NOA1302DCRG

NOA1302 Ambient Light Sensor with I2C Interface Description The NOA1302 integrates a wide dynamic range ambient light sensor (ALS) with a 16−bit ADC and a 2−wire I2C digital interface. The NOA1302 ambient light sensor provides a linear response over the range of close to 0 lux to well over 100,000 lux with programmable integration times to optimize noise performance. The sensor employs proprietary CMOS image sensing technology from ON Semiconductor which provides low noise and high dynamic range output signals and light response similar to the response of the human eye. The NOA1302 operates as an I2C slave device and supports commands to set options in the device and read out the ambient light intensity count. Features http://onsemi.com CTSSOP−8 DC SUFFIX CASE 949AA MARKING DIAGRAM 8 1302 • Senses Ambient Light and Provides an Output Count Proportional to • Human Eye Type of Spectral Response • Provides Comfortable Levels of Display Depending on the Viewing • • • • • • • • the Ambient Light Intensity (Top View) Applications • Saves Display Power in Applications such as: − Laptops, Notebooks, Digital Signage − LCD TVs and Monitors, Digital Picture Frames − LED Indoor/Outdoor Residential and Street Lights Vin = 3.3 V hv 6 VDD SDA 5 SCL 4 R1 1k R2 1k SDA MCU SCL ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. C1 10m C2 0.1m 3 VSS IC1 NOA1302 CL not to exceed 250 pF including all parasitic capacitances Figure 1. Typical Application Circuit © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 1 1 ÉÉ ÉÉ Environment Linear Response Over the Full Operating Range Senses Intensity of Ambient Light from ~0 Lux to over 100,000 Lux Programmable Integration Times of 400 ms, 200 ms and 100 ms No External Components Required Low Power Consumption Built−in 16−bit ADC I2C Serial Communication Port − Standard Mode – 100 kHz − Fast Mode – 400 kHz This Device is Pb−Free, Halogen Free/BFR Free, and RoHS Compliant 1 1302= Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package PIN ASSIGNMENT NC NC VSS SCL 1 8 NC NC VDD SDA ÉÉ ÉÉ AYWG Publication Order Number: NOA1302/D NOA1302 Table 1. ORDERING INFORMATION Part Number NOA1302DCRG Package CTSSOP−8 (Pb−Free) Shipping Configuration† 2500 / Tape & Reel Temperature Range 0°C to 70°C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. ADC hn 16−bits Control SCL SDA I2C Serial Interface Figure 2. Simplified Block Diagram Table 2. PIN FUNCTION DESCRIPTION Pin 1, 2, 7, 8 3 4 5 6 Pin Name N/C VSS SCL SDA VDD Not connected, leave this pin unconnected. Ground pin. External I2C clock supplied by the I2C master. Bi−directional data signal for communications between this device and the I2C master. Power pin. Description Table 3. ABSOLUTE MAXIMUM RATINGS Rating Input power supply Input voltage range Output voltage range Maximum Junction Temperature Storage Temperature ESD Capability, Human Body Model (Note 1) ESD Capability, Charged Device Model (Note 1) ESD Capability, Machine Model (Note 1) Moisture Sensitivity Level Lead Temperature Soldering (Note 2) Symbol VDD Vin Vout TJ(max) TSTG ESDHBM ESDCDM ESDMM MSL TSLD Value 5.5 −0.3 to VDD + 0.2 −0.3 to VDD + 0.2 85 −40 to 85 2.5 750 250 3 260 Unit V V V °C °C kV V V − °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 ESD Charged Device Model tested per ESD−STM5.3.1−1999 ESD Machine Model tested per EIA/JESD22−A115 Latchup Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78 2. