NCS2566DTBR2G

NCS2566 Six-Channel Video Driver with Triple SD & Triple Selectable SD/HD Filters The NCS2566 integrates reconstruction filters and video amplifiers. It’s a combination of two 3−channel drivers − the first one capable to deal with Standard Definition (SD) video signals and a second one including selectable filters for either Standard or High Definition (HD) video applications. The filters implemented are 6th order Butterworth Low Pass filters particularly effective for rejecting unwanted high frequency components and assuring good linearity of the phase change over frequency with well optimized group delays. All channels can accept DC− or AC−coupled signals; when AC− coupled the internal clamps are employed. The outputs can drive both AC− and DC−coupled 150 W loads. It is designed to be compatible with most Digital−to−Analog Converters (DAC) embedded in video processors. To further reduce power consumption, two enable pins are provided, one for each triple driver. One pin allows selection of the filter frequency of the SD/HD triple driver. Features • • • • • • • • • • • • • • • 3−Channel with Selectable 6th−Order 8/34 MHz Butterworth Filters 3−Channel with Fixed 6th−Order 8 MHz Butterworth Filters Transparent Input Clamp for Each Channel Integrated Level Shifter AC− or DC−Coupled Inputs and Outputs Low Quiescent Current Shutdown Current 42 mA Typical (Disabled) 5 V Power Supply Each Channel Capable to Drive 2 by 150 W Load Internal Gain: 6 dB $0.2 Wide Input Common Mode Range 8 kV ESD Protection (IEC61000−4−2 Compatible) Operating Temperature Range: −40°C to +85°C Available in a TSSOP−20 Package These are Pb−Free Devices • Set−Top Box • DVD players and related • HDTV April, 2011 − Rev. 3 TSSOP−20 DTB SUFFIX CASE 948E MARKING DIAGRAM 20 NCS 2566 ALYWG G 1 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS 1 20 SD OUT1 SD IN2 2 19 SD OUT2 SD IN3 3 18 SD OUT3 SD EN 4 17 GND VCC 5 16 GND SD IN1 SD/HD 6 15 SD/HD EN SD/HD IN1 7 14 SD/HD OUT1 SD/HD IN2 8 13 SD/HD OUT2 SD/HD IN3 9 12 SD/HD OUT3 NC 10 11 NC (Top View) Typical Applications © Semiconductor Components Industries, LLC, 2011 http://onsemi.com ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. 1 Publication Order Number: NCS2566/D NCS2566 SD IN1 1 Transparent Clamp 6dB 20 SD OUT1 6dB 19 SD OUT2 6dB 18 SD OUT3 6th Order, 8 MHz Filter SD IN2 2 Transparent Clamp 6th Order, 8 MHz Filter SD IN3 3 Transparent Clamp 6th Order, 8 MHz Filter SD EN 4 VCC 5 SD/HD 6 SD/HD IN1 7 17 GND 250kW GND GND 16 GND 250kW 15 SD/HD EN Transparent Clamp 6dB 14 SD/HD OUT1 6dB 13 SD/HD OUT2 6dB 12 SD/HD OUT3 6th Order, Selectable 8/34 MHz Filter SD/HD IN2 8 Transparent Clamp 6th Order, Selectable 8/34 MHz Filter SD/HD IN3 9 Transparent Clamp 6th Order, Selectable 8/34 MHz Filter NC 11 NC 10 Figure 1. NCS2566 Block Diagram http://onsemi.com 2 NCS2566 PIN FUNCTION AND DESCRIPTION Pin Name Type 1 SD IN1 Input SD Video Input 1 − SD Channel 1 Description 2 SD IN2 Input SD Video Input 2 − SD Channel 2 3 SD IN3 Input SD Video Input 3 − SD Channel 3 4 SD EN Input SD−Channel Enable/Disable Function: Low = Enable, High = Disable. When left open the default state is Enable. 