NCP629FC15T2G

NCP629 High Performance CMOS LDO Regulator with Enable and Enhanced ESD Protection in Chip Scale Package (CSP) The NCP629 provides 150 mA of output current at fixed voltage options. It is designed for portable battery powered applications and offers high performance features such as low power operation, fast enable response time, and low dropout. The device is designed to be used with low cost ceramic capacitors. Features •Output Voltage Options: 1.5 V, 1.8 V, 2.8 V, 3.0 V, 3.3 V, 3.5 V, 5.0 V •Ultra-Low Dropout Voltage of 150 mV at 150 mA •Fast Enable Turn-on Time of 15 ms •Wide Supply Voltage Operating Range •Supports sub-1 V Enable Threshold •Excellent Line and Load Regulation •High Accuracy up to 2% Output Voltage Tolerance over All Operating Conditions •Typical Noise Voltage of 50 mVrms without a Bypass Capacitor •Ultra Small CSP Footprint and Height: 1.028 x 1.19 mm, Max Height 0.6 mm •Enhanced ESD Protection (HBM 3.5 kV, MM 400 V) •These are Pb-Free Devices http://onsemi.com MARKING DIAGRAM XXXG AYWW 5 PIN FLIP-CHIP CASE 499AY XXX A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package PIN CONNECTIONS A3 C3 ÍÍÍ ÍÍÍ A1 B2 C1 (Top View) Typical Applications •Personal Electronics (MP3 Players) •Portable Devices (Cellular Phones) •Noise Sensitive Circuits – VCO, RF Stages, etc. •Camcorders and Cameras A3 C3 C1 B2 A1 = ENABLE = Vin = Vout = NC = GND (substrate) ORDERING INFORMATION Vin Vout NCP629 ENABLE Vin Cin GND Vout See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Cout Figure 1. Typical Application Circuit © Semiconductor Components Industries, LLC, 2008 February, 2008 - Rev. 1 1 Publication Order Number: NCP629/D NCP629 Vin Vout Driver with Current Limit + - Vref Thermal Shutdown GND ENABLE Figure 2. Simplified Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name C3 Vin A1 GND A3 ENABLE Description Positive Power Supply Input Power Supply Ground; Device Substrate The Enable Input places the device into low-power standby when pulled to logic low (< 0.4 V). Connect to Vin if the function is not used. B2 NC No Connection C1 Vout Regulated Output Voltage ABSOLUTE MAXIMUM RATINGS Symbol Value Unit Input Voltage Range (Note 1) Rating Vin -0.3 to 6.5 V Output Voltage Range Vout -0.3 to 6.5 (or Vin + 0.3) Whichever is Lower V ENABLE -0.3 to 6.5 (or Vin + 0.3) Whichever is Lower V TJ(max) 150 °C TSTG -65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 3500 V ESD Capability, Machine Model (Note 2) ESDMM 400 V MSL MSL1/260 - Enable Input Range Maximum Junction Temperature Storage Temperature Range Moisture Sensitivity Level Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Thermal Characteristics (Note 3) Thermal Resistance, Junction-to-Air (Note 4) Value Unit °C/W RqJA 277 3. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 4. Values based on copper area of 645 mm2, 1 oz copper thickness. OPERATING RANGES (Note 5) Symbol Min Max Operating Input Voltage (Note 6) Rating Vin 1.5 6 V Output Current Iout 0 150 mA Ambient Temperature TA -40 125 °C 5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 6. Minimum Vin = 1.5 V or (Vout + VDO), whichever is higher. http://onsemi.com 2 Unit NCP629 ELECTRICAL CHARACTERISTICS (Vin = Vout + 0.5 V, Cin = Cout =1.0 mF, for typical values TA = 25°C, for min/max values TA = -40°C to 125°C; unless otherwise noted.) (Note 7) Parameter Test Conditions Symbol Output Voltage 1.5 V 1.8 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Iout = 1.0 mA to 150 mA Vin = (Vout + 0.5 V) to 6.0 V Vout Power Supply Ripple Rejection (Note 8) (Vin = Vout + 1.0 V + 0.5 Vp-p) Iout = 1.0 mA to 150 mA f = 120 Hz f = 1.0 kHz f = 10 kHz PSRR Line