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IDT79RC32T365-150BC

IDT79RC32T365-150BC

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    LBGA256

  • 描述:

    IC MPU INTERPRISE 150MHZ 256BGA

  • 数据手册
  • 价格&库存
IDT79RC32T365-150BC 数据手册
RC32365 IDTTM InterpriseTM Integrated Communications Processor Device Overview – – – – – – – 2-way set associative LRU replacement algorithm 4 word line size Sub-block ordering Byte parity Per line cache locking Can be programmed on a page basis to implement writethrough no write allocate, write-through write allocate, or write-back algorithms – Enhanced EJTAG and JTAG Interfaces – Compatible with IEEE Std. 1149.1-1990 ◆ Security Engine – Dedicated DMA channels for high speed data transfers to and from the security engine – On-chip memory for storage of two security contexts – Supports ECB and CBC modes for the following symmetric encryption algorithms: DES, triple DES (both two key (k1=k3) and three key (k1!=k3) modes), AES-128 with 128-bit blocks, AES-192 with 128-bit blocks – Hardware support for encryption pad generation and checking using one of seven popular padding algorithms: supports pad algorithm required by IPSec ESP – Supports MD5 and SHA-1 one-way hash functions – Programmable truncation length of computed hash and HMAC on a security context basis – Supports concurrent hash and encryption operations The RC32365 device is a member of the IDT™ Interprise™ family of integrated communications processors. This device is designed to address a range of communications applications that require the efficient processing of IPSec algorithms. These applications include gateways, wireless access points, and virtual private network (VPN) equipment. The key to the RC32365’s efficient processing of IPSec algorithms is a highly progammable security engine which off-loads the CPU core of encryption/decryption, hashing, and padding tasks. Features List ◆ RC32300 32-bit CPU core – 32-bit MIPS instruction set – Supports big or little endian operation – MMU – 16-entry TLB – Supports variable page sizes and enhanced write algorithm – Supports variable number of locked entries – 8KB Instruction Cache – 2-way set associative – LRU replacement algorithm – 4 word line size – Sub-block ordering – Word parity – Per line cache locking – 2KB Data Cache Block Diagram MII Security Functions 32-bit MIPS CPU Core EJTAG JTAG D. Cache MII Interrupt Controller . . MMU Bus/System Integrity Monitor I. Cache 2 Ethernet 10/100 Interfaces Security Context Storage Hash Unit RNG Encryption Unit DMA Controller Arbiter IPBusTM SDRAM & Device Controllers including PCMCIA Support Memory & Peripheral Bus (including PCMCIA) 3 Counter Timers GPIO Interface UART (16550) Serial Channel GPIO Pins SPI Controller SPI Bus PCI Master/Target Interface PCI Arbiter (Host Mode) PCI Bus Figure 1 RC32365 Internal Block Diagram IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. 1 of 44 © 2005 Integrated Device Technology, Inc. October 5, 2005 DSC 6210 RC32365 – Optimized for IPSec AH, ESP, and AH+ESP (single MAC) tunnel and transport mode processing: initialization Vector (IV) insertion and extraction, HMAC checking, AH mutable field processing for both IPv4 and IPv6 packets, IPSec pad generation and checking ◆ Random Number Generator – True hardware random number generator suitable for security applications: may be used to generate symmetric and public keys, initialization vectors, and nonces – Dedicated DMA engine for transferring random numbers to memory – Generates random numbers at a bit rate equal to IPBus clock frequency divided by 32 – Provides 4 word (16 byte) FIFO to queue random numbers – Randomness tester continually verifies proper operation of random number generator using a randomness test defined in FIPS 140-2 ◆ PCI Interface – 32-bit PCI revision 2.2 compliant – Supports host or satellite operation in both master and target modes – PCI clock: supports frequencies from 