RI-TMS3705ADR_08

RI-TMS3705ADR www.ti.com SCBS863 – NOVEMBER 2003 LF BASE STATION IC FEATURES • • • • • Low Current Consumption in Sleep Mode Automatic Transponder Frequency Measurement and Adaptation Diagnosis Function Full Bridge Antenna Driver Built in Band-Pass Filter and Limiter • • • • • • Digital FSK Demodulator High Speed Data Transmission in Synchronous Mode Power on Reset PLL Short Circuit Protection Support of All TI-RFid™ LF Transponder Functions DESCRIPTION The LF base station IC TMS3705ADR allows efficient development and production of RFID readers for low power hand scanners, stationary readers and vehicle immobilizers. This base station IC drives the antenna of a TI-RFid™ transponder system to send data modulated on the antenna signal, and to detect and demodulate the response from the transponder. It allows also minimizing the external component count. ORDERING INFORMATION PACKAGE (1) Package/Pin count Packing/Delivery (1) SO 16 (10 mm × 6 mm) Tape on Reel, 2500 units per reel Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TI-RFid is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003, Texas Instruments Incorporated RI-TMS3705ADR www.ti.com SCBS863 – NOVEMBER 2003 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) RI-TMS3705ADR Operating Voltage Current Consumption ESD Protection (MILSTD 883, HBM ) Operating Temperature Storage Temperature (1) 4.5 to 5.5 DC Charge Phase (without antenna load) Sleep Mode (without I/O currents) –2000 to +2000 –40 to +85 –40 to +100 (125 up to 1000hrs over lifetime) typical 8 mA; typical 15 µA; max. 20 mA max. 0.2 mA V °C °C UNIT V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER Operating Frequency Interface to Micro Controller Antenna Inductivity PART NUMBER RI-TMS3705ADR Typical 134.2, FSK Two wire multifunctional serial interface, 15625 baud 400–700 recommended µH UNIT kHz 2 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 15-Jan-2008 PACKAGING INFORMATION Orderable Device TMS3705A1DRG4 (1) Status (1) ACTIVE Package Type Package Drawing Pins Package Eco Plan (2) Qty 16 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-3-260C-168 HR The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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