9DBU0931AKLF

9-Output 1.5V PCIe Gen1-2-3 Fanout Buffer 9DBU0931 DATASHEET Description Features/Benefits The 9DBU0931 is a member of IDT's 1.5V Ultra-Low-Power (ULP) PCIe family. The device has 9 output enables for clock management, and 3 selectable SMBus addresses. • LP-HCSL outputs; save 18 resistors compared to standard • Recommended Application • 1.5V PCIe Gen1-2-3 Fanout Buffer (FOB) Output Features • • 9 1–167MHz Low-Power (LP) HCSL DIF pairs • • Key Specifications • • • • DIF additive cycle-to-cycle jitter < 5ps DIF output-to-output skew < 60ps DIF additive phase jitter is < 300fs rms for PCIe Gen 3 DIF additive phase jitter < 350fs rms for SGMII • • • • • HCSL outputs 47mW typical power consumption in PLL mode; minimal power consumption Outputs can optionally be supplied from any voltage between 1.05 and 1.5V; maximum power savings Spread Spectrum (SS) compatible; allows SS for EMI reduction OE# pins for each output; support DIF power management HCSL-compatible differential input; can be driven by common clock sources SMBus-selectable features; optimize signal integrity to application • slew rate for each output • differential output amplitude Device contains default configuration; SMBus interface not required for device operation 3.3V tolerant SMBus interface works with legacy controllers Three selectable SMBus addresses; multiple devices can easily share an SMBus segment 6 × 6 mm 48-VFQFPN; minimal board space Block Diagram vOE(8:0)# 9 DIF8 DIF7 DIF6 CLK_IN DIF5 CLK_IN# DIF4 vSADR ^CKPWRGD_PD# SDATA_3.3 DIF3 DIF2 CONTROL LOGIC DIF1 SCLK_3.3 9DBU0931 MARCH 9, 2017 DIF0 1 ©2017 Integrated Device Technology, Inc. 9DBU0931 DATASHEET vOE5# VDD1.5 VDDIO GND DIF6 DIF6# vOE6# DIF7 DIF7# vOE7# VDDIO ^CKPWRGD_PD# Pin Configuration 48 47 46 45 44 43 42 41 40 39 38 37 vSADR_tri 1 36 DIF5# vOE8# 2 35 DIF5 DIF8 3 34 vOE4# DIF8# 4 33 DIF4# VDDR1.5 5 32 DIF4 9DBU0931 CLK_IN 6 CLK_IN# 7 31 VDDIO 30 VDDO1.5 epad is GND GNDR 8 29 GND GNDDIG 9 28 vOE3# SCLK_3.3 10 27 DIF3# SDATA_3.3 11 26 DIF3 VDDDIG1.5 12 25 vOE2# DIF2# DIF2 GND VDDIO DIF1# VDD1.5 DIF1 DIF0# vOE1# DIF0 vOE0# VDDIO 13 14 15 16 17 18 19 20 21 22 23 24 48-pin VFQFPN, 6x6 mm, 0.4mm pitch ^v prefix indicates internal 120KOhm pull up AND pull down resistor (biased to VDD/2) v prefix indicates internal 120KOhm pull down resistor prefix indicates internal 120KOhm pull up resistor ^ SMBus Address Selection Table State of SADR on first application of CKPWRGD_PD# SADR 0 M 1 Address 1101011 1101100 1101101 + Read/Write bit x x x Power Management Table CKPWRGD_PD# CLK_IN 0 1 1 1 X Running Running Running SMBus OEx bit X 0 1 1 OEx# Pin X X 0 1 DIFx True O/P Comp. O/P Low Low Low Low Running Running Low Low Power Connections VDD Pin Number VDDIO GND Description 5 8 12 9 Input receiver analog Digital power 22,29,40 DIF outputs 20,30,31,38 13,21,31,39,47 Note: EPAD on this device is not electrically connected to the die. It should be connected to ground for best thermal performance. 