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NCP81141MNTXG

NCP81141MNTXG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    QFN28_EP

  • 描述:

    ICREGVRCTLR1PHASE28QFN

  • 数据手册
  • 价格&库存
NCP81141MNTXG 数据手册
NCP81141 Single-Phase Controller with SVID Interface for Desktop and Notebook CPU Applications The NCP81141 Single−Phase buck solution is optimized for Intel VR12.6 compatible CPUs. The controller combines true differential voltage sensing, differential inductor DCR current sensing, input voltage feed−forward, and adaptive voltage positioning to provide accurately regulated power for both Desktop and Notebook applications. The single phase controller uses DCR current sensing providing the fastest initial response to dynamic load events at reduced system cost. The NCP81141 incorporates an internal MOSFET driver for improved system efficiency. High performance operational error amplifiers are provided to simplify compensation of the system. Patented Dynamic Reference Injection further simplifies loop compensation by eliminating the need to compromise between closed−loop transient response and Dynamic VID performance. Patented Total Current Summing provides highly accurate digital current monitoring. www.onsemi.com MARKING DIAGRAM 1 QFN28 CASE 485AR A L Y W G NCP 81141 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Features • • • • • • • • • • • • • • Meets Intel™ VR12.6 Specifications High Performance Operational Error Amplifier Digital Soft Start Ramp Dynamic Reference Injection “Lossless” DCR Current Sensing Adaptive Voltage Positioning (AVP) Switching Frequency Range of 250 kHz – 1 MHz VIN Range 4.5 V − 25 V Startup into Pre−Charged Load While Avoiding False OVP Vin Feed Forward Ramp Slope Over Voltage Protection (OVP) and Under Voltage Protection (UVP) Over Current Protection (OCP) VR−RDY Output with Internal Delays These Devices are Pb−Free and are RoHS Compliant See detailed ordering and shipping information in the package dimensions section on page 21 of this data sheet. Applications • Desktop and Notebook Processors © Semiconductor Components Industries, LLC, 2015 September, 2015 − Rev. 2 1 Publication Order Number: NCP81141/D NCP81141 NCP81141 Figure 1. Block Diagram for NCP81141 www.onsemi.com 2 C94 0.1uF J29 J27 2 100 R48 place close to L1 R32 8.25K TSENSE 2 0.0 1 R3 1 2PIN 2 1 0.0 2 R2 1 J13 100 2 R34 1 2 2 2 ILIM J8 J23 1 1 D NP 1 R 158 2 R156 54.9 1 D NP 1 R 159 2 R155 64.9 1 {4} 75 R157 1 D NP 1 1 R18 13.7K J42 C155 1.5nF 2.1K 2 VSP {4} C 51 1nF R 68 {4} 7 1 220K R T130 R131 75.0K 1 1 place close to L1 C 156 560pF J45 {4} VR_RD Y {4} ENABLE J47 U16A N L37W Z07 510pF C67 VSN SER_EN R187 390 +5V_IN SDIO {5} SCLK {5} ALERT# {5} V _1P05_V CCP J1 5PIN 1 2 SER_VR _RD Y 2 1 8 4 2 1 J26 J61 J63 J62 1 V5S 1 1 1 1 2 1 CSSUM R140 1 BST1 H G1 SW1 LG1 105K 2 C79 1uF R71 2 2 2 26.1K 2 C61 0.1uF J56 1 R 38 1 VR_HOT SDIO ALERT# SC LK VR_RDY {4} VR_HOT R132 165K C86 1uF 1 2 SER_EN VSENSE R125 0.0 JP5 ETCH RT126 100K VCC U {5} VCC _SEN SE {5} VSS_SEN SE 1 1 3 5 7 9 11 13 15 17 19 1 2 2 1 1 2 R 160 2 2 1 J19 SW1 LG1 BST1 VSP VSN IOU T ROSC COMP FB DIFFOUT CSCOMP ILIM 1 1 2 3 4 5 6 7 29 28 27 26 25 24 23 22 SW N1 CSP1 CSREF H G1 EN ABLE VR HOT SD IO ALER T SC LK VR _R DY VR MP U6 NCP81141 {3} 1 J11 R4 10nF C 82 VRMP VBOOT R184 30.1K ILIM IOUT C SC OMP CSSUM CSR EF IMAX PVCC EPAD VCC VSP VSN DIFF OUT FB C OMP R OSC 2 4 6 8 10 12 14 16 18 20 1 2 0.0 VD C 1 R40 1.0K 15 16 17 18 19 20 21 2 C SN 1 {3} VCC3 