NL27WZ126

NL27WZ126 Dual Buffer with 3−State Outputs The NL27WZ126 is a high performance dual noninverting buffer operating from a 1.65 V to 5.5 V supply. Features http://onsemi.com MARKING DIAGRAM 8 • • • • • • • • • • • Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements 3−State OE Input is Active−High Replacement for NC7WZ126 Chip Complexity = 72 FETs Pb−Free Package is Available 8 1 US8 US SUFFIX CASE 493 M2 M G G 1 M2 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. OE1 1 8 VCC PIN ASSIGNMENT Pin 1 Function OE A1 Y2 GND A2 Y1 OE2 VCC A1 2 7 OE2 2 3 Y2 3 6 Y1 4 5 GND 4 5 A2 6 7 8 Figure 1. Pinout (Top View) FUNCTION TABLE Input A1 OE1 A2 OE2 EN 1 Y1 Y2 OEn H H L X = Don’t Care n = 1, 2 An H L X Output Yn H L Z Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 April, 2006 − Rev. 6 Publication Order Number: NL27WZ126/D NL27WZ126 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance (Note 1) Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) VI < GND VO < GND Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to )7.0 *50 *50 $50 $100 $100 *65 to )150 260 )150 250 250 Level 1 UL 94 V−0 @ 0.125 in > 2000 > 200 N/A V Unit V V V mA mA mA mA mA °C °C °C °C/W mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO TA Dt/DV Supply Voltage Input Voltage Output Voltage Operating Free−Air Temperature Input Transition Rise or Fall Rate VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Parameter Operating Data Retention Only (Note 5) (HIGH or LOW State) Min 1.65 1.5 0 0 *40 0 0 0 Max 5.5 5.5 5.5 5.5 )85 20 10 5 Unit V V V °C ns/V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 NL27WZ126 DC ELECTRICAL CHARACTERISTICS VCC Symbol VIH VIL VOH Parameter High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage VIN = VIH IOH = 100 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA IOL = 100 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA VIN = VCC or GND VOUT = 5.5 V VIN = VCC or GND VIN = VIL or VIH 0 V v VOUT v 5.5 V Condition (V) 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 2.7 3.0 3.0 4.5 1.65 to 5.5 1.65 2.7 3.0 3.0 4.5 0 to 5.5 0 5.5 1.65 to 5.5 VCC − 0.1 1.9 2.2 2.4 2.3 3.8 VCC 2.1 2.4 2.7 2.5 4.0 0.20 0.22 0.28 0.38 0.42 0.1 0.3 0.4 0.4 0.55 0.55 $0.1 1 1 $0.5 Min 0.7 VCC 0.3 VCC VCC − 0.1 1.9 2.2 2.4 2.3 3.8 0.1 0.3 0.4 0.4 0.55 0.55 $1.0 10 10 $5 TA = 255C Typ Max *405C v TA v 855C Min 0.7 VCC 0.3 VCC Max Unit V V V VOL Low−Level Output Voltage VIN = VIH or VIL V IIN IOFF ICC IOZ Input Leakage Current Power Off−Output Leakage Current Quiescent Supply Current 3−State Output Leakage mA mA mA mA AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) VCC Symbol tPLH tPHL Parameter Propagation Delay AN to YN (Figures 3 and 4, Table 1) Condition RL = 1 MW RL = 1 MW RL = 500 W RL = 1 MW RL = 500 W tOSLH tOSHL tPZH tPZL Output to Output Skew (Note 6) Output Enable Time (Figures 5, 6 and 7, Table 1) RL = 500 W RL = 500 W RL = 250 W CL = 15 pF CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 50 pF CL = 50 pF CL = 50 pF 3.3 $ 0.3 5.0 $ 0.5 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 tPHZ tPLZ Output Enable Time (Figures 5, 6 and 7, Table 1) RL and R1= 500 W CL = 50 pF 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 3.0 1.8 1.2 0.8 2.5 1.5 0.8 0.3 5.0 $ 0.5 (V) 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 Min 2.0 1.0 0.8 1.2 0.5 0.8 TA = 255C Typ Max 12 7.5 5.2 5.7 4.5 5.0 1.0 0.8 14 8.5 6.2 5.5 12 8.0 5.7 4.7 3.0 1.8 1.2 0.8 2.5 1.5 0.8 0.3 *405C v TA v 855C Min 2.0 1.0 0.8 1.2 0.5 0.8 Max 13 8 5.5 6.0 4.8 5.3 1.0 0.8 15 9.0 6.5 5.8 13 8.5 6.0 5.0 ns ns ns Unit ns 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. This specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 3 NL27WZ126 CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance (Note 7) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical 2.5 2.5 9 11 Unit pF pF pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. tf = 3 ns 90% 90% Vmi tf = 3 ns VCC INPUT 10% OE = GND INPUT A and B Vmi 10% OUTPUT CL * RL GND tPHL tPLH VOH OUTPUT Y Vmo Vmo VOL *Includes all probe and jig capacitance. A 1 MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. tPLH or tPHL 2.7 V OE Vmi Vmi 0V tPZH Vmo tPHZ VCC VOH − 0.3 V ≈0V tPZL tPLZ ≈ 3.0 V On Vmo VOL + 0.3 V GND On Figure 5. AC Output Enable and Disable Waveform http://onsemi.com 4 NL27WZ126 Table 1. Output Enable and Disable Times tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 nsv VCC Symbol Vmi Vmo 3.3 V $ 0.3 V 1.5 V 1.5 V 2.7 V 1.5 V 1.5 V 2.5 V $ 0.2 V VCC/2 VCC/2 2 VCC INPUT VCC OUTPUT CL = 50 pF RL = 250 W INPUT R1 = 500 W OUTPUT CL = 50 pF RL = 500 W A 1 MHz square input wave is recommended for propagation delay tests. A 1 MHz square input wave is recommended for propagation delay tests. Figure 6. tPZL or tPLZ Figure 7. tPZH or tPHZ DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL27WZ126US NL27WZ126USG Logic Circuit Indicator NL NL No. of Gates per Package 2 2 Temp Range Identifier 7 7 Device Function 126 126 Package Suffix US USG Package Type US8 US8 (Pb−Free) Tape and Reel Size† 178 mm, 3000 Units 178 mm, 3000 Units Technology WZ WZ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NL27WZ126 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B J −X− A 8 5 −Y− DETAIL E B L 1 4 R S U C H N TXY V P G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC −T− SEATING PLANE D 0.10 (0.004) K M 0.10 (0.004) T R 0.10 TYP M F DETAIL E SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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