To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
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Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
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contained therein.
Hitachi SuperH RISC engine
SH7750 Series
SH7750, SH7750S, SH7750R
Hardware Manual
ADE-602-124E
Rev. 6.0
7/10/2002
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The SH-4 (SH7750 Series: SH7750, SH7750S, SH7750R) microprocessor incorporates the 32-bit
SH-4 CPU and is also equipped with peripheral functions necessary for configuring a user system.
The SH7750 Series is built in with a variety of peripheral functions such as cache memory,
memory management unit (MMU), interrupt controller, timers, two serial communication
interfaces (SCI, SCIF), real-time clock (RTC), user break controller (UBC), bus state controller
(BSC) and smart card interface. This series can be used in a wide range of multimedia equipment.
The bus controller is compatible with ROM, SRAM, DRAM, synchronous DRAM and PCMCIA,
as well as 64-bit synchronous DRAM 4-bank system and 64-bit data bus.
Target Readers: This manual is designed for use by people who design application systems using
the SH7750, SH7750S, or SH7750R.
To use this manual, basic knowledge of electric circuits, logic circuits and microcomputers is
required.
Purpose: This manual provides the information of the hardware functions and electrical
characteristics of the SH7750, SH7750S, and SH7750R.
The SH-4 Programming Manual contains detailed information of executable instructions. Please
read the Programming Manual together with this manual.
How to Use the Book:
• To understand general functions
→ Read the manual from the beginning.
The manual explains the CPU, system control functions, peripheral functions and electrical
characteristics in that order.
• To understanding CPU functions
→ Refer to the separate SH-4 Programming Manual.
Explanatory Note: Bit sequence: upper bit at left, and lower bit at right
List of Related Documents: The latest documents are available on our Web site. Please make
sure that you have the latest version.
(http://www.hitachisemiconductor.com/)
• User manuals for SH7750, SH7750S, and SH7750R
Name of Document
Document No.
SH7750 Series Hardware Manual
This manual
SH-4 Programming Manual
ADE-602-156
Rev. 6.0, 07/02, page iii of I
• User manuals for development tools
Name of Document
Document No.
C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual
ADE-702-246
Simulator/Debugger User’s Manual
ADE-702-186
Hitachi Embedded Workshop User’s Manual
ADE-702-201
Rev. 6.0, 07/02, page iv of I
List of Items Revised or Added for This Version
Section
Page
Item
Description
1.1 SH7750 Series (SH7750, 1
SH7750S, SH7750R)
Features
4 to 8
Description amended
and added
Table 1.1 SH7750 Series
Features
Description added for
LSI, and description
and Note added for
Clock pulse generator
(CPG)
SH7750 and SH7750S
added to cache memory
Cache memory
[SH7750R] added to
table
Description added for
Direct memory access
controller (DMAC) and
Timer unit (TMU)
SH7750R table added
to Product lineup
Notes 1, 2, 3 added
1.2 Block Diagram
9
Figure 1.1 Block Diagram of
SH7750 Series Functions
I cache 8 KB and 0
cache 16 KB deleted
from table
1.3 Pin Arrangement
10 to 12
Figure 1.2 to 1.4
SH7750R added, and
description amended
1.4 Pin Functions
13 to 40
Table 1.2 to 1.4
Table and note
amended
2.7 Processor Modes
55
3.2 Register Descriptions
61
Figure 3.2 MMU-Related
Registers
Amended
62
3. Page table entry
assistance register (PTEA)
SH7750R added after
SH7750S
62
1. Page table entry high
register (PTEH),
6. MMU control register
(MMUCR)
Description added
3.3.1 Physical Address
Space
64 to 67
Description deleted
Description added
Rev. 6.0, 07/02, page v of I
Section
Page
Item
3.3.3 Virtual Address Space
68, 69
Description changed
3.3.4 On-Chip RAM Space
69
Description changed
3.3.7 Address Space
Identifier (ASID)
70
Note added
4.1.1 Features
4.2 Register Descriptions
Description
Completely revised
95
Table 4.1 Cache Features
(SH7750, SH7750S)
Completely revised
95
Table 4.2 Cache Features
(SH7750R)
Newly added
96
Table 4.3 Features of Store
Queues
Description added
97
Figure 4.1 Cache and Store
Queue Control Registers
Figure changed and
Note added
97
(1) Cache Control Register
(CCR)
Description added and
amended
4.3.1 Configuration
Description added
101
Figure 4.3 Configuration of
Operand Cache (SH7750R)
Newly added
4.3.6 RAM Mode
106 to
107
Description amended
and added
4.3.7 OC Index Mode
107
Description added
4.4.1 Configuration
109
Figure 4.5 amended to
figure 4.6, description
added and amended
110
Figure 4.7 Configuration of
Newly added
Instruction Cache (SH7750R)
4.6 Memory-Mapped Cache
Configuration (SH7750R)
116
Newly added
4.7 Store Queues
122
Description amended
and added
4.7.3 Transfer to External
Memory
122, 123
Description added
4.7.4 SQ Protection
124
Description added
4.7.5 Reading the SQs
(SH7750R Only)
124
Newly added
4.7.6 SQ Usage Notes
125
Newly added
5.2 Register Descriptions
128
Description amended
5.4 Exception Types and
Priorities
130 to
132
Rev. 6.0, 07/02, page vi of I
Table 5.2 Exceptions
Description and note
added
Section
Page
Item
Description
5.6.3 Interrupts
157
(3) Peripheral Module
Interrupts
Description changed
7.3 Instruction Set
186
Table 7.7 Branch Instructions Description added
8.3 Execution Cycles and
Pipeline Stalling
204 to
206
Description amended
9.1.1 Types of Power-Down
Modes
Note changed
222
Table 9.1 Status of CPU and Hardware standby
Peripheral Modules in Power- (SH7750S, SH7750R)
Down Modes
added to table,
description amended
9.1.2 Register Configuration
223
Table 9.2 Power-Down Mode Description and Note
Registers
added to table
9.1.3 Pin Configuration
223
Table 9.3 Power-Down Mode Description added to
Pins
Function in table and
amended
9.2.2 Peripheral Module Pin
High Impedance Control
226
Other information
Description amended
9.2.3 Peripheral Module Pin
Pull-Up Control
226
Other Information
Added
9.2.4 Standby Control
Register 2 (STBCR2)
227
Bit table
Bit 6 amended to STHZ
and bit 1 to MSTP6,
note added
227
Bit 6, Bits 1 and 0
Description added
9.2.5 Clock-Stop Register 00 228, 229
(CLKSTP00) (SH7750R Only)
Newly added
9.2.6 Clock-Stop Clear
229
Register 00 (CLKSTPCLR00)
(SH7750R Only)
Added
9.4.1 Transition to Deep
Sleep Mode
230
Description amended,
Note added
9.5.2 Exit from Standby
Mode
232
9.6.1 Transition to Module
Standby Function
234
9.6.2 Exit from Module
Standby Function
234
Exit by Interrupt
Note added
Text amended
Table description and
note added
9.7 Hardware Standby Mode 235
(SH7750S, SH7750R Only)
Description amended
Note deleted
SH7750R added
Rev. 6.0, 07/02, page vii of I
Section
Page
Item
Description
9.8.5 Hardware Standby
Mode Timing (SH7750S,
SH7750R Only)
244 to
246
Figures 9.12, 9.13, 9.15
Figures changed
10.2.1 Block Diagram of
CPG
249
Figure 10.1 (1) Block
Diagram of CPG (SH7750,
SH7750S)
Amended
250
Figure 10.1 (2) Block
Diagram of CPG (SH7750R)
Newly added
10.2.2 CPG Pin
Configuration
252
Table 10.1 CPG Pins
Table and Note
amended
10.2.3 CPG Register
Configuration
252
Table 10.2 CPG Register
Description added
Notes added
10.3 Clock Operating Modes
Description added and
amended
253
Table 10.3 (1) Clock
Operating Modes (SH7750,
SH7750S)
Table amended and
Note amended and
added
253
Table 10.3 (2) Clock
Newly added
Operating Modes (SH7750R)
254
Table 10.4 FRQCR Settings
and Internal Clock
Frequencies
Table and Note
amended
10.8.2 Watchdog Timer
Control/Status Register
(WTCSR)
261
Description amended
10.10 Notes on Board
Design
265
When Using a PLL Oscillator
Circuit
Description amended
266
Figure 10.5 Points for
Attention when Using PLL
Oscillator Circuit
Amended
11.1.1 Features
267
11.1.2 Block Diagram
268
Figure 11.1 Block Diagram
of RTC
Figure amended and
Note added
11.1.3 Pin Configuration
269
Table 11.1 RTC Pins
Table amended
Table 11.2 RTC Registers
RTC control register 3
and Year alarm register
added to table, and
Note added
11.1.4 Register Configuration 270
Rev. 6.0, 07/02, page viii of I
Description added for
Alarm interrupts
Section
Page
11.2.2 Second Counter
(RSECCNT)
271
Item
Description
Description amended
11.2.17 RTC Control
283
Register 3 (RCR3) and YearAlarm Register (RYRAR)
(SH7750R Only)
Newly added
11.3.3 Alarm Function
288
Description added
11.5.2 Carry Flag and
Interrupt Flag in Standby
Mode
289
Added
11.5.3 Crystal Oscillator
Circuit
290
12.1.1 Features
291
12.1.2 Block Diagram
292
12.1.4 Register Configuration 293,
294
Figure 11.5 Example of
Crystal Oscillator Circuit
Connection
Note amended
Description amended
and added
Figure 12.1
Block Diagram of TMU,
amended
Table 12.2 TMU Registers
Description and Note
added
12.2.3 Timer Start Register
2 (TSTR2)
297
Added
12.2.4 Timer Constant
Registers (TCOR)
298
Description amended
and added
12.2.5 Timer Counters
(TCNT)
298,
299
Description amended
and added
12.2.6 Timer Control
Registers (TCR)
299
Description amended
and added
12.3.1 Counter Operation
304
Description added
12.4 Interrupts
308
Description amended
and added
309
Table 12.3 TMU Interrupt
Sources
Channels 3 and 4
added to table
Note added
13.1.1 Features
312
Burst ROM interface
Description amended
and added, and Note
added
13.1.2 Block Diagram
313
Figure 13.1 Block Diagram
of BSC
Figure amended and
add Note added
Rev. 6.0, 07/02, page ix of I
Section
Item
Description
13.1.4 Register Configuration 318
Table 13.2 BSC Registers
Bus control register 3
and 4 added to table,
and Note added
13.1.5 Overview of Areas
320
Table 13.3 External Memory
Space Map
64* added to Area 0, 5,
6 Settable Bus Widths,
and Note 7 added
319
Space Divisions
Description amended
320
Table 13.3 External Memory
Space Map
Table amended, and
Notes amended and
added
321, 322
Memory Bus Width
Description added
326
Bit table
Bit 18 amended and
note added
327
Bit 31, Bit 30, Bit 29
Description added
328
Bit 26
330
Bit 16
Description and notes
added
330
Bit 15, Bit 14
Description amended
331
Bits 13 to 11
332
Bits 10 to 8
Table amended and
note added
333
Bits 7 to 5
334
Bit 0
Description amended
13.2.2 Bus Control Register
2 (BCR2)
335
Bits 15, 14
Description added
13.2.3 Bus Control Register
3 (BCR3) (SH7750R Only)
337
338
13.2.4 Bus Control Register
4 (BCR4)
338,
339
Newly added
13.2.5 Wait Control Register
1 (WCR1)
342
Note amended
13.2.6 Wait Control Register
2 (WCR2)
344 to
349
Bits 31 to 29, Bits 25 to 23,
Bits 19 to 17, Bits 15 to 13,
Bits 11 to 9, Bits 8 to 6,
Bits 5 to 3, and Bits 2 to 0
Description added and
amended
13.2.7 Wait Control Register
3 (WCR3)
351
Bit table
Bits 19 and 7 changed,
and Note added
13.2.1 Bus Control Register
1 (BCR1)
Page
351
Rev. 6.0, 07/02, page x of I
7
Newly added
Bits 12 to 1—Reserved
Description added
Description added
Section
Page
Item
Description
13.2.8 Memory Control
Register (MCR)
355
Bits 15 to 13—Write
Precharge Delay (TRWL2–
TRWL0)
Description added
358
For Synchronous DRAM
Interface
AMX6 description and
Notes amended
13.2.10 Synchronous DRAM 362 to
Mode Register (SDMR)
364
Description amended,
and Note added
13.3.1 Endian/Access Size
and Data Alignment
Description amended
371
Data Configuration
Quadword partially
amended
13.3.2 Areas
382
Area 0, Area 1
Description added and
amended
13.3.3 SRAM Interface
387
370
Basic interface changed
to SRAM interface
387
Basic Timing
Description amended
388, 393
to 395
Figures 13.6, 13.11 to 13.13
Notes added
395
Read-Strobe Negate Timing
(Setting Only Possible in the
SH7750R)
Description added and
amended
13.3.4 DRAM Interface
400 to 408 Figures 13.17 to 13.22
Notes added
13.3.5 Synchronous DRAM
Interface
413
Connection of Synchronous
DRAM
Description added
415
Address Multiplexing
Description amended
417 to
428
Figure 13.28 to 13.37
Note added
435
Power-On Sequence
Newly added
438
Notes on Changing the Burst
Length (Variation Only
Possible in the SH7750R)
Newly added
440
Connecting a 128-Mbit/256Newly added
Mbit Synchronous DRAM with
64-bit Bus Width
13.3.6 Burst ROM Interface
441, 442
Description amended
442 to 444 Figure 13.46 to 13.48
Notes added
Rev. 6.0, 07/02, page xi of I
Section
Page
13.3.7 PCMCIA Interface
444, 445
13.3.8 MPX Interface
Item
Description
Description amended
and added
446
Table 13.18 Relationship
between Address and CE
when Using PCMCIA
Interface
449, 452
to 454
Figures 13.50, 13.53 to 13.55 Notes added
450
Figure 13.51 Wait Timing for SH7750R added to
PCMCIA Memory Card
Note
Interface
451
Figure 13.52 PCMCIA Space Amended
Allocation
455
471
Table amended
Description added and
amended
Figure 13.71 MPX Interface
Timing 7
Amended
457 to 472 Figures 13.57 to 13.72
Notes added
473
Description amended
475 to 477 Figures 13.74 to 13.76
Notes added
13.3.10 Waits between
Access Cycles
479
Replaced
13.3.11 Bus Arbitration
480, 481
13.3.16 Notes on Usage
487
Refresh, Bus Arbitration
Description amended
487
Synchronous DRAM Mode
Register Setting (SH7750,
SH7750R Only)
Newly added
13.3.9 Byte Control SRAM
Interface
14.1 Overview
Figure 13.77 Waits between
Access Cycles
Description added and
amended
489
Description added and
amended
14.1.1 Features
489 to 491
Description amended
14.1.2 Block Diagram
(SH7750, SH7750S)
492
Title amended
14.2 Register Descriptions
(SH7750, SH7750S)
Rev. 6.0, 07/02, page xii of I
492
496
Figure 14.1 Block Diagram
of DMAC
Amended
Title amended
Section
Page
Item
Description
14.2.1 DMA Source Address 496
Registers 0–3 (SAR0–SAR3)
Description amended
14.2.2 DMA Destination
Address Registers 0–3
(DAR0–DAR3)
497
Description amended
14.2.3 DMA Transfer Count
Registers 0–3 (DMATCR0–
DMATCR3)
498
Description amended
14.2.4 DMA Channel Control 499
Registers 0–3 (CHCR0–
CHCR3)
502, 503
Description of DDT
mode added
Bits 19 to 16
Initial value changed
503
Bits 15, 14 and Bits 13, 12
Description amended
505
Bits 6 to 4
Description added
14.2.5 DMA Operation
Register (DMAOR)
508
Bit 4
Description amended
14.3.2 DMA Transfer
Requests
513
• External Request
Acceptance Conditions
Description added
14.3.4 Types of DMA
Transfer
526
Table 14.9 External Request Usable DMAC channels
Transfer Sources and
changed
Destinations in DDT Mode
525
(a) Normal DMA Mode
Description amendment
14.3.5 Number of Bus Cycle
States and '5(4 Pin
Sampling Timing
533 to
535
Figure 14.15 to 14.17
Figure description
added
14.5 On-Demand Data
Transfer Mode (DDT Mode)
545
14.5.2 Pins in DDT Mode
547
%$9/: Data bus D63–D0
release signal
Description added
Figures 14.26, 14.27
Title amended
Figure 14.28
Newly added
554
Figure 14.29
Amended
14.5.3 Transfer Request
551, 552
Acceptance on Each Channel 553
14.5.4 Notes on Use of DDT
Module
Description
amendments
554, 555
Figure 14.30, 14.31
Errors corrected
572
c. of 3. Handshake protocol
using the data bus (valid on
channel 0 only)
Description amended
573
b. of 8. Data transfer end
request
Added
573
12. Confirming DMA transfer
requests and number of
transfers executed
Description amended
Rev. 6.0, 07/02, page xiii of I
Section
Page
14.6 Configuration of the
DMAC (SH7750R)
574
Newly added
14.7 Register Descriptions
(SH7750R)
579
Newly added
14.8 Operation (SH7750R)
586
Added
14.9 Usage Notes
591
4.
Description amended
592
9.
Newly added
15.2.8 Serial Port Register
(SCSPTR1)
609
Bit 7
Description amended
16.1.2 Block Diagram
659
Figure 16.1 Block Diagram
of SCIF
Amended
16.1.3 Pin Configuration
660
Table 16.1 SCIF Pins
Note changed
16.2.6 Serial Control
Register (SCSCR2)
667
Bit 1
Description amended
Bit 7—Receive Error (ER)
Note description
changed
672
Bit 3—Framing Error (FER)
Description changed
672
16.2.7 Serial Status Register 669
(SCFSR2)
Item
Description
Bit 2—Parity Error (PER)
Description changed
16.2.9 FIFO Control Register 676
(SCFCR2)
Bits 10 to 8
SH7750R added
16.2.11 Serial Port Register
(SCSPTR2)
Figure 16.6 MRESET/SCK2
Pin
Deleted
689
Figure 16.6 Sample SCIF
Initialization Flowchart
Amended
696
Serial Data Reception
Description added to 5.
16.3.2 Serial Operation
17.1 Overview
703
Description amended
17.3.2 Pin Connections
711
Description deleted
18.1.3 Pin Configuration
740
Table 18.3 SCIF I/O Port
Pins
Amended
19.1.2 Block Diagram
752
Figure 19.1 Block Diagram
of INTC
Amended
19.1.4 Register Configuration 753
Table 19.2 INTC Registers
Description added to
table, Notes added and
amended
19.2.3 On-Chip Peripheral
Module Interrupts
Rev. 6.0, 07/02, page xiv of I
757, 758
Description added and
amended
Section
Page
Item
Description
19.2.4 Interrupt Exception
Handling and Priority
758
759 to
761
Table 19.5 Interrupt
Exception Handling Sources
and Priority Order
19.3.1 Interrupt Priority
Registers A to D (IPRA–
IPRD)
762
Table 19.6 Interrupt Request SH7750R added to
Sources and IPRA–IPRD
Note 3
Registers
Description added
Description added to
table, Notes added and
amended
19.3.3 Interrupt-Priority-Level 764
Setting Register 00
(INTPRI00)
Newly added
19.3.4 Interrupt Source
Register 00 (INTREQ00)
(SH7750R Only)
765
Newly added
19.3.5 Interrupt Mask
Register 00 (INTMSK00)
(SH7750R Only)
766
Newly added
19.3.6 Interrupt Mask Clear 767
Register 00 (INTMSKCLR00)
(SH7750R Only)
Newly added
19.3.7 Bit Assignments of
INTREQ00, INTMSK00, and
INTMSKCLR00 (SH7750R
Only)
767
19.3.4 moved to 19.3.7
19.4.1 Interrupt Operation
Sequence
768
Note 3 added
19.5 Interrupt Response
Time
771
Note amended
20.2.4 Break Address Mask
Register (BAMRA)
778, 779
Bit 2, and Bits 3, 1, and 0
Description added
20.2.10 Break Data Mask
Register B (BDMRB)
783
Bits 31 to 0
Description added
20.3.7 Program Counter
(PC) Value Saved
791
20.3.7 Program Counter
(PC) Value Saved
4. Description added
20.4 User Break Debug
Support Function
794
Figure 20.2 User Break
Debug Support Function
Flowchart
Amended
21.1.1 Features
799
21.1.2 Block Diagram
800
Description amended
Figure 21.1 Block Diagram
of H-UDI Circuit
Figure changed and
Note added
Rev. 6.0, 07/02, page xv of I
Section
Page
Item
Description
21.1.3 Pin Configuration
801
Table 21.1 H-UDI Pins
Table amended and
Note 3 added
Table 21.2 H-UDI Registers
Description added to
table and Notes 3 and 4
added
21.1.4 Register Configuration 802
21.2.1 Instruction Register
(SDIR)
804
[SH7750R] description
added
21.2.4 Interrupt Source
Register (SDINT)
806
Newly added
21.2.5 Boundary Scan
Register (SDBSR)
806
Newly added
808, 809
21.3.3 H-UDI Interrupt
Table 21.3 Configuration of
the Boundary Scan Register
(2), (3)
811
Newly added
Description changed
21.3.4 BYPASS
Deleted
21.3.4 Boundary Scan
(EXTEST, SAMPLE/
PRELOAD, BYPASS)
812
21.4 Usage Notes
812
5.
Description added
22.1 Absolute Maximum
Ratings
813
Table 22.1 Absolute
Maximum Ratings
Table amended and
notes amended
22.2 DC Characteristics
814, 815
Table 22.2
DC Characteristics
(HD6417750RBP240)
Newly added
816, 817
Table 22.3
DC Characteristics
(HD6417750RF240)
Newly added
818, 819
Table 22.4
DC Characteristics
(HD6417750RBP200)
Newly added
820, 821
Table 22.5
DC Characteristics
(HD6417750RF200)
Newly added
822, 823
Table 22.6
DC Characteristics
(HD6417750SBP200)
Amended
826, 827
Table 22.8
DC Characteristics
(HD6417750BP200M)
Amended
Rev. 6.0, 07/02, page xvi of I
Newly added
Section
Page
Item
Description
22.2 DC Characteristics
836, 837
Table 22.13
DC Characteristics
(HD6417750SVF133)
Amended
838, 839
Table 22.14
DC Characteristics
(HD6417750SVBT133)
Amended
840, 841
Table 22.15
DC Characteristics
(HD6417750VF128)
Amended
842
Table 22.17 Clock Timing
(HD6417750RBP240)
Newly added
842
Table 22.18 Clock Timing
(HD6417750RF240)
Newly added
842
Table 22.19 Clock Timing
(HD6417750BP200M,
HD6417750SBP200,
HD6417750RBP200)
HD6417750RBP200
clock timing added
842
Table 22.20 Clock Timing
(HD6417750RF200)
Newly added
842
Table 22.21 Clock Timing
(HD6417750SF200)
Amended
843
Table 22.22 Clock Timing
(HD6417750F167,
HD6417750F167I,
HD6417750SF167,
HD6417750SF167I)
Amended
843
Table 22.23 Clock Timing
(HD6417750SVF133,
HD6417750SVBT133)
Amended
843
Table 22.24 Clock Timing
(HD6417750VF128)
Amended
844, 845
Table 22.25 Clock and
Control Signal Timing
(HD6417750RBP240)
Newly added
846, 847
Table 22.26 Clock and
Control Signal Timing
(HD6417750RF240)
Newly added
848, 849
Table 22.27 Clock and
Control Signal Timing
(HD6417750RBP200)
Newly added
22.3 AC Characteristics
22.3.1 Clock and Control
Signal Timing
Rev. 6.0, 07/02, page xvii of I
Section
Page
Item
Description
22.3.1 Clock and Control
Signal Timing
850, 851
Table 22.28 Clock and
Control Signal Timing
(HD6417750RF200)
Newly added
852, 853
Table 22.29 Clock and
Control Signal Timing
(HD6417750BP200M,
HD6417750SBP200)
Newly added
854, 855
Table 22.30 Clock and
Control Signal Timing
(HD6417750SF200)
Amended
856, 857
Table 22.31 Clock and
Control Signal Timing
(HD6417750F167,
HD6417750F167I,
HD6417750SF167,
HD6417750SF167I)
Amended
858, 859
Table 22.32 Clock and
Control Signal Timing
(HD6417750SVF133,
HD6417750SVBT133)
Amended
860, 861
Table 22.33 Clock and
Control Signal Timing
(HD6417750VF128)
Amended
864
Figure 22.6 Standby Return
Oscillation Settling Time
(Return by 5(6(7)
Amended
865
Figure 22.8 Standby Return
Oscillation Settling Time
(Return by ,5/6–,5/3)
Amended
866
Figure 22.10 PLL
Amended
Synchronization Settling Time
in Case of IRL Interrupt
22.3.2 Control Signal Timing 868
Table 22.34 Control Signal
Timing (1)
Table newly added
22.3.3 Bus Timing
880
Figure 22.18 SRAM Bus
Cycle: Basic Bus Cycle (No
Wait, Address Setup/Hold
Time Insertion, AnS = 1,
AnH = 1)
Figure changed and
Note added
881
Figure 22.19 Burst ROM
Bus Cycle (No Wait)
Amended
871, 872
Table 22.35 Bus Timing (1)
Table newly added
Rev. 6.0, 07/02, page xviii of I
Section
Page
Item
Description
22.3.4 Peripheral Module
Signal Timing
924, 925
Table 22.36 Peripheral
Module Signal Timing (1)
Table newly added
900 to
921, 923
Figures 22.37 to 22.58,
Figure 22.60
Titles amended
930
Figure 22.62 RTC Oscillation Amended
Settling Time at Power-On
932
Figure 22.66(b) '%5(4/75
Input Timing and %$9/
Output Timing
Newly added
937 to
942
Table A.1 Address List
BCR4, RCR3, RYRAR,
SDINT and Notes
added
Appendix A Address List
BCR3 area 7 address
amended
DMAC, INTC, CPG,
TMU table added
Appendix B Package
Dimensions
943, 944
Figure B.1 Package
Dimensions (256-Pin BGA)
Amended
Figure B.2 Package
Dimensions (208-Pin QFP)
Appendix C Mode Pin
Settings
946
Clock Modes
Table 10.3 (1), (2)
inserted
947
Area 0 Bus Width
Area 0 memory type
deleted and data
integrated into area 0
bus width table
Appendix D &.,25(1% Pin
Configuration
948
Figure D.1 &.,25(1% Pin
Configuration
Amended
Appendix E Pin Functions
950 to
952
Table E.1 Pin States in
Reset, Power-Down State,
and Bus-Released State
Sleep row deleted
(17) BUS 64
(128M: 4M × 8b × 4) × 8
(SH7750R only)
Newly added
Appendix F Synchronous
DRAM Address
Multiplexing Tables
970, 971
D40–D51 deleted
Notes added
(18) BUS 64
(256M: 4M × 16b × 4) × 4
(SH7750R only)
Rev. 6.0, 07/02, page xix of I
Section
Page
Item
Description
Appendix F Synchronous
DRAM Address
Multiplexing Tables
972, 973
(19) BUS 32
(128M: 4M × 8b × 4) × 4
(SH7750S and SH7750R
only)
SH7750R added
(20) BUS 32
(256M: 4M × 16b × 4) × 2
(SH7750S and SH7750R
only)
Appendix H Power-On and
Power-Off Procedures
977 to
979
Appendix I Product Code
Lineup
980
Rev. 6.0, 07/02, page xx of I
Newly added
Table I.1 SH7750 Series
Product Code Lineup
SH7750R added
Contents
Section 1
1.1
1.2
1.3
1.4
Overview ...........................................................................................................
SH7750 Series (SH7750, SH7750S, SH7750R) Features .................................................
Block Diagram ..................................................................................................................
Pin Arrangement ...............................................................................................................
Pin Functions.....................................................................................................................
1.4.1 Pin Functions (256-Pin BGA) ..............................................................................
1.4.2 Pin Functions (208-Pin QFP) ...............................................................................
1.4.3 Pin Functions (264-Pin CSP) ...............................................................................
Section 2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Programming Model ......................................................................................
Data Formats .....................................................................................................................
Register Configuration ......................................................................................................
2.2.1 Privileged Mode and Banks .................................................................................
2.2.2 General Registers .................................................................................................
2.2.3 Floating-Point Registers .......................................................................................
2.2.4 Control Registers..................................................................................................
2.2.5 System Registers ..................................................................................................
Memory-Mapped Registers ...............................................................................................
Data Format in Registers ...................................................................................................
Data Formats in Memory ..................................................................................................
Processor States.................................................................................................................
Processor Modes ...............................................................................................................
Section 3
3.1
3.2
3.3
3.4
Memory Management Unit (MMU) .........................................................
Overview ...........................................................................................................................
3.1.1 Features ................................................................................................................
3.1.2 Role of the MMU .................................................................................................
3.1.3 Register Configuration .........................................................................................
3.1.4 Caution .................................................................................................................
Register Descriptions ........................................................................................................
Address Space ...................................................................................................................
3.3.1 Physical Address Space........................................................................................
3.3.2 External Memory Space .......................................................................................
3.3.3 Virtual Address Space..........................................................................................
3.3.4 On-Chip RAM Space ...........................................................................................
3.3.5 Address Translation..............................................................................................
3.3.6 Single Virtual Memory Mode and Multiple Virtual Memory Mode....................
3.3.7 Address Space Identifier (ASID) .........................................................................
TLB Functions...................................................................................................................
1
1
9
10
13
13
23
31
41
41
42
42
45
47
49
50
52
53
53
54
55
57
57
57
57
60
60
61
64
64
67
68
69
69
70
70
71
Rev. 6.0, 07/02, page xxi of I
3.5
3.6
3.7
3.4.1 Unified TLB (UTLB) Configuration....................................................................
3.4.2 Instruction TLB (ITLB) Configuration ................................................................
3.4.3 Address Translation Method ................................................................................
MMU Functions ................................................................................................................
3.5.1 MMU Hardware Management .............................................................................
3.5.2 MMU Software Management...............................................................................
3.5.3 MMU Instruction (LDTLB) .................................................................................
3.5.4 Hardware ITLB Miss Handling............................................................................
3.5.5 Avoiding Synonym Problems ..............................................................................
MMU Exceptions ..............................................................................................................
3.6.1 Instruction TLB Multiple Hit Exception ..............................................................
3.6.2 Instruction TLB Miss Exception ..........................................................................
3.6.3 Instruction TLB Protection Violation Exception..................................................
3.6.4 Data TLB Multiple Hit Exception........................................................................
3.6.5 Data TLB Miss Exception....................................................................................
3.6.6 Data TLB Protection Violation Exception ...........................................................
3.6.7 Initial Page Write Exception ................................................................................
Memory-Mapped TLB Configuration ...............................................................................
3.7.1 ITLB Address Array.............................................................................................
3.7.2 ITLB Data Array 1 ...............................................................................................
3.7.3 ITLB Data Array 2 ...............................................................................................
3.7.4 UTLB Address Array ...........................................................................................
3.7.5 UTLB Data Array 1..............................................................................................
3.7.6 UTLB Data Array 2..............................................................................................
Section 4
4.1
4.2
4.3
4.4
71
75
75
78
78
78
78
79
80
81
81
82
83
84
84
85
86
87
88
89
90
90
92
93
Caches ................................................................................................................ 95
Overview ........................................................................................................................... 95
4.1.1 Features ................................................................................................................ 95
4.1.2 Register Configuration ......................................................................................... 96
Register Descriptions ........................................................................................................ 97
Operand Cache (OC) ......................................................................................................... 99
4.3.1 Configuration ....................................................................................................... 99
4.3.2 Read Operation..................................................................................................... 103
4.3.3 Write Operation.................................................................................................... 104
4.3.4 Write-Back Buffer................................................................................................ 105
4.3.5 Write-Through Buffer .......................................................................................... 105
4.3.6 RAM Mode .......................................................................................................... 106
4.3.7 OC Index Mode.................................................................................................... 107
4.3.8 Coherency between Cache and External Memory ............................................... 107
4.3.9 Prefetch Operation ............................................................................................... 108
Instruction Cache (IC) ....................................................................................................... 108
4.4.1 Configuration ....................................................................................................... 108
4.4.2 Read Operation..................................................................................................... 111
Rev. 6.0, 07/02, page xxii of I
4.5
4.6
4.7
4.4.3 IC Index Mode ..................................................................................................... 111
Memory-Mapped Cache Configuration (SH7750, SH7750S)........................................... 112
4.5.1 IC Address Array ................................................................................................. 112
4.5.2 IC Data Array ....................................................................................................... 113
4.5.3 OC Address Array................................................................................................ 114
4.5.4 OC Data Array ..................................................................................................... 115
Memory-Mapped Cache Configuration (SH7750R) ......................................................... 116
4.6.1 IC Address Array ................................................................................................. 117
4.6.2 IC Data Array ....................................................................................................... 118
4.6.3 OC Address Array................................................................................................ 119
4.6.4 OC Data Array ..................................................................................................... 120
4.6.5 Summary of the Memory-Mapping of the OC ..................................................... 121
Store Queues ..................................................................................................................... 122
4.7.1 SQ Configuration ................................................................................................. 122
4.7.2 SQ Writes ............................................................................................................. 122
4.7.3 Transfer to External Memory ............................................................................... 122
4.7.4 SQ Protection ....................................................................................................... 124
4.7.5 Reading the SQs (SH7750R Only)....................................................................... 124
4.7.6 SQ Usage Notes ................................................................................................... 125
Section 5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
Exceptions ........................................................................................................ 127
Overview ........................................................................................................................... 127
5.1.1 Features ................................................................................................................ 127
5.1.2 Register Configuration ......................................................................................... 127
Register Descriptions ........................................................................................................ 128
Exception Handling Functions .......................................................................................... 129
5.3.1 Exception Handling Flow..................................................................................... 129
5.3.2 Exception Handling Vector Addresses................................................................. 129
Exception Types and Priorities.......................................................................................... 130
Exception Flow ................................................................................................................. 132
5.5.1 Exception Flow .................................................................................................... 132
5.5.2 Exception Source Acceptance .............................................................................. 133
5.5.3 Exception Requests and BL Bit............................................................................ 135
5.5.4 Return from Exception Handling ......................................................................... 135
Description of Exceptions ................................................................................................. 135
5.6.1 Resets ................................................................................................................... 136
5.6.2 General Exceptions .............................................................................................. 141
5.6.3 Interrupts .............................................................................................................. 155
5.6.4 Priority Order with Multiple Exceptions.............................................................. 158
Usage Notes....................................................................................................................... 159
Restrictions........................................................................................................................ 160
Rev. 6.0, 07/02, page xxiii of I
Section 6
6.1
6.2
6.3
6.4
6.5
6.6
Overview ........................................................................................................................... 161
Data Formats ..................................................................................................................... 161
6.2.1 Floating-Point Format .......................................................................................... 161
6.2.2 Non-Numbers (NaN)............................................................................................ 163
6.2.3 Denormalized Numbers........................................................................................ 164
Registers ............................................................................................................................ 165
6.3.1 Floating-Point Registers ....................................................................................... 165
6.3.2 Floating-Point Status/Control Register (FPSCR) ................................................. 167
6.3.3 Floating-Point Communication Register (FPUL)................................................. 168
Rounding ........................................................................................................................... 168
Floating-Point Exceptions ................................................................................................. 169
Graphics Support Functions .............................................................................................. 170
6.6.1 Geometric Operation Instructions ........................................................................ 170
6.6.2 Pair Single-Precision Data Transfer ..................................................................... 172
Section 7
7.1
7.2
7.3
Floating-Point Unit ........................................................................................ 161
Instruction Set .................................................................................................. 173
Execution Environment..................................................................................................... 173
Addressing Modes............................................................................................................. 175
Instruction Set ................................................................................................................... 179
Section 8
8.1
8.2
8.3
Pipelining .......................................................................................................... 193
Pipelines ............................................................................................................................ 193
Parallel-Executability ........................................................................................................ 200
Execution Cycles and Pipeline Stalling............................................................................. 204
Section 9
9.1
9.2
9.3
9.4
Power-Down Modes ...................................................................................... 221
Overview ........................................................................................................................... 221
9.1.1 Types of Power-Down Modes.............................................................................. 221
9.1.2 Register Configuration ......................................................................................... 223
9.1.3 Pin Configuration ................................................................................................. 223
Register Descriptions ........................................................................................................ 224
9.2.1 Standby Control Register (STBCR) ..................................................................... 224
9.2.2 Peripheral Module Pin High Impedance Control ................................................. 226
9.2.3 Peripheral Module Pin Pull-Up Control ............................................................... 226
9.2.4 Standby Control Register 2 (STBCR2) ................................................................ 227
9.2.5 Clock-Stop Register 00 (CLKSTP00) (SH7750R Only)...................................... 228
9.2.6 Clock-Stop Clear Register 00 (CLKSTPCLR00) (SH7750R Only) .................... 229
Sleep Mode........................................................................................................................ 230
9.3.1 Transition to Sleep Mode ..................................................................................... 230
9.3.2 Exit from Sleep Mode .......................................................................................... 230
Deep Sleep Mode .............................................................................................................. 230
9.4.1 Transition to Deep Sleep Mode............................................................................ 230
Rev. 6.0, 07/02, page xxiv of I
9.5
9.6
9.7
9.8
9.4.2 Exit from Deep Sleep Mode................................................................................. 231
Standby Mode ................................................................................................................... 231
9.5.1 Transition to Standby Mode................................................................................. 231
9.5.2 Exit from Standby Mode ...................................................................................... 232
9.5.3 Clock Pause Function........................................................................................... 232
Module Standby Function ................................................................................................. 233
9.6.1 Transition to Module Standby Function............................................................... 233
9.6.2 Exit from Module Standby Function.................................................................... 234
Hardware Standby Mode (SH7750S, SH7750R Only) ..................................................... 235
9.7.1 Transition to Hardware Standby Mode ................................................................ 235
9.7.2 Exit from Hardware Standby Mode ..................................................................... 235
9.7.3 Usage Notes ......................................................................................................... 235
STATUS Pin Change Timing............................................................................................ 236
9.8.1 In Reset................................................................................................................. 237
9.8.2 In Exit from Standby Mode.................................................................................. 238
9.8.3 In Exit from Sleep Mode...................................................................................... 240
9.8.4 In Exit from Deep Sleep Mode............................................................................. 242
9.8.5 Hardware Standby Mode Timing (SH7750S, SH7750R Only)............................ 244
Section 10 Clock Oscillation Circuits ............................................................................ 247
10.1 Overview ........................................................................................................................... 247
10.1.1 Features ................................................................................................................ 247
10.2 Overview of CPG .............................................................................................................. 249
10.2.1 Block Diagram of CPG ........................................................................................ 249
10.2.2 CPG Pin Configuration ........................................................................................ 252
10.2.3 CPG Register Configuration ................................................................................ 252
10.3 Clock Operating Modes..................................................................................................... 253
10.4 CPG Register Description ................................................................................................. 254
10.4.1 Frequency Control Register (FRQCR) ................................................................. 254
10.5 Changing the Frequency.................................................................................................... 257
10.5.1 Changing PLL Circuit 1 Starting/Stopping (When PLL Circuit 2 is Off)............ 257
10.5.2 Changing PLL Circuit 1 Starting/Stopping (When PLL Circuit 2 is On) ............ 257
10.5.3 Changing Bus Clock Division Ratio (When PLL Circuit 2 is On)....................... 258
10.5.4 Changing Bus Clock Division Ratio (When PLL Circuit 2 is Off) ...................... 258
10.5.5 Changing CPU or Peripheral Module Clock Division Ratio................................ 258
10.6 Output Clock Control ........................................................................................................ 258
10.7 Overview of Watchdog Timer........................................................................................... 259
10.7.1 Block Diagram ..................................................................................................... 259
10.7.2 Register Configuration ......................................................................................... 260
10.8 WDT Register Descriptions .............................................................................................. 260
10.8.1 Watchdog Timer Counter (WTCNT) ................................................................... 260
10.8.2 Watchdog Timer Control/Status Register (WTCSR) ........................................... 261
10.8.3 Notes on Register Access ..................................................................................... 263
Rev. 6.0, 07/02, page xxv of I
10.9 Using the WDT ................................................................................................................. 263
10.9.1 Standby Clearing Procedure................................................................................. 263
10.9.2 Frequency Changing Procedure ........................................................................... 264
10.9.3 Using Watchdog Timer Mode.............................................................................. 264
10.9.4 Using Interval Timer Mode.................................................................................. 265
10.10 Notes on Board Design...................................................................................................... 265
Section 11 Realtime Clock (RTC) .................................................................................. 267
11.1 Overview ........................................................................................................................... 267
11.1.1 Features ................................................................................................................ 267
11.1.2 Block Diagram ..................................................................................................... 268
11.1.3 Pin Configuration ................................................................................................. 269
11.1.4 Register Configuration ......................................................................................... 269
11.2 Register Descriptions ........................................................................................................ 271
11.2.1 64 Hz Counter (R64CNT) .................................................................................... 271
11.2.2 Second Counter (RSECCNT)............................................................................... 271
11.2.3 Minute Counter (RMINCNT) .............................................................................. 272
11.2.4 Hour Counter (RHRCNT) .................................................................................... 272
11.2.5 Day-of-Week Counter (RWKCNT) ..................................................................... 273
11.2.6 Day Counter (RDAYCNT) .................................................................................. 274
11.2.7 Month Counter (RMONCNT).............................................................................. 274
11.2.8 Year Counter (RYRCNT) .................................................................................... 275
11.2.9 Second Alarm Register (RSECAR)...................................................................... 276
11.2.10 Minute Alarm Register (RMINAR) ..................................................................... 276
11.2.11 Hour Alarm Register (RHRAR)........................................................................... 277
11.2.12 Day-of-Week Alarm Register (RWKAR) ............................................................ 277
11.2.13 Day Alarm Register (RDAYAR) ......................................................................... 278
11.2.14 Month Alarm Register (RMONAR)..................................................................... 279
11.2.15 RTC Control Register 1 (RCR1) .......................................................................... 279
11.2.16 RTC Control Register 2 (RCR2) .......................................................................... 281
11.2.17 RTC Control Register 3 (RCR3) and Year-Alarm Register (RYRAR)
(SH7750R Only) .................................................................................................. 283
11.3 Operation........................................................................................................................... 285
11.3.1 Time Setting Procedures ...................................................................................... 285
11.3.2 Time Reading Procedures .................................................................................... 286
11.3.3 Alarm Function .................................................................................................... 288
11.4 Interrupts ........................................................................................................................... 289
11.5 Usage Notes....................................................................................................................... 289
11.5.1 Register Initialization ........................................................................................... 289
11.5.2 Carry Flag and Interrupt Flag in Standby Mode................................................... 289
11.5.3 Crystal Oscillator Circuit...................................................................................... 289
Rev. 6.0, 07/02, page xxvi of I
Section 12 Timer Unit (TMU) ......................................................................................... 291
12.1 Overview ........................................................................................................................... 291
12.1.1 Features ................................................................................................................ 291
12.1.2 Block Diagram ..................................................................................................... 292
12.1.3 Pin Configuration ................................................................................................. 292
12.1.4 Register Configuration ......................................................................................... 293
12.2 Register Descriptions ........................................................................................................ 295
12.2.1 Timer Output Control Register (TOCR) .............................................................. 295
12.2.2 Timer Start Register (TSTR) ................................................................................ 296
12.2.3 Timer Start Register 2 (TSTR2) (SH7750R Only)............................................... 297
12.2.4 Timer Constant Registers (TCOR)....................................................................... 298
12.2.5 Timer Counters (TCNT)....................................................................................... 298
12.2.6 Timer Control Registers (TCR)............................................................................ 299
12.2.7 Input Capture Register (TCPR2) .......................................................................... 303
12.3 Operation........................................................................................................................... 304
12.3.1 Counter Operation ................................................................................................ 304
12.3.2 Input Capture Function......................................................................................... 307
12.4 Interrupts ........................................................................................................................... 308
12.5 Usage Notes....................................................................................................................... 309
12.5.1 Register Writes..................................................................................................... 309
12.5.2 TCNT Register Reads .......................................................................................... 309
12.5.3 Resetting the RTC Frequency Divider ................................................................. 309
12.5.4 External Clock Frequency .................................................................................... 309
Section 13 Bus State Controller (BSC) ......................................................................... 311
13.1 Overview ........................................................................................................................... 311
13.1.1 Features ................................................................................................................ 311
13.1.2 Block Diagram ..................................................................................................... 313
13.1.3 Pin Configuration ................................................................................................. 314
13.1.4 Register Configuration ......................................................................................... 318
13.1.5 Overview of Areas ............................................................................................... 319
13.1.6 PCMCIA Support................................................................................................. 322
13.2 Register Descriptions ........................................................................................................ 326
13.2.1 Bus Control Register 1 (BCR1)............................................................................ 326
13.2.2 Bus Control Register 2 (BCR2)............................................................................ 335
13.2.3 Bus Control Register 3 (BCR3) (SH7750R Only) ............................................... 337
13.2.4 Bus Control Register 4 (BCR4) (SH7750R Only) ............................................... 338
13.2.5 Wait Control Register 1 (WCR1) ......................................................................... 340
13.2.6 Wait Control Register 2 (WCR2) ......................................................................... 343
13.2.7 Wait Control Register 3 (WCR3) ......................................................................... 351
13.2.8 Memory Control Register (MCR) ........................................................................ 352
13.2.9 PCMCIA Control Register (PCR) ........................................................................ 359
13.2.10 Synchronous DRAM Mode Register (SDMR)..................................................... 362
Rev. 6.0, 07/02, page xxvii of I
13.2.11 Refresh Timer Control/Status Register (RTCSR) ................................................ 364
13.2.12 Refresh Timer Counter (RTCNT) ........................................................................ 367
13.2.13 Refresh Time Constant Register (RTCOR).......................................................... 368
13.2.14 Refresh Count Register (RFCR)........................................................................... 369
13.2.15 Notes on Accessing Refresh Control Registers.................................................... 369
13.3 Operation........................................................................................................................... 370
13.3.1 Endian/Access Size and Data Alignment ............................................................. 370
13.3.2 Areas .................................................................................................................... 382
13.3.3 SRAM Interface ................................................................................................... 387
13.3.4 DRAM Interface................................................................................................... 395
13.3.5 Synchronous DRAM Interface............................................................................. 413
13.3.6 Burst ROM Interface............................................................................................ 441
13.3.7 PCMCIA Interface ............................................................................................... 444
13.3.8 MPX Interface...................................................................................................... 455
13.3.9 Byte Control SRAM Interface.............................................................................. 473
13.3.10 Waits between Access Cycles .............................................................................. 478
13.3.11 Bus Arbitration..................................................................................................... 480
13.3.12 Master Mode ........................................................................................................ 483
13.3.13 Slave Mode........................................................................................................... 484
13.3.14 Partial-Sharing Master Mode ............................................................................... 485
13.3.15 Cooperation between Master and Slave ............................................................... 486
13.3.16 Notes on Usage .................................................................................................... 487
Section 14 Direct Memory Access Controller (DMAC) .......................................... 489
14.1 Overview ........................................................................................................................... 489
14.1.1 Features ................................................................................................................ 489
14.1.2 Block Diagram (SH7750, SH7750S) ................................................................... 492
14.1.3 Pin Configuration (SH7750, SH7750S) ............................................................... 493
14.1.4 Register Configuration (SH7750, SH7750S) ....................................................... 494
14.2 Register Descriptions (SH7750, SH7750S)....................................................................... 496
14.2.1 DMA Source Address Registers 0–3 (SAR0–SAR3)........................................... 496
14.2.2 DMA Destination Address Registers 0–3 (DAR0–DAR3) .................................. 497
14.2.3 DMA Transfer Count Registers 0–3 (DMATCR0–DMATCR3) ......................... 498
14.2.4 DMA Channel Control Registers 0–3 (CHCR0–CHCR3) ................................... 499
14.2.5 DMA Operation Register (DMAOR) ................................................................... 507
14.3 Operation........................................................................................................................... 510
14.3.1 DMA Transfer Procedure..................................................................................... 510
14.3.2 DMA Transfer Requests....................................................................................... 512
14.3.3 Channel Priorities................................................................................................. 515
14.3.4 Types of DMA Transfer ....................................................................................... 518
14.3.5 Number of Bus Cycle States and '5(4 Pin Sampling Timing........................... 527
14.3.6 Ending DMA Transfer ......................................................................................... 541
14.4 Examples of Use................................................................................................................ 544
Rev. 6.0, 07/02, page xxviii of I
14.5
14.6
14.7
14.8
14.9
14.4.1 Examples of Transfer between External Memory and an External Device
with DACK .......................................................................................................... 544
On-Demand Data Transfer Mode (DDT Mode)................................................................ 545
14.5.1 Operation.............................................................................................................. 545
14.5.2 Pins in DDT Mode ............................................................................................... 547
14.5.3 Transfer Request Acceptance on Each Channel................................................... 550
14.5.4 Notes on Use of DDT Module ............................................................................. 571
Configuration of the DMAC (SH7750R) .......................................................................... 574
14.6.1 Block Diagram of the DMAC .............................................................................. 574
14.6.2 Pin Configuration (SH7750R).............................................................................. 575
14.6.3 Register Configuration (SH7750R)...................................................................... 576
Register Descriptions (SH7750R) ..................................................................................... 579
14.7.1 DMA Source Address Registers 0–7 (SAR0–SAR7)........................................... 579
14.7.2 DMA Destination Address Registers 0–7 (DAR0–DAR7) .................................. 579
14.7.3 DMA Transfer Count Registers 0–7 (DMATCR0–DMATCR7) ......................... 580
14.7.4 DMA Channel Control Registers 0–7 (CHCR0–CHCR7) ................................... 580
14.7.5 DMA Operation Register (DMAOR) ................................................................... 583
Operation (SH7750R)........................................................................................................ 586
14.8.1 Channel Specification for a Normal DMA Transfer ............................................ 586
14.8.2 Channel Specification for DDT-Mode DMA Transfer ........................................ 586
14.8.3 Transfer Channel Notification in DDT Mode ...................................................... 586
14.8.4 Clearing Request Queues by DTR Format........................................................... 587
14.8.5 Interrupt-Request Codes....................................................................................... 588
Usage Notes....................................................................................................................... 591
Section 15 Serial Communication Interface (SCI) ..................................................... 593
15.1 Overview ........................................................................................................................... 593
15.1.1 Features ................................................................................................................ 593
15.1.2 Block Diagram ..................................................................................................... 595
15.1.3 Pin Configuration ................................................................................................. 596
15.1.4 Register Configuration ......................................................................................... 596
15.2 Register Descriptions ........................................................................................................ 597
15.2.1 Receive Shift Register (SCRSR1) ........................................................................ 597
15.2.2 Receive Data Register (SCRDR1)........................................................................ 597
15.2.3 Transmit Shift Register (SCTSR1)....................................................................... 598
15.2.4 Transmit Data Register (SCTDR1) ...................................................................... 598
15.2.5 Serial Mode Register (SCSMR1) ......................................................................... 599
15.2.6 Serial Control Register (SCSCR1) ....................................................................... 601
15.2.7 Serial Status Register (SCSSR1) .......................................................................... 605
15.2.8 Serial Port Register (SCSPTR1)........................................................................... 609
15.2.9 Bit Rate Register (SCBRR1) ................................................................................ 613
15.3 Operation........................................................................................................................... 621
15.3.1 Overview .............................................................................................................. 621
Rev. 6.0, 07/02, page xxix of I
15.3.2 Operation in Asynchronous Mode ....................................................................... 623
15.3.3 Multiprocessor Communication Function............................................................ 634
15.3.4 Operation in Synchronous Mode.......................................................................... 642
15.4 SCI Interrupt Sources and DMAC .................................................................................... 651
15.5 Usage Notes....................................................................................................................... 652
Section 16 Serial Communication Interface with FIFO (SCIF) ............................. 657
16.1 Overview ........................................................................................................................... 657
16.1.1 Features ................................................................................................................ 657
16.1.2 Block Diagram ..................................................................................................... 659
16.1.3 Pin Configuration ................................................................................................. 660
16.1.4 Register Configuration ......................................................................................... 661
16.2 Register Descriptions ........................................................................................................ 661
16.2.1 Receive Shift Register (SCRSR2) ........................................................................ 661
16.2.2 Receive FIFO Data Register (SCFRDR2)............................................................ 662
16.2.3 Transmit Shift Register (SCTSR2)....................................................................... 662
16.2.4 Transmit FIFO Data Register (SCFTDR2) .......................................................... 663
16.2.5 Serial Mode Register (SCSMR2) ......................................................................... 663
16.2.6 Serial Control Register (SCSCR2) ....................................................................... 665
16.2.7 Serial Status Register (SCFSR2) .......................................................................... 668
16.2.8 Bit Rate Register (SCBRR2) ................................................................................ 674
16.2.9 FIFO Control Register (SCFCR2)........................................................................ 675
16.2.10 FIFO Data Count Register (SCFDR2) ................................................................. 678
16.2.11 Serial Port Register (SCSPTR2)........................................................................... 679
16.2.12 Line Status Register (SCLSR2)............................................................................ 684
16.3 Operation........................................................................................................................... 685
16.3.1 Overview .............................................................................................................. 685
16.3.2 Serial Operation ................................................................................................... 686
16.4 SCIF Interrupt Sources and the DMAC ............................................................................ 697
16.5 Usage Notes....................................................................................................................... 698
Section 17 Smart Card Interface ...................................................................................... 703
17.1 Overview ........................................................................................................................... 703
17.1.1 Features ................................................................................................................ 703
17.1.2 Block Diagram ..................................................................................................... 704
17.1.3 Pin Configuration ................................................................................................. 705
17.1.4 Register Configuration ......................................................................................... 705
17.2 Register Descriptions ........................................................................................................ 706
17.2.1 Smart Card Mode Register (SCSCMR1) ............................................................. 706
17.2.2 Serial Mode Register (SCSMR1) ......................................................................... 707
17.2.3 Serial Control Register (SCSCR1) ....................................................................... 708
17.2.4 Serial Status Register (SCSSR1) .......................................................................... 709
17.3 Operation........................................................................................................................... 710
Rev. 6.0, 07/02, page xxx of I
17.3.1 Overview .............................................................................................................. 710
17.3.2 Pin Connections ................................................................................................... 711
17.3.3 Data Format.......................................................................................................... 712
17.3.4 Register Settings................................................................................................... 713
17.3.5 Clock .................................................................................................................... 715
17.3.6 Data Transmit/Receive Operations....................................................................... 718
17.4 Usage Notes....................................................................................................................... 725
Section 18 I/O Ports ............................................................................................................ 731
18.1 Overview ........................................................................................................................... 731
18.1.1 Features ................................................................................................................ 731
18.1.2 Block Diagrams.................................................................................................... 732
18.1.3 Pin Configuration ................................................................................................. 739
18.1.4 Register Configuration ......................................................................................... 741
18.2 Register Descriptions ........................................................................................................ 742
18.2.1 Port Control Register A (PCTRA) ....................................................................... 742
18.2.2 Port Data Register A (PDTRA)............................................................................ 743
18.2.3 Port Control Register B (PCTRB)........................................................................ 744
18.2.4 Port Data Register B (PDTRB) ............................................................................ 745
18.2.5 GPIO Interrupt Control Register (GPIOIC) ......................................................... 745
18.2.6 Serial Port Register (SCSPTR1)........................................................................... 746
18.2.7 Serial Port Register (SCSPTR2)........................................................................... 748
Section 19 Interrupt Controller (INTC) ......................................................................... 751
19.1 Overview ........................................................................................................................... 751
19.1.1 Features ................................................................................................................ 751
19.1.2 Block Diagram ..................................................................................................... 751
19.1.3 Pin Configuration ................................................................................................. 753
19.1.4 Register Configuration ......................................................................................... 753
19.2 Interrupt Sources ............................................................................................................... 754
19.2.1 NMI Interrupt ....................................................................................................... 754
19.2.2 IRL Interrupts....................................................................................................... 755
19.2.3 On-Chip Peripheral Module Interrupts................................................................. 757
19.2.4 Interrupt Exception Handling and Priority ........................................................... 758
19.3 Register Descriptions ........................................................................................................ 761
19.3.1 Interrupt Priority Registers A to D (IPRA–IPRD) ............................................... 761
19.3.2 Interrupt Control Register (ICR) .......................................................................... 762
19.3.3 Interrupt-Priority-Level Setting Register 00 (INTPRI00) (SH7750R Only)........ 764
19.3.4 Interrupt Source Register 00 (INTREQ00) (SH7750R Only) .............................. 765
19.3.5 Interrupt Mask Register 00 (INTMSK00) (SH7750R Only)................................ 766
19.3.6 Interrupt Mask Clear Register 00 (INTMSKCLR00) (SH7750R Only) .............. 767
19.3.7 Bit Assignments of INTREQ00, INTMSK00, and INTMSKCLR00
(SH7750R Only) ..................................................................................................767
Rev. 6.0, 07/02, page xxxi of I
19.4 INTC Operation................................................................................................................. 768
19.4.1 Interrupt Operation Sequence............................................................................... 768
19.4.2 Multiple Interrupts................................................................................................ 770
19.4.3 Interrupt Masking with MAI Bit .......................................................................... 770
19.5 Interrupt Response Time ................................................................................................... 771
Section 20 User Break Controller (UBC) ..................................................................... 773
20.1 Overview ........................................................................................................................... 773
20.1.1 Features ................................................................................................................ 773
20.1.2 Block Diagram ..................................................................................................... 774
20.2 Register Descriptions ........................................................................................................ 776
20.2.1 Access to UBC Control Registers ........................................................................ 776
20.2.2 Break Address Register A (BARA) ..................................................................... 777
20.2.3 Break ASID Register A (BASRA) ....................................................................... 778
20.2.4 Break Address Mask Register A (BAMRA) ........................................................ 778
20.2.5 Break Bus Cycle Register A (BBRA) .................................................................. 779
20.2.6 Break Address Register B (BARB) ...................................................................... 781
20.2.7 Break ASID Register B (BASRB) ....................................................................... 781
20.2.8 Break Address Mask Register B (BAMRB)......................................................... 781
20.2.9 Break Data Register B (BDRB) ........................................................................... 781
20.2.10 Break Data Mask Register B (BDMRB) .............................................................. 782
20.2.11 Break Bus Cycle Register B (BBRB)................................................................... 783
20.2.12 Break Control Register (BRCR)........................................................................... 783
20.3 Operation........................................................................................................................... 785
20.3.1 Explanation of Terms Relating to Accesses ......................................................... 785
20.3.2 Explanation of Terms Relating to Instruction Intervals ....................................... 786
20.3.3 User Break Operation Sequence........................................................................... 787
20.3.4 Instruction Access Cycle Break ........................................................................... 788
20.3.5 Operand Access Cycle Break ............................................................................... 789
20.3.6 Condition Match Flag Setting .............................................................................. 790
20.3.7 Program Counter (PC) Value Saved .................................................................... 790
20.3.8 Contiguous A and B Settings for Sequential Conditions...................................... 791
20.3.9 Usage Notes ......................................................................................................... 792
20.4 User Break Debug Support Function ................................................................................ 793
20.5 Examples of Use................................................................................................................ 795
20.6 User Break Controller Stop Function ................................................................................ 797
20.6.1 Transition to User Break Controller Stopped State .............................................. 797
20.6.2 Cancelling the User Break Controller Stopped State ........................................... 797
20.6.3 Examples of Stopping and Restarting the User Break Controller ........................ 798
Section 21 Hitachi User Debug Interface (H-UDI).................................................... 799
21.1 Overview ........................................................................................................................... 799
21.1.1 Features ................................................................................................................ 799
Rev. 6.0, 07/02, page xxxii of I
21.1.2 Block Diagram ..................................................................................................... 799
21.1.3 Pin Configuration ................................................................................................. 801
21.1.4 Register Configuration ......................................................................................... 802
21.2 Register Descriptions ........................................................................................................ 803
21.2.1 Instruction Register (SDIR).................................................................................. 803
21.2.2 Data Register (SDDR).......................................................................................... 805
21.2.3 Bypass Register (SDBPR).................................................................................... 805
21.2.4 Interrupt Source Register (SDINT) (SH7750R Only) .......................................... 806
21.2.5 Boundary Scan Register (SDBSR) (SH7750R Only)........................................... 806
21.3 Operation........................................................................................................................... 810
21.3.1 TAP Control ......................................................................................................... 810
21.3.2 H-UDI Reset......................................................................................................... 811
21.3.3 H-UDI Interrupt ................................................................................................... 811
21.3.4 Boundary Scan (EXTEST, SAMPLE/PRELOAD, BYPASS) (SH7750R Only). 812
21.4 Usage Notes....................................................................................................................... 812
Section 22 Electrical Characteristics .............................................................................. 813
22.1 Absolute Maximum Ratings.............................................................................................. 813
22.2 DC Characteristics............................................................................................................. 814
22.3 AC Characteristics............................................................................................................. 842
22.3.1 Clock and Control Signal Timing ........................................................................ 844
22.3.2 Control Signal Timing.......................................................................................... 868
22.3.3 Bus Timing........................................................................................................... 871
22.3.4 Peripheral Module Signal Timing ........................................................................ 924
22.3.5 AC Characteristic Test Conditions....................................................................... 934
22.3.6 Delay Time Variation Due to Load Capacitance.................................................. 935
Appendix A Address List .................................................................................................. 937
Appendix B Package Dimensions .................................................................................. 943
Appendix C Mode Pin Settings ....................................................................................... 947
Appendix D &.,25(1% Pin Configuration ............................................................... 949
Appendix E Pin Functions ................................................................................................ 951
E.1
E.2
Pin States ........................................................................................................................... 951
Handling of Unused Pins................................................................................................... 954
Appendix F
Synchronous DRAM Address Multiplexing Tables ........................ 955
Appendix G Prefetching of Instructions and its Side Effects ................................. 977
Rev. 6.0, 07/02, page xxxiii of I
Appendix H Power-On and Power-Off Procedures................................................... 978
Appendix I
Product Code Lineup ................................................................................. 979
Index........................................................................................................................................... 981
Figures
Figure 1.1
Figure 1.2
Figure 1.3
Figure 1.4
Figure 2.1
Figure 2.2
Figure 2.3
Figure 2.4
Figure 2.5
Figure 2.6
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Figure 3.5
Figure 3.6
Figure 3.7
Figure 3.8
Figure 3.9
Figure 3.10
Figure 3.11
Figure 3.12
Figure 3.13
Figure 3.14
Figure 3.15
Figure 3.16
Figure 3.17
Figure 3.18
Figure 4.1
Figure 4.2
Figure 4.3
Figure 4.4
Figure 4.5
Figure 4.6
Figure 4.7
Block Diagram of SH7750 Series Functions.................................................... 9
Pin Arrangement (256-Pin BGA)..................................................................... 10
Pin Arrangement (208-Pin QFP) ...................................................................... 11
Pin Arrangement (264-Pin CSP) ...................................................................... 12
Data Formats .................................................................................................... 41
CPU Register Configuration in Each Processor Mode..................................... 44
General Registers ............................................................................................. 46
Floating-Point Registers ................................................................................... 48
Data Formats In Memory ................................................................................. 53
Processor State Transitions .............................................................................. 55
Role of the MMU ............................................................................................. 59
MMU-Related Registers................................................................................... 61
Physical Address Space (MMUCR.AT = 0) .................................................... 65
P4 Area............................................................................................................. 66
External Memory Space ................................................................................... 67
Virtual Address Space (MMUCR.AT = 1)....................................................... 68
UTLB Configuration ........................................................................................ 71
Relationship between Page Size and Address Format...................................... 72
ITLB Configuration.......................................................................................... 75
Flowchart of Memory Access Using UTLB..................................................... 76
Flowchart of Memory Access Using ITLB ...................................................... 77
Operation of LDTLB Instruction ..................................................................... 79
Memory-Mapped ITLB Address Array............................................................ 88
Memory-Mapped ITLB Data Array 1 .............................................................. 89
Memory-Mapped ITLB Data Array 2 .............................................................. 90
Memory-Mapped UTLB Address Array .......................................................... 91
Memory-Mapped UTLB Data Array 1............................................................. 92
Memory-Mapped UTLB Data Array 2............................................................. 93
Cache and Store Queue Control Registers ....................................................... 97
Configuration of Operand Cache(SH7750, SH7750S)..................................... 100
Configuration of Operand Cache (SH7750R) .................................................. 101
Configuration of Write-Back Buffer ................................................................ 105
Configuration of Write-Through Buffer........................................................... 105
Configuration of Instruction Cache (SH7750, SH7750S) ................................ 109
Configuration of Instruction Cache (SH7750R)............................................... 110
Rev. 6.0, 07/02, page xxxiv of I
Figure 4.8
Figure 4.9
Figure 4.10
Figure 4.11
Figure 4.12
Figure 4.13
Figure 4.14
Figure 4.15
Figure 4.16
Figure 5.1
Figure 5.2
Figure 5.3
Figure 6.1
Figure 6.2
Figure 6.3
Figure 6.4
Figure 8.1
Figure 8.2
Figure 8.3
Figure 9.1
Figure 9.2
Figure 9.3
Figure 9.4
Figure 9.5
Figure 9.6
Figure 9.7
Figure 9.8
Figure 9.9
Figure 9.10
Figure 9.11
Figure 9.12
Figure 9.13
Figure 9.14
Figure 9.15
Figure 10.1 (1)
Figure 10.1 (2)
Figure 10.2
Figure 10.3
Figure 10.4
Figure 10.5
Figure 11.1
Figure 11.2
Figure 11.3
Memory-Mapped IC Address Array ................................................................ 113
Memory-Mapped IC Data Array ...................................................................... 114
Memory-Mapped OC Address Array............................................................... 115
Memory-Mapped OC Data Array .................................................................... 116
Memory-Mapped IC Address Array ................................................................ 118
Memory-Mapped IC Data Array ...................................................................... 119
Memory-Mapped OC Address Array............................................................... 120
Memory-Mapped OC Data Array .................................................................... 121
Store Queue Configuration............................................................................... 122
Register Bit Configurations.............................................................................. 128
Instruction Execution and Exception Handling................................................ 133
Example of General Exception Acceptance Order........................................... 134
Format of Single-Precision Floating-Point Number......................................... 161
Format of Double-Precision Floating-Point Number ....................................... 162
Single-Precision NaN Bit Pattern ..................................................................... 164
Floating-Point Registers ................................................................................... 166
Basic Pipelines ................................................................................................. 194
Instruction Execution Patterns.......................................................................... 195
Examples of Pipelined Execution..................................................................... 207
STATUS Output in Power-On Reset ............................................................... 237
STATUS Output in Manual Reset.................................................................... 237
STATUS Output in Standby → Interrupt Sequence......................................... 238
STATUS Output in Standby → Power-On Reset Sequence ............................ 238
STATUS Output in Standby → Manual Reset Sequence................................. 239
STATUS Output in Sleep → Interrupt Sequence............................................. 240
STATUS Output in Sleep → Power-On Reset Sequence................................. 240
STATUS Output in Sleep → Manual Reset Sequence..................................... 241
STATUS Output in Deep Sleep → Interrupt Sequence ................................... 242
STATUS Output in Deep Sleep → Power-On Reset Sequence ....................... 242
STATUS Output in Deep Sleep → Manual Reset Sequence ........................... 243
Hardware Standby Mode Timing (When CA = Low in Normal Operation).... 244
Hardware Standby Mode Timing (When CA = Low in WDT Operation) ....... 245
Timing When Power Other than VDD-RTC is Off.......................................... 246
Timing When VDD-RTC Power is Off → On................................................. 246
Block Diagram of CPG (SH7750, SH7750S) .................................................. 249
Block Diagram of CPG (SH7750R) ................................................................. 250
Block Diagram of WDT ................................................................................... 259
Writing to WTCNT and WTCSR..................................................................... 263
Points for Attention when Using Crystal Resonator......................................... 265
Points for Attention when Using PLL Oscillator Circuit ................................. 266
Block Diagram of RTC .................................................................................... 268
Examples of Time Setting Procedures ............................................................. 285
Examples of Time Reading Procedures ........................................................... 287
Rev. 6.0, 07/02, page xxxv of I
Figure 11.4
Figure 11.5
Figure 12.1
Figure 12.2
Figure 12.3
Figure 12.4
Figure 12.5
Figure 12.6
Figure 12.7
Figure 13.1
Figure 13.2
Figure 13.3
Figure 13.4
Figure 13.5
Figure 13.6
Figure 13.7
Figure 13.8
Figure 13.9
Figure 13.10
Figure 13.11
Figure 13.12
Figure 13.13
Figure 13.14
Figure 13.15
Figure 13.16
Figure 13.17
Figure 13.18
Figure 13.19
Figure 13.20
Figure 13.21
Figure 13.22 (1)
Figure 13.22 (2)
Figure 13.22 (3)
Figure 13.22 (4)
Figure 13.23
Figure 13.24
Figure 13.25
Example of Use of Alarm Function.................................................................. 288
Example of Crystal Oscillator Circuit Connection........................................... 290
Block Diagram of TMU ................................................................................... 292
Example of Count Operation Setting Procedure .............................................. 305
TCNT Auto-Reload Operation ......................................................................... 305
Count Timing when Operating on Internal Clock ............................................ 306
Count Timing when Operating on External Clock ........................................... 306
Count Timing when Operating on On-Chip RTC Output Clock...................... 307
Operation Timing when Using Input Capture Function ................................... 308
Block Diagram of BSC..................................................................................... 313
Correspondence between Virtual Address Space and External Memory
Space ................................................................................................................ 319
External Memory Space Allocation ................................................................. 321
Example of 5'< Sampling Timing at which BCR4 is Set
(Two Wait Cycles are Inserted by WCR2)....................................................... 338
Writing to RTCSR, RTCNT, RTCOR, and RFCR........................................... 370
Basic Timing of SRAM Interface..................................................................... 388
Example of 64-Bit Data Width SRAM Connection ......................................... 389
Example of 32-Bit Data Width SRAM Connection ......................................... 390
Example of 16-Bit Data Width SRAM Connection ......................................... 391
Example of 8-Bit Data Width SRAM Connection ........................................... 392
SRAM Interface Wait Timing (Software Wait Only) ...................................... 393
SRAM Interface Wait State Timing (Wait State Insertion by 5'< Signal) .... 394
SRAM Interface Read-Strobe Negate Timing (AnS = 1, AnW = 4, AnH = 2) 395
Example of DRAM Connection (64-Bit Data Width, Area 3) ......................... 396
Example of DRAM Connection (32-Bit Data Width, Area 3) ......................... 397
Example of DRAM Connection (16-Bit Data Width, Areas 2 and 3) .............. 398
Basic DRAM Access Timing ........................................................................... 400
DRAM Wait State Timing ............................................................................... 401
DRAM Burst Access Timing ........................................................................... 402
DRAM Bus Cycle (EDO Mode, RCD = 0, AnW = 0, TPC = 1)...................... 403
Burst Access Timing in DRAM EDO Mode.................................................... 404
DRAM Burst Bus Cycle, RAS Down Mode Start
(Fast Page Mode, RCD = 0, AnW = 0) ............................................................ 405
DRAM Burst Bus Cycle, RAS Down Mode Continuation
(Fast Page Mode, RCD = 0, AnW = 0) ............................................................ 406
DRAM Burst Bus Cycle, RAS Down Mode Start
(EDO Mode, RCD = 0, AnW = 0) ................................................................... 407
DRAM Burst Bus Cycle, RAS Down Mode Continuation
(EDO Mode, RCD = 0, AnW = 0) ................................................................... 408
CAS-Before-RAS Refresh Operation............................................................... 409
DRAM CAS-Before-RAS Refresh Cycle Timing (TRAS = 0, TRC = 1)........ 410
DRAM Self-Refresh Cycle Timing.................................................................. 412
Rev. 6.0, 07/02, page xxxvi of I
Figure 13.26
Figure 13.27
Figure 13.28
Figure 13.29
Figure 13.30
Figure 13.31
Figure 13.32
Figure 13.33
Figure 13.34
Figure 13.35
Figure 13.36
Figure 13.37
Figure 13.38
Example of 64-Bit Data Width Synchronous DRAM Connection (Area 3) .... 414
Example of 32-Bit Data Width Synchronous DRAM Connection (Area 3) .... 415
Basic Timing for Synchronous DRAM Burst Read ......................................... 417
Basic Timing for Synchronous DRAM Single Read........................................ 418
Basic Timing for Synchronous DRAM Burst Write ........................................ 419
Basic Timing for Synchronous DRAM Single Write....................................... 421
Burst Read Timing ........................................................................................... 423
Burst Read Timing (RAS Down, Same Row Address) .................................... 424
Burst Read Timing (RAS Down, Different Row Addresses)........................... 425
Burst Write Timing .......................................................................................... 426
Burst Write Timing (Same Row Address) ....................................................... 427
Burst Write Timing (Different Row Addresses) .............................................. 428
Burst Read Cycle for Different Bank and Row Address Following
Preceding Burst Read Cycle............................................................................. 430
Figure 13.39
Auto-Refresh Operation ................................................................................... 432
Figure 13.40
Synchronous DRAM Auto-Refresh Timing..................................................... 432
Figure 13.41
Synchronous DRAM Self-Refresh Timing ...................................................... 434
Figure 13.42 (1) Synchronous DRAM Mode Write Timing (PALL) ......................................... 436
Figure 13.42 (2) Synchronous DRAM Mode Write Timing (Mode Register Set) ...................... 437
Figure 13.43
Basic Timing of Synchronous DRAM Burst Read (Burst Length = 4)............ 438
Figure 13.44
Basic Timing of a Burst Write to Synchronous DRAM................................... 440
Figure 13.45
Example of the Connection of Synchronous DRAM with 64-bit Bus Width
(256 Mbits)....................................................................................................... 441
Figure 13.46
Burst ROM Basic Access Timing .................................................................... 442
Figure 13.47
Burst ROM Wait Access Timing ..................................................................... 443
Figure 13.48
Burst ROM Wait Access Timing ..................................................................... 444
Figure 13.49
Example of PCMCIA Interface ........................................................................ 448
Figure 13.50
Basic Timing for PCMCIA Memory Card Interface........................................ 449
Figure 13.51
Wait Timing for PCMCIA Memory Card Interface ......................................... 450
Figure 13.52
PCMCIA Space Allocation .............................................................................. 451
Figure 13.53
Basic Timing for PCMCIA I/O Card Interface ................................................ 452
Figure 13.54
Wait Timing for PCMCIA I/O Card Interface ................................................. 453
Figure 13.55
Dynamic Bus Sizing Timing for PCMCIA I/O Card Interface ........................ 454
Figure 13.56
Example of 64-Bit Data Width MPX Connection............................................ 456
Figure 13.57
MPX Interface Timing 1
(Single Read Cycle, AnW = 0, No External Wait, Bus Width: 64 Bits) .......... 457
Figure 13.58
MPX Interface Timing 2
(Single Read, AnW = 0, One External Wait Inserted, Bus Width: 64 Bits) ..... 458
Figure 13.59
MPX Interface Timing 3
(Single Write Cycle, AnW = 0, No Wait, Bus Width: 64 Bits)........................ 459
Figure 13.60
MPX Interface Timing 4
(Single Write, AnW = 1, One External Wait Inserted, Bus Width: 64 Bits) .... 460
Rev. 6.0, 07/02, page xxxvii of I
Figure 13.61
Figure 13.62
Figure 13.63
Figure 13.64
Figure 13.65
Figure 13.66
Figure 13.67
Figure 13.68
Figure 13.69
Figure 13.70
Figure 13.71
Figure 13.72
Figure 13.73
Figure 13.74
Figure 13.75
Figure 13.76
Figure 13.77
Figure 13.78
MPX Interface Timing 5
(Burst Read Cycle, AnW = 0, No External Wait, Bus Width: 64 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 461
MPX Interface Timing 6
(Burst Read Cycle, AnW = 0, External Wait Control, Bus Width: 64 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 462
MPX Interface Timing 7
(Burst Write Cycle, AnW = 0, No External Wait, Bus Width: 64 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 463
MPX Interface Timing 8
(Burst Write Cycle, AnW = 1, External Wait Control, Bus Width: 64 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 464
MPX Interface Timing 1
(Burst Read Cycle, AnW = 0, No External Wait, Bus Width: 32 Bits,
Transfer Data Size: 64 Bytes) .......................................................................... 465
MPX Interface Timing 2
(Burst Read Cycle, AnW = 0, One External Wait Inserted, Bus Width: 32 Bits,
Transfer Data Size: 64 Bytes) .......................................................................... 466
MPX Interface Timing 3
(Burst Write Cycle, AnW = 0, No External Wait, Bus Width: 32 Bits,
Transfer Data Size: 64 Bytes) .......................................................................... 467
MPX Interface Timing 4
(Burst Write Cycle, AnW = 1, One External Wait Inserted, Bus Width: 32 Bits,
Transfer Data Size: 64 Bytes) .......................................................................... 468
MPX Interface Timing 5
(Burst Read Cycle, AnW = 0, No External Wait, Bus Width: 32 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 469
MPX Interface Timing 6
(Burst Read Cycle, AnW = 0, External Wait Control, Bus Width: 32 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 470
MPX Interface Timing 7
(Burst Write Cycle, AnW = 0, No External Wait, Bus Width: 32 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 471
MPX Interface Timing 8
(Burst Write Cycle, AnW = 1, External Wait Control, Bus Width: 32 Bits,
Transfer Data Size: 32 Bytes) .......................................................................... 472
Example of 64-Bit Data Width Byte Control SRAM....................................... 474
Byte Control SRAM Basic Read Cycle (No Wait) .......................................... 475
Byte Control SRAM Basic Read Cycle (One Internal Wait Cycle) ................. 476
Byte Control SRAM Basic Read Cycle
(One Internal Wait + One External Wait) ........................................................ 477
Waits between Access Cycles .......................................................................... 479
Arbitration Sequence........................................................................................ 482
Rev. 6.0, 07/02, page xxxviii of I
Figure 14.1
Figure 14.2
Figure 14.3
Figure 14.4
Figure 14.5
Figure 14.6
Figure 14.7
Figure 14.8
Figure 14.9
Figure 14.10
Figure 14.11
Figure 14.12
Figure 14.13
Figure 14.14
Figure 14.15
Figure 14.16
Figure 14.17
Figure 14.18
Figure 14.19
Figure 14.20
Figure 14.21
Figure 14.22
Figure 14.23
Figure 14.24
Figure 14.25
Figure 14.26
Figure 14.27
Block Diagram of DMAC ................................................................................ 492
DMAC Transfer Flowchart .............................................................................. 511
Round Robin Mode .......................................................................................... 516
Example of Changes in Priority Order in Round Robin Mode......................... 517
Data Flow in Single Address Mode.................................................................. 519
DMA Transfer Timing in Single Address Mode.............................................. 520
Operation in Dual Address Mode..................................................................... 521
Example of Transfer Timing in Dual Address Mode ....................................... 522
Example of DMA Transfer in Cycle Steal Mode ............................................. 523
Example of DMA Transfer in Burst Mode....................................................... 523
Bus Handling with Two DMAC Channels Operating...................................... 527
Dual Address Mode/Cycle Steal Mode External Bus → External Bus/
'5(4 (Level Detection), DACK (Read Cycle)............................................... 530
Dual Address Mode/Cycle Steal Mode External Bus → External Bus/
'5(4 (Edge Detection), DACK (Read Cycle) ............................................... 531
Dual Address Mode/Burst Mode External Bus → External Bus/
'5(4 (Level Detection), DACK (Read Cycle)............................................... 532
Dual Address Mode/Burst Mode External Bus → External Bus/
'5(4 (Edge Detection), DACK (Read Cycle) ............................................... 533
Dual Address Mode/Cycle Steal Mode On-Chip SCI (Level Detection) →
External Bus ..................................................................................................... 534
Dual Address Mode/Cycle Steal Mode External Bus → On-Chip SCI
(Level Detection).............................................................................................. 535
Single Address Mode/Cycle Steal Mode External Bus → External Bus/
'5(4 (Level Detection).................................................................................. 536
Single Address Mode/Cycle Steal Mode External Bus → External Bus/
'5(4 (Edge Detection)................................................................................... 537
Single Address Mode/Burst Mode External Bus → External Bus/
'5(4 (Level Detection).................................................................................. 538
Single Address Mode/Burst Mode External Bus → External Bus/
'5(4 (Edge Detection)................................................................................... 539
Single Address Mode/Burst Mode External Bus → External Bus/
'5(4 (Level Detection)/32-Byte Block Transfer
(Bus Width: 64 Bits, SDRAM: Row Hit Write)............................................... 540
On-Demand Transfer Mode Block Diagram .................................................... 545
System Configuration in On-Demand Data Transfer Mode............................. 547
Data Transfer Request Format ......................................................................... 548
Single Address Mode: Synchronous DRAM → External Device Longword
Transfer SDRAM auto-precharge Read bus cycle, burst (RCD[1:0] = 01,
CAS latency = 3, TPC[2:0] = 001)....................................................................... 551
Single Address Mode: External Device → Synchronous DRAM Longword
Transfer SDRAM auto-precharge Write bus cycle, burst (RCD[1:0] = 01,
TRWL[2:0] = 101, TPC[2:0] = 001).................................................................... 552
Rev. 6.0, 07/02, page xxxix of I
Figure 14.28
Figure 14.29
Figure 14.30
Figure 14.31
Figure 14.32
Figure 14.33
Figure 14.34
Figure 14.35
Figure 14.36
Figure 14.37
Figure 14.38
Figure 14.39
Figure 14.40
Figure 14.41
Figure 14.42
Figure 14.43
Figure 14.44
Figure 14.45
Figure 14.46
Figure 14.47
Figure 14.48
Figure 14.49
Figure 14.50
Figure 14.51
Figure 14.52
Figure 14.53
Dual Address Mode/Synchronous DRAM → SRAM Longword Transfer...... 553
Single Address Mode/Burst Mode/External Bus → External Device 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer..................................... 554
Single Address Mode/Burst Mode/External Device → External Bus 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer..................................... 554
Single Address Mode/Burst Mode/External Bus → External Device 32-Bit
Transfer/Channel 0 On-Demand Data Transfer ............................................... 555
Single Address Mode/Burst Mode/External Device → External Bus 32-Bit
Transfer/Channel 0 On-Demand Data Transfer ............................................... 556
Handshake Protocol Using Data Bus (Channel 0 On-Demand Data Transfer) 557
Handshake Protocol without Use of Data Bus (Channel 0 On-Demand Data
Transfer)........................................................................................................... 558
Read from Synchronous DRAM Precharge Bank ............................................ 559
Read from Synchronous DRAM Non-Precharge Bank (Row Miss) ................ 559
Read from Synchronous DRAM (Row Hit) ..................................................... 560
Write to Synchronous DRAM Precharge Bank................................................ 560
Write to Synchronous DRAM Non-Precharge Bank (Row Miss).................... 561
Write to Synchronous DRAM (Row Hit)......................................................... 561
Single Address Mode/Burst Mode/External Bus → External Device 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer..................................... 562
DDT Mode Setting ........................................................................................... 563
Single Address Mode/Burst Mode/Edge Detection/ External Device →
External Bus Data Transfer .............................................................................. 563
Single Address Mode/Burst Mode/Level Detection/ External Bus →
External Device Data Transfer ......................................................................... 564
Single Address Mode/Burst Mode/Edge Detection/Byte, Word, Longword,
Quadword/External Bus → External Device Data Transfer............................. 564
Single Address Mode/Burst Mode/Edge Detection/Byte, Word, Longword,
Quadword/External Device → External Bus Data Transfer............................. 565
Single Address Mode/Burst Mode/32-Byte Block Transfer/DMA Transfer
Request to Channels 1–3 Using Data Bus ........................................................ 566
Single Address Mode/Burst Mode/32-Byte Block Transfer/ External Bus →
External Device Data Transfer/ Direct Data Transfer Request to Channel 2
without Using Data Bus ................................................................................... 567
Single Address Mode/Burst Mode/External Bus → External Device Data
Transfer/Direct Data Transfer Request to Channel 2 ....................................... 568
Single Address Mode/Burst Mode/External Device → External Bus Data
Transfer/Direct Data Transfer Request to Channel 2 ....................................... 569
Single Address Mode/Burst Mode/External Bus → External Device Data
Transfer (Active Bank Address)/Direct Data Transfer Request to Channel 2.. 570
Single Address Mode/Burst Mode/External Device → External Bus Data
Transfer (Active Bank Address)/Direct Data Transfer Request to Channel 2.. 571
Block Diagram of the DMAC .......................................................................... 574
Rev. 6.0, 07/02, page xl of I
Figure 14.54
Figure 14.55
Figure 14.56
Figure 15.1
Figure 15.2
Figure 15.3
Figure 15.4
Figure 15.5
Figure 15.6
Figure 15.7
Figure 15.8
Figure 15.9
Figure 15.10
Figure 15.10
Figure 15.11
Figure 15.12
Figure 15.13
Figure 15.14
Figure 15.15
Figure 15.15
Figure 15.16
Figure 15.17
Figure 15.18
Figure 15.19
Figure 15.20
Figure 15.21
Figure 15.21
Figure 15.22
Figure 15.23
Figure 15.24
Figure 15.25
Figure 16.1
Figure 16.2
Figure 16.3
DTR Format (Transfer Request Format) (SH7750R)....................................... 584
Single Address Mode/Burst Mode/External Bus → External Device
32-Byte Block Transfer/Channel 0 On-Demand Data Transfer ....................... 589
Single Address Mode/Burst Mode/External Bus → External Device/
32-Byte Block Transfer/On-Demand Data Transfer on Channel 4 .................. 590
Block Diagram of SCI...................................................................................... 595
MD0/SCK Pin .................................................................................................. 611
MD7/TxD Pin................................................................................................... 612
RxD Pin ............................................................................................................ 6 12
Data Format in Asynchronous Communication (Example with 8-Bit Data,
Parity, Two Stop Bits) ...................................................................................... 623
Relation between Output Clock and Transfer Data Phase
(Asynchronous Mode)...................................................................................... 625
Sample SCI Initialization Flowchart ................................................................ 626
Sample Serial Transmission Flowchart ............................................................ 627
Example of Transmit Operation in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit) ............................................. 629
Sample Serial Reception Flowchart (1)............................................................ 630
Sample Serial Reception Flowchart (2)............................................................ 631
Example of SCI Receive Operation
(Example with 8-Bit Data, Parity, One Stop Bit) ............................................. 633
Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A) ..................................... 635
Sample Multiprocessor Serial Transmission Flowchart ................................... 636
Example of SCI Transmit Operation (Example with 8-Bit Data,
Multiprocessor Bit, One Stop Bit).................................................................... 638
Sample Multiprocessor Serial Reception Flowchart (1)................................... 639
Sample Multiprocessor Serial Reception Flowchart (2)................................... 640
Example of SCI Receive Operation (Example with 8-Bit Data,
Multiprocessor Bit, One Stop Bit).................................................................... 641
Data Format in Synchronous Communication ................................................. 642
Sample SCI Initialization Flowchart ................................................................ 644
Sample Serial Transmission Flowchart ............................................................ 645
Example of SCI Transmit Operation................................................................ 646
Sample Serial Reception Flowchart (1)............................................................ 647
Sample Serial Reception Flowchart (2)............................................................ 648
Example of SCI Receive Operation ................................................................. 649
Sample Flowchart for Serial Data Transmission and Reception ...................... 650
Receive Data Sampling Timing in Asynchronous Mode ................................. 654
Example of Synchronous Transmission by DMAC ......................................... 655
Block Diagram of SCIF.................................................................................... 659
MD8/5765 Pin................................................................................................. 681
&765 Pin .......................................................................................................... 682
Rev. 6.0, 07/02, page xli of I
Figure 16.4
Figure 16.5
Figure 16.6
Figure 16.7
Figure 16.8
Figure 16.9
Figure 16.10
Figure 16.10
Figure 16.11
Figure 16.12
Figure 16.13
Figure 16.14
Figure 17.1
Figure 17.2
Figure 17.3
Figure 17.4
Figure 17.5
Figure 17.6
Figure 17.7
Figure 17.8
Figure 17.9
Figure 17.10
Figure 17.11
Figure 17.12
Figure 17.13
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
Figure 18.7
Figure 18.8
Figure 18.9
Figure 19.1
Figure 19.2
Figure 19.3
Figure 20.1
Figure 20.2
Figure 21.1
Figure 21.2
MD1/TxD2 Pin................................................................................................. 683
MD2/RxD2 Pin ................................................................................................ 683
Sample SCIF Initialization Flowchart .............................................................. 689
Sample Serial Transmission Flowchart ............................................................ 690
Example of Transmit Operation (Example with 8-Bit Data, Parity,
One Stop Bit).................................................................................................... 692
Example of Operation Using Modem Control (&765)..................................... 692
Sample Serial Reception Flowchart (1)............................................................ 693
Sample Serial Reception Flowchart (2)............................................................ 694
Example of SCIF Receive Operation (Example with 8-Bit Data, Parity,
One Stop Bit).................................................................................................... 696
Example of Operation Using Modem Control (5765)..................................... 696
Receive Data Sampling Timing in Asynchronous Mode ................................. 699
Overrun Error Flag ........................................................................................... 701
Block Diagram of Smart Card Interface........................................................... 704
Schematic Diagram of Smart Card Interface Pin Connections......................... 711
Smart Card Interface Data Format ................................................................... 712
TEND Generation Timing................................................................................ 714
Sample Start Character Waveforms ................................................................. 715
Difference in Clock Output According to GM Bit Setting............................... 717
Sample Initialization Flowchart ....................................................................... 719
Sample Transmission Processing Flowchart .................................................... 721
Sample Reception Processing Flowchart ......................................................... 723
Receive Data Sampling Timing in Smart Card Mode ...................................... 725
Retransfer Operation in SCI Receive Mode ..................................................... 726
Retransfer Operation in SCI Transmit Mode ................................................... 727
Procedure for Stopping and Restarting the Clock ............................................ 728
16-Bit Port........................................................................................................ 732
4-Bit Port.......................................................................................................... 733
MD0/SCK Pin .................................................................................................. 734
MD7/TxD Pin................................................................................................... 735
RxD Pin ............................................................................................................ 735
MD1/TxD2 Pin................................................................................................. 736
MD2/RxD2 Pin ................................................................................................ 736
&765 Pin .......................................................................................................... 737
MD8/5765 Pin................................................................................................. 738
Block Diagram of INTC................................................................................... 752
Example of IRL Interrupt Connection.............................................................. 755
Interrupt Operation Flowchart.......................................................................... 769
Block Diagram of User Break Controller......................................................... 774
User Break Debug Support Function Flowchart .............................................. 794
Block Diagram of H-UDI Circuit..................................................................... 800
TAP Control State Transition Diagram ............................................................ 810
Rev. 6.0, 07/02, page xlii of I
Figure 21.3
Figure 22.1
Figure 22.2(1)
Figure 22.2(2)
Figure 22.3
Figure 22.4
Figure 22.5
Figure 22.6
Figure 22.7
Figure 22.8
Figure 22.9
Figure 22.10
Figure 22.11
Figure 22.12
Figure 22.13
Figure 22.14
Figure 22.15
Figure 22.16
Figure 22.17
Figure 22.18
Figure 22.19
Figure 22.20
Figure 22.21
Figure 22.22
Figure 22.23
Figure 22.24
Figure 22.25
Figure 22.26
Figure 22.27
Figure 22.28
Figure 22.29
H-UDI Reset..................................................................................................... 811
EXTAL Clock Input Timing ............................................................................ 862
CKIO Clock Output Timing............................................................................. 862
CKIO Clock Output Timing............................................................................. 862
Power-On Oscillation Settling Time ................................................................ 863
Standby Return Oscillation Settling Time (Return by 5(6(7) ....................... 863
Power-On Oscillation Settling Time ................................................................ 864
Standby Return Oscillation Settling Time (Return by 5(6(7) ....................... 864
Standby Return Oscillation Settling Time (Return by NMI)............................ 865
Standby Return Oscillation Settling Time (Return by ,5/6–,5/3)................. 865
PLL Synchronization Settling Time in Case of 5(6(7 or NMI Interrupt....... 866
PLL Synchronization Settling Time in Case of IRL Interrupt.......................... 866
Manual Reset Input Timing.............................................................................. 867
Mode Input Timing .......................................................................................... 867
Control Signal Timing...................................................................................... 870
Pin Drive Timing for Standby Mode................................................................ 870
SRAM Bus Cycle: Basic Bus Cycle (No Wait)................................................ 877
SRAM Bus Cycle: Basic Bus Cycle (One Internal Wait) ................................ 878
SRAM Bus Cycle: Basic Bus Cycle (One Internal Wait + One External Wait)879
SRAM Bus Cycle: Basic Bus Cycle (No Wait, Address Setup/Hold Time
Insertion, AnS = 1, AnH = 1) ........................................................................... 880
Burst ROM Bus Cycle (No Wait) .................................................................... 881
Burst ROM Bus Cycle (1st Data: One Internal Wait + One External Wait;
2nd/3rd/4th Data: One Internal Wait)............................................................... 882
Burst ROM Bus Cycle (No Wait, Address Setup/Hold Time Insertion,
AnS = 1, AnH = 1) ........................................................................................... 883
Burst ROM Bus Cycle (One Internal Wait + One External Wait) ................... 884
Synchronous DRAM Auto-Precharge Read Bus Cycle:
Single (RCD[1:0] = 01, CAS Latency = 3, TPC[2:0] = 011) ........................... 885
Synchronous DRAM Auto-Precharge Read Bus Cycle:
Burst (RCD[1:0] = 01, CAS Latency = 3, TPC[2:0] = 011) ............................ 886
Synchronous DRAM Normal Read Bus Cycle:
ACT + READ Commands, Burst (RCD[1:0] = 01, CAS Latency = 3)............ 887
Synchronous DRAM Normal Read Bus Cycle:
PRE + ACT + READ Commands, Burst (RCD[1:0] = 01, TPC[2:0] = 001,
CAS Latency = 3)............................................................................................. 888
Synchronous DRAM Normal Read Bus Cycle:
READ Command, Burst (CAS Latency = 3) ................................................... 889
Synchronous DRAM Auto-Precharge Write Bus Cycle:
Single (RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010).......................... 890
Synchronous DRAM Auto-Precharge Write Bus Cycle:
Burst (RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010) ........................... 891
Rev. 6.0, 07/02, page xliii of I
Figure 22.30
Synchronous DRAM Normal Write Bus Cycle:
ACT + WRITE Commands, Burst (RCD[1:0] = 01, TRWL[2:0] = 010) ........ 892
Figure 22.31
Synchronous DRAM Normal Write Bus Cycle:
PRE + ACT + WRITE Commands, Burst (RCD[1:0] = 01, TPC[2:0] = 001,
TRWL[2:0] = 010) ........................................................................................... 893
Figure 22.32
Synchronous DRAM Normal Write Bus Cycle:
WRITE Command, Burst (TRWL[2:0] = 010) ................................................ 894
Figure 22.33
Synchronous DRAM Bus Cycle:
Synchronous DRAM Precharge Command (TPC[2:0] = 001)......................... 895
Figure 22.34
Synchronous DRAM Bus Cycle:
Synchronous DRAM Auto-Refresh (TRAS = 1, TRC[2:0] = 001).................. 896
Figure 22.35
Synchronous DRAM Bus Cycle:
Synchronous DRAM Self-Refresh (TRC[2:0] = 001)...................................... 897
Figure 22.36 (a) Synchronous DRAM Bus Cycle:
Synchronous DRAM Mode Register Setting (PALL)...................................... 898
Figure 22.36 (b) Synchronous DRAM Bus Cycle:
Synchronous DRAM Mode Register Setting (SET)......................................... 899
Figure 22.37
DRAM Bus Cycles
(1) RCD[1:0] = 00, AnW[2:0] = 000, TPC[2:0] = 001
(2) RCD[1:0] = 01, AnW[2:0] = 001, TPC[2:0] = 010 .................................... 900
Figure 22.38
DRAM Bus Cycle (EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000,
TPC[2:0] = 001) ............................................................................................... 901
Figure 22.39
DRAM Burst Bus Cycle (EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000,
TPC[2:0] = 001) ............................................................................................... 902
Figure 22.40
DRAM Burst Bus Cycle (EDO Mode, RCD[1:0] = 01, AnW[2:0] = 001,
TPC[2:0] = 001) ............................................................................................... 903
Figure 22.41
DRAM Burst Bus Cycle (EDO Mode, RCD[1:0] = 01, AnW[2:0] = 001,
TPC[2:0] = 001, 2-Cycle CAS Negate Pulse Width) ....................................... 904
Figure 22.42
DRAM Burst Bus Cycle: RAS Down Mode State (EDO Mode,
RCD[1:0] = 00, AnW[2:0] = 000).................................................................... 905
Figure 22.43
DRAM Burst Bus Cycle: RAS Down Mode Continuation (EDO Mode,
RCD[1:0] = 00, AnW[2:0] = 000).................................................................... 906
Figure 22.44
DRAM Burst Bus Cycle (Fast Page Mode, RCD[1:0] = 00,
AnW[2:0] = 000, TPC[2:0] = 001)................................................................... 907
Figure 22.45
DRAM Burst Bus Cycle (Fast Page Mode, RCD[1:0] = 01,
AnW[2:0] = 001, TPC[2:0] = 001)................................................................... 908
Figure 22.46
DRAM Burst Bus Cycle (Fast Page Mode, RCD[1:0] = 01,
AnW[2:0] = 001, TPC[2:0] = 001, 2-Cycle CAS Negate Pulse Width)........... 909
Figure 22.47
DRAM Burst Bus Cycle: RAS Down Mode State (Fast Page Mode,
RCD[1:0] = 00, AnW[2:0] = 000).................................................................... 910
Figure 22.48
DRAM Burst Bus Cycle: RAS Down Mode Continuation
(Fast Page Mode, RCD[1:0] = 00, AnW[2:0] = 000) ....................................... 911
Rev. 6.0, 07/02, page xliv of I
Figure 22.49
DRAM Bus Cycle: DRAM CAS-Before-RAS Refresh
(TRAS[2:0] = 000, TRC[2:0] = 001) ............................................................... 912
Figure 22.50
DRAM Bus Cycle: DRAM CAS-Before-RAS Refresh
(TRAS[2:0] = 001, TRC[2:0] = 001) ............................................................... 913
Figure 22.51
DRAM Bus Cycle: DRAM Self-Refresh (TRC[2:0] = 001) ............................ 914
Figure 22.52
PCMCIA Memory Bus Cycle
(1) TED[2:0] = 000, TEH[2:0] = 000, No Wait
(2) TED[2:0] = 001, TEH[2:0] = 001, One Internal Wait +
One External Wait............................................................................................ 915
Figure 22.53
PCMCIA I/O Bus Cycle
(1) TED[2:0] = 000, TEH[2:0] = 000, No Wait
(2) TED[2:0] = 001, TEH[2:0] = 001, One Internal Wait +
One External Wait............................................................................................ 916
Figure 22.54
PCMCIA I/O Bus Cycle (TED[2:0] = 001, TEH[2:0] = 001,
One Internal Wait, Bus Sizing) ........................................................................ 917
Figure 22.55
MPX Basic Bus Cycle: Read
(1) 1st Data (One Internal Wait)
(2) 1st Data (One Internal Wait + One External Wait)..................................... 918
Figure 22.56
MPX Basic Bus Cycle: Write
(1) 1st Data (No Wait)
(2) 1st Data (One Internal Wait)
(3) 1st Data (One Internal Wait + One External Wait)..................................... 919
Figure 22.57
MPX Bus Cycle: Burst Read
(1) 1st Data (One Internal Wait), 2nd to 8th Data (One Internal Wait)
(2) 1st Data (One Internal Wait), 2nd to 4th Data (One Internal Wait +
One External Wait)........................................................................................... 920
Figure 22.58
MPX Bus Cycle: Burst Write
(1) No Internal Wait
(2) 1st Data (One Internal Wait), 2nd to 4th Data (No Internal Wait +
External Wait Control) ..................................................................................... 921
Figure 22.59
Memory Byte Control SRAM Bus Cycles
(1) Basic Read Cycle (No Wait)
(2) Basic Read Cycle (One Internal Wait)
(3) Basic Read Cycle (One Internal Wait + One External Wait)...................... 922
Figure 22.60
Memory Byte Control SRAM Bus Cycle: Basic Read Cycle
(No Wait, Address Setup/Hold Time Insertion, AnS[0] = 1, AnH[1:0] =01) .. 923
Figure 22.61
TCLK Input Timing ......................................................................................... 930
Figure 22.62
RTC Oscillation Settling Time at Power-On.................................................... 930
Figure 22.63
SCK Input Clock Timing ................................................................................. 930
Figure 22.64
SCI I/O Synchronous Mode Clock Timing ...................................................... 931
Figure 22.65
I/O Port Input/Output Timing........................................................................... 931
Figure 22.66(a) '5(4/DRAK Timing...................................................................................... 931
Figure 22.66(b) '%5(4/75 Input Timing and %$9/ Output Timing..................................... 932
Rev. 6.0, 07/02, page xlv of I
Figure 22.67
Figure 22.68
Figure 22.69
Figure 22.70
Figure 22.71
Figure 22.72
Figure 22.73
Figure B.1
Figure B.2
Figure B.3
Figure B.4
Figure D.1
Figure G.1
Figure H.1
TCK Input Timing............................................................................................ 932
5(6(7 Hold Timing ........................................................................................ 932
H-UDI Data Transfer Timing........................................................................... 933
Pin Break Timing ............................................................................................. 933
NMI Input Timing............................................................................................ 933
Output Load Circuit ......................................................................................... 934
Load Capacitance vs. Delay Time.................................................................... 935
Package Dimensions (256-Pin BGA) (SH7750 and SH7750S) ....................... 943
Package Dimensions (256-Pin BGA) (SH7750R Only)................................... 944
Package Dimensions (208-Pin QFP) ................................................................ 945
Package Dimensions (264-Pin CSP) ................................................................ 946
&.,25(1% Pin Configuration ........................................................................ 949
Instruction Prefetch .......................................................................................... 977
Power-On and Power-Off Procedures .............................................................. 978
Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 3.1
Table 4.1
Table 4.2
Table 4.3
Table 4.4
Table 5.1
Table 5.2
Table 5.3
Table 6.1
Table 6.2
Table 7.1
Table 7.2
Table 7.3
Table 7.4
Table 7.5
Table 7.6
Table 7.7
Table 7.8
Table 7.9
Table 7.10
Table 7.11
SH7750 Series Features ..................................................................................... 1
Pin Functions...................................................................................................... 13
Pin Functions...................................................................................................... 23
Pin Functions...................................................................................................... 31
Initial Register Values ........................................................................................ 43
MMU Registers .................................................................................................. 60
Cache Features (SH7750, SH7750S) ................................................................. 95
Cache Features (SH7750R) ................................................................................ 95
Features of Store Queues.................................................................................... 96
Cache Control Registers..................................................................................... 96
Exception-Related Registers .............................................................................. 127
Exceptions .......................................................................................................... 130
Types of Reset.................................................................................................... 137
Floating-Point Number Formats and Parameters ............................................... 162
Floating-Point Ranges ........................................................................................ 163
Addressing Modes and Effective Addresses ...................................................... 175
Notation Used in Instruction List ....................................................................... 179
Fixed-Point Transfer Instructions....................................................................... 180
Arithmetic Operation Instructions...................................................................... 182
Logic Operation Instructions.............................................................................. 184
Shift Instructions ................................................................................................ 185
Branch Instructions ............................................................................................ 186
System Control Instructions ............................................................................... 187
Floating-Point Single-Precision Instructions...................................................... 189
Floating-Point Double-Precision Instructions .................................................... 190
Floating-Point Control Instructions.................................................................... 190
Rev. 6.0, 07/02, page xlvi of I
Table 7.12
Table 8.1
Table 8.2
Table 8.3
Table 9.1
Table 9.2
Table 9.3
Table 9.4
Table 10.1
Table 10.2
Table 10.3 (1)
Table 10.3 (2)
Table 10.4
Table 10.5
Table 11.1
Table 11.2
Table 11.3
Table 12.1
Table 12.2
Table 12.3
Table 13.1
Table 13.2
Table 13.3
Table 13.4
Table 13.5
Table 13.6
Table 13.7 (1)
Table 13.7 (2)
Table 13.8
Table 13.9
Table 13.10
Table 13.11 (1)
Table 13.11 (2)
Table 13.12
Table 13.13
Table 13.14
Table 13.15
Table 13.16
Table 13.17
Table 13.18
Table 14.1
Floating-Point Graphics Acceleration Instructions ............................................ 191
Instruction Groups.............................................................................................. 200
Parallel-Executability ......................................................................................... 204
Execution Cycles................................................................................................ 211
Status of CPU and Peripheral Modules in Power-Down Modes ........................ 222
Power-Down Mode Registers ............................................................................ 223
Power-Down Mode Pins .................................................................................... 223
State of Registers in Standby Mode ................................................................... 231
CPG Pins ............................................................................................................ 252
CPG Register...................................................................................................... 252
Clock Operating Modes (SH7750, SH7750S).................................................... 253
Clock Operating Modes (SH7750R) .................................................................. 253
FRQCR Settings and Internal Clock Frequencies .............................................. 254
WDT Registers................................................................................................... 260
RTC Pins ............................................................................................................ 269
RTC Registers .................................................................................................... 269
Crystal Oscillator Circuit Constants (Recommended Values) ........................... 289
TMU Pins ........................................................................................................... 292
TMU Registers ................................................................................................... 293
TMU Interrupt Sources ...................................................................................... 309
BSC Pins ............................................................................................................ 314
BSC Registers .................................................................................................... 318
External Memory Space Map............................................................................. 320
PCMCIA Interface Features............................................................................... 322
PCMCIA Support Interfaces .............................................................................. 323
MPX Interface is Selected (Areas 0 to 6) ........................................................... 350
64-Bit External Device/Big-Endian Access and Data Alignment ...................... 372
64-Bit External Device/Big-Endian Access and Data Alignment ...................... 373
32-Bit External Device/Big-Endian Access and Data Alignment ...................... 374
16-Bit External Device/Big-Endian Access and Data Alignment ...................... 375
8-Bit External Device/Big-Endian Access and Data Alignment ........................ 376
64-Bit External Device/Little-Endian Access and Data Alignment ................... 377
64-Bit External Device/Little-Endian Access and Data Alignment ................... 378
32-Bit External Device/Little-Endian Access and Data Alignment ................... 379
16-Bit External Device/Little-Endian Access and Data Alignment ................... 380
8-Bit External Device/Little-Endian Access and Data Alignment ..................... 381
Relationship between AMXEXT and AMX2–0 Bits and
Address Multiplexing......................................................................................... 399
Example of Correspondence between SH7750 Series and Synchronous DRAM
Address Pins (64-Bit Bus Width, AMX2–AMX0 = 011, AMXEXT = 0) ......... 416
Cycles for which Pipeline Access is Possible .................................................... 431
Relationship between Address and CE when Using PCMCIA Interface ........... 446
DMAC Pins ........................................................................................................ 493
Rev. 6.0, 07/02, page xlvii of I
Table 14.2
Table 14.3
Table 14.4
Table 14.5
Table 14.6
Table 14.7
Table 14.8
Table 14.9
Table 14.10
Table 14.11
Table 14.12
Table 14.13
Table 14.14
Table 14.15
Table 14.16
Table 14.17
Table 14.18
Table 15.1
Table 15.2
Table 15.3
Table 15.4
Table 15.5
Table 15.6
Table 15.7
Table 15.8
Table 15.9
Table 15.10
Table 15.11
Table 15.12
Table 15.13
Table 16.1
Table 16.2
Table 16.3
Table 16.4
Table 16.5
Table 16.6
Table 17.1
Table 17.2
Table 17.3
Table 17.4
Table 17.5
DMAC Pins in DDT Mode ................................................................................ 494
DMAC Registers ................................................................................................ 494
Selecting External Request Mode with RS Bits ................................................. 513
Selecting On-Chip Peripheral Module Request Mode with RS Bits .................. 514
Supported DMA Transfers ................................................................................. 518
Relationship between DMA Transfer Type, Request Mode, and Bus Mode ..... 524
External Request Transfer Sources and Destinations in Normal Mode ............. 525
External Request Transfer Sources and Destinations in DDT Mode ................. 526
Conditions for Transfer between External Memory and an External Device
with DACK, and Corresponding Register Settings ............................................ 544
DMAC Pins ........................................................................................................ 575
DMAC Pins in DDT Mode ................................................................................ 576
Register Configuration ....................................................................................... 577
Channel Selection by DTR Format (DMAOR.DBL = 1)................................... 584
Notification of Transfer Channel in Eight-Channel DDT Mode........................ 587
Function of %$9/ ............................................................................................. 587
DTR Format for Clearing Request Queues ........................................................ 588
DMAC Interrupt-Request Codes........................................................................ 589
SCI Pins.............................................................................................................. 596
SCI Registers...................................................................................................... 596
Examples of Bit Rates and SCBRR1 Settings in Asynchronous Mode ............. 615
Examples of Bit Rates and SCBRR1 Settings in Synchronous Mode................ 618
Maximum Bit Rate for Various Frequencies with Baud Rate Generator
(Asynchronous Mode)........................................................................................ 619
Maximum Bit Rate with External Clock Input (Asynchronous Mode).............. 620
Maximum Bit Rate with External Clock Input (Synchronous Mode) ................ 620
SCSMR1 Settings for Serial Transfer Format Selection .................................... 622
SCSMR1 and SCSCR1 Settings for SCI Clock Source Selection...................... 622
Serial Transfer Formats (Asynchronous Mode) ................................................. 624
Receive Error Conditions ................................................................................... 632
SCI Interrupt Sources ......................................................................................... 651
SCSSR1 Status Flags and Transfer of Receive Data.......................................... 652
SCIF Pins ........................................................................................................... 660
SCIF Registers.................................................................................................... 661
SCSMR2 Settings for Serial Transfer Format Selection .................................... 685
SCSCR2 Settings for SCIF Clock Source Selection .......................................... 686
Serial Transmit/Receive Formats ....................................................................... 687
SCIF Interrupt Sources....................................................................................... 697
Smart Card Interface Pins .................................................................................. 705
Smart Card Interface Registers........................................................................... 705
Smart Card Interface Register Settings .............................................................. 713
Values of n and Corresponding CKS1 and CKS0 Settings ................................ 715
Examples of Bit Rate B (bits/s) for Various SCBRR1 Settings (When n = 0)... 716
Rev. 6.0, 07/02, page xlviii of I
Table 17.6
Table 17.7
Table 17.8
Table 17.9
Table 18.1
Table 18.2
Table 18.3
Table 18.4
Table 19.1
Table 19.2
Table 19.3
Table 19.4
Table 19.5
Table 19.6
Table 19.7
Table 19.8
Table 19.9
Table 20.1
Table 21.1
Table 21.2
Table 21.3
Table 21.3
Table 21.3
Table 22.1
Table 22.2
Table 22.3
Table 22.4
Table 22.5
Table 22.6
Table 22.7
Table 22.8
Table 22.9
Table 22.10
Table 22.11
Table 22.12
Table 22.13
Table 22.14
Table 22.15
Table 22.16
Table 22.17
Table 22.18
Table 22.19
Examples of SCBRR1 Settings for Bit Rate B (bits/s) (When n = 0) ................ 716
Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode) ........ 716
Register Settings and SCK Pin State .................................................................. 717
Smart Card Mode Operating States and Interrupt Sources................................. 724
20-Bit General-Purpose I/O Port Pins ................................................................ 739
SCI I/O Port Pins................................................................................................ 740
SCIF I/O Port Pins.............................................................................................. 740
I/O Port Registers ............................................................................................... 741
INTC Pins........................................................................................................... 753
INTC Registers................................................................................................... 753
,5/6–,5/3 Pins and Interrupt Levels................................................................ 756
SH7750 ,5/6–,5/3 Pins and Interrupt Levels (When IRLM = 1).................... 757
Interrupt Exception Handling Sources and Priority Order ................................. 759
Interrupt Request Sources and IPRA–IPRD Registers....................................... 762
Interrupt Request Sources and the Bits of the INTPRI00 Register .................... 765
Bit Assignments ................................................................................................. 767
Interrupt Response Time .................................................................................... 771
UBC Registers.................................................................................................... 775
H-UDI Pins......................................................................................................... 801
H-UDI Registers................................................................................................. 802
Configuration of the Boundary Scan Register (1) .............................................. 807
Configuration of the Boundary Scan Register (2) .............................................. 808
Configuration of the Boundary Scan Register (3) .............................................. 809
Absolute Maximum Ratings............................................................................... 813
DC Characteristics (HD6417750RBP240)......................................................... 814
DC Characteristics (HD6417750RF240) ........................................................... 816
DC Characteristics (HD6417750RBP200)......................................................... 818
DC Characteristics (HD6417750RF200) ........................................................... 820
DC Characteristics (HD6417750SBP200) ......................................................... 822
DC Characteristics (HD6417750SF200)............................................................ 824
DC Characteristics (HD6417750BP200M) ........................................................ 826
DC Characteristics (HD6417750SF167)............................................................ 828
DC Characteristics (HD6417750SF167I)........................................................... 830
DC Characteristics (HD6417750F167) .............................................................. 832
DC Characteristics (HD6417750F167I)............................................................. 834
DC Characteristics (HD6417750SVF133) ......................................................... 836
DC Characteristics (HD6417750SVBT133) ...................................................... 838
DC Characteristics (HD6417750VF128) ........................................................... 840
Permissible Output Currents .............................................................................. 841
Clock Timing (HD6417750RBP240)................................................................. 842
Clock Timing (HD6417750RF240) ................................................................... 842
Clock Timing (HD6417750BP200M, HD6417750SBP200,
HD6417750RBP200) ......................................................................................... 842
Rev. 6.0, 07/02, page xlix of I
Table 22.20
Table 22.21
Table 22.22
Table 22.23
Table 22.24
Table 22.25
Table 22.26
Table 22.27
Table 22.28
Table 22.29
Table 22.30
Table 22.31
Table 22.32
Table 22.33
Table 22.34
Table 22.34
Table 22.35
Table 22.35
Table 22.35
Table 22.36
Table 22.36
Table 22.36
Table A.1
Table E.1
Table I.1
Clock Timing (HD6417750RF200) ................................................................... 842
Clock Timing (HD6417750SF200).................................................................... 842
Clock Timing (HD6417750F167, HD6417750F167I, HD6417750SF167,
HD6417750SF167I) ........................................................................................... 843
Clock Timing (HD6417750SVF133, HD6417750SVBT133) ........................... 843
Clock Timing (HD6417750VF128) ................................................................... 843
Clock and Control Signal Timing (HD6417750RBP240).................................. 844
Clock and Control Signal Timing (HD6417750RF240) .................................... 846
Clock and Control Signal Timing (HD6417750RBP200).................................. 848
Clock and Control Signal Timing (HD6417750RF200) .................................... 850
Clock and Control Signal Timing (HD6417750BP200M,
HD6417750SBP200).......................................................................................... 852
Clock and Control Signal Timing (HD6417750SF200)..................................... 854
Clock and Control Signal Timing (HD6417750F167, HD6417750F167I,
HD6417750SF167, HD6417750SF167I) ........................................................... 856
Clock and Control Signal Timing (HD6417750SVF133,
HD6417750SVBT133)....................................................................................... 858
Clock and Control Signal Timing (HD6417750VF128) .................................... 860
Control Signal Timing (1) .................................................................................. 868
Control Signal Timing (2) .................................................................................. 869
Bus Timing (1) ................................................................................................... 871
Bus Timing (2) ................................................................................................... 873
Bus Timing (3) ................................................................................................... 875
Peripheral Module Signal Timing (1) ................................................................ 924
Peripheral Module Signal Timing (2) ................................................................ 926
Peripheral Module Signal Timing (3) ................................................................ 928
Address List ....................................................................................................... 937
Pin States in Reset, Power-Down State, and Bus-Released State ...................... 951
SH7750 Series Product Code Lineup ................................................................. 979
Rev. 6.0, 07/02, page l of I
Section 1 Overview
1.1
SH7750 Series (SH7750, SH7750S, SH7750R) Features
The SH7750 Series (SH7750, SH7750S, SH7750R) is a 32-bit RISC (reduced instruction set
computer) microprocessor, featuring object code upward-compatibility with SH-1, SH-2, and SH3 microcomputers. It includes an instruction cache, an operand cache with a choice of copy-back
or write-through mode, and an MMU (memory management unit) with a 64-entry fully-associative
unified TLB (translation lookaside buffer). The SH7750 and SH7750S have an 8-kbyte instruction
cache and a 16-kbyte data cache. The SH7750R has a 16-kbyte instruction cache and a 32-kbyte
data cache.
The SH7750 Series has an on-chip bus state controller (BSC) that allows connection to DRAM
and synchronous DRAM. Its 16-bit fixed-length instruction set enables program code size to be
reduced by almost 50% compared with 32-bit instructions.
The features of the SH7750 Series are summarized in table 1.1.
Table 1.1
SH7750 Series Features
Item
Features
LSI
•
•
1
2 3
2
Operating frequency: 240 MHz* , 200 MHz, 167 MHz* * , 133 MHz* ,
3
128 MHz*
Performance
432 MIPS (240 MHz), 360 MIPS (200 MHz), 300 MIPS (167 MHz),
240 MIPS (133 MHz), 230 MIPS (128 MHz)
1.7 GFLOPS (240 MHz), 1.4 GFLOPS (200 MHz),
1.2 GFLOPS (167 MHz), 0.9 GFLOPS (133 MHz, 128 MHz)
•
Superscalar architecture: Parallel execution of two instructions
•
2
Packages: 256-pin BGA, 208-pin QFP, 264-pin CSP*
•
External buses
Separate 26-bit address and 64-bit data buses
External bus frequency of 1/2, 1/3, 1/4, 1/6, or 1/8 times internal bus
frequency
Rev. 6.0, 07/02, page 1 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
CPU
•
Original Hitachi SH architecture
•
32-bit internal data bus
•
General register file:
Sixteen 32-bit general registers (and eight 32-bit shadow registers)
Seven 32-bit control registers
Four 32-bit system registers
•
RISC-type instruction set (upward-compatible with SH Series)
Fixed 16-bit instruction length for improved code efficiency
Load-store architecture
Delayed branch instructions
Conditional execution
C-based instruction set
•
Superscalar architecture (providing simultaneous execution of two
instructions) including FPU
•
Instruction execution time: Maximum 2 instructions/cycle
•
Virtual address space: 4 Gbytes (448-Mbyte external memory space)
•
Space identifier ASIDs: 8 bits, 256 virtual address spaces
•
On-chip multiplier
•
Five-stage pipeline
Rev. 6.0, 07/02, page 2 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
FPU
•
On-chip floating-point coprocessor
•
Supports single-precision (32 bits) and double-precision (64 bits)
•
Supports IEEE754-compliant data types and exceptions
•
Two rounding modes: Round to Nearest and Round to Zero
•
Handling of denormalized numbers: Truncation to zero or interrupt
generation for compliance with IEEE754
•
Floating-point registers: 32 bits × 16 words × 2 banks
(single-precision × 16 words or double-precision × 8 words) × 2 banks
•
32-bit CPU-FPU floating-point communication register (FPUL)
•
Supports FMAC (multiply-and-accumulate) instruction
•
Supports FDIV (divide) and FSQRT (square root) instructions
•
Supports FLDI0/FLDI1 (load constant 0/1) instructions
•
Instruction execution times
Latency (FMAC/FADD/FSUB/FMUL): 3 cycles (single-precision), 8
cycles (double-precision)
Pitch (FMAC/FADD/FSUB/FMUL): 1 cycle (single-precision), 6 cycles
(double-precision)
Note: FMAC is supported for single-precision only.
•
3-D graphics instructions (single-precision only):
4-dimensional vector conversion and matrix operations (FTRV): 4
cycles (pitch), 7 cycles (latency)
4-dimensional vector inner product (FIPR): 1 cycle (pitch), 4 cycles
(latency)
Rev. 6.0, 07/02, page 3 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
Clock pulse
generator (CPG)
•
Choice of main clock:
SH7750, SH7750S: 1/2, 1, 3, or 6 times EXTAL
SH7750R: 1, 6, or 12 times EXTAL
•
Clock modes:
CPU frequency: 1, 1/2, 1/3, 1/4, 1/6, or 1/8 times main clock
Bus frequency: 1/2, 1/3, 1/4, 1/6, or 1/8 times main clock
Peripheral frequency: 1/2, 1/3, 1/4, 1/6, or 1/8 times main clock
Note: Maximum frequency varies with models.
•
Power-down modes
Sleep mode
Standby mode
Module standby function
Memory
management
unit (MMU)
•
Single-channel watchdog timer
•
4-Gbyte address space, 256 address space identifiers (8-bit ASIDs)
•
Single virtual mode and multiple virtual memory mode
•
Supports multiple page sizes: 1 kbyte, 4 kbytes, 64 kbytes, 1 Mbyte
•
4-entry fully-associative TLB for instructions
•
64-entry fully-associative TLB for instructions and operands
•
Supports software-controlled replacement and random-counter
replacement algorithm
•
TLB contents can be accessed directly by address mapping
Rev. 6.0, 07/02, page 4 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
Cache memory
•
[SH7750, SH7750S]
Instruction cache (IC)
8 kbytes, direct mapping
256 entries, 32-byte block length
Normal mode (8-kbyte cache)
Index mode
•
Operand cache (OC)
16 kbytes, direct mapping
512 entries, 32-byte block length
Normal mode (16-kbyte cache)
Index mode
RAM mode (8-kbyte cache + 8-kbyte RAM)
Choice of write method (copy-back or write-through)
Cache memory
[SH7750R]
•
Single-stage copy-back buffer, single-stage write-through buffer
•
Cache memory contents can be accessed directly by address mapping
(usable as on-chip memory)
•
Store queue (32 bytes × 2 entries)
•
Instruction cache (IC)
16 kbytes, 2-way set associative
256 entries/way, 32-byte block length
Cache-double-mode (16-kbyte cache)
Index mode
SH7750/SH7750S-compatible mode (8 kbytes, direct mapping)
•
Operand cache (OC)
32 kbytes, 2-way set associative
512 entries/way, 32-byte block length
Cache-double-mode (32-kbyte cache)
Index mode
RAM mode (16-kbyte cache + 16-kbyte RAM)
SH7750/SH7750S-compatible mode (16 kbytes, direct mapping)
•
Single-stage copy-back buffer, single-stage write-through buffer
•
Cache memory contents can be accessed directly by address mapping
(usable as on-chip memory)
•
Store queue (32 bytes × 2 entries)
Rev. 6.0, 07/02, page 5 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
Interrupt controller
(INTC)
•
Five independent external interrupts: NMI, IRL3 to IRL0
•
15-level encoded external interrupts: IRL3 to IRL0
•
On-chip peripheral module interrupts: Priority level can be set for each
module
•
Supports debugging by means of user break interrupts
•
Two break channels
•
Address, data value, access type, and data size can all be set as break
conditions
•
Supports sequential break function
•
Supports external memory access
User break
controller (UBC)
Bus state
controller (BSC)
64/32/16/8-bit external data bus
•
External memory space divided into seven areas, each of up to 64
Mbytes, with the following parameters settable for each area:
Bus size (8, 16, 32, or 64 bits)
Number of wait cycles (hardware wait function also supported)
Connection of DRAM, synchronous DRAM, and burst ROM possible
by setting space type
Supports fast page mode and DRAM EDO
Supports PCMCIA interface
Chip select signals (&63 to &69) output for relevant areas
•
DRAM/synchronous DRAM refresh functions
Programmable refresh interval
Supports CAS-before-RAS refresh mode and self-refresh mode
•
DRAM/synchronous DRAM burst access function
•
Big endian or little endian mode can be set
Rev. 6.0, 07/02, page 6 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
Direct memory
access controller
(DMAC)
•
Physical address DMA controller:
SH7750, SH7750S: 4-channel
SH7750R: 8-channel
•
Transfer data size: 8, 16, 32, or 64 bits, or 32 bytes
•
Address modes:
Single address mode
Dual address mode
Timer unit (TMU)
•
Transfer requests: External, on-chip module, or auto-requests
•
Bus modes: Cycle-steal or burst mode
•
Supports on-demand data transfer
•
Auto-reload 32-bit timer:
SH7750, SH7750S: 3-channel
SH7750R: 5-channel
•
Input capture function
•
Choice of seven counter input clocks
Realtime clock
(RTC)
•
On-chip clock and calendar functions
•
Built-in 32 kHz crystal oscillator with maximum 1/256 second resolution
(cycle interrupts)
Serial
communication
interface
(SCI, SCIF)
•
Two full-duplex communication channels (SCI, SCIF)
•
Channel 1 (SCI):
Choice of asynchronous mode or synchronous mode
Supports smart card interface
•
Channel 2 (SCIF):
Supports asynchronous mode
Separate 16-byte FIFOs provided for transmitter and receiver
Rev. 6.0, 07/02, page 7 of 986
Table 1.1
SH7750 Series Features (cont)
Item
Features
Product lineup
Abbreviation
Voltage
(Internal)
Operating
Frequency
Model No.
Package
SH7750
1.95 V
200 MHz
HD6417750BP200M
256-pin BGA
1.8 V
167 MHz
HD6417750F167
HD6417750F167I
208-pin QFP
1.5 V
128 MHz
HD6417750VF128
1.95 V
200 MHz
HD6417750SBP200
256-pin BGA
HD6417750SF200
208-pin QFP
SH7750S
SH7750R
1.8 V
167 MHz
HD6417750SF167
HD6417750SF167I
1.5 V
133 MHz
HD6417750SVF133
1.5 V
240 MHz
200 MHz
Notes: *1 For SH7750R only
*2 For SH7750S only
*3 For SH7750 only
Rev. 6.0, 07/02, page 8 of 986
HD6417750SVBT133
264-pin CSP
HD6417750RBP240
256-pin BGA
HD6417750RF240
208-pin QFP
HD6417750RBP200
256-pin BGA
HD6417750RF200
208-pin QFP
1.2
Block Diagram
Figure 1.1 shows an internal block diagram of the SH7750 Series.
Cache and
TLB
controller
Peripheral address bus
32-bit data
32-bit data
O cache
BSC
Address
RTC
16-bit peripheral data bus
SCI
(SCIF)
UTLB
TMU
DMAC
64-bit data
ITLB
Upper 32-bit data
Lower 32-bit data
CPG
INTC
64-bit data (store)
Lower 32-bit data
29-bit address
I cache
FPU
64-bit data
32-bit data (load)
UBC
32-bit data (store)
32-bit address (data)
32-bit data (instructions)
32-bit address (instructions)
CPU
External
bus interface
26-bit
address
BSC:
CPG:
DMAC:
FPU:
INTC:
ITLB:
Bus state controller
Clock pulse generator
Direct memory access controller
Floating-point unit
Interrupt controller
Instruction TLB (translation lookaside buffer)
UTLB:
RTC:
SCI:
SCIF:
TMU:
UBC:
64-bit
data
Unified TLB (translation lookaside buffer)
Realtime clock
Serial communication interface
Serial communication interface with FIFO
Timer unit
User break controller
Figure 1.1 Block Diagram of SH7750 Series Functions
Rev. 6.0, 07/02, page 9 of 986
1
2
3
4
5
6
7
D33
D45
F
D34
D44
G
D35
D43
H
D36
D42
J
D39
D15
D0
D14
D1
D13
D2
D12
D3
D11
D4
D10
D5
D9
M
N
P
R
T
14
15
16
VDD-RTC(3.3V)
VSS-RTC
EXTAL2
XTAL2
17
18
19
20
NMI
MD1/TXD2
MD0/SCK
D63
D48
D62
D49
D61
CA*
MD2/RXD2
D50
D60
RD/
/
/
RXD
,,,, ,,
,,
,
,
,,
,,
,
,,
,,,, ,,,,,
U
V
W
D51
D59
,,
,,
,,
,,
BGA256
(Top view)
D52
D58
D53
D57
D54
D56
D55
D31
D16
D30
D17
D29
D18
D28
D19
D27
D20
D26
D21
D25
Y
,
VDDQ (IO)
VSSQ (IO)
/
/
/
/
/
/
/
/
/
D8
D7
CKE
/DQM5
/DQM4
/DQM1
/DQM0
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
D6
L
13
RD/
/DQM2/
/DQM3/
/
/DQM6
/DQM7/
D23
D24
D22
D38
D40
12
CKIO
CKIO2
A6
A5
A4
A3
A2
D41
K
,,
,,
,,
,,
,,
,,
,,
,,
,,
,,
11
DRAK1
DRAK0
E
10
A1
A0
D32
D46
D37
VSS-PLL1
D47
VSS-PLL2
B
D
9
,,,,,,,,, ,
,,
A
C
8
MD3/
A25
A24
A23
A22
A21
A20
A19
A18
MD7/TXD
SCK2/
MD8/
TCLK
XTAL
VSS-CPG
VDD-CPG(3.3V)
VDD-PLL1(3.3V)
VDD-PLL2(3.3V)
TDI
TCK
TMS
TDO
/BRKACK
MD6/
STATUS1
STATUS0
DACK1
DACK0
MD5/
MD4/
Pin Arrangement
EXTAL
1.3
VDD (internal)
VSS (internal)
NC
Note: Power must be supplied to the on-chip PLL power supply pins (VDD-PLL1, VDD-PLL2, VSS-PLL1, VSS-PLL2,
VDD-CPG, VSS-CPG, VDD-RTC, and VSS-RTC) regardless of whether or not the PLL circuits, crystal resonator,
and RTC are used.
* Hardware standby request (SH7750S and SH7750R). In the SH7750, pull up to 3.3 V.
Figure 1.2 Pin Arrangement (256-Pin BGA)
Rev. 6.0, 07/02, page 10 of 986
SCK2/
MD7/TXD
MD8/
TCLK
A23
A22
A21
A20
A19
A18
A0
DACK1
DACK0
MD5/
MD4/
MD3/
A25
A24
/BRKACK
MD6/
STATUS1
STATUS0
A1
TDO
TDI
TCK
TMS
CA*
VDD-RTC(3.3V)
VSS-RTC
EXTAL2
XTAL2
D63
D48
D62
D49
D61
D50
D60
D51
D59
D52
D58
D53
D57
D54
D56
D55
VSSQ (IO)
,,
,,
,,
,,
D28
D19
,
,
/
/
/
/
/
/
/
/
/
RXD
D23
D24
D22
,,
,,
D27
D20
D26
D21
D25
/DQM7/
,,
,,
D31
D16
D30
D17
D29
D18
,,
VDDQ (IO)
D8
D7
CKE
/
/
,,
,,
VSS (internal)
/DQM2/
/DQM3/
/
/DQM6
D11
D4
D10
D5
D9
D6
VDD (internal)
RD/
,,
,,
MD2/RXD2
MD1/TXD2
MD0/SCK
,,
,,
A6
A5
A4
A3
A2
DRAK1
DRAK0
D12
D3
NMI
,,
Top view
A12
A11
A10
A9
A8
A7
CKIO
,
D15
D0
D14
D1
D13
D2
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
QFP208
A14
A13
,,
,
,,
,,
/DQM5
/DQM4
/DQM1
/DQM0
A17
A16
A15
D43
D36
D42
D37
D41
D38
D40
D39
,
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
EXTAL
XTAL
VSS-CPG
VDD-CPG(3.3V)
VSS-PLL1
VDD-PLL1(3.3V)
VSS-PLL2
VDD-PLL2(3.3V)
D46
D33
D45
D34
D44
D35
,,
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
,
D47
D32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Note: Power must be supplied to the on-chip PLL power supply pins (VDD-PLL1, VDD-PLL2, VSS-PLL1, VSS-PLL2,
VDD-CPG, VSS-CPG, VDD-RTC, and VSS-RTC) regardless of whether or not the PLL circuits, crystal resonator,
and RTC are used.
* Hardware standby request (SH7750S and SH7750R). In the SH7750, pull up to 3.3 V.
Figure 1.3 Pin Arrangement (208-Pin QFP)
Rev. 6.0, 07/02, page 11 of 986
, ,
,,,,,
,,,,,,
,,,
,,,
,,
,
,,
,
,
,,
,,
,,
,,
,,
,,
,,
,,
,,
,,
,,
,,
,
,
,,
,,
,,
,
,
,
,,
,,
,,,
,
,,,
,
,,
,
,,
,,
,,
,
,,,
,,
1
2
3
4
5
6
7
8
9
10
11
12
13
TDO
MD6
A0
VDDQ
VDDQ
A20
VDD
TCLK
VDD-PLL2
VSS
14
15
16
17
A
VSS-CPG
XTAL
EXTAL VDD-CPG
VSS-RTC XTAL2
EXTAL2
B
STATUS0 DACK0
A24
VDDQ MD7/TXD
CA
C
VSS-PLL2 VSS-PLL1 VDD-PLL1 TCK
VSSQ
VSSQ
MD3/
A22
A18
VDDQ
VDDQ
VDD-RTC MD1/TXD2 NMI
MD5/
A23
VSS
MD4/
VSSQ
VSSQ
SCK2
D48
A25
A21
A19
D49
VDDQ
D63
MD0/SCK
D62
D50
VDDQ
VDD
VSSQ
VSS
D61
D52
VDDQ
D51
VSSQ
D60
D59
VSSQ
D57
D53
D54
D58
VDDQ
D
VSSQ
TDI
VDD
A1
MD8/
VSSQ
E
TMS
VDDQ
VDDQ
RD/
MD2/RXD2
VSSQ
F
VDD
D47
VDDQ
D45
VDDQ
D46
VDDQ
D43
VDDQ
D32
D33
STATUS1
DACK1
VSSQ
VSS
VSSQ
D34
D44
D35
VSSQ
D36
D38
D42
D41
D37
VSSQ
D39
D0
VSSQ
D15
VDDQ
D40
D56
VSSQ
D31
D16
D55
VDDQ
D1
VSS
VSSQ
VDD
VDDQ
D14
D30
VSSQ
VSS
D18
VDDQ
D17
D2
D4
D3
VDDQ
D13
D14
VSSQ
D5
D11
D12
A16
VSSQ
VDDQ
VDDQ
D6
D10
CKE
G
H
CSP264
(Top view)
J
K
L
M
A9
VDDQ
A6
A2
D29
D28
D27
VDDQ
D19
VDD
VDDQ
VDDQ
A7
A4
DRAK0
VSSQ
VSS
D26
D21
VDDQ
D20
VDD
A11
VSSQ
VSSQ
VSSQ
VSSQ
D25
A17
VSS
A12
A8
VDDQ
VDDQ
VSSQ
A13
VSSQ
CKIO2
A3
VDD
A15
VSSQ
A10
CKIO
A5
DRAK1
N
P
R
RXD
T
VSSQ
D8
VDDQ
RD/
D24
D22
VSSQ
U
D9
D7
VDDQ
VDDQ
D23
VSSQ
VDDQ (IO)
VSSQ (IO)
VDD (internal)
VSS (internal)
NC
Note: Power must be supplied to the on-chip PLL power supply pins (VDD-PLL1, VDD-PLL2, VSS-PLL1, VSS-PLL2,
VDD-CPG, VSS-CPG, VDD-RTC, and VSS-RTC) regardless of whether or not the PLL circuits, crystal resonator,
and RTC are used.
Figure 1.4 Pin Arrangement (264-Pin CSP)
Rev. 6.0, 07/02, page 12 of 986
1.4
Pin Functions
1.4.1
Pin Functions (256-Pin BGA)
Table 1.2
Pin Functions
Memory Interface
No.
Pin
No.