V5S CSREF CSSUM J28 4.7uF C31 R 189 100k 1 2 1 TSENSE J32 R154 50k J39 1 DIFFOUT 1 2 V_1P05_V CCP 1 2 C56 1nF 1.00K 2 1 ROSC R37 1 R 50 49.9 J40 2 1 FB J59 20PIN 2R OW 1 1 2 2 1 1 1 2 C SC OMP 2 BST HG SW PGN D LG T SENSE VBOOT 8 9 10 11 12 13 14 1 2 Figure 2. Controller Application Schematic 1 3 1 www.onsemi.com 2 J2 5PIN 2 R 43 3.01K 1 C 57 1 2 10pF 1 J41 NCP81141 C OMP LG1 SW1 HG1 0.0 2 1 2 C185 22uF C212 22uF C42 22uF LG1 SW1 HG1 4 C186 22uF C213 22uF C43 22uF Q4 NTMFS4852N 4 DRVL1 TP17 TP14 DRVH1 C4 0.22uF 1 R164 1 C187 22uF C226 22uF C210 22uF 3 2 1 BST1 1 2 1 2 1 2 1 1 2 1 2 1 2 1 2 1 2 1 C188 22uF C227 22uF C45 22uF C189 22uF C176 22uF C46 22uF C190 22uF C177 22uF C47 22uF 1 C191 22uF C183 22uF C50 22uF SW1 TP8 C101 1nF 1 1 C2 10uF C192 22uF C184 22uF C222 22uF C193 22uF L1 560nH MCP1040LR56C 1 2 C1 10uF 1 2 1 5 6 7 8 3 2 1 5 6 7 8 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 C194 22uF C3 10uF 1 2 VCCU dnp + C218 ETCH 2 JP14 1 VCCU ETCH 2 C201 10uF JP13 1 VDC 1 2 1 2 1 2 1 2 1 2 dnp + C219 SWN1 {2} CSN1 {2} 1 2 2 1 2 1 2 1 2 1 2 2 1 2 Figure 3. Power Stage Typical Schematic 2 dnp + C220 1 2 4 dnp + C223 1 2 www.onsemi.com dnp + C211 1 2 Q2 NTMFS4821N DNP + C208 NCP81141 VCC VSP VSN DIFFOUT FB COMP ROSC NCP81141 28 27 26 25 24 23 22 ENABLE 1 21 ILIM VR_HOT 2 20 IOUT SDIO 3 19 CSCOMP 18 CSSUM NCP81141 ALERT 4 TAB: GROUND IMAX VRMP 7 15 PVCC 8 9 10 11 12 13 14 VBOOT 16 TSENSE 6 LG VR_RDY PGND CSREF SW 17 HG 5 BST SCLK Figure 4. NCP81141 Pin Configurations NCP81141 SINGLE ROW PIN DESCRIPTIONS Pin No. Symbol 1 ENABLE 2 VR_HOT# 3 SDIO 4 ALERT# Description Logic input. Logic high enables both outputs and logic low disables both outputs Thermal logic output for over temperature Serial VID data interface Serial VID ALERT# 5 SCLK 6 VR_RDY Serial VID clock 7 VRMP 8 BST High−Side bootstrap supply for phase 1 9 HG High side gate driver output for phase 1 10 SW Current return for high side gate driver 1 11 PGND 12 LG 13 TSENSE Temp Sense input for the single phase converter 14 VBOOT An input pin to adjust the boot−up voltage. During start up it is used to program VBOOT with a resistor to ground 15 PVCC Power Supply for gate driver, recommended decoupling 2.2 mF 16 IMAX Imax Input Pin. During start up it is used to program IMAX with a resistor to ground 17 CSREF Total output current sense amplifier reference voltage input 18 CSSUM Inverting input of total current sense amplifier 19 CSCOMP 20 IOUT Total output current monitor 21 ILIM Over current shutdown threshold setting. Resistor to CSCOMP to set threshold Open drain output. High indicates that the output is regulating Feed−forward input of Vin for the ramp slope compensation. The current fed into this pin is used to control the ramp of PWM slope Power Ground for gate driver Low−Side gate driver output for phase 1 Output of total current sense amplifier www.onsemi.com 5 NCP81141 NCP81141 SINGLE ROW PIN DESCRIPTIONS Pin No. Symbol Description 22 ROSC A resistance from this pin to ground programs the oscillator frequency 23 COMP Output of the error amplifier and the inverting input of the PWM comparator 24 FB 25 DIFFOUT 26 VSN Inverting input to differential remote sense amplifier 27 VSP Non−inverting input to the differential remote sense amplifier 28 VCC Power for the internal control circuits. A decoupling capacitor is connected from this pin to ground 29 FLAG/GND Error amplifier voltage feedback Output of the differential remote sense amplifier www.onsemi.com 6 