ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
GENERAL DESCRIPTION
FEATURES
The ICS87339I-11 is a low skew, high performance Differential-to-3.3V LVPECL Clock GenHiPerClockS™
erator/Divider and a member of the HiPerClockS™
family of High Performance Clock Solutions
from IDT. The ICS87339I-11 has one differential clock input pair. The CLK, nCLK pair can accept most
standard differential input levels. The clock enable is
internally synchronized to eliminate runt pulses on the
outputs during asynchronous assertion/deassertion of the
clock enable pin.
• Dual ÷2, ÷4 differential 3.3V LVPECL outputs;
Dual ÷4, ÷5, ÷6 differential 3.3V LVPECL outputs
Guaranteed output and part-to-part skew characteristics
make the ICS87339I-11 ideal for clock distribution applications demanding well defined performance and repeatability.
• Output skew: 35ps (maximum)
ICS
• One differential CLK, nCLK input pair
• CLK, nCLK pair can accept the following differential
input levels: LVDS, LVPECL, LVHSTL, SSTL, HCSL
• Maximum clock input frequency: 1GHz
• Translates any single ended input signal (LVCMOS, LVTTL,
GTL) to LVPECL levels with resistor bias on nCLK input
• Part-to-part skew: 385ps (maximum)
• Bank skew: Bank A - 20ps (maximum)
Bank B - 20ps (maximum)
• Propagation delay: 2.1ns (maximum)
• LVPECL mode operating voltage supply range:
VCC = 3V to 3.6V, VEE = 0V
• Available in both standard (RoHS5) and lead-free (RoHS 6)
packages
BLOCK DIAGRAM
PIN ASSIGNMENT
DIV_SELA
QA0
nQA0
nCLK_EN
D
÷2, ÷4
Q
R
LE
QA1
nQA1
CLK
nCLK
QB0
nQB0
÷4, ÷5, ÷6
R
QB1
nQB1
MR
VCC
nCLK_EN
DIV_SELB0
CLK
nCLK
RESERVED
MR
VCC
DIV_SELB1
DIV_SELA
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
QA0
nQA0
QA1
nQA1
QB0
nQB0
QB1
nQB1
VEE
ICS87339I-11
20-Lead TSSOP
6.50mm x 4.40mm x 0.92 package body
G Package
Top View
DIV_SELB0
20-Lead SOIC, 300MIL
7.5mm x 12.8mm x 2.25mm package body
M Package
Top View
DIV_SELB1
87339AGI-11
1
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
1, 8, 20
VCC
Power
2
nCLK_EN
Input
3
DIV_SELB0
Input
4
CLK
Input
5
6
nCLK
RESERVED
Input
Reser ve
Description
Positive supply pins.
Pulldown Clock enable. LVCMOS / LVTTL interface levels. See Table 3.
Selects divide value for Bank B outputs as described in Table 3.
Pulldown
LVCMOS / LVTTL interface levels.
Pulldown Non-inver ting differential clock input.
Pullup
Inver ting differential clock input.
Reser ve pin.
Active High Master Reset. When logic HIGH, the internal dividers are reset
causing the true outputs Qx to go low and the inver ted outputs nQx to go
7
MR
Input
Pulldown
high. When logic LOW, the internal dividers and the outputs are enabled.
LVCMOS / LVTTL interface levels.
Selects divide value for Bank B outputs as described in Table 3.
9
DIV_SELB1
Input
Pulldown
LVCMOS / LVTTL interface levels.
Selects divide value for Bank A outputs as described in Table 3.
10
DIV_SELA
Input
Pulldown
LVCMOS / LVTTL interface levels.
Power
Negative supply pin.
11
VEE
12, 13
nQB1, QB1 Output
Differential output pair. LVPECL interface levels.
14, 15
nQB0, QB0
Output
Differential output pair. LVPECL interface levels.
16, 17
nQA1, QA1 Output
Differential output pair. LVPECL interface levels.