Pin Name
I/O
Function
1
B2
5'<
I
Bus ready
2
B1
5(6(7
I
Reset
3
C2
&63
O
Chip select 0
&63
&63
4
C1
&64
O
Chip select 1
&64
&64
5
D4
&67
O
Chip select 4
&67
&67
6
D3
&68
O
Chip select 5
&68
7
D2
&69
O
Chip select 6
&69
8
D1
%6
O
Bust start
(%6)
9
E4
VSSQ
Power IO GND (0 V)
10
E3
5'5
O
11
F3
VDDQ
Power IO VDD (3.3 V)
12
F4
VSSQ
Power IO GND (0 V)
13
E2
D47
I/O
Data/port
(Port)
14
E1
D32
I/O
Data/port
15
G3
VDD
Power Internal VDD
(1.8 V)
16
G4
VSS
Power Internal GND
(0 V)
17
F2
D46
I/O
18
F1
D33
I/O
19
H3
VDDQ
Power IO VDD (3.3 V)
20
H4
VSSQ
Power IO GND (0 V)
21
G2
D45
I/O
22
G1
D34
23
H2
D44
24
H1
D35
I/O
25
J3
VDDQ
Power IO VDD (3.3 V)
26
J4
VSSQ
Power IO GND (0 V)
27
J2
D43
I/O
28
J1
D36
I/O
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
5'<
5'<
5'<
5(6(7
&(4$
&68
&(4%
&69
(%6)
(%6)
(%6)
&$6
2(
)5$0(
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
5'/&$66/
)5$0(
(%6)
2(
Rev. 6.0, 07/02, page 13 of 986
Table 1.2
Pin Functions (cont)
Memory Interface
No.
Pin
No.
Pin Name
I/O
Function
29
K2
D42
I/O
30
K1
D37
I/O
31
K3
VDDQ
Power IO VDD (3.3 V)
32
K4
VSSQ
Power IO GND (0 V)
33
L1
D41
I/O
34
L2
D38
35
M1
36
M2
37
SRAM
DRAM
SDRAM PCMCIA MPX
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
D40
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
D39
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
L3
VDDQ
Power IO VDD (3.3 V)
38
L4
VSSQ
Power IO GND (0 V)
39
N1
D15
I/O
Data
A15
40
N2
D0
I/O
Data
A0
41
P1
D14
I/O
Data
A14
Data
A1
Reset
42
P2
D1
I/O
43
M3
VDDQ
Power IO VDD (3.3 V)
44
M4
VSSQ
Power IO GND (0 V)
45
R1
D13
I/O
Data
A13
46
R2
D2
I/O
Data
A2
47
P3
VDD
Power Internal VDD
48
P4
VSS
Power Internal GND
(0 V)
49
T1
D12
I/O
Data
A12
Data
A3
50
T2
D3
I/O
51
R3
VDDQ
Power IO VDD (3.3 V)
52
R4
VSSQ
Power IO GND (0 V)
53
U1
D11
I/O
Data
A11
54
U2
D4
I/O
Data
A4
55
V1
D10
I/O
Data
A10
Data
A5
56
V2
D5
I/O
57
T3
VDDQ
Power IO VDD (3.3 V)
58
T4
VSSQ
Power IO GND (0 V)
59
W1
D9
I/O
Data
A9
60
Y1
D6
I/O
Data
A6
Rev. 6.0, 07/02, page 14 of 986
Table 1.2
No.
Pin
No.
61
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
U3
%$&./
%65(4
O
Bus
acknowledge/
bus request
62
V3
%5(4/
%6$&.
I
Bus
request/bus
acknowledge
63
W2
D8
I/O
Data
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
A8
64
Y2
D7
I/O
Data
65
W3
CKE
O
Clock output
enable
66
V5
VDDQ
Power IO VDD (3.3 V)
67
U5
VSSQ
Power IO GND (0 V)
68
Y3
:(8/&$68/ O
DQM5
D47–D40
select signal
:(8
&$68
DQM5
69
W4
:(7/&$67/ O
DQM4
D39–D32
select signal
:(7
&$67
DQM4
70
Y4
:(4/&$64/ O
DQM1
D15–D8 select
signal
:(4
&$64
DQM1
71
W5
:(3/&$63/ O
DQM0
D7–D0 select
signal
:(3
&$63
DQM0
Address
72
Y5
A17
O
73
V6
VDDQ
Power IO VDD (3.3 V)
74
U6
VSSQ
Power IO GND (0 V)
75
W6
A16
O
Address
76
Y6
A15
O
Address
77
V7
VDD
Power Internal VDD
78
U7
VSS
Power Internal GND
(0 V)
79
W7
A14
O
Address
Address
80
Y7
A13
O
81
V8
VDDQ
Power IO VDD (3.3 V)
82
U8
VSSQ
Power IO GND (0 V)
83
V4
NC
84
W8
A12
O
Address
85
Y8
A11
O
Address
86
W9
A10
O
Address
A7
CKE
:(4
Rev. 6.0, 07/02, page 15 of 986
Table 1.2
Pin Functions (cont)
Memory Interface
No.
Pin
No.
Pin Name
I/O
87
V9
VDDQ
Power IO VDD (3.3 V)
88
U9
VSSQ
Power IO GND (0 V)
89
Y9
A9
O
Address
90
W10
A8
O
Address
91
Y10
A7
O
Address
92
Y11
CKIO
O
Clock output
93
V10
VDDQ
Power IO VDD (3.3 V)
94
U10
VSSQ
Power IO GND (0 V)
95
W11
CKIO2
O
1
CKIO*
96
Y12
A6
O
Address
97
W12
A5
O
Address
98
Y13
A4
O
Address
99
V11
VDDQ
Power IO VDD (3.3 V)
100 U11
VSSQ
Power IO GND (0 V)
101 W13
A3
O
Address
102 Y14
A2
O
Address
103 V12
DRAK1
O
DMAC1
request
acknowledge
104 U13
DRAK0
O
DMAC0
request
acknowledge
105 V13
VDDQ
Power IO VDD (3.3 V)
106 U12
VSSQ
Power IO GND (0 V)
107 W14
&66
O
Chip select 3
&66
(&66)
&66
&66
108 Y15
&65
O
Chip select 2
&65
(&65)
&65
&65
109 V14
VDD
Power Internal VDD
110 U14
VSS
Power Internal GND
(0 V)
111 W15
5$6
O
5$6
112 Y16
5'/&$66/
)5$0(
O
Read/&$6/
)5$0(
Function
113 V15
VDDQ
Power IO VDD (3.3 V)
114 U15
VSSQ
Power IO GND (0 V)
Rev. 6.0, 07/02, page 16 of 986
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
CKIO
CKIO
5$6
2(
5$6
&$6
2(
)5$0(
Table 1.2
No.
Pin
No.
Pin Functions (cont)
Memory Interface
Function
DRAM
SDRAM PCMCIA MPX
I/O
115 W16
RD/:5
O
Read/write
RD/:5 RD/:5 RD/:5
116 Y17
:(5/&$65/ O
DQM2/
,&,25'
D23–D16
select signal
:(5
&$65
DQM2
,&,25'
117 W17
:(6/&$66/ O
DQM3/
,&,2:5
D31–D24
select signal
:(6
&$66
DQM3
,&,2:5
118 Y18
:(9/&$69/ O
DQM6
D55–D48
select signal
:(9
&$69
DQM6
119 V16
VDDQ
Power IO VDD (3.3 V)
120 U16
VSSQ
Power IO GND (0 V)
121 W18
:(:/&$6:/ O
DQM7/5(*
D63–D56
select signal
:(:
&$6:
DQM7
122 Y19
D23
I/O
Data
A23
123 W19
D24
I/O
Data
A24
124 Y20
D22
I/O
Data
A22
125 V17
RXD
I
SCI data input
126 U17
'5(43
I
Request from
DMAC0
127 U18
'5(44
I
Request from
DMAC1
Data
128 W20
D25
I/O
129 T18
VDDQ
Power IO VDD (3.3 V)
130 T17
VSSQ
Power IO GND (0 V)
131 V19
D21
I/O
Data
132 V20
D26
I/O
Data
133 U19
D20
I/O
Data
Data
134 U20
D27
I/O
135 R18
VDDQ
Power IO VDD (3.3 V)
136 R17
VSSQ
Power IO GND (0 V)
137 T19
D19
I/O
Data
138 T20
D28
I/O
Data
139 P18
VDD
Power Internal VDD
140 P17
VSS
Power Internal GND
(0 V)
141 R19
D18
I/O
Data
Reset
SRAM
Pin Name
RD/:5
5(*
A25
A21
A20
A19
A18
Rev. 6.0, 07/02, page 17 of 986
Table 1.2
No.
Pin
No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
Data
142 R20
D29
I/O
143 N18
VDDQ
Power IO VDD (3.3 V)
144 N17
VSSQ
Power IO GND (0 V)
145 P19
D17
I/O
Data
146 P20
D30
I/O
Data
147 N19
D16
I/O
Data
Data
148 N20
D31
I/O
149 M18
VDDQ
Power IO VDD (3.3 V)
150 M17
VSSQ
Power IO GND (0 V)
151 M19
D55
I/O
Data
152 M20
D56
I/O
Data
153 L19
D54
I/O
Data
154 L20
D57
I/O
Data
155 L18
VDDQ
Power IO VDD (3.3 V)
156 L17
VSSQ
Power IO GND (0 V)
157 K20
D53
I/O
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
A17
A16
Data
158 K19
D58
I/O
Data
159 J20
D52
I/O
Data
160 J19
D59
I/O
Data
161 K18
VDDQ
Power IO VDD (3.3 V)
162 K17
VSSQ
Power IO GND (0 V)
163 H20
D51
I/O
Data/port
164 H19
D60
I/O
Data
165 G20
D50
I/O
Data/port
166 G19
D61
I/O
Data
167 J18
VDDQ
Power IO VDD (3.3 V)
168 J17
VSSQ
Power IO GND (0 V)
169 F20
D49
I/O
Data/port
170 F19
D62
I/O
Data
171 G18
VDD
Power Internal VDD
172 G17
VSS
Power Internal GND
(0 V)
173 E20
D48
I/O
Data/port
Rev. 6.0, 07/02, page 18 of 986
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE0
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE1
(Port)
(Port)
(Port)
(Port)
(Port)
Table 1.2
No.
Pin
No.
Pin Functions (cont)
Memory Interface
DRAM
SDRAM PCMCIA MPX
I/O
Function
174 E19
D63
I/O
Data
175 F18
VDDQ
Power IO VDD (3.3 V)
176 F17
VSSQ
Power IO GND (0 V)
177 E17
VSSQ
Power IO GND (0 V)
178 E18
RD/:55
O
RD/:5
179 D20
MD0/SCK
I/O
Mode/SCI
clock
MD0
SCK
SCK
SCK
SCK
SCK
180 D19
MD1/TXD2 I/O
Mode SCIF
data output
MD1
TXD2
TXD2
TXD2
TXD2
TXD2
181 D18
MD2/RXD2 I
Mode/SCIF
data input
MD2
RXD2
RXD2
RXD2
RXD2
RXD2
182 C20
,5/3
I
Interrupt 0
183 C19
,5/4
I
Interrupt 1
184 B20
,5/5
I
Interrupt 2
MD8
5765
5765
5765
5765
5765
185 C18
,5/6
I
Interrupt 3
186 A20
NMI
I
Nonmaskable
interrupt
187 B19
XTAL2
O
RTC crystal
resonator pin
188 A19
EXTAL2
I
RTC crystal
resonator pin
189 B18
VSS-RTC
Power RTC GND
(0 V)
190 A18
VDD-RTC
Power RTC VDD
(3.3 V)
191 D17
CA
I
192 C17
VSS
Power Internal GND
(0 V)
193 B17
VDDQ
Power IO VDD (3.3 V)
194 C16
&765
I/O
SCIF data
control (&76)
195 A17
TCLK
I/O
RTC/TMU
clock
196 B16
MD8/5765 I/O
Reset
SRAM
Pin Name
ACCSIZE2
RD/:5 RD/:5 RD/:5
RD/:5
*2
Mode/SCIF
data control
(576)
Rev. 6.0, 07/02, page 19 of 986
Table 1.2
No.
Pin
No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
TXD
TXD
TXD
TXD
TXD
SCK2
SCK2
SCK2
SCK2
197 C15
VDDQ
Power IO VDD (3.3 V)
198 D15
VSSQ
Power IO GND (0 V)
199 B15
MD7/TXD
I/O
Mode/SCI
data output
MD7
200 A16
SCK2/
05(6(7
I
SCIF clock/
manual reset
05(6(7 SCK2
201 C14
VDD
Power Internal VDD
202 D14
VSS
Power Internal GND
(0 V)
203 A15
A18
O
Address
204 B14
A19
O
Address
205 C13
VDDQ
Power IO VDD (3.3 V)
206 D13
VSSQ
Power IO GND (0 V)
207 A14
A20
O
Address
208 B13
A21
O
Address
209 A13
A22
O
Address
210 B12
A23
O
Address
211 C12
VDDQ
Power IO VDD (3.3 V)
212 D12
VSSQ
Power IO GND (0 V)
213 A12
A24
O
Address
214 B11
A25
O
Address
215 A11
MD3/&(5$ I/O
Mode/
PCMCIA-CE
MD3
&(5$
216 A10
MD4/&(5% I/O
Mode/
PCMCIA-CE
MD4
&(5%
217 C11
VDDQ
Power IO VDD (3.3 V)
218 D11
VSSQ
Power IO GND (0 V)
219 B10
MD5/5$65 I/O
Mode/5$6
(DRAM)
220 A9
DACK0
O
DMAC0 bus
acknowledge
221 B9
DACK1
O
DMAC1 bus
acknowledge
222 C8
A0
O
Address
223 C10
VDDQ
Power IO VDD (3.3 V)
224 D10
VSSQ
Power IO GND (0 V)
Rev. 6.0, 07/02, page 20 of 986
MD5
5$65
Table 1.2
No.
Pin
No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
225 D8
A1
O
Address
226 A8
STATUS0
O
Status
227 B8
STATUS1
O
Status
228 A7
MD6/
,2,649
I
Mode/,2,649
(PCMCIA)
229 C9
VDDQ
Power IO VDD (3.3 V)
230 D9
VSSQ
Power IO GND (0 V)
231 B7
$6(%5./
BRKACK
I/O
Pin break/
acknowledge
(H-UDI)
232 A6
TDO
O
Data out
(H-UDI)
233 C7
VDD
Power Internal VDD
234 D7
VSS
Power Internal GND
(0 V)
235 B6
TMS
I
Mode
(H-UDI)
236 A5
TCK
I
Clock
(H-UDI)
237 B5
TDI
I
Data in
(H-UDI)
238 C4
7567
I
Reset
(H-UDI)
239 C3
&.,25(1% I
240 C6
NC
241 A4
VDD-PLL2
Power PLL2 VDD
(3.3V)
242 D6
VSS-PLL2
Power PLL2 GND (0V)
243 B4
VDD-PLL1
Power PLL1 VDD
(3.3V)
244 D5
VSS-PLL1
Power PLL1 GND (0V)
245 A3
VDD-CPG
Power CPG VDD
(3.3V)
246 B3
VSS-CPG
Power CPG GND (0V)
247 A2
XTAL
O
Reset
MD6
SRAM
DRAM
SDRAM PCMCIA MPX
,2,649
CKIO2, 5'5,
RD/:55
enable
Crystal
resonator
Rev. 6.0, 07/02, page 21 of 986
Table 1.2
No.
Pin Functions (cont)
Memory Interface
Pin
No.
Pin Name
I/O
Function
248 A1
EXTAL
I
External input
clock/crystal
resonator
249 C5
NC
250 D16
NC
251 H17
NC
252 H18
NC
253 N3
NC
254 N4
NC
255 U4
NC
256 V18
NC
I:
O:
I/O:
Power:
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
Input
Output
Input/output
Power supply
Notes: 1. Except in hardware standby mode, supply power to all power pins. In hardware standby
mode, supply power to RTC as a minimum.
2. Power must be supplied to VDD-PLL1/2 and VSS-PLL1/2 regardless of whether or not
the on-chip PLL circuits are used.
3. Power must be supplied to VDD-CPG and VSS-CPG regardless of whether or not the
on-chip crystal resonator is used.
4. Power must be supplied to VDD-RTC and VSS-RTC regardless of whether or not the
on-chip RTC is used.
5. VSSQ, VSS, VSS-RTC, VSS-PLL1/2, and VSS-CPG are connected inside the package.
6. In the SH7750S and SH7750R, at least the RTC power supply must be supplied in
hardware standby mode.
7. NC pins must be left completely open, and not connected to a power supply, GND, etc.
*1 CKIO2 is not connected to PLL2.
*2 Hardware standby request (SH7750S and SH7750R). In the SH7750, pull up to 3.3 V.
Rev. 6.0, 07/02, page 22 of 986
1.4.2
Pin Functions (208-Pin QFP)
Table 1.3
Pin Functions
Memory Interface
Pin
No.
Pin Name
I/O
Function
1
5'<
I
Bus ready
2
5(6(7
I
Reset
3
&63
O
Chip select 0
&63
&63
4
&64
O
Chip select 1
&64
&64
5
&67
O
Chip select 4
&67
&67
6
&68
O
Chip select 5
&68
7
&69
O
Chip select 6
&69
&(4%
&69
8
%6
O
Bust start
(%6)
(%6)
(%6)
(%6)
(%6)
9
VDDQ
Power
IO VDD (3.3 V)
10
VSSQ
Power
IO GND (0 V)
11
D47
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
12
D32
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
13
VDD
Power
Internal VDD
14
VSS
Power
Internal GND
(0 V)
15
D46
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
16
D33
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
17
D45
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
18
D34
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
19
D44
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
20
D35
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
21
VDDQ
Power
IO VDD (3.3 V)
22
VSSQ
Power
IO GND (0 V)
23
D43
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
24
D36
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
25
D42
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
26
D37
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
27
D41
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
28
D38
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
29
D40
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
30
D39
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
5'<
5'<
5'<
5(6(7
&(4$
&68
Rev. 6.0, 07/02, page 23 of 986
Table 1.3
Pin Functions (cont)
Memory Interface
Pin
No.
Pin Name
I/O
Function
31
VDDQ
Power
IO VDD (3.3 V)
32
VSSQ
Power
IO GND (0 V)
33
D15
I/O
Data
34
D0
I/O
Data
A0
35
D14
I/O
Data
A14
36
D1
I/O
Data
A1
37
D13
I/O
Data
A13
38
D2
I/O
Data
A2
39
VDD
Power
Internal VDD
(1.8 V)
40
VSS
Power
Internal GND
(0 V)
41
D12
I/O
Data
A12
42
D3
I/O
Data
A3
43
VDDQ
Power
IO VDD (3.3 V)
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
A15
44
VSSQ
Power
IO GND (0 V)
45
D11
I/O
Data
A11
46
D4
I/O
Data
A4
47
D10
I/O
Data
A10
48
D5
I/O
Data
A5
49
D9
I/O
Data
A9
50
D6
I/O
Data
A6
51
%$&./
%65(4
O
Bus
acknowledge/
bus request
52
%5(4/
%6$&.
I
Bus request/bus
acknowledge
53
D8
I/O
Data
A8
54
D7
I/O
Data
A7
55
CKE
O
Clock output
enable
56
VDDQ
Power
IO VDD (3.3 V)
57
VSSQ
Power
58
:(8/&$68/ O
DQM5
CKE
IO GND (0 V)
D47–D40 select
signal
Rev. 6.0, 07/02, page 24 of 986
:(8
&$68
DQM5
Table 1.3
Pin
No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
59
:(7/&$67/ O
DQM4
D39–D32 select
signal
:(7
&$67
DQM4
60
:(4/&$64/ O
DQM1
D15–D8 select
signal
:(4
&$64
DQM1
61
:(3/&$63/ O
DQM0
D7–D0 select
signal
:(3
&$63
DQM0
62
A17
O
Address
63
A16
O
Address
64
A15
O
Address
65
VDD
Power
Internal VDD
66
VSS
Power
Internal GND
(0 V)
67
A14
O
Address
68
A13
O
Address
69
VDDQ
Power
IO VDD (3.3 V)
70
VSSQ
Power
IO GND (0 V)
71
A12
O
Address
72
A11
O
Address
73
A10
O
Address
74
A9
O
Address
75
A8
O
Address
76
A7
O
Address
77
CKIO
O
Clock output
78
VDDQ
Power
IO VDD (3.3 V)
79
VSSQ
Power
IO GND (0 V)
80
A6
O
Address
81
A5
O
Address
82
A4
O
Address
83
A3
O
Address
84
A2
O
Address
85
DRAK1
O
DMAC1 request
acknowledge
86
DRAK0
O
DMAC0 request
acknowledge
87
VDDQ
Power
IO VDD (3.3 V)
:(4
CKIO
Rev. 6.0, 07/02, page 25 of 986
Table 1.3
Pin Functions (cont)
Memory Interface
Pin
No.
Pin Name
88
VSSQ
Power
IO GND (0 V)
89
&66
O
90
&65
91
92
93
5$6
O
5$6
94
5'/&$66/
)5$0(
O
Read/&$6/
)5$0(
2(
95
RD/:5
O
Read/write
RD/:5 RD/:5 RD/:5
96
:(5/&$65/ O
DQM2/
,&,25'
D23–D16 select
signal
:(5
&$65
DQM2
,&,25'
97
:(6/&$66/ O
DQM3/
,&,2:5
D31–D24 select
signal
:(6
&$66
DQM3
,&,2:5
98
:(9/&$69/ O
DQM6
D55–D48 select
signal
:(9
&$69
DQM6
99
VDDQ
Power
IO VDD (3.3 V)
100
VSSQ
Power
IO GND (0 V)
101
:(:/&$6:/ O
DQM7/5(*
D63–D56 select
signal
:(:
&$6:
DQM7
102
D23
I/O
Data
A23
103
D24
I/O
Data
A24
104
D22
I/O
Data
A22
105
RXD
I
SCI Data input
106
'5(43
I
Request from
DMAC0
107
'5(44
I
Request from
DMAC1
108
D25
I/O
Data
A25
109
D21
I/O
Data
A21
110
D26
I/O
Data
111
D20
I/O
Data
112
D27
I/O
Data
113
VDDQ
Power
IO VDD (3.3 V)
SRAM
DRAM
SDRAM PCMCIA MPX
Chip select 3
&66
(&66)
&66
&66
O
Chip select 2
&65
(&65)
&65
&65
VDD
Power
Internal VDD
VSS
Power
Internal GND
(0 V)
I/O
Function
Rev. 6.0, 07/02, page 26 of 986
Reset
5$6
5$6
&$6
2(
)5$0(
RD/:5
5(*
A20
Table 1.3
Pin
No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
114
VSSQ
Power
IO GND (0 V)
115
D19
I/O
Data
116
D28
I/O
Data
117
VDD
Power
Internal VDD
118
VSS
Power
Internal GND
(0 V)
119
D18
I/O
Data
120
D29
I/O
Data
121
D17
I/O
Data
122
D30
I/O
Data
123
D16
I/O
Data
124
D31
I/O
Data
125
VDDQ
Power
IO VDD (3.3 V)
126
VSSQ
Power
IO GND (0 V)
127
D55
I/O
Data
128
D56
I/O
Data
129
D54
I/O
Data
130
D57
I/O
Data
131
D53
I/O
Data
132
D58
I/O
Data
133
D52
I/O
Data
134
D59
I/O
Data
135
VDDQ
Power
IO VDD (3.3 V)
136
VSSQ
Power
IO GND (0 V)
137
D51
I/O
Data/port
138
D60
I/O
Data
139
D50
I/O
Data/port
140
D61
I/O
Data
141
D49
I/O
Data/port
142
D62
I/O
Data
143
VDD
Power
Internal VDD
144
VSS
Power
Internal GND
(0 V)
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
A19
A18
A17
A16
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE0
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE1
Rev. 6.0, 07/02, page 27 of 986
Table 1.3
Pin
No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
145
D48
I/O
Data/port
146
D63
I/O
Data
147
VDDQ
Power
IO VDD (3.3 V)
148
VSSQ
Power
IO GND (0 V)
149
MD0/SCK
I/O
Mode/SCI clock
150
MD1/TXD2
I/O
151
MD2/RXD2
152
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE2
MD0
SCK
SCK
SCK
SCK
SCK
Mode SCIF data MD1
output
TXD2
TXD2
TXD2
TXD2
TXD2
I
Mode/SCIF data MD2
input
RXD2
RXD2
RXD2
RXD2
RXD2
,5/3
I
Interrupt 0
153
,5/4
I
Interrupt 1
154
,5/5
I
Interrupt 2
155
,5/6
I
Interrupt 3
156
NMI
I
Nonmaskable
interrupt
157
XTAL2
O
RTC crystal
resonator pin
158
EXTAL2
I
RTC crystal
resonator pin
159
VSS-RTC
Power
RTC GND
(0 V)
160
VDD-RTC
Power
RTC VDD
(3.3 V)
161
CA
I
*
162
VSS
Power
Internal GND
(0 V)
163
VDDQ
Power
IO VDD (3.3 V)
164
&765
I/O
SCIF data control
(&76)
165
TCLK
I/O
RTC/TMU
clock
166
MD8/5765
I/O
Mode/SCIF data MD8
control (576)
5765
5765
5765
5765
5765
167
MD7/TXD
I/O
Mode/SCI data
output
TXD
TXD
TXD
TXD
TXD
Rev. 6.0, 07/02, page 28 of 986
MD7
Table 1.3
Pin
No.
Pin Functions (cont)
Memory Interface
SRAM
DRAM
SDRAM PCMCIA MPX
SCK2
SCK2
Pin Name
I/O
Function
Reset
168
SCK2/
05(6(7
I
SCIF clock/
manual reset
05(6(7 SCK2
169
VDD
Power
Internal VDD
170
VSS
Power
Internal GND
(0 V)
171
A18
O
Address
172
A19
O
Address
173
A20
O
Address
174
A21
O
Address
175
A22
O
Address
176
A23
O
Address
177
VDDQ
Power
IO VDD (3.3 V)
178
VSSQ
Power
IO GND (0 V)
179
A24
O
Address
180
A25
O
Address
181
MD3/&(5$
I/O
Mode/
PCMCIA-CE
MD3
&(5$
182
MD4/&(5%
I/O
Mode/
PCMCIA-CE
MD4
&(5%
183
MD5/5$65
I/O
Mode/5$6
(DRAM)
MD5
184
DACK0
O
DMAC0 bus
acknowledge
185
DACK1
O
DMAC1 bus
acknowledge
186
A0
O
Address
187
VDDQ
Power
IO VDD (3.3 V)
188
VSSQ
Power
IO GND (0 V)
189
A1
O
Address
190
STATUS0
O
Status
191
STATUS1
O
Status
192
MD6/
,2,649
I
Mode/,2,649
(PCMCIA)
193
$6(%5./
BRKACK
I/O
Pin break/
acknowledge
(H-UDI)
MD6
SCK2
SCK2
5$65
,2,649
Rev. 6.0, 07/02, page 29 of 986
Table 1.3
Pin Functions (cont)
Memory Interface
Pin
No.
Pin Name
I/O
Function
194
TDO
O
Data out
(H-UDI)
195
VDD
Power
Internal VDD
196
VSS
Power
Internal GND
(0 V)
197
TMS
I
Mode (H-UDI)
198
TCK
I
Clock (H-UDI)
199
TDI
I
Data in (H-UDI)
200
7567
I
Reset (H-UDI)
201
VDD-PLL2
Power
PLL2 VDD (3.3V)
202
VSS-PLL2
Power
PLL2 GND (0V)
203
VDD-PLL1
Power
PLL1 VDD (3.3V)
204
VSS-PLL1
Power
PLL1 GND (0V)
205
VDD-CPG
Power
CPG VDD (3.3V)
206
VSS-CPG
Power
CPG GND (0V)
207
XTAL
O
Crystal resonator
208
EXTAL
I
External input
clock/crystal
resonator
I:
O:
I/O:
Power:
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
Input
Output
Input/output
Power supply
Notes: 1. Except in hardware standby mode, supply power to all power pins. In hardware standby
mode, supply power to RTC as a minimum.
2. Power must be supplied to VDD-PLL1/2 and VSS-PLL1/2 regardless of whether or not
the on-chip PLL circuits are used.
3. Power must be supplied to VDD-CPG and VSS-CPG regardless of whether or not the
on-chip crystal resonator is used.
4. Power must be supplied to VDD-RTC and VSS-RTC regardless of whether or not the
on-chip RTC is used.
5. VSSQ, VSS, VSS-RTC, VSS-PLL1/2, and VSS-CPG are connected inside the package.
6. In the SH7750S and SH7750R, at least the RTC power supply must be supplied in
hardware standby mode.
7. The 5'5, RD/:55, CKIO2, and &.,25(1% pins are not provided on the QFP
package.
8. For a QFP package, the maximum operating frequency of the external bus is 84 MHz.
* Hardware standby request (SH7750S and SH7750R). In the SH7750, pull up to 3.3 V.
Rev. 6.0, 07/02, page 30 of 986
1.4.3
Pin Functions (264-Pin CSP)
Table 1.4
Pin Functions
Memory Interface
Pin
No. No.
Pin Name
I/O
Function
1
C2
5'<
I
Bus ready
2
B1
5(6(7
I
Reset
3
D3
&63
O
Chip select 0
&63
&63
4
E2
&64
O
Chip select 1
&64
&64
5
B2
&67
O
Chip select 4
&67
6
E3
&68
O
Chip select 5
&68
&(4$
&68
7
E4
&69
O
Chip select 6
&69
&(4%
&69
8
E1
%6
O
Bus start
(%6)
9
F4
5'5
O
5'/&$66/
)5$0(
2(
10
F3
VDDQ
Power IO VDD (3.3 V)
11
D4
VSSQ
Power IO GND (0 V)
12
F2
D47
I/O
Data/port
(Port)
13
F5
D32
I/O
Data/port
14
F1
VDD
Power Internal VDD
(1.5 V)
15
G4
VSS
Power Internal GND
(0 V)
16
G3
D46
I/O
17
F6
D33
I/O
18
G2
VDDQ
Power IO VDD (3.3 V)
19
G5
VSSQ
Power IO GND (0 V)
20
G1
D45
I/O
21
G6
D34
22
H3
23
24
25
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
5'<
5'<
5'<
5(6(7
&67
(%6)
(%6)
(%6)
(%6)
&$6
2(
)5$0(
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
D44
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
H4
D35
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
H1
VDDQ
Power IO VDD (3.3 V)
H5
VSSQ
Power IO GND (0 V)
26
H2
D43
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
27
H6
D36
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
28
J3
D42
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
29
J5
D37
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
30
J1
VDDQ
Power IO VDD (3.3 V)
Rev. 6.0, 07/02, page 31 of 986
Table 1.4
Pin
No. No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
31
J6
VSSQ
Power IO GND (0 V)
32
J4
D41
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
33
J2
D38
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
34
K6
D40
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
35
K1
D39
I/O
Data/port
(Port)
(Port)
(Port)
(Port)
(Port)
36
K5
VDDQ
Power IO VDD (3.3 V)
37
K3
VSSQ
Power IO GND (0 V)
38
K4
D15
I/O
Data
A15
39
K2
D0
I/O
Data
A0
40
L6
D14
I/O
Data
A14
41
L1
D1
I/O
Data
A1
42
L5
VDDQ
Power IO VDD (3.3 V)
43
L3
VSSQ
Power IO GND (0 V)
44
M5
D13
I/O
Data
A13
45
M1
D2
I/O
Data
A2
46
L4
VDD
Power Internal VDD
(1.5 V)
47
L2
VSS
Power Internal GND
(0 V)
48
N5
D12
I/O
Data
A12
49
M3
D3
I/O
Data
A3
50
M4
VDDQ
Power IO VDD (3.3 V)
51
N1
VSSQ
Power IO GND (0 V)
52
N4
D11
I/O
Data
A11
53
M2
D4
I/O
Data
A4
54
R3
D10
I/O
Data
A10
55
N3
D5
I/O
Data
A5
56
P3
VDDQ
Power IO VDD (3.3 V)
57
P1
VSSQ
Power IO GND (0 V)
58
U1
D9
I/O
Data
A9
59
R1
D6
I/O
Data
A6
60
T1
%$&./
%65(4
O
Bus
acknowledge/
bus request
Rev. 6.0, 07/02, page 32 of 986
Table 1.4
Pin
No. No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
61
R2
%5(4/
%6$&.
I
Bus request/bus
acknowledge
62
T3
D8
I/O
Data
63
U2
D7
I/O
Data
64
R4
CKE
O
Clock output
enable
65
T5
VDDQ
Power IO VDD (3.3 V)
66
T2
VSSQ
Power IO GND (0 V)
67
R5
:(8/&$68/ O
DQM5
D47–D40 select
signal
:(8
&$68
DQM5
68
P5
:(7/&$67/ O
DQM4
D39–D32 select
signal
:(7
&$67
DQM4
69
U5
:(4/&$64/ O
DQM1
D15–D8 select
signal
:(4
&$64
DQM1
70
P6
:(3/&$63/ O
DQM0
D7–D0 select
signal
:(3
&$63
DQM0
71
R6
A17
O
Address
72
P4
VDDQ
Power IO VDD (3.3 V)
73
T6
VSSQ
Power IO GND (0 V)
74
N6
A16
O
Address
75
U6
A15
O
Address
76
P7
VDD
Power Internal VDD
(1.5 V)
77
R7
VSS
Power Internal GND
(0 V)
78
M6
A14
O
Address
79
T7
A13
O
Address
80
N7
VDDQ
Power IO VDD (3.3 V)
81
U7
VSSQ
Power IO GND (0 V)
82
R8
A12
O
A8
A7
CKE
:(4
Address
83
P8
A11
O
Address
84
U8
A10
O
Address
85
N8
VDDQ
Power IO VDD (3.3 V)
86
T8
VSSQ
Power IO GND (0 V)
87
M8
A9
O
Address
88
R9
A8
O
Address
Rev. 6.0, 07/02, page 33 of 986
Table 1.4
Pin Functions (cont)
Memory Interface
Pin
No. No.
Pin Name
89
N9
A7
O
Address
90
U9
CKIO
O
Clock output
91
M9
VDDQ
Power IO VDD (3.3 V)
I/O
Function
92
P9
VSSQ
Power IO GND (0 V)
93
T9
CKIO2
O
CKIO*
94
M10 A6
O
Address
95
U10
A5
O
Address
96
N10
A4
O
Address
97
R10
VDDQ
Power IO VDD (3.3 V)
98
P10
VSSQ
Power IO GND (0 V)
99
T10
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
CKIO
CKIO
A3
O
Address
100 M11 A2
O
Address
101 U11
DRAK1
O
DMAC1 request
acknowledge
102 N11
DRAK0
O
DMAC0 request
acknowledge
103 R11
VDDQ
Power IO VDD (3.3 V)
104 N12
VSSQ
Power IO GND (0 V)
105 U12
&66
O
Chip select 3
&66
(&66)
&66
&66
106 P11
&65
O
Chip select 2
&65
(&65)
&65
&65
107 T11
VDD
Power Internal VDD
(1.5 V)
108 N13
VSS
Power Internal GND
(0 V)
109 R12
5$6
O
5$6
5$6
5$6
110 P12
5'/&$66/
)5$0(
O
Read/&$6/
)5$0(
111 U13
VDDQ
Power IO VDD (3.3 V)
112 P13
VSSQ
Power IO GND (0 V)
113 T12
RD/:5
O
Read/write
RD/:5 RD/:5 RD/:5
114 R15
:(5/&$65/ O
DQM2/
,&,25'
D23–D16 select
signal
:(5
&$65
DQM2
,&,25'
115 R13
:(6/&$66/ O
DQM3/
,&,2:5
D31–D24 select
signal
:(6
&$66
DQM3
,&,2:5
Rev. 6.0, 07/02, page 34 of 986
2(
&$6
2(
)5$0(
RD/:5
Table 1.4
Pin
No. No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
:(9
&$69
DQM6
:(:
&$6:
DQM7
116 R14
:(9/&$69/ O
DQM6
117 U14
VDDQ
Power IO VDD (3.3 V)
118 U17
VSSQ
Power IO GND (0 V)
119 U15
:(:/&$6:/ O
DQM7/5(*
D63–D56 select
signal
120 U16
D23
I/O
Data
A23
121 T13
D24
I/O
Data
A24
122 T15
D22
I/O
Data
A22
123 R16
RXD
I
SCI1 data input
124 T17
'5(43
I
Request from
DMAC0
125 P17
'5(44
I
Request from
DMAC1
Data
D55–D48 select
signal
126 P15
D25
I/O
127 N16
VDDQ
Power IO VDD (3.3 V)
128 T16
VSSQ
Power IO GND (0 V)
129 N15
D21
I/O
Data
130 N14
D26
I/O
Data
131 N17
D20
I/O
Data
132 M14 D27
I/O
Data
133 M15 VDDQ
Power IO VDD (3.3 V)
134 P14
Power IO GND (0 V)
VSSQ
135 M16 D19
I/O
Data
136 M13 D28
I/O
Data
137 M17 VDD
Power Internal VDD
(1.5 V)
138 L14
VSS
Power Internal GND
(0 V)
139 L15
D18
I/O
Data
140 M12 D29
I/O
Data
141 L16
VDDQ
Power IO VDD (3.3 V)
142 L13
VSSQ
Power IO GND (0 V)
143 L17
D17
I/O
Data
144 L12
D30
I/O
Data
5(*
A25
A21
A20
A19
A18
A17
Rev. 6.0, 07/02, page 35 of 986
Table 1.4
Pin Functions (cont)
Memory Interface
Pin
No. No.
Pin Name
I/O
Function
145 K15
D16
I/O
Data
146 K14
D31
I/O
Data
147 K17
VDDQ
Power IO VDD (3.3 V)
148 K13
VSSQ
Power IO GND (0 V)
149 K16
D55
I/O
Data
150 K12
D56
I/O
Data
151 J15
D54
I/O
Data
152 J13
D57
I/O
Data
153 J17
VDDQ
Power IO VDD (3.3 V)
154 J12
VSSQ
Power IO GND (0 V)
155 J14
D53
I/O
Data
156 J16
D58
I/O
Data
157 H12
D52
I/O
Data
Data
158 H17
D59
I/O
159 H13
VDDQ
Power IO VDD (3.3 V)
160 H15
VSSQ
Power IO GND (0 V)
161 H14
D51
I/O
Data/port
162 H16
D60
I/O
Data
163 G12 D50
I/O
Data/port
164 G17 D61
I/O
Data
165 G13 VDDQ
Power IO VDD (3.3 V)
166 G15 VSSQ
Power IO GND (0 V)
167 F13
D49
I/O
Data/port
168 F17
D62
I/O
Data
169 G14 VDD
Power Internal VDD
(1.5 V)
170 G16 VSS
Power Internal GND
(0 V)
171 E13
D48
I/O
Data/port
172 F15
D63
I/O
Data
173 F14
VDDQ
Power IO VDD (3.3 V)
174 E17
VSSQ
Power IO GND (0 V)
175 E14
RD/:55
O
RD/:5
Rev. 6.0, 07/02, page 36 of 986
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
A16
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE0
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE1
(Port)
(Port)
(Port)
(Port)
(Port)
ACCSIZE2
RD/:5 RD/:5 RD/:5
RD/:5
Table 1.4
Pin Functions (cont)
Memory Interface
Pin
No. No.
Pin Name
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
176 F16
MD0/SCK
I/O
Mode/SCI1
clock
MD0
SCK
SCK
SCK
SCK
SCK
177 C15
MD1/TXD2
I/O
Mode/SCIF
data output
MD1
TXD2
TXD2
TXD2
TXD2
TXD2
178 E15
MD2/RXD2 I
Mode/SCIF
data input
MD2
RXD2
RXD2
RXD2
RXD2
RXD2
179 D15
,5/3
I
Interrupt 0
180 D17
,5/4
I
Interrupt 1
181 A17
,5/5
I
Interrupt 2
182 B17
,5/6
I
Interrupt 3
183 C16
NMI
I
Nonmaskable
interrupt
184 A15
XTAL2
O
RTC crystal
resonator pin
185 A16
EXTAL2
I
RTC crystal
resonator pin
186 A14
VSS-RTC
Power RTC GND
(0 V)
187 C14
VDD-RTC
Power RTC VDD
(3.3 V)
188 B13
CA
I
189 C13
VDDQ
Power IO VDD (3.3 V)
190 D13
&765
I/O
SCIF data control
(&76)
191 A13
TCLK
I/O
RTC/TMU
clock
192 D12
MD8/5765
I/O
Mode/SCIF data MD8
control (576)
5765
5765
5765
5765
5765
193 C12
VDDQ
Power IO VDD (3.3 V)
194 D14
VSSQ
Power IO GND (0 V)
195 B12
MD7/TXD
I/O
Mode/SCI1 data MD7
output
TXD
TXD
TXD
TXD
TXD
196 E12
SCK2/
05(6(7
I
SCIF clock/
manual reset
SCK2
SCK2
SCK2
SCK2
197 A12
VDD
Power Internal VDD
(1.5 V)
Hardware
standby request
05(6(7 SCK2
Rev. 6.0, 07/02, page 37 of 986
Table 1.4
Pin Functions (cont)
Memory Interface
Pin
No. No.
Pin Name
I/O
198 D11
VSS
Power Internal GND
(0 V)
199 C11
A18
O
Address
200 F12
A19
O
Address
201 B11
VDDQ
Power IO VDD (3.3 V)
202 E11
VSSQ
Power IO GND (0 V)
Function
203 A11
A20
O
Address
204 F11
A21
O
Address
205 C10
A22
O
Address
Address
206 D10
A23
O
207 A10
VDDQ
Power IO VDD (3.3 V)
208 E10
VSSQ
Power IO GND (0 V)
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
209 B10
A24
O
Address
210 F10
A25
O
Address
211 C9
MD3/&(5$ I/O
Mode/
PCMCIA-CE
MD3
&(5$
212 E9
MD4/&(5% I/O
Mode/
PCMCIA-CE
MD4
&(5%
213 A9
VDDQ
Power IO VDD (3.3 V)
214 F9
VSSQ
Power IO GND (0 V)
215 D9
MD5/5$65 I/O
Mode/5$6
(DRAM)
216 B9
DACK0
O
DMAC0 bus
acknowledge
217 F8
DACK1
O
DMAC1 bus
acknowledge
218 A8
A0
O
Address
219 E8
VDDQ
Power IO VDD (3.3 V)
220 C8
VSSQ
Power IO GND (0 V)
221 D8
A1
O
Address
222 B8
STATUS0
O
Status
223 F7
STATUS1
O
Status
224 A7
MD6/
,2,649
I
Mode/,2,649
(PCMCIA)
225 E7
VDDQ
Power IO VDD (3.3 V)
226 C7
VSSQ
Power IO GND (0 V)
Rev. 6.0, 07/02, page 38 of 986
MD5
MD6
5$65
,2,649
Table 1.4
Pin
No. No.
Pin Functions (cont)
Memory Interface
Pin Name
I/O
Function
227 E6
$6(%5./
BRKACK
I/O
Pin break/
acknowledge
(H-UDI)
228 A6
TDO
O
Data out
(H-UDI)
229 D7
VDD
Power Internal VDD
(1.5 V)
230 B7
VSS
Power Internal GND
(0 V)
231 E5
TMS
I
232 C6
TCK
I
Clock (H-UDI)
233 D6
TDI
I
Data in (H-UDI)
234 A5
7567
I
Reset (H-UDI)
235 D5
&.,25(1% I
236 B6
VDD-PLL2
237 C3
VSS-PLL2
Power PLL2 GND (0V)
238 C5
VDD-PLL1
Power PLL1 VDD (3.3V)
239 C4
VSS-PLL1
Power PLL1 GND (0V)
240 A4
VDD-CPG
Power CPG VDD (3.3V)
241 A1
VSS-CPG
Power CPG GND (0V)
242 A2
XTAL
O
Crystal resonator
243 A3
EXTAL
I
External clock/
crystal resonator
244 B3
NC-1
245 B4
NC-2
246 B5
NC-3
247 B14
NC-4
248 B15
NC-5
249 B16
NC-6
250 C1
NC-7
251 C17
NC-8
252 D1
NC-9
253 D2
NC-10
254 D16
NC-11
255 E16
NC-12
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
Mode (H-UDI)
CKIO2, 5'5,
RD/:55 enable
Power PLL2 VDD (3.3V)
Rev. 6.0, 07/02, page 39 of 986
Table 1.4
Pin
No. No.
Pin Functions (cont)
Memory Interface
Pin Name
256 M7
NC-13
257 N2
NC-14
258 P2
NC-15
259 P16
NC-16
260 R17
NC-17
261 T4
NC-18
262 T14
NC-19
263 U3
NC-20
264 U4
NC-21
I:
O:
I/O:
Power:
I/O
Function
Reset
SRAM
DRAM
SDRAM PCMCIA MPX
Input
Output
Input/output
Power supply
Notes: 1. Except in hardware standby mode, supply power to all power pins. In hardware standby
mode, supply power to RTC as a minimum.
2. Power must be supplied to VDD-PLL1/2 and VSS-PLL1/2 regardless of whether or not
the on-chip PLL circuits are used.
3. Power must be supplied to VDD-CPG and VSS-CPG regardless of whether or not the
on-chip crystal resonator is used.
4. Power must be supplied to VDD-RTC and VSS-RTC regardless of whether or not the
on-chip RTC is used.
5. At least the RTC power supply must be supplied in hardware standby mode.
6. NC pins must be left completely open, and not connected to a power supply, GND, etc.
* CKIO2 is not connected to PLL2.
Rev. 6.0, 07/02, page 40 of 986
Section 2 Programming Model
2.1
Data Formats
The data formats handled by the SH7750 Series are shown in figure 2.1.
7
0
Byte (8 bits)
15
0
Word (16 bits)
31
0
Longword (32 bits)
31 30
Single-precision floating-point (32 bits)
63 62
Double-precision floating-point (64 bits)
22
s exp
s
51
exp
0
fraction
0
fraction
Figure 2.1 Data Formats
Rev. 6.0, 07/02, page 41 of 986
2.2
Register Configuration
2.2.1
Privileged Mode and Banks
Processor Modes: The SH7750 Series has two processor modes, user mode and privileged mode.
The SH7750 Series normally operates in user mode, and switches to privileged mode when an
exception occurs or an interrupt is accepted. There are four kinds of registers—general registers,
system registers, control registers, and floating-point registers—and the registers that can be
accessed differ in the two processor modes.
General Registers: There are 16 general registers, designated R0 to R15. General registers R0 to
R7 are banked registers which are switched by a processor mode change.
In privileged mode, the register bank bit (RB) in the status register (SR) defines which banked
register set is accessed as general registers, and which set is accessed only through the load control
register (LDC) and store control register (STC) instructions.
When the RB bit is 1 (that is, when bank 1 is selected), the 16 registers comprising bank 1 general
registers R0_BANK1 to R7_BANK1 and non-banked general registers R8 to R15 can be accessed
as general registers R0 to R15. In this case, the eight registers comprising bank 0 general registers
R0_BANK0 to R7_BANK0 are accessed by the LDC/STC instructions. When the RB bit is 0 (that
is, when bank 0 is selected), the 16 registers comprising bank 0 general registers R0_BANK0 to
R7_BANK0 and non-banked general registers R8 to R15 can be accessed as general registers R0
to R15. In this case, the eight registers comprising bank 1 general registers R0_BANK1 to
R7_BANK1 are accessed by the LDC/STC instructions.
In user mode, the 16 registers comprising bank 0 general registers R0_BANK0 to R7_BANK0 and
non-banked general registers R8 to R15 can be accessed as general registers R0 to R15. The eight
registers comprising bank 1 general registers R0_BANK1 to R7_BANK1 cannot be accessed.
Control Registers: Control registers comprise the global base register (GBR) and status register
(SR), which can be accessed in both processor modes, and the saved status register (SSR), saved
program counter (SPC), vector base register (VBR), saved general register 15 (SGR), and debug
base register (DBR), which can only be accessed in privileged mode. Some bits of the status
register (such as the RB bit) can only be accessed in privileged mode.
System Registers: System registers comprise the multiply-and-accumulate registers
(MACH/MACL), the procedure register (PR), the program counter (PC), the floating-point
status/control register (FPSCR), and the floating-point communication register (FPUL). Access to
these registers does not depend on the processor mode.
Rev. 6.0, 07/02, page 42 of 986
Floating-Point Registers: There are thirty-two floating-point registers, FR0–FR15 and XF0–
XF15. FR0–FR15 and XF0–XF15 can be assigned to either of two banks (FPR0_BANK0–
FPR15_BANK0 or FPR0_BANK1–FPR15_BANK1).
FR0–FR15 can be used as the eight registers DR0/2/4/6/8/10/12/14 (double-precision floatingpoint registers, or pair registers) or the four registers FV0/4/8/12 (register vectors), while XF0–
XF15 can be used as the eight registers XD0/2/4/6/8/10/12/14 (register pairs) or register matrix
XMTRX.
Register values after a reset are shown in table 2.1.
Table 2.1
Initial Register Values
Type
Registers
Initial Value*
General registers
R0_BANK0–R7_BANK0,
R0_BANK1–R7_BANK1,
R8–R15
Undefined
Control registers
SR
MD bit = 1, RB bit = 1, BL bit = 1, FD bit = 0,
I3–I0 = 1111 (H'F), reserved bits = 0, others
undefined
GBR, SSR, SPC, SGR,
DBR
Undefined
VBR
H'00000000
MACH, MACL, PR, FPUL
Undefined
PC
H'A0000000
FPSCR
H'00040001
FR0–FR15, XF0–XF15
Undefined
System registers
Floating-point
registers
Note: * Initialized by a power-on reset and manual reset.
The register configuration in each processor is shown in figure 2.2.
Switching between user mode and privileged mode is controlled by the processor mode bit (MD)
in the status register.
Rev. 6.0, 07/02, page 43 of 986
31
0
31
0
31
0
R0_BANK0*1 *2
R1_BANK0*2
R2_BANK0*2
R3_BANK0*2
R4_BANK0*2
R5_BANK0*2
R6_BANK0*2
R7_BANK0*2
R8
R9
R10
R11
R12
R13
R14
R15
R0_BANK1*1 *3
R1_BANK1*3
R2_BANK1*3
R3_BANK1*3
R4_BANK1*3
R5_BANK1*3
R6_BANK1*3
R7_BANK1*3
R8
R9
R10
R11
R12
R13
R14
R15
R0_BANK0*1 *4
R1_BANK0*4
R2_BANK0*4
R3_BANK0*4
R4_BANK0*4
R5_BANK0*4
R6_BANK0*4
R7_BANK0*4
R8
R9
R10
R11
R12
R13
R14
R15
SR
SR
SSR
SR
SSR
GBR
MACH
MACL
PR
GBR
MACH
MACL
PR
VBR
GBR
MACH
MACL
PR
VBR
PC
PC
SPC
PC
SPC
SGR
SGR
DBR
(a) Register configuration
in user mode
R0_BANK0*1 *4
R1_BANK0*4
R2_BANK0*4
R3_BANK0*4
R4_BANK0*4
R5_BANK0*4
R6_BANK0*4
R7_BANK0*4
(b) Register configuration in
privileged mode (RB = 1)
DBR
R0_BANK1*1 *3
R1_BANK1*3
R2_BANK1*3
R3_BANK1*3
R4_BANK1*3
R5_BANK1*3
R6_BANK1*3
R7_BANK1*3
(c) Register configuration in
privileged mode (RB = 0)
Notes: *1 The R0 register is used as the index register in indexed register-indirect addressing mode and
indexed GBR indirect addressing mode.
*2 Banked registers
*3 Banked registers
Accessed as general registers when the RB bit is set to 1 in the SR register. Accessed only by
LDC/STC instructions when the RB bit is cleared to 0.
*4 Banked registers
Accessed as general registers when the RB bit is cleared to 0 in the SR register. Accessed only by
LDC/STC instructions when the RB bit is set to 1.
Figure 2.2 CPU Register Configuration in Each Processor Mode
Rev. 6.0, 07/02, page 44 of 986
2.2.2
General Registers
Figure 2.3 shows the relationship between the processor modes and general registers. The SH7750
Series has twenty-four 32-bit general registers (R0_BANK0–R7_BANK0, R0_BANK1–
R7_BANK1, and R8–R15). However, only 16 of these can be accessed as general registers R0–
R15 in one processor mode. The SH7750 Series has two processor modes, user mode and
privileged mode, in which R0–R7 are assigned as shown below.
• R0_BANK0–R7_BANK0
In user mode (SR.MD = 0), R0–R7 are always assigned to R0_BANK0–R7_BANK0.
In privileged mode (SR.MD = 1), R0–R7 are assigned to R0_BANK0–R7_BANK0 only when
SR.RB = 0.
• R0_BANK1–R7_BANK1
In user mode, R0_BANK1–R7_BANK1 cannot be accessed.
In privileged mode, R0–R7 are assigned to R0_BANK1–R7_BANK1 only when SR.RB = 1.
Rev. 6.0, 07/02, page 45 of 986
SR.MD = 0 or
(SR.MD = 1, SR.RB = 0)
(SR.MD = 1, SR.RB = 1)
R0
R1
R2
R3
R4
R5
R6
R7
R0_BANK0
R1_BANK0
R2_BANK0
R3_BANK0
R4_BANK0
R5_BANK0
R6_BANK0
R7_BANK0
R0_BANK0
R1_BANK0
R2_BANK0
R3_BANK0
R4_BANK0
R5_BANK0
R6_BANK0
R7_BANK0
R0_BANK1
R1_BANK1
R2_BANK1
R3_BANK1
R4_BANK1
R5_BANK1
R6_BANK1
R7_BANK1
R0_BANK1
R1_BANK1
R2_BANK1
R3_BANK1
R4_BANK1
R5_BANK1
R6_BANK1
R7_BANK1
R0
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R8
R9
R10
R11
R12
R13
R14
R15
R8
R9
R10
R11
R12
R13
R14
R15
Figure 2.3 General Registers
Programming Note: As the user’s R0–R7 are assigned to R0_BANK0–R7_BANK0, and after an
exception or interrupt R0–R7 are assigned to R0_BANK1–R7_BANK1, it is not necessary for the
interrupt handler to save and restore the user’s R0–R7 (R0_BANK0–R7_BANK0).
After a reset, the values of R0_BANK0–R7_BANK0, R0_BANK1–R7_BANK1, and R8–R15 are
undefined.
Rev. 6.0, 07/02, page 46 of 986
2.2.3
Floating-Point Registers
Figure 2.4 shows the floating-point registers. There are thirty-two 32-bit floating-point registers,
divided into two banks (FPR0_BANK0–FPR15_BANK0 and FPR0_BANK1–FPR15_BANK1).
These 32 registers are referenced as FR0–FR15, DR0/2/4/6/8/10/12/14, FV0/4/8/12, XF0–XF15,
XD0/2/4/6/8/10/12/14, or XMTRX. The correspondence between FPRn_BANKi and the reference
name is determined by the FR bit in FPSCR (see figure 2.4).
• Floating-point registers, FPRn_BANKi (32 registers)
FPR0_BANK0, FPR1_BANK0, FPR2_BANK0, FPR3_BANK0, FPR4_BANK0,
FPR5_BANK0, FPR6_BANK0, FPR7_BANK0, FPR8_BANK0, FPR9_BANK0,
FPR10_BANK0, FPR11_BANK0, FPR12_BANK0, FPR13_BANK0, FPR14_BANK0,
FPR15_BANK0
FPR0_BANK1, FPR1_BANK1, FPR2_BANK1, FPR3_BANK1, FPR4_BANK1,
FPR5_BANK1, FPR6_BANK1, FPR7_BANK1, FPR8_BANK1, FPR9_BANK1,
FPR10_BANK1, FPR11_BANK1, FPR12_BANK1, FPR13_BANK1, FPR14_BANK1,
FPR15_BANK1
• Single-precision floating-point registers, FRi (16 registers)
When FPSCR.FR = 0, FR0–FR15 are assigned to FPR0_BANK0–FPR15_BANK0.
When FPSCR.FR = 1, FR0–FR15 are assigned to FPR0_BANK1–FPR15_BANK1.
• Double-precision floating-point registers or single-precision floating-point register pairs, DRi
(8 registers): A DR register comprises two FR registers.
DR0 = {FR0, FR1}, DR2 = {FR2, FR3}, DR4 = {FR4, FR5}, DR6 = {FR6, FR7},
DR8 = {FR8, FR9}, DR10 = {FR10, FR11}, DR12 = {FR12, FR13}, DR14 = {FR14, FR15}
• Single-precision floating-point vector registers, FVi (4 registers): An FV register comprises
four FR registers
FV0 = {FR0, FR1, FR2, FR3}, FV4 = {FR4, FR5, FR6, FR7},
FV8 = {FR8, FR9, FR10, FR11}, FV12 = {FR12, FR13, FR14, FR15}
• Single-precision floating-point extended registers, XFi (16 registers)
When FPSCR.FR = 0, XF0–XF15 are assigned to FPR0_BANK1–FPR15_BANK1.
When FPSCR.FR = 1, XF0–XF15 are assigned to FPR0_BANK0–FPR15_BANK0.
• Single-precision floating-point extended register pairs, XDi (8 registers): An XD register
comprises two XF registers
XD0 = {XF0, XF1}, XD2 = {XF2, XF3}, XD4 = {XF4, XF5}, XD6 = {XF6, XF7},
XD8 = {XF8, XF9}, XD10 = {XF10, XF11}, XD12 = {XF12, XF13}, XD14 = {XF14, XF15}
Rev. 6.0, 07/02, page 47 of 986
• Single-precision floating-point extended register matrix, XMTRX: XMTRX comprises all 16
XF registers
XMTRX =
XF0
XF4
XF8
XF12
XF1
XF5
XF9
XF13
XF2
XF6
XF10
XF14
XF3
XF7
XF11
XF15
FPSCR.FR = 0
FV0
FV4
FV8
FV12
FPSCR.FR = 1
FR0
FR1
DR2 FR2
FR3
DR4 FR4
FR5
DR6 FR6
FR7
DR8 FR8
FR9
DR10 FR10
FR11
DR12 FR12
FR13
DR14 FR14
FR15
FPR0_BANK0
FPR1_BANK0
FPR2_BANK0
FPR3_BANK0
FPR4_BANK0
FPR5_BANK0
FPR6_BANK0
FPR7_BANK0
FPR8_BANK0
FPR9_BANK0
FPR10_BANK0
FPR11_BANK0
FPR12_BANK0
FPR13_BANK0
FPR14_BANK0
FPR15_BANK0
XF0
XF1
XD2 XF2
XF3
XD4 XF4
XF5
XD6 XF6
XF7
XD8 XF8
XF9
XD10 XF10
XF11
XD12 XF12
XF13
XD14 XF14
XF15
FPR0_BANK1
FPR1_BANK1
FPR2_BANK1
FPR3_BANK1
FPR4_BANK1
FPR5_BANK1
FPR6_BANK1
FPR7_BANK1
FPR8_BANK1
FPR9_BANK1
FPR10_BANK1
FPR11_BANK1
FPR12_BANK1
FPR13_BANK1
FPR14_BANK1
FPR15_BANK1
DR0
XMTRX XD0
XF0
XF1
XF2
XF3
XF4
XF5
XF6
XF7
XF8
XF9
XF10
XF11
XF12
XF13
XF14
XF15
FR0
FR1
FR2
FR3
FR4
FR5
FR6
FR7
FR8
FR9
FR10
FR11
FR12
FR13
FR14
FR15
Figure 2.4 Floating-Point Registers
Rev. 6.0, 07/02, page 48 of 986
XD0
XMTRX
XD2
XD4
XD6
XD8
XD10
XD12
XD14
DR0
FV0
DR2
DR4
FV4
DR6
DR8
FV8
DR10
DR12
DR14
FV12
Programming Note: After a reset, the values of FPR0_BANK0–FPR15_BANK0 and
FPR0_BANK1–FPR15_BANK1 are undefined.
2.2.4
Control Registers
Status register, SR (32 bits, privilege protection, initial value = 0111 0000 0000 0000 0000
00XX 1111 00XX (X: undefined))
31 30 29 28 27
— MD RB BL
16 15 14
—
FD
10
—
9
8
M
Q
7
4
IMASK
3
2
—
1
0
S
T
Note: —: Reserved. These bits are always read as 0, and should only be written with 0.
• MD: Processor mode
MD = 0: User mode (some instructions cannot be executed, and some resources cannot be
accessed)
MD = 1: Privileged mode
• RB: General register bank specifier in privileged mode (set to 1 by a reset, exception, or
interrupt)
RB = 0: R0_BANK0–R7_BANK0 are accessed as general registers R0–R7. (R0_BANK1–
R7_BANK1 can be accessed using LDC/STC R0_BANK–R7_BANK instructions.)
RB = 1: R0_BANK1–R7_BANK1 are accessed as general registers R0–R7. (R0_BANK0–
R7_BANK0 can be accessed using LDC/STC R0_BANK–R7_BANK instructions.)
• BL: Exception/interrupt block bit (set to 1 by a reset, exception, or interrupt)
BL = 1: Interrupt requests are masked. If a general exception other than a user break occurs
while BL = 1, the processor switches to the reset state.
• FD: FPU disable bit (cleared to 0 by a reset)
FD = 1: An FPU instruction causes a general FPU disable exception, and if the FPU instruction
is in a delay slot, a slot FPU disable exception is generated. (FPU instructions: H'F***
instructions, LDC(.L)/STS(.L) instructions for FPUL/FPSCR)
• M, Q: Used by the DIV0S, DIV0U, and DIV1 instructions.
• IMASK: Interrupt mask level
External interrupts of a same level or a lower level than IMASK are masked.
• S: Specifies a saturation operation for a MAC instruction.
• T: True/false condition or carry/borrow bit
Rev. 6.0, 07/02, page 49 of 986
Saved status register, SSR (32 bits, privilege protection, initial value undefined): The current
contents of SR are saved to SSR in the event of an exception or interrupt.
Saved program counter, SPC (32 bits, privilege protection, initial value undefined): The
address of an instruction at which an interrupt or exception occurs is saved to SPC.
Global base register, GBR (32 bits, initial value undefined): GBR is referenced as the base
address in a GBR-referencing MOV instruction.
Vector base register, VBR (32 bits, privilege protection, initial value = H'0000 0000): VBR is
referenced as the branch destination base address in the event of an exception or interrupt. For
details, see section 5, Exceptions.
Saved general register 15, SGR (32 bits, privilege protection, initial value undefined): The
contents of R15 are saved to SGR in the event of an exception or interrupt.
Debug base register, DBR (32 bits, privilege protection, initial value undefined): When the
user break debug function is enabled (BRCR.UBDE = 1), DBR is referenced as the user break
handler branch destination address instead of VBR.
2.2.5
System Registers
Multiply-and-accumulate register high, MACH (32 bits, initial value undefined)
Multiply-and-accumulate register low, MACL (32 bits, initial value undefined)
MACH/MACL is used for the added value in a MAC instruction, and to store a MAC instruction
or MUL operation result.
Procedure register, PR (32 bits, initial value undefined): The return address is stored in PR in a
subroutine call using a BSR, BSRF, or JSR instruction, and PR is referenced by the subroutine
return instruction (RTS).
Program counter, PC (32 bits, initial value = H'A000 0000): PC indicates the instruction fetch
address.
Rev. 6.0, 07/02, page 50 of 986
Floating-point status/control register, FPSCR (32 bits, initial value = H'0004 0001)
31
22 21 20 19 18 17
—
FR SZ PR DN
12 11
Cause
7
6
Enable
2
1
Flag
0
RM
Note: —: Reserved. These bits are always read as 0, and should only be written with 0.
• FR: Floating-point register bank
FR = 0: FPR0_BANK0–FPR15_BANK0 are assigned to FR0–FR15; FPR0_BANK1–
FPR15_BANK1 are assigned to XF0–XF15.
FR = 1: FPR0_BANK0–FPR15_BANK0 are assigned to XF0–XF15; FPR0_BANK1–
FPR15_BANK1 are assigned to FR0–FR15.
• SZ: Transfer size mode
SZ = 0: The data size of the FMOV instruction is 32 bits.
SZ = 1: The data size of the FMOV instruction is a 32-bit register pair (64 bits).
• PR: Precision mode
PR = 0: Floating-point instructions are executed as single-precision operations.
PR = 1: Floating-point instructions are executed as double-precision operations (the result of
instructions for which double-precision is not supported is undefined).
Do not set SZ and PR to 1 simultaneously; this setting is reserved.
[SZ, PR = 11]: Reserved (FPU operation instruction is undefined.)
• DN: Denormalization mode
DN = 0: A denormalized number is treated as such.
DN = 1: A denormalized number is treated as zero.
• Cause: FPU exception cause field
• Enable: FPU exception enable field
• Flag: FPU exception flag field
FPU
Error (E)
Invalid
Division
Operation (V) by Zero (Z)
Overflow Underflow Inexact
(O)
(U)
(I)
Cause
FPU exception
cause field
Bit 17
Bit 16
Bit 15
Bit 14
Bit 13
Bit 12
Enable
FPU exception
enable field
None
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Flag
FPU exception
flag field
None
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Rev. 6.0, 07/02, page 51 of 986
When an FPU operation instruction is executed, the FPU exception cause field is cleared to
zero first. When the next FPU exception is occured, the corresponding bits in the FPU
exception cause field and FPU exception flag field are set to 1. The FPU exception flag field
holds the status of the exception generated after the field was last cleared.
• RM: Rounding mode
RM = 00: Round to Nearest
RM = 01: Round to Zero
RM = 10: Reserved
RM = 11: Reserved
• Bits 22 to 31: Reserved
Floating-point communication register, FPUL (32 bits, initial value undefined): Data transfer
between FPU registers and CPU registers is carried out via the FPUL register.
Programming Note: When SZ = 1 and big endian mode is selected, FMOV can be used for
double-precision floating-point load or store operations. In little endian mode, two 32-bit data size
moves must be executed, with SZ = 0, to load or store a double-precision floating-point number.
2.3
Memory-Mapped Registers
Appendix A, Address List shows the control registers mapped to memory. The control registers
are double-mapped to the following two memory areas. All registers have two addresses.
H'1C00 0000–H'1FFF FFFF
H'FC00 0000–H'FFFF FFFF
These two areas are used as follows.
• H'1C00 0000–H'1FFF FFFF
This area must be accessed using the address translation function of the MMU. Setting the
page number of this area to the corresponding filed of the TLB enables access to a memorymapped register. Accessing this area without using the address translation function of the
MMU is not guaranteed.
• H'FC00 0000–H'FFFF FFFF
Access to area H'FF00 0000–H'FFFF FFFF in user mode will cause an address error. Memorymapped registers can be referenced in user mode by means of access that involves address
translation.
Note: Do not access undefined locations in either area The operation of an access to an
undefined location is undefined. Also, memory-mapped registers must be accessed using a
fixed data size. The operation of an access using an invalid data size is undefined.
Rev. 6.0, 07/02, page 52 of 986
2.4
Data Format in Registers
Register operands are always longwords (32 bits). When a memory operand is only a byte (8 bits)
or a word (16 bits), it is sign-extended into a longword when loaded into a register.
31
0
Longword
2.5
Data Formats in Memory
Memory data formats are classified into bytes, words, and longwords. Memory can be accessed in
8-bit byte, 16-bit word, or 32-bit longword form. A memory operand less than 32 bits in length is
sign-extended before being loaded into a register.
A word operand must be accessed starting from a word boundary (even address of a 2-byte unit:
address 2n), and a longword operand starting from a longword boundary (even address of a 4-byte
unit: address 4n). An address error will result if this rule is not observed. A byte operand can be
accessed from any address.
Big endian or little endian byte order can be selected for the data format. The endian should be set
with the MD5 external pin in a power-on reset. Big endian is selected when the MD5 pin is low,
and little endian when high. The endian cannot be changed dynamically. Bit positions are
numbered left to right from most-significant to least-significant. Thus, in a 32-bit longword, the
leftmost bit, bit 31, is the most significant bit and the rightmost bit, bit 0, is the least significant
bit.
The data format in memory is shown in figure 2.5.
A
31
7
A+1
23
A+2
15
07
07
A+3
A + 11 A + 10 A + 9
7
0
31
07
0
7
0
15
Address A Byte 0 Byte 1 Byte 2 Byte 3
Address A + 4
Address A + 8
15
0 15
Word 0
31
Big endian
15
07
07
0
07
0
0 15
Word 1
0
A+8
7
Byte 3 Byte 2 Byte 1 Byte 0 Address A + 8
Word 1
Longword
23
31
0
Word 0
Longword
0
Address A + 4
Address A
Little endian
Figure 2.5 Data Formats In Memory
Rev. 6.0, 07/02, page 53 of 986
Note: The SH7750 Series does not support endian conversion for the 64-bit data format.
Therefore, if double-precision floating-point format (64-bit) access is performed in little
endian mode, the upper and lower 32 bits will be reversed.
2.6
Processor States
The SH7750 Series has five processor states: the reset state, exception-handling state, bus-released
state, program execution state, and power-down state.
Reset State: In this state the CPU is reset. The reset state is entered when the 5(6(7 pin goes
low. The CPU enters the power-on reset state if the 05(6(7 pin is high, and the manual reset
state if the 05(6(7 pin is low. For more information on resets, see section 5, Exceptions.
In the power-on reset state, the internal state of the CPU and the on-chip peripheral module
registers are initialized. In the manual reset state, the internal state of the CPU and registers of onchip peripheral modules other than the bus state controller (BSC) are initialized. Since the bus
state controller (BSC) is not initialized in the manual reset state, refreshing operations continue.
Refer to the register configurations in the relevant sections for further details.
Exception-Handling State: This is a transient state during which the CPU’s processor state flow
is altered by a reset, general exception, or interrupt exception handling source.
In the case of a reset, the CPU branches to address H'A000 0000 and starts executing the usercoded exception handling program.
In the case of a general exception or interrupt, the program counter (PC) contents are saved in the
saved program counter (SPC), the status register (SR) contents are saved in the saved status
register (SSR), and the R15 contents are saved in saved general register 15 (SGR). The CPU
branches to the start address of the user-coded exception service routine found from the sum of the
contents of the vector base address and the vector offset. See section 5, Exceptions, for more
information on resets, general exceptions, and interrupts.
Program Execution State: In this state the CPU executes program instructions in sequence.
Power-Down State: In the power-down state, CPU operation halts and power consumption is
reduced. The power-down state is entered by executing a SLEEP instruction. There are two modes
in the power-down state: sleep mode and standby mode. For details, see section 9, Power-Down
Modes.
Bus-Released State: In this state the CPU has released the bus to a device that requested it.
Transitions between the states are shown in figure 2.6.
Rev. 6.0, 07/02, page 54 of 986
From any state when
= 0 and
From any state when
= 0 and
=1
=0
Power-on reset state
Manual reset state
= 0,
=1
Reset state
= 1,
=1
= 1,
=0
Exception-handling state
Bus request
Bus request
clearance
Interrupt
Exception
interrupt
Bus-released state
Bus
request
Bus request
End of exception
transition
processing
Interrupt
Bus request
clearance
Bus request
clearance
Program execution state
SLEEP instruction
with STBY bit
cleared
Sleep mode
SLEEP instruction
with STBY bit set
Standby mode
Power-down state
Figure 2.6 Processor State Transitions
2.7
Processor Modes
There are two processor modes: user mode and privileged mode. The processor mode is
determined by the processor mode bit (MD) in the status register (SR). User mode is selected
when the MD bit is cleared to 0, and privileged mode when the MD bit is set to 1. When the reset
state or exception state is entered, the MD bit is set to 1. There are certain registers and bits which
can only be accessed in privileged mode.
Rev. 6.0, 07/02, page 55 of 986
Rev. 6.0, 07/02, page 56 of 986
Section 3 Memory Management Unit (MMU)
3.1
Overview
3.1.1
Features
The SH7750 Series can handle 29-bit external memory space from an 8-bit address space
identifier and 32-bit logical (virtual) address space. Address translation from virtual address to
physical address is performed using the memory management unit (MMU) built into the SH7750
Series. The MMU performs high-speed address translation by caching user-created address
translation table information in an address translation buffer (translation lookaside buffer: TLB).
The SH7750 Series has four instruction TLB (ITLB) entries and 64 unified TLB (UTLB) entries.
UTLB copies are stored in the ITLB by hardware. A paging system is used for address translation,
with support for four page sizes (1, 4, and 64 kbytes, and 1 Mbyte). It is possible to set the virtual
address space access right and implement storage protection independently for privileged mode
and user mode.
3.1.2
Role of the MMU
The MMU was conceived as a means of making efficient use of physical memory. As shown in
figure 3.1, when a process is smaller in size than the physical memory, the entire process can be
mapped onto physical memory, but if the process increases in size to the point where it does not fit
into physical memory, it becomes necessary to divide the process into smaller parts, and map the
parts requiring execution onto physical memory on an ad hoc basis ((1)). Having this mapping
onto physical memory executed consciously by the process itself imposes a heavy burden on the
process. The virtual memory system was devised as a means of handling all physical memory
mapping to reduce this burden ((2)). With a virtual memory system, the size of the available
virtual memory is much larger than the actual physical memory, and processes are mapped onto
this virtual memory. Thus processes only have to consider their operation in virtual memory, and
mapping from virtual memory to physical memory is handled by the MMU. The MMU is
normally managed by the OS, and physical memory switching is carried out so as to enable the
virtual memory required by a task to be mapped smoothly onto physical memory. Physical
memory switching is performed via secondary storage, etc.
The virtual memory system that came into being in this way works to best effect in a time sharing
system (TSS) that allows a number of processes to run simultaneously ((3)). Running a number of
processes in a TSS did not increase efficiency since each process had to take account of physical
memory mapping. Efficiency is improved and the load on each process reduced by the use of a
virtual memory system ((4)). In this system, virtual memory is allocated to each process. The task
of the MMU is to map a number of virtual memory areas onto physical memory in an efficient
manner. It is also provided with memory protection functions to prevent a process from
inadvertently accessing another process’s physical memory.
Rev. 6.0, 07/02, page 57 of 986
When address translation from virtual memory to physical memory is performed using the MMU,
it may happen that the translation information has not been recorded in the MMU, or the virtual
memory of a different process is accessed by mistake. In such cases, the MMU will generate an
exception, change the physical memory mapping, and record the new address translation
information.
Although the functions of the MMU could be implemented by software alone, having address
translation performed by software each time a process accessed physical memory would be very
inefficient. For this reason, a buffer for address translation (the translation lookaside buffer: TLB)
is provided in hardware, and frequently used address translation information is placed here. The
TLB can be described as a cache for address translation information. However, unlike a cache, if
address translation fails—that is, if an exception occurs—switching of the address translation
information is normally performed by software. Thus memory management can be performed in a
flexible manner by software.
There are two methods by which the MMU can perform mapping from virtual memory to physical
memory: the paging method, using fixed-length address translation, and the segment method,
using variable-length address translation. With the paging method, the unit of translation is a
fixed-size address space called a page (usually from 1 to 64 kbytes in size).
In the following descriptions, the address space in virtual memory in the SH7750 Series is referred
to as virtual address space, and the address space in physical memory as physical address space.
Rev. 6.0, 07/02, page 58 of 986
Physical
memory
Process 1
Physical
memory
Process 1
Virtual
memory MMU Physical
memory
Process 1
(1)
Process 1
Physical
memory
(2)
Process 1
Virtual
memory
,
,, ,,,,
MMU Physical
memory
Process 2
Process 2
,,,,,,,,,,
,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,
Process 3
Process 3
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,
,,,,,,
,,, ,,,,,,
(3)
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,
,,,
,,,,,,,,,,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,,,,,,,
(4)
Figure 3.1 Role of the MMU
Rev. 6.0, 07/02, page 59 of 986
3.1.3
Register Configuration
The MMU registers are shown in table 3.1.
Table 3.1
MMU Registers
Abbreviation
R/W
Initial
1
Value*
P4
2
Address*
Page table entry high
register
PTEH
R/W
Undefined
H'FF00 0000 H'1F00 0000 32
Page table entry low
register
PTEL
R/W
Undefined
H'FF00 0004 H'1F00 0004 32
Page table entry
assistance register
PTEA
R/W
Undefined
H'FF00 0034 H'1F00 0034 32
Translation table base
register
TTB
R/W
Undefined
H'FF00 0008 H'1F00 0008 32
TLB exception address
register
TEA
R/W
Undefined
H'FF00 000C H'1F00 000C 32
MMU control register
MMUCR
R/W
H'0000 0000 H'FF00 0010 H'1F00 0010 32
Name
Area 7
2
Address*
Access
Size
Notes: *1 The initial value is the value after a power-on reset or manual reset.
*2 This is the address when using the virtual/physical address space P4 area. When
making an access from physical address space area 7 using the TLB, the upper 3 bits
of the address are ignored.
3.1.4
Caution
Operation is not guaranteed if an area designated as a reserved area in this manual is accessed.
Rev. 6.0, 07/02, page 60 of 986
3.2
Register Descriptions
There are six MMU-related registers.
1. PTEH
31
10 9
VPN
8
7
0
— —
ASID
2. PTEL
31 30 29 28
10 9
PPN
— — —
8
7
— V SZ
6
5
PR
4
3
2
1
0
SZ C D SH WT
3. PTEA
31
4
3
2
TC
0
SA
4. TTB
31
0
TTB
5. TEA
31
Virtual address at which MMU exception or address error occurred
6. MMUCR
31
26 25 24 23
LRUI
— —
18 17 16 15
URB
— —
10 9
URC
8
7
6
5
4
3
2
1
0
SV — — — — — TI — AT
SQMD
— indicates a reserved bit: the write value must be 0, and a read will return 0.
Figure 3.2 MMU-Related Registers
Rev. 6.0, 07/02, page 61 of 986
1. Page table entry high register (PTEH): Longword access to PTEH can be performed from
H'FF00 0000 in the P4 area and H'1F00 0000 in area 7. PTEH consists of the virtual page number
(VPN) and address space identifier (ASID). When an MMU exception or address error exception
occurs, the VPN of the virtual address at which the exception occurred is set in the VPN field by
hardware. VPN varies according to the page size, but the VPN set by hardware when an exception
occurs consists of the upper 22 bits of the virtual address which caused the exception. VPN setting
can also be carried out by software. The number of the currently executing process is set in the
ASID field by software. ASID is not updated by hardware. VPN and ASID are recorded in the
UTLB by means of the LDLTB instruction.
A branch to the P0, P3, or U0 area which uses the updated ASID after the ASID field in PTEH is
rewritten should be made at least 6 instructions after the PTEH update instruction.
2. Page table entry low register (PTEL): Longword access to PTEL can be performed from
H'FF00 0004 in the P4 area and H'1F00 0004 in area 7. PTEL is used to hold the physical page
number and page management information to be recorded in the UTLB by means of the LDTLB
instruction. The contents of this register are not changed unless a software directive is issued.
3. Page table entry assistance register (PTEA): Longword access to PTEA can be performed
from H'FF00 0034 in the P4 area and H'1F00 0034 in area 7. PTEL is used to store assistance bits
for PCMCIA access to the UTLB by means of the LDTLB instruction. When performing access
from the CPU in the SH7750S and SH7750R with MMUCR.AT = 0, access is always performed
using the values of the SA and TC bits in this register. In the SH7750, it is not possible to access a
PCMCIA interface area with MMUCR.AT = 0. In the SH7750 Series, access to a PCMCIA
interface area by the DMAC is always performed using the DMAC’s CHCRn.SSAn,
CHCRn.DSAn, CHCRn.STC, and CHCRn.DTC values. The contents of this register are not
changed unless a software directive is issued.
4. Translation table base register (TTB): Longword access to TTB can be performed from
H'FF00 0008 in the P4 area and H'1F00 0008 in area 7. TTB is used, for example, to hold the base
address of the currently used page table. The contents of TTB are not changed unless a software
directive is issued. This register can be freely used by software.
5. TLB exception address register (TEA): Longword access to TEA can be performed from
H'FF00 000C in the P4 area and H'1F00 000C in area 7. After an MMU exception or address error
exception occurs, the virtual address at which the exception occurred is set in TEA by hardware.
The contents of this register can be changed by software.
6. MMU control register (MMUCR): MMUCR contains the following bits:
LRUI: Least recently used ITLB
URB: UTLB replace boundary
URC: UTLB replace counter
SQMD: Store queue mode bit
SV:
Single virtual mode bit
Rev. 6.0, 07/02, page 62 of 986
TI:
AT:
TLB invalidate
Address translation bit
Longword access to MMUCR can be performed from H'FF00 0010 in the P4 area and H'1F00
0010 in area 7. The individual bits perform MMU settings as shown below. Therefore, MMUCR
rewriting should be performed by a program in the P1 or P2 area. After MMUCR is updated, an
instruction that performs data access to the P0, P3, U0, or store queue area should be located at
least four instructions after the MMUCR update instruction. Also, a branch instruction to the P0,
P3, or U0 area should be located at least eight instructions after the MMUCR update instruction.
MMUCR contents can be changed by software. The LRUI bits and URC bits may also be updated
by hardware.
• LRUI: Least recently used ITLB. The LRU (least recently used) method is used to decide the
ITLB entry to be replaced in the event of an ITLB miss. The entry to be purged from the ITLB
can be confirmed using the LRUI bits. LRUI is updated by means of the algorithm shown
below. A dash in this table means that updating is not performed.
LRUI
[5]
[4]
[3]
[2]
[1]
[0]
When ITLB entry 0 is used
0
0
0
—
—
—
When ITLB entry 1 is used
1
—
—
0
0
—
When ITLB entry 2 is used
—
1
—
1
—
0
When ITLB entry 3 is used
—
—
1
—
1
1
Other than the above
—
—
—
—
—
—
When the LRUI bit settings are as shown below, the corresponding ITLB entry is updated by
an ITLB miss. An asterisk in this table means “don’t care”.
LRUI
[5]
[4]
[3]
[2]
[1]
[0]
ITLB entry 0 is updated
1
1
1
*
*
*
ITLB entry 1 is updated
0
*
*
1
1
*
ITLB entry 2 is updated
*
0
*
0
*
1
ITLB entry 3 is updated
*
*
0
*
0
0
Other than the above
Setting prohibited
Ensure that values for which “Setting prohibited” is indicated in the above table are not set at
the discretion of software. After a power-on or manual reset the LRUI bits are initialized to 0,
and therefore a prohibited setting is never made by a hardware update.
Rev. 6.0, 07/02, page 63 of 986
• URB: UTLB replace boundary. Bits that indicate the UTLB entry boundary at which
replacement is to be performed. Valid only when URB > 0.
• URC: UTLB replace counter. Random counter for indicating the UTLB entry for which
replacement is to be performed with an LDTLB instruction. URC is incremented each time the
UTLB is accessed. When URB > 0, URC is reset to 0 when the condition URC = URB occurs.
Also note that, if a value is written to URC by software which results in the condition URC >
URB, incrementing is first performed in excess of URB until URC = H'3F. URC is not
incremented by an LDTLB instruction.
• SQMD: Store queue mode bit. Specifies the right of access to the store queues.
0: User/privileged access possible
1: Privileged access possible (address error exception in case of user access)
• SV: Single virtual mode bit. Bit that switches between single virtual memory mode and
multiple virtual memory mode.
0: Multiple virtual memory mode
1: Single virtual memory mode
When this bit is changed, ensure that 1 is also written to the TI bit.
• TI: TLB invalidation bit. Writing 1 to this bit invalidates (clears to 0) all valid UTLB/ITLB
bits. This bit always returns 0 when read.
• AT: Address translation enable bit. Specifies MMU enabling or disabling.
0: MMU disabled
1: MMU enabled
MMU exceptions are not generated when the AT bit is 0. In the case of software that does not
use the MMU, therefore, the AT bit should be cleared to 0.
3.3
Address Space
3.3.1
Physical Address Space
The SH7750 Series supports a 32-bit physical address space, and can access a 4-Gbyte address
space. When the MMUCR.AT bit is cleared to 0 and the MMU is disabled, the address space is
this physical address space. The physical address space is divided into a number of areas, as
shown in figure 3.3. The physical address space is permanently mapped onto 29-bit external
memory space; this correspondence can be implemented by ignoring the upper 3 bits of the
physical address space addresses. In privileged mode, the 4-Gbyte space from the P0 area to the
P4 area can be accessed. In user mode, a 2-Gbyte space in the U0 area can be accessed. Accessing
the P1 to P4 areas (except the store queue area) in user mode will cause an address error.
Rev. 6.0, 07/02, page 64 of 986
External
memory space
H'0000 0000
P0 area
Cacheable
H'8000 0000
H'A000 0000
Area 0
Area 1
Area 2
Area 3
Area 4
Area 5
Area 6
Area 7
H'0000 0000
U0 area
Cacheable
H'8000 0000
P1 area
Cacheable
P2 area
Non-cacheable
Address error
H'C000 0000
P3 area
Cacheable
H'E000 0000
P4 area
Non-cacheable
Store queue area
Privileged mode
User mode
H'FFFF FFFF
Address error
H'E000 0000
H'E400 0000
H'FFFF FFFF
Figure 3.3 Physical Address Space (MMUCR.AT = 0)
In the SH7750, the CPU cannot access a PCMCIA interface area. When performing access from
the CPU to a PCMCIA interface area in the SH7750S or the SH7750R, access is always
performed using the values of the SA and TC bits set in the PTEA register.
The PCMCIA interface area is always accessed by the DMAC with the values of CHCRn.SSAn,
CHCRn.DSAn, CHCRn.STC, and CHCRn.DTC in the DMAC. For details, see section 14, Direct
Memory Access Controller (DMAC).
P0, P1, P3, U0 Areas: The P0, P1, P3, and U0 areas can be accessed using the cache. Whether or
not the cache is used is determined by the cache control register (CCR). When the cache is used,
with the exception of the P1 area, switching between the copy-back method and the write-through
method for write accesses is specified by the CCR.WT bit. For the P1 area, switching is specified
by the CCR.CB bit. Zeroizing the upper 3 bits of an address in these areas gives the corresponding
external memory space address. However, since area 7 in the external memory space is a reserved
area, a reserved area also appears in these areas.
P2 Area: The P2 area cannot be accessed using the cache. In the P2 area, zeroizing the upper 3
bits of an address gives the corresponding external memory space address. However, since area 7
in the external memory space is a reserved area, a reserved area also appears in this area.
Rev. 6.0, 07/02, page 65 of 986
P4 Area: The P4 area is mapped onto SH7750 Series on-chip I/O channels. This area cannot be
accessed using the cache. The P4 area is shown in detail in figure 3.4.
H'E000 0000
Store queue
H'E400 0000
Reserved area
H'F000 0000
H'F100 0000
H'F200 0000
H'F300 0000
H'F400 0000
H'F500 0000
H'F600 0000
H'F700 0000
Instruction cache address array
Instruction cache data array
Instruction TLB address array
Instruction TLB data arrays 1 and 2
Operand cache address array
Operand cache data array
Unified TLB address array
Unified TLB data arrays 1 and 2
H'F800 0000
Reserved area
H'FC00 0000
Control register area
Figure 3.4 P4 Area
The area from H'E000 0000 to H'E3FF FFFF comprises addresses for accessing the store queues
(SQs). When the MMU is disabled (MMUCR.AT = 0), the SQ access right is specified by the
MMUCR.SQMD bit. For details, see section 4.7, Store Queues.
The area from H'F000 0000 to H'F0FF FFFF is used for direct access to the instruction cache
address array. For details, see section 4.5.1, IC Address Array.
The area from H'F100 0000 to H'F1FF FFFF is used for direct access to the instruction cache data
array. For details, see section 4.5.2, IC Data Array.
The area from H'F200 0000 to H'F2FF FFFF is used for direct access to the instruction TLB
address array. For details, see section 3.7.1, ITLB Address Array.
Rev. 6.0, 07/02, page 66 of 986
The area from H'F300 0000 to H'F3FF FFFF is used for direct access to instruction TLB data
arrays 1 and 2. For details, see sections 3.7.2, ITLB Data Array 1, and 3.7.3, ITLB Data Array 2.
The area from H'F400 0000 to H'F4FF FFFF is used for direct access to the operand cache address
array. For details, see section 4.5.3, OC Address Array.
The area from H'F500 0000 to H'F5FF FFFF is used for direct access to the operand cache data
array. For details, see section 4.5.4, OC Data Array.
The area from H'F600 0000 to H'F6FF FFFF is used for direct access to the unified TLB address
array. For details, see section 3.7.4, UTLB Address Array.
The area from H'F700 0000 to H'F7FF FFFF is used for direct access to unified TLB data arrays 1
and 2. For details, see sections 3.7.5, UTLB Data Array 1, and 3.7.6, UTLB Data Array 2.
The area from H'FF00 0000 to H'FFFF FFFF is the on-chip peripheral module control register
area. For details, see appendix A, Address List.
3.3.2
External Memory Space
The SH7750 Series supports a 29-bit external memory space. The external memory space is
divided into eight areas as shown in figure 3.5. Areas 0 to 6 relate to memory, such as SRAM,
synchronous DRAM, DRAM, and PCMCIA. Area 7 is a reserved area. For details, see section 13,
Bus State Controller (BSC).
H'0000 0000
H'0400 0000
H'0800 0000
H'0C00 0000
H'1000 0000
H'1400 0000
H'1800 0000
H'1C00 0000
H'1FFF FFFF
Area 0
Area 1
Area 2
Area 3
Area 4
Area 5
Area 6
Area 7 (reserved area)
Figure 3.5 External Memory Space
Rev. 6.0, 07/02, page 67 of 986
3.3.3
Virtual Address Space
Setting the MMUCR.AT bit to 1 enables the P0, P3, and U0 areas of the physical memory space in
the SH7750 Series to be mapped onto any external memory space in 1-, 4-, or 64-kbyte, or 1Mbyte, page units. By using an 8-bit address space identifier, the P0, U0, P3, and store queue
areas can be increased to a maximum of 256. This is called the virtual memory space. Mapping
from virtual memory space to 29-bit external memory space is carried out using the TLB. Only
when area 7 in external memory space is accessed using virtual memory space, addresses H'1C00
0000 to H'1FFF FFFF of area 7 are not designated as a reserved area, but are equivalent to the P4
area control register area in the physical memory space. Virtual memory space is illustrated in
figure 3.6.
256
External
memory space
256
Area 0
Area 1
Area 2
P0 area
Cacheable
Address translation possible
Area 3
Area 4
Area 5
U0 area
Cacheable
Address translation possible
Area 6
Area 7
P1 area
Cacheable
Address translation not possible
P2 area
Non-cacheable
Address translation not possible
Address error
P3 area
Cacheable
Address translation possible
P4 area
Non-cacheable
Address translation not possible
Store queue area
Privileged mode
User mode
Address error
Figure 3.6 Virtual Address Space (MMUCR.AT = 1)
In the state of cache enabling, when the areas of P0, P3, and U0 are mapped onto a PCMCIA
interface area by means of the TLB, it is necessary either to specify 1 for the WT bit or to specify
0 for the C bit on that page. At that time, the regions are accessed by the values of SA and TC set
in page units of the TLB.
Rev. 6.0, 07/02, page 68 of 986
Here, access to the PCMCIA interface area by accessing an area of P1, P2, or P4 from the CPU is
disabled.
In addition, the PCMCIA interface area is always accessed by the DMAC with the values of
CHCRn.SSAn, CHCRn.DSAn, CHCRn.STC, and CHCRn.DTC in the DMAC. For details, see
section 14, Direct Memory Access Controller (DMAC).
P0, P3, U0 Areas: The P0 area (excluding addresses H'7C00 0000 to H'7FFF FFFF), P3 area, and
U0 area (excluding addresses H'7C00 0000 to H'7FFF FFFF) allow access using the cache and
address translation using the TLB. These areas can be mapped onto any external memory space in
1-, 4-, or 64-kbyte, or 1-Mbyte, page units. When CCR is in the cache-enabled state and the TLB
enable bit (C bit) is 1, accesses can be performed using the cache. In write accesses to the cache,
switching between the copy-back method and the write-through method is indicated by the TLB
write-through bit (WT bit), and is specified in page units.
Only when the P0, P3, and U0 areas are mapped onto external memory space by means of the
TLB, addresses H'1C00 0000 to H'1FFF FFFF of area 7 in external memory space are allocated to
the control register area. This enables on-chip peripheral module control registers to be accessed
from the U0 area in user mode. In this case, the C bit for the corresponding page must be cleared
to 0.
P1, P2, P4 Areas: Address translation using the TLB cannot be performed for the P1, P2, or P4
area (except for the store queue area). Accesses to these areas are the same as for physical memory
space. The store queue area can be mapped onto any external memory space by the MMU.
However, operation in the case of an exception differs from that for normal P0, U0, and P3 spaces.
For details, see section 4.7, Store Queues.
3.3.4
On-Chip RAM Space
In the SH7750 Series, half of the instruction cache can be used as on-chip RAM. This can be done
by changing the CCR settings.
When the operand cache is used as on-chip RAM (CCR.ORA = 1), P0 area addresses H'7C00
0000 to H'7FFF FFFF are an on-chip RAM area. Data accesses (byte/word/longword/quadword)
can be used in this area. This area can only be used in RAM mode.
3.3.5
Address Translation
When the MMU is used, the virtual address space is divided into units called pages, and
translation to physical addresses is carried out in these page units. The address translation table in
external memory contains the physical addresses corresponding to virtual addresses and additional
information such as memory protection codes. Fast address translation is achieved by caching the
contents of the address translation table located in external memory into the TLB. In the SH7750
Series, basically, the ITLB is used for instruction accesses and the UTLB for data accesses. In the
Rev. 6.0, 07/02, page 69 of 986
event of an access to an area other than the P4 area, the accessed virtual address is translated to a
physical address. If the virtual address belongs to the P1 or P2 area, the physical address is
uniquely determined without accessing the TLB. If the virtual address belongs to the P0, U0, or P3
area, the TLB is searched using the virtual address, and if the virtual address is recorded in the
TLB, a TLB hit is made and the corresponding physical address is read from the TLB. If the
accessed virtual address is not recorded in the TLB, a TLB miss exception is generated and
processing switches to the TLB miss exception routine. In the TLB miss exception routine, the
address translation table in external memory is searched, and the corresponding physical address
and page management information are recorded in the TLB. After the return from the exception
handling routine, the instruction which caused the TLB miss exception is re-executed.
3.3.6
Single Virtual Memory Mode and Multiple Virtual Memory Mode
There are two virtual memory systems, single virtual memory and multiple virtual memory, either
of which can be selected with the MMUCR.SV bit. In the single virtual memory system, a number
of processes run simultaneously, using virtual address space on an exclusive basis, and the
physical address corresponding to a particular virtual address is uniquely determined. In the
multiple virtual memory system, a number of processes run while sharing the virtual address
space, and a particular virtual address may be translated into different physical addresses
depending on the process. The only difference between the single virtual memory and multiple
virtual memory systems in terms of operation is in the TLB address comparison method (see
section 3.4.3, Address Translation Method).
3.3.7
Address Space Identifier (ASID)
In multiple virtual memory mode, the 8-bit address space identifier (ASID) is used to distinguish
between processes running simultaneously while sharing the virtual address space. Software can
set the ASID of the currently executing process in PTEH in the MMU. The TLB does not have to
be purged when processes are switched by means of ASID.
In single virtual memory mode, ASID is used to provide memory protection for processes running
simultaneously while using the virtual memory space on an exclusive basis.
Note: In single virtual memory mode, entries with the same virtual page number (VPN) but
different ASIDs cannot be set in the TLB simultaneously.
Rev. 6.0, 07/02, page 70 of 986
3.4
TLB Functions
3.4.1
Unified TLB (UTLB) Configuration
The unified TLB (UTLB) is so called because of its use for the following two purposes:
1. To translate a virtual address to a physical address in a data access
2. As a table of address translation information to be recorded in the instruction TLB in the event
of an ITLB miss
Information in the address translation table located in external memory is cached into the UTLB.
The address translation table contains virtual page numbers and address space identifiers, and
corresponding physical page numbers and page management information. Figure 3.7 shows the
overall configuration of the UTLB. The UTLB consists of 64 fully-associative type entries. Figure
3.8 shows the relationship between the address format and page size.
Entry 0
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Entry 1
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Entry 2
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Entry 63
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Figure 3.7 UTLB Configuration
Rev. 6.0, 07/02, page 71 of 986
• 1-kbyte page
Virtual address
10 9
31
VPN
0
Physical address
10 9
28
PPN
Offset
0
Offset
• 4-kbyte page
Virtual address
12 11
31
VPN
0
Physical address
12 11
28
PPN
Offset
0
Offset
• 64-kbyte page
Virtual address
16 15
31
VPN
0
Physical address
16 15
28
PPN
Offset
0
Offset
• 1-Mbyte page
Virtual address
20 19
31
VPN
0
Offset
Physical address
20 19
28
PPN
0
Offset
Figure 3.8 Relationship between Page Size and Address Format
• VPN: Virtual page number
For 1-kbyte page: upper 22 bits of virtual address
For 4-kbyte page: upper 20 bits of virtual address
For 64-kbyte page: upper 16 bits of virtual address
For 1-Mbyte page: upper 12 bits of virtual address
• ASID: Address space identifier
Indicates the process that can access a virtual page.
In single virtual memory mode and user mode, or in multiple virtual memory mode, if the SH
bit is 0, this identifier is compared with the ASID in PTEH when address comparison is
performed.
• SH: Share status bit
When 0, pages are not shared by processes.
When 1, pages are shared by processes.
Rev. 6.0, 07/02, page 72 of 986
• SZ: Page size bits
Specify the page size.
00: 1-kbyte page
01: 4-kbyte page
10: 64-kbyte page
11: 1-Mbyte page
• V: Validity bit
Indicates whether the entry is valid.
0: Invalid
1: Valid
Cleared to 0 by a power-on reset.
Not affected by a manual reset.
• PPN: Physical page number
Upper 22 bits of the physical address.
With a 1-kbyte page, PPN bits [28:10] are valid.
With a 4-kbyte page, PPN bits [28:12] are valid.
With a 64-kbyte page, PPN bits [28:16] are valid.
With a 1-Mbyte page, PPN bits [28:20] are valid.
The synonym problem must be taken into account when setting the PPN (see section 3.5.5,
Avoiding Synonym Problems).
• PR: Protection key data
2-bit data expressing the page access right as a code.
00: Can be read only, in privileged mode
01: Can be read and written in privileged mode
10: Can be read only, in privileged or user mode
11: Can be read and written in privileged mode or user mode
• C: Cacheability bit
Indicates whether a page is cacheable.
0: Not cacheable
1: Cacheable
When control register space is mapped, this bit must be cleared to 0.
When performing PCMCIA space mapping in the cache enabled state, either clear this bit to 0
or set the WT bit to 1.
Rev. 6.0, 07/02, page 73 of 986
• D: Dirty bit
Indicates whether a write has been performed to a page.
0: Write has not been performed
1: Write has been performed
• WT: Write-through bit
Specifies the cache write mode.
0: Copy-back mode
1: Write-through mode
When performing PCMCIA space mapping in the cache enabled state, either set this bit to 1 or
clear the C bit to 0.
• SA: Space attribute bits
Valid only when the page is mapped onto PCMCIA connected to area 5 or 6.
000: Undefined
001: Variable-size I/O space (base size according to ,2,649 signal)
010: 8-bit I/O space
011: 16-bit I/O space
100: 8-bit common memory space
101: 16-bit common memory space
110: 8-bit attribute memory space
111: 16-bit attribute memory space
• TC: Timing control bit
Used to select wait control register bits in the bus control unit for areas 5 and 6.
0: WCR2 (A5W2–A5W0) and PCR (A5PCW1–A5PCW0, A5TED2–A5TED0, A5TEH2–
A5TEH0) are used
1: WCR2 (A6W2–A6W0) and PCR (A6PCW1–A6PCW0, A6TED2–A6TED0, A6TEH2–
A6TEH0) are used
Rev. 6.0, 07/02, page 74 of 986
3.4.2
Instruction TLB (ITLB) Configuration
The ITLB is used to translate a virtual address to a physical address in an instruction access.
Information in the address translation table located in the UTLB is cached into the ITLB. Figure
3.9 shows the overall configuration of the ITLB. The ITLB consists of 4 fully-associative type
entries. The address translation information is almost the same as that in the UTLB, but with the
following differences:
1. D and WT bits are not supported.
2. There is only one PR bit, corresponding to the upper of the PR bits in the UTLB.
Entry 0 ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR SA [2:0] TC
Entry 1 ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR SA [2:0] TC
Entry 2 ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR SA [2:0] TC
Entry 3 ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR SA [2:0] TC
Figure 3.9 ITLB Configuration
3.4.3
Address Translation Method
Figures 3.10 and 3.11 show flowcharts of memory accesses using the UTLB and ITLB.
Rev. 6.0, 07/02, page 75 of 986
Data access to virtual address (VA)
VA is
in P4 area
VA is
in P2 area
On-chip I/O access
0
VA is
in P1 area
VA is in P0, U0,
or P3 area
No
CCR.OCE?
MMUCR.AT = 1
1
0
Yes
CCR.CB?
CCR.WT?
0
1
1
SH = 0
and (MMUCR.SV = 0 or
SR.MD = 0)
No
Yes
No
VPNs match
and ASIDs match and
V=1
No
VPNs match
and V = 1
Yes
Yes
No
Only one
entry matches
Data TLB miss
exception
Yes
SR.MD?
0 (User)
1 (Privileged)
Memory access
PR?
00 or
01 W
Data TLB multiple
hit exception
11
10
R/W?
R/W?
R
R
01 or 11
W
W
D?
0
Data TLB protection
violation exception
1
00 or 10
R/W?
R/W?
R
R
W
Data TLB protection
violation exception
Initial page write
exception
C=1
and CCR.OCE = 1
No
Yes
Cache access
in copy-back mode
0
WT?
1
Cache access
in write-through mode
Memory access
(Non-cacheable)
Figure 3.10 Flowchart of Memory Access Using UTLB
Rev. 6.0, 07/02, page 76 of 986
Instruction access to virtual address (VA)
VA is
in P4 area
Access prohibited
VA is
in P2 area
VA is
in P1 area
VA is in P0, U0,
or P3 area
No
0
MMUCR.AT = 1
CCR.ICE?
1
Yes
No
SH = 0
and (MMUCR.SV = 0 or
SR.MD = 0)
Yes
No
No
VPNs match
and V = 1
VPNs match
and ASIDs match and
V=1
Yes
Only one
entry matches
Hardware ITLB
miss handling
Search UTLB
Match?
Yes
Yes
No
Yes
Record in ITLB
No
SR.MD?
Instruction TLB
miss exception
0 (User)
1 (Privileged)
0
PR?
Instruction TLB
multiple hit exception
1
Instruction TLB protection
violation exception
C=1
and CCR.ICE = 1
No
Yes
Cache access
Memory access
(Non-cacheable)
Figure 3.11 Flowchart of Memory Access Using ITLB
Rev. 6.0, 07/02, page 77 of 986
3.5
MMU Functions
3.5.1
MMU Hardware Management
The SH7750 Series supports the following MMU functions.
1. The MMU decodes the virtual address to be accessed by software, and performs address
translation by controlling the UTLB/ITLB in accordance with the MMUCR settings.
2. The MMU determines the cache access status on the basis of the page management
information read during address translation (C, WT, SA, and TC bits).
3. If address translation cannot be performed normally in a data access or instruction access, the
MMU notifies software by means of an MMU exception.
4. If address translation information is not recorded in the ITLB in an instruction access, the
MMU searches the UTLB, and if the necessary address translation information is recorded in
the UTLB, the MMU copies this information into the ITLB in accordance with
MMUCR.LRUI.
3.5.2
MMU Software Management
Software processing for the MMU consists of the following:
1. Setting of MMU-related registers. Some registers are also partially updated by hardware
automatically.
2. Recording, deletion, and reading of TLB entries. There are two methods of recording UTLB
entries: by using the LDTLB instruction, or by writing directly to the memory-mapped UTLB.
ITLB entries can only be recorded by writing directly to the memory-mapped ITLB. For
deleting or reading UTLB/ITLB entries, it is possible to access the memory-mapped
UTLB/ITLB.
3. MMU exception handling. When an MMU exception occurs, processing is performed based on
information set by hardware.
3.5.3
MMU Instruction (LDTLB)
A TLB load instruction (LDTLB) is provided for recording UTLB entries. When an LDTLB
instruction is issued, the SH7750 Series copies the contents of PTEH, PTEL, and PTEA to the
UTLB entry indicated by MMUCR.URC. ITLB entries are not updated by the LDTLB instruction,
and therefore address translation information purged from the UTLB entry may still remain in the
ITLB entry. As the LDTLB instruction changes address translation information, ensure that it is
issued by a program in the P1 or P2 area. The operation of the LDTLB instruction is shown in
figure 3.12.
Rev. 6.0, 07/02, page 78 of 986
MMUCR
31
26 25 24 23
LRUI
—
18 17 16 15
URB
—
10 9 8 7
URC
SV
3 2 1 0
—
TI — AT
SQMD
Entry specification
PTEL
31
PTEH
31
10 9 8 7
VPN
—
10 9 8 7 6 5 4 3 2 1 0
29 28
—
PPN
— V SZ PR SZ C D SHWT
0
PTEA
ASID
4 3 2
31
—
TC
0
SA
Write
Entry 0
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Entry 1
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Entry 2
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
Entry 63
ASID [7:0] VPN [31:10] V
PPN [28:10] SZ [1:0] SH C PR [1:0] D WT SA [2:0] TC
UTLB
Figure 3.12 Operation of LDTLB Instruction
3.5.4
Hardware ITLB Miss Handling
In an instruction access, the SH7750 Series searches the ITLB. If it cannot find the necessary
address translation information (i.e. in the event of an ITLB miss), the UTLB is searched by
hardware, and if the necessary address translation information is present, it is recorded in the
ITLB. This procedure is known as hardware ITLB miss handling. If the necessary address
translation information is not found in the UTLB search, an instruction TLB miss exception is
generated and processing passes to software.
Rev. 6.0, 07/02, page 79 of 986
3.5.5
Avoiding Synonym Problems
When 1- or 4-kbyte pages are recorded in TLB entries, a synonym problem may arise. The
problem is that, when a number of virtual addresses are mapped onto a single physical address, the
same physical address data is recorded in a number of cache entries, and it becomes impossible to
guarantee data integrity. This problem does not occur with the instruction TLB or instruction
cache . In the SH7750 Series, entry specification is performed using bits [13:5] of the virtual
address in order to achieve fast operand cache operation. However, bits [13:10] of the virtual
address in the case of a 1-kbyte page, and bits [13:12] of the virtual address in the case of a 4kbyte page, are subject to address translation. As a result, bits [13:10] of the physical address after
translation may differ from bits [13:10] of the virtual address.
Consequently, the following restrictions apply to the recording of address translation information
in UTLB entries.
1. When address translation information whereby a number of 1-kbyte page UTLB entries are
translated into the same physical address is recorded in the UTLB, ensure that the VPN [13:10]
values are the same.
2. When address translation information whereby a number of 4-kbyte page UTLB entries are
translated into the same physical address is recorded in the UTLB, ensure that the VPN [13:12]
values are the same.
3. Do not use 1-kbyte page UTLB entry physical addresses with UTLB entries of a different page
size.
4. Do not use 4-kbyte page UTLB entry physical addresses with UTLB entries of a different page
size.
The above restrictions apply only when performing accesses using the cache. When cache index
mode is used, VPN [25] is used for the entry address instead of VPN [13], and therefore the above
restrictions apply to VPN [25].
Note: When multiple items of address translation information use the same physical memory to
provide for future SuperH RISC engine family expansion, ensure that the VPN [20:10]
values are the same. Also, do not use the same physical address for address translation
information of different page sizes.
Rev. 6.0, 07/02, page 80 of 986
3.6
MMU Exceptions
There are seven MMU exceptions: the instruction TLB multiple hit exception, instruction TLB
miss exception, instruction TLB protection violation exception, data TLB multiple hit exception,
data TLB miss exception, data TLB protection violation exception, and initial page write
exception. Refer to figures 3.10 and 3.11 for the conditions under which each of these exceptions
occurs.
3.6.1
Instruction TLB Multiple Hit Exception
An instruction TLB multiple hit exception occurs when more than one ITLB entry matches the
virtual address to which an instruction access has been made. If multiple hits occur when the
UTLB is searched by hardware in hardware ITLB miss handling, a data TLB multiple hit
exception will result.
When an instruction TLB multiple hit exception occurs a reset is executed, and cache coherency is
not guaranteed.
Hardware Processing: In the event of an instruction TLB multiple hit exception, hardware
carries out the following processing:
1. Sets the virtual address at which the exception occurred in TEA.
2. Sets exception code H'140 in EXPEVT.
3. Branches to the reset handling routine (H'A000 0000).
Software Processing (Reset Routine): The ITLB entries which caused the multiple hit exception
are checked in the reset handling routine. This exception is intended for use in program
debugging, and should not normally be generated.
Rev. 6.0, 07/02, page 81 of 986
3.6.2
Instruction TLB Miss Exception
An instruction TLB miss exception occurs when address translation information for the virtual
address to which an instruction access is made is not found in the UTLB entries by the hardware
ITLB miss handling procedure. The instruction TLB miss exception processing carried out by
hardware and software is shown below. This is the same as the processing for a data TLB miss
exception.
Hardware Processing: In the event of an instruction TLB miss exception, hardware carries out
the following processing:
1. Sets the VPN of the virtual address at which the exception occurred in PTEH.
2. Sets the virtual address at which the exception occurred in TEA.
3. Sets exception code H'040 in EXPEVT.
4. Sets the PC value indicating the address of the instruction at which the exception occurred in
SPC. If the exception occurred at a delay slot, sets the PC value indicating the address of the
delayed branch instruction in SPC.
5. Sets the SR contents at the time of the exception in SSR. The R15 contents at this time are
saved in SGR.
6. Sets the MD bit in SR to 1, and switches to privileged mode.
7. Sets the BL bit in SR to 1, and masks subsequent exception requests.
8. Sets the RB bit in SR to 1.
9. Branches to the address obtained by adding offset H'0000 0400 to the contents of VBR, and
starts the instruction TLB miss exception handling routine.
Software Processing (Instruction TLB Miss Exception Handling Routine): Software is
responsible for searching the external memory page table and assigning the necessary page table
entry. Software should carry out the following processing in order to find and assign the necessary
page table entry.
1. Write to PTEL the values of the PPN, PR, SZ, C, D, SH, V, and WT bits in the page table
entry recorded in the external memory address translation table. If necessary, the values of the
SA and TC bits should be written to PTEA.
2. When the entry to be replaced in entry replacement is specified by software, write that value to
URC in the MMUCR register. If URC is greater than URB at this time, the value should be
changed to an appropriate value after issuing an LDTLB instruction.
3. Execute the LDTLB instruction and write the contents of PTEH, PTEL, and PTEA to the TLB.
4. Finally, execute the exception handling return instruction (RTE), terminate the exception
handling routine, and return control to the normal flow. The RTE instruction should be issued
at least one instruction after the LDTLB instruction.
Rev. 6.0, 07/02, page 82 of 986
3.6.3
Instruction TLB Protection Violation Exception
An instruction TLB protection violation exception occurs when, even though an ITLB entry
contains address translation information matching the virtual address to which an instruction
access is made, the actual access type is not permitted by the access right specified by the PR bit.
The instruction TLB protection violation exception processing carried out by hardware and
software is shown below.
Hardware Processing: In the event of an instruction TLB protection violation exception,
hardware carries out the following processing:
1. Sets the VPN of the virtual address at which the exception occurred in PTEH.
2. Sets the virtual address at which the exception occurred in TEA.
3. Sets exception code H'0A0 in EXPEVT.
4. Sets the PC value indicating the address of the instruction at which the exception occurred in
SPC. If the exception occurred at a delay slot, sets the PC value indicating the address of the
delayed branch instruction in SPC.
5. Sets the SR contents at the time of the exception in SSR. The R15 contents at this time are
saved in SGR.
6. Sets the MD bit in SR to 1, and switches to privileged mode.
7. Sets the BL bit in SR to 1, and masks subsequent exception requests.
8. Sets the RB bit in SR to 1.
9. Branches to the address obtained by adding offset H'0000 0100 to the contents of VBR, and
starts the instruction TLB protection violation exception handling routine.
Software Processing (Instruction TLB Protection Violation Exception Handling Routine):
Resolve the instruction TLB protection violation, execute the exception handling return instruction
(RTE), terminate the exception handling routine, and return control to the normal flow. The RTE
instruction should be issued at least one instruction after the LDTLB instruction.
Rev. 6.0, 07/02, page 83 of 986
3.6.4
Data TLB Multiple Hit Exception
A data TLB multiple hit exception occurs when more than one UTLB entry matches the virtual
address to which a data access has been made. A data TLB multiple hit exception is also generated
if multiple hits occur when the UTLB is searched in hardware ITLB miss handling.
When a data TLB multiple hit exception occurs a reset is executed, and cache coherency is not
guaranteed. The contents of PPN in the UTLB prior to the exception may also be corrupted.
Hardware Processing: In the event of a data TLB multiple hit exception, hardware carries out the
following processing:
1. Sets the virtual address at which the exception occurred in TEA.
2. Sets exception code H'140 in EXPEVT.
3. Branches to the reset handling routine (H'A000 0000).
Software Processing (Reset Routine): The UTLB entries which caused the multiple hit
exception are checked in the reset handling routine. This exception is intended for use in program
debugging, and should not normally be generated.
3.6.5
Data TLB Miss Exception
A data TLB miss exception occurs when address translation information for the virtual address to
which a data access is made is not found in the UTLB entries. The data TLB miss exception
processing carried out by hardware and software is shown below.
Hardware Processing: In the event of a data TLB miss exception, hardware carries out the
following processing:
1. Sets the VPN of the virtual address at which the exception occurred in PTEH.
2. Sets the virtual address at which the exception occurred in TEA.
3. Sets exception code H'040 in the case of a read, or H'060 in the case of a write, in EXPEVT
(OCBP, OCBWB: read; OCBI, MOVCA.L: write).
4. Sets the PC value indicating the address of the instruction at which the exception occurred in
SPC. If the exception occurred at a delay slot, sets the PC value indicating the address of the
delayed branch instruction in SPC.
5. Sets the SR contents at the time of the exception in SSR. The R15 contents at this time are
saved in SGR.
6. Sets the MD bit in SR to 1, and switches to privileged mode.
7. Sets the BL bit in SR to 1, and masks subsequent exception requests.
8. Sets the RB bit in SR to 1.
9. Branches to the address obtained by adding offset H'0000 0400 to the contents of VBR, and
starts the data TLB miss exception handling routine.
Rev. 6.0, 07/02, page 84 of 986
Software Processing (Data TLB Miss Exception Handling Routine): Software is responsible
for searching the external memory page table and assigning the necessary page table entry.
Software should carry out the following processing in order to find and assign the necessary page
table entry.
1. Write to PTEL the values of the PPN, PR, SZ, C, D, SH, V, and WT bits in the page table
entry recorded in the external memory address translation table. If necessary, the values of the
SA and TC bits should be written to PTEA.
2. When the entry to be replaced in entry replacement is specified by software, write that value to
URC in the MMUCR register. If URC is greater than URB at this time, the value should be
changed to an appropriate value after issuing an LDTLB instruction.
3. Execute the LDTLB instruction and write the contents of PTEH, PTEL, and PTEA to the
UTLB.
4. Finally, execute the exception handling return instruction (RTE), terminate the exception
handling routine, and return control to the normal flow. The RTE instruction should be issued
at least one instruction after the LDTLB instruction.
3.6.6
Data TLB Protection Violation Exception
A data TLB protection violation exception occurs when, even though a UTLB entry contains
address translation information matching the virtual address to which a data access is made, the
actual access type is not permitted by the access right specified by the PR bit. The data TLB
protection violation exception processing carried out by hardware and software is shown below.
Hardware Processing: In the event of a data TLB protection violation exception, hardware
carries out the following processing:
1. Sets the VPN of the virtual address at which the exception occurred in PTEH.
2. Sets the virtual address at which the exception occurred in TEA.
3. Sets exception code H'0A0 in the case of a read, or H'0C0 in the case of a write, in EXPEVT
(OCBP, OCBWB: read; OCBI, MOVCA.L: write).
4. Sets the PC value indicating the address of the instruction at which the exception occurred in
SPC. If the exception occurred at a delay slot, sets the PC value indicating the address of the
delayed branch instruction in SPC.
5. Sets the SR contents at the time of the exception in SSR. The R15 contents at this time are
saved in SGR.
6. Sets the MD bit in SR to 1, and switches to privileged mode.
7. Sets the BL bit in SR to 1, and masks subsequent exception requests.
8. Sets the RB bit in SR to 1.
9. Branches to the address obtained by adding offset H'0000 0100 to the contents of VBR, and
starts the data TLB protection violation exception handling routine.
Rev. 6.0, 07/02, page 85 of 986
Software Processing (Data TLB Protection Violation Exception Handling Routine): Resolve
the data TLB protection violation, execute the exception handling return instruction (RTE),
terminate the exception handling routine, and return control to the normal flow. The RTE
instruction should be issued at least one instruction after the LDTLB instruction.
3.6.7
Initial Page Write Exception
An initial page write exception occurs when the D bit is 0 even though a UTLB entry contains
address translation information matching the virtual address to which a data access (write) is
made, and the access is permitted. The initial page write exception processing carried out by
hardware and software is shown below.
Hardware Processing: In the event of an initial page write exception, hardware carries out the
following processing:
1. Sets the VPN of the virtual address at which the exception occurred in PTEH.
2. Sets the virtual address at which the exception occurred in TEA.
3. Sets exception code H'080 in EXPEVT.
4. Sets the PC value indicating the address of the instruction at which the exception occurred in
SPC. If the exception occurred at a delay slot, sets the PC value indicating the address of the
delayed branch instruction in SPC.
5. Sets the SR contents at the time of the exception in SSR. The R15 contents at this time are
saved in SGR.
6. Sets the MD bit in SR to 1, and switches to privileged mode.
7. Sets the BL bit in SR to 1, and masks subsequent exception requests.
8. Sets the RB bit in SR to 1.
9. Branches to the address obtained by adding offset H'0000 0100 to the contents of VBR, and
starts the initial page write exception handling routine.
Rev. 6.0, 07/02, page 86 of 986
Software Processing (Initial Page Write Exception Handling Routine): The following
processing should be carried out as the responsibility of software:
1. Retrieve the necessary page table entry from external memory.
2. Write 1 to the D bit in the external memory page table entry.
3. Write to PTEL the values of the PPN, PR, SZ, C, D, WT, SH, and V bits in the page table
entry recorded in external memory. If necessary, the values of the SA and TC bits should be
written to PTEA.
4. When the entry to be replaced in entry replacement is specified by software, write that value to
URC in the MMUCR register. If URC is greater than URB at this time, the value should be
changed to an appropriate value after issuing an LDTLB instruction.
5. Execute the LDTLB instruction and write the contents of PTEH, PTEL, and PTEA to the
UTLB.
6. Finally, execute the exception handling return instruction (RTE), terminate the exception
handling routine, and return control to the normal flow. The RTE instruction should be issued
at least one instruction after the LDTLB instruction.
3.7
Memory-Mapped TLB Configuration
To enable the ITLB and UTLB to be managed by software, their contents can be read and written
by a P2 area program with a MOV instruction in privileged mode. Operation is not guaranteed if
access is made from a program in another area. A branch to an area other than the P2 area should
be made at least 8 instructions after this MOV instruction. The ITLB and UTLB are allocated to
the P4 area in physical memory space. VPN, V, and ASID in the ITLB can be accessed as an
address array, PPN, V, SZ, PR, C, and SH as data array 1, and SA and TC as data array 2. VPN,
D, V, and ASID in the UTLB can be accessed as an address array, PPN, V, SZ, PR, C, D, WT, and
SH as data array 1, and SA and TC as data array 2. V and D can be accessed from both the address
array side and the data array side. Only longword access is possible. Instruction fetches cannot be
performed in these areas. For reserved bits, a write value of 0 should be specified; their read value
is undefined.
Rev. 6.0, 07/02, page 87 of 986
3.7.1
ITLB Address Array
The ITLB address array is allocated to addresses H'F200 0000 to H'F2FF FFFF in the P4 area. An
address array access requires a 32-bit address field specification (when reading or writing) and a
32-bit data field specification (when writing). Information for selecting the entry to be accessed is
specified in the address field, and VPN, V, and ASID to be written to the address array are
specified in the data field.
In the address field, bits [31:24] have the value H'F2 indicating the ITLB address array, and the
entry is selected by bits [9:8]. As longword access is used, 0 should be specified for address field
bits [1:0].
In the data field, VPN is indicated by bits [31:10], V by bit [8], and ASID by bits [7:0].
The following two kinds of operation can be used on the ITLB address array:
1. ITLB address array read
VPN, V, and ASID are read into the data field from the ITLB entry corresponding to the entry
set in the address field.
2. ITLB address array write
VPN, V, and ASID specified in the data field are written to the ITLB entry corresponding to
the entry set in the address field.
24 23
31
Address field 1 1 1 1 0 0 1 0
10 9 8 7
0
E
10 9 8 7
31
Data field
VPN
VPN: Virtual page number
V: Validity bit
E: Entry
V
ASID
ASID: Address space identifier
: Reserved bits (0 write value, undefined
read value)
Figure 3.13 Memory-Mapped ITLB Address Array
Rev. 6.0, 07/02, page 88 of 986
0
3.7.2
ITLB Data Array 1
ITLB data array 1 is allocated to addresses H'F300 0000 to H'F37F FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification (when writing). Information for selecting the entry to be accessed is
specified in the address field, and PPN, V, SZ, PR, C, and SH to be written to the data array are
specified in the data field.
In the address field, bits [31:23] have the value H'F30 indicating ITLB data array 1, and the entry
is selected by bits [9:8].
In the data field, PPN is indicated by bits [28:10], V by bit [8], SZ by bits [7] and [4], PR by bit
[6], C by bit [3], and SH by bit [1].
The following two kinds of operation can be used on ITLB data array 1:
1. ITLB data array 1 read
PPN, V, SZ, PR, C, and SH are read into the data field from the ITLB entry corresponding to
the entry set in the address field.
2. ITLB data array 1 write
PPN, V, SZ, PR, C, and SH specified in the data field are written to the ITLB entry
corresponding to the entry set in the address field.
24 23
31
Address field 1 1 1 1 0 0 1 1 0
10 9 8 7
E
31 30 29 28
Data field
10 9 8 7 6 5 4 3 2 1 0
PPN
PPN:
V:
E:
SZ:
0
Physical page number
Validity bit
Entry
Page size bits
PR:
C:
SH:
:
V
C
PR SZ
SH
Protection key data
Cacheability bit
Share status bit
Reserved bits (0 write value, undefined
read value)
Figure 3.14 Memory-Mapped ITLB Data Array 1
Rev. 6.0, 07/02, page 89 of 986
3.7.3
ITLB Data Array 2
ITLB data array 2 is allocated to addresses H'F380 0000 to H'F3FF FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification (when writing). Information for selecting the entry to be accessed is
specified in the address field, and SA and TC to be written to data array 2 are specified in the data
field.
In the address field, bits [31:23] have the value H'F38 indicating ITLB data array 2, and the entry
is selected by bits [9:8].
In the data field, SA is indicated by bits [2:0], and TC by bit [3].
The following two kinds of operation can be used on ITLB data array 2:
1. ITLB data array 2 read
SA and TC are read into the data field from the ITLB entry corresponding to the entry set in
the address field.
2. ITLB data array 2 write
SA and TC specified in the data field are written to the ITLB entry corresponding to the entry
set in the address field.
24 23
31
Address field 1 1 1 1 0 0 1 1 1
10 9 8 7
0
E
4 3 2 0
31
Data field
SA
TC: Timing control bit
E: Entry
TC
SA: Space attribute bits
: Reserved bits (0 write value, undefined read
value)
Figure 3.15 Memory-Mapped ITLB Data Array 2
3.7.4
UTLB Address Array
The UTLB address array is allocated to addresses H'F600 0000 to H'F6FF FFFF in the P4 area. An
address array access requires a 32-bit address field specification (when reading or writing) and a
32-bit data field specification (when writing). Information for selecting the entry to be accessed is
specified in the address field, and VPN, D, V, and ASID to be written to the address array are
specified in the data field.
Rev. 6.0, 07/02, page 90 of 986
In the address field, bits [31:24] have the value H'F6 indicating the UTLB address array, and the
entry is selected by bits [13:8]. The address array bit [7] association bit (A bit) specifies whether
or not address comparison is performed when writing to the UTLB address array.
In the data field, VPN is indicated by bits [31:10], D by bit [9], V by bit [8], and ASID by bits
[7:0].
The following three kinds of operation can be used on the UTLB address array:
1. UTLB address array read
VPN, D, V, and ASID are read into the data field from the UTLB entry corresponding to the
entry set in the address field. In a read, associative operation is not performed regardless of
whether the association bit specified in the address field is 1 or 0.
2. UTLB address array write (non-associative)
VPN, D, V, and ASID specified in the data field are written to the UTLB entry corresponding
to the entry set in the address field. The A bit in the address field should be cleared to 0.
3. UTLB address array write (associative)
When a write is performed with the A bit in the address field set to 1, comparison of all the
UTLB entries is carried out using the VPN specified in the data field and PTEH.ASID. The
usual address comparison rules are followed, but if a UTLB miss occurs, the result is no
operation, and an exception is not generated. If the comparison identifies a UTLB entry
corresponding to the VPN specified in the data field, D and V specified in the data field are
written to that entry. If there is more than one matching entry, a data TLB multiple hit
exception results. This associative operation is simultaneously carried out on the ITLB, and if
a matching entry is found in the ITLB, V is written to that entry. Even if the UTLB
comparison results in no operation, a write to the ITLB side only is performed as long as there
is an ITLB match. If there is a match in both the UTLB and ITLB, the UTLB information is
also written to the ITLB.
31
24 23
Address field 1 1 1 1 0 1 1 0
10 9 8 7
VPN
VPN:
V:
E:
D:
Virtual page number
Validity bit
Entry
Dirty bit
2 1 0
A
E
31 30 29 28
Data field
8 7
14 13
D V
0
ASID
ASID: Address space identifier
A: Association bit
: Reserved bits (0 write value, undefined
read value)
Figure 3.16 Memory-Mapped UTLB Address Array
Rev. 6.0, 07/02, page 91 of 986
3.7.5
UTLB Data Array 1
UTLB data array 1 is allocated to addresses H'F700 0000 to H'F77F FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification (when writing). Information for selecting the entry to be accessed is
specified in the address field, and PPN, V, SZ, PR, C, D, SH, and WT to be written to the data
array are specified in the data field.
In the address field, bits [31:23] have the value H'F70 indicating UTLB data array 1, and the entry
is selected by bits [13:8].
In the data field, PPN is indicated by bits [28:10], V by bit [8], SZ by bits [7] and [4], PR by bits
[6:5], C by bit [3], D by bit [2], SH by bit [1], and WT by bit [0].
The following two kinds of operation can be used on UTLB data array 1:
1. UTLB data array 1 read
PPN, V, SZ, PR, C, D, SH, and WT are read into the data field from the UTLB entry
corresponding to the entry set in the address field.
2. UTLB data array 1 write
PPN, V, SZ, PR, C, D, SH, and WT specified in the data field are written to the UTLB entry
corresponding to the entry set in the address field.
24 23
31
Address field 1 1 1 1 0 1 1 1 0
14 13
10 9 8 7 6 5 4 3 2 1 0
PPN
PPN:
V:
E:
SZ:
D:
Physical page number
Validity bit
Entry
Page size bits
Dirty bit
V
PR:
C:
SH:
WT:
:
PR
C D
Protection key data
SZ SH WT
Cacheability bit
Share status bit
Write-through bit
Reserved bits (0 write value, undefined
read value)
Figure 3.17 Memory-Mapped UTLB Data Array 1
Rev. 6.0, 07/02, page 92 of 986
0
E
31 30 29 28
Data field
8 7
3.7.6
UTLB Data Array 2
UTLB data array 2 is allocated to addresses H'F780 0000 to H'F7FF FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification (when writing). Information for selecting the entry to be accessed is
specified in the address field, and SA and TC to be written to data array 2 are specified in the data
field.
In the address field, bits [31:23] have the value H'F78 indicating UTLB data array 2, and the entry
is selected by bits [13:8].
In the data field, TC is indicated by bit [3], and SA by bits [2:0].
The following two kinds of operation can be used on UTLB data array 2:
1. UTLB data array 2 read
SA and TC are read into the data field from the UTLB entry corresponding to the entry set in
the address field.
2. UTLB data array 2 write
SA and TC specified in the data field are written to the UTLB entry corresponding to the entry
set in the address field.
31
24 23
Address field 1 1 1 1 0 1 1 1 1
14 13
8 7
0
E
4 3 2
31
Data field
0
SA
TC: Timing control bit
E: Entry
TC
SA: Space attribute bits
: Reserved bits (0 write value, undefined read
value)
Figure 3.18 Memory-Mapped UTLB Data Array 2
Rev. 6.0, 07/02, page 93 of 986
Rev. 6.0, 07/02, page 94 of 986
Section 4 Caches
4.1
Overview
4.1.1
Features
An SH7750 or SH7750S has an on-chip 8-kbyte instruction cache (IC) for instructions and 16kbyte operand cache (OC) for data. Half of the memory of the operand cache (8 kbytes) may
alternatively be used as on-chip RAM. The features of this cache are summarized in table 4.1
The SH7750R has an on-chip 16-kbyte instruction cache (IC) for instructions and 32-kbyte
operand cache (OC) for data. Half of the memory of the operand cache (16 kbytes) may
alternatively be used as on-chip RAM. When the EMODE bit of the CCR register is 0, the
SH7750R’s cache is set to operate in the SH7750/SH7750S-compatible mode and behaves as
shown in table 4.1. The features of the cache when the EMODE bit in the CCR register is 1 are
given in table 4.2. The EMODE bit is initialized to 0 after a power-on reset or manual reset.
For high-speed writing to external memories, the SH7750 series supports 32 bytes × 2 of store
queues (SQ). Table 4.3 lists the features of these SQs.
Table 4.1
Cache Features (SH7750, SH7750S)
Item
Instruction Cache
Operand Cache
Capacity
8-kbyte cache
16-kbyte cache or 8-kbyte cache +
8-kbyte RAM
Type
Direct mapping
Direct mapping
Line size
32 bytes
32 bytes
Entries
256
512
Write method
Table 4.2
Copy-back/write-through selectable
Cache Features (SH7750R)
Item
Instruction Cache
Operand Cache
Capacity
16-kbyte cache
32-kbyte cache or 16-kbyte cache +
16-kbyte RAM
Type
2-way set-associative
2-way set-associative
Line size
32 bytes
32 bytes
Entries
256 entries/way
512 entries/way
Write method
Replacement method
Copy-back/write-through selectable
LRU (least-recently-used) algorithm LRU algorithm
Rev. 6.0, 07/02, page 95 of 986
Table 4.3
Features of Store Queues
Item
Store Queues
Capacity
2 × 32 bytes
Addresses
H'E000 0000 to H'E3FF FFFF
Write
Store instruction (1-cycle write)
Write-back
Prefetch instruction (PREF instruction)
Access right
MMU off: according to MMUCR.SQMD
MMU on: according to individual page PR
4.1.2
Register Configuration
Table 4.4 shows the cache control registers.
Table 4.4
Cache Control Registers
Name
Abbreviation R/W
Initial
1
Value*
P4
2
Address*
Area 7
2
Address*
Access
Size
Cache control
register
CCR
R/W
H'0000 0000
H'FF00 001C
H'1F00 001C
32
Queue address
control register 0
QACR0
R/W
Undefined
H'FF00 0038
H'1F00 0038
32
Queue address
control register 1
QACR1
R/W
Undefined
H'FF00 003C
H'1F00 003C
32
Notes: *1 The initial value is the value after a power-on or manual reset.
*2 This is the address when using the virtual/physical address space P4 area. The area 7
address is the address used when making an access from physical address space area
7 using the TLB.
Rev. 6.0, 07/02, page 96 of 986
4.2
Register Descriptions
There are three cache and store queue related control registers, as shown in figure 4.1.
CCR
31 30
16 15 14
12 11 10 9 8 7 6 5 4 3 2 1 0
CB
EMODE*
IIX
ICI ICE OIX ORA OCI WT OCE
QACR0
31
5 4
2 1 0
AREA
QACR1
31
5 4
2 1 0
AREA
*: SH7750R only
indicates reserved bits: 0 must be specified in a write; the read value is 0.
Figure 4.1 Cache and Store Queue Control Registers
(1) Cache Control Register (CCR): CCR contains the following bits:
EMODE:
IIX:
ICI:
ICE:
OIX:
ORA:
OCI:
CB:
WT:
OCE:
Double-sized cache mode (Only for SH7750R; reserved bit for SH7750 and SH7750S)
IC index enable
IC invalidation
IC enable
OC index enable
OC RAM enable
OC invalidation
Copy-back enable
Write-through enable
OC enable
Longword access to CCR can be performed from H'FF00 001C in the P4 area and H'1F00 001C in
area 7. The CCR bits are used for the cache settings described below. Consequently, CCR
modifications must only be made by a program in the non-cached P2 area. After CCR is updated,
an instruction that performs data access to the P0, P1, P3, or U0 area should be located at least
four instructions after the CCR update instruction. Also, a branch instruction to the P0, P1, P3, or
U0 area should be located at least eight instructions after the CCR update instruction.
Rev. 6.0, 07/02, page 97 of 986
• EMODE: Double-sized cache mode bit
In the SH7750R, this bit indicates whether the double-sized cache mode is used or not.
This bit is reserved in the SH7750 and SH7750S. The EMODE bit must not be written to while
the cache is being used.
1
0: SH7750/SH7750S-compatible mode* (initial value)
1: Double-sized cache mode
• IIX: IC index enable bit
0: Effective address bits [12:5] used for IC entry selection
1: Effective address bits [25] and [11:5] used for IC entry selection
• ICI: IC invalidation bit
When 1 is written to this bit, the V bits of all IC entries are cleared to 0. This bit always returns
0 when read.
• ICE: IC enable bit
Indicates whether or not the IC is to be used. When address translation is performed, the IC
cannot be used unless the C bit in the page management information is also 1.
0: IC not used
1: IC used
• OIX: OC index enable bit*
0: Effective address bits [13:5] used for OC entry selection
1: Effective address bits [25] and [12:5] used for OC entry selection
2
• ORA: OC RAM enable bit*
3
When the OC is enabled (OCE = 1), the ORA bit specifies whether the half of the OC are to be
used as RAM. When the OC is not enabled (OCE = 0), the ORA bit should be cleared to 0.
0: Normal mode (the entire OC is used as a cache)
1: RAM mode (half of the OC is used as a cache and the other half is used as RAM)
• OCI: OC invalidation bit
When 1 is written to this bit, the V and U bits of all OC entries are cleared to 0. This bit always
returns 0 when read.
• CB: Copy-back bit
Indicates the P1 area cache write mode.
0: Write-through mode
1: Copy-back mode
Rev. 6.0, 07/02, page 98 of 986
• WT: Write-through bit
Indicates the P0, U0, and P3 area cache write mode. When address translation is performed,
the value of the WT bit in the page management information has priority.
0: Copy-back mode
1: Write-through mode
• OCE: OC enable bit
Indicates whether or not the OC is to be used. When address translation is performed, the OC
cannot be used unless the C bit in the page management information is also 1.
0: OC not used
1: OC used
Note: *1 No compatibility for RAM mode in OC index mode and address assignment in RAM
mode.
*2 When the ORA bit is 1 in the SH7750R, the OIX bit should be cleared to 0.
*3 When the OIX bit in the SH7750R is 1, the ORA bit should be cleared to 0.
(2) Queue Address Control Register 0 (QACR0): Longword access to QACR0 can be
performed from H'FF00 0038 in the P4 area and H'1F00 0038 in area 7. QACR0 specifies the area
onto which store queue 0 (SQ0) is mapped when the MMU is off.