NCP81141 ABSOLUTE MAXIMUM RATINGS ELECTRICAL INFORMATION Pin Symbol VMAX VMIN COMP VCC + 0.3 V −0.3 V CSCOMP VCC + 0.3 V −0.3 V VSN GND + 300 mV GND – 300 mV DIFFOUT VCC + 0.3 V −0.3 V VR_RDY VCC + 0.3 V −0.3 V VCC 6.5 V −0.3 V ROSC VCC + 0.3 V −0.3 V IOUT 2.0 V −0.3 V VRMP +25 V −0.3 V SW 35 V 40 V ≤ 50 ns −5 V −10 V ≤ 200 ns BST 35 V wrt/ GND 40 V ≤ 50 ns wrt/GND 6.5 V wrt/ SW −0.3 V wrt/SW LG VCC + 0.3 V −0.3 V −5 V ≤ 200 ns HG BST + 0.3 V −0.3 V wrt/ SW −2 V ≤ 200 ns wrt/SW All Other Pins VCC + 0.3 V −0.3 V *All signals referenced to GND unless noted otherwise. THERMAL INFORMATION Description Thermal Characteristic QFN Package (Note 1) Operating Junction Temperature Range (Note 2) Symbol Typ Unit RqJA 68 °C/W TJ −40 to +125 °C −40 to +100 °C °C Operating Ambient Temperature Range Maximum Storage Temperature Range TSTG −40 to +150 Moisture Sensitivity Level QFN Package MSL 1 *The maximum package power dissipation must be observed. 1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM 2. JESD 51−7 (1S2P Direct−Attach Method) with 0 LFM www.onsemi.com 7 NCP81141 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min @ 1.3 V −21 Typ Max Unit 21 mA ERROR AMPLIFIER Input Bias Current Open Loop DC Gain CL = 20 pF to GND, RL = 10 kW to GND 80 dB Open Loop Unity Gain Bandwidth CL = 20 pF to GND, RL = 10 kW to GND 20 MHz DVin = 100 mV, G = −10 V/V, DVout = 1.5 V – 2.5 V, CL = 20 pF to GND, DC Load = 10k to GND 25 V/ms Slew Rate Maximum Output Voltage Minimum Output Voltage ISOURCE = 2.0 mA 3.5 V ISINK = 2.0 mA 1 V −12 12 mA VSP Input Voltage Range −0.3 3.0 V VSN Input Voltage Range −0.3 0.3 V DIFFERENTIAL SUMMING AMPLIFIER Input Bias Current −3dB Bandwidth Closed Loop DC gain VSP, CSREF = 1.3 V CL = 20 pF to GND, RL = 10 kW to GND VS+ to VS− = 0.5 to 1.3 V 10 MHz 1.0 V/V CURRENT SUMMING AMPLIFIER Offset Voltage (Vos), (Note 3) Input Bias Current CSSUM = CSREF = 1 V −300 300 mV −7.5 7.5 nA Open Loop Gain Current Sense Unity Gain Bandwidth CL = 20 pF to GND, RL = 10 kW to GND 80 dB 10 MHz INPUT SUPPLY 5.25 V EN = high, PS0, PS1 Mode 4.75 15 18 mA EN = high, PS3 Mode 8.0 12 mA 200 mA Supply Voltage Range VCC Quiescent Current EN = high, PS4 Mode (@ 25°C) EN = low VCC rising UVLO Threshold VCC falling 4.5 4.0 VCC UVLO Hysteresis VRMP falling V V 160 VRMP rising UVLO Threshold mA 50 mV 4.1 3.0 V V DAC SLEW RATE Soft Start Slew Rate Fast_SR/4 mV/ms Slew Rate Slow Fast_SR/2 Fast_SR/4 Fast_SR/8 Fast_SR/16 mV/ms Slew Rate Fast 48 mV/ms 3. Guaranteed by design or characterization data, not in production test. www.onsemi.com 8 NCP81141 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min Typ Max Unit 1.0 mA ENABLE INPUT Enable High Input Leakage Current Upper Threshold External 1k pull−up to 3.3 V VUPPER Lower Threshold VLOWER Total Hysteresis VUPPER – VLOWER 0.8 V 0.3 90 V mV IOUT OUTPUT Input Referred Offset Voltage Output Source Current Current Gain Ilimit to CSREF −5.5 Ilimit sink current = 80 mA (IOUTCURRENT ) / (ILIMITCURRENT), RILIM = 20k, RIOUT = 5.0k , DAC = 0.8 V, 1.25 V, 1.52 V 9.75 10 5.5 mV 850 mA 10.25 OSCILLATOR 250 Switching Frequency Range 1200 kHz ZERO CURRENT DETECT (ZCD) ZCD threshold, DCM detection SW wrt PGND −0.5 mV 2.9 V OUTPUT OVER VOLTAGE & UNDER VOLTAGE PROTECTION (OVP & UVP) Absolute Over Voltage Threshold During Soft Start CSREF Over Voltage Threshold Above DAC VSP rising Over Voltage Delay VSP rising Under Voltage Protection VCC rising 250 300 350 mV VCC falling 255 300 325 mV Under Voltage Delay 350 400 