18, 19
nQA0, QA0
Output
Differential output pair. LVPECL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
87339AGI-11
Test Conditions
2
Minimum
Typical
Maximum
Units
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
TABLE 3. CONTROL INPUT FUNCTION TABLE
Inputs
Outputs
MR
nCLK_EN
DIV_SELA
DIV_SELB0
DIV_SELB1
QA0, QA1
nQA0, nQA1
QB0, QB1
nQB0, nQB1
1
X
X
X
X
0
1
X
X
X
0
0
0
0
0
LOW
Not
Switching
÷2
HIGH
Not
Switching
÷2
LOW
Not
Switching
÷4
HIGH
Not
Switching
÷4
0
0
0
0
1
÷2
÷2
÷5
÷5
0
0
0
1
0
÷2
÷2
÷6
÷6
0
0
0
1
1
÷2
÷2
÷5
÷5
0
0
1
0
0
÷4
÷4
÷4
÷4
0
0
1
0
1
÷4
÷4
÷5
÷5
0
0
1
1
0
÷4
÷4
÷6
÷6
0
0
1
1
1
÷4
÷4
÷5
÷5
NOTE: After nCLK_EN switches, the clock outputs stop switching following a rising and falling input clock edge.
CLK
tRR
MR
Q (÷n)
FIGURE 1A. MR TIMING DIAGRAM
Enabled
Disabled
CLK
nCLK
nCLK_EN
QAx, QBx
nQAx, nQBx
FIGURE 1B. NCLK_EN TIMING DIAGRAM
87339AGI-11
3
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5 V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
20 Lead TSSOP
20 Lead SOIC
73.2°C/W (0 lfpm)
46.2°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = 3.3V±0.3V, TA = -40°C TO 85°C
Symbol
Parameter
Test Conditions
VCC
Positive Supply Voltage
IEE
Power Supply Current
Minimum
Typical
3.0
3.3
Maximum
Units
3.6
V
105
mA
Maximum
Units
2
VCC + 0.3
V
-0.3
0.8
V
150
µA
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = 3.3V±0.3V, TA = -40°C TO 85°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
nCLK_EN, MR,
DIV_SELA, DIV_SELBx
nCLK_EN, MR,
DIV_SELA, DIV_SELBx
Minimum
Typical
VIN = VCC = 3.6V
VIN = 0V, VCC = 3.6V
-5
µA
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VCC = 3.3V±0.3V, TA = -40°C TO 85°C
Symbol
Parameter
IIH
Input High Current
IIL
Input Low Current
Test Conditions
nCLK
Minimum
Typical
VIN = VCC = 3.6V
Units
5
µA
150
µA
CLK
VIN = VCC = 3.6V
nCLK
VIN = 0V, VCC = 3.6V
-150
µA
CLK
VIN = 0V, VCC = 3.6V
-5
µA
VPP
Peak-to-Peak Input Voltage
0.15
Common Mode Input Voltage;
VEE + 0.5
VCMR
NOTE 1, 2
NOTE 1: For single ended applications, the maximum input voltage for CLK, nCLK is VCC + 0.3V.
NOTE 2: Common mode voltage is defined as VIH.
87339AGI-11
Maximum
4
1.3
V
VCC - 0.85
V
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
TABLE 4D. LVPECL DC CHARACTERISTICS, VCC = 3.3V±0.3V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
Output High Voltage; NOTE1
VCC - 1.4
VCC - 0.9
V
VOL
Output Low Voltage; NOTE 1
VCC - 2.0
VCC - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1.0
V
VOH
NOTE 1: Outputs terminated with 50Ω to VCC - 2V.
TABLE 5. AC CHARACTERISTICS, VCC = 3.3V±0.3V, TA = -40°C TO 85°C
Symbol Parameter
fCLK
Clock Input Frequency
tPD
Propagation Delay; NOTE 1
t sk(o)
Output Skew; NOTE 2, 5
t sk(b)
Bank Skew;
NOTE 3, 5
t sk(pp)
Par t-to-Par t Skew; NOTE 4, 5
Test Conditions
Minimum
CLK to Q (Diff)
1. 6
Typical
15
Maximum
Units
1
GHz
2.1
ns
35
ps
Bank A
10
20
ps
Bank B
10
20
ps
385
ps
tS
Setup Time
nCLK_EN to CLK
350
ps
tH
Hold Time
CLK to nCLK_EN
100
ps
t RR
Reset Recover y Time
tPW
Minimum Pulse Width
tR / tF
Output Rise/Fall Time
400
CLK
550
20% to 80%
100
odc
Output Duty Cycle
48
All data taken with outputs ÷4.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points
NOTE 3: Defined as skew within a bank of outputs and with equal load conditions.
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at the differential cross points.
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.
