NCV7694MW0R2G

Safety Controller for Infra-Red LED Illumination to Complement the Image Sensor for Automotive Applications NCV7694 The NCV7694 is a device which can drive a string of infra−red LEDs using an external mosfet. The IR LEDs are used to illuminate the surroundings of the image sensor. Since these LEDs can damage the end users’ eyes, the power feed to the LEDs needs to be turned off during a fault condition. The NCV7694 driver features prevents the IR LEDs from being on too long due to an inappropriate exposure time or being turned on too frequently using external resistors. The value of the RETL resistor defines the maximum TON time of the emitted light intensity and the value of the RFRL resistor defines the maximum frequency of the FLASH signal from the image sensor. A LED driver with hardware interlocks helps protect the users’ eyes in cases where the control signal has failed or a fault in the LED power path has occurred. LED brightness level is easily programmed using an external resistor in series with the mosfet transistor. The device can also detect Open Load, Short Circuit to GND and VS. Faults are reported to the DIAG pin, which can directly disable the DC/DC converter to prevent possible damage. The device is available in 10 pin DFN package. Features • • • • • Constant Current Output for LED String Drive FLASH Input Pin Open LED Diagnostic Detection Short LED to GND and VS Detection Safety Feature Prevent Being ON too long Safety Feature Prevent Being ON too frequently External Resistor Defining max ON time External Resistor Defining min OFF time Protection against Short to Ground and Open of the External Resistors Detection and Protection Against Under−Voltage and over Temperature AEC−Q100 Qualified and PPAP Capable ASIL−A safety design, ISO26262 compliant 10 Pin Packaging Wettable Flank Package for Enhanced Optical Inspection These are Pb−Free Devices • • • • In−Cabin Monitoring Sensor Infrared Illumination for Automotive Cameras Machine Vision Systems Surveillance Systems Applications © Semiconductor Components Industries, LLC, 2020 February, 2021 − Rev. 2 1 1 DFNW10, 3x3, 0.5P CASE 507AG MARKING DIAGRAM NV76 94−0 ALYW S NV7694−0 A L Y W S = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN CONNECTIONS VS 1 DIAG 2 FLASH 3 RETL 4 RFRL 5 NCV7694 • • • • • • • • • • www.onsemi.com 10 VSTRING 9 DET 8 GATE 7 FB 6 GND Top View ORDERING INFORMATION Device Package Shipping† NCV7694MW0R2G DFN10 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NCV7694/D NCV7694 VS VBAT Supply for MCU and Image Sensor VDD_MCU VDD_MCU VDD_AR VDD_MCU R2 VDD_AR Data interface Micro− controller / DSP VS 20k Image Sensor AR 0135 FLASH FLASH NCV7694 DIAG GND Diag detection RETL R3 GND Define max exposure time VSTR REMC1 DET REMC2 1 kW GATE REMC3 FB REMC4 1 kW Q1 200 W 750 W Note1: 4x optional EMC shield resistors RFRL R4 Define max frequency ZD NVTFS5C478NL CSUPPLY R1 GND Note2: Optional Zener diode Figure 1. Application Diagram − Powered Directly from Battery VBAT Supply for MCU and Image Sensor VDD_MCU VDD_MCU Micro− controller / DSP 20k Image Sensor AR 0135 FLASH FLASH GND NCV7694 RETL R3 GND VString VS DIAG Diag detection DC /DC NCV898031 C1 R2 VDD_AR Data interface EN VDD_MCU VDD_AR R4 Define max frequency REMC1 1 kW DET REMC2 1 kW GATE REMC3 200 W FB REMC4 750 W Note1: 4x optional EMC shield resistors RFRL Define max exposure time VSTR GND NVTFS5C478NL CSUPPLY R1 ZD Note2: Optional Zener diode for Mosfet Gate protection Figure 2. Application Diagram − using DC/DC RECOMMENDED EXTERNAL COMPONENTS FOR THE APPLICATION DIAGRAM Component Function Min Typ Max Unit C1 Decoupling capacitor 100 nF R1 FB current sense resistor 100 mW R2 DIAG pull−up resistor R3 Resistor for Exposure Time Limitation 0.8 15 kW R4 Resistor for Frame Rate Limitation 0.8 15 kW 20 kW REMC1 Optional EMC shield resistor for VSTR pin 1000 W REMC2 Optional EMC shield resistor for DET pin 1000 