NLSX4401
1-Bit 20 Mb/s Dual-Supply
Level Translator
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MARKING
DIAGRAM
UDFN6
1.45 x 1.0
CASE 517AQ
1
Y
Features
M
• VL can be Less than, Greater than or Equal to VCC
• Wide VCC Operating Range: 1.5 V to 5.5 V
•
•
•
•
•
•
•
•
Wide VL Operating Range: 1.5 V to 5.5 V
High Speed with 24 Mb/s Guaranteed Date Rate
Low Bit−to−Bit Skew
Enable Input and I/O Pins are Overvoltage Tolerant (OVT) to 5.5 V
Non−preferential Powerup Sequencing
Power−Off Protection
Integrated 10 kW Pull−up Resistors
Small Space Saving Package:
1.45 mm x 1.0 mm UDFN6 Package
These Devices are Pb−Free and are RoHS Compliant
Typical Applications
•
SMBus, PMBus
• Low Voltage ASIC Level Translation
• Mobile Phones, PDAs, Cameras
I2C,
Y
The NLSX4401 is a 1−bit configurable dual−supply bidirectional
auto sensing translator that does not require a directional control pin.
The I/O VCC and I/O VL ports are designed to track two different
power supply rails, VCC and VL respectively. Both the VCC and VL
supply rails are configurable from 1.5 V to 5.5 V. This allows voltage
logic signals on the VL side to be translated into lower, higher or
equal value voltage logic signals on the VCC side, and vice−versa.
The NLSX4401 translator has integrated 10 kW pull−up resistors
on the I/O lines. The integrated pull−up resistors are used to pull up
the I/O lines to either VL or VCC. The NLSX4401 is an excellent
match for open−drain applications such as the I2C communication
bus.
M
= Specific Device Code
(Rotated 270° clockwise)
= Date Code
LOGIC DIAGRAM
VL
EN
VCC GND
I/O VL
I/O VCC
ORDERING INFORMATION
Device
Package
Shipping†
NLSX4401MU1TCG
UDFN6
(Pb−Free)
3000 / Tape
& Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Important Information
• ESD Protection for All Pins
− Human Body Model (HBM) > 5000 V
© Semiconductor Components Industries, LLC, 2015
May, 2018 − Rev. 3
1
Publication Order Number:
NLSX4401/D
NLSX4401
Figure 1. Block Diagram (1 I/O Line)
VL
1
6
VCC
I/O VL
2
5
I/O VCC
GND
3
4
EN
UDFN6
(Top Through View)
Figure 2. Pinout Diagram
PIN ASSIGNMENT
Pins
FUNCTION TABLE
Description
EN
Operating Mode
VCC
VCC Supply Voltage
L
Hi−Z
VL
VL Supply Voltage
H
I/O Buses Connected
GND
Ground
EN
Output Enable, Referenced to VL
I/O VCC
I/O Port, Referenced to VCC
I/O VL
I/O Port, Referenced to VL
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2
NLSX4401
MAXIMUM RATINGS
Symbol
Parameter
Value
Condition
Unit
VCC
High−side DC Supply Voltage
−0.5 to +7.0
V
VL
High−side DC Supply Voltage
−0.5 to +7.0
V
I/O VCC
VCC−Referenced DC Input/Output Voltage
−0.5 to +7.0
V
I/O VL
VL−Referenced DC Input/Output Voltage
−0.5 to +7.0
V
VEN
Enable Control Pin DC Input Voltage
−0.5 to +7.0
V
II/O_SC
Short−Circuit Duration (I/O VL and I/O VCC to GND)
±50
Continuous
mA
II/OK
Input/Output Clamping Current (I/O VL and I/O VCC)
−50
VI/O < 0
mA
TSTG
Storage Temperature
°C
−65 to +150
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
High−side Positive DC Supply Voltage
1.5
5.5
V
VL
High−side Positive DC Supply Voltage
1.5
5.5
V
Enable Control Pin Voltage
GND
5.5
V
VEN
VIO_VCC
I/O Pin Voltage (Side referred to VCC)
GND
5.5
V
VIO_VL
I/O Pin Voltage (Side referred to VL)
GND
5.5
V
Dt/DV
Input Transition Rise and Fall Rate
10
10
ns/V
+125
°C
TA
A− or B−Ports, Push−Pull Driving
Control Input
Operating Temperature Range
−55
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
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3
NLSX4401
DC ELECTRICAL CHARACTERISTICS (VL = 1.5 V to 5.5 V and VCC = 1.5 V to 5.5 V, unless otherwise specified) (Note 1)
−555C to +1255C
Symbol
Parameter