(3) Queue Address Control Register 1 (QACR1): Longword access to QACR1 can be
performed from H'FF00 003C in the P4 area and H'1F00 003C in area 7. QACR1 specifies the
area onto which store queue 1 (SQ1) is mapped when the MMU is off.
4.3
Operand Cache (OC)
4.3.1
Configuration
The operand cache of the SH7750 or SH7750S is of the direct-mapping type and consists of 512
cache lines, each composed of a 19-bit tag, V bit, U bit, and 32-byte data. The SH7750R’s
operand cache is 2-way set-associative. Each way consists of 512 cache lines.
Figure 4.2 shows the configuration of the operand cache for the SH7750 and SH7750S.
Figure 4.3 shows the configuration of the operand cache for the SH7750R.
Rev. 6.0, 07/02, page 99 of 986
Effective address
31
26 25
13 12 11 10 9
5 4 3 2 1 0
RAM area
determination
[11:5]
OIX
[13]
ORA
[12]
22
MMU
Entry selection
9
3
Address array
0
Tag
U
V
Longword (LW) selection
Data array
LW0 LW1 LW2 LW3 LW4 LW5 LW6 LW7
19
511
19 bits
1 bit 1 bit
32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits
Compare
Read data
Write data
Hit signal
Figure 4.2 Configuration of Operand Cache(SH7750, SH7750S)
Rev. 6.0, 07/02, page 100 of 986
Effective address
31
26 25
13 12
10
5 4
RAM area
judgment
[12:5]
OIX
ORA
2
0
Longword (LW)
selection
[13]
Entry
selection
22
Address array
(way 0, way 1)
9
0
Tag address
U
3
V
Data array (way 0, way 1)
LRU
LW0 LW1 LW2 LW3 LW4 LW5 LW6 LW7
MMU
19
511
19 bits
Compare Compare
way 0
way 1
1 bit 1 bit
32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits
Read data
1 bit
Write data
Hit signal
Figure 4.3 Configuration of Operand Cache (SH7750R)
Rev. 6.0, 07/02, page 101 of 986
• Tag
Stores the upper 19 bits of the 29-bit external memory address of the data line to be cached.
The tag is not initialized by a power-on or manual reset.
• V bit (validity bit)
Indicates that valid data is stored in the cache line. When this bit is 1, the cache line data is
valid. The V bit is initialized to 0 by a power-on reset, but retains its value in a manual reset.
• U bit (dirty bit)
The U bit is set to 1 if data is written to the cache line while the cache is being used in copyback mode. That is, the U bit indicates a mismatch between the data in the cache line and the
data in external memory. The U bit is never set to 1 while the cache is being used in writethrough mode, unless it is modified by accessing the memory-mapped cache (see section 4.5,
Memory-Mapped Cache Configuration). The U bit is initialized to 0 by a power-on reset, but
retains its value in a manual reset.
• Data field
The data field holds 32 bytes (256 bits) of data per cache line. The data array is not initialized
by a power-on or manual reset.
• LRU (SH7750R only)
In a 2-way set-associative cache, up to 2 items of data can be registered in the cache at each
entry address (address: 13–5). When an entry is registered, the LRU bit indicates which of the
2 ways it is to be registered in. The LRU bit is a single bit of each entry, and its value is
controlled by hardware.
The LRU (least-recently-used) algorithm is used for way selection, and selects the less recently
accessed way. The LRU bits are initialized to 0 by a power-on reset but not by a manual reset.
The LRU bits cannot be read or written by software.
Rev. 6.0, 07/02, page 102 of 986
4.3.2
Read Operation
When the OC is enabled (CCR.OCE = 1) and data is read by means of an effective address from a
cacheable area, the cache operates as follows:
1. The tag, V bit, and U bit are read from the cache line indexed by effective address bits [13:5].
2. The tag is compared with bits [28:10] of the address resulting from effective address
translation by the MMU:
→ (3a)
• If the tag matches and the V bit is 1
• If the tag matches and the V bit is 0
• If the tag does not match and the V bit is 0
→ (3b)
→ (3b)
• If the tag does not match, the V bit is 1, and the U bit is 0 → (3b)
• If the tag does not match, the V bit is 1, and the U bit is 1 → (3c)
3a. Cache hit
The data indexed by effective address bits [4:0] is read from the data field of the cache line
indexed by effective address bits [13:5] in accordance with the access size
(quadword/longword/word/byte).
3b. Cache miss (no write-back)
Data is read into the cache line from the external memory space corresponding to the effective
address. Data reading is performed, using the wraparound method, in order from the longword
data corresponding to the effective address, and when the corresponding data arrives in the
cache, the read data is returned to the CPU. While the remaining one cache line of data is being
read, the CPU can execute the next processing. When reading of one line of data is completed,
the tag corresponding to the effective address is recorded in the cache, and 1 is written to the V
bit.
3c. Cache miss (with write-back)
The tag and data field of the cache line indexed by effective address bits [13:5] are saved in the
write-back buffer. Then data is read into the cache line from the external memory space
corresponding to the effective address. Data reading is performed, using the wraparound
method, in order from the longword data corresponding to the effective address, and when the
corresponding data arrives in the cache, the read data is returned to the CPU. While the
remaining one cache line of data is being read, the CPU can execute the next processing. When
reading of one line of data is completed, the tag corresponding to the effective address is
recorded in the cache, 1 is written to the V bit, and 0 to the U bit. The data in the write-back
buffer is then written back to external memory.
Rev. 6.0, 07/02, page 103 of 986
4.3.3
Write Operation
When the OC is enabled (CCR.OCE = 1) and data is written by means of an effective address to a
cacheable area, the cache operates as follows:
1. The tag, V bit, and U bit are read from the cache line indexed by effective address bits [13:5].
2. The tag is compared with bits [28:10] of the address resulting from effective address
translation by the MMU:
Copy-back
Write-through
→ (3a)
→ (3c)
→ (3b)
→ (3d)
→ (3c)
• If the tag does not match and the V bit is 0
• If the tag does not match, the V bit is 1, and the U bit is 0 → (3c)
• If the tag does not match, the V bit is 1, and the U bit is 1 → (3e)
→ (3d)
→ (3d)
• If the tag matches and the V bit is 1
• If the tag matches and the V bit is 0
→ (3d)
3a. Cache hit (copy-back)
A data write in accordance with the access size (quadword/longword/word/byte) is performed
for the data indexed by bits [4:0] of the effective address of the data field of the cache line
indexed by effective address bits [13:5]. Then 1 is set in the U bit.
3b. Cache hit (write-through)
A data write in accordance with the access size (quadword/longword/word/byte) is performed
for the data indexed by bits [4:0] of the effective address of the data field of the cache line
indexed by effective address bits [13:5]. A write is also performed to the corresponding
external memory using the specified access size.
3c. Cache miss (no copy-back/write-back)
A data write in accordance with the access size (quadword/longword/word/byte) is performed
for the data indexed by bits [4:0] of the effective address of the data field of the cache line
indexed by effective address bits [13:5]. Then, data is read into the cache line from the external
memory space corresponding to the effective address. Data reading is performed, using the
wraparound method, in order from the longword data corresponding to the effective address,
and one cache line of data is read excluding the written data. During this time, the CPU can
execute the next processing. When reading of one line of data is completed, the tag
corresponding to the effective address is recorded in the cache, and 1 is written to the V bit and
U bit.
3d. Cache miss (write-through)
A write of the specified access size is performed to the external memory corresponding to the
effective address. In this case, a write to cache is not performed.
Rev. 6.0, 07/02, page 104 of 986
3e. Cache miss (with copy-back/write-back)
The tag and data field of the cache line indexed by effective address bits [13:5] are first saved
in the write-back buffer, and then a data write in accordance with the access size
(quadword/longword/word/byte) is performed for the data indexed by bits [4:0] of the effective
address of the data field of the cache line indexed by effective address bits [13:5]. Then, data is
read into the cache line from the external memory space corresponding to the effective
address. Data reading is performed, using the wraparound method, in order from the longword
data corresponding to the effective address, and one cache line of data is read excluding the
written data. During this time, the CPU can execute the next processing. When reading of one
line of data is completed, the tag corresponding to the effective address is recorded in the
cache, and 1 is written to the V bit and U bit. The data in the write-back buffer is then written
back to external memory.
4.3.4
Write-Back Buffer
In order to give priority to data reads to the cache and improve performance, the SH7750 Series
has a write-back buffer which holds the relevant cache entry when it becomes necessary to purge a
dirty cache entry into external memory as the result of a cache miss. The write-back buffer
contains one cache line of data and the physical address of the purge destination.
Physical address bits [28:5]
LW0
LW1
LW2
LW3
LW4
LW5
LW6
LW7
Figure 4.4 Configuration of Write-Back Buffer
4.3.5
Write-Through Buffer
The SH7750 Series has a 64-bit buffer for holding write data when writing data in write-through
mode or writing to a non-cacheable area. This allows the CPU to proceed to the next operation as
soon as the write to the write-through buffer is completed, without waiting for completion of the
write to external memory.
Physical address bits [28:0]
LW0
LW1
Figure 4.5 Configuration of Write-Through Buffer
Rev. 6.0, 07/02, page 105 of 986
4.3.6
RAM Mode
Setting CCR.ORA to 1 enables half of the operand cache to be used as RAM. In the SH7750 or
SH7750S, the 8 kbytes of operand cache entries 128 to 255 and 384 to 511 are used as RAM. In
the SH7750/SH7750S-compatible mode of the SH7750R, the 8-kbyte area otherwise used for OC
entries 256 to 511 is designated as a RAM area. In the double-sized cache mode of the SH7750R,
a total of 16 kbytes, comprising entries 256 to 511 in both of the ways of the operand cache, is
designated as a RAM area. Other entries can still be used as cache. RAM can be accessed using
addresses H'7C00 0000 to H'7FFF FFFF. Byte-, word-, longword-, and quadword-size data reads
and writes can be performed in the operand cache RAM area. Instruction fetches cannot be
performed in this area. With the SH7750R, the OC index mode is not available in RAM mode.
An example of RAM use in the SH7750 or SH7750S is shown below. Here, the 4 kbytes
comprising OC entries 128 to 255 are designated as RAM area 1, and the 4 kbytes comprising OC
entries 384 to 511 as RAM area 2.
• When OC index mode is off (CCR.OIX = 0)
H'7C00 0000 to H'7C00 0FFF (4 kB): Corresponds to RAM area 1
H'7C00 1000 to H'7C00 1FFF (4 kB): Corresponds to RAM area 1
H'7C00 2000 to H'7C00 2FFF (4 kB): Corresponds to RAM area 2
H'7C00 3000 to H'7C00 3FFF (4 kB): Corresponds to RAM area 2
H'7C00 4000 to H'7C00 4FFF (4 kB): Corresponds to RAM area 1
:
:
:
RAM areas 1 and 2 in the SH7750 or SH7750S then repeat every 8 kbytes up to H'7FFF FFFF.
Thus, to secure a continuous 8-kbyte RAM area, the area from H'7C00 1000 to H'7C00 2FFF
can be used, for example.
• When OC index mode is on (CCR.OIX = 1)
H'7C00 0000 to H'7C00 0FFF (4 kB): Corresponds to RAM area 1
H'7C00 1000 to H'7C00 1FFF (4 kB): Corresponds to RAM area 1
H'7C00 2000 to H'7C00 2FFF (4 kB): Corresponds to RAM area 1
:
:
:
H'7DFF F000 to H'7DFF FFFF (4 kB): Corresponds to RAM area 1
H'7E00 0000 to H'7E00 0FFF (4 kB): Corresponds to RAM area 2
H'7E00 1000 to H'7E00 1FFF (4 kB): Corresponds to RAM area 2
:
:
:
H'7FFF F000 to H'7FFF FFFF (4 kB): Corresponds to RAM area 2
As the distinction between RAM areas 1 and 2 is indicated by address bit [25], the area from
H'7DFF F000 to H'7E00 0FFF should be used to secure a continuous 8-kbyte RAM area.
Rev. 6.0, 07/02, page 106 of 986
Examples of RAM usage with the SH7750R is shown below.
• In SH7750/SH7750S-compatible mode (CCR.EMODE = 0)
H'7C00 0000 to H'7C00 1FFF (8 kB): RAM area (entries 256 to 511)
H'7C00 2000 to H'7C00 3FFF (8 kB): RAM area (entries 256 to 511)
:
:
:
In the same pattern, shadows of the RAM area are created in 8-kbyte blocks until H'7FFF
FFFF is reached.
• In double-sized cache mode (CCR.EMODE = 1)
In this mode, the 8 kbytes comprising entries 256 to 511 of OC way 0 are designated as RAM
area 1 and the 8-kbytes comprising entries 256 to 511 of OC way 1 are designated as RAM
area 2.
H'7C00 0000 to H'7C00 1FFF (8 kB): Corresponds to RAM area 1
H'7C00 2000 to H'7C00 3FFF (8 kB): Corresponds to RAM area 2
H'7C00 4000 to H'7C00 5FFF (8 kB): Corresponds to RAM area 1
H'7C00 6000 to H'7C00 7FFF (8 kB): Corresponds to RAM area 2
:
:
:
In the same pattern, shadows of the RAM area are created in 16-kbyte blocks until H'7FFF
FFFF is reached.
4.3.7
OC Index Mode
Setting CCR.OIX to 1 enables OC indexing to be performed using bit [25] of the effective
address. This is called OC index mode. In normal mode, with CCR.OIX cleared to 0, OC indexing
is performed using bits [13:5] of the effective address. Using index mode allows the OC to be
handled as two areas by means of effective address bit [25], providing efficient use of the cache.
The SH7750R cannot be used in RAM mode when OC index mode is selected.
4.3.8
Coherency between Cache and External Memory
Coherency between cache and external memory should be assured by software. In the SH7750
Series, the following four new instructions are supported for cache operations. Details of these
instructions are given in the Programming Manual.
Invalidate instruction:
OCBI @Rn
Cache invalidation (no write-back)
Purge instruction:
OCBP @Rn
Cache invalidation (with write-back)
Write-back instruction:
OCBWB @Rn
Cache write-back
Allocate instruction:
MOVCA.L R0,@Rn
Cache allocation
Rev. 6.0, 07/02, page 107 of 986
4.3.9
Prefetch Operation
The SH7750 Series supports a prefetch instruction to reduce the cache fill penalty incurred as the
result of a cache miss. If it is known that a cache miss will result from a read or write operation, it
is possible to fill the cache with data beforehand by means of the prefetch instruction to prevent a
cache miss due to the read or write operation, and so improve software performance. If a prefetch
instruction is executed for data already held in the cache, or if the prefetch address results in a
UTLB miss or a protection violation, the result is no operation, and an exception is not generated.
Details of the prefetch instruction are given in the Programming Manual.
Prefetch instruction:
PREF @Rn
4.4
Instruction Cache (IC)
4.4.1
Configuration
The instruction cache of the SH7750 or SH7750S is of the direct-mapping type and consists of
256 cache lines, each composed of a 19-bit tag, V bit, and 32-byte data (16 instructions). The
SH7750R’s instruction cache is 2-way set associative. Each way consists of 256 cache lines.
Figure 4.6 shows the configuration of the instruction cache for the SH7750 and SH7750S.
Figure 4.7 shows the configuration of the instruction cache for the SH7750R.
Rev. 6.0, 07/02, page 108 of 986
Effective address
31
26 25
13 12 11 10 9
5 4 3 2 1 0
[11:5]
IIX
[12]
Longword (LW) selection
22
MMU
Entry selection
8
Address array
0
3
Data array
Tag
V
LW0 LW1 LW2 LW3 LW4 LW5 LW6 LW7
19 bits
1 bit
32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits
19
255
Compare
Read data
Hit signal
Figure 4.6 Configuration of Instruction Cache (SH7750, SH7750S)
Rev. 6.0, 07/02, page 109 of 986
Effective address
31
25
13 12 11 10
5 4
2
0
[11:5]
IIX
[12]
Entry
selection
22
Longword (LW)
selection
Address array
(way 0, way1)
8
0
3
Data array (way 0, way 1)
Tag address
V
LW0 LW1 LW2 LW3 LW4 LW5 LW6 LW7
19 bits
1 bit
32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits 32 bits
LRU
MMU
19
255
Compare Compare
way 0
way 1
1 bit
Read data
Hit signal
Figure 4.7 Configuration of Instruction Cache (SH7750R)
• Tag
Stores the upper 19 bits of the 29-bit external address of the data line to be cached. The tag is
not initialized by a power-on or manual reset.
• V bit (validity bit)
Indicates that valid data is stored in the cache line. When this bit is 1, the cache line data is
valid. The V bit is initialized to 0 by a power-on reset, but retains its value in a manual reset.
• Data array
The data field holds 32 bytes (256 bits) of data per cache line. The data array is not initialized
by a power-on or manual reset.
Rev. 6.0, 07/02, page 110 of 986
• LRU (SH7750R only)
In a 2-way set-associative cache, up to 2 items of data can be registered in the cache at each
entry address (address: 12–5). When an entry is registered, the LRU bit indicates which of the
2 ways it is to be registered in. The LRU bit is a single bit of each entry, and its usage is
controlled by hardware.
The LRU (least-recently-used) algorithm is used for way selection, and selects the less recently
accessed way. The LRU bits are initialized to 0 by a power-on reset but not by a manual reset.
The LRU bits cannot be read or written by software.
4.4.2
Read Operation
When the IC is enabled (CCR.ICE = 1) and instruction fetches are performed by means of an
effective address from a cacheable area, the instruction cache operates as follows:
1. The tag and V bit are read from the cache line indexed by effective address bits [12:5].
2. The tag is compared with bits [28:10] of the address resulting from effective address
translation by the MMU:
•
If the tag matches and the V bit is 1
•
If the tag matches and the V bit is 0
•
If the tag does not match and the V bit is 0
•
If the tag does not match and the V bit is 1
→ (3a)
→ (3b)
→ (3b)
→ (3b)
3a. Cache hit
The data indexed by effective address bits [4:2] is read as an instruction from the data field of
the cache line indexed by effective address bits [12:5].
3b. Cache miss
Data is read into the cache line from the external memory space corresponding to the effective
address. Data reading is performed, using the wraparound method, in order from the longword
data corresponding to the effective address, and when the corresponding data arrives in the
cache, the read data is returned to the CPU as an instruction. When reading of one line of data
is completed, the tag corresponding to the effective address is recorded in the cache, and 1 is
written to the V bit.
4.4.3
IC Index Mode
Setting CCR.IIX to 1 enables IC indexing to be performed using bit [25] of the effective address.
This is called IC index mode. In normal mode, with CCR.IIX cleared to 0, IC indexing is
performed using bits [12:5] of the effective address. Using index mode allows the IC to be handled
as two areas by means of effective address bit [25], providing efficient use of the cache.
Rev. 6.0, 07/02, page 111 of 986
4.5
Memory-Mapped Cache Configuration (SH7750, SH7750S)
To enable the IC and OC to be managed by software, their contents can be read and written by a
P2 area program with a MOV instruction in privileged mode. Operation is not guaranteed if access
is made from a program in another area. In this case, a branch to the P0, U0, P1, or P3 area should
be made at least 8 instructions after this MOV instruction. The IC and OC are allocated to the P4
area in physical memory space. Only data accesses can be used on both the IC address array and
data array and the OC address array and data array, and accesses are always longword-size.
Instruction fetches cannot be performed in these areas. For reserved bits, a write value of 0 should
be specified; their read value is undefined.
4.5.1
IC Address Array
The IC address array is allocated to addresses H'F000 0000 to H'F0FF FFFF in the P4 area. An
address array access requires a 32-bit address field specification (when reading or writing) and a
32-bit data field specification. The entry to be accessed is specified in the address field, and the
write tag and V bit are specified in the data field.
In the address field, bits [31:24] have the value H'F0 indicating the IC address array, and the entry
is specified by bits [12:5]. CCR.IIX has no effect on this entry specification. The address array bit
[3] association bit (A bit) specifies whether or not association is performed when writing to the IC
address array. As only longword access is used, 0 should be specified for address field bits [1:0].
In the data field, the tag is indicated by bits [31:10], and the V bit by bit [0]. As the IC address
array tag is 19 bits in length, data field bits [31:29] are not used in the case of a write in which
association is not performed. Data field bits [31:29] are used for the virtual address specification
only in the case of a write in which association is performed.
The following three kinds of operation can be used on the IC address array:
1. IC address array read
The tag and V bit are read into the data field from the IC entry corresponding to the entry set in
the address field. In a read, associative operation is not performed regardless of whether the
association bit specified in the address field is 1 or 0.
2. IC address array write (non-associative)
The tag and V bit specified in the data field are written to the IC entry corresponding to the
entry set in the address field. The A bit in the address field should be cleared to 0.
3. IC address array write (associative)
When a write is performed with the A bit in the address field set to 1, the tag stored in the
entry specified in the address field is compared with the tag specified in the data field. If the
MMU is enabled at this time, comparison is performed after the virtual address specified by
data field bits [31:10] has been translated to a physical address using the ITLB. If the addresses
match and the V bit is 1, the V bit specified in the data field is written into the IC entry. In
Rev. 6.0, 07/02, page 112 of 986
other cases, no operation is performed. This operation is used to invalidate a specific IC entry.
If an ITLB miss occurs during address translation, or the comparison shows a mismatch, an
interrupt is not generated, no operation is performed, and the write is not executed. If an
instruction TLB multiple hit exception occurs during address translation, processing switches
to the instruction TLB multiple hit exception handling routine.
24 23
31
13 12
5 4 3 2 1 0
Address field 1 1 1 1 0 0 0 0
Entry
31
10 9
Data field
A
1 0
V
Tag
V : Validity bit
A : Association bit
: Reserved bits (0 write value, undefined read value)
Figure 4.8 Memory-Mapped IC Address Array
4.5.2
IC Data Array
The IC data array is allocated to addresses H'F100 0000 to H'F1FF FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification. The entry to be accessed is specified in the address field, and the longword
data to be written is specified in the data field.
In the address field, bits [31:24] have the value H'F1 indicating the IC data array, and the entry is
specified by bits [12:5]. CCR.IIX has no effect on this entry specification. Address field bits [4:2]
are used for the longword data specification in the entry. As only longword access is used, 0
should be specified for address field bits [1:0].
The data field is used for the longword data specification.
The following two kinds of operation can be used on the IC data array:
1. IC data array read
Longword data is read into the data field from the data specified by the longword specification
bits in the address field in the IC entry corresponding to the entry set in the address field.
2. IC data array write
The longword data specified in the data field is written for the data specified by the longword
specification bits in the address field in the IC entry corresponding to the entry set in the
address field.
Rev. 6.0, 07/02, page 113 of 986
31
24 23
13 12
Address field 1 1 1 1 0 0 0 1
5 4
Entry
2 1 0
L
31
0
Data field
Longword data
L : Longword specification bits
: Reserved bits (0 write value, undefined read value)
Figure 4.9 Memory-Mapped IC Data Array
4.5.3
OC Address Array
The OC address array is allocated to addresses H'F400 0000 to H'F4FF FFFF in the P4 area. An
address array access requires a 32-bit address field specification (when reading or writing) and a
32-bit data field specification. The entry to be accessed is specified in the address field, and the
write tag, U bit, and V bit are specified in the data field.
In the address field, bits [31:24] have the value H'F4 indicating the OC address array, and the
entry is specified by bits [13:5]. CCR.OIX and CCR.ORA have no effect on this entry
specification. The address array bit [3] association bit (A bit) specifies whether or not association
is performed when writing to the OC address array. As only longword access is used, 0 should be
specified for address field bits [1:0].
In the data field, the tag is indicated by bits [31:10], the U bit by bit [1], and the V bit by bit [0].
As the OC address array tag is 19 bits in length, data field bits [31:29] are not used in the case of a
write in which association is not performed. Data field bits [31:29] are used for the virtual address
specification only in the case of a write in which association is performed.
The following three kinds of operation can be used on the OC address array:
1. OC address array read
The tag, U bit, and V bit are read into the data field from the OC entry corresponding to the
entry set in the address field. In a read, associative operation is not performed regardless of
whether the association bit specified in the address field is 1 or 0.
2. OC address array write (non-associative)
The tag, U bit, and V bit specified in the data field are written to the OC entry corresponding to
the entry set in the address field. The A bit in the address field should be cleared to 0.
When a write is performed to a cache line for which the U bit and V bit are both 1, after writeback of that cache line, the tag, U bit, and V bit specified in the data field are written.
Rev. 6.0, 07/02, page 114 of 986
3. OC address array write (associative)
When a write is performed with the A bit in the address field set to 1, the tag stored in the
entry specified in the address field is compared with the tag specified in the data field. If the
MMU is enabled at this time, comparison is performed after the virtual address specified by
data field bits [31:10] has been translated to a physical address using the UTLB. If the
addresses match and the V bit is 1, the U bit and V bit specified in the data field are written
into the OC entry. This operation is used to invalidate a specific OC entry. In other cases, no
operation is performed. If the OC entry U bit is 1, and 0 is written to the V bit or to the U bit,
write-back is performed. If an UTLB miss occurs during address translation, or the comparison
shows a mismatch, an exception is not generated, no operation is performed, and the write is
not executed. If a data TLB multiple hit exception occurs during address translation,
processing switches to the data TLB multiple hit exception handling routine.
24 23
31
Address field 1 1 1 1 0 1 0 0
14 13
5 4 3 2 1 0
Entry
10 9
31
Data field
A
2 1 0
U V
Tag
V : Validity bit
U : Dirty bit
A : Association bit
: Reserved bits (0 write value, undefined read value)
Figure 4.10 Memory-Mapped OC Address Array
4.5.4
OC Data Array
The OC data array is allocated to addresses H'F500 0000 to H'F5FF FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification. The entry to be accessed is specified in the address field, and the longword
data to be written is specified in the data field.
In the address field, bits [31:24] have the value H'F5 indicating the OC data array, and the entry is
specified by bits [13:5]. CCR.OIX and CCR.ORA have no effect on this entry specification.
Address field bits [4:2] are used for the longword data specification in the entry. As only longword
access is used, 0 should be specified for address field bits [1:0].
The data field is used for the longword data specification.
Rev. 6.0, 07/02, page 115 of 986
The following two kinds of operation can be used on the OC data array:
1. OC data array read
Longword data is read into the data field from the data specified by the longword specification
bits in the address field in the OC entry corresponding to the entry set in the address field.
2. OC data array write
The longword data specified in the data field is written for the data specified by the longword
specification bits in the address field in the OC entry corresponding the entry set in the address
field. This write does not set the U bit to 1 on the address array side.
24 23
31
Address field 1 1 1 1 0 1 0 1
14 13
5 4
Entry
2 1 0
L
0
31
Data field
Longword data
L : Longword specification bits
: Reserved bits (0 write value, undefined read value)
Figure 4.11 Memory-Mapped OC Data Array
4.6
Memory-Mapped Cache Configuration (SH7750R)
To enable the management of the IC and OC by software, a program running in the privileged
mode is allowed to access their contents.
The contents of IC can be read and written by using MOV instructions in a P2-area program
running in the privileged mode. Operation is not guaranteed for access from a program in some
other area. Any branching to other areas must take place at least 8 instructions after this MOV
instruction.
The contents of IC can be read and written by using MOV instructions in a P1- or P2-area
program running in the privileged mode. Operation is not guaranteed if access is attempted from a
program running in some other area. A branch to the P0, U0, or P3 area must be made at least 8
instructions after this MOV instruction.
The IC and OC are allocated to the P4 area of the physical memory space. The address and data
arrays of both the IC and OC are only accessible by their data fields. Longword operations must
be used. Instruction fetches from these areas are not possible. For reserved bits, a write value of 0
should be specified; values read from such bits are undefined. Note that, in the SH7750/SH7750Scompatible mode, the configuration of the SH7750R’s memory-mapped cache is the same as that
of the SH7750 or SH7750S.
Rev. 6.0, 07/02, page 116 of 986
4.6.1
IC Address Array
The IC address array is allocated to addresses H'F000 0000 to H'F0FF FFFF in the P4 area. An
address array access requires a 32-bit address field specification (when reading or writing) and a
32-bit data field specification. The way and entry to be accessed is specified in the address field,
and the write tag and V bit are specified in the data field.
In the address field, bits [31:24] have the value H'F0 indicating the IC address array, the way is
specified by bit [13], and the entry by bits [12:5]. CCR.IIX has no effect on this entry
specification. The address array bit [3] association bit (A bit) specifies whether or not association
is performed when writing to the IC address array. As only longword access is used, 0 should be
specified for address field bits [1:0].
In the data field, the tag is indicated by bits [31:10], and the V bit by bit [0]. As the IC address
array tag is 19 bits in length, data field bits [31:29] are not used in the case of a write in which
association is not performed. Data field bits [31:29] are used for the virtual address specification
only in the case of a write in which association is performed.
The following three kinds of operation can be used on the IC address array:
1. IC address array read
The tag and V bit are read into the data field from the IC entry corresponding to the way and
the entry set in the address field. In a read, associative operation is not performed regardless of
whether the association bit specified in the address field is 1 or 0.
2. IC address array write (non-associative)
The tag and V bit specified in the data field are written to the IC entry corresponding to the
way and the entry set in the address field. The A bit in the address field should be cleared to 0.
3. IC address array write (associative)
When a write is performed with the A bit in the address field set to 1, the tag for each of the
ways stored in the entry specified in the address field is compared with the tag specified in the
data field. The way number set by bit [13] is not used. If the MMU is enabled at this time,
comparison is performed after the virtual address specified by data field bits [31:10] has been
translated to a physical address using the ITLB. If the addresses match and the V bit for that
way is 1, the V bit specified in the data field is written into the IC entry. In other cases, no
operation is performed. This operation is used to invalidate a specific IC entry. If an ITLB
miss occurs during address translation, or the comparison shows a mismatch, an interrupt is
not generated, no operation is performed, and the write is not executed. If an instruction TLB
multiple hit exception occurs during address translation, processing switches to the instruction
TLB multiple hit exception handling routine.
Rev. 6.0, 07/02, page 117 of 986
31
24 23
13 12
5 4 3 2 1 0
Address field 1 1 1 1 0 0 0 0
Entry
A
Way
31
10 9
Data field
Tag
1 0
V
V : Validity bit
A : Association bit
: Reserved bits (0 write value, undefined read value)
Figure 4.12 Memory-Mapped IC Address Array
4.6.2
IC Data Array
The IC data array is allocated to addresses H'F100 0000 to H'F1FF FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification. The way and entry to be accessed is specified in the address field, and the
longword data to be written is specified in the data field.
In the address field, bits [31:24] have the value H'F1 indicating the IC data array, the way is
specified by bit [13], and the entry by bits [12:5]. CCR.IIX has no effect on this entry
specification. Address field bits [4:2] are used for the longword data specification in the entry. As
only longword access is used, 0 should be specified for address field bits [1:0].
The data field is used for the longword data specification.
The following two kinds of operation can be used on the IC data array:
1. IC data array read
Longword data is read into the data field from the data specified by the longword specification
bits in the address field in the IC entry corresponding to the way and entry set in the address
field.
2. IC data array write
The longword data specified in the data field is written for the data specified by the longword
specification bits in the address field in the IC entry corresponding to the way and entry set in
the address field.
Rev. 6.0, 07/02, page 118 of 986
24 23
31
13 12
Address field 1 1 1 1 0 0 0 1
5 4
Entry
2 1 0
L
Way
31
0
Data field
Longword data
L : Longword specification bits
: Reserved bits (0 write value, undefined read value)
Figure 4.13 Memory-Mapped IC Data Array
4.6.3
OC Address Array
The OC address array is allocated to addresses H'F400 0000 to H'F4FF FFFF in the P4 area. An
address array access requires a 32-bit address field specification (when reading or writing) and a
32-bit data field specification. The way and entry to be accessed is specified in the address field,
and the write tag, U bit, and V bit are specified in the data field.
In the address field, bits [31:24] have the value H'F4 indicating the OC address array, the way is
specified by bit [14], and the entry by bits [13:5]. CCR.OIX has no effect on this entry
specification. In RAM mode (CCR.ORA = 1), the OC’s address arrays are only accessible in the
memory-mapped cache area, and bit [13] is used to specify the way. For details about address
mapping, see section 4.6.5. The address array bit [3] association bit (A bit) specifies whether or
not association is performed when writing to the OC address array. As only longword access is
used, 0 should be specified for address field bits [1:0].
In the data field, the tag is indicated by bits [31:10], the U bit by bit [1], and the V bit by bit [0].
As the OC address array tag is 19 bits in length, data field bits [31:29] are not used in the case of a
write in which association is not performed. Data field bits [31:29] are used for the virtual address
specification only in the case of a write in which association is performed.
The following three kinds of operation can be used on the OC address array:
1. OC address array read
The tag, U bit, and V bit are read into the data field from the OC entry corresponding to the
way and the entry set in the address field. In a read, associative operation is not performed
regardless of whether the association bit specified in the address field is 1 or 0.
2. OC address array write (non-associative)
The tag, U bit, and V bit specified in the data field are written to the OC entry corresponding to
the way and the entry set in the address field. The A bit in the address field should be cleared
to 0.
Rev. 6.0, 07/02, page 119 of 986
When a write is performed to a cache line for which the U bit and V bit are both 1, after writeback of that cache line, the tag, U bit, and V bit specified in the data field are written.
3. OC address array write (associative)
When a write is performed with the A bit in the address field set to 1, the tag for each of the
ways stored in the entry specified in the address field is compared with the tag specified in the
data field. The way number set by bit [14] is not used. If the MMU is enabled at this time,
comparison is performed after the virtual address specified by data field bits [31:10] has been
translated to a physical address using the UTLB. If the addresses match and the V bit for that
way is 1, the U bit and V bit specified in the data field are written into the OC entry. This
operation is used to invalidate a specific OC entry. In other cases, no operation is performed. If
the OC entry U bit is 1, and 0 is written to the V bit or to the U bit, write-back is performed. If
an UTLB miss occurs during address translation, or the comparison shows a mismatch, an
exception is not generated, no operation is performed, and the write is not executed. If a data
TLB multiple hit exception occurs during address translation, processing switches to the data
TLB multiple hit exception handling routine.
31
24 23
Address field 1 1 1 1 0 1 0 0
15 14 13
5 4 3 2 1 0
Entry
A
Way
31
10 9
Data field
Tag
2 1 0
U V
V : Validity bit
U : Dirty bit
A : Association bit
: Reserved bits (0 write value, undefined read value)
Figure 4.14 Memory-Mapped OC Address Array
4.6.4
OC Data Array
The OC data array is allocated to addresses H'F500 0000 to H'F5FF FFFF in the P4 area. A data
array access requires a 32-bit address field specification (when reading or writing) and a 32-bit
data field specification. The way and entry to be accessed is specified in the address field, and the
longword data to be written is specified in the data field.
In the address field, bits [31:24] have the value H'F5 indicating the OC data array, the way is
specified by bit [14], and the entry by bits [13:5]. CCR.OIX has no effect on this entry
specification. In RAM mode (CCR.ORA = 1), the OC’s data arrays are only accessible in the
memory-mapped cache area, and bit [13] is used to specify the way. For details about address
mapping, see section 4.6.5. Address field bits [4:2] are used for the longword data specification in
the entry. As only longword access is used, 0 should be specified for address field bits [1:0].
Rev. 6.0, 07/02, page 120 of 986
The data field is used for the longword data specification.
The following two kinds of operation can be used on the OC data array:
1. OC data array read
Longword data is read into the data field from the data specified by the longword specification
bits in the address field in the OC entry corresponding to the way and entry set in the address
field.
2. OC data array write
The longword data specified in the data field is written for the data specified by the longword
specification bits in the address field in the OC entry corresponding the way and entry set in
the address field. This write does not set the U bit to 1 on the address array side.
31
24 23
Address field 1 1 1 1 0 1 0 1
15 14 13
5 4
Entry
2 1 0
L
Way
31
Data field
0
Longword data
L : Longword specification bits
: Reserved bits (0 write value, undefined read value)
Figure 4.15 Memory-Mapped OC Data Array
4.6.5
Summary of the Memory-Mapping of the OC
The address ranges to which the OC is memory-mapped in the double-sized cache mode of the
SH7750R are summarized below, using examples of data-array access.
• In normal mode (CCR.ORA = 0)
H'F500 0000 to H'F500 3FFF (16 kB ): Way 0 (entries 0 to 511)
H'F500 4000 to H'F500 7FFF (16 kB ): Way 1 (entries 0 to 511)
:
:
:
In the same pattern, shadows of the cache area are created in 32-kbyte blocks until H'F5FF
FFFF.
• In RAM mode (CCR. ORA = 1)
H'F500 0000 to H'F500 1FFF (8 kB ): Way 0 (entries 0 to 255)
H'F500 2000 to H'F500 3FFF (8 kB ): Way 1 (entries 0 to 255)
:
:
:
In the same pattern, shadows of the cache area are created in 16-kbyte blocks until H'F5FF
FFFF.
Rev. 6.0, 07/02, page 121 of 986
4.7
Store Queues
The SH7750 Series supports two 32-byte store queues (SQs) to perform high-speed writes to
external memory.
In the SH7750S or SH7750R, if the SQs are not used the low power dissipation power-down
modes, in which SQ functions are stopped, can be used. The queue address control registers
(QACR0 and QACR1) cannot be accessed while SQ functions are stopped. See section 9, PowerDown Modes, for the procedure for stopping SQ functions.
4.7.1
SQ Configuration
There are two 32-byte store queues, SQ0 and SQ1, as shown in figure 4.16. These two store
queues can be set independently.
SQ0
SQ0[0]
SQ0[1]
SQ0[2]
SQ0[3]
SQ0[4]
SQ0[5]
SQ0[6]
SQ0[7]
SQ1
SQ1[0]
SQ1[1]
SQ1[2]
SQ1[3]
SQ1[4]
SQ1[5]
SQ1[6]
SQ1[7]
4B
4B
4B
4B
4B
4B
4B
4B
Figure 4.16 Store Queue Configuration
4.7.2
SQ Writes
A write to the SQs can be performed using a store instruction (MOV) on P4 area H'E000 0000 to
H'E3FF FFFC. A longword or quadword access size can be used. The meaning of the address bits
is as follows:
[31:26]:
[25:6]:
[5]:
[4:2]:
[1:0]
4.7.3
111000
Don’t care
0/1
LW specification
00
Store queue specification
Used for external memory transfer/access right
0: SQ0 specification
1: SQ1 specification
Specifies longword position in SQ0/SQ1
Fixed at 0
Transfer to External Memory
Transfer from the SQs to external memory can be performed with a prefetch instruction (PREF).
Issuing a PREF instruction for P4 area H'E000 0000 to H'E3FF FFFC starts a burst transfer from
the SQs to external memory. The burst transfer length is fixed at 32 bytes, and the start address is
always at a 32-byte boundary. While the contents of one SQ are being transferred to external
Rev. 6.0, 07/02, page 122 of 986
memory, the other SQ can be written to without a penalty cycle, but writing to the SQ involved in
the transfer to external memory is deferred until the transfer is completed.
The SQ transfer destination external memory address bit [28:0] specification is as shown below,
according to whether the MMU is on or off.
• When MMU is on
The SQ area (H'E000 0000 to H'E3FF FFFF) is set in VPN of the UTLB, and the transfer
destination external memory address in PPN. The ASID, V, SZ, SH, PR, and D bits have the
same meaning as for normal address translation, but the C and WT bits have no meaning with
regard to this page. Since burst transfer is prohibited for PCMCIA areas, the SA and TC bits
also have no meaning.
When a prefetch instruction is issued for the SQ area, address translation is performed and
external memory address bits [28:10] are generated in accordance with the SZ bit specification.
For external memory address bits [9:5], the address prior to address translation is generated in
the same way as when the MMU is off. External memory address bits [4:0] are fixed at 0.
Transfer from the SQs to external memory is performed to this address.
• When MMU is off
The SQ area (H'E000 0000 to H'E3FF FFFF) is specified as the address to issue a PREF
instruction. The meaning of address bits [31:0] is as follows:
[31:26]:
111000
Store queue specification
[25:6]:
Address
External memory address bits [25:6]
[5]:
0/1
0: SQ0 specification
1: SQ1 specification and external memory address bit [5]
[4:2]:
[1:0]
Don’t care
00
No meaning in a prefetch
Fixed at 0
External memory address bits [28:26], which cannot be generated from the above address, are
generated from the QACR0/1 registers.
QACR0 [4:2]:
External memory address bits [28:26] corresponding to SQ0
QACR1 [4:2]:
External memory address bits [28:26] corresponding to SQ1
External memory address bits [4:0] are always fixed at 0 since burst transfer starts at a 32-byte
boundary. In the SH7750, data transfer to a PCMCIA interface area cannot be performed using
an SQ. In the SH7750S or SH7750R, data transfer to a PCMCIA interface area is always
performed using the SA and TC bits in the PTEA register.
Rev. 6.0, 07/02, page 123 of 986
4.7.4
SQ Protection
Determination of an exception in a write to an SQ or transfer to external memory (PREF
instruction) is performed as follows according to whether the MMU is on or off. In the SH7750 or
SH7750S, if an exception occurs in an SQ write, the SQ contents may be corrupted. In the
SH7750R, original SQ contents are guaranteed. If an exception occurs in transfer from an SQ to
external memory, the transfer to external memory will be aborted.
• When MMU is on
Operation is in accordance with the address translation information recorded in the UTLB, and
MMUCR.SQMD. Write type exception judgment is performed for writes to the SQs, and read
type for transfer from the SQs to external memory (PREF instruction), and a TLB miss
exception, protection violation exception, or initial page write exception is generated.
However, if SQ access is enabled, in privileged mode only, by MMUCR.SQMD, an address
error will be flagged in user mode even if address translation is successful.
• When MMU is off
Operation is in accordance with MMUCR.SQMD.
0: Privileged/user access possible
1: Privileged access possible
If the SQ area is accessed in user mode when MMUCR.SQMD is set to 1, an address error will
be flagged.
4.7.5
Reading the SQs (SH7750R Only)
In the SH7750R, a load instruction may be executed in the privileged mode to read the contents of
the SQs from the address range of H'FF001000 to H'FF00103C in the P4 area. Only longword
access is possible.
[31:6]
[5]
[4:2]
[1:0]
: H'FF001000
: 0/1
: LW specification
: 00
: Store queue specification
: 0: SQ0 specification, 1: SQ1 specification
: Specification of longword position in SQ0 or SQ1
: Fixed at 0
Rev. 6.0, 07/02, page 124 of 986
4.7.6
SQ Usage Notes
If an exception occurs within the three instructions preceding an instruction that writes to an SQ in
the SH7750 and SH7750S, a branch may be made to the exception handling routine after
execution of the SQ write that should be suppressed when an exception occurs.
This may be due to the bug described in (1) or (2) below.
(1) When SQ data is transferred to external memory within a normal program
If a PREF instruction for transfer from an SQ to external memory is included in the three
instructions preceding an SQ store instruction, the SQ is updated because the SQ write that
should be suppressed when a branch is made to the exception handling routine is executed, and
after returning from the exception handling routine the execution order of the PREF instruction
and SQ store instruction is reversed, so that erroneous data may be transferred to external
memory.
(2) When SQ data is transferred to external memory in an exception handling routine
If store queue contents are transferred to external memory within an exception handling
routine, erroneous data may be transferred to external memory.
Example 1: When an SQ store instruction is executed after a PREF instruction for transfer from that same SQ
to external memory
PREF instruction
; PREF instruction for transfer from SQ to external memory
; Address of this instruction is saved to SPC when exception occurs.
; Instruction 1, instruction 2, or instruction 3 may be executed on return from exception handling routine.
Instruction 1 ; May be executed if an SQ store instruction.
Instruction 2 ; May be executed if an SQ store instruction.
Instruction 3 ; May be executed if an SQ store instruction.
Instruction 4 ; Not executed even if an SQ store instruction.
Example 2: When an instruction that generates an exception branches using a branch instruction
Instruction 1 (branch instruction) ; Address of this instruction is saved to SPC when exception occurs.
Instruction 2 ; May be executed if instruction 1 is a delay slot instruction and an instruction to store data to SQ.
Instruction 3
Instruction 4
Instruction 5
Instruction 6
Instruction 7 (branch destination of instruction 1)
; May be executed if an SQ access instruction.
Instruction 8 ; May be executed if an SQ store instruction.
Rev. 6.0, 07/02, page 125 of 986
Example 3: When an instruction that generates an exception does not branch using a branch instruction
Instruction 1 (branch instruction) ; Address of this instruction is saved to SPC when exception occurs.
Instruction 2 ; May be executed if an SQ store instruction.
Instruction 3 ; May be executed if an SQ store instruction.
Instruction 4 ; May be executed if an SQ store instruction.
Instruction 5
To recover from this problem it is necessary that conditions A and B be satisfied.
A: After the PREF instruction to transfer data from the store queue (SQ0, SQ1) to external
memory, a store instruction for the same store queue must be executed, and conditions (1) and
(2) below must be satisfied.
1
(1) Three NOP instructions* must be inserted between the above two instructions.
(2) There must not be a PREF instruction to transfer data from the store queue to external
memory in the delay slot of the branch instruction.
B: There must be no PREF instruction to transfer data from the store queue to external memory
executed in the exception handling routine.
If such an instruction is executed, and if there is a store to the store queue instruction among
2
the four instructions* at the address referred to by SPC, the data transferred to external
memory by the PREF instruction may indicate that execution of the store instruction has
completed.
Notes: *1 If there are other instructions between the above two instructions, the problem can be
avoided if the other instructions and NOP instructions together total three or more
instructions.
*2 If the instruction at the address referred to by SPC is a branch instruction the two
instructions at the branch destination may be affected.
Rev. 6.0, 07/02, page 126 of 986
Section 5 Exceptions
5.1
Overview
5.1.1
Features
Exception handling is processing handled by a special routine, separate from normal program
processing, that is executed by the CPU in case of abnormal events. For example, if the executing
instruction ends abnormally, appropriate action must be taken in order to return to the original
program sequence, or report the abnormality before terminating the processing. The process of
generating an exception handling request in response to abnormal termination, and passing control
to a user-written exception handling routine, in order to support such functions, is given the
generic name of exception handling.
SH7750 Series exception handling is of three kinds: for resets, general exceptions, and interrupts.
5.1.2
Register Configuration
The registers used in exception handling are shown in table 5.1.
Table 5.1
Exception-Related Registers
Abbreviation
R/W
Initial Value*
TRAPA exception
register
TRA
R/W
Undefined
H'FF00 0020 H'1F00 0020 32
Exception event
register
EXPEVT
R/W
H'0000 0000/
1
H'0000 0020*
H'FF00 0024 H'1F00 0024 32
Interrupt event
register
INTEVT
R/W
Undefined
H'FF00 0028 H'1F00 0028 32
Name
1
P4
2
Address*
Area 7
2
Address*
Access
Size
Notes: *1 H'0000 0000 is set in a power-on reset, and H'0000 0020 in a manual reset.
*2 This is the address when using the virtual/physical address space P4 area. The area 7
address is the address used when making an access from physical address space area
7 using the TLB.
Rev. 6.0, 07/02, page 127 of 986
5.2
Register Descriptions
There are three registers related to exception handling. Addresses are allocated to these registers,
and they can be accessed by specifying the P4 address or area 7 address.
1. The exception event register (EXPEVT) resides at P4 address H'FF00 0024, and contains a 12bit exception code. The exception code set in EXPEVT is that for a reset or general exception
event. The exception code is set automatically by hardware when an exception occurs.
EXPEVT can also be modified by software.
2. The interrupt event register (INTEVT) resides at P4 address H'FF00 0028, and contains a 12bit exception code. The exception code set in INTEVT is that for an interrupt request. The
exception code is set automatically by hardware when an exception occurs. INTEVT can also
be modified by software.
3. The TRAPA exception register (TRA) resides at P4 address H'FF00 0020, and contains 8-bit
immediate data (imm) for the TRAPA instruction. TRA is set automatically by hardware when
a TRAPA instruction is executed. TRA can also be modified by software.
The bit configurations of EXPEVT, INTEVT, and TRA are shown in figure 5.1.
EXPEVT and INTEVT
31
12 11
0
0
Exception code
0
TRA
31
2 1 0
10 9
0
0
imm
0 0
0: Reserved bits. These bits are always read as 0, and should only be written
with 0.
imm: 8-bit immediate data of the TRAPA instruction
Figure 5.1 Register Bit Configurations
Rev. 6.0, 07/02, page 128 of 986
5.3
Exception Handling Functions
5.3.1
Exception Handling Flow
In exception handling, the contents of the program counter (PC), status register (SR), and R15 are
saved in the saved program counter (SPC), saved status register (SSR), and saved general
register15(SGR), and the CPU starts execution of the appropriate exception handling routine
according to the vector address. An exception handling routine is a program written by the user to
handle a specific exception. The exception handling routine is terminated and control returned to
the original program by executing a return-from-exception instruction (RTE). This instruction
restores the PC and SR contents and returns control to the normal processing routine at the point at
which the exception occurred.
The SGR contents are not written back to R15 by an RTE instruction.
The basic processing flow is as follows. See section 2, Data Formats and Registers, for the
meaning of the individual SR bits.
1. The PC, SR, and R15 contents are saved in SPC, SSR, and SGR.
2. The block bit (BL) in SR is set to 1.
3. The mode bit (MD) in SR is set to 1.
4. The register bank bit (RB) in SR is set to 1.
5. In a reset, the FPU disable bit (FD) in SR is cleared to 0.
6. The exception code is written to bits 11–0 of the exception event register (EXPEVT) or
interrupt event register (INTEVT).
7. The CPU branches to the determined exception handling vector address, and the exception
handling routine begins.
5.3.2
Exception Handling Vector Addresses
The reset vector address is fixed at H'A000 0000. Exception and interrupt vector addresses are
determined by adding the offset for the specific event to the vector base address, which is set by
software in the vector base register (VBR). In the case of the TLB miss exception, for example,
the offset is H'0000 0400, so if H'9C08 0000 is set in VBR, the exception handling vector address
will be H'9C08 0400. If a further exception occurs at the exception handling vector address, a
duplicate exception will result, and recovery will be difficult; therefore, fixed physical addresses
(P1, P2) should be specified for vector addresses.
Rev. 6.0, 07/02, page 129 of 986
5.4
Exception Types and Priorities
Table 5.2 shows the types of exceptions, with their relative priorities, vector addresses, and
exception/interrupt codes.
Table 5.2
Exceptions
Exception Execution
Category Mode
Exception
Reset
General
exception
Abort type Power-on reset
Priority Priority Vector
Level
Order Address
Offset
Exception
Code
1
1
H'A000 0000 —
H’000
Manual reset
1
2
H'A000 0000 —
H’020
H-UDI reset
1
1
H'A000 0000 —
H’000
Instruction TLB multiple-hit
exception
1
3
H'A000 0000 —
H’140
Data TLB multiple-hit exception 1
4
H'A000 0000 —
H’140
2
0
(VBR/DBR)
H'100/— H'1E0
2
1
(VBR)
H'100
H'0E0
Instruction TLB miss exception
2
2
(VBR)
H'400
H'040
Instruction TLB protection
violation exception
2
3
(VBR)
H'100
H'0A0
General illegal instruction
exception
2
4
(VBR)
H'100
H'180
ReUser break before instruction
1
execution execution*
type
Instruction address error
Slot illegal instruction exception 2
4
(VBR)
H'100
H'1A0
General FPU disable exception 2
4
(VBR)
H'100
H'800
Slot FPU disable exception
2
4
(VBR)
H'100
H'820
Data address error (read)
2
5
(VBR)
H'100
H'0E0
Data address error (write)
2
5
(VBR)
H'100
H'100
Data TLB miss exception (read) 2
6
(VBR)
H'400
H'040
Data TLB miss exception (write) 2
6
(VBR)
H'400
H'060
Data TLB protection
violation exception (read)
2
7
(VBR)
H'100
H'0A0
Data TLB protection
violation exception (write)
2
7
(VBR)
H'100
H'0C0
FPU exception
2
8
(VBR)
H'100
H'120
Initial page write exception
2
9
(VBR)
H'100
H'080
2
4
(VBR)
H'100
H'160
2
10
(VBR/DBR)
H'100/— H'1E0
Completion Unconditional trap (TRAPA)
type
User break after instruction
1
execution*
Rev. 6.0, 07/02, page 130 of 986
Table 5.2
Exceptions (cont)
Exception Execution
Category Mode
Exception
Interrupt
Completion Nonmaskable interrupt
type
External IRL3–IRL0 0
interrupts
1
Priority Priority Vector
Level
Order
Address
Offset
Exception
Code
3
—
(VBR)
H'600
H'1C0
4
*2
(VBR)
H'600
H'200
H'220
2
H'240
3
H'260
4
H'280
5
H'2A0
6
H'2C0
7
H'2E0
8
H'300
9
H'320
A
H'340
B
H'360
C
H'380
D
H'3A0
E
Peripheral TMU0
module
TMU1
interrupt
(module/ TMU2
source)
TUNI0 4
H'3C0
*2
(VBR)
H'600
H'400
TUNI1
H'420
TUNI2
H'440
TICPI2
H'460
TMU3
TUNI3
H'B00
TMU4
TUNI4
H'B80
RTC
ATI
H'480
SCI
PRI
H'4A0
CUI
H'4C0
ERI
H'4E0
RXI
H'500
TXI
H'520
TEI
H'540
WDT
ITI
H'560
REF
RCMI
H'580
ROVI
H'5A0
H-UDI
H-UDI
H'600
GPIO
GPIOI
H'620
Rev. 6.0, 07/02, page 131 of 986
Table 5.2
Exceptions (cont)
Exception Execution
Category Mode
Exception
Interrupt
Priority Priority Vector
Level
Order
Address
Completion Peripheral DMAC
type
module
interrupt
(module/
source)
SCIF
DMTE0 4
*2
(VBR)
Offset
Exception
Code
H'600
H'640
DMTE1
H'660
DMTE2
H'680
DMTE3
H'6A0
DMTE4
*3
H'780
DMTE5
*3
H'7A0
DMTE6
*3
H'7C0
DMTE7
*3
H'7E0
DMAE
H'6C0
ERI
H'700
RXI
H'720
BRI
H'740
TXI
H'760
Priority: Priority is first assigned by priority level, then by priority order within each level (the lowest
number represents the highest priority).
Exception transition destination: Control passes to H'A000 0000 in a reset, and to [VBR + offset] in
other cases.
Exception code: Stored in EXPEVT for a reset or general exception, and in INTEVT for an interrupt.
IRL: Interrupt request level (pins IRL3–IRL0).
Module/source: See the sections on the relevant peripheral modules.
Notes: *1 When BRCR.UBDE = 1, PC = DBR. In other cases, PC = VBR + H'100.
*2 The priority order of external interrupts and peripheral module interrupts can be set by
software.
*3 SH7750R only.
5.5
Exception Flow
5.5.1
Exception Flow
Figure 5.2 shows an outline flowchart of the basic operations in instruction execution and
exception handling. For the sake of clarity, the following description assumes that instructions are
executed sequentially, one by one. Figure 5.2 shows the relative priority order of the different
kinds of exceptions (reset/general exception/interrupt). Register settings in the event of an
Rev. 6.0, 07/02, page 132 of 986
exception are shown only for SSR, SPC, SGR, EXPEVT/INTEVT, SR, and PC, but other registers
may be set automatically by hardware, depending on the exception. For details, see section 5.6,
Description of Exceptions. Also, see section 5.6.4, Priority Order with Multiple Exceptions, for
exception handling during execution of a delayed branch instruction and a delay slot instruction,
and in the case of instructions in which two data accesses are performed.
Reset
requested?
Yes
No
Execute next instruction
General
exception requested?
Yes
No
Interrupt
requested?
No
Is highestYes
priority exception
re-exception
type?
Cancel instruction execution
No
result
Yes
SSR ← SR
SPC ← PC
SGR ← R15
EXPEVT/INTEVT ← exception code
SR.{MD,RB,BL} ← 111
PC ← (BRCR.UBDE=1 && User_Break?
DBR: (VBR + Offset))
EXPEVT ← exception code
SR. {MD, RB, BL, FD, IMASK} ← 11101111
PC ← H'A000 0000
Figure 5.2 Instruction Execution and Exception Handling
5.5.2
Exception Source Acceptance
A priority ranking is provided for all exceptions for use in determining which of two or more
simultaneously generated exceptions should be accepted. Five of the general exceptions—the
general illegal instruction exception, slot illegal instruction exception, general FPU disable
exception, slot FPU disable exception, and unconditional trap exception—are detected in the
process of instruction decoding, and do not occur simultaneously in the instruction pipeline. These
exceptions therefore all have the same priority. General exceptions are detected in the order of
instruction execution. However, exception handling is performed in the order of instruction flow
(program order). Thus, an exception for an earlier instruction is accepted before that for a later
instruction. An example of the order of acceptance for general exceptions is shown in figure 5.3.
Rev. 6.0, 07/02, page 133 of 986
Pipeline flow:
Instruction n
Instruction n+1
IF
ID
EX
TLB miss (data access)
MA WB
IF
ID
EX
MA
WB
General illegal instruction exception
Instruction n+2
TLB miss (instruction access)
IF
ID
EX MA WB
Instruction n+3
IF
ID
EX
MA
WB
IF:
ID:
EX:
MA:
WB:
Instruction fetch
Instruction decode
Instruction execution
Memory access
Write-back
Order of detection:
General illegal instruction exception (instruction n+1) and
TLB miss (instruction n+2) are detected simultaneously
TLB miss (instruction n)
Order of exception handling:
Program order
TLB miss (instruction n)
1
Re-execution of instruction n
General illegal instruction exception
(instruction n+1)
2
Re-execution of instruction n+1
TLB miss (instruction n+2)
3
Re-execution of instruction n+2
Execution of instruction n+3
4
Figure 5.3 Example of General Exception Acceptance Order
Rev. 6.0, 07/02, page 134 of 986
5.5.3
Exception Requests and BL Bit
When the BL bit in SR is 0, exceptions and interrupts are accepted.
When the BL bit in SR is 1 and an exception other than a user break is generated, the CPU's
internal registers and the registers of the other modules are set to their states following a manual
reset, and the CPU branches to the same address as in a reset (H'A000 0000). For the operation in
the event of a user break, see section 20, User Break Controller. If an ordinary interrupt occurs, the
interrupt request is held pending and is accepted after the BL bit has been cleared to 0 by software.
If a nonmaskable interrupt (NMI) occurs, it can be held pending or accepted according to the
setting made by software.
Thus, normally, SPC and SSR are saved and then the BL bit in SR is cleared to 0, to enable
multiple exception state acceptance.
5.5.4
Return from Exception Handling
The RTE instruction is used to return from exception handling. When the RTE instruction is
executed, the SPC contents are restored to PC and the SSR contents to SR, and the CPU returns
from the exception handling routine by branching to the SPC address. If SPC and SSR were saved
to external memory, set the BL bit in SR to 1 before restoring the SPC and SSR contents and
issuing the RTE instruction.
5.6
Description of Exceptions
The various exception handling operations are described here, covering exception sources,
transition addresses, and processor operation when a transition is made.
Rev. 6.0, 07/02, page 135 of 986
5.6.1
Resets
(1) Power-On Reset
• Sources:
SCK2 pin high level and 5(6(7 pin low level
When the watchdog timer overflows while the WT/,7 bit is set to 1 and the RSTS bit is
cleared to 0 in WTCSR. For details, see section 10, Clock Oscillation Circuits.
• Transition address: H'A000 0000
• Transition operations:
Exception code H'000 is set in EXPEVT, initialization of VBR and SR is performed, and a
branch is made to PC = H'A000 0000.
In the initialization processing, the VBR register is set to H'0000 0000, and in SR, the MD,
RB, and BL bits are set to 1, the FD bit is cleared to 0, and the interrupt mask bits (I3–I0) are
set to B'1111.
CPU and on-chip peripheral module initialization is performed. For details, see the register
descriptions in the relevant sections. For some CPU functions, the 7567 pin and 5(6(7 pin
must be driven low. It is therefore essential to execute a power-on reset and drive the 7567
pin low when powering on.
If the SCK2 pin is changed to the low level while the 5(6(7 pin is low, a manual reset may
occur after the power-on reset operation. Do not drive the SCK2 pin low during this interval
(see figure 22.3).
Power_on_reset()
{
EXPEVT = H'00000000;
VBR = H'00000000;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
SR.(I0-I3) = B'1111;
SR.FD=0;
Initialize_CPU();
Initialize_Module(PowerOn);
PC = H'A0000000;
}
Rev. 6.0, 07/02, page 136 of 986
(2) Manual Reset
• Sources:
SCK2 pin low level and 5(6(7 pin low level
When a general exception other than a user break occurs while the BL bit is set to 1 in SR
When the watchdog timer overflows while the WT/,7 bit and RSTS bit are both set to 1 in
WTCSR. For details, see section 10, Clock Oscillation Circuits.
• Transition address: H'A000 0000
• Transition operations:
Exception code H'020 is set in EXPEVT, initialization of VBR and SR is performed, and a
branch is made to PC = H'A000 0000.
In the initialization processing, the VBR register is set to H'0000 0000, and in SR, the MD,
RB, and BL bits are set to 1, the FD bit is cleared to 0, and the interrupt mask bits (I3–I0) are
set to B'1111.
CPU and on-chip peripheral module initialization is performed. For details, see the register
descriptions in the relevant sections.
Manual_reset()
{
EXPEVT = H'00000020;
VBR = H'00000000;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
SR.(I0-I3) = B'1111;
SR.FD = 0;
Initialize_CPU();
Initialize_Module(Manual);
PC = H'A0000000;
}
Table 5.3
Types of Reset
Reset State Transition
Conditions
Internal States
On-Chip Peripheral
Modules
Type
SCK2
5(6(7
CPU
Power-on reset
High
Low
Initialized
Manual reset
Low
Low
Initialized
See Register
Configuration in
each section
Rev. 6.0, 07/02, page 137 of 986
(3) H-UDI Reset
• Source: SDIR.TI3–TI0 = B'0110 (negation) or B'0111 (assertion)
• Transition address: H'A000 0000
• Transition operations:
Exception code H'000 is set in EXPEVT, initialization of VBR and SR is performed, and a
branch is made to PC = H'A000 0000.
In the initialization processing, the VBR register is set to H'0000 0000, and in SR, the MD,
RB, and BL bits are set to 1, the FD bit is cleared to 0, and the interrupt mask bits (I3–I0) are
set to B'1111.
CPU and on-chip peripheral module initialization is performed. For details, see the register
descriptions in the relevant sections.
H-UDI_reset()
{
EXPEVT = H'00000000;
VBR = H'00000000;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
SR.(I0-I3) = B'1111;
SR.FD = 0;
Initialize_CPU();
Initialize_Module(PowerOn);
PC = H'A0000000;
}
Rev. 6.0, 07/02, page 138 of 986
(4) Instruction TLB Multiple-Hit Exception
• Source: Multiple ITLB address matches
• Transition address: H'A000 0000
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
Exception code H'140 is set in EXPEVT, initialization of VBR and SR is performed, and a
branch is made to PC = H'A000 0000.
In the initialization processing, the VBR register is set to H'0000 0000, and in SR, the MD,
RB, and BL bits are set to 1, the FD bit is cleared to 0, and the interrupt mask bits (I3–I0) are
set to B'1111.
CPU and on-chip peripheral module initialization is performed in the same way as in a manual
reset. For details, see the register descriptions in the relevant sections.
TLB_multi_hit()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
EXPEVT = H'00000140;
VBR = H'00000000;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
SR.(I0-I3) = B'1111;
SR.FD = 0;
Initialize_CPU();
Initialize_Module(Manual);
PC = H'A0000000;
}
Rev. 6.0, 07/02, page 139 of 986
(5) Operand TLB Multiple-Hit Exception
• Source: Multiple UTLB address matches
• Transition address: H'A000 0000
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
Exception code H'140 is set in EXPEVT, initialization of VBR and SR is performed, and a
branch is made to PC = H'A000 0000.
In the initialization processing, the VBR register is set to H'0000 0000, and in SR, the MD,
RB, and BL bits are set to 1, the FD bit is cleared to 0, and the interrupt mask bits (I3–I0) are
set to B'1111.
CPU and on-chip peripheral module initialization is performed in the same way as in a manual
reset. For details, see the register descriptions in the relevant sections.
TLB_multi_hit()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
EXPEVT = H'00000140;
VBR = H'00000000;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
SR.(I0-I3) = B'1111;
SR.FD = 0;
Initialize_CPU();
Initialize_Module(Manual);
PC = H'A0000000;
}
Rev. 6.0, 07/02, page 140 of 986
5.6.2
General Exceptions
(1) Data TLB Miss Exception
• Source: Address mismatch in UTLB address comparison
• Transition address: VBR + H'0000 0400
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'040 (for a read access) or H'060 (for a write access) is set in EXPEVT. The
BL, MD, and RB bits are set to 1 in SR, and a branch is made to PC = VBR + H'0400.
To speed up TLB miss processing, the offset is separate from that of other exceptions.
Data_TLB_miss_exception()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = read_access ? H'00000040 : H'00000060;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000400;
}
Rev. 6.0, 07/02, page 141 of 986
(2) Instruction TLB Miss Exception
•
Source: Address mismatch in ITLB address comparison
• Transition address: VBR + H'0000 0400
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'040 is set in EXPEVT. The BL, MD, and RB bits are set to 1 in SR, and a
branch is made to PC = VBR + H'0400.
To speed up TLB miss processing, the offset is separate from that of other exceptions.
ITLB_miss_exception()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = H'00000040;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000400;
}
Rev. 6.0, 07/02, page 142 of 986
(3) Initial Page Write Exception
• Source: TLB is hit in a store access, but dirty bit D = 0
• Transition address: VBR + H'0000 0100
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'080 is set in EXPEVT. The BL, MD, and RB bits are set to 1 in SR, and a
branch is made to PC = VBR + H'0100.
Initial_write_exception()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = H'00000080;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000100;
}
Rev. 6.0, 07/02, page 143 of 986
(4) Data TLB Protection Violation Exception
• Source: The access does not accord with the UTLB protection information (PR bits) shown
below.
PR
Privileged Mode
User Mode
00
Only read access possible
Access not possible
01
Read/write access possible
Access not possible
10
Only read access possible
Only read access possible
11
Read/write access possible
Read/write access possible
• Transition address: VBR + H'0000 0100
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'0A0 (for a read access) or H'0C0 (for a write access) is set in EXPEVT. The
BL, MD, and RB bits are set to 1 in SR, and a branch is made to PC = VBR + H'0100.
Data_TLB_protection_violation_exception()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = read_access ? H'000000A0 : H'000000C0;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000100;
}
Rev. 6.0, 07/02, page 144 of 986
(5) Instruction TLB Protection Violation Exception
• Source: The access does not accord with the ITLB protection information (PR bits) shown
below.
PR
Privileged Mode
User Mode
0
Access possible
Access not possible
1
Access possible
Access possible
• Transition address: VBR + H'0000 0100
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'0A0 is set in EXPEVT. The BL, MD, and RB bits are set to 1 in SR, and a
branch is made to PC = VBR + H'0100.
ITLB_protection_violation_exception()
{
TEA = EXCEPTION_ADDRESS;
PTEH.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = H'000000A0;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000100;
}
Rev. 6.0, 07/02, page 145 of 986
(6) Data Address Error
• Sources:
Word data access from other than a word boundary (2n +1)
Longword data access from other than a longword data boundary (4n +1, 4n + 2, or 4n +3)
Quadword data access from other than a quadword data boundary (8n +1, 8n + 2, 8n +3, 8n
+ 4, 8n + 5, 8n + 6, or 8n + 7)
Access to area H'8000 0000–H'FFFF FFFF in user mode
• Transition address: VBR + H'0000 0100
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'0E0 (for a read access) or H'100 (for a write access) is set in EXPEVT. The
BL, MD, and RB bits are set to 1 in SR, and a branch is made to PC = VBR + H'0100. For
details, see section 3, Memory Management Unit (MMU).
Data_address_error()
{
TEA = EXCEPTION_ADDRESS;
PTEN.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = read_access? H'000000E0: H'00000100;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000100;
}
Rev. 6.0, 07/02, page 146 of 986
(7) Instruction Address Error
• Sources:
Instruction fetch from other than a word boundary (2n +1)
Instruction fetch from area H'8000 0000–H'FFFF FFFF in user mode
• Transition address: VBR + H'0000 0100
• Transition operations:
The virtual address (32 bits) at which this exception occurred is set in TEA, and the
corresponding virtual page number (22 bits) is set in PTEH [31:10]. ASID in PTEH indicates
the ASID when this exception occurred.
The PC and SR contents for the instruction at which this exception occurred are saved in SPC
and SSR, and the contents of R15 are saved in SGR.
Exception code H'0E0 is set in EXPEVT. The BL, MD, and RB bits are set to 1 in SR, and a
branch is made to PC = VBR + H'0100. For details, see section 3, Memory Management Unit
(MMU).
Instruction_address_error()
{
TEA = EXCEPTION_ADDRESS;
PTEN.VPN = PAGE_NUMBER;
SPC = PC;
SSR = SR;
SGR = R15;
EXPEVT = H'000000E0;
SR.MD = 1;
SR.RB = 1;
SR.BL = 1;
PC = VBR + H'00000100;
}
Rev. 6.0, 07/02, page 147 of 986
(8) Unconditional Trap
• Source: Execution of TRAPA instruction
• Transition address: VBR + H'0000 0100
• Transition operations:
As this is a processing-completion-type exception, the PC contents for the instruction
following the TRAPA instruction are saved in SPC. The values of SR and R15 when the
TRAPA instruction is executed are saved in SSR and SGR. The 8-bit immediate value in the
TRAPA instruction is multiplied by 4, and the result is set in TRA [9:0]. Exception code H'160
is set in EXPEVT. The BL, MD, and RB bits are set to 1 in SR, and a branch is made to PC =
VBR + H'0100.
TRAPA_exception()
{
SPC = PC + 2;
SSR = SR;
SGR = R15;
TRA = imm FRm, 1 → T
Otherwise, 0 → T
1111nnnnmmmm0101
—
Comparison
result
FDIV
FRm,FRn
FRn/FRm → FRn
1111nnnnmmmm0011
—
—
FLOAT
FPUL,FRn
(float) FPUL → FRn
1111nnnn00101101
—
—
FMAC
FR0,FRm,FRn
FR0 * FRm + FRn → FRn
1111nnnnmmmm1110
—
—
FMUL
FRm,FRn
FRn * FRm → FRn
1111nnnnmmmm0010
—
—
FNEG
FRn
FRn ∧ H'80000000 → FRn
1111nnnn01001101
—
—
FRn → FRn
1111nnnnmmmm1010
FSQRT
FRn
1111nnnn01101101
—
—
FSUB
FRm,FRn
FRn – FRm → FRn
1111nnnnmmmm0001
—
—
FTRC
FRm,FPUL
(long) FRm → FPUL
1111mmmm00111101
—
—
Rev. 6.0, 07/02, page 189 of 986
Table 7.10 Floating-Point Double-Precision Instructions
Instruction
Operation
Instruction Code
Privileged
T Bit
FABS
DRn
DRn & H'7FFF FFFF FFFF
FFFF → DRn
1111nnn001011101
—
—
FADD
DRm,DRn
DRn + DRm → DRn
1111nnn0mmm00000
—
—
FCMP/EQ
DRm,DRn
When DRn = DRm, 1 → T
Otherwise, 0 → T
1111nnn0mmm00100
—
Comparison
result
FCMP/GT
DRm,DRn
When DRn > DRm, 1 → T
Otherwise, 0 → T
1111nnn0mmm00101
—
Comparison
result
FDIV
DRm,DRn
DRn /DRm → DRn
1111nnn0mmm00011
—
—
FCNVDS
DRm,FPUL
double_to_ float[DRm] → FPUL 1111mmm010111101
—
—
FCNVSD
FPUL,DRn
float_to_ double [FPUL] → DRn 1111nnn010101101
—
—
FLOAT
FPUL,DRn
(float)FPUL → DRn
1111nnn000101101
—
—
FMUL
DRm,DRn
DRn * DRm → DRn
1111nnn0mmm00010
—
—
FNEG
DRn
DRn ^ H'8000 0000 0000 0000
→ DRn
1111nnn001001101
—
—
FSQRT
DRn
1111nnn001101101
—
—
DRn
DRn
FSUB
DRm,DRn
DRn – DRm → DRn
1111nnn0mmm00001
—
—
FTRC
DRm,FPUL
(long) DRm → FPUL
1111mmm000111101
—
—
Operation
Instruction Code
Privileged
T Bit
Table 7.11 Floating-Point Control Instructions
Instruction
LDS
Rm,FPSCR
Rm → FPSCR
0100mmmm01101010
—
—
LDS
Rm,FPUL
Rm → FPUL
0100mmmm01011010
—
—
LDS.L
@Rm+,FPSCR
(Rm) → FPSCR, Rm+4 → Rm
0100mmmm01100110
—
—
LDS.L
@Rm+,FPUL
(Rm) → FPUL, Rm+4 → Rm
0100mmmm01010110
—
—
STS
FPSCR,Rn
FPSCR → Rn
0000nnnn01101010
—
—
STS
FPUL,Rn
FPUL → Rn
0000nnnn01011010
—
—
STS.L
FPSCR,@-Rn
Rn – 4 → Rn, FPSCR → (Rn)
0100nnnn01100010
—
—
STS.L
FPUL,@-Rn
Rn – 4 → Rn, FPUL → (Rn)
0100nnnn01010010
—
—
Rev. 6.0, 07/02, page 190 of 986
Table 7.12 Floating-Point Graphics Acceleration Instructions
Instruction
Operation
Instruction Code
Privileged
T Bit
FMOV
DRm,XDn
DRm → XDn
1111nnn1mmm01100
—
—
FMOV
XDm,DRn
XDm → DRn
1111nnn0mmm11100
—
—
FMOV
XDm,XDn
XDm → XDn
1111nnn1mmm11100
—
—
FMOV
@Rm,XDn
(Rm) → XDn
1111nnn1mmmm1000
—
—
FMOV
@Rm+,XDn
(Rm) → XDn, Rm + 8 → Rm
1111nnn1mmmm1001
—
—
FMOV
@(R0,Rm),XDn
(R0 + Rm) → XDn
1111nnn1mmmm0110
—
—
FMOV
XDm,@Rn
XDm → (Rn)
1111nnnnmmm11010
—
—
FMOV
XDm,@-Rn
Rn – 8 → Rn, XDm → (Rn)
1111nnnnmmm11011
—
—
FMOV
XDm,@(R0,Rn)
XDm → (R0+Rn)
1111nnnnmmm10111
—
—
FIPR
FVm,FVn
inner_product [FVm, FVn] →
FR[n+3]
1111nnmm11101101
—
—
FTRV
XMTRX,FVn
transform_vector [XMTRX, FVn] 1111nn0111111101
→ FVn
—
—
FRCHG
~FPSCR.FR → SPFCR.FR
1111101111111101
—
—
FSCHG
~FPSCR.SZ → SPFCR.SZ
1111001111111101
—
—
Rev. 6.0, 07/02, page 191 of 986
Rev. 6.0, 07/02, page 192 of 986
Section 8 Pipelining
The SH7750 Series is a 2-ILP (instruction-level-parallelism) superscalar pipelining
microprocessor. Instruction execution is pipelined, and two instructions can be executed in
parallel. The execution cycles depend on the implementation of a processor. Definitions in this
section may not be applicable to SH-4 Series models other than the SH7750 Series.
8.1
Pipelines
Figure 8.1 shows the basic pipelines. Normally, a pipeline consists of five or six stages: instruction
fetch (I), decode and register read (D), execution (EX/SX/F0/F1/F2/F3), data access (NA/MA),
and write-back (S/FS). An instruction is executed as a combination of basic pipelines. Figure 8.2
shows the instruction execution patterns.
Rev. 6.0, 07/02, page 193 of 986
1. General Pipeline
I
D
EX
• Instruction fetch • Instruction
• Operation
decode
• Issue
• Register read
• Destination address calculation
for PC-relative branch
NA
• Non-memory
data access
S
• Write-back
2. General Load/Store Pipeline
I
D
• Instruction fetch • Instruction
decode
• Issue
• Register read
EX
• Address
calculation
MA
• Memory
data access
S
• Write-back
3. Special Pipeline
I
D
• Instruction fetch • Instruction
decode
• Issue
• Register read
SX
• Operation
NA
• Non-memory
data access
S
• Write-back
4. Special Load/Store Pipeline
I
D
• Instruction fetch • Instruction
decode
• Issue
• Register read
SX
• Address
calculation
MA
• Memory
data access
S
• Write-back
5. Floating-Point Pipeline
I
D
• Instruction fetch • Instruction
decode
• Issue
• Register read
F1
• Computation 1
F2
• Computation 2
FS
• Computation 3
• Write-back
6. Floating-Point Extended Pipeline
I
D
• Instruction fetch • Instruction
decode
• Issue
• Register read
F0
• Computation 0
F1
• Computation 1
7. FDIV/FSQRT Pipeline
F3
Computation: Takes several cycles
Figure 8.1 Basic Pipelines
Rev. 6.0, 07/02, page 194 of 986
F2
• Computation 2
FS
• Computation 3
• Write-back
1. 1-step operation: 1 issue cycle
EXT[SU].[BW], MOV, MOV#, MOVA, MOVT, SWAP.[BW], XTRCT, ADD*, CMP*,
DIV*, DT, NEG*, SUB*, AND, AND#, NOT, OR, OR#, TST, TST#, XOR, XOR#,
ROT*, SHA*, SHL*, BF*, BT*, BRA, NOP, CLRS, CLRT, SETS, SETT,
LDS to FPUL, STS from FPUL/FPSCR, FLDI0, FLDI1, FMOV, FLDS, FSTS,
single-/double-precision FABS/FNEG
I
D
EX
NA
S
2. Load/store: 1 issue cycle
MOV.[BWL]. FMOV*@, LDS.L to FPUL, LDTLB, PREF, STS.L from FPUL/FPSCR
I
D
EX
MA
S
3. GBR-based load/store: 1 issue cycle
MOV.[BWL]@(d,GBR)
I
D
SX
MA
S
4. JMP, RTS, BRAF: 2 issue cycles
I
D
EX
D
NA
EX
S
NA
S
SX
D
MA
SX
D
S
NA
SX
S
NA
S
S
NA
SX
D
S
NA
SX
S
MA
S
S
NA
EX
D
S
NA
EX
S
MA
S
S
NA
EX
D
S
NA
EX
S
NA
S
S
NA
EX
S
NA
S
5. TST.B: 3 issue cycles
I
D
6. AND.B, OR.B, XOR.B: 4 issue cycles
I
D
SX
D
MA
SX
D
7. TAS.B: 5 issue cycles
I
D
EX
D
MA
EX
D
S
MA
EX
D
8. RTE: 5 issue cycles
I
D
EX
D
NA
EX
D
S
NA
EX
D
9. SLEEP: 4 issue cycles
I
D
EX
D
NA
EX
D
S
NA
EX
D
Figure 8.2 Instruction Execution Patterns
Rev. 6.0, 07/02, page 195 of 986
10. OCBI: 1 issue cycle
I
D
EX
MA
S
MA
MA
S
MA
11. OCBP, OCBWB: 1 issue cycle
I
D
EX
MA
MA
MA
12. MOVCA.L: 1 issue cycle
I
D
EX
MA
S
MA
MA
MA
MA
MA
MA
13. TRAPA: 7 issue cycles
I
D
EX
D
NA
EX
D
S
NA
EX
D
S
NA
EX
D
S
NA
EX
D
S
NA
EX
D
S
NA
EX
14. LDC to DBR/Rp_BANK/SSR/SPC/VBR, BSR: 1 issue cycle
I
D
EX
NA
SX
S
SX
15. LDC to GBR: 3 issue cycles
I
D
EX
D
NA
SX
D
S
SX
16. LDC to SR: 4 issue cycles
I
D
EX
D
NA
SX
D
S
SX
D
SX
17. LDC.L to DBR/Rp_BANK/SSR/SPC/VBR: 1 issue cycle
I
D
EX
MA
SX
S
SX
18. LDC.L to GBR: 3 issue cycles
I
D
EX
D
MA
SX
D
S
SX
Figure 8.2 Instruction Execution Patterns (cont)
Rev. 6.0, 07/02, page 196 of 986
S
NA
S
19. LDC.L to SR: 4 issue cycles
I
D
EX
D
MA
SX
D
S
SX
D
SX
20. STC from DBR/GBR/Rp_BANK/SR/SSR/SPC/VBR: 2 issue cycles
I
D
SX
D
NA
SX
S
NA
S
S
NA
SX
S
NA
21. STC.L from SGR: 3 issue cycles
I
D
SX
D
NA
SX
D
S
22. STC.L from DBR/GBR/Rp_BANK/SR/SSR/SPC/VBR: 2 issue cycles
I
D
SX
D
NA
SX
S
MA
S
S
NA
SX
S
MA
23. STC.L from SGR: 3 issue cycles
I
D
SX
D
NA
SX
D
S
24. LDS to PR, JSR, BSRF: 2 issue cycles
I
D
EX
D
NA
SX
S
SX
25. LDS.L to PR: 2 issue cycles
I
D
EX
D
MA
SX
S
SX
26. STS from PR: 2 issue cycles
I
D
SX
D
NA
SX
S
NA
S
NA
SX
S
MA
S
27. STS.L from PR: 2 issue cycles
I
D
SX
D
28. CLRMAC, LDS to MACH/L: 1 issue cycle
I
D
EX
NA
F1
S
F1
F2
FS
F2
FS
29. LDS.L to MACH/L: 1 issue cycle
I
D
EX
MA
F1
S
F1
30. STS from MACH/L: 1 issue cycle
I
D
EX
NA
S
Figure 8.2 Instruction Execution Patterns (cont)
Rev. 6.0, 07/02, page 197 of 986
31. STS.L from MACH/L: 1 issue cycle
I
D
EX
MA
S
NA
F1
S
32. LDS to FPSCR: 1 issue cycle
I
D
EX
F1
F1
33. LDS.L to FPSCR: 1 issue cycle
I
D
EX
MA
F1
S
F1
F1
34. Fixed-point multiplication: 2 issue cycles
DMULS.L, DMULU.L, MUL.L, MULS.W, MULU.W
I
D
EX
D
NA
EX
S
NA
(CPU)
S
f1
(FPU)
f1
f1
f1
F2
FS
35. MAC.W, MAC.L: 2 issue cycles
I
D
EX
D
MA
EX
S
MA
(CPU)
S
f1
(FPU)
f1
f1
f1
F2
FS
36. Single-precision floating-point computation: 1 issue cycle
FCMP/EQ,FCMP/GT, FADD,FLOAT,FMAC,FMUL,FSUB,FTRC,FRCHG,FSCHG
I
D
F1
F2
FS
37. Single-precision FDIV/SQRT: 1 issue cycle
I
D
F1
F2
FS
F3
F1
F2
FS
FS
F2
F1
FS
F2
38. Double-precision floating-point computation 1: 1 issue cycle
FCNVDS, FCNVSD, FLOAT, FTRC
I
D
F1
d
F2
F1
FS
F2
FS
39. Double-precision floating-point computation 2: 1 issue cycle
FADD, FMUL, FSUB
I
D
F1
d
F2
F1
d
FS
F2
F1
d
FS
F2
F1
d
FS
F2
F1
Figure 8.2 Instruction Execution Patterns (cont)
Rev. 6.0, 07/02, page 198 of 986
FS
40. Double-precision FCMP: 2 issue cycles
FCMP/EQ,FCMP/GT
D
I
F1
D
F2
F1
FS
F2
FS
41. Double-precision FDIV/SQRT: 1 issue cycle
FDIV, FSQRT
D
I
F1
d
F2
F1
FS
F2
F3
F1
F2
F1
FS
F2
F1
42. FIPR: 1 issue cycle
I
D
F0
F1
F2
FS
F1
F0
d
F2
F1
F0
d
FS
F2
F1
F0
FS
F2
FS
43. FTRV: 1 issue cycle
D
I
Notes:
F0
d
FS
F2
F1
FS
F2
FS
??
: Cannot overlap a stage of the same kind, except when two instructions are
executed in parallel.
D
: Locks D-stage
d
: Register read only
??
: Locks, but no operation is executed.
f1
: Can overlap another f1, but not another F1.
Figure 8.2 Instruction Execution Patterns (cont)
Rev. 6.0, 07/02, page 199 of 986
8.2
Parallel-Executability
Instructions are categorized into six groups according to the internal function blocks used, as
shown in table 8.1. Table 8.2 shows the parallel-executability of pairs of instructions in terms of
groups. For example, ADD in the EX group and BRA in the BR group can be executed in parallel.
Table 8.1
Instruction Groups
1. MT Group
CLRT
CMP/HI
Rm,Rn
MOV
Rm,Rn
CMP/EQ
#imm,R0
CMP/HS
Rm,Rn
NOP
CMP/EQ
Rm,Rn
CMP/PL
Rn
SETT
CMP/GE
Rm,Rn
CMP/PZ
Rn
TST
#imm,R0
CMP/GT
Rm,Rn
CMP/STR
Rm,Rn
TST
Rm,Rn
ADD
#imm,Rn
MOVT
Rn
SHLL2
Rn
ADD
Rm,Rn
NEG
Rm,Rn
SHLL8
Rn
ADDC
Rm,Rn
NEGC
Rm,Rn
SHLR
Rn
ADDV
Rm,Rn
NOT
Rm,Rn
SHLR16
Rn
AND
#imm,R0
OR
#imm,R0
SHLR2
Rn
AND
Rm,Rn
OR
Rm,Rn
SHLR8
Rn
DIV0S
Rm,Rn
ROTCL
Rn
SUB
Rm,Rn
ROTCR
Rn
SUBC
Rm,Rn
2. EX Group
DIV0U
DIV1
Rm,Rn
ROTL
Rn
SUBV
Rm,Rn
DT
Rn
ROTR
Rn
SWAP.B
Rm,Rn
EXTS.B
Rm,Rn
SHAD
Rm,Rn
SWAP.W
Rm,Rn
EXTS.W
Rm,Rn
SHAL
Rn
XOR
#imm,R0
EXTU.B
Rm,Rn
SHAR
Rn
XOR
Rm,Rn
EXTU.W
Rm,Rn
SHLD
Rm,Rn
XTRCT
Rm,Rn
MOV
#imm,Rn
SHLL
Rn
MOVA
@(disp,PC),R0 SHLL16
Rn
BF
disp
BRA
disp
BT
disp
BF/S
disp
BSR
disp
BT/S
disp
3. BR Group
Rev. 6.0, 07/02, page 200 of 986
Table 8.1
Instruction Groups (cont)
4. LS Group
FABS
DRn
FMOV.S
@Rm+,FRn
MOV.L
R0,@(disp,GBR)
FABS
FRn
FMOV.S
FRm,@(R0,Rn)
MOV.L
Rm,@(disp,Rn)
FLDI0
FRn
FMOV.S
FRm,@-Rn
MOV.L
Rm,@(R0,Rn)
FLDI1
FRn
FMOV.S
FRm,@Rn
MOV.L
Rm,@-Rn
FLDS
FRm,FPUL
FNEG
DRn
MOV.L
Rm,@Rn
FMOV
@(R0,Rm),DRn
FNEG
FRn
MOV.W
@(disp,GBR),R0
FMOV
@(R0,Rm),XDn
FSTS
FPUL,FRn
MOV.W
@(disp,PC),Rn
FMOV
@Rm,DRn
LDS
Rm,FPUL
MOV.W
@(disp,Rm),R0
FMOV
@Rm,XDn
MOV.B
@(disp,GBR),R0 MOV.W
@(R0,Rm),Rn
FMOV
@Rm+,DRn
MOV.B
@(disp,Rm),R0
MOV.W
@Rm,Rn
FMOV
@Rm+,XDn
MOV.B
@(R0,Rm),Rn
MOV.W
@Rm+,Rn
FMOV
DRm,@(R0,Rn)
MOV.B
@Rm,Rn
MOV.W
R0,@(disp,GBR)
FMOV
DRm,@-Rn
MOV.B
@Rm+,Rn
MOV.W
R0,@(disp,Rn)
FMOV
DRm,@Rn
MOV.B
R0,@(disp,GBR) MOV.W
Rm,@(R0,Rn)
FMOV
DRm,DRn
MOV.B
R0,@(disp,Rn)
MOV.W
Rm,@-Rn
FMOV
DRm,XDn
MOV.B
Rm,@(R0,Rn)
MOV.W
Rm,@Rn
FMOV
FRm,FRn
MOV.B
Rm,@-Rn
MOVCA.L
R0,@Rn
FMOV
XDm,@(R0,Rn)
MOV.B
Rm,@Rn
OCBI
@Rn
FMOV
XDm,@-Rn
MOV.L
@(disp,GBR),R0 OCBP
@Rn
FMOV
XDm,@Rn
MOV.L
@(disp,PC),Rn
OCBWB
@Rn
FMOV
XDm,DRn
MOV.L
@(disp,Rm),Rn
PREF
@Rn
FMOV
XDm,XDn
MOV.L
@(R0,Rm),Rn
STS
FPUL,Rn
FMOV.S
@(R0,Rm),FRn
MOV.L
@Rm,Rn
FMOV.S
@Rm,FRn
MOV.L
@Rm+,Rn
Rev. 6.0, 07/02, page 201 of 986
Table 8.1
Instruction Groups (cont)
5. FE Group
FADD
DRm,DRn
FIPR
FVm,FVn
FSQRT
DRn
FADD
FRm,FRn
FLOAT
FPUL,DRn
FSQRT
FRn
FCMP/EQ
FRm,FRn
FLOAT
FPUL,FRn
FSUB
DRm,DRn
FCMP/GT
FRm,FRn
FMAC
FR0,FRm,FRn FSUB
FRm,FRn
FCNVDS
DRm,FPUL
FMUL
DRm,DRn
FTRC
DRm,FPUL
FCNVSD
FPUL,DRn
FMUL
FRm,FRn
FTRC
FRm,FPUL
FDIV
DRm,DRn
FRCHG
FTRV
XMTRX,FVn
FDIV
FRm,FRn
FSCHG
Rev. 6.0, 07/02, page 202 of 986
Table 8.1
Instruction Groups (cont)
6. CO Group
AND.B
#imm,@(R0,GBR) LDS
Rm,FPSCR
STC
SR,Rn
BRAF
Rm
LDS
Rm,MACH
STC
SSR,Rn
BSRF
Rm
LDS
Rm,MACL
STC
VBR,Rn
CLRMAC
LDS
Rm,PR
STC.L
DBR,@-Rn
CLRS
LDS.L
@Rm+,FPSCR
STC.L
GBR,@-Rn
DMULS.L
Rm,Rn
LDS.L
@Rm+,FPUL
STC.L
Rp_BANK,@-Rn
DMULU.L
Rm,Rn
LDS.L
@Rm+,MACH
STC.L
SGR,@-Rn
FCMP/EQ
DRm,DRn
LDS.L
@Rm+,MACL
STC.L
SPC,@-Rn
FCMP/GT
DRm,DRn
LDS.L
@Rm+,PR
STC.L
SR,@-Rn
JMP
@Rn
LDTLB
STC.L
SSR,@-Rn
JSR
@Rn
MAC.L
@Rm+,@Rn+
STC.L
VBR,@-Rn
LDC
Rm,DBR
MAC.W
@Rm+,@Rn+
STS
FPSCR,Rn
LDC
Rm,GBR
MUL.L
Rm,Rn
STS
MACH,Rn
LDC
Rm,Rp_BANK
MULS.W
Rm,Rn
STS
MACL,Rn
LDC
Rm,SPC
MULU.W
Rm,Rn
STS
PR,Rn
LDC
Rm,SR
OR.B
#imm,@(R0,GBR) STS.L
LDC
Rm,SSR
RTE
STS.L
FPUL,@-Rn
LDC
Rm,VBR
RTS
STS.L
MACH,@-Rn
LDC.L
@Rm+,DBR
SETS
STS.L
MACL,@-Rn
LDC.L
@Rm+,GBR
SLEEP
STS.L
PR,@-Rn
LDC.L
@Rm+,Rp_BANK STC
DBR,Rn
TAS.B
@Rn
LDC.L
@Rm+,SPC
STC
GBR,Rn
TRAPA
#imm
LDC.L
@Rm+,SR
STC
Rp_BANK,Rn
TST.B
#imm,@(R0,GBR)
LDC.L
@Rm+,SSR
STC
SGR,Rn
XOR.B
#imm,@(R0,GBR)
LDC.L
@Rm+,VBR
STC
SPC,Rn
FPSCR,@-Rn
Rev. 6.0, 07/02, page 203 of 986
Table 8.2
Parallel-Executability
2nd Instruction
1st
Instruction
MT
EX
BR
LS
FE
CO
MT
O
O
O
O
O
X
EX
O
X
O
O
O
X
BR
O
O
X
O
O
X
LS
O
O
O
X
O
X
FE
O
O
O
O
X
X
CO
X
X
X
X
X
X
O: Can be executed in parallel
X: Cannot be executed in parallel
8.3
Execution Cycles and Pipeline Stalling
There are three basic clocks in this processor: the I-clock, B-clock, and P-clock. Each hardware
unit operates on one of these clocks, as follows:
• I-clock: CPU, FPU, MMU, caches
• B-clock: External bus controller
• P-clock: Peripheral units
The frequency ratios of the three clocks are determined with the frequency control register
(FRQCR). In this section, machine cycles are based on the I-clock unless otherwise specified. For
details of FRQCR, see section 10, Clock Oscillation Circuits.
Instruction execution cycles are summarized in table 8.3. Penalty cycles due to a pipeline stall or
freeze are not considered in this table.
• Issue rate: Interval between the issue of an instruction and that of the next instruction
• Latency: Interval between the issue of an instruction and the generation of its result
(completion)
• Instruction execution pattern (see figure 8.2)
• Locked pipeline stages (see table 8.3)
• Interval between the issue of an instruction and the start of locking (see table 8.3)
• Lock time: Period of locking in machine cycle units (see table 8.3)
Rev. 6.0, 07/02, page 204 of 986
The instruction execution sequence is expressed as a combination of the execution patterns shown
in figure 8.2. One instruction is separated from the next by the number of machine cycles for its
issue rate. Normally, execution, data access, and write-back stages cannot be overlapped onto the
same stages of another instruction; the only exception is when two instructions are executed in
parallel under parallel-executability conditions. Refer to (a) through (d) in figure 8.3 for some
simple examples.
Latency is the interval between issue and completion of an instruction, and is also the interval
between the execution of two instructions with an interdependent relationship. When there is
interdependency between two instructions fetched simultaneously, the latter of the two is stalled
for the following number of cycles:
• (Latency) cycles when there is flow dependency (read-after-write)
• (Latency - 1) or (latency - 2) cycles when there is output dependency (write-after-write)
Single/double-precision FDN, FSQRT is the preceding instruction (latency – 1) cycles
The other FE group is the preceding instruction (latency – 2) cycles
• 5 or 2 cycles when there is anti-flow dependency (write-after-read), as in the following cases:
FTRV is the preceding instruction (5 cycle)
A double-precision FADD, FSUB, or FMUL is the preceding instruction (2 cycles)
In the case of flow dependency, latency may be exceptionally increased or decreased, depending
on the combination of sequential instructions (figure 8.3 (e)).
• When a floating-point (FP) computation is followed by an FP register store, the latency of the
FP computation may be decreased by 1 cycle.
• If there is a load of the shift amount immediately before an SHAD/SHLD instruction, the
latency of the load is increased by 1 cycle.
• If an instruction with a latency of less than 2 cycles, including write-back to an FP register, is
followed by a double-precision FP instruction, FIPR, or FTRV, the latency of the first
instruction is increased to 2 cycles.
The number of cycles in a pipeline stall due to flow dependency will vary depending on the
combination of interdependent instructions or the fetch timing (see figure 8.3. (e)).
Output dependency occurs when the destination operands are the same in a preceding FE group
instruction and a following LS group instruction.
For the stall cycles of an instruction with output dependency, the longest latency to the last writeback among all the destination operands must be applied instead of “latency” (see figure 8.3 (f)).
A stall due to output dependency with respect to FPSCR, which reflects the result of an FP
operation, never occurs. For example, when FADD follows FDIV with no dependency between
FP registers, FADD is not stalled even if both instructions update the cause field of FPSCR.
Rev. 6.0, 07/02, page 205 of 986
Anti-flow dependency can occur only between a preceding double-precision FADD, FMUL,
FSUB, or FTRV and a following FMOV, FLDI0, FLDI1, FABS, FNEG, or FSTS. See figure 8.3
(g).
If an executing instruction locks any resource—i.e. a function block that performs a basic
operation—a following instruction that happens to attempt to use the locked resource must be
stalled (figure 8.3 (h)). This kind of stall can be compensated by inserting one or more instructions
independent of the locked resource to separate the interfering instructions. For example, when a
load instruction and an ADD instruction that references the loaded value are consecutive, the 2cycle stall of the ADD is eliminated by inserting three instructions without dependency. Software
performance can be improved by such instruction scheduling.
Other penalties arise in the event of exceptions or external data accesses, as follows.
• Instruction TLB miss
• Instruction access to external memory (instruction cache miss, etc.)
• Data access to external memory (operand cache miss, etc.)
• Data access to a memory-mapped control register.
During the penalty cycles of an instruction TLB miss or external instruction access, no instruction
is issued, but execution of instructions that have already been issued continues. The penalty for a
data access is a pipeline freeze: that is, the execution of uncompleted instructions is interrupted
until the arrival of the requested data. The number of penalty cycles for instruction and data
accesses is largely dependent on the user’s memory subsystems.
Rev. 6.0, 07/02, page 206 of 986
(a) Serial execution: non-parallel-executable instructions
SHAD R0,R1
ADD
R2,R3
next
I
I
D
I
1 issue cycle
EX
NA
EX
D
1 stall cycle
D
S
NA
EX-group SHAD and EX-group ADD
cannot be executed in parallel. Therefore,
SHAD is issued first, and the following
ADD is recombined with the next
instruction.
S
...
(b) Parallel execution: parallel-executable and no dependency
ADD
R2,R1
MOV.L @R4,R5
I
I
D
D
1 issue cycle
EX
NA
EX
MA
EX-group ADD and LS-group MOV.L can
be executed in parallel. Overlapping of
stages in the 2nd instruction is possible.
S
S
(c) Issue rate: multi-step instruction
4 issue cycles
AND.B#1,@(R0,GBR)
MOV
next
R1,R2
I
D
SX
D
MA
SX
D
I
4 stall cycles
S
NA
SX
D
i
I
S
NA
SX
D
...
S
MA
E
S
A
AND.B and MOV are fetched
simultaneously, but MOV is stalled due to
resource locking. After the lock is released,
MOV is refetched together with the next
instruction.
S
(d) Branch
BT/S L_far
ADD R0,R1
SUB R2,R3
I
I
BT/S L_far
ADD R0,R1
I
I
D
D
I
I
D
D
I
No stall
D
D
I
L_far
BT L_skip
ADD #1,R0
L_skip:
EX
EX
D
NA
NA
EX
S
S
NA
No stall occurs if the branch is not taken.
S
2-cycle latency for I-stage of branch destination
If the branch is taken, the I-stage of the
EX
NA
S
branch destination is stalled for the period
EX
NA
S
of latency. This stall can be covered with a
1 stall cycle
delay slot instruction which is not parallelI
D
...
executable with the branch instruction.
EX
—
D
NA
—
...
S
—
Even if the BT/BF branch is taken, the Istage of the branch destination is not
stalled if the displacement is zero.
Figure 8.3 Examples of Pipelined Execution
Rev. 6.0, 07/02, page 207 of 986
(e) Flow dependency
MOV
ADD
R0,R1
R2,R1
ADD
R2,R1
MOV.L @R1,R1
next
MOV.L @R1,R1
ADD
R0,R1
next
I
I
D
D
I
I
D
i
I
1 stall cycle
I
D
I
I
Zero-cycle latency
EX
NA
S
EX
NA
S
1-cycle latency
EX
NA
S
EX
MA
D
...
EX
D
...
The following instruction, ADD, is not
stalled when executed after an instruction
with zero-cycle latency, even if there is
dependency.
ADD and MOV.L are not executed in
parallel, since MOV.L references the result
of ADD as its destination address.
S
2-cycle latency
S
EX
NA
1 stall cycle
Because MOV.L and ADD are not fetched
simultaneously in this example, ADD is
stalled for only 1 cycle even though the
latency of MOV.L is 2 cycles.
MA
S
2-cycle latency
1-cycle increase
MOV.L @R1,R1
SHAD R1,R2
next
I
D
I
I
EX
MA
D
...
S
d
EX
NA
S
2 stall cycles
Due to the flow dependency between the
load and the SHAD/SHLD shift amount,
the latency of the load is increased to 3
cycles.
4-cycle latency for FPSCR
FADD
STS
STS
FR1,FR2
FPUL,R1
FPSCR,R2
I
D
I
F1
D
I
F2
EX
FS
NA
S
D
EX
NA
S
2 stall cycles
7-cycle latency for lower FR
8-cycle latency for upper FR
FADD
FMOV
FMOV
DR0,DR2
FR3,FR5
FR2,FR4
I
D
F1
d
F2
F1
d
FS
F2
F1
d
FS
F2
F1
d
FS
F2
F1
FS
F2
F1
I
FS
F2
D
I
FR3 write
FS FR2 write
EX
NA
S
EX
D
NA
3-cycle latency for upper/lower FR
FLOAT FPUL,DR0
FMOV.S FR0,@-R15
I
D
I
D
F1
d
F2
F1
FS
F2
FR1 write
FS FR0 write
EX
MA
S
Zero-cycle latency
3-cycle increase
FLDI1
FIPR
FR3
FV0,FV4
I
I
D
D
EX
NA
S
d
F0
F1
3 stall cycles
F2
FS
F2
F1
F0
d
FS
F2
F1
F0
2-cycle latency
1-cycle increase
FMOV
FTRV
@R1,XD14
XMTRX,FV0
I
I
D
D
EX
MA
S
d
3 stall cycles
F0
d
F1
F0
d
FS
F2
F1
Figure 8.3 Examples of Pipelined Execution (cont)
Rev. 6.0, 07/02, page 208 of 986
FS
F2
FS
S
(e) Flow dependency (cont)
Effectively 1-cycle latency for consecutive LDS/FLOAT instructions
LDS
FLOAT
LDS
FLOAT
R0,FPUL
FPUL,FR0
R1,FPUL
FPUL,R1
I
FTRC
STS
FTRC
STS
FR0,FPUL
FPUL,R0
FR1,FPUL
FPUL,R1
I
D
I
I
D
I
I
EX
D
D
I
NA
F1
EX
D
S
F2
NA
F1
F1
D
D
I
F2
EX
F1
D
FS
F1
F2
FS
F3
NA
F2
EX
FS
S
F2
S
FS
NA
FS
Effectively 1-cycle latency for consecutive
FTRC/STS instructions
S
(f) Output dependency
11-cycle latency
FSQRT FR4
I
D
FMOV
FR0,FR4
I
D
FADD
DR0,DR2
F1
10 stall cycles = latency (11) - 1
FS
F1
FS
F2
The registers are written-back
in program order.
7-cycle latency for lower FR
8-cycle latency for upper FR
I
FMOV
F2
I
FR0,FR3
D
F1
d
F2
F1
d
FS
F2
F1
d
FS
F2
F1
d
FS
F2
F1
FS
F2
F1
D
FS
F2
EX
FR3 write
FS FR2 write
NA
S
6 stall cycles = longest latency (8) - 2
(g) Anti-flow dependency
FTRV
XMTRX,FV0
FMOV @R1,XD0
I
I
D
F0
d
F1
F0
d
F2
F1
F0
d
FS
F2
F1
F0
FS
F2
F1
D
FS
F2
EX
FS
MA
S
FS
F2
F1
FS
F2
FS
5 stall cycles
FADD DR0,DR2
FMOV FR4,FR1
I
I
D
F1
d
F2
F1
d
D
FS
F2
F1
d
EX
2 stall cycles
FS
F2
F1
d
FS
F2
F1
NA
S
Figure 8.3 Examples of Pipelined Execution (cont)
Rev. 6.0, 07/02, page 209 of 986
(h) Resource conflict
#1
#2
#3
..................................................
#8
#9
#10
#11
#12
1 cycle/issue
FDIV
FR6,FR7
I
F1
D
F2
FS
Latency
F1 stage locked for 1 cycle
F3
F1
I
FMAC FR0,FR8,FR9
FMAC FR0,FR10,FR11
D
F1
I
D
F2
FS
F1
F2
F2
FS
F1
F2
FS
...
:
FMAC FR0,FR12,FR13
I
D
FS
1 stall cycle (F1 stage resource conflict)
I
FIPR FV8,FV0
FADD FR15,FR4
F0
D
D
I
F1
F2
F1
FS
F2
FS
SX
D
NA
SX
FS
F2
F1
d
FS
F2
F1
1 stall cycle
LDS.L @R15+,PR
I
STC
I
EX
D
D
MA
SX
FS
SX
GBR,R2
D
3 stall cycles
I
FADD DR0,DR2
I
MAC.W @R1+,@R2+
D
F2
F1
d
FS
F2
F1
d
5 stall cycles
EX
f1
D
S
EX
f1
MA
S
f1
F2
f1
MA
D
I
EX
f1
D
EX
f1
FS
F2
S
FS
MA
S
f1
DR4,DR6
F2
f1
D
I
3 stall cycles
S
FS
F2
EX
f1
D
FS
MA
EX
f1
S
MA
S
f1
F2
f1
2 stall cycles
FS
F2
F1
d
FS
F2
F1
d
FS
F2
F1
d
FS
F2
F1
d
Figure 8.3 Examples of Pipelined Execution (cont)
Rev. 6.0, 07/02, page 210 of 986
FS
F2
FS
f1 stage can overlap preceding f1,
but F1 cannot overlap f1.
MA
1 stall
cycle
FADD
FS
F2
F1
D
I
MAC.W @R1+,@R2+
MAC.W @R1+,@R2+
F1
d
D
S
NA
FS
F2
F1
FS
F2
F1
FS
...
Table 8.3
Execution Cycles
Functional
Category
No.
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
Instruction
Data transfer 1
instructions
2
EXTS.B
Rm,Rn
EX
1
1
#1
—
—
—
EXTS.W
Rm,Rn
EX
1
1
#1
—
—
—
3
EXTU.B
Rm,Rn
EX
1
1
#1
—
—
—
4
EXTU.W
Rm,Rn
EX
1
1
#1
—
—
—
5
MOV
Rm,Rn
MT
1
0
#1
—
—
—
6
MOV
#imm,Rn
EX
1
1
#1
—
—
—
7
MOVA
@(disp,PC),R0
EX
1
1
#1
—
—
—
8
MOV.W
@(disp,PC),Rn
LS
1
2
#2
—
—
—
9
MOV.L
@(disp,PC),Rn
LS
1
2
#2
—
—
—
10
MOV.B
@Rm,Rn
LS
1
2
#2
—
—
—
11
MOV.W
@Rm,Rn
LS
1
2
#2
—
—
—
12
MOV.L
@Rm,Rn
LS
1
2
#2
—
—
—
13
MOV.B
@Rm+,Rn
LS
1
1/2
#2
—
—
—
14
MOV.W
@Rm+,Rn
LS
1
1/2
#2
—
—
—
15
MOV.L
@Rm+,Rn
LS
1
1/2
#2
—
—
—
16
MOV.B
@(disp,Rm),R0
LS
1
2
#2
—
—
—
17
MOV.W
@(disp,Rm),R0
LS
1
2
#2
—
—
—
18
MOV.L
@(disp,Rm),Rn
LS
1
2
#2
—
—
—
19
MOV.B
@(R0,Rm),Rn
LS
1
2
#2
—
—
—
20
MOV.W
@(R0,Rm),Rn
LS
1
2
#2
—
—
—
21
MOV.L
@(R0,Rm),Rn
LS
1
2
#2
—
—
—
22
MOV.B
@(disp,GBR),R0
LS
1
2
#3
—
—
—
23
MOV.W
@(disp,GBR),R0
LS
1
2
#3
—
—
—
24
MOV.L
@(disp,GBR),R0
LS
1
2
#3
—
—
—
25
MOV.B
Rm,@Rn
LS
1
1
#2
—
—
—
26
MOV.W
Rm,@Rn
LS
1
1
#2
—
—
—
27
MOV.L
Rm,@Rn
LS
1
1
#2
—
—
—
28
MOV.B
Rm,@-Rn
LS
1
1/1
#2
—
—
—
29
MOV.W
Rm,@-Rn
LS
1
1/1
#2
—
—
—
30
MOV.L
Rm,@-Rn
LS
1
1/1
#2
—
—
—
31
MOV.B
R0,@(disp,Rn)
LS
1
1
#2
—
—
—
Rev. 6.0, 07/02, page 211 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
Instruction
Data transfer 32
instructions
33
MOV.W
R0,@(disp,Rn)
LS
1
1
#2
—
—
—
34
MOV.L
Rm,@(disp,Rn)
LS
1
1
#2
—
—
—
MOV.B
Rm,@(R0,Rn)
LS
1
1
#2
—
—
—
35
MOV.W
Rm,@(R0,Rn)
LS
1
1
#2
—
—
—
36
MOV.L
Rm,@(R0,Rn)
LS
1
1
#2
—
—
—
37
MOV.B
R0,@(disp,GBR)
LS
1
1
#3
—
—
—
38
MOV.W
R0,@(disp,GBR)
LS
1
1
#3
—
—
—
39
MOV.L
R0,@(disp,GBR)
LS
1
1
#3
—
—
—
40
MOVCA.L R0,@Rn
LS
1
3–7
#12
MA
4
3–7
41
MOVT
Rn
EX
1
1
#1
—
—
—
42
OCBI
@Rn
LS
1
1–2
#10
MA
4
1–2
43
OCBP
@Rn
LS
1
1–5
#11
MA
4
1–5
44
OCBWB
@Rn
LS
1
1–5
#11
MA
4
1–5
45
PREF
@Rn
LS
1
1
#2
—
—
—
46
SWAP.B
Rm,Rn
EX
1
1
#1
—
—
—
47
SWAP.W
Rm,Rn
EX
1
1
#1
—
—
—
48
XTRCT
Rm,Rn
EX
1
1
#1
—
—
—
ADD
Fixed-point 49
arithmetic
50
instructions
51
Rm,Rn
EX
1
1
#1
—
—
—
ADD
#imm,Rn
EX
1
1
#1
—
—
—
ADDC
Rm,Rn
EX
1
1
#1
—
—
—
52
ADDV
Rm,Rn
EX
1
1
#1
—
—
—
53
CMP/EQ
#imm,R0
MT
1
1
#1
—
—
—
54
CMP/EQ
Rm,Rn
MT
1
1
#1
—
—
—
55
CMP/GE
Rm,Rn
MT
1
1
#1
—
—
—
56
CMP/GT
Rm,Rn
MT
1
1
#1
—
—
—
57
CMP/HI
Rm,Rn
MT
1
1
#1
—
—
—
58
CMP/HS
Rm,Rn
MT
1
1
#1
—
—
—
59
CMP/PL
Rn
MT
1
1
#1
—
—
—
60
CMP/PZ
Rn
MT
1
1
#1
—
—
—
61
CMP/STR Rm,Rn
MT
1
1
#1
—
—
—
62
DIV0S
EX
1
1
#1
—
—
—
Rm,Rn
Rev. 6.0, 07/02, page 212 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
Fixed-point 63
arithmetic
64
instructions
65
Instruction
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
DIV0U
EX
1
1
#1
—
—
—
DIV1
Rm,Rn
EX
1
1
#1
—
—
—
DMULS.L
Rm,Rn
CO
2
4/4
#34
F1
4
2
66
DMULU.L Rm,Rn
CO
2
4/4
#34
F1
4
2
67
DT
Rn
EX
1
1
#1
—
—
—
68
MAC.L
@Rm+,@Rn+
CO
2
2/2/4/4
#35
F1
4
2
69
MAC.W
@Rm+,@Rn+
CO
2
2/2/4/4
#35
F1
4
2
70
MUL.L
Rm,Rn
CO
2
4/4
#34
F1
4
2
71
MULS.W
Rm,Rn
CO
2
4/4
#34
F1
4
2
72
MULU.W
Rm,Rn
CO
2
4/4
#34
F1
4
2
73
NEG
Rm,Rn
EX
1
1
#1
—
—
—
74
NEGC
Rm,Rn
EX
1
1
#1
—
—
—
75
SUB
Rm,Rn
EX
1
1
#1
—
—
—
76
SUBC
Rm,Rn
EX
1
1
#1
—
—
—
77
SUBV
Rm,Rn
EX
1
1
#1
—
—
—
AND
Rm,Rn
EX
1
1
#1
—
—
—
AND
#imm,R0
EX
1
1
#1
—
—
—
Logical
78
instructions
79
80
AND.B
#imm,@(R0,GBR) CO
4
4
#6
—
—
—
81
NOT
Rm,Rn
EX
1
1
#1
—
—
—
82
OR
Rm,Rn
EX
1
1
#1
—
—
—
83
OR
#imm,R0
EX
1
1
#1
—
—
—
84
OR.B
#imm,@(R0,GBR) CO
4
4
#6
—
—
—
85
TAS.B
@Rn
5
5
#7
—
—
—
86
TST
Rm,Rn
MT
1
1
#1
—
—
—
87
TST
#imm,R0
MT
1
1
#1
—
—
—
88
TST.B
#imm,@(R0,GBR) CO
3
3
#5
—
—
—
89
XOR
Rm,Rn
EX
1
1
#1
—
—
—
90
XOR
#imm,R0
EX
1
1
#1
—
—
—
91
XOR.B
#imm,@(R0,GBR) CO
4
4
#6
—
—
—
CO
Rev. 6.0, 07/02, page 213 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
Shift
92
instructions
93
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
Instruction
ROTL
Rn
EX
1
1
#1
—
—
—
ROTR
Rn
EX
1
1
#1
—
—
—
94
ROTCL
Rn
EX
1
1
#1
—
—
—
95
ROTCR
Rn
EX
1
1
#1
—
—
—
96
SHAD
Rm,Rn
EX
1
1
#1
—
—
—
97
SHAL
Rn
EX
1
1
#1
—
—
—
98
SHAR
Rn
EX
1
1
#1
—
—
—
99
SHLD
Rm,Rn
EX
1
1
#1
—
—
—
100
SHLL
Rn
EX
1
1
#1
—
—
—
101
SHLL2
Rn
EX
1
1
#1
—
—
—
102
SHLL8
Rn
EX
1
1
#1
—
—
—
103
SHLL16
Rn
EX
1
1
#1
—
—
—
104
SHLR
Rn
EX
1
1
#1
—
—
—
105
SHLR2
Rn
EX
1
1
#1
—
—
—
106
SHLR8
Rn
EX
1
1
#1
—
—
—
107
SHLR16
Rn
EX
1
1
#1
—
—
—
BF
disp
BR
1
2 (or 1)
#1
—
—
—
Branch
108
instructions
109
BF/S
disp
BR
1
2 (or 1)
#1
—
—
—
110
BT
disp
BR
1
2 (or 1)
#1
—
—
—
111
BT/S
disp
BR
1
2 (or 1)
#1
—
—
—
112
BRA
disp
BR
1
2
#1
—
—
—
113
BRAF
Rn
CO
2
3
#4
—
—
—
114
BSR
disp
BR
1
2
#14
SX
3
2
115
BSRF
Rn
CO
2
3
#24
SX
3
2
116
JMP
@Rn
CO
2
3
#4
—
—
—
117
JSR
@Rn
CO
2
3
#24
SX
3
2
118
RTS
CO
2
3
#4
—
—
—
Rev. 6.0, 07/02, page 214 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
System
119
control
120
instructions
121
Instruction
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
NOP
MT
1
0
#1
—
—
—
CLRMAC
CO
1
3
#28
F1
3
2
CLRS
CO
1
1
#1
—
—
—
122
CLRT
MT
1
1
#1
—
—
—
123
SETS
CO
1
1
#1
—
—
—
124
SETT
MT
1
1
#1
—
—
—
125
TRAPA
CO
7
7
#13
—
—
—
#imm
126
RTE
CO
5
5
#8
—
—
—
127
SLEEP
CO
4
4
#9
—
—
—
128
LDTLB
CO
1
1
#2
—
—
—
129
LDC
Rm,DBR
CO
1
3
#14
SX
3
2
130
LDC
Rm,GBR
CO
3
3
#15
SX
3
2
131
LDC
Rm,Rp_BANK
CO
1
3
#14
SX
3
2
132
LDC
Rm,SR
CO
4
4
#16
SX
3
2
133
LDC
Rm,SSR
CO
1
3
#14
SX
3
2
134
LDC
Rm,SPC
CO
1
3
#14
SX
3
2
135
LDC
Rm,VBR
CO
1
3
#14
SX
3
2
136
LDC.L
@Rm+,DBR
CO
1
1/3
#17
SX
3
2
137
LDC.L
@Rm+,GBR
CO
3
3/3
#18
SX
3
2
138
LDC.L
@Rm+,Rp_BANK CO
1
1/3
#17
SX
3
2
139
LDC.L
@Rm+,SR
CO
4
4/4
#19
SX
3
2
140
LDC.L
@Rm+,SSR
CO
1
1/3
#17
SX
3
2
141
LDC.L
@Rm+,SPC
CO
1
1/3
#17
SX
3
2
142
LDC.L
@Rm+,VBR
CO
1
1/3
#17
SX
3
2
143
LDS
Rm,MACH
CO
1
3
#28
F1
3
2
144
LDS
Rm,MACL
CO
1
3
#28
F1
3
2
145
LDS
Rm,PR
CO
2
3
#24
SX
3
2
146
LDS.L
@Rm+,MACH
CO
1
1/3
#29
F1
3
2
147
LDS.L
@Rm+,MACL
CO
1
1/3
#29
F1
3
2
148
LDS.L
@Rm+,PR
CO
2
2/3
#25
SX
3
2
149
STC
DBR,Rn
CO
2
2
#20
—
—
—
150
STC
SGR,Rn
CO
3
3
#21
—
—
—
Rev. 6.0, 07/02, page 215 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
Instruction
System
151
control
152
instructions
153
STC
GBR,Rn
CO
2
2
#20
—
—
—
STC
Rp_BANK,Rn
CO
2
2
#20
—
—
—
STC
SR,Rn
CO
2
2
#20
—
—
—
154
STC
SSR,Rn
CO
2
2
#20
—
—
—
155
STC
SPC,Rn
CO
2
2
#20
—
—
—
156
STC
VBR,Rn
CO
2
2
#20
—
—
—
157
STC.L
DBR,@-Rn
CO
2
2/2
#22
—
—
—
158
STC.L
SGR,@-Rn
CO
3
3/3
#23
—
—
—
159
STC.L
GBR,@-Rn
CO
2
2/2
#22
—
—
—
160
STC.L
Rp_BANK,@-Rn
CO
2
2/2
#22
—
—
—
161
STC.L
SR,@-Rn
CO
2
2/2
#22
—
—
—
162
STC.L
SSR,@-Rn
CO
2
2/2
#22
—
—
—
163
STC.L
SPC,@-Rn
CO
2
2/2
#22
—
—
—
164
STC.L
VBR,@-Rn
CO
2
2/2
#22
—
—
—
165
STS
MACH,Rn
CO
1
3
#30
—
—
—
166
STS
MACL,Rn
CO
1
3
#30
—
—
—
167
STS
PR,Rn
CO
2
2
#26
—
—
—
168
STS.L
MACH,@-Rn
CO
1
1/1
#31
—
—
—
169
STS.L
MACL,@-Rn
CO
1
1/1
#31
—
—
—
170
STS.L
PR,@-Rn
CO
2
2/2
#27
—
—
—
Single171
precision
172
floating-point
instructions 173
FLDI0
FRn
LS
1
0
#1
—
—
—
FLDI1
FRn
LS
1
0
#1
—
—
—
FMOV
FRm,FRn
LS
1
0
#1
—
—
—
174
FMOV.S
@Rm,FRn
LS
1
2
#2
—
—
—
175
FMOV.S
@Rm+,FRn
LS
1
1/2
#2
—
—
—
176
FMOV.S
@(R0,Rm),FRn
LS
1
2
#2
—
—
—
177
FMOV.S
FRm,@Rn
LS
1
1
#2
—
—
—
178
FMOV.S
FRm,@-Rn
LS
1
1/1
#2
—
—
—
179
FMOV.S
FRm,@(R0,Rn)
LS
1
1
#2
—
—
—
180
FLDS
FRm,FPUL
LS
1
0
#1
—
—
—
181
FSTS
FPUL,FRn
LS
1
0
#1
—
—
—
Rev. 6.0, 07/02, page 216 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
Single182
precision
183
floating-point
instructions 184
185
186
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
Instruction
FABS
FRn
LS
1
0
FADD
FRm,FRn
FE
1
3/4
#36
—
—
—
FCMP/EQ FRm,FRn
FE
1
2/4
#36
—
—
—
FCMP/GT FRm,FRn
FE
1
2/4
#36
—
—
—
FDIV
FE
1
12/13
#37
FRm,FRn
#1
—
—
—
F3
2
10
F1
11
1
187
FLOAT
FPUL,FRn
FE
1
3/4
#36
—
—
—
188
FMAC
FR0,FRm,FRn
FE
1
3/4
#36
—
—
—
189
FMUL
FRm,FRn
FE
1
3/4
#36
—
—
—
190
FNEG
FRn
LS
1
0
#1
—
—
—
191
FSQRT
FRn
FE
1
11/12
#37
F3
2
9
F1
10
1
192
FSUB
FRm,FRn
FE
1
3/4
#36
—
—
—
193
FTRC
FRm,FPUL
FE
1
3/4
#36
—
—
—
194
FMOV
DRm,DRn
LS
1
0
#1
—
—
—
195
FMOV
@Rm,DRn
LS
1
2
#2
—
—
—
196
FMOV
@Rm+,DRn
LS
1
1/2
#2
—
—
—
197
FMOV
@(R0,Rm),DRn
LS
1
2
#2
—
—
—
198
FMOV
DRm,@Rn
LS
1
1
#2
—
—
—
199
FMOV
DRm,@-Rn
LS
1
1/1
#2
—
—
—
200
FMOV
DRm,@(R0,Rn)
LS
1
1
#2
—
—
—
Double201
precision
202
floating-point
instructions 203
FABS
DRn
LS
1
0
#1
—
—
—
FADD
DRm,DRn
FE
1
(7, 8)/9
#39
F1
2
6
FCMP/EQ DRm,DRn
CO
2
3/5
#40
F1
2
2
204
FCMP/GT DRm,DRn
CO
2
3/5
#40
F1
2
2
205
FCNVDS
DRm,FPUL
FE
1
4/5
#38
F1
2
2
206
FCNVSD
FPUL,DRn
FE
1
(3, 4)/5
#38
F1
2
2
207
FDIV
DRm,DRn
FE
1
(24, 25)/ #41
26
F3
2
23
F1
22
3
F1
2
2
208
FLOAT
FPUL,DRn
FE
1
(3, 4)/5
#38
F1
2
2
209
FMUL
DRm,DRn
FE
1
(7, 8)/9
#39
F1
2
6
Rev. 6.0, 07/02, page 217 of 986
Table 8.3
Execution Cycles (cont)
Functional
Category
No.
Double210
precision
211
floating-point
instructions
InstrucExecuLock
tion
Issue
tion
Group Rate Latency Pattern Stage Start Cycles
Instruction
FNEG
DRn
LS
1
0
#1
FSQRT
DRn
FE
1
(23, 24)/ #41
25
—
—
—
F3
2
22
F1
21
3
F1
2
2
212
FSUB
DRm,DRn
FE
1
(7, 8)/9
#39
F1
2
6
213
FTRC
DRm,FPUL
FE
1
4/5
#38
F1
2
2
LDS
Rm,FPUL
LS
1
1
#1
—
—
—
FPU system 214
control
215
instructions
216
LDS
Rm,FPSCR
CO
1
4
#32
F1
3
3
LDS.L
@Rm+,FPUL
CO
1
1/2
#2
—
—
—
217
LDS.L
@Rm+,FPSCR
CO
1
1/4
#33
F1
3
3
218
STS
FPUL,Rn
LS
1
3
#1
—
—
—
219
STS
FPSCR,Rn
CO
1
3
#1
—
—
—
220
STS.L
FPUL,@-Rn
CO
1
1/1
#2
—
—
—
221
STS.L
FPSCR,@-Rn
CO
1
1/1
#2
—
—
—
Graphics
222
acceleration
223
instructions
224
FMOV
DRm,XDn
LS
1
0
#1
—
—
—
FMOV
XDm,DRn
LS
1
0
#1
—
—
—
FMOV
XDm,XDn
LS
1
0
#1
—
—
—
225
FMOV
@Rm,XDn
LS
1
2
#2
—
—
—
226
FMOV
@Rm+,XDn
LS
1
1/2
#2
—
—
—
227
FMOV
@(R0,Rm),XDn
LS
1
2
#2
—
—
—
228
FMOV
XDm,@Rn
LS
1
1
#2
—
—
—
229
FMOV
XDm,@-Rm
LS
1
1/1
#2
—
—
—
230
FMOV
XDm,@(R0,Rn)
LS
1
1
#2
—
—
—
231
FIPR
FVm,FVn
FE
1
4/5
#42
F1
3
1
232
FRCHG
FE
1
1/4
#36
—
—
—
233
FSCHG
FE
1
1/4
#36
—
—
—
234
FTRV
FE
1
(5, 5, 6,
7)/8
#43
F0
2
4
F1
3
4
XMTRX,FVn
Notes: 1. See table 8.1 for the instruction groups.
2. Latency “L1/L2...”: Latency corresponding to a write to each register, including
MACH/MACL/FPSCR.
Example: MOV.B @Rm+, Rn “1/2”: The latency for Rm is 1 cycle, and the latency for
Rn is 2 cycles.
3. Branch latency: Interval until the branch destination instruction is fetched
Rev. 6.0, 07/02, page 218 of 986
4. Conditional branch latency “2 (or 1)”: The latency is 2 for a nonzero displacement, and
1 for a zero displacement.
5. Double-precision floating-point instruction latency “(L1, L2)/L3”: L1 is the latency for FR
[n+1], L2 that for FR [n], and L3 that for FPSCR.
6. FTRV latency “(L1, L2, L3, L4)/L5”: L1 is the latency for FR [n], L2 that for FR [n+1], L3
that for FR [n+2], L4 that for FR [n+3], and L5 that for FPSCR.
7. Latency “L1/L2/L3/L4” of MAC.L and MAC.W instructions: L1 is the latency for Rm, L2
that for Rn, L3 that for MACH, and L4 that for MACL.
8. Latency “L1/L2” of MUL.L, MULS.W, MULU.W, DMULS.L, and DMULU.L instructions:
L1 is the latency for MACH, and L2 that for MACL.
9. Execution pattern: The instruction execution pattern number (see figure 8.2)
10. Lock/stage: Stage locked by the instruction
11. Lock/start: Locking start cycle; 1 is the first D-stage of the instruction.
12. Lock/cycles: Number of cycles locked
Exceptions:
1. When a floating-point computation instruction is followed by an FMOV store, an STS
FPUL, Rn instruction, or an STS.L FPUL, @-Rn instruction, the latency of the floatingpoint computation is decreased by 1 cycle.
2. When the preceding instruction loads the shift amount of the following SHAD/SHLD, the
latency of the load is increased by 1 cycle.
3. When an LS group instruction with a latency of less than 3 cycles is followed by a
double-precision floating-point instruction, FIPR, or FTRV, the latency of the first
instruction is increased to 3 cycles.
Example: In the case of FMOV FR4,FR0 and FIPR FV0,FV4, FIPR is stalled for 2
cycles.
4. When MAC/MUL/DMUL is followed by an STS.L MAC, @-Rn instruction, the latency of
MAC/MUL/DMUL is 5 cycles.
5. In the case of consecutive executions of MAC/MUL/DMUL, the latency is decreased to
2 cycles.
6. When an LDS to MAC is followed by an STS.L MAC, @-Rn instruction, the latency of
the LDS to MAC is 4 cycles.
7. When an LDS to MAC is followed by MAC/MUL/DMUL, the latency of the LDS to MAC
is 1 cycle.
8. When an FSCHG or FRCHG instruction is followed by an LS group instruction that
reads or writes to a floating-point register, the aforementioned LS group instruction[s]
cannot be executed in parallel.
9. When a single-precision FTRC instruction is followed by an “STS FPUL, Rn” instruction,
the latency of the single-precision FTRC instruction is 1 cycle.
Rev. 6.0, 07/02, page 219 of 986
Rev. 6.0, 07/02, page 220 of 986
Section 9 Power-Down Modes
9.1
Overview
In the power-down modes, some of the on-chip peripheral modules and the CPU functions are
halted, enabling power consumption to be reduced.
9.1.1
Types of Power-Down Modes
The following power-down modes and functions are provided:
• Sleep mode
• Deep sleep mode
• Standby mode
• Hardware standby mode*
• Module standby function (TMU, RTC, SCI/SCIF, DMAC, SQ*, and UBC* on-chip peripheral
modules)
Note: * SH7750S, SH7750R only
Table 9.1 shows the conditions for entering these modes from the program execution state, the
status of the CPU and peripheral modules in each mode, and the method of exiting each mode.
Rev. 6.0, 07/02, page 221 of 986
Table 9.1
Status of CPU and Peripheral Modules in Power-Down Modes
Status
PowerDown
Mode
Entering
Conditions
CPG
CPU
On-Chip
Memory
On-chip
Peripheral
Modules
Pins
External
Memory
Exiting
Method
Sleep
SLEEP
instruction
executed
while STBY
bit is 0 in
STBCR
Operating Halted
(registers
held)
Held
Operating
Held
Refreshing • Interrupt
• Reset
Deep
sleep
SLEEP
instruction
executed
while STBY
bit is 0 in
STBCR,
and DSLP
bit is 1 in
STBCR2
Operating Halted
(registers
held)
Held
Operating
(DMA
halted)
Held
Selfrefreshing
• Interrupt
• Reset
Standby
SLEEP
instruction
executed
while STBY
bit is 1 in
STBCR
Halted
Halted
(registers
held)
Held
Halted*
Held
Selfrefreshing
• Interrupt
• Reset
Hardware Setting CA
standby
pin low
(SH7750S,
SH7750R)
Halted
Halted
Undefined Halted*
Module
standby
Operating Operating Held
Setting
MSTP bit
to 1 in
STBCR/
STBCR2
Specified
modules
halted*
High
Undefined
impedance
Held
• Power-on
reset
Refreshing • Clearing
MSTP bit
to 0
• Reset
Note: * The RTC operates when the START bit in RCR2 is 1 (see section 11, Realtime Clock
(RTC)).
Rev. 6.0, 07/02, page 222 of 986
9.1.2
Register Configuration
Table 9.2 shows the registers used for power-down mode control.
Table 9.2
Power-Down Mode Registers
Name
Abbreviation
R/W
Initial Value
P4 Address
Area 7
Address
Access
Size
Standby control
register
STBCR
R/W
H'00
H'FFC00004
H'1FC00004
8
Standby control
register 2
STBCR2
R/W
H'00
H'FFC00010
H'1FC00010
8
Clock stop
register 00*
CLKSTP00
R/W
H'00000000
H'FE0A0000
H'1E0A0000
32
Clock release
register 00*
CLKSTPCLR00
W
H'00000000
H'FE0A0008
H'1E0A0008
32
Note: * SH7750R only
9.1.3
Pin Configuration
Table 9.3 shows the pins used for power-down mode control.
Table 9.3
Power-Down Mode Pins
Pin Name
Abbreviation
I/O
Function
Processor status 1
STATUS1
Output
Processor status 0
STATUS0
Indicate the processor’s operating status.
(STATUS1, STATUS0)
HH: Reset
HL: Sleep mode
LH: Standby mode
LL: Normal operation
Hardware standby
request
(SH7750S and
SH7750R only)
CA
Input
Transits to hardware standby mode by a
low-level input to the pin.
Notes: H: High level
L: Low level
Rev. 6.0, 07/02, page 223 of 986
9.2
Register Descriptions
9.2.1
Standby Control Register (STBCR)
The standby control register (STBCR) is an 8-bit readable/writable register that specifies the
power-down mode status. It is initialized to H'00 by a power-on reset via the 5(6(7 pin or due to
watchdog timer overflow.
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
STBY
PHZ
PPU
MSTP4
MSTP3
MSTP2
MSTP1
MSTP0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit 7—Standby (STBY): Specifies a transition to standby mode.
Bit 7: STBY
Description
0
Transition to sleep mode on execution of SLEEP instruction
1
Transition to standby mode on execution of SLEEP instruction
(Initial value)
Bit 6—Peripheral Module Pin High Impedance Control (PHZ): Controls the state of
peripheral module related pins in standby mode. When the PHZ bit is set to 1, peripheral module
related pins go to the high-impedance state in standby mode.
For the relevant pins, see section 9.2.2, Peripheral Module Pin High Impedance Control.
Bit 6: PHZ
Description
0
Peripheral module related pins are in normal state
1
Peripheral module related pins go to high-impedance state
(Initial value)
Bit 5—Peripheral Module Pin Pull-Up Control (PPU): Controls the state of peripheral module
related pins. When the PPU bit is cleared to 0, the pull-up resistor is turned on for peripheral
module related pins in the input or high-impedance state.
For the relevant pins, see section 9.2.3, Peripheral Module Pin Pull-Up Control.
Bit 5: PPU
Description
0
Peripheral module related pin pull-up resistors are on
1
Peripheral module related pin pull-up resistors are off
(Initial value)
Bit 4—Module Stop 4 (MSTP4): Specifies stopping of the clock supply to the DMAC among the
on-chip peripheral modules. The clock supply to the DMAC is stopped when the MSTP4 bit is set
Rev. 6.0, 07/02, page 224 of 986
to 1. When DMA transfer is used, stop the transfer before setting the MSTP4 bit to 1. When DMA
transfer is performed after clearing the MSTP4 bit to 0, DMAC settings must be made again.
Bit 4: MSTP4
Description
0
DMAC operates
1
DMAC clock supply is stopped
(Initial value)
Bit 3—Module Stop 3 (MSTP3): Specifies stopping of the clock supply to serial communication
interface channel 2 (SCIF) among the on-chip peripheral modules. The clock supply to the SCIF is
stopped when the MSTP3 bit is set to 1.
Bit 3: MSTP3
Description
0
SCIF operates
1
SCIF clock supply is stopped
(Initial value)
Bit 2—Module Stop 2 (MSTP2): Specifies stopping of the clock supply to the timer unit (TMU)
among the on-chip peripheral modules. The clock supply to the TMU is stopped when the MSTP2
bit is set to 1.
Bit 2: MSTP2
Description
0
TMU operates
1
TMU clock supply is stopped
(Initial value)
Bit 1—Module Stop 1 (MSTP1): Specifies stopping of the clock supply to the realtime clock
(RTC) among the on-chip peripheral modules. The clock supply to the RTC is stopped when the
MSTP1 bit is set to 1. When the clock supply is stopped, RTC registers cannot be accessed but the
counters continue to operate.
Bit 1: MSTP1
Description
0
RTC operates
1
RTC clock supply is stopped
(Initial value)
Bit 0—Module Stop 0 (MSTP0): Specifies stopping of the clock supply to serial communication
interface channel 1 (SCI) among the on-chip peripheral modules. The clock supply to the SCI is
stopped when the MSTP0 bit is set to 1.
Bit 0: MSTP0
Description
0
SCI operates
1
SCI clock supply is stopped
(Initial value)
Rev. 6.0, 07/02, page 225 of 986
9.2.2
Peripheral Module Pin High Impedance Control
When bit 6 in the standby control register (STBCR) is set to 1, peripheral module related pins go
to the high-impedance state in standby mode.