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D http://onsemi.com 2 NOA1302 Table 4. OPERATING RANGES Standard Mode Rating Power supply voltage Power supply current (VDD = 3.3 V) Low level input voltage (VDD related input levels) High level input voltage (VDD related input levels) Hysteresis of Schmitt trigger inputs (VDD > 2 V) Low level output voltage (open drain) at 3 mA sink current (VDD > 2 V) High level output voltage (with 1 kW pullup resistance) at and output current of −20 mA (VDD > 2 V) Input current of IO pin with an input voltage between 0.1 VDD and 0.9 VDD Output low current Capacitance on IO pin Operating free−air temperature range Symbol VDD IDD VIL VIH Vhys VOL VOH II IOL CI TA Min 3.0 325 −0.3 0.7 VDD N/A 0 VDD − 0.1 −10 − − 0 Max 3.6 950 0.3 VDD VDD + 0.2 N/A 0.4 N/A 10 45 10 70 Min 3.0 325 −0.3 0.7 VDD 0.05 VDD 0 VDD − 0.1 −10 − − 0 Fast Mode Max 3.6 950 0.3 VDD VDD + 0.2 − 0.4 N/A 10 45 10 70 Unit V mA V V V V V mA mA pF °C Table 5. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over VDD = 3.3 V, 0°C < TA < 70°C) (Note 3) Standard Mode Parameter SCL clock frequency Hold time for START condition. After this period, the first clock pulse is generated. Low period of SCL clock High period of SCL clock Data hold time for I2C−bus devices Data set−up time Rise time of both SDA and SCL (input signals) (Note 4) Fall time of both SDA and SCL (input signals) (Note 4) Rise time of SDA output signal (Note 4) Fall time of SDA output signal (Note 4) Output fall time from VIHmin to VILmax with a bus capacitance from 10 pF to 250 pF. (Note 5) Set−up time for STOP condition Bus free time between STOP and START condition Capacitive load for each bus line (including all parasitic capacitance) Noise margin at the low level for each connected device (including hysteresis) Noise margin at the high level for each connected device (including hysteresis) Symbol fSCL tHD;STA tLOW tHIGH tHD;DAT_d tSU;DAT tr_INPUT tf_INPUT tr_OUT tf_OUT tof tSU;STO tBUF CL VnL VnH Min 10 4.0 4.7 4.0 0 250 5 5 − − 2 4.0 4.7 − 0.1 VDD 0.2 VDD 3.45 − 300 300 1000 1000 250 − − 250 − − Max 100 − Fast Mode Min 100 0.6 1.3 0.6 0 100 5 5 − − 2 0.6 1.3 − 0.1 VDD 0.2 VDD 0.9 − 300 300 1000 1000 250 − − 250 − − Max 400 − Unit kHz mS mS mS mS nS nS nS nS nS nS mS mS pF V V 3. Refer to Figure 3 for more information on AC characteristics 4. The rise time and fall time are measured with a pull−up resistor Rp = 1 kW and Cb of 250 pF (including all parasitic capacitances). 5. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 250 pF. http://onsemi.com 3 NOA1302 Table 6. OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications are for VDD = 3.3 V, TA = 25°C) Parameter Irradiance responsivity Illuminance responsivity Test Conditions lp (see Figure 5) Incandescent light source: Ev = 100 lux (see Figure 6) Incandescent light source: Ev = 1000 lux (see Figure 6) Illuminance responsivity Fluorescent light source: Ev = 100 lux (see Figure 7) Fluorescent light source: Ev = 1000 lux (see Figure 7) Dark current Ev = 0 lux (see Figure 9) Rv Symbol Re Rv Min Typ 545 150 1480 130 1290 2 Counts Counts Max Unit nM Counts SDA tf tLOW tr tSU;DAT tf tSP tr tBUF SCL S tHD;STA tHD;DAT tHIGH tSU;STO P S Figure 3. AC Characteristics http://onsemi.com 4 NOA1302 TYPICAL CHARACTERISTICS Figure 4. Photo Diode Spectral Response (Without Filter) Figure 5. Human Eye vs. NOA1302 Spectral Response Figure 6. Incandescent Light Response (200 ms Integration) Figure 7. Fluorescent Light Response (200 ms Integration) Figure 8. Light Response vs. VDD Figure 9. Dark Counts vs. Temperature (200 ms Integration) http://onsemi.com 5 NOA1302 TYPICAL CHARACTERISTICS Figure 10. Dark Counts vs. Vdd Figure 11. Idd vs. Temperature Figure 12. Idd vs.Vdd Figure 13. Idd vs Ev Figure 14. Maximum Value of RP (in kW) as a function of Bus Capacitance (in pF) http://onsemi.com 6 NOA1302 DESCRIPTION OF OPERATION Ambient Light Sensor Architecture The NOA1302 employs a sensitive photo diode fabricated in ON Semiconductor’s standard CMOS process technology. The major