PSLE382E-R44

EQM08-4KC-F5AS102-00 Preliminary Messrs. Shock Sensor Specification Part No. : PSLE382E-R44 RoHS Compliant Halogen-Free Compliant 16.Dec. 2010 Approved by Kazuki Shimizu Checked by Yasuhiro Nakai Issued by KYOCERA CORPORATION CIRCUIT COMPONENT DIVISION PIZ SECTION Akira Oikawa EQM08-4KC-F5AS102-00 Modification Table No. 00 Date 16.Dec 2010 Change The first edition Apploved Checked Kazuki Yasuhiro Akira Shimizu Nakai Oikawa CIRCUIT COMPONENT DIVISION PIZ SECTION Issued (1/5) 1.Scope Preliminary This specification shall cover the characteristics of the shock sensor. 2.Kyocera’s Type Name PSLE382E-R44 3.Customer’s Type Name 4.Electrical Characteristics Items Specifications 4-1 Primary Axis Inclined Angle 25± 3degree 4-2 Capacitance 340 ± 160pF, at 1Vrms, 1kHz 4-3 Charge Sensitivity 0.09 ± 0.035 pC/G , under vibration at 200Hz, 2G 4-4 Insulation Resistance 0.5Gohm minimum, at 10VDC after 1min. 4-5 Resonant Frequency 44 ± 9kHz 4-6 Non-linearity 5% maximum, under vibration at 25G (Referense only) Voltage Sensitivity 0.265mV/G ,under vibration at 200Hz, 2G The reference temperature shall be 25 ºC ±5ºC. 5.Dimensions and Marking Marking of Polarity Characteristic Spec ２Ｓ 2E Ｓ 1.7 2: Initial of Primary Axis Inclined Angle. 2.0±0.2 E: Electrical Characteristics 3.7 EIAJ Date Code 2008 2009 2010 2011 4.1±0.2 Jan. Jan. Jan. Jan. ~ ~ ~ ~ Dec. Dec. Dec. Dec. : n~z except “o” : A~M except “I” : N~Z except “O” : a~m except “i” Note: These alphabet should be repeated after 1.05±0.1 Fig.1 Jan.2012. Unit:mm CIRCUIT COMPONENT DIVISION PIZ SECTION (2/5) 6.Environmental Characteristics Preliminary Items Conditions 6-1.High Temperature Keep in a chamber at 85 ±2°C for 1000 +12/-0 hours, and then keep at room Storage Test temperature for 1 hour. The characteristics of shock sensor shall meet the specifications. 6-2.Low Temperature Keep in a chamber at –40 ±2°C for 1000 +12/-0 hours, and then keep at Storage Test room temperature for 1 hour. The characteristics of shock sensor shall meet the specifications. 6-3.Moisture Keep in a chamber at 90 to 95 % R.H. and 60 ± 2°C for 500 +12/-0 hours, Resistance Test and then keep at room temperature for 1 hour. The characteristics of shock sensor shall meet the specifications. 6-4.Temperature Apply 100 thermal cycles with the following temperatures: Cycling Test - upper temperature 85°C for 20 minutes and transfer time 10 minutes - lower temperature -40°C for 20 minutes and transfer time 10 minutes - total cycle time is 1hour and then left at room temperature for 1 hour. The characteristics of shock sensor shall meet the specifications. 6-5.Mechanical Shock After applying the acceleration at 29430m/sec2 {3000G} in each of X, Y and Test Z axis (each 3 times). The characteristics of shock sensor shall meet the specifications. 6-6.Solderability Test At first, being soaked in the Methanol solution containing Rosin for 5 seconds and then being dipped in a bath of Pb/Sn solder at 250 ± 5°C for 4 ± 0.5 seconds. The surface of the electrode terminal shall be soldered more than 95%. 6-7.Resistance to Pre-heat temperature is 150 to 180°C for 1 minute. High temperature is 250 Soldering Heat Test ± 5°C, over 200°C for 20 seconds max.(2times). Then keep at room temperature for 1 hour. The characteristics of shock sensor shall meet the specifications. 