NCP629

NCP629 High Performance CMOS LDO Regulator with Enable and Enhanced ESD Protection in Chip Scale Package (CSP) The NCP629 provides 150 mA of output current at fixed voltage options. It is designed for portable battery powered applications and offers high performance features such as low power operation, fast enable response time, and low dropout. The device is designed to be used with low cost ceramic capacitors. Features http://onsemi.com MARKING DIAGRAM XXXG AYWW 5 PIN FLIP-CHIP CASE 499AY XXX A Y WW G • Output Voltage Options: • • • • • • • • • • • • • • 1.5 V, 1.8 V, 2.8 V, 3.0 V, 3.3 V, 3.5 V, 5.0 V Ultra-Low Dropout Voltage of 150 mV at 150 mA Fast Enable Turn-on Time of 15 ms Wide Supply Voltage Operating Range Supports sub-1 V Enable Threshold Excellent Line and Load Regulation High Accuracy up to 2% Output Voltage Tolerance over All Operating Conditions Typical Noise Voltage of 50 mVrms without a Bypass Capacitor Ultra Small CSP Footprint and Height: 1.028 x 1.19 mm, Max Height 0.6 mm Enhanced ESD Protection (HBM 3.5 kV, MM 400 V) These are Pb-Free Devices = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package PIN CONNECTIONS A3 C3 Typical Applications Personal Electronics (MP3 Players) Portable Devices (Cellular Phones) Noise Sensitive Circuits – VCO, RF Stages, etc. Camcorders and Cameras ORDERING INFORMATION Vin Vin Vout NCP629 ENABLE GND Cout Vout See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Cin Figure 1. Typical Application Circuit © Semiconductor Components Industries, LLC, 2008 1 February, 2008 - Rev. 1 ÍÍÍ ÍÍÍ A1 A3 C3 C1 B2 A1 B2 C1 (Top View) = ENABLE = Vin = Vout = NC = GND (substrate) Publication Order Number: NCP629/D NCP629 Vin Vout Driver with Current Limit + - Thermal Shutdown ENABLE Vref GND Figure 2. Simplified Block Diagram PIN FUNCTION DESCRIPTION Pin No. C3 A1 A3 B2 C1 Pin Name Vin GND ENABLE NC Vout Positive Power Supply Input Power Supply Ground; Device Substrate The Enable Input places the device into low-power standby when pulled to logic low (< 0.4 V). Connect to Vin if the function is not used. No Connection Regulated Output Voltage Description ABSOLUTE MAXIMUM RATINGS Rating Input Voltage Range (Note 1) Output Voltage Range Enable Input Range Maximum Junction Temperature Storage Temperature Range ESD Capability, Human Body Model (Note 2) ESD Capability, Machine Model (Note 2) Moisture Sensitivity Level Symbol Vin Vout ENABLE TJ(max) TSTG ESDHBM ESDMM MSL Value -0.3 to 6.5 -0.3 to 6.5 (or Vin + 0.3) Whichever is Lower -0.3 to 6.5 (or Vin + 0.3) Whichever is Lower 150 -65 to 150 3500 400 MSL1/260 Unit V V V °C °C V V - Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Thermal Characteristics (Note 3) Thermal Resistance, Junction-to-Air (Note 4) Symbol RqJA Value 277 Unit °C/W 3. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 4. Values based on copper area of 645 mm2, 1 oz copper thickness. OPERATING RANGES (Note 5) Rating Operating Input Voltage (Note 6) Output Current Ambient Temperature Symbol Vin Iout TA Min 1.5 0 -40 Max 6 150 125 Unit V mA °C 5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 6. Minimum Vin = 1.5 V or (Vout + VDO), whichever is higher. http://onsemi.com 2 NCP629 ELECTRICAL CHARACTERISTICS (Vin = Vout + 0.5 V, Cin = Cout =1.0 mF, for typical values TA = 25°C, for min/max values TA = -40°C to 125°C; unless otherwise noted.) (Note 7) Parameter Regulator Output Output Voltage 1.5 V 1.8 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Power Supply Ripple Rejection (Note 8) (Vin = Vout + 1.0 V + 0.5 Vp-p) Iout = 1.0 mA to 150 mA Vin = (Vout + 0.5 V) to 6.0 V Vout V 1.470 1.764 2.744 2.940 3.234 3.430 4.900 (-2%) Regline Regload 62 55 38 1.0 1.530 1.836 2.856 3.060 3.366 3.570 5.100 (+2%) dB 10 mV mV 300 2.0 2.0 2.0 50 550 150 125 75 20 25 30 800 225 175 125 mA mA 135 140 145 175 10 170 175 180 °C °C mVrms mA mV Test Conditions Symbol Min Typ Max Unit Iout = 1.0 mA to 150 mA f = 120 Hz f = 1.0 kHz f = 10 kHz Vin = (Vout + 0.5 V) to 6.0 V, Iout = 1.0 mA Iout = 1.0 mA to 150 mA PSRR Line Regulation Load Regulation 1.5 V 1.8 V 2.8 V to 5.0 V Output Noise Voltage (Note 8) Output Short Circuit Current Dropout Voltage 1.5 V 1.8 V 2.8 V to 5.0 V General Disable Current Ground Current 1.5 V 1.8 V to 3.0 V 3.3 V to 5.0 V Thermal Shutdown Temperature (Note 8) Thermal Shutdown Hysteresis (Note 8) Chip Enable ENABLE Input Threshold Voltage Voltage Increasing, Logic High Voltage Decreasing, Logic Low Enable Input Bias Current (Note 8) Timing Output Turn On Time 1.5 V to 3.5 V 5.0 V Vout = 1.5 V, f = 10 Hz to 100 kHz Vout = 0 V Measured at: Vout – 2.0% Iout = 150 mA Vn Isc VDO ENABLE = 0 V, Vin = 6 V -40°C ≤ TA ≤ 85°C ENABLE = 0.9 V, Iout = 1.0 mA to 150 mA IDIS IGND - 0.01 1.0 TSD TSH Vth(EN) 0.9 IEN ENABLE = 0 V to Vin ton 15 30 25 50 3.0 0.4 100 V nA ms 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA = 25 °C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. Values based on design and/or characterization. http://onsemi.com 3 NCP629 TYPICAL CHARACTERISTICS 1.500 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 1.0 mA 1.500 Iout = 1.0 mA 1.495 1.495 1.490 Iout = 150 mA 1.490 Iout = 150 mA 1.485 1.485 1.480 1.475 -40 1.480 1.475 -40 -15 10 35 60 85 110 125 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature (1.5 V Fixed Output, Vin = 2 V) 3.005 Vout, OUTPUT VOLTAGE (V) 3.000 2.995 2.990 2.985 2.980 2.975 -40 Vout, OUTPUT VOLTAGE (V) Iout = 1.0 mA 3.005 3.000 2.995 2.990 2.985 2.980 2.975 2.970 -40 Figure 4. Output Voltage vs. Temperature (1.5 V Fixed Output, Vin = 6 V) Iout = 1.0 mA Iout = 150 mA Iout = 150 mA -15 10 35 60 85 110 125 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 5. Output Voltage vs. Temperature (3.0 V Fixed Output, Vin = 3.5 V) Figure 6. Output Voltage vs. Temperature (3.0 V Fixed Output, Vin = 6 V) http://onsemi.com 4 NCP629 TYPICAL CHARACTERISTICS 5.000 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 1.0 mA 4.995 4.990 Iout = 150 mA 4.985 4.980 4.975 4.970 4.965 -40 -15 10 35 60 85 110 125 5.000 Iout = 1.0 mA 4.995 4.990 4.985 Iout = 150 mA 4.980 4.975 4.970 4.965 -40 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 7. Output Voltage vs. Temperature (5.0 V Fixed Output, Vin = 5.5 V) 250 VDO, DROPOUT VOLTAGE (mV) VDO, DROPOUT VOLTAGE (mV) Vout = 1.5 V 200 Iout = 150 mA 150 Iout = 100 mA 100 Iout = 50 mA 50 0 -40 -20 Iout = 1 mA 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) 250 Figure 8. Output Voltage vs. Temperature (5.0 V Fixed Output, Vin = 6 V) Iout = 150 mA 200 Vout = 1.5 V 150 Vout = 3.0 V 100 50 0 -40 -20 Vout = 5.0 V 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) Figure 9. Dropout Voltage vs. Temperature (Over Current Range) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 1.0 2.0 3.0 4.0 5.0 6.0 Vin, INPUT VOLTAGE (V) 1.5 V 800 5.0 V Vth(en), ENABLE THRESHOLD (mV) Iout = 0 mA Cout = 1.0 mF TA = 25°C ENABLE = Vin 3.0 V Figure 10. Dropout Voltage vs. Temperature (Over Output Voltage) Vout, OUTPUT VOLTAGE (V) 750 Enable Increasing 700 Enable Decreasing 650 Vin = 5.5 V 600 -40 -15 10 35 60 85 110 125 3.3 V 2.80 V 1.80 V TA, AMBIENT TEMPERATURE (°C) Figure 11. Output Voltage vs. Input Voltage Figure 12. Enable Threshold vs. Temperature http://onsemi.com 5 NCP629 TYPICAL CHARACTERISTICS 160 IGND, GROUND CURRENT (mA) 155 150 145 140 135 130 125 120 115 110 -40 -20 0 Vout = 1.5 V Iout = 150 mA ENABLE = 0.9 V 20 40 60 80 100 120 Iout = 1.0 mA Vout = 5.0 V Iout = 150 mA Iout = 1.0 mA 