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98ULPA877AKLF

98ULPA877AKLF

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFQFN-40

  • 描述:

    IC CLOCK DRIVER 1.8V LP 40VFQFPN

  • 数据手册
  • 价格&库存
98ULPA877AKLF 数据手册
ICS98ULPA877A 1.8V Low-Power Wide-Range Frequency Clock Driver Pin Configuration 1 E F G H J K 52-Ball BGA Top View CLKT6 VDDQ 31 CLKT5 34 CLKC6 CLKC5 35 32 VDDQ 36 33 CLKT0 CLKC0 5 CLKT5 GND GND OS VDDQ OE VDDQ GND GND CLKC9 VDDQ 1 30 CLKC7 CLKT2 CLKC2 2 29 CLKT7 CLKT2 3 28 VDDQ 21 OS FBIN_INC CLKC7 20 10 CLKT7 VDDQ OE GND CLKC6 19 22 CLKT8 9 18 VDDQ VDDQ CLKT6 CLKC8 23 17 8 CLKC5 CLKC9 FBOUTT AVDD CLK_INC 15 24 16 7 VDDQ FBOUTC AGND CLKT9 25 14 6 CLKT4 VDDQ 13 FB_INC CLKC4 CLKC4 FB_INT 26 12 27 5 11 4 CLK_INC CLKT3 CLK_INT CLKT4 CLKT5 CLKT8 CLKC8 CLKT9 CLKC9 NOTE: 1. The Logic Detect (LD) powers down the device when a logic LOW is applied to both CLK_INT and CLK_INC. 1177F—12/10/09 6 CLKT6 CLKC6 CLKC7 CLKT7 FB_INT FB_INC FB_OUTC FB_OUTT CLKT8 CLKC8 CLKC1 CLK_INT FBIN_INT 4 CLKC5 GND NB VDDQ NB NB VDDQ NB GND CLKT9 37 CLKT1 CLKC3 PLL 3 CLKC0 GND NB VDDQ NB NB VDDQ NB GND CLKT4 CLKC0 CLKT3 - 100K CLKT1 2 CLKT0 GND GND VDDQ VDDQ VDDQ VDDQ GND GND CLKC4 CLKC1 1 CLKT1 CLKC1 CLKC2 CLKT2 CLK_INT CLK_INC AGND AVDD CLKT3 CLKC3 39 A B C D E F G H J K CLKT0 CLKC2 10K 6 D CLKC3 OS AVDD LD or OE POWER DOWN AND LD, OS, or OE TEST MODE PLL BYPASS LOGIC LD 5 C (1) OE 4 B 40 Block Diagram 3 A Product Description/Features: • Low skew, low jitter PLL clock driver • 1 to 10 differential clock distribution (SSTL_18) • Feedback pins for input to output synchronization • Spread Spectrum tolerant inputs • Auto PD when input signal is at a certain logic state Switching Characteristics: • Period jitter: 40ps (DDR2-400/533) 30ps (DDR2-667/800) • Half-period jitter: 60ps (DDR2-400/533) 50ps (DDR2-667/800) • OUTPUT - OUTPUT skew: 40ps (DDR2-400/533) 30ps (DDR2-667/800) • CYCLE - CYCLE jitter 40ps 2 38 Recommended Application: • DDR2 Memory Modules / Zero Delay Board Fan Out • Provides complete DDR2 DIMM logic solution FBOUTT FBOUTC 40-Pin MLF ICS98ULPA877A Pin Descriptions Te r m i n a l Name Electrical Characteristics Description AGND Analog Ground Ground AVDD A n a l o g p ow e r 1.8 V nominal CLK_INT C l o ck i n p u t w i t h a ( 1 0 K - 1 0 0 K O h m ) p u l l d o w n r e s i s t o r Differential input CLK_INC Complentar y clock input with a (10K-100K Ohm) pulldown resistor Differential input FB_INT Feedback clock input Differential input FB_INC Complementary feedback clock input Differential input FB_OUTT Feedback clock output Differential output FB_OUTC Complementary feedback clock output Differential output OE Output Enable (Asynchronous) LVCMOS input OS Output Select (tied to GND or VDDQ) LVCMOS input GND Ground Ground VDDQ Logic and output power 1.8V nominal CLKT[0:9] Clock outputs Differential outputs CLKC[0:9] Complementary clock outputs Differential outputs NB No ball The PLL clock buffer, ICS98ULPA877A, is