DATA SHEET
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Linear Regulator Dual-Rail, Very
Low‐Dropout,
Programmable Soft‐Start
QFN20
CASE 485DB
1.5 A
PIN CONNECTIONS
IN
NC
NC
NC
OUT
NCP59748
The NCP59748 is dual−rail very low dropout voltage regulator,
capable of providing an output current in excess of 1.5 A with a
dropout voltage of 60 mV typ. at full load current. The devices are
stable with ceramic and any other type of output capacitor ≥ 2.2 mF.
This series contains adjustable output voltage version with output
voltage down to 0.8 V. Internal protection features consist of built-in
thermal shutdown and output current limiting protection.
User-programmable Soft-Start and Power-Good pins are available on
both QFN and DFN versions.
The NCP59748 is offered in DFN10 3×3 and QFN20 5×5 packages.
Output Current in Excess of 1.5 A
VIN Range: 0.8 V to 5.5 V
VBIAS Range: 2.7 V to 5.5 V
Output Voltage Range: 0.8 V to 3.6 V
Dropout Voltage: 60 mV at 1.5 A
Programmable Soft-Start
Open Drain Power Good Output
Fast Transient Response
Stable with Any Type of Output Capacitor ≥ 2.2 mF
Current Limit and Thermal Shutdown Protection
These are Pb−Free Devices
5
4
3
2
1
6
20
7
19
GND
8
18
9
17
10
16
11 12 13 14 15
OUT
OUT
OUT
NC
FB
EN
GND
NC
NC
SS
IN
IN
IN
PG
BIAS
QFN20−5y5−0.65P
Features
•
•
•
•
•
•
•
•
•
•
•
DFN10
CASE 485C
IN
1
10
OUT
IN
2
9
PG
BIAS
EN
3
OUT
FB
SS
GND
Thermal
Pad
4
8
7
6
5
DFN10−3y3−0.5P
MARKING DIAGRAMS
1
NCP59748
AWLYYWWG
G
Applications
• Consumer and Industrial Equipment Point of Load Regulation
• FPGA, DSP and Logic Power Supplies
• Switching Power Supply Post Regulation
NCP59748
QFN20
A
WL
YY, Y
WW, W
G
1
NCP
59748
AYWG
G
DFN10
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 4 of this data sheet.
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2016
January, 2022 − Rev. 4
1
Publication Order Number:
NCP59748/D
NCP59748
Figure 2. Simplified Schematic Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Name
QFN20
DFN10
Description
IN
5−8
1, 2
EN
11
5
Enable pin. Driving this pin high enables the regulator. Driving this pin low puts the
regulator into shutdown mode. This pin must not be left floating.
SS
15
7
Soft-Start pin. A capacitor connected on this pin to ground sets the start-up time. If this
pin is left floating, the regulator output soft-start ramp time is typically 200 ms.
BIAS
10
4
Bias input voltage for error amplifier, reference, and internal control circuits.
PG
9
3
Power-Good (PG) is an open-drain, active-high output that indicates the status of
VOUT. When VOUT exceeds the PG trip threshold, the PG pin goes into a
high-impedance state. When VOUT is below this threshold the pin is driven to a
low-impedance state. A pull-up resistor from 10 kW to 1 MW should be connected from
this pin to a supply up to 5.5 V. The supply can be higher than the input voltage.
Alternatively, the PG pin can be left floating if output monitoring is not necessary.
FB
16
8
This pin is the feedback connection to the center tap of an external resistor divider
network that sets the output voltage. This pin must not be left floating.
OUT
1, 18−20
9, 10
Regulated output voltage. A small capacitor (total typical capacitance ≥ 2.2 mF,
ceramic) is needed from this pin to ground to assure stability.
NC
2−4, 13, 14, 17
N/A
No connection. This pin can be left floating or connected to GND to allow better
thermal contact to the top-side plane.
GND
12
6
PAD/TAB
Unregulated input to the device.
Ground
Should be soldered to the ground plane for increased thermal performance.