W REMC3 Optional EMC shield resistor for GATE pin 200 W REMC4 Optional EMC shield resistor for FB pin 750 W Figure 1 shows an example of the typical output drive configuration. The current through the external LEDs is equal to (Note 1) Optional EMC serial resistor shall be used in case if the LEDs are detached far away from the NCV7694 device. The resistors improves the EMC susceptibility of the application. (Note 2) Optional Zener diode may be used if the VS supply is higher than VGS voltage of the external transistor. In case of Open Load on the LEDs, the GATE voltage will go high, the Zener diode will limit the maximum voltage during eventual Open Load condition. ILEDs = VFB / R1 Where: • VFB is internal feedback reference = 300 mV • R1 is feedback resistor which set the current www.onsemi.com 2 NCV7694 Block Diagram VS Supply monitoring VSTRING FLASH RDETPull−up VSVth 1.22 V SCth = Vstr − 1.22 V Short Circuit LED − Vstr RFLASH DET Controlling, DIAG Short Circuit LED − GND 350 mV Monitoring, VSGth Filtering & decoding GATE RGATE RETL tETL = K ETL FB reference RETL Exposure Time Limit RFRL KFRL fFRL= 1/ tFRL tRTL= 300mV FB VFBref Open Load RFRL Frame Rate Limit 150 mV VOLth GND Figure 3. Simplified Block Diagram www.onsemi.com 3 NCV7694 Timing Characteristics e.g.: 45 Hz = 22 .2 ms period Typical pulse Too long pulse Short pulse Typical pulse Double frequency pulse FLASH ET threhsold Exposure Time Counter tETL tFRL FR threshold Frame Rate Counter LED output Typical pulse Short pulse Rest of the pulse Driver is activated with is cut−OFF because “ET” next rising edge of counter exceed the FLASH pulse threshold Second pulse is cut off because “FR” counter is not reach the threshold Figure 4. Simplified Internal Timing Characteristic of the Internal ETL, FRL Counter Safety Feature Behavior The period of the internals counters can be adjusted by external resistors. Total tolerance of the maximum TON or maximum Frame Rate limits will be affected by internal accuracy and accuracy of the external resistor by following equation: Using 1% external resistor approximately 13% tolerance can be achieved. External Resistor Approach The resistor (RETL, RFRL) creates bias voltage on the pins. Internal oscillator speed is derived from value of the resistors. While FLASH signal is high, internal ETL counter is counting and when the threshold is exceeded, the output is disabled. When FLASH pin is low, the Frame Rate timer is starting to count. The next rising edge of the FLASH signal is propagated to the output only if FRL timer expires. a TOTAL + www.onsemi.com 4 Ǹa2device ) a2resistor + Ǹ13.02 ) 12 + 13.04 % NCV7694 PIN FUNCTION DESCRIPTION 10−pin DFN10 Package Pin # Label 1 VS Description Supply voltage of the device 2 DIAG 3 FLASH Diagnostic output 4 RETL External resistor defines maximum Exposure Time Limit 5 RFRL External resistor defines maximum Frame Rate Limit 6 GND Ground 7 FB 8 GATE 9 DET 10 VSTRING Logic input for flash exposure time Feedback reference input 300 mV. Gate drive for external mosfet LED short detection input Short circuit reference voltage MAXIMUM RATINGS Symbol Parameter Min. Max. Unit Vmax_VS Continuous supply voltage Transient Voltage (t < 500 ms, “load dump”) −0.3 − +40 +40 V V Vmax_FLASH Low Voltage Input pin −0.3 +3.6 V Vmax_GATE Output voltage (during Open Load condition) −0.3 +VS V Vmax_RETL, RFRL DC voltage on Resistors −0.3 +3.6 V Vmax_FB Low Voltage Input pin −0.3 +3.6 V Vmax_DIAG Open Drain pin −0.3 +40 V Vmax_DET, VSTRING High Voltage Input pin −0.3 +40 V Tjmax Junction Temperature, TJ −40 +125 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ATTRIBUTES Parameer ESD Capability (Note 2) HBM (Human Body Model) CDM (Charge Device Model) MM (Machine Model) Moisture Sensitivity (DFN10−EP) (Note 3) Storage Temperature Range Package Thermal Resistance (DFN10−EP) (Note 4) − Junction to Ambient, RqJA − Junction to Board, RqJB − Junction to Case (Top), RqJC Ambient Temperature Value Unit ≥ ±4.0 ≥ ±1.0 ≥ ±200 kV kV V 1 MSL −40 to 150 °C 62.5 5.5 2.7 °C/W °C/W °C/W −40 to 105 °C 2. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114) ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model ESD MM according to AEC−Q100 3. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and Application Note AND8003/D. 4. Values represent thermal resistances under natural convection are obtained in a simulation on a JEDEC−standard, 2S2P; High Effective Thermal Conductivity Test Board as specified in JESD51−7, in an environment described in JESD51−2a. www.onsemi.com 5 NCV7694 ELECTRICAL CHARACTERISTICS (7 V < VS < 28 V, RETL = 4.99 kW, RFRL =1.96 kW, 4 V < VSTRING < 28 V, Transistor = NVTFS5C478NL, LED = SFH 4725AS, R1 = 100 mW, −40°C ≤ TJ ≤ 125°C, unless otherwise specified) Characteristic Symbol Conditions Min. Typ. Max. Unit 7 − 28 V 4.0 4.5 5.0 V 150 300 550 mV VS = 14 V, FLASH = High, IFRL, IETL subtracted − 4.0 6.0 mA VS = 14V, FLASH = Low, IFRL, IETL subtracted − 3.8 6.0 mA VS = 14 V, FLASH = High, Open Load condition, IFRL, IETL subtracted − 4.0 6.0 mA 130 150 170 °C − 15 − °C 270 4.5 300 − 330 − mV V − 8 15 μs GENERAL Supply Voltage Supply Under−Voltage Lockout VS_OP Parametric operation VSUV VS rising Supply Under−Voltage hysteresis VSUVhys Supply Current in normal condition I_VS Supply Current in Fault condition I_VSerr Thermal Shutdown (TSD) Thermal Hysteresis FB DRIVER FB Regulation reference Gate ON voltage VFBref VGATE tON Under Voltage Lockout < VS FB = 220 mV, DET = 1.0 V 50% criterion tOFF 50% criterion − 6.6 15 μs |(Falling time) – (Rising Time)| 50% criterion − 1.4 4 μs RGATE 5 30 100 kW VinH VinL 1.3 − 30 1.2 1.15 120 − 1.1 190 V V kW − 1.0 − V 0.8 − 15 kW − − 6.0 ms − 2.5 − kW/s 1.3 ±13.0 − − % mA − − 57.5 mA Propagation Delay FLASH rising – FB ON Propagation Delay FLASH falling – FB OFF FLASH propagation Delay Delta tpd_delta Output pull−down resistance FLASH INPUT PIN Input High Threshold Input Low Threshold Input pull−down resistance RFLASH PROGRAMMING RETL Bias voltage VETL ETL resistor operation range RETL Maximum TON time (typ) ETL multiplication TONmax KETL V ETL 1.0 + + 200.4 mA 4990 R ETL external resistor value operation range for RETL = 800 W => tETL= 320 ms; for RETL = 15 kW => tETL = 6 ms Derived from RETL and KETL(typ); valid for RETL = 15 kW I ETL + K ETL + t ETL + KETL tolerance Overcurrent protection RETL tolETL IETL_lim Open Load protection RETL IETL_open R ETL t ETL R ETL 4.99 + + 1.996 ms 2.5 K ETL Tolerance of Exposure Time Limit Short to ground Resistor detection for RETL < 750 W Open Load detection Resistor detection for RETL > 17.5 kW www.onsemi.com 6 NCV7694 ELECTRICAL CHARACTERISTICS (7 V < VS < 28 V, RETL = 4.99 kW, RFRL =1.96 kW, 4 V < VSTRING < 28 V, Transistor = NVTFS5C478NL, LED = SFH 4725AS, R1 = 100 mW, −40°C ≤ TJ ≤ 125°C, unless otherwise specified) Characteristic Symbol Conditions Min. Typ. Max. Unit PROGRAMMING FRL resistor operation range RFRL external resistor value operation range for RFRL = 1 kW => fFRL =100 Hz (10 ms) for RFRL = 10 kW => fFRL=10Hz (100 ms) 0.8 − 15 kW Maximum FLASH Frequency (typ) fmax Derived from RFRL and KFRL(typ); valid for RFRL = 800 W − − 125 Hz FRL multiplication KFRL K FRL + t FRL + R FRL t FRL − − 0.1 R FRL 1.96 + + 19.6 ms 0.1 K FRL 1 1 + + (51 Hz) t FRL 0.0196 Tolerance of Frame Rate Limit Short to ground Resistor detection for RFRL < 750 W Open Load detection Resistor detection for RFRL > 17.5 kW f FRL + KFRL tolerance Overcurrent protection RFRL tolFRL IFRL_lim Open Load protection RFRL IFRL_open 1.3 ±13.0 − − % mA − − 57.5 mA OPEN LOAD / SHORT TO GND Open Load Detection Threshold (FB pin) Open Load Blanking Time Short to GND Detection Threshold (DET pin) Short to GND Blanking Time VOLth tOLBlank FLASH = High 130 10 150 22 170 35 mV ms VSGth FLASH = Low 300 350 400 mV 5 10 15 ms VSTR ING − 1.22 10 120 VSTR ING − 0.9 15 