440 50 Ckt in development mV ns ms 5 OVERCURRENT PROTECTION ILIM Threshold Current (OCP shutdown after 50 ms delay) (PS0) Rlim = 20k 9.0 10 11.0 mA ILIM Threshold Current (immediate OCP shutdown) (PS0) Rlim = 20k 13.5 15 16.5 mA ILIM Threshold Current (OCP shutdown after 50 ms delay) ILIM Threshold Current (immediate OCP shutdown) (PS1, PS2, PS3) Rlim = 20k 10 mA (PS1, PS2, PS3) Rlim = 20k, PS0 mode 15 mA VR_HOT# Output Low Voltage Output Leakage Current I_VRHOT = −4 mA High Impedance State −1.0 0.3 V 1.0 mA TSENSE Alert# Assert Threshold 491 mV Alert# De−assert Threshold 513 mV VRHOT Assert Threshold 472 mV VRHOT Rising Threshold 494 mV TSENSE Bias Current 115 120 125 mA 2 V ADC 0 Voltage Range 3. Guaranteed by design or characterization data, not in production test. www.onsemi.com 9 NCP81141 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min Typ Max Unit 1.25 % 1 LSB ADC Total Unadjusted Error (TUE) Differential Nonlinearity (DNL) −1.25 8−bit, no missing codes Power Supply Sensitivity ±1 % Conversion Time 30 ms Round Robin 90 ms VR_RDY,(Power Good) Output Output Low Saturation Voltage IVR_RDY = 4 mA 0.3 V Rise Time External pull−up of 1 kW to 3.3 V, CTOT = 45 pF, DVo = 10% to 90% 100 ns Fall Time External pull−up of 1KW to 3.3V, CTOT = 45 pF, DVo = 90% to 10% 10 ns Output Voltage at Power−up VR_RDY pulled up to 5 V via 2 kW Output Leakage Current When High VR_RDY = 5.0 V −1.0 1.2 V 1.0 mA VR_RDY Delay (rising) DAC = TARGET to VR_RDY 50 ms VR_RDY Delay (falling) From OCP or OVP 5 ms Pull−up Resistance, Sourcing Current BST = PVCC 1.2 High Side Driver Sourcing Current BST = PVCC 4.17 Pull−down Resistance, Sinking Current BST = PVCC 0.8 High Side Driver Sinking Current BST = PVCC 6.25 HIGH−SIDE MOSFET DRIVER 2.9 W A 2.2 W A HG Rise Time VCC = 5 V, 3 nF load, BST−SW = 5V 6.0 16 30 ns HG Fall Time VCC = 5 V, 3 nF load, BST−SW = 5V 6.0 11 30 ns DRVH Turn−Off Propagation Delay tpdhDRVH CLOAD = 3 nF 4.0 30 ns HG Turn on Propagation Delay tpdlDRVH CLOAD = 3 nF 15 40 ns SW Pull−Down Resistance SW to PGND 1.9 kW LG Pull−Down Resistance HG to SWBST−SW = 0 V 1.9 kW 30 LOW−SIDE MOSFET DRIVER Pull−up Resistance, Sourcing Current 0.9 Low Side Driver Sourcing Current 5.56 Pull−down Resistance, Sinking Current 0.8 Low Side Driver Sinking Current 12.5 LG Rise Time LG Fall Time 3.0 W A 2.0 W A 3 nF load 6.0 16 30 ns 3 nF load 6.0 11 30 ns LG Turn−On Propagation Delay tpdhDRVL CLOAD = 3 nF 11 30 ns LG Pull−Down Resistance LG to PGND, VCC = 5 V 1.9 kW PVCC Quiescent Current EN = L (Shutdown) EN = H, no switching 1.0 490 mA 3. Guaranteed by design or characterization data, not in production test. www.onsemi.com 10 NCP81141 ELECTRICAL CHARACTERISTICS Unless otherwise stated: −40°C < TA < 100°C; VCC = 5 V; CVCC = 0.1 mF Parameter Test Conditions Min Typ Max Unit EN_L or EN = H with DRVL = H 5.0 9.0 22 W BOOTSTRAP RECTIFIER SWITCH On Resistance 3. Guaranteed by design or characterization data, not in production test. tfDRVL trDRVL DRVL tfDRVH tpdhDRVH DRVH−SW trDRVH VTH VTH tpdhDRVL SW 1V Figure 5. Driver Timing Diagram NOTE: Timing is referenced to the 90% and the 10% points, unless otherwise stated. www.onsemi.com 11 NCP81141 STATE TRUTH TABLE STATE VR_RDY Pin Error AMP Comp Pin OVP & UVP POR 0 < VCC < UVLO N/A N/A N/A Disabled EN < threshold UVLO >threshold Low Low Disabled Start up Delay & Calibration EN> threshold UVLO>threshold Low Low Disabled Soft Start EN > threshold UVLO >threshold Low Operational Active / No latch Normal