Test Conditions (Note 2)
Min
Typ
Max
Unit
VIHC
I/O VCC Input HIGH Voltage
VCC – 0.4
−
−
V
VILC
I/O VCC Input LOW Voltage
−
−
0.15
V
VIHL
I/O VL Input HIGH Voltage
VL – 0.4
−
−
V
VILL
I/O VL Input LOW Voltage
−
−
0.15
V
VIH
Control Pin Input HIGH Voltage
0.65 * VL
−
−
V
VIL
Control Pin Input LOW Voltage
−
−
0.35 * VL
V
2/3 * VCC
−
−
V
−
−
0.4
V
2/3 * VL
−
−
V
VOHC
I/O VCC Output HIGH Voltage
I/O VCC source current = 20 mA
VOLC
I/O VCC Output LOW Voltage
I/O VCC sink current = 1 mA
VOHL
I/O VL Output HIGH Voltage
I/O VL source current = 20 mA
VOLL
I/O VL Output LOW Voltage
I/O VL sink current = 1 mA
−
−
0.4
V
IQVCC
VCC Supply Current
I/O VCC and I/O VL unconnected, VEN = VL
VL = 5.5 V, VCC = 0 V
VL = 0 V, VCC = 5.5 V
−
−
−
0.5
−
−
2.0
1.0
−1.0
mA
I/O VCC and I/O VL unconnected, VEN = VL
VL = 5.5 V, VCC = 0 V
V = 0 V, V
L
CC = 5.5 V
−
−
−
0.3
−
−
1.5
−1.0
1.0
mA
I/O VCC and I/O VL unconnected, VEN = GND
−
0.1
1.0
mA
I/O VCC and I/O VL unconnected, VEN = GND
−
0.1
1.0
mA
−
−
1.0
mA
I/O VCC Port, VCC = 0 V, VL = 0 to 5.5 V
−
−
1.0
mA
I/O VL Port, VCC = 0 to 5.5 V, VL = 0 V
Supply Current
IQVL
VL Supply Current
Supply Current
ITS−VCC VCC Tristate Output Mode
ITS−VL
II
VL Tristate Output Mode Supply Current
Enable Pin Input Leakage Current
IOFF
I/O Power-Off Leakage Current
−
−
1.0
IOZ
I/O Tristate Output Mode
Leakage Current
−
0.1
1.0
mA
RPU
Pull−Up Resistors
I/O VL and VC
−
10
−
kΩ
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Typical values are for VL = +1.8 V, VCC = +3.3 V and TA = +25°C.
2. All units are production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design.
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4
NLSX4401
TIMING CHARACTERISTICS − RAIL−TO−RAIL DRIVING CONFIGURATIONS
(I/O test circuit of Figures 3 and 4, CLOAD = 15 pF, driver output impedance ≤ 50 W, RLOAD = 1 MW)
−405C to +855C
(Notes 3 & 4)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VL = 1.5 V, VCC = 1.5 V
tRVCC
I/O VCC Rise Time
9
32
ns
tFVCC
I/O VCC Fall Time
11
20
ns
tRVL
I/O VL Rise Time
20
30
ns
tFVL
I/O VL Fall Time
10
13
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
7
16
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
12
15
ns
tEN
Enable Time
50
ns
tDIS
Disable Time
300
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
15
Mbps
VL = 1.5 V, VCC = 5.5 V
tRVCC
I/O VCC Rise Time
9
12
ns
tFVCC
I/O VCC Fall Time
17
30
ns
tRVL
I/O VL Rise Time
2
4
ns
tFVL
I/O VL Fall Time
3
7
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
14
24
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
3
5
ns
tEN
Enable Time
40
ns
tDIS
Disable Time
250
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
20
Mbps
VL = 1.8 V, VCC = 2.8 V
tRVCC
I/O VCC Rise Time
11
18
ns
tFVCC
I/O VCC Fall Time
10
15
ns
tRVL
I/O VL Rise Time
12
15
ns
tFVL
I/O VL Fall Time
5
8
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
7
10
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
5
9
ns
tEN
Enable Time
50
ns
tDIS
Disable Time
300
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
20
Mbps
VL = 2.5 V, VCC = 3.6 V
tRVCC
I/O VCC Rise Time
8
12
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Typical values are for the specified VL and VCC at TA = +25°C. All units are production tested at TA = +25°C.
4. Limits over the operating temperature range are guaranteed by design.
5. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port (I/O_VLn or I/O_VCCn)
and switching with the same polarity (LOW−to−HIGH or HIGH−to−LOW). Skew is defined by applying a single input to the two input channels
and measuring the difference in propagation delays between the output channels.