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 2 MARCH 9, 2017 9DBU0931 DATASHEET Pin Descriptions PIN # PIN NAME 1 vSADR_tri 2 vOE8# 3 4 DIF8 DIF8# 5 VDDR1.5 6 7 8 9 10 11 12 13 CLK_IN CLK_IN# GNDR GNDDIG SCLK_3.3 SDATA_3.3 VDDDIG1.5 VDDIO 14 vOE0# 15 16 DIF0 DIF0# 17 vOE1# 18 19 20 21 22 23 24 DIF1 DIF1# VDD1.5 VDDIO GND DIF2 DIF2# 25 vOE2# 26 27 DIF3 DIF3# 28 vOE3# 29 30 31 32 33 GND VDDO1.5 VDDIO DIF4 DIF4# 34 vOE4# 35 36 DIF5 DIF5# 37 vOE5# 38 39 40 VDD1.5 VDDIO GND MARCH 9, 2017 TYPE DESCRIPTION LATCHED Tri-level latch to select SMBus Address. It has an internal 120kohm pull down IN resistor. See SMBus Address Selection Table. Active low input for enabling output 8. This pin has an internal 120kohm pullIN down. OUT Differential true clock output. OUT Differential complementary clock output. 1.5V power for differential input clock (receiver). This VDD should be treated as PWR an Analog power rail and filtered appropriately. IN True input for differential reference clock. IN Complementary input for differential reference clock. GND Analog ground pin for the differential input (receiver) GND Ground pin for digital circuitry. IN Clock pin of SMBus circuitry, 3.3V tolerant. I/O Data pin for SMBus circuitry, 3.3V tolerant. PWR 1.5V digital power (dirty power) PWR Power supply for differential outputs Active low input for enabling output 0. This pin has an internal 120kohm pullIN down. OUT Differential true clock output. OUT Differential complementary clock output. Active low input for enabling output 1. This pin has an internal 120kohm pullIN down. OUT Differential true clock output. OUT Differential complementary clock output. PWR Power supply, nominally 1.5V PWR Power supply for differential outputs GND Ground pin. OUT Differential true clock output. OUT Differential complementary clock output. Active low input for enabling output 2. This pin has an internal 120kohm pullIN down. OUT Differential true clock output. OUT Differential complementary clock output. Active low input for enabling output 3. This pin has an internal 120kohm pullIN down. GND Ground pin. PWR Power supply for outputs, nominally 1.5V. PWR Power supply for differential outputs OUT Differential true clock output. OUT Differential complementary clock output. Active low input for enabling output 4. This pin has an internal 120kohm pullIN down. OUT Differential true clock output. OUT Differential complementary clock output. Active low input for enabling output 5. This pin has an internal 120kohm pullIN down. PWR Power supply, nominally 1.5V PWR Power supply for differential outputs GND Ground pin. 3 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET Pin Descriptions (cont.) PIN # PIN NAME 41 DIF6 42 DIF6# TYPE OUT OUT 43 vOE6# IN 44 45 DIF7 DIF7# OUT OUT 46 vOE7# IN 47 VDDIO PWR 48 ^CKPWRGD_PD# 49 EPAD DESCRIPTION Differential true clock output. Differential complementary clock output. Active low input for enabling output 6. This pin has an internal 120kohm pulldown. Differential true clock output. Differential complementary clock output. Active low input for enabling output 7. This pin has an internal 120kohm pulldown. Power supply for differential outputs Input notifies device to sample latched inputs and start up on first high assertion. Low enters Power Down Mode, subsequent high assertions exit Power Down Mode. This pin has internal 120kohm pull-up resistor. Connect EPAD to ground. IN GND Test Loads Low-Power Differential Output Test Load 5 inches Rs Zo=100ohm 2pF Rs 2pF Note: The device can drive transmission line lengths greater than those allowed by the PCIe SIG Alternate Differential Output Terminations Rs Zo Units 33 100 Ohms 27 85 Driving LVDS 3.3V Driving LVDS Cc R7a R7b R8a R8b Rs Zo Cc Rs LVDS Clock input Device Driving LVDS inputs Component R7a, R7b R8a, R8b Cc Vcm Value Receiver has Receiver does not termination have termination 10K ohm 5.6K ohm 0.1µF 1.2 volts Note 140 ohm 75 ohm 0.1µF 1.2 volts 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 4 MARCH 9, 2017 9DBU0931 DATASHEET Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the 9DBU0931. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. PARAMETER SYMBOL CONDITIONS Supply Voltage Input Voltage Input High Voltage, SMBus Storage Temperature Junction Temperature Input ESD Protection VDDx VIN VIHSMB Ts Tj ESD prot Applies to VDD, VDDA and VDDIO MIN -0.5 -0.5 TYP SMBus clock and data pins -65 Human Body Model MAX 2 VDD+0.5 3.3 150 125 2000 UNITS NOTES V V V °C °C V 1,2 1, 1 1 1 1 1 Guaranteed by design and characterization, not 100% tested in production. 2 Operation under these conditions is neither implied nor guaranteed. 3 Not to exceed 2.0V. Electrical Characteristics–Clock Input Parameters TA = TAMB, Supply voltages per normal operation conditions; see Test Loads for loading conditions PARAMETER Input Common Mode Voltage - DIF_IN Input Swing - DIF_IN Input Slew Rate - DIF_IN Input Leakage Current Input Duty Cycle Input Jitter - Cycle to Cycle 1 2 SYMBOL CONDITIONS MIN TYP VCOM Common mode input voltage 200 725 mV 1 VSWING dv/dt IIN dtin J DIFIn Differential value Measured differentially VIN = VDD , VIN = GND Measurement from differential waveform Differential measurement 300 0.4 -5 45 0 1450 8 5 55 150 mV V/ns µA % ps 1 1,2 50 MAX UNITS NOTES 1 1 Guaranteed by design and characterization, not 100% tested in production. Slew rate measured through +/-75mV window centered around differential zero. MARCH 9, 2017 5 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET Electrical Characteristics–Input/Supply/Common Parameters–Normal Operating Conditions TA = TAMB, Supply voltages per normal operation conditions; see Test Loads for loading conditions PARAMETER SYMBOL CONDITIONS MIN TYP MAX Supply Voltage Output Supply Voltage Ambient Operating Temperature Input High Voltage Input Mid Voltage Input Low Voltage VDDx VDDIO Supply voltage for core and analog Low voltage supply LP-HCSL outputs Commercial range Industrial range Single-ended inputs, except SMBus Single-ended tri-level inputs ('_tri' suffix) Single-ended inputs, except SMBus Single-ended inputs, VIN = GND, VIN = VDD Single-ended inputs VIN = 0 V; inputs with internal pull-up resistors VIN = VDD; inputs with internal pull-down resistors 1.425 0.95 0 -40 0.75 VDD 0.4 VDD -0.3 -5 1.5 1.05-1.5 25 25 1.575 1.575 70 85 VDD + 0.3 0.6 VDD 0.25 VDD 5 V V °C °C V V V µA -200 200 µA 1 167 7 5 2.7 6 MHz nH pF pF pF 2 1 1 1,5 1 1 ms 1,2 30 33 kHz 0 66 kHz 1 3 clocks 1,3 300 µs 1,3 5 5 0.6 3.3 0.4 2 2 3.3 1000 300 ns ns V V V mA V ns ns 400 kHz Input Current TAMB VIH VIM VIL IIN IINP Input Frequency Pin Inductance Fin Lpin CIN Capacitance CINDIF_IN COUT Clk Stabilization TSTAB OE# Latency tLATOE# Tdrive_PD# tDRVPD Tfall Trise SMBus Input Low Voltage SMBus Input High Voltage SMBus Output Low Voltage SMBus Sink Current Nominal Bus Voltage SCLK/SDATA Rise Time SCLK/SDATA Fall Time SMBus Operating Frequency tF tR Logic Inputs, except DIF_IN DIF_IN differential clock inputs Output pin capacitance