NLAS5213BMUTAG

NLAS5213 1 W RON DPST and Dual SPST Switches The NLAS5213A and NLAS5213B are DPST and Dual SPST devices, respectively. They each consist of 2 single throw switches and are both designed for audio applications within portable devices. The NLAS5213A is controlled with a single enable pin while the NLAS5213B has two independent enables. Both the NLAS5213A and NLAS5213B operate over a wide VCC range, 1.65 V to 4.5 V, and maintain a very low RON: 1.3  Max @ VCC = 4.2 V. Each is available in a choice of two packages: US8 and UDFN8. http://onsemi.com MARKING DIAGRAM 8 Features • • • • • • US8 US SUFFIX CASE 493 8 1 PST and Dual SPST Pinouts RON: 1.3  Max @ VCC = 4.2 V VCC Range: 1.65 V to 4.5 V 8 kV Human Body Model ESD on I/O to GND UDFN8 or US8 Packages Available These are Pb−Free Devices XXMG G 1 8 1 XX M G Typical Applications • Mobile Phones • Portable Devices UDFN8 MU SUFFIX CASE 517AJ XXM G = Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) APPLICATION DIAGRAM CODEC NLAS5213 ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 9 of this data sheet. © Semiconductor Components Industries, LLC, 2009 January, 2009 − Rev. 2 1 Publication Order Number: NLAS5213/D NLAS5213 NO1 1 8 COM1 NO1 1 8 COM1 IN 2 7 GND IN1 2 7 GND N.C. 3 6 VCC IN2 3 6 VCC NO 2 4 5 COM2 NO 2 4 5 COM2 NLAS5213A NLAS5213B Figure 1. Functional Block Diagram Pinouts (UDFN8) COM1 1 8 NO1 COM1 1 8 NO1 GND 2 7 IN GND 2 7 IN1 VCC 3 6 N.C. VCC 3 6 IN2 COM2 4 5 NO2 COM2 4 5 NO2 NLAS5213B NLAS5213A Figure 2. Functional Block Diagram Pinouts (US8) http://onsemi.com 2 NLAS5213 NLAS5213A Pin # UDFN8 US8 Name Direction Description 1 8 NO1 I/O Normally Open Signal Line of Switch 1 2 7 IN Input Control Input 3 6 N.C. N/A No Connect 4 5 NO2 I/O Normally Open Signal Line of Switch 2 5 4 COM2 I/O Common Signal Line of Switch 2 6 3 VCC Input Analog Supply Voltage 7 2 GND Input Ground 8 1 COM1 I/O Common Signal Line of Switch 1 UDFN8 US8 Name Direction Description 1 8 NO1 I/O Normally Open Signal Line of Switch 1 2 7 IN1 Input Control Input of Switch 1 3 6 IN2 Input Control Input of Switch 2 4 5 NO2 I/O Normally Open Signal Line of Switch 2 5 4 COM2 I/O Common Signal Line of Switch 2 6 3 VCC Input Analog Supply Voltage 7 2 GND Input Ground 8 1 COM1 I/O Common Signal Line of Switch 1 NLAS5213B Pin # NLAS5213A FUNCTION TABLE NLAS5213B FUNCTION TABLE IN NO1, NO2 IN NO1, NO2 0 1 OFF ON 0 1 OFF ON http://onsemi.com 3 NLAS5213 OPERATING CONDITIONS MAXIMUM RATINGS Symbol Pins Parameter Value Positive DC Supply Voltage Condition Unit VCC VCC −0.5 to 5.5 V VIS NOx, NCx, COMx Analog Signal Voltage −0.5 to VCC + 0.5 V VIN IN1, IN2 Control Input Voltage −0.5 to 5.5 V ICC VCC IIS_CON NOx, NCx, COMx Positive DC Supply Current Analog Signal Continues Current ±300 Closed Switch mA IIS_PK NOx, NCx, COMx Analog Signal Peak Current ±500 10% Duty Cycle mA IIN IN Control Input Current ±20 mA −65 to 150 ºC TSTG 50 Storage Temperature Range mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS* Symbol Pins Parameter Value Unit VCC VCC 1.65 to 4.5 V VIS NOx, NCx, COMx Analog Signal Voltage 0 to VCC V VIN IN1, IN2 Control Input Voltage 0 to VCC V Operating Temperature Range −40 to 85 ºC TA Positive DC Supply Voltage Condition Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particularconditions listed for each section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. ESD PROTECTION Symbol ESD Parameter Value Human Body Model I/O to GND All Pins Unit kV 8.0 4.0 DC ELECTRICAL CHARACTERISTICS CONTROL INPUT (Typical: T = 25°C, VCC = 3.3 V) −40°C to +85°C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit VIH OE Control Input HIGH Voltage 2.7 3.3 4.2 1.4 1.7 2.3 − − V VIL OE Control Input LOW Voltage 2.7 3.3 4.2 − − 0.5 0.5 0.8 V IIN OE Control Input Leakage Current 1.65 − 4.5 − − ±1.0 A 0 ≤ VIS ≤ VCC http://onsemi.com 4 NLAS5213 SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C, VCC = 3.3 V) −40°C to +85°C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max 1.65 − 4.5 − − 1.0 Unit A 3.6 − − 