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NCP59748
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Input Voltage Range
VIN
−0.3 to +6
V
Input Voltage Range
VBIAS
−0.3 to +6
V
Enable Voltage Range
VEN
−0.3 to +6
V
Power−Good Voltage Range
VPG
−0.3 to +6
V
PG Sink Current
IPG
0 to +1.5
mA
SS Pin Voltage Range
VSS
−0.3 to +6
V
Feedback Pin Voltage Range
VFB
−0.3 to +6
V
Output Voltage Range
VOUT
−0.3 to (VIN + 0.3) ≤ 6
V
Maximum Output Current
IOUT
Internally Limited
PD
See Thermal Characteristics Table and Formula
Output Short Circuit Duration
Indefinite
Continuous Total Power Dissipation
Maximum Junction Temperature
TJMAX
+150
°C
Storage Junction Temperature Range
TSTG
−55 to +150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latch-up Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Resistance, Junction−to−Ambient (Note 5)
RqJA
30.5
°C/W
Thermal Resistance, Junction−to−Case (bottom) (Note 6)
RqJC
4.1
°C/W
Thermal Resistance, Junction−to−Ambient (Note 5)
RqJA
41.5
°C/W
Thermal Resistance, Junction−to−Case (bottom) (Note 6)
RqJC
6.6
°C/W
Thermal Characteristics, QFN20, 5x5, 0.65P package
Thermal Characteristics, DFN10, 3x3, 0.5P package
3. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
4. Thermal data are derived by thermal simulations based on methodology specified in the JEDEC JESD51 series standards. The following
assumptions are used in the simulations:
This data was generated with only a single device at the center of a high−K (2s2p) board with 3 in x 3 in copper area which follows the
JEDEC51.7 guidelines.
− QFN20: The exposed pad is connected to the PCB ground layer through a 4x4 thermal via array. Vias are 0.3 mm diameter, plated.
− QFN20: Each of top and bottom copper layers has a dedicated pattern for 20% copper coverage.
− DFN10: The exposed pad is connected to the PCB ground layer through a 3x2 thermal via array. Vias are 0.3 mm diameter, plated.
− DFN10: Each of top and bottom copper layers are assumed to have thermal conductivity representing 20% copper coverage.
5. The junction−to−ambient thermal resistance under natural convection is obtained in a simulation on a high−K board, following the JEDEC51.7
guidelines with assumptions as above, in an environment described in JESD51−2a.
6. The junction−to−case (bottom) thermal resistance is obtained by simulating a cold plate test on the IC exposed pad. Test description can
be found in the ANSI SEMI standard G30−88.
Table 4. RECOMMENDED OPERATING CONDITIONS (Note 7)
Symbol
Min
Max
Unit
Input Voltage
VIN
VOUT + VDO
5.5
V
Bias Voltage
VBIAS
2.7
5.5
V
TJ
−40
125
°C
Rating
Junction Temperature
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
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3
NCP59748
Table 5. ELECTRICAL CHARACTERISTICS (At VEN = 1.1 V, VIN = VOUT + 0.3 V, CBIAS = 0.1 mF, CSS = 1 nF, CIN = COUT = 10 mF,
IOUT = 50 mA, VBIAS = 5.0 V, TJ = −40°C to +125°C, unless otherwise noted. Typical values are at TJ = +25°C.)
Symbol
VIN
Parameter
Test Conditions
Input Voltage Range
Min
Typ
Max
Unit
VOUT + VDO
−
5.5
V
2.7
−
5.5
V
−
−
1.6
0.4
−
−
V
V
VBIAS
Bias Pin Voltage Range
UVLO
Undervoltage Lock-out
VBIAS Rising
Hysteresis
VREF
Internal Reference (Adj.)