190 V ms kW tSGBlank SHORT CIRCUIT Short to VSTRING Detection Threshold VSCth FLASH = High tSCBlank RDETPull−up Pull−up to VSTRING VSTR ING − 1.5 5 30 VSTRING diagnostic activation threshold VSTRth VSTRING voltage 2.0 2.2 2.4 V Output low level VOUTL Fault is present, IDIAG = 0.33 mA − 0.2 0.4 V Short Circuit Blanking Time Input pull−up resistor on DET pin DIAG OUTPUT www.onsemi.com 7 NCV7694 PINS DESCRIPTION FLASH Open Load condition, if the when FB voltage will be below threshold for longer than blanking time. It is not allowed to put external voltage higher than 0.19 V on the FB pin when the device is not active. The voltage on the FB pin has to be below 0.19 V during VS supply ramp up while FLASH PWM signal is already present. Flash Input pin is compatible with 1.8 V / 2.8 V logic of the ON Semiconductor image sensors. Internal pull down resistor is implemented to prevent unwanted switch on. Based on the RETL and RFRL resistors, the maximum TON FLASH time which can be propagated to the output is 6 ms and minimum TOFF time, which will can be set, is typically 8 ms. The NCV7694 can be used as companion device for 60 Hz camera sensors in full FLASH TON range or 120 Hz with limited TON range. GATE The NCV7694 can drive MOSFET transistors with minimum GATE voltage of 4.5 V. The preferred mosfet transistor is NVTFS5C478NL. DIAG RETL and RFRL Open Drain DIAG pin can be connected with pull up resistor to MCU which will be informed about a fault in case of Open Load, Short to VSTRING or Short to Ground of the LEDs. Diagnostic pin can be connected to the Enable pin of the DC/DC converter. The output VSTRING voltage will be disconnected and user and devices are protected against damages. The NCV7694 driver can also inform the system while FLASH pulse is too long or is send too frequent. The Open Load and Short circuit detections of the RETL, RFRL timing resistors are reported on the DIAG pin as well as the Thermal Shutdown Flag and Under Voltage status on the VS supply. To reduce thermal retina hazard and thermal injury risk of the cornea, the safety turn−off function is implemented. External RETL and RFRL resistor defines maximum exposure time and maximum frame rate. The maximum times are calculated using resistor values of the RETL and RFRL resistors divided by KFRL or KETL coefficients. If the FLASH pulse is permanently HIGH, the output pulse is being activated only after FRL timer expire and during the allowed ETL time period. Short and Open on the RETL and RFRL To be able detect the defect on the external resistors the Open Load and Short to Ground detections are implemented in the NCV7694. If the resistor value will be below 750 W, short to ground will be detected. If the resistor value becomes higher than 17.5 kW, Open Load is detected. As soon as a fault condition is detected, then after a short filter time the driver is switched off and fault on the DIAG pin is reported DET Detection pin is sensing the voltage at the cathode of the LEDs. The voltage on DET pin during the FLASH−ON period should be in range from VSGth (0.35 V) to VSVth (VSTRING – 1.22 V). Below 0.35 V the device will detect Short to ground and above VSTRING minus 1.22 V the device will detect Short LEDs to VSTRING. In case of DET pin is disconnected, device will go into fault because internal pull−up to VSTRING is implemented. Short to ground can be detected only when output is not activated. VSTRING High voltage input pin sense the voltage on the top of the LEDs and enable the Open Load and Short diagnostic as soon as the voltage exceed the threshold VSTRth >2.2 V. If DC/DC converter is not used, the VSTRING voltage has to be connected to the VS pin. If the LED diagnostic is not required, then the VSTRING pin has to be grounded. FB A feedback loop regulates the current through the external LEDs. The voltage across the external sense resistor is regulated to the 300 mV typ. Using FB pin can be