16 MHz to 66 MHz, PCI clock may be asynchronous to master clock (CLK) – PCI arbiter in Host mode: supports 3 external masters, fixed priority or round robin arbitration – I2O “like” PCI Messaging Unit ◆ Two Ethernet Interfaces – 10 and 100 Mb/s ISO/IEC 8802-3:1996 compliant – Two IEEE 802.3u compatible Media Independent Interfaces (MII) with serial management interface – MII supports IEEE 802.3u auto-negotiation speed selection – Supports 64 entry hash table based multicast address filtering – 512 byte transmit and receive FIFOs – Supports flow control functions outlined in IEEE Std. 802.3x1997 ◆ SDRAM Controller – Supports up to 512 MB of memory – 2 chip selects (each supports 2 or 4 banks internal SDRAM banks) – 32-bit data width, supports 8/16/32-bit width devices – Supports 16Mb, 64Mb, 128Mb, and 256Mb, and 512Mb devices – Automatic refresh generation ◆ Memory and Peripheral Device Controller – Provides “glueless” interface to standard SRAM, Flash, ROM, dual-port memory, and peripheral devices – Provides “glueless” interface to many 16-bit PCMCIA devices – Demultiplexed address and data buses: 32-bit data bus, 26-bit address bus, 6 chip selects, control for external data bus buffers – Supports 8-bit, 16-bit, and 32-bit width devices: automatic byte gathering and scattering – Flexible protocol configuration parameters: programmable number of wait states (0 to 63), programmable postread/postwrite delay (0 to 31), supports external wait state generation, supports Intel and Motorola style peripherals – Write protect capability per chip select – Programmable bus transaction timer generates warm reset when counter expires – Supports up to 64MB of memory per chip select ◆ DMA Controller – 9 DMA channels: two channels for each of the two Ethernet interfaces (transmit/receive), two channels for PCI (PCI to Memory and Memory to PCI), two channels for security engine (input/output), one channel for the hardware random number generator – Provides flexible descriptor based operation – Supports unaligned transfers (i.e., source or destination address may be on any byte boundary) with arbitrary byte length ◆ General Purpose Peripherals – Serial port compatible with 16550 Universal Asynchronous Receiver Transmitter (UART) – Three general purpose 32-bit counter/timers – Interrupt Controller – Serial Peripheral Interface (SPI) supporting host mode – 16 general purpose I/O (GPIO) pins which can be configured as interrupt sources ◆ System Features – JTAG Interface (IEEE Std. 1149.1 compatible) – 256 pin CABGA package – 2.5V core supply and 3.3V I/O supply CPU Execution Core The RC32365 is built around the RC32300 32-bit high performance microprocessor core. The RC32300 implements the enhanced MIPS-II ISA and helps meet the real-time goals and maximize throughput of communications and consumer systems by providing capabilities such as a prefetch instruction, multiple DSP instructions, and cache locking. The instruction set is largely compatible with the MIPS32 instruction set, allowing the customer to select from a broad range of software and development tools. Cache locking guarantees real-time performance by holding critical code and parameters in the cache for immediate availability. The microprocessor also implements an on-chip MMU with a TLB, making the it fully compliant with the requirements of real time operating systems. Security Engine The RC32365 incorporates an on-chip security engine that has been designed to accelerate IPSec performance and minimize the amount of performance required by the CPU to process secure packet traffic. The engine includes hardware support for the DES, 3DES, and AES encryption algorithms and the MD5 and SHA1 hash functions. The engine also supports hardware-assisted packet processing for the various modes of IPSec, including AH, ESP, and AH+ESP tunnel and transport modes. Two dedicated DMA channels are used to transfer data to and from the security engine, allowing