calculated by Vout/Vin. During a transient event, both high and low comparator output transitions shift phase to the points where the error amplifier output intersects the down and up ramp of the triangle wave. Overvoltage Protection and Power Good Monitor An output voltage monitor is incorporated. During normal operation, if the voltage at the DIFFOUT pin exceeds 1.3 V, the VR_RDY pin goes low, the DRVON signal remains high, the PWM outputs are set low. The outputs will remain disabled until the VCC voltage is removed and reapplied. During normal operation, if the output voltage falls more than 300 mV below the DAC setting, the VR_RDY pin will be set low until the output rises. PROTECTION FEATURES Undervoltage Lockout An undervoltage lockout (UVLO) senses the VCC input. During powerup, the input voltage to the controller is monitored, and the PWM outputs and the soft−start circuit are disabled until the input voltage exceeds the threshold voltage of the UVLO comparator. The UVLO comparator incorporates hysteresis to avoid chattering, since VCC is likely to decrease as soon as the converter initiates soft−start. Soft−Start The NCP5382 incorporates an externally programmable soft−start. The soft−start circuit works by controlling the ramp−up of the DAC voltage during powerup. The initial soft−start pin voltage is 0 V. The soft−start circuitry clamps the DAC input of the Remote Sense Amplifier to the SS pin voltage until the SS pin voltage exceeds the DAC setting minus VID offset. The soft−start pin is pulled to 0 V if there is an overcurrent shutdown, if the ENABLE pin is low, if VCC is below the UVLO threshold, or if an overvoltage condition exists. There are two possible soft−start modes: Legacy VR10 and VR11. VR10 mode simply ramps Vcore from 0 V directly to the DAC setting at the rate set by the capacitor connected to the SS pin. The VR11 mode ramps Vcore to 1.1 V at the SS capacitor charge rate, pauses at 1.1 V for 170 s, reads the VID pins to determine the DAC setting, then ramps Vcore to the final DAC setting at the Dynamic VID slew rate of 7.3 mV/s. Typical VR10 and VR11 soft−start sequences are shown in the following graphs. Overcurrent Shutdown A programmable overcurrent function is incorporated within the IC. A comparator and latch makeup this function. The inverting input of the comparator is connected to the ILIM pin. The voltage at this pin sets the maximum output current the converter can produce. The ROSC pin provides a convenient and accurate reference voltage from which a resistor divider can create the overcurrent setpoint voltage. Although not actually disabled, tying the ILIM pin directly to the ROSC pin sets the limit above useful levels – effectively disabling overcurrent shutdown. The comparator noninverting input is the summed current information from the current sense amplifiers. The overcurrent latch is set when the current http://onsemi.com 24 NCP5382 2.4 2.2 2.0 VOLTAGE 1.8 VID Setting 1.6 1.4 1.2 1.0 0.8 0.6 Vcore Voltage SS Pin Voltage 0.4 0.2 0 TIME 0 Figure 9. Typical VR10 Soft−Start Sequence to Vcore = 1.3 V 2.4 2.2 2.0 VID Setting VOLTAGE 1.8 Boot Voltage 1.6 1.4 1.2 1.0 Boot Dwell Time 0.8 0.6 Vcore Voltage SS Pin Voltage 0.4 0.2 0 NCP5382 Internal Dynamic VID Rate Limit TIME 0 Figure 10. Typical VR11 Soft−Start Sequence to Vcore = 1.3 V http://onsemi.com 25 NCP5382 APPLICATION INFORMATION 16. Start the second ATX supply by turning it on and setting the PSON DIP switch low. The green VID lights should light up to match the VTT tool VID setting. 17. Set the VR_ENABLE DIP switch up to start the NCP5382. 