From VDD Power-Up and after input clock stabilization or de-assertion of PD# to 1st clock Allowable Frequency for PCIe Applications (Triangular modulation) Allowable Frequency for non-PCIe Applications (Triangular modulation) DIF start after OE# assertion DIF stop after OE# deassertion DIF output enable after PD# de-assertion Fall time of single-ended control inputs Rise time of single-ended control inputs VILSMB VIHSMB VOLSMB IPULLUP VDDSMB tRSMB t FSMB VDDSMB = 3.3V, see note 4 for VDDSMB < 3.3V at IPULLUP at VOL Bus Voltage (Max VIL - 0.15V) to (Min VIH + 0.15V) (Min VIH + 0.15V) to (Max VIL - 0.15V) fMAXSMB Maximum SMBus operating frequency Input SS Modulation Frequency PCIe Input SS Modulation Frequency non-PCIe fMODINPCIe fMODIN 1.5 1.5 2.1 4 1.425 UNITS NOTES 1 1 4 1 1 6 1 Guaranteed by design and characterization, not 100% tested in production. Control input must be monotonic from 20% to 80% of input swing. 3 Time from deassertion until outputs are > 200 mV. 4 For VDDSMB < 3.3V, VIHSMB > = 0.8xVDDSMB 5 DIF_IN input. 2 6 The differential input clock must be running for the SMBus to be active. 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 6 MARCH 9, 2017 9DBU0931 DATASHEET Electrical Characteristics–DIF Low-Power HCSL Outputs TA = TAMB, Supply voltages per normal operation conditions; see Test Loads for loading conditions PARAMETER SYMBOL CONDITIONS MIN TYP Scope averaging on, fast setting Scope averaging on, slow setting Slew rate matching, scope averaging on 1.4 0.9 Slew rate matching dV/dt dV/dt ΔdV/dt 2.3 1.5 9.3 3.5 2.5 20 Voltage High VHIGH 630 750 850 Slew rate Voltage Low VLOW Statistical measurement on single-ended signal using oscilloscope math function. (Scope averaging on) Max Voltage Min Voltage Vswing Crossing Voltage (abs) Crossing Voltage (var) Vmax Vmin Vswing Vcross_abs Δ-Vcross Measurement on single ended signal using absolute value. (Scope averaging off) Scope averaging off Scope averaging off Scope averaging off MAX UNITS NOTES V/ns V/ns % 1,2,3 1,2,3 1,2,4 7 mV -150 26 150 763 22 1448 390 11 1150 -300 300 250 550 140 7 mV mV mV mV 7 7 1,2 1,5 1,6 1 Guaranteed by design and characterization, not 100% tested in production. Measured from differential waveform. 2 3 Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around differential 0V. 4 Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. 5 Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock rising and Clock# falling). 6 The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross absolute) allowed. The intent is to limit Vcross induced modulation by setting Δ-Vcross to be smaller than Vcross absolute. 7 At default SMBus settings. Electrical Characteristics–Current Consumption TA = TAMB, Supply voltages per normal operation conditions; see Test Loads for loading conditions PARAMETER 1 2 SYMBOL CONDITIONS MIN TYP MAX UNITS IDDA VDDO1.5+VDDR, PLL Mode, at 100MHz 2.2 3 mA Operating Supply Current IDD VDDx, All outputs active at 100MHz 4 6 mA IDDIO VDDIO, All outputs active at 100MHz 35 40 mA Powerdown Current IDDAPD IDDPD IDDIOPD VDDO1.5+VDDR, CKPWRGD_PD#=0 VDDx, CKPWRGD_PD#=0 VDDIO, CKPWRGD_PD#=0 0.4 0.2 0.0004 1 0.6 0.1 mA mA mA NOTES 2 2 2 Guaranteed by design and characterization, not 100% tested in production. Input clock stopped. MARCH 9, 2017 7 