5 VCC Power 6 SD/HD Input Pin of selection enabling the Standard Definition or High Definition Filters (8 MHz / 34 MHz) for channels SD/HD (pins 7−14, 8−13 & 9−12) − when Low SD filters are selected, when High HD filters are selected. 7 SD/HD IN1 Input Selectable SD or HD Video Input 1 − SD/HD Channel 1 8 SD/HD IN2 Input Selectable SD or HD Video Input 2 − SD/HD Channel 2 9 SD/HD IN3 Input Selectable SD or HD Video Input 3 − SD/HD Channel 3 10 NC Open Not Connected 11 NC Open Not Connected 12 SD/HD OUT3 Output SD/HD Video Output 3 − SD/HD Channel 3 13 SD/HD OUT2 Output SD/HD Video Output 2 − SD/HD Channel 2 14 SD/HD OUT1 Output SD/HD Video Output 1 − SD/HD Channel 1 15 SD/HD EN Input SD/HD Channel Enable /Disable Function: Low = Enable, High = Disable. When left open the default state is Enable. 16 GND GND Connected to Ground 17 GND GND Connected to Ground 18 SD OUT3 Output SD Video Output 3 − SD Channel 3 19 SD OUT2 Output SD Video Output 2 − SD Channel 2 20 SD OUT1 Output SD Video Output 1 − SD Channel 1 Device Power Supply Voltage: +5 V $5% http://onsemi.com 3 NCS2566 MAXIMUM RATINGS Parameter Symbol Rating Unit VCC −0.3 v VCC v 5.5 Vdc Input Voltage Range VI −0.3 v VI v VCC Vdc Input Differential Voltage Range VID −0.3 v VI v VCC Vdc Output Current Per Channel IO 50 mA Maximum Junction Temperature (Note 1) TJ 150 °C Power Supply Voltages Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Range Tstg −60 to +150 °C Power Dissipation PD (See Graph) mW Thermal Resistance, Junction−to−Air RqJA 125 °C/W ESD Protection Voltage (IEC61000−4−2) Vesd >8000 V ESD HBM − Human Body Model HBM 4000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. MAXIMUM POWER DISSIPATION 1800 The maximum power that can be safely dissipated is limited by the associated rise in junction temperature. For the plastic packages, the maximum safe junction temperature is 150°C. If the maximum is exceeded momentarily, proper circuit operation will be restored as soon as the die temperature is reduced. Leaving the device in the “overheated” condition for an extended period can result in device burnout. To ensure proper operation, it is important to observe the derating curves. POWER DISSIPATION (mV) 1600 1400 1200 1000 800 600 400 200 0 −40 −30−20−10 0 10 20 30 40 50 60 70 80 90100 TEMPERATURE (°C) Figure 2. Power Dissipation vs Temperature http://onsemi.com 4 NCS2566 DC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, Rsource = 37.5 W, TA = 25°C, inputs AC−coupled with 0.1 µF, all outputs AC−coupled with 220 µF into 150 W referenced to 400 kHz; unless otherwise specified) Symbol Characteristics Conditions Min Typ Max Unit 4.7 5.0 5.3 V POWER SUPPLY VCC Supply Voltage Range ICC Supply Current ISD 3 SD Channels Active 3 HD Channels Active 3 SD + 3 SD Channels Active 3 SD + 3 HD Channels Active 25 40 50 65 80 No Channel Active 42 80 mA GND 1.4 VPP 0.8 V Shutdown Current mA DC PERFORMANCE Vi Input Common Mode Voltage Range VIL SD/HD Input Low Level 0 VIH SD/HD Input High Level 2.4 Rpd Pulldown Resistors on Pins SD_EN and SD/HD_EN VCC V 250 kW OUTPUT CHARACTERISTICS VOH Output Voltage High Level 2.8 V VOL Output Voltage Low Level 200 mV Output Current 40 mA IO AC ELECTRICAL CHARACTERISTICS FOR STANDARD DEFINITION CHANNELS (Pin Numbers (1, 20) (2, 19), (3, 18), (7, 14), (8, 