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NLSX4401
TIMING CHARACTERISTICS − RAIL−TO−RAIL DRIVING CONFIGURATIONS (continued)
(I/O test circuit of Figures 3 and 4, CLOAD = 15 pF, driver output impedance ≤ 50 W, RLOAD = 1 MW)
−405C to +855C
(Notes 3 & 4)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VL = 2.5 V, VCC = 3.6 V
tFVCC
I/O VCC Fall Time
8
12
ns
tRVL
I/O VL Rise Time
7
10
ns
tFVL
I/O VL Fall Time
5
7
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
7
10
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
5
8
ns
tEN
Enable Time
40
ns
tDIS
Disable Time
225
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
24
Mbps
VL = 2.8 V, VCC = 1.8 V
tRVCC
I/O VCC Rise Time
13
20
ns
tFVCC
I/O VCC Fall Time
7
10
ns
tRVL
I/O VL Rise Time
8
13
ns
tFVL
I/O VL Fall Time
9
15
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
6
9
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
7
12
ns
tEN
Enable Time
60
ns
tDIS
Disable Time
250
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
24
Mbps
VL = 3.6 V, VCC = 2.5 V
tRVCC
I/O VCC Rise Time
9
12
ns
tFVCC
I/O VCC Fall Time
6
9
ns
tRVL
I/O VL Rise Time
6
12
ns
tFVL
I/O VL Fall Time
7
12
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
5
7
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
6
9
ns
tEN
Enable Time
50
ns
tDIS
Disable Time
250
ns
tPPSKEW
MDR
Part−to−Part Skew
2
Maximum Data Rate
24
ns
Mbps
VL = 5.5 V, VCC = 1.5 V
tRVCC
I/O VCC Rise Time
13
20
ns
tFVCC
I/O VCC Fall Time
6
9
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Typical values are for the specified VL and VCC at TA = +25°C. All units are production tested at TA = +25°C.
4. Limits over the operating temperature range are guaranteed by design.
5. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port (I/O_VLn or I/O_VCCn)
and switching with the same polarity (LOW−to−HIGH or HIGH−to−LOW). Skew is defined by applying a single input to the two input channels
and measuring the difference in propagation delays between the output channels.
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NLSX4401
TIMING CHARACTERISTICS − RAIL−TO−RAIL DRIVING CONFIGURATIONS (continued)
(I/O test circuit of Figures 3 and 4, CLOAD = 15 pF, driver output impedance ≤ 50 W, RLOAD = 1 MW)
−405C to +855C
(Notes 3 & 4)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VL = 5.5 V, VCC = 1.5 V
tRVL
I/O VL Rise Time
8
10
ns
tFVL
I/O VL Fall Time
20
27
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
5
8
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
14
24
ns
tEN
Enable Time
ns
tDIS
Disable Time
ns
tPPSKEW
MDR
Part−to−Part Skew
2
Maximum Data Rate
20
ns
Mbps
VL = 5.5 V, VCC = 5.5 V
tRVCC
I/O VCC Rise Time
5
7
ns
tFVCC
I/O VCC Fall Time
6
8
ns
tRVL
I/O VL Rise Time
5
7
ns
tFVL
I/O VL Fall Time
4
7
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
4
6
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
4
6
ns
tEN
Enable Time
30
ns
tDIS
Disable Time
225
ns
tPPSKEW
MDR
Part−to−Part Skew
2
Maximum Data Rate
24
ns
Mbps
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Typical values are for the specified VL and VCC at TA = +25°C. All units are production tested at TA = +25°C.
4. Limits over the operating temperature range are guaranteed by design.
5. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port (I/O_VLn or I/O_VCCn)
and switching with the same polarity (LOW−to−HIGH or HIGH−to−LOW). Skew is defined by applying a single input to the two input channels
and measuring the difference in propagation delays between the output channels.
TIMING CHARACTERISTICS − OPEN DRAIN DRIVING CONFIGURATIONS
(I/O test circuit of Figures 5 and 6, CLOAD = 15 pF, driver output impedance ≤ 50 W, RLOAD = 1 MW)
−405C to +855C
(Notes 6 & 7)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VL = 1.5 V, VCC = 1.5 V
tRVCC
I/O VCC Rise Time
55
70
ns
tFVCC
I/O VCC Fall Time
7
14
ns
tRVL
I/O VL Rise Time
50
65
ns
tFVL
I/O VL Fall Time
7
12
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Typical values are for the specified VL and VCC at TA = +25°C. All units are production tested at TA = +25°C.