87339AGI-11
5
ps
ps
600
ps
52
%
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
PARAMETER MEASUREMENT INFORMATION
2V
V CC
VCC,
VCCO
Qx
SCOPE
nCLK
V
LVPECL
V
Cross Points
PP
CMR
CLK
nQx
VEE
VEE
-1.3V ± 0.3V
3.3V OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
PART 1
nQx
nQx
Qx
Qx
PART 2
nQy
nQy
Qy
Qy
tsk(pp)
tsk(o)
PART-TO-PART SKEW
OUTPUT SKEW
nQAx
80%
80%
QAx
VSW I N G
Clock
Outputs
nQBx
20%
20%
tF
tR
QBx
tsk(b)
OUTPUT RISE/FALL TIME
BANK SKEW
nCLK
nQAx, nQBx
CLK
nQAx,
nQBx
QAx,
QBx
QAx, QBx
Pulse Width
t
t
odc =
PD
PERIOD
t PW
t PERIOD
PROPAGATION DELAY
87339AGI-11
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
6
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VCC = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
Figure 2 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VCC/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
VCC
R1
1K
Single Ended Clock Input
CLK
V_REF
nCLK
C1
0.1u
R2
1K
FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
TERMINATION FOR LVPECL OUTPUTS
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
50Ω transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion. Figures 3A and 3B show two different layouts which
are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 3A. LVPECL OUTPUT TERMINATION
87339AGI-11
125Ω
84Ω
FIGURE 3B. LVPECL OUTPUT TERMINATION
7
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both VSWING and VOH must meet the
VPP and VCMR input requirements. Figures 4A to 4E show interface examples for the HiPerClockS CLK/nCLK input driven by
the most common driver types. The input interfaces suggested
here are examples only. Please consult with the vendor of the
driver component to confirm the driver termination requirements.
For example in Figure 4A, the input termination applies for ICS
HiPerClockS LVHSTL drivers. If you are using an LVHSTL driver
from another vendor, use their termination recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
LVPECL
nCLK
HiPerClockS
Input
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
R1
50
HiPerClockS
Input
R2
50
R2
50
R3
50
FIGURE 4A. HIPERCLOCKS CLK/NCLK INPUT DRIVEN
ICS HIPERCLOCKS LVHSTL DRIVER
FIGURE 4B. HIPERCLOCKS CLK/NCLK INPUT DRIVEN
3.3V LVPECL DRIVER
BY
3.3V
3.3V
3.3V
3.3V
3.3V
R3
125
BY
R4
125
Zo = 50 Ohm
LVDS_Driv er
Zo = 50 Ohm
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
nCLK
Receiv er
Zo = 50 Ohm
R2
84
FIGURE 4C. HIPERCLOCKS CLK/NCLK INPUT DRIVEN
3.3V LVPECL DRIVER
FIGURE 4D. HIPERCLOCKS CLK/NCLK INPUT DRIVEN
3.3V LVDS DRIVER
BY
BY
3.3V
3.3V
3.3V
LVPECL
Zo = 50 Ohm
C1
Zo = 50 Ohm
C2
R3
125
R4
125
CLK
nCLK
R5
100 - 200
R6
100 - 200
R1
84
HiPerClockS
Input
R2
84
R5,R6 locate near the driver pin.
FIGURE 4E. HIPERCLOCKS CLK/NCLK INPUT DRIVEN
3.3V LVPECL DRIVER WITH AC COUPLE
87339AGI-11
BY
8
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS87339I-11.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS87339I-11 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 0.3V = 3.6V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * ICC_MAX = 3.6V * 105mA = 378mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power_MAX (3.6V, with all outputs switching) = 378mW + 120mW = 498mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.498W * 66.6°C/W = 118.1°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
Table 6A. Thermal Resistance θJA for 20-pin TSSOP, Forced Convection
θ by Velocity (Linear Feet per Minute)
JA
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
114.5°C/W
73.2°C/W
98.0°C/W
66.6°C/W
88.0°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
Table 6B. Thermal Resistance θJA for 20-pin SOIC, Forced Convection
θ by Velocity (Linear Feet per Minute)
JA
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
46.2°C/W
200
500
65.7°C/W
39.7°C/W
57.5°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
87339AGI-11
9
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
3. Calculations and Equations.
LVPECL output driver circuit and termination are shown in Figure 5.
