NL17SZU04DFT2

NL17SZU04 Single Unbuffered Inverter The NL17SZU04 is a single unbuffered inverter in two tiny footprint package. The device performs much as LCX multi−gate products in speed and drive. Features • • • • • • • http://onsemi.com Tiny SOT−353 and SOT−553 Packages Source/Sink
16 mA at 4.5 V VCC Over−Voltage Tolerant Inputs and Outputs Pin For Pin with NC7SZU04P5X, TC7SZU04FU and TC7SZU04AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available MARKING DIAGRAMS 5 5 L6d 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 1 d = Date Code 5 5 NC 1 A 2 GND 3 5 L6 D 1 SOT−553 XV5 SUFFIX CASE 463B VCC L6 D 4 1 = Device Marking = One Digit Date Code Y PIN ASSIGNMENT Figure 1. Pinout (Top View) A 1 Y Pin Function 1 NC 2 A 3 GND 4 Y 5 VCC Figure 2. Logic Symbol FUNCTION TABLE Output Input Y=A A Y L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.  Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 4 1 Publication Order Number: NL17SZU04/D NL17SZU04 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 7.0 V VIN DC Input Voltage 0.5 to 7.0 V DC Output Voltage 0.5 to 7.0 V VOUT IIK DC Input Diode Current 50 mA IOK DC Output Diode Current 50 mA IOUT DC Output Sink Current
50 mA ICC DC Supply Current per Supply Pin
100 mA 65 to 150 °C 260 °C TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias JA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD 150 °C SOT−353 (Note 1) SOT−553 350 496 °C/W SOT−353 SOT−553 186 135 mW Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Class IC Class A N/A V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Max Unit 1.65 1.5 5.5 5.5 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V DC Output Voltage 0 5.5 V −40 +85 °C 0 0 100 20 ns/V VOUT TA Operating Temperature Range tr, tf Input Rise and Fall Time (Operating) Data Retention Only Min VCC = 3.0 V
0.3 V VCC = 5.0 V
0.5 V http://onsemi.com 2 NL17SZU04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VIH High−Level Input Voltage VIL Low−Level Input Voltage VOH VIN = VIL or VIH VOL Low−Level Output Voltage VIN = VIH or VOH IIN (V) Min 1.65 to 1.85 0.85 VCC 0.85 VCC 2.3 to 5.5 0.8 VCC 0.8 VCC Condition High−Level Output Voltage IOH = −100 A IOH = −3 mA
40
C  TA  85
C TA = 25
C VCC Typ Max Min Max Unit V 1.65 to 1.85 0.15 VCC 0.15 VCC 2.3 to 5.5 0.2 VCC 0.2 VCC V V 1.65 to 5.5 1.65 VCC − 0.1 1.29 VCC 1.52 VCC − 0.1 1.29 IOH = −4 mA 2.3 1.9 2.1 1.9 IOH = −6 mA 2.7 2.2 2.4 2.2 IOH = −8 mA 3.0 2.4 2.7 2.4 IOH = −12 mA 3.0 2.3 2.5 2.3 IOH = −16 mA 4.5 3.8 4.0 3.8 IOL = 100 A IOL = 3 mA 1.65 to 5.5 1.65 0.08 0.1 0.24 0.1 0.24 IOL = 4 mA 2.3 0.20 0.3 0.3 IOL = 6 mA 2.7 0.22 0.4 0.4 IOL = 8 mA 3.0 0.28 0.4 0.4 IOL = 12 mA 3.0 0.38 0.55 0.55 IOL = 16 mA 4.5 0.42 0.55 0.55 0 to 5.5
0.1
1.0 A 0 1 10 A 1.65 to 5.5 1 10 A Input Leakage Current VIN = VCC or GND IOFF Power Off−Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND V AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Fi (Figure 3 and d 4)) TA = 25
C
40
C  TA  85
C Condition (V) Min Max Min Max Unit RL = 1 M
CL = 15 pF 1.8
0.15 1.0 11.7 1.0 12.1 ns RL = 1 M
CL = 15 pF 2.5
0.2 0.8 6.2 0.8 6.5 RL = 1 M
CL = 15 pF 3.3
0.3 0.5 4.5 0.5 4.8 1.0 6.0 1.0 6.5 0.5 3.9 0.5 1.0 0.8 5.0 0.8 5.5 RL = 500 
CL = 50 pF RL = 1 M
CL = 15 pF 5.0
0.5 RL = 500 
CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.5 pF CPD Power Dissipation Capacitance ( (Note 5)) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 6.5 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 10 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD
VCC
fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD
VCC2
fin + ICC
VCC. http://onsemi.com 3 NL17SZU04 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% 10% 10% tPHL OUTPUT GND tPLH RL INPUT CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL17SZU04DFT2 NL 1 NL17SZU04DFT2G NL NL17SZU04XV5T2 NL Device Order Number Technology Device Function Package Suffix Tape and Reel Suffix 7 SZ U04 DF 1 7 SZ U04 1 7 SZ U04 Package Type Tape and Reel Size† T2 SOT−353/ SC70−5/ SC−88A 178 mm, 3000 Unit DF T2 SOT−353/ SC70−5/ SC−88A (Pb−Free) 178 mm, 3000 Unit XV5 T2 SOT−553* 178 mm, 4000 Unit †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZU04 PACKAGE DIMENSIONS SOT−353 DF SUFFIX 5−LEAD PACKAGE CASE 419A−02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm  inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZU04 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX 5−LEAD PACKAGE CASE 463B−01 ISSUE A A −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. C K 4 1 2 B −Y− 3 D G S DIM A B C D G J K S J 5 PL 0.08 (0.003) M X Y MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 STYLE 1: PIN 1. 2. 3. 4. 5. INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 STYLE 2: PIN 1. 2. 3. 4. 5. CATHODE ANODE CATHODE CATHODE CATHODE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm  inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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