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET Electrical Characteristics–Output Duty Cycle, Jitter, Skew and PLL Characteristics TA = TAMB, Supply voltages per normal operation conditions; see Test Loads for loading conditions PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES Duty Cycle Distortion Skew, Input to Output Skew, Output to Output Jitter, Cycle to Cycle tDCD tpdBYP tsk3 Measured differentially, at 100MHz VT = 50% VT = 50% -1 2400 -0.2 2862 30 0.5 3700 60 % ps ps 1,3 1 1,4 tjcy c-cy c Additive Jitter 0.1 5 ps 1,2 1 Guaranteed by design and characterization, not 100% tested in production. 2 Measured from differential waveform. 3 Duty cycle distortion is the difference in duty cycle between the output and the input clock. 4 All outputs at default slew rate. Electrical Characteristics–Phase Jitter Parameters TA = TAMB, Supply voltages per normal operation conditions; see Test Loads for loading conditions PARAMETER SYMBOL CONDITIONS tjphPCIeG1 PCIe Gen 1 PCIe Gen 2 Low Band 10kHz < f < 1.5MHz PCIe Gen 2 High Band 1.5MHz < f < Nyquist (50MHz) PCIe Gen 3 (2-4MHz or 2-5MHz, CDR = 10MHz) 125MHz, 1.5MHz to 10MHz, -20dB/decade rollover < 1.5MHz, -40db/decade rolloff > 10MHz tjphPCIeG2 Additive Phase Jitter tjphPCIeG3 tjphSGMIIM0 tjphSGMIIM1 MIN 125MHz, 12kHz to 20MHz, -20dB/decade rollover < 1.5MHz, -40db/decade rolloff > 10MHz INDUSTRY LIMIT UNITS TYP MAX 0.1 5 N/A 0.1 0.4 N/A 0.1 0.7 N/A 0.1 0.3 N/A 200 250 N/A 313 350 N/A ps (p-p) ps (rms) ps (rms) ps (rms) fs (rms) fs (rms) Notes 1,2,3,5 1,2,3,4, 5 1,2,3,4 1,2,3,4 1,6 1,6 1 Guaranteed by design and characterization, not 100% tested in production. See http://www.pcisig.com for complete specs. 3 Sample size of at least 100K cycles. This figure extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12. 2 4 For RMS figures, additive jitter is calculated by solving the following equation: Additive jitter = SQRT[(total jitter)^2 - (input jitter)^2]. 5 Driven by 9FGV0831 or equivalent. Rohde & Schwarz SMA100. 6 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 8 MARCH 9, 2017 9DBU0931 DATASHEET Additive Phase Jitter Plot: 125M (12kHz to 20MHz) RMS additive jitter: 313fs MARCH 9, 2017 9 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET General SMBus Serial Interface Information How to Write How to Read • • • • • • • • • • • • • • • • • • • • • Controller (host) sends a start bit Controller (host) sends the write address IDT clock will acknowledge Controller (host) sends the beginning byte location = N IDT clock will acknowledge Controller (host) sends the byte count = X IDT clock will acknowledge Controller (host) starts sending Byte N through Byte N+X-1 IDT clock will acknowledge each byte one at a time Controller (host) sends a stop bit • • • Controller (host) will send a start bit Controller (host) sends the write address IDT clock will acknowledge Controller (host) sends the beginning byte location = N IDT clock will acknowledge Controller (host) will send a separate start bit Controller (host) sends the read address IDT clock will acknowledge IDT clock will send the data byte count = X IDT clock sends Byte N+X-1 IDT clock sends Byte 0 through Byte X (if X(H) was written to Byte 8) Controller (host) will need to acknowledge each byte Controller (host) will send a not acknowledge bit Controller (host) will send a stop bit Index Block Write Operation Controller (Host) T Index Block Read Operation IDT (Slave/Receiver) Controller (Host) starT bit T Slave Address WR IDT (Slave/Receiver) starT bit Slave Address WRite WR WRite ACK ACK Beginning Byte = N Beginning Byte = N ACK ACK Data Byte Count = X RT ACK Slave Address Beginning Byte N RD ACK X Byte O O ACK O Data Byte Count=X O ACK O Beginning Byte N Byte N + X - 1 ACK ACK P ReaD stoP bit X Byte O Repeat starT O O O O O O Note: SMBus Address is Latched on SADR pin. 