• Relevant Pins
SCI related pins
MD0/SCK
MD1/TXD2
MD7/TXD
MD8/RTS2
CTS2
DMA related pins
DACK0
DRAK0
DACK1
DRAK1
• Other Information
The setting in this register is invalid when the above pins are used as port output pins.
For details of pin states, see Appendix E, Pin Functions.
9.2.3
Peripheral Module Pin Pull-Up Control
When bit 5 in the standby control register (STBCR) is cleared to 0, peripheral module related pins
are pulled up when in the input or high-impedance state.
• Relevant Pins
SCI related pins
MD0/SCK
MD1/TXD2
MD2/RXD2
MD7/TXD
MD8/RTS2
SCK2/05(6(7
RXD
CTS2
DMA related pins
'5(43
DACK0
DRAK0
'5(44
DACK1
DRAK1
TMU related pin
TCLK
• Other Information
The setting in this register is invalid in the hardware standby mode.
For details of pin states, see Appendix E, Pin Functions.
Rev. 6.0, 07/02, page 226 of 986
9.2.4
Standby Control Register 2 (STBCR2)
Standby control register 2 (STBCR2) is an 8-bit readable/writable register that specifies the sleep
mode and deep sleep mode transition conditions. It is initialized to H'00 by a power-on reset via
the 5(6(7 pin or due to watchdog timer overflow.
Bit:
Initial value:
R/W:
7
6
DSLP
2
STHZ*
5
—
4
—
3
2
—
—
1
0
1
1
MSTP6* MSTP5*
0
0
0
0
0
0
0
0
R/W
R/W
R
R
R
R
R/W
R/W
Notes: *1 Reserved bit in the SH7750.
*2 Reserved bit in the SH7750 and SH7750S.
Bit 7—Deep Sleep (DSLP): Specifies a transition to deep sleep mode
Bit 7: DSLP
Description
0
Transition to sleep mode or standby mode on execution of SLEEP
instruction, according to setting of STBY bit in STBCR register (Initial value)
1
Transition to deep sleep mode on execution of SLEEP instruction*
Note: * When the STBY bit in the STBCR register is 0
Bit 6 (SH7750R Only)—STATUS Pin High-Impedance Control (STHZ): This bit selects
whether the STATUS0 and 1 pins are set to high-impedance when in hardware standby mode.
Bit 6: STHZ
Description
0
Sets STATUS0, 1 pins to high-impedance when in hardware standby mode
(Initial value)
1
Drives STATUS0, 1 pins to LH when in hardware standby mode
Bit 6 (SH7750 and SH7750S)—Reserved: Only 0 should only be written to these bits; operation
cannot be guaranteed if 1 is written. These bits are always read as 0.
Bits 5 to 2—Reserved: Only 0 should only be written to these bits; operation cannot be
guaranteed if 1 is written. These bits are always read as 0.
Bits 1 and 0 (SH7750)—Reserved: Only 0 should only be written to these bits; operation cannot
be guaranteed if 1 is written. These bits are always read as 0.
Rev. 6.0, 07/02, page 227 of 986
Bit 1 (SH7750S and SH7750R)—Module Stop 6 (MSTP6): Specifies that the clock supply to
the store queue (SQ) in the cache controller (CCN) is stopped. Setting the MSTP6 bit to 1 stops
the clock supply to the SQ, and the SQ functions are therefore unavailable.
Bit 1: MSTP6
Description
0
SQ operating
1
Clock supply to SQ stopped
(Initial value)
Bit 0 (SH7750S and SH7750R)—Module Stop 5 (MSTP5): Specifies stopping of the clock
supply to the user break controller (UBC) among the on-chip peripheral modules. See section
20.6, User Break Controller Stop Functions for how to set the clock supply.
Bit 0: MSTP5
Description
0
UBC operating
1
Clock supply to UBC stopped
9.2.5
(Initial value)
Clock-Stop Register 00 (CLKSTP00) (SH7750R Only)
Clock-stop register 00 (CLKSTP00) controls the operation clock for peripheral modules. To
resume supply of the clock signal, write a 1 to the corresponding bit in the CLKSTPCLR00
register. Writing a 0 to the CLKSTP00 register does not affect the register’s value. The
CLKSTP00 register is a 32-bit register that can be read from or written to. It is initialized to
H'0000 0000 by a power-on reset, but not by a manual reset or when the device enters standby
mode.
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
CSTP1 CSTP0
0
0
R/W R/W
Bits 31 to 2—Reserved: Any data written to these bits should always be 0. These bits are always
read as 0.
Rev. 6.0, 07/02, page 228 of 986
Bit 1—Clock stop 1 (CSTP1): This bit specifies stopping of the peripheral clock supply to
channels 3 and 4 of the timer unit (TMU).
Bit 1: CSTP1
Description
0
Peripheral clock is supplied to TMU channels 3 and 4
1
Peripheral clock supply to TMU channels 3 and 4 is stopped
(Initial value)
Bit 0
Clock Stop 0 (CSTP0): Specifies stopping of the peripheral clock supply to the interrupt
controller (INTC). If this bit is set, INTC does not detect interrupts on the TMU’s channels 3 and
4.
Bit 0: CSTP0
Description
0
INTC detects interrupts on channels 3 and 4 of the TMU
1
INTC does not detect interrupts on channels 3 and 4 of the TMU
9.2.6
(Initial value)
Clock-Stop Clear Register 00 (CLKSTPCLR00) (SH7750R Only)
The clock-stop clear register 00 (CLKSTPCLR00) is a 32-bit write-only register that clears the
corresponding bits of the CLKSTP00 register.
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
Bits 31 to 0
Clock-Stop Clear: Specify whether or not to clear the corresponding bit of the
clock-stop setting. See section 9.2.5, Clock-Stop Register 00 (LKSTP00) (SH7750R only), for the
correspondence between the bits and the clocks that are stopped.
Bits 31 to 0
Description
0
Does not change the clock-stop setting for the corresponding clock
1
Clears the clock-stop setting for the corresponding clock
Rev. 6.0, 07/02, page 229 of 986
9.3
Sleep Mode
9.3.1
Transition to Sleep Mode
If a SLEEP instruction is executed when the STBY bit in STBCR is cleared to 0, the chip switches
from the program execution state to sleep mode. After execution of the SLEEP instruction, the
CPU halts but its register contents are retained. The on-chip peripheral modules continue to
operate, and the clock continues to be output from the CKIO pin.
In sleep mode, a high-level signal is output at the STATUS1 pin, and a low-level signal at the
STATUS0 pin.
9.3.2
Exit from Sleep Mode
Sleep mode is exited by means of an interrupt (NMI, IRL, or on-chip peripheral module) or a
reset. In sleep mode, interrupts are accepted even if the BL bit in the SR register is 1. If necessary,
SPC and SSR should be saved to the stack before executing the SLEEP instruction.
Exit by Interrupt: When an NMI, IRL, or on-chip peripheral module interrupt is generated, sleep
mode is exited and interrupt exception handling is executed. The code corresponding to the
interrupt source is set in the INTEVT register.
Exit by Reset: Sleep mode is exited by means of a power-on or manual reset via the 5(6(7 pin,
or a power-on or manual reset executed when the watchdog timer overflows.
9.4
Deep Sleep Mode
9.4.1
Transition to Deep Sleep Mode
If a SLEEP instruction is executed when the STBY bit in STBCR is cleared to 0 and the DSLP bit
in STBCR2 is set to 1, the chip switches from the program execution state to deep sleep mode.
After execution of the SLEEP instruction, the CPU halts but its register contents are retained.
Except for the DMAC*, on-chip peripheral modules continue to operate. The clock continues to
be output to the CKIO pin, but all bus access (including auto refresh) stops. When using memory
that requires refreshing, set the self-refresh function prior to making the transition to deep sleep
mode.
In deep sleep mode, a high-level signal is output at the STATUS1 pin, and a low-level signal at
the STATUS0 pin.
Note: * Terminate DMA transfers prior to making the transition to deep sleep mode. If you make a
transition to deep sleep mode while DMA transfers are in progress, the results of those
transfers cannot be guaranteed.
Rev. 6.0, 07/02, page 230 of 986
9.4.2
Exit from Deep Sleep Mode
As with sleep mode, deep sleep mode is exited by means of an interrupt (NMI, IRL, or on-chip
peripheral module) or a reset.
9.5
Standby Mode
9.5.1
Transition to Standby Mode
If a SLEEP instruction is executed when the STBY bit in STBCR is set to 1, the chip switches
from the program execution state to standby mode. In standby mode, the on-chip peripheral
modules halt as well as the CPU. Clock output from the CKIO pin is also stopped.
The CPU and cache register contents are retained. Some on-chip peripheral module registers are
initialized. The state of the peripheral module registers in standby mode is shown in table 9.4.
Table 9.4
State of Registers in Standby Mode
Module
Initialized Registers
Registers That Retain
Their Contents
Interrupt controller
—
All registers
User break controller
—
All registers
Bus state controller
—
All registers
On-chip oscillation circuits
—
All registers
Timer unit
TSTR register*
All registers except TSTR
Realtime clock
—
All registers
Direct memory access controller
—
All registers
Serial communication interface
See Appendix A, Address List See Appendix A, Address List
Notes: DMA transfer should be terminated before making a transition to standby mode. Transfer
results are not guaranteed if standby mode is entered during transfer.
* Not initialized when the realtime clock (RTC) is in use (see section 12, Timer Unit
(TMU)).
The procedure for a transition to standby mode is shown below.
1. Clear the TME bit in the WDT timer control register (WTCSR) to 0, and stop the WDT.
Set the initial value for the up-count in the WDT timer counter (WTCNT), and set the clock to
be used for the up-count in bits CKS2–CKS0 in the WTCSR register.
2. Set the STBY bit in the STBCR register to 1, then execute a SLEEP instruction.
3. When standby mode is entered and the chip’s internal clock stops, a low-level signal is output
at the STATUS1 pin, and a high-level signal at the STATUS0 pin.
Rev. 6.0, 07/02, page 231 of 986
9.5.2
Exit from Standby Mode
Standby mode is exited by means of an interrupt (NMI, IRL, or on-chip peripheral module) or a
reset via the 5(6(7 pin.
Exit by Interrupt: A hot start can be performed by means of the on-chip WDT. When an NMI,
1
2
IRL* , RTC, or GPIO* interrupt is detected, the WDT starts counting. After the count overflows,
clocks are supplied to the entire chip, standby mode is exited, and the STATUS1 and STATUS0
pins both go low. Interrupt exception handling is then executed, and the code corresponding to the
interrupt source is set in the INTEVT register. In standby mode, interrupts are accepted even if the
BL bit in the SR register is 1, and so, if necessary, SPC and SSR should be saved to the stack
before executing the SLEEP instruction.
The phase of the CKIO pin clock output may be unstable immediately after an interrupt is
detected, until standby mode is exited.
Notes: *1 Only when the RTC clock (32.768 kHz) is operating (see section 19.2.2, IRL
Interrupts), standby mode can be exited by means of IRL3–IRL0 (when the IRL3–
IRL0 level is higher than the SR register I3–I0 mask level).
*2 GPIO can be used to cancel standby mode when the RTC clock (32.768 kHz) is
operating (when the GPIO level is higher than the SR register I3–I0 mask level).
Exit by Reset: Standby mode is exited by means of a reset (power-on or manual) via the 5(6(7
pin. The 5(6(7 pin should be held low until clock oscillation stabilizes. The internal clock
continues to be output at the CKIO pin.
9.5.3
Clock Pause Function
In standby mode, it is possible to stop or change the frequency of the clock input from the EXTAL
pin. This function is used as follows.
1. Enter standby mode following the transition procedure described above.
2. When standby mode is entered and the chip’s internal clock stops, a low-level signal is output
at the STATUS1 pin, and a high-level signal at the STATUS0 pin.
3. The input clock is stopped, or its frequency changed, after the STATUS1 pin goes low and the
STATUS0 pin high.
4. When the frequency is changed, input an NMI or IRL interrupt after the change. When the
clock is stopped, input an NMI or IRL interrupt after applying the clock.
5. After the time set in the WDT, clock supply begins inside the chip, the STATUS1 and
STATUS0 pins both go low, and operation is resumed from interrupt exception handling.
Rev. 6.0, 07/02, page 232 of 986
9.6
Module Standby Function
9.6.1
Transition to Module Standby Function
Setting the MSTP6–MSTP0, CSTP1, and CSTP0 bits in the standby control register to 1 enables
the clock supply to the corresponding on-chip peripheral modules to be halted. Use of this
function allows power consumption in sleep mode to be further reduced.
In the module standby state, the on-chip peripheral module external pins retain their states prior to
halting of the modules, and most registers retain their states prior to halting of the modules.
Rev. 6.0, 07/02, page 233 of 986
Bit
Description
CSTP1*
6
CSTP0*
6
MSTP6*
4
MSTP5*
4
MSTP4
MSTP3
MSTP2
MSTP1
MSTP0
0
Peripheral clock is supplied to TMU channels 3 and 4
1
Peripheral clock supplied to TMU channels 3 and 4 is stopped
0
INTC detects interrupts on TMU channels 3 and 4
1
INTC does not detect interrupts on TMU channels 3 and 4
0
SQ operates
1
Clock supplied to SQ is stopped
0
UBC operates
1
Clock supplied to UBC is stopped*
0
DMAC operates
1
Clock supplied to DMAC is stopped*
5
3
0
SCIF operates
1
Clock supplied to SCIF is stopped
0
TMU operates
1
Clock supplied to TMU is stopped, and register is initialized*
0
RTC operates
1
Clock supplied to RTC is stopped*
0
SCI operates
1
Clock supplied to SCI is stopped
1
2
Notes: *1 The register initialized is the same as in standby mode, but initialization is not
performed if the RTC clock is not in use (see section 12, Timer Unit (TMU)).
*2 The counter operates when the START bit in RCR2 is 1 (see section 11, Realtime
Clock (RTC)).
*3 Terminate DMA transfers prior to making the transition to module standby mode. If you
make a transition to module standby mode while DMA transfers are in progress, the
results of those transfers cannot be guaranteed.
*4 SH7750S, SH7750R only
*5 For details, see section 20.6, User Break Controller Stop Functions.
*6 SH7750R only
9.6.2
Exit from Module Standby Function
The module standby function is exited by clearing the MSTP6–MSTP0, CSTP1, and CSTP0 bits
to 0, or by a power-on reset via the 5(6(7 pin or a power-on reset caused by watchdog timer
overflow.
Rev. 6.0, 07/02, page 234 of 986
9.7
Hardware Standby Mode (SH7750S, SH7750R Only)
9.7.1
Transition to Hardware Standby Mode
Setting the CA pin level low effects a transition to hardware standby mode. In this mode, all
modules other than the RTC stop, as in the standby mode selected using the SLEEP command.
Hardware standby mode differs from standby mode as follows:
1. Interrupts and manual resets are not available;
2. All output pins other than the STATUS pin are in the high-impedance state and the pull-up
resistance is off.
3. Even when no power is supplied to power pins other than the RTC power supply pin, the RTC
continues to operate.
The status of the STATUS pin is determined by the STHZ bit of STBCR2. See appendix E, Pin
Functions, for details of output pin states.
Operation when a low-level is input to the CA pin when in the standby mode depends on the CPG
status, as follows:
1. In standby mode
The clock remains stopped and a transition is made to the hardware standby state.
2. When WDT is operating when standby mode is exited by interrupt
Standby mode is momentarily exited, the CPU restarts, and then a transition is made to
hardware standby mode.
Note that the level of the CA pin must be kept low while in hardware standby mode.
9.7.2
Exit from Hardware Standby Mode
Hardware standby mode can only be exited by effecting a power-on reset.
Setting the CA pin level high after the 5(6(7 pin level has been set low and the SCK2 pin high
starts the clock to oscillate. The 5(6(7 pin level should be kept low until the clock has stabilized,
then set high so that the CPU starts the power-on reset procedure.
Note that hardware standby mode cannot be exited using interrupts or a manual reset.
9.7.3
Usage Notes
The CA pin level must be kept high during the power-on oscillation settling period when the RTC
power supply is started (figure 9.15).
Rev. 6.0, 07/02, page 235 of 986
9.8
STATUS Pin Change Timing
The STATUS1 and STATUS0 pin change timing is shown below.
The meaning of the STATUS pin settings is as follows:
Reset:
Sleep:
Standby:
Normal:
HH (STATUS1 high, STATUS0 high)
HL (STATUS1 high, STATUS0 low)
LH (STATUS1 low, STATUS0 high)
LL (STATUS1 low, STATUS0 low)
The meaning of the clock units is as follows:
Bcyc: Bus clock cycle
Pcyc: Peripheral clock cycle
Rev. 6.0, 07/02, page 236 of 986
9.8.1
In Reset
Power-On Reset
CKIO
PLL stabilization
time
SCK2
Normal
STATUS
Reset
Normal
0–30 Bcyc
0–5 Bcyc
Figure 9.1 STATUS Output in Power-On Reset
Manual Reset
CKIO
*
SCK2
STATUS
Normal
Reset
Normal
0–30 Bcyc
≥ 0 Bcyc
Note: * In a manual reset, STATUS = HH (reset) is set and an internal reset started after waiting
until the end of the currently executing bus cycle.
Figure 9.2 STATUS Output in Manual Reset
Rev. 6.0, 07/02, page 237 of 986
9.8.2
In Exit from Standby Mode
Standby → Interrupt
Oscillation stops
Interrupt request
WDT overflow
CKIO
WDT count
STATUS
Normal
Standby
Normal
Figure 9.3 STATUS Output in Standby → Interrupt Sequence
Standby → Power-On Reset
Oscillation stops
Reset
CKIO
*1
SCK2
STATUS
Normal
Standby
*2
0–10 Bcyc
Reset
Normal
0–30 Bcyc
Notes: *1 When standby mode is exited by means of a power-on reset, a WDT count is not
low for the PLL oscillation stabilization time.
performed. Hold
*2 Undefined
Figure 9.4 STATUS Output in Standby → Power-On Reset Sequence
Rev. 6.0, 07/02, page 238 of 986
Standby → Manual Reset
Oscillation stops
Reset
CKIO
*1
SCK2
STATUS
Normal
Standby
*2
0–10 Bcyc
Reset
Normal
0–30 Bcyc
Notes: *1 When standby mode is exited by means of a manual reset, a WDT count is not
low for the PLL oscillation stabilization time.
performed. Hold
*2 Undefined
Figure 9.5 STATUS Output in Standby → Manual Reset Sequence
Rev. 6.0, 07/02, page 239 of 986
9.8.3
In Exit from Sleep Mode
Sleep → Interrupt
Interrupt request
CKIO
STATUS
Normal
Sleep
Normal
Figure 9.6 STATUS Output in Sleep → Interrupt Sequence
Sleep → Power-On Reset
Reset
CKIO
*1
SCK2
STATUS
Normal
Sleep
*2
0–10 Bcyc
Reset
Normal
0–30 Bcyc
Notes: *1 When sleep mode is exited by means of a power-on reset, hold
oscillation stabilization time.
*2 Undefined
Figure 9.7 STATUS Output in Sleep → Power-On Reset Sequence
Rev. 6.0, 07/02, page 240 of 986
low for the
Sleep → Manual Reset
Reset
CKIO
*
SCK2
Normal
STATUS
Sleep
Reset
0–30 Bcyc
Note: * Hold
Normal
0–30 Bcyc
low until STATUS = reset.
Figure 9.8 STATUS Output in Sleep → Manual Reset Sequence
Rev. 6.0, 07/02, page 241 of 986
9.8.4
In Exit from Deep Sleep Mode
Deep Sleep → Interrupt
Interrupt request
CKIO
STATUS
Sleep
Normal
Normal
Figure 9.9 STATUS Output in Deep Sleep → Interrupt Sequence
Deep Sleep → Power-On Reset
Reset
CKIO
*1
SCK2
STATUS
Normal
Sleep
*2
0–10 Bcyc
Reset
Normal
0–30 Bcyc
Notes: *1 When deep sleep mode is exited by means of a power-on reset, hold
oscillation stabilization time.
*2 Undefined
low for the
Figure 9.10 STATUS Output in Deep Sleep → Power-On Reset Sequence
Rev. 6.0, 07/02, page 242 of 986
Deep Sleep → Manual Reset
Reset
CKIO
*
SCK2
Normal
STATUS
Sleep
Reset
0–30 Bcyc
Note: * Hold
Normal
0–30 Bcyc
low until STATUS = reset.
Figure 9.11 STATUS Output in Deep Sleep → Manual Reset Sequence
Rev. 6.0, 07/02, page 243 of 986
9.8.5
Hardware Standby Mode Timing (SH7750S, SH7750R Only)
Figure 9.12 shows the timing of the signals of the respective pins in hardware standby mode.
The CA pin level must be kept low while in hardware standby mode.
After setting the 5(6(7 pin level low, the clock starts when the CA pin level is switched to high.
CKIO
CA
SCK2
(High)
STATUS
Normal*1
Standby*3
0–10 Bcyc
*2
Reset
0–10 Bcyc
Waiting for end of bus cycle
Notes: *1 Same at sleep and reset.
*2 Undefined
*3 High impedance when STBCR2. STHZ = 0
Figure 9.12 Hardware Standby Mode Timing
(When CA = Low in Normal Operation)
Rev. 6.0, 07/02, page 244 of 986
Interrupt request
WDT overflow
CKIO
CA
(High)
SCK2
STATUS
(High)
Standby
Normal
Standby*
0–10 Bcyc
WDT count
Note: * High impedance when STBCR2. STHZ = 0
Figure 9.13 Hardware Standby Mode Timing
(When CA = Low in WDT Operation)
Rev. 6.0, 07/02, page 245 of 986
VDDQ*
VDD min
VDD
CA
SCK2
Min 0s
Min 0s
Max 50 µs
Note: * VDDQ, VDD-CPG, VDD-PLL1, VDD-PLL2
Figure 9.14 Timing When Power Other than VDD-RTC is Off
VDD-RTC
Power-on oscillation
setting time
CA
VDD, VDDQ*
Min 0s
SCK2
Note: * VDD, VDD-PLL1/2, VDDQ, VDD-CPG
Figure 9.15 Timing When VDD-RTC Power is Off → On
Rev. 6.0, 07/02, page 246 of 986
Section 10 Clock Oscillation Circuits
10.1
Overview
The on-chip oscillation circuits comprise a clock pulse generator (CPG) and a watchdog timer
(WDT).
The CPG generates the clocks supplied inside the processor and performs power-down mode
control.
The WDT is a single-channel timer used to count the clock stabilization time when exiting standby
mode or the frequency is changed. It can be used as a normal watchdog timer or an interval timer.
10.1.1
Features
The CPG has the following features:
• Three clocks
The CPG can generate independently the CPU clock (Iφ) used by the CPU, FPU, caches, and
TLB, the peripheral module clock (Pφ) used by the peripheral modules, and the bus clock
(CKIO) used by the external bus interface.
• Six clock modes
Any of six clock operating modes can be selected, with different combinations of CPU clock,
bus clock, and peripheral module clock division ratios after a power-on reset.
• Frequency change function
PLL (phase-locked loop) circuits and a frequency divider in the CPG enable the CPU clock,
bus clock, and peripheral module clock frequencies to be changed independently. Frequency
changes are performed by software in accordance with the settings in the frequency control
register (FRQCR).
• PLL on/off control
Power consumption can be reduced by stopping the PLL circuits during low-frequency
operation.
• Power-down mode control
It is possible to stop the clock in sleep mode and standby mode, and to stop specific modules
with the module standby function.
Rev. 6.0, 07/02, page 247 of 986
The WDT has the following features
• Can be used to secure clock stabilization time
Used when exiting standby mode or a temporary standby state when the clock frequency is
changed.
• Can be switched between watchdog timer mode and interval timer mode
• Internal reset generation in watchdog timer mode
An internal reset is executed on counter overflow.
Power-on reset or manual reset can be selected.
• Interrupt generation in interval timer mode
An interval timer interrupt is generated on counter overflow.
• Selection of eight counter input clocks
Any of eight clocks can be selected, scaled from the ×1 clock of frequency divider 2 shown in
figure 10.1.
The CPG is described in sections 10.2 to 10.6, and the WDT in sections 10.7 to 10.9.
Rev. 6.0, 07/02, page 248 of 986
10.2
Overview of CPG
10.2.1
Block Diagram of CPG
Figure 10.1 (1) shows a block diagram of the CPG in the SH7750 and SH7750S, and figure 10.1
(2) a block diagram of the CPG in the SH7750R.
Oscillator circuit
PLL circuit 1
×6
XTAL
Frequency
divider 2
×1
× 1/2
× 1/3
× 1/4
× 1/6
× 1/8
CPU clock (Iø)
cycle Icyc
Frequency
divider 1
Crystal
oscillator
Peripheral module
clock (Pø) cycle
Pcyc
× 1/2
EXTAL
MD8
Bus clock (Bø)
cycle Bcyc
PLL circuit 2
×1
CKIO
CPG control unit
MD2
MD1
MD0
Clock frequency
control circuit
Standby control
circuit
FRQCR
STBCR
STBCR2
Bus interface
Internal bus
FRQCR: Frequency control register
STBCR: Standby control register
STBCR2: Standby control register 2
Figure 10.1 (1) Block Diagram of CPG (SH7750, SH7750S)
Rev. 6.0, 07/02, page 249 of 986
Oscillator circuit
Frequency
divider 2
PLL circuit 1
×6
× 12
XTAL
×1
× 1/2
× 1/3
× 1/4
× 1/6
× 1/8
CPU clock (Iø)
cycle Icyc
Crystal
oscillator
Peripheral module
clock (Pø) cycle
Pcyc
EXTAL
MD8
Bus clock (Bø)
cycle Bcyc
PLL circuit 2
×1
CKIO
CPG control unit
MD2
MD1
MD0
Clock frequency
control circuit
Standby control
circuit
FRQCR
STBCR
STBCR2
Bus interface
Internal bus
FRQCR: Frequency control register
STBCR: Standby control register
STBCR2: Standby control register 2
Figure 10.1 (2) Block Diagram of CPG (SH7750R)
Rev. 6.0, 07/02, page 250 of 986
The function of each of the CPG blocks is described below.
PLL Circuit 1: PLL circuit 1 has a function for multiplying the clock frequency from the EXTAL
pin or crystal oscillator by 6 with the SH7750 and SH7750S, and by 6 or 12 with the SH7750R.
Starting and stopping is controlled by a frequency control register setting. Control is performed so
that the internal clock rising edge phase matches the input clock rising edge phase.
PLL Circuit 2: PLL circuit 2 coordinates the phases of the bus clock and the CKIO pin output
clock. Starting and stopping is controlled by a frequency control register setting.
Crystal Oscillator: This is the oscillator circuit used when a crystal resonator is connected to the
XTAL and EXTAL pins. Use of the crystal oscillator can be selected with the MD8 pin.
Frequency Divider 1 (SH7750 and SH7750S only): Frequency divider 1 has a function for
adjusting the clock waveform duty to 50% by halving the input clock frequency when clock input
from the EXTAL pin is supplied internally without using PLL circuit 1.
Frequency Divider 2: Frequency divider 2 generates the CPU clock (Iφ), bus clock (Bφ), and
peripheral module clock (Pφ). The division ratio is set in the frequency control register.
Clock Frequency Control Circuit: The clock frequency control circuit controls the clock
frequency by means of the MD pins and frequency control register.
Standby Control Circuit: The standby control circuit controls the state of the on-chip oscillation
circuits and other modules when the clock is switched and in sleep and standby modes.
Frequency Control Register (FRQCR): The frequency control register contains control bits for
clock output from the CKIO pin, PLL circuit 1 and 2 on/off control, and the CPU clock, bus clock,
and peripheral module clock frequency division ratios.
Standby Control Register (STBCR): The standby control register contains power save mode
control bits. For further information on the standby control register, see section 9, Power-Down
Modes.
Standby Control Register 2 (STBCR2): Standby control register 2 contains a power save mode
control bit. For further information on standby control register 2, see section 9, Power-Down
Modes.
Rev. 6.0, 07/02, page 251 of 986
10.2.2
CPG Pin Configuration
Table 10.1 shows the CPG pins and their functions.
Table 10.1 CPG Pins
Pin Name
Abbreviation
I/O
Function
Mode control pins
MD0
Input
Set clock operating mode
XTAL
Output
Connects crystal resonator
EXTAL
Input
Connects crystal resonator, or used as
external clock input pin
MD8
Input
Selects use/non-use of crystal resonator
MD1
MD2
Crystal I/O pins
(clock input pins)
When MD8 = 0, external clock is input from
EXTAL
When MD8 = 1, crystal resonator is
connected directly to EXTAL and XTAL
Clock output pin
CKIO
Output
CKIO enable pin
CKE
Output
Used as external clock output pin
Level can also be fixed
0 when CKIO output clock is unstable and in
case of synchronous DRAM self-refreshing*
Note: * Set to 1 in a power-on reset.
For details of synchronous DRAM self-refreshing, see section 13.3.5, Synchronous DRAM
Interface.
10.2.3
CPG Register Configuration
Table 10.2 shows the CPG register configuration.
Table 10.2 CPG Register
Name
Abbreviation
R/W
Initial Value
P4 Address
Area 7
Address
Access
Size
Frequency control
register
FRQCR
R/W
Undefined*
H'FFC00000
H'1FC00000
16
Note: * Depends on the clock operating mode set by pins MD2–MD0.
Rev. 6.0, 07/02, page 252 of 986
10.3
Clock Operating Modes
Tables 10.3 (1) and 10.3 (2) show the clock operating modes corresponding to various
combinations of mode control pin (MD2–MD0) settings (initial settings such as the frequency
division ratio).
Table 10.4 shows FRQCR settings and internal clock frequencies.
Table 10.3 (1) Clock Operating Modes (SH7750, SH7750S)
External
Pin Combination
Clock
Operating
Mode
MD2
MD1
0
0
0
1
2
1
3
4
1
0
5
Frequency
(vs. Input Clock)
MD0
1/2
Frequency
Divider
PLL2
CPU
Clock
Bus
Clock
Peripheral
Module
Clock
PLL1
FRQCR
Initial Value
0
Off
On
On
6
3/2
3/2
H'0E1A
1
Off
On
On
6
1
1
H'0E23
0
On
On
On
3
1
1/2
H'0E13
1
Off
On
On
6
2
1
H'0E13
0
On
On
On
3
3/2
3/4
H'0E0A
1
Off
On
On
6
3
3/2
H'0E0A
Notes: 1. Turning on/off of the ½ frequency divider is solely determined by the clock operating
mode.
2. For the ranges of input clock frequency, see the descriptions of the EXTAL clock input
frequency (fEX) and CKIO clock output (fOP) in section 22.3.1, Clock and Control Signal
Timing.
Table 10.3 (2) Clock Operating Modes (SH7750R)
External
Pin Combination
Clock
Operating
Mode
MD2
MD1
0
0
0
1
1
2
3
4
1
0
5
6
1
MD0
Frequency
(vs. Input Clock)
PLL1
PLL2
CPU
Clock
Bus
Clock
Peripheral
Module Clock
FRQCR
Initial Value
0
On (×12)
On
12
3
3
H'0E1A
1
On (×12)
On
12
3/2
3/2
H'0E2C
0
On (×6)
On
6
2
1
H'0E13
1
On (×12)
On
12
4
2
H'0E13
0
On (×6)
On
6
3
3/2
H'0E0A
1
On (×12)
On
12
6
3
H'0E0A
0
Off (×6)
Off
1
1/2
1/2
H'0808
Notes: 1. The multiplication factor of PLL 1 is solely determined by the clock operating mode.
2. For the ranges of input clock frequency, see the descriptions of the EXTAL clock input
frequency (fEX) and CKIO clock output (fOP) in section 22.3.1, Clock and Control Signal
Timing.
Rev. 6.0, 07/02, page 253 of 986
Table 10.4 FRQCR Settings and Internal Clock Frequencies
Frequency Division Ratio
FRQCR
(Lower 9 Bits)
CPU Clock
Bus Clock
Peripheral Module Clock
H'008
1
1/2
1/2
H'00A
1/4
H'00C
1/8
1/3
H'011
H'013
1/3
1/6
1/4
H'01A
H'01C
1/4
1/8
H'023
1/6
1/6
H'02C
1/8
1/8
1/4
1/4
H'05A
1/2
H'05C
1/8
H'063
1/6
1/6
H'06C
1/8
1/8
H'0A3
1/3
1/6
1/6
H'0EC
1/4
1/8
1/8
Note: For the lower 9 bits of FRQCR, do not set values other than those shown in the table.
10.4
CPG Register Description
10.4.1
Frequency Control Register (FRQCR)
The frequency control register (FRQCR) is a 16-bit readable/writable register that specifies
use/non-use of clock output from the CKIO pin, PLL circuit 1 and 2 on/off control, and the CPU
clock, bus clock, and peripheral module clock frequency division ratios. Only word access can be
used on FRQCR.
FRQCR is initialized only by a power-on reset via the 5(6(7 pin. The initial value of each bit is
determined by the clock operating mode.
Rev. 6.0, 07/02, page 254 of 986
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
15
14
13
12
11
10
9
—
—
—
—
0
0
0
0
1
1
1
—
R/W
R/W
R/W
R
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
IFC1
IFC0
BFC2
BFC1
BFC0
PFC2
PFC1
PFC0
—
—
—
—
—
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKOEN PLL1EN PLL2EN
8
IFC2
Bits 15 to 12—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 11—Clock Output Enable (CKOEN): Specifies whether a clock is output from the CKIO
pin or the CKIO pin is placed in the high-impedance state. When the CKIO pin goes to the highimpedance state, operation continues at the operating frequency before this state was entered.
When the CKIO pin becomes high-impedance, it is pulled up.
Bit 11: CKOEN
Description
0
CKIO pin goes to high-impedance state (pulled up*)
1
Clock is output from CKIO pin
(Initial value)
Note: * It is not pulled up in hardware standby mode.
Bit 10—PLL Circuit 1 Enable (PLL1EN): Specifies whether PLL circuit 1 is on or off.
Bit 10: PLL1EN
Description
0
PLL circuit 1 is not used
1
PLL circuit 1 is used
(Initial value)
Bit 9—PLL Circuit 2 Enable (PLL2EN): Specifies whether PLL circuit 2 is on or off.
Bit 9: PLL2EN
Description
0
PLL circuit 2 is not used
1
PLL circuit 2 is used
(Initial value)
Rev. 6.0, 07/02, page 255 of 986
Bits 8 to 6—CPU Clock Frequency Division Ratio (IFC): These bits specify the CPU clock
frequency division ratio with respect to the input clock, 1/2 frequency divider, or PLL circuit 1
output frequency.
Bit 8: IFC2
Bit 7: IFC1
Bit 6: IFC0
Description
0
0
0
×1
1
× 1/2
0
× 1/3
1
× 1/4
0
× 1/6
1
× 1/8
1
1
0
Other than the above
Setting prohibited (Do not set)
Bits 5 to 3—Bus Clock Frequency Division Ratio (BFC): These bits specify the bus clock
frequency division ratio with respect to the input clock, 1/2 frequency divider, or PLL circuit 1
output frequency.
Bit 5: BFC2
Bit 4: BFC1
Bit 3: BFC0
Description
0
0
0
×1
1
× 1/2
0
× 1/3
1
× 1/4
0
× 1/6
1
× 1/8
1
1
0
Other than the above
Setting prohibited (Do not set)
Bits 2 to 0—Peripheral Module Clock Frequency Division Ratio (PFC): These bits specify the
peripheral module clock frequency division ratio with respect to the input clock, 1/2 frequency
divider, or PLL circuit 1 output frequency.
Bit 2: PFC2
Bit 1: PFC1
Bit 0: PFC0
Description
0
0
0
× 1/2
1
× 1/3
0
× 1/4
1
× 1/6
0
× 1/8
1
1
0
Other than the above
Rev. 6.0, 07/02, page 256 of 986
Setting prohibited (Do not set)
10.5
Changing the Frequency
There are two methods of changing the internal clock frequency: by changing stopping and
starting of PLL circuit 1, and by changing the frequency division ratio of each clock. In both
cases, control is performed by software by means of the frequency control register. These methods
are described below.
10.5.1
Changing PLL Circuit 1 Starting/Stopping (When PLL Circuit 2 is Off)
When PLL circuit 1 is changed from the stopped to started state, a PLL stabilization time is
required. The oscillation stabilization time count is performed by the on-chip WDT.
1. Set a value in WDT to provide the specified oscillation stabilization time, and stop the WDT.
The following settings are necessary:
WTCSR register TME bit = 0: WDT stopped
WTCSR register CKS2–CKS0 bits: WDT count clock division ratio
WTCNT counter: Initial counter value
2. Set the PLL1EN bit to 1.
3. Internal processor operation stops temporarily, and the WDT starts counting up. The internal
clock stops and an unstable clock is output to the CKIO pin.
4. After the WDT count overflows, clock supply begins within the chip and the processor
resumes operation. The WDT stops after overflowing.
10.5.2
Changing PLL Circuit 1 Starting/Stopping (When PLL Circuit 2 is On)
When PLL circuit 2 is on, a PLL circuit 1 and PLL circuit 2 oscillation stabilization time is
required.
1. Make WDT settings as in 10.5.1.
2. Set the PLL1EN bit to 1.
3. Internal processor operation stops temporarily, PLL circuit 1 oscillates, and the WDT starts
counting up. The internal clock stops and an unstable clock is output to the CKIO pin.
4. After the WDT count overflows, PLL circuit 2 starts oscillating. The WDT resumes its upcount from the value set in step 1 above. During this time, also, the internal clock is stopped
and an unstable clock is output to the CKIO pin.
5. After the WDT count overflows, clock supply begins within the chip and the processor
resumes operation. The WDT stops after overflowing.
Rev. 6.0, 07/02, page 257 of 986
10.5.3
Changing Bus Clock Division Ratio (When PLL Circuit 2 is On)
If PLL circuit 2 is on when the bus clock frequency division ratio is changed, a PLL circuit 2
oscillation stabilization time is required.
1. Make WDT settings as in 10.5.1.
2. Set the BFC2–BFC0 bits to the desired value.
3. Internal processor operation stops temporarily, and the WDT starts counting up. The internal
clock stops and an unstable clock is output to the CKIO pin.
4. After the WDT count overflows, clock supply begins within the chip and the processor
resumes operation. The WDT stops after overflowing.
10.5.4
Changing Bus Clock Division Ratio (When PLL Circuit 2 is Off)
If PLL circuit 2 is off when the bus clock frequency division ratio is changed, a WDT count is not
performed.
1. Set the BFC2–BFC0 bits to the desired value.
2. The set clock is switched to immediately.
10.5.5
Changing CPU or Peripheral Module Clock Division Ratio
When the CPU or peripheral module clock frequency division ratio is changed, a WDT count is
not performed.
1. Set the IFC2–IFC0 or PFC2–PFC0 bits to the desired value.
2. The set clock is switched to immediately.
10.6
Output Clock Control
The CKIO pin can be switched between clock output and a fixed level setting by means of the
CKOEN bit in the FRQCR register. When the CKIO pin goes to the high-impedance state, it is
pulled up.
Rev. 6.0, 07/02, page 258 of 986
10.7
Overview of Watchdog Timer
10.7.1
Block Diagram
Figure 10.2 shows a block diagram of the WDT.
WDT
Standby
release
Internal reset
request
Standby
mode
Standby
control
Frequency divider
Reset
control
Clock selection
Interrupt
request
Interrupt
control
Frequency
divider 2 ×1
clock
Clock selector
Overflow
Clock
WTCSR
WTCNT
Bus interface
WTCSR: Watchdog timer control/status register
WTCNT: Watchdog timer counter
Figure 10.2 Block Diagram of WDT
Rev. 6.0, 07/02, page 259 of 986
10.7.2
Register Configuration
The WDT has the two registers summarized in table 10.5. These registers control clock selection
and timer mode switching.
Table 10.5 WDT Registers
Name
Abbreviation
R/W
Initial
Value
P4 Address
Area 7
Address
Access Size
Watchdog timer
counter
WTCNT
R/W*
H'00
H'FFC00008
H'1FC00008
R: 8, W: 16*
Watchdog timer
control/status
register
WTCSR
R/W*
H'00
H'FFC0000C
H'1FC0000C
R: 8, W: 16*
Note: * Use word-size access when writing. Perform the write with the upper byte set to H'5A or
H'A5, respectively. Byte- and longword-size writes cannot be used.
Use byte access when reading.
10.8
WDT Register Descriptions
10.8.1
Watchdog Timer Counter (WTCNT)
The watchdog timer counter (WTCNT) is an 8-bit readable/writable counter that counts up on the
selected clock. When WTCNT overflows, a reset is generated in watchdog timer mode, or an
interrupt in interval timer mode. WTCNT is initialized to H'00 only by a power-on reset via the
5(6(7 pin.
To write to the WTCNT counter, use a word-size access with the upper byte set to H'5A. To read
WTCNT, use a byte-size access.
Bit:
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W:
Rev. 6.0, 07/02, page 260 of 986
10.8.2
Watchdog Timer Control/Status Register (WTCSR)
The watchdog timer control/status register (WTCSR) is an 8-bit readable/writable register
containing bits for selecting the count clock and timer mode, and overflow flags.
WTCSR is initialized to H'00 only by a power-on reset via the 5(6(7 pin. It retains its value in
an internal reset due to WDT overflow. When used to count the clock stabilization time when
exiting standby mode, WTCSR retains its value after the counter overflows.
To write to the WTCSR register, use a word-size access with the upper byte set to H'A5. To read
WTCSR, use a byte-size access.
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
TME
WT/,7
RSTS
WOVF
IOVF
CKS2
CKS1
CKS0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit 7—Timer Enable (TME): Specifies starting and stopping of timer operation. Clear this bit to
0 when using the WDT in standby mode or to change a clock frequency.
Bit 7: TME
Description
0
Up-count stopped, WTCNT value retained
1
Up-count started
(Initial value)
Bit 6—Timer Mode Select (WT/,7
,7):
,7 Specifies whether the WDT is used as a watchdog timer or
interval timer.
Bit 6: WT/,7
,7
Description
0
Interval timer mode
1
Watchdog timer mode
(Initial value)
Note: The up-count may not be performed correctly if WT/,7 is modified while the WDT is running.
Bit 5—Reset Select (RSTS): Specifies the kind of reset to be performed when WTCNT
overflows in watchdog timer mode. This setting is ignored in interval timer mode.
Bit 5: RSTS
Description
0
Power-on reset
1
Manual reset
(Initial value)
Rev. 6.0, 07/02, page 261 of 986
Bit 4—Watchdog Timer Overflow Flag (WOVF): Indicates that WTCNT has overflowed in
watchdog timer mode. This flag is not set in interval timer mode.
Bit 4: WOVF
Description
0
No overflow
1
WTCNT has overflowed in watchdog timer mode
(Initial value)
Bit 3—Interval Timer Overflow Flag (IOVF): Indicates that WTCNT has overflowed in
interval timer mode. This flag is not set in watchdog timer mode.
Bit 3: IOVF
Description
0
No overflow
1
WTCNT has overflowed in interval timer mode
(Initial value)
Bits 2 to 0—Clock Select 2 to 0 (CKS2–CKS0): These bits select the clock used for the WTCNT
count from eight clocks obtained by dividing the frequency divider 2 input clock*. The overflow
periods shown in the following table are for use of a 33 MHz input clock, with frequency divider 1
off, and PLL circuit 1 on (×6).
Note: * When PLL1 is switched on or off, the clock following the switch is used.
Description
Bit 2: CKS2
Bit 1: CKS1
Bit 0: CKS0
Clock Division Ratio
Overflow Period
0
0
0
1/32
41 µs
1
1/64
82 µs
0
1/128
164 µs
1
1/256
328 µs
0
1/512
656 µs
1
1/1024
1.31 ms
0
1/2048
2.62 ms
1
1/4096
5.25 ms
1
1
0
1
(Initial value)
Note: The up-count may not be performed correctly if bits CKS2–CKS0 are modified while the
WDT is running. Always stop the WDT before modifying these bits.
Rev. 6.0, 07/02, page 262 of 986
10.8.3
Notes on Register Access
The watchdog timer counter (WTCNT) and watchdog timer control/status register (WTCSR)
differ from other registers in being more difficult to write to. The procedure for writing to these
registers is given below.
Writing to WTCNT and WTCSR: These registers must be written to with a word transfer
instruction. They cannot be written to with a byte or longword transfer instruction. When writing
to WTCNT, perform the transfer with the upper byte set to H'5A and the lower byte containing the
write data. When writing to WTCSR, perform the transfer with the upper byte set to H'A5 and the
lower byte containing the write data. This transfer procedure writes the lower byte data to
WTCNT or WTCSR. The write formats are shown in figure 10.3.
WTCNT write
15
Address: H'FFC00008
(H'1FC00008)
8
7
0
H'5A
Write data
WTCSR write
15
Address: H'FFC0000C
(H'1FC0000C)
8
7
0
H'A5
Write data
Figure 10.3 Writing to WTCNT and WTCSR
10.9
Using the WDT
10.9.1
Standby Clearing Procedure
The WDT is used when clearing standby mode by means of an NMI or other interrupt. The
procedure is shown below. (As the WDT does not operate when standby mode is cleared with a
reset, the 5(6(7 pin should be held low until the clock stabilizes.)
1. Be sure to clear the TME bit in the WTCSR register to 0 before making a transition to standby
mode. If the TME bit is set to 1, an inadvertent reset or interval timer interrupt may be caused
when the count overflows.
2. Select the count clock to be used with bits CKS2–CKS0 in the WTCSR register, and set the
initial value in the WTCNT counter. Make these settings so that the time until the count
overflows is at least as long as the clock oscillation stabilization time. For details of the clock
oscillation stabilization time, see section 22.3.1, Clock and Control Signal Timing.
3. Make a transition to standby mode, and stop the clock, by executing a SLEEP instruction.
Rev. 6.0, 07/02, page 263 of 986
4. The WDT starts counting on detection of an NMI signal transition edge or an interrupt.
5. When the WDT count overflows, the CPG starts clock supply and the processor resumes
operation. The WOVF flag in the WTCSR register is not set at this time.
6. The counter stops at a value of H'00–H'01. The value at which the counter stops depends on
the clock ratio.
10.9.2
Frequency Changing Procedure
The WDT is used in a frequency change using the PLL. It is not used when the frequency is
changed simply by making a frequency divider switch.
1. Be sure to clear the TME bit in the WTCSR register to 0 before making a frequency change. If
the TME bit is set to 1, an inadvertent reset or interval timer interrupt may be caused when the
count overflows.
2. Select the count clock to be used with bits CKS2–CKS0 in the WTCSR register, and set the
initial value in the WTCNT counter. Make these settings so that the time until the count
overflows is at least as long as the clock oscillation stabilization time. For details of the clock
oscillation stabilization time, see section 22.3.1, Clock and Control Signal Timing.
3. When the frequency control register (FRQCR) is modified, the clock stops, and the standby
state is entered temporarily. The WDT starts counting.
4. When the WDT count overflows, the CPG starts clock supply and the processor resumes
operation. The WOVF flag in the WTCSR register is not set at this time.
5.
The counter stops at a value of H'00–H'01. The value at which the counter stops depends on
the clock ratio.
6.
When re-setting WTCNT immediately after modifying the frequency control register
(FRQCR), first read the counter and confirm that its value is as described in step 5 above.
10.9.3
Using Watchdog Timer Mode
1. Set the WT/,7 bit in the WTCSR register to 1, select the type of reset with the RSTS bit, and
the count clock with bits CKS2–CKS0, and set the initial value in the WTCNT counter.
2. When the TME bit in the WTCSR register is set to 1, the count starts in watchdog timer mode.
3. During operation in watchdog timer mode, write H'00 to the counter periodically so that it does
not overflow.
4. When the counter overflows, the WDT sets the WOVF flag in the WTCSR register to 1, and
generates a reset of the type specified by the RSTS bit. The counter then continues counting.
Rev. 6.0, 07/02, page 264 of 986
10.9.4
Using Interval Timer Mode
When the WDT is operating in interval timer mode, an interval timer interrupt is generated each
time the counter overflows. This enables interrupts to be generated at fixed intervals.
1. Clear the WT/,7 bit in the WTCSR register to 0, select the count clock with bits CKS2–CKS0,
and set the initial value in the WTCNT counter.
2. When the TME bit in the WTCSR register is set to 1, the count starts in interval timer mode.
3. When the counter overflows, the WDT sets the IOVF flag in the WTCSR register to 1, and
sends an interval timer interrupt request to INTC. The counter continues counting.
10.10
Notes on Board Design
When Using a Crystal Resonator: Place the crystal resonator and capacitors close to the EXTAL
and XTAL pins. To prevent induction from interfering with correct oscillation, ensure that no
other signal lines cross the signal lines for these pins.
CL1
Avoid crossing signal lines
CL2
R
EXTAL
Recommended values
CL1 = CL2 = 0–33 pF
R = 0Ω
XTAL
SH7750 Series
Note: The values for CL1, CL2, and the damping resistance should be determined after
consultation with the crystal resonator manufacturer.
Figure 10.4 Points for Attention when Using Crystal Resonator
When Inputting External Clock from EXTAL Pin: Make no connection to the XTAL pin.
Rev. 6.0, 07/02, page 265 of 986
When Using a PLL Oscillator Circuit: Separate VDD-CPG and VSS-CPG from the other VDD
and VSS lines at the board power supply source, and insert resistors RCB and RB and bypass
capacitors CPB and CB close to the pins as noise filters.
RCB1
VDD-PLL1
CPB1
VSS-PLL1
RCB2
Recommended values
RCB1 = RCB2 = 10
CPB1 = CPB2 = 10 F
RB = 10
CB = 10 F
VDD-PLL2
SH7750
Series
CPB2
VSS-PLL2
RB
VDD-CPG
3.3 V
CB
VSS-CPG
Figure 10.5 Points for Attention when Using PLL Oscillator Circuit
Rev. 6.0, 07/02, page 266 of 986
Section 11 Realtime Clock (RTC)
11.1
Overview
The SH7750 Series includes an on-chip realtime clock (RTC) and a 32.768 kHz crystal oscillator
for use by the RTC.
11.1.1
Features
The RTC has the following features.
• Clock and calendar functions (BCD display)
Counts seconds, minutes, hours, day-of-week, days, months, and years.
• 1 to 64 Hz timer (binary display)
The 64 Hz counter register indicates a state of 64 Hz to 1 Hz within the RTC frequency divider
• Start/stop function
• 30-second adjustment function
• Alarm interrupts
Comparison with second, minute, hour, day-of-week, day, month, or year (year is available
only with the SH7750R) can be selected as the alarm interrupt condition
• Periodic interrupts
An interrupt period of 1/256 second, 1/64 second, 1/16 second, 1/4 second, 1/2 second, 1
second, or 2 seconds can be selected
• Carry interrupt
Carry interrupt function indicating a second counter carry, or a 64 Hz counter carry when the
64 Hz counter is read
• Automatic leap year adjustment
Rev. 6.0, 07/02, page 267 of 986
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the RTC.
ATI
PRI
CUI
RTCCLK
RESET, STBY, etc
16.384 kHz
Prescaler
RTC crystal
oscillator
32.768 kHz
RTC operation
control unit
128 Hz
RCR1
RCR2
Counter unit
RCR3*
Interrupt
control unit
R64CNT
RSECCNT
RMINCNT
RHRCNT
RDAYCNT
RWKCNT
RMONCNT
RYRCNT
RSECAR
RMINAR
RHRAR
RDAYAR
RWKAR
RMONAR
RYRAR*
To registers
Bus interface
Internal peripheral module bus
Note: * SH7750R only
Figure 11.1 Block Diagram of RTC
Rev. 6.0, 07/02, page 268 of 986
11.1.3
Pin Configuration
Table 11.1 shows the RTC pins.
Table 11.1 RTC Pins
Pin Name
Abbreviation
I/O
Function
RTC oscillator crystal pin
EXTAL2
Input
Connects crystal to RTC oscillator
RTC oscillator crystal pin
XTAL2
Output
Connects crystal to RTC oscillator
Clock input/clock output
TCLK
I/O
External clock input pin/input capture
control input pin/RTC output pin
(shared with TMU)
Dedicated RTC power
supply
VDD-RTC
—
RTC oscillator power supply pin*
Dedicated RTC GND pin
VSS-RTC
—
RTC oscillator GND pin*
Note: * Power must be supplied to the RTC power supply pins even when the RTC is not used.
11.1.4
Register Configuration
Table 11.2 summarizes the RTC registers.
Table 11.2 RTC Registers
Initialization
Abbreviation
R/W
PowerOn
Reset
64 Hz
counter
R64CNT
R
Counts Counts Counts Undefined
H'FFC80000 H'1FC80000 8
Second
counter
RSECCNT
R/W
Counts Counts Counts Undefined
H'FFC80004 H'1FC80004 8
Minute
counter
RMINCNT
R/W
Counts Counts Counts Undefined
H'FFC80008 H'1FC80008 8
Hour
counter
RHRCNT
R/W
Counts Counts Counts Undefined
H'FFC8000C H'1FC8000C 8
Day-ofweek
counter
RWKCNT
R/W
Counts Counts Counts Undefined
H'FFC80010 H'1FC80010 8
Day
counter
RDAYCNT
R/W
Counts Counts Counts Undefined
H'FFC80014 H'1FC80014 8
Name
Manual Standby Initial
Reset Mode
Value
Area 7
P4 Address Address
Access
Size
Rev. 6.0, 07/02, page 269 of 986
Table 11.2 RTC Registers (cont)
Initialization
Power-On Manual
Reset
Reset
Standby Initial
Mode
Value
Area 7
P4 Address Address
Month RMONCNT R/W
counter
Counts
Counts
Counts
Undefined
H'FFC80018 H'1FC80018 8
Year
RYRCNT
counter
R/W
Counts
Counts
Counts
Undefined
H'FFC8001C H'1FC8001C 16
Second RSECAR
alarm
register
R/W
1
Initialized* Held
Held
Undefined* H'FFC80020 H'1FC80020 8
Minute RMINAR
alarm
register
R/W
1
Initialized* Held
Held
Undefined* H'FFC80024 H'1FC80024 8
Hour
RHRAR
alarm
register
R/W
1
Initialized* Held
Held
Undefined* H'FFC80028 H'1FC80028 8
Day-of- RWKAR
week
alarm
register
R/W
1
Initialized* Held
Held
Undefined* H'FFC8002C H'1FC8002C 8
Day
RDAYAR
alarm
register
R/W
1
Initialized* Held
Held
Undefined* H'FFC80030 H'1FC80030 8
Month RMONAR
alarm
register
R/W
1
Initialized* Held
Held
Undefined* H'FFC80034 H'1FC80034 8
RTC
RCR1
control
register
1
R/W
Initialized Initialized Held
3
H'00*
H'FFC80038 H'1FC80038 8
RTC
RCR2
control
register
2
R/W
2
Initialized Initialized* Held
4
H'09*
H'FFC8003C H'1FC8003C 8
RTC
RCR3
control
register
5
3*
R/W
Initialized Held
Held
H'00
H'FFC80050 H'1FC80050 8
Year
RYRAR
alarm
5
register*
R/W
Held
Held
Undefined
H'FFC80054 H'1FC80054 16
Name
Abbreviation
R/W
Notes: *1
*2
*3
*4
*5
Held
1
1
1
1
1
1
The ENB bit in each register is initialized.
Bits other than the RTCEN bit and START bit are initialized.
The value of the CF bit and AF bit is undefined.
The value of the PEF bit is undefined.
SH7750R only
Rev. 6.0, 07/02, page 270 of 986
Access
Size
11.2
Register Descriptions
11.2.1
64 Hz Counter (R64CNT)
R64CNT is an 8-bit read-only register that indicates a state of 64 Hz to 1 Hz within the RTC
frequency divider.
If this register is read when a carry is generated from the 128 kHz frequency division stage, bit 7
(CF) in RTC control register 1 (RCR1) is set to 1, indicating the simultaneous occurrence of the
carry and the 64 Hz counter read. In this case, the read value is not valid, and so R64CNT must be
read again after first writing 0 to the CF bit in RCR1 to clear it.
When the RESET bit or ADJ bit in RTC control register 2 (RCR2) is set to 1, the RTC frequency
divider is initialized and R64CNT is initialized to H'00.
R64CNT is not initialized by a power-on or manual reset, or in standby mode.
Bit 7 is always read as 0 and cannot be modified.
Bit:
11.2.2
7
6
5
4
3
2
1
0
—
1 Hz
2 Hz
4 Hz
8 Hz
16 Hz
32 Hz
64 Hz
Initial value:
0
R/W:
R
Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R
R
R
R
R
R
R
Second Counter (RSECCNT)
RSECCNT is an 8-bit readable/writable register used as a counter for setting and counting the
BCD-coded second value in the RTC. It counts on the carry (transition of the R64CNT.1Hz bit
from 0 to 1) generated once per second by the 64 Hz counter.
The setting range is decimal 00 to 59. The RTC will not operate normally if any other value is set.
Write processing should be performed after stopping the count with the START bit in RCR2, or
by using the carry flag.
RSECCNT is not initialized by a power-on or manual reset, or in standby mode.
Bit 7 is always read as 0. A write to this bit is invalid, but the write value should always be 0.
Bit:
7
—
Initial value:
0
R/W:
R
6
5
4
3
2
10-second units
1
0
1-second units
Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.0, 07/02, page 271 of 986
11.2.3
Minute Counter (RMINCNT)
RMINCNT is an 8-bit readable/writable register used as a counter for setting and counting the
BCD-coded minute value in the RTC. It counts on the carry generated once per minute by the
second counter.
The setting range is decimal 00 to 59. The RTC will not operate normally if any other value is set.
Write processing should be performed after stopping the count with the START bit in RCR2, or
by using the carry flag.
RMINCNT is not initialized by a power-on or manual reset, or in standby mode.
Bit 7 is always read as 0. A write to this bit is invalid, but the write value should always be 0.
Bit:
7
6
—
11.2.4
Initial value:
0
R/W:
R
5
4
3
10-minute units
2
1
0
1-minute units
Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Hour Counter (RHRCNT)
RHRCNT is an 8-bit readable/writable register used as a counter for setting and counting the
BCD-coded hour value in the RTC. It counts on the carry generated once per hour by the minute
counter.
The setting range is decimal 00 to 23. The RTC will not operate normally if any other value is set.
Write processing should be performed after stopping the count with the START bit in RCR2, or
by using the carry flag.
RHRCNT is not initialized by a power-on or manual reset, or in standby mode.
Bits 7 and 6 are always read as 0. A write to these bits is invalid, but the write value should always
be 0.
Bit:
7
6
—
—
Initial value:
0
0
R/W:
R
R
Rev. 6.0, 07/02, page 272 of 986
5
4
3
10-hour units
2
1
0
1-hour units
Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
11.2.5
Day-of-Week Counter (RWKCNT)
RWKCNT is an 8-bit readable/writable register used as a counter for setting and counting the
BCD-coded day-of-week value in the RTC. It counts on the carry generated once per day by the
hour counter.
The setting range is decimal 0 to 6. The RTC will not operate normally if any other value is set.
Write processing should be performed after stopping the count with the START bit in RCR2, or
by using the carry flag.
RWKCNT is not initialized by a power-on or manual reset, or in standby mode.
Bits 7 to 3 are always read as 0. A write to these bits is invalid, but the write value should always
be 0.
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
Day of week code
Undefined Undefined Undefined
Initial value:
0
0
0
0
0
R/W:
R
R
R
R
R
Day-of-week code
0
1
2
3
4
5
6
Day of week
Sun
Mon
Tue
Wed
Thu
Fri
Sat
R/W
R/W
R/W
Rev. 6.0, 07/02, page 273 of 986
11.2.6
Day Counter (RDAYCNT)
RDAYCNT is an 8-bit readable/writable register used as a counter for setting and counting the
BCD-coded day value in the RTC. It counts on the carry generated once per day by the hour
counter.
The setting range is decimal 01 to 31. The RTC will not operate normally if any other value is set.
Write processing should be performed after stopping the count with the START bit in RCR2, or
by using the carry flag.
RDAYCNT is not initialized by a power-on or manual reset, or in standby mode.
The setting range for RDAYCNT depends on the month and whether the year is a leap year, so
care is required when making the setting. Taking the year counter (RYRCNT) value as the year,
leap year calculation is performed according to whether or not the value is divisible by 400, 100,
and 4.
Bits 7 and 6 are always read as 0. A write to these bits is invalid, but the write value should always
be 0.
Bit:
11.2.7
7
6
5
4
—
—
10-day units
Initial value:
0
0
R/W:
R
R
3
2
1
0
1-day units
Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
Month Counter (RMONCNT)
RMONCNT is an 8-bit readable/writable register used as a counter for setting and counting the
BCD-coded month value in the RTC. It counts on the carry generated once per month by the day
counter.
The setting range is decimal 01 to 12. The RTC will not operate normally if any other value is set.
Write processing should be performed after stopping the count with the START bit in RCR2, or
by using the carry flag.
RMONCNT is not initialized by a power-on or manual reset, or in standby mode.
Bits 7 to 5 are always read as 0. A write to these bits is invalid, but the write value should always
be 0.
Rev. 6.0, 07/02, page 274 of 986
Bit:
11.2.8
7
6
5
4
—
—
—
10-month
unit
Initial value:
0
0
0
Undefined Undefined Undefined Undefined Undefined
R/W:
R
R
R
R/W
3
2
1
0
1-month units
R/W
R/W
R/W
R/W
Year Counter (RYRCNT)
RYRCNT is a 16-bit readable/writable register used as a counter for setting and counting the
BCD-coded year value in the RTC. It counts on the carry generated once per year by the month
counter.
The setting range is decimal 0000 to 9999. The RTC will not operate normally if any other value
is set. Write processing should be performed after stopping the count with the START bit in
RCR2, or by using the carry flag.
RYRCNT is not initialized by a power-on or manual reset, or in standby mode.
Bit:
15
14
13
12
11
10
1000-year units
9
8
100-year units
Initial value: Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W:
Bit:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
10-year units
1-year units
Initial value: Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.0, 07/02, page 275 of 986
11.2.9
Second Alarm Register (RSECAR)
RSECAR is an 8-bit readable/writable register used as an alarm register for the RTC’s BCD-coded
second value counter, RSECCNT. When the ENB bit is set to 1, the RSECAR value is compared
with the RSECCNT value. Comparison between the counter and the alarm register is performed
for those registers among RSECAR, RMINAR, RHRAR, RWKAR, RDAYAR, and RMONAR in
which the ENB bit is set to 1, and the RCR1 alarm flag is set when the respective values all match.
The setting range is decimal 00 to 59 + ENB bit. The RTC will not operate normally if any other
value is set.
The ENB bit in RSECAR is initialized to 0 by a power-on reset. The other fields in RSECAR are
not initialized by a power-on or manual reset, or in standby mode.
Bit:
7
6
ENB
Initial value:
R/W:
0
R/W
5
4
3
10-second units
2
1
0
1-second units
Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
11.2.10 Minute Alarm Register (RMINAR)
RMINAR is an 8-bit readable/writable register used as an alarm register for the RTC’s BCDcoded minute value counter, RMINCNT. When the ENB bit is set to 1, the RMINAR value is
compared with the RMINCNT value. Comparison between the counter and the alarm register is
performed for those registers among RSECAR, RMINAR, RHRAR, RWKAR, RDAYAR, and
RMONAR in which the ENB bit is set to 1, and the RCR1 alarm flag is set when the respective
values all match.
The setting range is decimal 00 to 59 + ENB bit. The RTC will not operate normally if any other
value is set.
The ENB bit in RMINAR is initialized by a power-on reset. The other fields in RMINAR are not
initialized by a power-on or manual reset, or in standby mode.
Bit:
7
6
ENB
Initial value:
R/W:
0
R/W
5
4
3
10-minute units
2
1
0
1-minute units
Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
Rev. 6.0, 07/02, page 276 of 986
R/W
R/W
R/W
R/W
R/W
R/W
11.2.11 Hour Alarm Register (RHRAR)
RHRAR is an 8-bit readable/writable register used as an alarm register for the RTC’s BCD-coded
hour value counter, RHRCNT. When the ENB bit is set to 1, the RHRAR value is compared with
the RHRCNT value. Comparison between the counter and the alarm register is performed for
those registers among RSECAR, RMINAR, RHRAR, RWKAR, RDAYAR, and RMONAR in
which the ENB bit is set to 1, and the RCR1 alarm flag is set when the respective values all match.
The setting range is decimal 00 to 23 + ENB bit. The RTC will not operate normally if any other
value is set.
The ENB bit in RHRAR is initialized by a power-on reset. The other fields in RHRAR are not
initialized by a power-on or manual reset, or in standby mode.
Bit 6 is always read as 0. A write to this bit is invalid, but the write value should always be 0.
Bit:
Initial value:
R/W:
7
6
ENB
—
0
0
R/W
R
5
4
3
2
10-hour units
1
0
1-hour units
Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
11.2.12 Day-of-Week Alarm Register (RWKAR)
RWKAR is an 8-bit readable/writable register used as an alarm register for the RTC’s BCD-coded
day-of-week value counter, RWKCNT. When the ENB bit is set to 1, the RWKAR value is
compared with the RWKCNT value. Comparison between the counter and the alarm register is
performed for those registers among RSECAR, RMINAR, RHRAR, RWKAR, RDAYAR, and
RMONAR in which the ENB bit is set to 1, and the RCR1 alarm flag is set when the respective
values all match.
The setting range is decimal 0 to 6 + ENB bit. The RTC will not operate normally if any other
value is set.
The ENB bit in RWKAR is initialized by a power-on reset. The other fields in RWKAR are not
initialized by a power-on or manual reset, or in standby mode.
Bits 6 to 3 are always read as 0. A write to these bits is invalid, but the write value should always
be 0.
Rev. 6.0, 07/02, page 277 of 986
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
ENB
—
—
—
—
Day of week code
0
0
0
0
0
Undefined Undefined Undefined
R/W
R
R
R
R
R/W
0
R/W
R/W
Day-of-week code
0
1
2
3
4
5
6
Day of week
Sun
Mon
Tue
Wed
Thu
Fri
Sat
11.2.13 Day Alarm Register (RDAYAR)
RDAYAR is an 8-bit readable/writable register used as an alarm register for the RTC’s BCDcoded day value counter, RDAYCNT. When the ENB bit is set to 1, the RDAYAR value is
compared with the RDAYCNT value. Comparison between the counter and the alarm register is
performed for those registers among RSECAR, RMINAR, RHRAR, RWKAR, RDAYAR, and
RMONAR in which the ENB bit is set to 1, and the RCR1 alarm flag is set when the respective
values all match.
The setting range is decimal 01 to 31 + ENB bit. The RTC will not operate normally if any other
value is set. The setting range for RDAYAR depends on the month and whether the year is a leap
year, so care is required when making the setting.
The ENB bit in RDAYAR is initialized by a power-on reset. The other fields in RDAYAR are not
initialized by a power-on or manual reset, or in standby mode.
Bit 6 is always read as 0. A write to this bit is invalid, but the write value should always be 0.
Bit:
Initial value:
R/W:
7
6
5
ENB
—
10-day units
0
0
R/W
R
Rev. 6.0, 07/02, page 278 of 986
4
3
2
1
0
1-day units
Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
11.2.14 Month Alarm Register (RMONAR)
RMONAR is an 8-bit readable/writable register used as an alarm register for the RTC’s BCDcoded month value counter, RMONCNT. When the ENB bit is set to 1, the RMONAR value is
compared with the RMONCNT value. Comparison between the counter and the alarm register is
performed for those registers among RSECAR, RMINAR, RHRAR, RWKAR, RDAYAR, and
RMONAR in which the ENB bit is set to 1, and the RCR1 alarm flag is set when the respective
values all match.
The setting range is decimal 01 to 12 + ENB bit. The RTC will not operate normally if any other
value is set.
The ENB bit in RMONAR is initialized by a power-on reset. The other fields in RMONAR are
not initialized by a power-on or manual reset, or in standby mode.
Bits 6 and 5 are always read as 0. A write to these bits is invalid, but the write value should always
be 0.
Bit:
Initial value:
R/W:
7
6
5
4
ENB
—
—
10-month
unit
0
0
0
Undefined Undefined Undefined Undefined Undefined
R/W
R
R
R/W
3
2
1
0
1-month units
R/W
R/W
R/W
R/W
11.2.15 RTC Control Register 1 (RCR1)
RCR1 is an 8-bit readable/writable register containing a carry flag and alarm flag, plus flags to
enable or disable interrupts for these flags.
The CIE and AIE bits are initialized to 0 by a power-on or manual reset; the value of bits other
than CIE and AIE is undefined. In standby mode RCR1 is not initialized, and retains its current
value.
Bit:
7
6
5
4
3
2
1
0
CF
—
—
CIE
AIE
—
—
AF
0
0
R/W
R/W
Initial value: Undefined Undefined Undefined
R/W:
R/W
R
R
Undefined Undefined Undefined
R
R
R/W
Rev. 6.0, 07/02, page 279 of 986
Bit 7—Carry Flag (CF): This flag is set to 1 on generation of a second counter carry, or a 64 Hz
counter carry when the 64 Hz counter is read. The count register value read at this time is not
guaranteed, and so the count register must be read again.
Bit 7: CF
Description
0
No second counter carry, or 64 Hz counter carry when 64 Hz counter is read
[Clearing condition]
When 0 is written to CF
1
Second counter carry, or 64 Hz counter carry when 64 Hz counter is read
[Setting conditions]
•
Generation of a second counter carry, or a 64 Hz counter carry when the
64 Hz counter is read
•
When 1 is written to CF
Bit 4—Carry Interrupt Enable Flag (CIE): Enables or disables interrupt generation when the
carry flag (CF) is set to 1.
Bit 4: CIE
Description
0
Carry interrupt is not generated when CF flag is set to 1
1
Carry interrupt is generated when CF flag is set to 1
(Initial value)
Bit 3—Alarm Interrupt Enable Flag (AIE): Enables or disables interrupt generation when the
alarm flag (AF) is set to 1.
Bit 3: AIE
Description
0
Alarm interrupt is not generated when AF flag is set to 1
1
Alarm interrupt is generated when AF flag is set to 1
Rev. 6.0, 07/02, page 280 of 986
(Initial value)
Bit 0—Alarm Flag (AF): Set to 1 when the alarm time set in those registers among RSECAR,
RMINAR, RHRAR, RWKAR, RDAYAR, and RMONAR in which the ENB bit is set to 1
matches the respective counter values.
Bit 0: AF
Description
0
Alarm registers and counter values do not match
(Initial value)
[Clearing condition]
When 0 is written to AF
1
Alarm registers and counter values match*
[Setting condition]
When alarm registers in which the ENB bit is set to 1 and counter values
match*
Note: * Writing 1 does not change the value.
Bits 6, 5, 2, and 1—Reserved. The initial value of these bits is undefined. A write to these bits is
invalid, but the write value should always be 0.
11.2.16 RTC Control Register 2 (RCR2)
RCR2 is an 8-bit readable/writable register used for periodic interrupt control, 30-second
adjustment, and frequency divider RESET and RTC count control.
RCR2 is basically initialized to H'09 by a power-on reset, except that the value of the PEF bit is
undefined. In a manual reset, bits other than RTCEN and START are initialized, while the value
of the PEF bit is undefined. In standby mode RCR2 is not initialized, and retains its current value.
Bit:
7
6
5
4
3
2
1
0
PEF
PES2
PES1
PES0
RTCEN
ADJ
RESET
START
0
0
0
1
0
0
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value: Undefined
R/W:
R/W
Rev. 6.0, 07/02, page 281 of 986
Bit 7—Periodic Interrupt Flag (PEF): Indicates interrupt generation at the interval specified by
bits PES2–PES0. When this flag is set to 1, a periodic interrupt is generated.
Bit 7: PEF
Description
0
Interrupt is not generated at interval specified by bits PES2–PES0
[Clearing condition]
When 0 is written to PEF
1
Interrupt is generated at interval specified by bits PES2–PES0
[Setting conditions]
•
Generation of interrupt at interval specified by bits PES2–PES0
•
When 1 is written to PEF
Bits 6 to 4—Periodic Interrupt Enable (PES2–PES0): These bits specify the period for periodic
interrupts.
Bit 6: PES2
Bit 5: PES1
Bit 4: PES0
Description
0
0
0
No periodic interrupt generation
1
Periodic interrupt generated at 1/256-second intervals
0
Periodic interrupt generated at 1/64-second intervals
1
Periodic interrupt generated at 1/16-second intervals
0
Periodic interrupt generated at 1/4-second intervals
1
Periodic interrupt generated at 1/2-second intervals
0
Periodic interrupt generated at 1-second intervals
1
Periodic interrupt generated at 2-second intervals
1
1
0
1
(Initial value)
Bit 3—Oscillator Enable (RTCEN): Controls the operation of the RTC’s crystal oscillator.
Bit 3: RTCEN
Description
0
RTC crystal oscillator is halted
1
RTC crystal oscillator is operated
Rev. 6.0, 07/02, page 282 of 986
(Initial value)
Bit 2—30-Second Adjustment (ADJ): Used for 30-second adjustment. When 1 is written to this
bit, a value up to 29 seconds is rounded down to 00 seconds, and a value of 30 seconds or more is
rounded up to 1 minute. The frequency divider circuits (RTC prescaler and R64CNT) are also
reset at this time. This bit always returns 0 if read.
Bit 2: ADJ
Description
0
Normal clock operation
1
30-second adjustment performed
(Initial value)
Bit 1—Reset (RESET): The frequency divider circuits are initialized by writing 1 to this bit.
When 1 is written to the RESET bit, the frequency divider circuits (RTC prescaler and R64CNT)
are reset and the RESET bit is automatically cleared to 0 (i.e. does not need to be written with 0).
Bit 1: RESET
Description
0
Normal clock operation
1
Frequency divider circuits are reset
(Initial value)
Bit 0—Start Bit (START): Stops and restarts counter (clock) operation.
Bit 0: START
Description
0
Second, minute, hour, day, day-of-week, month, and year counters are
stopped*
1
Second, minute, hour, day, day-of-week, month, and year counters operate
normally*
(Initial value)
Note: * The 64 Hz counter continues to operate unless stopped by means of the RTCEN bit.
11.2.17 RTC Control Register 3 (RCR3) and Year-Alarm Register (RYRAR)
(SH7750R Only)
RCR3 and RYRAR are readable/writable registers. RYRAR is the alarm register for the RTC’s
BCD-coded year-value counter RYRCNT. When the YENB bit of RCR3 is set to 1, the RYRCNT
value is compared with the RYRAR value. Comparison between the counter and the alarm register
only takes place with the alarm registers in which the ENB and YENB bits are set to 1. The alarm
flag of RCR1 is only set to 1 when the respective values all match.
The setting range of RYRAR is decimal 0000 to 9999, and normal operation is not obtained if a
value beyond this range is set here.
RCR3 is initialized by a power-on reset, but RYRAR will not be initialized by a power-on or
manual reset, or by the device entering standby mode.
Rev. 6.0, 07/02, page 283 of 986
Bits 6 to 0 of RCR3 are always read as 0. Writing to these bits is invalid. If a value is written to
these bits, it should always be 0.
RCR3
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
YENB
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
R/W
R
R
R
R
R
R
R
15
14
13
12
11
10
9
8
RYRAR
Bit:
1000 years
100 years
Initial value: Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W:
Bit:
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
10 years
1 year
Initial value: Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W:
R/W
R/W
Rev. 6.0, 07/02, page 284 of 986
R/W
R/W
R/W
R/W
R/W
R/W
11.3
Operation
Examples of the use of the RTC are shown below.
11.3.1
Time Setting Procedures
Figure 11.2 shows examples of the time setting procedures.
Stop clock
Reset frequency divider
Set second/minute/hour/day/
day-of-week/month/year
Start clock operation
Set RCR2.RESET to 1
Clear RCR2.START to 0
In any order
Set RCR2.START to 1
(a) Setting time after stopping clock
Clear carry flag
Yes
Clear RCR1.CF to 0
(Write 1 to RCR1.AF so that alarm flag
is not cleared)
Write to counter register
Set RYRCNT first and RSECCNT last
Carry flag = 1?
Read RCR1 register and check CF bit
No
(b) Setting time while clock is running
Figure 11.2 Examples of Time Setting Procedures
The procedure for setting the time after stopping the clock is shown in (a). The programming for
this method is simple, and it is useful for setting all the counters, from second to year.
Rev. 6.0, 07/02, page 285 of 986
The procedure for setting the time while the clock is running is shown in (b). This method is
useful for modifying only certain counter values (for example, only the second data or hour data).
If a carry occurs during the write operation, the write data is automatically updated and there will
be an error in the set data. The carry flag should therefore be used to check the write status. If the
carry flag (RCR1.CF) is set to 1, the write must be repeated.
The interrupt function can also be used to determine the carry flag status.
11.3.2
Time Reading Procedures
Figure 11.3 shows examples of the time reading procedures.
Rev. 6.0, 07/02, page 286 of 986
Disable carry interrupts
Clear carry flag
Clear RCR1.CIE to 0
Clear RCR1.CF to 0
(Write 1 to RCR1.AF so that alarm flag
is not cleared)
Read counter register
Yes
Carry flag = 1?
Read RCR1 register and check CF bit
No
(a) Reading time without using interrupts
Clear carry flag
Enable carry interrupts
Clear carry flag
Set RCR1.CIE to 1
Clear RCR1.CF to 0
(Write 1 to RCR1.AF so that alarm flag
is not cleared)
Read counter register
Yes
Interrupt generated?
No
Disable carry interrupts
Clear RCR1.CIE to 0
(b) Reading time using interrupts
Figure 11.3 Examples of Time Reading Procedures
If a carry occurs while the time is being read, the correct time will not be obtained and the read
must be repeated. The procedure for reading the time without using interrupts is shown in (a), and
the procedure using carry interrupts in (b). The method without using interrupts is normally used
to keep the program simple.
Rev. 6.0, 07/02, page 287 of 986
11.3.3
Alarm Function
The use of the alarm function is illustrated in figure 11.4.
Clock running
Disable alarm interrupts
Clear RCR1.AIE to prevent erroneous interrupts
Set alarm time
Clear alarm flag
Enable alarm interrupts
Be sure to reset the flag as it may have been
set during alarm time setting
Set RCR1.AIE to 1
Monitor alarm time
(Wait for interrupt or check
alarm flag)
Figure 11.4 Example of Use of Alarm Function
An alarm can be generated by the second, minute, hour, day-of-week, day, month, or year (year is
available only with the SH7750R) value, or a combination of these. Write 1 to the ENB bit in the
alarm registers involved in the alarm setting, and set the alarm time in the lower bits. Write 0 to
the ENB bit in registers not involved in the alarm setting.
When the counter and the alarm time match, RCR1.AF is set to 1. Alarm detection can be
confirmed by reading this bit, but normally an interrupt is used. If 1 has been written to
RCR1.AIE, an alarm interrupt is generated in the event of alarm, enabling the alarm to be
detected.
The alarm flag remains set while the counter and alarm time match. If the alarm flag is cleared by
writing 0 during this period, it will therefore be set again immediately afterward. This needs to be
taken into consideration when writing the program.
Rev. 6.0, 07/02, page 288 of 986
11.4
Interrupts
There are three kinds of RTC interrupt: alarm interrupts, periodic interrupts, and carry interrupts.
An alarm interrupt request (ATI) is generated when the alarm flag (AF) in RCR1 is set to 1 while
the alarm interrupt enable bit (AIE) is also set to 1.
A periodic interrupt request (PRI) is generated when the periodic interrupt enable bits (PES2–
PES0) in RCR2 are set to a value other than 000 and the periodic interrupt flag (PEF) is set to 1.
A carry interrupt request (CUI) is generated when the carry flag (CF) in RCR1 is set to 1 while the
carry interrupt enable bit (CIE) is also set to 1.
11.5
Usage Notes
11.5.1
Register Initialization
After powering on and making the RCR1 register settings, reset the frequency divider (by setting
RCR2.RESET to 1) and make initial settings for all the other registers.
11.5.2
Carry Flag and Interrupt Flag in Standby Mode
When the carry flag or interrupt flag is set to 1 at the same time this LSI transits to normal mode
from standby mode by a reset or interrupt, the flag may not be set to 1. After exiting standby
mode, check the counters to judge the flag states if necessary.
11.5.3
Crystal Oscillator Circuit
Crystal oscillator circuit constants (recommended values) are shown in table 11.3, and the RTC
crystal oscillator circuit in figure 11.5.
Table 11.3 Crystal Oscillator Circuit Constants (Recommended Values)
fosc
Cin
Cout
32.768 kHz
10–22 pF
10–22 pF
Rev. 6.0, 07/02, page 289 of 986
SH7750
Series
VDD-RTC
VSS-RTC
Rf
RD
XTAL2
EXTAL2
XTAL
Noise filter
CRTC
Cin
Cout
RRTC
3.3 V
Notes: 1. Select either the Cin or Cout side for the frequency adjustment variable capacitor according to
requirements such as the adjustment range, degree of stability, etc.
2. Built-in resistance value Rf (typ. value) = 10 MΩ, RD (typ. value) = 400 kΩ
3. Cin and Cout values include floating capacitance due to the wiring. Take care when using a solidearth board.
4. The crystal oscillation stabilization time depends on the mounted circuit constants, floating
capacitance, etc., and should be decided after consultation with the crystal resonator
manufacturer.
5. Place the crystal resonator and load capacitors Cin and Cout as close as possible to the chip.
(Correct oscillation may not be possible if there is externally induced noise in the EXTAL2 and
XTAL2 pins.)
6. Ensure that the crystal resonator connection pin (EXTAL2 and XTAL2) wiring is routed as far away
as possible from other power lines (except GND) and signal lines.
7. Insert a noise filter in the RTC power supply.
Figure 11.5 Example of Crystal Oscillator Circuit Connection
Rev. 6.0, 07/02, page 290 of 986
Section 12 Timer Unit (TMU)
12.1
Overview
The SH7750 Series of microprocessors include an on-chip 32-bit timer unit (TMU). The TMU of
the SH7750 or SH7750S has three 32-bit timer channels (channels 0 to 2), and the TMU of the
SH7750R has five channels (channels 0 to 4).
12.1.1
Features
The TMU has the following features.
• Auto-reload type 32-bit down-counter provided for each channel
• Input capture function provided in channel 2
• Selection of rising edge or falling edge as external clock input edge when external clock is
selected or input capture function is used
• 32-bit timer constant register for auto-reload use, readable/writable at any time, and 32-bit
down-counter provided for each channel
• For channels 0 to 2, selection of seven counter input clocks for each channel
External clock (TCLK), on-chip RTC output clock, five internal clocks (Pφ/4, Pφ/16, Pφ/64,
Pφ/256, Pφ/1024) (Pφ is the peripheral module clock)
• For channels 3 and 4, selection is made among five internal clocks (SH7750R only).
• Channels 0 to 2 can also operate in module standby mode when the on-chip RTC output clock
is selected as the counter input clock; that is, timer operation continues even when the clock
has been stopped for the TMU.
Timer count operations using an external or internal clock are only possible when a clock is
supplied to the timer unit.
• Two interrupt sources
One underflow source (each channel) and one input capture source (channel 2)
• DMAC data transfer request capability
On channel 2, a data transfer request is sent to the DMAC when an input capture interrupt is
generated.
Rev. 6.0, 07/02, page 291 of 986
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the TMU.
RESET, STBY, TUNE0,TUNE1
etc.
TMU
control unit
PCLK/4,16, 64*1
TUNI3, 4*2
TUNI2 ICPI2 TCLK RTCCLK
TCLK
control unit
Prescaler
To each To channels
channel 0 to 2
TOCR
TSTR
TSTR2*2
Ch 0, 1
Counter unit
TCR
Ch 3, 4*2
Ch 2
Interrupt
contrun unit
TCOR
Interrupt
contrun unit
Counter unit
TCNT
TCR2
TCOR2
TCNT2
Counter unit
TCPR2
TCR
TCOR
Interrupt
contrun unit
TCNT
Bus interface
Internal peripheral module bus
Notes: *1 Signals with 1/4, 1/16, and 1/64 the Pφ frequency, supplied to the on-chip peripheral functions.
*2 SH7750R only
Figure 12.1 Block Diagram of TMU
12.1.3
Pin Configuration
Table 12.1 shows the TMU pins.
Table 12.1 TMU Pins
Pin Name
Abbreviation
I/O
Function
Clock input/clock output
TCLK
I/O
External clock input pin/input capture
control input pin/RTC output pin
(shared with RTC)
Rev. 6.0, 07/02, page 292 of 986
12.1.4
Register Configuration
Table 12.2 summarizes the TMU registers.
Table 12.2 TMU Registers
Initialization
PowerStandOn
Manual by
Area 7
R/W Reset Reset Mode Initial Value P4 Address Address
Channel
Name
Abbreviation
Com- Timer
mon output
control
register
TOCR
R/W IniIniHeld
tialized tialized
H'00
H’FFD80000 H'1FD80000 8
Timer
start
register
TSTR
R/W IniIniIniH'00
1
tialized tialized tialized*
H’FFD80004 H'1FD80004 8
3
Timer
TSTR2* R/W IniHeld
start
tialized
register 2
0
1
2
Held
Timer
TCOR0 R/W IniIniHeld
constant
tialized tialized
register 0
H'00
Access
Size
H'FE100004 H'1E100004 8
H'FFFFFFFF H’FFD80008 H'1FD80008 32
Timer
TCNT0
counter 0
2
R/W IniIniHeld*
tialized tialized
H'FFFFFFFF H’FFD8000C H'1FD8000C 32
Timer
TCR0
control
register 0
R/W IniIniHeld
tialized tialized
H'0000
Timer
TCOR1 R/W IniIniHeld
constant
tialized tialized
register 1
H’FFD80010 H'1FD80010 16
H'FFFFFFFF H’FFD80014 H'1FD80014 32
Timer
TCNT1
counter 1
2
R/W IniIniHeld*
tialized tialized
H'FFFFFFFF H’FFD80018 H'1FD80018 32
Timer
TCR1
control
register 1
R/W IniIniHeld
tialized tialized
H'0000
Timer
TCOR2 R/W IniIniHeld
constant
tialized tialized
register 2
H’FFD8001C H'1FD8001C 16
H'FFFFFFFF H’FFD80020 H'1FD80020 32
Timer
TCNT2
counter 2
2
R/W IniIniHeld*
tialized tialized
H'FFFFFFFF H’FFD80024 H'1FD80024 32
Timer
TCR2
control
register 2
R/W IniIniHeld
tialized tialized
H'0000
H’FFD80028 H'1FD80028 16
Undefined
H’FFD8002C H'1FD8002C 32
Input
capture
register
TCPR2 R
Held
Held
Held
Rev. 6.0, 07/02, page 293 of 986
Initialization
Channel
Name
3
3*
3
4*
Abbreviation
PowerStandOn
Manual by
Area 7
R/W Reset Reset Mode Initial Value P4 Address Address
Access
Size
Held
Timer
TCOR3 R/W Initialized
constant
register 3
Held
H'FFFFFFFF H’FE100008 H'1E100008 32
Timer
TCNT3
counter 3
Held
R/W Initialized
Held
H'FFFFFFFF H’FE10000C H'1E10000C 32
Timer
TCR3
control
register 3
Held
R/W Initialized
Held
H'0000
Held
Timer
TCOR4 R/W Initialized
constant
register 4
Held
H'FFFFFFFF H’FE100014 H'1E100014 32
Timer
TCNT4
counter 4
Held
R/W Initialized
Held
H'FFFFFFFF H’FE100018 H'1E100018 32
Timer
TCR4
control
register 4
Held
R/W Initialized
Held
H'0000
H’FE100010 H'1E100010 16
H’FE10001C H'1E10001C 16
Notes: *1 Not initialized in module standby mode when the input clock is the on-chip RTC output
clock.
*2 Counts in module standby mode when the input clock is the on-chip RTC output clock.
*3 SH7750R only
Rev. 6.0, 07/02, page 294 of 986
12.2
Register Descriptions
12.2.1
Timer Output Control Register (TOCR)
TOCR is an 8-bit readable/writable register that specifies whether external pin TCLK is used as
the external clock or input capture control input pin, or as the on-chip RTC output clock output
pin.
TOCR is initialized to H'00 by a power-on or manual reset, but is not initialized in standby mode.
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
TCOE
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R/W
Bits 7 to 1—Reserved: These bits are always read as 0. A write to these bits is invalid, but the
write value should always be 0.
Bit 0—Timer Clock Pin Control (TCOE): Specifies whether timer clock pin TCLK is used as
the external clock or input capture control input pin, or as the on-chip RTC output clock output
pin.
Bit 0: TCOE
Description
0
Timer clock pin (TCLK) is used as external clock input or input capture
control input pin
(Initial value)
1
Timer clock pin (TCLK) is used as on-chip RTC output clock output pin*
Note: * Low level output in standby mode.
Rev. 6.0, 07/02, page 295 of 986
12.2.2
Timer Start Register (TSTR)
TSTR is an 8-bit readable/writable register that specifies whether the channel 0–2 timer counters
(TCNT) are operated or stopped.
TSTR is initialized to H'00 by a power-on or manual reset, or standby mode. In module standby
mode, TSTR is not initialized when the input clock selected by each channel is the on-chip RTC
output clock (RTCCLK), and is initialized only when the input clock is the external clock (TCLK)
or internal clock (Pφ).
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
STR2
STR1
STR0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R/W
R/W
R/W
Bits 7 to 3—Reserved: These bits are always read as 0. A write to these bits is invalid, but the
write value should always be 0.
Bit 2—Counter Start 2 (STR2): Specifies whether timer counter 2 (TCNT2) is operated or
stopped.
Bit 2: STR2
Description
0
TCNT2 count operation is stopped
1
TCNT2 performs count operation
(Initial value)
Bit 1—Counter Start 1 (STR1): Specifies whether timer counter 1 (TCNT1) is operated or
stopped.
Bit 1: STR1
Description
0
TCNT1 count operation is stopped
1
TCNT1 performs count operation
(Initial value)
Bit 0—Counter Start 0 (STR0): Specifies whether timer counter 0 (TCNT0) is operated or
stopped.
Bit 0: STR0
Description
0
TCNT0 count operation is stopped
1
TCNT0 performs count operation
Rev. 6.0, 07/02, page 296 of 986
(Initial value)
12.2.3
Timer Start Register 2 (TSTR2) (SH7750R Only)
TSTR2 is an 8-bit readable/writable register that specifies whether the channels 3–4 timer counters
(TSTR2) run or are stopped.
TSTR2 is initialized to H'00 by a power-on reset and retains its value in standby mode. If standby
mode is entered when the STR3 or STR4 bit is set to 1, counting is halted at the same time as the
peripheral module clock is stopped. Counting is restarted on resumption of the clock-signal
supply.
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
STR4
STR3
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R/W
R/W
Bits 7 to 2—Reserved: These bits are always read as 0. Writing to these bits is invalid. If a value
is written to these bits, it should always be 0.
Bit 1—Counter Start 4 (STR4): Specifies whether timer counter 4 (TCNT4) runs or is stopped.
Bit 1: STR4
Description
0
Counting by TCNT4 is stopped
1
Counting by TCNT4 proceeds
(Initial value)
Bit 0—Counter Start 3 (STR3): Specifies whether timer counter 3 (TCNT3) runs or is stopped.
Bit 0: STR3
Description
0
Counting by TCNT3 is stopped
1
Counting by TCNT3 proceeds
(Initial value)
Rev. 6.0, 07/02, page 297 of 986
12.2.4
Timer Constant Registers (TCOR)
The TCOR registers are 32-bit readable/writable registers. There are TCOR registers, one for each
channel.
When a TCNT counter underflows while counting down, the TCOR value is set in that TCNT,
which continues counting down from the set value.
The TCOR registers for channels 0 to 2 are initialized to H'FFFFFFFF by a power-on or manual
reset, but are not initialized and retain their contents in standby mode. The TCOR registers for
channels 3 and 4 of the SH7750R are initialized to H'FFFFFFFF by a power-on reset, but are not
initialized and retain their contents on a manual reset and in standby mode.
Bit:
31
30
29
2
1
0
·············
Initial value:
R/W:
12.2.5
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
Timer Counters (TCNT)
The TCNT registers are 32-bit readable/writable registers. There are TCNT registers, one for each
channel.
Each TCNT counts down on the input clock selected by TPSC2–TPSC0 in the timer control
register (TCR).
When a TCNT counter underflows while counting down, the underflow flag (UNF) is set in the
corresponding timer control register (TCR). At the same time, the timer constant register (TCOR)
value is set in TCNT, and the count-down operation continues from the set value.
The TCNT registers for channels 0 to 2 are initialized to H'FFFFFFFF by a power-on or manual
reset, but are not initialized and retain their contents in standby mode. The TCNT registers for
channels 3 and 4 of the SH7750R are initialized to H'FFFFFFFF by a power-on reset, but are not
initialized and retain their contents on a manual reset and in standby mode.
Bit:
31
30
29
2
1
0
Initial value:
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
·············
R/W:
When the input clock is the on-chip RTC output clock (RTCCLK) in channels 0 to 2, TCNT
counts even in module standby mode (that is, when the clock for the TMU is stopped). When the
Rev. 6.0, 07/02, page 298 of 986
input clock is the external clock (TCLK) or internal clock (Pφ), TCNT contents are retained in
standby mode.
12.2.6
Timer Control Registers (TCR)
The TCR registers are 16-bit readable/writable registers. There are five TCR registers, one for
each channel.
Each TCR selects the count clock, specifies the edge when an external clock is selected in
channels 0 to 2, and controls interrupt generation when the flag indicating timer counter (TCNT)
underflow is set to 1. TCR2 is also used for channel 2 input capture control, and control of
interrupt generation in the event of input capture.
The TCR registers for channels 0 to 2 are initialized to H'0000 by a power-on or manual reset, but
are not initialized and retain their contents in standby mode. The TCR registers for channels 3 and
4 of the SH7750R are initialized to H'0000 by a power-on reset, but are not initialized and retain
their contents on a manual reset and in standby mode.
1. Channel 0 and 1 TCR bit configuration
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
UNF
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R/W
Bit:
7
6
5
4
3
2
1
0
—
—
UNIE
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.0, 07/02, page 299 of 986
2. Channel 2 TCR bit configuration
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
ICPF
UNF
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R/W
R/W
Bit:
7
6
5
4
3
2
1
0
ICPE1
ICPE0
UNIE
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value:
R/W:
3. TCR bit configuration for channels 3 and 4 (SH7750R only)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
UNF
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R/W
Bit:
7
6
5
4
3
2
1
0
—
—
UNIE
—
—
TPSC2
TPSC1
TPSC0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R/W
R
R
R/W
R/W
R/W
Bits 15 to 9, 7, and 6 (Channels 0 and 1); Bits 15 to 10 (Channel 2)—Reserved: These bits are
always read as 0. A write to these bits is invalid, but the write value should always be 0.
Bit 9—Input Capture Interrupt Flag (ICPF) (Channel 2 Only): Status flag, provided in
channel 2 only, that indicates the occurrence of input capture.
Bit 9: ICPF
Description
0
Input capture has not occurred
[Clearing condition]
When 0 is written to ICPF
1
Input capture has occurred
[Setting condition]
When input capture occurs*
Note: * Writing 1 does not change the value.
Rev. 6.0, 07/02, page 300 of 986
(Initial value)
Bit 8—Underflow Flag (UNF): Status flag that indicates the occurrence of underflow.
Bit 8: UNF
Description
0
TCNT has not underflowed
(Initial value)
[Clearing condition]
When 0 is written to UNF
1
TCNT has underflowed
[Setting condition]
When TCNT underflows*
Note: * Writing 1 does not change the value.
Bits 7 and 6—Input Capture Control (ICPE1, ICPE0) (Channel 2 Only): These bits, provided
in channel 2 only, specify whether the input capture function is used, and control enabling or
disabling of interrupt generation when the function is used.
When the input capture function is used, a data transfer request is sent to the DMAC in the event
of input capture.
When using the input capture function, the TCLK pin must be designated as an input pin with the
TCOE bit in the TOCR register. The CKEG bits specify whether the rising edge or falling edge of
the TCLK signal is used to set the TCNT2 value in the input capture register (TCPR2).
The TCNT2 value is set in TCPR2 only when the TCR2.ICPF bit is 0. When the TCR2.ICPF bit is
1, TCPR2 is not set in the event of input capture. When input capture occurs, a DMAC transfer
request is generated regardless of the value of the TCR2.ICPF bit. However, a new DMAC
transfer request is not generated until processing of the previous request is finished.
Bit 7: ICPE1
Bit 6: ICPE0
Description
0
0
Input capture function is not used
1
Reserved (Do not set)
0
Input capture function is used, but interrupt due to input capture
(TICPI2) is not enabled
1
(Initial value)
Data transfer request is sent to DMAC in the event of input
capture
1
Input capture function is used, and interrupt due to input
capture (TICPI2) is enabled
Data transfer request is sent to DMAC in the event of input
capture
Rev. 6.0, 07/02, page 301 of 986
Bit 5—Underflow Interrupt Control (UNIE): Controls enabling or disabling of interrupt
generation when the UNF status flag is set to 1, indicating TCNT underflow.
Bit 5: UNIE
Description
0
Interrupt due to underflow (TUNI) is not enabled
1
Interrupt due to underflow (TUNI) is enabled
(Initial value)
Bits 4 and 3—Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select the external clock input
edge when an external clock is selected or the input capture function is used in channels 0 to 2.
Bit 4: CKEG1
Bit 3: CKEG0
Description
0
0
Count/input capture register set on rising edge
1
Count/input capture register set on falling edge
X
Count/input capture register set on both rising and falling edges
1
(Initial value)
Note: X: 0 or 1 (don’t care)
Bits 2 to 0—Timer Prescaler 2 to 0 (TPSC2–TPSC0): These bits select the TCNT count clock.
With channels 0 to 2, when the on-chip RTC output clock is selected as the count clock for a
channel, that channel can operate even in module standby mode. When another clock is selected,
the channel does not operate in standby mode.
Bit 2: TPSC2
Bit 1: TPSC1
Bit 0: TPSC0
Description
0
0
0
Counts on Pφ/4
1
Counts on Pφ/16
0
Counts on Pφ/64
1
Counts on Pφ/256
0
Counts on Pφ/1024
1
Reserved (Do not set)
0
Counts on on-chip RTC output clock
(Do not set this pattern for channel 3 or 4)
1
Counts on external clock
(Do not set this pattern for channel 3 or 4)
1
1
0
1
Rev. 6.0, 07/02, page 302 of 986
(Initial value)
12.2.7
Input Capture Register (TCPR2)
TCPR2 is a 32-bit read-only register for use with the input capture function, provided only in
channel 2.
The input capture function is controlled by means of the input capture control bits (ICPE) and
clock edge bits (CKEG) in TCR2. When input capture occurs, the TCNT2 value is copied into
TCPR2. The value is set in TCPR2 only when the ICPF bit in TCR2 is 0.
TCPR2 is not initialized by a power-on or manual reset, or in standby mode.
Bit:
31
30
29
2
1
0
R
R
R
·············
Initial value:
R/W:
Undefined
R
R
R
Rev. 6.0, 07/02, page 303 of 986
12.3
Operation
Each channel has a 32-bit timer counter (TCNT) that performs count-down operations, and a 32bit timer constant register (TCOR). The channels have an auto-reload function that allows cyclic
count operations, and can also perform external event counting. Channel 2 also has an input
capture function.
12.3.1
Counter Operation
When one of bits STR0–STR4 is set to 1 in the timer start register (TSTR, TSTR2), the timer
counter (TCNT) for the corresponding channel starts counting. When TCNT underflows, the UNF
flag is set in the corresponding timer control register (TCR). If the UNIE bit in TCR is set to 1 at
this time, an interrupt request is sent to the CPU. At the same time, the value is copied from
TCOR into TCNT, and the count-down continues (auto-reload function).
Example of Count Operation Setting Procedure: Figure 12.2 shows an example of the count
operation setting procedure.
1. Select the count clock, for channel 0, 1, or 2, with bits TPSC2–TPSC0 in the timer control
register (TCR). When an external clock is selected, set the TCLK pin to input mode with the
TCOE bit in TOCR, and select the external clock edge with bits CKEG1 and CKEG0 in TCR.
2. Specify whether an interrupt is to be generated on TCNT underflow with the UNIE bit in TCR.
3. When the input capture function is used, set the ICPE bits in TCR, including specification of
whether the interrupt function is to be used.
4. Set a value in the timer constant register (TCOR).
5. Set the initial value in the timer counter (TCNT).
6. Set the STR bit to 1 in the timer start register (TSTR, TSTR2) to start the count.
Rev. 6.0, 07/02, page 304 of 986
Operation selection
Select count clock
1
Underflow interrupt
generation setting
2
When input capture
function is used
Input capture interrupt
generation setting
Timer constant
register setting
4
Set initial timer
counter value
5
Start count
6
3
Note: When an interrupt is generated, clear the source flag in the interrupt handler. If the interrupt
enabled state is set without clearing the flag, another interrupt will be generated.
Figure 12.2 Example of Count Operation Setting Procedure
Auto-Reload Count Operation: Figure 12.3 shows the TCNT auto-reload operation.
TCNT value
TCOR value set in TCNT
on underflow
TCOR
H'00000000
Time
STR0–STR2
UNF
Figure 12.3 TCNT Auto-Reload Operation
Rev. 6.0, 07/02, page 305 of 986
TCNT Count Timing:
• Operating on internal clock
Any of five count clocks (Pφ/4, Pφ/16, Pφ/64, Pφ/256, or Pφ/1024) scaled from the peripheral
module clock can be selected as the count clock by means of the TPSC2–TPSC0 bits in TCR.
Figure 12.4 shows the timing in this case.
Pφ
Internal clock
N+1
TCNT
N
N–1
Figure 12.4 Count Timing when Operating on Internal Clock
• Operating on external clock
For channels 0 to 2, external clock pin (TCLK) input can be selected as the timer clock by
means of the TPSC2–TPSC0 bits in TCR. The rising edge, falling edge, or both edges can be
selected as the detected edge of the external clock with the CKEG1 and CKEG0 bits in TCR.
Figure 12.5 shows the timing for both-edge detection.
Pφ
External clock
input pin
TCNT
N+1
N
Figure 12.5 Count Timing when Operating on External Clock
Rev. 6.0, 07/02, page 306 of 986
N–1
• Operating on on-chip RTC output clock
The on-chip RTC output clock can be selected as the timer clock in channels 0 to 2 by means
of the TPSC2–TPSC0 bits in TCR. Figure 12.6 shows the timing in this case.
RTC output clock
TCNT
N+1
N
N–1
Figure 12.6 Count Timing when Operating on On-Chip RTC Output Clock
12.3.2
Input Capture Function
Channel 2 has an input capture function.
The procedure for using the input capture function is as follows:
1. Use the TCOE bit in the timer output control register (TOCR) to set the TCLK pin to input
mode.
2. Use bits TPSC2–TPSC0 in the timer control register (TCR) to set an internal clock or the onchip RTC output clock as the timer operating clock.
3. Use bits IPCE1 and IPCE0 in TCR to specify use of the input capture function, and whether
interrupts are to generated when this function is used.
4. Use bits CKEG1 and CKEG0 in TCR to specify whether the rising or falling edge of the
TCLK signal is to be used to set the timer counter (TCNT) value in the input capture register
(TCPR2).
This function cannot be used in standby mode.
When input capture occurs, the TCNT2 value is set in TCPR2 only when the ICPF bit in TCR2 is
0. Also, a new DMAC transfer request is not generated until processing of the previous request is
finished.
Figure 12.7 shows the operation timing when the input capture function is used (with TCLK rising
edge detection).
Rev. 6.0, 07/02, page 307 of 986
TCNT value
TCOR value set in TCNT
on underflow
TCOR
H'00000000
Time
TCLK
TCPR2
TCNT value set
TICPI2
Figure 12.7 Operation Timing when Using Input Capture Function
12.4
Interrupts
There are four TMU interrupt sources, comprising underflow interrupts and the input capture
interrupt (when the input capture function is used). Underflow interrupts are generated on each of
the channels, and input capture interrupts on channel 2 only.
An underflow interrupt request is generated (for each channel) when the UNF bit in TCR is 1 and
the interrupt enable bit for the corresponding channel is 1.
When the input capture function is used and an input capture request is generated, an interrupt is
requested if the input capture input flag (ICPF) in TCR2 is 1 and the input capture control bits
(ICPE1, ICPE0) in TCR2 are 11.
The TMU interrupt sources are summarized in table 12.3.
Rev. 6.0, 07/02, page 308 of 986
Table 12.3 TMU Interrupt Sources
Channel
Interrupt Source
Description
Priority
0
TUNI0
Underflow interrupt 0
High
1
TUNI1
Underflow interrupt 1
2
TUNI2
Underflow interrupt 2
TICPI2
Input capture interrupt 2
3*
TUNI3
Underflow interrupt 3
4*
TUNI4
Underflow interrupt 4
Low
Note: * SH7750R only
12.5
Usage Notes
12.5.1
Register Writes
When performing a register write, timer count operation must be stopped by clearing the start bit
(STR0–STR4) for the relevant channel in the timer start register (TSTR, TSTR2).
Note that the timer start register (TSTR, TSTR2) can be written to, and the underflow flag (UNF)
and input capture flag (ICPF) of the timer control registers (TRCR0 to TCR4) can be cleared
while the count is in progress. When the flags (UNF, ICPF) are cleared while the count is in
progress, make sure not to change the values of bits other than those being cleared.
12.5.2
TCNT Register Reads
When performing a TCNT register read, processing for synchronization with the timer count
operation is performed. If a timer count operation and register read processing are performed
simultaneously, the TCNT counter value prior to the count-down operation is read by means of the
synchronization processing.
12.5.3
Resetting the RTC Frequency Divider
When the on-chip RTC output clock is selected as the count clock, the RTC frequency divider
should be reset.
12.5.4
External Clock Frequency
Ensure that the external clock frequency for any channel does not exceed Pφ/4.
Rev. 6.0, 07/02, page 309 of 986
Rev. 6.0, 07/02, page 310 of 986
Section 13 Bus State Controller (BSC)
13.1
Overview
The functions of the bus state controller (BSC) include division of the external memory space, and
output of control signals in accordance with various types of memory and bus interface
specifications. The BSC functions allow DRAM, synchronous DRAM, SRAM, ROM, etc., to be
connected to the SH7750 Series, and also support the PCMCIA interface protocol, enabling
system design to be simplified and data transfers to be carried out at high speed by a compact
system.
13.1.1
Features
The BSC has the following features:
• External memory space is managed as 7 independent areas
Maximum 64 Mbytes for each of areas 0 to 6
Bus width of each area can be set in a register (except area 0, which uses an external pin
setting)
Wait state insertion by 5'< pin
Wait state insertion can be controlled by program
Specification of types of memory connectable to each area
Output the control signals of memory to each area
Automatic wait cycle insertion to prevent data bus collisions in case of consecutive
memory accesses to different areas, or a read access followed by a write access to the same
area
Write strobe setup time and hold time periods can be inserted in a write cycle to enable
connection to low-speed memory
• SRAM interface
Wait state insertion can be controlled by program
Wait state insertion by 5'< pin
Connectable areas: 0 to 6
Settable bus widths: 64, 32, 16, 8
• DRAM interface
Row address/column address multiplexing according to DRAM capacity
Burst operation (fast page mode, EDO mode)
CAS-before-RAS refresh and self-refresh
8-CAS byte control for power-down operation
DRAM control signal timing can be controlled by register settings
Rev. 6.0, 07/02, page 311 of 986
Consecutive accesses to the same row address
Connectable areas: 2, 3
Settable bus widths: 64, 32, 16
• Synchronous DRAM interface
Row address/column address multiplexing according to synchronous DRAM capacity
Burst operation
Auto-refresh and self-refresh
Synchronous DRAM control signal timing can be controlled by register settings
Consecutive accesses to the same row address
Connectable areas: 2, 3
Settable bus widths: 64, 32
• Burst ROM interface
Wait state insertion can be controlled by program
Burst operation, executing the number of transfers set in a register
Connectable areas: 0, 5, 6
Settable bus widths: 64*, 32, 16, 8
• MPX interface
Address/data multiplexing
Connectable areas: 0 to 6
Settable bus widths: 64, 32
• Byte control SRAM interface
SRAM interface with byte control
Connectable areas: 1, 4
Settable bus widths: 64, 32, 16
• PCMCIA interface
Wait state insertion can be controlled by program
Bus sizing function for I/O bus width
• Fine refreshing control
Supports refresh operation immediately after self-refresh operation in low-power DRAM
by means of refresh counter overflow interrupt function
• Refresh counter can be used as interval timer
Interrupt request generated by compare-match
Interrupt request generated by refresh counter overflow
Note: * SH7750R only
Rev. 6.0, 07/02, page 312 of 986
13.1.2
Block Diagram
Bus
interface
Internal bus
Figure 13.1 shows a block diagram of the BSC.
WCR1
Wait
control unit
WCR2
WCR3
Area
control unit
–
–
BCR1
BCR2
BCR4*
–
Memory
control unit
,
CKE
,
MCR
Module bus
BCR3*
RD/
PCR
Interrupt
controller
Peripheral bus
RFCR
RTCNT
Refresh
control unit
Comparator
RTCOR
RTCSR
BSC
WCR:
BCR:
MCR:
PCR:
Wait control register
Bus control register
Memory control register
PCMCIA control register
RFCR:
RTCNT:
RTCOR:
RTCSR:
Refresh count register
Refresh timer count register
Refresh time constant register
Refresh timer control/status register
Note: * SH7750R only
Figure 13.1 Block Diagram of BSC
Rev. 6.0, 07/02, page 313 of 986
13.1.3
Pin Configuration
Table 13.1 shows the BSC pin configuration.
Table 13.1 BSC Pins
Name
Signals
I/O
Description
Address bus
A25–A0
O
Address output
Data bus
D63–D52,
D31–D0
I/O
Data input/output
D51–D32/
PORT19–
PORT0
I/O
%6
O
Data bus/port
Bus cycle start
When port functions are used and DDT mode is
selected, input the DTR format. Otherwise, when
port functions are used, D60-D52 cannot be used
and should be left open.
When port functions are not used: data input/output
When port functions are used: input/output port
(input or output set for each bit by register)
Signal that indicates the start of a bus cycle
When setting synchronous DRAM interface:
asserted once for a burst transfer
For other burst transfers: asserted each data cycle
Chip select 6–0
&69–&63
O
Chip select signals that indicate the area being
accessed
&68 and &69 are also used as PCMCIA &(4$ and
&(4%
Read/write
RD/:5
O
Data bus input/output direction designation signal
Also used as the DRAM/synchronous
DRAM/PCMCIA interface write designation signal
Row address
strobe
5$6
O
5$6 signal when setting DRAM/synchronous DRAM
interface
Read/column
address strobe/
cycle frame
5'/&$66/
)5$0(
O
Strobe signal that indicates a read cycle
When setting synchronous DRAM interface: &$6
signal
When setting MPX interface: )5$0( signal
Data enable 0
:(3/&$63/
DQM0
O
When setting synchronous DRAM interface:
selection signal for D7–D0
When setting DRAM interface: &$6 signal for
D7–D0
When setting MPX interface: high-level output
In other cases: write strobe signal for D7–D0
Rev. 6.0, 07/02, page 314 of 986
Table 13.1 BSC Pins (cont)
Name
Signals
I/O
Description
Data enable 1
:(4/&$64/
DQM1
O
When setting synchronous DRAM interface:
selection signal for D15–D8
When setting DRAM interface: &$6 signal for
D15–D8
When setting PCMCIA interface: write strobe signal
When setting MPX interface: high-level output
In other cases: write strobe signal for D15–D8
Data enable 2
:(5/&$65/
DQM2/,&,25'
O
When setting synchronous DRAM interface:
selection signal for D23–D16
When setting DRAM interface: &$6 signal for
D23–D16
When setting PCMCIA interface: ,&,25' signal
When setting MPX interface: high-level output
In other cases: write strobe signal for D23–D16
Data enable 3
:(6/&$66/
O
DQM3/,&,2:5
When setting synchronous DRAM interface:
selection signal for D31–D24
When setting DRAM interface: &$6 signal for
D31–D24
When setting PCMCIA interface: ,&,2:5 signal
When setting MPX interface: high-level output
In other cases: write strobe signal for D31–D24
Data enable 4
:(7/&$67/
DQM4
O
When setting synchronous DRAM interface:
selection signal for D39–D32
When setting DRAM interface: &$6 signal for
D39–D32
When setting MPX interface: high-level output
In other cases: write strobe signal for D39–D32
Data enable 5
:(8/&$68/
DQM5
O
When setting synchronous DRAM interface:
selection signal for D47–D40
When setting DRAM interface: &$6 signal for
D47–D40
When setting MPX interface: high-level output
In other cases: write strobe signal for D47–D40
Rev. 6.0, 07/02, page 315 of 986
Table 13.1 BSC Pins (cont)
Name
Signals
I/O
Description
Data enable 6
:(9/&$69/
DQM6
O
When setting synchronous DRAM interface:
selection signal for D55–D48
When setting DRAM interface: &$6 signal for
D55–D48
When setting MPX interface: high-level output
In other cases: write strobe signal for D55–D48
Data enable 7
:(:/&$6:/
DQM7/5(*
O
When setting synchronous DRAM interface:
selection signal for D63–D56
When setting DRAM interface: &$6 signal for
D63–D56
When setting PCMCIA interface: 5(* signal
When setting MPX interface: high-level output
In other cases: write strobe signal for D63–D56
Ready
5'<
I
Wait state request signal
Area 0 MPX
interface
specification/
16-bit I/O
MD6/,2,649
I
In power-on reset: Designates area 0 bus as MPX
interface (1: SRAM, 0: MPX)
Clock enable
CKE
O
Synchronous DRAM clock enable control signal
Bus release
request
%5(4/
%6$&.
I
Bus release request signal/bus acknowledge signal
Bus use
permission
%$&./
%65(4
O
Bus use permission signal/bus request
Area 0 bus
width/PCMCIA
card select
1
MD3/&(5$*
I/O
In power-on reset* : external space area 0 bus width
specification signal
When setting PCMCIA interface: 16-bit I/O
designation signal. Valid only in little-endian mode.
2
MD4/&(5%*
4
When setting PCMCIA interface: &(5$, &(5%
Endian switchover/ MD5/5$65*
row address strobe
3
I/O
Endian specification in a power-on reset.*
5$65 when DRAM is connected to area 2
I/O
Indicates master/slave status in a power-on reset.*
Master/slave
switchover
MD7/TXD
DMAC0
acknowledge
signal
DACK0
O
DMAC channel 0 data acknowledge
DMAC1
acknowledge
signal
DACK1
O
DMAC channel 1 data acknowledge
Serial interface TXD
Rev. 6.0, 07/02, page 316 of 986
4
4
Table 13.1 BSC Pins (cont)
Name
Signals
I/O
Description
Read/column
address strobe/
cycle frame 2
5'5
O
Same signal as 5'/&$66/)5$0(
Read/write 2
RD/:55
This signal is used when the 5'/&$66/)5$0(
signal load is heavy.
O
Same signal as RD/:5
This signal is used when the RD/:5 signal load is
heavy.
Notes: *1 MD3/&(5$ input/output switching is performed by BCR1.A56PCM. Output is selected
when BCR1.A56PCM = 1.
*2 MD4/&(5% input/output switching is performed by BCR1.A56PCM. Output is selected
when BCR1.A56PCM = 1.
*3 MD5/5$65 input/output switching is performed by BCR1.DRAMTP. Output is selected
when BCR1.DRAMTP (2–0) = 101.
*4 In a power-on reset by means of the 5(6(7 pin.
Rev. 6.0, 07/02, page 317 of 986
13.1.4
Register Configuration
The BSC has the 11 registers shown in table 13.2. In addition, the synchronous DRAM mode
register incorporated in synchronous DRAM can also be accessed as an SH7750 Series register.
The functions of these registers include control of interfaces to various types of memory, wait
states, and refreshing.
Table 13.2 BSC Registers
Name
Abbrevia- R/W
tion
Initial
Value
Bus control register 1
BCR1
R/W
H'0000 0000 H'FF80 0000 H'1F80 0000 32
Bus control register 2
P4
Address
Area 7
Address
Access
Size
BCR2
R/W
H'3FFC
H'FF80 0004 H'1F80 0004 16
2
BCR3
R/W
H'0000
H'FF80 0050 H'1F80 0050 16
2
Bus control register 4*
BCR4
R/W
H'0000 0000 H'FE0A 00F0 H'1E0A 00F0 32
Wait state control
register 1
WCR1
R/W
H'7777 7777 H'FF80 0008 H'1F80 0008 32
Wait state control
register 2
WCR2
R/W
H'FFFE EFFF H'FF80 000C H'1F80 000C 32
Wait state control
register 3
WCR3
R/W
H'0777 7777 H'FF80 0010 H'1F80 0010 32
Memory control register MCR
R/W
H'0000 0000 H'FF80 0014 H'1F80 0014 32
PCMCIA control register PCR
R/W
H'0000
H'FF80 0018 H'1F80 0018 16
Refresh timer
control/status register
RTCSR
R/W
H'0000
H'FF80 001C H'1F80 001C 16
Refresh timer counter
RTCNT
R/W
H'0000
H'FF80 0020 H'1F80 0020 16
Refresh time constant
counter
RTCOR
R/W
H'0000
H'FF80 0024 H'1F80 0024 16
Refresh count register
RFCR
R/W
H'0000
H'FF80 0028 H'1F80 0028 16
Synchronous
DRAM mode
registers
For
area 2
SDMR2
W
—
H'FF90 xxxx* H'1F90 xxxx
For
area 3
SDMR3
Bus control register 3*
1
1
H'FF94 xxxx* H'1F94 xxxx
Notes: *1 For details, see section 13.2.10, Synchronous DRAM Mode Registers (SDMR).
*2 Settable only for SH7750R.
Rev. 6.0, 07/02, page 318 of 986
8
13.1.5
Overview of Areas
Space Divisions: The architecture of the SH7750 Series provides a 32-bit virtual address space.
The virtual address is divided into five areas according to the upper address value. External
memory space comprises a 29-bit address space, divided into eight areas.
The virtual address can be allocated to any external address by means of the memory management
unit (MMU). Details are given in section 3, Memory Management Unit (MMU). This section
describes the areas into which the external address is divided.
With the SH7750 Series, various kinds of memory or PC cards can be connected to the seven
areas of external address as shown in table 13.3, and chip select signals (&63–&69, &(5$, &(5%)
are output for each of these areas. &63 is asserted when accessing area 0, and &69 when accessing
area 6. When DRAM or synchronous DRAM is connected to area 2 or 3, signals such as 5$6,
&$6, RD/:5, and DQM are also asserted. When the PCMCIA interface is selected for area 5 or
6, &(5$, &(5% is asserted in addition to &68, &69 for the byte to be accessed.
256
H'0000 0000
P0 and
U0 areas
P0 and
U0 areas
H'8000 0000
P1 area
H'A000 0000
H'C000 0000
P1 area
P2 area
P2 area
P3 area
P3 area
H'E000 0000 Store queue area
H'E400 0000
P4 area
H'FFFF FFFF
Store queue area
P4 area
Physical address
space
(MMU off)
Virtual address
space
(MMU on)
Area 0 (
)
H'0000 0000
Area 1 (
)
H'0400 0000
Area 2 (
)
H'0800 0000
Area 3 (
)
H'0C00 0000
Area 4 (
)
H'1000 0000
Area 5 (
)
H'1400 0000
Area 6 (
)
H'1800 0000
H'1C00 0000
H'1FFF FFFF
Area 7 (reserved area)
External memory
space
Notes: 1. When the MMU is off (MMUCR.AT = 0), the top 3 bits of the 32-bit address are ignored, and
memory is mapped onto a fixed 29-bit external address.
2. When the MMU is on (MMUCR.AT = 1), the P0, U0, P3, and store queue areas can be
mapped onto any external address using the TLB.
For details, see section 3, Memory Management Unit (MMU).
Figure 13.2 Correspondence between Virtual Address Space and External Memory Space
Rev. 6.0, 07/02, page 319 of 986
Table 13.3 External Memory Space Map
Area
0
External
Addresses
H'00000000–
H'03FFFFFF
Size
Connectable
Memory
64 Mbytes
SRAM
Burst ROM
MPX
1
H'04000000–
H'07FFFFFF
2
H'08000000–
H'0BFFFFFF
64 Mbytes
64 Mbytes
H'0C000000–
H'0FFFFFFF
4
H'10000000–
H'13FFFFFF
5
H'14000000–
H'17FFFFFF
64 Mbytes
64 Mbytes
64 Mbytes
5
H'1C000000–
H'1FFFFFFF
2
8,16,32,
6
64* bits,
32 bytes
2
8,16,32,
6
64* bits,
32 bytes
2
8,16,32,
6
64* bits,
32 bytes
2
8, 16, 32, 64*
2 3
Synchronous DRAM 32, 64* *
2 3
DRAM
16, 32, 64* *
2
MPX
32, 64*
SRAM
MPX
8, 16, 32, 64*
2
32, 64*
Byte control RAM
16, 32, 64*
SRAM
8, 16, 32, 64*
2
32, 64*
SRAM
MPX
64 Mbytes
32, 64*
SRAM
2
2
7
8, 16, 32* , 64*
2 4
8, 16* *
2
8, 16, 32, 64*
2
32, 64*
2
PCMCIA
8,16, 32* , 64*
2 4
8,16* *
—
—
Burst ROM
7*
8,16,32,
6
64* bits,
32 bytes
2
8, 16, 32, 64*
2 3
Synchronous DRAM 32, 64* *
2 3
DRAM
16, 32* *
MPX
64 Mbytes
2
16, 32, 64*
PCMCIA
H'18000000–
H'1BFFFFFF
8,16,32,
6
64* bits,
32 bytes
Byte control SRAM
SRAM
8,16,32,
6
64* bits,
32 bytes
2
MPX
Burst ROM
6
Access Size
1
7
8, 16, 32* , 64*
1
32, 64*
8, 16, 32, 64*
2
32, 64*
SRAM
MPX
3
Settable Bus
Widths
1
8, 16, 32, 64*
7
8,16,32,
6
64* bits,
32 bytes
Notes: *1 Memory bus width specified by external pins
*2 Memory bus width specified by register
*3 With synchronous DRAM interface, bus width is 32 or 64 bits only.
With DRAM interface, bus width is 16 or 32 bits only for area 2, and 16, 32, or 64 bits
only for area 3. Bus width of area 2 is as same as that of area 3 which is specified by
MCR.
*4 With PCMCIA interface, bus width is 8 or 16 bits only.
*5 Do not access a reserved area, as operation cannot be guaranteed in this case.
*6 64-bit access applies only to transfer by the DMAC. (CHCRn. TS = 000)
In a transfer to an external memory by FMOV (FPSCR.SZ = 1), two transfer operations,
each with an access size of 32 bits, are conducted.
*7 Settable only for SH7750R.
Rev. 6.0, 07/02, page 320 of 986
Area 0: H'00000000
SRAM/burst ROM/MPX
Area 1: H'04000000
SRAM/MPX/byte control SRAM
Area 2: H'08000000
SRAM/synchronous DRAM/DRAM/
MPX
Area 3: H'0C000000
SRAM/synchronous DRAM/DRAM/
MPX
Area 4: H'10000000
SRAM/MPX/byte control SRAM
Area 5: H'14000000
SRAM/burst ROM/PCMCIA/MPX
Area 6: H'18000000
SRAM/burst ROM/PCMCIA/MPX
The PCMCIA interface is
for memory and I/O card use
Figure 13.3 External Memory Space Allocation
Memory Bus Width: In the SH7750 Series, the memory bus width can be set independently for
each space. For area 0, a bus size of 8, 16, 32, or 64 bits can be selected in a power-on reset by the
5(6(7 pin, using external pins. The relationship between the external pins (MD4 and MD3) and
the bus width in a power-on reset is shown below.
MD4
MD3
Bus Width
0
0
64 bits
1
8 bits
0
16 bits
1
32 bits
1
When SRAM interface or ROM is used in areas 1 to 6, a bus width of 8, 16, 32, or 64 bits can be
selected with bus control register 2 (BCR2). When burst ROM is used, a bus width of 8, 16, 32, or
64* bits can be selected. When byte control SRAM interface is used, a bus width of 16, 32, or 64
bits can be selected. When the MPX interface is used, a bus width of 32 or 64 bits can be selected.
When the DRAM interface is used, a bus width of 16, 32, or 64 bits can be selected with the
memory control register (MCR). When the DRAM interface is used for area 2 or 3, a bus width of
16 or 32 bits should be set. For the synchronous DRAM interface, set a bus width of 32 or 64 bits
in the MCR register.
Rev. 6.0, 07/02, page 321 of 986
When using the PCMCIA interface, set a bus width of 8 or 16 bits.
For details, see section 13.3.7, PCMCIA Interface.
When using port functions, set a bus width of 8, 16, or 32 bits for all areas.
For details, see section 13.2.2, Bus Control Register 2 (BCR2), and section 13.2.7, Memory
Control Register (MCR).
The area 7 address range, H'1C000000 to H'1FFFFFFFF, is a reserved space and must not be used.
Note: * SH7750R only
13.1.6
PCMCIA Support
The SH7750 Series supports PCMCIA compliant interface specifications for external memory
space areas 5 and 6.
The interfaces supported are the IC memory card interface and I/O card interface stipulated in
JEIDA specifications version 4.2 (PCMCIA2.1).
External memory space areas 5 and 6 support both the IC memory card interface and the I/O card
interface.
The PCMCIA interface is supported only in little-endian mode.
Table 13.4 PCMCIA Interface Features
Item
Features
Access
Random access
Data bus
8/16 bits
Memory type
Mask ROM, OTPROM, EPROM, EEPROM, flash memory, SRAM
Common memory capacity
Max. 64 Mbytes
Attribute memory capacity
Max. 64 Mbytes
Others
Dynamic bus sizing for I/O bus width, access to PCMCIA interface
from address translation areas
Rev. 6.0, 07/02, page 322 of 986
Table 13.5 PCMCIA Support Interfaces
IC Memory Card Interface
Signal
Pin Name
I/O Function
Ground
I/O Card Interface
Signal
Name
I/O Function
GND
Ground
Corresponding
SH7750 Series
Pin
1
GND
—
2
D3
I/O Data
D3
I/O Data
D3
3
D4
I/O Data
D4
I/O Data
D4
4
D5
I/O Data
D5
I/O Data
D5
5
D6
I/O Data
D6
I/O Data
D6
6
D7
I/O Data
D7
I/O Data
D7
7
&(4
I
Card enable
&(4
I
Card enable
&68 or &69
8
A10
I
Address
A10
I
Address
A10
9
2(
I
Output enable
2(
I
Output enable
5'
10
A11
I
Address
A11
I
Address
A11
11
A9
I
Address
A9
I
Address
A9
12
A8
I
Address
A8
I
Address
A8
13
A13
I
Address
A13
I
Address
A13
14
A14
I
Address
A14
I
Address
A14
15
:(/3*0
I
Write enable
:(/3*0
I
Write enable
:(4
16
5' CH1 > CH2 > CH3
• CH0 > CH2 > CH3 > CH1
• CH2 > CH0 > CH1 > CH3
The priority order is selected with bits PR1 and PR0 in DMAOR.
Round Robin Mode: In round robin mode, each time the transfer of one transfer unit (byte, word,
longword, quadword, or 32 bytes) ends on a given channel, that channel is assigned the lowest
priority level. This is illustrated in figure 14.3. The order of priority in round robin mode
immediately after a reset is CH0 > CH1 > CH2 > CH3.
Note: In round robin mode, if no transfer request is accepted for any channel during DMA
transfer, the priority order becomes CH0 > CH1 > CH2 > CH3.
Rev. 6.0, 07/02, page 515 of 986
Transfer on channel 0
Initial priority order
CH0 > CH1 > CH2 > CH3
Channel 0 is given the lowest
priority.
Priority order after transfer CH1 > CH2 > CH3 > CH0
Transfer on channel 1
Initial priority order
CH0 > CH1 > CH2 > CH3
Priority order after transfer CH2 > CH3 > CH0 > CH1
When channel 1 is given the
lowest priority, the priority of
channel 0, which was higher
than channel 1, is also
shifted simultaneously.
Transfer on channel 2
Initial priority order
CH0 > CH1 > CH2 > CH3
Priority order after transfer
Priority after transfer due to
issuance of a transfer request
for channel 1 only.
CH3 > CH0 > CH1 > CH2
When channel 2 is given the
lowest priority, the priorities of
channels 0 and 1, which were
higher than channel 2, are
also shifted simultaneously. If
there is a transfer request for
channel 1 only immediately
afterward, channel 1 is given
the lowest priority and the
priorities of channels 3 and 0
are simultaneously shifted
down.
CH2 > CH3 > CH0 > CH1
Transfer on channel 3
Initial priority order
CH0 > CH1 > CH2 > CH3
No change in priority order
Priority order after transfer CH0 > CH1 > CH2 > CH3
Figure 14.3 Round Robin Mode
Figure 14.4 shows the changes in priority levels when transfer requests are issued simultaneously
for channels 0 and 3, and channel 1 receives a transfer request during a transfer on channel 0. The
operation of the DMAC in this case is as follows.
Rev. 6.0, 07/02, page 516 of 986
1. Transfer requests are issued simultaneously for channels 0 and 3.
2. Since channel 0 has a higher priority level than channel 3, the channel 0 transfer is executed
first (channel 3 is on transfer standby).
3. A transfer request is issued for channel 1 during the channel 0 transfer (channels 1 and 3 are on
transfer standby).
4. At the end of the channel 0 transfer, channel 0 shifts to the lowest priority level.
5. At this point, channel 1 has a higher priority level than channel 3, so the channel 1 transfer is
started (channel 3 is on transfer standby).
6. At the end of the channel 1 transfer, channel 1 shifts to the lowest priority level.
7. The channel 3 transfer is started.
8. At the end of the channel 3 transfer, the channel 3 and channel 2 priority levels are lowered,
giving channel 3 the lowest priority.
Transfer request
1. Issued for channels 0
and 3
3. Issued for channel 1
Channel
waiting
3
DMAC operation
Channel priority
order
2. Start of channel 0
transfer
0>1>2>3
Change of
priority order
1, 3
4. End of channel 0
transfer
1>2>3>0
5. Start of channel 1
transfer
3
6. End of channel 1
transfer
Change of
priority order
2>3>0>1
7. Start of channel 3
transfer
None
Change of
priority order
8. End of channel 3
transfer
0>1>2>3
Figure 14.4 Example of Changes in Priority Order in Round Robin Mode
Rev. 6.0, 07/02, page 517 of 986
14.3.4
Types of DMA Transfer
The DMAC supports the transfers shown in table 14.6. It can operate in single address mode, in
which either the transfer source or the transfer destination is accessed using the acknowledge
signal, or in dual address mode, in which both the transfer source and transfer destination
addresses are output. The actual transfer operation timing depends on the bus mode, which can be
either burst mode or cycle steal mode.
Table 14.6 Supported DMA Transfers
Transfer Destination
External Device
with DACK
External
Memory
Memory-Mapped
External Device
On-Chip
Peripheral Module
External device
with DACK
Not available
Single address
mode
Single address
mode
Not available
External memory
Single address
mode
Dual address
mode
Dual address mode Dual address mode
Memory-mapped
external device
Single address
mode
Dual address
mode
Dual address mode Dual address mode
On-chip peripheral
module
Not available
Dual address
mode
Dual address mode Not available
Transfer Source
Rev. 6.0, 07/02, page 518 of 986
Address Modes
Single Address Mode: In single address mode, both the transfer source and the transfer
destination are external; one is accessed by the DACK signal and the other by an address. In this
mode, the DMAC performs a DMA transfer in one bus cycle by simultaneously outputting the
external device strobe signal (DACK) to either the transfer source or transfer destination external
device to access it, while outputting an address to the other side of the transfer. Figure 14.5 shows
an example of a transfer between external memory and an external device with DACK in which
the external device outputs data to the data bus and that data is written to external memory in the
same bus cycle.
External
address
bus
External
data bus
SH7750 Series
External
memory
DMAC
External device
with DACK
DACK
: Data flow
Figure 14.5 Data Flow in Single Address Mode
Two types of transfer are possible in single address mode: (1) transfer between an external device
with DACK and a memory-mapped external device, and (2) transfer between an external device
with DACK and external memory. Only the external request signal ('5(4) is used in both these
cases.
Figure 14.6 shows the DMA transfer timing for single address mode.
The access timing depends on the type of external memory. For details, see the descriptions of the
memory interfaces in section 13, Bus State Controller (BSC).
Rev. 6.0, 07/02, page 519 of 986
CKIO
Address output to external memory
space
A28–A0
CSn
Data output from external device
with DACK
D63–D0
DACK signal to external
device with DACK
DACK
signal to external memory space
WE
(a) From external device with DACK to external memory space
CKIO
Address output to external memory
space
A28–A0
CSn
Data output from external memory
space
D63–D0
RD
signal to external memory space
DACK signal to external
device with DACK
DACK
(b) From external memory space to external device with DACK
Figure 14.6 DMA Transfer Timing in Single Address Mode
Dual Address Mode: Dual address mode is used to access both the transfer source and the
transfer destination by address. The transfer source and destination can be accessed by either onchip peripheral module or external address.
Even if the operand cache is used in RAM mode, the RAM cannot be set as the transfer source or
transfer destination.
In dual address mode, data corresponding to the size specified by CHCRn.TS is read from the
transfer source in the data read cycle, and, in the data write cycle, it is transferred in two bus
cycles in order to write in the transfer destination the data corresponding to the size specified by
Rev. 6.0, 07/02, page 520 of 986
CHCRn.TS. In this process, the transfer data is temporarily stored in the data buffer in the bus
state controller (BSC).
In a transfer between external memories such as that shown in figure 14.7, data is read from
external memory into the BSC’s data buffer in the read cycle, then written to the other external
memory in the write cycle. Figure 14.8 shows the timing for this operation. The DACK output
timing is the same as that of &6Q in a read or write cycle specified by the CHCRn.AM bit.
SAR
BSC
Data bus
DAR
Memory
Address bus
DMAC
Transfer source
module
Transfer destination
module
Data buffer
Taking the SAR value as the address, data is read from the transfer source module
and stored temporarily in the data buffer in the bus state controller (BSC).
1st bus cycle
SAR
BSC
Data bus
DAR
Memory
Address bus
DMAC
Transfer source
module
Transfer destination
module
Data buffer
Taking the DAR value as the address, the data stored in the BSC’s data buffer is
written to the transfer destination module.
2nd bus cycle
Figure 14.7 Operation in Dual Address Mode
Rev. 6.0, 07/02, page 521 of 986
CKIO
A26–A0
Transfer source
address
Transfer destination
address
D63–D0
DACK
Data read cycle
(1st cycle)
Data write cycle
(2nd cycle)
Transfer from external memory space to external memory space
Figure 14.8 Example of Transfer Timing in Dual Address Mode
Bus Modes
There are two bus modes, cycle steal mode and burst mode, selected with the TM bit in CHCR0–
CHCR3.
Cycle Steal Mode: In cycle steal mode, the DMAC releases the bus to the CPU at the end of each
transfer-unit (8-bit, 16-bit, 32-bit, 64-bit, or 32-byte) transfer. When the next transfer request is
issued, the DMAC reacquires the bus from the CPU and carries out another transfer-unit transfer.
At the end of this transfer, the bus is again given to the CPU. This is repeated until the transfer end
condition is satisfied.
Cycle steal mode can be used with all categories of transfer request source, transfer source, and
transfer destination.
Figure 14.9 shows an example of DMA transfer timing in cycle steal mode. The transfer
conditions in this example are dual address mode and '5(4 level detection.