components of this sensor are as shown in Figure 2. The photons which are to be detected pass through an ON Semiconductor proprietary color filter limiting extraneous photons and thus performing as a band pass filter on the incident wave front. The filter only transmits photons in the visible spectrum which are primarily detected by the human eye. The photo response of this sensor is as shown in Figure 5. The ambient light signal detected by the photo diode is converted to digital signal using a variable slope integrating ADC with a resolution of 16−bits, unsigned. The ADC value is provided to the control block connected to the I2C interface block. Equation 1 shows the relationship of output counts Cnt as a function of integration constant Ik, integration time Tint (in seconds) and the intensity of the ambient light, IL(in lux), at room temperature (25°C). IL + C nt (I k @ T int) (eq. 1) sent MSB first. RD/WR_ command bit follows the address bits. Upon receiving a valid address the device responds by driving SDA low for an ACK. After receiving an ACK, the I2C master sends eight bits of data with MSB first. Upon receiving eight bits of data the NOA1302 generates an ACK. The I2C master terminates this write command with a stop condition. SDA A[6:0] WR ACK D[7:0] ACK SCL Start Condition Stop Condition Figure 15. I2C Write Command Where: Ik = 6.67 (for fluorescent light) Ik = 7.5 (for incandescent light) Hence the intensity of the ambient fluorescent light (in lux): IL + C nt (6.67 @ T int) C nt (7.5 @ T int) (eq. 2) and the intensity of the ambient incandescent light (in lux): IL + (eq. 3) Figure 16 shows an I2C read command sent by the master to the slave device. The I2C read command begins with a start condition. After the start condition, seven bits of address are sent by the master MSB first, followed by the RD/WR_ command bit. For a read command the RD/WR_ bit is high. Upon receiving the address bits and RD/WR_ command bits the device responds with an ACK. After sending an ACK, the device sends eight bits of data MSB first. After receiving the data, the master terminates this transaction by issuing a NACK command to indicate that the master only wanted to read one byte from the device. The master generates a stop condition to end this transaction. Repeated START condition is not supported. Each I2C transaction must be terminated with a STOP condition after all required bits have been transmitted and received. For example let: Cnt = 1200 Tint = 200 mS Intensity of ambient incandescent light, IL(in lux): 1200 IL + (7.5 @ 200 mS) (eq. 4) SDA A[6:0] RD ACK D[7:0] NACK SCL Start Condition Stop Condition IL = 800 lux The NOA1302 operates on the I2C bus as a slave device. The I2C address is fixed at 0x39 (hexadecimal 39). Registers can be programmed by sending commands over an I2C bus. Ambient light intensity count value can be obtained by reading registers. The ambient light intensity count is 16 bits, hence two I2C read operations are needed. This device supports both standard (100 Kbit/s) and fast mode (400 Kbit/s) of operation on the I2C bus. Figure 15 shows an I2C write operation. To write to an internal register of the NOA1302 a write command must be sent by an I2C master. The write command begins with a start condition. After the start condition, seven bits of address are I2C Interface Figure 16. I2C Read Command Programmer’s Model Ambient light intensity count is obtained from the the NOA1302 by issuing a fixed sequence of I2C commands. Integration time is programmable by writing different values to the integration time register. The following sections describe what a programmer needs to know about issuing commands to the chip and register access. Integration Time Register Table 