NL17SV32XV5T2

NL17SV32XV5T2 Single Gate 2−Input OR Gate The NL17SV32 is an ultra−high performance 2 input OR gate manufactured in 0.35 m C MOS technology with excellent performance down to 0.9 V. This device is ideal for extremely high−speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. Features http://onsemi.com MARKING DIAGRAM UM MG G • • • • • • • • • • • Extremely High Speed: tPD = 1.0 ns (Typ) at VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation Balanced "24 mA Output Drive @ 3.3 V Near Zero Static Supply Current Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm These are Pb−Free Devices Cellular Digital Camera PDA Digital Video SOT−553 CASE 463B Typical Applications UM = Device Code M = Date Code* A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN DIAGRAM A 1 5 VCC Important Information • High ESD Ratings for Handling: • Human Body Model: 2000 V Machine Model: 200 V Latchup Max Rating: 500 mA B 2 Industry Standard GND 3 4 Y • Compatible with Fairchild’s NC7SV32 and TI’s SN74AUC1G32 FUNCTION TABLE Input A L L H H Input B L H L H Output Y L H H H 1 2 3 4 5 *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. IN A IN B w1 PIN ASSIGNMENT Input Input GND Output VCC A B − Y − ORDERING INFORMATION Device NL17SV32XV5T2 Package Shipping † OUT Y SOT−553* 4000 Tape & Reel Figure 1. Logic Symbol NL17SV32XV5T2G SOT−553* 4000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. © Semiconductor Components Industries, LLC, 2005 September, 2005 − Rev. 2 1 Publication Order Number: NL17SV32XV5T2/D NL17SV32XV5T2 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1.0 mm from Case for 10 seconds Junction Temperature Under Bias Thermal Resistance (Note 1) Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating Oxygen index: 28 to 34 VI < GND VO = GND VO = VCC Rating Value −0.5 to + 4.6 −0.5 to + 4.6 −0.5 to VCC +0.5 ±50 −50 +50 ±50 ±50 ±50 − 65 to +150 260 +150 250 250 Level 1 UL 94 V−0 @ 0125 in Unit V V V mA mA mA mA mA °C °C °C °C/W mW Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN Vout IOH/IOL Positive DC Supply Voltage Digital Input Voltage Output Voltage Output Current VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V −40 VCC = 3.3V ± 0.3 V 0 Parameter Min 0.9 0 0 Max 3.6 3.6 VCC ±24 ±18 ±6 ±4 ±2 ±0.1 +85 10 Unit V V V mA tA tr, tf Operating Temperature Range. All Package Types Input Rise or Fall Time °C nS/V DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 http://onsemi.com 2 NL17SV32XV5T2 DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND) TA = 25°C Symbol VIH Parameter High Level Input Voltage Condition VCC 0.90 1.10 v= VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 IOH = −100 mA 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.30 v VCC v 2.70 2.70 v VCC v 3.60 2.30 v VCC v 2.70 2.70 v VCC v 3.60 2.70 v VCC v 3.60 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 2.30 v VCC v 2.70 2.70 v VCC v 3.60 2.70 v VCC v 3.60 0.90 to 3.60 0 VI = VCC or GND 0.90 to 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 0.75 x VCC 0.75 x VCC 1.25 2.0 1.8 2.2 1.7 2.4 2.2 0.1 0.1 0.2 0.2 0.2 0.2 0.25 x VCC 0.25 x VCC 0.3 0.4 0.4 0.6 0.4 0.55 ±0.1 1 0.9 Min 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 0.75 x VCC 0.75 x VCC 1.25 2.0 1.8 2.2 1.7 2.4 2.2 0.1 0.1 0.2 0.2 0.2 0.2 0.25 x VCC 0.25 x VCC 0.3 0.4 0.4 0.6 0.4 0.55 ±0.9 5 5 mA mA mA V Max TA = −40 to 85°C Min 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Max Unit V VIL Low Level Input Voltage V VOH High Level Output Voltage V IOH = −2.0 mA IOH = −4.0 mA IOH = −6.0 mA IOH = −12 mA IOH = −18 mA IOH = −24 mA VOL Low Level Output Voltage IOL = 100 mA IOL = 2.0 mA IOL = 4.0 mA IOL = 6.0 mA IOL = 12 mA IOL = 18 mA IOL = 24 mA IIN IOFF ICC Input Leakage Current Power Off Leakage Current Quiescent Supply Current 0 = VI = 3.6 V http://onsemi.com 3 NL17SV32XV5T2 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C Symbol TPHL, TPLH Parameter Propagation Delay Condition CL = 15 pF, RL = 1.0 MW CL = 15 pF, RL = 2.0 kW CL = 30 pF, RL = 500 kW VCC 0.90 1.10 v VCC v 1.30 1.40 v VCC v 1.60 1.65 v VCC v 1.95 2.30 v VCC v 2.70 2.70 v VCC v 3.60 0 0 VI = 0 V or VCC F = 10 MHz 0.90 to 3.60 3.0 1.0 1.0 0.8 0.7 Min 25°C Typ 13 6.0 3.2 2.0 1.2 1.0 2.0 4.5 20 15.8 8.7 6.0 4.1 3.3 1.0 1.0 1.0 0.7 0.6 18.6 9.7 6.8 4.7 4.0 Max 85°C Min Max Unit nS nS nS CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance pF pF pF http://onsemi.com 4 NL17SV32XV5T2 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B D − X− 5 4 A L 1 2 3 E −Y− b 5 PL 0.08 (0.003) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E e L HE MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM MAX 0.022 0.024 0.009 0.011 0.005 0.007 0.063 0.067 0.047 0.051 0.020 BSC 0.004 0.008 0.012 0.059 0.063 0.067 MIN 0.020 0.007 0.003 0.059 0.043 HE e c M XY SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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