TJ = +25°C
0.796
0.8
0.804
VOUT
Output Voltage Range
VIN = 5 V, IOUT = 1.5 A
VREF
−
3.6
V
Accuracy (Note 1)
2.97 V < VBIAS < 5.5 V,
50 mA < IOUT < 1.5 A
−2
±0.5
+2
%
VOUT/VIN
Line Regulation
VOUT (NOM) + 0.3 < VIN < 5.5 V
−
0.03
−
%/V
VOUT/IOUT
Load Regulation
50 mA < IOUT < 1.5 A
−
0.09
−
%/A
VIN Dropout Voltage (Note 2)
IOUT = 1.5 A,
VBIAS − VOUT (NOM) ≥ 3.25 V (Note 3)
−
60
165
mV
VBIAS Dropout Voltage (Note 2)
IOUT = 1.5 A, VIN = VBIAS
−
1.31
1.6
V
Current Limit
VOUT = 80% × VOUT (NOM)
2.0
−
5.5
A
−
1
2
mA
−
1
50
mA
−1
0.15
1
mA
dB
VDO
ICL
IBIAS
Bias Pin Current
ISHDN
Shutdown Supply Current (IGND)
IFB
PSRR
VEN ≤ 0.4 V
Feedback Pin Current
Power-Supply Rejection
(VIN to VOUT)
Power-Supply Rejection
(VBIAS to VOUT)
1 kHz, IOUT = 1.5 A, VIN = 1.8 V,
VOUT = 1.5 V
−
60
−
300 kHz, IOUT = 1.5 A, VIN = 1.8 V,
VOUT = 1.5 V
−
30
−
1 kHz, IOUT = 1.5 A, VIN = 1.8 V,
VOUT = 1.5 V
−
50
−
300 kHz, IOUT = 1.5 A, VIN = 1.8 V,
VOUT = 1.5 V
−
30
−
dB
Noise
Output Noise Voltage
100 Hz to 100 kHz, IOUT = 1.5 A
−
25 × VOUT
−
tSTRT
Minimum Startup Time
RLOAD for IOUT = 1.0 A, CSS = open
−
200
−
ms
Soft-Start Charging Current
VSS = 0.4 V
−
0.44
−
mA
ISS
mVrms
VEN, HI
Enable Input High Level
1.1
−
5.5
V
VEN, LO
Enable Input Low Level
0
−
0.4
V
VEN, HYS
Enable Pin Hysteresis
−
50
−
mV
VEN, DG
Enable Pin Deglitch Time
−
20
−
ms
IEN
Enable Pin Current
VEN = 5 V
−
0.1
1
mA
VIT
PG Trip Threshold
VOUT Decreasing
85
90
94
%VOUT
VHYS
PG Trip Hysteresis
−
3
−
%VOUT
−
0.3
V
VPG, LO
PG Output Low Voltage
IPG = 1 mA (Sinking), VOUT < VIT
−
IPG, LKG
PG Leakage Current
VPG = 5.25 V, VOUT > VIT
−
0.1
1
mA
Thermal Shutdown Temperature
Shutdown, Temperature Increasing
Reset, Temperature Decreasing
−
−
+165
+140
−
−
°C
TSD
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Adjustable devices tested at VREF; external resistor tolerance is not taken into account.
2. Dropout is defined as the voltage from the input to VOUT when VOUT is 3% below nominal.
3. 3.25 V is a test condition of this device and can be adjusted by referring to Figure 8.
Table 6. ORDERING INFORMATION
Output
Current
Output
Voltage
Junction
Temperature Range
NCP59748MN1ADJTBG
1.5 A
ADJ
NCP59748MN2ADJTBG
1.5 A
ADJ
Device
Package
Shipping†
−40°C to +125°C
DFN10
3000 / Tape & Reel
−40°C to +125°C
QFN20
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NCP59748
TYPICAL CHARACTERISTICS
0.20
0.5
0.15
0.4
0.10
−40°C
+125°C
0.05
0
CHANGE IN VOUT (%)
CHANGE IN VOUT (%)
At TJ = +25°C, VIN = VOUT(TYP) + 0.3 V, VBIAS = 5 V, IOUT = 50 mA, VEN = VIN,
CIN = 1 mF, CBIAS = 4.7 mF, and COUT = 10 mF, unless otherwise noted.