the CPU to work on other tasks during this time. 2 of 44 October 5, 2005 RC32365 Revision History PCI Interface The PCI interface on the RC32365 is compatible with version 2.2 of the PCI specification. An on-chip arbiter supports up to three external bus masters, supporting both fixed priority and rotating priority arbitration schemes. The RC32365 can support both satellite and host PCI configurations, enabling it to act as a slave controller for a PCI add-in card application, or as the primary PCI controller in the system. The PCI interface can be operated synchronously or asynchronously to the other I/O interfaces on the RC32365 device. PCMCIA Interface The RC32365 provides a "glueless" connection to a single PCMCIA I/O device via the memory and peripheral device controller. The PCMCIA interface allows the RC32365 to connect to various types of I/O peripherals including fax modems, storage devices, and wireless LAN chipsets. The RC32365 implementation provides a maximum throughput of 160 Mbps through the 16-bit wide interface as specified by the PCMCIA 2.1 Standard. March 17, 2003: Initial publication. May 15, 2003: Removed “write protect capability” from features of the SDRAM Controller. July 9, 2003: In Table 6, changed values for RSTN (output). Changed values in Tables 7, 8, 9, 10, and 17. October 3, 2003: Added 180 MHz speed grade. Changed min values in Table 7 from 1.8 to 1.2 for all signals except SDCLKINP and SDCKENP. Changed min values for Tdo 10b and 10c in Table 10 for PCIBEN, etc. and PCIGNTN/PCIREQN from 2.0 to 1.5. February 25, 2004: Deleted reference to RNGCLK in Table 1 (GPIO[6]) and Table 22. May 25, 2004: In Table 9, signals MIIxRXCLK and MIIxTXCLK, the Min and Max values for Thigh/Tlow_9c were changed to 140 and 260 respectively and the Min and Max values for Thigh/Tlow_9d were changed to 14.0 and 26.0 respectively. October 5, 2005: Removed 180 MHz speed grade. Ethernet Interface The RC32365 has two Ethernet Channels supporting 10Mbps and 100Mbps speeds and provides a standard media independent interface (MII) off-chip, allowing a wide range of external devices to be connected efficiently. Memory and I/O Controller The RC32365 incorporates a flexible memory and peripheral device controller providing direct support for SDRAM, Flash ROM, SRAM, PCMCIA, and other I/O devices. It can interface directly to 8-bit boot ROM for a very low cost system implementation. It also offers various trade-offs in cost / performance for the main memory architecture. The timers implemented on the RC32365 satisfy the requirements of most real time operating systems. DMA Controller The DMA controller off-loads the CPU core from moving data among the on-chip interfaces, external peripherals, and memory. The DMA controller supports scatter / gather DMA with no alignment restrictions, appropriate for communications and graphics systems. Enhanced JTAG Interface For system debugging, the RC32300 CPU core includes an Enhanced JTAG (EJTAG) interface which operates in Run-Time Mode. Thermal Considerations The RC32365 is guaranteed in a ambient temperature range of 0° to +70° C for commercial temperature devices and - 40° to +85° for industrial temperature devices. 3 of 44 October 5, 2005 RC32365 Pin Description Table The following table lists the functions of the pins provided on the RC32365. Some of the functions listed may be multiplexed onto the same pin (indicated as alternate functions). To define the active polarity of a signal, a suffix will be used. Signals ending with an “N” should be interpreted as being active, or asserted, when at a logic zero (low) level. All other signals (including clocks, buses, and select lines) will be interpreted as being active, or asserted, when at a logic one (high) level. Signal Type Name/Description Memory and Peripheral Bus BDIRN O External Buffer Direction. Memory and peripheral bus external data bus buffer direction control. If the RC32365 memory