Operation EN > threshold UVLO >threshold High Operational Active / Latching Over Voltage Low N/A DAC + 150 mV Over Current Low Operational Last DAC Code VOUT = 0 V Low: if Reg34h:bit0 = 0; High:if Reg34h:bit0 = 1; Clamped at 0.9 V Disabled Method of Reset N/A General The NCP81141 is a single phase PWM controller with integrated driver, designed to meet the Intel VR12.6 specifications with a serial SVID control interface. It is designed to work in notebook and desktop applications. The NCP81141 has one internal Driver: DRV1. Internally, there is a single PWM signal: PWM1. DRV1 is driven by PWM1. www.onsemi.com 12 NCP81141 Serial VID interface (SVID) For SVID Interface communication details please contact Intel Inc. BOOT VOLTAGE PROGRAMMING The NCP81141 has a Vboot voltage that can be externally programmed. The Boot voltage for the NCP81141 is set using VBOOT pin on power up. A 10uA current is sourced from the VBoot pin and the resulting voltage is measured. This is compared with the thresholds in table below. This value is programmed on power up and cannot be changed after the initial power up sequence is complete. BOOT VOLTAGE TABLE R Vboot 30.1k 0V 49.9k 1.65 V 69.8k 1.70 V 90.9k 1.75 V REMOTE SENSE AMPLIFIER A high performance high input impedance true differential amplifier is provided to accurately sense the output voltage of the regulator. The VSP and VSN inputs should be connected to the regulator’s output voltage sense points. The remote sense amplifier takes the difference of the output voltage with the DAC voltage and adds the droop voltage to V DIFOUT + ǒV VSP * V VSNǓ ) ǒ1.3 V * V DACǓ ) ǒV DROOP * V CSREFǓ This signal then goes through a standard error compensation network and into the inverting input of the error amplifier. The non−inverting input of the error amplifier is connected to the same 1.3 V reference used for the differential sense amplifier output bias. REMOTE SENSE AMPLIFIER The differential current-sense circuit diagram is shown in figure below. An internally-used signal Vcs, representing the inductor current level, is the voltage difference between CSREF and CSCOMP. The output side of the inductor is used to create a low impedance virtual ground. The current-sense amplifier actively filters and gains up the voltage applied across the inductor to recover the voltage drop across the inductor’s DC resistance(DCR). RCS_NTC is placed close to the inductor and compensate for the change in the DCR with temperature. The DC gain in the current sending loop is (VCSREF * VSCOMP) GCS + VCS + + RCS (Iout DCR) VDCR RCS3 RCS + RCS2 ) (RCS1 RCS_NTC) (RCS1 ) RCS_NTC) Figure 6. Differential Current−Sense Circuit diagram www.onsemi.com 13 NCP81141 High Performance Voltage Error Amplifier A high performance error amplifier is provided for high bandwidth transient performance. A standard type 3 compensation circuit is normally used to compensate the system. Current Sense Amplifier The output current signal is floating with respect to CSREF. The current signal is the difference between CSCOMP and CSREF. The output side of the inductor is used to create a low impedance virtual ground. The amplifier actively filters and gains up the voltage applied across the inductor to recover the voltage drop across the inductor series resistance (DCR). Rth is placed near the inductor to sense the temperature of the inductor. This allows the filter time constant and gain to be a function of the Rth NTC resistor and compensate for the