+25°C
−0.05
−0.10
−0.15
−0.20
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
−0.1
−0.3
0.5
1.0
1.5
2.0
2.5
3.0
VBIAS − VOUT (V)
Figure 3. VIN Line Regulation
Figure 4. VBIAS Line Regulation
3.5
4.0
0.5
0.3
0.2
CHANGE IN VOUT (%)
0.4
0.3
+125°C
0.1
+25°C
0
−0.1
−0.2
−0.3
−40°C
0
10
20
30
40
50
0.1
+25°C
0
−0.1
−0.2
−0.3
−40°C
0
0.5
1.0
1.5
IOUT, OUTPUT CURRENT (mA)
IOUT, OUTPUT CURRENT (A)
Figure 5. Load Regulation
Figure 6. Load Regulation
50
+125°C
40
+25°C
30
−40°C
20
10
0
+125°C
0.2
−0.4
−0.5
60
0
+25°C
−0.2
0.4
−0.4
−0.5
+125°C
−40°C
0.1
VIN − VOUT (V)
VDO (VIN − VOUT) DROPOUT VOLTAGE (mV)
CHANGE IN VOUT (%)
0.2
−0.4
−0.5
0.5
VDO (VIN − VOUT) DROPOUT VOLTAGE (mV)
0.3
0.5
1.0
1.5
200
180
IOUT = 1.5 A
160
140
120
100
80
+125°C
60
+25°C
40
−40°C
20
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
IOUT, OUTPUT CURRENT (A)
VBIAS − VOUT (V)
Figure 7. VIN Dropout Voltage vs. IOUT and
Temperature TJ
Figure 8. VIN Dropout Voltage vs. (VBIAS −
VOUT) and Temperature TJ
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4.5
NCP59748
TYPICAL CHARACTERISTICS
VDO (VBIAS − VOUT) DROPOUT VOLTAGE (mV)
VDO (VIN − VOUT) DROPOUT VOLTAGE (mV)
At TJ = +25°C, VIN = VOUT(TYP) + 0.3 V, VBIAS = 5 V, IOUT = 50 mA, VEN = VIN,
CIN = 1 mF, CBIAS = 4.7 mF, and COUT = 10 mF, unless otherwise noted.
200
1200
180
IOUT = 0.5 A
160
140
−40°C
120
+25°C
100
+125°C
80
60
40
20
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VBIAS − VOUT (V)
1100
−40°C
1000
+25°C
900
+125°C
800
700
600
0
2000
2000
1800
−40°C
1000
800
−40°C
1000
800
600
400
400
200
200
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
IOUT, OUTPUT CURRENT (A)
VBIAS (V)
Figure 11. BIAS Pin Current vs. IOUT and
Temperature TJ
Figure 12. BIAS Pin Current vs. VBIAS and
Temperature TJ
0.500
5.5
VPG,LO, L−LEVEL PG VOLTAGE (V)
1.0
0.475
0.450
ISS (mA)
+125°C
1200
600
0
+25°C
1400
IBIAS (mA)
1200
IBIAS (mA)
1600
+25°C
+125°C
1.5
Figure 10. VBIAS Dropout Voltage vs. IOUT and
Temperature TJ
1800
1400
1.0
IOUT, OUTPUT CURRENT (A)
Figure 9. VIN Dropout Voltage vs. (VBIAS −
VOUT) and Temperature TJ
1600
0.5
0.425
0.400
0.375
0.350
0.325
0.300
−50
−25
0
25
50
75
100
125
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
2
4
6
8
10
TJ, JUNCTION TEMPERATURE (°C)
IPG, PG PIN CURRENT (mA)
Figure 13. Soft Start Charging Current ISS vs.
Temperature TJ
Figure 14. L−level PG Voltage vs. Current
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12
NCP59748
TYPICAL CHARACTERISTICS
At TJ = +25°C, VIN = VOUT(TYP) + 0.3 V, VBIAS = 5 V, IOUT = 50 mA, VEN = VIN,
CIN = 1 mF, CBIAS = 4.7 mF, and COUT = 10 mF, unless otherwise noted.