18. Check that the output voltage is about 19 mV below the VID setting. The NCP5382 is a high performance multiphase controller optimized to meet the Intel VR11 Specifications. The demo board for the NCP5382 is available by request. It is configured as a four phase solution with decoupling designed to provide a 1.0 m load line under a 100 A step load. A schematic is available upon request from ON Semiconductor. Startup Procedure The demo board comes with a Socket 775 and requires an Intel dynamic load tool (VTT Tool) available through a third party supplier, Cascade Systems. The web page is http://www.cascadesystems.net/. Start by installing the test tool software. It’s best to power the test tool from a separate ATX power supply. The test tool should be set to a valid VID code of 0.5 V or above in−order for the controller to start. Consult the VTT help manual for more detailed instructions. Step Load Testing The VTT tool is used to generate the high di/dt step load. Select the dynamic loading option in the VTT test tool software. Set the desired step load size, frequency, duty, and slew rate. See Figures 11 and 12. Startup Sequence 1. Make sure the VTT software is installed. 2. Powerup the PC or Laptop do not start the VTT software. 3. Insert the VTT Test Tool adapter into the socket and lock it down. 4. Inset the socket saver pin field into the bottom of the VTT test tool. 5. Carefully line up the tool with the socket in the board and press tool into the board. 6. Connect the scope probe, or DMM to the voltage sense lines on the test tool. When using a scope probe it is best to isolate the scope from the AC ground. Make the ground connection on the scope probe as short as possible. 7. Connect the first ATX supply to the VTT tool. 8. Powerup the first ATX supply to the VTT tool. 9. Start the VTT tool software in VR11 mode with the current limit set to 150 A. 10. Using the VTT tool software, select a VID code that is 0.5 V or above. 11. Connect the second ATX supply to the demo board. 12. Set the VID DIP switches. All the VID switches should be up or open. 13. Set the VR_ENABLE DIP switch down or closed. 14. Set the VR10 DIP switch up or open. 15. Set the VID_SEL switch up or open. Figure 11. Typical Step Load Response Figure 12. Typical Load Release Event http://onsemi.com 26 NCP5382 Dynamic VID Testing The VTT tool provides for VID stepping based on the Intel Requirements. Select the Dynamic VID option. Before enabling the test set the lowest VID to 0.5 V or greater and set the highest VID to a value that is greater than the lowest VID selection, then enable the test. See Figures 13 through 15. Design Methodology Decoupling the VCC Pin on the IC An RC input filter is required as shown in the VCC pin to minimize supply noise on the IC. The resistor should be sized such that it does not generate a large voltage drop between the 12 V supply and the IC. See the schematic values. Understanding Soft−Start The controller supports two different startup routines. A legacy VR10 ramp to the initial VID code, or a VR11 Ramp to the 1.1 V VID code, with a pause to capture the VID code then resume ramping to target value based on an internal slew rate limit. See Figures 16 and 17. The controller is designed to regulate to the voltage on the SS pin until it reaches the internal DAC voltage. The soft−start cap sets the initial ramp rate using a typical 5.0 A current. The typical value to use for the soft−start cap (SS), is typically set to 0.01 F. This results in a ramp time to 1.1 V of 2.2 ms based on equation 1. dt Css ^ iss ss dvss 1.1 · V dv + ss and iss + 5 · A dtss 2.2 · ms Figure 13. 1.6 to 0.5 Dynamic VID Response Css + 0.01 · F Figure 14. Dynamic VID Settling Time Rising Figure 16. VR11 Startup Figure 17. VR10 Legacy Startup Figure 15. Dynamic VID Settling Time Falling http://onsemi.com 27 (eq. 1) NCP5382 Programming the Current Limit and the Oscillator Frequency The demo board is set for an operating frequency of approximately 300 kHz. The OSC pin provides a 2.0 V reference voltage which is divided down with a resistor divider and fed into the current limit pin ILIM. Calculate the total series resistance to set the frequency and then calculate the individual values for current limit divider. The series resistors RLIM1 and RLIM2 sink current to ground. This current is internally mirrored into a capacitor to create an oscillator. The period is proportional to the resistance and frequency is inversely proportional to the resistance. The resistance may be estimated by equation 2 or 3 depending on the phase count. 