Regulation Vin = (Vout + 0.5 V) to 6.0 V, Iout = 1.0 mA Regline Load Regulation 1.5 V 1.8 V 2.8 V to 5.0 V Iout = 1.0 mA to 150 mA Regload Output Noise Voltage (Note 8) Vout = 1.5 V, f = 10 Hz to 100 kHz Output Short Circuit Current Vout = 0 V Dropout Voltage 1.5 V 1.8 V 2.8 V to 5.0 V Measured at: Vout – 2.0% Iout = 150 mA VDO Disable Current ENABLE = 0 V, Vin = 6 V -40°C ≤ TA ≤ 85°C IDIS Ground Current 1.5 V 1.8 V to 3.0 V 3.3 V to 5.0 V ENABLE = 0.9 V, Iout = 1.0 mA to 150 mA IGND Min Typ Max Unit Regulator Output V 1.470 1.764 2.744 2.940 3.234 3.430 4.900 (-2%) 1.530 1.836 2.856 3.060 3.366 3.570 5.100 (+2%) dB - 62 55 38 - - 1.0 10 - 2.0 2.0 2.0 20 25 30 Vn - 50 - mVrms Isc 300 550 800 mA - 150 125 75 225 175 125 - 0.01 1.0 - 135 140 145 170 175 180 mV mV mV General mA mA Thermal Shutdown Temperature (Note 8) TSD - 175 - °C Thermal Shutdown Hysteresis (Note 8) TSH - 10 - °C Chip Enable ENABLE Input Threshold Voltage V Vth(EN) Voltage Increasing, Logic High 0.9 - - Voltage Decreasing, Logic Low - - 0.4 - 3.0 100 - 15 30 25 50 Enable Input Bias Current (Note 8) IEN nA Timing Output Turn On Time 1.5 V to 3.5 V 5.0 V ENABLE = 0 V to Vin ms ton 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA = 25 °C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. Values based on design and/or characterization. http://onsemi.com 3 NCP629 TYPICAL CHARACTERISTICS 1.500 1.500 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) Iout = 1.0 mA 1.495 1.490 Iout = 150 mA 1.485 1.480 1.475 -40 -15 10 35 60 85 1.490 Iout = 150 mA 1.485 1.480 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature (1.5 V Fixed Output, Vin = 2 V) Figure 4. Output Voltage vs. Temperature (1.5 V Fixed Output, Vin = 6 V) 3.005 Iout = 1.0 mA 3.000 2.995 Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 1.495 1.475 -40 110 125 3.005 Iout = 150 mA 2.990 2.985 2.980 2.975 -40 Iout = 1.0 mA -15 10 35 60 85 110 125 Iout = 1.0 mA 3.000 2.995 2.990 Iout = 150 mA 2.985 2.980 2.975 2.970 -40 TA, AMBIENT TEMPERATURE (°C) -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) Figure 5. Output Voltage vs. Temperature (3.0 V Fixed Output, Vin = 3.5 V) Figure 6. Output Voltage vs. Temperature (3.0 V Fixed Output, Vin = 6 V) http://onsemi.com 4 NCP629 TYPICAL CHARACTERISTICS 5.000 Iout = 1.0 mA Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 5.000 4.995 4.990 Iout = 150 mA 4.985 4.980 4.975 Iout = 1.0 mA 4.995 4.990 4.985 Iout = 150 mA 4.980 4.975 4.970 4.970 4.965 -40 -15 10 35 60 110 125 85 4.965 -40 -15 TA, AMBIENT TEMPERATURE (°C) 60 85 110 125 Figure 8. Output Voltage vs. Temperature (5.0 V Fixed Output, Vin = 6 V) 250 250 VDO, DROPOUT VOLTAGE (mV) Vout = 1.5 V 200 Iout = 150 mA 150 Iout = 100 mA 100 Iout = 50 mA 50 Iout = 1 mA 0 -40 -20 0 20 40 60 80 100 Iout = 150 mA 200 Vout = 1.5 V 150 Vout = 3.0 V 100 50 Vout = 5.0 V 0 -40 -20 120 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 9. Dropout Voltage vs. Temperature (Over Current Range) Figure 10. Dropout Voltage vs. Temperature (Over Output Voltage) 800 6.0 5.5 5.0 Iout = 0 mA Cout = 1.0 mF TA = 25°C ENABLE = Vin 4.5 4.0 Vth(en), ENABLE THRESHOLD (mV) VDO, DROPOUT VOLTAGE (mV) 35 TA, AMBIENT TEMPERATURE (°C) Figure 7. Output Voltage vs. Temperature (5.0 V Fixed Output, Vin = 5.5 V) Vout, OUTPUT VOLTAGE (V) 10 5.0 V 3.3 V 3.0 V 3.5 3.0 2.80 V 2.5 2.0 1.80 V 1.5 V 1.5 1.0 0.5 0 0 1.0 2.0 3.0 4.0 5.0 6.0 750 Enable Increasing 700 Enable Decreasing 650 Vin = 5.5 V 600 -40 -15 10 35 60 85 110 125 Vin, INPUT VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C) Figure 11. Output Voltage vs. Input Voltage Figure 12. Enable Threshold vs. Temperature http://onsemi.com 5 NCP629 