10.0 A ICC VCC Quiescent Supply Current VIS = VCC or GND; ID = 0 A ICCT VCC Increase in ICC per Control Voltage VIN = 2.6 V OFF State Leakage 0 ≤ VIS ≤ VCC 1.65 − 4.5 − − ±1.0 A Power OFF Leakage Current 0 ≤ VIS ≤ VCC 0 − − ±1.0 A IOZ IOFF D+, D− ON RESISTANCE (Typical: T = 25°C, VCC = 3.3 V) −40°C to +85°C VCC (V) Min RON On−Resistance ION = −100 mA VIS = 0 to VCC 2.7 3.3 4.2 − RFLAT On−Resistance Flatness ION = −100 mA VIS = 0 to VCC 2.7 3.3 4.2 − RON On−Resistance Matching ION = −100 mA VIS = 0 to VCC 2.7 3.3 4.2 − Symbol Pins Parameter Test Conditions Typ Max Unit 2.0 1.4 1.3  0.32 0.35 0.37 −  0.16 0.16 0.15 −  AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 5 pF, f = 1 MHz) −405C to +855C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit tON Closed Turn−ON Time to Open 1.65 − 4.5 − 20 − ns tOFF Open to Turn−OFF Time Closed 1.65 − 4.5 − 15 − ns 1.65 − 4.5 − 496 − MHz BW −3 dB Bandwidth CL = 5 pF ISOLATION (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 5 pF, f = 1 MHz) −405C to +855C Symbol Pins VCC (V) Min Typ Max Unit OIRR Open OFF−Isolation 1.65 − 4.5 − −57 − dB XTALK HSD+, HSD− Non−Adjacent Channel Crosstalk 1.65 − 4.5 − −97 − dB Parameter Test Conditions CAPACITANCE (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 5 pF, f = 1 MHz) −405C to +855C Symbol Pins Parameter Test Conditions Min Typ Max Unit CIN OE Control Pin Input Capacitance VCC = 0 V − 8.5 − pF CON HSD+, to D+ ON Capacitance VIN = 0 V − 32 − pF COFF HSD+, HSD− OFF Capacitance VIS = 3.3 V; VIN = 3.3 V − 19 − pF http://onsemi.com 5 NLAS5213 1.6 1.4 1.6 85°C 25°C 1.2 1.2 −40°C RDS(on) () 1 0.8 0.6 1 −40°C 0.8 0.6 0.4 0.4 0.2 0.2 0 0 0 0.4 0.8 1.2 1.6 2 2.4 0 0.4 0.8 1.2 1.6 2 2.4 Vin (V) Vin (V) Figure 3. RON @ VCC = 2.7 V Figure 4. RON @ VCC = 3.3 V 1.4 85°C 1.2 25°C 1 RDS(on) () RDS(on) () 85°C 1.4 25°C −40°C 0.8 0.6 0.4 0.2 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 Vin (V) Figure 5. RON @ VCC = 4.2 V http://onsemi.com 6 3.6 4 2.8 3.2 NLAS5213 160 140 VCC = 4.3 V 120 ICC, (A) 100 80 60 VCC = 3.3 V 40 VCC = 2.7 V 20 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 VIN, (V) Figure 6. ICC vs. VIN VCC DUT VCC Input Output GND VOUT 0.1 F 50  35 pF tBMM Output 50 % OF DROOP VOLTAGE DROOP Switch Select Pin Figure 7. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% 0V Output VOUT Open 50% 50  VOH 90% 35 pF 90% Output VOL Input tON Figure 8. tON/tOFF VCC VCC Input DUT Output 50% 50% 0V 50  VOUT Open tOFF VOH 35 pF Output Input tOFF Figure 9. tON/tOFF http://onsemi.com 7 10% 10% VOL tON NLAS5213 50  Reference DUT Transmitted Input Output 50  Generator 50  Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50  Figure 10. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL http://onsemi.com 8 NLAS5213 DEVICE ORDERING INFORMATION Marking Package Type Shipping† NLAS5213AUSG VD US8 (Pb−Free) 3,000 / Tape & Reel NLAS5213AMUTAG VD UDFN8 (Pb−Free) 3,000 / Tape & Reel NLAS5213BUSG VE US8 (Pb−Free) 3,000 / Tape & Reel NLAS5213BMUTAG VE UDFN8 (Pb−Free) 3,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS US8 CASE 493 ISSUE F DATE 01 SEP 2021 SCALE 4 :1 GENERIC MARKING DIAGRAM* 8 XX MG G 1 XX M G = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON04475D US8 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2021 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN8 1.8x1.2, 0.4P CASE 517AJ−01 ISSUE O 8 1 DATE 08 NOV 2006 SCALE 4:1 A B D ÉÉ ÉÉ 0.10 C PIN ONE REFERENCE 0.10 C L1 E DETAIL A NOTE 5 TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW e/2 (b2) A1 e 1 4 8 5 C SEATING PLANE DETAIL A 8X L 8X b 0.10 M C A B 0.05 M C NOTE 3 MOUNTING FOOTPRINT SOLDERMASK DEFINED 8X 0.66 7X 0.22 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF GENERIC MARKING DIAGRAM* (L2) BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. XXM G XX = Specific Device Code M = Date Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON23417D UDFN8 1.8X1.2, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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