7. Limits over the operating temperature range are guaranteed by design.
8. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port (I/O_VLn or I/O_VCCn)
and switching with the same polarity (LOW−to−HIGH or HIGH−to−LOW). Skew is defined by applying a single input to the two input channels
and measuring the difference in propagation delays between the output channels.
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NLSX4401
TIMING CHARACTERISTICS − OPEN DRAIN DRIVING CONFIGURATIONS (continued)
(I/O test circuit of Figures 5 and 6, CLOAD = 15 pF, driver output impedance ≤ 50 W, RLOAD = 1 MW)
−405C to +855C
(Notes 6 & 7)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VL = 1.5 V, VCC = 1.5 V
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
20
34
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
19
34
ns
tEN
Enable Time
100
ns
tDIS
Disable Time
300
ns
tPPSKEW
MDR
Part−to−Part Skew
2
Maximum Data Rate
3
ns
Mbps
VL = 1.5 V, VCC = 5.5 V
tRVCC
I/O VCC Rise Time
22
34
ns
tFVCC
I/O VCC Fall Time
20
27
ns
tRVL
I/O VL Rise Time
43
55
ns
tFVL
I/O VL Fall Time
6
12
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
13
26
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
19
24
ns
tEN
Enable Time
80
ns
tDIS
Disable Time
250
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
3
Mbps
VL = 1.8 V, VCC = 3.3 V
tRVCC
I/O VCC Rise Time
34
40
ns
tFVCC
I/O VCC Fall Time
1
15
ns
tRVL
I/O VL Rise Time
40
48
ns
tFVL
I/O VL Fall Time
1
2
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
9
15
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
6
11
ns
tEN
Enable Time
70
ns
tDIS
Disable Time
300
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
7
Mbps
VL = 5.5 V, VCC = 1.5 V
tRVCC
I/O VCC Rise Time
44
52
ns
tFVCC
I/O VCC Fall Time
1
2
ns
tRVL
I/O VL Rise Time
7
30
ns
tFVL
I/O VL Fall Time
17
23
ns
Propagation Delay (Driving I/O VL, VL to VCC)
10
17
ns
tPDVL−VCC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Typical values are for the specified VL and VCC at TA = +25°C. All units are production tested at TA = +25°C.
7. Limits over the operating temperature range are guaranteed by design.
8. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port (I/O_VLn or I/O_VCCn)
and switching with the same polarity (LOW−to−HIGH or HIGH−to−LOW). Skew is defined by applying a single input to the two input channels
and measuring the difference in propagation delays between the output channels.
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NLSX4401
TIMING CHARACTERISTICS − OPEN DRAIN DRIVING CONFIGURATIONS (continued)
(I/O test circuit of Figures 5 and 6, CLOAD = 15 pF, driver output impedance ≤ 50 W, RLOAD = 1 MW)
−405C to +855C
(Notes 6 & 7)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
12
24
ns
VL = 5.5 V, VCC = 1.5 V
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
tEN
Enable Time
100
ns
tDIS
Disable Time
300
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
3
Mbps
VL = 5.5 V, VCC = 5.5 V
tRVCC
I/O VCC Rise Time
42
50
ns
tFVCC
I/O VCC Fall Time
2
3
ns
tRVL
I/O VL Rise Time
44
48
ns
tFVL
I/O VL Fall Time
2
3
ns
tPDVL−VCC
Propagation Delay (Driving I/O VL, VL to VCC)
4
6
ns
tPDVCC−VL
Propagation Delay (Driving I/O VCC, VCC to VL)
6
9
ns
tEN
Enable Time
60
ns
tDIS
Disable Time
225
ns
2
ns
tPPSKEW
MDR
Part−to−Part Skew
Maximum Data Rate
7
Mbps
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Typical values are for the specified VL and VCC at TA = +25°C. All units are production tested at TA = +25°C.
7. Limits over the operating temperature range are guaranteed by design.
8. Skew is the variation of propagation delay between output signals and applies only to output signals on the same port (I/O_VLn or I/O_VCCn)
and switching with the same polarity (LOW−to−HIGH or HIGH−to−LOW). Skew is defined by applying a single input to the two input channels
and measuring the difference in propagation delays between the output channels.