detected www.onsemi.com 8 NCV7694 DETAILED OPERATING DESCRIPTION Under Voltage Lockout short filter time the driver is switched off and fault on the DIAG pin is reported. Under voltage Lockout feature is used to protect against an abnormal status during startup. When the initial soft start voltage is greater than 4.5 V (typ) the device starts to be active. Below this threshold the GATE output pin is pulled low to ground to prevent opening external N−MOS transistor and DIAG pin is pulled low to report. Exceeding the Flash Pulse If the duration of the FLASH pulse exceeds the pre−defined timing or the FLASH pulse repetition is too frequent, the GATE of the transistor is switched off. The limitation of the FLASH pulses is also reported on the DIAG pin. The first FLASH pulse after power−on−reset should be delayed longer than FRL period, otherwise the FLASH pulse will be limited and DIAG pin will report a fault until FRL counter expires. Thermal Shutdown The thermal shutdown circuit checks the internal junction temperature of the device. When the internal temperature rises above the Thermal shutdown threshold, then after a www.onsemi.com 9 NCV7694 Open Load Detection V BAT VDD_MCU V STRING DC /DC NCV898031 EN C1 R2 20 kW DIAG VSTR VSTRING DET FLASH DIAG NCV7694 R3 Define max exposure time GATE FB R ETL VFB < 150 mV R1 R FRL R4 Define max frequency > VSTRth Open Load FLASH = High FLASH VS GND Figure 5. Open Load Detection Circuit approximately 2 ms to re−activate the DC/DC VSTRING voltage of the converter. With typical FRL setting, the driver will be ready to perform the diagnostic on the next FLASH pulse. If the ENable of the DC/DC converter is not driven by NCV7694, the Open Load is reported to the DIAG pin. Diagnostic is not active when VSTRING < VSTRth. The first FLASH pulse will not be detected when driver is going to be recovered from a Short to GND fault because the DC/DC converter in not fully active. When Open Load fault is introduced during FLASH = High and VSTRING > VSTRth, the 22 ms blanking time eliminate the false faults. When blanking time expires, the NCV7694 immediately report a fault on the DIAG pin. The output GATE pin remains active. The DIAG pin is recovered with the falling edge on the FLASH pin or after ETL counter is expired. If EN pin of the DC/DC converter is connected to the DIAG output, the Open Load causes switching OFF the VSTRING voltage. The DIAG pin is recovered as soon as FLASH pin goes low or ELT counter expired. It will take www.onsemi.com 10 NCV7694 OPEN LOAD BEHAVIOR Conditions: VS powered, DC /DC used, EN connected to the DIAG pin VSTRING Open Load present V STRth VGATE FLASH input VDET 2.2 V VDIAG t OLBlank t DC_EN t DC_EN t DC_EN = 1.5 ms activation delay of the DC/DC FLASH is Fault is present V STRING is not propagated and detected sufficient, Open to the output LED is OFF Load isn’t detected Figure 6. Timing of the Open Load Behavior www.onsemi.com 11 NCV7694 Short to Ground output diagnostic pin can be connected directly to the Enable of the DC/DC converter. In case of fault, the DC/DC converter is automatically disabled after blanking times. In case of short to ground, huge amount of current is passing through the LEDs. To protect the LEDs and Human eyes, the safety mechanism can be implemented. The DIAG V BAT VDD_MCU EN V STRING DC / DC NCV898031 C1 R2 20 kW High LED current VS VSTR FLASH = Low DIAG DET V DET < 350 mV FLASH DIAG GATE NCV7694 FB R ETL R3 Define max exposure time R1 R FRL R4 Define max frequency Short DET pin to Ground FLASH GND Figure 7. Short to Ground Detection Circuit input pin. (The next FLASH pulse will not be propagated to the output, because the DC/DC converter is not activated). The microprocessor can distinguish between Short to GND and Open Load during FLASH = Low. If the DIAG pin remains low during FLASH = Low, the Short to Ground was detected and it is not recommended to not turn ON the VSTRING