Rev. 6.0, 07/02, page 522 of 986
Bus returned to CPU
Bus cycle
CPU
CPU
CPU
DMAC
DMAC
Read
Write
CPU
DMAC
DMAC
Read
Write
CPU
CPU
Figure 14.9 Example of DMA Transfer in Cycle Steal Mode
Burst Mode: In burst mode, once the DMAC has acquired the bus it holds the bus and transfers
data continuously until the transfer end condition is satisfied. With '5(4 low level detection in
external request mode, however, when '5(4 is driven high the bus passes to another bus master
after the end of the DMAC transfer request that has already been accepted, even if the transfer end
condition has not been satisfied.
Figure 14.10 shows an example of DMA transfer timing in burst mode. The transfer conditions in
this example are single address mode and '5(4 level detection (CHCRn.DS = 0, CHCRn.TM =
1).
Bus cycle
CPU
CPU
CPU
DMAC
DMAC
DMAC
DMAC
DMAC
DMAC
CPU
Figure 14.10 Example of DMA Transfer in Burst Mode
Note: Burst mode can be set regardless of the transfer size. A 32-byte block transfer burst mode
setting can also be made.
Relationship between DMA Transfer Type, Request Mode, and Bus Mode
Table 14.7 shows the relationship between the type of DMA transfer, the request mode, and the
bus mode.
Rev. 6.0, 07/02, page 523 of 986
Table 14.7 Relationship between DMA Transfer Type, Request Mode, and Bus Mode
Address
Mode
Single
Dual
32B:
B:
C:
External:
Internal:
Request
Mode
Bus
Mode
Transfer Size Usable
(Bits)
Channels
External device with DACK
and external memory
External
B/C
8/16/32/64/32B 0, 1 (2, 3)*
External device with DACK
and memory-mapped
external device
External
B/C
8/16/32/64/32B 0, 1 (2, 3)*
External memory and
external memory
Internal*
7
External*
1
B/C
5 6
8/16/32/64/32B 0, 1, 2, 3* *
External memory and
memory-mapped external
device
Internal*
7
External*
1
B/C
5 6
8/16/32/64/32B 0, 1, 2, 3* *
1
Memory-mapped external
Internal*
7
device and memory-mapped External*
external device
B/C
5 6
8/16/32/64/32B 0, 1, 2, 3* *
2
3
B/C*
8/16/32/64*
4
5 6
0, 1, 2, 3* *
2
3
B/C*
8/16/32/64*
4
5 6
0, 1, 2, 3* *
Type of Transfer
External memory and
on-chip peripheral module
Internal*
Memory-mapped external
device and on-chip
peripheral module
Internal*
6
6
32-byte burst transfer
Burst
Cycle steal
External request
Auto-request or on-chip peripheral module request
Notes: *1 External request, auto-request, or on-chip peripheral module request (TMU input
capture interrupt request) possible. In the case of an on-chip peripheral module request,
it is not possible to specify external memory data transfer with the SCI (SCIF) as the
transfer request source.
*2 External request, auto-request, or on-chip peripheral module request possible. If the
transfer request source is the SCI (SCIF), either the transfer source must be SCRDR1
(SCFRDR2) or the transfer destination must be SCTDR1 (SCFTDR2).
*3 When the transfer request source is the SCI (SCIF), only cycle steal mode can be used.
*4 Access size permitted for the on-chip peripheral module register that is the transfer
source or transfer destination.
*5 When the transfer request is an external request, only channels 0 and 1 can be used.
*6 In DDT mode, transfer requests can be accepted for all channels from external devices
capable of DTR format output.
*7 See tables 14.8 and 14.9 for the transfer sources and transfer destinations in DMA
transfer by means of an external request.
Rev. 6.0, 07/02, page 524 of 986
(a) Normal DMA Mode
Table 14.8 shows the memory interfaces that can be specified for the transfer source and transfer
destination in DMA transfer initiated by an external request supported by the SH7750 Series in
normal DMA mode.
Table 14.8 External Request Transfer Sources and Destinations in Normal Mode
Transfer Source
Transfer Destination
Usable
Address DMAC
Mode
Channels
1
Synchronous DRAM
External device with DACK
Single
0, 1
2
External device with DACK
Synchronous DRAM
Single
0, 1
3
SRAM-type, DRAM
External device with DACK
Single
0, 1
4
External device with DACK
SRAM-type, DRAM
Single
0, 1
5
Synchronous DRAM
SRAM-type, MPX, PCMCIA
Dual
0, 1
6
SRAM-type, MPX, PCMCIA
Dual
0, 1
7
SRAM-type, DRAM, PCMCIA,
MPX
Dual
0, 1
8
SRAM-type, MPX, PCMCIA
Dual
0, 1
Transfer Direction (Settable Memory Interface)
*
Synchronous DRAM
SRAM-type, MPX, PCMCIA
*
*
SRAM-type, DRAM, PCMCIA,
MPX
*
*: DACK output setting in dual address mode transfer
"SRAM-type" in the table indicates an SRAM, byte control SRAM, or burst ROM setting.
Notes: 1. Memory interfaces on which transfer is possible in single address mode are SRAM,
byte control SRAM, burst ROM, DRAM, and synchronous DRAM.
2. When performing dual address mode transfer, make the DACK output setting for the
SRAM, byte control SRAM, burst ROM, PCMCIA, or MPX interface.
(b) DDT Mode
Table 14.9 shows the memory interfaces that can be specified for the transfer source and transfer
destination in DMA transfer initiated by an external request supported by the SH7750 Series in
DDT mode.
Rev. 6.0, 07/02, page 525 of 986
Table 14.9 External Request Transfer Sources and Destinations in DDT Mode
Transfer Destination
Usable
Address DMAC
Mode
Channels
External device with DACK
Single
0, 1, 2, 3
Single
0, 1, 2, 3
Transfer Direction (Settable Memory Interface)
Transfer Source
1
1
Synchronous DRAM*
2
External device with DACK
3
Synchronous DRAM
4
SRAM-type, MPX, PCMCIA
5
SRAM-type, DRAM, PCMCIA,
MPX
6
SRAM-type, MPX, PCMCIA
Synchronous DRAM
SRAM-type, MPX, PCMCIA
*2 Synchronous DRAM
SRAM-type, MPX, PCMCIA
*2 SRAM-type, DRAM, PCMCIA,
MPX
*2 Dual
0, 1, 2, 3
Dual
0, 1, 2, 3
*2 Dual
0, 1, 2, 3
Dual
0, 1, 2, 3
"SRAM-type" in the table indicates an SRAM, byte control SRAM, or burst ROM setting.
Notes: 1. The only memory interface on which single address mode transfer is possible in DDT
mode is synchronous DRAM.
2. When performing dual address mode transfer, make the DACK output setting for the
SRAM, byte control SRAM, burst ROM, PCMCIA, or MPX interface.
*1 In SH7750, the bus width must be 64 bits
*2 DACK output setting in dual address mode transfer
Bus Mode and Channel Priority Order
When, for example, channel 1 is transferring data in burst mode, and a transfer request is issued to
channel 0, which has a higher priority, the channel 0 transfer is started immediately.
If fixed mode has been set for the priority levels (CH0 > CH1), transfer on channel 1 is continued
after transfer on channel 0 is completely finished, whether cycle steal mode or burst mode is set
for channel 0.
If round robin mode has been set for the priority levels, transfer on channel 1 is restarted after one
transfer unit of data is transferred on channel 0, whether cycle steal mode or burst mode is set for
channel 0. Channel execution alternates in the order: channel 1 → channel 0 → channel 1 →
channel 0.
An example of round robin mode operation is shown in figure 14.11.
Since channel 1 is in burst mode (in the case of edge sensing) regardless of whether fixed mode or
round robin mode is set for the priority order, the bus is not released to the CPU until channel 1
transfer ends.
Rev. 6.0, 07/02, page 526 of 986
CPU
CPU
DMAC CH1
DMAC CH1
DMAC channel 1
burst mode
DMAC CH0
DMAC CH1
DMAC CH0
CH0
CH1
CH0
DMAC CH1
DMAC channel 0 and
channel 1 round robin
mode
DMAC CH1
DMAC channel 1
burst mode
CPU
CPU
Priority system: Round robin mode
Channel 0:
Cycle steal mode
Channel 1:
Burst mode (edge-sensing)
Figure 14.11 Bus Handling with Two DMAC Channels Operating
Note: When channel 1 is in level-sensing burst mode with the settings shown in figure 14.11, the
bus is passed to the CPU during a break in requests.
14.3.5
Number of Bus Cycle States and '5(4 Pin Sampling Timing
Number of States in Bus Cycle: The number of states in the bus cycle when the DMAC is the
bus master is controlled by the bus state controller (BSC) just as it is when the CPU is the bus
master. See section 13, Bus State Controller (BSC), for details.
'5(4 Pin Sampling Timing: In external request mode, the '5(4 pin is sampled at the rising
edge of CKIO clock pulses. When '5(4 input is detected, a DMAC bus cycle is generated and
DMA transfer executed after four CKIO cycles at the earliest.
The second and subsequent '5(4 sampling operations are performed one cycle after the start of
the first DMAC transfer bus cycle (in the case of single address mode).
DRAK is output for one cycle only, once each time '5(4 is detected, regardless of the transfer
mode or '5(4 detection method. In the case of burst mode edge detection, '5(4 is sampled in
the first cycle only, and so DRAK is output in the first cycle only .
Operation: Figures 14.12 to 14.22 show the timing in each mode.
1. Cycle Steal Mode
In cycle steal mode, The '5(4 sampling timing differs for dual address mode and single
address mode, and for level detection and edge detection of '5(4.
For example, in figure 14.12 (cycle steal mode, dual address mode, level detection), DMAC
transfer begins, at the earliest, four CKIO cycles after the first sampling operation. The second
sampling operation is performed one cycle after the start of the first DMAC transfer write
cycle. If '5(4 is not detected at this time, sampling is executed in every subsequent cycle.
Rev. 6.0, 07/02, page 527 of 986
In figure 14.13 (cycle steal mode, dual address mode, edge detection), DMAC transfer begins,
at the earliest, five CKIO cycles after the first sampling operation. The second sampling
operation begins from the cycle in which the first DMAC transfer read cycle ends. If '5(4 is
not detected at this time, sampling is executed in every subsequent cycle.
For details of the timing for various kinds of memory access, see section 13, Bus State
Controller (BSC).
Figure 14.18 shows the case of cycle steal mode, single address mode, and level detection. In
this case, too, transfer is started, at the earliest, four CKIO cycles after the first '5(4
sampling operation. The second sampling operation is performed one cycle after the start of
the first DMAC transfer bus cycle.
Figure 14.19 shows the case of cycle steal mode, single address mode, and edge detection. In
this case, transfer is started, at the earliest, five CKIO cycles after the first '5(4 sampling
operation. The second sampling begins one cycle after the first assertion of DRAK.
In single address mode, the DACK signal is output every DMAC transfer cycle.
2. Burst Mode, Dual Address Mode, Level Detection
'5(4 sampling timing in burst mode using dual address mode and level detection is virtually
the same as for cycle steal mode.
For example, in figure 14.14, DMAC transfer begins, at the earliest, four CKIO cycles after the
first sampling operation. The second sampling operation is performed one cycle after the start
of the first DMAC transfer write cycle.
In the case of dual address mode transfer initiated by an external request, the DACK signal can
be output in either the read cycle or the write cycle of the DMAC transfer according to the
specification of the AM bit in CHCR.
3. Burst Mode, Single Address Mode, Level Detection
'5(4 sampling timing in burst mode using single address mode and level detection is shown
in figure 14.20.
In the example shown in figure 14.20, DMAC transfer begins, at the earliest, four CKIO cycles
after the first sampling operation, and the second sampling operation begins one cycle after the
start of the first DMAC transfer bus cycle.
In single address mode, the DACK signal is output every DMAC transfer cycle.
In figure 14.22, with a 32-byte data size, 64-bit bus width, and SDRAM: row hit write, DMAC
transfer begins, at the earliest, six CKIO cycles after the first sampling operation. The second
sampling operation begins one cycle after DACK is asserted for the first DMAC transfer.
4. Burst Mode, Dual Address Mode, Edge Detection
In burst mode using dual address mode and edge detection, '5(4 sampling is performed in
the first cycle only.
Rev. 6.0, 07/02, page 528 of 986
For example, in the case shown in figure 14.15, DMAC transfer begins, at the earliest, five
CKIO cycles after the first sampling operation. DMAC transfer then continues until the end of
the number of data transfers set in DMATCR. '5(4 is not sampled during this time, and
therefore DRAK is output in the first cycle only.
In the case of dual address mode transfer initiated by an external request, the DACK signal can
be output in either the read cycle or the write cycle of the DMAC transfer according to the
specification of the AM bit in CHCR.
5. Burst Mode, Single Address Mode, Edge Detection
In burst mode using single address mode and edge detection, '5(4 sampling is performed
only in the first cycle.
For example, in the case shown in figure 14.21, DMAC transfer begins, at the earliest, five
cycles after the first sampling operation. DMAC transfer then continues until the end of the
number of data transfers set in DMATCR. '5(4 is not sampled during this time, and
therefore DRAK is output in the first cycle only.
In single address mode, the DACK signal is output every DMAC transfer cycle.
Suspension of DMA Transfer in Case of '5(4 Level Detection
With '5(4 level detection in burst mode or cycle steal mode, and in dual address mode or single
address mode, the external device for which DMA transfer is being executed can judge from the
rising edge of CKIO that DARK has been asserted, and suspend DMA transfer by negating
'5(4. In this case, the next DARK signal is not output.
Rev. 6.0, 07/02, page 529 of 986
Figure 14.12 Dual Address Mode/Cycle Steal Mode
External Bus → External Bus/'5(4
'5(4 (Level Detection), DACK (Read Cycle)
Rev. 6.0, 07/02, page 530 of 986
DACK0
Bus cycle
DRAK0
(level
detection)
D[63:0]
A[25:0]
CKIO
:
2nd
acceptance
Write
Destination address
DMAC
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
Bus locked
CPU
Read
Source address
DMAC
Write
Destination address
Bus locked
CPU
Figure 14.13 Dual Address Mode/Cycle Steal Mode
External Bus → External Bus/'5(4
'5(4 (Edge Detection), DACK (Read Cycle)
Rev. 6.0, 07/02, page 531 of 986
DACK0
Bus cycle
DRAK0
(edge
detection)
D[63:0]
A[25:0]
CKIO
:
DMAC
Write
CPU
Destination address
2nd
acceptance
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
Bus locked
DMAC
Write
CPU
Destination address
3rd
acceptance
Read
Source address
Bus locked
DMAC
4th
acceptance
Read
Source address
Figure 14.14 Dual Address Mode/Burst Mode
External Bus → External Bus/'5(4
'5(4 (Level Detection), DACK (Read Cycle)
Rev. 6.0, 07/02, page 532 of 986
DACK0
Bus cycle
DRAK0
(level
detection)
D[63:0]
A[25:0]
CKIO
:
2nd
acceptance
Write
Destination address
DMAC-1
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
Bus locked
Read
Write
Destination address
DMAC-2
Source address
Bus locked
CPU
Figure 14.15 Dual Address Mode/Burst Mode
External Bus → External Bus/'5(4
'5(4 (Edge Detection), DACK (Read Cycle)
Rev. 6.0, 07/02, page 533 of 986
DACK0
Bus cycle
DRAK0
(edge
detection)
D[63:0]
A[25:0]
CKIO
:
sampling and determination of channel priority
CPU
1st
acceptance
Read
Read
DMAC-2
Write
Destination address
Bus locked
Source address
TE bit: transfer end
Write
Destination address
DMAC-1
Source address
Bus locked
CPU
Figure 14.16 Dual Address Mode/Cycle Steal Mode
On-Chip SCI (Level Detection) → External Bus
Rev. 6.0, 07/02, page 534 of 986
Bus cycle
D[63:0]
A[25:0]
On-chip
peripheral
data bus
On-chip
peripheral
address bus
CKIO
(Bcyc:Pcyc = 1:1)
CPU
Read
Source address
DMAC
Write
Destination address
CPU
Read
Source address
DMAC
Write
Destination address
CPU
Read
Source address
DMAC
Write
CPU
Destination address
Figure 14.17 Dual Address Mode/Cycle Steal Mode
External Bus → On-Chip SCI (Level Detection)
Rev. 6.0, 07/02, page 535 of 986
Bus cycle
On-chip
peripheral
data bus
On-chip
peripheral
address bus
D[63:0]
A[25:0]
CKIO
(Bcyc:Pcyc = 1:1)
CPU
Read
T1
T2
Write
CPU
Destination address
DMAC
Source address
Read
T1
T2
Write
CPU
Destination address
DMAC
Source address
Read
T1
T2
Write
Destination address
DMAC
Source address
Figure 14.18 Single Address Mode/Cycle Steal Mode
External Bus → External Bus/'5(4
'5(4 (Level Detection)
Rev. 6.0, 07/02, page 536 of 986
DACK0
Bus cycle
DRAK0
(level
detection)
D[63:0]
A[25:0]
CKIO
:
DMAC
2nd
acceptance
CPU
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
DMAC
3rd
acceptance
Read
Source address
CPU
DMAC
4th
acceptance
Read
Source address
CPU
DMAC
Read
Source address
CPU
Figure 14.19 Single Address Mode/Cycle Steal Mode
External Bus → External Bus/'5(4
'5(4 (Edge Detection)
Rev. 6.0, 07/02, page 537 of 986
DACK0
Bus cycle
DRAK0
(edge
detection)
D[63:0]
A[25:0]
CKIO
:
DMAC
2nd
acceptance
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
CPU
DMAC
3rd
acceptance
Read
Source address
CPU
DMAC
Read
Source address
CPU
Figure 14.20 Single Address Mode/Burst Mode
External Bus → External Bus/'5(4
'5(4 (Level Detection)
Rev. 6.0, 07/02, page 538 of 986
DACK0
Bus cycle
DRAK0
(level
detection)
D[63:0]
A[25:0]
CKIO
:
DMAC-1
2nd
acceptance
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
DMAC-2
3rd
acceptance
Read
Source address
DMAC-3
Read
Source address
CPU
4th
acceptance
DMAC-4
Read
Source address
Figure 14.21 Single Address Mode/Burst Mode
External Bus → External Bus/'5(4
'5(4 (Edge Detection)
Rev. 6.0, 07/02, page 539 of 986
DACK0
Bus cycle
DRAK0
(edge
detection)
D[63:0]
A[25:0]
CKIO
:
DMAC-1
sampling and determination of channel priority
CPU
1st
acceptance
Read
Source address
DMAC-2
DMAC-3
Read
Source address
TE bit: transfer end
Read
Source address
DMAC-4
Read
Source address
CPU
Figure 14.22 Single Address Mode/Burst Mode
External Bus → External Bus/'5(4
'5(4 (Level Detection)/32-Byte Block Transfer
(Bus Width: 64 Bits, SDRAM: Row Hit Write)
Rev. 6.0, 07/02, page 540 of 986
DACK0
Bus cycle
DRAK0
(level
detection)
D[63:0]
A[25:0]
CKIO
:
CPU
Asserted 2 cycles before
start of bus cycle
2nd
acceptance
D3
DMAC-1
D2
sampling and determination of channel priority
1st
acceptance
D1
Destination
address
3rd
acceptance
D1
Asserted 2 cycles before
start of bus cycle
D4
D3
DMAC-2
D2
Destination
address
D1
Asserted 2 cycles before
start of bus cycle
D4
D3
DMAC-3
D2
Destination
address
D4
CPU
14.3.6
Ending DMA Transfer
The conditions for ending DMA transfer are different for ending on individual channels and for
ending on all channels together. Except for the case where transfer ends when the value in the
DMA transfer count register (DMATCR) reaches 0, the following conditions apply to ending
transfer.
1. Cycle Steal Mode (External Request, On-Chip Peripheral Module Request, Auto-Request)
When a transfer end condition is satisfied, acceptance of DMAC transfer requests is
suspended. The DMAC completes transfer for the transfer requests accepted up to the point at
which the transfer end condition was satisfied, then stops.
In cycle steal mode, the operation is the same for both edge and level transfer request
detection.
2. Burst Mode, Edge Detection (External Request, On-Chip Peripheral Module Request, AutoRequest)
The delay between the point at which a transfer end condition is satisfied and the point at
which the DMAC actually stops is the same as in cycle steal mode. In burst mode with edge
detection, only the first transfer request activates the DMAC, but the timing of stop request
(DE = 0 in CHCR, DME = 0 in DMAOR) sampling is the same as the transfer request
sampling timing shown in 4 and 5 under Operation in section 14.3.5. Therefore, a transfer
request is regarded as having been issued until a stop request is detected, and the
corresponding processing is executed before the DMAC stops.
3. Burst Mode, Level Detection (External Request)
The delay between the point at which a transfer end condition is satisfied and the point at
which the DMAC actually stops is the same as in cycle steal mode. As in the case of burst
mode with edge detection, the timing of stop request (DE = 0 in CHCR, DME = 0 in DMAOR)
sampling is the same as the transfer request sampling timing shown in 2 and 3 under Operation
in section 14.3.5. Therefore, a transfer request is regarded as having been issued until a stop
request is detected, and the corresponding processing is executed before the DMAC stops.
4. Transfer Suspension Bus Timing
Transfer suspension is executed on completion of processing for one transfer unit. In dual
address mode transfer, write cycle processing is executed even if a transfer end condition is
satisfied during the read cycle, and the transfers covered in 1, 2, and 3 above are also executed
before operation is suspended.
Rev. 6.0, 07/02, page 541 of 986
Conditions for Ending Transfer on Individual Channels: Transfer ends on the corresponding
channel when either of the following conditions is satisfied:
• The value in the DMA transfer count register (DMATCR) reaches 0.
• The DE bit in the DMA channel control register (CHCR) is cleared to 0.
1. End of transfer when DMATCR = 0
When the DMATCR value reaches 0, DMA transfer ends on the corresponding channel and
the transfer end flag (TE) in CHCR is set. If the interrupt enable bit (IE) is set at this time, an
interrupt (DMTE) request is sent to the CPU.
Transfer ending when DMATCR = 0 does not follow the procedures described in 1, 2, 3, and 4
in section 14.3.6.
2. End of transfer when DE = 0 in CHCR
When the DMA enable bit (DE) in CHCR is cleared, DMA transfer is suspended on the
corresponding channel. The TE bit is not set in this case. Transfer ending in this case follows
the procedures described in 1, 2, 3, and 4 in section 14.3.6.
Conditions for Ending Transfer Simultaneously on All Channels: Transfer ends on all
channels simultaneously when either of the following conditions is satisfied:
• The address error bit (AE) or NMI flag (NMIF) in the DMA operation register (DMAOR) is
set to 1.
• The DMA master enable bit (DME) in DMAOR is cleared to 0.
1. End of transfer when AE = 1 in DMAOR
If the AE bit in DMAOR is set to 1 due to an address error, DMA transfer is suspended on all
channels in accordance with the conditions in 1, 2, 3, and 4 in section 14.3.6, and the bus is
passed to the CPU. Therefore, when AE is set to 1, the values in the DMA source address
register (SAR), DMA destination address register (DAR), and DMA transfer count register
(DMATCR) indicate the addresses for the DMA transfer to be performed next and the
remaining number of transfers. The TE bit is not set in this case. Before resuming transfer, it is
necessary to make a new setting for the channel that caused the address error, then write 0 to
the AE bit after first reading 1 from it. Acceptance of external requests is suspended while AE
is set to 1, so a DMA transfer request must be reissued when resuming transfer. Acceptance of
internal requests is also suspended, so when resuming transfer, the DMA transfer request
enable bit for the relevant on-chip peripheral module must be cleared to 0 before the new
setting is made.
Rev. 6.0, 07/02, page 542 of 986
2. End of transfer when NMIF = 1 in DMAOR
If the NMIF bit in DMAOR is set to 1 due to an NMI interrupt, DMA transfer is suspended on
all channels in accordance with the conditions in 1, 2, 3, and 4 in section 14.3.6, and the bus is
passed to the CPU. Therefore, when NMIF is set to 1, the values in the DMA source address
register (SAR), DMA destination address register (DAR), and DMA transfer count register
(DMATCR) indicate the addresses for the DMA transfer to be performed next and the
remaining number of transfers. The TE bit is not set in this case. Before resuming transfer after
NMI interrupt handling is completed, 0 must be written to the NMIF bit after first reading 1
from it. As in the case of AE being set to 1, acceptance of external requests is suspended while
NMIF is set to 1, so a DMA transfer request must be reissued when resuming transfer.
Acceptance of internal requests is also suspended, so when resuming transfer, the DMA
transfer request enable bit for the relevant on-chip peripheral module must be cleared to 0
before the new setting is made.
3. End of transfer when DME = 0 in DMAOR
If the DME bit in DMAOR is cleared to 0, DMA transfer is suspended on all channels in
accordance with the conditions in 1, 2, 3, and 4 in section 14.3.6, and the bus is passed to the
CPU. The TE bit is not set in this case. When DME is cleared to 0, the values in the DMA
source address register (SAR), DMA destination address register (DAR), and DMA transfer
count register (DMATCR) indicate the addresses for the DMA transfer to be performed next
and the remaining number of transfers. When resuming transfer, DME must be set to 1.
Operation will then be resumed from the next transfer.
Rev. 6.0, 07/02, page 543 of 986
14.4
Examples of Use
14.4.1
Examples of Transfer between External Memory and an External Device with
DACK
Examples of transfer of data in external memory to an external device with DACK using DMAC
channel 1 are considered here.
Table 14.10 shows the transfer conditions and the corresponding register settings.
Table 14.10 Conditions for Transfer between External Memory and an External Device
with DACK, and Corresponding Register Settings
Transfer Conditions
Register
Set Value
Transfer source: external memory
SAR1
H'0C000000
Transfer source: external device with DACK
DAR1
(Accessed by DACK)
Number of transfers: 32
DMATCR1
H'00000020
Transfer source address: decremented
CHCR1
H'000022A5
DMAOR
H'00000201
Transfer destination address: (setting invalid)
Transfer request source: external pin ('5(44)
edge detection
Bus mode: burst
Transfer unit: word
No interrupt request at end of transfer
Channel priority order: 2 > 0 > 1 > 3
Rev. 6.0, 07/02, page 544 of 986
14.5
On-Demand Data Transfer Mode (DDT Mode)
14.5.1
Operation
Setting the DDT bit to 1 in DMAOR causes a transition to on-demand data transfer mode (DDT
mode). In DDT mode, it is possible to specify direct single address mode transfer to channel 0 via
the data bus and DDT module, and simultaneously issue a transfer request, using the '%5(4,
%$9/, 75, 7'$&., and ID [1:0] signals between an external device and the DMAC. Figure
14.23 shows a block diagram of the DMAC, DDT, BSC, and an external device (with '%5(4,
%$9/, 75, 7'$&., ID [1:0], and D [63:0] = DTR pins).
DMAC
DDT
Memory
SAR0
DAR0
DREQ0–3
ddtmode tdack id[1:0]
Request
ddtmode controller
bavl
Address bus
CHCR0
Data bus
Data
buffer
DMATCR0
DTR
BSC
Data buffer
External
device (with
,
,
,
,
and ID [1:0])
FIFO or
memory
ID[1:0]
Figure 14.23 On-Demand Transfer Mode Block Diagram
For channels 0 to 3, after making the settings for normal DMA transfer using the CPU, a transfer
request can be issued from an external device using the '%5(4, %$9/, 75, 7'$&., ID [1:0],
and D [63:0] = DTR signals (handshake protocol using the data bus). A transfer request can also
be issued simply by asserting 75, without using the external bus (handshake protocol without use
of the data bus). For channel 2, after making the DMA transfer settings in the normal way, a
transfer request can be issued directly from an external device (with '%5(4, %$9/, 75,
7'$&., ID [1:0], and D [63:0] = DTR pins) by asserting '%5(4 and 75 simultaneously.
Note: DTR format = Data transfer request format
In DDT mode, there is a choice of five modes for performing DMA transfer.
Rev. 6.0, 07/02, page 545 of 986
1. Normal data transfer mode (channel 0)
%$9/ (the data bus available signal) is asserted in response to '%5(4 (the data bus request
signal) from an external device. Two CKIO-synchronous cycles after %$9/ is asserted, the
external data bus drives the data transfer setting command (DTR command) in synchronization
with 75 (the transfer request signal). The initial settings are then made in the DMAC channel
0 control register, and the DMA transfer is processed.
2. Normal data transfer mode (channels 1 to 3)
In this mode, the data transfer settings are made in the DMAC from the CPU, and DMA
transfer requests only are performed from the external device.
As in 1 above, '%5(4 is asserted from the external device and the external bus is secured,
then the DTR format is driven.
The transfer request channel can be specified by means of the two ID bits in the DTR format.
3. Handshake protocol using the data bus (valid for channel 0 only)
This mode is only valid for channel 0.
After the initial settings have been made in the DMAC channel 0 control register by means of
normal data transfer mode (channel 0) in the SH7750, or after the initial settings have been
made in the DMAC channel 0 control register from the CPU or by means of normal data
transfer mode (channel 0) in the SH7750S, the DDT module asserts a data transfer request for
the DMAC by setting DTR format ID = 00, MD = 00, and SZ ≠ 101 or 110, and driving the
DTR format.
4. Handshake protocol without use of the data bus
The DDT module includes a function for recording the previously asserted request channel. By
using this function, it is possible to assert a transfer request for the channel for which a request
was asserted immediately before, by asserting 75 only from an external device after a transfer
request has once been made to the channel for which an initial setting has been made in the
DMAC control register (DTR format and data transfer setting by the CPU in the DMAC).
5. Direct data transfer mode (valid for channel 2 only)
A data transfer request can be asserted for channel 2 by asserting '%5(4 and 75
simultaneously from an external device after the initial settings have been made in the DMAC
channel 2 control register.
Rev. 6.0, 07/02, page 546 of 986
14.5.2
Pins in DDT Mode
Figure 14.24 shows the system configuration in DDT mode.
/DREQ0
/DRACK0
/DREQ1
/DACK0
SH7750 Series
ID1, ID0/DRAK1, DACK1
External device
CLK
D63–D0
A25–A0, RAS, CAS, WE, DQMn, CKE
Synchronous
DRAM
Figure 14.24 System Configuration in On-Demand Data Transfer Mode
• '%5(4:
'%5(4 Data bus release request signal for transmitting the data transfer request format (DTR
format) or a DMA request from an external device to the DMAC
If there is a wait for release of the data bus, an external device can have the data bus released
by asserting '%5(4. When '%5(4 is accepted, the BSC asserts %$9/.
• %$9/:
%$9/ Data bus D63–D0 release signal
Assertion of %$9/ means that the data bus will be released two cycles later.
The SH-4 does not switch the data pins to output status for a total of three cycles: the cycle in
which the data bus is released and the cycles preceding and following it.
• 75:
75 Transfer request signal
Assertion of 75 has the following different meanings.
In normal data transfer mode (channel 0), 75 is asserted, and at the same time the DTR
format is output, two cycles after %$9/ is asserted.
In the case of the handshake protocol without use of the data bus, asserting 75 enables a
transfer request to be issued for the channel for which a transfer request was made
immediately before. This function can be used only when %$9/ is not asserted two cycles
earlier.
In the case of direct data transfer mode (valid only for channel 2), a direct transfer request
can be made to channel 2 by asserting '%5(4 and 75 simultaneously.
Rev. 6.0, 07/02, page 547 of 986
• 7'$&.:
7'$&. Reply strobe signal for external device from DMAC
The assert timing of this signal is the same as the DACKn assert timing of the memory
interfaces.
Note that it is a low active signal.
• ID1, ID0: Channel number notification signals
00: Channel 0 (means demand data transfer)
01: Channel 1
10: Channel 2
11: Channel 3
Data Transfer Request Format
63
61 60 59
SZ
ID
57
MD
55
48
COUNT
(Reserved)
31
0
ADDRESS
R/W
Figure 14.25 Data Transfer Request Format
The data transfer request format (DTR format) consists of 64 bits, with connection to D[63:0]. In
the case of normal data transfer mode (channel 0, except channel 0) and the handshake protocol
using the data bus, the transfer data size, read/write access, channel number, transfer request
mode, number of transfers, and transfer source or transfer destination address are specified. A
specification in bits 47–32 is invalid.
In the SH7750, only single address mode can be set in normal data transfer mode (channel 0).
With the DTR format, DS = (0: MD = 10, 11, 1: MD = 01), RL = 0, AL = 0, DM[1:0] = 01,
SM[1:0] = 01, RS[3:0] = (0010: R/W = 0, 0011: R/W = 1), TM = (0: MD = 11, 1: MD = 01, 10),
TS[2:0] = (SZ), and IE = 0 settings are made in DMA channel control register 0, COUNT is set in
transfer count register 0, and ADDRESS is set in source/destination address register 0. Therefore,
in DDT mode, the above control registers cannot be written to by the CPU, but can be read.
In the SH7750S, DMAC control registers CHCR0, SAR0, DAR0, and DMATCR0 can be written
to and read by the CPU even in normal data transfer mode (channel 0). Caution is necessary in this
case, as a DMAC control register written to by the CPU will be overwritten by a subsequent
transfer request (MD[1:0] = 01, 10, or 11) using the DTR format.
Bits 63 to 61: Transmit Size (SZ2–SZ0)
• 000: Byte size (8-bit) specification
• 001: Word size (16-bit) specification
• 010: Longword size (32-bit) specification
Rev. 6.0, 07/02, page 548 of 986
• 011: Quadword size (64-bit) specification
• 100: 32-byte block transfer specification
• 101: Setting prohibited
• 110: Request queue clear specification
• 111: Transfer end specification
Bit 60: Read/Write (R/W)
• 0: Memory read specification
• 1: Memory write specification
Bits 59 and 58: Channel Number (ID1, ID0)
• 00: Channel 0 (demand data transfer)
• 01: Channel 1
• 10: Channel 2
• 11: Channel 3
Bits 57 and 56: Transfer Request Mode (MD1, MD0)
• 00: Handshake protocol (data bus used)
• 01: Burst mode (edge detection) specification
• 10: Burst mode (level detection) specification
• 11: Cycle steal mode specification
Bits 55 to 48: Transfer Count (COUNT7–COUNT0)
• Transfer count: 1 to 255
• 00000000: Maximum number of transfers (16M)
Bits 47 to 32: Reserved
Bits 31 to 0: Address (ADDRESS31–ADDRESS0)
• R/W = 0: Transfer source address specification
• R/W = 1: Transfer destination address specification
Notes: 1. Only the ID field is valid for channels 1 to 3.
2. To start DMA transfer by means of demand data transfer on channel 0, the initial value
of MD in the DTR format must be 01, 10, or 11.
3. The COUNT field is ignored if MD = 00.
4. In edge-sense burst mode, DMA transfer is executed continuously. In level-sense burst
mode and cycle steal mode, a handshake protocol is used to transfer each unit of data.
5. The maximum number of transfers can be specified by setting COUNT = 0 as DTR
format initialization data. If the amount of data to be transferred is unknown, set
COUNT = 0, start DMA transfer, and transfer the DTR format (ID = 00, MD ≠ 00, SZ
Rev. 6.0, 07/02, page 549 of 986
= 111) when the required amount of data has been transferred. This will terminate
DMA transfer on channel 0.
In this case, the TE bit in DMA channel control register 0 is not set, but transfer cannot
be restarted.
6. When port functions are used (BCR2.PORTEN = 1) and DDT mode is selected, input
the DTR format for D[63:52] and D[31:0]. In this case, if ID[1:0] = 00, input MD[1:0]
and SZ ≠ 101, 110.
14.5.3
Transfer Request Acceptance on Each Channel
On channel 0, a DMA data transfer request can be made by means of the DTR format. No further
transfer requests are accepted between DTR format acceptance and the end of the data transfer.
On channels 1 to 3, output a transfer request from an external device by means of the DTR format
(ID = 01, 10, or 11) after making DMAC control register settings in the same way as in normal
DMA mode. Each of channels 1 to 3 has a request queue that can accept up to four transfer
requests. When a request queue is full, the fifth and subsequent transfer requests will be ignored,
and so transfer requests must not be output.
When CHCR.TE = 1 when a transfer request remains in the request queue and a transfer is
completed, the request queue retains it. When another transfer request is sent at that time, the
transfer request is added to the request queue if the request queue is vacant.
Rev. 6.0, 07/02, page 550 of 986
Figure 14.26 Single Address Mode: Synchronous DRAM → External Device Longword Transfer
SDRAM auto-precharge Read bus cycle, burst (RCD[1:0] = 01, CAS latency = 3,
TPC[2:0] = 001)
Rev. 6.0, 07/02, page 551 of 986
Tb
Tg
tRASD
Tj
Tk
Tl
tAD
Tm
Tn
ID1–ID0
D63–D0
(READ)
DQMn
RD/
n
tBAVD
tTRS
tBAVD
tRASD
tTRH
To
Tp
tRDS
tIDD
tTDAD
tBSD
tCASD2
tDQMD
[2CKIO cycle - tDTRS] (18nsF100MHz)
DTR1CKIO cycle (10nsF100MHz)
tCASD2
tRWD
tCSD
c1
tDTRH
Ti
Row
Th
Address
tDTRS
Tf
H/L
Te
Row
tDBQH
Td
Precharge-sel
Tc
tAD
Row
tDBQS
Ta
BANK
CKIO
tBSD
tRDH
c2
Ts
c3
tDQMD
Tr
DMAC Channel
c1
Tq
c4
Tu
tIDD
tTDAD
tCSD
tAD
Tt
Tv
Tw
Figure 14.27 Single Address Mode: External Device → Synchronous DRAM Longword Transfer
SDRAM auto-precharge Write bus cycle, burst (RCD[1:0] = 01, TRWL[2:0] = 101,
TPC[2:0] = 001)
Rev. 6.0, 07/02, page 552 of 986
Tg
tRASD
Tj
Tk
Tl
tAD
Tm
Tn
ID1–ID0
D63–D0
(READ)
DQMn
RD/
tBAVD
tTRS
tBAVD
tBSD
tTRH
tIDD
tCASD2
tBSD
tWDD
c2
DMAC Channel
tTDAD
c1
To
tRWD
tDQMD
[2CKIO cycle - tDTRS] (18ns F100MHz)
DTR 1CKIO cycle (10ns 100MHz)
tWDD
tCASD2
tRASD
tRWD
tCSD
c1
tDTRH
Ti
Row
Th
Address
tDTRS
Tf
H/L
Te
Row
tDBQH
Td
Precharge-sel
Tc
tAD
Row
tDBQS
Tb
BANK
CKIO
Ta
c4
tIDD
tTDAD
c3
Tp
Tr
tDQMD
tCSD
tAD
Tq
Ts
Tt
Tu
Tv
Tw
Figure 14.28 Dual Address Mode/Synchronous DRAM → SRAM Longword Transfer
Rev. 6.0, 07/02, page 553 of 986
Tb
Tg
tRASD
Tj
Tk
Tl
tAD
Tm
Tn
ID1-ID0
D63-D0
(READ)
DQMn
RD/
tBAVD
tTRS
tBAVD
tRASD
tTRH
To
Tp
tRDS
tBSD
tCASD2
tDQMD
[2CKIO cycles - tDTRS] (= 18ns: 100MHz)
DTR= 1CKIO cycle (= 10ns: 100MHz)
tCASD2
tRWD
tCSD
c1
tDTRH
Ti
Row
Th
Addr
tDTRS
Tf
H/L
Te
Row
tDBQH
Td
Precharge-sel
Tc
tAD
Row
tDBQS
Ta
BANK
CKIO
tBSD
tRDH
c2
Ts
c3
tDQMD
Tr
DMAC Channel
c1
Tq
c4
tCSD
tAD
Tt
DMAC Channel
tTDAD
tTDAD
CLK
A25–A0
D63–D0
RA
CA
D0
DTR
RAS,
CAS, WE
BA
D1
D2
D3
RD
00
ID1, ID0
Figure 14.29 Single Address Mode/Burst Mode/External Bus → External Device 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer
CLK
RA
A25–A0
D63–D0
D0
DTR
RAS,
CAS, WE
CA
BA
D1
D2
D3
D4
D5
WT
ID1, ID0
Figure 14.30 Single Address Mode/Burst Mode/External Device → External Bus 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer
Rev. 6.0, 07/02, page 554 of 986
CLK
A25–A0
D63–D0
RAS,
CAS, WE
RA
CA
DTR
CA
D0
BA
RD
CA
D1
RD
RD
DQMn
ID1, ID0
00
00
Figure 14.31 Single Address Mode/Burst Mode/External Bus → External Device 32-Bit
Transfer/Channel 0 On-Demand Data Transfer
Rev. 6.0, 07/02, page 555 of 986
CLK
RA
A25–A0
D63–D0
RAS,
CAS, WE
DTR
BA
CA
CA
D0
D1
WT
WT
DQMn
ID1, ID0
Figure 14.32 Single Address Mode/Burst Mode/External Device → External Bus 32-Bit
Transfer/Channel 0 On-Demand Data Transfer
Rev. 6.0, 07/02, page 556 of 986
CLK
A25–A0
D63–D0
CA
DTR
MD = 10 or 11
CMD
D0
CA
D1
D2
D3
DTR
MD = 00
WT
D0
D1
WT
ID1, ID0
Start of data transfer
Next transfer request
Figure 14.33 Handshake Protocol Using Data Bus
(Channel 0 On-Demand Data Transfer)
Rev. 6.0, 07/02, page 557 of 986
CLK
A25–A0
D63–D0
CA
DTR
MD = 10 or 11
CMD
D0
CA
D1
D2
D3
D0
WT
WT
ID1, ID0
Start of data transfer
Next transfer request
Figure 14.34 Handshake Protocol without Use of Data Bus
(Channel 0 On-Demand Data Transfer)
Rev. 6.0, 07/02, page 558 of 986
D1
D2
D3
CLK
RA
A25–A0
CA
D0
D63–D0
RAS, CAS,
WE
BA
D1
D2
D3
RD
Figure 14.35 Read from Synchronous DRAM Precharge Bank
CLK
Transfer requests can be accepted
RA
A25–A0
CA
D63–D0
RAS, CAS,
WE
D0
PCH
BA
D1
D2
D3
RD
Figure 14.36 Read from Synchronous DRAM Non-Precharge Bank (Row Miss)
Rev. 6.0, 07/02, page 559 of 986
CLK
A25–A0
CA
D0
D63–D0
RAS, CAS,
WE
D1
D2
D3
RD
Figure 14.37 Read from Synchronous DRAM (Row Hit)
CLK
A25–A0
RA
D0
D63–D0
RAS, CAS,
WE
CA
BA
D1
D2
D3
WT
Figure 14.38 Write to Synchronous DRAM Precharge Bank
Rev. 6.0, 07/02, page 560 of 986
CLK
Transfer requests can be accepted
RA
A25–A0
CA
D63–D0
RAS, CAS,
WE
D0
BA
PCH
D1
D2
D3
WT
Figure 14.39 Write to Synchronous DRAM Non-Precharge Bank (Row Miss)
CLK
A25–A0
CA
D63–D0
D0
RAS, CAS,
WE
WT
D1
D2
D3
Figure 14.40 Write to Synchronous DRAM (Row Hit)
Rev. 6.0, 07/02, page 561 of 986
CLK
RA
A25–A0
D63–D0
RAS,
CAS, WE
ID1, ID0
CA
DTR
D0
BA
D1
D2
RD
00
Figure 14.41 Single Address Mode/Burst Mode/External Bus → External Device 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer
Rev. 6.0, 07/02, page 562 of 986
DMA Operation Register (DMAOR)
31
15
9
8
4
2
PR[1:0]
DDT
AE
NMIF
COD
(SH7750S)
DDT: 0: Normal DMA mode
1: On-demand data transfer mode
1 0
DME
Figure 14.42 DDT Mode Setting
CLK
No DMA request sampling
A25–A0
D63–D0
CA
DTR
MD = 01
CMD
D0
WT
CA
D1
D2
D3
D0
D1
D2
D3 D1
D2
D3
WT
ID1, ID0
Start of data transfer
Figure 14.43 Single Address Mode/Burst Mode/Edge Detection/
External Device → External Bus Data Transfer
Rev. 6.0, 07/02, page 563 of 986
CLK
Wait for next DMA request
CA
A25–A0
D63–D0
CA
DTR
MD = 10
D0
CMD
D1 D2 D3
RD
D0 D1 D2
D3
RD
ID1, ID0
Start of data transfer
Figure 14.44 Single Address Mode/Burst Mode/Level Detection/
External Bus → External Device Data Transfer
CLK
A25–A0
D63–D0
CMD
CA
CA
D0
DTR
MD = 01
RD
CA
Idle cycle
RD
D2
Idle cycle
D3
Idle cycle
RD
DQMn
ID1, ID0
Figure 14.45 Single Address Mode/Burst Mode/Edge Detection/Byte, Word, Longword,
Quadword/External Bus → External Device Data Transfer
Rev. 6.0, 07/02, page 564 of 986
CLK
A25–A0
D63–D0
CMD
DQMn
CA
DTR
MD = 01
CA
CA
D0
D1
D3
WT
WT
WT
Idle cycle
Idle cycle
Idle cycle
ID1, ID0
Figure 14.46 Single Address Mode/Burst Mode/Edge Detection/Byte, Word, Longword,
Quadword/External Device → External Bus Data Transfer
Rev. 6.0, 07/02, page 565 of 986
CLK
A25–A0
D63–D0
RA
CA
DTR
D0
D1
D2
D3
ID = 1, 2, or 3
RAS,
CAS, WE
ID1, ID0
BA
RD
01 or 10 or 11
Figure 14.47 Single Address Mode/Burst Mode/32-Byte Block Transfer/DMA Transfer
Request to Channels 1–3 Using Data Bus
Rev. 6.0, 07/02, page 566 of 986
CLK
A25–A0
RA
CA
D63–D0
RAS,
CAS, WE
D0
BA
D1
D2
D3
D4
D5
D6
D7
RD
ID1, ID0
10
No DTR cycle, so requests can be made at any time
Figure 14.48 Single Address Mode/Burst Mode/32-Byte Block Transfer/
External Bus → External Device Data Transfer/
Direct Data Transfer Request to Channel 2 without Using Data Bus
Rev. 6.0, 07/02, page 567 of 986
Four requests can be queued
Handshaking is necessary
to send additional requests
CLK
1st
2nd 3rd
5th
4th
No more requests
A25–A0
RA
CA
D0
D63–D0
RAS,
CAS, WE
BA
RD
CA
CA
D1
RD
D2
D3
D0
D1 D2
D3
D0
RD
D1
NOP
ID1, ID0
Must be ignored
(no request transmitted)
Figure 14.49 Single Address Mode/Burst Mode/External Bus → External Device Data
Transfer/Direct Data Transfer Request to Channel 2
Rev. 6.0, 07/02, page 568 of 986
D2
Four requests can be queued
Handshaking is necessary
to send additional requests
CLK
1st 2nd 3rd
A25–A0
5th
4th
RA
D0
D63–D0
RAS,
CAS, WE
CA
BA
WT
CA
CA
D1
D2
D3
D0
WT
D1
D2
D3
D0
WT
CA
D1
D2
D3
WT
ID1, ID0
Must be ignored
(no request transmitted)
Figure 14.50 Single Address Mode/Burst Mode/External Device → External Bus Data
Transfer/Direct Data Transfer Request to Channel 2
Rev. 6.0, 07/02, page 569 of 986
Handshaking is necessary
to send additional requests
Four requests can be queued
CLK
1st 2nd 3rd
A25–A0
5th
4th
CA
D0
D63–D0
RAS,
CAS, WE
CA
RD
D1
RD
CA
D2
D3
D0
D1
RD
CA
D2
D3
D0
D1
D2
RD
ID1, ID0
Must be ignored
(no request transmitted)
Figure 14.51 Single Address Mode/Burst Mode/External Bus → External Device Data
Transfer (Active Bank Address)/Direct Data Transfer Request to Channel 2
Rev. 6.0, 07/02, page 570 of 986
Four requests can be queued
Handshaking is necessary
to send additional requests
CLK
1st 2nd 3rd
4th
5th
A25–A0
CA
D63–D0
D0
RAS,
CAS, WE
WT
CA
CA
D1
D2
D3
D0
D1
D2
D3
D0
CA
D1
WT
WT
D2
D3
WT
ID1, ID0
Must be ignored
(no request transmitted)
Figure 14.52 Single Address Mode/Burst Mode/External Device → External Bus Data
Transfer (Active Bank Address)/Direct Data Transfer Request to Channel 2
14.5.4
Notes on Use of DDT Module
1. Normal data transfer mode (channel 0)
Initial settings for channel 0 demand transfer must be DTR.ID = 00 and DTR.MD = 01, 10, or
11. In this case, only single address mode can be set for channel 0.
2. Normal data transfer mode (channels 1 to 3)
If a setting of DTR.ID = 01, 10, or 11 is made, DTR.MD will be ignored.
3. Handshake protocol using the data bus (valid on channel 0 only)
a. The handshake protocol using the data bus can be executed only on channel 0. (Set
DTR.ID = 00, DTR.MD = 00, DTR.SZ ≠ 101 or 110. Operation is not guaranteed if
settings of DTR.ID = 00, DTR.MD = 00, and DTR.SZ = 101 or 110 are made.)
b. If, during execution of the handshake protocol using the data bus for channel 0, a request is
input for one of channels 1 to 3, and after that DMA transfer is executed settings of
DTR.ID = 00, DTR.MD = 00, and DTR, SZ ≠ 101.110 are input in the handshake protocol
using the data bus, a transfer request will be asserted for channel 0.
Rev. 6.0, 07/02, page 571 of 986
c. In the SH7750S and SH7750R, initial settings can be made in the DMAC channel 0 control
register from the CPU (possible settings are CHCR0.RS = 0000, 0010, or 0011). If settings
of DTR.ID = 00, DTR.MD = 00, and DTR.SZ ≠ 101 or 110 are subsequently input, a
transfer request to channel 0 will be asserted.
4. Handshake protocol without use of the data bus
a. With the handshake protocol without use of the data bus, a DMA transfer request can be
input to the DMAC again for the channel for which transfer was requested immediately
before by asserting 75 only.
b. When using the handshake protocol without use of the data bus, first make the necessary
settings in the DMAC control registers.
c. When not using the handshake protocol without use of the data bus, if 75 only is asserted
without outputting DTR, a request will be issued for the channel for which DMA transfer
was requested immediately before. Also, if the first DMA transfer request after a power-on
reset is input by asserting 75 only, it will be ignored and the DMAC will not operate.
d. If 75 only is asserted by means of the handshake protocol without use of the data bus and a
DMA transfer request is input when channel 0 DMA transfer has ended and CHCR0.TE =
1, the DMAC will freeze. Before issuing a DMA transfer request, the TE flag must be
cleared by writing CHCR0.TE = 0 after reading CHCR0.TE = 1.
5. Direct data transfer mode (valid on channel 2 only)
a. If a DMA transfer request for channel 2 is input by simultaneous assertion of '%5(4 and
75 during DMA transfer execution with the handshake protocol without use of the data
bus, it will be accepted if there is space in the DDT channel 2 request queue.
b. In direct data transfer mode (with '%5(4 and 75 asserted simultaneously), '%5(4 is not
interpreted as a bus arbitration signal, and therefore the %$9/ signal is never asserted.
6. Request queue transfer request acceptance
a. The DDT has four request queues for each of channels 1 to 3. When these request queues
are full, a DMA transfer request from an external device will be ignored.
b. If a DMA transfer request for channel 0 is input during execution of a channel 0 DMA bus
cycle, the DDT will ignore that request. Confirm that channel 0 DMA transfer has finished
(burst mode) or that a DMA bus cycle is not in progress (cycle steal mode).
7. DTR format
a. The DDT module processes DTR.ID, DTR.MD, and DTR.SZ as follows.
When DTR.ID= 00
•
MD = 00, SZ ≠ 101, 110: Handshake protocol using the data bus
•
MD ≠ 00, SZ = 111: CHCR0.DE = 0 setting (DMA transfer end request)
MD ≠ 10, SZ = 110: DDT request queue clear
When DTR.ID ≠ 00
•
•
Transfer request to channels 1—3 (items other than ID ignored)
Rev. 6.0, 07/02, page 572 of 986
8. Data transfer end request
a. A data transfer end request (DTR.ID = 00, MD ≠ 00, SZ = 111) cannot be accepted during
channel 0 DMA transfer. Therefore, if edge detection and burst mode are set for channel 0,
transfer cannot be ended midway.
b. When a transfer end request (DTR.ID = 00, MD ≠ 00, SZ = 111) is accepted, the values set
in CHCR0, SAR0, DAR0, and DMATCR0 are retained. With the SH7750, execution
cannot be restarted from an external device in this case. To restart execution in the
SH7750S and SH7750R, set CHCR0.DE = 1 with an MOV instruction.
9. Request queue clearance
a. When settings of DTR.ID = 00, DTR.MD = 10, and SZ = 110 are accepted by the DDT in
normal data transfer mode, DDT channel 0 requests and channel 1 to 3 request queues are
all cleared. All external requests held on the DMAC side are also cleared.
b. In case 4-d, the DMAC freeze state can be cleared.
c. When settings of DMAOR.DDT = 1, DTR.ID = 00, DTR.MD = 10, and SZ = 110 are
accepted by the DDT in case 11, the DMAC freeze state can be cleared.
10. '%5(4 assertion
a. After '%5(4 is asserted, do not assert '%5(4 again until %$9/ is asserted, as this will
result in a discrepancy between the number of '%5(4 and %$9/ assertions.
b. The %$9/ assertion period due to '%5(4 assertion is one cycle.
If a row address miss occurs in a read or write in the non-precharged bank during
synchronous DRAM access, %$9/ is asserted for a number of cycles in accordance with
the RAS precharge interval set in BSC.MCR.TCP.
c. It takes one cycle for '%5(4 to be accepted by the DMAC after being asserted by an
external device. If a row address miss occurs at this time in a read or write in the nonprecharged bank during synchronous DRAM access, and %$9/ is asserted, the '%5(4
signal asserted by the external device is ignored. Therefore, %$9/ is not asserted again
due to this signal.
11. Clearing DDT mode
Check that DMA transfer is not in progress on any channel before setting the DMAOR.DDT
bit. If the DMAOR.DDT setting is changed from 1 to 0 during DMA transfer in DDT mode,
the DMAC will freeze.
This also applies when switching from normal DMA mode (DMAOR.DDT = 0) to DDT
mode.
12. Confirming DMA transfer requests and number of transfers executed
The channel associated with a DMA bus cycle being executed in response to a DMA transfer
request can be confirmed by determining the level of external pins ID1 and ID0 at the rising
edge of the CKIO clock while 7'$&. is asserted.
(ID = 00: channel 0; ID = 01: channel 1; ID = 10: channel 2; ID = 11: channel 3)
Rev. 6.0, 07/02, page 573 of 986
14.6
Configuration of the DMAC (SH7750R)
14.6.1
Block Diagram of the DMAC
Figure 14.53 is a block diagram of the DMAC in the SH7750R.
On-chip
peripheral
module
Internal bus
Peripheral bus
DMAC module
Count control
SARn
Registr control
DARn
DMATCRn
Activation
control
CHCRn
DMAOR
TMU
SCI, SCIF
Request
priority
control
queclr0–7
Bus
interface
DACK0, DACK1
DRAK0, DRAK1
External address/on-chip
peripheral module address
dmaqueclr0-7
,
32B data
buffer
/
D[63:0]
External bus
Bus state
controller
8
Request
SAR0, DAR0, DMATCR0,
CHCR0 only
DDT module
DTR command buffer
Request controller
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
DBREQ
DDTMODE
BAVL
DDTD
ID[1:0]
48 bits
id[2:0]
tdack
DMAORn:
SARn:
DARn:
DMATCRn:
CHCRn:
DMAC operation register
DMAC source address register
DMAC destination address register
DMAC transfer count register
DMAC channel control register
n = 0 to 7
Figure 14.53 Block Diagram of the DMAC
Rev. 6.0, 07/02, page 574 of 986
14.6.2
Pin Configuration (SH7750R)
Tables 14.11 and 14.12 show the pin configuration of the DMAC.
Table 14.11 DMAC Pins
Channel
Pin Name
Abbreviation
I/O
Function
0
DMA transfer
request
'5(43
Input
DMA transfer request input from
external device to channel 0
'5(4 acceptance
confirmation
DRAK0
Output
Acceptance of request for DMA
transfer from channel 0 to external
device
Notification to external device of start
of execution
1
DMA transfer end
notification
DACK0
Output
Strobe output to external device of
DMA transfer request from channel 0
to external device
DMA transfer
request
'5(44
Input
DMA transfer request input from
external device to channel 1
'5(4 acceptance
confirmation
DRAK1
Output
Acceptance of request for DMA
transfer from channel 1 to external
device
Notification to external device of start
of execution
DMA transfer end
notification
DACK1
Output
Strobe output to external device of
DMA transfer request from channel 1
to external device
Rev. 6.0, 07/02, page 575 of 986
Table 14.12 DMAC Pins in DDT Mode
Pin Name
Abbreviation
I/O
Function
Data bus request
'%5(4
('5(43)
Input
Data bus release request from external
device for DTR format input
Data bus available
%$9//,'5
(DRAK0)
Output
Data bus release notification
Data bus can be used 2 cycles after
%$9/ is asserted
Notification of channel number to
external device at same time as 7'$&.
output
Transfer request signal
75
('5(44)
Input
If asserted 2 cycles after %$9/
assertion, DTR format is sent
Only 75 asserted: DMA request
'%5(4 and 75 asserted
simultaneously: Direct request to
channel 2
DMAC strobe
7'$&.
(DACK0)
Output
Reply strobe signal for external device
from DMAC
Channel number
notification
ID[1:0]
(DRAK1, DACK1)
Output
Notification of channel number to
external device at same time as 7'$&.
output
(ID [1] = DRAK1, ID [0] = DACK1)
Requests for DMA transfer from external devices are normally accepted only on channel 0
('5(43) and channel 1 ('5(44). In DDT mode, the %$9/ pin functions as both the data-busavailable pin and channel-number-notification (,'5) pin.
14.6.3
Register Configuration (SH7750R)
Table 14.13 shows the configuration of the DMAC’s registers. The DMAC of the SH7750R has a
total of 33 registers: four registers are assigned to each channel, and there is a control register for
the overall control of the DMAC.
Rev. 6.0, 07/02, page 576 of 986
Table 14.13 Register Configuration
Channel
Name
0
1
2
3
Abbreviation
Read/
Write
DMA source
address register 0
SAR0
R/W*
2
Undefined
H'FFA00000 H'1FA00000 32
DMA destination
address register 0
DAR0
R/W*
2
Undefined
H'FFA00004 H'1FA00004 32
DMA transfer
count register 0
DMATCR0 R/W*
2
Undefined
H'FFA00008 H'1FA00008 32
DMA channel
control register 0
CHCR0
R/W* * H'00000000 H'FFA0000C H'1FA0000C 32
DMA source
address register 1
SAR1
R/W
Undefined
H'FFA00010 H'1FA00010 32
DMA destination
address register 1
DAR1
R/W
Undefined
H'FFA00014 H'1FA00014 32
DMA transfer
count register 1
DMATCR1 R/W
Undefined
H'FFA00018 H'1FA00018 32
DMA channel
control register 1
CHCR1
R/W*
DMA source
address register 2
SAR2
R/W
Undefined
H'FFA00020 H'1FA00020 32
DMA destination
address register 2
DAR2
R/W
Undefined
H'FFA00024 H'1FA00024 32
DMA transfer
count register 2
DMATCR2 R/W
Undefined
H'FFA00028 H'1FA00028 32
DMA channel
control register 2
CHCR2
R/W*
DMA source
address register 3
SAR3
R/W
Undefined
H'FFA00030 H'1FA00030 32
DMA destination
address register 3
DAR3
R/W
Undefined
H'FFA00034 H'1FA00034 32
DMA transfer
count register 3
DMATCR3 R/W
Undefined
H'FFA00038 H'1FA00038 32
DMA channel
control register 3
CHCR3
R/W*
1
H'00000000 H'FFA0003C H'1FA0003C 32
DMAOR
R/W*
1
H'00000000 H'FFA00040 H'1FA00040 32
Com- DMA operation
mon register
Area 7
Initial Value P4 Address Address
Access
Size
1 2
1
1
H'00000000 H'FFA0001C H'1FA0001C 32
H'00000000 H'FFA0002C H'1FA0002C 32
Rev. 6.0, 07/02, page 577 of 986
Table 14.13 Register Configuration (cont)
Channel
Name
4
5
6
7
Abbreviation
Read/
Write
Area 7
Initial Value P4 Address Address
DMA source
address register 4
SAR4
R/W
Undefined
H'FFA00050 H'1FA00050 32
DMA destination
address register 4
DAR4
R/W
Undefined
H'FFA00054 H'1FA00054 32
DMA transfer
count register 4
DMATCR4 R/W
Undefined
H'FFA00058 H'1FA00058 32
DMA channel
control register 4
CHCR4
R/W*
DMA source
address register 5
SAR5
R/W
Undefined
H'FFA00060 H'1FA00060 32
DMA destination
address register 5
DAR5
R/W
Undefined
H'FFA00064 H'1FA00064 32
DMA transfer
count register 5
DMATCR5 R/W
Undefined
H'FFA00068 H'1FA00068 32
DMA channel
control register 5
CHCR5
R/W*
DMA source
address register 6
SAR6
R/W
Undefined
H'FFA00070 H'1FA00070 32
DMA destination
address register 6
DAR6
R/W
Undefined
H'FFA00074 H'1FA00074 32
DMA transfer
count register 6
DMATCR6 R/W
Undefined
H'FFA00078 H'1FA00078 32
DMA channel
control register 6
CHCR6
R/W*
DMA source
address register 7
SAR7
R/W
Undefined
H'FFA00080 H'1FA00080 32
DMA destination
address register 7
DAR7
R/W
Undefined
H'FFA00084 H'1FA00084 32
DMA transfer
count register 7
DMATCR7 R/W
Undefined
H'FFA00088 H'1FA00088 32
DMA channel
control register 7
CHCR7
R/W*
1
1
1
1
Access
Size
H'00000000 H'FFA0005C H'1FA0005C 32
H'00000000 H'FFA0006C H'1FA0006C 32
H'00000000 H'FFA0007C H'1FA0007C 32
H'00000000 H'FFA0008C H'1FA0008C 32
Notes: Longword access should be used for all control registers. If a different access width is
used, reads will return all 0s and writes will not be possible.
*1 Bit 1 of CHCR0–CHCR7 and bits 2 and 1 of DMAOR can only be written with 0 after
being read as 1, to clear the flags.
*2 In the SH7750R, writes from the CPU and writes from external I/O devices using the
DTR format are possible in DDT mode.
Rev. 6.0, 07/02, page 578 of 986
14.7
Register Descriptions (SH7750R)
14.7.1
DMA Source Address Registers 0–7 (SAR0–SAR7)
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
DMA source address registers 0–7 (SAR0–SAR7) are 32-bit readable/writable registers that
specify the source address for a DMA transfer. The functions of these registers are the same as on
the SH7750 or SH7750S. For more information, see section 14.2.1, DMA Source Address
Registers 0–3 (SAR0–SAR3).
14.7.2
DMA Destination Address Registers 0–7 (DAR0–DAR7)
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
DMA destination address registers 0–7 (DAR0–DAR7) are 32-bit readable/writable registers that
specify the destination address for a DMA transfer. The functions of these registers are the same
as on the SH7750 and SH7750S. For more information, see section 14.2.2, DMA Destination
Address Registers 0–3 (DAR0–DAR3).
Rev. 6.0, 07/02, page 579 of 986
14.7.3
DMA Transfer Count Registers 0–7 (DMATCR0–DMATCR7)
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
0
0
0
0
0
0
0
0
—
—
—
—
—
—
—
—
R/W:
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W R/W R/W R/W R/W R/W R/W R/W
R/W: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
DMA transfer count registers 0–7 (DMATCR0–DMATCR7) are 32-bit readable/writable registers
that specify the number of transfers in transfer operations for the corresponding channel (byte
count, word count, longword count, quadword count, or 32-byte count). Functions of these
registers are the same as the transfer-count registers of the SH7750 or SH7750S. For more
information, see section 14.2.3, DMA Transfer Count Registers 0–3 (DMATCR0–DMATCR3).
14.7.4
DMA Channel Control Registers 0–7 (CHCR0–CHCR7)
Bit:
31
30
29
28
27
26
25
24
SSA2 SSA1 SSA0 STC DSA2 DSA1 DSA0 DTC
Initial value:
0
0
0
0
0
0
0
0
R/W: R/W R/W R/W R/W R/W R/W R/W R/W
Bit:
15
14
13
12
11
10
9
8
DM1 DM0 SM1 SM0 RS3 RS2 RS1 RS0
Initial value:
0
0
0
0
0
0
0
0
23
22
21
20
19
18
17
16
—
—
—
—
DS
RL
AM
AL
0
0
0
0
0
0
0
0
R
R
R
R
7
6
5
4
TM
0
R/W (R/W) R/W (R/W)
3
TS2 TS1 TS0 QCL
0
0
0
0
2
1
0
IE
TE
DE
0
0
0
R/W: R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/(W) R/W R/(W) R/W
DMA channel control registers 0–7(CHCR0–CHCR7) are 32-bit readable/writable registers that
specify the operating mode, transfer method, etc., for each channel. Bits 31–28 and 27–24
correspond to the source address and destination address, respectively; these settings are only
valid when the transfer involves the CS5 or CS6 space and the relevant space has been specified as
a PCMCIA-interface space. In other cases, these bits should be cleared to 0. For more information
about the PCMCIA interface, see section 13.3.7, PCMCIA Interface, in section 13, Bus State
Controller.
Rev. 6.0, 07/02, page 580 of 986
No function is assigned to bits 18 and 16 of the CHCR2–CHCR7 registers. Writing to these bits of
the CHCR2–CHCR7 registers is invalid. If, however, a value is written to these bits, it should
always be 0. These bits are always read as 0.
These registers are initialized to H'00000000 by a power-on or manual reset. Their values are
retained in standby, sleep, and deep-sleep modes.
Bits 31 to 29—Source Address Space Attribute Specification (SSA2–SSA0): These bits specify
the space attribute for PCMCIA access. These bits are only valid in the case of page mapping to
PCMCIA connected to areas 5 and 6. For details of the settings, see the description of the SSA2SSA0 bits in section 14.2.4, DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bit 28—Source Address Wait Control Select (STC): Specifies CS5 or CS6 space wait control
for PCMCIA access. This bit selects the wait control register in the BSC that performs area 5 and
6 wait cycle control. For details of the settings, see the description of the STC bit in section 14.2.4,
DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bits 27 to 25—Destination Address Space Attribute Specification (DSA2–DSA0): These bits
specify the space attribute for PCMCIA access. These bits are only valid in the case of page
mapping to PCMCIA connected to areas 5 and 6. For details of the settings, see the description of
the DSA2–DSA0 bits in section 14.2.4, DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bit 24—Destination Address Wait Control Select (DTC): Specifies CS5 or CS6 space wait
cycle control for PCMCIA access. This bit selects the wait control register in the BSC that
performs area 5 and 6 wait cycle control. For details of the settings, see the description of the DTC
bit in section 14.2.4, DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bits 23 to 20—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 19—'5(4
'5(4 Select (DS): Specifies either low level detection or falling edge detection as the
sampling method for the '5(4 pin used in external request mode.
In normal DMA mode, this bit is valid only in CHCR0 and CHCR1. In DDT mode, it is valid in
CHCR0–CHCR7. For details of the settings, see the description of the DS bit in section 14.2.4,
DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bit 18—Request Check Level (RL): Selects whether the DRAK signal (that notifies an external
device of the acceptance of '5(4) is an active-high or active-low output.
This bit is valid only in CHCR0 and CHCR1 in normal mode, and is invalid in DDT mode. For
details of the settings, see the description of the RL bit in section 14.2.4, DMA Channel Control
Registers 0–3 (CHCR0–CHCR3).
Rev. 6.0, 07/02, page 581 of 986
Bit 17—Acknowledge Mode (AM): In dual address mode, selects whether DACK is output in the
data read cycle or write cycle. In single address mode, DACK is always output regardless of the
setting of this bit.
In normal DMA mode, this bit is valid only in CHCR0 and CHCR1. In DDT mode, it is valid in
CHCR0–CHCR7. (DDT mode: 7'$&.) For details of the settings, see the description of the AM
bit in section 14.2.4, DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bit 16—Acknowledge Level (AL): Specifies the DACK (acknowledge) signal as active-high or
active-low.
This bit is valid only in CHCR0 and CHCR1 in normal mode, and is invalid in DDT mode. For
details of the settings, see the description of the AL bit in section 14.2.4, DMA Channel Control
Registers 0–3 (CHCR0–CHCR3).
Bits 15 and 14—Destination Address Mode 1 and 0 (DM1, DM0): These bits specify
incrementing/decrementing of the DMA transfer destination address. The specification of these
bits is ignored when data is transferred from external memory to an external device in single
address mode. For details of the settings, see the description of the DM1 and DM0 bits in section
14.2.4, DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bits 13 and 12—Source Address Mode 1 and 0 (SM1, SM0): These bits specify
incrementing/decrementing of the DMA transfer source address. The specification of these bits is
ignored when data is transferred from an external device to external memory in single address
mode. For details of the settings, see the description of the SM1 and SM0 bits in section 14.2.4,
DMA Channel Control Registers 0–3 (CHCR0–CHCR3).
Bits 11 to 8—Resource Select 3 to 0 (RS3–RS0): These bits specify the transfer request source.
For details of the settings, see the description of the RS3–RS0 bits in section 14.2.4, DMA
Channel Control Registers 0–3 (CHCR0–CHCR3).
Bit 7—Transmit Mode (TM): Specifies the bus mode for transfer. For details of the settings, see
the description of the TM bit in section 14.2.4, DMA Channel Control Registers 0–3 (CHCR0–
CHCR3).
Bits 6 to 4—Transmit Size 2 to 0 (TS2–TS0): These bits specify the transfer data size (access
size). For details of the settings, see the description of the TS2–TS0 bits in section 14.2.4, DMA
Channel Control Registers 0–3 (CHCR0–CHCR3).
Bit 3
Request Queue Clear (QCL): Writing a 1 to this bit clears the request queues of the
corresponding channel as well as any external requests that have already been accepted. This bit is
only functional when DMAOR.DDT = 1 and DMAOR.DBL = 1.
Rev. 6.0, 07/02, page 582 of 986
CHCR Bit 3
QCL
Description
0
This bit is always read as 0.
(Initial value)
Writing a 0 to this bit is invalid.
1
When DMAOR.DBL = 1, writing a 1 to this bit clears the request queues on the
DDT side and any external requests stored in the DMAC. The written value is
not retained.
Bit 2—Interrupt Enable (IE): When this bit is set to 1, an interrupt request (DMTE) is generated
after the number of data transfers specified in DMATCR (when TE = 1). For details of the
settings, see the description of the IE bit in section 14.2.4, DMA Channel Control Registers 0–3
(CHCR0–CHCR3).
Bit 1—Transfer End (TE): This bit is set to 1 after the number of transfers specified in
DMATCR. If the IE bit is set to 1 at this time, an interrupt request (DMTE) is generated.
If data transfer ends before TE is set to 1 (for example, due to an NMI interrupt, address error, or
clearing of the DE bit or the DME bit in DMAOR), the TE bit is not set to 1. When this bit is 1,
the transfer enabled state is not entered even if the DE bit is set to 1. For details of the settings, see
the description of the TE bit in section 14.2.4, DMA Channel Control Registers 0–3 (CHCR0–
CHCR3).
Bit 0—DMAC Enable (DE): Enables operation of the corresponding channel. For details of the
settings, see the description of the DE bit in section 14.2.4, DMA Channel Control Registers 0–3
(CHCR0–CHCR3).
14.7.5
DMA Operation Register (DMAOR)
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
R
DDT DBL
Initial value:
0
0
R/W: R/W R/W
PR1 PR0
0
0
R/W R/W
AE NMIF DME
0
0
0
R/(W) R/(W) R/W
DMAOR is a 32-bit readable/writable register that specifies the DMAC transfer mode.
Rev. 6.0, 07/02, page 583 of 986
DMAOR is initialized to H'00000000 by a power-on or manual reset. They retain their values in
standby mode and deep sleep mode.
Bits 31 to 16—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 15—On-Demand Data Transfer (DDT): Specifies on-demand data transfer mode. For
details of the settings, see the description of the DDT bit in section 14.2.5, DMA Operation
Register (DMAOR)
Bit 14
Number of DDT-Mode Channels (DBL): Selects the number of channels that are able
to accept external requests in DDT mode.
Bit 14: DBL
Description
0
Four DDT-mode channels
1
Eight DDT-mode channels
(Initial value)
Note: When DMAOR.DBL = 0, channels 4 to 7 cannot accept external requests.
When DMAOR.DBL = 1, one channel can be selected from among channels 0–7 by the
combination of DTR.SZ and DTR.ID in the DTR format (see figure 14.54). Table 14.14 shows the
channel selection by DTR format in the DDT mode.
Table 14.14 Channel Selection by DTR Format (DMAOR.DBL = 1)
DTR.ID[1:0]
DTR.SZ[2:0] ≠ 101
DTR.SZ[2:0] = 101
00
CH0
CH4
01
CH1
CH5
10
CH2
CH6
11
CH3
CH7
63
61 60 59 58 57 56 55
SZ
R/W
ID
MD
4847
COUNT
32 31
(Reserved)
0
ADDRESS
Figure 14.54 DTR Format (Transfer Request Format) (SH7750R)
Bits 13 to 10—Reserved: These bits are always read as 0, and should only be written with 0.
Bits 9 and 8—Priority Mode 1 and 0 (PR1, PR0): These bits determine the order of priority for
channel execution when transfer requests are made for a number of channels simultaneously.
Rev. 6.0, 07/02, page 584 of 986
DMAOR
Bit 9
DMAOR
Bit 8
PR1
PR0
Description
0
0
CH0 > CH1 > CH2 > CH3 > CH4 > CH5 > CH6 > CH7
0
1
CH0 > CH2 > CH3 > CH4 > CH5 > CH6 > CH7 > CH1
1
0
CH2 > CH0 > CH1 > CH3 > CH4 > CH5 > CH6 > CH7
1
1
Round robin mode
(Initial value)
Bits 7 to 3—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 2—Address Error Flag (AE): Indicates that an address error has occurred during DMA
transfer. If this bit is set during data transfer, transfers on all channels are suspended, and an
interrupt request (DMAE) is generated. The CPU cannot write 1 to AE. This bit can only be
cleared by writing 0 after reading 1. For details of the settings, see the description of the AE bit in
section 14.2.5, DMA Operation Register (DMAOR)
Bit 1—NMI Flag (NMIF): Indicates that NMI has been input. This bit is set regardless of
whether or not the DMAC is operating. If this bit is set during data transfer, transfers on all
channels are suspended. The CPU cannot write 1 to NMIF. This bit can only be cleared by writing
0 after reading 1. For details of the settings, see the description of the NMIF bit in section 14.2.5,
DMA Operation Register (DMAOR)
Bit 0—DMAC Master Enable (DME): Enables activation of the entire DMAC. When the DME
bit and the DE bit of the CHCR register for the corresponding channel are set to 1, that channel is
enabled for transfer. If this bit is cleared during data transfer, transfers on all channels are
suspended.
Even if the DME bit has been set, transfer is not enabled when TE is 1 or DE is 0 in CHCR, or
when the NMI or AE bit in DMAOR is 1. For details of the settings, see the description of the
DME bit in section 14.2.5, DMA Operation Register (DMAOR)
Rev. 6.0, 07/02, page 585 of 986
14.8
Operation (SH7750R)
Operation specific to the SH7750R is described here. For details of operation, see section 14.3,
Operation.
14.8.1
Channel Specification for a Normal DMA Transfer
In normal DMA transfer mode, the DMAC always operates with eight channels, and external
requests are only accepted on channel 0 ('5(4) and channel 1 ('5(44).
After setting the registers of the channels in use, including CHCR, SAR, DAR, and DMATCR,
DMA transfer is started on receiving a DMA transfer request in the transfer-enabled state (DE = 1,
DME = 1, TE = 0, NMIF = 0, AE = 0), in the order of predetermined priority. The transfer ends
when the transfer-end condition is satisfied. There are three modes for transfer requests: autorequest, external request, and on-chip peripheral module request. The addressing modes for DMA
transfer are the single-address mode and the dual-address mode. Bus mode is selectable between
burst mode and cycle steal mode.
14.8.2
Channel Specification for DDT-Mode DMA Transfer
For DMA transfer in DDT mode, the DMAOR.DBL setting selects either four or eight channels.
External requests are accepted on channels 0–3 when DMAOR.DBL = 0, and on channels 0–7
when DMAOR.DBL = 1. For further information on these settings, see the entry on the DBL bit in
section 14.7.5, DMA Operation Register (DMAOR).
14.8.3
Transfer Channel Notification in DDT Mode
When the DMAC is set up for four-channel external request acceptance in DDT mode
(DMAOR.DBL = 0), the ID [1:0] bits are used to notify the external device of the DMAC channel
that is to be used. For more details, see section 14.5, On-Demand Data Transfer Mode.
When the DMAC is set up for eight-channel external request acceptance in DDT mode
(DMAOR.DBL = 1), the ID [1:0] bits and the simultaneous (on the timing of 7'$&. assertion)
assertion of ,'5 from the %$9/ (bus-release notification) pin are used to notify the external
device of the DMAC channel that is to be used (see table 14.15, Notification of Transfer Channel
in Eight-Channel DDT Mode).
When the DMAC is set up for eight-channel external request acceptance in DDT mode
(DMAOR.DBL = 1), it is important to note that the %$9/#pin#has the two functions as shown in
table 14.16.
Rev. 6.0, 07/02, page 586 of 986
Table 14.15 Notification of Transfer Channel in Eight-Channel DDT Mode
%$9//,'5
%$9/ ,'5
ID[1:0]
Transfer Channel
1
00
CH0
01
CH1
10
CH2
11
CH3
00
CH4
01
CH5
10
CH6
11
CH7
0
Table 14.16 Function of %$9/
Function of %$9/
7'$&. = High
Bus available (data-bus enabled)
7'$&. = Low
Notification of channel number (,'5)
14.8.4
Clearing Request Queues by DTR Format
In DDT mode, the request queues of any channel can be cleared by using DTR.ID, DTR.MD,
DTR.SZ, and DTR.COUNT [7:4] in a DTR format. This function is only available when
DMAOR.DBL = 1. Table 14.17 shows the DTR format settings for clearing request queues.
Rev. 6.0, 07/02, page 587 of 986
Table 14.17 DTR Format for Clearing Request Queues
DMAOR.DBL DTR.ID
DTR.MD
DTR.SZ
DTR.COUNT[7:4]
Description
0
10
110
*
Clear the request queues of all channels
(1–7).
00
Clear the CH0 request-accepted flag
11
1
00
10
Setting prohibited
110
*
Clear the request queues of all channels
(1–7).
Clear the CH0 request-accepted flag.
11
0001
Clear the CH0 request-accepted flag
0010
Clear the CH1 request queues.
0011
Clear the CH2 request queues.
0100
Clear the CH3 request queues.
0101
Clear the CH4 request queues.
0110
Clear the CH5 request queues.
0111
Clear the CH6 request queues.
1000
Clear the CH7 request queues.
Note: (SH7750R) DTR.SZ = DTR[63:61], DTR.ID = DTR[59:58], DTR.MD = DTR[57:56],
DTR.COUNT[7:4] = DTR[55:52]
14.8.5
Interrupt-Request Codes
When the number of transfers specified in DMATCR has been finished and the interrupt request is
enabled (CHCR.IE = 1), a transfer-end interrupt request can be sent to the CPU from each
channel. Table 14.18 lists the interrupt-request codes that are associated with these transfer-end
interrupts.
Rev. 6.0, 07/02, page 588 of 986
Table 14.18 DMAC Interrupt-Request Codes
Source of the Interrupt
Description
INTEVT Code
Priority
DMTE0
CH0 transfer-end interrupt
H'640
High
DMTE1
CH1 transfer-end interrupt
H'660
DMTE2
CH2 transfer-end interrupt
H'680
DMTE3
CH3 transfer-end interrupt
H'6A0
DMTE4
CH4 transfer-end interrupt
H'780
DMTE5
CH5 transfer-end interrupt
H'7A0
DMTE6
CH6 transfer-end interrupt
H'7C0
DMTE7
CH7 transfer-end interrupt
H'7E0
DMAE
Address error interrupt
H'6C0
Low
DMTE4–DMTE7: These codes are not used in the SH7750 or SH7750S.
CKIO
/
RA
A25–A0
D63–D0
RAS,
CAS, WE
ID1, ID0
CA
DTR
D0
BA
D1
D2
RD
00
Figure 14.55 Single Address Mode/Burst Mode/External Bus → External Device 32-Byte
Block Transfer/Channel 0 On-Demand Data Transfer
Rev. 6.0, 07/02, page 589 of 986
CKIO
/
RA
A25–A0
D63–D0
RAS,
CAS, WE
ID1, ID0
CA
DTR
D0
BA
D1
RD
00
Figure 14.56 Single Address Mode/Burst Mode/External Bus →
External Device/32-Byte Block Transfer/On-Demand Data Transfer on Channel 4
Rev. 6.0, 07/02, page 590 of 986
D2
14.9
Usage Notes
1. When modifying SAR0–SAR3, DAR0–DAR3, DMATCR0–DMATCR3, and CHCR0–
CHCR3 in the SH7750 or SH7750S or when modifying SAR0–SAR7, DAR0–DAR7,
DMATCR0–DMATCR7, and CHCR0–CHCR7 in the SH7750R, first clear the DE bit for the
relevant channel.
2. The NMIF bit in DMAOR is set when an NMI interrupt is input even if the DMAC is not
operating.
Confirmation method when DMA transfer is not executed correctly:
With the SH7750 and SH7750S, read the NMIF, AE, and DME bits in DMAOR, the DE and
TE bits in CHCR0–CHCR3, and DMATCR0–DMATCR3. With the SH7750R, read the
NMIF, AE, and DME bits in DMAOR, the DE and TE bits in CHCR0–CHCR7, and
DMATCR0–DMATCR7. If NMIF was set before the transfer, the DMATCR transfer count
will remain at the set value. If NMIF was set during the transfer, when the DE bit is 1 and the
TE bit is 0 in CHCR0–CHCR3 in the SH7750 or SH7750S or CHCR0–CHCR7 in the
SH7750R, the DMATCR value will indicate the remaining number of transfers.
Also, the next addresses to be accessed can be found by reading SAR0–SAR3 and DAR0–
DAR3 in the SH7750 or SH7750S or SAR0–SAR7 and DAR0–DAR7 in the SH7750R. If the
AE bit has been set, an address error has occurred. Check the set values in CHCR, SAR, and
DAR.
3. Check that DMA transfer is not in progress before making a transition to the module standby
state, standby mode, or deep sleep mode.
Either check that TE = 1 in the SH7750 or SH7750S’s CHCR0–CHCR3 or in the SH7750R’s
CHCR0–CHCR7, or clear DME to 0 in DMAOR to terminate DMA transfer. When DME is
cleared to 0 in DMAOR, transfer halts at the end of the currently executing DMA bus cycle.
Note, therefore, that transfer may not end immediately, depending on the transfer data size.
DMA operation is not guaranteed if the module standby state, standby mode, or deep sleep
mode is entered without confirming that DMA transfer has ended.
4. Do not specify a DMAC, CCN, BSC, or UBC control register as the DMAC transfer source or
destination.
5. When activating the DMAC, make the SAR, DAR, and DMATCR register settings for the
relevant channel before setting DE to 1 in CHCR, or make the register settings with DE
cleared to 0 in CHCR, then set DE to 1. It does not matter whether setting of the DME bit to 1
in DMAOR is carried out first or last. To operate the relevant channel, DME and DE must both
be set to 1. The DMAC may not operate normally if the SAR, DAR, and DMATCR settings
are not made (with the exception of the unused register in single address mode).
6. After the DMATCR count reaches 0 and DMA transfer ends normally, always write 0 to
DMATCR even when executing the maximum number of transfers on the same channel.
7. When falling edge detection is used for external requests, keep the external request pin high
when making DMAC settings.
Rev. 6.0, 07/02, page 591 of 986
8. When using the DMAC in single address mode, set an external address as the address. All
channels will halt due to an address error if an on-chip peripheral module address is set.
9. In external request ('5(4) edge detection in the SH7750R, an external request that has been
accepted can be cancelled in the following way. Firstly, negate '5(4 and change the value of
CHCR.DS from 1 to 0. After that, set the CHCR.DS bit back to 1, then assert '5(4. (Though
the SH7750R does not have a DMAOR.COD bit, similar to when the DMAOR.COD bit is 1 in
the SH7750S, external requests that have once been accepted can be cancelled when the
external request ('5(4) edge is detected.)
Rev. 6.0, 07/02, page 592 of 986
Section 15 Serial Communication Interface (SCI)
15.1
Overview
The SH7750 Series is equipped with a single-channel serial communication interface (SCI) and a
single-channel serial communication interface with built-in FIFO registers (SCI with FIFO: SCIF).
The SCI can handle both asynchronous and synchronous serial communication.
The SCI supports a smart card interface conforming to ISO/IEC 7816-3 (Identification Card) as a
serial communication interface function for IC card interface use. For details, see section 17,
Smart Card Interface.
The SCIF is a dedicated asynchronous communication serial interface with built-in 16-stage FIFO
registers for both transmission and reception. For details, see section 16, Serial Communication
Interface with FIFO (SCIF).
15.1.1
Features
SCI features are listed below.
• Choice of synchronous or asynchronous serial communication mode
Asynchronous mode
Serial data communication is executed using an asynchronous system in which
synchronization is achieved character by character. Serial data communication can be
carried out with standard asynchronous communication chips such as a Universal
Asynchronous Receiver/Transmitter (UART) or Asynchronous Communication Interface
Adapter (ACIA). A multiprocessor communication function is also provided that enables
serial data communication with a number of processors.
There is a choice of 12 serial data transfer formats.
Data length:
7 or 8 bits
Stop bit length:
1 or 2 bits
Parity:
Even/odd/none
Multiprocessor bit:
1 or 0
Receive error detection: Parity, overrun, and framing errors
Break detection:
A break can be detected by reading the RxD pin level directly
from the serial port register (SCSPTR1) when a framing error
occurs.
Rev. 6.0, 07/02, page 593 of 986
Synchronous mode
Serial data communication is synchronized with a clock. Serial data communication can be
carried out with other chips that have a synchronous communication function.
There is a single serial data transfer format.
Data length:
8 bits
Receive error detection: Overrun errors
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously. Double-buffering is used in both the transmitter and the receiver,
enabling continuous transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected.
• Choice of serial clock source: internal clock from baud rate generator or external clock from
SCK pin
• Four interrupt sources
There are four interrupt sources—transmit-data-empty, transmit-end, receive-data-full, and
receive-error—that can issue requests independently. The transmit-data-empty interrupt and
receive-data-full interrupt can activate the DMA controller (DMAC) to execute a data transfer.
• When not in use, the SCI can be stopped by halting its clock supply to reduce power
consumption.
Rev. 6.0, 07/02, page 594 of 986
15.1.2
Block Diagram
Bus interface
Figure 15.1 shows a block diagram of the SCI.
Module data bus
RxD
SCRDR1
SCTDR1
SCRSR1
SCTSR1
TxD
Parity generation
SCSSR1
SCSCR1
SCSMR1
SCSPTR1
Transmission/
reception
control
Internal
data bus
SCBRR1
Pφ
Baud rate
generator
Pφ/4
Pφ/16
Pφ/64
Clock
Parity check
External clock
SCK
TEI
TXI
RXI
ERI
SCI
SCRSR1:
SCRDR1:
SCTSR1:
SCTDR1:
SCSMR1:
SCSCR1:
SCSSR1:
SCBRR1:
SCSPTR1:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Serial port register
Figure 15.1 Block Diagram of SCI
Rev. 6.0, 07/02, page 595 of 986
15.1.3
Pin Configuration
Table 15.1 shows the SCI pin configuration.
Table 15.1 SCI Pins
Pin Name
Abbreviation
I/O
Function
Serial clock pin
MD0/SCK
I/O
Clock input/output
Receive data pin
RxD
Input
Receive data input
Transmit data pin
MD7/TxD
Output
Transmit data output
Note: The serial clock pin and transmit data pin function as mode input pins MD0 and MD7
after a power-on reset. They are made to function as serial pins by performing SCI
operation settings with the TE, RE, CKEI, and CKE0 bits in SCSCR1 and the C/$ bit in
SCSMR1. Break state transmission and detection, can be set in the SCI’s SCSPTR1
register.
15.1.4
Register Configuration
The SCI has the internal registers shown in table 15.2. These registers are used to specify
asynchronous mode or synchronous mode, the data format, and the bit rate, and to perform
transmitter/receiver control.
With the exception of the serial port register, the SCI registers are initialized in standby mode and
in the module standby state as well as after a power-on reset or manual reset. When recovering
from standby mode or the module standby state, the registers must be set again.
Table 15.2 SCI Registers
Name
Abbreviation
R/W
Initial
Value
P4 Address
Area 7
Address
Access
Size
Serial mode register
SCSMR1
R/W
H'00
H'FFE00000
H'1FE00000
8
Bit rate register
SCBRR1
R/W
H'FF
H'FFE00004
H'1FE00004
8
Serial control register
SCSCR1
R/W
H'00
H'FFE00008
H'1FE00008
8
Transmit data register
SCTDR1
R/W
H'FF
H'FFE0000C
H'1FE0000C
8
Serial status register
SCSSR1
1
R/(W)*
H'84
H'FFE00010
H'1FE00010
8
Receive data register
SCRDR1
R
H'00
H'FFE00014
H'1FE00014
8
R/W
2
H'00*
H'FFE0001C
H'1FE0001C
8
Serial port register
SCSPTR1
Notes: *1 Only 0 can be written, to clear flags.
*2 The value of bits 2 and 0 is undefined.
Rev. 6.0, 07/02, page 596 of 986
15.2
Register Descriptions
15.2.1
Receive Shift Register (SCRSR1)
Bit:
7
6
5
4
3
2
1
0
R/W:
—
—
—
—
—
—
—
—
SCRSR1 is the register used to receive serial data.
The SCI sets serial data input from the RxD pin in SCRSR1 in the order received, starting with the
LSB (bit 0), and converts it to parallel data. When one byte of data has been received, it is
transferred to SCRDR1 automatically.
SCRSR1 cannot be directly read or written to by the CPU.
15.2.2
Receive Data Register (SCRDR1)
Bit:
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
SCRDR1 is the register that stores received serial data.
When the SCI has received one byte of serial data, it transfers the received data from SCRSR1 to
SCRDR1 where it is stored, and completes the receive operation. SCRSR1 is then enabled for
reception.
Since SCRSR1 and SCRDR1 function as a double buffer in this way, it is possible to receive data
continuously.
SCRDR1 is a read-only register, and cannot be written to by the CPU.
SCRDR1 is initialized to H'00 by a power-on reset or manual reset, in standby mode, and in the
module standby state.
Rev. 6.0, 07/02, page 597 of 986
15.2.3
Transmit Shift Register (SCTSR1)
Bit:
7
6
5
4
3
2
1
0
R/W:
—
—
—
—
—
—
—
—
SCTSR1 is the register used to transmit serial data.
To perform serial data transmission, the SCI first transfers transmit data from SCTDR1 to
SCTSR1, then sends the data to the TxD pin starting with the LSB (bit 0).
When transmission of one byte is completed, the next transmit data is transferred from SCTDR1
to SCTSR1, and transmission started, automatically. However, data transfer from SCTDR1 to
SCTSR1 is not performed if the TDRE flag in the serial status register (SCSSR1) is set to 1.
SCTSR1 cannot be directly read or written to by the CPU.
15.2.4
Transmit Data Register (SCTDR1)
Bit:
7
6
5
4
3
2
1
0
Initial value:
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W:
SCTDR1 is an 8-bit register that stores data for serial transmission.
When the SCI detects that SCTSR1 is empty, it transfers the transmit data written in SCTDR1 to
SCTSR1 and starts serial transmission. Continuous serial transmission can be carried out by
writing the next transmit data to SCTDR1 during serial transmission of the data in SCTSR1.
SCTDR1 can be read or written to by the CPU at all times.
SCTDR1 is initialized to H'FF by a power-on reset or manual reset, in standby mode, and in the
module standby state.
Rev. 6.0, 07/02, page 598 of 986
15.2.5
Serial Mode Register (SCSMR1)
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
C/$
CHR
PE
O/(
STOP
MP
CKS1
CKS0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCSMR1 is an 8-bit register used to set the SCI’s serial transfer format and select the baud rate
generator clock source.
SCSMR1 can be read or written to by the CPU at all times.
SCSMR1 is initialized to H'00 by a power-on reset or manual reset, in standby mode, and in the
module standby state.
Bit 7—Communication Mode (C/$
$): Selects asynchronous mode or synchronous mode as the
SCI operating mode.
Bit 7: C/$
$
Description
0
Asynchronous mode
1
Synchronous mode
(Initial value)
Bit 6—Character Length (CHR): Selects 7 or 8 bits as the data length in asynchronous mode. In
synchronous mode, a fixed data length of 8 bits is used regardless of the CHR setting,
Bit 6: CHR
Description
0
8-bit data
1
7-bit data*
(Initial value)
Note: * When 7-bit data is selected, the MSB (bit 7) of SCTDR1 is not transmitted.
Bit 5—Parity Enable (PE): In asynchronous mode, selects whether or not parity bit addition is
performed in transmission, and parity bit checking in reception. In synchronous mode, parity bit
addition and checking is not performed, regardless of the PE bit setting.
Bit 5: PE
Description
0
Parity bit addition and checking disabled
1
Parity bit addition and checking enabled*
(Initial value)
Note: * When the PE bit is set to 1, the parity (even or odd) specified by the O/( bit is added to
transmit data before transmission. In reception, the parity bit is checked for the parity (even
or odd) specified by the O/( bit.
Rev. 6.0, 07/02, page 599 of 986
Bit 4—Parity Mode (O/(
(): Selects either even or odd parity for use in parity addition and
checking. The O/( bit setting is only valid when the PE bit is set to 1, enabling parity bit addition
and checking, in asynchronous mode. The O/( bit setting is invalid in synchronous mode, and
when parity addition and checking is disabled in asynchronous mode.
Bit 4: O/(
(
Description
0
Even parity*
1
2
Odd parity*
1
(Initial value)
Notes: *1 When even parity is set, parity bit addition is performed in transmission so that the total
number of 1-bits in the transmit character plus the parity bit is even. In reception, a
check is performed to see if the total number of 1-bits in the receive character plus the
parity bit is even.
*2 When odd parity is set, parity bit addition is performed in transmission so that the total
number of 1-bits in the transmit character plus the parity bit is odd. In reception, a check
is performed to see if the total number of 1-bits in the receive character plus the parity
bit is odd.
Bit 3—Stop Bit Length (STOP): Selects 1 or 2 bits as the stop bit length in asynchronous mode.
The STOP bit setting is only valid in asynchronous mode. If synchronous mode is set, the STOP
bit setting is invalid since stop bits are not added.
Bit 3: STOP
Description
0
1 stop bit*
1
1
2 stop bits*
(Initial value)
2
Notes: *1 In transmission, a single 1-bit (stop bit) is added to the end of a transmit character
before it is sent.
*2 In transmission, two 1-bits (stop bits) are added to the end of a transmit character
before it is sent.
In reception, only the first stop bit is checked, regardless of the STOP bit setting. If the second
stop bit is 1, it is treated as a stop bit; if it is 0, it is treated as the start bit of the next transmit
character.
Rev. 6.0, 07/02, page 600 of 986
Bit 2—Multiprocessor Mode (MP): Selects a multiprocessor format. When a multiprocessor
format is selected, the PE bit and O/( bit parity settings are invalid. The MP bit setting is only
valid in asynchronous mode; it is invalid in synchronous mode.
For details of the multiprocessor communication function including notes on use, see section
15.3.3, Multiprocessor Communication Function.
Bit 2: MP
Description
0
Multiprocessor function disabled
1
Multiprocessor format selected
(Initial value)
Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the onchip baud rate generator. The clock source can be selected from Pφ, Pφ/4, Pφ/16, and Pφ/64,
according to the setting of bits CKS1 and CKS0.
For the relation between the clock source, the bit rate register setting, and the baud rate, see
section 15.2.9, Bit Rate Register (SCBRR1).
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
Pφ clock
1
Pφ/4 clock
0
Pφ/16 clock
1
Pφ/64 clock
1
(Initial value)
Note: Pφ: Peripheral clock
15.2.6
Serial Control Register (SCSCR1)
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The SCSCR1 register performs enabling or disabling of SCI transfer operations, serial clock
output in asynchronous mode, and interrupt requests, and selection of the serial clock source.
SCSCR1 can be read or written to by the CPU at all times.
SCSCR1 is initialized to H'00 by a power-on reset or manual reset, in standby mode, and in the
module standby state.
Rev. 6.0, 07/02, page 601 of 986
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables transmit-data-empty interrupt
(TXI) request generation when serial transmit data is transferred from SCTDR1 to SCTSR1 and
the TDRE flag in SCSSR1 is set to 1.
Bit 7: TIE
Description
0
Transmit-data-empty interrupt (TXI) request disabled*
1
Transmit-data-empty interrupt (TXI) request enabled
(Initial value)
Note: * TXI interrupt requests can be cleared by reading 1 from the TDRE flag, then clearing it to 0,
or by clearing the TIE bit to 0.
Bit 6—Receive Interrupt Enable (RIE): Enables or disables receive-data-full interrupt (RXI)
request and receive-error interrupt (ERI) request generation when serial receive data is transferred
from SCRSR1 to SCRDR1 and the RDRF flag in SCSSR1 is set to 1.
Bit 6: RIE
Description
0
Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI)
request disabled*
(Initial value)
1
Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI)
request enabled
Note: * RXI and ERI interrupt requests can be cleared by reading 1 from the RDRF flag, or the
FER, PER, or ORER flag, then clearing the flag to 0, or by clearing the RIE bit to 0.
Bit 5—Transmit Enable (TE): Enables or disables the start of serial transmission by the SCI.
Bit 5: TE
Description
0
Transmission disabled*
1
2
1
Transmission enabled*
(Initial value)
Notes: *1 The TDRE flag in SCSSR1 is fixed at 1.
*2 In this state, serial transmission is started when transmit data is written to SCTDR1 and
the TDRE flag in SCSSR1 is cleared to 0.
SCSMR1 setting must be performed to decide the transmit format before setting the TE
bit to 1.
Rev. 6.0, 07/02, page 602 of 986
Bit 4—Receive Enable (RE): Enables or disables the start of serial reception by the SCI.
Bit 4: RE
Description
0
Reception disabled*
1
2
Reception enabled*
1
(Initial value)
Notes: *1 Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which
retain their states.
*2 Serial reception is started in this state when a start bit is detected in asynchronous
mode or serial clock input is detected in synchronous mode.
SCSMR1 setting must be performed to decide the receive format before setting the RE
bit to 1.
Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts.
The MPIE bit setting is only valid in asynchronous mode when the MP bit in SCSMR1 is set to 1.
The MPIE bit setting is invalid in synchronous mode or when the MP bit is cleared to 0.
Bit 3: MPIE
Description
0
Multiprocessor interrupts disabled (normal reception performed) (Initial value)
[Clearing conditions]
1
•
When the MPIE bit is cleared to 0
•
When data with MPB = 1 is received
Multiprocessor interrupts enabled*
Note: * When receive data including MPB = 1 is received, the MPIE bit is cleared to 0 automatically,
and generation of RXI and ERI interrupts (when the TIE and RIE bits in SCSCR1 are set to
1) and FER and ORER flag setting is enabled.
Bit 2—Transmit-End interrupt Enable (TEIE): Enables or disables transmit-end interrupt
(TEI) request generation when there is no valid transmit data in SCTDR1 at the time for MSB data
transmission.
Bit 2: TEIE
Description
0
Transmit-end interrupt (TEI) request disabled*
1
Transmit-end interrupt (TEI) request enabled*
(Initial value)
Note: * TEI interrupt requests can be cleared by reading 1 from the TDRE flag in SCSSR1, then
clearing it to 0 and clearing the TEND flag to 0, or by clearing the TEIE bit to 0.
Rev. 6.0, 07/02, page 603 of 986
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock
source and enable or disable clock output from the SCK pin. The combination of the CKE1 and
CKE0 bits determines whether the SCK pin functions as the serial clock output pin or the serial
clock input pin.
The setting of the CKE0 bit, however, is only valid for internal clock operation (CKE1 = 0) in
asynchronous mode. The CKE0 bit setting is invalid in synchronous mode and in the case of
external clock operation (CKE1 = 1). The CKE1 and CKE0 bits must be set before determining
the SCI’s operating mode with SCSMR1.
For details of clock source selection, see table 15.9 in section 15.3, Operation.
Bit 1: CKE1
Bit 0: CKE0
Description
0
0
Asynchronous mode
Internal clock/SCK pin functions as
1
input pin (input signal ignored)*
Synchronous mode
Internal clock/SCK pin functions as
1
serial clock output*
Asynchronous mode
Internal clock/SCK pin functions as
2
clock output*
Synchronous mode
Internal clock/SCK pin functions as
serial clock output
Asynchronous mode
External clock/SCK pin functions as
3
clock input*
Synchronous mode
External clock/SCK pin functions as
serial clock input
Asynchronous mode
External clock/SCK pin functions as
3
clock input*
Synchronous mode
External clock/SCK pin functions as
serial clock input
1
1
0
1
Notes: *1 Initial value
*2 Outputs a clock of the same frequency as the bit rate.
*3 Inputs a clock with a frequency 16 times the bit rate.
Rev. 6.0, 07/02, page 604 of 986
15.2.7
Serial Status Register (SCSSR1)
Bit:
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
1
0
0
0
0
1
—
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Initial value:
R/W:
Note: * Only 0 can be written, to clear the flag.
SCSSR1 is an 8-bit register containing status flags that indicate the operating status of the SCI,
and multiprocessor bits.
SCSSR1 can be read or written to by the CPU at all times. However, 1 cannot be written to flags
TDRE, RDRF, ORER, PER, and FER. Also note that in order to clear these flags they must be
read as 1 beforehand. The TEND flag and MPB flag are read-only flags and cannot be modified.
SCSSR1 is initialized to H'84 by a power-on reset or manual reset, in standby mode, and in the
module standby state.
Bit 7—Transmit Data Register Empty (TDRE): Indicates that data has been transferred from
SCTDR1 to SCTSR1 and the next serial transmit data can be written to SCTDR1.
Bit 7: TDRE
Description
0
Valid transmit data has been written to SCTDR1
[Clearing conditions]
1
•
When 0 is written to TDRE after reading TDRE = 1
•
When data is written to SCTDR1 by the DMAC
There is no valid transmit data in SCTDR1
(Initial value)
[Setting conditions]
•
Power-on reset, manual reset, standby mode, or module standby
•
When the TE bit in SCSCR1 is 0
•
When data is transferred from SCTDR1 to SCTSR1 and data can be
written to SCTDR1
Rev. 6.0, 07/02, page 605 of 986
Bit 6—Receive Data Register Full (RDRF): Indicates that the received data has been stored in
SCRDR1.
Bit 6: RDRF
Description
0
There is no valid receive data in SCRDR1
(Initial value)
[Clearing conditions]
1
•
Power-on reset, manual reset, standby mode, or module standby
•
When 0 is written to RDRF after reading RDRF = 1
•
When data in SCRDR1 is read by the DMAC
There is valid receive data in SCRDR1
[Setting condition]
When serial reception ends normally and receive data is transferred from
SCRSR1 to SCRDR1
Note: SCRDR1 and the RDRF flag are not affected and retain their previous values when an error
is detected during reception or when the RE bit in SCSCR1 is cleared to 0.
If reception of the next data is completed while the RDRF flag is still set to 1, an overrun
error will occur and the receive data will be lost.
Bit 5—Overrun Error (ORER): Indicates that an overrun error occurred during reception,
causing abnormal termination.
Bit 5: ORER
Description
0
Reception in progress, or reception has ended normally*
1
(Initial value)
[Clearing conditions]
1
•
Power-on reset, manual reset, standby mode, or module standby
•
When 0 is written to ORER after reading ORER = 1
An overrun error occurred during reception*
2
[Setting condition]
When the next serial reception is completed while RDRF = 1
Notes: *1 The ORER flag is not affected and retains its previous state when the RE bit in
SCSCR1 is cleared to 0.
*2 The receive data prior to the overrun error is retained in SCRDR1, and the data
received subsequently is lost. Serial reception cannot be continued while the ORER flag
is set to 1. In synchronous mode, serial transmission cannot be continued either.
Rev. 6.0, 07/02, page 606 of 986
Bit 4—Framing Error (FER): Indicates that a framing error occurred during reception in
asynchronous mode, causing abnormal termination.
Bit 4: FER
Description
0
Reception in progress, or reception has ended normally*
1
(Initial value)
[Clearing conditions]
1
•
Power-on reset, manual reset, standby mode, or module standby
•
When 0 is written to FER after reading FER = 1
A framing error occurred during reception
[Setting condition]
When the SCI checks whether the stop bit at the end of the receive data is 1
2
when reception ends, and the stop bit is 0*
Notes: *1 The FER flag is not affected and retains its previous state when the RE bit in SCSCR1
is cleared to 0.
*2 In 2-stop-bit mode, only the first stop bit is checked for a value of 1; the second stop bit
is not checked. If a framing error occurs, the receive data is transferred to SCRDR1 but
the RDRF flag is not set. Serial reception cannot be continued while the FER flag is set
to 1.
Bit 3—Parity Error (PER): Indicates that a parity error occurred during reception with parity
addition in asynchronous mode, causing abnormal termination.
Bit 3: PER
Description
0
Reception in progress, or reception has ended normally*
1
(Initial value)
[Clearing conditions]
1
•
Power-on reset, manual reset, standby mode, or module standby
•
When 0 is written to PER after reading PER = 1
A parity error occurred during reception *
2
[Setting condition]
When, in reception, the number of 1-bits in the receive data plus the parity
bit does not match the parity setting (even or odd) specified by the O/( bit in
SCSMR1
Notes: *1 The PER flag is not affected and retains its previous state when the RE bit in SCSCR1
is cleared to 0.
*2 If a parity error occurs, the receive data is transferred to SCRDR1 but the RDRF flag is
not set. Serial reception cannot be continued while the PER flag is set to 1.
Rev. 6.0, 07/02, page 607 of 986
Bit 2—Transmit End (TEND): Indicates that there is no valid data in SCTDR1 when the last bit
of the transmit character is sent, and transmission has been ended.
The TEND flag is read-only and cannot be modified.
Bit 2: TEND
Description
0
Transmission is in progress
[Clearing conditions]
1
•
When 0 is written to TDRE after reading TDRE = 1
•
When data is written to SCTDR1 by the DMAC
Transmission has been ended
(Initial value)
[Setting conditions]
•
Power-on reset, manual reset, standby mode, or module standby
•
When the TE bit in SCSCR1 is 0
•
When TDRE = 1 on transmission of the last bit of a 1-byte serial transmit
character
Bit 1—Multiprocessor Bit (MPB)*: This bit is read-only and cannot be written to. The read
value is undefined.
Note: * This bit is prepared for storing a multi-processor bit in the received data when the receipt
is carried out with a multi-processor format in asynchronous mode. This bit does not
function correctly in this LSI. However, do not use the read value from this bit.
Bit 0—Multiprocessor Bit Transfer (MPBT): When transmission is performed using a
multiprocessor format in asynchronous mode, MPBT stores the multiprocessor bit to be added to
the transmit data.
The MPBT bit setting is invalid in synchronous mode, when a multiprocessor format is not used,
and when the operation is not transmission.
Unlike transmit data, the MPBT bit is not double-buffered, so it is necessary to check whether
transmission has been completed before changing its value.
Bit 0: MPBT
Description
0
Data with a 0 multiprocessor bit is transmitted
1
Data with a 1 multiprocessor bit is transmitted
Rev. 6.0, 07/02, page 608 of 986
(Initial value)
15.2.8
Serial Port Register (SCSPTR1)
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
EIO
—
—
—
0
0
0
0
0
—
0
—
R/W
—
—
—
R/W
R/W
R/W
R/W
SPB1IO SPB1DT SPB0IO SPB0DT
SCSPTR1 is an 8-bit readable/writable register that controls input/output and data for the port pins
multiplexed with the serial communication interface (SCI) pins. Input data can be read from the
RxD pin, output data written to the TxD pin, and breaks in serial transmission/reception
controlled, by means of bits 1 and 0. SCK pin data reading and output data writing can be
performed by means of bits 3 and 2. Bit 7 controls enabling and disabling of the RXI interrupt.
SCSPTR1 can be read or written to by the CPU at all times. All SCSPTR1 bits except bits 2 and 0
are initialized to H'00 by a power-on reset or manual reset; the value of bits 2 and 0 is undefined.
SCSPTR1 is not initialized in the module standby state or standby mode.
Bit 7—Error Interrupt Only (EIO): When the EIO bit is 1, an RXI interrupt request is not sent
to the CPU even if the RIE bit is set to 1. When the DMAC is used, this setting means that only
ERI interrupts are handled by the CPU. The DMAC transfers read data to memory or another
peripheral module. This bit specifies enabling or disabling of the RXI interrupt.
Bit 7: EIO
Description
0
When the RIE bit is 1, RXI and ERI interrupts are sent to INTC(Initial value)
1
When the RIE bit is 1, only ERI interrupts are sent to INTC
Bits 6 to 4—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 3—Serial Port Clock Port I/O (SPB1IO): Specifies serial port SCK pin input/output. When
the SCK pin is actually set as a port output pin and outputs the value set by the SPB1DT bit, the
C/$ bit in SCSMR1 and the CKE1 and CKE0 bits in SCSCR1 should be cleared to 0.
Bit 3: SPB1IO
Description
0
SPB1DT bit value is not output to the SCK pin
1
SPB1DT bit value is output to the SCK pin
(Initial value)
Rev. 6.0, 07/02, page 609 of 986
Bit 2—Serial Port Clock Port Data (SPB1DT): Specifies the serial port SCK pin input/output
data. Input or output is specified by the SPB1IO bit (see the description of bit 3, SPB1IO, for
details). When output is specified, the value of the SPB1DT bit is output to the SCK pin. The SCK
pin value is read from the SPB1DT bit regardless of the value of the SPB1IO bit. The initial value
of this bit after a power-on or manual reset is undefined.
Bit 2: SPB1DT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Bit 1—Serial Port Break I/O (SPB0IO): Specifies the serial port TxD pin output condition.
When the TxD pin is actually set as a port output pin and outputs the value set by the SPB0DT bit,
the TE bit in SCSCR1 should be cleared to 0.
Bit 1: SPB0IO
Description
0
SPB0DT bit value is not output to the TxD pin
1
SPB0DT bit value is output to the TxD pin
(Initial value)
Bit 0—Serial Port Break Data (SPB0DT): Specifies the serial port RxD pin input data and TxD
pin output data. The TxD pin output condition is specified by the SPB0IO bit (see the description
of bit 1, SPB0IO, for details). When the TxD pin is designated as an output, the value of the
SPB0DT bit is output to the TxD pin. The RxD pin value is read from the SPB0DT bit regardless
of the value of the SPB0IO bit. The initial value of this bit after a power-on or manual reset is
undefined.
Bit 0: SPB0DT
Description
0
Input/output data is low-level
1
Input/output data is high-level
SCI I/O port block diagrams are shown in figures 15.2 to 15.4.
Rev. 6.0, 07/02, page 610 of 986
Reset
R
Q
D
SPB1IO
C
SPTRW
Internal data bus
Reset
MD0/SCK
Q
R
D
SPB1DT
C
SPTRW
Mode setting
register
SCI
Clock output enable signal
Serial clock output signal
*
Serial clock input signal
Clock input enable signal
SPTRR
SPTRW: Write to SPTR
SPTRR: Read SPTR
Note: * Signals that set the SCK pin function as internal clock output or external clock input according to
the CKE0 and CKE1 bits in SCSCR1 and the C/ bit in SCSMR1.
Figure 15.2 MD0/SCK Pin
Rev. 6.0, 07/02, page 611 of 986
Reset
R
Q
D
SPB0IO
C
Internal data bus
SPTRW
Reset
MD7/TxD
R
Q
D
SPB0DT
C
SPTRW
SCI
Transmit enable signal
Mode setting register
Serial transmit data
SPTRW: Write to SPTR
Figure 15.3 MD7/TxD Pin
SCI
RxD
Serial receive data
Internal data bus
SPTRR
SPTRR: Read SPTR
Figure 15.4 RxD Pin
Rev. 6.0, 07/02, page 612 of 986
15.2.9
Bit Rate Register (SCBRR1)
Bit:
7
6
5
4
3
2
1
0
Initial value:
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W:
SCBRR1 is an 8-bit register that sets the serial transfer bit rate in accordance with the baud rate
generator operating clock selected by bits CKS1 and CKS0 in SCSMR1.
SCBRR1 can be read or written to by the CPU at all times.
SCBRR1 is initialized to H'FF by a power-on reset or manual reset, in standby mode, and in the
module standby state.
The SCBRR1 setting is found from the following equations.
Asynchronous mode:
N=
Pφ
× 106 – 1
64 × 22n–1 × B
Synchronous mode:
N=
Where B:
N:
Pφ:
n:
Pφ
8×
22n–1
×B
× 106 – 1
Bit rate (bits/s)
SCBRR1 setting for baud rate generator (0 ≤ N ≤ 255)
Peripheral module operating frequency (MHz)
Baud rate generator input clock (n = 0 to 3)
(See the table below for the relation between n and the clock.)
SCSMR1 Setting
n
Clock
CKS1
CKS0
0
Pφ
0
0
1
Pφ/4
0
1
2
Pφ/16
1
0
3
Pφ/64
1
1
Rev. 6.0, 07/02, page 613 of 986
The bit rate error in asynchronous mode is found from the following equation:
Error (%) =
Pφ × 106
– 1 × 100
(N + 1) × B × 64 × 22n–1
Table 15.3 shows sample SCBRR1 settings in asynchronous mode, and table 15.4 shows sample
SCBRR1 settings in synchronous mode.
Rev. 6.0, 07/02, page 614 of 986
Table 15.3 Examples of Bit Rates and SCBRR1 Settings in Asynchronous Mode
Pφ
φ (MHz)
2
2.097152
2.4576
3
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
141
0.03
1
148
–0.04
1
174
–0.26
1
212
0.03
150
1
103
0.16
1
108
0.21
1
127
0.00
1
155
0.16
300
0
207
0.16
0
217
0.21
0
255
0.00
1
77
0.16
600
0
103
0.16
0
108
0.21
0
127
0.00
0
155
0.16
1200
0
51
0.16
0
54
–0.70
0
63
0.00
0
77
0.16
2400
0
25
0.16
0
26
1.14
0
31
0.00
0
38
0.16
4800
0
12
0.16
0
13
–2.48
0
15
0.00
0
19
–2.34
9600
0
6
–6.99
0
6
–2.48
0
7
0.00
0
9
–2.34
19200
0
2
8.51
0
2
13.78
0
3
0.00
0
4
–2.34
31250
0
1
0.00
0
1
4.86
0
1
22.88
0
2
0.00
38400
0
1
–18.62 0
1
–14.67 0
1
0.00
Pφ
φ (MHz)
3.6864
4
4.9152
5
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
64
0.70
2
70
0.03
2
86
0.31
2
88
–0.25
150
1
191
0.00
1
207
0.16
1
255
0.00
2
64
0.16
300
1
95
0.00
1
103
0.16
1
127
0.00
1
129
0.16
600
0
191
0.00
0
207
0.16
0
255
0.00
1
64
0.16
1200
0
95
0.00
0
103
0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
0
6
–6.99
0
7
0.00
0
7
1.73
31250
—
—
—
0
3
0.00
0
4
–1.70
0
4
0.00
38400
0
2
0.00
0
2
8.51
0
3
0.00
0
3
1.73
Legend
Blank: No setting is available.
—:
A setting is available but error occurs.
Rev. 6.0, 07/02, page 615 of 986
Table 15.3 Examples of Bit Rates and SCBRR1 Settings in Asynchronous Mode (cont)
Pφ
φ (MHz)
6
6.144
7.37288
8
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
106
–0.44
2
108
0.08
2
130
–0.07
2
141
0.03
150
2
77
0.16
2
79
0.00
2
95
0.00
2
103
0.16
300
1
155
0.16
1
159
0.00
1
191
0.00
1
207
0.16
600
1
77
0.16
1
79
0.00
1
95
0.00
1
103
0.16
1200
0
155
0.16
0
159
0.00
0
191
0.00
0
207
0.16
2400
0
77
0.16
0
79
0.00
0
95
0.00
0
103
0.16
4800
0
38
0.16
0
39
0.00
0
47
0.00
0
51
0.16
9600
0
19
–2.34
0
19
0.00
0
23
0.00
0
25
0.16
19200
0
9
–2.34
0
9
0.00
0
11
0.00
0
12
0.16
31250
0
5
0.00
0
5
2.40
0
6
5.33
0
7
0.00
38400
0
4
–2.34
0
4
0.00
0
5
0.00
0
6
–6.99
Pφ
φ (MHz)
9.8304
10
12
12.288
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
174
–0.26
2
177
–0.25
2
212
0.03
2
217
0.08
150
2
127
0.00
2
129
0.16
2
155
0.16
2
159
0.00
300
1
255
0.00
2
64
0.16
2
77
0.16
2
79
0.00
600
1
127
0.00
1
129
0.16
1
155
0.16
1
159
0.00
1200
0
255
0.00
1
64
0.16
1
77
0.16
1
79
0.00
2400
0
127
0.00
0
129
0.16
0
155
0.16
0
159
0.00
4800
0
63
0.00
0
64
0.16
0
77
0.16
0
79
0.00
9600
0
31
0.00
0
32
–1.36
0
38
0.16
0
39
0.00
19200
0
15
0.00
0
15
1.73
0
19
0.16
0
19
0.00
31250
0
9
–1.70
0
9
0.00
0
11
0.00
0
11
2.40
38400
0
7
0.00
0
7
1.73
0
9
–2.34
0
9
0.00
Rev. 6.0, 07/02, page 616 of 986
Table 15.3 Examples of Bit Rates and SCBRR1 Settings in Asynchronous Mode (cont)
Pφ
φ (MHz)
14.7456
16
19.6608
20
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
3
64
0.70
3
70
0.03
3
86
0.31
3
88
–0.25
150
2
191
0.00
2
207
0.16
2
255
0.00
3
64
0.16
300
2
95
0.00
2
103
0.16
2
127
0.00
2
129
0.16
600
1
191
0.00
1
207
0.16
1
255
0.00
2
64
0.16
1200
1
95
0.00
1
103
0.16
1
127
0.00
1
129
0.16
2400
0
191
0.00
0
207
0.16
0
255
0.00
1
64
0.16
4800
0
95
0.00
0
103
0.16
0
127
0.00
0
129
0.16
9600
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
19200
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
31250
0
14
–1.70
0
15
0.00
0
19
–1.70
0
19
0.00
38400
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
Pφ
φ (MHz)
24
24.576
28.7
30
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
3
106
–0.44
3
108
0.08
3
126
0.31
3
132
0.13
150
3
77
0.16
3
79
0.00
3
92
0.46
3
97
–0.35
300
2
155
0.16
2
159
0.00
2
186
–0.08
2
194
0.16
600
2
77
0.16
2
79
0.00
2
92
0.46
2
97
–0.35
1200
1
155
0.16
1
159
0.00
1
186
–0.08
1
194
0.16
2400
1
77
0.16
1
79
0.00
1
92
0.46
1
97
–0.35
4800
0
155
0.16
0
159
0.00
0
186
–0.08
0
194
–1.36
9600
0
77
0.16
0
79
0.00
0
92
0.46
0
97
–0.35
19200
0
38
0.16
0
39
0.00
0
46
–0.61
0
48
–0.35
31250
0
23
0.00
0
24
–1.70
0
28
–1.03
0
29
0.00
38400
0
19
–2.34
0
19
0.00
0
22
1.55
0
23
1.73
Rev. 6.0, 07/02, page 617 of 986
Table 15.4 Examples of Bit Rates and SCBRR1 Settings in Synchronous Mode
Pφ
φ (MHz)
4
8
16
28.7
30
Bit Rate (bits/s)
n
N
n
N
n
N
n
N
n
N
10
—
—
—
—
—
—
—
—
—
—
250
2
249
3
124
3
249
—
—
—
—
500
2
124
2
249
3
124
3
223
3
233
1k
1
249
2
124
2
249
3
111
3
116
2.5k
1
99
1
199
2
99
2
178
2
187
5k
0
199
1
99
1
199
2
89
2
93
10k
0
99
0
199
1
99
1
178
1
187
25k
0
39
0
79
0
159
1
71
1
74
50k
0
19
0
39
0
79
0
143
0
149
100k
0
9
0
19
0
39
0
71
0
74
250k
0
3
0
7
0
15
—
—
0
29
500k
0
1
0
3
0
7
—
—
0
14
1M
0
0*
0
1
0
3
—
—
—
—
0
0*
0
1
—
—
—
—
2M
Note: As far as possible, the setting should be made so that the error is within 1%.
Legend
Blank: No setting is available.
—:
A setting is available but error occurs.
Continuous transmission/reception is not possible.
*
Rev. 6.0, 07/02, page 618 of 986
Table 15.5 shows the maximum bit rate for various frequencies in asynchronous mode. Tables
15.6 and 15.7 show the maximum bit rates with external clock input.
Table 15.5 Maximum Bit Rate for Various Frequencies with Baud Rate Generator
(Asynchronous Mode)
Settings
Pφ
φ (MHz)
Maximum Bit Rate (bits/s)
n
N
2
62500
0
0
2.097152
65536
0
0
2.4576
76800
0
0
3
93750
0
0
3.6864
115200
0
0
4
125000
0
0
4.9152
153600
0
0
8
250000
0
0
9.8304
307200
0
0
12
375000
0
0
14.7456
460800
0
0
16
500000
0
0
19.6608
614400
0
0
20
625000
0
0
24
750000
0
0
24.576
768000
0
0
28.7
896875
0
0
30
937500
0
0
Rev. 6.0, 07/02, page 619 of 986
Table 15.6 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
Pφ
φ (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bits/s)
2
0.5000
31250
2.097152
0.5243
32768
2.4576
0.6144
38400
3
0.7500
46875
3.6864
0.9216
57600
4
1.0000
62500
4.9152
1.2288
76800
8
2.0000
125000
9.8304
2.4576
153600
12
3.0000
187500
14.7456
3.6864
230400
16
4.0000
250000
19.6608
4.9152
307200
20
5.0000
312500
24
6.0000
375000
24.576
6.1440
384000
28.7
7.1750
448436
30
7.5000
468750
Table 15.7 Maximum Bit Rate with External Clock Input (Synchronous Mode)
Pφ
φ (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bits/s)
8
1.3333
1333333.3
16
2.6667
2666666.7
24
4.0000
4000000.0
28.7
4.7833
4783333.3
30
5.0000
5000000.0
Rev. 6.0, 07/02, page 620 of 986
15.3
Operation
15.3.1
Overview
The SCI can carry out serial communication in two modes: asynchronous mode in which
synchronization is achieved character by character, and synchronous mode in which
synchronization is achieved with clock pulses.
Selection of asynchronous or synchronous mode and the transmission format is made using
SCSMR1 as shown in table 15.8. The SCI clock source is determined by a combination of the C/$
bit in SCSMR1 and the CKE1 and CKE0 bits in SCSCR1, as shown in table 15.9.
• Asynchronous mode
Data length: Choice of 7 or 8 bits
Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits (the
combination of these parameters determines the transfer format and character length)
Detection of framing, parity, and overrun errors, and breaks, during reception
Choice of internal or external clock as SCI clock source
When internal clock is selected: The SCI operates on the baud rate generator clock and a
clock with the same frequency as the bit rate can be output.
When external clock is selected: A clock with a frequency of 16 times the bit rate must be
input (the on-chip baud rate generator is not used).
• Synchronous mode
Transfer format: Fixed 8-bit data
Detection of overrun errors during reception
Choice of internal or external clock as SCI clock source
When internal clock is selected: The SCI operates on the baud rate generator clock and a
serial clock is output off-chip.
When external clock is selected: The on-chip baud rate generator is not used, and the SCI
operates on the input serial clock.
Rev. 6.0, 07/02, page 621 of 986
Table 15.8 SCSMR1 Settings for Serial Transfer Format Selection
SCSMR1 Settings
SCI Transfer Format
Bit 7: Bit 6: Bit 2: Bit 5: Bit 3:
C/$
$
CHR MP
PE
STOP Mode
Data
Length
Multiprocessor Parity Stop Bit
Bit
Bit
Length
0
8-bit data
No
0
0
0
0
1
1
Asynchronous
mode
No
2 bits
0
Yes
1
1
0
7-bit data
No
1
1
0
*
1
1
0
Yes
*
*
*
*
1 bit
2 bits
Asynchronous 8-bit data
mode
(multiprocessor
7-bit data
format)
Yes
No
1 bit
2 bits
1 bit
1
1
1 bit
2 bits
0
1
0
1 bit
2 bits
0
1
1 bit
2 bits
Synchronous
mode
8-bit data
No
None
Note: An asterisk in the table means “Don’t care.”
Table 15.9 SCSMR1 and SCSCR1 Settings for SCI Clock Source Selection
SCSMR1
SCSCR1 Setting
Bit 7:
C/$
$
Bit 1:
CKE1
Bit 0:
CKE0
0
0
0
1
1
SCI Transmit/Receive Clock
Mode
Asynchronous
mode
0
Clock
Source
SCK Pin Function
Internal
SCI does not use SCK pin
Outputs clock with same
frequency as bit rate
External
Inputs clock with frequency of
16 times the bit rate
Internal
Outputs serial clock
External
Inputs serial clock
1
1
0
0
1
1
0
1
Rev. 6.0, 07/02, page 622 of 986
Synchronous
mode
15.3.2
Operation in Asynchronous Mode
In asynchronous mode, characters are sent or received, each preceded by a start bit indicating the
start of communication and followed by one or two stop bits indicating the end of communication.
Serial communication is thus carried out with synchronization established on a character-bycharacter basis.
Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex
communication. Both the transmitter and the receiver also have a double-buffered structure, so
that data can be read or written during transmission or reception, enabling continuous data
transfer.
Figure 15.5 shows the general format for asynchronous serial communication.
In asynchronous serial communication, the transmission line is usually held in the mark state (high
level). The SCI monitors the transmission line, and when it goes to the space state (low level),
recognizes a start bit and starts serial communication.
One serial communication character consists of a start bit (low level), followed by data (in LSBfirst order), a parity bit (high or low level), and finally one or two stop bits (high level).
In asynchronous mode, the SCI performs synchronization at the falling edge of the start bit in
reception. The SCI samples the data on the eighth pulse of a clock with a frequency of 16 times
the length of one bit, so that the transfer data is latched at the center of each bit.
Idle state (mark state)
1
Serial
data
(LSB)
0
D0
Start
bit
1 bit
1
(MSB)
D1
D2
D3
D4
D5
D6
D7
Transmit/receive data
7 or 8 bits
0/1
1
1
Parity
bit
Stop
bit(s)
1 bit,
or none
1 or
2 bits
One unit of transfer data (character or frame)
Figure 15.5 Data Format in Asynchronous Communication (Example with 8-Bit Data,
Parity, Two Stop Bits)
Data Transfer Format
Table 15.10 shows the data transfer formats that can be used in asynchronous mode. Any of 12
transfer formats can be selected according to the SCSMR1 setting.
Rev. 6.0, 07/02, page 623 of 986
Table 15.10 Serial Transfer Formats (Asynchronous Mode)
SCSMR1 Settings
Serial Transfer Format and Frame Length
CHR PE
MP STOP
1
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P
STOP
0
1
0
1
S
8-bit data
P
STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
*
1
0
S
8-bit data
MPB STOP
0
*
1
1
S
8-bit data
MPB STOP STOP
1
*
1
0
S
7-bit data
MPB STOP
1
*
1
1
S
7-bit data
MPB STOP STOP
S:
STOP:
P:
MPB:
Note:
2
3
4
5
Start bit
Stop bit
Parity bit
Multiprocessor bit
An asterisk in the table means “Don’t care.”
Rev. 6.0, 07/02, page 624 of 986
6
7
8
9
10
11
12
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK pin can be selected as the SCI’s serial clock, according to the setting of the C/$ bit in
SCSMR1 and the CKE1 and CKE0 bits in SCSCR1. For details of SCI clock source selection, see
table 15.9.
When an external clock is input at the SCK pin, the clock frequency should be 16 times the bit rate
used.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is at the center of each transmit data bit, as shown in figure 15.6.
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
One frame
Figure 15.6 Relation between Output Clock and Transfer Data Phase
(Asynchronous Mode)
Data Transfer Operations
SCI Initialization (Asynchronous Mode): Before transmitting and receiving data, it is necessary
to clear the TE and RE bits in SCSCR1 to 0, then initialize the SCI as described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to
0 before making the change using the following procedure. When the TE bit is cleared to 0, the
TDRE flag is set to 1 and SCTSR1 is initialized. Note that clearing the RE bit to 0 does not change
the contents of the RDRF, PER, FER, and ORER flags, or the contents of SCRDR1.
When an external clock is used the clock should not be stopped during operation, including
initialization, since operation will be unreliable in this case.
Figure 15.7 shows a sample SCI initialization flowchart.
Rev. 6.0, 07/02, page 625 of 986
1. Set the clock selection in SCSCR1.
Initialization
Be sure to clear bits RIE, TIE, TEIE,
and MPIE, and bits TE and RE, to 0.
Clear TE and RE bits
in SCSCR1 to 0
When clock output is selected in
asynchronous mode, it is output
immediately after SCSCR1 settings
are made.
Set CKE1 and CKE0 bits
in SCSCR1 (leaving TE and
RE bits cleared to 0)
2. Set the transmit/receive format in
SCSMR1.
3. Write a value corresponding to the
bit rate into SCBRR1. (Not
necessary if an external clock is
used.)
Set transmit/receive format
in SCSMR1
4. Wait at least one bit interval, then set
the TE bit or RE bit in SCSCR1 to 1.
Also set the RIE, TIE, TEIE, and
MPIE bits.
Set value in SCBRR1
Wait
1-bit interval elapsed?
Yes
Set TE and RE bits in SCSCR1
to 1, and set RIE, TIE, TEIE,
and MPIE bits
No
Setting the TE and RE bits enables
the TxD and RxD pins to be used.
When transmitting, the SCI will go to
the mark state; when receiving, it will
go to the idle state, waiting for a start
bit.
End
Figure 15.7 Sample SCI Initialization Flowchart
Serial Data Transmission (Asynchronous Mode): Figure 15.8 shows a sample flowchart for
serial transmission.
Use the following procedure for serial data transmission after enabling the SCI for transmission.
Rev. 6.0, 07/02, page 626 of 986
1. SCI status check and transmit data
write: Read SCSSR1 and check that
the TDRE flag is set to 1, then write
transmit data to SCTDR1 and clear
the TDRE flag to 0.
Start of transmission
Read TDRE flag in SCSSR1
TDRE = 1?
No
Yes
Write transmit data to SCTDR1
and clear TDRE flag
in SCSSR1 to 0
All data transmitted?
No
Yes
Read TEND flag in SCSSR1
TEND = 1?
No
2. Serial transmission continuation
procedure: To continue serial
transmission, read 1 from the TDRE
flag to confirm that writing is possible,
then write data to SCTDR1, and then
clear the TDRE flag to 0. (Checking
and clearing of the TDRE flag is
automatic when the direct memory
access controller (DMAC) is activated
by a transmit-data-empty interrupt
(TXI) request, and data is written to
SCTDR1.)
3. Break output at the end of serial
transmission: To output a break in
serial transmission, clear the SPB0DT
bit to 0 and set the SPB0IO bit to 1 in
SCSPTR, then clear the TE bit in
SCSCR1 to 0.
Yes
Break output?
No
Yes
Clear SPB0DT to 0 and
set SPB0IO to 1
Clear TE bit in SCSCR1 to 0
End of transmission
Figure 15.8 Sample Serial Transmission Flowchart
Rev. 6.0, 07/02, page 627 of 986
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SCSSR1. When TDRE is cleared to 0, the SCI recognizes
that data has been written to SCTDR1, and transfers the data from SCTDR1 to SCTSR1.
2. After transferring data from SCTDR1 to SCTSR1, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is
generated.
The serial transmit data is sent from the TxD pin in the following order.
a. Start bit: One 0-bit is output.
b. Transmit data: 8-bit or 7-bit data is output in LSB-first order.
c. Parity bit or multiprocessor bit: One parity bit (even or odd parity), or one multiprocessor
bit is output. (A format in which neither a parity bit nor a multiprocessor bit is output can
also be selected.)
d. Stop bit(s): One or two 1-bits (stop bits) are output.
e. Mark state: 1 is output continuously until the start bit that starts the next transmission is
sent.
3. The SCI checks the TDRE flag at the timing for sending the stop bit. If the TDRE flag is
cleared to 0, data is transferred from SCTDR1 to SCTSR1, the stop bit is sent, and then serial
transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SCSSR1 is set to 1, the stop bit is sent, and then
the line goes to the mark state in which 1 is output continuously. If the TEIE bit in SCSCR1 is
set to 1 at this time, a TEI interrupt request is generated.
Figure 15.9 shows an example of the operation for transmission in asynchronous mode.
Rev. 6.0, 07/02, page 628 of 986
Start
bit
1
Serial
data
0
Data
D0
D1
Parity Stop Start
bit
bit bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
TXI interrupt
request
request
Data written to SCTDR1
and TDRE flag cleared to
0 by TXI interrupt handler
TEI interrupt
request
One frame
Figure 15.9 Example of Transmit Operation in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
Serial Data Reception (Asynchronous Mode): Figure 15.10 shows a sample flowchart for serial
reception.
Use the following procedure for serial data reception after enabling the SCI for reception.
Rev. 6.0, 07/02, page 629 of 986
Start of reception
Read ORER, PER, and FER flags
in SCSSR1
PER or FER
or ORER = 1?
No
Read RDRF flag in SCSSR1
No
RDRF = 1?
Yes
Read receive data in SCRDR1,
and clear RDRF flag
in SCSSR1 to 0
No
All data received?
Yes
Clear RE bit in SCSCR1 to 0
Yes
Error handling
1. Receive error handling and
break detection: If a receive
error occurs, read the ORER,
PER, and FER flags in
SCSSR1 to identify the error.
After performing the
appropriate error handling,
ensure that the ORER, PER,
and FER flags are all cleared to
0. Reception cannot be
resumed if any of these flags
are set to 1. In the case of a
framing error, a break can be
detected by reading the value
of the RxD pin.
2. SCI status check and receive
data read : Read SCSSR1 and
check that RDRF = 1, then read
the receive data in SCRDR1
and clear the RDRF flag to 0.
3. Serial reception continuation
procedure: To continue serial
reception, complete zeroclearing of the RDRF flag
before the stop bit for the
current frame is received. (The
RDRF flag is cleared
automatically when the direct
memory access controller
(DMAC) is activated by an RXI
interrupt and the SCRDR1
value is read.)
End of reception
Figure 15.10 Sample Serial Reception Flowchart (1)
Rev. 6.0, 07/02, page 630 of 986
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
FER = 1?
Yes
Yes
Break?
No
Framing error handling
No
Clear RE bit in SCSCR1 to 0
PER = 1?
Yes
Parity error handling
Clear ORER, PER, and FER flags
in SCSSR1 to 0
End
Figure 15.10 Sample Serial Reception Flowchart (2)
Rev. 6.0, 07/02, page 631 of 986
In serial reception, the SCI operates as described below.