designed for a VDDQ of 1.8 V, a AVDD of 1.8 V and differential data input and output levels. Package options include a plastic 52-ball VFBGA and a 40-pin MLF. ICS98ULPA877A is a zero delay buffer that distributes a differential clock input pair (CLK_INT, CLK_INC) to ten differential pair of clock outputs (CLKT[0:9], CLKC[0:9]) and one differential pair feedback clock outputs (FB_OUTT, FBOUTC). The clock outputs are controlled by the input clocks (CLK_INT, CLK_INC), the feedback clocks (FB_INT, FB_INC), the LVCMOS program pins (OE, OS) and the Analog Power input (AVDD). When OE is low, the outputs (except FB_OUTT/FB_OUTC) are disabled while the internal PLL continues to maintain its locked-in frequency. OS (Output Select) is a program pin that must be tied to GND or VDDQ. When OS is high, OE will function as described above. When OS is low, OE has no effect on CLKT7/CLKC7 (they are free running in addition to FB_OUTT/FB_OUTC). When AVDD is grounded, the PLL is turned off and bypassed for test purposes. When both clock signals (CLK_INT, CLK_INC) are logic low, the device will enter a low power mode. An input logic detection circuit on the differential inputs, independent from the input buffers, will detect the logic low level and perform a low power state where all outputs, the feedback and the PLL are OFF. When the inputs transition from both being logic low to being differential signals, the PLL will be turned back on, the inputs and outputs will be enabled and the PLL will obtain phase lock between the feedback clock pair (FB_INT, FB_INC) and the input clock pair (CLK_INT, CLK_INC) within the specified stabilization time tSTAB. The PLL in ICS98ULPA877A clock driver uses the input clocks (CLK_INT, CLK_INC) and the feedback clocks (FB_INT, FB_INC) to provide high-performance, low-skew, low-jitter output differential clocks (CLKT[0:9], CLKC[0:9]). ICS98ULPA877A is also able to track Spread Spectrum Clocking (SSC) for reduced EMI. 1177F—12/10/09 2 ICS98ULPA877A ICS98ULPA877A is available in Commercial Temperature Range (0°C to 70°C) and Industrial Temperature Range (-40°C to +85°C). See Ordering Information for details Function Table Inputs Outputs PLL AVDD OE OS CLK_INT CLK_INC CLKT CLKC FB_OUTT FB_OUTC GND H X L H L H L H Bypassed/Off GND H X H L H L H L Bypassed/Off GND L H L H *L(Z) *L(Z) L H Bypassed/Off GND L L H L *L(Z), CLKT7 active *L(Z), CLKC7 active H L Bypassed/Off 1.8V(nom) L H L H *L(Z) *L(Z) L H On 1.8V(nom) L L H L *L(Z), CLKT7 active *L(Z), CLKC7 active H L On 1.8V(nom) H X L H L H L H On 1.8V(nom) H X H L H L H L On 1.8V(nom) X X L L *L(Z) *L(Z) *L(Z) *L(Z) Off 1.8V(nom) X X H H Reser ved *L(Z) means the outputs are disabled to a low stated meeting the IODL limit. 1177F—12/10/09 3 ICS98ULPA877A Absolute Maximum Ratings Supply Voltage (VDDQ & AVDD) . . . . . . . . . Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . Ambient Operating Temperature . . . . . . . . . . Storage Temperature . . . . . . . . . . . . . . . . . . . -0.5V to 2.5V GND - 0.5V to VDDQ + 0.5V -40°C to +85°C -65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only and functional operation of the device at these or any other conditions above those listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Electrical Characteristics - Input/Supply/Common Output Parameters Commercial: TA = 0°C - 70°C; Industrial: TA = -40°C - +85°C; Supply Voltage AVDDQ, VDDQ = 1.8 V +/- 0.1V (unless otherwise stated) SYMBOL MIN PARAMETER CONDITIONS Input High Current IIH VI = VDDQ or GND (CLK_INT, CLK_INC) Input Low Current (OE, IIL VI = VDDQ or GND OS, FB_INT, FB_INC) Output Disabled Low IODL OE = L, VODL = 100mV 100 Current CL = 0pf @ 410MHz IDD1.8 Operating Supply Current CL = 0pf IDDLD VIK VDDQ = 1.7V Iin = -18mA Input Clamp Voltage VDDQ - 0.2 IOH = -100 µA VOH High-level output voltage IOH = -9 mA 1.1 IOL=100 µA VOL Low-level output voltage IOL=9 mA 1 VI = GND or VDDQ CIN 2 Input Capacitance COUT 2 VOUT = GND or VDDQ Output Capacitance1 1 Guaranteed by design, not 100% tested in production. 1177F—12/10/09 4 TYP MAX UNITS ±250 µA ±10 µA µA 300 500 -1.2 1.45 0.25 0.10 0.6 3 3 mA µA V V V V V pF pF ICS98ULPA877A Recommended Operating Condition (see note1) Commercial: TA = 0°C - 70°C; Industrial: TA = -40°C - +85°C; Supply Voltage AVDDQ, VDDQ = 1.8 V +/- 0.1V (unless otherwise stated) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 1.7 1.8 1.9 V Supply Voltage VDDQ, AVDD CLK_INT, CLK_INC, FB_INC, V 0.35 x VDDQ Low level input voltage VIL FB_INT V OE, OS 0.35 x VDDQ CLK_INT, CLK_INC, FB_INC, V 0.65 x V DDQ High level input voltage VIH FB_INT OE, OS 0.65 x V DDQ V DC input signal voltage VIN -0.3 VDDQ + 0.3 V (note 2) DC - CLK_INT, CLK_INC, V 0.3 VDDQ + 0.4 Differential input signal FB_INC, FB_INT VID voltage (note 3) AC - CLK_INT, CLK_INC, V 0.6 VDDQ + 0.4 FB_INC, FB_INT Output differential crossVOX VDDQ/2 - 0.10 VDDQ/2 + 0.10 V voltage (note 4) Input differential crossVIX VDDQ/2 - 0.15 VDD/2 VDDQ2 + 0.15 V voltage (note 4) High level output current IOH -9 mA Low level output current IOL 9 mA Operating free-air TA -40 85 °C temperature Notes: 1. Unused inputs must be held high or low to prevent them from floating. 2. DC input signal voltage specifies the allowable DC execution of differential input. 3. Differential inputs signal voltages specifies the differential voltage [VTR-VCP] required for switching, where VTR is the true input level and VCP is the complementary input level. 4. Differential cross-point voltage is expected to track variations of VDDQ and is the voltage at which the differential signal must be crossing. 