6.0 IDIS, DISABLE CURRENT (mA) 5.0 4.0 3.0 2.0 ENABLE = 0 V 1.0 0 -40 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 13. Ground Current (Sleep Mode) vs. Temperature 160 IGND, GROUND CURRENT (mA) 1.5 V 120 1.8 V 100 80 60 40 20 0 0 1.0 2.0 3.0 4.0 5.0 6.0 Vin, INPUT VOLTAGE (V) IGND, GROUND CURRENT (mA) 140 2.8 V 3.0 V 3.3 V 5.0 V 137 136 135 134 133 132 131 130 129 128 127 0 Figure 14. Ground Current (Run Mode) vs. Temperature Vout = 1.5 V Vin = 2.0 V 25 50 75 100 125 150 Iout, OUTPUT CURRENT (mA) Figure 15. Ground Current vs. Input Voltage Figure 16. Ground Current vs. Output Current http://onsemi.com 6 NCP629 TYPICAL CHARACTERISTICS Isc, OUTPUT SHORT CIRCUIT CURRENT (mA) 650 ILIM, CURRENT LIMIT (mA) 700 600 500 400 300 200 100 0 0 20 40 60 80 100 120 0 1.0 2.0 3.0 4.0 5.0 6.0 TA, AMBIENT TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) 600 550 500 450 -40 -20 Figure 17. Output Short Circuit Current vs. Temperature Regload, LOAD REGULATION (mV) 4.0 Regline, LINE REGULATION (mV) 5.0 Figure 18. Current Limit vs. Input Voltage 3.0 4.0 3.0 2.0 2.0 1.0 Vin = (Vout + 0.5 V) to 6.0 V Iout = 1.0 mA 0 -40 -20 0 20 40 60 80 100 120 1.0 Iout = 1.0 mA to 150 mA 0 -40 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 19. Line Regulation vs. Temperature 45 OUTPUT TURN ON TIME (mS) 40 35 30 25 3.0 V 20 15 10 -40 -20 0 20 40 60 80 100 120 1.5 V PSRR (dB) 5.0 V 80 70 60 Figure 20. Load Regulation vs. Temperature 1.5 V 3.3 V 50 40 30 20 10 0 Vin = Vout + 1.0 V Vripple = 0.5 Vp-p Cout = 1.0 mF Iout = 1.0 mA to 150 mA 0.1 1.0 10 100 5.0 V TA, AMBIENT TEMPERATURE (°C) f, FREQUENCY (kHz) Figure 21. Output Turn On Time vs. Temperature Figure 22. Power Supply Ripple Rejection vs. Frequency http://onsemi.com 7 NCP629 TYPICAL CHARACTERISTICS 10 OUTPUT CAPACITOR ESR (W) Vout = 5.0 V Vout = 1.5 V Unstable Region 1.0 Stable Region 0.1 Cout = 1.0 mF to 10 mF TA = -40°C to 125°C Vin = up to 6.0 V 0 25 50 75 100 125 150 0.01 Iout, OUTPUT CURRENT (mA) Figure 23. Output Stability with Output Capacitor ESR over Output Current Vout = 1.5 V Figure 24. Load Transient Response (1.0 mF) Vout = 1.5 V Figure 25. Load Transient Response (10 mF) http://onsemi.com 8 NCP629 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output load current at a constant temperature. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Output Noise Voltage The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average junction temperature is not significantly affected. Line Transient Response Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope. Load Transient Response This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results are expressed in mVrms or nV/√Hz. Disable and Ground Current Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between low-load and high-load conditions. Thermal Protection Ground Current (IGND) is the current that flows through the ground pin when the regulator operates with a load on its output. This consists of internal IC operation, bias, etc. It is actually the difference between the input current (measured through the LDO input pin) and the output load current. If the regulator has an input pin that reduces its internal bias and shuts off the output (enable/disable function), this term is called the disable current (IDIS.) Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Package Power Dissipation The power dissipation level at which the junction temperature reaches its maximum operating value. APPLICATIONS INFORMATION The NCP629 series regulator is self-protected with internal thermal shutdown and internal current limit. Typical application circuit is shown in Figure 1. Input Decoupling (Cin) A ceramic or tantalum 1.0 mF capacitor is recommended and should be connected close to the NCP629 package. Higher capacitance and lower ESR will improve the overall line transient response. The NCP629 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Typical characteristics were measured with Murata ceramic capacitors GRM31MR71E105KA01 (1.0 mF, 25 V X7R, 1206). Larger values improve noise rejection and load regulation transient response. Figure 23 shows the stability region for a range of operating conditions and ESR values. No-Load Regulation Considerations Output Decoupling (Cout) The NCP629 contains an overshoot clamp circuit to improve transient response during a load current step release. When output voltage exceeds the nominal by approximately 20 mV, this circuit becomes active and clamps the output from further voltage increase. Tying the ENABLE pin to Vin will ensure that the part is active whenever the supply voltage is present, thus guaranteeing that the clamp circuit is active whenever leakage current is present. http://onsemi.com 9 NCP629 Noise Decoupling The NCP629 is a low noise regulator and needs no external noise reduction capacitor. Unlike other low noise regulators which require an external capacitor and have slow startup times, the NCP629 operates without a noise reduction capacitor, has a typical 15 ms startup delay and achieves a 50 mVrms overall noise level between 10 Hz and 100 kHz. Enable Operation The power dissipated by the NCP629 can be calculated from the following equations: P D [ V in I GND @ I out ) I out V in * V out (eq. 2) or Vin(MAX) [ PD(MAX) ) (Vout Iout) Iout ) IGND (eq. 3) RthJA, THERMAL RESISTANCE JUNCTION-TO-AMBIENT (°C/W) The enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. The turn-on/turn-off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable function is not to be used then the pin should be connected to Vin. Thermal 340 320 300 (1 oz) 280 260 (2 oz) 240 220 200 0 100 200 300 400 500 PCB COPPER AREA (mm2) 600 700 As power in the NCP629 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCP629 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCP629 can handle is given by: PD(MAX) + TJ(MAX) * TA RqJA (eq. 1) Figure 26. RthJA vs. PCB Copper Area Since TJ is not recommended to exceed 125_C, then the NCP629 soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 360 mW when the ambient temperature (TA) is 25_C. See Figure 26 for RthJA versus PCB area. Hints Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCP629, and make traces as short as possible. DEVICE ORDERING INFORMATION Device NCP629FC15T2G NCP629FC18T2G NCP629FC28T2G NCP629FC30T2G NCP629FC33T2G NCP629FC35T2G NCP629FC50T2G Version 1.5 V 1.8 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Marking Code AAA AAC AAD AAE AAF AAG AAH 5 Pin Flip-Chip 3000/Tape & Reel Package Shipping† †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NCP629 PACKAGE DIMENSIONS 5 PIN FLIP-CHIP CASE 499AY-01 ISSUE O 4X E 0.10 C A B 0.10 C 0.05 C 1 5X b 2 3 0.05 C A B 0.05 C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT:  Literature Distribution Center for ON Semiconductor  P.O. Box 5163, Denver, Colorado 80217 USA  Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free  USA/Canada Europe, Middle East and Africa Technical Support:  Phone: 421 33 790 2910 Japan Customer Focus Center  Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative È È A2 e2 e1 A B C TERMINAL A1 LOCATOR D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A A1 A2 b D E e1 e2 MILLIMETERS MIN NOM MAX 0.475 0.530 0.585 0.170 0.200 0.230 0.305 0.330 0.355 0.220 0.250 0.270 1.028 BSC 1.190 BSC 0.250 BSC 0.410 BSC A1 A C SEATING PLANE SOLDERING FOOTPRINT* 0.82 0.41 0.50 0.25 0.25 DIMENSIONS: MILLIMETERS 5X *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 NCP629/D