TYPICAL CHARACTERISTICS 160 IGND, GROUND CURRENT (mA) IDIS, DISABLE CURRENT (mA) 6.0 5.0 4.0 3.0 2.0 ENABLE = 0 V 1.0 0 -40 -15 10 35 60 85 110 Iout = 1.0 mA 150 Vout = 5.0 V 145 Iout = 150 mA 140 135 Iout = 1.0 mA 130 125 Vout = 1.5 V 120 Iout = 150 mA 115 ENABLE = 0.9 V 110 -40 125 -20 0 20 40 60 100 80 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 13. Ground Current (Sleep Mode) vs. Temperature Figure 14. Ground Current (Run Mode) vs. Temperature 120 137 160 2.8 V 140 3.0 V 1.5 V IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) 155 5.0 V 3.3 V 120 1.8 V 100 80 60 40 20 Vout = 1.5 V Vin = 2.0 V 136 135 134 133 132 131 130 129 128 127 0 0 1.0 2.0 3.0 4.0 5.0 0 6.0 25 50 75 100 125 150 Vin, INPUT VOLTAGE (V) Iout, OUTPUT CURRENT (mA) Figure 15. Ground Current vs. Input Voltage Figure 16. Ground Current vs. Output Current http://onsemi.com 6 NCP629 700 650 ILIM, CURRENT LIMIT (mA) Isc, OUTPUT SHORT CIRCUIT CURRENT (mA) TYPICAL CHARACTERISTICS 600 550 500 450 -40 -20 400 300 200 100 20 40 60 80 100 0 120 1.0 2.0 3.0 5.0 4.0 TA, AMBIENT TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 17. Output Short Circuit Current vs. Temperature Figure 18. Current Limit vs. Input Voltage Regload, LOAD REGULATION (mV) 3.0 2.0 1.0 Vin = (Vout + 0.5 V) to 6.0 V Iout = 1.0 mA 0 -40 -20 0 20 40 60 80 100 120 6.0 5.0 4.0 3.0 2.0 1.0 Iout = 1.0 mA to 150 mA 0 -40 -15 10 35 60 85 110 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 19. Line Regulation vs. Temperature Figure 20. Load Regulation vs. Temperature 45 80 40 70 1.5 V 60 35 3.3 V 5.0 V PSRR (dB) Regline, LINE REGULATION (mV) 500 0 0 4.0 OUTPUT TURN ON TIME (mS) 600 30 25 3.0 V 20 1.5 V 50 40 5.0 V 30 Vin = Vout + 1.0 V Vripple = 0.5 Vp-p Cout = 1.0 mF Iout = 1.0 mA to 150 mA 20 15 10 10 -40 -20 0 0 20 40 60 80 100 120 0.1 1.0 10 100 TA, AMBIENT TEMPERATURE (°C) f, FREQUENCY (kHz) Figure 21. Output Turn On Time vs. Temperature Figure 22. Power Supply Ripple Rejection vs. Frequency http://onsemi.com 7 NCP629 TYPICAL CHARACTERISTICS OUTPUT CAPACITOR ESR (W) 10 Vout = 5.0 V Unstable Region Vout = 1.5 V 1.0 Stable Region 0.1 Cout = 1.0 mF to 10 mF TA = -40°C to 125°C Vin = up to 6.0 V 0.01 0 25 50 75 100 125 150 Iout, OUTPUT CURRENT (mA) Figure 23. Output Stability with Output Capacitor ESR over Output Current Vout = 1.5 V Figure 24. Load Transient Response (1.0 mF) Vout = 1.5 V Figure 25. Load Transient Response (10 mF) http://onsemi.com 8 NCP629 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output load current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average junction temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope. Output Noise Voltage Load Transient Response This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results are expressed in mVrms or nV/√Hz. Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between low-load and high-load conditions. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Disable and Ground Current Ground Current (IGND) is the current that flows through the ground pin when the regulator operates with a load on its output. This consists of internal IC operation, bias, etc. It is actually the difference between the input current (measured through the LDO input pin) and the output load current. If the regulator has an input pin that reduces its internal bias and shuts off the output (enable/disable function), this term is called the disable current (IDIS.) Maximum Package Power Dissipation The power dissipation level at which the junction temperature reaches its maximum operating value. APPLICATIONS INFORMATION The NCP629 series regulator is self-protected with internal thermal shutdown