1177F—12/10/09 5 ICS98ULPA877A Timing Requirements Commercial: TA = 0°C - 70°C; Industrial: TA = -40°C - +85°C; Supply Voltage AVDDQ, VDDQ = 1.8 V +/- 0.1V (unless otherwise stated) CONDITIONS PARAMETER SYMBOL MIN MAX UNITS Max clock frequency freqop 1.8V+0.1V @ 25°C 95 410 MHz Application Frequency Range freqApp 1.8V+0.1V @ 25°C 160 410 MHz Input clock duty cycle dtin 40 60 % 15 µs CLK stabilization TSTAB NOTE: The PLL must be able to handle spread spectrum induced skew. NOTE: Operating clock frequency indicates a range over which the PLL must be able to lock, but in which it is not required to meet the other timing parameters. (Used for low speed system debug.) NOTE: Application clock frequency indicates a range over which the PLL must meet all timing parameters. NOTE: Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal, within the value specificied by the Static Phase Offset (t∅), after power-up. During normal operation, the stabilization time is also the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal when CK and CK# go to a logic low state, enter the power-down mode and later return to active operation. CK and CK# may be left floating after they have been driven low for one complete clock cycle. 1177F—12/10/09 6 ICS98ULPA877A 1 Switching Characteristics Commercial: TA = 0°C - 70°C; Industrial: TA = -40°C - +85°C; Supply Voltage AVDDQ, VDDQ = 1.8 V +/- 0.1V (unless otherwise stated) PARAMETER CONDITION SYMBOL ten Output enable time OE to any output tdis OE to any output Output disable time Period jitter tjit (per) Half-period jitter tjit(hper) Input slew rate SLr1(i) Output clock slew rate SLr1(o) Cycle-to-cycle period jitter tjit(cc+) tjit(cc-) Dynamic Phase Offset t(Ø)dyn Static Phase Offset t jit (per) + t (Ø)dyn + t skew(o) t(Ø)dyn + tskew(o) tSPO2 ∑(su) ∑t (h) Output to Output Skew (MHz) MIN 30.00 3 40 -40 50 20 50 80 60 40 30 33 UNITS ns ns ps ps ps ps v/ns v/ns v/ns ps ps ps ps ps ps ps ps ps kHz 0.00 -0.50 % 160 to 410 160 to 270 271 to 410 160 to 270 271 to 410 Input Clock Output Enable (OE), (OS) 160 to 410 160 to 270 271 to 410 271 to 410 -40 -30 -60 -50 1 0.5 1.5 0 0 -50 -20 -50 160 to 270 271 to 410 tskew SSC modulation frequency SSC clock input frequency deviation PLL Loop bandwidth (-3 dB from unity gain) 2.0 Notes: 1. Switching characteristics guaranteed for application frequency range. 2. Static phase offset shifted by design. 1177F—12/10/09 7 TYP 4.73 5.82 2.5 2.5 0 MAX 8 8 40 30 60 50 4 MHz ICS98ULPA877A Parameter Measurement Information VDD ICS98ULPA877A V(CLK) V (CLK) GND Figure 1: IBIS Model Output Load VDD/2 GND C = 10pF ICS98ULPA877A R = 10 Z = 60 SCOPE Z = 50 L = 2.97" R = 1M C = 1pF Z = 120 R = 10 Z = 60 Z = 50 VTT C = 10pF L = 2.97" R = 1M C = 1pF VTT GND Note: VTT = GND VDD/2 Figure 2: Output Load Test Circuit Yx, FB_OUTC Yx, FB_OUTT tC(N + 1) tC(N) tJIT(CC) = tC(N) + tC(N + 1) Figure 3: Cycle-to-Cycle Jitter 1177F—12/10/09 8 ICS98ULPA877A Parameter Measurement Information CLK_INC CLK_INT CLK_INC CLK_INT t( )n+1 t( )n n =N t( ) = t( )n 1 N Figure 4: Static Phase Offset Yx# Yx Yx, FB_OUTC Yx, FB_OUTT tSKEW Figure 5: Output Skew Yx, FB_OUTC Yx, FB_OUTT tC(n) Yx, FB_OUTC Yx, FB_OUTT 1 fo t(JIT_PER) = tC(n) - 1 fo Figure 6: Period Jitter 1177F—12/10/09 9 ICS98ULPA877A Parameter