13) & (9, 12)) (VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified, SD/HD = Low) Characteristics Symbol AVSD Voltage Gain BWSD Low Pass Filter Bandwidth (Note 3) Conditions Min Typ Max Unit Vin = 1 V − All SD Channels 5.8 6.0 6.2 dB −1 dB −3 dB 5.5 6.5 7.2 8.0 @ 27 MHz 43 MHz ARSD Stop−Band Attenuation (Note 4) 50 dB dGSD Differential Gain Error 0.7 % dFSD Differential Phase Error 0.7 ° THD Total Harmonic Distortion Vout = 1.4 VPP @ 3.58 MHz 0.35 % XSD Channel−to−Channel Crosstalk @ 1 MHz & Vin = 1.4 VPP −58 dB NTC−7 test signal, 100 kHz to 4.2 MHz (Note 2) 72 dB @ 4.5 MHz 70 ns 100 kHz to 8 MHz 20 ns SNRSD DtSD DGDSD Signal−to−Noise Ratio Propagation Delay Group Delay variation 2. SNR = 20 x log (714 mV/RMS Noise) 3. 100% of Tested ICs fit the bandwidth and attenuation tolerance at 25°C. 4. Guaranteed by Characterization. http://onsemi.com 5 NCS2566 AC ELECTRICAL CHARACTERISTICS FOR HIGH DEFINITION CHANNELS (Pin Numbers (7, 14), (8, 13) & (9, 12)) (VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified, SD/HD = High) Characteristics Symbol AVHD Voltage Gain BWHD Low Pass Filter Bandwidth ARHD Stop−band Attenuation THDHD Total Harmonic Distortion XHD Channel−to−Channel Crosstalk SNRHD Signal−to−Noise Ratio DtHD Propagation Delay DGDHD Group Delay Variation from Conditions Min Typ Max Unit Vin = 1 V − All HD Channels 5.8 6.0 6.2 dB −1 dB (Note 6) −3 dB (Note 7) 26 30 31 34 @ 44.25 MHz (Note 7) @ 74.25 MHz (Note 6) 33 15 42 dB Vout = 1.4 VPP @ 10 MHz Vout = 1.4 VPP @ 15 MHz Vout = 1.4 VPP @ 22 MHz 0.4 0.6 0.8 % @ 1 MHz & Vin = 1.4 VPP −58 dB white signal, 100 kHz to 30 MHz, (Note 5) 72 dB 25 ns 6.0 ns 100 kHz to 30 MHz 5. SNR = 20 x log (714 mV/RMS Noise) 6. Guaranteed by characterization. 7. 100% of tested ICs fit the bandwidth and attenuation tolerance at 25°C. http://onsemi.com 6 MHz NCS2566 TYPICAL CHARACTERISTICS 30 30 20 20 10 10 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified 0 −10 −20 −30 −1 dB @ 6.7 MHz −3 dB @ 8.1 MHz −53 dB @ 27 MHz −40 −50 −70 100k 1M −30 −1 dB @ 31 MHz −3 dB @ 33 MHz −16 dB @ 44.25 MHz −38 dB @ 74.25 MHz −40 −50 10M −70 100k 100M 1M 10M 100M FREQUENCY (Hz) FREQUENCY (Hz) Figure 3. SD Normalized Frequency Response Figure 4. HD Normalized Frequency Response 0.4 1.4 0.35 1.2 0.226 dB @ 3.6 MHz 0.3 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) −20 −60 −60 0.25 0.2 0.15 0.1 0.5 0 −0.1 100k 1M 1.0 0.8 0.6 0.4 0.2 0 −0.4 100k 10M Figure 5. SD Passband Flatness Figure 6. HD Passband Flatness 30M −20 −25 −51.8 dB @ 6.85 MHz −30 −55 −35 −60 −40 GAIN (dB) −50 −79 dB @ 50 kHz −50 −55 −80 −60 −85 −65 100k 1M −70 20 10M −37.6 dB @ 25 MHz −45 −75 −90 20k 10M FREQUENCY (Hz) −45 −70 1M FREQUENCY (Hz) −40 −65 1.035 dB @ 18.7 MHz −0.2 −0.5 GAIN (dB) 0 −10 −67 dB @ 50 kHz 100k 1M 10M 50M FREQUENCY (Hz) FREQUENCY (Hz) Figure 7. SD Channel−to−Channel Crosstalk Figure 8. HD Channel−to−Channel Crosstalk http://onsemi.com 7 NCS2566 TYPICAL CHARACTERISTICS 30 15 20 10 10 5 GROUP DELAY (ns) GROUP DELAY (ns) VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified 0 −10 20.7 ns @ 7 MHz −20 −30 −40 −50 −60 0 −5 9.1 ns @ 24.1 MHz −10 −15 −20 −25 −30 −70 400k 1M 10M −35 400k 20M 1M 10M 100M FREQUENCY (Hz) FREQUENCY (Hz) Figure 9. SD Normalized