7 describes integration time register which controls the exposure time. This register has three bits, EC[2:0] which control the duration of the integration time. http://onsemi.com 7 NOA1302 Table 7. INTEGRATION TIME REGISTER EC[2,1,0] 000 001 010 011 100 101 110 111 Operation Normal mode of operation Normal mode of operation Normal mode of operation Test mode Simulation test mode use only Reserved for future use Reserved for future use Reserved for future use Integration Time 400 ms 200 ms (Default) 100 ms 16.7 ms 1.0 ms 1. Send write command 0x1Dh to set EC[0] = 0. 2. Send write command 0x88h to set EC[1] = 1, now EC[2:0] = 010. Proper operation of the I2C bus depends on keeping the bus capacitance low and selecting suitable pull−up resistor values. Figure 17 and Figure 18 show the rise and fall time on SDA in output mode under maximum load conditions. The measurement set−up is shown in Figure 19. Figure 14 shows the maximum value of the pull−up resistor (RP) as a function of the I2C data bus capacitance. Rise and Fall Time of SDA (Output) Programming Sequence and Command Summary This section describes supported commands and programming sequence. The NOA1302 only supports single byte write and a single byte read I2C commands. Ambient light intensity count is 16 bits wide, thus two I2C read commands are needed. Table 8 describes supported commands. All of these commands have to be sent to the fixed address (0x39). Table 8. DEVICE COMMANDS Command 0x00h 0x03h 0x1Dh 0x18h 0x43h 0x83h 0x88h 0x90h Function Start reading ADC data Complete reading ADC data Change EC[0] to 0 Reset EC[2:0] to default value (001) Prepare ADC LS byte for reading Prepare ADC MS byte for reading Change EC[1] to 1 Change EC[2] to 1 RP = 1 kW CL = 250 pF (including all parasitic caps) tr = 530 ns Figure 17. SDA Rise Time (tr) Programming Sequence To read 16 bits wide ambient light intensity count, the following commands must be issued in sequence: 1. Send write command 0x00h to start the ADC conversion cycle. 2. Send write command 0x03h to complete the ADC cycle. 3. Send write command 0x43h to prepare the LS byte for reading. 4. Send read byte command, returns LS byte of count. 5. Send write command 0x83h to prepare the MS byte for reading. 6. Send read byte command, returns MS byte of count. To change the integration time, for example to 100 ms, the following commands must be used in sequence: RP = 1 kW CL = 250 pF (including all parasitic caps) tf = 21 ns Figure 18. SDA Fall Time (tf) 16−bits Control I2C Serial Interface SCL SDA LED Pulse Generator hn ADC NOA1302 Figure 19. Measurement Set−up http://onsemi.com 8 NOA1302 PACKAGE DIMENSIONS CTSSOP8 3x3 CASE 949AA−01 ISSUE O 0.20 C D A 8 5 NOTE 5 4X D 8X b D2 0.15 NOTE 3 M C A-B D E2 E1 PIN 1 INDICATOR NOTE 6 E 0.25 1 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION AND IS DETERMINED BETWEEN 0.08 AND 0.15 MM FROM THE LEAD TIP. 4. DIMENSIONS D AND E1 DOES NOT INCLUDE MOLD PROTRUSIONS, TIE BAR BURRS, GATE BURRS OR FLASH. END FLASH SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS D AND E1 DO INCLUDE ANY MOLD CAVITY MISMATCH AND ARE DETERMINED AT THE GAUGE PLANE. 5. DATUMS A AND B TO BE DETERMINED AT THE GAUGE PLANE. 6. DETAILS OF THE PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THIS ZONE. DIM A A1 A2 b c D D2 E E1 E2 e L M MILLIMETERS MIN MAX −−− 1.10 0.00 0.14 0.73 0.93 0.24 0.39 0.13 0.24 3.00 BSC 0.66 1.37 4.90 BSC 3.00 BSC 0.41 1.37 0.65 BSC 0.39 0.67 0° 8° B NOTE 5 e TOP VIEW e/2 AUXILIARY TOP VIEW C M L DETAIL A GAUGE PLANE A A1 A2 SIDE VIEW C 8X DETAIL A 0.15 C SEATING PLANE c END VIEW SOLDERING FOOTPRINT* 0.48 8X 0.72 8X 1.05 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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