Measurement Information Yx, FB_OUTC Yx, FB_OUTT tJIT(HPER_n+1) tJIT(HPER_n) 1 fo tJIT(HPER) = tJIT(HPER_n) - 1 2xfo Figure 7: Half-Period Jitter 80% 80% VID V OD 20% 20% Clock Inputs and outputs tSLR tSLF Figure 8: Input and Output Slew Rates 1177F—12/10/09 10 ICS98ULPA877A CLK# CLK FBIN# FBIN t( ) t( ) SSC OFF SSC OFF SSC ON SSC ON t( )dyn t( )dyn t( )dyn t( )dyn Figure 9: Dynamic Phase Offset 50% VDDQ OE Y# tEN 50% VDDQ Y. Y# Y OE 50% VDDQ tDIS Y 50% VDDQ Y# Figure 10: Time Delay Between OE and Clock Output (Y, Y#) 1177F—12/10/09 11 ICS98ULPA877A VIA CARD 1 BEAD 0603 AVDD VDDQ 4.7uF 1206 0.1uF 0603 2200pF 0603 PLL GND AGND VIA CARD Figure 11. AVDD Filtering *Place the 2200pF capacitors close to the PLL. *Use wide traces for PLL Analog power and GND. Connect PLL and caps to AGND trace and connect trace to one GND via (farthest from PLL). *Recommended bead: Fair-rite P/N 2506036017Y0 or equivalent (0.8 DC max., 600 at 100MHz). 1177F—12/10/09 12 ICS98ULPA877A C SEATING PLANE Numeric Designations for Horizontal Grid A1 b REF T 4 3 2 1 A B C D Alpha Designations for Vertical Grid (Letters I, O, Q, and S not used) D d TYP D1 -e- TYP TOP VIEW E c REF -e- TYP h TYP 0.12 C E1 ALL DIMENSIONS IN MILLIMETERS D E 7.00 Bsc 4.50 Bsc T Min/Max 0.86/1.00 e 0.65 Bsc ----- BALL GRID ----HORIZ VERT 6 10 Max. TOTAL 60 d Min/Max 0.25/0.45 h Min/Max 0.15/0.31 D1 E1 5.85 Bsc 3.25 Bsc Note: Ball grid total indicates maximum ball count for package. Lesser quantity may be used. * Source Ref.: JEDEC Publication 95, MO-205*, MO-225** 10-0055 Ordering Information 98ULPA877AHLFT Example: XXXX y H z LF T Designation for tape and reel packaging Lead Free, RoHS Compliant (Optional) Temperature Grade Blank = 0°C to +70°C (Commercial) I = -40°C to +85°C (Industrial) Package Type H = BGA Revision Designator (will not correlate with datasheet revision) Device Type 1177F—12/10/09 13 REF. DIMENSIONS b c 0.575 0.625 ** ICS98ULPA877A Seating Plane A1 Index Area L A3 N (Ref.) ND & NE Even (ND - 1) x e (Ref.) (Typ.) If ND & NE are Even e/2 1 1 Anvil Singulation 2 2 or E (NE - 1) x e (Ref.) E2 Sawn Singulation E2/2 Top View b (Ref.) ND & NE Odd A D e C 0.08 D2/2 D2 C THERMALLY ENHANCED, VERY THIN, FINE PITCH QUAD FLAT / NO LEAD PLASTIC PACKAGE ALL DIMENSION S IN MILLIMETERS N ND NE D x E BASIC D2 MIN. / MAX. E2 MIN. / MAX. L MIN. / MAX. 40 10 10 6.00 x 6.00 2.75 / 3.05 2.75 / 3.05 0.30 / 0.50 SYMBOL A A1 A3 b e MIN. MAX. 0.80 1.00 0 0.05 0.25 Reference 0.18 0.30 0.50 BASIC Source Reference: MLF2™ S 10-0053 Ordering Information 98ULPA877AKLFT Example: XXXX y K z LF T Designation for tape and reel packaging Lead Free, RoHS Compliant (Optional) Temperature Grade Blank = 0°C to +70°C (Commercial) I = -40°C to +85°C (Industrial) Package Type K = MLF Revision Designator (will not correlate with datasheet revision) Device Type 1177F—12/10/09 14 Thermal Base IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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