and internal current limit. Typical application circuit is shown in Figure 1. characteristics were measured with Murata ceramic capacitors GRM31MR71E105KA01 (1.0 mF, 25 V X7R, 1206). Larger values improve noise rejection and load regulation transient response. Figure 23 shows the stability region for a range of operating conditions and ESR values. Input Decoupling (Cin) A ceramic or tantalum 1.0 mF capacitor is recommended and should be connected close to the NCP629 package. Higher capacitance and lower ESR will improve the overall line transient response. No-Load Regulation Considerations The NCP629 contains an overshoot clamp circuit to improve transient response during a load current step release. When output voltage exceeds the nominal by approximately 20 mV, this circuit becomes active and clamps the output from further voltage increase. Tying the ENABLE pin to Vin will ensure that the part is active whenever the supply voltage is present, thus guaranteeing that the clamp circuit is active whenever leakage current is present. Output Decoupling (Cout) The NCP629 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Typical http://onsemi.com 9 NCP629 Noise Decoupling The power dissipated by the NCP629 can be calculated from the following equations: The NCP629 is a low noise regulator and needs no external noise reduction capacitor. Unlike other low noise regulators which require an external capacitor and have slow startup times, the NCP629 operates without a noise reduction capacitor, has a typical 15 ms startup delay and achieves a 50 mVrms overall noise level between 10 Hz and 100 kHz. P D [ V inǒI GND@I outǓ ) I outǒV in * V outǓ (eq. 2) or Vin(MAX) [ PD(MAX) ) (Vout Iout) Iout ) IGND (eq. 3) Enable Operation RthJA, THERMAL RESISTANCE JUNCTION-TO-AMBIENT (°C/W) The enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. The turn-on/turn-off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable function is not to be used then the pin should be connected to Vin. Thermal As power in the NCP629 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCP629 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCP629 can handle is given by: PD(MAX) + TJ(MAX) * TA RqJA (eq. 1) Since TJ is not recommended to exceed 125_C, then the NCP629 soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 360 mW when the ambient temperature (TA) is 25_C. See Figure 26 for RthJA versus PCB area. 340 320 300 (1 oz) 280 260 (2 oz) 240 220 200 0 100 200 300 400 500 PCB COPPER AREA (mm2) 600 700 Figure 26. RthJA vs. PCB Copper Area Hints Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCP629, and make traces as short as possible. DEVICE ORDERING INFORMATION Device Version Marking Code NCP629FC15T2G 1.5 V AAA NCP629FC18T2G 1.8 V AAC NCP629FC28T2G 2.8 V AAD NCP629FC30T2G 3.0 V AAE NCP629FC33T2G 3.3 V AAF NCP629FC35T2G 3.5 V AAG NCP629FC50T2G 5.0 V AAH Package Shipping† 5 Pin Flip-Chip 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 5 PIN FLIP−CHIP CASE 499AY−01 ISSUE O DATE 06 JUN 2007 SCALE 4:1 E 4X 0.10 C TERMINAL A1 LOCATOR A ÈÈ ÈÈ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B D DIM A A1 A2 b D E e1 e2 A1 0.10 C A2 0.05 C A C MILLIMETERS MIN NOM MAX 0.475 0.530 0.585 0.170 0.200 0.230 0.305 0.330 0.355 0.220 0.250 0.270 1.028 BSC 1.190 BSC 0.250 BSC 0.410 BSC SOLDERING FOOTPRINT* SEATING PLANE 0.82 e2 0.41 1 5X b 0.05 C A B 0.05 C 2 3 0.25 e1 A B 0.50 C 5X 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON24677D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 5 PIN FLIP−CHIP, 1.028X1.190 PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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