4.5
−40°C
ICL, CURRENT LIMIT (A)
4.0
3.5
+25°C
+125°C
3.0
2.5
2.0
1.5
1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VBIAS − VOUT (V)
Figure 15. Current Limit vs. (VBIAS − VOUT)
Figure 16. Start by Enable @ CSS = 0 nF
90
80
PSRR (dB)
70
60
IOUT = 100 mA
IOUT = 1.5 A
50
40
30
VIN = 1.8 V + 100 mVPP Modulation
VBIAS = 5 V, VOUTNOM = 1.2 V
CBIAS = 4.7 mF, COUT = 10 mF
Resistive Load
20
10
0
10
100
1K
10K
100K
1M
10M
FREQUENCY (Hz)
Figure 17. Start by Enable @ CSS = 1 nF
Figure 18. VIN PSRR
NOISE SPECTRAL DENSITY (nV/√Hz)
90
80
PSRR (dB)
70
IOUT = 100 mA
IOUT = 0.5 A
IOUT = 1.5 A
60
50
40
30
20
VBIAS = 5 V + 100 mVPP Modulation,
VIN = 1.8 V, VOUTNOM = 1.2 V
CIN = 0.1 mF + 1 mF + 10 mF
COUT = 10 mF, Resistive Load
10
100
1K
10K
100K
1M
10M
350
CSS = 0
CSS = 1 nF
CSS = 10 nF
300
VIN = 1.5 V
VBIAS = 5 V
VOUTNOM = 1.2 V
ILOAD = 100 mA
CBIAS = 4.7 mF
CIN = COUT = 10 mF
Resistive Load
250
200
150
100
50
100
1K
10K
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 19. VBIAS PSRR
Figure 20. Noise Density vs. CSS
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100K
NCP59748
APPLICATIONS INFORMATION
greater. Ceramic or other low ESR capacitors are
recommended. For the best performance all the capacitors
should be connected to the NCP59748 respective pins
directly in the device PCB copper layer, not through vias
having not negligible impedance.
The NCP59748 dual−rail very low dropout voltage
regulator is using NMOS pass transistor for output voltage
regulation from VIN voltage. All the low current internal
controll circuitry is powered from the VBIAS voltage.
The use of an NMOS pass transistor offers several
advantages in applications. Unlike a PMOS topology
devices, the output capacitor has reduced impact on loop
stability. Vin to Vout operating voltage difference can be
very low compared with standard PMOS regulators in very
low Vin applications.
The NCP59748 offers programmable smooth monotonic
start-up. The controlled voltage rising limits the inrush
current what is advantageous in applications with large
capacitive loads. The Voltage Controlled Soft−Start timing
is programmable by external Css capacitor value.
The Enable (EN) input is equipped with internal
hysteresis and deglitch filter.
Open Drain type Power Good (PG) output is available for
Vout monitoring and sequencing of other devices.
NCP58748 is a Adjustable linear regulator. The required
Output voltage can be adjusted by two external resistors.
Typical application schematics is shown in Figure 21.
Enable Operation
The enable pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet. If the enable function is not to be used
then the pin should be connected to VIN or VBIAS.
The NCP59748 device is equipped with Output Active
Discharge transistor that is pulling the output to GND
through an 1.2 kW (typ.) resistor when the device is disabled.
To get the full functionality of Soft−Start, it is
recommended to turn on the VIN and VBIAS supply voltages
first and activate the Enable pin no sooner than VIN and
VBIAS are on their nominal levels.
Output Noise
When the NCP59748 device reaches the end of the
Soft−Start cycle, the Soft Start capacitor is switched to serve
as a Noise filtering capacitor.
Output Voltage Adjust
The output voltage can be adjusted from 0.8 V to 3.6 V
using resistors divider between the output and the FB input.
Recommended resistor values for frequently used voltages
can be found in the Table 7.
Programmable Soft−Start
V OUT + 0.8 ǒ1 ) R 1ńR 2Ǔ
Figure 21. Typical Application Schematics
The Soft-Start ramp time depends on the Soft−Start
charging current ISS, Soft-Start capacitor value CSS and
internal reference voltage VREF.
The Soft–Start time can be calculated using following
equations:
tss = CSS x (VREF / ISS) [s, F,V,A]
or in more practical units
tSS = CSS x 0.8V / 0.44 = CSS x 1.82
where
tss = Soft−Start time in miliseconds
CSS = Soft−Start capacitor value in nano Farads
Capacitor values for frequently used Soft-Start times can be
found in the Table 8.
The maximal recommended value of CSS capacitor is
15 nF. For higher CSS values the capacitor full discharging
before new Soft-Start cycle is not guaranteed.
Dropout Voltage
Because of two power supply inputs VIN and VBIAS and
one VOUT regulator output, there are two Dropout voltages
specified.
The first, the VIN Dropout voltage is the voltage
difference (VIN – VOUT) when VOUT starts to decrease by
percents specified in the Electrical Characteristics table.
VBIAS is high enough, specific value is published in the
Electrical Characteristics table.
The second, VBIAS dropout voltage is the voltage
difference (VBIAS – VOUT) when VIN and VBIAS pins are
joined together and VOUT starts to decrease.