change in the DCR with temperature. Figure 7. Current Sense Amplifier The DC gain equation for the current sensing: Rcs1*Rth V CSCOMP−CSREF + − Rcs2 ) Rcs1)Rth Rph * ǒIout Total * DCRǓ Set the gain by adjusting the value of the Rph resistor. The DC gain should be set to the output voltage droop. If the voltage from CSCOMP to CSREF is less than 100 mV at ICCMAX then it is recommend increasing the gain of the CSCOMP amp. This is required to provide a good current signal to offset voltage ratio for the ILIMIT pin. When no droop is needed, the gain of the amplifier should be set to provide ~100 mV across the current limit programming resistor at full load. The values of Rcs1 and Rcs2 are set based on the 100k NTC and the temperature effect of the inductor and should not need to be changed. The NTC should be placed close to the inductor. The pole frequency in the CSCOMP filter should be set equal to the zero from the output inductor. This allows the circuit to recover the inductor DCR voltage drop current signal. Ccs1 and Ccs2 are in parallel to allow for fine tuning of the time constant using commonly available values. It is best to fine tune this filter during transient testing. Fz + DCR@25° C 2 * PI * L Phase PROGRAMMING CURRENT LIMIT The current limit thresholds are programmed with a resistor between the ILIMIT and CSCOMP pins. The ILIMIT pin mirrors the voltage at the CSREF pin and mirrors the sink current internally to IOUT (reduced by the IOUT Current Gain) and the current limit comparators. The 100% current limit trips if the ILIMIT sink current exceeds 10 mA for 50 ms. The 150% current limit trips with minimal delay if the ILIMIT sink current exceeds 15 mA. Set the value of the current limit resistor based on the CSCOMP−CSREF voltage as shown below. Note the loadline is set at 50% of cscomp/csref differential. www.onsemi.com 14 NCP81141 ǒ 2* Rcs) Rcs1*Rth Rcs1)Rth Rph R LIMIT + * ǒIout LIMIT * DCRǓ Ǔ or R LIMIT + 10m ǒ2 * VCSCOMP−CSREF@ILIMITǓ 10m PROGRAMMING IOUT The IOUT pin sources a current in proportion to the ILIMIT sink current. The voltage on the IOUT pin is monitored by the internal A/D converter and should be scaled with an external resistor to ground such that a load equal to ICCMAX generates a 2 V signal on IOUT. A pull−up resistor from 5 V VCC can be used to offset the IOUT signal positive if needed. R IOUT + ǒ 2.0 V * R LIMIT Rcs1*Rth Rcs1)Rth Rph Rcs2) 10 * Ǔ * ǒIout ICC_MAX * DCRǓ * 2 PROGRAMMING ICC_MAX A resistor to Ground is monitored on startup and this sets the ICC_MAX value. 10 mA is sourced from these pins to generate a voltage on the program resistor. The resistor value should be no less than 10k. ICC_MAX + R * 10 mA * 64 A 2V PROGRAMMING TSENSE A temperature sense inputs are provided. A precision current is sourced out the output of the TSENSE pin to generate a voltage on the temperature sense network. The voltage on the temperature sense input is sampled by the internal A/D converter. A 100k NTC similar to the VISHAY ERT−J1VS104JA should be used. Rcomp1 is mainly used for noise. See the specification table for the thermal sensing voltage thresholds and source current. TSENSE Rcomp1 0.0 Cfilter 0.1uF Rcomp2 8.2K AGND t’RNTC 100k AGND Figure 8. TSENSE Circuit www.onsemi.com 15 NCP81141 PRECISION OSCILLATOR Switching frequency is programmed by a resistor Rosc to ground at the Rosc pin. The typical frequency range is from 500 kHz to 1.2 MHz. The FREQ pin provides approximately 2 V out and the