Group Delay Figure 10. HD Normalized Group Delay Output 0.7 VPP 25 ns 70 ns Output 0.7 VPP Input Figure 11. SD Propagation Delay Input Input Figure 12. HD Propagation Delay Input Output Output 200 mV 200 mV Figure 13. SD Small Signal Response Figure 14. HD Small Signal Response http://onsemi.com 8 NCS2566 TYPICAL CHARACTERISTICS VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified Output Input Output Input 1 VPP 1 VPP Figure 15. SD Large Signal Response Figure 16. HD Large Signal Response 0 −10 −20 PSRR (dB) −30 −40 −50 −60 −70 −80 −90 −100 20 100k 1M FREQUENCY (Hz) 10M Figure 17. SD and HD VCC PSRR vs. Frequency http://onsemi.com 9 50M NCS2566 TYPICAL CHARACTERISTICS 20 60 10 50 0 40 −10 30 −20 20 −30 10 −40 0 −50 −10 −60 −20 −70 −30 −80 400k 1M −40 50M 10M (Hz) NORMALIZED GROUP DELAY (ns) NORMALIZED GAIN (dB) VCC = +5.0 V, Vin = 1 VPP, Rsource = 37.5 W, TA = 25°C, Inputs AC−coupled with 0.1 mF, All Outputs AC−coupled with 220 mF into 150 W Referenced to 400 kHz; unless otherwise specified 20 35 10 30 0 25 −10 20 −20 15 −30 10 −40 5 −50 0 −60 −5 −70 −10 −80 400k −15 1M (Hz) 10M NORMALIZED GROUP DELAY (ns) NORMALIZED GAIN (dB) Figure 18. SD Frequency Response and Group Delay 100M Figure 19. HD Frequency Response and Group Delay 0.9 0.9 0.75 0.76 0.77 0.68 0.7 0.6 0.5 0..4 0.31 0.3 0.8 DIFFERENTIAL PHASE (°) DIFFERENTIAL GAIN (%) 0.8 0.2 0.1 0 0.75 0.7 0.65 0.6 0.5 0..4 0.36 0.3 0.2 0.14 0.07 0.1 0 1 2 3 4 5 0 6 1 2 3 4 5 HARMONIC HARMONIC Figure 20. SD Differential Gain Figure 21. SD Differential Phase http://onsemi.com 10 6 NCS2566 APPLICATIONS INFORMATION DAC output signal level and the input common mode voltage of the video driver. When the configuration is DC−Coupled at the Inputs and Outputs the 0.1 mF and 220 mF coupling capacitors are no longer used and the clamps are in that case inactive; this configuration provides a low cost solution which can be implemented with few external components. The input is AC−coupled when either the input−signal amplitude goes over the range 0 V to 1.4 V or if the video source requires such a coupling. In some circumstances it may be necessary to auto−bias signals with the addition of a pull−up and pull−down resistors or only pull−up resistor (Typical 7.5 MW combined with the internal 800 kW pulldown) making the clamp inactive. The output AC−coupling configuration is advantageous for eliminating DC ground loop, but may have the drawback of increasing sensitivity to video line or field tilt issues if the output coupling capacitor is too small. DC ground loop with the drawback of making the device more sensitive to video line or field tilt issues in the case of a too low output coupling capacitor. In some cases it may be necessary to increase the nominal 220 mF capacitor value. All the device pins are protected against electrostatic discharge at a level of 4 kV HBM and 8 kV according to IEC61000−4−2. This feature has been considered with a particular attention with ESD structure able to sustain the typical values requested by the systems like Set Top Boxes or Blue-Ray players. This parameter is particularly important for video driver which usually constitutes the last stage in the video chain before the video output connector. The IEC61000-4-2 