Input and Output Capacitors
The device is designed to be stable for all available types
and values of output capacitors ≥ 2.2 mF. The device is also
stable with multiple capacitors in parallel, which can be of
any type or value.
In applications where no low input supplies impedance
available (PCB inductance in VIN and/or VBIAS inputs as
example), the recommended CIN and CBIAS value is 1 mF or
Power Good
Power−Good (PG) is an open−drain, active−high output
that indicates the status of VOUT. When VOUT exceeds the
PG trip threshold, the PG pin goes into a high−impedance
state. When VOUT is below this threshold the pin is driven
to a low−impedance state. A pull−up resistor from 10 kW to
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8
NCP59748
1 MW should be connected from this pin to a supply up to
5.5 V. The supply can be higher than the input voltage.
Alternatively, the PG pin can be left floating if output
monitoring is not necessary.
Table 8. CAPACITOR VALUES FOR PROGRAMMING
THE SOFT−START TIME
Soft−Start Time
CSS
0.2 ms
Open
0.5 ms
270 pF
1 ms
560 pF
5 ms
2.7 nF
10 ms
5.6 nF
18 ms
10 nF
Current Limitation
The internal Current Limitation circuitry allows the
device to supply the full nominal current and surges but
protects the device against Current Overload or Short. The
response time of this protection is in the range of
microseconds.
Thermal Protection
Internal thermal shutdown (TSD) circuitry is provided to
protect the integrated circuit in the event that the maximum
junction temperature is exceeded. When TSD activated , the
regulator output turns off. When cooling down under the low
temperature threshold, device output is activated again. This
TSD feature is provided to prevent failures from accidental
overheating.
Table 7. RESISTOR VALUES FOR PROGRAMMING
THE OUTPUT VOLTAGE
VOUT (V)
R1 (kW)
R2 (kW)
0.8
Short
Open
0.9
0.619
4.99
1.0
1.13
4.53
1.05
1.37
4.33
1.1
1.87
4.99
1.2
2.49
4.99
1.5
4.12
4.75
1.8
3.57
2.87
2.5
3.57
1.69
3.3
3.57
1.15
NOTE:
VOUT = 0.8 x (1 + R1/R2)
Resistors in the table are standard 1% types
www.onsemi.com
9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN10, 3x3, 0.5P
CASE 485C
ISSUE F
SCALE 2:1
DATE 16 DEC 2021
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
*This information is generic. Please refer to
Y
= Year
device data sheet for actual part marking.
W
= Work Week
Pb−Free indicator, “G” or microdot “G”, may
G
= Pb−Free Package
or may not be present. Some products may
(Note: Microdot may be in either location) not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON03161D
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DFN10, 3X3 MM, 0.5 MM PITCH
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN20 5x5, 0.65P
CASE 485DB
ISSUE O
1 20
SCALE 2:1
PIN ONE
REFERENCE
ÉÉ
ÉÉ
A B
D
L
L1
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
0.15 C
0.15 C
L
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. OPTIONAL FEATURES.
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
TOP VIEW
A
(A3)
DETAIL B
0.10 C
DATE 02 APR 2013
DETAIL B
0.08 C
A1
NOTE 5
NOTE 4
ALTERNATE
CONSTRUCTION
C
SIDE VIEW
0.10
DETAIL A
6
D2
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
C A B
20X L
M
1
0.10
M
XXXXXXXX
XXXXXXXX
AWLYYWWG
G
C A B
11
E2
1
16
20X
e
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
XXXXX
A
WL
YY
WW
G
NOTE 3
PACKAGE
OUTLINE
*This information is generic. Please refer
to device data sheet for actual part
marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
20X
0.78
3.30
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
RECOMMENDED
SOLDERING FOOTPRINT*
5.30
3.30
MILLIMETERS
MIN
MAX
0.80
1.00
−−−
0.05
0.20 REF
0.25
0.35
5.00 BSC
3.05
3.25
5.00 BSC
3.05
3.25
0.65 BSC
0.45
0.65
−−−
0.15
5.30
20X
0.65
PITCH
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON88183E
QFN20 5x5, 0.65P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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© Semiconductor Components Industries, LLC, 2019
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