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NLSX4401
TEST SETUP
NLSX4401
VL
VCC
NLSX4401
VL
EN
I/O VL
I/O VCC
Source
I/O VL
I/O VCC
CLOAD
CLOAD
RLOAD
NLSX4401
Figure 4. Rail−to−Rail Driving I/O VCC
NLSX4401
VL
VCC
EN
I/O VCC
VCC
CLOAD
CLOAD
RLOAD
RLOAD
Figure 5. Open−Drain Driving I/O VL
Figure 6. Open−Drain Driving I/O VCC
tRISE/FALL v
3 ns
I/O VL
tPD_VL−VCC
I/O VCC
VCC
EN
I/O VCC
I/O VL
90%
50%
10%
Source
RLOAD
Figure 3. Rail−to−Rail Driving I/O VL
VL
VCC
EN
tRISE/FALL v 3 ns
I/O VCC
90%
50%
10%
tPD_VCC−VL
I/O VL
tPD_VL−VCC
90%
50%
10%
tPD_VCC−VL
90%
50%
10%
tF−VCC
tR−VCC
tF−VL
Figure 7. Definition of Timing Specification Parameters
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10
tR−VL
NLSX4401
VCC
2xVCC
OPEN
R1
PULSE
GENERATOR
DUT
RT
CL
Test
RL
Switch
tPZH, tPHZ
Open
tPZL, tPLZ
2 x VCC
CL = 15 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 50 kW or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 8. Test Circuit for Enable/Disable Time Measurement
tR
tF
Input
tPLH
Output
EN
VCC
90%
50%
10%
GND
GND
tPZL
tPHL
90%
50%
10%
tR
VL
50%
Output
Output
HIGH
IMPEDANCE
50%
tPZH
tF
tPLZ
tPHZ
10%
VOL
90%
VOH
50%
Figure 9. Timing Definitions for Propagation Delays and Enable/Disable Measurement
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11
HIGH
IMPEDANCE
NLSX4401
APPLICATIONS INFORMATION
Level Translator Architecture
impedance of the device that is connected to the translator.
The timing parameters listed in the data sheet assume that
the output impedance of the drivers connected to the
translator is less than 50 kW.
The NLSX4401 auto sense translator provides
bi−directional voltage level shifting to transfer data in
multiple supply voltage systems. This device has two
supply voltages, VL and VCC, which set the logic levels on
the input and output sides of the translator. When used to
transfer data from the I/O VL to the I/O VCC ports, input
signals referenced to the VL supply are translated to output
signals with a logic level matched to VCC. In a similar
manner, the I/O VCC to I/O VL translation shifts input
signals with a logic level compatible to VCC to an output
signal matched to VL.
The NLSX4401 consists of two bi−directional channels
that independently determine the direction of the data flow
without requiring a directional pin. The one−shot circuits
are used to detect the rising or falling input signals. In
addition, the one shots decrease the rise and fall time of the
output signal for high−to−low and low−to−high transitions.
Each input/output channel has an internal 10 kW
pull−up. The magnitude of the pull−up resistors can be
reduced by connecting external resistors in parallel to the
internal 10 kW resistors.
Enable Input (EN)
The NLSX4401 has an Enable pin (EN) that provides
tri−state operation at the I/O pins. Driving the Enable pin
to a low logic level minimizes the power consumption of
the device and drives the I/O VCC and I/O VL pins to a high
impedance state. Normal translation operation occurs
when the EN pin is equal to a logic high signal. The EN pin
is referenced to the VL supply and has Overvoltage
Tolerant (OVT) protection.
Power Supply Guidelines
During normal operation, supply voltage VL can be
greater than, less than or equal to VCC. The sequencing of
the power supplies will not damage the device during the
power up operation.
For optimal performance, 0.01 mF to 0.1 mF decoupling
capacitors should be used on the VCCA and VCCB power
supply pins. Ceramic capacitors are a good design choice
to filter and bypass any noise signals on the voltage lines
to the ground plane of the PCB. The noise immunity will
be maximized by placing the capacitors as close as possible
to the supply and ground pins, along with minimizing the
PCB connection traces.
Input Driver Requirements
The rise (tR) and fall (tF) timing parameters of the open
drain outputs depend on the magnitude of the pull−up
resistors. In addition, the propagation times (tPHL / tPLH),
skew (tPSKEW) and maximum data rate depend on the
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12
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
1
SCALE 4:1
A
B
D
DATE 15 MAY 2008
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
SIDE VIEW
A2
e
6X
C
SEATING
PLANE
6X
0.30
PACKAGE
OUTLINE
L
1.24
3
1
DETAIL A
6X
0.53
6
4
6X
BOTTOM VIEW
b
0.10 C A B
0.05 C
NOTE 3
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98AON30313E
UDFN6, 1.45x1.0, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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