standard has been used to test our devices in the real application environment. Test methodology can be provided on request. The NCS2566 6−channel video filter driver has been optimized for Standard and High Definition video applications covering the requirements of the standards Composite video (CVBS), S−Video, Component Video (480i/525i, 576i/625i, 720p/1080i) and related (RGB). The first 3−channels (SD1, SD2, SD3) are dedicated for Standard Definition, CVBS and S−Video applications for which the frequency bandwidth required does not exceed 8 MHz. The 3 other channels (SD/HD1, SD/HD2, SD/HD3) have selectable filters (8 MHz and 34 MHz) for covering either standard−definition−like video applications or High Definition video applications. These frequencies are selectable using the pin SD/HD. If the application requires, the video driver outputs may also be disabled using the SD EN or SD/HD EN required by the application the pins SD EN or SD/HD EN. In the regular mode of operation each channel provides an internal voltage−to−voltage gain of 2 from input to output. This effectively reduces the number of external components required as compared to discrete approaches implemented with stand−alone op amps. An internal level shifter is employed shifting up the output voltage by adding an offset of 200 mV. This prevents sync pulse clipping and allows DC−coupled output to the 150 W video load. In addition the NCS2566 integrates a 6th−order Butterworth filter for each channel. This allows rejection of aliases or unwanted over−sampling effects produced by the video DAC. Similary for DVD recorders which uses an ADC, this anti−aliasing filter (reconstruction filter) will avoid picture quality issues and will aide filtration of parasitic signals caused by EMI interference. A built−in diode−like clamp is used in the chip for each channel to support the AC−coupled mode of operation. The clamp is active when the input signal goes below 0 V. The built−in clamp and level shifter allow the device to operate in different configuration modes depending on the http://onsemi.com 11 NCS2566 10mF +5V 0.1mF 0.1mF 1 CVBS RS 75W 220mF 75W Cables 75W 220mF 75W Cables 75W 220mF 75W Cables 2 OUT2 SD IN2 19 Y 75W 0.1mF 3 C OUT3 SD IN3 18 C 75W 4 SD EN SD EN 5 6 SD/HD 0.1mF Y/G NCS2566 RS RS CVBS 20 75W 0.1mF Y RS OUT1 SD IN1 GND VCC SD/HD 7 GND SD/HD EN SD/HD IN4 SD/HD OUT4 17 16 15 14 75W 220mF 75W Cables 75W 220mF 75W Cables 75W 220mF 75W Cables Y/G 75W 0.1mF Pb/B 13 8 Pb/B SD/HD IN5 SD/HD OUT5 RS Pr/R 75W 0.1mF 9 SD/HD IN6 SD/HD OUT6 12 75W RS SD/HD EN Pr/R AC−Coupling CAPs 10 are Optional NC NC 11 AC−Coupling CAPs are Optional Figure 22. Typical Application ORDERING INFORMATION Device NCS2566DTBR2G Package Shipping† TSSOP−20 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 12 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−20 WB CASE 948E ISSUE D DATE 17 FEB 2016 SCALE 2:1 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING PLANE DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 XXXX XXXX ALYWG G 1 0.65 PITCH 16X 0.36 16X 1.26 DOCUMENT NUMBER: 98ASH70169A DESCRIPTION: TSSOP−20 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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