1. The SCI monitors the transmission line, and if a 0 start bit is detected, performs internal
synchronization and starts reception.
2. The received data is stored in SCRSR1 in LSB-to-MSB order.
3. The parity bit and stop bit are received.
After receiving these bits, the SCI carries out the following checks.
a. Parity check: The SCI checks whether the number of 1-bits in the receive data agrees with
the parity (even or odd) set in the O/( bit in SCSMR1.
b. Stop bit check: The SCI checks whether the stop bit is 1. If there are two stop bits, only the
first is checked.
c. Status check: The SCI checks whether the RDRF flag is 0, indicating that the receive data
can be transferred from SCRSR1 to SCRDR1.
If all the above checks are passed, the RDRF flag is set to 1, and the receive data is stored in
SCRDR1.
If a receive error is detected in the error check, the operation is as shown in table 15.11.
Note: No further receive operations can be performed when a receive error has occurred. Also
note that the RDRF flag is not set to 1 in reception, and so the error flags must be cleared
to 0.
4. If the EIO bit in SCSPTR1 is cleared to 0 and the RIE bit in SCSCR1 is set to 1 when the
RDRF flag changes to 1, a receive-data-full interrupt (RXI) request is generated.
If the RIE bit in SCSCR1 is set to 1 when the ORER, PER, or FER flag changes to 1, a
receive-error interrupt (ERI) request is generated. A receive-data-full request is always output
to the DMAC when the RDRF flag changes to 1.
Table 15.11 Receive Error Conditions
Receive Error
Abbreviation
Condition
Data Transfer
Overrun error
ORER
Reception of next data is
completed while RDRF flag
in SCSSR1 is set to 1
Receive data is not transferred
from SCRSR1 to SCRDR1
Framing error
FER
Stop bit is 0
Receive data is transferred
from SCRSR1 to SCRDR1
Parity error
PER
Received data parity differs
from that (even or odd) set
in SCSMR1
Receive data is transferred
from SCRSR1 to SCRDR1
Figure 15.11 shows an example of the operation for reception in asynchronous mode.
Rev. 6.0, 07/02, page 632 of 986
1
Serial
data
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
0/1
RDRF
FER
RXI interrupt
request
One frame
SCRDR1 data read and
RDRF flag cleared to 0
by RXI interrupt handler
ERI interrupt request
generated by framing
error
Figure 15.11 Example of SCI Receive Operation
(Example with 8-Bit Data, Parity, One Stop Bit)
Rev. 6.0, 07/02, page 633 of 986
15.3.3
Multiprocessor Communication Function
The multiprocessor communication function performs serial communication using a
multiprocessor format, in which a multiprocessor bit is added to the transfer data, in asynchronous
mode. Use of this function enables data transfer to be performed among a number of processors
sharing a serial transmission line.
When multiprocessor communication is carried out, each receiving station is addressed by a
unique ID code.
The serial communication cycle consists of two cycles: an ID transmission cycle which specifies
the receiving station , and a data transmission cycle. The multiprocessor bit is used to differentiate
between the ID transmission cycle and the data transmission cycle.
The transmitting station first sends the ID of the receiving station with which it wants to perform
serial communication as data with a 1 multiprocessor bit added. It then sends transmit data as data
with a 0 multiprocessor bit added.
The receiving station skips the data until data with a 1 multiprocessor bit is sent*.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose ID does
not match continue to skip the data until data with a 1 multiprocessor bit is again received*. In this
way, data communication is carried out among a number of processors.
Figure 15.12 shows an example of inter-processor communication using a multiprocessor format.
Note: * With this LSI, the RDRF flag in SCSSR1 is also set to 1 when data with a 0
multiprocessor bit transmitted to another station is received. When the RDRF flag in
SCSSR1 is set to 1, check the state of the MPIE bit in SCSCR1 with the exception
handling routine, and if the MPIE bit is 1, skip the data. That is to say, data skipping is
implemented in cooperation with the exception handling routine.
Rev. 6.0, 07/02, page 634 of 986
Transmitting
station
Serial transmission line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial
data
H'01
H'AA
(MPB = 1)
ID transmission cycle:
Receiving station
specification
(MPB = 0)
Data transmission cycle:
Data transmission to
receiving station specified
by ID
MPB: Multiprocessor bit
Figure 15.12 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
Data Transfer Formats
There are four data transfer formats. When the multiprocessor format is specified, the parity bit
specification is invalid. For details, see table 15.10.
Clock
See the description under Clock in section 15.3.2.
Data Transfer Operations
Multiprocessor Serial Data Transmission: Figure 15.13 shows a sample flowchart for
multiprocessor serial data transmission.
Use the following procedure for multiprocessor serial data transmission after enabling the SCI for
transmission.
Rev. 6.0, 07/02, page 635 of 986
Start of transmission
Read TEND flag in SCSSR1
TEND = 1?
No
2. Preparation for data transfer: Read
SCSSR1 and check that the TEND
flag is set to 1, then set the MPBT bit
in SCSSR1 to 1.
Yes
Set MPBT bit in SCSSR1 to 1 and
write ID data to SCTDR1
3. Serial data transmission: Write the
first transmit data to SCTDR1, then
clear the TDRE flag to 0.
Clear TDRE flag to 0
Read TEND flag in SCSSR1
TEND = 1?
1. SCI status check and ID data write:
Read SCSSR1 and check that the
TEND flag is set to 1, then set the
MPBT bit in SCSSR1 to 1 and write
ID data to SCTDR1. Finally, clear the
TDRE flag to 0.
No
Yes
Clear MPBT bit in SCSSR1 to 0
To continue data transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to SCTDR1, and then clear
the TDRE flag to 0. (Checking and
clearing of the TDRE flag is
automatic when the direct memory
access controller (DMAC) is
activated by a transmit-data-empty
interrupt (TXI) request, and data is
written to SCTDR1.)
Write data to SCTDR1
Clear TDRE flag to 0
Read TDRE flag in SCSSR1
TDRE = 1?
No
Yes
No
All data transmitted?
Yes
End of transmission
Figure 15.13 Sample Multiprocessor Serial Transmission Flowchart
Rev. 6.0, 07/02, page 636 of 986
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SCSSR1. When TDRE is cleared to 0, the SCI recognizes
that data has been written to SCTDR1, and transfers the data from SCTDR1 to SCTSR1.
2. After transferring data from SCTDR1 to SCTSR1, the SCI sets the TDRE flag to 1 and starts
transmission.
The serial transmit data is sent from the TxD pin in the following order.
a. Start bit: One 0-bit is output.
b. Transmit data: 8-bit or 7-bit data is output in LSB-first order.
c. Multiprocessor bit: One multiprocessor bit (MPBT value) is output.
d. Stop bit(s): One or two 1-bits (stop bits) are output.
e. Mark state: 1 is output continuously until the start bit that starts the next transmission is
sent.
3. The SCI checks the TDRE flag at the timing for sending the stop bit. If the TDRE flag is set to
1, the TEND flag in SCSSR1 is set to 1, the stop bit is sent, and then the line goes to the mark
state in which 1 is output. If the TEIE bit in SCSCR1 is set to 1 at this time, a transmit-end
interrupt (TEI) request is generated.
4. The SCI monitors the TDRE flag. When TDRE is cleared to 0, the SCI recognizes that data
has been written to SCTDR1, and transfers the data from SCTDR1 to SCTSR1.
5. After transferring data from SCTDR1 to SCTSR1, the SCI sets the TDRE flag to 1 and starts
transmitting. If the transmit-data-empty interrupt enable bit (TIE bit) in SCSCR1 is set to 1 at
this time, a transmit-data-empty interrupt (TXI) request is generated.
The order of transmission is the same as in step 2.
Figure 15.14 shows an example of SCI operation for transmission using a multiprocessor format.
Rev. 6.0, 07/02, page 637 of 986
1
Serial
data
Start
bit
0
Multiproces- Stop
sor bit bit
Data
D0 D1
D7
1
1
Start
bit
0
Data
D0 D1
Multiproces- Stop Start
bit
sor bit bit
D7
0
1
0
Data
D0 D1
Multiproces- Stop
sor bit bit
D7
0
1
Idle state
(mark state)
TDRE
TEND
Data written to SCTDR1
and TDRE flag cleared
to 0 by TXI interrupt
handler
One frame
TXI interrupt
request
TEI interrupt
request
MPBT bit cleared to 0, data
written to SCTDR1, and
TDRE flag cleared to 0 by
TEI interrupt handler
Figure 15.14 Example of SCI Transmit Operation (Example with 8-Bit Data,
Multiprocessor Bit, One Stop Bit)
Multiprocessor Serial Data Reception: Figure 15.15 shows a sample flowchart for
multiprocessor serial reception.
Use the following procedure for multiprocessor serial data reception after enabling the SCI for
reception.
Rev. 6.0, 07/02, page 638 of 986
Start of reception
1. ID reception cycle: Set the MPIE
bit in SCSCR1 to 1.
Set MPIE bit in SCSCR1 to 1
2. SCI status check, ID reception
and comparison: Read SCSSR1
and SCSCR1, and check that the
RDRF flag is set to 1 and MPIE
bit is set to 0, then read the
receive data in SCRDR1 and
compare it with this station’s ID.
Read ORER and FER flags
in SCSSR1
FER = 1 or ORER = 1?
Yes
If the data is not this station’s ID,
set the MPIE bit to 1 again, and
clear the RDRF flag to 0. If the
data is this station’s ID, clear the
RDRF flag to 0.
No
Read RDRF flag in SCSSR1
Read MPIE bit in SCSCR1
No
3. SCI status check and data
reception: Read SCSSR1 and
check that the RDRF flag is set to
1, then read the data in SCRDR1.
RDRF = 1 and MPIE = 0?
Yes
Read receive data in SCRDR1
No
This station’s ID?
Yes
Read ORER and FER flags
in SCSSR1
FER = 1 or ORER = 1?
Yes
No
Read RDRF flag in SCSSR1
RDRF = 1?
4. Receive error handling and break
detection: If a receive error
occurs, read the ORER and FER
flags in SCSSR1 to identify the
error. After performing the
appropriate error handling,
ensure that the ORER and FER
flags are all cleared to 0.
Reception cannot be resumed if
either of these flags is set to 1. In
the case of a framing error, a
break can be detected by reading
the RxD pin value.
No
Yes
Read receive data in SCRDR1
All data received?
Yes
No
Error handling
End of reception
Figure 15.15 Sample Multiprocessor Serial Reception Flowchart (1)
Rev. 6.0, 07/02, page 639 of 986
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
FER = 1?
Yes
Break?
Yes
No
Framing error handling
Clear RE bit in SCSCR1 to 0
Clear ORER and FER flags
in SCSSR1 to 0
End
Figure 15.15 Sample Multiprocessor Serial Reception Flowchart (2)
Rev. 6.0, 07/02, page 640 of 986
Figure 15.16 shows an example of SCI operation for multiprocessor format reception.
1
Start
Data (ID1)
bit
Serial
data
0
D0
D1
Data
(Data1)
Stop Start
MPB bit bit
D7
1
1
0
D0
D1
Stop
MPB bit
D7
0
1
Idle state
(mark state)
1
MPIE
RDRF
SCRDR1
value
ID1
RXI interrupt request
(multiprocessor
interrupt)
MPIE = 0
SCRDR1 data read
and RDRF flag
cleared to 0 by RXI
interrupt handler
As data is not this RXI interrupt
station’s ID, MPIE request
bit is set to 1 again
The RDRF flag
is cleared to 0
by the RXI
interrupt handler.
(a) Data does not match station’s ID
1
Start
Data (ID2)
bit
Serial
data
0
D0
D1
Stop Start
MPB bit bit
D7
1
1
0
Data
(Data2)
D0
D1
Stop
MPB bit
D7
0
1
1
Idle state
(mark state)
MPIE
RDRF
SCRDR1
value
ID2
ID1
RXI interrupt request
(multiprocessor interrupt)
MPIE = 0
SCRDR1 data read
and RDRF flag
cleared to 0 by RXI
interrupt handler
As data matches this
station’s ID, reception
continues and data is
received by RXI
interrupt handler
Data2
MPIE bit set
to 1 again
(b) Data matches station’s ID
Figure 15.16 Example of SCI Receive Operation (Example with 8-Bit Data, Multiprocessor
Bit, One Stop Bit)
Rev. 6.0, 07/02, page 641 of 986
In multiprocessor mode serial reception, the SCI operates as described below.
1. The SCI monitors the transmission line, and if a 0 start bit is detected, performs internal
synchronization and starts reception.
2. The received data is stored in SCRSR1 in LSB-to-MSB order.
3. If the MPIE bit is 1, MPIE is cleared to 0 when a 1 is received in the multiprocessor bit
position. If the multiprocessor bit is 0, the MPIE bit is not changed.
4. If the MPIE bit is 0, RDRF is checked at the stop bit position, and if RDRF is 1 the overrun
error bit is set. If the stop bit is not 0, the framing error bit is set. If RDRF is 0, the value in
SCRSR1 is transferred to SCRDR1, and if the stop bit is 0, RDRF is set to 1.
15.3.4
Operation in Synchronous Mode
In synchronous mode, data is transmitted or received in synchronization with clock pulses, making
it suitable for high-speed serial communication.
Inside the SCI, the transmitter and receiver are independent units, enabling full-duplex
communication. Both the transmitter and the receiver also have a double-buffered structure, so
that data can be read or written during transmission or reception, enabling continuous data
transfer.
Figure 15.17 shows the general format for synchronous serial communication.
One unit of transfer data (character or frame)
*
*
Serial clock
LSB
Serial data
Don’t care
Bit 0
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7 Don’t care
Note: * High except in continuous transmission/reception
Figure 15.17 Data Format in Synchronous Communication
In synchronous serial communication, data on the transmission line is output from one falling edge
of the serial clock to the next. Data confirmation is guaranteed at the rising edge of the serial
clock.
Rev. 6.0, 07/02, page 642 of 986
In serial communication, one character consists of data output starting with the LSB and ending
with the MSB. After the MSB is output, the transmission line holds the MSB state.
In synchronous mode, the SCI receives data in synchronization with the falling edge of the serial
clock.
Data Transfer Format
A fixed 8-bit data format is used. No parity or multiprocessor bits are added.
Clock
Either an internal clock generated by the on-chip baud rate generator or an external serial clock
input at the SCK pin can be selected, according to the setting of the C/$ bit in SCSMR1 and the
CKE1 and CKE0 bits in SCSCR1. For details of SCI clock source selection, see table 15.9.
When the SCI is operated on an internal clock, the serial clock is output from the SCK pin.
Eight serial clock pulses are output in the transfer of one character, and when no transfer is
performed the clock is fixed high. In reception only, if an on-chip clock source is selected, clock
pulses are output while RE = 1. When the last data is received, RE should be cleared to 0 before
the end of bit 7.
Data Transfer Operations
SCI Initialization (Synchronous Mode): Before transmitting and receiving data, it is necessary
to clear the TE and RE bits in SCSCR1 to 0, then initialize the SCI as described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to
0 before making the change using the following procedure. When the TE bit is cleared to 0, the
TDRE flag is set to 1 and SCTSR1 is initialized. Note that clearing the RE bit to 0 does not change
the contents of the RDRF, PER, FER, and ORER flags, or the contents of SCRDR1.
Figure 15.18 shows a sample SCI initialization flowchart.
Rev. 6.0, 07/02, page 643 of 986
1. Set the clock selection in SCSCR1.
Be sure to clear bits RIE, TIE, TEIE,
and MPIE, TE and RE, to 0.
Initialization
Clear TE and RE bits
in SCSCR1 to 0
2. Set transmit/receive format in
SCSMR1.
3. Write a value corresponding to the bit
rate into SCBRR1. (Not necessary if
an external clock is used.)
Set RIE, TIE, TEIE, MPIE, CKE1,
and CKE0 bits in SCSCR1
(leaving TE and RE bits
cleared to 0)
4. Wait at least one bit interval, then set
the TE bit or RE bit in SCSCR1 to 1.
Also set the RIE, TIE, TEIE, and MPIE
bits. Setting the TE and RE bits
enables the TxD and RxD pins to be
used.
Set transmit/receive format
in SCSMR1
Set value in SCBRR1
Wait
1-bit interval elapsed?
No
Yes
Set TE and RE bits in SCSCR1
to 1, and set RIE, TIE, TEIE,
and MPIE bits
End
Figure 15.18 Sample SCI Initialization Flowchart
Rev. 6.0, 07/02, page 644 of 986
Serial Data Transmission (Synchronous Mode): Figure 15.19 shows a sample flowchart for
serial transmission.
Use the following procedure for serial data transmission after enabling the SCI for transmission.
1. SCI status check and transmit
data write: Read SCSSR1 and
check that the TDRE flag is set to
1, then write transmit data to
SCTDR1 and clear the TDRE flag
to 0.
Start of transmission
Read TDRE flag in SCSSR1
TDRE = 1?
No
Yes
Write transmit data to SCTDR1
and clear TDRE flag
in SCSSR1 to 0
All data transmitted?
No
Yes
2. To continue serial transmission,
be sure to read 1 from the TDRE
flag to confirm that writing is
possible, then write data to
SCTDR1, and then clear the
TDRE flag to 0. (Checking and
clearing of the TDRE flag is
automatic when the direct
memory access controller
(DMAC) is activated by a
transmit-data-empty interrupt
(TXI) request, and data is written
to SCTDR1.)
Read TEND flag in SCSSR1
TEND = 1?
No
Yes
Clear TE bit in SCSCR1 to 0
End
Figure 15.19 Sample Serial Transmission Flowchart
Rev. 6.0, 07/02, page 645 of 986
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SCSSR1. When TDRE is cleared to 0, the SCI recognizes
that data has been written to SCTDR1, and transfers the data from SCTDR1 to SCTSR1.
2. After transferring data from SCTDR1 to SCTSR1, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI)
request is generated.
When clock output mode has been set, the SCI outputs 8 serial clock pulses. When use of an
external clock has been specified, data is output synchronized with the input clock.
The serial transmit data is sent from the TxD pin starting with the LSB (bit 0) and ending with
the MSB (bit 7).
3. The SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
If the TDRE flag is cleared to 0, data is transferred from SCTDR1 to SCTSR1, and serial
transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SCSSR1 is set to 1, the MSB (bit 7) is sent, and
the TxD pin maintains its state.
If the TEIE bit in SCSCR1 is set to 1 at this time, a transmit-end interrupt (TEI) request is
generated.
4. After completion of serial transmission, the SCK pin is fixed high.
Figure 15.20 shows an example of SCI operation in transmission.
Transfer
direction
Serial clock
LSB
Serial data
Bit 0
MSB
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI interrupt
request
Data written to SCTDR1
and TDRE flag cleared to
0 in TXI interrupt handler
TXI interrupt
request
One frame
Figure 15.20 Example of SCI Transmit Operation
Rev. 6.0, 07/02, page 646 of 986
TEI interrupt
request
Serial Data Reception (Synchronous Mode): Figure 15.21 shows a sample flowchart for serial
reception.
Use the following procedure for serial data reception after enabling the SCI for reception.
When changing the operating mode from asynchronous to synchronous, be sure to check that the
ORER, PER, and FER flags are all cleared to 0. The RDRF flag will not be set if the FER or PER
flag is set to 1, and neither transmit nor receive operations will be possible.
Start of reception
Read ORER flag in SCSSR1
Yes
ORER = 1?
No
Error handling
Read RDRF flag in SCSSR1
No
RDRF = 1?
Yes
Read receive data in SCRDR1,
and clear RDRF flag
in SCSSR1 to 0
No
All data received?
Yes
Clear RE bit in SCSCR1 to 0
End of reception
1. Receive error handling: If a
receive error occurs, read the
ORER flag in SCSSR1 , and
after performing the appropriate
error handling, clear the ORER
flag to 0. Transfer cannot be
resumed if the ORER flag is set
to 1.
2. SCI status check and receive
data read: Read SCSSR1 and
check that the RDRF flag is set
to 1, then read the receive data
in SCRDR1 and clear the RDRF
flag to 0. Transition of the RDRF
flag from 0 to 1 can also be
identified by an RXI interrupt.
3. Serial reception continuation
procedure: To continue serial
reception, finish reading the
RDRF flag, reading SCRDR1,
and clearing the RDRF flag to 0,
before the MSB (bit 7) of the
current frame is received. (The
RDRF flag is cleared
automatically when the direct
memory access controller
(DMAC) is activated by a
receive-data-full interrupt (RXI)
request and the SCRDR1 value
is read.)
Figure 15.21 Sample Serial Reception Flowchart (1)
Rev. 6.0, 07/02, page 647 of 986
Error handling
No
ORER = 1?
Yes
Overrun error handling
Clear ORER flag in SCSSR1 to 0
End
Figure 15.21 Sample Serial Reception Flowchart (2)
In serial reception, the SCI operates as described below.
1. The SCI performs internal initialization in synchronization with serial clock input or output.
2. The received data is stored in SCRSR1 in LSB-to-MSB order.
After reception, the SCI checks whether the RDRF flag is 0, indicating that the receive data
can be transferred from SCRSR1 to SCRDR1.
If this check is passed, the RDRF flag is set to 1, and the receive data is stored in SCRDR1. If
a receive error is detected in the error check, the operation is as shown in table 15.11.
Neither transmit nor receive operations can be performed subsequently when a receive error
has been found in the error check.
Also, as the RDRF flag is not set to 1 when receiving, the flag must be cleared to 0.
3. If the RIE bit in SCRSR1 is set to 1 when the RDRF flag changes to 1, a receive-data-full
interrupt (RXI) request is generated. If the RIE bit in SCRSR1 is set to 1 when the ORER flag
changes to 1, a receive-error interrupt (ERI) request is generated.
Figure 15.22 shows an example of SCI operation in reception.
Rev. 6.0, 07/02, page 648 of 986
Transfer
direction
Serial clock
Serial data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI interrupt
request
Data read from
SCRDR1 and RDRF
flag cleared to 0 in RXI
interrupt handler
RXI interrupt
request
ERI interrupt
request due to
overrun error
One frame
Figure 15.22 Example of SCI Receive Operation
Simultaneous Serial Data Transmission and Reception (Synchronous Mode): Figure 15.23
shows a sample flowchart for simultaneous serial transmit and receive operations.
Use the following procedure for simultaneous serial data transmit and receive operations after
enabling the SCI for transmission and reception.
Rev. 6.0, 07/02, page 649 of 986
Start of transmission/reception
Read TDRE flag in SCSSR1
No
TDRE = 1?
Yes
Write transmit data
to SCTDR1 and clear TDRE flag
in SCSSR1 to 0
1. SCI status check and transmit data
write:
Read SCSSR1 and check that the
TDRE flag is set to 1, then write
transmit data to SCTDR1 and clear
the TDRE flag to 0. Transition of the
TDRE flag from 0 to 1 can also be
identified by a TXI interrupt.
2. Receive error handling:
If a receive error occurs, read the
ORER flag in SCSSR1 , and after
performing the appropriate error
handling, clear the ORER flag to 0.
Transmission/reception cannot be
resumed if the ORER flag is set to 1.
3. SCI status check and receive data
read:
Read ORER flag in SCSSR1
Read SCSSR1 and check that the
RDRF flag is set to 1, then read the
receive data in SCRDR1 and clear the
Yes
ORER = 1?
RDRF flag to 0. Transition of the
RDRF flag from 0 to 1 can also be
identified by an RXI interrupt.
No
Error handling
Read RDRF flag in SCSSR1
No
RDRF = 1?
Yes
Read receive data in SCRDR1,
and clear RDRF flag
in SCSSR1 to 0
No
All data transferred?
Yes
Clear TE and RE bits
in SCRSR1 to 0
End of transmission/reception
4. Serial transmission/reception
continuation procedure:
To continue serial transmission/
reception, finish reading the RDRF
flag, reading SCRDR1, and clearing
the RDRF flag to 0, before the MSB
(bit 7) of the current frame is received.
Also, before the MSB (bit 7) of the
current frame is transmitted, read 1
from the TDRE flag to confirm that
writing is possible, then write data to
SCTDR1 and clear the TDRE flag to
0.
(Checking and clearing of the TDRE
flag is automatic when the DMAC is
activated by a transmit-data-empty
interrupt (TXI) request, and data is
written to SCTDR1. Similarly, the
RDRF flag is cleared automatically
when the DMAC is activated by a
receive-data-full interrupt (RXI)
request and the SCRDR1 value is
read.)
Note: When switching from transmit or receive operation to simultaneous transmit and receive
operations, first clear the TE bit and RE bit to 0, then set both these bits to 1.
Figure 15.23 Sample Flowchart for Serial Data Transmission and Reception
Rev. 6.0, 07/02, page 650 of 986
15.4
SCI Interrupt Sources and DMAC
The SCI has four interrupt sources: the transmit-end interrupt (TEI) request, receive-error interrupt
(ERI) request, receive-data-full interrupt (RXI) request, and transmit-data-empty interrupt (TXI)
request.
Table 15.12 shows the interrupt sources and their relative priorities. Individual interrupt sources
can be enabled or disabled with the TIE, RIE, and TEIE bits in SCRSR1, and the EIO bit in
SCSPTR1. Each kind of interrupt request is sent to the interrupt controller independently.
When the TDRE flag in the serial status register (SCSSR1) is set to 1, a TDR-empty request is
generated separately from the interrupt request. A TDR-empty request can activate the direct
memory access controller (DMAC) to perform data transfer. The TDRE flag is cleared to 0
automatically when a write to the transmit data register (SCTDR1) is performed by the DMAC.
When the RDRF flag in SCSSR1 is set to 1, an RDR-full request is generated separately from the
interrupt request. An RDR-full request can activate the DMAC to perform data transfer.
The RDRF flag is cleared to 0 automatically when a receive data register (SCRDR1) read is
performed by the DMAC.
When the ORER, FER, or PER flag in SCSSR1 is set to 1, an ERI interrupt request is generated.
The DMAC cannot be activated by an ERI interrupt request. When receive data processing is to be
carried out by the DMAC and receive error handling is to be performed by means of an interrupt
to the CPU, set the RIE bit to 1 and also set the EIO bit in SCSPTR1 to 1 so that an interrupt error
occurs only for a receive error. If the EIO bit is cleared to 0, interrupts to the CPU will be
generated even during normal data reception.
When the TEND flag in SCSSR1 is set to 1, a TEI interrupt request is generated. The DMAC
cannot be activated by a TEI interrupt request.
A TXI interrupt indicates that transmit data can be written, and a TEI interrupt indicates that the
transmit operation has ended.
Table 15.12 SCI Interrupt Sources
Interrupt
Source
Description
DMAC
Activation
Priority on
Reset Release
ERI
Receive error (ORER, FER, or PER)
Not possible High
RXI
Receive data register full (RDRF)
Possible
↑
TXI
Transmit data register empty (TDRE)
Possible
↓
TEI
Transmit end (TEND)
Not possible Low
See section 5, Exceptions, for the priority order and relation to non-SCI interrupts.
Rev. 6.0, 07/02, page 651 of 986
15.5
Usage Notes
The following points should be noted when using the SCI.
SCTDR1 Writing and the TDRE Flag: The TDRE flag in SCSSR1 is a status flag that indicates
that transmit data has been transferred from SCTDR1 to SCTSR1. When the SCI transfers data
from SCTDR1 to SCTSR1, the TDRE flag is set to 1.
Data can be written to SCTDR1 regardless of the state of the TDRE flag. However, if new data is
written to SCTDR1 when the TDRE flag is cleared to 0, the data stored in SCTDR1 will be lost
since it has not yet been transferred to SCTSR1. It is therefore essential to check that the TDRE
flag is set to 1 before writing transmit data to SCTDR1.
Simultaneous Multiple Receive Errors: If a number of receive errors occur at the same time, the
state of the status flags in SCSSR1 is as shown in table 15.13. If there is an overrun error, data is
not transferred from SCRSR1 to SCRDR1, and the receive data is lost.
Table 15.13 SCSSR1 Status Flags and Transfer of Receive Data
SCSSR1 Status Flags
Receive Errors
RDRF
ORER
FER
PER
Receive Data
Transfer
SCRSR1 → SCRDR1
Overrun error
1
1
0
0
X
Framing error
0
0
1
0
O
Parity error
0
0
0
1
O
Overrun error + framing error
1
1
1
0
X
Overrun error + parity error
1
1
0
1
X
Framing error + parity error
0
0
1
1
O
Overrun error + framing error +
parity error
1
1
1
1
X
O: Receive data is transferred from SCRSR1 to SCRDR1.
X: Receive data is not transferred from SCRSR1 to SCRDR1.
Break Detection and Processing: Break signals can be detected by reading the RxD pin directly
when a framing error (FER) is detected. In the break state the input from the RxD pin consists of
all 0s, so the FER flag is set and the parity error flag (PER) may also be set. Note that the SCI
receiver continues to operate in the break state, so if the FER flag is cleared to 0 it will be set to 1
again.
Rev. 6.0, 07/02, page 652 of 986
Sending a Break Signal: The input/output condition and level of the TxD pin are determined by
bits SPB0IO and SPB0DT in the serial port register (SCSPTR1). This feature can be used to send
a break signal.
After the serial transmitter is initialized, the TxD pin function is not selected and the value of the
SPB0DT bit substitutes for the mark state until the TE bit is set to 1 (i.e. transmission is enabled).
The SPB0IO and SPB0DT bits should therefore be set to 1 (designating output and high level)
beforehand.
To send a break signal during serial transmission, clear the SPB0DT bit to 0 (designating low
level), then clear the TE bit to 0 (halting transmission). When the TE bit is cleared to 0, the
transmitter is initialized regardless of its current state, and the TxD pin becomes an output port
outputting the value 0.
Receive Error Flags and Transmit Operations (Synchronous Mode Only): Transmission
cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if the TDRE
flag is set to 1. Be sure to clear the receive error flags to 0 before starting transmission.
Note also that the receive error flags are not cleared to 0 by clearing the RE bit to 0.
Receive Data Sampling Timing and Receive Margin in Asynchronous Mode: The SCI
operates on a base clock with a frequency of 16 times the bit rate. In reception, the SCI
synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive
data is latched at the rising edge of the eighth base clock pulse. The timing is shown in figure
15.24.
Rev. 6.0, 07/02, page 653 of 986
16 clocks
8 clocks
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5
Base clock
–7.5 clocks
Receive data
(RxD)
Start bit
+7.5 clocks
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 15.24 Receive Data Sampling Timing in Asynchronous Mode
The receive margin in asynchronous mode can therefore be expressed as shown in equation (1).
M = (0.5 –
M:
N:
D:
L:
F:
1
| D – 0.5 |
) – (L – 0.5) F –
(1 + F) × 100% ................. (1)
2N
N
Receive margin (%)
Ratio of clock frequency to bit rate (N = 16)
Clock duty cycle (D = 0 to 1.0)
Frame length (L = 9 to 12)
Absolute deviation of clock frequency
From equation (1), if F = 0 and D = 0.5, the receive margin is 46.875%, as given by equation (2).
When D = 0.5 and F = 0:
M = (0.5 – 1/(2 × 16)) × 100% = 46.875% ............................................ (2)
This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%.
Rev. 6.0, 07/02, page 654 of 986
When Using the DMAC:
• When an external clock source is used as the serial clock, the transmit clock should not be
input until at least 5 peripheral operating clock cycles after SCTDR1 is updated by the DMAC.
Incorrect operation may result if the transmit clock is input within 4 cycles after SCTDR1 is
updated. (See figure 15.25)
SCK
t
TDRE
TxD
D0
D1
D2
D3
D4
D5
D6
D7
Note: When operating on an external clock, set t > 4.
Figure 15.25 Example of Synchronous Transmission by DMAC
• When SCRDR1 is read by the DMAC, be sure to set the SCI receive-data-full interrupt (RXI)
as the activation source with bits RS3 to RS0 in CHCR.
• When using the DMAC for transmission/reception, making a setting to disable RXI and TXI
interrupt requests to the interrupt controller. Even if issuance of interrupt requests is set,
interrupt requests to the interrupt controller will be cleared by the DMAC independently of the
interrupt handling program.
When Using Synchronous External Clock Mode:
• Do not set TE or RE to 1 until at least 4 peripheral operating clock cycles after external clock
SCK has changed from 0 to 1.
• Only set both TE and RE to 1 when external clock SCK is 1.
• In reception, note that if RE is cleared to 0 from 2.5 to 3.5 peripheral operating clock cycles
after the rising edge of the RxD D7 bit SCK input, RDRF will be set to 1 but copying to
SCRDR1 will not be possible.
When Using Synchronous Internal Clock Mode: In reception, note that if RE is cleared to zero
1.5 peripheral operating clock cycles after the rising edge of the RxD D7 bit SCK output, RDRF
will be set to 1 but copying to SCRDR1 will not be possible.
When Using DMAC: When using the DMAC for transmission/reception, make a setting to
suppress output of RXI and TXI interrupt requests to the interrupt controller. Even if a setting is
made to output interrupt requests, interrupt requests to the interrupt controller will be cleared by
the DMAC independently of the interrupt handling program.
Rev. 6.0, 07/02, page 655 of 986
Rev. 6.0, 07/02, page 656 of 986
Section 16 Serial Communication Interface with FIFO
(SCIF)
16.1
Overview
The SH7750 Series is equipped with a single-channel serial communication interface with built-in
FIFO buffers (Serial Communication Interface with FIFO: SCIF). The SCIF can perform
asynchronous serial communication.
Sixteen-stage FIFO registers are provided for both transmission and reception, enabling fast,
efficient, and continuous communication.
16.1.1
Features
SCIF features are listed below.
• Asynchronous serial communication
Serial data communication is executed using an asynchronous system in which
synchronization is achieved character by character. Serial data communication can be carried
out with standard asynchronous communication chips such as a Universal Asynchronous
Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter (ACIA).
There is a choice of 8 serial data transfer formats.
Data length: 7 or 8 bits
Stop bit length: 1 or 2 bits
Parity: Even/odd/none
Receive error detection: Parity, framing, and overrun errors
Break detection: If the receive data following that in which a framing error occurred is also
at the space “0” level, and there is a frame error, a break is detected. When a framing error
occurs, a break can also be detected by reading the RxD2 pin level directly from the serial
port register (SCSPTR2).
• Full-duplex communication capability
The transmitter and receiver are independent units, enabling transmission and reception to be
performed simultaneously.
The transmitter and receiver both have a 16-stage FIFO buffer structure, enabling fast and
continuous serial data transmission and reception.
• On-chip baud rate generator allows any bit rate to be selected.
• Choice of serial clock source: internal clock from baud rate generator or external clock from
SCK2 pin
Rev. 6.0, 07/02, page 657 of 986
• Four interrupt sources
There are four interrupt sources—transmit-FIFO-data-empty, break, receive-FIFO-data-full,
and receive-error—that can issue requests independently.
• The DMA controller (DMAC) can be activated to execute a data transfer by issuing a DMA
transfer request in the event of a transmit-FIFO-data-empty or receive-FIFO-data-full interrupt.
• When not in use, the SCIF can be stopped by halting its clock supply to reduce power
consumption.
• Modem control functions (5765 and &765) are provided.
• The amount of data in the transmit/receive FIFO registers, and the number of receive errors in
the receive data in the receive FIFO register, can be ascertained.
• A timeout error (DR) can be detected during reception.
Rev. 6.0, 07/02, page 658 of 986
16.1.2
Block Diagram
Bus interface
Figure 16.1 shows a block diagram of the SCIF.
Module data bus
RxD2
SCFRDR2
(16-stage)
SCFTDR2
(16-stage)
SCRSR2
SCTSR2
SCSMR2
SCLSR2
SCFDR2
SCFCR2
SCFSR2
SCSCR2
SCSPTR2
SCBRR2
Pφ
Baud rate
generator
Parity generation
Pφ/4
Pφ/16
Transmission/
reception
control
TxD2
Internal
data bus
Pφ/64
Clock
Parity check
External clock
SCK2
TXI
RXI
ERI
BRI
SCIF
SCRSR2:
SCFRDR2:
SCTSR2:
SCFTDR2:
SCSMR2:
SCSCR2:
Receive shift register
Receive FIFO data register
Transmit shift register
Transmit FIFO data register
Serial mode register
Serial control register
SCFSR2:
SCBRR2:
SCSPTR2:
SCFCR2:
SCFDR2:
SCLSR2:
Serial status register
Bit rate register
Serial port register
FIFO control register
FIFO data count register
Line status register
Figure 16.1 Block Diagram of SCIF
Rev. 6.0, 07/02, page 659 of 986
16.1.3
Pin Configuration
Table 16.1 shows the SCIF pin configuration.
Table 16.1 SCIF Pins
Pin Name
Abbreviation
I/O
Function
Serial clock pin
SCK2/05(6(7
Input
Clock input
Receive data pin
MD2/RxD2
Input
Receive data input
Transmit data pin
MD1/TxD2
Output
Transmit data output
Modem control pin
&765
I/O
Transmission enabled
Modem control pin
MD8/5765
I/O
Transmission request
Note: After a power-on reset, these pins function as mode input pins MD0, MD1, MD2, MD7, and
MD8. These pins can function as serial pins by setting the SCIF operation with the TE, RE,
and CKE1 bits in SCSCR2 and the MCE bit in SCFCR2. These pins are made to function
as serial pins by performing SCIF operation settings with the TE, RE, and CKE1 bits in
SCSCR2 and the MCE bit in SCFCR2. Break state transmission and detection can be set in
the SCIF’s SCSPTR2 register.
Rev. 6.0, 07/02, page 660 of 986
16.1.4
Register Configuration
The SCIF has the internal registers shown in table 16.2. These registers are used to specify the
data format and bit rate, and to perform transmitter/receiver control.
Table 16.2 SCIF Registers
Name
Abbreviation
R/W
Initial
Value
P4
Address
Serial mode register
SCSMR2
R/W
H'0000
H'FFE80000 H'IFE80000 16
Bit rate register
SCBRR2
R/W
H'FF
H'FFE80004 H'IFE80004 8
Serial control register
SCSCR2
R/W
H'0000
H'FFE80008 H'IFE80008 16
Transmit FIFO data register SCFTDR2 W
Serial status register
SCFSR2
Area 7
Address
Access
Size
Undefined H'FFE8000C H'IFE8000C 8
R/(W)*
1
H'0060
H'FFE80010 H'IFE80010 16
Receive FIFO data register SCFRDR2 R
Undefined H'FFE80014 H'IFE80014 8
FIFO control register
SCFCR2
R/W
H'0000
FIFO data count register
SCFDR2
R
H'0000
Serial port register
H'0000*
SCSPTR2 R/W
Line status register
SCLSR2
R/(W)*
3
H'0000
H'FFE80018 H'IFE80018 16
H'FFE8001C H'IFE8001C 16
2
H'FFE80020 H'IFE80020 16
H'FFE80024 H'IFE80024 16
Notes: *1 Only 0 can be written, to clear flags. Bits 15 to 8, 3, and 2 are read-only, and cannot be
modified.
*2 The value of bits 6, 4, and 0 is undefined.
*3 Only 0 can be written, to clear flags. Bits 15 to 1 are read-only, and cannot be modified.
16.2
Register Descriptions
16.2.1
Receive Shift Register (SCRSR2)
Bit:
7
6
5
4
3
2
1
0
R/W:
—
—
—
—
—
—
—
—
SCRSR2 is the register used to receive serial data.
The SCIF sets serial data input from the RxD2 pin in SCRSR2 in the order received, starting with
the LSB (bit 0), and converts it to parallel data. When one byte of data has been received, it is
transferred to the receive FIFO register, SCFRDR2, automatically.
SCRSR2 cannot be directly read or written to by the CPU.
Rev. 6.0, 07/02, page 661 of 986
16.2.2
Receive FIFO Data Register (SCFRDR2)
Bit:
7
6
5
4
3
2
1
0
R/W:
R
R
R
R
R
R
R
R
SCFRDR2 is a 16-stage FIFO register that stores received serial data.
When the SCIF has received one byte of serial data, it transfers the received data from SCRSR2 to
SCFRDR2 where it is stored, and completes the receive operation. SCRSR2 is then enabled for
reception, and consecutive receive operations can be performed until the receive FIFO register is
full (16 data bytes).
SCFRDR2 is a read-only register, and cannot be written to by the CPU.
If a read is performed when there is no receive data in the receive FIFO register, an undefined
value will be returned. When the receive FIFO register is full of receive data, subsequent serial
data is lost.
The contents of SCFRDR2 are undefined after a power-on reset or manual reset.
16.2.3
Transmit Shift Register (SCTSR2)
Bit:
7
6
5
4
3
2
1
0
R/W:
—
—
—
—
—
—
—
—
SCTSR2 is the register used to transmit serial data.
To perform serial data transmission, the SCIF first transfers transmit data from SCFTDR2 to
SCTSR2, then sends the data to the TxD2 pin starting with the LSB (bit 0).
When transmission of one byte is completed, the next transmit data is transferred from SCFTDR2
to SCTSR2, and transmission started, automatically.
SCTSR2 cannot be directly read or written to by the CPU.
Rev. 6.0, 07/02, page 662 of 986
16.2.4
Transmit FIFO Data Register (SCFTDR2)
Bit:
7
6
5
4
3
2
1
0
R/W:
W
W
W
W
W
W
W
W
SCFTDR2 is an 8-bit 16-stage FIFO register that stores data for serial transmission.
If SCTSR2 is empty when transmit data has been written to SCFTDR2, the SCIF transfers the
transmit data written in SCFTDR2 to SCTSR2 and starts serial transmission.
SCFTDR2 is a write-only register, and cannot be read by the CPU.
The next data cannot be written when SCFTDR2 is filled with 16 bytes of transmit data. Data
written in this case is ignored.
The contents of SCFTDR2 are undefined after a power-on reset or manual reset.
16.2.5
Serial Mode Register (SCSMR2)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
CHR
PE
O/(
STOP
—
CKS1
CKS0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R/W
R/W
R/W
R/W
R
R/W
R/W
SCSMR2 is a 16-bit register used to set the SCIF’s serial transfer format and select the baud rate
generator clock source.
SCSMR2 can be read or written to by the CPU at all times.
SCSMR2 is initialized to H'0000 by a power-on reset or manual reset. It is not initialized in
standby mode or in the module standby state.
Bits 15 to 7—Reserved: These bits are always read as 0, and should only be written with 0.
Rev. 6.0, 07/02, page 663 of 986
Bit 6—Character Length (CHR): Selects 7 or 8 bits as the asynchronous mode data length.
Bit 6: CHR
Description
0
8-bit data
1
7-bit data*
(Initial value)
Note: * When 7-bit data is selected, the MSB (bit 7) of SCFTDR2 is not transmitted.
Bit 5—Parity Enable (PE): Selects whether or not parity bit addition is performed in
transmission, and parity bit checking in reception.
Bit 5: PE
Description
0
Parity bit addition and checking disabled
1
Parity bit addition and checking enabled*
(Initial value)
Note: * When the PE bit is set to 1, the parity (even or odd) specified by the O/( bit is added to
transmit data before transmission. In reception, the parity bit is checked for the parity (even
or odd) specified by the O/( bit.
Bit 4—Parity Mode (O/(
(): Selects either even or odd parity for use in parity addition and
checking. The O/( bit setting is only valid when the PE bit is set to 1, enabling parity bit addition
and checking. The O/( bit setting is invalid when parity addition and checking is disabled.
Bit 4: O/(
(
Description
0
Even parity*
1
2
Odd parity*
1
(Initial value)
Notes: *1 When even parity is set, parity bit addition is performed in transmission so that the total
number of 1-bits in the transmit character plus the parity bit is even. In reception, a
check is performed to see if the total number of 1-bits in the receive character plus the
parity bit is even.
*2 When odd parity is set, parity bit addition is performed in transmission so that the total
number of 1-bits in the transmit character plus the parity bit is odd. In reception, a check
is performed to see if the total number of 1-bits in the receive character plus the parity
bit is odd.
Bit 3—Stop Bit Length (STOP): Selects 1 or 2 bits as the stop bit length.
Bit 3: STOP
Description
0
1 stop bit*
1
2
2 stop bits*
1
(Initial value)
Notes: *1 In transmission, a single 1-bit (stop bit) is added to the end of a transmit character
before it is sent.
*2 In transmission, two 1-bits (stop bits) are added to the end of a transmit character
before it is sent.
Rev. 6.0, 07/02, page 664 of 986
In reception, only the first stop bit is checked, regardless of the STOP bit setting. If the second
stop bit is 1, it is treated as a stop bit; if it is 0, it is treated as the start bit of the next transmit
character.
Bit 2—Reserved: This bit is always read as 0, and should only be written with 0.
Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the onchip baud rate generator. The clock source can be selected from Pφ, Pφ/4, Pφ/16, and Pφ/64,
according to the setting of bits CKS1 and CKS0.
For the relation between the clock source, the bit rate register setting, and the baud rate, see
section 16.2.8, Bit Rate Register (SCBRR2).
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
Pφ clock
1
Pφ/4 clock
0
Pφ/16 clock
1
Pφ/64 clock
1
(Initial value)
Note: Pφ: Peripheral clock
16.2.6
Serial Control Register (SCSCR2)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
REIE
—
CKE1
—
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R
R/W
R
Initial value:
R/W:
The SCSCR2 register performs enabling or disabling of SCIF transfer operations, and interrupt
requests, and selection of the serial clock source.
SCSCR2 can be read or written to by the CPU at all times.
SCSCR2 is initialized to H'0000 by a power-on reset or manual reset. It is not initialized in
standby mode or in the module standby state.
Rev. 6.0, 07/02, page 665 of 986
Bits 15 to 8, 2, and 0—Reserved: These bits are always read as 0, and should only be written
with 0.
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables transmit-FIFO-data-empty
interrupt (TXI) request generation when serial transmit data is transferred from SCFTDR2 to
SCTSR2, the number of data bytes in the transmit FIFO register falls to or below the transmit
trigger set number, and the TDFE flag in the serial status register (SCFSR2) is set to 1.
Bit 7: TIE
Description
0
Transmit-FIFO-data-empty interrupt (TXI) request disabled*
1
Transmit-FIFO-data-empty interrupt (TXI) request enabled
(Initial value)
Note: * TXI interrupt requests can be cleared by writing transmit data exceeding the transmit trigger
set number to SCFTDR2 after reading 1 from the TDFE flag, then clearing it to 0, or by
clearing the TIE bit to 0.
Bit 6—Receive Interrupt Enable (RIE): Enables or disables generation of a receive-data-full
interrupt (RXI) request when the RDF flag or DR flag in SCFSR2 is set to 1, a receive-error
interrupt (ERI) request when the ER flag in SCFSR2 is set to 1, and a break interrupt (BRI)
request when the BRK flag in SCFSR2 or the ORER flag in SCLSR2 is set to 1.
Bit 6: RIE
Description
0
Receive-data-full interrupt (RXI) request, receive-error interrupt (ERI)
request, and break interrupt (BRI) request disabled*
(Initial value)
1
Receive-data-full interrupt (RXI) request, receive-error interrupt (ERI)
request, and break interrupt (BRI) request enabled
Note: * An RXI interrupt request can be cleared by reading 1 from the RDF or DR flag, then
clearing the flag to 0, or by clearing the RIE bit to 0. ERI and BRI interrupt requests can be
cleared by reading 1 from the ER, BRK, or ORER flag, then clearing the flag to 0, or by
clearing the RIE and REIE bits to 0.
Bit 5—Transmit Enable (TE): Enables or disables the start of serial transmission by the SCIF.
Bit 5: TE
Description
0
Transmission disabled
1
Transmission enabled*
(Initial value)
Note: * Serial transmission is started when transmit data is written to SCFTDR2 in this state.
Serial mode register (SCSMR2) and FIFO control register (SCFCR2) settings must be
made, the transmission format decided, and the transmit FIFO reset, before the TE bit is set
to 1.
Rev. 6.0, 07/02, page 666 of 986
Bit 4—Receive Enable (RE): Enables or disables the start of serial reception by the SCIF.
Bit 4: RE
Description
0
Reception disabled*
1
2
Reception enabled*
1
(Initial value)
Notes: *1 Clearing the RE bit to 0 does not affect the DR, ER, BRK, RDF, FER, PER, and ORER
flags, which retain their states.
*2 Serial transmission is started when a start bit is detected in this state.
Serial mode register (SCSMR2) and FIFO control register (SCFCR2) settings must be
made, the reception format decided, and the receive FIFO reset, before the RE bit is set
to 1.
Bit 3—Receive Error Interrupt Enable (REIE): Enables or disables generation of receive-error
interrupt (ERI) and break interrupt (BRI) requests. The REIE bit setting is valid only when the
RIE bit is 0.
Bit 3: REIE
Description
0
Receive-error interrupt (ERI) and break interrupt (BRI) requests disabled*
(Initial value)
1
Receive-error interrupt (ERI) and break interrupt (BRI) requests enabled
Note: * Receive-error interrupt (ERI) and break interrupt (BRI) requests can be cleared by reading 1
from the ER, BRK, or ORER flag, then clearing the flag to 0, or by clearing the RIE and
REIE bits to 0. When REIE is set to 1, ERI and BRI interrupt requests will be generated
even if RIE is cleared to 0. In DMAC transfer, this setting is made if the interrupt controller is
to be notified of ERI and BRI interrupt requests.
Bit 1—Clock Enable 1 (CKE1): Selects the SCIF clock source. The CKE1 bit must be set before
determining the SCIF’s operating mode with SCSMR2.
Bit 1: CKE1
Description
0
Internal clock/SCK2 pin functions as port
1
External clock/SCK2 pin functions as clock input*
(Initial value)
Note: * Inputs a clock with a frequency 16 times the bit rate.
Rev. 6.0, 07/02, page 667 of 986
16.2.7
Serial Status Register (SCFSR2)
Bit:
15
14
13
12
11
10
9
8
PER3
PER2
PER1
PER0
FER3
FER2
FER1
FER0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
ER
TEND
TDFE
BRK
FER
PER
RDF
DR
0
1
1
0
0
0
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/(W)*
R/(W)*
Initial value:
R/W:
Note: * Only 0 can be written, to clear the flag.
SCFSR2 is a 16-bit register. The lower 8 bits consist of status flags that indicate the operating
status of the SCIF, and the upper 8 bits indicate the number of receive errors in the data in the
receive FIFO register.
SCFSR2 can be read or written to by the CPU at all times. However, 1 cannot be written to flags
ER, TEND, TDFE, BRK, RDF, and DR. Also note that in order to clear these flags they must be
read as 1 beforehand. The FER flag and PER flag are read-only flags and cannot be modified.
SCFSR2 is initialized to H'0060 by a power-on reset or manual reset. It is not initialized in
standby mode or in the module standby state.
Bits 15 to 12—Number of Parity Errors (PER3–PER0): These bits indicate the number of data
bytes in which a parity error occurred in the receive data stored in SCFRDR2.
After the ER bit in SCFSR2 is set, the value indicated by bits 15 to 12 is the number of data bytes
in which a parity error occurred.
If all 16 bytes of receive data in SCFRDR2 have parity errors, the value indicated by bits PER3 to
PER0 will be 0.
Bits 11 to 8—Number of Framing Errors (FER3–FER0): These bits indicate the number of
data bytes in which a framing error occurred in the receive data stored in SCFRDR2.
After the ER bit in SCFSR2 is set, the value indicated by bits 11 to 8 is the number of data bytes in
which a framing error occurred.
If all 16 bytes of receive data in SCFRDR2 have framing errors, the value indicated by bits FER3
to FER0 will be 0.
Rev. 6.0, 07/02, page 668 of 986
Bit 7—Receive Error (ER): Indicates that a framing error or parity error occurred during
reception.*
Note: * The ER flag is not affected and retains its previous state when the RE bit in SCSCR2 is
cleared to 0. When a receive error occurs, the receive data is still transferred to SCFRDR2,
and reception continues.
The FER and PER bits in SCFSR2 can be used to determine whether there is a receive
error that is to be from SCFRDR2.
Bit 7: ER
Description
0
No framing error or parity error occurred during reception
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When 0 is written to ER after reading ER = 1
A framing error or parity error occurred during reception
[Setting conditions]
•
When the SCIF checks whether the stop bit at the end of the receive
data is 1 when reception ends, and the stop bit is 0*
•
When, in reception, the number of 1-bits in the receive data plus the
parity bit does not match the parity setting (even or odd) specified by the
O/( bit in SCSMR2
Note: * In 2-stop-bit mode, only the first stop bit is checked for a value of 1; the second stop bit is
not checked.
Rev. 6.0, 07/02, page 669 of 986
Bit 6—Transmit End (TEND): Indicates that there is no valid data in SCFTDR2 when the last
bit of the transmit character is sent, and transmission has been ended.
Bit 6: TEND
Description
0
Transmission is in progress
[Clearing conditions]
1
•
When transmit data is written to SCFTDR2, and 0 is written to TEND
after reading TEND = 1
•
When data is written to SCFTDR2 by the DMAC
Transmission has been ended
(Initial value)
[Setting conditions]
•
Power-on reset or manual reset
•
When the TE bit in SCSCR2 is 0
•
When there is no transmit data in SCFTDR2 on transmission of the last
bit of a 1-byte serial transmit character
Rev. 6.0, 07/02, page 670 of 986
Bit 5—Transmit FIFO Data Empty (TDFE): Indicates that data has been transferred from
SCFTDR2 to SCTSR2, the number of data bytes in SCFTDR2 has fallen to or below the transmit
trigger data number set by bits TTRG1 and TTRG0 in the FIFO control register (SCFCR2), and
new transmit data can be written to SCFTDR2.
Bit 5: TDFE
Description
0
A number of transmit data bytes exceeding the transmit trigger set number
have been written to SCFTDR2
[Clearing conditions]
1
•
When transmit data exceeding the transmit trigger set number is written
to SCFTDR2 after reading TDFE = 1, and 0 is written to TDFE
•
When transmit data exceeding the transmit trigger set number is written
to SCFTDR2 by the DMAC
The number of transmit data bytes in SCFTDR2 does not exceed the
transmit trigger set number
(Initial value)
[Setting conditions]
•
Power-on reset or manual reset
•
When the number of SCFTDR2 transmit data bytes falls to or below the
transmit trigger set number as the result of a transmit operation*
Note: * As SCFTDR2 is a 16-byte FIFO register, the maximum number of bytes that can be written
when TDFE = 1 is 16 - (transmit trigger set number). Data written in excess of this will be
ignored.
The number of data bytes in SCFTDR2 is indicated by the upper bits of SCFDR2.
Bit 4—Break Detect (BRK): Indicates that a receive data break signal has been detected.
Bit 4: BRK
Description
0
A break signal has not been received
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When 0 is written to BRK after reading BRK = 1
A break signal has been received*
[Setting condition]
When data with a framing error is received, followed by the space “0” level
(low level ) for at least one frame length
Note: * When a break is detected, the receive data (H'00) following detection is not transferred to
SCFRDR2. When the break ends and the receive signal returns to mark “1”, receive data
transfer is resumed.
Rev. 6.0, 07/02, page 671 of 986
Bit 3—Framing Error (FER): Indicates whether or not a framing error has been found in the
data that is to be read next from SCFRDR2.
Bit 3: FER
Description
0
There is no framing error that is to be read from SCFRDR2
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When there is no framing error in the data that is to be read next from
SCFRDR2
There is a framing error that is to be read from SCFRDR2
[Setting condition]
When there is a framing error in the data that is to be read next from
SCFRDR2
Bit 2—Parity Error (PER): Indicates whether or not a parity error has been found in the data that
is to be read next from SCFRDR2.
Bit 2: PER
Description
0
There is no parity error that is to be read from SCFRDR2
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When there is no parity error in the data that is to be read next from
SCFRDR2
There is a parity error in the receive data that is to be read from SCFRDR2
[Setting condition]
When there is a parity error in the data that is to be read next from
SCFRDR2
Rev. 6.0, 07/02, page 672 of 986
Bit 1—Receive FIFO Data Full (RDF): Indicates that the received data has been transferred
from SCRSR2 to SCFRDR2, and the number of receive data bytes in SCFRDR2 is equal to or
greater than the receive trigger number set by bits RTRG1 and RTRG0 in the FIFO control
register (SCFCR2).
Bit 1: RDF
Description
0
The number of receive data bytes in SCFRDR2 is less than the receive
trigger set number
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When SCFRDR2 is read until the number of receive data bytes in
SCFRDR2 falls below the receive trigger set number after reading RDF
= 1, and 0 is written to RDF
•
When SCFRDR2 is read by the DMAC until the number of receive data
bytes in SCFRDR2 falls below the receive trigger set number
The number of receive data bytes in SCFRDR2 is equal to or greater than
the receive trigger set number
[Setting condition]
When SCFRDR2 contains at least the receive trigger set number of receive
data bytes*
Note: * SCFRDR2 is a 16-byte FIFO register. When RDF = 1, at least the receive trigger set
number of data bytes can be read. If all the data in SCFRDR2 is read and another read is
performed, the data value will be undefined. The number of receive data bytes in SCFRDR2
is indicated by the lower bits of SCFDR2.
Rev. 6.0, 07/02, page 673 of 986
Bit 0—Receive Data Ready (DR): Indicates that there are fewer than the receive trigger set
number of data bytes in SCFRDR2, and no further data has arrived for at least 15 etu after the stop
bit of the last data received.
Bit 0: DR
Description
0
Reception is in progress or has ended normally and there is no receive data
left in SCFRDR2
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When all the receive data in SCFRDR2 has been read after reading DR
= 1, and 0 is written to DR
•
When all the receive data in SCFRDR2 has been read by the DMAC
No further receive data has arrived
[Setting condition]
When SCFRDR2 contains fewer than the receive trigger set number of
receive data bytes, and no further data has arrived for at least 15 etu after
the stop bit of the last data received*
Note: * Equivalent to 1.5 frames with an 8-bit, 1-stop-bit format.
etu: Elementary time unit (time for transfer of 1 bit)
16.2.8
Bit Rate Register (SCBRR2)
Bit:
7
6
5
4
3
2
1
0
Initial value:
1
1
1
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W:
SCBRR2 is an 8-bit register that sets the serial transfer bit rate in accordance with the baud rate
generator operating clock selected by bits CKS1 and CKS0 in SCSMR2.
SCBRR2 can be read or written to by the CPU at all times.
SCBRR2 is initialized to H'FF by a power-on reset or manual reset. It is not initialized in standby
mode or in the module standby state.
Rev. 6.0, 07/02, page 674 of 986
The SCBRR2 setting is found from the following equation.
Asynchronous mode:
Pφ
× 106 – 1
64 × 22n–1 × B
N=
Where B:
N:
Pφ:
n:
Bit rate (bits/s)
SCBRR2 setting for baud rate generator (0 ≤ N ≤ 255)
Peripheral module operating frequency (MHz)
Baud rate generator input clock (n = 0 to 3)
(See the table below for the relation between n and the clock.)
SCSMR2 Setting
n
Clock
CKS1
CKS0
0
Pφ
0
0
1
Pφ/4
0
1
2
Pφ/16
1
0
3
Pφ/64
1
1
The bit rate error in asynchronous mode is found from the following equation:
Error (%) =
16.2.9
Pφ × 106
– 1 × 100
(N + 1) × B × 64 × 22n–1
FIFO Control Register (SCFCR2)
Bit:
15
14
13
12
11
—
—
—
—
—
10
9
8
RSTRG2* RSTRG1* RSTRG0*
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R/W
R/W
R/W
Bit:
7
6
5
4
3
2
1
0
RTRG1
RTRG0
TTRG1
TTRG0
MCE
TFRST
RFRST
LOOP
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value:
R/W:
Note: * Reserved bit in the SH7750.
Rev. 6.0, 07/02, page 675 of 986
SCFCR2 performs data count resetting and trigger data number setting for the transmit and receive
FIFO registers, and also contains a loopback test enable bit.
SCFCR2 can be read or written to by the CPU at all times.
SCFCR2 is initialized to H'0000 by a power-on reset or manual reset. It is not initialized in
standby mode or in the module standby state.
Bits 15 to 11—Reserved: These bits are always read as 0, and should only be written with 0.
Bits 10 to 8 (SH7750)—Reserved: These bits are always read as 0, and should only be written
with 0.
Bits 10 to 8 (SH7750S, SH7750R)—5765
5765 Output Active Trigger (RSTRG2, RSTG1, and
RSTG0): These bits output the high level to the 5765 signal when the number of received data
stored in the receive FIFO data register (SCFRDR2) exceeds the trigger number, as shown in the
table below.
Bit 10: RSTRG2
Bit 9: RSTRG1
Bit 8: RSTRG0
5765 Output Active Trigger
0
0
0
15
1
1
0
4
1
6
0
8
1
10
0
12
1
14
1
1
0
1
(Initial value)
Bits 7 and 6—Receive FIFO Data Number Trigger (RTRG1, RTRG0): These bits are used to
set the number of receive data bytes that sets the receive data full (RDF) flag in the serial status
register (SCFSR2).
The RDF flag is set when the number of receive data bytes in SCFRDR2 is equal to or greater than
the trigger set number shown in the following table.
Bit 7: RTRG1
Bit 6: RTRG0
Receive Trigger Number
0
0
1
1
4
1
0
8
1
14
Rev. 6.0, 07/02, page 676 of 986
(Initial value)
Bits 5 and 4—Transmit FIFO Data Number Trigger (TTRG1, TTRG0): These bits are used
to set the number of remaining transmit data bytes that sets the transmit FIFO data register empty
(TDFE) flag in the serial status register (SCFSR2). The TDFE flag is set when the number of
transmit data bytes in SCFTDR2 is equal to or less than the trigger set number shown in the
following table.
Bit 5: TTRG1
Bit 4: TTRG0
Transmit Trigger Number
0
0
8 (8)
1
4 (12)
0
2 (14)
1
1 (15)
1
(Initial value)
Note: Figures in parentheses are the number of empty bytes in SCFTDR2 when the flag is set.
Bit 3—Modem Control Enable (MCE): Enables the &765 and 5765 modem control signals.
Bit 3: MCE
Description
0
Modem signals disabled*
1
Modem signals enabled
(Initial value)
Note: * &765 is fixed at active-0 regardless of the input value, and 5765 output is also fixed at 0.
Bit 2—Transmit FIFO Data Register Reset (TFRST): Invalidates the transmit data in the
transmit FIFO data register and resets it to the empty state.
Bit 2: TFRST
Description
0
Reset operation disabled*
1
Reset operation enabled
(Initial value)
Note: * A reset operation is performed in the event of a power-on reset or manual reset.
Bit 1—Receive FIFO Data Register Reset (RFRST): Invalidates the receive data in the receive
FIFO data register and resets it to the empty state.
Bit 1: RFRST
Description
0
Reset operation disabled*
1
Reset operation enabled
(Initial value)
Note: * A reset operation is performed in the event of a power-on reset or manual reset.
Rev. 6.0, 07/02, page 677 of 986
Bit 0—Loopback Test (LOOP): Internally connects the transmit output pin (TxD2) and receive
input pin (RxD2), and the 5765 pin and &765 pin, enabling loopback testing.
Bit 0: LOOP
Description
0
Loopback test disabled
1
Loopback test enabled
(Initial value)
16.2.10 FIFO Data Count Register (SCFDR2)
SCFDR2 is a 16-bit register that indicates the number of data bytes stored in SCFTDR2 and
SCFRDR2.
The upper 8 bits show the number of transmit data bytes in SCFTDR2, and the lower 8 bits show
the number of receive data bytes in SCFRDR2.
SCFDR2 can be read by the CPU at all times.
Bit:
15
14
13
12
11
10
9
8
—
—
—
T4
T3
T2
T1
T0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
These bits show the number of untransmitted data bytes in SCFTDR2. A value of H'00 indicates
that there is no transmit data, and a value of H'10 indicates that SCFTDR2 is full of transmit data.
Bit:
7
6
5
4
3
2
1
0
—
—
—
R4
R3
R2
R1
R0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
These bits show the number of receive data bytes in SCFRDR2. A value of H'00 indicates that
there is no receive data, and a value of H'10 indicates that SCFRDR2 is full of receive data.
Rev. 6.0, 07/02, page 678 of 986
16.2.11 Serial Port Register (SCSPTR2)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
RTSIO
RTSDT
CTSIO
CTSDT
—
—
0
—
0
—
0
0
0
—
R/W
R/W
R/W
R/W
R
R
R/W
R/W
Initial value:
R/W:
SPB2IO SPB2DT
SCSPTR2 is a 16-bit readable/writable register that controls input/output and data for the port pins
multiplexed with the serial communication interface (SCIF) pins. Input data can be read from the
RxD2 pin, output data written to the TxD2 pin, and breaks in serial transmission/reception
controlled, by means of bits 1 and 0. Data can be read from, and output data written to, the &765
pin by means of bits 5 and 4. Data can be read from, and output data written to, the 5765 pin by
means of bits 6 and 7.
SCSPTR2 can be read or written to by the CPU at all times. All SCSPTR2 bits except bits 6, 4,
and 0 are initialized to 0 by a power-on reset or manual reset; the value of bits 6, 4, and 0 is
undefined. SCSPTR2 is not initialized in standby mode or in the module standby state.
Bits 15 to 8—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 7—Serial Port RTS Port I/O (RTSIO): Specifies the serial port 5765 pin input/output
condition. When the 5765 pin is actually set as a port output pin and outputs the value set by the
RTSDT bit, the MCE bit in SCFCR2 should be cleared to 0.
Bit 7: RTSIO
Description
0
RTSDT bit value is not output to 5765 pin
1
RTSDT bit value is output to 5765 pin
(Initial value)
Rev. 6.0, 07/02, page 679 of 986
Bit 6—Serial Port RTS Port Data (RTSDT): Specifies the serial port 5765 pin input/output
data. Input or output is specified by the RTSIO bit (see the description of bit 7, RTSIO, for
details). In output mode, the RTSDT bit value is output to the 5765 pin. The 5765 pin value is
read from the RTSDT bit regardless of the value of the RTSIO bit. The initial value of this bit
after a power-on reset or manual reset is undefined.
Bit 6: RTSDT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Bit 5—Serial Port CTS Port I/O (CTSIO): Specifies the serial port &765 pin input/output
condition. When the &765 pin is actually set as a port output pin and outputs the value set by the
CTSDT bit, the MCE bit in SCFCR2 should be cleared to 0.
Bit 5: CTSIO
Description
0
CTSDT bit value is not output to &765 pin
1
CTSDT bit value is output to &765 pin
(Initial value)
Bit 4—Serial Port CTS Port Data (CTSDT): Specifies the serial port &765 pin input/output
data. Input or output is specified by the CTSIO bit (see the description of bit 5, CTSIO, for
details). In output mode, the CTSDT bit value is output to the &765 pin. The &765 pin value is
read from the CTSDT bit regardless of the value of the CTSIO bit. The initial value of this bit
after a power-on reset or manual reset is undefined.
Bit 4: CTSDT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Bits 3 and 2—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 1—Serial Port Break I/O (SPB2IO): Specifies the serial port TxD2 pin output condition.
When the TxD2 pin is actually set as a port output pin and outputs the value set by the SPB2DT
bit, the TE bit in SCSCR2 should be cleared to 0.
Bit 1: SPB2IO
Description
0
SPB2DT bit value is not output to the TxD2 pin
1
SPB2DT bit value is output to the TxD2 pin
Rev. 6.0, 07/02, page 680 of 986
(Initial value)
Bit 0—Serial Port Break Data (SPB2DT): Specifies the serial port RxD2 pin input data and
TxD2 pin output data. The TxD2 pin output condition is specified by the SPB2IO bit (see the
description of bit 1, SPB2IO, for details). When the TxD2 pin is designated as an output, the value
of the SPB2DT bit is output to the TxD2 pin. The RxD2 pin value is read from the SPB2DT bit
regardless of the value of the SPB2IO bit. The initial value of this bit after a power-on reset or
manual reset is undefined.
Bit 0: SPB2DT
Description
0
Input/output data is low-level
1
Input/output data is high-level
SCIF I/O port block diagrams are shown in figures 16.2 to 16.5.
Reset
R
D7
Q
D
RTSIO
C
Internal data bus
SPTRW
Reset
MD8/
R
D6
Q
D
RTSDT
C
SPTRW
SCIF
Modem control
enable signal*
signal
Mode setting
register
SPTRR
SPTRW: Write to SPTR
SPTRR: Read SPTR
Note: * The
pin function is designated as modem control by the MCE bit in SCFCR2.
Figure 16.2 MD8/5765
5765 Pin
Rev. 6.0, 07/02, page 681 of 986
Reset
R
Q
D
CTSIO
C
D5
Internal data bus
SPTRW
Reset
R
Q
D
CTSDT
C
D4
SCIF
SPTRW
signal
Modem control enable signal*
SPTRR
SPTRW: Write to SPTR
SPTRR: Read SPTR
Note: * The
pin function is designated as modem control by the MCE bit in SCFCR2.
Figure 16.3 &765 Pin
Rev. 6.0, 07/02, page 682 of 986
Reset
R
Q
D
SPB2IO
C
D1
Internal data bus
SPTRW
Reset
MD1/TxD2
R
Q
D
SPB2DT
C
D0
SCIF
Transmit enable
signal
SPTRW
Mode setting
register
Serial transmit data
SPTRW: Write to SPTR
Figure 16.4 MD1/TxD2 Pin
SCIF
MD2/RxD2
Serial receive
data
Mode setting
register
D0
Internal data bus
SPTRR
SPTRR: Read SPTR
Figure 16.5 MD2/RxD2 Pin
Rev. 6.0, 07/02, page 683 of 986
16.2.12 Line Status Register (SCLSR2)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
ORER
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
(R/W)*
Note: * Only 0 can be written, to clear the flag.
Bits 15 to 1—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 0—Overrun Error (ORER): Indicates that an overrun error occurred during reception,
causing abnormal termination.
Bit 0: ORER
Description
0
Reception in progress, or reception has ended normally*
1
(Initial value)
[Clearing conditions]
1
•
Power-on reset or manual reset
•
When 0 is written to ORER after reading ORER = 1
An overrun error occurred during reception*
2
[Setting condition]
When the next serial reception is completed while the receive FIFO is full
Notes: *1 The ORER flag is not affected and retains its previous state when the RE bit in
SCSCR2 is cleared to 0.
*2 The receive data prior to the overrun error is retained in SCFRDR2, and the data
received subsequently is lost. Serial reception cannot be continued while the ORER flag
is set to 1.
Rev. 6.0, 07/02, page 684 of 986
16.3
Operation
16.3.1
Overview
The SCIF can carry out serial communication in asynchronous mode, in which synchronization is
achieved character by character. See section 15.3.2, Operation in Asynchronous Mode, for details.
Sixteen-stage FIFO buffers are provided for both transmission and reception, reducing the CPU
overhead and enabling fast, continuous communication to be performed. 5765 and &765 signals
are also provided as modem control signals.
The transmission format is selected using the serial mode register (SCSMR2), as shown in table
16.3. The SCIF clock source is determined by the CKE1 bit in the serial control register
(SCSCR2), as shown in table 16.4.
• Data length: Choice of 7 or 8 bits
• Choice of parity addition and addition of 1 or 2 stop bits (the combination of these parameters
determines the transfer format and character length)
• Detection of framing errors, parity errors, receive-FIFO-data-full state, overrun errors, receivedata-ready state, and breaks, during reception
• Indication of the number of data bytes stored in the transmit and receive FIFO registers
• Choice of internal or external clock as SCIF clock source
When internal clock is selected: The SCIF operates on the baud rate generator clock, and can
output a clock with a frequency of 16 times the bit rate.
When external clock is selected: A clock with a frequency of 16 times the bit rate must be
input (the on-chip baud rate generator is not used).
Table 16.3 SCSMR2 Settings for Serial Transfer Format Selection
SCSMR2 Settings
SCIF Transfer Format
Bit 6:
CHR
Bit 5:
PE
Bit 3:
STOP
Mode
Data
Length
Multiprocessor
Bit
0
0
0
Asynchronous mode
8-bit data No
Parity
Bit
Stop Bit
Length
No
1 bit
1
1
2 bits
0
Yes
1
1
0
0
2 bits
7-bit data
No
1
1
0
1
1 bit
1 bit
2 bits
Yes
1 bit
2 bits
Rev. 6.0, 07/02, page 685 of 986
Table 16.4 SCSCR2 Settings for SCIF Clock Source Selection
SCSCR2 Setting
SCIF Transmit/Receive Clock
Bit 1: CKE1
Mode
Clock Source
SCK2 Pin Function
0
Asynchronous mode
Internal
SCIF does not use SCK2 pin
External
Inputs clock with frequency of 16
times the bit rate
1
16.3.2
Serial Operation
Transmit/Receive Format
Table 16.5 shows the transmit/receive formats that can be used. Any of 8 transfer formats can be
selected according to the SCSMR2 settings.
Rev. 6.0, 07/02, page 686 of 986
Table 16.5 Serial Transmit/Receive Formats
SCSMR2
Settings
Serial Transmit/Receive Format and Frame Length
CHR PE
STOP
1
2
3
4
5
6
7
8
9
10
11
12
0
0
0
S
8-bit data
STOP
0
0
1
S
8-bit data
STOP STOP
0
1
0
S
8-bit data
P
STOP
0
1
1
S
8-bit data
P
STOP STOP
1
0
0
S
7-bit data
STOP
1
0
1
S
7-bit data
STOP STOP
1
1
0
S
7-bit data
P
STOP
1
1
1
S
7-bit data
P
STOP STOP
S:
Start bit
STOP: Stop bit
P:
Parity bit
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK2 pin can be selected as the SCIF’s serial clock, according to the setting of the CKE1 bit
in SCSCR2. For details of SCIF clock source selection, see table 16.4.
When an external clock is input at the SCK2 pin, the clock frequency should be 16 times the bit
rate used.
Rev. 6.0, 07/02, page 687 of 986
Data Transfer Operations
SCIF Initialization: Before transmitting and receiving data, it is necessary to clear the TE and RE
bits in SCSCR2 to 0, then initialize the SCIF as described below.
When the transfer format, etc., is changed, the TE and RE bits must be cleared to 0 before making
the change using the following procedure. When the TE bit is cleared to 0, SCTSR2 is initialized.
Note that clearing the TE and RE bits to 0 does not change the contents of SCFSR2, SCFTDR2, or
SCFRDR2. The TE bit should be cleared to 0 after all transmit data has been sent and the TEND
flag in SCFSR2 has been set. TEND can also be cleared to 0 during transmission, but the data
being transmitted will go to the mark state after the clearance. Before setting TE again to start
transmission, the TFRST bit in SCFCR2 should first be set to 1 to reset SCFTDR2.
When an external clock is used the clock should not be stopped during operation, including
initialization, since operation will be unreliable in this case.
Figure 16.6 shows a sample SCIF initialization flowchart.
Rev. 6.0, 07/02, page 688 of 986
1. Set the clock selection in SCSCR2.
Initialization
Be sure to clear bits RIE and TIE,
and bits TE and RE, to 0.
Clear TE and RE bits
in SCSCR2 to 0
2. Set the transmit/receive format in
SCSMR2.
3. Write a value corresponding to the
bit rate into SCBRR2. (Not
necessary if an external clock is
used.)
Set TFRST and RFRST bits
in SCFCR2 to 1
Set CKE1 bit in SCSCR2
(leaving TE and RE bits
cleared to 0)
4. Wait at least one bit interval, then
set the TE bit or RE bit in SCSCR2
to 1. Also set the RIE, REIE, and
TIE bits.
Setting the TE and RE bits enables
the TxD2 and RxD2 pins to be
used. When transmitting, the SCIF
will go to the mark state; when
receiving, it will go to the idle state,
waiting for a start bit.
Set transmit/receive format
in SCSMR2
Set value in SCBRR2
Wait
1-bit interval elapsed?
No
Yes
Set RTRG1–0, TTRG1–0,
and MCE bits in SCFCR2
Clear TFRST and RFRST bits to 0
Set TE and RE bits
in SCSCR2 to 1,
and set RIE, TIE, and REIE bits
End
Figure 16.6 Sample SCIF Initialization Flowchart
Rev. 6.0, 07/02, page 689 of 986
Serial Data Transmission: Figure 16.7 shows a sample flowchart for serial transmission.
Use the following procedure for serial data transmission after enabling the SCIF for transmission.
1. SCIF status check and transmit data
write:
Start of transmission
Read TDFE flag in SCFSR2
TDFE = 1?
No
The number of transmit data bytes
that can be written is 16 - (transmit
trigger set number).
Yes
Write transmit data (16 - transmit
trigger set number) to SCFTDR2,
read 1 from TDFE flag and TEND
flag in SCFSR2, then clear to 0
All data transmitted?
2. Serial transmission continuation
procedure:
No
Yes
No
Yes
Break output?
Yes
Clear SPB2DT to 0 and
set SPB2IO to 1
To continue serial transmission, read
1 from the TDFE flag to confirm that
writing is possible, then write data to
SCFTDR2, and then clear the TDFE
flag to 0.
3. Break output at the end of serial
transmission:
Read TEND flag in SCFSR2
TEND = 1?
Read SCFSR2 and check that the
TDFE flag is set to 1, then write
transmit data to SCFTDR2, read 1
from the TDFE and TEND flags, then
clear these flags to 0.
No
To output a break in serial
transmission, clear the SPB2DT bit to
0 and set the SPB2IO bit to 1 in
SCSPTR2, then clear the TE bit in
SCSCR2 to 0.
In steps 1 and 2, it is possible to
ascertain the number of data bytes
that can be written from the number
of transmit data bytes in SCFTDR2
indicated by the upper 8 bits of
SCFDR2.
Clear TE bit in SCSCR2 to 0
End of transmission
Figure 16.7 Sample Serial Transmission Flowchart
Rev. 6.0, 07/02, page 690 of 986
In serial transmission, the SCIF operates as described below.
1. When data is written into SCFTDR2, the SCIF transfers the data from SCFTDR2 to SCTSR2
and starts transmitting. Confirm that the TDFE flag in the serial status register (SCFSR2) is set
to 1 before writing transmit data to SCFTDR2. The number of data bytes that can be written is
at least 16 - transmit trigger setting.
2. When data is transferred from SCFTDR2 to SCTSR2 and transmission is started, consecutive
transmit operations are performed until there is no transmit data left in SCFTDR2. When the
number of transmit data bytes in SCFTDR2 falls to or below the transmit trigger number set in
the FIFO control register (SCFCR2), the TDFE flag is set. If the TIE bit in SCSCR2 is set to 1
at this time, a transmit-FIFO-data-empty interrupt (TXI) request is generated.
The serial transmit data is sent from the TxD2 pin in the following order.
a. Start bit: One 0-bit is output.
b. Transmit data: 8-bit or 7-bit data is output in LSB-first order.
c. Parity bit: One parity bit (even or odd parity) is output. (A format in which a parity bit is
not output can also be selected.)
d. Stop bit(s): One or two 1-bits (stop bits) are output.
e. Mark state: 1 is output continuously until the start bit that starts the next transmission is
sent.
3. The SCIF checks the SCFTDR2 transmit data at the timing for sending the stop bit. If data is
present, the data is transferred from SCFTDR2 to SCTSR2, the stop bit is sent, and then serial
transmission of the next frame is started.
If there is no transmit data, the TEND flag in SCFSR2 is set to 1, the stop bit is sent, and then
the line goes to the mark state in which 1 is output.
Figure 16.8 shows an example of the operation for transmission in asynchronous mode.
Rev. 6.0, 07/02, page 691 of 986
Start
bit
1
Serial
data
Data
0
D0
D1
Parity Stop Start
bit
bit bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
1
Idle state
(mark state)
1
TDFE
TEND
TXI interrupt
TXI interrupt
request
request
Data written to SCFTDR2
and TDFE flag read as 1
then cleared to 0 by TXI
interrupt handler
One frame
Figure 16.8 Example of Transmit Operation
(Example with 8-Bit Data, Parity, One Stop Bit)
4. When modem control is enabled, transmission can be stopped and restarted in accordance with
the &765 input value. When &765 is set to 1, if transmission is in progress, the line goes to the
mark state after transmission of one frame. When &765 is set to 0, the next transmit data is
output starting from the start bit.
Figure 16.9 shows an example of the operation when modem control is used.
Start
bit
Serial data
TxD2
0
Parity Stop
bit
bit
D0
D1
D7 0/1
1
Start
bit
0
D0 D1
D7 0/1
CTS2
Drive high before stop bit
Figure 16.9 Example of Operation Using Modem Control (&765
&765)
&765
Rev. 6.0, 07/02, page 692 of 986
Serial Data Reception: Figure 16.10 shows a sample flowchart for serial reception.
Use the following procedure for serial data reception after enabling the SCIF for reception.
Start of reception
Read ER, DR, BRK flags in
SCFSR2 and ORER
flag in SCLSR2
ER or DR or BRK or ORER
= 1?
No
Read RDF flag in SCFSR2
No
RDF = 1?
Yes
Read receive data in
SCFRDR2, and clear RDF
flag in SCFSR2 to 0
No
All data received?
Yes
Clear RE bit in SCSCR2 to 0
End of reception
Yes
Error handling
1. Receive error handling and
break detection: Read the DR,
ER, and BRK flags in
SCFSR2, and the ORER flag
in SCLSR2, to identify any
error, perform the appropriate
error handling, then clear the
DR, ER, BRK, and ORER
flags to 0. In the case of a
framing error, a break can also
be detected by reading the
value of the RxD2 pin.
2. SCIF status check and receive
data read : Read SCFSR2 and
check that RDF = 1, then read
the receive data in SCFRDR2,
read 1 from the RDF flag, and
then clear the RDF flag to 0.
The transition of the RDF flag
from 0 to 1 can also be
identified by an RXI interrupt.
3. Serial reception continuation
procedure: To continue serial
reception, read at least the
receive trigger set number of
receive data bytes from
SCFRDR2, read 1 from the
RDF flag, then clear the RDF
flag to 0. The number of
receive data bytes in
SCFRDR2 can be ascertained
by reading the lower bits of
SCFDR2.
Figure 16.10 Sample Serial Reception Flowchart (1)
Rev. 6.0, 07/02, page 693 of 986
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
1. Whether a framing error or parity error
has occurred that is to be read from
SCFRDR2 can be ascertained from
the FER and PER bits in SCFSR2.
2. When a break signal is received,
receive data is not transferred to
SCFRDR2 while the BRK flag is set.
However, note that the last data in
SCFRDR2 is H'00 (the break data in
which a framing error occurred is
stored).
ER = 1?
Yes
Receive error handling
No
BRK = 1?
Yes
Break handling
No
DR = 1?
Yes
Read receive data in SCFRDR2
Clear DR, ER, BRK flags
in SCFSR2,
and ORER flag in SCLSR2, to 0
End
Figure 16.10 Sample Serial Reception Flowchart (2)
Rev. 6.0, 07/02, page 694 of 986
In serial reception, the SCIF operates as described below.
1. The SCIF monitors the transmission line, and if a 0 start bit is detected, performs internal
synchronization and starts reception.
2. The received data is stored in SCRSR2 in LSB-to-MSB order.
3. The parity bit and stop bit are received.
After receiving these bits, the SCIF carries out the following checks.
a. Stop bit check: The SCIF checks whether the stop bit is 1. If there are two stop bits, only
the first is checked.
b. The SCIF checks whether receive data can be transferred from the receive shift register
(SCRSR2) to SCFRDR2.
c. Overrun error check: The SCIF checks that the ORER flag is 0, indicating that no overrun
error has occurred.
d. Break check: The SCIF checks that the BRK flag is 0, indicating that the break state is not
set.
If b, c, and d checks are passed, the receive data is stored in SCFRDR2.
Note: Reception continues when parity error, framing error occurs.
4. If the RIE bit in SCSCR2 is set to 1 when the RDF or DR flag changes to 1, a receive-FIFOdata-full interrupt (RXI) request is generated.
If the RIE bit or REIE bit in SCSCR2 is set to 1 when the ER flag changes to 1, a receive-error
interrupt (ERI) request is generated.
If the RIE bit or REIE bit in SCSCR2 is set to 1 when the BRK or ORER flag changes to 1, a
break reception interrupt (BRI) request is generated.
Figure 16.11 shows an example of the operation for reception in asynchronous mode.
Rev. 6.0, 07/02, page 695 of 986
1
Start
bit
Serial
data
0
Data
D0
D1
Parity Stop Start
bit
bit bit
D7
0/1
1
0
Data
D0
Parity Stop
bit
bit
D1
D7
0/1
0
0/1
RDF
FER
RXI interrupt
request
One frame
Data read and RDF flag
read as 1 then cleared to
0 by RXI interrupt handler
ERI interrupt request
generated by receive
error
Figure 16.11 Example of SCIF Receive Operation
(Example with 8-Bit Data, Parity, One Stop Bit)
5. When modem control is enabled, the 5765 signal is output when SCFRDR2 is empty. When
5765 is 0, reception is possible.
When 5765 is 1, this indicates that SCFRDR2 contains 15 or more
bytes of data.
SH7750:
SH7750S, SH7750R: When 5765 is 1, this indicates that SCFRDR2 contains a number of
data bytes equal to or greater than the 5765 output active trigger set
number. The 5765 output active trigger value is specified by bits 10 to
8 in the FIFO control register (SCFCR2), described in section 16.2.9,
FIFO control register (SCFCR2).
5765 also becomes 1 when bit 4 (RE) in SCSCR2 is 0.
Figure 16.12 shows an example of the operation when modem control is used.
Parity Stop
bit
bit
Start
bit
Serial data
RxD2
0
D0
D1
D2
D7 0/1 1
Start
bit
0
Figure 16.12 Example of Operation Using Modem Control (5765
5765)
5765
Rev. 6.0, 07/02, page 696 of 986
16.4
SCIF Interrupt Sources and the DMAC
The SCIF has four interrupt sources: transmit-FIFO-data-empty interrupt (TXI) request, receiveerror interrupt (ERI) request, receive-FIFO-data-full interrupt (RXI) request, and break interrupt
(BRI) request.
Table 16.6 shows the interrupt sources and their order of priority. The interrupt sources are
enabled or disabled by means of the TIE, RIE, and REIE bits in SCSCR2. A separate interrupt
request is sent to the interrupt controller for each of these interrupt sources.
When transmission/reception is carried out using the DMAC, output of interrupt requests to the
interrupt controller can be inhibited by clearing the RIE bit in SCSCR2 to 0. By setting the REIE
bit to 1 while the RIE bit is cleared to 0, it is possible to output ERI and BRI interrupt requests, but
not RXI interrupt requests.
When the TDFE flag in the serial status register (SCFSR2) is set to 1, a transmit-FIFO-data-empty
request is generated separately from the interrupt request. A transmit-FIFO-data-empty request
can activate the DMAC to perform data transfer.
When the RDF flag or DR flag in SCFSR2 is set to 1, a receive-FIFO-data-full request is
generated separately from the interrupt request. A receive-FIFO-data-full request can activate the
DMAC to perform data transfer.
When using the DMAC for transmission/reception, set and enable the DMAC before making the
SCIF settings. See section 14, Direct Memory Access Controller (DMAC), for details of the
DMAC setting procedure.
When the BRK flag in SCFSR2 or the ORER flag in the line status register (SCLSR2) is set to 1, a
BRI interrupt request is generated.
The TXI interrupt indicates that transmit data can be written, and the RXI interrupt indicates that
there is receive data in SCFRDR2.
Table 16.6 SCIF Interrupt Sources
Interrupt
Source
Description
DMAC
Activation
Priority on
Reset Release
ERI
Interrupt initiated by receive error flag (ER)
Not possible
High
RXI
Interrupt initiated by receive FIFO data full flag
(RDF) or receive data ready flag (DR)
Possible
BRI
Interrupt initiated by break flag (BRK) or overrun Not possible
error flag (ORER)
TXI
Interrupt initiated by transmit FIFO data empty
flag (TDFE)
Possible
Low
Rev. 6.0, 07/02, page 697 of 986
See section 5, Exceptions, for priorities and the relationship with non-SCIF interrupts.
16.5
Usage Notes
Note the following when using the SCIF.
SCFTDR2 Writing and the TDFE Flag: The TDFE flag in the serial status register (SCFSR2) is
set when the number of transmit data bytes written in the transmit FIFO data register (SCFTDR2)
has fallen to or below the transmit trigger number set by bits TTRG1 and TTRG0 in the FIFO
control register (SCFCR2). After TDFE is set, transmit data up to the number of empty bytes in
SCFTDR2 can be written, allowing efficient continuous transmission.
However, if the number of data bytes written in SCFTDR2 is equal to or less than the transmit
trigger number, the TDFE flag will be set to 1 again after being read as 1 and cleared to 0. TDFE
clearing should therefore be carried out when SCFTDR2 contains more than the transmit trigger
number of transmit data bytes.
The number of transmit data bytes in SCFTDR2 can be found from the upper 8 bits of the FIFO
data count register (SCFDR2).
SCFRDR2 Reading and the RDF Flag: The RDF flag in the serial status register (SCFSR2) is
set when the number of receive data bytes in the receive FIFO data register (SCFRDR2) has
become equal to or greater than the receive trigger number set by bits RTRG1 and RTRG0 in the
FIFO control register (SCFCR2). After RDF is set, receive data equivalent to the trigger number
can be read from SCFRDR2, allowing efficient continuous reception.
However, if the number of data bytes in SCFRDR2 is equal to or greater than the trigger number,
the RDF flag will be set to 1 again if it is cleared to 0. RDF should therefore be cleared to 0 after
being read as 1 after all the receive data has been read.
The number of receive data bytes in SCFRDR2 can be found from the lower 8 bits of the FIFO
data count register (SCFDR2).
Break Detection and Processing: Break signals can be detected by reading the RxD2 pin directly
when a framing error (FER) is detected. In the break state the input from the RxD2 pin consists of
all 0s, so the FER flag is set and the parity error flag (PER) may also be set.
Although the SCIF stops transferring receive data to SCFRDR2 after receiving a break, the receive
operation continues.
Sending a Break Signal: The input/output condition and level of the TxD2 pin are determined by
bits SPB2IO and SPB2DT in the serial port register (SCSPTR2). This feature can be used to send
a break signal.
Rev. 6.0, 07/02, page 698 of 986
After the serial transmitter is initialized, the TxD2 pin function is not selected and the value of the
SPB2DT bit substitutes for the mark state until the TE bit is set to 1 (i.e. transmission is enabled).
The SPB2IO and SPB2DT bits should therefore be set to 1 (designating output and high level)
beforehand.
To send a break signal during serial transmission, clear the SPB2DT bit to 0 (designating low
level), then clear the TE bit to 0 (halting transmission). When the TE bit is cleared to 0, the
transmitter is initialized, regardless of its current state, and 0 is output from the TxD2 pin.
Receive Data Sampling Timing and Receive Margin: The SCIF operates on a base clock with a
frequency of 16 times the transfer rate. In reception, the SCIF synchronizes internally with the fall
of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the
eighth base clock pulse. The timing is shown in figure 16.13.
16 clocks
8 clocks
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5
Base clock
–7.5 clocks
Receive data
(RxD2)
Start bit
+7.5 clocks
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 16.13 Receive Data Sampling Timing in Asynchronous Mode
The receive margin in asynchronous mode can therefore be expressed as shown in equation (1).
M = (0.5 –
M:
N:
D:
L:
F:
1
| D – 0.5 |
) – (L – 0.5) F –
(1 + F) × 100% ....................... (1)
2N
N
Receive margin (%)
Ratio of clock frequency to bit rate (N = 16)
Clock duty cycle (D = 0 to 1.0)
Frame length (L = 9 to 12)
Absolute deviation of clock frequency
Rev. 6.0, 07/02, page 699 of 986
From equation (1), if F = 0 and D = 0.5, the receive margin is 46.875%, as given by equation (2).
When D = 0.5 and F = 0:
M = (0.5 – 1 / (2 × 16) ) × 100% = 46.875% ............................................... (2)
This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%.
SCK2/05(6(7
05(6(7:
05(6(7 As the manual reset pin is multiplexed with the SCK2 pin, a manual reset must
not be executed while the SCIF is operating in external clock mode.
When Using the DMAC: When using the DMAC for transmission/reception, inhibit output of
RXI and TXI interrupt requests to the interrupt controller. If interrupt request output is enabled,
interrupt requests to the interrupt controller will be cleared by the DMAC without regard to the
interrupt handler.
Serial Ports: Note that, when the SCIF pin value is read using a serial port, the value read will be
the value two peripheral clock cycles earlier.
Overrun Error Flag (SH7750): SCIF overrun error flag is not set in the case that overrun error
and flaming error occurred simultaneously in receiving data, that means 17th byte data which
overrun was accompanying with flaming error. In such case, only SCFSR2. ER flag which shows
occurrence of flaming error is set. Receive FIFO stores data received before the overrun and does
not store (i. e. lose) overrun data. SCIF has no bit which corresponds to SCFSR2. FER for the lost
data.
In addition to the overrun error handling software routine, exception handler should check cooccurrence of overrun error when a flaming error is occurred and when a co-occurrence is found,
it should handle also overrun error (When (i) a overrun error solely occurred without
accompanying with other receive error and (ii) when a parity error is accompanied with overrun
error, usual overrun error handling can be used. Overrun error handling should rather be done
primarily).
Rev. 6.0, 07/02, page 700 of 986
Flow chart:
Framing error occurrence
When flaming error (SCFSR.ER=1) is occurred, bit7 to
Bits 7 to 0
in SCFDR2 = H'10?
bit0 should be read out from SCFDR2. If bit7 to bit0
No
equals H'10, contents of the receive FIFO should be
read. When the data received last is not accompanied
Yes
with flaming error (SCFSR2.FER=0) both overrun error
Normal error handling
handling and flaming error handling shoud be
PER or FER bit
in SCFSR2 set to 1?
Yes
conducted.
No
Error handling
Read receive FIFO
No
Last data?
Yes
Overrun error handling
+
framing error handling
Figure 16.14 Overrun Error Flag
Rev. 6.0, 07/02, page 701 of 986
Rev. 6.0, 07/02, page 702 of 986
Section 17 Smart Card Interface
17.1
Overview
The subset of the IC card (smart card) interface conforming to ISO/IEC7816-3 (Identification
Card) is supported as a serial communication interface (SCI) extension function.
Switching between the normal serial communication interface and the smart card interface is
carried out by means of a register setting.
17.1.1
Features
Features of the smart card interface are listed below.
• Asynchronous mode
Data length: 8 bits
Parity bit generation and checking
Transmission of error signal (parity error) in receive mode
Error signal detection and automatic data retransmission in transmit mode
Direct convention and inverse convention both supported
• On-chip baud rate generator allows any bit rate to be selected
• Three interrupt sources
There are three interrupt sources—transmit-data-empty, receive-data-full, and transmit/receive
error—that can issue requests independently.
The transmit-data-empty interrupt and receive-data-full interrupt can activate the DMA
controller (DMAC) to execute data transfer.
Rev. 6.0, 07/02, page 703 of 986
17.1.2
Block Diagram
Bus interface
Figure 17.1 shows a block diagram of the smart card interface.
Module data bus
RxD
SCRDR1
SCTDR1
SCRSR1
SCTSR1
SCSCMR1
SCSSR1
SCSCR1
SCSMR1
SCSPTR1
SCBRR1
Pφ
Baud rate
generator
Parity generation
Pφ/4
Pφ/16
Transmission/
reception
control
TxD
Internal
data bus
Pφ/64
Clock
Parity check
External clock
SCK
TXI
RXI
ERI
SCI
SCSCMR1:
SCRSR1:
SCRDR1:
SCTSR1:
SCTDR1:
SCSMR1:
SCSCR1:
SCSSR1:
SCBRR1:
SCSPTR1:
Smart card mode register
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Serial port register
Figure 17.1 Block Diagram of Smart Card Interface
Rev. 6.0, 07/02, page 704 of 986
17.1.3
Pin Configuration
Table 17.1 shows the smart card interface pin configuration.
Table 17.1 Smart Card Interface Pins
Pin Name
Abbreviation
I/O
Function
Serial clock pin
MD0/SCK
I/O
Clock input/output
Receive data pin
RxD
Input
Receive data input
Transmit data pin
MD7/TxD
Output
Transmit data output
17.1.4
Register Configuration
The smart card interface has the internal registers shown in table 17.2. Details of the SCBRR1,
SCTDR1, SCRDR1, and SCSPTR1 registers are the same as for the normal SCI function: see the
register descriptions in section 15, Serial Communication Interface (SCI).
With the exception of the serial port register, the smart card interface registers are initialized in
standby mode and in the module standby state as well as by a power-on reset or manual reset.
When recovering from standby mode or the module standby state, the registers must be set again.
Table 17.2 Smart Card Interface Registers
Name
Abbreviation
R/W
Initial
Value
P4 Address
Area 7
Address
Access
Size
Serial mode register
SCSMR1
R/W
H'00
H'FFE00000
H'1FE00000
8
Bit rate register
SCBRR1
R/W
H'FF
H'FFE00004
H'1FE00004
8
Serial control register
SCSCR1
R/W
H'00
H'FFE00008
H'1FE00008
8
Transmit data register
SCTDR1
R/W
H'FF
H'FFE0000C
H'1FE0000C
8
H'84
H'FFE00010
H'1FE00010
8
1
Serial status register
SCSSR1
R/(W)*
Receive data register
SCRDR1
R
H'00
H'FFE00014
H'1FE00014
8
Smart card mode
register
SCSCMR1
R/W
H'00
H'FFE00018
H'1FE00018
8
Serial port register
SCSPTR1
R/W
2
H'00*
H'FFE0001C
H'1FE0001C
8
Notes: *1 Only 0 can be written, to clear flags.
*2 The value of bits 2 and 0 is undefined.
Rev. 6.0, 07/02, page 705 of 986
17.2
Register Descriptions
Only registers that have been added, and bit functions that have been modified, for the smart card
interface are described here.
17.2.1
Smart Card Mode Register (SCSCMR1)
SCSCMR1 is an 8-bit readable/writable register that selects the smart card interface function.
SCSCMR1 is initialized to H'00 by a power-on reset or manual reset, in standby mode, and in the
module standby state.
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
SDIR
SINV
—
SMIF
Initial value:
—
—
—
—
0
0
—
0
R/W:
—
—
—
—
R/W
R/W
—
R/W
Bits 7 to 4 and 1—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion
format.
Bit 3: SDIR
Description
0
SCTDR1 contents are transmitted LSB-first
(Initial value)
Receive data is stored in SCRDR1 LSB-first
1
SCTDR1 contents are transmitted MSB-first
Receive data is stored in SCRDR1 MSB-first
Bit 2—Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This
function is used together with the bit 3 function for communication with an inverse convention
card. The SINV bit does not affect the logic level of the parity bit. For parity-related setting
procedures, see section 17.3.4, Register Settings.
Bit 2: SINV
Description
0
SCTDR1 contents are transmitted as they are
Receive data is stored in SCRDR1 as it is
1
SCTDR1 contents are inverted before being transmitted
Receive data is stored in SCRDR1 in inverted form
Rev. 6.0, 07/02, page 706 of 986
(Initial value)
Bit 0—Smart Card Interface Mode Select (SMIF): Enables or disables the smart card interface
function.
Bit 0: SMIF
Description
0
Smart card interface function is disabled
1
Smart card interface function is enabled
17.2.2
(Initial value)
Serial Mode Register (SCSMR1)
Bit 7 of SCSMR1 has a different function in smart card interface mode.
Bit:
7
6
5
4
3
2
1
0
GM(C/$)
CHR
PE
O/(
STOP
MP
CKS1
CKS0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Initial value:
R/W:
Bit 7—GSM Mode (GM): Sets the smart card interface function to GSM mode.
With the normal smart card interface, this bit is cleared to 0. Setting this bit to 1 selects GSM
mode, an additional mode for controlling the timing for setting the TEND flag that indicates
completion of transmission, and the type of clock output used. The details of the additional clock
output control mode are specified by the CKE1 and CKE0 bits in the serial control register
(SCSCR1). In GSM mode, the pulse width is guaranteed when SCK start/stop specifications are
made by CKE1 and CKE0.
Bit 7: GM
Description
0
Normal smart card interface mode operation
1
(Initial value)
•
The TEND flag is set 12.5 etu after the beginning of the start bit
•
Clock output on/off control only
GSM mode smart card interface mode operation
•
The TEND flag is set 11.0 etu after the beginning of the start bit
•
Clock output on/off and fixed-high/fixed-low control (set in SCSCR1)
Note: etu: Elementary time unit (time for transfer of 1 bit)
Bits 6 to 0: Operate in the same way as for the normal SCI. See section 15, Serial Communication
Interface (SCI), for details. With the smart card interface, the following settings should be used:
CHR = 0, PE = 1, STOP = 1, MP = 0.
Rev. 6.0, 07/02, page 707 of 986
17.2.3
Serial Control Register (SCSCR1)
Bits 1 and 0 of SCSCR1 have a different function in smart card interface mode.
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
—
—
CKE1
CKE0
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits 7 to 4: Operate in the same way as for the normal SCI. See section 15, Serial Communication
Interface (SCI), for details.
Bits 3 and 2—Reserved: Not used with the smart card interface.
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits specify the function of the SCK
pin. In smart card interface mode, an internal clock is always used as the clock source. In smart
card interface mode, it is possible to specify a fixed high level or fixed low level for the clock
output, in addition to the usual switching between enabling and disabling of the clock output.
GM
CKE1
0
0
1
1
0
1
CKE0
SCK Pin Function
0
Port I/O pin
1
Clock output as SCK output pin
0
Invalid setting: must not be used
1
Invalid setting: must not be used
0
Output pin with output fixed low
1
Clock output as output pin
0
Output pin with output fixed high
1
Clock output as output pin
Rev. 6.0, 07/02, page 708 of 986
17.2.4
Serial Status Register (SCSSR1)
Bit 4 of SCSSR1 has a different function in smart card interface mode. Coupled with this, the
setting conditions for bit 2 (TEND) are also different.
Bit:
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
FER/
ERS
PER
TEND
—
—
1
0
0
0
0
1
0
0
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Initial value:
R/W:
Note: * Only 0 can be written, to clear the flag.
Bits 7 to 5: Operate in the same way as for the normal SCI. See section 15, Serial Communication
Interface (SCI), for details.
Bit 4—Error Signal Status (ERS): In smart card interface mode, bit 4 indicates the status of the
error signal sent back from the receiving side during transmission. Framing errors are not detected
in smart card interface mode.
Bit 4: ERS
Description
0
Normal reception, no error signal
(Initial value)
[Clearing conditions]
1
•
Power-on reset, manual reset, standby mode, or module standby
•
When 0 is written to ERS after reading ERS = 1
An error signal has been sent from the receiving side indicating detection of
a parity error
[Setting condition]
•
When the low level of the error signal is detected
Note: Clearing the TE bit in SCSCR1 to 0 does not affect the ERS flag, which retains its previous
state.
Bit 3—Parity Error (PER): Operates in the same way as for the normal SCI. See section 15,
Serial Communication Interface (SCI), for details.
Rev. 6.0, 07/02, page 709 of 986
Bit 2—Transmit End (TEND): The setting conditions for the TEND flag are as follows.
Bit 2: TEND
Description
0
Transmission in progress
[Clearing condition]
•
1
When 0 is written to TDRE after reading TDRE = 1
Transmission has been ended
(Initial value)
[Setting conditions]
•
Power-on reset, manual reset, standby mode, or module standby
•
When the TE bit in SCSCR1 is 0 and the FER/ERS bit is also 0
•
When the GM bit in SCSMR1 is 0, and TDRE = 1 and FER/ERS = 0
(normal transmission) 2.5 etu after transmission of a 1-byte serial
character
•
When the GM bit in SCSMR1 is 1, and TDRE = 1 and FER/ERS = 0
(normal transmission) 1.0 etu after transmission of a 1-byte serial
character
etu: Elementary Time Unit (time for transfer for 1 bit)
Bits 1 and 0—Reserved: Not used with the smart card interface.
17.3
Operation
17.3.1
Overview
The main functions of the smart card interface are as follows.
• One frame consists of 8-bit data plus a parity bit.
• In transmission, a guard time of at least 2 etu (elementary time unit: the time for transfer of one
bit) is left between the end of the parity bit and the start of the next frame.
• If a parity error is detected during reception, a low error signal level is output for a 1-etu period
10.5 etu after the start bit.
• If an error signal is detected during transmission, the same data is transmitted automatically
after the elapse of 2 etu or longer.
• Only asynchronous communication is supported; there is no synchronous communication
function.
Rev. 6.0, 07/02, page 710 of 986
17.3.2
Pin Connections
Figure 17.2 shows a schematic diagram of smart card interface related pin connections.
In communication with an IC card, since both transmission and reception are carried out on a
single data transmission line, the TxD pin and RxD pin should be connected outside the chip. The
data transmission line should be pulled up on the VCC power supply side with a resistor.
When the clock generated on the smart card interface is used by an IC card, the SCK pin output is
input to the CLK pin of the IC card. No connection is needed if the IC card uses an internal clock.
Chip port output is used as the reset signal.
Other pins must normally be connected to the power supply or ground.
Note: If an IC card is not connected, and both TE and RE are set to 1, closed
transmission/reception is possible, enabling self-diagnosis to be carried out.
VCC
TxD
IO
Data line
RxD
SH7750
Series
SCK
Clock line
Px (port)
Reset line
Connected equipment
CLK
RST
IC card
Figure 17.2 Schematic Diagram of Smart Card Interface Pin Connections
Rev. 6.0, 07/02, page 711 of 986
17.3.3
Data Format
Figure 17.3 shows the smart card interface data format. In reception in this mode, a parity check is
carried out on each frame, and if an error is detected an error signal is sent back to the transmitting
side to request retransmission of the data. If an error signal is detected during transmission, the
same data is retransmitted.
When there is no parity error
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
D6
D7
Dp
Transmitting station output
When a parity error occurs
Ds
D0
D1
D2
D3
D4
D5
DE
Transmitting station output
Ds:
D0–D7:
Dp:
DE:
Start bit
Data bits
Parity bit
Error signal
Receiving
station
output
Figure 17.3 Smart Card Interface Data Format
The operation sequence is as follows.
1. When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor.
2. The transmitting station starts transmission of one frame of data. The data frame starts with a
start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp).
3. With the smart card interface, the data line then returns to the high-impedance state. The data
line is pulled high with a pull-up resistor.
4. The receiving station carries out a parity check.
If there is no parity error and the data is received normally, the receiving station waits for
reception of the next data.
Rev. 6.0, 07/02, page 712 of 986
If a parity error occurs, however, the receiving station outputs an error signal (DE, low-level)
to request retransmission of the data. After outputting the error signal for the prescribed length
of time, the receiving station places the signal line in the high-impedance state again. The
signal line is pulled high again by a pull-up resistor.
5. If the transmitting station does not receive an error signal, it proceeds to transmit the next data
frame.
If it receives an error signal, however, it returns to step 2 and retransmits the erroneous data.
17.3.4
Register Settings
Table 17.3 shows a bit map of the registers used by the smart card interface. Bits indicated as 0 or
1 must be set to the value shown. The setting of other bits is described below.
Table 17.3 Smart Card Interface Register Settings
Bit
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SCSMR1
GM
0
1
O/(
1
0
CKS1
CKS0
SCBRR1
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCSCR1
TIE
RIE
TE
RE
0
0
CKE1
CKE0
SCTDR1
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SCSSR1
TDRE
RDRF
ORER
FER/ERS PER
TEND
0
0
SCRDR1
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
SCSCMR1 —
—
—
—
SDIR
SINV
—
SMIF
SCSPTR1
—
—
—
SPB1IO
SPB1DT SPB0IO
EIO
SPB0DT
Note: A dash indicates an unused bit.
Serial Mode Register (SCSMR1) Settings: The GM bit is used to select the timing of TEND flag
setting, and, together with the CKE1 and CKE0 bits in the serial control register (SCSCR1), to
select the clock output state.
The O/( bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the
inverse convention type.
Bits CKS1 and CKS0 select the clock source of the on-chip baud rate generator. See section
17.3.5, Clock.
Rev. 6.0, 07/02, page 713 of 986
I/O data
Ds
Da
Db
Dc
Dd
De
Df
Dg
Dh
Dp
DE
Guard
time
12.5 etu
TXI
(TEND interrupt)
GM = 0
11.0 etu
GM = 1
etu: Elementary Time Unit (time for transfer for 1 bit)
Figure 17.4 TEND Generation Timing
Bit Rate Register (SCBRR1) Setting: SCBRR1 is used to set the bit rate. See section 17.3.5,
Clock, for the method of calculating the value to be set.
Serial Control Register (SCSCR1) Settings: The function of the TIE, RIE, TE, and RE bits is
the same as for the normal SCI. See section 15, Serial Communication Interface (SCI), for details.
The CKE1 and CKE0 bits specify the clock output state. See section 17.3.5, Clock, for details.
Smart Card Mode Register (SCSCMR1) Settings: The SDIR bit and SINV bit are both cleared
to 0 if the IC card is of the direct convention type, and both set to 1 if of the inverse convention
type.
The SMIF bit is set to 1 when the smart card interface is used.
Figure 17.5 shows examples of register settings and the waveform of the start character for the two
types of IC card (direct convention and inverse convention).
With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to
state A, and transfer is performed in LSB-first order. The start character data in this case is H'3B.
The parity bit is 1 since even parity is stipulated for the smart card.
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to
state Z, and transfer is performed in MSB-first order. The start character data in this case is H'3F.
The parity bit is 0, corresponding to state Z, since even parity is stipulated for the smart card.
Inversion specified by the SINV bit applies only to the data bits, D7 to D0. For parity bit
inversion, the O/( bit in SCSMR1 is set to odd parity mode. (This applies to both transmission and
reception).
Rev. 6.0, 07/02, page 714 of 986
(Z)
A
Z
Z
A
Z
Z
Z
A
A
Z
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
(Z)
State
(Z)
State
(a) Direct convention (SDIR = SINV = O/ = 0)
(Z)
A
Z
Z
A
A
A
A
A
A
Z
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
(b) Inverse convention (SDIR = SINV = O/ = 1)
Figure 17.5 Sample Start Character Waveforms
17.3.5
Clock
Only an internal clock generated by the on-chip baud rate generator can be used as the
transmit/receive clock for the smart card interface. The bit rate is set with the bit rate register
(SCBRR1) and the CKS1 and CKS0 bits in the serial mode register (SCSMR1). The equation for
calculating the bit rate is shown below. Table 17.5 shows some sample bit rates.
If clock output is selected with CKE0 set to 1, a clock with a frequency of 372 times the bit rate is
output from the SCK pin.
B=
Pφ
× 106
1488 × 22n–1 × (N + 1)
Where: N = Value set in SCBRR1 (0 ≤ N ≤ 255)
B = Bit rate (bits/s)
Pφ = Peripheral module operating frequency (MHz)
n = 0 to 3 (See table 17.4)
Table 17.4 Values of n and Corresponding CKS1 and CKS0 Settings
n
CKS1
CKS0
0
0
0
1
0
1
2
1
0
3
1
1
Rev. 6.0, 07/02, page 715 of 986
Table 17.5 Examples of Bit Rate B (bits/s) for Various SCBRR1 Settings (When n = 0)
Pφ
φ (MHz)
N
7.1424
10.00
10.7136
14.2848
25.0
33.0
50.0
0
9600.0
13440.9
14400.0
19200.0
33602.2
44354.8
67204.3
1
4800.0
6720.4
7200.0
9600.0
16801.1
22177.4
33602.2
2
3200.0
4480.3
4800.0
6400.0
11200.7
14784.9
22401.4
Note: Bit rates are rounded to one decimal place.
The method of calculating the value to be set in the bit rate register (SCBRR1) from the peripheral
module operating frequency and bit rate is shown below. Here, N is an integer in the range 0 ≤ N ≤
255, and the smaller error is specified.
N=
Pφ
× 106 – 1
1488 × 22n–1 × B
Table 17.6 Examples of SCBRR1 Settings for Bit Rate B (bits/s) (When n = 0)
Pφ
φ (MHz)
7.1424
10.00
10.7136
14.2848
25.00
33.00
50.00
Bits/s
N
Error
N
Error
N
Error
N
Error
N
Error
N
Error
N
Error
9600
0
0.00
1
30.00
1
25.00
1
8.99
3
14.27
4
8.22
6
0.01
Table 17.7 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
Pφ
φ (MHz)
Maximum Bit Rate (bits/s)
N
n
7.1424
19200
0
0
10.00
26882
0
0
10.7136
28800
0
0
16.00
43010
0
0
20.00
53763
0
0
25.0
67204
0
0
30.0
80645
0
0
33.0
88710
0
0
50.0
67204
0
0
Rev. 6.0, 07/02, page 716 of 986
The bit rate error is given by the following equation:
Pφ
Error (%) =
1488 ×
22n–1
× B × (N + 1)
× 106 – 1 × 100
Table 17.8 shows the relationship between the smart card interface transmit/receive clock register
settings and the output state.
Table 17.8 Register Settings and SCK Pin State
Register Values
SCK Pin
Setting
SMIF
GM
CKE1
CKE0
Output
State
1
1*
1
0
0
0
Port
Determined by setting of SPB1IO
and SPB1DT bits in SCSPTR1
1
0
0
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
2*
2
3*
2
SCK (serial clock) output state
Low output
Low-level output state
SCK (serial clock) output state
High output
High-level output state
SCK (serial clock) output state
Notes: *1 The SCK output state changes as soon as the CKE0 bit setting is changed.
Clear the CKE1 bit to 0.
*2 Stopping and starting the clock by changing the CKE0 bit setting does not affect the
clock duty cycle.
Port value
Width is
undefined
Width is
undefined
Port value
SCK
(a) When GM = 0
CKE1 value
Specified
width
Specified
width
CKE1 value
SCK
(b) When GM = 1
Figure 17.6 Difference in Clock Output According to GM Bit Setting
Rev. 6.0, 07/02, page 717 of 986
17.3.6
Data Transmit/Receive Operations
Initialization: Before transmitting and receiving data, the smart card interface must be initialized
as described below. Initialization is also necessary when switching from transmit mode to receive
mode, or vice versa. Figure 17.7 shows a sample initialization processing flowchart.
1. Clear the TE and RE bits in the serial control register (SCSCR1) to 0.
2. Clear error flags FER/ERS, PER, and ORER in the serial status register (SCSSR1) to 0.
3. Set the GM bit, parity bit (O/(), and baud rate generator select bits (CKS1 and CKS0) in the
serial mode register (SCSMR1). Clear the CHR and MP bits to 0, and set the STOP and PE
bits to 1.
4. Set the SMIF, SDIR, and SINV bits in the smart card mode register (SCSCMR1).
When the SMIF bit is set to 1, the TxD pin and RxD pin both go to the high-impedance state.
5. Set the value corresponding to the bit rate in the bit rate register (SCBRR1).
6. Set the clock source select bits (CKE1 and CKE0) in SCSCR1. Clear the TIE, RIE, TE, RE,
MPIE, and TEIE bits to 0.
If the CKE0 bit is set to 1, the clock is output from the SCK pin.
7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCSCR1. Do not set the
TE bit and RE bit at the same time, except for self-diagnosis.
Rev. 6.0, 07/02, page 718 of 986
Initialization
Clear TE and RE bits
in SCSCR1 to 0
1
Clear FER/ERS, PER, and
ORER flags in SCSCR1 to 0
2
In SCSMR1, set parity in O/ bit,
clock in CKS1 and CKS0 bits,
and set GM
3
Set SMIF, SDIR, and SINV bits
in SCSCMR1
4
Set value in SCBRR1
5
In SCSCR1, set clock in CKE1
and CKE0 bits, and clear TIE,
RIE, TE, RE, MPIE, and
TEIE bits to 0.
6
Wait
1-bit interval elapsed?
No
Yes
Set TIE, RIE, TE, and RE bits
in SCSCR1
7
End
Figure 17.7 Sample Initialization Flowchart
Rev. 6.0, 07/02, page 719 of 986
Serial Data Transmission: As data transmission in smart card mode involves error signal
sampling and retransmission processing, the processing procedure is different from that for the
normal SCI. Figure 17.8 shows a sample transmission processing flowchart.
1. Perform smart card interface mode initialization as described in Initialization above.
2. Check that the FER/ERS error flag in SCSSR1 is cleared to 0.
3. Repeat steps 2 and 3 until it can be confirmed that the TEND flag in SCSSR1 is set to 1.
4. Write the transmit data to SCTDR1, clear the TDRE flag to 0, and perform the transmit
operation. The TEND flag is cleared to 0.
5. To continue transmitting data, go back to step 2.
6. To end transmission, clear the TE bit to 0.
With the above processing, interrupt handling is possible.
If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt
requests are enabled, a transmit-data-empty interrupt (TXI) request will be generated. If an error
occurs in transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrupt
requests are enabled, a transmit/receive-error interrupt (ERI) request will be generated. See
Interrupt Operation in section 17.3.6 below for details.
Rev. 6.0, 07/02, page 720 of 986
Start
1
Initialization
Start of transmission
2
FER/ERS = 0?
No
Yes
Error handling
No
TEND = 1?
3
Yes
No
Write transmit data to SCTDR1,
and clear TDRE flag
in SCSSR1 to 0
4
All data transmitted?
5
Yes
FER/ERS = 0?
No
Yes
Error handling
No
TEND = 1?
Yes
Clear TE bit in SCSCR1 to 0
6
End of transmission
Figure 17.8 Sample Transmission Processing Flowchart
Rev. 6.0, 07/02, page 721 of 986
Serial Data Reception: Data reception in smart card mode uses the same processing procedure as
for the normal SCI. Figure 17.9 shows a sample reception processing flowchart.
1. Perform smart card interface mode initialization as described in Initialization above.
2. Check that the ORER flag and PER flag in SCSSR1 are cleared to 0. If either is set, perform
the appropriate receive error handling, then clear both the ORER and the PER flag to 0.
3. Repeat steps 2 and 3 until it can be confirmed that the RDRF flag is set to 1.
4. Read the receive data from SCRDR1.
5. To continue receiving data, clear the RDRF flag to 0 and go back to step 2.
6. To end reception, clear the RE bit to 0.
With the above processing, interrupt handling is possible.
If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests
are enabled, a receive-data-full interrupt (RXI) request will be generated. If an error occurs in
reception and either the ORER flag or the PER flag is set to 1, a transmit/receive-error interrupt
(ERI) request will be generated.
See Interrupt Operation in section 17.3.6 below for details.
If a parity error occurs during reception and the PER flag is set to 1, the received data is still
transferred to SCRDR1, and therefore this data can be read.
Rev. 6.0, 07/02, page 722 of 986
Start
1
Initialization
Start of reception
2
ORER = 0 and PER = 0?
No
Yes
Error handling
No
RDRF = 1?
3
Yes
No
Read receive data from
SCRDR1 and clear RDRF flag
in SCSSR1 to 0
4
All data received?
5
Yes
Clear RE bit in SCSCR1 to 0
6
End of reception
Figure 17.9 Sample Reception Processing Flowchart
Mode Switching Operation: When switching from receive mode to transmit mode, first confirm
that the receive operation has been completed, then start from initialization, clearing RE to 0 and
setting TE to 1. The RDRF flag or the PER and ORER flags can be used to check that the receive
operation has been completed.
When switching from transmit mode to receive mode, first confirm that the transmit operation has
been completed, then start from initialization, clearing TE to 0 and setting RE to 1. The TEND
flag can be used to check that the transmit operation has been completed.
Rev. 6.0, 07/02, page 723 of 986
Interrupt Operation: There are three interrupt sources in smart card interface mode, generating
transmit-data-empty interrupt (TXI) requests, transmit/receive-error interrupt (ERI) requests, and
receive-data-full interrupt (RXI) requests. The transmit-end interrupt (TEI) request cannot be used
in this mode.
When the TEND flag in SCSSR1 is set to 1, a TXI interrupt request is generated.
When the RDRF flag in SCSSR1 is set to 1, an RXI interrupt request is generated.
When any of flags ORER, PER, and FER/ERS in SCSSR1 is set to 1, an ERI interrupt request is
generated. The relationship between the operating states and interrupt sources is shown in table
17.9.
Table 17.9 Smart Card Mode Operating States and Interrupt Sources
Operating State
Transmit mode
Receive mode
Flag
Mask Bit
Interrupt Source
Normal operation
TEND
TIE
TXI
Error
FER/ERS
RIE
ERI
Normal operation
RDRF
RIE
RXI
Error
PER, ORER
RIE
ERI
Data Transfer Operation by DMAC: In smart card mode, as with the normal SCI, transfer can
be carried out using the DMAC. In a transmit operation, when the TEND flag in SCSSR1 is set to
1, a TXI interrupt is requested. If the TXI request is designated beforehand as a DMAC activation
source, the DMAC will be activated by the TXI request, and transfer of the transmit data will be
carried out. The TEND flag is automatically cleared to 0 when data transfer is performed by the
DMAC. In the event of an error, the SCI retransmits the same data automatically. The TEND flag
remains cleared to 0 during this time, and the DMAC is not activated. Thus, the number of bytes
specified by the SCI and DMAC are transmitted automatically, including retransmission following
an error. However, the ERS flag is not cleared automatically when an error occurs, and therefore
the RIE bit should be set to 1 beforehand so that an ERI request will be generated in the event of
an error, and the ERS flag will be cleared.
In a receive operation, an RXI interrupt request is generated when the RDRF flag in SCSSR1 is
set to 1. If the RXI request is designated beforehand as a DMAC activation source, the DMAC
will be activated by the RXI request, and transfer of the receive data will be carried out. The
RDRF flag is cleared to 0 automatically when data transfer is performed by the DMAC. If an error
occurs, an error flag is set but the RDRF flag is not. The DMAC is not activated, but instead, an
ERI interrupt request is sent to the CPU. The error flag must therefore be cleared.
When performing data transfer using the DMAC, it is essential to set and enable the DMAC
before carrying out SCI settings. For details of the DMAC setting procedures, see section 14,
Direct Memory Access Controller (DMAC).
Rev. 6.0, 07/02, page 724 of 986
17.4
Usage Notes
The following points should be noted when using the SCI as a smart card interface.
(1) Receive Data Sampling Timing and Receive Margin
In asynchronous mode, the SCI operates on a base clock with a frequency of 372 times the transfer
rate. In reception, the SCI synchronizes internally with the fall of the start bit, which it samples on
the base clock. Receive data is latched at the rising edge of the 186th base clock pulse. The timing
is shown in figure 17.10.
372 clocks
186 clocks
0
185
371 0
185
371 0
Base clock
Receive data
(RxD)
Start
bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 17.10 Receive Data Sampling Timing in Smart Card Mode
The receive margin in smart card mode can therefore be expressed as shown in the following
equation.
M = (0.5 –
M:
N:
D:
L:
F:
1
| D – 0.5 |
) – (L – 0.5) F –
(1 + F) × 100%
2N
N
Receive margin (%)
Ratio of clock frequency to bit rate (N = 372)
Clock duty cycle (D = 0 to 1.0)
Frame length (L =10)
Absolute deviation of clock frequency
Rev. 6.0, 07/02, page 725 of 986
From the above equation, if F = 0 and D = 0.5, the receive margin is 49.866%, as given by the
following equation.
When D = 0.5 and F = 0:
M = (0.5 – 1/2 × 372) × 100% = 49.866%
(2) Retransfer Operations
Retransfer operations are performed by the SCI in receive mode and transmit mode as described
below.
Retransfer Operation when SCI is in Receive Mode: Figure 17.11 illustrates the retransfer
operation when the SCI is in receive mode.
1. If an error is found when the received parity bit is checked, the PER bit in SCSSR1 is
automatically set to 1. If the RIE bit in SCSCR1 is enabled at this time, an ERI interrupt
request is generated. The PER bit in SCSSR1 should be cleared to 0 before the next parity bit
is sampled.
2. The RDRF bit in SCSSR1 is not set for a frame in which an error has occurred.
3. If an error is found when the received parity bit is checked, the PER bit in SCSSR1 is not set to
1.
4. If no error is found when the received parity bit is checked, the receive operation is judged to
have been completed normally, and the RDRF bit in SCSSR1 is automatically set to 1. If the
RIE bit in SCSCR1 is enabled at this time, an RXI interrupt request is generated.
5. When a normal frame is received, the pin retains the high-impedance state at the timing for
error signal transmission.
nth transfer frame
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Transfer frame n+1
(DE)
5
Ds D0 D1 D2 D3 D4
RDRF
2
4
1
3
PER
Figure 17.11 Retransfer Operation in SCI Receive Mode
Rev. 6.0, 07/02, page 726 of 986
Retransfer Operation when SCI is in Transmit Mode: Figure 17.12 illustrates the retransfer
operation when the SCI is in transmit mode.
1. If an error signal is sent back from the receiving side after transmission of one frame is
completed, the FER/ERS bit in SCSSR1 is set to 1. If the RIE bit in SCSCR1 is enabled at this
time, an ERI interrupt request is generated. The FER/ERS bit in SCSSR1 should be cleared to
0 before the next parity bit is sampled.
2. The TEND bit in SCSSR1 is not set for a frame for which an error signal indicating an error is
received.
3. If an error signal is not sent back from the receiving side, the FER/ERS bit in SCSSR1 is not
set.
4. If an error signal is not sent back from the receiving side, transmission of one frame, including
a retransfer, is judged to have been completed, and the TEND bit in SCSSR1 is set to 1. If the
TIE bit in SCSCR1 is enabled at this time, a TXI interrupt request is generated.
nth transfer frame
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
TDRE
Transfer from SCTDR1
to SCTSR1
Transfer from SCTDR1
to SCTSR1
Transfer frame n+1
(DE)
Ds D0 D1 D2 D3 D4
Transfer from
SCTDR1 to
SCTSR1
TEND
2
4
FER/ERS
1
3
Figure 17.12 Retransfer Operation in SCI Transmit Mode
Rev. 6.0, 07/02, page 727 of 986
(3) Standby Mode and Clock
When switching between smart card interface mode and standby mode, the following procedures
should be used to maintain the clock duty cycle.
Switching from Smart Card Interface Mode to Standby Mode:
1. Set the SBP1IO and SBP1DT bits in SCSPTR1 to the values for the fixed output state in
standby mode.
2. Write 0 to the TE and RE bits in the serial control register (SCSCR1) to stop transmit/receive
operations. At the same time, set the CKE1 bit to the value for the fixed output state in standby
mode.
3. Write 0 to the CKE0 bit in SCSCR1 to stop the clock.
4. Wait for one serial clock cycle. During this period, the duty cycle is preserved and clock output
is fixed at the specified level.
5. Write H'00 to the serial mode register (SCSMR1) and smart card mode register (SCSMR1).
6. Make the transition to the standby state.
Returning from Standby Mode to Smart Card Interface Mode:
7. Clear the standby state.
8. Set the CKE1 bit in SCSCR1 to the value for the fixed output state at the start of standby (the
current SCK pin state).
9. Set smart card interface mode and output the clock. Clock signal generation is started with the
normal duty cycle.
Standby mode
Normal operation
123
4
56
Normal operation
7
89
Figure 17.13 Procedure for Stopping and Restarting the Clock
Rev. 6.0, 07/02, page 728 of 986
(4) Power-On and Clock
The following procedure should be used to secure the clock duty cycle after powering on.
1. The initial state is port input and high impedance. Use pull-up or pull-down resistors to fix the
potential.
2. Fix at the output specified by the CKE1 bit in the serial control register (SCSCR1).
3. Set the serial mode register (SCSMR1) and smart card mode register (SCSCMR1), and switch
to smart card mode operation.
4. Set the CKE0 bit in SCSCR1 to 1 to start clock output.
Rev. 6.0, 07/02, page 729 of 986
Rev. 6.0, 07/02, page 730 of 986
Section 18 I/O Ports
18.1
Overview
The SH7750 Series has a 20-bit general-purpose I/O port, SCI I/O port, and SCIF I/O port.
18.1.1
Features
The features of the general-purpose I/O port are as follows:
• 20-bit I/O port with input/output direction independently specifiable for each bit
• Pull-up can be specified independently for each bit.
• Interrupt input is possible for 16 of the 20 I/O port bits.
• Use or non-use of the I/O port can be selected with the PORTEN bit in bus control register 2
(BCR2).
The features of the SCI I/O port are as follows:
• Data can be output when the I/O port is designated for output and SCI enabling has not been
set. This allows break function transmission.
• The RxD pin value can be read at all times, allowing break state detection.
• SCK pin control is possible when the I/O port is designated for output and SCI enabling has
not been set.
• The SCK pin value can be read at all times.
The features of the SCIF I/O port are as follows:
• Data can be output when the I/O port is designated for output and SCIF enabling has not been
set. This allows break function transmission.
• The RxD2 pin value can be read at all times, allowing break state detection.
• &765 and 5765 pin control is possible when the I/O port is designated for output and SCIF
enabling has not been set.
• The &765 and 5765 pin values can be read at all times.
Rev. 6.0, 07/02, page 731 of 986
18.1.2
Block Diagrams
Figure 18.1 shows a block diagram of the 16-bit general-purpose I/O port.
PBnPUP
PORTEN
Pull-up resistor
Internal bus
PDTRW
Port 15 (input/
output)/D47
to
Port 0 (input/
output)/D32
1
D Q
C
MPX
0
Dn output data
BCK
0
1
MPX
DnDIR
PBnIO
MPX
0
Interrupt
controller
PTIRENn
PORTEN
PBnPuP
DnDIR
PBnIO
PTIRENn
0: Port not available
0: Pull-up
0: Input
0: Input
0: Interrupt input disabled
Data input strobe
1
Q
C
D
BCK
Dn input data
1: Port available
1: Pull-up off
1: Output
1: Output
1: Interrupt input enabled
Figure 18.1 16-Bit Port
Rev. 6.0, 07/02, page 732 of 986
Figure 18.2 shows a block diagram of the 4-bit general-purpose I/O port.
PBnPUP
Pull-up resistor
PORTEN
Internal bus
PDTRW
Port 19 (input/
output)/D51
to
Port 16 (input/
output)/D48
1
D Q
C
MPX
0
Dn output data
BCK
0
1
PBnIO
Data input strobe
0
MPX
MPX
DnDIR
1
C
Q D
BCK
Dn input data
PORTEN
PBnPuP
DnDIR
PBnIO
0: Port not available
0: Pull-up
0: Input
0: Input
1: Port available
1: Pull-up off
1: Output
1: Output
Figure 18.2 4-Bit Port
Rev. 6.0, 07/02, page 733 of 986
SCI I/O port block diagrams are shown in figures 18.3 to 18.5.
Reset
R
Q
D
SPB1IO
C
Internal data bus
SPTRW
Reset
MD0/SCK
Q
R
D
SPB1DT
C
SPTRW
Mode setting
register
SCI
Clock output enable signal
Serial clock output signal
Serial clock input signal
Clock input enable signal
SPTRR
SPTRW: Write to SPTR
SPTRR: Read SPTR
Note: * Signals that set the SCK pin function as internal clock output or external clock input according to
the CKE0 and CKE1 bits in SCSCR1 and the C/ bit in SCSMR1.
Figure 18.3 MD0/SCK Pin
Rev. 6.0, 07/02, page 734 of 986
*
Reset
R
Q
D
SPB0IO
C
Internal data bus
SPTRW
Reset
MD7/TxD
R
Q
D
SPB0DT
C
SPTRW
SCI
Transmit enable signal
Mode setting register
Serial transmit data
SPTRW: Write to SPTR
Figure 18.4 MD7/TxD Pin
SCI
RxD
Serial receive data
Internal data bus
SPTRR
SPTRR: Read SPTR
Figure 18.5 RxD Pin
Rev. 6.0, 07/02, page 735 of 986
SCIF I/O port block diagrams are shown in figures 18.6 to 18.9.
Reset
R
Q
D
SPB2IO
C
Internal data bus
SPTRW
Reset
MD1/TxD2
R
Q
D
SPB2DT
C
SPTRW
Mode setting
register
SCIF
Transmit enable
signal
Serial transmit data
SPTRW: Write to SPTR
Figure 18.6 MD1/TxD2 Pin
SCIF
MD2/RxD2
Serial receive
data
Mode setting
register
Internal data bus
SPTRR
SPTRR: Read SPTR
Figure 18.7 MD2/RxD2 Pin
Rev. 6.0, 07/02, page 736 of 986
Reset
R
Q
D
CTSIO
C
Internal data bus
SPTRW
Reset
R
Q
D
CTSDT
C
SCIF
SPTRW
signal
Modem control enable
signal*
SPTRR
SPTRW: Write to SPTR
SPTRR: Read SPTR
Note: * MCE bit in SCFCR2: signal that designates modem control as the
pin function.
Figure 18.8 &765 Pin
Rev. 6.0, 07/02, page 737 of 986
Reset
R
Q
D
RTSIO
C
Internal data bus
SPTRW
Reset
MD8/
R
Q
D
RTSDT
C
SPTRW
Mode setting
register
SCIF
Modem control
enable signal*
signal
SPTRR
SPTRW: Write to SPTR
SPTRR: Read SPTR
Note: * MCE bit in SCFCR2: signal that designates modem control as the
Figure 18.9 MD8/5765
5765 Pin
Rev. 6.0, 07/02, page 738 of 986
pin function.
18.1.3
Pin Configuration
Table 18.1 shows the 20-bit general-purpose I/O port pin configuration.
Table 18.1 20-Bit General-Purpose I/O Port Pins
Pin Name
Signal
I/O
Function
Port 19 pin
PORT19/D51
I/O
I/O port
Port 18 pin
PORT18/D50
I/O
I/O port
Port 17 pin
PORT17/D49
I/O
I/O port
Port 16 pin
PORT16/D48
I/O
I/O port
Port 15 pin
PORT15/D47
I/O*
I/O port / GPIO interrupt
Port 14 pin
PORT14/D46
I/O*
I/O port / GPIO interrupt
Port 13 pin
PORT13/D45
I/O*
I/O port / GPIO interrupt
Port 12 pin
PORT12/D44
I/O*
I/O port / GPIO interrupt
Port 11 pin
PORT11/D43
I/O*
I/O port / GPIO interrupt
Port 10 pin
PORT10/D42
I/O*
I/O port / GPIO interrupt
Port 9 pin
PORT9/D41
I/O*
I/O port / GPIO interrupt
Port 8 pin
PORT8/D40
I/O*
I/O port / GPIO interrupt
Port 7 pin
PORT7/D39
I/O*
I/O port / GPIO interrupt
Port 6 pin
PORT6/D38
I/O*
I/O port / GPIO interrupt
Port 5 pin
PORT5/D37
I/O*
I/O port / GPIO interrupt
Port 4 pin
PORT4/D36
I/O*
I/O port / GPIO interrupt
Port 3 pin
PORT3/D35
I/O*
I/O port / GPIO interrupt
Port 2 pin
PORT2/D34
I/O*
I/O port / GPIO interrupt
Port 1 pin
PORT1/D33
I/O*
I/O port / GPIO interrupt
Port 0 pin
PORT0/D32
I/O*
I/O port / GPIO interrupt
Note: * When port pins are used as GPIO interrupts, they must be set to input mode. The input
setting can be made in the PCTRA register.
Rev. 6.0, 07/02, page 739 of 986
Table 18.2 shows the SCI I/O port pin configuration.
Table 18.2 SCI I/O Port Pins
Pin Name
Abbreviation
I/O
Function
Serial clock pin
MD0/SCK
I/O
Clock input/output
Receive data pin
RxD
Input
Receive data input
Transmit data pin
MD7/TxD
Output
Transmit data output
Note: Pins MD0/SCK and MD7/TxD function as mode input pins MD0 and MD7 after a power-on
reset. They are made to function as serial pins by performing SCI operation settings with
the TE, RE, CKEI, and CKE0 bits in SCSCR1 and the C/$ bit in SCSMR1. Break state
transmission and detection can be performed by means of a setting in the SCI’s SCSPTR1
register.
Table 18.3 shows the SCIF I/O port pin configuration.