voltage. When Short to Ground is introduced during VSTRING > VSTRth and FLASH is low, the 10 ms blanking time eliminate the false faults. When blanking time expires, the NCV7694 immediately report a fault on the DIAG pin which leads to the switching OFF the VSTRING voltage to protect the LEDs. The output GATE pin remains active. The device is recovered with next rising edge on the FLASH www.onsemi.com 12 NCV7694 BEHAVIOR OF THE SHORT TO GND Conditions: VS powered, DC /DC used, EN connected to the DIAG pin V STRING Short to GND V STRth V DET V GATE FLASH input (VSTRING – VF) 2.2V t SGBlank V DIAG t SGBlank t DC_EN t DC_EN t DC_EN = 1.5 ms activation delay of the DC/DC FLASH is Fault is present V STRING is not propagated and detected sufficient, Open to the output LEDs are OFF Load isn’t detected *) DIAG latched until next FLASH rising edge Figure 8. Timing of the Short to GND Behavior www.onsemi.com 13 NCV7694 Short to VS VBAT VDD_MCU VSTRING DC / DC NCV898031 EN C1 R2 20 kW VS V STRING > V STRth VSTR FLASH = High VDET > (V STRING – 1.22)V FLASH FLASH DIAG DIAG DET FB RETL R3 Define max exposure time GATE − OFF R1 RFRL R4 Define max frequency High transistor current GATE NCV7694 GND Figure 9. Short to VSTRING Detection Circuit When Short Cathode of the LEDs to VSTRING voltage is introduced during the FLASH = High and VSTRING > VSTRth, the 10 ms blanking time eliminate the false faults. When the blanking time expires, the NCV7694 immediately switch OFF the GATE output to protect the external transistor against high power dissipation. The DIAG pin will report a fault which will lead to switching OFF the DC/DC VSTRING voltage if the DIAG pin is connected to the Enable of the DC/DC converter. The fault is latched during the FLASH signal is high or until ETL counter expires. The device will be recovered only with next falling edge on the FLASH or when the ETL counter is expired. The diagnostic is not active when VSTRING < VSTRth or also during FLASH = Low. www.onsemi.com 14 NCV7694 Behavior of the Short to VSTRING: Conditions: VS powered, DC /DC used, EN connected to the DIAG pin V STRING Short to V STRING t DC _EN V STRth FLASH input V DET 2.2V V GATE t SCBlank V DIAG t SCBlank FLASH is Fault is present Fault is present propagated and detected GATE is ON during to the output LED is OFF blanking time only Figure 10. Timing of the Short to VSTRING Behavior www.onsemi.com 15 NCV7694 Overview of the Faults FLASH = OFF OFF ON VSTRING LEDs are OFF VSTR Normal Operation GATE LEDs are ON VSTRING – VF_LEDs GATE enabled FB 0V 300mV R1 R1 OFF VSTRING ON VSTRING VSTRING VSTRING LEDs are OFF LEDs are OFF VSTR DET_PULL UP VSTR ~ VSTRING DET ~ VSTRING DET GATE disabled GATE FB ~ VSTRING ~ 0V enabled FB ~ 0V ~ 0.0mV R1 R1 Unrecognizable VSTR DET_PULL UP ON VSTRING High ILED Short to Ground VSTRING DET 0V GATE LEDs are stressed DC/DC can disable VSTRING VSTRING VSTR 0V DET GATE disabled FB VSTRING High ILED OFF DET < 0.35 V or FB < 150mV 0.0mV ~ 0.0mV R1 R1 Fault is latched until next rising DET < 0.35 V OFF Short to VSTRING VSTRING DET LEDs are OFF GATE VSTRING VSTRING VSTRING GATE FB 0V VSTRING enabled 300 mV ON R1 R1 DET > (VSTRING – 1.22 V) Unrecognizable Figure 11. Overview of the Faults www.onsemi.com 16 MOSFET is stressed DC/DC can disable VSTRING VSTR DET disabled FB Same as Open Load condition DET < 0.35 V or FB < 150 mV ON VSTRING VSTR DET_PULL UP LEDs are stressed DC/DC can disable VSTRING enabled FB High PD(N−MOS) Open Load VSTRING VSTR disabled FB VSTRING > VSTRth VSTRING DET ~VSTRING DET DET_PULL UP ON VSTRING > VSTRth VSTRING MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFNW10, 3x3, 0.5P CASE 507AG ISSUE B 1 SCALE 2:1 DATE 14 APR 2020 GENERIC MARKING DIAGRAM* 1 XXXXX XXXXX ALYWG G XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON73716G DFNW10, 3x3, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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