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER Byte N + X - 1 10 N Not acknowledge P stoP bit MARCH 9, 2017 9DBU0931 DATASHEET SMBus Table: Output Enable Register 1 Byte 0 Name Control Function Type 0 DIF OE7 Output Enable RW Low/Low Bit 7 DIF OE6 Output Enable RW Low/Low Bit 6 DIF OE5 Output Enable RW Low/Low Bit 5 DIF OE4 Output Enable RW Low/Low Bit 4 DIF OE3 Output Enable RW Low/Low Bit 3 DIF OE2 Output Enable RW Low/Low Bit 2 DIF OE1 Output Enable RW Low/Low Bit 1 DIF OE0 Output Enable RW Low/Low Bit 0 1. A low on these bits will override the OE# pin and force the differential output Low/Low SMBus Table: Output Enable and Output Amplitude Control Register Byte 1 Name Control Function Type 0 Reserved Bit 7 Reserved Bit 6 DIF OE8 Output Enable RW Low/Low Bit 5 Reserved Bit 4 Reserved Bit 3 Reserved Bit 2 AMPLITUDE 1 RW 00 = 0.55V Bit 1 Controls Output Amplitude AMPLITUDE 0 RW 10 = 0.7V Bit 0 1. A low on the DIF OE bit will override the OE# pin and force the differential output Low/Low SMBus Table: DIF Slew Rate Control Register Byte 2 Name Control Function Type SLEWRATESEL DIF7 Adjust Slew Rate of DIF7 RW Bit 7 SLEWRATESEL DIF6 Adjust Slew Rate of DIF6 RW Bit 6 SLEWRATESEL DIF5 Adjust Slew Rate of DIF5 RW Bit 5 SLEWRATESEL DIF4 Adjust Slew Rate of DIF4 RW Bit 4 SLEWRATESEL DIF3 Adjust Slew Rate of DIF3 RW Bit 3 SLEWRATESEL DIF2 Adjust Slew Rate of DIF2 RW Bit 2 SLEWRATESEL DIF1 Adjust Slew Rate of DIF1 RW Bit 1 SLEWRATESEL DIF0 Adjust Slew Rate of DIF0 RW Bit 0 Note: See "DIF 0.7V Low-Power HCSL Outputs" table for slew rates. SMBus Table: DIF Slew Rate Control Register Byte 3 Name Control Function Type Reserved Bit 7 Reserved Bit 6 Reserved Bit 5 Reserved Bit 4 Reserved Bit 3 Reserved Bit 2 Reserved Bit 1 SLEWRATESEL DIF8 Adjust Slew Rate of DIF8 RW Bit 0 Note: See "DIF 0.7V Low-Power HCSL Outputs" table for slew rates. 0 Slow Setting Slow Setting Slow Setting Slow Setting Slow Setting Slow Setting Slow Setting Slow Setting 0 Slow Setting 1 Enabled Enabled Enabled Enabled Enabled Enabled Enabled Enabled Default 1 1 1 1 1 1 1 1 1 Default 0 1 1 0 1 1 1 0 Enabled 01= 0.65V 11 = 0.8V Fast Fast Fast Fast Fast Fast Fast Fast 1 Setting Setting Setting Setting Setting Setting Setting Setting Default 1 1 1 1 1 1 1 1 1 Default 1 1 0 0 Fast Setting 0 1 1 1 Byte 4 is Reserved and reads back 'hFF MARCH 9, 2017 11 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET SMBus Table: Revision and Vendor ID Register Byte 5 Name Control Function RID3 Bit 7 RID2 Bit 6 Revision ID RID1 Bit 5 RID0 Bit 4 VID3 Bit 3 VID2 Bit 2 VENDOR ID VID1 Bit 1 VID0 Bit 0 Type R R R R R R R R SMBus Table: Device Type/Device ID Byte 6 Name Device Type1 Bit 7 Device Type0 Bit 6 Device ID5 Bit 5 Device ID4 Bit 4 Device ID3 Bit 3 Device ID2 Bit 2 Device ID1 Bit 1 Device ID0 Bit 0 Type R R R R R R R R SMBus Table: Byte Count Register Byte 7 Name Bit 7 Bit 6 Bit 5 BC4 Bit 4 BC3 Bit 3 BC2 Bit 2 BC1 Bit 1 BC0 Bit 0 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER Control Function Device Type Device ID Control Function Reserved Reserved Reserved Byte Count Programming 12 Type RW RW RW RW RW 0 1 A rev = 0000 0001 = IDT 0 1 00 = FGx, 01 = DBx, 10 = DMx, 11= DBx w/oPLL 001001 binary or 09 hex 0 Default 0 0 0 0 0 0 0 1 Default 1 1 0 0 1 0 0 1 1 Default 0 0 0 0 Writing to this register will configure how 1 many bytes will be read back, default is 0 = 8 bytes. 0 0 MARCH 9, 2017 9DBU0931 DATASHEET Marking Diagrams ICS DBU0931AL YYWW COO LOT ICS BU0931AIL YYWW COO LOT Notes: 1. “LOT” is the lot sequence number. 2. “COO” denotes country of origin. 3. YYWW is the last two digits of the year and week that the part was assembled. 4. Line 2: truncated part number 5. “L” denotes RoHS compliant package. 6. “I” denotes industrial temperature range device. Thermal Characteristics PARAMETER SYMBOL CONDITIONS Thermal Resistance θJC θJb θJA0θ θJA1 θJA3 θJA5 Junction to Case Junction to Base Junction to Air, still air Junction to Air, 1 m/s air flow Junction to Air, 3 m/s air flow Junction to Air, 5 m/s air flow PKG NDG48 TYP VALUE 33 2.1 37 30 27 26 UNITS NOTES °C/W °C/W °C/W °C/W °C/W °C/W 1 1 1 1 1 1 1 ePad soldered to board MARCH 9, 2017 13 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET Package Outline and Dimensions (NDG48) 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 14 MARCH 9, 2017 9DBU0931 DATASHEET Package Outline and Dimensions (NDG48), cont. MARCH 9, 2017 15 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 9DBU0931 DATASHEET Ordering Information Part / Order Number Shipping Packaging 9DBU0931AKLF Trays 9DBU0931AKLFT Tape and Reel 9DBU0931AKILF Trays 9DBU0931AKILFT Tape and Reel Package 48-pin VFQFPN 48-pin VFQFPN 48-pin VFQFPN 48-pin VFQFPN Temperature 0 to +70° C 0 to +70° C -40 to +85° C -40 to +85° C “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. “A” is the device revision designator (will not correlate with the datasheet revision). Revision History Rev. A B C D E Initiator Issue Date Description RDW 7/16/2014 1. Updated electrical tables with final parameters. Updated SMBus Input High/Low parameters conditions, MAX values, and RDW 9/19/2014 footnotes. 1. Updated pin out and pin descriptions to show ePad on package connected to ground. RDW 4/22/2015 2. Minor updates to front page text for family consistency. 3. Updated Clock Input Parameters table to be consistent with PCIe Vswing parameter. 1. Updated pins 30 and 29 from VDDA1.5 and GNDA to VDDO1.5 and RDW 2/16/2017 GND to clearly indicate that this part has no PLL. 1. Removed "Bypass Mode" reference in "Output Duty Cycle..." and "Phase Jitter Parameters" tables; update note 3 under Output Duty Cycle table. RDW 3/9/2017 2. Corrected spelling errors/typos. 3. Change VDDA to VDDO1.5 in Current Consumption table. 4. Update Additive Phase Jitter conditions for PCIe Gen3. 9-OUTPUT 1.5V PCIE GEN1-2-3 FANOUT BUFFER 16 Page # Various 6 1-5 2, 3 MARCH 9, 2017 Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA www.idt.com 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.idt.com/go/sales www.idt.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. 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