6-8.Board Flex Test After soldered on the circuit board specified as below, then the load which cause 3 mm bend to the board is applied. The characteristics of shock sensor shall meet the specifications. The shock sensor cause no defect in the appearance. (Circuit Board: FR4, 100 x 40 x 1.6 ) 50 20 F R230 1.0 3.0mm 45 45 The reference temperature shall be 25°C±5°C. CIRCUIT COMPONENT DIVISION PIZ SECTION (3/5) 7. Recommended Land pattern Preliminary 1.4 . 4.8 ２ ｘ Ｓ 1.4 Unit: (mm) 2.0 Fig.2 Recommended Land pattern 8. Recommended Convection Reflow profile 300 Reflow Peak:245+/-5ºC 250 Temperature (ºC) (Over to than 40sec) (Over230ºC,30 230℃,less 40sec) 200 Preheat 150 150 to 180ºC 100 50 Over 200ºC within 80 sec 90 to 120sec 0 Time(Sec) Fig.3 Recommended Convection Reflow profile 9. Taping Specifications 9-1.CarrierTape 9-1-1.Dimensions Marking of Polarity K P0 D0 T P2 Unit: (mm) E Sym F W BB00 T2 A0 P1 D1 Pulling Direction bol Dimensions Sym bol Dimensions A0 2.25 ± 0.1 P0 4.0 ± 0.1 B0 4.4 ± 0.1 P1 4.0 ± 0.1 W 12.0 +0.3/-0.1 D0 1.5 +0.1/-0 E 1.75 ± 0.1 K 1.25± 0.1 F 5.5± 0.05 T 0.3 ± 0.05 Fig.4 Emboss Carrier Tape Dimensions CIRCUIT COMPONENT DIVISION PIZ SECTION (4/5) 9-2. Taping Preliminary 9-2-1. Taping Quantity One reel of the carrier tape shall pack 3000 pcs. Shock sensor shall be contained in pocket continuously. 9-2-2. Dimensions W1 E A C N D W2 Fig.5 Reel Unit: (mm) A N W1 W2 180±5.0 60min. 12.5 +2.0/-0.0 20.5 max. C D E 13.0±0.2 21.0±0.8 2.0±0.5 Symbol Dimensions Symbol Dimensions 9-2-3. Leader and Blank Pocket Package shall consist of leader, blank pocket and loaded pocket as follows. (fig.6) Pulling Direction D C B A A) Leader B) Blank Pocket (160mm Min.) A+B: 400mm to 560mm C) Load Pocket D) Blank Pocket (40 to 190mm ) Fig.6 Packing Method Peeling load of top tape shall be 0.1N {10gf} to 0.7N {70gf} from Carrier Tape. Top Tape Carrier Tape 165º to 180º Pulling Direction Fig.7 Peeling Strength CIRCUIT COMPONENT DIVISION PIZ SECTION (5/5) 9-2-4. Reel label Preliminary A reel label shall be contained as below: (Based on EIAJ C-3 format) A) Customer P/N B) Lot No. C) Quantity D) Shipping date E) Vender Name 9-2-5. Exterior Package label Shock sensor shall be packed properly to avoid defect in transportation and the marking of exterior package shall be contained as below: A) Name of Customer B) P/O No. C) Customer P/N D) Lot No. E) Quantity F) Shipping Date G) Vender Name 10. The agreement of this specifications Should any part of the content of this specification become questionable, it shall be settled by mutual deliberations. 11. Remarks on Usage A) This part can use only reflow soldering. B) Not washable C) Maximum temperature is 280 degree. 12.RoHS Compliant A) Sensor Case: LCP(liquid crystal polymer) B) Terminal: Plating: Bronze with phosphate (thickness 100 um) Cu(1-2um), Ag(1-3 um) C) Elememt: Piezo Ceramic, contains lead-oxide, however, piezo-electronic devices are exempted from RoHS compliant requirement of article 4(1). (Refer to Annex, Section 7) All materials meet to RoHS Compliant. 13.Halogen-Free Compliant A) Bromine（Br） ＜900ppm（0.09％） B) Chlorine（Cl） ＜900ppm（0.09%） C)Total concentration of Chlorine（Cl）＋Bromine（Br） ＜1500ppm（0.15％） D)Antimony Trioxide（Sb2O3） ＜1000ppm（0.1％） Ｅ）Red Phosphorus ＜1000ppm（0.1％） All materials meet to Halogen-Free Compliant. CIRCUIT COMPONENT DIVISION PIZ SECTION