9 32.36 k ^ 10.14 10 * 1440 300 · k (eq. 2) 2, 4, 6−Phase Mode 9 ROSC + 10.14 10 * 1440 Frequency (eq. 3) 3, 5−Phase Mode 9 ROSC + 9.711 10 * 1111 Frequency 100 ROSC (kOhms) 90 80 2, 4, 6−Phase Mode 70 3, 5−Phase Mode 60 50 40 30 20 10 0 1000 900 800 700 600 500 400 300 200 100 Frequency (kHz) Figure 18. ROSC vs. Phase Frequency The current limit function is based on the total sensed current of all phases multiplied by a gain of 5.94. DCR sensed inductor current is function of the winding temperature. The best approach is to set the maximum current limit based on the expected average maximum temperature of the inductor windings. DCRTmax + DCR25C · (1 ) 0.00393 · C−1 (TTmax−25 · C)) Calculate the current limit voltage: ǒ VILIMIT ^ 5.94 · IMIN_OCP · DCRTmax ) ǓǓ * 0.02 ǒ DCR50C · Vout · Vin−Vout * (N−1) · Vout L L 2 · Vin · Fs (eq. 4) (eq. 5) Solve for the individual resistors: VILIMIT · ROSC 2·V Final Equation for the Current Limit Threshold RLIM1 + ROSC−RLIM2 RLIM2 + ILIMIT(Tinductor) ^ ǒ 2 · V · RLIM2 RLIM1)RLIM2 Ǔ ) 0.02 5.94 · (DCR25C · (1 ) 0.00393 · C−1(TInductor−25 · C))) * (eq. 6) ǒ Ǔ Vout · Vin−Vout * (N−1) · Vout L L 2 · Vin · Fs (eq. 7) Inductor Selection When using inductor current sensing it is recommended that the inductor does not saturate by more than 10% at maximum load. The inductor also must not go into hard saturation before current limit trips. The demo board includes a four phase output filter using the T50−8 core from Micrometals with 4turns and a DCR target of 0.75 m @ 25°C. Smaller DCR values can be used, however, current sharing accuracy and droop accuracy decrease as DCR decreases. Use the excel spreadsheet for regulation accuracy calculations for a specific value of DCR. The inductors on the demo board have a DCR at 25°C of 0.75 m. Selecting the closest available values of 16.9 k for RLIM1 and 15.8 k for RLIM2 yield a nominal operating frequency of 305 kHz and an approximate current limit of 167 A at 100°C. The total sensed current can be observed as a scaled voltage at the VDRP pin added to a positive, no−load offset of approximately 1.3 V. http://onsemi.com 28 NCP5382 Inductor Current Sense Compensation The NCP5382 uses the inductor current sensing method. This method uses an RC filter to cancel out the inductance of the inductor and recover the voltage that is the result of Rsense(T) + the current flowing through the inductor’s DCR. This is done by matching the RC time constant of the current sense filter to the L/DCR time constant. The first cut approach is to use a 0.47 F capacitor for C and then solve for R. L 0.47 · F · DCR25C · (1 ) 0.00393 · C−1 · (T−25 · C)) (eq. 8) inductor temperature final selection of R is best done experimentally on the bench by monitoring the Vdroop pin and performing a step load test on the actual solution. It is desirable to keep the Rsense resistor value below 1.0 k whenever possible by increasing the capacitor values in the inductor compensation network. The bias current flowing out of the current sense pins is approximately 100 nA. This current flows through the current sense resistor and creates an offset at the capacitor which will appear as a load current at the Vdroop pin. A 1.0 k resistor will keep this offset at the droop pin below 2.5 mV. Figure 19. Simple Average PSPICE Model A simple state average model shown in Figure 20 can be used to determine a stable solution and provide insight into the control system. The demoboard inductor measured 350 nH and 0.75 m at room temp. The actual value used for Rsense was 953  which matches the equation for Rsense at approximately 50C. Because the inductor value is a function of load and E1 + + − − E 0 GAIN = 6 12 − + − + VRamp_min 1.3 V 0 − + L 1 DCR 2 (250e−9/6) Vin 12 1 4 RDRP 5.11 k RF CF 4.3 k 1.5 n 680 p Unity Gain BW = 15 MHz R6 