and peripheral bus is connected to the A side of a transceiver such as an IDT74FCT245, then this pin may be directly connected to the direction control (e.g., BDIR) pin of the transceiver. BOEN[1:0] O External Buffer Enable. These signals provide output enable control for external buffers on the memory and peripheral data bus. BWEN[3:0] O Byte Write Enables. These signals are memory and peripheral bus byte write enable signals. BWEN[0] corresponds to byte lane MDATA[7:0] BWEN[1] corresponds to byte lane MDATA[15:8] BWEN[2] corresponds to byte lane MDATA[23:16] BWEN[3] corresponds to byte lane MDATA[31:24] CSN[5:0] O Chip Selects. These signals are used to select an external device on the memory and peripheral bus. MADDR[21:0] O Address Bus. 22-bit memory and peripheral bus address bus. MADDR[25:22] are available as GPIO[5:2] alternate functions. MDATA[31:0] I/O Data Bus. 32-bit memory and peripheral data bus. During a cold reset, bits 0 through 16 of this data bus function as inputs that are used to load the boot configuration vector. OEN O Output Enable. This signal is asserted when data should be driven by an external device on the memory and peripheral bus. RWN O Read Write. This signal indicates whether the transaction on the memory and peripheral bus is a read transaction or a write transaction. A high level indicates a read from an external device. A low level indicates a write to an external device. WAITACKN I Wait or Transfer Acknowledge. When configured as wait, this signal is asserted during a memory and peripheral bus transaction to extend the bus cycle. When configured as a transfer acknowledge, this signal is asserted during a transaction to signal the completion of the transaction. RASN O SDRAM Row Address Strobe. Row address strobe asserted during memory and peripheral bus SDRAM transactions. CASN O SDRAM Column Address Strobe. Column address strobe asserted during memory and peripheral bus SDRAM transactions. SDCSN[1:0] O SDRAM Chip Selects. These signals are used to select SDRAM device(s) on the memory and peripheral bus. SDWEN O SDRAM Write Enable. This signal is asserted during memory and peripheral bus SDRAM write transactions. SDCLKOUT O SDRAM Clock Output. This clock is used for all SDRAM memory and peripheral bus operations. SDCLKINP I SDRAM Clock Input. This clock input is typically a delayed version of SDCLKOUT. Data from the SDRAMs is sampled using this clock. Table 1 Pin Description (Part 1 of 6) 4 of 44 October 5, 2005 RC32365 Signal Type Name/Description General Purpose I/O GPIO[0] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: U0SOUT Alternate function: UART channel 0 serial output. GPIO[1] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: U0SINP Alternate function: UART channel 0 serial input. GPIO[2] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: MADDR[22] Alternate function: Memory and Peripheral bus address bit 22 (output). GPIO[3] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: MADDR[23] Alternate function: Memory and Peripheral bus address bit 23 (output). GPIO[4] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: MADDR[24] Alternate function: Memory and Peripheral bus address bit 24 (output). GPIO[5] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: MADDR[25] Alternate function: Memory and Peripheral bus address bit 25 (output). GPIO[6] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. The value of this pin may be used as a Counter Timer Clock input. GPIO[7] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: SDCKENP Alternate function: SDRAM clock enable output The value of this pin may be used as a Counter Timer Clock input. GPIO[8] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: CEN1 Alternate function: PCMCIA chip enable 1 (CE1#) (output). GPIO[9] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: CEN2 Alternate function: PCMCIA chip enable 2 (CE2#) (output). GPIO[10] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: REGN Alternate function: PCMCIA Attribute Memory Select (REG#) (output). GPIO[11] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: IORDN Alternate function: PCMCIA IO Read (IORD#) (output). GPIO[12] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: IOWRN Alternate function: PCMCIA IO Write (IOWR#) (output). GPIO[13] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: PCIREQN[2] Alternate function: PCI bus request 2 (output). GPIO[14] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: PCIGNTN[2] Alternate function: PCI bus grant 2 (output). Table 1 Pin Description (Part 2 of 6) 5 of 44 October 5, 2005 RC32365 Signal GPIO[15] Type Name/Description I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: PCIMUINTN Alternate function: PCI Messaging unit interrupt output. SCK I/O Serial Clock. This signal is used as the serial SPI clock output. This pin may be used as a bit input/output port. SDI I/O Serial Data Input. This signal is used to shift in serial SPI data. This pin may be used as a bit input/output port. SDO I/O Serial Data Output. This signal is used to shift out serial SPI data. This pin may be used as a bit input/output port. PCIAD[31:0] I/O PCI Multiplexed Address/Data Bus. Address is driven by a bus master during initial PCIFRAMEN assertion. Data is then driven by the bus master during writes or by the bus target during reads. PCICBEN[3:0] I/O PCI Multiplexed Command/Byte Enable Bus. PCI command is driven by the bus master during the initial PCIFRAMEN assertion. Byte enables are driven by the bus master during subsequent data phase(s). Serial Interface PCI Bus PCICLK I PCI Clock. Clock used for all PCI bus transactions. PCIDEVSELN I/O PCI Device Select. This signal is driven by a bus target to indicate that the target has decoded the address as one of its own address spaces. PCIFRAMEN I/O PCI Frame. Driven by a bus master. Assertion indicates the beginning of a bus transaction. Negation indicates the last data. PCIGNTN[1:0] I/O PCI Bus Grant. In PCI host mode with internal arbiter: The assertion of these signals indicates to the agent that the internal RC32365 arbiter has granted the agent access to the PCI bus. In PCI host mode with external arbiter: PCIGNTN[0]: asserted by an external arbiter to indicate to the RC32365 that access to the PCI bus has been granted. PCIGNTN[1]: unused and driven high. In PCI satellite mode: PCIGNTN[0]: this signal is asserted by an external arbiter to indicate to the RC32365 that access to the PCI bus has been granted. PCIGNTN[1]: this signal takes on the alternate function of PCIEECS and is used as a PCI Serial EEPROM chip select. PCIIRDYN I/O PCI Initiator Ready. Driven by the bus master to indicate that the current data can complete. PCILOCKN I/O PCI Lock. This signal is asserted by an external bus master to indicate that an exclusive operation is occurring. PCIPAR I/O PCI Parity. Even parity of the PCIAD[31:0] bus. Driven by the bus master during address and write data phases. Driven by the bus target during the read data phases. PCIPERRN I/O PCI Parity Error. This signal is asserted by the receiving bus agent 2 clocks after the data is received if a parity error is detected. Table 1 Pin Description (Part 3 of 6) 6 of 44 October 5, 2005 RC32365 Signal Type Name/Description PCIREQN[1:0] I/O PCI Bus Request. In PCI host mode with internal arbiter: These signals are inputs whose assertion indicates to the internal RC32365 arbiter that an agent desires ownership of the PCI bus. In PCI host mode with external arbiter: PCIREQN[0]: asserted by the RC32365 to request ownership of the PCI bus. PCIREQN[1]: unused and driven high. In PCI satellite mode: PCIREQN[0]: this signal is asserted by the RC32365 to request ownership of the PCI bus. PCIREQN[1]: function changes to PCIIDSEL and is used as a chip select during configuration read and write transactions. PCIRSTN I/O PCI Reset. In host mode, this signal is asserted