source current is mirrored into the internal ramp generator. The switching frequency can be found in figure below with a given Rosc. The frequency shown in the figure is under condition of 10 A output current at VID = 1.8 V. The frequency has a variation over VID voltage and loading current, which maintains similar output ripple voltage over different operation condition. Figure 9. Operating Frequency vs. ROSC The oscillator generates a triangular ramp that is 0.5 ~ 2.5 V in amplitude depending on the VRMP pin voltage to provide input voltage feed forward compensation. www.onsemi.com 16 NCP81141 Programming the Ramp Feed-Forward Circuit The ramp generator circuit provides the ramp used by the PWM comparators. The ramp generator provides voltage feed-forward control by varying the ramp magnitude with respect to the VRMP pin voltage. The VRMP pin also has a 3.2 V UVLO function. The VRMP UVLO is only active after the controller is enabled. The VRMP pin is high impedance input when the controller is disabled. The PWM ramp time is changed according to the following V RAMPpk + pk pp + 0.1 V VRMP Figure 10. RPM Mode Figure 11. Ramp Feed Forward & ROSC setup www.onsemi.com 17 NCP81141 Programming DAC Feed−Forward Filter The DAC feed−forward implementation is realized by having a filter on the VSN pin. Programming Rvsn sets the gain of the DAC feed−forward and Cvsn provides the time constant to cancel the time constant of the system per the following equations. Cout is the total output capacitance and Rout is the output impedance of the system. Rvsn + Cout * Rout * 453.6 Cvsn + 10 6 Rout * Cout Rvsn Figure 12. DAC Feed−Forward Filter Programming DROOP The signals CSCOMP and CSREF are differentially summed with the output voltage feedback to add precision voltage droop to the output voltage. Droop + DCR * ǒR CSńR phǓ Figure 13. Droop Phase COMPARITOR The noninverting input of the comparator for phase one is connected to the output of the error amplifier (COMP) and the phase current (IL*DCR*Phase Balance Gain Factor). The inverting input is connected to the oscillator ramp voltage with a 1.3 V offset. The operating input voltage range of the comparator is from 0 V to 3.0 V and the output of the comparator generates the PWM signal which is applied to the input of the internal driver. During steady state operation, the duty cycle is centered on the valley of the sawtooth ramp waveform. The steady state duty cycle is still calculated by approximately Vout/Vin. Protection Features UNDERVOLTAGE LOCKOUT There are several under voltage monitors in the system. Hysteresis is incorporated within the comparators. NCP81141 monitors the VCC Shunt supply. The gate driver monitors both the gate driver VCC and the BST voltage. SOFT START Soft start is implemented internally. A digital counter steps the DAC up from zero to the target voltage based on the predetermined rate in the spec table. OVER CURRENT LATCH−OFF PROTECTION The NCP81141 compares a programmable current−limit set point to the voltage from the output of the current−summing amplifier. The level of current limit is set with the resistor from the ILIM pin to CSCOMP. The current through the external resistor connected between ILIM and CSCOMP is then compared to the internal current limit current ICL. If the current generated through this resistor into the ILIM pin (Ilim) exceeds the internal current−limit threshold current (ICL), an internal latch−off counter starts, and the controller shuts