C3 10.6 n 0.75 m CCer (22e−6*18) 1Aac ESRCer 0Adc (1.5e−3/18) 2 ESLBulk (3.5e−9/10) ESLCer (1.5e−9/18) 1 1 + − I1 = 10 I2 = 110 TD = 10u TR = 50n TF = 50n PW = 40u PER = 80u I2 + − 0 CFB1 1E3 RBRD ESRBulk (7e−3/10) 2 0 22 p 2 100 p CBulk (560e−6*10) (0.85e−3/6) Voff CH LBRD RFB1 100 RFB −+ Voff Vout + − 1k + 1k 1.3 Voffset − 0 0 Figure 20. http://onsemi.com 29 + VDAC − 1.25 V 0 NCP5382 A complex switching model is available by request which includes a more detailed board parasitic for this demo board. bulk capacitors have an ESR of 7.0 m. Thus the bulk ESR plus the board impedance is 0.7 m + 0.75 m or 1.45 m. The actual output filter impedance does not drop to 1.0 m until the ceramic breaks in at over 375 kHz. The controller must provide some loop gain slightly less than one out to a frequency in excess 300 kHz. At frequencies below where the bulk capacitance ESR breaks with the bulk capacitance, the DC−DC converter must have sufficiently high gain to control the output impedance completely. Standard Type−3 compensation works well with the NCP5382. RFB1 should be kept above 50  for amplifier stability reasons. The goal is to compensate the system such that the resulting gain generates constant output impedance from DC up to the frequency where the ceramic takes over holding the impedance below 1.0 m. See the example of the locations of the poles and zeros that were set to optimize the model above. Compensation and Output Filter Design The values shown on the demo board are a good place to start for any similar output filter solution. The dynamic performance can then be adjusted by swapping out various individual components. If the required output filter and switching frequency are significantly different, it’s best to use the available PSPICE models to design the compensation and output filter from scratch. The design target for this demo board was 1.0 m out to 2.0 MHz. The phase switching frequency is currently set to 300 kHz. It can easily be seen that the board impedance of 0.75 m between the load and the bulk capacitance has a large effect on the output filter. In this case the ten 560 F Zout Open Loop Zout Closed Loop Open Loop Gain with Current loop Closed 80 Voltage Loop Compensation Gain 1/(2*PI*CFB1*(RFB1+RFB)) 60 1/(2*PI*CF*RF) 40 20 1/(2*PI*RF*CH) RF/RFB1 RF/RFB Error Amp Open Loop Gain dB 0 1/(2*PI*(RBRD+ESRBulk)*CBulk) −20 −40 1/(2*PI*SQRT(ESL_Cer*CCer)) 1mOhm −60 −80 −100 100 1/(2*PI*CCer*(RBRD+ESRBulk)) 1000 10000 100000 1000000 10000000 Frequency Figure 21. By matching the following equations a good set of starting compensation values can be found for a typical mixed bulk and ceramic capacitor type output filter. 1 1 + 2 · CF · RF 2 · (RBRD ) ESRBulk) · CBulk 1 1 + 2 · CFBI · (RFBI ) RFB) 2 · CCer * (RBRD ) ESRBulk) http://onsemi.com 30 (eq. 9) NCP5382 RFB is always set to 1.0 k and RFB1 is usually set to 100  for maximum phase boost. The value of RF is typically set to 4.0 k. RRDP determines the target output impedance by the basic equation: Vout + Zout + RFB · DCR · 5.94 Iout RDRP RFB · DCR · 5.94 RDRP + Zout Droop Injection and Thermal Compensation The VDRP signal is generated by summing the sensed output currents for each phase and applying a gain of approximately six. VDRP is externally summed into the feedback network by the resistor RDRP. This induces an offset which is proportional to the output current thereby forcing the controlled resistive output impedance. (eq. 10) The value of the inductor’s DCR varies with temperature according to the following equation 10: DCRTmax + DCR25C · (1 ) 0.00393 · C−1(TTmax−25 · C)) The system can be thermally compensated to cancel this effect out to a great degree by adding an NTC (negative temperature coefficient resistor) in parallel with RFB to reduce the droop gain as the temperature increases. The NTC device is nonlinear. Putting a resistor in series with the (eq. 11) NTC helps make the device appear more linear with temperature. The series resistor is split and inserted on both sides of the NTC to reduce noise injection into the feedback loop. The recommended value for RISO1 and RISO2 is approximately 1.0 k. The output impedance varies with inductor temperature by the equation: Zout(T) + RFB · DCR25C · (1 ) 0.00393 · C−1(T max −25C)) · 5.94 Rdroop (eq. 12) By including the NTC RT2 and the series isolation resistors the new equation becomes: Zout(T) + RFB · (RISO1)RT2(T))RISO2) RFB)RISO1)RT2(T))RISO2 · DCR25C · (1 ) 0.00393 · C−1(T max −25C)) · 5.94 Rdroop The typical equation of a NTC is based on a curve fit equation 13. 