Table 18.3 SCIF I/O Port Pins
Pin Name
Abbreviation
I/O
Function
Serial clock pin
05(6(7/SCK2
Input
Clock input
Receive data pin
MD2/RxD2
Input
Receive data input
Transmit data pin
MD1/TxD2
Output
Transmit data output
Modem control pin
&765
I/O
Transmission enabled
Modem control pin
MD8/5765
I/O
Transmission request
Note: The MRESET/SCK2 pin functions as the 05(6(7 manual reset pin when a manual reset is
executed. The MD1/TxD2, MD2/RxD2, and MD8/5765 pins function as the MD1, MD2, and
MD8 mode input pins after a power-on reset. These pins are made to function as serial pins
by performing SCIF operation settings with the TE and RE bits in SCSCR2 and the MCE bit
in SCFCR2. Break state transmission and detection can be set in the SCIF’s SCSPTR2
register.
Rev. 6.0, 07/02, page 740 of 986
18.1.4
Register Configuration
The 20-bit general-purpose I/O port, SCI I/O port, and SCIF I/O port have seven registers, as
shown in table 18.4.
Table 18.4 I/O Port Registers
Area 7
Address
Access
Size
Name
Abbreviation R/W
Initial Value* P4 Address
Port control register A
PCTRA
R/W
H'00000000
H'FF80002C H'1F80002C 32
Port data register A
PDTRA
R/W
Undefined
H'FF800030
H'1F800030
16
Port control register B
PCTRB
R/W
H'00000000
H'FF800040
H'1F800040
32
Port data register B
PDTRB
R/W
Undefined
H'FF800044
H'1F800044
16
GPIO interrupt control
register
GPIOIC
R/W
H'00000000
H'FF800048
H'1F800048
16
Serial port register
SCSPTR1
R/W
Undefined
H'FFE0001C H'1FE0001C 8
Serial port register
SCSPTR2
R/W
Undefined
H'FFE80020 H'1FE80020 16
Note: * Initialized by a power-on reset.
Rev. 6.0, 07/02, page 741 of 986
18.2
Register Descriptions
18.2.1
Port Control Register A (PCTRA)
Port control register A (PCTRA) is a 32-bit readable/writable register that controls the
input/output direction and pull-up for each bit in the 16-bit port (port 15 pin to port 0 pin). As the
initial value of port data register A (PDTRA) is undefined, all the bits in the 16-bit port should be
set to output with PCTRA after writing a value to the PDTRA register.
PCTRA is initialized to H'00000000 by a power-on reset. It is not initialized by a manual reset or
in standby mode, and retains its contents.
Bit:
31
30
29
28
27
26
25
24
PB15PUP PB15IO PB14PUP PB14IO PB13PUP PB13IO PB12PUP PB12IO
Initial value:
R/W:
Bit:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
23
22
21
20
19
18
17
16
PB9PUP
PB9IO
PB8PUP
PB8IO
PB11PUP PB11IO PB10PUP PB10IO
Initial value:
R/W:
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
15
14
13
12
11
10
9
8
PB7PUP
PB7IO
PB6PUP
PB6IO
PB5PUP
PB5IO
PB4PUP
PB4IO
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
PB3PUP
PB3IO
PB2PUP
PB2IO
PB1PUP
PB1IO
PB0PUP
PB0IO
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.0, 07/02, page 742 of 986
Bit 2n + 1 (n = 0–15)—Port Pull-Up Control (PBnPUP): Specifies whether each bit in the 16bit port is to be pulled up with a built-in resistor. Pull-up is automatically turned off for a port pin
set to output by bit PBnIO.
Bit 2n + 1: PBnPUP
Description
0
Bit m (m = 0–15) of 16-bit port is pulled up
1
Bit m (m = 0–15) of 16-bit port is not pulled up
(Initial value)
Bit 2n (n = 0–15)—Port I/O Control (PBnIO): Specifies whether each bit in the 16-bit port is an
input or an output.
Bit 2n: PBnIO
Description
0
Bit m (m = 0–15) of 16-bit port is an input
1
Bit m (m = 0–15) of 16-bit port is an output
18.2.2
(Initial value)
Port Data Register A (PDTRA)
Port data register A (PDTRA) is a 16-bit readable/writable register used as a data latch for each bit
in the 16-bit port. When a bit is set as an output, the value written to the PDTRA register is output
from the external pin. When a value is read from the PDTRA register while a bit is set as an input,
the external pin value sampled on the external bus clock is read. When a bit is set as an output, the
value written to the PDTRA register is read.
PDTRA is not initialized by a power-on or manual reset, or in standby mode, and retains its
contents.
Bit:
15
14
13
12
11
10
9
PB15DT PB14DT PB13DT PB12DT PB11DT PB10DT PB9DT
Initial value:
R/W:
Bit:
Initial value:
R/W:
8
PB8DT
—
—
—
—
—
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
PB7DT
PB6DT
PB5DT
PB4DT
PB3DT
PB2DT
PB1DT
PB0DT
—
—
—
—
—
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.0, 07/02, page 743 of 986
18.2.3
Port Control Register B (PCTRB)
Port control register B (PCTRB) is a 32-bit readable/writable register that controls the input/output
direction and pull-up for each bit in the 4-bit port (port 19 pin to port 16 pin). As the initial value
of port data register B (PDTRB) is undefined, each bit in the 4-bit port should be set to output with
PCTRB after writing a value to the PDTRB register.
PCTRB is initialized to H'00000000 by a power-on reset. It is not initialized by a manual reset or
in standby mode, and retains its contents.
Bit:
31
30
29
28
27
26
25
24
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
23
22
21
20
19
18
17
16
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
PB19PUP PB19IO PB18PUP PB18IO PB17PUP PB17IO PB16PUP PB16IO
Initial value:
R/W:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit 2n + 1 (n = 0–3)—Port Pull-Up Control (PBnPUP): Specifies whether each bit in the 4-bit
port is to be pulled up with a built-in resistor. Pull-up is automatically turned off for a port pin set
to output by bit PBnIO.
Bit 2n + 1: PBnPUP
Description
0
Bit m (m = 16–19) of 4-bit port is pulled up
1
Bit m (m = 16–19) of 4-bit port is not pulled up
Rev. 6.0, 07/02, page 744 of 986
(Initial value)
Bit 2n (n = 0–3)—Port I/O Control (PBnIO): Specifies whether each bit in the 4-bit port is an
input or an output.
Bit 2n: PBnIO
Description
0
Bit m (m = 16–19) of 4-bit port is an input
1
Bit m (m = 16–19) of 4-bit port is an output
18.2.4
(Initial value)
Port Data Register B (PDTRB)
Port data register B (PDTRB) is a 16-bit readable/writable register used as a data latch for each bit
in the 4-bit port. When a bit is set as an output, the value written to the PDTRB register is output
from the external pin. When a value is read from the PDTRB register while a bit is set as an input,
the external pin value sampled on the external bus clock is read. When a bit is set as an output, the
value written to the PDTRB register is read.
PDTRB is not initialized by a power-on or manual reset, or in standby mode, and retains its
contents.
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
Initial value:
0
0
0
0
—
—
—
—
R/W:
R
R
R
R
R/W
R/W
R/W
R/W
18.2.5
PB19DT PB18DT PB17DT PB16DT
GPIO Interrupt Control Register (GPIOIC)
The GPIO interrupt control register (GPIOIC) is a 16-bit readable/writable register that performs
16-bit interrupt input control.
GPIOIC is initialized to H'00000000 by a power-on reset. It is not initialized by a manual reset or
in standby mode, and retains its contents.
GPIO interrupts are active-low level interrupts. Bit-by-bit masking is possible, and the OR of all
the bits set as GPIO interrupts is used for interrupt detection. Which bits interrupts are input to can
be identified by reading the PDTRA register.
Rev. 6.0, 07/02, page 745 of 986
Bit:
15
14
13
12
11
10
9
8
PTIREN15 PTIREN14 PTIREN13 PTIREN12 PTIREN11 PTIREN10 PTIREN9 PTIREN8
Initial value:
R/W:
Bit:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
PTIREN7 PTIREN6 PTIREN5 PTIREN4 PTIREN3 PTIREN2 PTIREN1 PTIREN0
Initial value:
R/W:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit n (n = 0–15)—Port Interrupt Enable (PTIRENn): Specifies whether interrupt input is
performed for each bit.
Bit n: PTIRENn
Description
0
Port m (m = 0–15) of 16-bit port is used as a normal I/O port (Initial value)
1
Port m (m = 0–15) of 16-bit port is used as a GPIO interrupt*
Note: * When using an interrupt, set the corresponding port to input in the PCTRA register before
making the PTIRENn setting.
18.2.6
Serial Port Register (SCSPTR1)
Bit:
Initial value:
R/W:
7
6
5
4
EIO
—
—
—
3
2
1
0
SPB1IO SPB1DT SPB0IO SPB0DT
0
0
0
0
0
—
0
—
R/W
—
—
—
R/W
R/W
R/W
R/W
The serial port register (SCSPTR1) is an 8-bit readable/writable register that controls input/output
and data for the port pins multiplexed with the serial communication interface (SCI) pins. Input
data can be read from the RxD pin, output data written to the TxD pin, and breaks in serial
transmission/reception controlled, by means of bits 1 and 0. SCK pin data reading and output data
writing can be performed by means of bits 3 and 2. Bit 7 controls enabling and disabling of the
RXI interrupt.
SCSPTR1 can be read or written to by the CPU at all times. All SCSPTR1 bits except bits 2 and 0
are initialized to H'00 by a power-on reset or manual reset; the value of bits 2 and 0 is undefined.
SCSPTR1 is not initialized in the module standby state or standby mode.
Bit 7—Error Interrupt Only (EIO): See section 15.2.8, Serial Port Register (SCSPTR1).
Bits 6 to 4—Reserved: These bits are always read as 0, and should only be written with 0.
Rev. 6.0, 07/02, page 746 of 986
Bit 3—Serial Port Clock Port I/O (SPB1IO): Specifies serial port SCK pin input/output. When
the SCK pin is actually set as a port output pin and outputs the value set by the SPB1DT bit, the
C/$ bit in SCSMR1 and the CKE1 and CKE0 bits in SCSCR1 should be cleared to 0.
Bit 3: SPB1IO
Description
0
SPB1DT bit value is not output to the SCK pin
1
SPB1DT bit value is output to the SCK pin
(Initial value)
Bit 2—Serial Port Clock Port Data (SPB1DT): Specifies the serial port SCK pin input/output
data. Input or output is specified by the SPB1IO bit (see the description of bit 3, SPB1IO, for
details). When output is specified, the value of the SPB1DT bit is output to the SCK pin. The SCK
pin value is read from the SPB1DT bit regardless of the value of the SPB1IO bit. The initial value
of this bit after a power-on reset or manual reset is undefined.
Bit 2: SPB1DT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Bit 1—Serial Port Break I/O (SPB0IO): Specifies the serial port TxD pin output condition.
When the TxD pin is actually set as a port output pin and outputs the value set by the SPB0DT bit,
the TE bit in SCSCR1 should be cleared to 0.
Bit 1: SPB0IO
Description
0
SPB0DT bit value is not output to the TxD pin
1
SPB0DT bit value is output to the TxD pin
(Initial value)
Bit 0—Serial Port Break Data (SPB0DT): Specifies the serial port RxD pin input data and TxD
pin output data. The TxD pin output condition is specified by the SPB0IO bit (see the description
of bit 1, SPB0IO, for details). When the TxD pin is designated as an output, the value of the
SPB0DT bit is output to the TxD pin. The RxD pin value is read from the SPB0DT bit regardless
of the value of the SPB0IO bit. The initial value of this bit after a power-on reset or manual reset
is undefined.
Bit 0: SPB0DT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Rev. 6.0, 07/02, page 747 of 986
18.2.7
Serial Port Register (SCSPTR2)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
RTSIO
RTSDT
CTSIO
CTSDT
—
—
0
—
0
—
0
0
0
—
R/W
R/W
R/W
R/W
R
R
R/W
R/W
Initial value:
R/W:
SPB2IO SPB2DT
The serial port register (SCSPTR2) is a 16-bit readable/writable register that controls input/output
and data for the port pins multiplexed with the serial communication interface (SCIF) pins. Input
data can be read from the RxD2 pin, output data written to the TxD2 pin, and breaks in serial
transmission/reception controlled, by means of bits 1 and 0. &765 pin data reading and output data
writing can be performed by means of bits 5 and 4, and 5765 pin data reading and output data
writing by means of bits 7 and 6.
SCSPTR2 can be read or written to by the CPU at all times. All SCSPTR2 bits except bits 6, 4,
and 0 are initialized to 0 by a power-on reset or manual reset; the value of bits 6, 4, and 0 is
undefined. SCSPTR2 is not initialized in standby mode or in the module standby state.
Bits 15 to 8—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 7—Serial Port RTS Port I/O (RTSIO): Specifies serial port 5765 pin input/output. When
the 5765 pin is actually set as a port output pin and outputs the value set by the RTSDT bit, the
MCE bit in SCFCR2 should be cleared to 0.
Bit 7: RTSIO
Description
0
RTSDT bit value is not output to the 5765 pin
1
RTSDT bit value is output to the 5765 pin
Rev. 6.0, 07/02, page 748 of 986
(Initial value)
Bit 6—Serial Port RTS Port Data (RTSDT): Specifies the serial port 5765 pin input/output
data. Input or output is specified by the RTSIO pin (see the description of bit 7, RTSIO, for
details). When the 5765 pin is designated as an output, the value of the RTSDT bit is output to the
5765 pin. The 5765 pin value is read from the RTSDT bit regardless of the value of the RTSIO
bit. The initial value of this bit after a power-on reset or manual reset is undefined.
Bit 6: RTSDT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Bit 5—Serial Port CTS Port I/O (CTSIO): Specifies serial port &765 pin input/output. When
the &765 pin is actually set as a port output pin and outputs the value set by the CTSDT bit, the
MCE bit in SCFCR2 should be cleared to 0.
Bit 5: CTSIO
Description
0
CTSDT bit value is not output to the &765 pin
1
CTSDT bit value is output to the &765 pin
(Initial value)
Bit 4—Serial Port CTS Port Data (CTSDT): Specifies the serial port &765 pin input/output
data. Input or output is specified by the CTSIO pin (see the description of bit 5, CTSIO, for
details). When the &765 pin is designated as an output, the value of the CTSDT bit is output to the
&765 pin. The &765 pin value is read from the CTSDT bit regardless of the value of the CTSIO
bit. The initial value of this bit after a power-on reset or manual reset is undefined.
Bit 4: CTSDT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Bits 3 and 2—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 1—Serial Port Break I/O (SPB2IO): Specifies the serial port TxD2 pin output condition.
When the TxD2 pin is actually set as a port output pin and outputs the value set by the SPB2DT
bit, the TE bit in SCSCR2 should be cleared to 0.
Bit 1: SPB2IO
Description
0
SPB2DT bit value is not output to the TxD2 pin
1
SPB2DT bit value is output to the TxD2 pin
(Initial value)
Rev. 6.0, 07/02, page 749 of 986
Bit 0—Serial Port Break Data (SPB2DT): Specifies the serial port RxD2 pin input data and
TxD2 pin output data. The TxD2 pin output condition is specified by the SPB2IO bit (see the
description of bit 1, SPB2IO, for details). When the TxD2 pin is designated as an output, the value
of the SPB2DT bit is output to the TxD2 pin. The RxD2 pin value is read from the SPB2DT bit
regardless of the value of the SPB2IO bit. The initial value of this bit after a power-on reset or
manual reset is undefined.
Bit 0: SPB2DT
Description
0
Input/output data is low-level
1
Input/output data is high-level
Rev. 6.0, 07/02, page 750 of 986
Section 19 Interrupt Controller (INTC)
19.1
Overview
The interrupt controller (INTC) ascertains the priority of interrupt sources and controls interrupt
requests to the CPU. The INTC registers set the order of priority of each interrupt, allowing the
user to handle interrupt requests according to user-set priority.
19.1.1
Features
The INTC has the following features.
• Fifteen interrupt priority levels can be set
By setting the three interrupt priority registers, the priorities of on-chip peripheral module
interrupts can be selected from 15 levels for different request sources.
• NMI noise canceler function
The NMI input level bit indicates the NMI pin state. The pin state can be checked by reading
this bit in the interrupt exception service routine, enabling it to be used as a noise canceler.
• NMI request masking when SR.BL bit is set to 1
It is possible to select whether or not NMI requests are to be masked when the SR.BL bit is set
to 1.
19.1.2
Block Diagram
Figure 19.1 shows a block diagram of the INTC.
Rev. 6.0, 07/02, page 751 of 986
NMI
Input control
–
4
4
TMU
(Interrupt request)
RTC
(Interrupt request)
SCI
(Interrupt request)
SCIF
(Interrupt request)
SR
WDT
(Interrupt request)
I3 I2 I1 I0
REF
(Interrupt request)
DMAC
(Interrupt request)
H-UDI
(Interrupt request)
GPIO
(Interrupt request)
Comparator
Priority
identifier
Interrupt
request
CPU
IPR
IPRA–IPRD*1
INTPRI00*2
Bus interface
INTC
TMU: Timer unit
RTC: Realtime clock unit
SCI:
Serial communication interface
SCIF: Serial communication interface with FIFO
WDT: Watchdog timer
REF: Memory refresh controller section of the bus state controller
DMAC: Direct memory access controller
H-UDI: Hitachi user debug interface
GPIO: I/O port
ICR: Interrupt control register
IPRA–IPRD: Interrupt priority registers A–D*1
INTPRI00: Interrupt priority level setting register 00*2
SR:
Status register
Notes: *1 IPRD is provided only in the SH7750S and SH7750R.
*2 INTPRI00 is provided only in the SH7750R.
Figure 19.1 Block Diagram of INTC
Rev. 6.0, 07/02, page 752 of 986
Internal bus
ICR
19.1.3
Pin Configuration
Table 19.1 shows the INTC pin configuration.
Table 19.1 INTC Pins
Pin Name
Abbreviation
I/O
Function
Nonmaskable interrupt
input pin
NMI
Input
Input of nonmaskable interrupt request
signal
Interrupt input pins
,5/6–,5/3
Input
Input of interrupt request signals
(maskable by I3–I0 in SR)
19.1.4
Register Configuration
The INTC has the registers shown in table 19.2.
Table 19.2 INTC Registers
Initial Value*
1
P4 Address
Area 7
Address
Access
Size
*2
H'FFD00000
H'1FD00000
16
R/W
H'0000
H'FFD00004
H'1FD00004
16
IPRB
R/W
H'0000
H'FFD00008
H'1FD00008
16
Interrupt priority
register C
IPRC
R/W
H'0000
H'FFD0000C
H'1FD0000C
16
Interrupt priority
3
register D*
IPRD
R/W
H'DA74
H'FFD00010
H'1FD00010
16
Interrupt priority
level setting
4
register 00*
INTPRI00
R/W
H'00000000
H'FE080000
H'1E080000
32
Interrupt source
4
register 00*
INTREQ00
R
H'00000000
H'FE080020
H'1E080020
32
Interrupt mask
4
register 00*
INTMSK00
R/W
H'00000300
H'FE080040
H'1E080040
32
—
H'FE080060
H'1E080060
32
Name
Abbreviation
R/W
Interrupt control
register
ICR
R/W
Interrupt priority
register A
IPRA
Interrupt priority
register B
Interrupt mask
INTMSKCLR00 R
4
clear register 00*
Notes: *1
*2
*3
*4
Initialized by a power-on reset or manual reset.
H'8000 when the NMI pin is high, H'0000 when the NMI pin is low.
SH7750S and SH7750R only
SH7750R only
Rev. 6.0, 07/02, page 753 of 986
19.2
Interrupt Sources
There are three types of interrupt sources: NMI, RL, and on-chip peripheral modules. Each
interrupt has a priority level (16–0), with level 16 as the highest and level 1 as the lowest. When
level 0 is set, the interrupt is masked and interrupt requests are ignored.
19.2.1
NMI Interrupt
The NMI interrupt has the highest priority level of 16. It is always accepted unless the BL bit in
the status register in the CPU is set to 1. In sleep or standby mode, the interrupt is accepted even if
the BL bit is set to 1.
A setting can also be made to have the NMI interrupt accepted even if the BL bit is set to 1.
Input from the NMI pin is edge-detected. The NMI edge select bit (NMIE) in the interrupt control
register (ICR) is used to select either rising or falling edge. When the NMIE bit in the ICR register
is modified, the NMI interrupt is not detected for a maximum of 6 bus clock cycles after the
modification.
NMI interrupt exception handling does not affect the interrupt mask level bits (I3–I0) in the status
register (SR).
Rev. 6.0, 07/02, page 754 of 986
19.2.2
IRL Interrupts
IRL interrupts are input by level at pins ,5/6–,5/3. The priority level is the level indicated by
pins ,5/6–,5/3. An ,5/6–,5/3 value of 0 (0000) indicates the highest-level interrupt request
(interrupt priority level 15). A value of 15 (1111) indicates no interrupt request (interrupt priority
level 0).
SH7750 Series
Interrupt
requests
Priority
encoder
4
to
to
Figure 19.2 Example of IRL Interrupt Connection
Rev. 6.0, 07/02, page 755 of 986
Table 19.3 ,5/6–,5/3
,5/6 ,5/3 Pins and Interrupt Levels
,5/6
,5/5
,5/4
,5/3
Interrupt Priority Level
Interrupt Request
0
0
0
0
15
Level 15 interrupt request
1
14
Level 14 interrupt request
0
13
Level 13 interrupt request
1
12
Level 12 interrupt request
0
11
Level 11 interrupt request
1
10
Level 10 interrupt request
0
9
Level 9 interrupt request
1
8
Level 8 interrupt request
0
7
Level 7 interrupt request
1
6
Level 6 interrupt request
0
5
Level 5 interrupt request
1
4
Level 4 interrupt request
0
3
Level 3 interrupt request
1
2
Level 2 interrupt request
0
1
Level 1 interrupt request
1
0
No interrupt request
1
1
0
1
1
0
0
1
1
0
1
A noise-cancellation feature is built in, and the IRL interrupt is not detected unless the levels
sampled at every bus clock cycle remain unchanged for three consecutive cycles, so that no
transient level on the ,5/ pin change is detected. In standby mode, as the bus clock is stopped,
noise cancellation is performed using the 32.768 kHz clock for the RTC instead. When the RTC is
not used, therefore, interruption by means of IRL interrupts cannot be performed in standby mode.
The priority level of the IRL interrupt must not be lowered unless the interrupt is accepted and the
interrupt handling starts. However, the priority level can be changed to a higher one.
The interrupt mask bits (I3–I0) in the status register (SR) are not affected by IRL interrupt
handling.
Pins ,5/3–,5/6 can be used for four independent interrupt requests by setting the IRLM bit to 1
in the ICR register. When independent interrupt requests are used in the SH7750, the interrupt
priority levels are fixed (table 19.4). When independent interrupt requests are used in the
SH7750S or SH7750R, the interrupt priority levels can be set in interrupt priority register D
(IPRD).
Rev. 6.0, 07/02, page 756 of 986
Table 19.4 SH7750 ,5/6–,5/3
,5/6 ,5/3 Pins and Interrupt Levels (When IRLM = 1)
,5/6
,5/5
,5/4
,5/3
Interrupt Priority Level
Interrupt Request
1/0
1/0
1/0
0
13
IRL0
1/0
1/0
0
1
10
IRL1
1/0
0
1
1
7
IRL2
0
1
1
1
4
IRL3
19.2.3
On-Chip Peripheral Module Interrupts
On-chip peripheral module interrupts are generated by the following nine modules:
• Hitachi user debug interface (H-UDI)
• Direct memory access controller (DMAC)
• Timer unit (TMU)
• Realtime clock (RTC)
• Serial communication interface (SCI)
• Serial communication interface with FIFO (SCIF)
• Bus state controller (BSC)
• Watchdog timer (WDT)
• I/O port (GPIO)
Not every interrupt source is assigned a different interrupt vector, bus sources are reflected in the
interrupt event register (INTEVT), so it is easy to identify sources by using the INTEVT register
value as a branch offset in the exception handling routine.
A priority level from 15 to 0 can be set for each module by means of interrupt priority registers A
to D (IPRA–IPRD), 00 (INTPRI00).
The interrupt mask bits (I3–I0) in the status register (SR) are not affected by on-chip peripheral
module interrupt handling.
On-chip peripheral module interrupt source flag and interrupt enable flag updating should only be
carried out when the BL bit in the status register (SR) is set to 1. To prevent acceptance of an
erroneous interrupt from an interrupt source that should have been updated, first read the on-chip
peripheral register containing the relevant flag, then clear the BL bit to 0. In the case of interrupts
on channel 3 or 4 of the TMU, also read from the interrupt source register 00 (INTREQ00). This
will secure the necessary timing internally. When updating a number of flags, there is no problem
if only the register containing the last flag updated is read.
Rev. 6.0, 07/02, page 757 of 986
If flag updating is performed while the BL bit is cleared to 0, the program may jump to the
interrupt handling routine when the INTEVT register value is 0. In this case, interrupt handling is
initiated due to the timing relationship between the flag update and interrupt request recognition
within the chip. Processing can be continued without any problem by executing an RTE
instruction.
19.2.4
Interrupt Exception Handling and Priority
Table 19.5 lists the codes for the interrupt event register (INTEVT), and the order of interrupt
priority. Each interrupt source is assigned a unique INTEVT code. The start address of the
interrupt handler is common to each interrupt source. This is why, for instance, the value of
INTEVT is used as an offset at the start of the interrupt handler and branched to in order to
identify the interrupt source.
The order of priority of the on-chip peripheral modules is specified as desired by setting priority
levels from 0 to 15 in interrupt priority registers A to D (IPRA–IPRD). The order of priority of the
on-chip peripheral modules is set to 0 by a reset.
When the priorities for multiple interrupt sources are set to the same level and such interrupts are
generated simultaneously, they are handled according to the default priority order shown in table
19.5.
Updating of interrupt priority registers A to D, 00 should only be carried out when the BL bit in
the status register (SR) is set to 1. To prevent erroneous interrupt acceptance, first read one of the
interrupt priority registers, then clear the BL bit to 0. This will secure the necessary timing
internally.
Rev. 6.0, 07/02, page 758 of 986
Table 19.5 Interrupt Exception Handling Sources and Priority Order
Interrupt Source
INTEVT Interrupt Priority IPR (Bit
Code
(Initial Value)
Numbers)
Priority within
IPR Setting Unit
Default
Priority
NMI
H'1C0
16
—
—
IRL
,5/6–,5/3 = 0 H'200
15
—
—
,5/6–,5/3 = 1 H'220
14
—
—
,5/6–,5/3 = 2 H'240
13
—
—
,5/6–,5/3 = 3 H'260
12
—
—
,5/6–,5/3 = 4 H'280
11
—
—
,5/6–,5/3 = 5 H'2A0
10
—
—
,5/6–,5/3 = 6 H'2C0
9
—
—
,5/6–,5/3 = 7 H'2E0
8
—
—
,5/6–,5/3 = 8 H'300
7
—
—
,5/6–,5/3 = 9 H'320
6
—
—
,5/6–,5/3 = A H'340
5
—
—
,5/6–,5/3 = B H'360
4
—
—
,5/6–,5/3 = C H'380
3
—
—
,5/6–,5/3 = D H'3A0
2
—
—
,5/6–,5/3 = E H'3C0
1
High
↑
↓
Low
IRL0
H'240
IRL1
H'2A0
IRL2
H'300
—
IPRD (15–12)* —
1
IPRD (11–8)*
15–0 (13)*
15–0 (10)*
15–0 (7)*
1
1
—
1
1
1
—
1
—
1
IPRD (3–0)*
—
—
IPRD (7–4)*
IRL3
H'360
15–0 (4)*
H-UDI
H-UDI
H'600
15–0 (0)
IPRC (3–0)
GPIO
GPIOI
H'620
15–0 (0)
IPRC (15–12) —
DMAC
DMTE0
H'640
15–0 (0)
IPRC (11–8)
DMTE1
H'660
DMTE2
H'680
DMTE3
H'6A0
2
DMTE4*
H'780
DMTE5*
2
H'7A0
DMTE6*
2
H'7C0
DMTE7*
2
H'7E0
DMAE
H'6C0
High
↑
↓
Low
Rev. 6.0, 07/02, page 759 of 986
Table 19.5 Interrupt Exception Handling Sources and Priority Order (cont)
Interrupt Source
INTEVT Interrupt Priority IPR (Bit
Code
(Initial Value)
Numbers)
Priority within
IPR Setting Unit
Default
Priority
TMU3
TUNI3*
2
H'B00
15–0 (0)
INTPRI00
(11–8)
—
TMU4
TUNI4*
2
H'B80
15–0 (0)
INTPRI00
(15–12)
—
TMU0
TUNI0
H'400
15–0 (0)
IPRA (15–12)
—
TMU1
TUNI1
H'420
15–0 (0)
IPRA (11–8)
—
TMU2
TUNI2
H'440
15–0 (0)
IPRA (7–4)
High
TICPI2
H'460
ATI
H'480
PRI
H'4A0
CUI
H'4C0
ERI
H'4E0
RXI
H'500
TXI
H'520
TEI
H'540
ERI
H'700
RXI
H'720
BRI
H'740
TXI
H'760
WDT
ITI
REF
RTC
SCI1
SCIF
15–0 (0)
IPRA (3–0)
High
↑
↓
Low
15–0 (0)
IPRB (7–4)
High
↑
↓
Low
15–0 (0)
IPRC (7–4)
High
↑
↓
Low
H'560
15–0 (0)
IPRB (15–12)
—
RCMI
H'580
15–0 (0)
IPRB (11–8)
High
High
↑
↓
ROVI
H'5A0
Low
Low
Low
Notes: TUNI0–TUNI4: Underflow interrupts
TICPI2: Input capture interrupt
ATI:
Alarm interrupt
PRI:
Periodic interrupt
CUI:
Carry-up interrupt
ERI:
Receive-error interrupt
RXI:
Receive-data-full interrupt
TXI:
Transmit-data-empty interrupt
TEI:
Transmit-end interrupt
BRI:
Break interrupt request
ITI:
Interval timer interrupt
RCMI: Compare-match interrupt
ROVI: Refresh counter overflow interrupt
Rev. 6.0, 07/02, page 760 of 986
H-UDI: Hitachi use debug interface
GPIOI: I/O port interrupt
DMTE0–DMTE7: DMAC transfer end interrupts
DMAE: DMAC address error interrupt
*1 Interrupt priority levels can only be changed in the SH7750S or SH7750R. In the
SH7750, the initial values cannot be changed.
*2 SH7750R only
19.3
Register Descriptions
19.3.1
Interrupt Priority Registers A to D (IPRA–IPRD)
Interrupt priority registers A to D (IPRA–IPRD) are 16-bit readable/writable registers that set
priority levels from 0 to 15 for on-chip peripheral module interrupts. IPRA to IPRC are initialized
to H'0000 and IPRD is to H'DA74 by a reset. They are not initialized in standby mode.
IPRA to IPRC
Bit:
15
14
13
12
11
10
9
8
Initial value:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit:
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W:
R/W:
IPRD (SH7750S and SH7750R only)
Bit:
15
14
13
12
11
10
9
8
Initial value:
1
1
0
1
1
0
1
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
R/W:
Bit:
Initial value:
R/W:
0
1
1
1
0
1
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.0, 07/02, page 761 of 986
Table 19.6 shows the relationship between the interrupt request sources and the IPRA–IPRD
register bits.
Table 19.6 Interrupt Request Sources and IPRA–IPRD Registers
Bits
Register
15–12
11–8
Interrupt priority register A
TMU0
TMU1
Interrupt priority register B
Interrupt priority register C
3
Interrupt priority register D*
7–4
3–0
TMU2
RTC
WDT
REF*
1
SCI1
2
Reserved*
GPIO
DMAC
SCIF
H-UDI
IRL0
IRL1
IRL2
IRL3
Notes: *1 REF is the memory refresh unit in the bus state controller (BSC). See section 13, Bus
State Controller (BSC), for details.
*2 Reserved bits: These bits are always read as 0 and should always be written with 0.
*3 SH7750S and SH7750R only
As shown in table 19.6, four on-chip peripheral modules are assigned to each register. Interrupt
priority levels are established by setting a value from H'F (1111) to H'0 (0000) in each of the fourbit groups: 15–12, 11–8, 7–4, and 3–0. Setting H'F designates priority level 15 (the highest level),
and setting H'0 designates priority level 0 (requests are masked).
19.3.2
Interrupt Control Register (ICR)
The interrupt control register (ICR) is a 16-bit register that sets the input signal detection mode for
external interrupt input pin NMI and indicates the input signal level at the NMI pin. This register
is initialized by a power-on reset or manual reset. It is not initialized in standby mode.
Bit:
15
14
13
12
11
10
9
8
Bit name:
NMIL
MAI
—
—
—
—
NMIB
NMIE
Initial value:
0/1*
0
0
0
0
0
0
0
R/W:
R
R/W
—
—
—
—
R/W
R/W
Bit:
7
6
5
4
3
2
1
0
IRLM
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
R/W
—
—
—
—
—
—
—
Bit name:
Initial value:
R/W:
Note: * 1 when NMI pin input is high, 0 when low.
Rev. 6.0, 07/02, page 762 of 986
Bit 15—NMI Input Level (NMIL): Sets the level of the signal input at the NMI pin. This bit can
be read to determine the NMI pin level. It cannot be modified.
Bit 15: NMIL
Description
0
NMI pin input level is low
1
NMI pin input level is high
Bit 14—NMI Interrupt Mask (MAI): Specifies whether or not all interrupts are to be masked
while the NMI pin input level is low, irrespective of the CPU’s SR.BL bit.
Bit 14: MAI
Description
0
Interrupts enabled even while NMI pin is low
1
Interrupts disabled while NMI pin is low*
(Initial value)
Note: * NMI interrupts are accepted in normal operation and in sleep mode.
In standby mode, all interrupts are masked, and standby is not cleared, while the NMI pin is
low.
Bit 9—NMI Block Mode (NMIB): Specifies whether an NMI request is to be held pending or
detected immediately while the SR.BL bit is set to 1.
Bit 9: NMIB
Description
0
NMI interrupt requests held pending while SR.BL bit is set to 1
(Initial value)
1
NMI interrupt requests detected while SR.BL bit is set to 1
Notes: 1. If interrupt requests are enabled while SR.BL = 1, the previous exception information
will be lost, and so must be saved beforehand.
2. This bit is cleared automatically by NMI acceptance.
Bit 8—NMI Edge Select (NMIE): Specifies whether the falling or rising edge of the interrupt
request signal to the NMI pin is detected.
Bit 8: NMIE
Description
0
Interrupt request detected on falling edge of NMI input
1
Interrupt request detected on rising edge of NMI input
(Initial value)
Rev. 6.0, 07/02, page 763 of 986
Bit 7—IRL Pin Mode (IRLM): Specifies whether pins ,5/6–,5/3 are to be used as levelencoded interrupt requests or as four independent interrupt requests.
Bit 7: IRLM
Description
0
,5/ pins used as level-encoded interrupt requests
1
,5/ pins used as four independent interrupt requests (level-sense IRQ
mode)
(Initial value)
Bits 13 to 10 and 6 to 0—Reserved: These bits are always read as 0, and should only be written
with 0.
19.3.3
Interrupt-Priority-Level Setting Register 00 (INTPRI00) (SH7750R Only)
The interrupt-priority-level setting register 00 (INTPRI00) sets the priority levels (levels 15–0) for
the on-chip peripheral module interrupts. INTPRI00 is a 32-bit readable/writable register. It is
initialized to H'00000000 by a reset, but is not initialized when the device enters standby mode.
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
R
R
R
R
R
R
R
R/W: R/W R/W R/W R/W R/W R/W R/W R/W
Table 19.7 shows the correspondence between interrupt request sources and the bits in INTPRI00.
Rev. 6.0, 07/02, page 764 of 986
Table 19.7 Interrupt Request Sources and the Bits of the INTPRI00 Register
Bit
Register
31 to 28
Reserved
Interruptpriority-level
setting
register 00
27 to 24
23 to 20
19 to 16
15 to 12
11 to 8
7 to 4
3 to 0
Reserved
Reserved
Reserved
TMU ch4 TMU ch3 Reserved
Reserved
Note: As shown in the table above, levels for all eight on-chip peripheral modules are assigned in
a single register. The interrupt priority level for the interrupt source that corresponds to each
set of four bits is set as a value from H'F (1111) to H'0 (0000). The setting H'F selects
interrupt priority level 15, which is the highest, and H'0 selects level 0, which means that
interrupt requests from that source are masked.
Reserved bits are always read as 0. When writing, only 0s should be written to these bits.
19.3.4
Interrupt Source Register 00 (INTREQ00) (SH7750R Only)
The interrupt source register 00 (INTREQ00) indicates the origin of the interrupt request that has
been sent to the INTC. The states of the bits in this register is not affected by masking of the
corresponding interrupts by the settings in the INTPRI00 or INTMSK00 register. INTREQ00 is a
32-bit read-only register.
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Bit 31 to 0—Interrupt Request: Each of the non-reserved bits in this register indicates that there
is an interrupt request relevant to that bit. For the correspondence between the bits and interrupt
sources, see section 19.3.7, Bit Assignments of INTREQ00, INTMSK00, and INTMSKCLR00
(SH7750R Only).
Bits 31 to 0
Description
0
There is no interrupt request that corresponds to this bit
1
There is an interrupt request that corresponds to this bit.
Rev. 6.0, 07/02, page 765 of 986
19.3.5
Interrupt Mask Register 00 (INTMSK00) (SH7750R Only)
The interrupt mask register 00 (INTMSK00) sets the masking of individual interrupt requests.
INTMSK00 is a 32-bit register. It is initialized to H'000003FF by a reset, and retains this value in
standby mode.
To cancel masking of an interrupt, write a 1 to the corresponding bit in the INTMSKCLR00
register. Note that writing a 0 to a bit in INTMSK00 does not change its value.
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
R/W:
R
R
R
R
R
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Bit 31 to 0—Interrupt Mask: Sets the masking of the interrupt request that corresponds to the
given bit. For the correspondence between bits and interrupt sources, see section 19.3.7, Bit
Assignments of INTREQ00, INTMSK00, and INTMSKCLR00 (SH7750R Only).
Bits 31 to 0
Description
0
Interrupt requests from the source that corresponds to this bit are
accepted
1
Interrupt requests from the source that corresponds to this bit are
masked
(Initial value)
Rev. 6.0, 07/02, page 766 of 986
19.3.6
Interrupt Mask Clear Register 00 (INTMSKCLR00) (SH7750R Only)
The interrupt mask clear register 00 (INTMSKCLR00) clears the masking of individual interrupt
requests. INTMSKCLR00 is a 32-bit write-only register.
Bit:
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W:
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
Bit:
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R/W:
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
Bit 31 to 0
Interrupt Mask Clear: Each bit selects whether or not to clear the masking of the
interrupt source that corresponds to that bit. For the correspondence between the bits and interrupt
sources, see section 19.3.7, Bit Assignments of INTREQ00, INTMSK00, and INTMSKCLR00
(SH7750R Only).
Bits 31 to 0
Description
0
Masking of interrupt requests from the source that corresponds to the
bit is not changed
1
Masking of interrupt requests from the source that corresponds to the
bit is cleared
19.3.7
Bit Assignments of INTREQ00, INTMSK00, and INTMSKCLR00
(SH7750R Only)
The relationship between the bits in these registers and interrupt sources is as shown below.
Table 19.8 Bit Assignments
Bit number
Module
Interrupt
31 to 10, 7 to 0
Reserved
Reserved
9
TMU
TUNI4
8
TMU
TUNI3
Rev. 6.0, 07/02, page 767 of 986
19.4
INTC Operation
19.4.1
Interrupt Operation Sequence
The sequence of operations when an interrupt is generated is described below. Figure 19.3 shows a
flowchart of the operations.
1. The interrupt request sources send interrupt request signals to the interrupt controller.
2. The interrupt controller selects the highest-priority interrupt from the interrupt requests sent,
according to the priority levels set in interrupt priority registers A to C (IPRA–IPRC). Lowerpriority interrupts are held pending. If two of these interrupts have the same priority level, or if
multiple interrupts occur within a single module, the interrupt with the highest priority
according to table 19.5, Interrupt Exception Handling Sources and Priority Order, is selected.
3. The priority level of the interrupt selected by the interrupt controller is compared with the
interrupt mask bits (I3–I0) in the status register (SR) of the CPU. If the request priority level is
higher that the level in bits I3–I0, the interrupt controller accepts the interrupt and sends an
interrupt request signal to the CPU.
4. The CPU accepts an interrupt at a break between instructions.
5. The interrupt source code is set in the interrupt event register (INTEVT).
6. The status register (SR) and program counter (PC) are saved to SSR and SPC, respectively.
The R15 contents at this time are saved in SGR.
7. The block bit (BL), mode bit (MD), and register bank bit (RB) in SR are set to 1.
8. The CPU jumps to the start address of the interrupt handler (the sum of the value set in the
vector base register (VBR) and H'00000600).
The interrupt handler may branch with the INTEVT register value as its offset in order to identify
the interrupt source. This enables it to branch to the handling routine for the particular interrupt
source.
Notes: 1. The interrupt mask bits (I3–I0) in the status register (SR) are not changed by
acceptance of an interrupt in the SH7750 Series.
2. The interrupt source flag should be cleared in the interrupt handler. To ensure that an
interrupt request that should have been cleared is not inadvertently accepted again, read
the interrupt source flag after it has been cleared, then wait for the interval shown in
table 19.7 (Time for priority decision and SR mask bit comparison) before clearing the
BL bit or executing an RTE instruction.
3. For some interrupt sources, their interrupt masks (INTMSK00) must e cleared using
the INTMSKCLR00 register.
Rev. 6.0, 07/02, page 768 of 986
Program
execution state
Interrupt
generated?
No
Yes
(BL bit
in SR = 0) or
(sleep or standby
mode)?
No
NMIB in
ICR = 1 and
NMI?
Yes
No
No
NMI?
Yes
Yes
No
Level 15
interrupt?
Yes
Yes
I3–I0* =
level 14 or
lower?
No
Set interrupt source
in INTEVT
Yes
Level 14
interrupt?
Yes
I3–I0 =
level 13 or
lower?
No Yes
Save SR to SSR;
save PC to SPC
No
Level 1
interrupt?
No
Yes
I3–I0 =
level 0?
No
Set BL, MD, RB bits
in SR to 1
Branch to exception
handler
Note: * I3–I0: Interrupt mask bits in status register (SR)
Figure 19.3 Interrupt Operation Flowchart
Rev. 6.0, 07/02, page 769 of 986
19.4.2
Multiple Interrupts
When handling multiple interrupts, interrupt handling should include the following procedures:
1. Branch to a specific interrupt handler corresponding to a code set in the INTEVT register. The
code in INTEVT can be used as a branch-offset for branching to the specific handler.
2. Clear the interrupt source in the corresponding interrupt handler.
3. Save SPC and SSR to the stack.
4. Clear the BL bit in SR, and set the accepted interrupt level in the interrupt mask bits in SR.
5. Handle the interrupt.
6. Set the BL bit in SR to 1.
7. Restore SSR and SPC from memory.
8. Execute the RTE instruction.
When these procedures are followed in order, an interrupt of higher priority than the one being
handled can be accepted after clearing BL in step 4. This enables the interrupt response time to be
shortened for urgent processing.
19.4.3
Interrupt Masking with MAI Bit
By setting the MAI bit to 1 in the ICR register, it is possible to mask interrupts while the NMI pin
is low, irrespective of the BL and IMASK bits in the SR register.
• In normal operation and sleep mode
All interrupts are masked while the NMI pin is low. However, an NMI interrupt only is
generated by a transition at the NMI pin.
• In standby mode
All interrupts are masked while the NMI pin is low, and an NMI interrupt is not generated by a
transition at the NMI pin. Therefore, standby cannot be cleared by an NMI interrupt while the
MAI bit is set to 1.
Rev. 6.0, 07/02, page 770 of 986
19.5
Interrupt Response Time
The time from generation of an interrupt request until interrupt exception handling is performed
and fetching of the first instruction of the exception service routine is started (the interrupt
response time) is shown in table 19.9.
Table 19.9 Interrupt Response Time
Number of States
Item
NMI
RL
Peripheral
Modules
Time for priority decision and
SR mask bit comparison*
1Icyc + 4Bcyc
1Icyc + 7Bcyc
1Icyc + 2Bcyc
Wait time until end of
sequence being executed by
CPU
S – 1 (≥ 0) ×
Icyc
S – 1 (≥ 0) ×
Icyc
S – 1 (≥ 0) ×
Icyc
Time from interrupt exception
handling (save of SR and PC)
until fetch of first instruction of
exception handler is started
4 × Icyc
4 × Icyc
4 × Icyc
Response
time
Total
5Icyc + 4Bcyc
+ (S – 1)Icyc
5Icyc + 7Bcyc
+ (S – 1)Icyc
5Icyc + 2Bcyc
+ (S – 1)Icyc
Minimum
case
13Icyc
19Icyc
9Icyc
When Icyc:
Bcyc = 2:1
Maximum
case
36 + S Icyc
60 + S Icyc
20 + S Icyc
When Icyc:
Bcyc = 8:1
Notes
Icyc: One cycle of internal clock supplied to CPU, etc.
Bcyc: One CKIO cycle
S:
Latency of instruction
Note: * In the SH7750 and SH7750S including the case where the mask bit (IMASK) in SR is
changed, and a new interrupt is generated.
Rev. 6.0, 07/02, page 771 of 986
Rev. 6.0, 07/02, page 772 of 986
Section 20 User Break Controller (UBC)
20.1
Overview
The user break controller (UBC) provides functions that simplify program debugging. When break
conditions are set in the UBC, a user break interrupt is generated according to the contents of the
bus cycle generated by the CPU. This function makes it easy to design an effective selfmonitoring debugger, enabling programs to be debugged with the chip alone, without using an incircuit emulator.
20.1.1
Features
The UBC has the following features.
• Two break channels (A and B)
User break interrupts can be generated on independent conditions for channels A and B, or on
sequential conditions (sequential break setting: channel A → channel B).
• The following can be set as break compare conditions:
Address (selection of 32-bit virtual address and ASID for comparison):
Address: All bits compared/lower 10 bits masked/lower 12 bits masked/lower 16 bits
masked/lower 20 bits masked/all bits masked
ASID: All bits compared/all bits masked
Data (channel B only, 32-bit mask capability)
Bus cycle: Instruction access/operand access
Read/write
Operand size: Byte/word/longword/quadword
• An instruction access cycle break can be effected before or after the instruction is executed.
Rev. 6.0, 07/02, page 773 of 986
20.1.2
Block Diagram
Figure 20.1 shows a block diagram of the UBC.
Access
control
Address
bus
Data
bus
Channel A
Access
comparator
BBRA
BARA
Address
comparator
BASRA
BAMRA
Channel B
Access
comparator
BBRB
BARB
Address
comparator
BASRB
BAMRB
Data
comparator
BDRB
BDMRB
BBRA:
BARA:
BASRA:
BAMRA:
BBRB:
BARB:
BASRB:
BAMRB:
BDRB:
BDMRB:
BRCR:
Break bus cycle register A
Break address register A
Break ASID register A
Break address mask register A
Break bus cycle register B
Break address register B
Break ASID register B
Break address mask register B
Break data register B
Break data mask register B
Break control register
Control
BRCR
User break trap request
Figure 20.1 Block Diagram of User Break Controller
Rev. 6.0, 07/02, page 774 of 986
Table 20.1 shows the UBC registers.
Table 20.1 UBC Registers
Name
Abbreviation
R/W
Initial Value
P4 Address
Area 7
Address
Access
Size
Break address
register A
BARA
R/W
Undefined
H'FF200000
H'1F200000
32
Break address
mask
register A
BAMRA
R/W
Undefined
H'FF200004
H'1F200004
8
Break bus
cycle register A
BBRA
R/W
H'0000
H'FF200008
H'1F200008
16
Break ASID
register A
BASRA
R/W
Undefined
H'FF000014
H'1F000014
8
Break address
register B
BARB
R/W
Undefined
H'FF20000C
H'1F20000C
32
Break address
mask
register B
BAMRB
R/W
Undefined
H'FF200010
H'1F200010
8
Break bus
cycle register B
BBRB
R/W
H'0000
H'FF200014
H'1F200014
16
Break ASID
register B
BASRB
R/W
Undefined
H'FF000018
H'1F000018
8
Break data
register B
BDRB
R/W
Undefined
H'FF200018
H'1F200018
32
Break data
mask register B
BDMRB
R/W
Undefined
H'FF20001C
H'1F20001C
32
Break control
register
BRCR
R/W
H'0000*
H'FF200020
H'1F200020
16
Note: * Some bits are not initialized. See section 20.2.12, Break Control Register (BRCR), for
details.
Rev. 6.0, 07/02, page 775 of 986
20.2
Register Descriptions
20.2.1
Access to UBC Control Registers
The access size must be the same as the control register size. If the sizes are different, a write will
not be effected in a UBC register write operation, and a read operation will return an undefined
value. UBC control register contents cannot be transferred to a floating-point register using a
floating-point memory load instruction.
When a UBC control register is updated, use either of the following methods to make the updated
value valid:
1. Execute an RTE instruction after the memory store instruction that updated the register. The
updated value will be valid from the RTE instruction jump destination onward.
2. Execute instructions requiring 5 states for execution after the memory store instruction that
updated the register. As the SH7750 Series executes two instructions in parallel and a
minimum of 0.5 state is required for execution of one instruction, 11 instructions must be
inserted. The updated value will be valid from the 6th state onward.
Rev. 6.0, 07/02, page 776 of 986
20.2.2
Break Address Register A (BARA)
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
31
30
29
28
27
26
25
24
BAA31
BAA30
BAA29
BAA28
BAA27
BAA26
BAA25
BAA24
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
23
22
21
20
19
18
17
16
BAA23
BAA22
BAA21
BAA20
BAA19
BAA18
BAA17
BAA16
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
15
14
13
12
11
10
9
8
BAA15
BAA14
BAA13
BAA12
BAA11
BAA10
BAA9
BAA8
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
BAA7
BAA6
BAA5
BAA4
BAA3
BAA2
BAA1
BAA0
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: *: Undefined
Break address register A (BARA) is a 32-bit readable/writable register that specifies the virtual
address used in the channel A break conditions. BARA is not initialized by a power-on reset or
manual reset.
Bits 31 to 0—Break Address A31 to A0 (BAA31–BAA0): These bits hold the virtual address
(bits 31–0) used in the channel A break conditions.
Rev. 6.0, 07/02, page 777 of 986
20.2.3
Break ASID Register A (BASRA)
Bit:
Initial value:
R/W:
7
6
5
4
3
2
1
0
BASA7
BASA6
BASA5
BASA4
BASA3
BASA2
BASA1
BASA0
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: *: Undefined
Break ASID register A (BASRA) is an 8-bit readable/writable register that specifies the ASID
used in the channel A break conditions. BASRA is not initialized by a power-on reset or manual
reset.
Bits 7 to 0—Break ASID A7 to A0 (BASA7–BASA0): These bits hold the ASID (bits 7–0) used
in the channel A break conditions.
20.2.4
Break Address Mask Register A (BAMRA)
Bit:
7
6
5
4
3
2
1
—
—
—
—
Initial value:
0
0
0
0
*
*
*
*
R/W:
R
R
R
R
R/W
R/W
R/W
R/W
BAMA2 BASMA BAMA1
0
BAMA0
Note: *: Undefined
Break address mask register A (BAMRA) is an 8-bit readable/writable register that specifies
which bits are to be masked in the break ASID set in BASRA and the break address set in BARA.
BAMRA is not initialized by a power-on reset or manual reset.
Bits 7 to 4—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 2—Break ASID Mask A (BASMA): Specifies whether all bits of the channel A break ASID7
to ASID0 (BASA7–BASA0) are to be masked.
Bit 2: BASMA
Description
0
All BASRA bits are included in break conditions
1
No BASRA bits are included in break conditions
Rev. 6.0, 07/02, page 778 of 986
Bits 3, 1, and 0—Break Address Mask A2 to A0 (BAMA2–BAMA0): These bits specify which
bits of the channel A break address 31 to 0 (BAA31–BAA0) set in BARA are to be masked.
Bit 3: BAMA2
Bit 1: BAMA1
Bit 0: BAMA0
Description
0
0
0
All BARA bits are included in break conditions
1
Lower 10 bits of BARA are masked, and not
included in break conditions
0
Lower 12 bits of BARA are masked, and not
included in break conditions
1
All BARA bits are masked, and not included in
break conditions
0
Lower 16 bits of BARA are masked, and not
included in break conditions
1
Lower 20 bits of BARA are masked, and not
included in break conditions
*
Reserved (cannot be set)
1
1
0
1
Note: *: Don’t care
20.2.5
Break Bus Cycle Register A (BBRA)
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
SZA2
IDA1
IDA0
RWA1
RWA0
SZA1
SZA0
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Break bus cycle register A (BBRA) is a 16-bit readable/writable register that sets three
conditions—(1) instruction access/operand access, (2) read/write, and (3) operand size—from
among the channel A break conditions.
BBRA is initialized to H'0000 by a power-on reset. It retains its value in standby mode.
Bits 15 to 7—Reserved: These bits are always read as 0, and should only be written with 0.
Rev. 6.0, 07/02, page 779 of 986
Bits 5 and 4—Instruction Access/Operand Access Select A (IDA1, IDA0): These bits specify
whether an instruction access cycle or an operand access cycle is used as the bus cycle in the
channel A break conditions.
Bit 5: IDA1
Bit 4: IDA0
Description
0
0
Condition comparison is not performed
1
Instruction access cycle is used as break condition
0
Operand access cycle is used as break condition
1
Instruction access cycle or operand access cycle is used as
break condition
1
(Initial value)
Bits 3 and 2—Read/Write Select A (RWA1, RWA0): These bits specify whether a read cycle or
write cycle is used as the bus cycle in the channel A break conditions.
Bit 3: RWA1
Bit 2: RWA0
Description
0
0
Condition comparison is not performed
1
Read cycle is used as break condition
1
0
Write cycle is used as break condition
1
Read cycle or write cycle is used as break condition
(Initial value)
Bits 6, 1, and 0—Operand Size Select A (SZA2–SZA0): These bits select the operand size of
the bus cycle used as a channel A break condition.
Bit 6: SZA2
Bit 1: SZA1
Bit 0: SZA0
Description
0
0
0
Operand size is not included in break conditions
(Initial value)
1
Byte access is used as break condition
0
Word access is used as break condition
1
Longword access is used as break condition
1
1
0
1
0
Quadword access is used as break condition
1
Reserved (cannot be set)
*
Reserved (cannot be set)
Note: *: Don’t care
Rev. 6.0, 07/02, page 780 of 986
20.2.6
Break Address Register B (BARB)
BARB is the channel B break address register. The bit configuration is the same as for BARA.
20.2.7
Break ASID Register B (BASRB)
BASRB is the channel B break ASID register. The bit configuration is the same as for BASRA.
20.2.8
Break Address Mask Register B (BAMRB)
BAMRB is the channel B break address mask register. The bit configuration is the same as for
BAMRA.
20.2.9
Break Data Register B (BDRB)
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
31
30
29
28
27
26
25
24
BDB31
BDB30
BDB29
BDB28
BDB27
BDB26
BDB25
BDB24
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
23
22
21
20
19
18
17
16
BDB23
BDB22
BDB21
BDB20
BDB19
BDB18
BDB17
BDB16
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
15
14
13
12
11
10
9
8
BDB15
BDB14
BDB13
BDB12
BDB11
BDB10
BDB9
BDB8
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
BDB7
BDB6
BDB5
BDB4
BDB3
BDB2
BDB1
BDB0
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: *: Undefined
Break data register B (BDRB) is a 32-bit readable/writable register that specifies the data (bits 31–
0) to be used in the channel B break conditions. BDRB is not initialized by a power-on reset or
manual reset.
Rev. 6.0, 07/02, page 781 of 986
Bits 31 to 0—Break Data B31 to B0 (BDB31–BDB0): These bits hold the data (bits 31–0) to be
used in the channel B break conditions.
20.2.10 Break Data Mask Register B (BDMRB)
Bit:
31
30
29
28
27
26
25
24
BDMB31 BDMB30 BDMB29 BDMB28 BDMB27 BDMB26 BDMB25 BDMB24
Initial value:
R/W:
Bit:
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
23
22
21
20
19
18
17
16
BDMB23 BDMB22 BDMB21 BDMB20 BDMB19 BDMB18 BDMB17 BDMB16
Initial value:
R/W:
Bit:
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
15
14
13
12
11
10
9
8
BDMB15 BDMB14 BDMB13 BDMB12 BDMB11 BDMB10 BDMB9 BDMB8
Initial value:
R/W:
Bit:
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
BDMB7 BDMB6 BDMB5 BDMB4 BDMB3 BDMB2 BDMB1 BDMB0
Initial value:
R/W:
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: *: Undefined
Break data mask register B (BDMRB) is a 32-bit readable/writable register that specifies which
bits of the break data set in BDRB are to be masked. BDMRB is not initialized by a power-on
reset or manual reset.
Rev. 6.0, 07/02, page 782 of 986
Bits 31 to 0—Break Data Mask B31 to B0 (BDMB31–BDMB0): These bits specify whether the
corresponding bit of the channel B break data B31 to B0 (BDB31–BDB0) set in BDRB is to be
masked.
Bit 31–0: BDMBn
Description
0
Channel B break data bit BDBn is included in break conditions
1
Channel B break data bit BDBn is masked, and not included in break
conditions
n = 31 to 0
Note: When the data bus value is included in the break conditions, the operand size should be
specified. When byte size is specified, set the same data in bits 15–8 and 7–0 of BDRB and
BDMRB.
20.2.11 Break Bus Cycle Register B (BBRB)
BBRB is the channel B bus break register. The bit configuration is the same as for BBRA.
20.2.12 Break Control Register (BRCR)
Bit:
Initial value:
R/W:
Bit:
Initial value:
R/W:
15
14
13
12
11
10
9
8
CMFA
CMFB
—
—
—
PCBA
—
—
0
0
0
0
0
*
0
0
R/W
R/W
R
R
R
R/W
R
R
7
6
5
4
3
2
1
0
DBEB
PCBB
—
—
SEQ
—
—
UBDE
*
*
0
0
*
0
0
0
R/W
R/W
R
R
R/W
R
R
R/W
Note: *: Undefined
The break control register (BRCR) is a 16-bit readable/writable register that specifies (1) whether
channels A and B are to be used as two independent channels or in a sequential condition, (2)
whether the break is to be effected before or after instruction execution, (3) whether the BDRB
register is to be included in the channel B break conditions, and (4) whether the user break debug
function is to be used. BRCR also contains condition match flags. The CMFA, CMFB, and UBDE
bits in BRCR are initialized to 0 by a power-on reset, but retain their value in standby mode. The
value of the PCBA, DBEB, PCBB, and SEQ bits is undefined after a power-on reset or manual
reset, so these bits should be initialized by software as necessary.
Rev. 6.0, 07/02, page 783 of 986
Bit 15—Condition Match Flag A (CMFA): Set to 1 when a break condition set for channel A is
satisfied. This flag is not cleared to 0 (to confirm that the flag is set again after once being set, it
should be cleared with a write.)
Bit 15: CMFA
Description
0
Channel A break condition is not matched
1
Channel A break condition match has occurred
(Initial value)
Bit 14—Condition Match Flag B (CMFB): Set to 1 when a break condition set for channel B is
satisfied. This flag is not cleared to 0 (to confirm that the flag is set again after once being set, it
should be cleared with a write.)
Bit 14: CMFB
Description
0
Channel B break condition is not matched
1
Channel B break condition match has occurred
(Initial value)
Bits 13 to 11—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 10—Instruction Access Break Select A (PCBA): Specifies whether a channel A instruction
access cycle break is to be effected before or after the instruction is executed. This bit is not
initialized by a power-on reset or manual reset.
Bit 10: PCBA
Description
0
Channel A PC break is effected before instruction execution
1
Channel A PC break is effected after instruction execution
Bits 9 and 8—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 7—Data Break Enable B (DBEB): Specifies whether the data bus condition is to be included
in the channel B break conditions. This bit is not initialized by a power-on reset or manual reset.
Bit 7: DBEB
Description
0
Data bus condition is not included in channel B conditions
1
Data bus condition is included in channel B conditions
Note: When the data bus is included in the break conditions, bits IDB1–0 in break bus cycle
register B (BBRB) should be set to 10 or 11.
Rev. 6.0, 07/02, page 784 of 986
Bit 6—PC Break Select B (PCBB): Specifies whether a channel B instruction access cycle break
is to be effected before or after the instruction is executed. This bit is not initialized by a power-on
reset or manual reset.
Bit 6: PCBB
Description
0
Channel B PC break is effected before instruction execution
1
Channel B PC break is effected after instruction execution
Bits 5 and 4—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 3—Sequence Condition Select (SEQ): Specifies whether the conditions for channels A and B
are to be independent or sequential. This bit is not initialized by a power-on reset or manual reset.
Bit 3: SEQ
Description
0
Channel A and B comparisons are performed as independent conditions
1
Channel A and B comparisons are performed as sequential conditions
(channel A → channel B)
Bits 2 and 1—Reserved: These bits are always read as 0, and should only be written with 0.
Bit 0—User Break Debug Enable (UBDE): Specifies whether the user break debug function (see
section 20.4, User Break Debug Support Function) is to be used.
Bit 0: UBDE
Description
0
User break debug function is not used
1
User break debug function is used
20.3
Operation
20.3.1
Explanation of Terms Relating to Accesses
(Initial value)
An instruction access is an access that obtains an instruction. An operand access is any memory
access for the purpose of instruction execution. For example, the access to address PC+disp×2+4
in the instruction MOV.W @(disp,PC), Rn (an access very close to the program counter) is an
operand access. The fetching of an instruction from the branch destination when a branch
instruction is executed is also an instruction access. As the term “data” is used to distinguish data
from an address, the term “operand access” is used in this section.
Rev. 6.0, 07/02, page 785 of 986
In the SH7750 Series, all operand accesses are treated as either read accesses or write accesses.
The following instructions require special attention:
• PREF, OCBP, and OCBWB instructions: Treated as read accesses.
• MOVCA.L and OCBI instructions: Treated as write accesses.
• TAS.B instruction: Treated as one read access and one write access.
The operand accesses for the PREF, OCBP, OCBWB, and OCBI instructions are accesses with no
access data.
The SH7750 Series handles all operand accesses as having a data size. The data size can be byte,
word, longword, or quadword. The operand data size for the PREF, OCBP, OCBWB, MOVCA.L,
and OCBI instructions is treated as longword.
20.3.2
Explanation of Terms Relating to Instruction Intervals
In this section, “1 (2, 3, ...) instruction(s) after...”, as a measure of the distance between two
instructions, is defined as follows. A branch is counted as an interval of two instructions.
• Example of sequence of instructions with no branch:
100 Instruction A (0 instructions after instruction A)
102
Instruction B (1 instruction after instruction A)
104
Instruction C (2 instructions after instruction A)
106
Instruction D (3 instructions after instruction A)
• Example of sequence of instructions with a branch (however, the example of a sequence of
instructions with no branch should be applied when the branch destination of a delayed branch
instruction is the instruction itself + 4):
100 Instruction A: BT/S L200 (0 instructions after instruction A)
102 Instruction B (1 instruction after instruction A, 0 instructions after instruction B)
L200 200 Instruction C (3 instructions after instruction A, 2 instructions after instruction B)
202 Instruction D (4 instructions after instruction A, 3 instructions after instruction
B)
Rev. 6.0, 07/02, page 786 of 986
20.3.3
User Break Operation Sequence
The sequence of operations from setting of break conditions to user break exception handling is
described below.
1. Specify pre- or post-execution breaking in the case of an instruction access, inclusion or
exclusion of the data bus value in the break conditions in the case of an operand access, and
use of independent or sequential channel A and B break conditions, in the break control
register (BRCR). Set the break addresses in the break address registers for each channel
(BARA, BARB), the ASIDs corresponding to the break space in the break ASID registers
(BASRA, BASRB), and the address and ASID masking methods in the break address mask
registers (BAMRA, BAMRB). If the data bus value is to be included in the break conditions,
also set the break data in the break data register (BDRB) and the data mask in the break data
mask register (BDMRB).
2. Set the break bus conditions in the break bus cycle registers (BBRA, BBRB). If even one of
the BBRA/BBRB instruction access/operand access select (ID bit) and read/write select groups
(RW bit) is set to 00, a user break interrupt will not be generated on the corresponding channel.
Make the BBRA and BBRB settings after all other break-related register settings have been
completed. If breaks are enabled with BBRA/BBRB while the break address, data, or mask
register, or the break control register is in the initial state after a reset, a break may be
generated inadvertently.
3. The operation when a break condition is satisfied depends on the BL bit (in the CPU’s SR
register). When the BL bit is 0, exception handling is started and the condition match flag
(CMFA/CMFB) for the respective channel is set for the matched condition. When the BL bit is
1, the condition match flag (CMFA/CMFB) for the respective channel is set for the matched
condition but exception handling is not started.
The condition match flags (CMFA, CMFB) are set by a branch condition match, but are not
automatically cleared. Therefore, a memory store instruction should be used on the BRCR
register to clear the flags to 0. See section 20.3.6, Condition Match Flag Setting, for the exact
setting conditions for the condition match flags.
4. When sequential condition mode has been selected, and the channel B condition is matched
after the channel A condition has been matched, a break is effected at the instruction at which
the channel B condition was matched. See section 20.3.8, Contiguous A and B Settings for
Sequential Conditions, for the operation when the channel A condition match and channel B
condition match occur close together. With sequential conditions, only the channel B condition
match flag is set. When sequential condition mode has been selected, if it is wished to clear the
channel A match when the channel A condition has been matched but the channel B condition
has not yet been matched, this can be done by writing 0 to the SEQ bit in the BRCR register.
Rev. 6.0, 07/02, page 787 of 986
20.3.4
Instruction Access Cycle Break
1. When an instruction access/read/word setting is made in the break bus cycle register
(BBRA/BBRB), an instruction access cycle can be used as a break condition. In this case,
breaking before or after execution of the relevant instruction can be selected with the
PCBA/PCBB bit in the break control register (BRCR). When an instruction access cycle is
used as a break condition, clear the LSB of the break address registers (BARA, BARB) to 0. A
break will not be generated if this bit is set to 1.
2. When a pre-execution break is specified, the break is effected when it is confirmed that the
instruction is to be fetched and executed. Therefore, an overrun-fetched instruction (an
instruction that is fetched but not executed when a branch or exception occurs) cannot be used
in a break. However, if a TLB miss or TLB protection violation exception occurs at the time of
the fetch of an instruction subject to a break, the break exception handling is carried out first.
The instruction TLB exception handling is performed when the instruction is re-executed (see
section 5.4, Exception Types and Priorities). Also, since a delayed branch instruction and the
delay slot instruction are executed as a single instruction, if a pre-execution break is specified
for a delay slot instruction, the break will be effected before execution of the delayed branch
instruction. However, a pre-execution break cannot be specified for the delay slot instruction
for an RTE instruction.
3. With a pre-execution break, the instruction set as a break condition is executed, then a break
interrupt is generated before the next instruction is executed. When a post-execution break is
set for a delayed branch instruction, the delay slot is executed and the break is effected before
execution of the instruction at the branch destination (when the branch is made) or the
instruction two instructions ahead of the branch instruction (when the branch is not made).
4. When an instruction access cycle is set for channel B, break data register B (BDRB) is ignored
in judging whether there is an instruction access match. Therefore, a break condition specified
by the DBEB bit in BRCR is not executed.
Rev. 6.0, 07/02, page 788 of 986
20.3.5
Operand Access Cycle Break
1. In the case of an operand access cycle break, the bits included in address bus comparison vary
as shown below according to the data size specification in the break bus cycle register
(BBRA/BBRB).
Data Size
Address Bits Compared
Quadword (100)
Address bits A31–A3
Longword (011)
Address bits A31–A2
Word (010)
Address bits A31–A1
Byte (001)
Address bits A31–A0
Not included in condition (000)
In quadword access, address bits A31–A3
In longword access, address bits A31–A2
In word access, address bits A31–A1
In byte access, address bits A31–A0
2. When data value is included in break conditions in channel B
When a data value is included in the break conditions, set the DBEB bit in the break control
register (BRCR) to 1. In this case, break data register B (BDRB) and break data mask register
B (BDMRB) settings are necessary in addition to the address condition. A user break interrupt
is generated when all three conditions—address, ASID, and data—are matched. When a
quadword access occurs, the 64-bit access data is divided into an upper 32 bits and lower 32
bits, and interpreted as two 32-bit data units. A break is generated if either of the 32-bit data
units satisfies the data match condition.
Set the IDB1–0 bits in break bus cycle register B (BBRB) to 10 or 11. When byte data is
specified, the same data should be set in the two bytes comprising bits 15–8 and bits 7–0 in
break data register B (BDRB) and break data mask register B (BDMRB). When word or byte
is set, bits 31–16 of BDRB and BDMRB are ignored.
3. When the DBEB bit in the break control register (BRCR) is set to 1, a break is not generated
by an operand access with no access data (an operand access in a PREF, OCBP, OCBWB, or
OCBI instruction).
Rev. 6.0, 07/02, page 789 of 986
20.3.6
Condition Match Flag Setting
1. Instruction access with post-execution condition, or operand access
The flag is set when execution of the instruction that causes the break is completed. As an
exception to this, however, in the case of an instruction with more than one operand access the
flag may be set on detection of the match condition alone, without waiting for execution of the
instruction to be completed.
Example 1:
100 BT L200 (branch performed)
102 Instruction (operand access break on channel A) → flag not set
Example 2:
110 FADD (FPU exception)
112 Instruction (operand access break on channel A) → flag not set
2. Instruction access with pre-execution condition
The flag is set when the break match condition is detected.
Example 1:
110 Instruction (pre-execution break on channel A) → flag set
112 Instruction (pre-execution break on channel B) → flag not set
Example 2:
110 Instruction (pre-execution break on channel B, instruction access TLB miss) → flag set
20.3.7
Program Counter (PC) Value Saved
1. When instruction access (pre-execution) is set as a break condition, the program counter (PC)
value saved to SPC in user break interrupt handling is the address of the instruction at which
the break condition match occurred. In this case, a user break interrupt is generated and the
fetched instruction is not executed.
2. When instruction access (post-execution) is set as a break condition, the program counter (PC)
value saved to SPC in user break interrupt handling is the address of the instruction to be
executed after the instruction at which the break condition match occurred. In this case, the
fetched instruction is executed, and a user break interrupt is generated before execution of the
next instruction.
3. When an instruction access (post-execution) break condition is set for a delayed branch
instruction, the delay slot instruction is executed and a user break is effected before execution
of the instruction at the branch destination (when the branch is made) or the instruction two
instructions ahead of the branch instruction (when the branch is not made). In this case, the PC
value saved to SPC is the address of the branch destination (when the branch is made) or the
instruction following the delay slot instruction (when the branch is not made).
Rev. 6.0, 07/02, page 790 of 986
4. When operand access (address only) is set as a break condition, the address of the instruction
to be executed after the instruction at which the condition match occurred is saved to SPC.
The instruction at which the condition match occurred is executed, and a user break interrupt
occurs before the following instruction is executed.
5. When operand access (address + data) is set as a break condition, execution of the instruction
at which the condition match occurred is completed. A user break interrupt is generated before
execution of instructions from one instruction later to four instructions later. It is not possible
to specify at which instruction, from one later to four later, the interrupt will be generated. The
start address of the instruction after the instruction for which execution is completed at the
point at which user break interrupt handling is started is saved to SPC. If an instruction
between one instruction later and four instructions later causes another exception, control is
performed as follows. Designating the exception caused by the break as exception 1, and the
exception caused by an instruction between one instruction later and four instructions later as
exception 2, the fact that memory updating and register updating that essentially cannot be
performed by exception 2 cannot be performed is guaranteed irrespective of the existence of
exception 1. The program counter value saved is the address of the first instruction for which
execution is suppressed. Whether exception 1 or exception 2 is used for the exception jump
destination and the value written to the exception register (EXPEVT/INTEVT) is not
guaranteed. However, if exception 2 is from a source not synchronized with an instruction
(external interrupt or peripheral module interrupt), exception 1 is used for the exception jump
destination and the value written to the exception register (EXPEVT/INTEVT).
20.3.8
Contiguous A and B Settings for Sequential Conditions
When channel A match and channel B match timings are close together, a sequential break may
not be guaranteed. Rules relating to the guaranteed range are given below.
1. Instruction access matches on both channel A and channel B
Instruction B is 0 instructions after
instruction A
Equivalent to setting the same address. Do not use
this setting.
Instruction B is 1 instruction after
instruction A
Sequential operation is not guaranteed.
Instruction B is 2 or more instructions
after instruction A
Sequential operation is guaranteed.
2. Instruction access match on channel A, operand access match on channel B
Instruction B is 0 or 1 instruction after
instruction A
Sequential operation is not guaranteed.
Instruction B is 2 or more instructions
after instruction A
Sequential operation is guaranteed.
Rev. 6.0, 07/02, page 791 of 986
3. Operand access match on channel A, instruction access match on channel B
Instruction B is 0 to 3 instructions after
instruction A
Sequential operation is not guaranteed.
Instruction B is 4 or more instructions
after instruction A
Sequential operation is guaranteed.
4. Operand access matches on both channel A and channel B
Do not make a setting such that a single operand access will match the break conditions of
both channel A and channel B. There are no other restrictions. For example, sequential
operation is guaranteed even if two accesses within a single instruction match channel A and
channel B conditions in turn.
20.3.9
Usage Notes
1. Do not execute a post-execution instruction access break for the SLEEP instruction.
2. Do not make an operand access break setting between 1 and 3 instructions before a SLEEP
instruction.
3. The value of the BL bit referenced in a user break exception depends on the break setting, as
follows.
a. Pre-execution instruction access break: The BL bit value before the executed instruction is
referenced.
b. Post-execution instruction access break: The OR of the BL bit values before and after the
executed instruction is referenced.
c. Operand access break (address/data): The BL bit value after the executed instruction is
referenced.
d. In the case of an instruction that modifies the BL bit
SL.BL
PreExecution
Instruction
Access
PostExecution
Instruction
Access
PreExecution
Instruction
Access
PostExecution
Instruction
Access
Operand Access
(Address/Data)
0→0
A
A
A
A
A
1→0
M
M
M
M
A
0→1
A
M
A
M
M
1→1
M
M
M
M
M
A: Accepted
M: Masked
Rev. 6.0, 07/02, page 792 of 986
e. In the case of an RTE delay slot
The BL bit value before execution of a delay slot instruction is the same as the BL bit value
before execution of an RTE instruction. The BL bit value after execution of a delay slot
instruction is the same as the first BL bit value for the first instruction executed on
returning by means of an RTE instruction (the same as the value of the BL bit in SSR
before execution of the RTE instruction).
f. If an interrupt or exception is accepted with the BL bit cleared to 0, the value of the BL bit
before execution of the first instruction of the exception handling routine is 1.
4. If channels A and B both match independently at virtually the same time, and, as a result, the
SPC value is the same for both user break interrupts, only one user break interrupt is generated,
but both the CMFA bit and the CMFB bit are set. For example:
110 Instruction (post-execution instruction break on channel A) → SPC = 112, CMFA = 1
112 Instruction (pre-execution instruction break on channel B) → SPC = 112, CMFB = 1
5. The PCBA or PCBB bit in BRCR is invalid for an instruction access break setting.
6. When the SEQ bit in BRCR is 1, the internal sequential break state is initialized by a channel
B condition match. For example: A → A → B (user break generated) → B (no break
generated)
7. In the event of contention between a re-execution type exception and a post-execution break in
a multistep instruction, the re-execution type exception is generated. In this case, the CMF bit
may or may not be set to 1 when the break condition occurs.
8. A post-execution break is classified as a completion type exception. Consequently, in the event
of contention between a completion type exception and a post-execution break, the postexecution break is suppressed in accordance with the priorities of the two events. For example,
in the case of contention between a TRAPA instruction and a post-execution break, the user
break is suppressed. However, in this case, the CMF bit is set by the occurrence of the break
condition.
20.4
User Break Debug Support Function
The user break debug support function enables the processing used in the event of a user break
exception to be changed. When a user break exception occurs, if the UBDE bit is set to 1 in the
BRCR register, the DBR register value will be used as the branch destination address instead of
[VBR + offset]. The value of R15 is saved in the SGR register regardless of the value of the
UBDE bit in the BRCR register or the kind of exception event. A flowchart of the user break
debug support function is shown in figure 20.2.
Rev. 6.0, 07/02, page 793 of 986
Exception/interrupt
generation
Hardware operation
SPC ← PC
SSR ← SR
SR.BL ← B'1
SR.MD ← B'1
SR.RB ← B'1
Exception
Exception/
interrupt/trap?
Trap
Interrupt
EXPEVT ← exception code
INTEVT ← interrupt code
EXPEVT ← H'160
TRA ← TRAPA (imm)
SGR ← R15
No
Yes
Reset exception?
(BRCR.UBDE == 1) &&
(user break exception)?
Yes
No
PC ← DBR
PC ← VBR + vector offset
Debug program
Exception service routine
PC ← H'A0000000
R15 ← SGR
(STC instruction)
Execute RTE instruction
PC ← SPC
SR ← SSR
End of exception
operations
Figure 20.2 User Break Debug Support Function Flowchart
Rev. 6.0, 07/02, page 794 of 986
20.5
Examples of Use
Instruction Access Cycle Break Condition Settings
• Register settings: BASRA = H'80 / BARA = H'00000404 / BAMRA = H'00 /
BBRA = H'0014 / BASRB = H'70 / BARB = H'00008010 / BAMRB = H'01 /
BBRB = H'0014 / BDRB = H'00000000 / BDMRB = H'00000000 / BRCR = H'0400
Conditions set: Independent channel A/channel B mode
Channel A: ASID: H'80 / address: H'00000404 / address mask: H'00
Bus cycle: instruction access (post-instruction-execution), read (operand size not included
in conditions)
Channel B: ASID: H'70 / address: H'00008010 / address mask: H'01
Data: H'00000000 / data mask: H'00000000
Bus cycle: instruction access (pre-instruction-execution), read (operand size not included in
conditions)
A user break is generated after execution of the instruction at address H'00000404 with
ASID = H'80, or before execution of an instruction at addresses H'00008000–H'000083FE
with ASID = H'70.
• Register settings: BASRA = H'80 / BARA = H'00037226 / BAMRA = H'00 /
BBRA = H'0016 / BASRB = H'70 / BARB = H'0003722E / BAMRB = H'00 /
BBRB = H'0016 / BDRB = H'00000000 / BDMRB = H'00000000 / BRCR = H'0008
Conditions set: Channel A → channel B sequential mode
Channel A: ASID: H'80 / address: H'00037226 / address mask: H'00
Bus cycle: instruction access (pre-instruction-execution), read, word
Channel B: ASID: H'70 / address: H'0003722E / address mask: H'00
Data: H'00000000 / data mask: H'00000000
Bus cycle: instruction access (pre-instruction-execution), read, word
The instruction at address H'00037266 with ASID = H'80 is executed, then a user break is
generated before execution of the instruction at address H'0003722E with ASID = H'70.
• Register settings: BASRA = H'80 / BARA = H'00027128 / BAMRA = H'00 /
BBRA = H'001A / BASRB = H'70 / BARB = H'00031415 / BAMRB = H'00 /
BBRB = H'0014 / BDRB = H'00000000 / BDMRB = H'00000000 / BRCR = H'0000
Conditions set: Independent channel A/channel B mode
Channel A: ASID: H'80 / address: H'00027128 / address mask: H'00
Bus cycle: CPU, instruction access (pre-instruction-execution), write, word
Rev. 6.0, 07/02, page 795 of 986
Channel B: ASID: H'70 / address: H'00031415 / address mask: H'00
Data: H'00000000 / data mask: H'00000000
Bus cycle: CPU, instruction access (pre-instruction-execution), read (operand size not
included in conditions)
A user break interrupt is not generated on channel A since the instruction access is not a write
cycle.
A user break interrupt is not generated on channel B since instruction access is performed on
an even address.
Operand Access Cycle Break Condition Settings
• Register settings: BASRA = H'80 / BARA = H'00123456 / BAMRA = H'00 /
BBRA = H'0024 / BASRB = H'70/ BARB = H'000ABCDE / BAMRB = H'02 /
BBRB = H'002A / BDRB = H'0000A512 / BDMRB = H'00000000 / BRCR = H'0080
Conditions set: Independent channel A/channel B mode
Channel A: ASID: H'80 / address: H'00123456 / address mask: H'00
Bus cycle: operand access, read (operand size not included in conditions)
Channel B: ASID: H'70 / address: H'000ABCDE / address mask: H'02
Data: H'0000A512 / data mask: H'00000000
Bus cycle: operand access, write, word
Data break enabled
On channel A, a user break interrupt is generated in the event of a longword read at address
H'00123454, a word read at address H'00123456, or a byte read at address H'00123456, with
ASID = H'80.
On channel B, a user break interrupt is generated when H'A512 is written by word access to
any address from H'000AB000 to H'000ABFFE with ASID = H'70.
Rev. 6.0, 07/02, page 796 of 986
20.6
User Break Controller Stop Function
In the SH7750S, this function stops the clock supplied to the user break controller and is used to
minimize power dissipation when the chip is operating. Note that, if you use this function, you
cannot use the user break controller. This function is not provided in the SH7750.
20.6.1
Transition to User Break Controller Stopped State
Setting the MSTP5 bit of the STBCR2 (inside the CPG) to 1 stops the clock supply and causes the
user break controller to enter the stopped state. Follow steps (1) to (5) below to set the MSTP5 bit
to 1 and enter the stopped state.
(1) Initialize BBRA and BBRB to 0;
(2) Initialize BRCR to 0;
(3) Make a dummy read of BRCR;
(4) Read STBCR2, then set the MSTP5 bit in the read data to 1 and write back.
(5) Make two dummy reads of STBCR2.
Make sure that, if an exception or interrupt occurs while performing steps (1) to (5), you do not
change the values of these registers in the exception handling routine.
Do not read or write the following registers while the user break controller clock is stopped:
BARA, BAMRA, BBRA, BARB, BAMRB, BBRB, BDRB, BDMRB, and BRCR. If these
registers are read or written, the value cannot be guaranteed.
20.6.2
Cancelling the User Break Controller Stopped State
The clock supply can be restarted by setting the MSTP5 bit of STBCR2 (inside the CPG) to 0. The
user break controller can then be operated again. Follow steps (6) and (7) below to clear the
MSTP5 bit to 0 to cancel the stopped state.
(6) Read STBCR2, then clear the MSTP5 bit in the read data to 0 and write the modified data
back;
(7) Make two dummy reads of STBGR2.
As with the transition to the stopped state, if an exception or interrupt occurs while processing
steps (6) and (7), make sure that the values in these registers are not changed in the exception
handling routine.
Rev. 6.0, 07/02, page 797 of 986
20.6.3
Examples of Stopping and Restarting the User Break Controller
The following are example programs:
; Transition to user break controller stopped state
; (1) Initialize BBRA and BBRB to 0.
mov
#0, R0
mov.l
#BBRA, R1
mov.w
R0, @R1
mov.l
#BBRB, R1
mov.w
R0, @R1
; (2) Initialize BRCR to 0.
mov.l
#BRCR, R1
mov.w
R0, @R1
; (3) Dummy read BRCR.
mov.w
@R1, R0
; (4) Read STBCR2, then set MSTP5 bit in the read data to 1 and write
it back
mov.l
#STBCR2, R1
mov.b
@R1, R0
or #H’1, R0
mov.b
R0, @R1
; (5) Twice dummy read STBCR2.
mov.b
@R1, R0
mov.b
@R1, R0
; Canceling user break controller stopped state
; (6) Read STBCR2, then clear MSTP5 bit in the read data to 0 and write
it back
mov.l
#STBCR2, R1
mov.b
@R1, R0
and
#H’FE, R0
mov.b
R0, @R1
; (7) Twice dummy read STBCR2.
mov.b
@R1, R0
mov.b
@R1, R0
Rev. 6.0, 07/02, page 798 of 986
Section 21 Hitachi User Debug Interface (H-UDI)
21.1
Overview
21.1.1
Features
The Hitachi user debug interface (H-UDI) is a serial input/output interface conforming to JTAG,
IEEE 1149.1, and IEEE Standard Test Access Port and Boundary-Scan Architecture. The
SH7750R’s H-UDI supports boundary-scan, but is used for emulator connection as well. The
functions of this interface should not be used when using an emulator. Refer to the emulator
manual for the method of connecting the emulator. The H-UDI uses six pins (TCK, TMS, TDI,
TDO, 7567, and $6(%5./BRKACK). The pin functions and serial transfer protocol conform to
the JTAG specifications.
21.1.2
Block Diagram
Figure 21.1 shows a block diagram of the H-UDI. The TAP (test access port) controller and
control registers are reset independently of the chip reset pin by driving the 7567 pin low or
setting TMS to 1 and applying TCK for at least five clock cycles. The other circuits are reset and
initialized in an ordinary reset. The H-UDI circuit has four internal registers: SDBPR, SDIR,
SDDRH, and SDDRL (these last two together designated SDDR). The SDBPR register supports
the JTAG bypass mode, SDIR is the command register, and SDDR is the data register. SDIR can
be accessed directly from the TDI and TDO pins.
Rev. 6.0, 07/02, page 799 of 986
Break
control
/BRKACK
Interrupt/reset
etc.
TCK
Decoder
TDI
SDBSR
SDBPR
Shift register
SDIR
*
*
SDINT
SDDRH
SDDRL
TDO
MUX
Note: * Provided only in the SH7750R.
Figure 21.1 Block Diagram of H-UDI Circuit
Rev. 6.0, 07/02, page 800 of 986
Peripheral module bus
TAP
controller
TMS
21.1.3
Pin Configuration
Table 21.1 shows the H-UDI pin configuration.
Table 21.1 H-UDI Pins
Pin Name
Abbreviation
I/O
Function
When Not Used
Clock pin
TCK
Input
Same as the JTAG serial clock input Open*
pin. Data is transferred from data
input pin TDI to the H-UDI circuit, and
data is read from data output pin
TDO, in synchronization with this
signal.
1
Mode pin
TMS
Input
The mode select input pin. Changing Open*
this signal in synchronization with
TCK determines the meaning of the
data input from TDI. The protocol
conforms to the JTAG (IEEE Std
1149.1) specification.
1
Reset pin
7567
Input
2
3
The input pin that resets the H-UDI. * *
This signal is received
asynchronously with respect to TCK,
and effects a reset of the JTAG
interface circuit when low. 7567 must
be driven low for a certain period
when powering on, regardless of
whether or not JTAG is used. This
differs from the IEEE specification.
Data input
pin
TDI
Input
The data input pin. Data is sent to the Open*
H-UDI circuit by changing this signal
in synchronization with TCK.
Data output
pin
TDO
Output
The data output pin. Data is sent to
the H-UDI circuit by reading this
signal in synchronization with TCK.
Open
Emulator pin
$6(%5./
BRKACK
Input/
output
Dedicated emulator pin
1
Open*
1
Notes: *1 Pulled up inside the chip. When designing a board that allows use of an emulator, or
when using interrupts and resets via the H-UDI, there is no problem in connecting a
pullup resistance externally.
*2 When designing a board that enables the use of an emulator, or when using interrupts
and resets via the H-UDI, drive 7567 low for a period overlapping 5(6(7 at power-on,
and also provide for control by 7567 alone.
*3 Fixed to the ground or connected to the same signal line as 5(6(7/#or to a signal line
that behaves in the same way. However, there is a problem when this pin is fixed to the
ground. 7567 is pulled up in the chip so, when this pin is fixed to the ground via
external connection, a minute current will flow. The size of this current is determined by
Rev. 6.0, 07/02, page 801 of 986
the rating of the pull-up resistor on port-pin f. Although this current has no effect on the
chip’s operation, unnecessary current will be dissipated.
The maximum frequency of TCK (TMS, TDI, TDO) is 20 MHz. Make the TCK or SH7750 Series
CPG setting so that the TCK frequency is lower than that of the SH7750 Series’ on-chip
peripheral module clock.
21.1.4
Register Configuration
Table 21.2 shows the H-UDI registers. Except for SDBPR, these registers are mapped in the
control register space and can be referenced by the CPU.
Table 21.2 H-UDI Registers
CPU Side
Abbreviation
P4
R/W Address
Access Initial
1
Size
Value*
R/W
Access Initial
1
Size
Value*
Instruction
register
SDIR
R
16
H'FFFF
R/W
32
H'FFFFFFFD
(Fixed
2
value* )
Data register
H
SDDR/ R/W H'FFF00008 H'1FF00008
SDDRH
32/16
Undefined
—
—
—
Data register
L
SDDRL R/W H'FFF0000A H'1FF0000A 16
Undefined
—
—
—
Bypass
register
SDBPR —
—
Undefined
R/W
1
—
Interrupt
source
4
register*
SDINT
16
H'0000
W*
32
H'00000000
—
Undefined
R/W
—
Undefined
Name
Area 7
Address
H-UDI Side
H'FFF00000 H'1FF00000
—
—
R/W H'FFF00014 H'1FF00014
Boundary
SDBSR —
4
scan register*
—
—
3
Notes: *1 Initialized when the 7567 pin goes low or when the TAP is in the Test-Logic-Reset
state.
*2 The value read from H-UDI is fixed (H'FFFFFFFD).
*3 Using the H-UDI interrupt command, a 1 can be written to the least significant bit.
*4 SH7750R only
Rev. 6.0, 07/02, page 802 of 986
21.2
Register Descriptions
21.2.1
Instruction Register (SDIR)
The instruction register (SDIR) is a 16-bit register that can only be read by the CPU. In the initial
state, bypass mode is set. The value (command) is set from the serial input pin (TDI). SDIR is
initialized by the 7567 pin or in the TAP Test-Logic-Reset state. When this register is written to
from the H-UDI, writing is possible regardless of the CPU mode. However, if a read is performed
by the CPU while writing is in progress, it may not be possible to read the correct value. In this
case, SDIR should be read twice, and then read again if the read values do not match. Operation is
undefined if a reserved command is set in this register.
SH7750, SH7750S:
Bit:
15
14
13
12
11
10
9
8
TI3
TI2
TI1
TI0
—
—
—
—
Initial value:
1
1
1
1
1
1
1
1
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
Initial value:
1
1
1
1
1
1
1
1
R/W:
R
R
R
R
R
R
R
R
Bits 15 to 12—Test Instruction Bits (TI3–TI0)
Bit 15: TI3
Bit 14: TI2
Bit 13: TI1
Bit 12: TI0
Description
0
0
—
—
Reserved
1
0
—
Reserved
1
0
H-UDI reset negate
1
H-UDI reset assert
0
—
Reserved
1
—
H-UDI interrupt
0
—
Reserved
1
0
Reserved
1
Bypass mode
1
0
1
(Initial value)
Bits 11 to 0—Reserved: These bits are always read as 1, and should only be written with 1.
Rev. 6.0, 07/02, page 803 of 986
SH7750R:
Bit:
15
14
13
12
11
10
9
8
TI7
TI6
TI5
TI4
TI3
TI2
TI1
TI0
Initial value:
1
1
1
1
1
1
1
1
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
—
Initial value:
1
1
1
1
1
1
1
1
R/W:
R
R
R
R
R
R
R
R
Bits 15 to 8—Test Instruction Bits (TI7–TI0)
Bit 15: Bit 14: Bit 13: Bit 12: Bit 11: Bit 10: Bit 9:
TI7
TI6
TI5
TI4
TI3
TI2
TI1
Bit 8:
TI0
Description
0
0
0
0
0
0
0
0
EXTEST
0
0
0
0
0
1
0
0
SAMPLE/PRELOAD
0
1
1
0
—
—
—
—
H-UDI reset negate
0
1
1
1
—
—
—
—
H-UDI reset assert
1
0
1
—
—
—
—
—
H-UDI interrupt
1
1
1
1
1
1
1
1
Bypass mode (Initial value)
Other than above
Reserved
Bits 7 to 0—Reserved: These bits are always read as 1, and should only be written with 1.
Rev. 6.0, 07/02, page 804 of 986
21.2.2
Data Register (SDDR)
The data register (SDDR) is a 32-bit register, comprising the two 16-bit registers SDDRH and
SDDRL, that can be read and written to by the CPU. The value in this register is not initialized by
a 7567 or CPU reset.
Bit:
Initial value:
R/W:
Bit:
Initial value:
31
30
29
28
27
26
25
24
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
23
22
21
20
19
18
17
16
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
15
14
13
12
11
10
9
8
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit:
7
6
5
4
3
2
1
0
Initial value:
*
*
*
*
*
*
*
*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W:
Bit:
Initial value:
R/W:
R/W:
Note: *: Undefined
Bits 31 to 0—DR Data: These bits store the SDDR value.
21.2.3
Bypass Register (SDBPR)
The bypass register (SDBPR) is a one-bit register that cannot be accessed by the CPU. When
bypass mode is set in SDIR, SDBPR is connected between the TDI pin and TDO pin of the
H-UDI.
Rev. 6.0, 07/02, page 805 of 986
21.2.4
Interrupt Source Register (SDINT) (SH7750R Only)
The interrupt source register (SDINT) is a 16-bit register that can be read from and written to by
the CPU.
From the H-UDI pins, the INTREQ bit is set to 1 when a H-UDI interrupt command is set in the
SDIR register (Update-IR). While SDIR is holding a H-UDI interrupt command, the SDINT
register is connected between the TDI and TDO pins of the H-UDI, allowing it to be read as a 32bit register. In this case, the upper 16 bits will all be 0, and the lower 16 bits will represent SDINT.
From the CPU, only writing a 0 to the INTREQ bit is possible. While this bit holds a 1, the
interrupt requests continue to be issued, so this bit should always be cleared in the interrupt
handler.
This register is initialized in the Test-Logic-Reset state of 7567 or TAP.
Bit:
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R
Bit:
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
INTREQ
Initial value:
0
0
0
0
0
0
0
0
R/W:
R
R
R
R
R
R
R
R/W
Bits 15 to 1—Reserved: These bits are always read as 0. When writing, only 0s should be written
here.
Bit 0
Interrupt Request (INTREQ): Indicates whether or not an interrupt request has been
issued by an H-UDI interrupt command. From the CPU, the interrupt request can be cleared by
writing a 0 to this bit. If a 1 is written to this bit, it retains the value it had before the write
operation.
21.2.5
Boundary Scan Register (SDBSR) (SH7750R Only)
The boundary scan register (SDBSR) is a shift register that is placed on the pads to control the
chip’s I/O pins. This register can perform a boundary scan test that conforms to the JTAG standard
(IEEE Std 1149.1) using EXTEST, SAMPLE, and PRELOAD commands. Table 21.3 shows the
relationship between the SH7750R’s pins and the boundary scan register.
Rev. 6.0, 07/02, page 806 of 986
Table 21.3 Configuration of the Boundary Scan Register (1)
No.
Pin Name
Type
No.
Pin Name
Type
No.
Pin Name
Type
309
A19
OUT
272
D48
OUT
IN
308
A18
CTL
271
D62
IN
CTL
from TDI
345
&.,25(1%
344
MD6/,2,649
IN
307
A18
OUT
270
D62
343
STATUS1
CTL
306
SCK2/05(6(7
IN
269
D62
OUT
342
STATUS1
OUT
305
SCK2/05(6(7
CTL
268
D49
IN
341
STATUS0
CTL
304
SCK2/05(6(7
OUT
267
D49
CTL
340
STATUS0
OUT
303
MD7/TXD
IN
266
D49
OUT
339
A1
CTL
302
MD7/TXD
CTL
265
D61
IN
338
A1
OUT
301
MD7/TXD
OUT
264
D61
CTL
337
A0
CTL
300
MD8/RTS2
IN
263
D61
OUT
336
A0
OUT
299
MD8/RTS2
CTL
262
D50
IN
335
DACK1
CTL
298
MD8/RTS2
OUT
261
D50
CTL
334
DACK1
OUT
297
TCLK
IN
260
D50
OUT
333
DACK0
CTL
296
TCLK
CTL
259
D60
IN
332
DACK0
OUT
295
TCLK
OUT
258
D60
CTL
331
MD5/5$65
IN
294
CTS2
IN
257
D60
OUT
330
MD5/5$65
CTL
293
CTS2
CTL
256
D51
IN
329
MD5/5$65
OUT
292
CTS2
OUT
255
D51
CTL
328
MD4/&(5%
IN
291
NMI
IN
254
D51
OUT
327
MD4/&(5%
CTL
290
,5/6
IN
253
D59
IN
326
MD4/&(5%
OUT
289
,5/5
IN
252
D59
CTL
325
MD3/&(5$
IN
288
,5/4
IN
251
D59
OUT
324
MD3/&(5$
CTL
287
,5/3
IN
250
D52
IN
323
MD3/&(5$
OUT
286
MD2/RXD2
IN
249
D52
CTL
322
A25
CTL
285
MD1/TXD2
IN
248
D52
OUT
321
A25
OUT
284
MD1/TXD2
CTL
247
D58
IN
320
A24
CTL
283
MD1/TXD2
OUT
246
D58
CTL
319
A24
OUT
282
MD0/SCK
IN
245
D58
OUT
318
A23
CTL
281
MD0/SCK
CTL
244
D53
IN
317
A23
OUT
280
MD0/SCK
OUT
243
D53
CTL
316
A22
CTL
279
RD/:55
CTL
242
D53
OUT
315
A22
OUT
278
RD/:55
OUT
241
D57
IN
314
A21
CTL
277
D63
IN
240
D57
CTL
313
A21
OUT
276
D63
CTL
239
D57
OUT
312
A20
CTL
275
D63
OUT
238
D54
IN
311
A20
OUT
274
D48
IN
237
D54
CTL
310
A19
CTL
273
D48
CTL
236
D54
OUT
Note: CTL is an active-low signal. The relevant pin is driven to the OUT state when CTL is set LOW.
Rev. 6.0, 07/02, page 807 of 986
Table 21.3 Configuration of the Boundary Scan Register (2)
No.
Pin Name
Type
No.
Pin Name
Type
No.
Pin Name
Type
235
D56
IN
196
D21
IN
157
DRAK1
OUT
234
D56
CTL
195
D21
CTL
156
A2
CTL
233
D56
OUT
194
D21
OUT
155
A2
OUT
232
D55
IN
193
D25
IN
154
A3
CTL
231
D55
CTL
192
D25
CTL
153
A3
OUT
230
D55
OUT
191
D25
OUT
152
A4
CTL
229
D31
IN
190
'5(44
IN
151
A4
OUT
228
D31
CTL
189
'5(43
IN
150
A5
CTL
227
D31
OUT
188
RXD
IN
149
A5
OUT
226
D16
IN
187
D22
IN
148
A6
CTL
225
D16
CTL
186
D22
CTL
147
A6
OUT
224
D16
OUT
185
D22
OUT
146
A7
CTL
223
D30
IN
184
D24
IN
145
A7
OUT
222
D30
CTL
183
D24
CTL
144
A8
CTL
221
D30
OUT
182
D24
OUT
143
A8
OUT
220
D17
IN
181
D23
IN
142
A9
CTL
219
D17
CTL
180
D23
CTL
141
A9
OUT
218
D17
OUT
179
D23
OUT
140
A10
CTL
217
D29
IN
178
:(:/&$6:/DQM7/5(*
CTL
139
A10
OUT
216
D29
CTL
177
:(:/&$6:/DQM7/5(*
OUT
138
A11
CTL
215
D29
OUT
176
:(9/&$69/DQM6
CTL
137
A11
OUT
214
D18
IN
175
:(9/&$69/DQM6
OUT
136
A12
CTL
213
D18
CTL
174
:(6/&$66/DQM3/,&,2:5 CTL
135
A12
OUT
212
D18
OUT
173
:(6/&$66/DQM3/,&,2:5 OUT
134
A13
CTL
211
D28
IN
172
:(5/&$65/DQM2/,&,25' CTL
133
A13
OUT
210
D28
CTL
171
:(5/&$65/DQM2/,&,25' OUT
132
A14
CTL
209
D28
OUT
170
RD/:5
CTL
131
A14
OUT
208
D19
IN
169
RD/:5
OUT
130
A15
CTL
207
D19
CTL
168
5'/&$66/)5$0(
CTL
129
A15
OUT
206
D19
OUT
167
5'/&$66/)5$0(
OUT
128
A16
CTL
205
D27
IN
166
5$6
CTL
127
A16
OUT
204
D27
CTL
165
5$6
OUT
126
A17
CTL
203
D27
OUT
164
&65
CTL
125
A17
OUT
202
D20
IN
163
&65
OUT
124
:(3/&$63/DQM0
CTL
201
D20
CTL
162
&66
CTL
123
:(3/&$63/DQM0
OUT
200
D20
OUT
161
&66
OUT
122
:(4/&$64/DQM1
CTL
199
D26
IN
160
DRAK0
CTL
121
:(4/&$64/DQM1
OUT
198
D26
CTL
159
DRAK0
OUT
120
:(7/&$67/DQM4
CTL
197
D26
OUT
158
DRAK1
CTL
119
:(7/&$67/DQM4
OUT
Note: CTL is an active-low signal. The relevant pin is driven to the OUT state when CTL is set LOW.
Rev. 6.0, 07/02, page 808 of 986
Table 21.3 Configuration of the Boundary Scan Register (3)
No.
Pin Name
Type
No.
Pin Name
Type
No.
Pin Name
Type
118
:(8/&$68/DQM5
CTL
78
D13
IN
38
D35
CTL
117
:(8/&$68/DQM5
OUT
77
D13
CTL
37
D35
OUT
116
CKE
CTL
76
D13
OUT
36
D44
IN
115
CKE
OUT
75
D1
IN
35
D44
CTL
114
D7
IN
74
D1
CTL
34
D44
OUT
113
D7
CTL
73
D1
OUT
33
D34
IN
112
D7
OUT
72
D14
IN
32
D34
CTL
111
D8
IN
71
D14
CTL
31
D34
OUT
110
D8
CTL
70
D14
OUT
30
D45
IN
109
D8
OUT
69
D0
IN
29
D45
CTL
108
%5(4/%6$&.
IN
68
D0
CTL
28
D45
OUT
107
%$&./%65(4
CTL
67
D0
OUT
27
D33
IN
106
%$&./%65(4
OUT
66
D15
IN
26
D33
CTL
105
D6
IN
65
D15
CTL
25
D33
OUT
104
D6
CTL
64
D15
OUT
24
D46
IN
103
D6
OUT
63
D39
IN
23
D46
CTL
102
D9
IN
62
D39
CTL
22
D46
OUT
101
D9
CTL
61
D39
OUT
21
D32
IN
100
D9
OUT
60
D40
IN
20
D32
CTL
99
D5
IN
59
D40
CTL
19
D32
OUT
98
D5
CTL
58
D40
OUT
18
D47
IN
97
D5
OUT
57
D38
IN
17
D47
CTL
96
D10
IN
56
D38
CTL
16
D47
OUT
95
D10
CTL
55
D38
OUT
15
5'5
CTL
94
D10
OUT
54
D41
IN
14
5'5
OUT
93
D4
IN
53
D41
CTL
13
%6
CTL
92
D4
CTL
52
D41
OUT
12
%6
OUT
91
D4
OUT
51
D37
IN
11
CS6
CTL
90
D11
IN
50
D37
CTL
10
CS6
OUT
89
D11
CTL
49
D37
OUT
9
CS5
CTL
88
D11
OUT
48
D42
IN
8
CS5
OUT
87
D3
IN
47
D42
CTL
7
CS4
CTL
86
D3
CTL
46
D42
OUT
6
CS4
OUT
85
D3
OUT
45
D36
IN
5
CS1
CTL
84
D12
IN
44
D36
CTL
4
CS1
OUT
83
D12
CTL
43
D36
OUT
3
CS0
CTL
82
D12
OUT
42
D43
IN
2
CS0
OUT
81
D2
IN
41
D43
CTL
1
5'<
IN
80
D2
CTL
40
D43
OUT
to TDO
79
D2
OUT
39
D35
IN
Note: CTL is an active-low signal. The relevant pin is driven to the OUT state when CTL is set LOW.
Rev. 6.0, 07/02, page 809 of 986
21.3
Operation
21.3.1
TAP Control
Figure 21.2 shows the internal states of the TAP control circuit. These conform to the state
transitions specified by JTAG.
• The transition condition is the TMS value at the rising edge of TCK.
• The TDI value is sampled at the rising edge of TCK, and shifted at the falling edge.
• The TDO value changes at the falling edge of TCK. When not in the Shift-DR or Shift-IR
state, TDO is in the high-impedance state.
• In a transition to 7567 = 0, a transition is made to the Test-Logic-Reset state asynchronously
with respect to TCK.
1
Test-Logic-Reset
0
0
Run-Test/Idle
1
Select-DR-Scan
1
Select-IR-Scan
0
1
0
1
Capture-DR
Capture-IR
0
0
0
Shift-DR
1
1
Exit1-DR
0
0
Pause-DR
0
Pause-IR
1
1
0
Exit2-DR
Exit2-IR
1
1
Update-DR
Update-IR
0
1
Figure 21.2 TAP Control State Transition Diagram
Rev. 6.0, 07/02, page 810 of 986
1
Exit1-IR
0
1
0
Shift-IR
1
0
1
0
21.3.2
H-UDI Reset
A power-on reset is effected by an SDIR command. A reset is effected by sending an H-UDI reset
assert command, and then sending an H-UDI reset negate command, from the H-UDI pin (see
figure 21.3). The interval required between the H-UDI reset assert command and the H-UDI reset
negate command is the same as the length of time the reset pin is held low in order to effect a
power-on reset.
H-UDI
reset assert
H-UDI pin
H-UDI
reset negate
Chip internal reset
CPU state
Normal
Reset
Reset processing
Figure 21.3 H-UDI Reset
21.3.3
H-UDI Interrupt
The H-UDI interrupt function generates an interrupt by setting a command value in SDIR from the
H-UDI. The H-UDI interrupt is of general exception/interrupt operation type, with a branch to an
address based on VBR and return effected by means of an RTE instruction. The exception code
stored in control register INTEVT in this case is H'600. The priority of the H-UDI interrupt can be
controlled with bits 3 to 0 of control register IPRC.
In the SH7750 or SH7750S, the H-UDI interrupt request signal is asserted for about eight cycles
of the LSI’s on-chip peripheral clock after the command is set. The number of cycles for assertion
is determined by the ratio of TCK to the frequency of the on-chip peripheral clock. Since the
period of assertion is limited, the CPU may miss a request.
In the SH7750R, the H-UDI interrupt request signal is asserted when the INTREQ bit in the
SDINT register is set to 1 after the command is set (Update-IR). The interrupt request signal will
not be negated unless a 0 is written to the INTREQ bit by software; therefore, the CPU will not
miss a request. As long as the H-UDI interrupt command is set in SDIR, the SDINT register is
connected between the TDI and TDO pins.
Note that, in the SH7750 or SH7750S, the H-UDI interrupt command automatically becomes a
bypass command immediately after it has been set. In the SH7750R, the command is not changed
except by the following operations: update in the Update-IR state, initialization in the Test-LogicReset state, and initialization by assertion of#7567.
Rev. 6.0, 07/02, page 811 of 986
21.3.4
Boundary Scan (EXTEST, SAMPLE/PRELOAD, BYPASS) (SH7750R Only)
In the SH7750R, setting a command from the H-UDI in SDIR can place the H-UDI pins in the
boundary scan mode that conforms to the JTAG standard. However, the following limitations
apply.
1. Boundary scan does not cover clock-related signals (EXTAL, EXTAL2, XTAL, XTAL2, and
CKIO).
2. Boundary scan does not cover reset-related signals (5(6(7, CA)
3. Boundary scan does not cover H-UDI-related signals (TCK, TDI, TDO, TMS, 7567).
4. With EXTEST, assert the 5(6(7 pin (low), and assert the CA pin (high). With
SAMPLE/PRELOAD, assert the CA pin (high).
5. To perform boundary scan, supply a clock to the EXTAL pin, and wait for the power-on
oscillation settling time to elapse before starting boundary scan. The frequency range of the
input clock is from 1 to 33.3 MHz.
Note that after the power-on oscillation settling time has elapsed, a clock does not need to be
supplied to the EXTAL pin any longer.
For details on the power-on oscillation settling time, see section 22, Electrical Characteristics.
6. In BYPASS mode of the SH7750 or SH7750S, the bypass register (SPDBPR) is not initialized
in the Capture-DR state.
21.4
Usage Notes
1. SDIR Command
Once an SDIR command has been set, it remains unchanged until initialization by asserting
7567 or placing the TAP in the Test-Logic-Reset state, or until another command (other than
an H-UDI interrupt command) is written from the H-UDI.
2. SDIR Commands in Sleep Mode
Sleep mode is cleared by an H-UDI interrupt or H-UDI reset, and these exception requests are
accepted in this mode. In standby mode, neither an H-UDI interrupt nor an H-UDI reset is
accepted.
3. In standby mode, the H-UDI function cannot be used. Furthermore, TCK must be retained at a
high level when entering the standby mode in order to retain the TAP state before and after
standby mode.
4. The H-UDI is used for emulator connection. Therefore, H-UDI functions cannot be used when
an emulator is used.
5. The H-UDI pins of the SH7750 and SH7750S must not be connected to a boundary-scan signal
loop on the board.
Rev. 6.0, 07/02, page 812 of 986
Section 22 Electrical Characteristics
22.1
Absolute Maximum Ratings
Table 22.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
I/O, PLL, RTC, CPG power supply
voltage
VDDQ
VDD-PLL1/2
VDD-RTC
VDD-CPG
2
–0.3 to 4.2, –0.3 to 4.2*
V
Internal power supply voltage
VDD
–0.3 to 2.5, –0.3 to 2.1*
2
V
Input voltage
Vin
–0.3 to VDDQ + 0.3
V
Operating temperature
Topr
1
–20 to 75, –40 to 85*
°C
Storage temperature
Tstg
–55 to 125
°C
Notes: Permanent damage to the chip may result if the maximum ratings are exceeded.
Permanent damage to the chip may result if all VSS pins are not connected to GND.
For information on the power-on and power-off procedures, refer to appendix H, Power-On
and Power-Off Procedures.
*1 HD6417750F167I, HD6417750SF167I only
*2 HD6417750R only
Rev. 6.0, 07/02, page 813 of 986
22.2
DC Characteristics
Table 22.2 DC Characteristics (HD6417750RBP240)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.4
1.5
1.6
IDD
—
230
580
Sleep mode
—
—
120
Standby
mode
—
—
400
—
—
800
—
170
215
Sleep mode
—
35
40
Standby
mode
—
—
440
—
—
880
—
15
25
3
5
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current Standby
dissipation
mode
IDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
µA
1
Ta = 25°C*
1
Ta > 50°C*
mA
Iφ = 240 MHz,
Bφ = 120 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
µA
RTC on*
2
RTC off
V
Input leakage All input
current
pins
|Iin|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
Three-state
leakage
current
|Isti|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
I/O, all
output pins
(off state)
Rev. 6.0, 07/02, page 814 of 986
Item
Symbol
Min
Typ
Max
Unit
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Test Conditions
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and connect VSS-CPG, VSS-PLL1/2, and VSS-RTC to
GND, regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the total current value for the 3.3 V versions of VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG.
*1 RCR2.RTCEN must be set to 1 to reduce the leak current in the standby mode. (There
is no need to input a clock from EXTAL2.)
*2 RTCON refers to the status in which RCR2.RTCEN is set to 1 and a clock is being input
to EXTAL2.
Rev. 6.0, 07/02, page 815 of 986
Table 22.3 DC Characteristics (HD6417750RF240)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.4
1.5
1.6
IDD
—
230
580
Sleep mode
—
—
120
Standby
mode
—
—
400
—
—
800
—
140
180
Sleep mode
—
35
40
Standby
mode
—
—
440
—
—
880
—
15
25
3
5
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current Standby
dissipation
mode
IDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 240 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
mA
Iφ = 240 MHz,
Bφ = 80 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
µA
RTC on*
2
RTC off
V
Input leakage All input
current
pins
|Iin|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
Three-state
leakage
current
|Isti|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
I/O, all
output pins
(off state)
Rev. 6.0, 07/02, page 816 of 986
Item
Symbol
Min
Typ
Max
Unit
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Test Conditions
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the total current value for the 3.3 V versions of VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG.
*1 RCR2.RTCEN must be set to 1 to reduce the leak current in the standby mode. (There
is no need to input a clock from EXTAL2.)
*2 RTCON refers to the status in which RCR2.RTCEN is set to 1 and a clock is being input
to EXTAL2.
Rev. 6.0, 07/02, page 817 of 986
Table 22.4 DC Characteristics (HD6417750RBP200)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.35
1.5
1.6
IDD
—
190
480
Sleep mode
—
—
100
Standby
mode
—
—
400
—
—
800
—
140
180
Sleep mode
—
30
35
Standby
mode
—
—
440
—
—
880
—
15
25
3
5
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current Standby
dissipation
mode
IDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 200 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
mA
Iφ = 200 MHz,
Bφ = 100 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
µA
RTC on*
2
RTC off
V
Input leakage All input
current
pins
|Iin|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
Three-state
leakage
current
|Isti|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
I/O, all
output pins
(off state)
Rev. 6.0, 07/02, page 818 of 986
Item
Symbol
Min
Typ
Max
Unit
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Test Conditions
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and connect VSS-CPG, VSS-PLL1/2, and VSS-RTC to
GND, regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-RTC, and VDD-CPG 3.3 V system currents.
*1 RCR2.RTCEN must be set to 1 to reduce the leak current in the standby mode. (There
is no need to input a clock from EXTAL2.)
*2 RTCON refers to the status in which RCR2.RTCEN is set to 1 and a clock is being input
to EXTAL2.
Rev. 6.0, 07/02, page 819 of 986
Table 22.5 DC Characteristics (HD6417750RF200)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.35
1.5
1.6
IDD
—
190
480
Sleep mode
—
—
100
Standby
mode
—
—
400
—
—
800
—
140
180
Sleep mode
—
30
35
Standby
mode
—
—
440
—
—
880
—
15
25
3
5
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current Standby
dissipation
mode
IDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 200 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
mA
Iφ = 200 MHz,
Bφ = 67 MHz
µA
Ta = 25°C*
1
Ta > 50°C*
1
µA
RTC on*
2
RTC off
V
Input leakage All input
current
pins
|Iin|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
Three-state
leakage
current
|Isti|
—
—
1
µA
VIN = 0.5 to VDDQ
–0.5 V
I/O, all
output pins
(off state)
Rev. 6.0, 07/02, page 820 of 986
Item
Symbol
Min
Typ
Max
Unit
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Test Conditions
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
*1 RCR2.RTCEN must be set to 1 to reduce the leak current in the standby mode. (There
is no need to input a clock from EXTAL2.)
*2 RTCON refers to the status in which RCR2.RTCEN is set to 1 and a clock is being input
to EXTAL2.
Rev. 6.0, 07/02, page 821 of 986
Table 22.6 DC Characteristics (HD6417750SBP200)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.8
1.95
2.07
IDD
—
410
780
Sleep mode
—
165
210
Standby
mode
—
—
2000
—
—
5000
—
140
180
Sleep mode
—
40
50
Standby
mode
—
—
2200
—
—
5500
—
15
25
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current During RTC IDD-RTC
dissipation
operation
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 200 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 200 MHz,
Bφ = 100 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
µA
RTC input clock:
32.768 kHz
Power is supplied
only to VDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 822 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 823 of 986
Table 22.7 DC Characteristics (HD6417750SF200)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.8
1.95
2.07
IDD
—
410
780
Sleep mode
—
165
210
Standby
mode
—
—
2000
—
—
5000
—
140
180
Sleep mode
—
40
50
Standby
mode
—
—
2200
—
—
5500
—
15
25
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current During RTC IDD-RTC
dissipation
operation
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 200 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 200 MHz,
Bφ = 67 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
µA
RTC input clock:
32.768 kHz
Power is supplied
only to VDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 824 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 825 of 986
Table 22.8 DC Characteristics (HD6417750BP200M)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.8
1.95
2.07
IDD
—
1000
1200
Sleep mode
—
165
—
Standby
mode
—
—
2000
—
—
5000
—
160
200
Sleep mode
—
40
—
Standby
mode
—
—
2200
—
—
5500
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
Input voltage 5(6(7,
NMI, 7567
IDDQ
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 200 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 200 MHz,
Bφ = 100 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 826 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 827 of 986
Table 22.9 DC Characteristics (HD6417750SF167)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.6
1.8
2.0
IDD
—
320
650
Sleep mode
—
120
150
Standby
mode
—
50
400
—
100
800
—
140
180
Sleep mode
—
40
50
Standby
mode
—
110
440
—
220
880
—
15
45
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current During RTC IDD-RTC
dissipation
operation
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 167 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 167 MHz,
Bφ = 84 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
µA
RTC input clock:
32.768 kHz
Power is supplied
only to VDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 828 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 829 of 986
Table 22.10 DC Characteristics (HD6417750SF167I)
Ta = –40 to +85°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.6
1.8
2.0
IDD
—
320
650
Sleep mode
—
140
175
Standby
mode
—
50
400
—
100
880
—
180
220
Sleep mode
—
50
65
Standby
mode
—
110
440
—
220
960
—
15
45
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current During RTC IDD-RTC
dissipation
operation
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 167 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 167 MHz,
Bφ = 84 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
µA
RTC input clock:
32.768 kHz
Power is supplied
only to VDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 830 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 831 of 986
Table 22.11 DC Characteristics (HD6417750F167)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.6
1.8
2.0
IDD
—
630
700
Sleep mode
—
120
—
Standby
mode
—
—
400
—
—
800
—
160
200
Sleep mode
—
40
—
Standby
mode
—
—
440
—
—
880
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
Input voltage 5(6(7,
NMI, 7567
IDDQ
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 167 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 167 MHz,
Bφ = 84 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 832 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 833 of 986
Table 22.12 DC Characteristics (HD6417750F167I)
Ta = –40 to +85°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.6
1.8
2.0
IDD
—
720
800
Sleep mode
—
140
—
Standby
mode
—
50
400
—
100
880
—
180
220
Sleep mode
—
50
—
Standby
mode
—
110
440
—
220
960
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
Input voltage 5(6(7,
NMI, 7567
IDDQ
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 167 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 167 MHz,
Bφ = 83 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 834 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 835 of 986
Table 22.13 DC Characteristics (HD6417750SVF133)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.4
1.5
1.7
IDD
—
210
520
Sleep mode
—
50
60
Standby
mode
—
—
100
—
—
200
—
80
160
Sleep mode
—
35
40
Standby
mode
—
—
110
—
—
220
—
15
25
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current During RTC IDD-RTC
dissipation
operation
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 133 MHz,
Bφ = 66 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 133 MHz,
Bφ = 67 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
µA
RTC input clock:
32.768 kHz
Power is supplied only
to VDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 836 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 837 of 986
Table 22.14 DC Characteristics (HD6417750SVBT133)
Ta = –30 to +70°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.4
1.5
1.7
IDD
—
210
520
Sleep mode
—
50
60
Standby
mode
—
—
100
—
—
200
—
80
160
Sleep mode
—
35
40
Standby
mode
—
—
110
—
—
220
—
15
45
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
IDDQ
RTC current During RTC IDD-RTC
dissipation
operation
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 133 MHz,
Bφ = 66 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 133 MHz,
Bφ = 67 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
µA
RTC input clock:
32.768 kHz
Power is supplied only
to VDD-RTC
Input voltage 5(6(7,
NMI, 7567
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 838 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Rev. 6.0, 07/02, page 839 of 986
Table 22.15 DC Characteristics (HD6417750VF128)
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Power supply
voltage
VDDQ
VDD-PLL1/2
VDD-CPG
VDD-RTC
3.0
3.3
3.6
V
Normal mode, sleep
mode, deep sleep
mode, standby mode
VDD
1.4
1.5
1.7
IDD
—
—
520
Sleep mode
—
—
60
Standby
mode
—
—
100
—
—
200
—
—
160
Sleep mode
—
—
40
Standby
mode
—
—
110
—
—
220
VDDQ ×
0.9
—
VDDQ +
0.3
2.0
—
VDDQ +
0.3
–0.3
—
VDDQ ×
0.1
–0.3
—
VDDQ ×
0.2
Current
dissipation
Current
dissipation
Normal
operation
Normal
operation
Input voltage 5(6(7,
NMI, 7567
IDDQ
VIH
Other input
pins
5(6(7,
NMI, 7567
VIL
Other input
pins
Normal mode, sleep
mode, deep sleep
mode, standby mode
mA
Iφ = 128 MHz,
Bφ = 64 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
mA
Iφ = 128 MHz,
Bφ = 64 MHz
µA
Ta = 25°C (RTC on*)
Ta > 50°C (RTC on*)
V
Output
voltage
All output
pins
VOH
2.4
—
—
VOL
—
—
0.55
Pull-up
resistance
All pull-up
resistance
Rpull
20
60
180
kΩ
Pin
capacitance
All pins
CL
—
—
10
pF
Rev. 6.0, 07/02, page 840 of 986
V
Notes: 1. Connect VDD-PLL1/2, VDD-RTC, and VDD-CPG to VDDQ, and VSS-CPG, VSS-PLL1/2, and VSSQ-RTC to GND,
regardless of whether or not the PLL circuits and RTC are used.
2. The current dissipation values are for VIH min = VDDQ – 0.5 V and VIL max = 0.5 V with all
output pins unloaded.
3. IDDQ is the sum of the VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG 3.3 V system currents.
* To reduce the leakage current in standby mode, the RTC must be turned on (input the
clock from EXTAL2 and set RCR2.RTCEN to 1).
Table 22.16 Permissible Output Currents
Ta = –20 to +75°C
Item
Symbol
Min
Typ
Max
Unit
Permissible output low current
(per pin)
IOL
—
—
2
mA
Permissible output low current
(total)
ΣIOL
—
—
120
Permissible output high current
(per pin)
–IOH
—
—
2
Permissible output high current
(total)
Σ(–IOH)
—
—
40
Note: To protect chip reliability, do not exceed the output current values in table 22.16.
Rev. 6.0, 07/02, page 841 of 986
22.3
AC Characteristics
In principle, SH7750 Series input should be synchronous. Unless specified otherwise, ensure that
the setup time and hold times for each input signal are observed.
Table 22.17 Clock Timing (HD6417750RBP240)
Item
Operating
frequency
Symbol
Min
Typ
Max
Unit
f
1
—
240
MHz
External bus
1
—
120
Peripheral modules
1
—
60
Symbol
Min
Typ
Max
Unit
f
1
—
240
MHz
External bus
1
—
84
Peripheral modules
1
—
60
CPU, FPU, cache, TLB
Table 22.18 Clock Timing (HD6417750RF240)
Item
Operating
frequency
CPU, FPU, cache, TLB
Table 22.19 Clock Timing (HD6417750BP200M, HD6417750SBP200, HD6417750RBP200)
Item
Operating
frequency
Symbol
Min
Typ
Max
Unit
f
1
—
200
MHz
External bus
1
—
100
Peripheral modules
1
—
50
Symbol
Min
Typ
Max
Unit
f
1
—
200
MHz
External bus
1
—
84
Peripheral modules
1
—
50
Symbol
Min
Typ
Max
Unit
f
1
—
200
MHz
External bus
1
—
67
Peripheral modules
1
—
50
CPU, FPU, cache, TLB
Table 22.20 Clock Timing (HD6417750RF200)
Item
Operating
frequency
CPU, FPU, cache, TLB
Table 22.21 Clock Timing (HD6417750SF200)
Item
Operating
frequency
CPU, FPU, cache, TLB
Rev. 6.0, 07/02, page 842 of 986
Table 22.22 Clock Timing (HD6417750F167, HD6417750F167I, HD6417750SF167,
HD6417750SF167I)
Item
Operating
frequency
Symbol
Min
Typ
Max
Unit
f
1
—
167
MHz
External bus
1
—
84
Peripheral modules
1
—
42
CPU, FPU, cache, TLB
Table 22.23 Clock Timing (HD6417750SVF133, HD6417750SVBT133)
Item
Operating
frequency
Table 22.24
Symbol
Min
Typ
Max
Unit
f
1
—
134
MHz
External bus
1
—
67
Peripheral modules
1
—
34
Symbol
Min
Typ
Max
Unit
f
1
—
128
MHz
External bus
1
—
64
Peripheral modules
1
—
32
CPU, FPU, cache, TLB
Clock Timing (HD6417750VF128)
Item
Operating
frequency
CPU, FPU, cache, TLB
Rev. 6.0, 07/02, page 843 of 986
22.3.1
Clock and Control Signal Timing
Table 22.25 Clock and Control Signal Timing (HD6417750RBP240)
VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
Symbol
Min
Max
Unit
PLL1 6-times/PLL2
operation
fEX
16
34
MHz
PLL1 12-times/PLL2
operation
fEX
14
20
PLL1/PLL2 not operating
fEX
1
34
EXTAL clock input cycle time
tEXcyc
30
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
PLL1/PLL2 operating
fOP
25
120
MHz
PLL1/PLL2 not operating
fOP
1
34
MHz
CKIO clock output cycle time
tcyc
8.3
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Standby return oscillation settling time 1
tOSC2
3
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
3
—
ms
22.7
EXTAL
clock input
frequency
Rev. 6.0, 07/02, page 844 of 986
Figure
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 3
tOSC4
3
—
ms
22.8
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
34 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 845 of 986
Table 22.26 Clock and Control Signal Timing (HD6417750RF240)
VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
Symbol
Min
Max
Unit
PLL1 6-times/PLL2
operation
fEX
16
34
MHz
PLL1 12-times/PLL2
operation
fEX
14
20
PLL1/PLL2 not operating
Figure
fEX
1
34
EXTAL clock input cycle time
tEXcyc
30
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
PLL1/PLL2 operating
fOP
25
84
MHz
PLL1/PLL2 not operating
fOP
1
34
MHz
CKIO clock output cycle time
tcyc
11.9
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Standby return oscillation settling time 1
tOSC2
3
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
3
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
3
—
ms
22.8
Rev. 6.0, 07/02, page 846 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
34 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 847 of 986
Table 22.27 Clock and Control Signal Timing (HD6417750RBP200)
VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
Symbol
Min
Max
Unit
PLL1 6-times/PLL2
operation
fEX
16
34
MHz
PLL1 12-times/PLL2
operation
fEX
14
17
PLL1/PLL2 not operating
Figure
fEX
1
34
EXTAL clock input cycle time
tEXcyc
30
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
PLL1/PLL2 operating
fOP
25
100
MHz
PLL1/PLL2 not operating
fOP
1
100
MHz
CKIO clock output cycle time
tcyc
10
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Standby return oscillation settling time 1
tOSC2
5
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Rev. 6.0, 07/02, page 848 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
34 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 849 of 986
Table 22.28 Clock and Control Signal Timing (HD6417750RF200)
VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
Symbol
Min
Max
Unit
PLL1 6-times/PLL2
operation
fEX
16
34
MHz
PLL1 12-times/PLL2
operation
fEX
14
17
PLL1/PLL2 not operating
Figure
fEX
1
34
EXTAL clock input cycle time
tEXcyc
30
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
PLL1/PLL2 operating
fOP
25
84
MHz
PLL1/PLL2 not operating
fOP
1
34
MHz
CKIO clock output cycle time
tcyc
11.9
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Standby return oscillation settling time 1
tOSC2
5
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Rev. 6.0, 07/02, page 850 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
34 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 851 of 986
Table 22.29 Clock and Control Signal Timing (HD6417750BP200M, HD6417750SBP200)
VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
PLL2
operating
PLL2 not
operating
Symbol
Min
Max
Unit
fEX
16
67
MHz
1/2 divider not fEX
operating
8
34
1/2 divider
operating
fEX
2
67
1/2 divider not fEX
operating
1
34
1/2 divider
operating
Figure
EXTAL clock input cycle time
tEXcyc
15
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
fOP
25
100
MHz
PLL2 operating
fOP
1
100
MHz
CKIO clock output cycle time
PLL2 not operating
tcyc
10
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Rev. 6.0, 07/02, page 852 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1
tOSC2
10
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
34 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 853 of 986
Table 22.30 Clock and Control Signal Timing (HD6417750SF200)
VDDQ = 3.0 to 3.6 V, VDD = 1.8 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
PLL2
operating
PLL2 not
operating
Symbol
Min
Max
Unit
fEX
16
67
MHz
1/2 divider not fEX
operating
8
34
1/2 divider
operating
fEX
2
67
1/2 divider not fEX
operating
1
34
1/2 divider
operating
Figure
EXTAL clock input cycle time
tEXcyc
15
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
fOP
25
67
MHz
PLL2 operating
fOP
1
67
MHz
CKIO clock output cycle time
PLL2 not operating
tcyc
10
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Rev. 6.0, 07/02, page 854 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1
tOSC2
10
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
34 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 855 of 986
Table 22.31 Clock and Control Signal Timing (HD6417750F167, HD6417750F167I,
HD6417750SF167, HD6417750SF167I)
HD6417750SF167, HD6417750F167: VDDQ = 3.0 to 3.6 V, VDD = 1.8 V, Ta = –20 to +75°C,
CL = 30 pF
HD6417750SF167I, HD6417750F167I: VDDQ = 3.0 to 3.6 V, VDD = 1.8 V, Ta = –40 to +85°C,
CL = 30 pF
Item
EXTAL
clock input
frequency
PLL2
operating
PLL2 not
operating
Symbol
Min
Max
Unit
fEX
16
56
MHz
1/2 divider not fEX
operating
8
28
1/2 divider
operating
fEX
2
56
1/2 divider not fEX
operating
1
28
1/2 divider
operating
Figure
EXTAL clock input cycle time
tEXcyc
18
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
fOP
25
84
MHz
PLL2 operating
fOP
1
84
MHz
CKIO clock output cycle time
tcyc
12
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
PLL2 not operating
Rev. 6.0, 07/02, page 856 of 986
Item
Symbol
Min
Max
Unit
Figure
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Standby return oscillation settling time 1
tOSC2
10
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
28 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 857 of 986
Table 22.32 Clock and Control Signal Timing (HD6417750SVF133, HD6417750SVBT133)
HD6417750SVBT133: VDDQ = 3.0 to 3.6 V, VDD = 1.5 V typ, Ta = –30 to +70°C, CL = 30 pF
HD6417750SVF133: VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
PLL2
operating
PLL2 not
operating
Symbol
Min
Max
Unit
fEX
16
45
MHz
1/2 divider not fEX
operating
8
23
1/2 divider
operating
fEX
2
45
1/2 divider not fEX
operating
1
23
1/2 divider
operating
Figure
EXTAL clock input cycle time
tEXcyc
22
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
PLL2 operating
fOP
25
67
MHz
PLL2 not operating
fOP
1
67
MHz
CKIO clock output cycle time
tcyc
14
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Rev. 6.0, 07/02, page 858 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1
tOSC2
10
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
23 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 859 of 986
Table 22.33 Clock and Control Signal Timing (HD6417750VF128)
VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF
Item
EXTAL
clock input
frequency
PLL2
operating
PLL2
not
operating
Symbol
Min
Max
Unit
fEX
16
43
MHz
1/2 divider not fEX
operating
8
22
1/2 divider
operating
fEX
2
43
1/2 divider not fEX
operating
1
22
1/2 divider
operating
Figure
EXTAL clock input cycle time
tEXcyc
23
1000
ns
22.1
EXTAL clock input low-level pulse width
tEXL
3.5
—
ns
22.1
EXTAL clock input high-level pulse width
tEXH
3.5
—
ns
22.1
EXTAL clock input rise time
tEXr
—
4
ns
22.1
EXTAL clock input fall time
tEXf
—
4
ns
22.1
CKIO clock
output
fOP
25
64
MHz
PLL2 operating
fOP
1
64
MHz
CKIO clock output cycle time
PLL2 not operating
tcyc
15
1000
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL1
1
—
ns
22.2(1)
CKIO clock output high-level pulse width
tCKOH1
1
—
ns
22.2(1)
CKIO clock output rise time
tCKOr
—
3
ns
22.2(1)
CKIO clock output fall time
tCKOf
—
3
ns
22.2(1)
CKIO clock output low-level pulse width
tCKOL2
3
—
ns
22.2(2)
CKIO clock output high-level pulse width
tCKOH2
3
—
ns
22.2(2)
Power-on oscillation settling time
tOSC1
10
—
ms
22.3, 22.5
Power-on oscillation settling time/mode
settling
tOSCMD
10
—
ms
22.3, 22.5
SCK2 reset setup time
tSCK2RS
20
—
ns
22.11
SCK2 reset hold time
tSCK2RH
20
—
ns
22.3, 22.5, 22.11
MD reset setup time
tMDRS
3
—
tcyc
22.12
MD reset hold time
tMDRH
20
—
ns
22.3, 22.5, 22.12
5(6(7 assert time
tRESW
20
—
tcyc
22.3, 22.4, 22.5,
22.6, 22.11
PLL synchronization settling time
tPLL
200
—
µs
22.9, 22.10
Rev. 6.0, 07/02, page 860 of 986
Item
Symbol
Min
Max
Unit
Figure
Standby return oscillation settling time 1
tOSC2
10
—
ms
22.4, 22.6
Standby return oscillation settling time 2
tOSC3
5
—
ms
22.7
Standby return oscillation settling time 3
tOSC4
5
—
ms
22.8
Standby return oscillation settling time 1* tOSC2
2
—
ms
Standby return oscillation settling time 2* tOSC3
2
—
ms
Standby return oscillation settling time 3* tOSC4
2
—
ms
IRL interrupt determination time
(RTC used, standby mode)
tIRLSTB
—
200
µs
22.10
7567 reset hold time
tTRSTRH
0
—
ns
22.3, 22.5
Notes: 1. When a crystal resonator is connected to EXTAL and XTAL, the maximum frequency is
22 MHz. When a 3rd overtone crystal resonator is used, an external tank circuit is
necessary.
2. The maximum load capacitance to be connected to CKIO pin should be 50 pF in PLL2
operation, because there is a feedback from CKIO pin.
* When the oscillation settling time of a crystal resonator is lower than or equal to 1 ms.