VCC
Q1
VOUT
RL
50
VCC - 2V
FIGURE 5. LVPECL DRIVER CIRCUIT
AND
TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CC
•
For logic high, VOUT = V
OH_MAX
(V
CC_MAX
•
-V
OH_MAX
OL_MAX
CC_MAX
-V
OL_MAX
CC_MAX
– 0.9V
) = 0.9V
For logic low, VOUT = V
(V
=V
=V
CC_MAX
– 1.7V
) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CC_MAX
- 2V))/R ] * (V
CC_MAX
L
-V
OH_MAX
) = [(2V - (V
CC_MAX
-V
OH_MAX
))/R ] * (V
CC_MAX
L
-V
OH_MAX
)=
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
– (V
CC_MAX
- 2V))/R ] * (V
L
CC_MAX
-V
OL_MAX
) = [(2V - (V
CC_MAX
-V
OL_MAX
))/R ] * (V
L
CC_MAX
-V
OL_MAX
)=
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
87339AGI-11
10
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
RELIABILITY INFORMATION
TABLE 7A.
θJAVS. AIR FLOW TSSOP TABLE
θ by Velocity (Linear Feet per Minute)
JA
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
114.5°C/W
73.2°C/W
98.0°C/W
66.6°C/W
88.0°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 7B. θJAVS. AIR FLOW SOIC TABLE
θ by Velocity (Linear Feet per Minute)
JA
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
46.2°C/W
200
500
65.7°C/W
39.7°C/W
57.5°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS87339I-11 is: 1745
Compatible with MC10EP139, MC100EP139
87339AGI-11
11
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
PACKAGE OUTLINE - G SUFFIX
FOR
20 LEAD TSSOP
PACKAGE OUTLINE - M SUFFIX
Millimeters
MIN
N
20 LEAD SOIC
TABLE 8B. PACKAGE DIMENSIONS
TABLE 8A. PACKAGE DIMENSIONS
SYMBOL
FOR
Millimeters
SYMBOL
Minimum
MAX
N
20
A
Maximum
20
--
2.65
A
--
1.20
A1
0.05
0.15
A1
0.10
--
2.05
2.55
0.33
0.51
A2
0.80
1.05
A2
b
0.19
0.30
B
c
0.09
0.20
C
0.18
0.32
6.60
D
12.60
13.00
E
7.40
7.60
D
6.40
E
E1
6.40 BASIC
4.30
e
e
4.50
H
0.65 BASIC
1.27 BASIC
10.00
10.65
L
0.45
0.75
h
0.25
0.75
α
0°
8°
L
0.40
1.27
aaa
--
0.10
α
0°
8°
Reference Document: JEDEC Publication 95, MS-013, MO-119
Reference Document: JEDEC Publication 95, MO-153
87339AGI-11
12
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS87339AGI-11
ICS87339AI11
20 lead TSSOP
Tube
-40°C to 85°C
ICS87339AGI-11T
ICS87339AI11
20 lead TSSOP
2500 Tape & Reel
-40°C to 85°C
ICS87339AGI-11LF
ICS7339AI11L
20 Lead "Lead-Free" TSSOP
Tube
-40°C to 85°C
ICS87339AGI-11LFT
ICS7339AI11L
20 Lead "Lead-Free" TSSOP
2500 Tape & Reel
-40°C to 85°C
ICS87339AMI-11
ICS87339AMI-11
20 lead SOIC
Tube
-40°C to 85°C
ICS87339AMI-11T
ICS87339AMI-11
20 lead SOIC
1000 Tape & Reel
-40°C to 85°C
ICS87339AMI-11LF
ICS7339AI11L
20 Lead "Lead-Free" SOIC
Tube
-40°C to 85°C
ICS87339AMI-11LFT
ICS7339AI11L
20 Lead "Lead-Free" SOIC
1000 Tape & Reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by
IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
87339AGI-11
13
REV. A March 3, 2009
ICS87339I-11
LOW SKEW, ÷2/4,÷4/5/6,
DIFFERENTIAL-TO-3.3V LVPECL CLOCK GENERATOR
REVISION HISTORY SHEET
Rev
Table
A
T1
Page
1
2
T9
T9
1
13
13
A
A
87339AGI-11
Description of Change
Pin Assignment - changed pin 6, "nc" to "reser ved".
Pin Description table - corrected pin 6 to read reser ved to coordinate with Pin
Assignment.
Features section - corrected Output skew and Par t-to-Par t skew bullets.
Ordering Information table - added Lead-Free note.
Ordering Information table - added Lead-Free markings
14
Date
3/10/05
4/12/05
12/19/07
REV. A March 3, 2009