by the RC32365 to generate a PCI reset. In satellite mode, assertion of this signal initiates a warm reset. PCISERRN I/O PCI System Error. This signal is driven by an agent to indicate an address parity error, data parity error during a special cycle command, or any other system error. Requires an external pull-up. PCISTOPN I/O PCI Stop. Driven by the bus target to terminate the current bus transaction. For example, to indicate a retry. PCITRDYN I/O PCI Target Ready. Driven by the bus target to indicate that the current data can complete. Ethernet Interface MII0CL I Ethernet 0 MII Collision Detected. This signal is asserted by the ethernet PHY when a collision is detected. MII0CRS I Ethernet 0 MII Carrier Sense. This signal is asserted by the ethernet PHY when either the transmit or receive medium is not idle. MII0RXCLK I Ethernet 0 MII Receive Clock. This clock is a continuous clock that provides a timing reference for the reception of data. MII0RXD[3:0] I Ethernet 0 MII Receive Data. This nibble wide data bus contains the data received by the ethernet PHY. MII0RXDV I Ethernet 0 MII Receive Data Valid. The assertion of this signal indicates that valid receive data is in the MII receive data bus. MII0RXER I Ethernet 0 MII Receive Error. The assertion of this signal indicates that an error was detected somewhere in the ethernet frame currently being sent in the MII receive data bus. MII0TXCLK I Ethernet 0 MII Transmit Clock. This clock is a continuous clock that provides a timing reference for the transfer of transmit data. MII0TXD[3:0] O Ethernet 0 MII Transmit Data. This nibble wide data bus contains the data to be transmitted. MII0TXENP O Ethernet 0 MII Transmit Enable. The assertion of this signal indicates that data is present on the MII for transmission. MII0TXER O Ethernet 0 MII Transmit Coding Error. When this signal is asserted together with MIITXENP, the ethernet PHY will transmit symbols which are not valid data or delimiters. MII1CL I Ethernet 1 MII Collision Detected. This signal is asserted by the ethernet PHY when a collision is detected. MII1CRS I Ethernet 1 MII Carrier Sense. This signal is asserted by the ethernet PHY when either the transmit or receive medium is not idle. MII1RXCLK I Ethernet 1 MII Receive Clock. This clock is a continuous clock that provides a timing reference for the reception of data. Table 1 Pin Description (Part 4 of 6) 7 of 44 October 5, 2005 RC32365 Signal Type Name/Description MII1RXD[3:0] I Ethernet 1 MII Receive Data. This nibble wide data bus contains the data received by the ethernet PHY. MII1RXDV I Ethernet 1 MII Receive Data Valid. The assertion of this signal indicates that valid receive data is in the MII receive data bus. MII1RXER I Ethernet 1 MII Receive Error. The assertion of this signal indicates that an error was detected somewhere in the ethernet frame currently being sent in the MII receive data bus. MII1TXCLK I Ethernet 1 MII Transmit Clock. This clock is a continuous clock that provides a timing reference for the transfer of transmit data. MII1TXD[3:0] O Ethernet 1 MII Transmit Data. This nibble wide data bus contains the data to be transmitted. MII1TXENP O Ethernet 1 MII Transmit Enable. The assertion of this signal indicates that data is present on the MII for transmission. MII1TXER O Ethernet 1 MII Transmit Coding Error. When this signal is asserted together with MIITXENP, the ethernet PHY will transmit symbols which are not valid data or delimiters. MIIMDC O MII Management Data Clock. This signal is used as a timing reference for transmission of data on the management interface. MIIMDIO I/O MII Management Data. This bidirectional signal is used to transfer data between the station management entity and the ethernet PHY. JTAG_TMS I JTAG Mode. The value on this signal controls the test mode select of the boundary scan logic or JTAG Controller. When using the EJTAG debug interface, this pin should be left disconnected (since there is an internal pull-up) or driven high. EJTAG_TMS I EJTAG Mode. The value on this signal controls the test mode select of the EJTAG Controller. When using the JTAG boundary scan, this pin should be left disconnected (since there is an internal pull-up) or driven high. JTAG_TRST_N I JTAG Reset. This active low signal asynchronously resets the boundary scan logic, JTAG TAP Controller, and the EJTAG Debug TAP Controller. An external pull-up on the board is recommended to meet the JTAG specification in cases where the tester can access this signal. However, for systems running in functional mode, one of the following should occur: 1) actively drive this signal low with control logic 2) statically drive this signal low with an external pull-down on the board 3) clock JTAG_TCK while holding EJTAG_TMS and/or JTAG_TMS high. JTAG_TCK I JTAG Clock. This is an input test clock used to clock the shifting of data into or out of the boundary scan logic, JTAG Controller, or the EJTAG Controller. JTAG_TCK is independent of the system and the processor clock with a nominal 50% duty cycle. JTAG_TDO O JTAG Data Output. This is the serial data shifted out from the boundary scan logic, JTAG Controller, or the EJTAG Controller. When no data is being shifted out, this signal is tri-stated. JTAG_TDI I JTAG Data Input. This is the serial data input to the boundary scan logic, JTAG Controller, or the EJTAG Controller. EJTAG / JTAG Table 1 Pin Description (Part 5 of 6) 8 of 44 October 5, 2005 RC32365 Signal Type Name/Description CLK I Master Clock. This is the master clock input. The processor frequency is a multiple of this clock frequency. This clock is used as the system clock for all memory and peripheral bus operations except those associated with SDRAMs. COLDRSTN I Cold Reset. The assertion of this signal initiates a cold reset. This causes the processor state to be initialized, boot configuration to be loaded, and the internal PLL to lock onto the master clock (CLK). I/O Reset. The assertion of this bidirectional signal initiates a warm reset. This signal is asserted by the RC32365 during a warm reset. It can also be asserted by an external device to force the RC32365 to take a warm reset exception. Miscellaneous RSTN Table 1 Pin Description (Part 6 of 6) Pin Characteristics Pin Name Memory and Peripheral Bus BDIRN BOEN[1:0] BWEN[3:0] CSN[5:0] MADDR[21:0] MDATA[31:0] OEN RWN WAITACKN RASN CASN SDCSN[1:0] SDWEN SDCLKOUT SDCLKINP General Purpose I/O GPIO[15:13] GPIO[12:0] Serial Interface SCK SDI SDO PCI Bus Interface PCIAD[31:0] PCICBEN[3:0] PCICLK PCIDEVSELN Internal Resistor Type Buffer I/O Type O O O O O I/O O O I O O O O O I LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL High Drive High Drive High Drive High Drive High Drive High Drive High Drive High Drive STI2 High Drive High Drive High Drive High Drive High Drive STI I/O I/O PCI LVTTL PCI Low Drive pull-up I/O I/O I/O LVTTL LVTTL LVTTL Low Drive Low Drive Low Drive pull-up pull-up pull-up I/O I/O I I/O PCI PCI PCI PCI PCI PCI PCI PCI External Resistor1 pull-up pull-up pull-up on board pull-up on board pull-up on board pull-up on board Table 2 Pin Characteristics (Part 1 of 2) 9 of 44 October 5, 2005 RC32365 Pin Name PCIFRAMEN PCIGNTN[1:0] PCIIRDYN PCILOCKN PCIPAR PCIPERRN PCIREQN[1:0] PCIRSTN PCISERRN PCISTOPN PCITRDYN Ethernet Interfaces MII0CL MII0CRS MII0RXCLK MII0RXD[3:0] MII0RXDV MII0RXER MII0TXCLK MII0TXD[3:0] MII0TXENP MII0TXER MII1CL MII1CRS MII1RXCLK MII1RXD[3:0] MII1RXDV MII1RXER MII1TXCLK MII1TXD[3:0] MII1TXENP MII1TXER MIIMDC MIIMDIO EJTAG / JTAG JTAG_TMS EJTAG_TMS JTAG_TRST_N JTAG_TCK JTAG_TDO JTAG_TDI Miscellaneous CLK COLDRSTN RSTN Type Buffer I/O Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI PCI Open Collector; PCI PCI PCI I I I I I I I O O O I I I I I I I O O O O I/O LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL STI STI STI STI STI STI STI Low Drive Low Drive Low Drive STI STI STI STI STI STI