NZL5V6AXV3T1_07

NZL5V6AXV3T1 Series Preferred Devices Dual Common Anode ESD Protection Diodes SC−89 Package These dual monolithic silicon ESD protection diodes are intended for use in voltage− and ESD−sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: http://onsemi.com PIN 1. CATHODE 2. CATHODE 3. ANODE 1 3 2 • SC−89 Package Allows Either Two Separate Unidirectional • • • • Configurations or a Single Bidirectional Configuration ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Meets IEC61000−4−2 Level 4 Low Leakage < 5.0 mA These are Pb−Free Devices SC−89 CASE 463C STYLE 4 MARKING DIAGRAM 3 Lx 1 G M 2 G Mechanical Characteristics: CASE: Void-free, Transfer-molded, Thermosetting Plastic Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: L = Device Code x = Specific Device M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device NZL5V6AXV3T1 NZL5V6AXV3T1G NZL6V8AXV3T1 NZL6V8AXV3T1G NZL6V8AXV3T3G NZL7V5AXV3T1 NZL7V5AXV3T1G Package SC−89* SC−89* SC−89* SC−89* SC−89* SC−89* SC−89* Shipping † 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 10000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 260°C Device Meets MSL 1 Requirements †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *This package is inherently Pb−Free. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the table on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2007 1 February, 2007 − Rev. 5 Publication Order Number: NZL5V6AXV3T1/D NZL5V6AXV3T1 Series MAXIMUM RATINGS Rating Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance Junction to Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) IEC61000−4−2 (Contact) Symbol °PD° RqJA TJ, Tstg TL Value 240 1.9 525 −55 to +150 260 10 Unit °mW° mW/°C °C/W °C °C kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 board with minimum recommended mounting pad. *Other voltages may be available upon request. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol VRWM IR VBR IT IF VF Parameter Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF VC VBR VRWM IF I IR VF IT V IPP Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max @ IF = 10 mA for all types) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) Breakdown Voltage IR @ VRWM mA 5.0 1.0 1.0 1.0 VC (V) @ IPP = 1.0 A† Typ 7.0 7.9 7.9 8.8 Surge VC (V) @ Max IPP† Max 10.1 11.9 11.9 13.5 4.8 6.7 6.7 5.7 Max IPP (A)† Ppk (W)† Typ 50 73 73 75 Device NZL5V6AXV3T1 NZL6V8AXV3T1 NZL6V8AXV3T3 NZL7V5AXV3T1 Device Marking L0 L2 L2 L3 VRWM V 3.0 4.5 4.5 5.0 VBR (Note 2) (V) Min 5.32 6.46 6.46 7.12 Nom 5.6 6.8 6.8 7.5 Max 5.88 7.14 7.14 7.88 @ IzT mA 5.0 5.0 5.0 5.0 2. VBR measured at pulse test current IT at an ambient temperature of 25°C. † Surge current waveform per Figure 5. http://onsemi.com 2 NZL5V6AXV3T1 Series TYPICAL CHARACTERISTICS BREAKDOWN VOLTAGE (VOLTS) (VBR @ IT) 9.0 250 8.0 7V5 200 6V8 7.0 IR (nA) 150 5V6 100 6.0 5V6 6V8 50 0 −55 7V5 5.0 −55 −5 + 45 + 95 TEMPERATURE (°C) + 145 −5 + 45 + 95 TEMPERATURE (°C) + 145 Figure 1. Typical Breakdown Voltage versus Temperature 50 PD, POWER DISSIPATION (mW) 45 40 CAPACITANCE (pF) 35 30 5V6 25 20 15 10 5 0 0 0.4 0.8 1.2 1.6 2.0 6V8 7V5 300 250 200 150 100 Figure 2. Typical Leakage Current versus Temperature FR−5 BOARD 50 0 0 25 50 75 100 125 TEMPERATURE (°C) 150 175 VOLTAGE (V) Figure 3. Typical Capacitance versus Bias Voltage (Upper curve for each part is unidirectional mode, lower curve is bidirectional mode) Figure 4. Steady State Power Derating Curve 100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms tP 20 40 t, TIME (ms) 60 80 Figure 5. 8 X 20 ms Pulse Waveform http://onsemi.com 3 NZL5V6AXV3T1 Series Figure 6. Positive 8 kV contact per IEC 6100−4−2 − NZL6V8AXV3T1G Figure 7. Negative 8 kV contact per IEC 6100−4−2 − NZL6V8AXV3T1G http://onsemi.com 4 NZL5V6AXV3T1 Series TYPICAL COMMON ANODE APPLICATIONS A dual junction common anode design in an SC−89 package protects two separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below. A KEYBOARD TERMINAL PRINTER ETC. B I/O C D FUNCTIONAL DECODER GND NZLxxxAXV3T1 Figure 8. Computer Interface Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS I/O CPU NZLxxxAXV3T1 CLOCK CONTROL BUS GND NZLxxxAXV3T1 Figure 9. Microprocessor Protection http://onsemi.com 5 NZL5V6AXV3T1 Series PACKAGE DIMENSIONS SC−89, 3−LEAD CASE 463C−03 ISSUE C A −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C−01 OBSOLETE, NEW STANDARD 463C−02. MILLIMETERS MIN NOM MAX 1.50 1.60 1.70 0.75 0.85 0.95 0.60 0.70 0.80 0.23 0.28 0.33 0.50 BSC 0.53 REF 0.10 0.15 0.20 0.30 0.40 0.50 1.10 REF −−− −−− 10 _ −−− −−− 10 _ 1.50 1.60 1.70 INCHES NOM MAX 0.063 0.067 0.034 0.040 0.028 0.031 0.011 0.013 0.020 BSC 0.021 REF 0.004 0.006 0.008 0.012 0.016 0.020 0.043 REF −−− −−− 10 _ −−− −−− 10 _ 0.059 0.063 0.067 MIN 0.059 0.030 0.024 0.009 3 1 2 B −Y− S K G 2 PL DIM A B C D G H J K L M N S D 0.08 (0.003) M 3 PL XY M C N J −T− SEATING PLANE STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE SOLDERING FOOTPRINT H H L G RECOMMENDED PATTERN OF SOLDER PADS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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