down if the fault is not removed after 50 ms (shut down immediately for 150% load current) after which the outputs will remain disabled until the VCC voltage or EN is toggled. www.onsemi.com 18 NCP81141 The voltage swing seen on CSCOMP cannot go below ground. This limits the voltage drop across the DCR. The over−current limit is programmed by a resistor on the ILIM pin. The resistor value can be calculated by the following equation: R ILIM + ǒILIM * DCR * R CSńR PHǓ * 2 I CL Where ICL = 10 mA. Figure 14. Current Limit UNDER VOLTAGE MONITOR The output voltage is monitored at the output of the differential amplifier for UVLO. If the output falls more than 300 mV below the DAC−DROOP voltage the UVLO comparator will trip sending the VR_RDY signal low. www.onsemi.com 19 NCP81141 OVER VOLTAGE PROTECTION The output voltage is also monitored at the output of the differential amplifier for OVP. During normal operation, if the output voltage exceeds the DAC voltage by 400 mV, the VR_RDY flag goes low, and the DAC will be ramped down slowly. At the same time, the high side gate driver is turned off and the low side gate driver is turned on until the voltage falls to 100 mV. The part will stay in this mode until the VCC voltage or EN is toggled. During start up, the OVP threshold is set to 2.9 V. This allows the controller to start up without false triggering the OVP. Figure 15. OVP Behavior at Startup Figure 16. OVP During Normal Operation Mode During start up, the OVP threshold is set to 2.2 V. This allows the controller to start up without false triggering the OVP. www.onsemi.com 20 NCP81141 ORDERING INFORMATION Package Shipping† NCP81141MNTWG QFN28 (Pb−Free) 4000 / Tape & Reel NCP81141MNTXG QFN28 (Pb−Free) 4000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Figure 17. Alternative Extended Soldering Footprint ON Semiconductor claims no responsibility for damage or usage beyond that of specific recommended soldering footprint Intel is trademark of Intel Corporation in the U.S. and/or other countries. www.onsemi.com 21 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN28 4x4, 0.4P CASE 485AR−01 ISSUE A DATE 20 NOV 2009 1 SCALE 2:1 PIN ONE REFERENCE B A D ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ L L1 DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 ÏÏ ÏÏ EXPOSED Cu 0.10 C 0.10 C L MOLD CMPD DETAIL B TOP VIEW ALTERNATE CONSTRUCTION A DETAIL B A3 0.10 C GENERIC MARKING DIAGRAM* 0.08 C NOTE 4 A1 SIDE VIEW SEATING PLANE C XXXXXX XXXXXX ALYWG G 0.10 C A B D2 DETAIL A K 8 0.10 C A B 15 28X L E2 1 PIN 1 INDICATOR 22 e 28X BOTTOM VIEW b 0.07 C A B 0.05 C MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.15 0.25 4.00 BSC 2.50 2.70 4.00 BSC 2.50 2.70 0.40 BSC 0.30 REF 0.30 0.50 −−− 0.15 XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. RECOMMENDED MOUNTING FOOTPRINT NOTE 3 4.30 2.71 28X 0.62 1 2.71 4.30 PACKAGE OUTLINE 0.40 PITCH DOCUMENT NUMBER: 98AON30349E 28X 0.26 DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com QFN28 4X4, 0.4P DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON30349E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY M. LIN. 15 MAY 2008 A CHANGED DIMENSIONS D2, E2, K, L, MOUNTING FOOTPRINT AND MARKING DIAGRAM INFORMATION. REQ. BY J. LIU. 20 NOV 2009 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2009 November, 2009 − Rev. 01A Case Outline Number: 485AR onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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