1 Ǔƫ ƪǒ2731) TǓ * ǒ298 RT2(T) + RT225C · e  (eq. 13) inductor with respect to the NTC and airflow, and should be verified with an actual system thermal solution. OVP The overvoltage protection threshold is not adjustable. OVP protection is enabled as soon as soft−start begins and is disabled when the part is disabled. When OVP is tripped, the controller commands all four gate drivers to enable their low side MOSFETs, and VR_RDY transitions low. In order to recover from an OVP condition, VCC must fall below the UVLO threshold. See the state diagram for further details. The OVP circuit monitors the output of DIFFOUT. If the DIFFOUT signal reaches 180 mV above the nominal 1.3 V offset the OVP will trip. The DIFFOUT signal is the difference between the output voltage and the DAC voltage plus the 1.3 V internal offset. This results in the OVP tracking the DAC voltage even during a dynamic change in the VID setting during operation. (eq. 14) The demo board is populated with a 10 k NTC with a Beta of 4300. Figure 22 shows the uncompensated and compensated output impedance versus temperature. Gate Driver and MOSFET Selection ON Semiconductor provides the companion gate driver IC (NCP3418B). The NCP3418B driver is optimized to work with a range of MOSFETs commonly used in CPU applications. The NCP3418B provides special functionality and is required for the high performance dynamic VID operation of the part. Contact your local Figure 22. Uncompensated and Compensated Output Impedance vs. Temperature ON Semiconductor provides an excel spreadsheet to help with the selection of the NTC. The actual selection of the NTC will be effected by the location of the output http://onsemi.com 31 NCP5382 Board Stack−Up The demo board follows the recommended Intel Stack−up and copper thickness as shown. ON Semiconductor applications engineer for MOSFET recommendations. Figure 23. Board Layout A complete Allegro ATX and BTX demo board layout file and schematics are available by request at www.onsemi.com and can be viewed using the Allegro Free Physical Viewer 15.x from the Cadence website http://www.cadence.com/. Close attention should be paid to the routing of the sense traces and control lines that propagate away from the controller IC. Routing should follow the demo board example. For further information or layout review contact ON Semiconductor. http://onsemi.com 32 NCP5382 PACKAGE DIMENSIONS 48 PIN QFN, 7x7 MN SUFFIX CASE 485K−02 ISSUE C D ÈÈÈ ÈÈÈ ÈÈÈ PIN 1 LOCATION NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b APPLIES TO THE PLATED TERMINAL AND IS MEASURED ABETWEEN 0.25 AND 0.30 MM FROM TERMINAL 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B E DIM A A1 A3 b D D2 E E2 e K L 2X 0.15 C 2X 0.15 C TOP VIEW (A3) 0.10 C MILLIMETERS MIN NOM MAX 0.800 0.900 1.000 0.000 0.025 0.050 0.200 REF 0.180 0.250 0.300 7.000 BSC 5.260 5.360 5.460 7.000 BSC 5.260 5.360 5.460 0.500 BSC 0.200 −−−− −−−− 0.300 0.400 0.500 A 48 X 0.08 C SIDE VIEW A1 C EXPOSED PAD D2 L 48 X 13 SEATING PLANE K 24 4X 12 25 E2 1 b 36 48 48 X NOTE 3 37 e 0.10 C A B 0.05 C BOTTOM VIEW The products described herein (NCP5382/D), may be covered by one or more of the following U.S. patent; 7057381. There may be other patents pending. Pentium is a registered trademark of Intel Corporation. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 33 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca Sales Representative NCP5382/D