Rev. 6.0, 07/02, page 861 of 986
tEXcyc
tEXL
tEXH
VIH
VIH
VIH
1/2VDDQ
1/2VDDQ
VIL
VIL
tEXf
tEXr
Note: When the clock is input from the EXTAL pin
Figure 22.1 EXTAL Clock Input Timing
tcyc
tCKOL1
tCKOH1
VOH
VOH
VOH
1/2VDDQ
1/2VDDQ
VOL
VOL
tCKOf
tCKOr
Figure 22.2(1) CKIO Clock Output Timing
tCKOH2
1.5 V
tCKOL2
1.5 V
1.5 V
Figure 22.2(2) CKIO Clock Output Timing
Rev. 6.0, 07/02, page 862 of 986
Stable oscillation
CKIO,
internal clock
VDD min
VDD
tRESW
tOSC1
tSCK2RH
SCK2
tOSCMD
tMDRH
MD8, MD7,
MD2–MD0
tTRSTRH
Notes: 1. Oscillation settling time when on-chip resonator is used
2. PLL2 not operating
Figure 22.3 Power-On Oscillation Settling Time
Standby
Stable oscillation
CKIO,
internal clock
tRESW
tOSC2
Notes: 1. Oscillation settling time when on-chip resonator is used
2. PLL2 not operating
Figure 22.4 Standby Return Oscillation Settling Time (Return by 5(6(7)
5(6(7
Rev. 6.0, 07/02, page 863 of 986
Stable oscillation
Internal clock
VDD min
VDD
tRESW
tOSC1
tSCK2RH
SCK2
tOSCMD
tMDRH
MD8, MD7,
MD2–MD0
tTRSTRH
CKIO
Notes: 1. Oscillation settling time when on-chip resonator is used
2. PLL2 operating
Figure 22.5 Power-On Oscillation Settling Time
Stable oscillation
Standby
Internal
clock
tRESW
tOSC2
CKIO
Notes: 1. Oscillation settling time when on-chip resonator is used
2. PLL2 operating
Figure 22.6 Standby Return Oscillation Settling Time (Return by 5(6(7)
5(6(7
Rev. 6.0, 07/02, page 864 of 986
Standby
Stable oscillation
CKIO,
internal clock
tOSC3
NMI
Note: Oscillation settling time when on-chip resonator is used
Figure 22.7 Standby Return Oscillation Settling Time (Return by NMI)
Stable oscillation
Standby
CKIO,
internal clock
tOSC4
–
Note: Oscillation settling time when on-chip resonator is used
Figure 22.8 Standby Return Oscillation Settling Time (Return by ,5/6–,5/3
,5/6 ,5/3)
,5/3
Rev. 6.0, 07/02, page 865 of 986
Reset or NMI
interrupt request
Stable input clock
Stable input clock
EXTAL input
tPLL × 2
PLL synchronization
PLL synchronization
PLL output,
CKIO output
Internal clock
STATUS1–
STATUS0
Normal
Normal
Standby
Note: When external clock from EXTAL is input
Figure 22.9 PLL Synchronization Settling Time in Case of 5(6(7 or NMI Interrupt
–
interrupt request
Stable input clock
Stable input clock
EXTAL input
PLL synchronization
tIRLSTB
tPLL × 2
PLL synchronization
PLL output,
CKIO output
Internal clock
STATUS1–
STATUS0
Normal
Standby
Normal
Note: When external clock from EXTAL is input
Figure 22.10 PLL Synchronization Settling Time in Case of IRL Interrupt
Rev. 6.0, 07/02, page 866 of 986
CKIO
tRESW
tSCK2RS
tSCK2RH
SCK2
Figure 22.11 Manual Reset Input Timing
tMDRS
tMDRH
MD6–MD3
Figure 22.12 Mode Input Timing
Rev. 6.0, 07/02, page 867 of 986
22.3.2
Control Signal Timing
Table 22.34 Control Signal Timing (1)
HD6417750
RBP240
HD6417750
RBP200
*
HD6417750
RF240
*
HD6417750
RF200
*
*
Item
Symbol Min
Max
Min
Max
Min
Max
Min
Max
Unit Figure
%5(4 setup
time
tBREQS
2
—
2.5
—
3.5
—
3.5
—
ns
22.13
%5(4 hold
time
tBREQH
1.5
—
1.5
—
1.5
—
1.5
—
ns
22.13
%$&. delay
time
tBACKD
—
5.3
—
6
—
6
—
6
ns
22.13
Bus tri-state
delay time
tBOFF1
—
12
—
12
—
12
—
12
ns
22.13
Bus tri-state
delay time
to standby
mode
tBOFF2
—
2
—
2
—
2
—
2
tcyc
22.14
Bus buffer
on time
tBON1
—
12
—
12
—
12
—
12
ns
22.13
Bus buffer
on time from
standby
tBON2
—
1
—
1
—
1
—
1
tcyc
22.14
STATUS0/1
delay time
tSTD1
—
5
—
6
—
6
—
6
ns
22.14
STATUS0/1
delay time
to standby
tSTD2
—
2
—
2
—
2
—
2
tcyc
22.14
Note: * VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 868 of 986
Notes
Table 22.34 Control Signal Timing (2)
HD6417750
VF128
*1
HD6417750
SVF133
HD6417750
SVBT133
*1
HD6417750
F167
HD6417750
F167I
HD6417750
SF167
HD6417750
SF167I
HD6417750
SF200
*2
HD6417750
BP200M
HD6417750
SBP200
*3
Item
Symbol Min
Max
Min
Max
Min
Max
Min
Max
Unit Figure
%5(4 setup
time
tBREQS
3.5
—
3.5
—
3.5
—
3
—
ns
22.13
%5(4 hold
time
tBREQH
1.5
—
1.5
—
1.5
—
1.5
—
ns
22.13
%$&. delay
time
tBACKD
—
10
—
10
—
8
—
6
ns
22.13
Bus tri-state
delay time
tBOFF1
—
15
—
15
—
12
—
10
ns
22.13
Bus tri-state
delay time
to standby
mode
tBOFF2
—
2
—
2
—
2
—
2
tcyc
22.14
Bus buffer
on time
tBON1
—
15
—
15
—
12
—
10
ns
22.13
Bus buffer
on time from
standby
tBON2
—
1
—
1
—
1
—
1
tcyc
22.14
STATUS0/1
delay time
tSTD1
—
11
—
11
—
9
—
7
ns
22.14
STATUS0/1
delay time
to standby
tSTD2
—
2
—
2
—
2
—
2
tcyc
22.14
Notes
Notes: *1 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
*2 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
(HD6417750F167, HD6417750SF167, HD6417750SF200)
VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –40 to +85°C, CL = 30 pF, PLL2 on
(HD6417750F167I, HD6417750SF167I)
*3 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 869 of 986
CKIO
tBREQH
A[25-0],
,
RD/
,
RD/
,
,
tBREQS
tBREQS
tBACKD
tBACKD
tBOFF1
,
,
,
tBREQH
tBON1
,
,
Figure 22.13 Control Signal Timing
Normal operation
Standby mode
Normal operation
CKIO
STATUS 0, STATUS 1
Standby
Normal
tSTD2
,
,
,
, RD/
,
,
,
,
,
Normal
tSTD1
,
tBOFF2
RD/
tBON2
A25–A0, D63–D0
DACKn, DRAKn, SCK,
,
* TXD, TXD2,
Note: * When the PHZ bit in STBCR is set to 1, these pins go to the high-impedance state (except
for pins being used as port pins, which retain their port state).
Figure 22.14 Pin Drive Timing for Standby Mode
Rev. 6.0, 07/02, page 870 of 986
22.3.3
Bus Timing
Table 22.35 Bus Timing (1)
HD6417750
RBP240
HD6417750
RBP200
HD6417750
RF240
HD6417750
RF200
*
*
*
*
Item
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Address delay time
tAD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
Notes
%6 delay time
tBSD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
&6 delay time
tCSD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
5: delay time
tRWD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
5' delay time
tRSD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
Read data setup
time
tRDS
2
—
2.5
—
3.5
—
3.5
—
ns
Read data hold
time
tRDH
1.5
—
1.5
—
1.5
—
1.5
—
ns
:( delay time
(falling edge)
tWEDF
—
5.3
—
6
—
6
—
6
ns
:( delay time
tWED1
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
Write data delay
time
tWDD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
5'< setup time
tRDYS
2
—
2.5
—
3.5
—
3.5
—
ns
5'< hold time
tRDYH
1.5
—
1.5
—
1.5
—
1.5
—
ns
5$6 delay time
tRASD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
&$6 delay time 1
tCASD1
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
DRAM
&$6 delay time 2
tCASD2
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
SDRAM
CKE delay time
tCKED
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
SDRAM
DQM delay time
tDQMD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
SDRAM
)5$0( delay time
tFMD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
MPX
,2,649 setup time
tIO16S
2
—
2.5
—
3.5
—
3.5
—
ns
PCMCIA
,2,649 hold time
tIO16H
1.5
—
1.5
—
1.5
—
1.5
—
ns
PCMCIA
,&,2:5 delay time
(falling edge)
tICWSDF
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
PCMCIA
,&,25' delay time
tICRSD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
PCMCIA
DACK delay time
tDACD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
DACK delay time
(falling edge)
tDACDF
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
Relative
to CKIO
falling
edge
Relative
to CKIO
falling
edge
Rev. 6.0, 07/02, page 871 of 986
HD6417750
RBP240
HD6417750
RBP200
HD6417750
RF240
HD6417750
RF200
*
*
*
*
Item
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
DTR setup time
tDTRS
2.0
—
2.5
—
3.5
—
3.5
—
ns
DTR hold time
tDTRH
1.5
—
1.5
—
1.5
—
1.5
—
ns
'%5(4 setup time
tDBQS
2.0
—
2.5
—
3.5
—
3.5
—
ns
'%5(4 hold time
tDBQH
1.5
—
1.5
—
1.5
—
1.5
—
ns
75 setup time
tTRS
2.0
—
2.5
—
3.5
—
3.5
—
ns
75 hold time
tTRH
1.5
—
1.5
—
1.5
—
1.5
—
ns
%$9/ delay time
tBAVD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
7'$&. delay time
tTDAD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
ID1, ID0 delay time
tIDD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
Note: * VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 872 of 986
Notes
Table 22.35 Bus Timing (2)
HD6417750
SF167
HD6417750
SVF133
HD6417750
SF167I
HD6417750
SVBT133
HD6417750
SF200
HD6417750
SBP200
*1
*2
*3
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Notes
Address delay time
tAD
1.5
10
1.5
8
1.5
6
ns
%6 delay time
tBSD
1.5
10
1.5
8
1.5
6
ns
&6 delay time
tCSD
1.5
10
1.5
8
1.5
6
ns
5: delay time
tRWD
1.5
10
1.5
8
1.5
6
ns
5' delay time
tRSD
1.5
10
1.5
8
1.5
6
ns
Read data setup
time
tRDS
3.5
—
3.5
—
3
—
ns
Read data hold
time
tRDH
1.5
—
1.5
—
1.5
—
ns
:( delay time
(falling edge)
tWEDF
—
10
—
8
—
6
ns
:( delay time
tWED1
1.5
10
1.5
8
1.5
6
ns
Write data delay
time
tWDD
1.5
10
1.5
8
1.5
6
ns
5'< setup time
tRDYS
3.5
—
3.5
—
3
—
ns
5'< hold time
tRDYH
1.5
—
1.5
—
1.5
—
ns
5$6 delay time
tRASD
1.5
10
1.5
8
1.5
6
ns
&$6 delay time 1
tCASD1
1.5
10
1.5
8
1.5
6
ns
DRAM
&$6 delay time 2
tCASD2
1.5
10
1.5
8
1.5
6
ns
SDRAM
CKE delay time
tCKED
1.5
10
1.5
8
1.5
6
ns
SDRAM
DQM delay time
tDQMD
1.5
10
1.5
8
1.5
6
ns
SDRAM
)5$0( delay time
tFMD
1.5
10
1.5
8
1.5
6
ns
MPX
,2,649 setup time
tIO16S
3.5
—
3.5
—
3
—
ns
PCMCIA
,2,649 hold time
tIO16H
1.5
—
1.5
—
1.5
—
ns
PCMCIA
,&,2:5 delay time
(falling edge)
tICWSDF
1.5
10
1.5
8
1.5
6
ns
PCMCIA
,&,25' delay time
tICRSD
1.5
10
1.5
8
1.5
6
ns
PCMCIA
DACK delay time
tDACD
1.5
10
1.5
8
1.5
6
ns
DACK delay time
(falling edge)
tDACDF
1.5
10
1.5
8
1.5
6
ns
Relative to CKIO falling
edge
Relative to CKIO falling
edge
Rev. 6.0, 07/02, page 873 of 986
HD6417750
SF167
Item
HD6417750
SVF133
HD6417750
SF167I
HD6417750
SVBT133
HD6417750
SF200
HD6417750
SBP200
*1
*2
*3
Symbol
Min
Max
Min
Max
Min
Max
Unit
DTR setup time
tDTRS
3.5
—
3.5
—
3
—
ns
DTR hold time
tDTRH
1.5
—
1.5
—
1.5
—
ns
'%5(4 setup time
tDBQS
3.5
—
3.5
—
3
—
ns
'%5(4 hold time
tDBQH
1.5
—
1.5
—
1.5
—
ns
75 setup time
tTRS
3.5
—
3.5
—
3
—
ns
75 hold time
tTRH
1.5
—
1.5
—
1.5
—
ns
%$9/ delay time
tBAVD
1.5
10
1.5
8
1.5
6
ns
7'$&. delay time
tTDAD
1.5
10
1.5
8
1.5
6
ns
ID1, ID0 delay time
tIDD
1.5
10
1.5
8
1.5
6
ns
Notes
Notes: *1 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
*2 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
(HD6417750SF167, HD6417750SF200)
VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –40 to +85°C, CL = 30 pF, PLL2 on
(HD6417750SF167I)
*3 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 874 of 986
Table 22.35 Bus Timing (3)
HD6417750
F167
HD6417750
VF128
HD6417750
F167I
HD6417750
BP200M
*1
*2
*3
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Notes
Address delay time
tAD
1.3
10
1.3
8
1.2
6
ns
%6 delay time
tBSD
1.3
10
1.3
8
1.2
6
ns
&6 delay time
tCSD
1.3
10
1.3
8
1.2
6
ns
5: delay time
tRWD
1.3
10
1.3
8
1.2
6
ns
5' delay time
tRSD
1.3
10
1.3
8
1.2
6
ns
Read data setup
time
tRDS
3.5
—
3.5
—
3
—
ns
Read data hold
time
tRDH
1.5
—
1.5
—
1.5
—
ns
:( delay time
(falling edge)
tWEDF
—
10
—
8
—
6
ns
:( delay time
tWED1
1.3
10
1.3
8
1.2
6
ns
Write data delay
time
tWDD
1.3
10
1.3
8
1.2
6
ns
5'< setup time
tRDYS
3.5
—
3.5
—
3
—
ns
5'< hold time
tRDYH
1.5
—
1.5
—
1.5
—
ns
5$6 delay time
tRASD
1.3
10
1.3
8
1.2
6
ns
&$6 delay time 1
tCASD1
1.3
10
1.3
8
1.2
6
ns
DRAM
&$6 delay time 2
tCASD2
1.3
10
1.3
8
1.2
6
ns
SDRAM
CKE delay time
tCKED
0.5
10
0.5
8
0.5
6
ns
SDRAM
DQM delay time
tDQMD
1.3
10
1.3
8
1.2
6
ns
SDRAM
)5$0( delay time
tFMD
1.3
10
1.3
8
1.2
6
ns
MPX
,2,649 setup time
tIO16S
3.5
—
3.5
—
3
—
ns
PCMCIA
,2,649 hold time
tIO16H
1.5
—
1.5
—
1.5
—
ns
PCMCIA
,&,2:5 delay time
(falling edge)
tICWSDF
1.3
10
1.3
8
1.2
6
ns
PCMCIA
,&,25' delay time
tICRSD
1.3
10
1.3
8
1.2
6
ns
PCMCIA
DACK delay time
tDACD
1.3
10
1.3
8
1.2
6
ns
DACK delay time
(falling edge)
tDACDF
1.3
10
1.3
8
1.2
6
ns
Relative to CKIO falling
edge
Relative to CKIO falling
edge
Rev. 6.0, 07/02, page 875 of 986
HD6417750
F167
Item
HD6417750
VF128
HD6417750
F167I
HD6417750
BP200M
*1
*2
*3
Symbol
Min
Max
Min
Max
Min
Max
Unit
DTR setup time
tDTRS
3.5
—
3.5
—
3
—
ns
DTR hold time
tDTRH
1.5
—
1.5
—
1.5
—
ns
'%5(4 setup time
tDBQS
3.5
—
3.5
—
3
—
ns
'%5(4 hold time
tDBQH
1.5
—
1.5
—
1.5
—
ns
75 setup time
tTRS
3.5
—
3.5
—
3
—
ns
75 hold time
tTRH
1.5
—
1.5
—
1.5
—
ns
%$9/ delay time
tBAVD
1.3
10
1.3
8
1.2
6
ns
7'$&. delay time
tTDAD
1.3
10
1.3
8
1.2
6
ns
ID1, ID0 delay time
tIDD
1.3
10
1.3
8
1.2
6
ns
Notes
Notes: *1 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
*2 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
(HD6417750F167)
VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –40 to +85°C, CL = 30 pF, PLL2 on
(HD6417750F167I)
*3 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 876 of 986
T1
T2
CKIO
tAD
tAD
tCSD
tCSD
tRWD
tRWD
A25–A0
RD/
tRSD
tRSD
tRSD
tRDS
D63–D0
(read)
tWED1
tWEDF
tWDD
tRDH
tWEDF
tWDD
tWDD
D63–D0
(write)
tBSD
tDACD
DACKn
(SA: IO ← memory)
tDACDF
DACKn
(SA: IO → memory)
tDACD
tBSD
tDACD
tDACD
tDACDF
tDACD
DACKn
(DA)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.15 SRAM Bus Cycle: Basic Bus Cycle (No Wait)
Rev. 6.0, 07/02, page 877 of 986
T1
Tw
T2
CKIO
tAD
tAD
tCSD
tCSD
tRWD
tRWD
A25–A0
RD/
tRSD
tRSD
tRSD
tRDS
D63–D0
tRDH
(read)
tWED1
tWEDF
tWDD
tWEDF
tWDD
tWDD
D63–D0
(write)
tBSD
tBSD
tRDYS
tDACD
tRDYH
tDACD
tDACD
DACKn
(SA: IO ← memory)
tDACDF
DACKn
(SA: IO → memory)
tDACD
tDACDF
tDACD
DACKn
(DA)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.16 SRAM Bus Cycle: Basic Bus Cycle (One Internal Wait)
Rev. 6.0, 07/02, page 878 of 986
T1
Tw
Twe
T2
CKIO
tAD
tAD
tCSD
tCSD
tRWD
tRWD
A25–A0
RD/
tRSD
tRSD
tRSD
tRDS
D63–D0
(read)
tWED1
tWEDF
tWDD
tRDH
tWEDF
tWDD
tWDD
D63–D0
(write)
tBSD
tBSD
tRDYS
tDACD
DACKn
(SA: IO ← memory)
tDACDF
tRDYH
tRDYS
tDACD
tRDYH
tDACD
tDACDF
DACKn
(SA: IO → memory)
tDACD
tDACD
DACKn
(DA)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.17 SRAM Bus Cycle: Basic Bus Cycle (One Internal Wait + One External Wait)
Rev. 6.0, 07/02, page 879 of 986
TS1
T1
T2
TH1
CKIO
tAD
tAD
tCSD
tCSD
tRWD
tRWD
A25–A0
RD/
tRSD
tRSD
tRDS
D63–D0
(read)
tWED1
tWEDF
tWDD
tRSD
*
tRDH
tWEDF
tWDD
tWDD
D63–D0
(write)
tBSD
tBSD
tDACD
tDACD
DACKn
(SA: IO ← memory)
tDACDF
DACKn
(SA: IO → memory)
DACKn
(DA)
tDACD
tDACD
tDACDF
tDACD
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
* SH7750R only
Figure 22.18 SRAM Bus Cycle: Basic Bus Cycle (No Wait, Address Setup/Hold Time
Insertion, AnS = 1, AnH = 1)
Rev. 6.0, 07/02, page 880 of 986
T1
TB2
TB1
TB2
TB1
TB2
TB1
T2
CKIO
tAD
tAD
A25–A5
tAD
A4–A0
RD/
tCSD
tCSD
tRWD
tRWD
tRSD
tRSD
tRDS
D31–D0
(read)
tBSD
tDACD
tRDH
tRDS
tRDH
tBSD
tDACD tDACD
DACKn
(SA: IO ← memory)
tRSD
tDACD
tDACD
DACKn
(DA)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.19 Burst ROM Bus Cycle (No Wait)
Rev. 6.0, 07/02, page 881 of 986
Figure 22.20 Burst ROM Bus Cycle
(1st Data: One Internal Wait + One External Wait; 2nd/3rd/4th Data: One Internal Wait)
Rev. 6.0, 07/02, page 882 of 986
tDACD
tDACD
tDACD
Twb
tRDH
tAD
TB1
tRDYH
TB2
tRDS
tRDYH
Twe
tRDYS
tRSD
tRDYS
tBSD
tRWD
tCSD
tAD
Tw
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
DACKn
(SA: IO ← memory)
D31–D0
(read)
RD/
A4–A0
A25–A5
CKIO
T1
TB2
TB1
Twb
TB2
Twb
tRDYS
TB1
tRDH
tRWD
tAD
tRDYH
tDACD
tRDS
tRSD
tCSD
T2
Figure 22.21 Burst ROM Bus Cycle
(No Wait, Address Setup/Hold Time Insertion, AnS = 1, AnH = 1)
Rev. 6.0, 07/02, page 883 of 986
tBSD
TB2
TH1
TS1
TB1
TB2
TH1
TS1
TB1
tRDS
T2
tRDH
TH1
tAD
tDACD
tDACD
tBSD
tDACD
tRDS
tDACD
tDACD
tRSD
tRWD
TB1
tRWD
tAD
TS1
tRDH
TH1
tCSD
tRSD
TB2
tCSD
tAD
T1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
DACKn
(SA: IO ← memory)
D31–D0
(read)
RD/
A4–A0
A25–A5
CKIO
TS1
Figure 22.22 Burst ROM Bus Cycle (One Internal Wait + One External Wait)
Rev. 6.0, 07/02, page 884 of 986
tRDH
tAD
TB1
Twb
Twbe
TB2
TB1
Twb
Twbe
TB2
tBSD
TB1
tBSD
Twb
Twbe
tRDS
T2
tAD
tBSD
tDACD
tDACD
tRDYH
tRDYS
tDACD
tRDYS
tBSD
tRSD
tRDYH
tDACD
tRDYS
tRDYS
tRDYH
tDACD
tRDYH
tRDH
tRSD
tRWD
tRDS
TB2
tRWD
Twe
tCSD
tRSD
Tw
tCSD
tAD
T1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
DACKn
(SA: IO ← memory)
D31–D0
(read)
RD/
A4–A0
A25–A5
CKIO
Figure 22.23 Synchronous DRAM Auto-Precharge Read Bus Cycle: Single
(RCD[1:0] = 01, CAS Latency = 3, TPC[2:0] = 011)
Rev. 6.0, 07/02, page 885 of 986
tRASD
Tc3
tRDS
Tc4/Td1
d0
tRDH
Td2
tDQMD
Td3
Td4
tAD
Tpc
tDACD
tWDD
tCASD2
tRASD
tDQMD
tCASD2 tCASD2
tBSD
tDACD tDACD
tBSD
tRWD
column
Tc2
tRWD
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
CKE
D63–D0
(write)
D63–D0
(read)
DQMn
RD/
Row
Address
H/L
tAD
Tc1
tCSD
Row
Precharge-sel
Trw
tCSD
Row
tAD
BANK
CKIO
Tr
Tpc
Tpc
tWDD
Figure 22.24 Synchronous DRAM Auto-Precharge Read Bus Cycle: Burst
(RCD[1:0] = 01, CAS Latency = 3, TPC[2:0] = 011)
Rev. 6.0, 07/02, page 886 of 986
tRASD
tRDS
Tc4/Td1
d0
tRDH
Td2
tDQMD
Td3
Td4
tAD
Tpc
tDACD
tWDD
tCASD2
tRASD
tDQMD
tCASD2 tCASD2
tDACD
tBSD
tBSD
d1
d2
d3
tDACD
tRWD
Tc3
tRWD
Tc2
tCSD
c0
H/L
tAD
Tc1
tCSD
Row
Row
Row
tAD
Trw
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
CKE
D63–D0
(write)
D63–D0
(read)
DQMn
RD/
Address
Precharge-sel
BANK
CKIO
Tr
Tpc
Tpc
tWDD
Tr
Trw
Tc1
Tc2
Tc3
Tc4/Td1
Td3
Td2
Td4
CKIO
tAD
tAD
BANK
Row
tAD
tRWD
Precharge-sel
Row
H/L
tRWD
Address
Row
c0
tCSD
tCSD
tRWD
tRWD
RD/
tRASD
tRASD
tCASD2 tCASD2
tCASD2
tDQMD
tDQMD
DQMn
tRDS
D63–D0
(read)
D63–D0
(write)
tRDH
d1
d0
tBSD
tDACD
d2
d3
tWDD
tWDD
tDACD
tBSD
tDACD
DACKn
(SA: IO ← memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.25 Synchronous DRAM Normal Read Bus Cycle: ACT + READ Commands,
Burst (RCD[1:0] = 01, CAS Latency = 3)
Rev. 6.0, 07/02, page 887 of 986
Tpr
Tpc
Tr
Trw
Tc1
Tc2
Tc3
Tc4/Td1
Td4
Td3
Td2
CKIO
tAD
tAD
tAD
BANK
Row
Precharge-sel
Row
H/L
Address
Row
c0
tAD
tCSD
tCSD
tRWD
tRWD
RD/
tRASD tRASD tRASD tRASD
tCASD2
tCASD2
tCASD2
tDQMD
tDQMD
DQMn
tRDS
D63–D0
(read)
D63–D0
(write)
tRDH
d0
tDACD
d2
d3
tWDD
tBSD
DACKn
(SA: IO ← memory)
d1
tWDD
tDACD
tBSD
tDACD
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.26 Synchronous DRAM Normal Read Bus Cycle: PRE + ACT + READ
Commands, Burst (RCD[1:0] = 01, TPC[2:0] = 001, CAS Latency = 3)
Rev. 6.0, 07/02, page 888 of 986
Tc1
Tc2
Tc3
Tc4/Td1
Td3
Td2
Td4
CKIO
tAD
tAD
BANK
Row
Precharge-sel
Address
H/L
c0
tCSD
tCSD
tRWD
tRWD
tRASD
tRASD
RD/
tCASD2
tCASD2
tDQMD
tDQMD
DQMn
tRDS
D63–D0
(read)
D63–D0
(write)
tRDH
d0
d1
d3
tWDD
tWDD
tBSD
tDACD
d2
tDACD
tBSD
tDACD
DACKn
(SA: IO ← memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.27 Synchronous DRAM Normal Read Bus Cycle: READ Command, Burst
(CAS Latency = 3)
Rev. 6.0, 07/02, page 889 of 986
Tr
Trw
Tc1
Tc2
Tc3
Tc4
Trwl
Trwl
Tpc
CKIO
tAD
BANK
Row
Precharge-sel
Row
Address
Row
tAD
tAD
H/L
Column
tCSD
tCSD
tRWD
tRWD
tCASD2
tCASD2
RD/
tRASD
tRASD
tCASD2
tDQMD
tDQMD
DQMn
tWDD
tWDD
D63–D0
(write)
tWDD
c0
tBSD
tBSD
CKE
DACKn
(SA: IO → memory)
tDACD
tDACD
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.28 Synchronous DRAM Auto-Precharge Write Bus Cycle: Single
(RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010)
Rev. 6.0, 07/02, page 890 of 986
Tr
Trw
Tc1
Tc2
Tc3
Trwl
Tc4
Trwl
Tpc
CKIO
tAD
tAD
BANK
Row
Precharge-sel
Row
H/L
Address
Row
c0
tAD
tCSD
tCSD
tRWD
tRWD
tCASD2
tCASD2
RD/
tRASD
tRASD
tCASD2
tDQMD
tDQMD
DQMn
tWDD
tWDD
D63–D0
(write)
tWDD
d0
tBSD
d1
d2
d3
tBSD
CKE
DACKn
(SA: IO → memory)
tDACD
tDACD
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.29 Synchronous DRAM Auto-Precharge Write Bus Cycle: Burst
(RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010)
Rev. 6.0, 07/02, page 891 of 986
Tr
Trw
Tc1
Tc2
Tc3
Trwl
Tc4
Trwl
CKIO
tAD
tAD
BANK
Row
Precharge-sel
Row
H/L
Address
Row
c0
tAD
tCSD
tCSD
tRWD
tRWD
tCASD2
tCASD2
RD/
tRASD
tRASD
tCASD2
tDQMD
tDQMD
DQMn
tWDD
tWDD
D63–D0
(write)
tWDD
d0
tBSD
d1
d2
d3
tBSD
CKE
tDACD
tDACD
DACKn
(SA: IO → memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.30 Synchronous DRAM Normal Write Bus Cycle: ACT + WRITE Commands,
Burst (RCD[1:0] = 01, TRWL[2:0] = 010)
Rev. 6.0, 07/02, page 892 of 986
Tpr
Tpc
Tr
Trw
Tc1
Tc2
Tc3
Trwl
Tc4
Trwl
CKIO
tAD
tAD
tAD
BANK
Row
Row
Precharge-sel
H/L
Row
H/L
Row
c0
tAD
Address
tCSD
tCSD
tRWD
tRWD
tRASD
tRASD
tRWD
tRWD
RD/
tRASD
tRASD
tCASD2 tCASD2
tCASD2
tDQMD
tDQMD
DQMn
tWDD
tWDD
D63–D0
(write)
tWDD
d0
tBSD
d1
d2
d3
tBSD
CKE
tDACD
tDACD
tDACD
DACKn
(SA: IO → memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.31 Synchronous DRAM Normal Write Bus Cycle: PRE + ACT + WRITE
Commands, Burst (RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010)
Rev. 6.0, 07/02, page 893 of 986
Tnop
(Tnop)
Tc1
Tc2
Tc3
Trwl
Tc4
Trwl
CKIO
tAD
BANK
tAD
Row
Precharge-sel
H/L
Address
c0
tCSD
tCSD
tRWD
tRWD
RD/
tCASD2
tCASD2
tDQMD
tDQMD
DQMn
tWDD
tWDD
tWDD
D63–D0
(write)
d1
d0
tBSD
d2
d3
tBSD
CKE
tDACD
SA-DMA
tDACD
DACKn
(SA: IO → memory)
Normal write
Notes: In the case of SA-DMA only, the (Tnop) cycle is inserted, and the DACKn signal is output as shown by the
solid line. In a normal write, the (Tnop) cycle is omitted and the DACKn signal is output as shown by the
dotted line.
IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.32 Synchronous DRAM Normal Write Bus Cycle: WRITE Command, Burst
(TRWL[2:0] = 010)
Rev. 6.0, 07/02, page 894 of 986
Tpr
Tpc
CKIO
tAD
tAD
BANK
Row
Precharge-sel
H/L
Address
tCSD
tCSD
tRWD
tRWD
tRASD
tRASD
RD/
tCASD2
tCASD2
tDQMD
tDQMD
tWDD
tWDD
DQMn
D63–D0
(write)
tBSD
CKE
tDACD
tDACD
DACKn
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.33 Synchronous DRAM Bus Cycle: Synchronous DRAM Precharge Command
(TPC[2:0] = 001)
Rev. 6.0, 07/02, page 895 of 986
TRr1
TRr2
TRr3
TRr4
TRrw
TRr5
Trc
Trc
Trc
CKIO
tAD
tAD
BANK
Precharge-sel
Address
tCSD
tCSD
tCSD
tRWD
tCSD
tRWD
RD/
tRASD
tRASD
tRASD
tCASD2
tCASD2
tCASD2
tRASD
tCASD2
tDQMD
tDQMD
tWDD
tWDD
DQMn
D63–D0
(write)
tBSD
CKE
tDACD
tDACD
DACKn
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.34 Synchronous DRAM Bus Cycle: Synchronous DRAM Auto-Refresh
(TRAS = 1, TRC[2:0] = 001)
Rev. 6.0, 07/02, page 896 of 986
TRs1
TRs2
TRs3
TRs4
TRs5
Trc
Trc
Trc
CKIO
tAD
tAD
BANK
Precharge-sel
Address
tCSD
tCSD
tCSD
tCSD
tRWD
tRWD
RD/
tRASD
tCASD2
tRASD
tCASD2
tRASD
tRASD
tCASD2
tCASD2
tDQMD
tDQMD
tWDD
tWDD
DQMn
D63–D0
(write)
tBSD
tCKED
tCKED
CKE
tDACD
tDACD
DACKn
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.35 Synchronous DRAM Bus Cycle: Synchronous DRAM Self-Refresh
(TRC[2:0] = 001)
Rev. 6.0, 07/02, page 897 of 986
TRp1
TRp2
TRp3
TRp4
TMw
TMw2
TMw3
TMw4
TMw5
CKIO
tAD
tAD
tAD
BANK
Precharge-sel
Address
tCSD
tCSD
tCSD
tRWD
tRWD
tRWD
tRASD
tRASD
tRASD
tCASD2
tCASD2
RD/
tCASD2
tCASD2
tDQMD
tDQMD
tWDD
tWDD
DQMn
D63–D0
(write)
tBSD
CKE
tDACD
tDACD
DACKn
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.36 (a) Synchronous DRAM Bus Cycle: Synchronous DRAM Mode Register
Setting (PALL)
Rev. 6.0, 07/02, page 898 of 986
TRp1
TRp2
TRp3
TRp4
TMw
TMw2
TMw3
TMw4
TMw5
CKIO
tAD
tAD
tAD
BANK
Precharge-sel
Address
tCSD
tCSD
tCSD
tRWD
tRWD
tRWD
tRASD
tRASD
tRASD
tCASD2
tCASD2
RD/
tCASD2
tCASD2
tDQMD
tDQMD
tWDD
tWDD
DQMn
D63–D0
(write)
tBSD
CKE
tDACD
tDACD
DACKn
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.36 (b) Synchronous DRAM Bus Cycle: Synchronous DRAM Mode Register
Setting (SET)
Rev. 6.0, 07/02, page 899 of 986
Figure 22.37 DRAM Bus Cycles
(1) RCD[1:0] = 00, AnW[2:0] = 000, TPC[2:0] = 001
(2) RCD[1:0] = 01, AnW[2:0] = 001, TPC[2:0] = 010
Rev. 6.0, 07/02, page 900 of 986
tDACD
tDACD
tDACD
tWDD
tRASD
Tr2
tDACD
tWDD
tCASD1
tRASD
tRWD
tCSD
Row
tAD
Tr1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO → memory)
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
tBSD
(1)
tCASD1
Tc2
tBSD
tRDS
column
tAD
Tc1
tDACD
tDACD
tWDD
tRDH
tCASD1
tRASD
tRWD
tCSD
tAD
Tpc
tDACD
tDACD
tWDD
tCASD1
tRASD
tRWD
tCSD
Row
tAD
Tr1
tDACD
tDACD
tWDD
tRASD
Tr2
Trw
tBSD
tBSD
Tc2
tRDS
tCASD1
Tcw
(2)
column
tAD
Tc1
tDACD
tDACD
tWDD
tRDH
tCASD1
tRASD
tRWD
tCSD
tAD
Tpc
Tpc
T1r
Tr2
Tc1
Tc2
Tce
Tpc
CKIO
tAD
tAD
Row
A25–A0
tAD
Column
tCSD
tCSD
tRWD
tRWD
RD/
tRASD
tRASD
tCASD1
tRASD
tCASD1
tCASD1
tRDS
D63–D0
(read)
tRDH
tWDD
D63–D0
(write)
tBSD
DACKn
(SA: IO ← memory)
tDACD
tBSD
tDACD
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.38 DRAM Bus Cycle
(EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000, TPC[2:0] = 001)
Rev. 6.0, 07/02, page 901 of 986
Figure 22.39 DRAM Burst Bus Cycle
(EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000, TPC[2:0] = 001)
Rev. 6.0, 07/02, page 902 of 986
tBSD
c1
tRDH
Tc2
Tc1
d1
c2
tBSD
Tc2
Tc1
d2
tCASD1
c3
Tc2
tRDS
Tce
d3
tAD
Tpc
tDACD
tWDD
tRWD
tRASD
tDACD
tBSD
tRDS
tDACD
d0
tBSD
tRDH
tCASD1
tRASD
tRWD
tCASD1
tAD
Tc1
tRWD
tCASD1
c0
Tc2
tCSD
tRASD
tAD
Tc1
tCSD
Row
tAD
Tr2
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
T1r
Figure 22.40 DRAM Burst Bus Cycle
(EDO Mode, RCD[1:0] = 01, AnW[2:0] = 001, TPC[2:0] = 001)
Rev. 6.0, 07/02, page 903 of 986
tDACD tDACD
tWDD
tCASD1
tRASD
tBSD
tBSD
tCASD1
c0
Tcw
Tc2
tCASD1
Tc1
tRDS
tRDH
tDACD
d0
tCASD1
c1
Tcw
Tc2
Tc1
d1
c2
Tcw
Tc2
Tc1
Tc2
c3
d2
tCASD1
Tcw
tRDS
Tce
tAD
Tpc
d3
tRDH
tCASD1
tRASD
tRWD
tAD
Tc1
tRWD
tRASD
Trw
tCSD
Row
Tr2
tCSD
tAD
Tr1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Figure 22.41 DRAM Burst Bus Cycle (EDO Mode, RCD[1:0] = 01, AnW[2:0] = 001,
TPC[2:0] = 001, 2-Cycle CAS Negate Pulse Width)
Rev. 6.0, 07/02, page 904 of 986
c0
Tcw
Tc2
Tc1
tCASD1
Tcnw
c1
Tc2
tRDH
Tcw
Tcnw
Tc1
c2
Tcw
Tc2
Tc1
tCASD1
Tcnw
d2
Tcw
c3
Tc2
Tcnw
tRDS
Tce
tAD
Tpc
tRASD
tDACD t
DACD
tWDD
tCASD1
tRASD
tBSD
tCASD1
tRDS
tDACD
d0
d1
d3
tRDH
tCASD1
tRASD
tRWD
tAD
Tc1
tRWD
tBSD
Trw
tCSD
Row
Tr2
tCSD
tAD
Tr1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Figure 22.42 DRAM Burst Bus Cycle: RAS Down Mode State
(EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000)
Rev. 6.0, 07/02, page 905 of 986
tDACD
tWDD
tCASD1
tRASD
tRWD
tCSD
tAD
Tr1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Tpc
tDACD
tBSD
tRASD
Row
Tr2
tCASD1
tAD
Tc1
tBSD
c0
Tc2
tRDS
Tc2
tRDH
tDACD
c1
d0
tCASD1
tAD
Tc1
Tc1
d1
c2
Tc2
tBSD
Tc1
d2
tBSD
tCASD1
c3
Tc2
tRDS
Tce
d3
tRDH
tCASD1
tRWD
tCSD
tAD
Figure 22.43 DRAM Burst Bus Cycle: RAS Down Mode Continuation
(EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000)
Rev. 6.0, 07/02, page 906 of 986
tDACD
tBSD
tWDD
tCASD1
tRWD
tCSD
tAD
tBSD
tCASD1
c0
Tr2
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Tr1
tRDS
tCASD1
tAD
Tc1
tRDH
tDACD
d0
c1
Tc2
Tc1
d1
c2
Tc2
tBSD
Tc1
d2
c3
tBSD
tCASD1
Tc2
tRDS
tRASD
Tce
d3
RAS-down
mode ended
tRDH
tCASD1
tRWD
tCSD
tAD
Figure 22.44 DRAM Burst Bus Cycle
(Fast Page Mode, RCD[1:0] = 00, AnW[2:0] = 000, TPC[2:0] = 001)
Rev. 6.0, 07/02, page 907 of 986
tCASD1
d0
tCASD1
c1
Tc2
d1
Tc1
c2
Tc2
d2
Tc1
c3
Tc2
d3
tAD
Tpc
tDACD
tDACD
tWDD
tCASD1
tRASD
tDACD
tDACD
tWDD
tRASD
tBSD
tDACD
tBSD
tRDS
tDACD
tWDD
tRDH
d1
d2
d3
tRDS
tCASD1
tWDD
tRDH
tCASD1
tRASD
tRWD
c0
Tc1
tRWD
d0
tAD
Tc2
tCSD
Row
Tc1
tCSD
tAD
Tr2
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO → memory)
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Tr1
Figure 22.45 DRAM Burst Bus Cycle
(Fast Page Mode, RCD[1:0] = 01, AnW[2:0] = 001, TPC[2:0] = 001)
Rev. 6.0, 07/02, page 908 of 986
c0
Tcw
Tc2
d0
tCASD1
Tc1
c1
Tcw
Tc2
Tc1
d1
c2
Tcw
Tc2
Tc1
c3
Tcw
Tc2
tAD
Tpc
tDACD
tDACD
tWDD
tCASD1
tRASD
tDACD
tDACD
tWDD
tRASD
tBSD
d0
tDACD
tRDS
tCASD1
tDACD
tWDD
tRDH
d1
d2
d2
d3
tRDS
tCASD1
tRDH
tWDD
d3
tCASD1
tRASD
tRWD
tBSD
tAD
Tc1
tRWD
Trw
tCSD
Row
Tr2
tCSD
tAD
Tr1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO → memory)
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Figure 22.46 DRAM Burst Bus Cycle (Fast Page Mode, RCD[1:0] = 01, AnW[2:0] = 001,
TPC[2:0] = 001, 2-Cycle CAS Negate Pulse Width)
Rev. 6.0, 07/02, page 909 of 986
c0
Tcw
Tc2
Tc1
tCASD1
Tcnw
c1
Tcw
Tc2
d1
Tcnw
d2
Tc1
c2
Tcw
Tc2
d2
Tcnw
d3
Tc1
c3
Tcw
Tc2
tAD
Tcnw
tDACD
tDACD
tWDD
tWDD
tRASD
tDACD
tDACD
tCASD1
tRASD
tBSD tBSD
d0
tWDD
tRDH
tDACD
d0
tDACD
tRDS
tCASD1
d1
tRDS
tCASD1
Tpc
tRDH
tWDD
d3
tCASD1
tRASD
tRWD
tAD
Tc1
tRWD
Trw
tCSD
Row
Tr2
tCSD
tAD
Tr1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO → memory)
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Figure 22.47 DRAM Burst Bus Cycle: RAS Down Mode State
(Fast Page Mode, RCD[1:0] = 00, AnW[2:0] = 000)
Rev. 6.0, 07/02, page 910 of 986
tRWD
tRWD
tDACD
tDACD
tWDD
tCASD1
tRASD
tCSD
tAD
Tr1
tCSD
tAD
Tpc
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO → memory)
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
tDACD
tDACD
tAD
Tc1
tBSD
d0
tCASD1
tWDD
tRASD
Row
Tr2
tDACD
tBSD
tRDS
c0
Tc2
d0
c1
tDACD
Tc2
d1
tWDD
tRDH
tCASD1
Tc1
d1
Tc1
d2
c2
Tc2
d2
tCASD1
Tc1
d3
tRDS
c3
Tc2
tRDH
tWDD
d3
tCASD1
tRWD
tCSD
tAD
Figure 22.48 DRAM Burst Bus Cycle: RAS Down Mode Continuation
(Fast Page Mode, RCD[1:0] = 00, AnW[2:0] = 000)
Rev. 6.0, 07/02, page 911 of 986
d1
Tc1
c3
Tc2
tAD
tDACD
tDACD
tWDD
tCASD1
tBSD
tDACD tDACD
tDACD
tBSD
d0
tWDD
tDACD
d1
tWDD
d2
d2
d3
tRDH
tWDD
d3
tRDS
tRDH
tRDS
d0
tCASD1 tCASD1
tRASD
tCASD1 tCASD1
RAS down mode ended
tRWD
c2
Tc2
tRWD
Tc1
tRWD
c1
Tc2
tCSD
Tc1
tCSD
c0
Tc2
tCSD
tAD
Tc1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(SA: IO → memory)
DACKn
(SA: IO ← memory)
D63–D0
(write)
D63–D0
(read)
RD/
A25–A0
CKIO
Tnop
TRr1
TRr2
TRr3
TRr4
TRr5
Trc
Trc
Trc
CKIO
tAD
A25–A0
tCSD
tRWD
RD/
tRASD
tCASD1
tRASD
tCASD1
tRASD
tCASD1
tWDD
D63–D0
(write)
DACKn
(SA: IO ← memory)
tDACD
tDACD
DACKn
(SA: IO → memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.49 DRAM Bus Cycle: DRAM CAS-Before-RAS Refresh
(TRAS[2:0] = 000, TRC[2:0] = 001)
Rev. 6.0, 07/02, page 912 of 986
TRr1
TRr2
TRr3
TRr4
TRr4w
TRr5
Trc
Trc
Trc
CKIO
tAD
A25–A0
tCSD
tRWD
RD/
tRASD
tCASD1
tRASD
tCASD1
tRASD
tCASD1
tWDD
D63–D0
(write)
DACKn
(SA: IO ← memory)
tDACD
tDACD
DACKn
(SA: IO → memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.50 DRAM Bus Cycle: DRAM CAS-Before-RAS Refresh
(TRAS[2:0] = 001, TRC[2:0] = 001)
Rev. 6.0, 07/02, page 913 of 986
TRr1
TRr2
TRr3
TRr4
TRr5
Trc
Trc
Trc
CKIO
tAD
A25–A0
tCSD
tRWD
RD/
tRASD
tCASD1
tRASD
tCASD1
tRASD
tCASD1
tWDD
D63–D0
(write)
DACKn
(SA: IO ← memory)
tDACD
tDACD
DACKn
(SA: IO → memory)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.51 DRAM Bus Cycle: DRAM Self-Refresh (TRC[2:0] = 001)
Rev. 6.0, 07/02, page 914 of 986
Figure 22.52 PCMCIA Memory Bus Cycle
(1) TED[2:0] = 000, TEH[2:0] = 000, No Wait
(2) TED[2:0] = 001, TEH[2:0] = 001, One Internal Wait + One External Wait
Rev. 6.0, 07/02, page 915 of 986
)
tDACD
tBSD
tRDS
(1)
tBSD
tWDD
tDACD
tWDD
tRDH
tRSD
tRWD
tCSD
tAD
tWEDF
tRSD
tWEDF
tWDD
tWED1
tRSD
tRWD
tCSD
tAD
Tpcm2
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
*: SH7750S only
DACKn
(DA)
D15–D0
(write)
D15–D0
(read)
RD/
(
A25–A0
CKIO
Tpcm1
TED
tDACD
tBSD
tWDD
tWED1
tRSD
tRWD
tCSD
tAD
Tpcm0
tBSD
tWDD
Tpcm1
tRDYS
tWEDF
tRSD
Tpcm1w
(2)
tRDYS
tWDD
tRSD
tRWD
tCSD
tAD
tDACD
tRDH
TEH
tWEDF
*
Tpcm2w
tRDYH
tRDS
Tpcm2
tRDYH
Tpcm1w
Figure 22.53 PCMCIA I/O Bus Cycle
(1) TED[2:0] = 000, TEH[2:0] = 000, No Wait
(2) TED[2:0] = 001, TEH[2:0] = 001, One Internal Wait + One External Wait
Rev. 6.0, 07/02, page 916 of 986
(
(
)
)
)
tDACD
tIO16S
tBSD
(1)
tWDD
tDACD
tIO16H
tBSD
tWDD
tICWSDF tICWSDF
tRDS
tRDH
tRWD
tCSD
tAD
tICRSD tICRSD
tRWD
tCSD
tAD
Tpci2
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
D15–D0
(write)
D15–D0
(read)
RD/
(
A25–A0
CKIO
Tpci1
tDACD
tBSD
tWDD
tICWSDF
tICRSD
tRWD
tCSD
tAD
Tpci0
tBSD
tWDD
Tpci1
tRDYS
tICWSDF
(2)
tIO16H
tICWSDF
tWDD
tRWD
tCSD
tAD
tDACD
tRDH
tICRSD
Tpci2w
tIO16S
tRDS
Tpci2
tRDYH
tRDYH
Tpci1w
tRDYS
tICRSD
Tpci1w
Figure 22.54 PCMCIA I/O Bus Cycle
(TED[2:0] = 001, TEH[2:0] = 001, One Internal Wait, Bus Sizing)
Rev. 6.0, 07/02, page 917 of 986
(
(
(
)
)
)
tBSD
tWDD
tBSD
tWDD
tICWSDF
tICWSDF
tICRSD
tRWD
tCSD
tAD
Tpci1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
D15–D0
(write)
D15–D0
(read)
RD/
A0
A25–A1
CKIO
Tpci0
tICWSDF
tRDS
Tpci2
tIO16S tIO16H
tRDYS tRDYH
tICRSD
Tpci1w
tRDH
tICRSD
Tpci2w
tWDD
tCSD
tAD
Tpci0
tWDD
tICWSDF
Tpci1
tICWSDF
Tpci2
tRDYS tRDYH
Tpci1w
Tpci2w
tWDD
tRWD
tCSD
tAD
Figure 22.55 MPX Basic Bus Cycle: Read
(1) 1st Data (One Internal Wait)
(2) 1st Data (One Internal Wait + One External Wait)
Rev. 6.0, 07/02, page 918 of 986
tWDD
(1)
tBSD
tWED1
tDACD
tRDYH
tRDH
tCSD
tRWD
D0
tRDS
Tmd1
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tDACD
tBSD
tWDD
tFMD
tRDYS
tWED1
tRWD
tCSD
A
tFMD
Tmd1w
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
RD/
D63–D0
/
CKIO
Tm1
tWDD
tDACD
tBSD
tWDD
tFMD
Tmd1w
(2)
tRDYS
tRDYH
Tmd1w
tDACD
tWED1
tRWD
tRDYH
tRDH
tCSD
D0
tRDS
Tmd1
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tBSD
tRDYS
tWED1
tRWD
tCSD
A
tFMD
Tm0
Figure 22.56 MPX Basic Bus Cycle: Write
(1) 1st Data (No Wait)
(2) 1st Data (One Internal Wait)
(3) 1st Data (One Internal Wait + One External Wait)
Rev. 6.0, 07/02, page 919 of 986
tBSD
(1)
tWED1
tRWD
tCSD
tWDD
tDACD
tRDYH
D0
tWDD
tFMD
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tDACD
tBSD
tRDYS
tWED1
tRWD
tCSD
A
tWDD
tFMD
Tmd1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
RD/
D63–D0
/
CKIO
Tm1
(2)
tBSD
D0
tWED1
tRWD
tCSD
tWDD
tDACD
tRDYH
Tmd1
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tDACD
tBSD
tWDD
tFMD
Tmd1w
tRDYS
tWED1
tRWD
tCSD
A
tWDD
tFMD
Tm1
(3)
tRDYS
tBSD
D0
tRDYH
Tmd1w
tCSD
tWDD
tDACD
tWED1
tRWD
tRDYH
Tmd1
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tDACD
tBSD
tWDD
tFMD
Tmd1w
tRDYS
tWED1
tRWD
tCSD
A
tWDD
tFMD
Tm1
Figure 22.57 MPX Bus Cycle: Burst Read
(1) 1st Data (One Internal Wait), 2nd to 8th Data (One Internal Wait)
(2) 1st Data (One Internal Wait), 2nd to 4th Data (One Internal Wait + One External Wait)
Rev. 6.0, 07/02, page 920 of 986
Tmd1
tDACD
tBSD
(1)
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tBSD
tRDYS
tWED1
tRDYH
D2
D3
tFMD
Tmd4
tDACD
tWED1
tRWD
D1
tRDH
Tmd3
tRWD
D0
Tmd2
tCSD
tWDD tRDS
Tmd1w
tCSD
A
tWDD
tFMD
Tm1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
RD/
D63–D0
/
CKIO
tDACD
tBSD
Tmd1
D0
tBSD
Tmd2
D1
Tmd3
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
(2)
tRDYH
tRDH
Tmd2w
tRDYH tRDYS
tWDD tRDS
Tmd1w
tRDYS
tWED1
tRWD
tCSD
A
tWDD
tFMD
Tm1
D2
tFMD
Tmd4w
tWED1
tRWD
tCSD
tDACD
D3
Tmd4
Figure 22.58 MPX Bus Cycle: Burst Write
(1) No Internal Wait
(2) 1st Data (One Internal Wait), 2nd to 4th Data (No Internal Wait + External Wait
Control)
Rev. 6.0, 07/02, page 921 of 986
tDACD
tBSD
tRDYS
tWED1
tRWD
tCSD
A
tWDD
tFMD
Tm1
(1)
D2
Tmd3
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
tBSD
D1
Tmd2
tRDYH
D0
tWDD
Tmd1
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
RD/
D63–D0
/
CKIO
D3
tFMD
Tmd4
tDACD
tWED1
tRWD
tCSD
tDACD
tBSD
D0
Tmd1
tBSD
D1
Tmd2
D2
Tmd3
1st data bus cycle information
D63–D61: Access size
000: Byte
001: Word (2 bytes)
010: Long (4 bytes)
011: Quad (8 bytes)
1xx: Burst (32 bytes)
D25–D0: Address
(2)
tRDYH
Tmd2w
tRDYH tRDYS
tWDD
Tmd1w
tRDYS
tWED1
tRWD
tCSD
A
tWDD
tFMD
Tm1
tFMD
Tmd4w
D3
Tmd4
tDACD
tWED1
tRWD
tCSD
Figure 22.59 Memory Byte Control SRAM Bus Cycles
(1) Basic Read Cycle (No Wait)
(2) Basic Read Cycle (One Internal Wait)
(3) Basic Read Cycle (One Internal Wait + One External Wait)
Rev. 6.0, 07/02, page 922 of 986
tRSD
tDACD
tDACD
tBSD
tWED1
(1)
tDACD
tBSD
tWEDF
tRDS
tDACD
tDACD
tWED1
tRDH
tRSD
tRWD
tRWD
tRSD
tCSD
tAD
tCSD
tAD
T2
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
DACKn
(DA)
DACKn
(SA: IO ← memory)
D63–D0
(read)
RD/
A25–A0
CKIO
T1
tDACD
tDACD
tBSD
tWED1
tRSD
Tw
(2)
tDACD
tRDYS
tBSD
tWEDF
tRSD
tRWD
tCSD
tAD
T1
tWED1
tRDH
tRSD
tRWD
tCSD
tAD
tDACD
tDACD
tRDYH
tRDS
T2
tDACD
tRSD
Tw
(3)
tRDYH
Twe
tRDYS
tDACD
tRDYS
tBSD
tWEDF
tDACD
tBSD
tWED1
tRSD
tRWD
tCSD
tAD
T1
tRDH
tRSD
tRWD
tCSD
tAD
tDACD
tDACD
tWED1
tRDYH
tRDS
T2
TS1
T1
T2
TH1
CKIO
tAD
tAD
tCSD
tCSD
tRWD
tRWD
A25–A0
RD/
tRSD
D63–D0
(read)
tRDS
tWED1
tBSD
tDACD
tRSD
tRSD
tRDH
tWED1
tWEDF
tBSD
tDACD
DACKn
(SA: IO ← memory)
tDACD
tDACD
DACKn
(DA)
Notes: IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
Figure 22.60 Memory Byte Control SRAM Bus Cycle: Basic Read Cycle (No Wait, Address
Setup/Hold Time Insertion, AnS[0] = 1, AnH[1:0] =0 1)
Rev. 6.0, 07/02, page 923 of 986
22.3.4
Peripheral Module Signal Timing
Table 22.36 Peripheral Module Signal Timing (1)
HD6417750
RBP240
HD6417750
RBP200
*2
HD6417750
RF240
*2
HD6417750
RF200
*2
*2
Module
Item
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
TMU,
RTC
Timer clock
pulse width
(high)
tTCLKWH
4
—
4
—
4
—
4
—
Pcyc*
Timer clock
pulse width
(low)
tTCLKWL
4
—
4
—
4
—
4
—
Timer clock
rise time
tTCLKr
—
0.8
—
0.8
—
0.8
—
Timer clock
fall time
tTCLKf
—
0.8
—
0.8
—
0.8
Oscillation
settling time
tROSC
—
3
—
3
—
Input clock
cycle (asynchronous)
tScyc
4
—
4
—
Input clock
cycle (synchronous)
tScyc
6
—
6
Input clock
pulse width
tSCKW
0.4
0.6
Input clock
rise time
tSCKr
—
Input clock
fall time
tSCKf
Transfer data
delay time
SCI
Figure
1
22.61
Pcyc*
1
22.61
0.8
1
Pcyc*
22.61
—
0.8
1
Pcyc*
22.61
3
—
3
s
22.62
4
—
4
—
Pcyc*
—
6
—
6
—
0.4
0.6
0.4
0.6
0.4
0.8
—
0.8
—
0.8
—
0.8
—
0.8
—
tTXD
1.5
5.3
1.5
6
Receive data tRXS
setup time
(synchronous)
16
—
16
Receive data tRXH
hold time
(synchronous)
16
—
16
Rev. 6.0, 07/02, page 924 of 986
1
22.63
Pcyc*
1
22.63
0.6
tScyc
22.63
—
0.8
1
Pcyc*
22.63
0.8
—
0.8
1
Pcyc*
22.63
1.5
6
1.5
6
ns
22.64
—
16
—
16
—
ns
22.64
—
16
—
16
—
ns
22.64
HD6417750
RBP240
HD6417750
RBP200
*2
HD6417750
RF240
*2
HD6417750
RF200
*2
*2
Module
Item
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Figure
I/O
ports
Output data
delay time
tPORTD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
22.65
Input data
setup time
tPORTS
2
—
2.5
—
3.5
—
3.5
—
ns
22.65
Input data
hold time
tPORTH
1.5
—
1.5
—
1.5
—
1.5
—
ns
22.65
'5(4Q
setup time
tDRQS
2
—
2.5
—
3.5
—
3.5
—
ns
22.66
'5(4Q
hold time
tDRQH
1.5
—
1.5
—
1.5
—
1.5
—
ns
22.66
DRAKn
delay time
tDRAKD
1.5
5.3
1.5
6
1.5
6
1.5
6
ns
22.66
NMI pulse
width (high)
tNMIH
5
—
5
—
5
—
5
—
tcyc
22.71
Normal
or sleep
mode
30
—
30
—
30
—
30
—
ns
22.71
Standby
mode
5
—
5
—
5
—
5
—
tcyc
22.71
Normal
or sleep
mode
30
—
30
—
30
—
30
—
ns
22.71
Standby
mode
DMAC
INTC
NMI pulse
width (low)
H-UDI
tNMIL
Input clock
cycle
tTCKcyc
50
—
50
—
50
—
50
—
ns
22.67
Input clock
pulse width
(high)
tTCKH
15
—
15
—
15
—
15
—
ns
22.67
Input clock
pulse width
(low)
tTCKL
15
—
15
—
15
—
15
—
ns
22.67
Input clock
rise time
tTCKr
—
10
—
10
—
10
—
10
ns
22.67
Input clock
fall time
tTCKf
—
10
—
10
—
10
—
10
ns
22.67
$6(%5.
setup time
tASEBRKS
10
—
10
—
10
—
10
—
tcyc
22.68
$6(%5.
hold time
tASEBRKH
10
—
10
—
10
—
10
—
tcyc
22.68
TDI/TMS
setup time
tTDIS
15
—
15
—
15
—
15
—
ns
22.69
TDI/TMS
hold time
tTDIH
15
—
15
—
15
—
15
—
ns
22.69
TDO delay
time
tTDO
0
10
0
10
0
10
0
10
ns
22.69
ASE-PINBRK
pulse width
tPINBRK
2
—
2
—
2
—
2
—
Pcyc*
1
22.70
Notes: *1 Pcyc: P clock cycles
*2 VDDQ = 3.0 to 3.6 V, VDD = 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 925 of 986
Table 22.36 Peripheral Module Signal Timing (2)
HD6417750
SF167
HD6417750
SVF133
HD6417750
SF167I
HD6417750
SVBT133
HD6417750
SF200
HD6417750
SBP200
*3
*2
*4
Module
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
TMU,
RTC
Timer clock
pulse width
(high)
tTCLKWH
4
—
4
—
4
—
Pcyc*
1
22.61
Timer clock
pulse width
(low)
tTCLKWL
4
—
4
—
4
—
Pcyc*
1
22.61
Timer clock
rise time
tTCLKr
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.61
Timer clock
fall time
tTCLKf
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.61
Oscillation
settling time
tROSC
—
3
—
3
—
3
s
22.62
Input clock
cycle (asynchronous)
tScyc
4
—
4
—
4
—
Pcyc*
1
22.63
Input clock
cycle (synchronous)
tScyc
6
—
6
—
6
—
Pcyc*
1
22.63
Input clock
pulse width
tSCKW
0.4
0.6
0.4
0.6
0.4
0.6
tScyc
22.63
Input clock
rise time
tSCKr
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.63
Input clock
fall time
tSCKf
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.63
Transfer data
delay time
tTXD
1.5
10
1.5
8
1.5
6
ns
22.64
Receive data tRXS
setup time
(synchronous)
16
—
16
—
16
—
ns
22.64
Receive data tRXH
hold time
(synchronous)
16
—
16
—
16
—
ns
22.64
Output data
delay time
tPORTD
1.5
10
1.5
8
1.5
6
ns
22.65
Input data
setup time
tPORTS
3.5
—
3.5
—
3
—
ns
22.65
Input data
hold time
tPORTH
1.5
—
1.5
—
1.5
—
ns
22.65
SCI
I/O
ports
Rev. 6.0, 07/02, page 926 of 986
Figure
HD6417750
SF167
HD6417750
SVF133
HD6417750
SF167I
HD6417750
SVBT133
HD6417750
SF200
HD6417750
SBP200
*3
*2
*4
Module
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Figure
DMAC
'5(4Q
setup time
tDRQS
3.5
—
3.5
—
3
—
ns
22.66
'5(4Q
hold time
tDRQH
1.5
—
1.5
—
1.5
—
ns
22.66
DRAKn
delay time
tDRAKD
1.5
10
1.5
8
1.5
6
ns
22.66
NMI pulse
width (high)
tNMIH
5
—
5
—
5
—
tcyc
22.71
Normal or sleep mode
30
—
30
—
30
—
ns
22.71
Standby mode
NMI pulse
width (low)
tNMIL
5
—
5
—
5
—
tcyc
22.71
Normal or sleep mode
30
—
30
—
30
—
ns
22.71
Standby mode
Input clock
cycle
tTCKcyc
50
—
50
—
50
—
ns
22.67
Input clock
pulse width
(high)
tTCKH
15
—
15
—
15
—
ns
22.67
Input clock
pulse width
(low)
tTCKL
15
—
15
—
15
—
ns
22.67
Input clock
rise time
tTCKr
—
10
—
10
—
10
ns
22.67
Input clock
fall time
tTCKf
—
10
—
10
—
10
ns
22.67
$6(%5.
setup time
tASEBRKS
10
—
10
—
10
—
tcyc
22.68
$6(%5.
hold time
tASEBRKH
10
—
10
—
10
—
tcyc
22.68
TDI/TMS
setup time
tTDIS
15
—
15
—
15
—
ns
22.69
TDI/TMS
hold time
tTDIH
15
—
15
—
15
—
ns
22.69
TDO delay
time
tTDO
0
10
0
10
0
10
ns
22.69
ASE-PINBRK
pulse width
tPINBRK
2
—
2
—
2
—
Pcyc*
INTC
H-UDI
1
22.70
Notes: *1 Pcyc: P clock cycles
*2 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
*3 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
(HD6417750SF167, HD6417750SF200)
VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –40 to +85°C, CL = 30 pF, PLL2 on
(HD6417750SF167I)
*4 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 927 of 986
Table 22.36 Peripheral Module Signal Timing (3)
HD6417750
F167
HD6417750
VF128
HD6417750
F167I
HD6417750
BP200M
*3
*2
*4
Module
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
TMU,
RTC
Timer clock
pulse width
(high)
tTCLKWH
4
—
4
—
4
—
Pcyc*
1
22.61
Timer clock
pulse width
(low)
tTCLKWL
4
—
4
—
4
—
Pcyc*
1
22.61
Timer clock
rise time
tTCLKr
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.61
Timer clock
fall time
tTCLKf
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.61
Oscillation
settling time
tROSC
—
3
—
3
—
3
s
22.62
Input clock
cycle (asynchronous)
tScyc
4
—
4
—
4
—
Pcyc*
1
22.63
Input clock
cycle (synchronous)
tScyc
6
—
6
—
6
—
Pcyc*
1
22.63
Input clock
pulse width
tSCKW
0.4
0.6
0.4
0.6
0.4
0.6
tScyc
22.63
Input clock
rise time
tSCKr
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.63
Input clock
fall time
tSCKf
—
0.8
—
0.8
—
0.8
1
Pcyc*
22.63
Transfer data
delay time
tTXD
1.3
10
1.3
8
1.2
6
ns
22.64
Receive data tRXS
setup time
(synchronous)
16
—
16
—
16
—
ns
22.64
Receive data tRXH
hold time
(synchronous)
16
—
16
—
16
—
ns
22.64
Output data
delay time
tPORTD
0.5
10
0.5
8
0.5
6
ns
22.65
Input data
setup time
tPORTS
3.5
—
3.5
—
3
—
ns
22.65
Input data
hold time
tPORTH
1.5
—
1.5
—
1.5
—
ns
22.65
SCI
I/O
ports
Rev. 6.0, 07/02, page 928 of 986
Figure
HD6417750
F167
HD6417750
VF128
HD6417750
F167I
HD6417750
BP200M
*3
*2
*4
Module
Item
Symbol
Min
Max
Min
Max
Min
Max
Unit
Figure
DMAC
'5(4Q
setup time
tDRQS
3.5
—
3.5
—
3
—
ns
22.66
'5(4Q
hold time
tDRQH
1.5
—
1.5
—
1.5
—
ns
22.66
DRAKn
delay time
tDRAKD
1.0
10
1.0
8
1.0
6
ns
22.66
NMI pulse
width (high)
tNMIH
5
—
5
—
5
—
tcyc
22.71
30
—
30
—
30
—
ns
22.71
Standby mode
INTC
H-UDI
Normal or sleep mode
5
—
5
—
5
—
tcyc
22.71
Normal or sleep mode
30
—
30
—
30
—
ns
22.71
Standby mode
tTCKcyc
50
—
50
—
50
—
ns
22.67
Input clock
pulse width
(high)
tTCKH
15
—
15
—
15
—
ns
22.67
Input clock
pulse width
(low)
tTCKL
15
—
15
—
15
—
ns
22.67
Input clock
rise time
tTCKr
—
10
—
10
—
10
ns
22.67
Input clock
fall time
tTCKf
—
10
—
10
—
10
ns
22.67
$6(%5.
setup time
tASEBRKS
10
—
10
—
10
—
tcyc
22.68
$6(%5.
hold time
tASEBRKH
10
—
10
—
10
—
tcyc
22.68
TDI/TMS
setup time
tTDIS
15
—
15
—
15
—
ns
22.69
TDI/TMS
hold time
tTDIH
15
—
15
—
15
—
ns
22.69
TDO delay
time
tTDO
0
10
0
10
0
10
ns
22.69
ASE-PINBRK
pulse width
tPINBRK
2
—
2
—
2
—
Pcyc*
NMI pulse
width (low)
tNMIL
Input clock
cycle
1
22.70
Notes: *1 Pcyc: P clock cycles
*2 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.5 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
*3 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
(HD6417750F167)
VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –40 to +85°C, CL = 30 pF, PLL2 on
(HD6417750F167I)
*4 VDDQ = 3.0 to 3.6 V, VDD = typ. 1.8 V, Ta = –20 to +75°C, CL = 30 pF, PLL2 on
Rev. 6.0, 07/02, page 929 of 986
TCLK
tTCLKWH
tTCLKWL
tTCLKf
tTCLKr
Figure 22.61 TCLK Input Timing
Stable oscillation
RTC internal clock
VDD-RTC
VDD-RTC min
tROSC
Figure 22.62 RTC Oscillation Settling Time at Power-On
tSCKW
SCK, SCK2
tScyc
tSCKf
Figure 22.63 SCK Input Clock Timing
Rev. 6.0, 07/02, page 930 of 986
tSCKr
tScyc
SCK
tTXD
tTXD
TXD
RXD
tRXS tRXH
Figure 22.64 SCI I/O Synchronous Mode Clock Timing
CKIO
Ports 19–0
(read)
tPORTS tPORTH
Ports 19–0
(write)
tPORTD
tPORTD
Figure 22.65 I/O Port Input/Output Timing
CKIO
tDRQH
tDRQS
DRAKn
tDRQH
tDRQS
tDRAKD
Figure 22.66(a) '5(4/DRAK
Timing
'5(4
Rev. 6.0, 07/02, page 931 of 986
CKIO
tDBQS
tDBQH
DBREQ
tBAVD
tBAVD
BAVL
tTRH
tTRS
TR
tDTRS
D63 to D0
(READ)
tDTRH
(2)
(1)
(1): [2CKIO cycle – tDTRS] (= 18 ns: 100 MHz)
(2): DTR = 1CKIO cycle (= 10 ns: 100 MHz)
(tDTRS + tDTRH) < DTR < 10 ns
Figure 22.66(b) '%5(4/75
'%5(4 75 Input Timing and %$9/ Output Timing
tTCKcyc
tTCKL
tTCKH
VIH
VIH
VIH
1/2VDDQ
1/2VDDQ
VIL
VIL
tTCKf
tTCKr
Note: When clock is input from TCK pin
Figure 22.67 TCK Input Timing
(Low)
SCK2/
(High)
tASEBRKS tASEBRKH
tASEBRKS tASEBRKH
/
BRKACK
Figure 22.68 5(6(7 Hold Timing
Rev. 6.0, 07/02, page 932 of 986
tTCKcyc
TCK
tTDIS
TDI
TMS
tTDIH
tTDO
TDO
Figure 22.69 H-UDI Data Transfer Timing
tPINBRK
Figure 22.70 Pin Break Timing
tNMIH
tNMIL
NMI
Figure 22.71 NMI Input Timing
Rev. 6.0, 07/02, page 933 of 986
22.3.5
AC Characteristic Test Conditions
The AC characteristic test conditions are as follows:
• Input/output signal reference level: 1.5 V (VDDQ = 3.3 ±0.3 V)
• Input pulse level: VSSQ–3.0 V (VSSQ–VDDQ for 5(6(7, 7567, NMI, and $6(%5./BRKACK)
• Input rise/fall time: 1 ns
The output load circuit is shown in figure 22.72.
IOL
DUT output
LSI output pin
VREF
CL
IOH
Notes: 1. CL is the total value, including the capacitance of the test jig, etc.
The capacitance of each pin is set to 30 pF.
2. IOL and IOH values are as shown in table 22.16, Permissible Output Currents.
Figure 22.72 Output Load Circuit
Rev. 6.0, 07/02, page 934 of 986
22.3.6
Delay Time Variation Due to Load Capacitance
A graph (reference data) of the variation in delay time when a load capacitance greater than that
stipulated (30 pF) is connected to the SH7750 Series’ pins is shown below. The graph shown in
figure 22.73 should be taken into consideration if the stipulated capacitance is exceeded when
connecting an external device.
The graph will not be linear if the connected load capacitance exceeds the range shown in figure
22.73.
+4.0 ns
Delay Time
+3.0 ns
+2.0 ns
+1.0 ns
+0.0 ns
+0 pF
+25 pF
+50 pF
Load Capacitance
Figure 22.73 Load Capacitance vs. Delay Time
Rev. 6.0, 07/02, page 935 of 986
Rev. 6.0, 07/02, page 936 of 986
Appendix A Address List
Table A.1
Address List
Power-On
Size Reset
Manual
Reset
Synchronization
Sleep Standby Clock
Module Register
Area 7
1
P4 Address Address*
CCN
PTEH
H'FF00 0000 H'1F00 0000 32
Undefined
Undefined
Held
Held
Iclk
CCN
PTEL
H'FF00 0004 H'1F00 0004 32
Undefined
Undefined
Held
Held
Iclk
CCN
TTB
H'FF00 0008 H'1F00 0008 32
Undefined
Undefined
Held
Held
Iclk
CCN
TEA
H'FF00 000C H'1F00 000C 32
Undefined
Held
Held
Held
Iclk
CCN
MMUCR
H'FF00 0010 H'1F00 0010 32
H'0000 0000 H'0000 0000 Held
Held
Iclk
CCN
BASRA
H'FF00 0014 H'1F00 0014 8
Undefined
Held
Held
Held
Iclk
CCN
BASRB
H'FF00 0018 H'1F00 0018 8
Undefined
Held
Held
Held
Iclk
CCN
CCR
H'FF00 001C H'1F00 001C 32
H'0000 0000 H'0000 0000 Held
Held
Iclk
CCN
TRA
H'FF00 0020 H'1F00 0020 32
Undefined
Held
Iclk
CCN
EXPEVT
H'FF00 0024 H'1F00 0024 32
H'0000 0000 H'0000 0020 Held
Held
Iclk
CCN
INTEVT
H'FF00 0028 H'1F00 0028 32
Undefined
Undefined
Held
Held
Iclk
CCN
PTEA
H'FF00 0034 H'1F00 0034 32
Undefined
Undefined
Held
Held
Iclk
CCN
QACR0
H'FF00 0038 H'1F00 0038 32
Undefined
Undefined
Held
Held
Iclk
CCN
QACR1
H'FF00 003C H'1F00 003C 32
Undefined
Undefined
Held
Held
Iclk
UBC
BARA
H'FF20 0000 H'1F20 0000 32
Undefined
Held
Held
Held
Iclk
UBC
BAMRA
H'FF20 0004 H'1F20 0004 8
Undefined
Held
Held
Held
Iclk
UBC
BBRA
H'FF20 0008 H'1F20 0008 16
H'0000
Held
Held
Held
Iclk
UBC
BARB
H'FF20 000C H'1F20 000C 32
Undefined
Held
Held
Held
Iclk
UBC
BAMRB
H'FF20 0010 H'1F20 0010 8
Undefined
Held
Held
Held
Iclk
UBC
BBRB
H'FF20 0014 H'1F20 0014 16
H'0000
Held
Held
Held
Iclk
UBC
BDRB
H'FF20 0018 H'1F20 0018 32
Undefined
Held
Held
Held
Iclk
UBC
BDMRB
H'FF20 001C H'1F20 001C 32
Undefined
Held
Held
Held
Iclk
UBC
BRCR
H'FF20 0020 H'1F20 0020 16
H'0000*
Held
Held
Held
Iclk
BSC
BCR1
H'FF80 0000 H'1F80 0000 32
H'0000 0000* Held
2
2
Held
Held
Bclk
Held
Held
Bclk
Held
Held
Held
Bclk
H'FE0A00F0 H'1E0A00F0 32
H'0000 0000 Held
Held
Held
Bclk
H'FF80 0008 H'1F80 0008 32
H'7777 7777 Held
Held
Held
Bclk
H'FF80 000C H'1F80 000C 32
H'FFFE EFFF Held
Held
Held
Bclk
H'3FFC*
BSC
BCR3*
5
H'FF80 0050 H'1F80 0050 16
H'0000
BSC
5
BCR4*
BSC
WCR1
BSC
WCR2
BCR2
Held
Held
H'FF80 0004 H'1F80 0004 16
BSC
Undefined
2
Rev. 6.0, 07/02, page 937 of 986
Table A.1
Address List (cont)
Module Register
BSC
WCR3
H'FF80 0010 H'1F80 0010 32
H'0777 7777 Held
Held
Held
Bclk
BSC
MCR
H'FF80 0014 H'1F80 0014 32
H'0000 0000 Held
Held
Held
Bclk
BSC
PCR
H'FF80 0018 H'1F80 0018 16
H'0000
Held
Held
Held
Bclk
BSC
RTCSR
H'FF80 001C H'1F80 001C 16
H'0000
Held
Held
Held
Bclk
BSC
RTCNT
H'FF80 0020 H'1F80 0020 16
H'0000
Held
Held
Held
Bclk
BSC
RTCOR
H'FF80 0024 H'1F80 0024 16
H'0000
Held
Held
Held
Bclk
BSC
RFCR
H'FF80 0028 H'1F80 0028 16
H'0000
Held
Held
Held
Bclk
BSC
PCTRA
H'FF80 002C H'1F80 002C 32
H'0000 0000 Held
Held
Held
Bclk
BSC
PDTRA
H'FF80 0030 H'1F80 0030 16
Undefined
Held
Held
Held
Bclk
BSC
PCTRB
H'FF80 0040 H'1F80 0040 32
H'0000 0000 Held
Held
Held
Bclk
BSC
PDTRB
H'FF80 0044 H'1F80 0044 16
Undefined
Held
Held
Held
Bclk
BSC
GPIOIC
H'FF80 0048 H'1F80 0048 16
H'0000 0000 Held
Held
Held
Bclk
BSC
SDMR2
H'FF90 xxxx H'1F90 xxxx
8
Write-only
BSC
SDMR3
H'FF94 xxxx H'1F94 xxxx
8
DMAC
SAR0
H'FFA0 0000 H'1FA0 0000 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DAR0
H'FFA0 0004 H'1FA0 0004 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DMATCR0 H'FFA0 0008 H'1FA0 0008 32
Undefined
Undefined
Held
Held
Bclk
DMAC
CHCR0
H'FFA0 000C H'1FA0 000C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
DMAC
SAR1
H'FFA0 0010 H'1FA0 0010 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DAR1
H'FFA0 0014 H'1FA0 0014 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DMATCR1 H'FFA0 0018 H'1FA0 0018 32
Undefined
Undefined
Held
Held
Bclk
DMAC
CHCR1
H'FFA0 001C H'1FA0 001C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
DMAC
SAR2
H'FFA0 0020 H'1FA0 0020 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DAR2
H'FFA0 0024 H'1FA0 0024 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DMATCR2 H'FFA0 0028 H'1FA0 0028 32
Undefined
Undefined
Held
Held
Bclk
DMAC
CHCR2
H'FFA0 002C H'1FA0 002C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
DMAC
SAR3
H'FFA0 0030 H'1FA0 0030 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DAR3
H'FFA0 0034 H'1FA0 0034 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DMATCR3 H'FFA0 0038 H'1FA0 0038 32
Undefined
Undefined
Held
Held
Bclk
DMAC
CHCR3
H'FFA0 003C H'1FA0 003C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
DMAC
DMAOR
H'FFA0 0040 H'1FA0 0040 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
Rev. 6.0, 07/02, page 938 of 986
Power-On
Size Reset
Manual
Reset
Synchronization
Sleep Standby Clock
Area 7
1
P4 Address Address*
Bclk
Bclk
Table A.1
Address List (cont)
Area 7
1
P4 Address Address*
Module Register
DMAC
5
SAR4*
DMAC
5
DAR4*
DMAC
Power-On
Size Reset
Manual
Reset
Synchronization
Sleep Standby Clock
H'FFA0 0050 H'1FA0 0050 32
Undefined
Undefined
Held
Held
Bclk
H'FFA0 0054 H'1FA0 0054 32
Undefined
Undefined
Held
Held
Bclk
DMATCR4* H'FFA0 0058 H'1FA0 0058 32
Undefined
Undefined
Held
Held
Bclk
5
5
DMAC
CHCR4*
H'FFA0 005C H'1FA0 005C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
DMAC
5
SAR5*
H'FFA0 0060 H'1FA0 0060 32
Undefined
Undefined
Held
Held
Bclk
DMAC
5
DAR5*
H'FFA0 0064 H'1FA0 0064 32
Undefined
Undefined
Held
Held
Bclk
DMATCR5* H'FFA0 0068 H'1FA0 0068 32
Undefined
Undefined
Held
Held
Bclk
H'FFA0 006C H'1FA0 006C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
H'FFA0 0070 H'1FA0 0070 32
Undefined
Undefined
Held
Held
Bclk
H'FFA0 0074 H'1FA0 0074 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DMATCR6* H'FFA0 0078 H'1FA0 0078 32
Undefined
Undefined
Held
Held
Bclk
DMAC
5
CHCR6*
H'FFA0 007C H'1FA0 007C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
DMAC
5
SAR7*
H'FFA0 0080 H'1FA0 0080 32
Undefined
Undefined
Held
Held
Bclk
DMAC
DAR7*
5
H'FFA0 0084 H'1FA0 0084 32
Undefined
Undefined
Held
Held
Bclk
DMAC
5
DMATCR7* H'FFA0 0088 H'1FA0 0088 32
Undefined
Undefined
Held
Held
Bclk
DMAC
5
CHCR7*
H'FFA0 008C H'1FA0 008C 32
H'0000 0000 H'0000 0000 Held
Held
Bclk
CPG
FRQCR
H'FFC0 0000 H'1FC0 0000 16
*2
Held
Held
Held
Pclk
STBCR
H'FFC0 0004 H'1FC0 0004 8
H'00
Held
Held
Held
Pclk
WTCNT
H'FFC0 0008 H'1FC0 0008 8/16* H'00
Held
Held
Held
Pclk
6
CPG*
WTCSR
3
H'FFC0 000C H'1FC0 000C 8/16* H'00
Held
Held
Held
Pclk
6
CPG*
STBCR2
H'FFC0 0010 H'1FC0 0010 8
H'00
Held
Held
Held
Pclk
RTC
R64CNT
H'FFC8 0000 H'1FC8 0000 8
Held
Held
Held
Held
Pclk
RTC
RSECCNT H'FFC8 0004 H'1FC8 0004 8
Held
Held
Held
Held
Pclk
RTC
RMINCNT H'FFC8 0008 H'1FC8 0008 8
Held
Held
Held
Held
Pclk
RTC
RHRCNT
H'FFC8 000C H'1FC8 000C 8
Held
Held
Held
Held
Pclk
RTC
RWKCNT H'FFC8 0010 H'1FC8 0010 8
Held
Held
Held
Held
Pclk
RTC
RDAYCNT H'FFC8 0014 H'1FC8 0014 8
Held
Held
Held
Held
Pclk
RTC
RMONCNT H'FFC8 0018 H'1FC8 0018 8
Held
Held
Held
Held
Pclk
DMAC
5
DMAC
CHCR5*
DMAC
5
SAR6*
DMAC
5
CPG*
6
6
CPG*
DAR6*
5
5
3
RTC
RYRCNT
H'FFC8 001C H'1FC8 001C 16
Held
Held
Held
Held
Pclk
RTC
RSECAR
H'FFC8 0020 H'1FC8 0020 8
Held *
2
Held
Held
Held
Pclk
Held *
2
Held
Held
Held
Pclk
RTC
RMINAR
H'FFC8 0024 H'1FC8 0024 8
Rev. 6.0, 07/02, page 939 of 986
Table A.1
Address List (cont)
Synchronization
Sleep Standby Clock
Module Register
RTC
H'FFC8 0028 H'1FC8 0028 8
2
Held *
Held
Held
Held
Pclk
RHRAR
Power-On
Size Reset
Manual
Reset
Area 7
1
P4 Address Address*
RTC
RWKAR
H'FFC8 002C H'1FC8 002C 8
2
Held *
Held
Held
Held
Pclk
RTC
RDAYAR
H'FFC8 0030 H'1FC8 0030 8
Held *
2
Held
Held
Held
Pclk
RMONAR H'FFC8 0034 H'1FC8 0034 8
Held *
2
Held
Held
Held
Pclk
RTC
RCR1
H'FFC8 0038 H'1FC8 0038 8
2
H'00*
2
H'00*
Held
Held
Pclk
RTC
RCR2
H'FFC8 003C H'1FC8 003C 8
H'09*
2
2
H'00*
Held
Held
Pclk
H'FFC8 0050 H'1FC8 0050 8
H'00
Held
Held
Held
Pclk
H'FFC8 0054 H'1FC8 0054 16
Undefined
Held
Held
Held
Pclk
2
H'0000*
Held
Held
Pclk
H'0000
Held
Held
Pclk
RTC
RTC
RCR3*
5
5
RTC
RYRAR*
INTC
ICR
H'FFD0 0000 H'1FD0 0000 16
H'0000*
INTC
IPRA
H'FFD0 0004 H'1FD0 0004 16
H'0000
INTC
IPRB
H'FFD0 0008 H'1FD0 0008 16
H'0000
H'0000
Held
Held
Pclk
INTC
IPRC
H'FFD0 000C H'1FD0 000C 16
H'0000
H'0000
Held
Held
Pclk
INTC
4
IPRD*
H'FFD00010 H'1F000010
H'DA74
H'DA74
Held
Held
Pclk
INTC
INTPRI00 H'FE08 0000 H'1E08 0000 32
*5
H'0000 0000 Held
Held
Held
Pclk
INTC
INTREQ00 H'FE08 0020 H'1E08 0020 32
*5
H'0000 0000 Held
Held
Held
Pclk
INTC
INTMSK00 H'FE08 0040 H'1E08 0040 32
*5
H'0000 0300 Held
Held
Held
Pclk
INTC
INTMSKCL H'FE08 0060 H'1E08 0060 32
5
R00*
Write-only
6
CPG*
CLKSTP00 H'FE0A 0000 H'1E0A 0000 32
*5
H'0000 0000 Held
6
CPG*
CLKSTPC H'FE0A 0008 H'1E0A 0008 32
5
LR00*
Write-only
TMU
5
TSTR2*
H'FE10 0004 H'1E10 0004 8
H'00
Held
Held
Held
Pclk
H'FE10 0008 H'1E10 0008 32
H'FFFF FFFF Held
Held
Held
Pclk
H'FE10 000C H'1E10 000C 32
H'FFFF FFFF Held
Held
Held
Pclk
H'FE10 0010 H'1E10 0010 16
H'0000
Held
Held
Held
Pclk
H'FE10 0014 H'1E10 0014 32
H'FFFF FFFF Held
Held
Held
Pclk
5
TMU
TCOR3*
TMU
5
TCNT3*
TMU
TCR3*
5
5
16
2
Pclk
Held
Held
Pclk
Pclk
TMU
TCOR4*
TMU
5
TCNT4*
H'FE10 0018 H'1E10 0018 32
H'FFFF FFFF Held
Held
Held
Pclk
TMU
5
TCR4*
H'FE10 001C H'1E10 001C 16
H'0000
Held
Held
Pclk
Rev. 6.0, 07/02, page 940 of 986
Held
Table A.1
Address List (cont)
Module Register
Area 7
1
P4 Address Address*
TMU
H'FFD8 0000 H'1FD8 0000 8
TOCR
Power-On
Size Reset
H'00
Manual
Reset
Synchronization
Sleep Standby Clock
H'00
Held
Held
Held
2
H'00*
Pclk
TMU
TSTR
H'FFD8 0004 H'1FD8 0004 8
H'00
TMU
TCOR0
H'FFD8 0008 H'1FD8 0008 32
H'FFFF FFFF H'FFFF FFFF Held
Held
Pclk
TMU
TCNT0
H'FFD8 000C H'1FD8 000C 32
H'FFFF FFFF H'FFFF FFFF Held
Held
Pclk
TMU
TCR0
H'FFD8 0010 H'1FD8 0010 16
H'0000
Held
Held
Pclk
TMU
TCOR1
H'FFD8 0014 H'1FD8 0014 32
H'FFFF FFFF H'FFFF FFFF Held
Held
Pclk
TMU
TCNT1
H'FFD8 0018 H'1FD8 0018 32
H'FFFF FFFF H'FFFF FFFF Held
Held
Pclk
TMU
TCR1
H'FFD8 001C H'1FD8 001C 16
H'0000
Held
Held
Pclk
TMU
TCOR2
H'FFD8 0020 H'1FD8 0020 32
H'FFFF FFFF H'FFFF FFFF Held
Held
Pclk
TMU
TCNT2
H'FFD8 0024 H'1FD8 0024 32
H'FFFF FFFF H'FFFF FFFF Held
Held
Pclk
TMU
TCR2
H'FFD8 0028 H'1FD8 0028 16
H'0000
H'0000
Held
Held
Pclk
TMU
TCPR2
H'FFD8 002C H'1FD8 002C 32
Held
Held
Held
Held
Pclk
SCI
SCSMR1
H'FFE0 0000 H'1FE0 0000 8
H'00
H'00
Held
H'00
Pclk
SCI
SCBRR1
H'FFE0 0004 H'1FE0 0004 8
H'FF
H'FF
Held
H'FF
Pclk
SCI
SCSCR1
H'FFE0 0008 H'1FE0 0008 8
H'00
H'00
Held
H'00
Pclk
SCI
SCTDR1
H'FFE0 000C H'1FE0 000C 8
H'FF
H'FF
Held
H'FF
Pclk
SCI
SCSSR1
H'FFE0 0010 H'1FE0 0010 8
H'84
H'84
Held
H'84
Pclk
SCI
SCRDR1
H'FFE0 0014 H'1FE0 0014 8
H'00
H'00
Held
H'00
Pclk
SCI
SCSCMR1 H'FFE0 0018 H'1FE0 0018 8
H'00
H'00
Held
H'00
Pclk
SCI
SCSPTR1 H'FFE0 001C H'1FE0 001C 8
2
H'00*
2
H'00*
Held
2
H'00*
Pclk
SCIF
SCSMR2
H'FFE8 0000 H'1FE8 0000 16
H'0000
H'0000
Held
Held
Pclk
SCIF
SCBRR2
H'FFE8 0004 H'1FE8 0004 8
H'FF
H'FF
Held
Held
Pclk
SCIF
SCSCR2
H'FFE8 0008 H'1FE8 0008 16
H'0000
H'0000
Held
Held
Pclk
SCIF
SCFTDR2 H'FFE8 000C H'1FE8 000C 8
Undefined
Undefined
Held
Held
Pclk
SCIF
SCFSR2
H'0060
H'0060
Held
Held
Pclk
SCIF
SCFRDR2 H'FFE8 0014 H'1FE8 0014 8
Undefined
Undefined
Held
Held
Pclk
SCIF
SCFCR2
H'FFE8 0018 H'1FE8 0018 16
H'0000
H'0000
Held
Held
Pclk
SCIF
SCFDR2
H'FFE8 001C H'1FE8 001C 16
H'0000
H'0000
Held
Held
Pclk
2
H'0000*
Held
Held
Pclk
H'0000
Held
Held
Pclk
H'FFE8 0010 H'1FE8 0010 16
SCIF
SCSPTR2 H'FFE8 0020 H'1FE8 0020 16
2
H'0000*
SCIF
SCLSR2
H'0000
H'FFE8 0024 H'1FE8 0024 16
H'00
Pclk
H'0000
H'0000
Rev. 6.0, 07/02, page 941 of 986
Table A.1
Address List (cont)
Synchronization
Sleep Standby Clock
Module Register
H-UDI
H'FFF0 0000 H'1FF0 0000 16
H'FFFF*
2
Held
Held
Held
Pclk
SDIR
Power-On
Size Reset
Manual
Reset
Area 7
1
P4 Address Address*
H-UDI
SDDR
H'FFF0 0008 H'1FF0 0008 32
Undefined
Held
Held
Held
Pclk
H-UDI
5
SDINT*
H'FFF0 0014 H'1FF0 0014 16
H'0000
Held
Held
Held
Pclk
Notes: *1 With control registers, the above addresses in the physical page number field can be
accessed by means of a TLB setting. When these addresses are referenced directly
without using the TLB, operations are limited.
*2 Includes undefined bits. See the descriptions of the individual modules.
*3 Use word-size access when writing. Perform the write with the upper byte set to H'5A or
H'A5, respectively. Byte- and longword-size writes cannot be used.
Use byte-size access when reading.
*4 SH7750S, SH7750R only
*5 SH7750R only
*6 Includes power-down states
Rev. 6.0, 07/02, page 942 of 986
Appendix B Package Dimensions
Unit: mm
27.0
27.0
A
B
0.20 (× 4)
C
0.635
W
2.1
0.6 ± 0.1
0.35 C
0.20 C
1.27
Y
A
1.27
0.635
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
2 4 6 8 10 12 14 16 18 20
1 3 5 7 9 11 13 15 17 19
256 × φ0.75 ± 0.15
0.30 M C A B
0.10 M C
Details of the part A
Hitachi Code
JEDEC
JEITA
Mass (reference value)
BP-256
Conforms
—
3.0 g
Figure B.1 Package Dimensions (256-Pin BGA) (SH7750 and SH7750S)
Rev. 6.0, 07/02, page 943 of 986
Unit: mm
27.0
A
B
0.20 (× 4)
27.0
C
0.635
W
2.1
0.6 ± 0.1
0.35 C
0.20 C
1.27
Y
A
1.27
0.635
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
2 4 6 8 10 12 14 16 18 20
1 3 5 7 9 11 13 15 17 19
256 × φ0.75 ± 0.15
0.30 M C A B
0.10 M C
Details of the part A
Hitachi Code
JEDEC
JEITA
Mass (reference value)
BP-256A
Conforms
—
3.0 g
Figure B.2 Package Dimensions (256-Pin BGA) (SH7750R Only)
Rev. 6.0, 07/02, page 944 of 986
Unit: mm
30.6 ± 0.2
28
105
156
157
53
52
0.10 M
0.10
*Dimension including the plating thickness
Base material dimension
3.20
0.20 ± 0.04
0.15 +0.10
–0.15
1 *0.22 ± 0.05
*0.17 ± 0.05
0.15 ± 0.04
208
3.56 Max
0.5
30.6 ± 0.2
104
1.3
1.25
0˚ – 8˚
0.5 ± 0.1
Hitachi Code
JEDEC
JEITA
Mass (reference value)
FP-208E
—
Conforms
5.3 g
Figure B.3 Package Dimensions (208-Pin QFP)
Rev. 6.0, 07/02, page 945 of 986
0.20 C B
Unit: mm
15.00
0.80
0.20 C A
16 14 12 10 8 6 4 2
17 15 13 11 9 7 5 3 1
A
C
E
B
15.00
G
J
L
N
R
1.10
U
4×
A
0.15
1.10
0.2 C
1.40Max
Hitachi Code
JEDEC
JEITA
Mass (reference value)
Figure B.4 Package Dimensions (264-Pin CSP)
Rev. 6.0, 07/02, page 946 of 986
264 × φ0.50 ± 0.05
φ0.08 M C A B
C
0.40 ± 0.05
0.10 C
0.80
BP-264
–
–
0.6 g
B
D
F
H
K
M
P
T
Appendix C Mode Pin Settings
The MD8–MD0 pin values are input in the event of a power-on reset via the 5(6(7 or
SCK2/05(6(7 pin.
(1) Clock Modes
• Clock Operating Modes (SH7750, SH7750S)
External
Pin Combination
Clock
Operating
Mode
MD2
MD1
0
0
0
1
1
2
3
4
1
0
5
Frequency
(vs. Input Clock)
MD0
1/2
Frequency
Divider
PLL2
CPU
Clock
Bus
Clock
Peripheral
Module
Clock
PLL1
FRQCR
Initial Value
0
Off
On
On
6
3/2
3/2
H'0E1A
1
0
Off
On
On
6
1
1
H'0E23
On
On
On
3
1
1/2
H'0E13
1
Off
On
On
6
2
1
H'0E13
0
On
On
On
3
3/2
3/4
H'0E0A
1
Off
On
On
6
3
3/2
H'0E0A
Notes: 1. Turning on/off of the ½ frequency divider is solely determined by the clock operating
mode.
2. For the ranges of input clock frequency, see the descriptions of the EXTAL clock input
frequency (fEX) and CKIO clock output (fOP) in section 22.3.1, Clock and Control Signal
Timing.
• Clock Operating Modes (SH7750R)
External
Pin Combination
Clock
Operating
Mode
MD2
MD1
0
0
0
1
1
2
3
4
1
0
5
6
1
MD0
Frequency
(vs. Input Clock)
PLL1
PLL2
CPU
Clock
Bus
Clock
Peripheral
Module Clock
FRQCR
Initial Value
0
On (×12)
On
12
3
3
H'0E1A
1
On (×12)
On
12
3/2
3/2
H'0E2C
0
On (×6)
On
6
2
1
H'0E13
1
On (×12)
On
12
4
2
H'0E13
0
On (×6)
On
6
3
3/2
H'0E0A
1
On (×12)
On
12
6
3
H'0E0A
0
Off (×6)
Off
1
1/2
1/2
H'0808
Notes: 1. The multiplication factor of PLL 1 is solely determined by the clock operating mode.
2. For the ranges of input clock frequency, see the descriptions of the EXTAL clock input
frequency (fEX) and CKIO clock output (fOP) in section 22.3.1, Clock and Control Signal
Timing.
Rev. 6.0, 07/02, page 947 of 986
(2) Area 0 Bus Width
Pin Value
MD6
MD4
MD3
Bus Width
Memory Type
0
0
0
64 bits
MPX interface
1
8 bits
Reserved (setting prohibited)
0
16 bits
Reserved
1
32 bits
MPX interface
0
64 bits
SRAM interface
1
8 bits
SRAM interface
0
16 bits
SRAM interface
1
32 bits
SRAM interface
1
1
0
1
(3) Endian
Pin Value
MD5
Endian
0
Big endian
1
Little endian
(4) Master/Slave
Pin Value
MD7
Master/Slave
0
Slave
1
Master
(5) Clock Input
Pin Value
MD8
Clock Input
0
External input clock
1
Crystal resonator
Rev. 6.0, 07/02, page 948 of 986
Appendix D &.,25(1% Pin Configuration
SH7750 Series
VDDQ
rd_pullup_control
/
rd_dt_
rd_hiz_control
/
VDDQ
VDDQ
rdwr_pullup_control
rdwr_dt_
RD/
rdwr_hiz_control
VDDQ
RD/
Bus clock
PLL2
CKIO
ckio_hiz_control
CKIO2
VDDQ
VSSQ
Figure D.1 &.,25(1% Pin Configuration
Rev. 6.0, 07/02, page 949 of 986
&.,25(1%
Description
0
5'5, RD/:55, and CKIO2 have the same pin states as 5', RD/:5, and
CKIO, respectively
1
5'5, RD/:55, and CKIO2 are in the high-impedance state
Note: CKIO is fed back to PLL2 to coordinate the external clock and internal clock phases.
However, CKIO2 is not fed back.
Rev. 6.0, 07/02, page 950 of 986
Appendix E Pin Functions
E.1
Pin States
Table E.1
Pin States in Reset, Power-Down State, and Bus-Released State
Reset
(Power-On)
Signal Name
D0–D7
D8–D15
D16–D23
D24–D31
I/O
I/O
I/O
I/O
I/O
Master Slave
Z*
15
Z*
15
Z*
15
Z*
15
D32–D51
I/O
Z*
15
D52–D55
I/O
Z*
15
Z*
15
Z*
16
16
D56–D63
A0, A1, A18–A25
I/O
O
A2–A17
O
Z*
5(6(7
I
I
%$&./%65(4
O
H
%5(4/%6$&.
%6
CKE
&69–&63
5$6
5'/&$66
I
O
O
O
O
O
I*
Z*
Z*
15
Z*
15
Z*
15
Z*
15
ZK *
Z*
15
Z*
15
Z*
15
Z*
15
Z*
16
14
Z* O*
17
Z*
16
14
9
I*
Z*
16
H
H
16
Z*
H
16
Z*
H
16
Z*
O
H
5'<
I
16
PI*
16
PI*
:(9/&$69/DQM6
:(8/&$68/DQM5
:(7/&$67/DQM4
:(6/&$66/DQM3
O
O
O
O
H
H
H
H
H
Z*
15
Z*
15
Z*
15
Z*
16
Z*
16
Z*
16
Z*
16
Z*
16
15
Z* O*
I*
Z*
15
Z*
15
Z*
15
Z*
15
ZK *
6
15
Z*
15
Z*
15
Z*
15
Z
Z*
15
Z
Z*
15
Z
15
Z
15
Z
Z*
15
Z*
15
Z
Z*
14
Z
Z*
14
Z
Z*
Z* O*
Z*
14
14
7
Z* O*
I
I
H
I*
O
13
14
Z* H*
I*
7
Z
13
Z*
I
14
Z
6
Z
L
O*
H
14
7
Z* H*
14
Z*
Z
6
O*
14
Z*
14
5
Z* O*
14
5
Z* O*
Z
6
O*
14
Z*
14
5
Z* O*
14
5
Z* O*
Z
H
14
Z*
14
7
Z* H*
14
Z*
Z
I*
O*
6
O*
6
O*
6
O*
6
O*
6
I*
13
I*
13
I*
13
I
Z*
14
14
Z* O*
5
14
Z* O*
5
Z
Z*
14
14
Z* O*
5
14
Z* O*
5
Z
Z*
14
14
Z* O*
5
14
Z* O*
5
Z
Z*
14
14
Z* O*
5
14
Z* O*
5
Z
Z*
14
14
5
14
5
Z
Z* O*
Output
state held
when used
as port
I
14
Z*
13
O*
Z*
Z*
7
6
Z
15
15
14
14
15
Z*
14
I*
Z*
Z* K
Z* K
Z*
13
Hardware
Standby Notes
15
15
Z*
H
Z*
15
H
13
15
Bus
Standby Released
Z*
I
O*
H
RD/:5
O
15
H
16
16
Z*
:(:/&$6:/DQM7
Z*
I
H
H
Master Slave
15
I
16
Reset
(Manual)
Z* O*
Rev. 6.0, 07/02, page 951 of 986
Table E.1
Pin States in Reset, Power-Down State, and Bus-Released State (cont)
Reset
(Power-On)
Signal Name
:(5/&$65/DQM2
:(4/&$64/DQM1
:(3/&$63/DQM0
DACK1–DACK0
I/O
Master Slave
Bus
Standby Released
Z*
16
6
O*
14
5
Z* O*
Z*
16
O*
6
Z*
16
O*
6
Master Slave
O
H
O
H
O
H
O
L
Reset
(Manual)
L
L
14
Z*
14
14
Z* O*
5
14
Z* O*
5
Z
Z*
14
14
Z* O*
5
14
Z* O*
5
Z
12
Z* O*
8
12
12
8
L
I*
I*
16
MD6/,2,649
I
I*
16
I*
16
I*
MD5/5$65
1
16
I/O* I*
I*
16
13
6
13
Z* O* Z*
I*
16
I*
16
MD7/TXD
MD4/&(5%
MD3/&(5$
I/O
I/O*
2
I/O*
3
I*
16
I*
16
Z*
12
Z* H
13
Z* H
O
O
O
ZO*
STATUS1–
STATUS0
O
O
O
O
,5/6–,5/3
I
16
PI*
16
PI*
I*
13
I
PI*
16
PI*
16
I*
13
PI*
16
PI*
16
I*
12
'5(44–'5(43
I
I*
13
CKIO
NMI
Z*
13
11
Z
Z*
16
12
Z* O*
13
I*
O*
12
Z* O
13
I*
13
5
Z* O*
Z*
13
13
Z* H*
7
Z*
13
13
7
ZO*
14
5
Z* O*
Hardware
Standby Notes
Z* H*
11
O
ZO*
13
5
Z* O*
11
13
I*
13
I*
12
Z*
13
Z*
13
ZO*
O
I*
13
11
13
I*
13
I*
12
DMAC
Z
SCI
I
PCMCIA
(I/O)
Z
DRAM2
Z
PCMCIA
Z
PCMCIA
Z
Z*
O
I*
Z
18
I*
13
I
INTC
I*
13
I
INTC
I*
12
I
DMAC
O
L
L
L
L
12
8
Z* O*
Z
DMAC
I/O
16
I*
16
I*
12
I*
12
I*
12
12
8
12
I* Z* O* I* O
Z
SCI
I
16
PI*
16
PI*
12
I*
12
I*
12
I*
12
I*
I
SCI
SCK2/05(6(7
I
16
PI*
16
PI*
12
I*
12
I*
12
I*
12
I*
MD1/TXD2
I/O
I*
16
I*
16
Z*
12
8
Z* O*
Z* O
MD2/RXD2
I
I*
16
I*
16
I*
12
I*
12
I*
12
I*
12
DRAK1–DRAK0
MD0/SCK
RXD
&765
MD8/5765
I/O
PI*
I/O
16
I*
TCLK
I/O
PI*
TDO
O
O
TMS
I
TCK
I
TDI
I
7567
CKIO2*
I
10
O
16
PI*
I*
16
16
16
PI*
16
O
PI*
16
PI*
16
PI*
16
PI*
16
O
Rev. 6.0, 07/02, page 952 of 986
Z*
O
PI*
16
PI*
16
PI*
16
PI*
16
O
12
12
I*
12
I*
12
I*
12
I*
12
I*
I*
I*
16
I*
16
I*
16
ZO*
11
I*
16
I*
16
I*
16
I*
16
ZO*
I
SCIF
Z
SCIF
12
12
12
I*
I
SCIF
12
12
8
12
Z
SCIF
12
12
8
12
Z
SCIF
12
I* Z* O* I* O
I* Z* O* I* O
12
O
16
12
O*
11
I* O
I* O
Z
TMU
O
O
I*
16
I*
16
I*
16
I*
16
ZO*
11
Z
H-UDI
I*
16
I
H-UDI
I*
16
I
H-UDI
I*
16
I
H-UDI
I*
16
I
H-UDI
ZO*
11
Z
Table E.1
Pin States in Reset, Power-Down State, and Bus-Released State (cont)
Reset
(Power-On)
Signal Name
5'5*
10
I/O
O
10
Master Slave
H
Z*
16
16
Reset
(Manual)
Master Slave
Bus
Standby Released
Hardware
Standby Notes
6
O*
14
5
Z* O*
Z
Z*
14
H
Z*
14
14
H
Z*
&.,25(1%
I
I
I
I
I
I
I
I
CA
I
I
I
I
I
I
I
I
Notes: I:
O:
H:
L:
Z:
K:
Z*
14
O
RD/:55*
Z* H*
7
14
5
Z* O*
Z
Input
Output
High-level output
Low-level output
High-impedance
Output state held
Output when area 2 DRAM is used.
Output when area 5 PCMCIA is used.
Output when area 6 PCMCIA is used.
Depends on refresh and DMAC operations.
Z (I) or O (refresh), depending on register setting (BCR1.HIZCNT).
Depends on refresh operation.
Z (I) or H (state held), depending on register setting (BCR1.HIZMEM).
Z or O, depending on register setting (STBCR.PHZ).
Output when refreshing is set.
Operation in respective state when &.,25(1% = 0; Z when &.,25(1% = 1.
Z or O, depending on register setting (FRQCR.CKOEN).
Pulled up or not pulled up, depending on register setting (STBCR.PPU).
Pulled up or not pulled up, depending on register setting (BCR1.IPUP).
Pulled up or not pulled up, depending on register setting (BCR1.OPUP).
Not pulled up.
Pulled up with a built-in pull-up resistance. However, cannot be used for MD pin pullup in a power-on reset. Pull up or down outside the SH-4.
*17 Output when refreshing is set (SH7750R only).
*18 Z or O, depending on register setting (STBCR2.STHZ) (SH7750R only).
*1
*2
*3
*4
*5
*6
*7
*8
*9
*10
*11
*12
*13
*14
*15
*16
Rev. 6.0, 07/02, page 953 of 986
E.2
Handling of Unused Pins
• When RTC is not used
EXTAL2: Pull up to 3.3 V
Leave unconnected
XTAL2:
VDD-RTC: Power supply (3.3 V)
VSS-RTC: Power supply (0 V)
• When PLL1 is not used
VDD-PLL1: Power supply (3.3 V)
VSS-PLL1: Power supply (0 V)
• When PLL2 is not used
VDD-PLL2: Power supply (3.3 V)
VSS-PLL2: Power supply (0 V)
• When on-chip crystal oscillator is not used
Leave unconnected
XTAL:
VDD-CPG: Power supply (3.3 V)
VSS-CPG: Power supply (0 V)
Rev. 6.0, 07/02, page 954 of 986
Appendix F Synchronous DRAM Address
Multiplexing Tables
(1)
BUS 64
AMX 0
(16M: 512k × 16b × 2) × 4 *
AMXEXT 0
16M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
8MB
Synchronous DRAM
Address Pins
Function
A14
A22
A22
A11
BANK selects bank address
A13
A21
H/L
A10
Address precharge setting
A12
A20
0
A9
Address
A11
A19
0
A8
A10
A18
A10
A7
A9
A17
A9
A6
A8
A16
A8
A5
A7
A15
A7
A4
A6
A14
A6
A3
A5
A13
A5
A2
A4
A12
A4
A1
A3
A11
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 955 of 986
(2)
BUS 32
AMX 0
(16M: 512k × 16b × 2) × 2 *
AMXEXT 0
16M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
4MB
Synchronous DRAM
Address Pins
Function
A14
A13
A21
A21
A11
BANK selects bank address
A12
A20
H/L
A10
Address precharge setting
A11
A19
0
A9
Address
A10
A18
0
A8
A9
A17
A9
A7
A8
A16
A8
A6
A7
A15
A7
A5
A6
A14
A6
A4
A5
A13
A5
A3
A4
A12
A4
A2
A3
A11
A3
A1
A2
A10
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 956 of 986
(3)
BUS 64
AMX 0
(16M: 512k × 16b × 2) × 4 *
AMXEXT 1
16M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
8MB
Synchronous DRAM
Address Pins
Function
A14
A21
A21
A11
BANK selects bank address
A13
A22
H/L
A10
Address precharge setting
A12
A20
0
A9
Address
A11
A19
0
A8
A10
A18
A10
A7
A9
A17
A9
A6
A8
A16
A8
A5
A7
A15
A7
A4
A6
A14
A6
A3
A5
A13
A5
A2
A4
A12
A4
A1
A3
A11
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 957 of 986
(4)
BUS 32
AMX 0
(16M: 512k × 16b × 2) × 2 *
AMXEXT 1
16M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
4MB
Synchronous DRAM
Address Pins
Function
A14
A13
A20
A20
A11
BANK selects bank address
A12
A21
H/L
A10
Address precharge setting
A11
A19
0
A9
Address
A10
A18
0
A8
A9
A17
A9
A7
A8
A16
A8
A6
A7
A15
A7
A5
A6
A14
A6
A4
A5
A13
A5
A3
A4
A12
A4
A2
A3
A11
A3
A1
A2
A10
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 958 of 986
(5)
BUS 64
AMX 1
(16M: 1M × 8b × 2) × 8 *
AMXEXT 0
16M, column-addr-9bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
16MB
Synchronous DRAM
Address Pins
Function
A14
A23
A23
A11
BANK selects bank address
A13
A22
H/L
A10
Address precharge setting
A12
A21
0
A9
Address
A11
A20
A11
A8
A10
A19
A10
A7
A9
A18
A9
A6
A8
A17
A8
A5
A7
A16
A7
A4
A6
A15
A6
A3
A5
A14
A5
A2
A4
A13
A4
A1
A3
A12
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 959 of 986
(6)
BUS 32
AMX 1
(16M: 1M × 8b × 2) × 4 *
AMXEXT 0
16M, column-addr-9bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
8MB
Synchronous DRAM
Address Pins
Function
A14
A13
A22
A22
A11
BANK selects bank address
A12
A21
H/L
A10
Address precharge setting
A11
A20
0
A9
Address
A10
A19
A10
A8
A9
A18
A9
A7
A8
A17
A8
A6
A7
A16
A7
A5
A6
A15
A6
A4
A5
A14
A5
A3
A4
A13
A4
A2
A3
A12
A3
A1
A2
A11
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 960 of 986
(7)
BUS 64
AMX 1
(16M: 1M × 8b × 2) × 8 *
AMXEXT 1
16M, column-addr-9bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
16MB
Synchronous DRAM
Address Pins
Function
A14
A22
A22
A11
BANK selects bank address
A13
A23
H/L
A10
Address precharge setting
A12
A21
0
A9
Address
A11
A20
A11
A8
A10
A19
A10
A7
A9
A18
A9
A6
A8
A17
A8
A5
A7
A16
A7
A4
A6
A15
A6
A3
A5
A14
A5
A2
A4
A13
A4
A1
A3
A12
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 961 of 986
(8)
BUS 32
AMX 1
(16M: 1M × 8b × 2) × 4 *
AMXEXT 1
16M, column-addr-9bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
8MB
Synchronous DRAM
Address Pins
Function
A14
A13
A21
A21
A11
BANK selects bank address
A12
A22
H/L
A10
Address precharge setting
A11
A20
0
A9
Address
A10
A19
A10
A8
A9
A18
A9
A7
A8
A17
A8
A6
A7
A16
A7
A5
A6
A15
A6
A4
A5
A14
A5
A3
A4
A13
A4
A2
A3
A12
A3
A1
A2
A11
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 962 of 986
(9)
BUS 64
AMX 2
(64M: 1M × 16b × 4) × 4 *
64M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
32MB
Synchronous DRAM
Address Pins
A16
A24
A24
A13
A15
A23
A23
A12
A14
A22
0
A11
A13
A21
H/L
A10
A12
A20
0
A9
A11
A19
0
A8
A10
A18
A10
A7
A9
A17
A9
A6
A8
A16
A8
A5
A7
A15
A7
A4
A6
A14
A6
A3
A5
A13
A5
A2
A4
A12
A4
A1
A3
A11
A3
A0
A2
Not used
A1
Not used
A0
Not used
Function
BANK selects bank address
Address precharge setting
Address
Rev. 6.0, 07/02, page 963 of 986
(10)
BUS 32
AMX 2
(64M: 1M × 16b × 4) × 2 *
64M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
16MB
Synchronous DRAM
Address Pins
Function
A16
A15
A23
A23
A13
A14
A22
A22
A12
A13
A21
0
A11
A12
A20
H/L
A10
A11
A19
0
A9
A10
A18
0
A8
A9
A17
A9
A7
A8
A16
A8
A6
A7
A15
A7
A5
A6
A14
A6
A4
A5
A13
A5
A3
A4
A12
A4
A2
A3
A11
A3
A1
A2
A10
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 964 of 986
BANK selects bank address
Address precharge setting
Address
(11)
BUS 64
(64M: 2M × 8b × 4) × 8 *
(128M: 2M × 16b × 4) × 4
64M, column-addr-9bit
AMX 3
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
64MB
Synchronous DRAM
Address Pins
A16
A25
A25
A13
A15
A24
A24
A12
A14
A23
0
A11
A13
A22
H/L
A10
A12
A21
0
A9
A11
A20
A11
A8
A10
A19
A10
A7
A9
A18
A9
A6
A8
A17
A8
A5
A7
A16
A7
A4
A6
A15
A6
A3
A5
A14
A5
A2
A4
A13
A4
A1
A3
A12
A3
A0
A2
Not used
A1
Not used
A0
Not used
Function
BANK selects bank address
Address precharge setting
Address
Rev. 6.0, 07/02, page 965 of 986
(12)
BUS 32
(64M: 2M × 8b × 4) × 4 *
(128M: 2M × 16b × 4) × 2
64M, column-addr-9bit
AMX 3
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
32MB
Synchronous DRAM
Address Pins
Function
A16
A15
A24
A24
A13
A14
A23
A23
A12
A13
A22
0
A11
A12
A21
H/L
A10
A11
A20
0
A9
A10
A19
A10
A8
A9
A18
A9
A7
A8
A17
A8
A6
A7
A16
A7
A5
A6
A15
A6
A4
A5
A14
A5
A3
A4
A13
A4
A2
A3
A12
A3
A1
A2
A11
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 966 of 986
BANK selects bank address
Address precharge setting
Address
(13)
BUS 64
AMX 4
(64M: 512k × 32b × 4) × 2 *
64M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
16MB
Synchronous DRAM
Address Pins
Function
BANK selects bank address
A15
A23
A23
A12
A14
A22
A22
A11
A13
A21
H/L
A10
Address precharge setting
A12
A20
0
A9
Address
A11
A19
0
A8
A10
A18
A10
A7
A9
A17
A9
A6
A8
A16
A8
A5
A7
A15
A7
A4
A6
A14
A6
A3
A5
A13
A5
A2
A4
A12
A4
A1
A3
A11
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 967 of 986
(14)
BUS 32
AMX 4
(64M: 512k × 32b × 4) × 1 *
64M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
8MB
Synchronous DRAM
Address Pins
Function
A15
BANK selects bank address
A14
A22
A22
A12
A13
A21
A21
A11
A12
A20
H/L
A10
Address precharge setting
A11
A19
0
A9
Address
A10
A18
0
A8
A9
A17
A9
A7
A8
A16
A8
A6
A7
A15
A7
A5
A6
A14
A6
A4
A5
A13
A5
A3
A4
A12
A4
A2
A3
A11
A3
A1
A2
A10
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 968 of 986
(15)
BUS 64
AMX 5
(64M: 1M × 32b × 2) × 2 *
64M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
16MB
Synchronous DRAM
Address Pins
Function
A15
A23
A23
A12
BANK selects bank address
A14
A22
0
A11
A13
A21
H/L
A10
Address precharge setting
A12
A20
0
A9
Address
A11
A19
0
A8
A10
A18
A10
A7
A9
A17
A9
A6
A8
A16
A8
A5
A7
A15
A7
A4
A6
A14
A6
A3
A5
A13
A5
A2
A4
A12
A4
A1
A3
A11
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 969 of 986
(16)
BUS 32
AMX 5
(64M: 1M × 32b × 2) × 1 *
64M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
8MB
Synchronous DRAM
Address Pins
Function
A15
A14
A22
A22
A12
A13
A21
0
A11
A12
A20
H/L
A10
Address precharge setting
A11
A19
0
A9
Address
A10
A18
0
A8
A9
A17
A9
A7
A8
A16
A8
A6
A7
A15
A7
A5
A6
A14
A6
A4
A5
A13
A5
A3
A4
A12
A4
A2
A3
A11
A3
A1
A2
A10
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 970 of 986
BANK selects bank address
(17)
BUS 64
(128M: 4M × 8b × 4) × 8 (SH7750R only)
AMX 6
128M, column-addr-10bit
128MB
AMXEXT0
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
Synchronous DRAM
Address Pins
Function
BANK selects bank address
A16
A26
A26
A13
A15
A25
A25
A12
A14
A24
0
A11
A13
A23
H/L
A10
Address precharge setting
A12
A22
A12
A9
Address
A11
A21
A11
A8
A10
A20
A10
A7
A9
A19
A9
A6
A8
A18
A8
A5
A7
A17
A7
A4
A6
A16
A6
A3
A5
A15
A5
A2
A4
A14
A4
A1
A3
A13
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 971 of 986
(18)
BUS 64
(256M: 4M × 16b × 4) × 4 (SH7750R only) *
AMX 6
256M, column-addr-9bit
128MB
AMXEXT1
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
Synchronous DRAM
Address Pins
Function
BANK selects bank address
A17
A26
A26
A14
A16
A25
A25
A13
A15
A24
0
A12
A14
A23
0
A11
A13
A22
H/L
A10
Address precharge setting
A12
A21
0
A9
Address
A11
A20
A11
A8
A10
A19
A10
A7
A9
A18
A9
A6
A8
A17
A8
A5
A7
A16
A7
A4
A6
A15
A6
A3
A5
A14
A5
A2
A4
A13
A4
A1
A3
A12
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 972 of 986
(19)
BUS 32
(128M: 4M × 8b × 4) × 4 (SH7750S and SH7750R only) *
AMX 6
column-addr-10bit
64MB
AMXEXT 0
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
Synchronous DRAM
Address Pins
Function
A15
A25
A25
A13
A14
A24
A24
A12
BANK selects bank address
A13
A23
0
A11
Address precharge setting
A12
A22
H/L
A10
Address
A11
A21
A11
A9
A10
A20
A10
A8
A9
A19
A9
A7
A8
A18
A8
A6
A7
A17
A7
A5
A6
A16
A6
A4
A5
A15
A5
A3
A4
A14
A4
A2
A3
A13
A3
A1
A2
A12
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 973 of 986
(20)
BUS 32
(256M: 4M × 16b × 4) × 2 (SH7750S and SH7750R only) *
AMX 6
256M, column-addr-9bit
64MB
AMXEXT 1
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
Synchronous DRAM
Address Pins
Function
A16
A25
A25
A14
A15
A24
A24
A13
A14
A23
0
A12
A13
A22
0
A11
A12
A21
H/L
A10
Address precharge setting
A11
A20
0
A9
Address
A10
A19
A10
A8
A9
A18
A9
A7
A8
A17
A8
A6
A7
A16
A7
A5
A6
A15
A6
A4
A5
A14
A5
A3
A4
A13
A4
A2
A3
A12
A3
A1
A2
A11
A2
A0
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 974 of 986
BANK selects bank address
(21)
BUS 64
AMX 7
(16M: 256k × 32b × 2) × 2 *
16M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
4MB
Synchronous DRAM
Address Pins
Function
A13
A21
A21
A10
BANK selects bank address
A12
A20
H/L
A9
Address precharge setting
A11
A19
0
A8
Address
A10
A18
A10
A7
A9
A17
A9
A6
A8
A16
A8
A5
A7
A15
A7
A4
A6
A14
A6
A3
A5
A13
A5
A2
A4
A12
A4
A1
A3
A11
A3
A0
A2
Not used
A1
Not used
A0
Not used
Rev. 6.0, 07/02, page 975 of 986
(22)
BUS 32
AMX 7
(16M: 256k × 32b × 2) × 1 *
16M, column-addr-8bit
SH7750 Series Address Pins
RAS Cycle
CAS Cycle
2MB
Synchronous DRAM
Address Pins
Function
A13
A12
A20
A20
A10
BANK selects bank address
A11
A19
H/L
A9
Address precharge setting
A10
A18
0
A8
Address
A9
A17
A9
A7
A8
A16
A8
A6
A7
A15
A7
A5
A6
A14
A6
A4
A5
A13
A5
A3
A4
A12
A4
A2
A3
A11
A3
A1
A2
A10
A2
A0
A1
Not used
A0
Not used
Note: * Example of a synchronous DRAM configuration
Rev. 6.0, 07/02, page 976 of 986
Appendix G Prefetching of Instructions and its Side Effects
The SH7750 series incorporates an on-chip buffer for holding instructions that have been read
ahead of their execution (prefetching of instructions). Therefore, do not allocate programs to
memory in such a way that instructions are in the last 20 bytes of any memory space. If a program
is allocated in such a way, the prefetching of instructions may lead to a bus access for reading an
instruction from beyond the memory space. The following shows a case in which such bus access
is a problem.
Address
Area 0
Area 1
H'03FFFFF8
H'03FFFFFA
H'03FFFFFC
H'03FFFFFE
H'04000000
H'04000002
.
.
.
.
.
.
ADD R1,R4
JMP @R2
NOP
NOP
PC (Program counter)
Address of instruction for prefetching
Figure G.1 Instruction Prefetch
Figure G.1 depicts a case in which the instruction (ADD) indicated by the program counter and the
instruction at the address H’04000002 are fetched simultaneously. The program is assumed to
branch to a region other than area 1 after the subsequent JMP instruction and delay slot instruction
have been executed.
In this case, a bus access to area 1 (instruction prefetch), which is not visible in the program flow,
may occur.
1. Side effects of the prefetching of instructions
a. An external bus access caused by an instruction prefetch may cause malfunctions in
external devices, such as FIFOs, that are connected to the region accessed.
b. If no device responds to an external bus request that is triggered by an instruction prefetch,
execution may hang.
2. Methods of preventing the invalid prefetching of instructions
a. Use an MMU.
b. Do not allocate programs so that they run into the last 20-byte region of any memory space.
Rev. 6.0, 07/02, page 977 of 986
Appendix H Power-On and Power-Off Procedures
• Power-on
1
Supply the internal power after supplying power to the I/O, PLL, RTC, and CPG.*
Supply power to VDDQ, VDD-PLL1/2, VDD-RTC, and VDD-CPG simultaneously.
At power-on, the 5(6(7 signal is low. Normally, supply power to the I/O, RTC, and CPG
before (or at the same time as) entering the signal lines (5(6(7, SCK2, MD0 to MD10,
and external clock). If the signal lines are entered first, the LSI may be damaged.
Input high level to SCK2 (05(6(7) in compliance with the voltage level of the I/O, PLL,
RTC, CPG power supply voltage.
• Power-off
When turning off the power, there are no restrictions for the timing of 5(6(7 and SCK2.
1
Turn off the I/O, PLL, RTC, CPG power supply voltage after (or at the same time as)*
turning off the internal power supply voltage.
Note however that the internal power supply voltage may exceed the I/O, PLL, RTC, CPG
power supply voltage by a maximum of 0.3 V only when the system is being turned off.
The power supply level must be lowered in compliance with the I/O, PLL, RTC, CPG
power supply voltage.
Note: *1 10 ms or less for the HD6417750R.
• The ratings and procedures for power-on and power-off are given below.
VSSQ = VSS-PLL1 = VSS-PLL2 = VSS-RTC = VSS-CPG = 0 V
The LSI may be damaged if
−0.3 V < Vin < VDDQ + 0.3 V
−0.3 V < VDD < VDDQ + 0.3 V
are not satisfied when VDDQ = VDD-RTC = VDD-CPG.
Power-on
VDDQ
Power-off
2.0 V
VDD
1.2 V
GND
ton
0 ≤ ton < 10 ms*
toff
0 ≤ toff < 10 ms*
Note: * HD6417750R only
Figure H.1 Power-On and Power-Off Procedures
Rev. 6.0, 07/02, page 978 of 986
Appendix I Product Code Lineup
Table I.1
SH7750 Series Product Code Lineup
Abbreviation
Voltage
Operating
Frequency
Operating
Temperature
Mark Code
Package
SH7750
1.95 V
200 MHz
–20 to 75°C
HD6417750BP200M
BGA-256
1.8 V
167 MHz
–20 to 75°C
HD6417750F167
QFP-208
–40 to 85°C
HD6417750F167I
1.5 V
128 MHz
–20 to 75°C
HD6417750VF128
1.95 V
200 MHz
–20 to 75°C
HD6417750SBP200
BGA-256
–20 to 75°C
HD6417750SF200
QFP-208
–20 to 75°C
HD6417750SF167
QFP-208
–40 to 85°C
HD6417750SF167I
–20 to 75°C
HD6417750SVF133
–30 to 70°C
HD6417750SVBT133
CSP-264
–20 to 75°C
HD6417750RBP240
BGA-256
–20 to 75°C
HD6417750RF240
QFP-208
–20 to 75°C
HD6417750RBP200
BGA-256
–20 to 75°C
HD6417750RF200
QFP-208
SH7750S
1.8 V
1.5 V
SH7750R
1.5 V
1.5 V
167 MHz
133 MHz
240 MHz
200 MHz
Rev. 6.0, 07/02, page 979 of 986
Rev. 6.0, 07/02, page 980 of 986
Index
Big endian .................................................53
Bus Arbitration........................................480
Bus State Controller ................................311
Address Multiplexing..........................399
Areas ...........................................319, 382
Burst Access........................................402
Burst ROM Interface...........................441
Byte Control SRAM Interface.............473
DRAM Interface .................................395
EDO Mode ..........................................403
Endian .................................................370
I/O card interface ........................322, 444
IC memory card interface............322, 444
Master Mode .......................................483
MPX Interface.....................................455
Partial-Sharing Master Mode ..............485
PCMCIA Interface ..............................444
PCMCIA Support................................322
RAS Down Mode................................404
Refresh Timing ...................................409
Refreshing ...........................................431
Slave Mode .........................................484
SRAM Interface ..................................387
Synchronous DRAM Interface............413
Wait State Control...............................401
Waits between Access Cycles .............478
Operand Cache ................................95, 99
prefetch................................................122
Prefetch Operation...............................108
RAM Mode .........................................106
Store Queues .......................................122
Tag...............................................102, 110
U bit.....................................................102
V bit.............................................102, 110
Write-Back Buffer ...............................105
Write-Through Buffer .........................105
Clock Oscillation Circuits .......................247
Bus Clock Division Ratio ....................258
Changing the Frequency......................257
Clock Operating Modes.......................253
PLL Circuit..........................................257
clock pulse generator...............................247
Control Registers.................................42, 49
DBR.......................................................50
Debug base register ...............................50
GBR.......................................................50
Global base register ...............................50
Saved general register 15 ......................50
Saved program counter..........................50
Saved status register ..............................50
SGR .......................................................50
SPC........................................................50
SR ..........................................................49
SSR........................................................50
Status register ........................................49
VBR.......................................................50
Vector base register ...............................50
C
D
Caches .......................................................95
Address Array ............. 112, 114, 117, 119
cache fill..............................................108
Data Array................... 113, 115, 118, 120
IC Index Mode ....................................111
Instruction Cache ..........................95, 108
OC Index Mode...................................107
Data Format...............................................53
Direct Memory Access Controller...........489
Address Modes ....................................519
Burst Mode..........................................523
Bus Modes...........................................522
Channel Priorities ................................515
Cycle Steal Mode ................................522
A
Address Space ...........................................64
B
Rev. 6.0, 07/02, page 981 of 986
DMA Transfer.....................................518
DMA Transfer Requests .....................512
Dual Address Mode ............................520
Ending DMA Transfer ........................541
Fixed Mode .........................................515
On-Demand Data Transfer Mode........545
Round Robin Mode.............................515
Single Address Mode ..........................519
E
effective address......................................175
Exceptions...............................................127
Address Error ..............................146, 147
Exception Types..................................130
FPU exception.............................154, 169
General Exceptions .............................141
General FPU Disable Exception .........151
General illegal instruction ...................169
General Illegal Instruction Exception .149
Initial Page Write Exception ...............143
Instruction TLB Protection Violation
Exception ........................................145
Slot FPU Disable Exception................152
slot illegal instruction exception .........169
Slot Illegal Instruction Exception........150
TLB Miss Exception ...................141, 142
TLB Multiple-Hit Exception.......139, 140
TLB Protection Violation Exception...144
Unconditional Trap .............................148
User Breakpoint Trap..........................153
External Memory Space Map..................320
F
Floating-Point Registers.............. 43, 47, 165
Floating-Point Unit .................................161
Denormalized Numbers ......................164
Floating-Point Format .........................161
Geometric Operation Instructions .......170
NaN .............................................163, 164
Non-Numbers......................................163
Pair Single-Precision Data Transfer ....172
Rev. 6.0, 07/02, page 982 of 986
G
General Registers ................................42, 45
Graphics Support Functions ....................170
H
Hitachi User Debug Interface..................799
TAP Control ........................................810
I
I/O Ports ..................................................731
Instruction Set .................................173, 179
Arithmetic Operation Instructions .......182
Branch instructions......................186, 214
Data transfer instructions.....................211
Double-precision floating-point
instructions ......................................217
Fixed-point arithmetic instructions......212
Fixed-Point Transfer Instructions........180
Floating-Point Control Instructions .....190
Floating-Point Double-Precision
Instructions ......................................190
Floating-Point Graphics Acceleration
Instructions ......................................191
Floating-Point Single-Precision
Instructions ......................................189
FPU system control instructions..........218
Graphics acceleration instructions.......218
Logic Operation Instructions...............184
Shift instructions..........................185, 214
Single-precision floating-point
instructions ......................................216
System control instructions .........187, 215
Interrupt Controller .................................751
Interrupt Priority..................................759
On-Chip Peripheral Module Interrupts757
Interrupts .................................................155
ATI ......................................................289
BRI ......................................................697
ERI ......................................651, 697, 724
IRL Interrupts..............................156, 755
NMI .....................................................155
NMI Interrupt ......................................754
Peripheral Module Interrupts...............157
PRI ......................................................289
RXI...................................... 651, 697, 724
TEI ......................................................651
TICPI...................................................309
TUNI ...................................................309
TXI...................................... 651, 697, 724
Pull-Up Control ...................................226
Sleep Mode..........................................230
Programming Model .................................41
Banks.....................................................42
Data Formats .........................................41
Privileged Mode ....................................42
L
R
Little endian ..............................................53
Realtime Clock ........................................267
Alarm Function ...................................288
Crystal Oscillator Circuit.....................289
CUI ......................................................289
Time Setting ........................................285
Registers
BAMRA ..............................................778
BAMRB ..............................................781
BARA..................................................777
BARB ..................................................781
BASRA................................................778
BASRB................................................781
BBRA ..................................................779
BBRB ..................................................783
BCR1...................................................326
BCR2...................................................335
BDRB ..................................................781
BRCR ..................................................783
CCR.......................................................97
CHCR ..................................................499
DAR ....................................................497
DMAOR ..............................................507
DMATCR............................................498
EXPEVT..............................................128
FPSCR.................................................167
FPUL ...................................................168
FRQCR................................................254
GPIOIC................................................745
ICR ......................................................762
INTEVT ..............................................128
IPR.......................................................761
MCR ....................................................352
MMUCR................................................61
PCR .....................................................359
PCTRA ................................................742
M
Memory Management Unit .......................57
Address Array .................................88, 90
Address Space Identifier .......................70
Address Translation ..............................69
Address Translation Method .................75
ASID .....................................................70
Avoiding Synonym Problems ...............80
Data Array.......................................89, 92
External memory space ...................64, 67
ITLB......................................................75
LDTLB..................................................78
MMU Exceptions..................................81
MMU Functions....................................78
Physical address space ....................58, 64
time sharing system...............................57
TLB .................................................57, 71
UTLB ....................................................71
Virtual address space.......................58, 68
virtual memory system..........................57
P
Pipelining ................................................193
Execution Cycles.........................204, 211
Parallel-Executability..........................200
Pipeline Stalling ..................................204
Power-Down Modes ...............................221
Clock Pause Function..........................232
Deep Sleep Mode ................................230
Exit from Standby Mode.....................232
Hardware Standby Mode.....................235
High Impedance Control .....................226
Module Standby Function ...................233
Rev. 6.0, 07/02, page 983 of 986
PCTRB ................................................744
PDTRA................................................743
PDTRB................................................745
PTEH.....................................................61
QACR0 .................................................97
R64CNT ..............................................271
RCR1...................................................279
RCR2...................................................281
RDAYAR............................................278
RDAYCNT .........................................274
RFCR ..................................................369
RHRAR...............................................277
RHRCNT ............................................272
RMINAR.............................................276
RMINCNT ..........................................272
RMONAR ...........................................279
RMONCNT.........................................274
RSECAR .............................................276
RSECCNT...........................................271
RTCNT................................................367
RTCOR ...............................................368
RTCSR ................................................364
RWKAR..............................................277
RWKCNT ...........................................273
RYRCNT ............................................275
SAR.....................................................496
SCBRR1..............................................613
SCBRR2..............................................674
SCFCR2 ..............................................675
SCFDR2 ..............................................678
SCFRDR2 ...........................................662
SCFSR2...............................................668
SCFTDR2............................................663
SCLSR2 ..............................................684
SCRDR1..............................................597
SCRSR1 ..............................................597
SCRSR2 ..............................................661
SCSCMR1...........................................706
SCSCR1 ......................................601, 708
SCSCR2 ..............................................665
SCSMR1 .....................................599, 707
SCSMR2 .............................................663
SCSPTR1 ....................................609, 746
Rev. 6.0, 07/02, page 984 of 986
SCSPTR2 ....................................679, 748
SCSSR1 .......................................605, 709
SCTDR1 ..............................................598
SCTSR1...............................................598
SCTSR2...............................................662
SDBPR ................................................805
SDDR ..................................................805
SDIR....................................................803
SDMR..................................................362
STBCR ................................................224
STBCR2 ..............................................227
TCNT ..................................................298
TCOR ..................................................298
TCPR2 .................................................303
TCR .....................................................299
TEA .......................................................61
TOCR ..................................................295
TRA.....................................................128
TSTR ...................................................296
TTB .......................................................61
WCR1..................................................340
WCR2..................................................343
WCR3..................................................351
WTCNT...............................................260
WTCSR ...............................................261
Resets ......................................................136
H-UDI Reset................................138, 811
Manual Reset.......................................137
Power-On Reset...................................136
Rounding .................................................168
S
Serial Communication Interface..............593
Asynchronous mode ....................621, 623
Bit Rate................................................613
Break ...................................................652
Framing error...............................632, 652
Multiprocessor Communication Function
.........................................................634
Overrun error...............................632, 652
Parity error...................................632, 652
Synchronous mode ......................621, 642
Serial Communication Interface with FIFO
............................................................657
Asynchronous Mode ...........................685
Break ...................................................698
Smart Card Interface ...............................703
bit rate .................................................715
System Registers .................................42, 50
Floating-point status/control register ....51
FPSCR...................................................51
MACH...................................................50
MACL ...................................................50
Multiply-and-accumulate register high .50
Multiply-and-accumulate register low ..50
PC..........................................................50
PR..........................................................50
Procedure register .................................50
Program counter....................................50
T
Timer Unit ...............................................291
Auto-Reload Count Operation.............305
Input Capture Function........................307
TCNT Count Timing ...........................306
U
User Break Controller .............................773
Instruction Access Cycle Break...........788
Operand Access Cycle Break ..............789
User Break Debug Support Function...793
User Break Operation Sequence..........787
W
Watchdog Timer..............................247, 259
Interval Timer Mode ...........................265
Watchdog Timer Mode .......................264
Rev. 6.0, 07/02, page 985 of 986
Rev. 6.0, 07/02, page 986 of 986
SH7750 Series Hardware Manual
Publication Date: 1st Edition, June 1998
6th Edition, July 2002
Published by:
Business Operation Division
Semiconductor & Integrated Circuits
Hitachi, Ltd.
Edited by:
Technical Documentation Group
Hitachi Kodaira Semiconductor Co., Ltd.
Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
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