STI Low Drive Low Drive Low Drive Low Drive Low Drive I I I I O I LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL STI STI STI STI Low Drive STI I I I/O LVTTL LVTTL LVTTL STI STI Low Drive / STI Internal Resistor External Resistor1 pull-up on board pull-up on board pull-up on board pull-up on board pull-down on board pull-up on board pull-up on board pull-up on board pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up pull-up See Chapters 22 and 23 of the RC32365 User Reference Manual pull-up pull-up pull-up on board Table 2 Pin Characteristics (Part 2 of 2) 1. External pull-up required in most system applications. Some applications may require additional pull-ups not identified in this table. 2. Schmidt Trigger Input (STI). 10 of 44 October 5, 2005 RC32365 Boot Configuration Vector The boot configuration vector is read into the RC32365 during cold reset. The vector defines parameters in the RC32365 that are essential to operation when cold reset is complete. The encoding of boot configuration vector is described in Table 3, and the vector input is illustrated in Figure 4. Signal Name/Description MDATA[2:0] CPU Clock Multiplier. This field specifies the value by which the PLL multiplies the master clock input (CLK) to obtain the processor clock frequency (PCLK). 0x0 - Multiply by 2 0x1 - 0x7 — Reserved MDATA[3] Endian. This bit specifies the endianness. 0x0 - little endian 0x1 - big endian MDATA[4] Reserved. This pin may be driven high or low during boot configuration and its state is recorded in the Boot Configuration Vector (BCV) field of the BCV register. This reserved bit may be used to pass boot configuration parameters to software. MDATA[6:5] Boot Device Width. This field specifies the width of the boot device (i.e., Device 0). 0x0 - 8-bit boot device width 0x1 - 16-bit boot device width 0x2 - 32-bit boot device width 0x3 - reserved MDATA[7] Reset Mode. This bit specifies the length of time the RSTN signal is driven. 0x0 - Normal reset: RSTN driven for minimum of 4096 clock cycles 0x1 - reserved MDATA[8] Disable Watchdog Timer. When this bit is set, the watchdog timer is disabled following a cold reset. 0x0 - Watchdog timer is enabled 0x1 - Watchdog timer is disabled MDATA[11:9] PCI Mode. This bit controls the operating mode of the PCI bus interface. The initial value of the EN bit in the PCIC register is determined by the PCI mode. 0x0 - Disabled (EN initial value is zero) 0x1 - PCI satellite mode with PCI target not ready (EN initial value is one) 0x2 - PCI satellite mode with suspended CPU execution (EN initial value is one) 0x3 - PCI host mode with external arbiter (EN initial value is zero) 0x4 - PCI host mode with internal arbiter using fixed priority arbitration algorithm (EN initial value is zero) 0x5 - PCI host mode with internal arbiter using round robin arbitration algorithm (EN initial value is zero) 0x6 - reserved 0x7 - reserved MDATA[15:12] Reserved. These pins may be driven high or low during boot configuration and their state is recorded in the Boot Configuration Vector (BCV) field of the BCV register. These reserved bits may be used to pass boot configuration parameters to software. Table 3 Boot Configuration Vector Encoding 11 of 44 October 5, 2005 RC32365 Logic Diagram The following Logic Diagram shows the primary pin functions of the RC32365. Miscellaneous Signals CLK COLDRSTN RSTN 2 4 6 22 32 MIIMDC MIIMDIO Ethernet MII0CL MII0CRS MII0RXCLK MII0RXD[3:0] MII0RXDV MII0RXER MII0TXCLK MII0TXD[3:0] MII0TXENP MII0TXER MII1CL MII1CRS MII1RXCLK MII1RXD[3:0] MII1RXDV MII1RXER MII1TXCLK MII1TXD[3:0] MII1TXENP MII1TXER PCI Bus PCIAD[31:0] PCICBEN[3:0] PCICLK PCIDEVSELN PCIFRAMEN PCIGNTN[1:0] PCIIRDYN PCILOCKN PCIPAR PCIPERRN PCIREQN[1:0] PCIRSTN PCISERRN PCISTOPN PCITRDYN 2 4 BDIRN BOEN[1:0] BWEN[3:0] CSN[5:0] MADDR[21:0] MDATA[31:0] OEN RWN WAITACKN RASN CASN SDCSN[1:0] SDWEN SDCLKOUT SDCLKINP Memory and Peripheral Bus 4 RC32365 4 JTAG_TMS EJTAG_TMS JTAG_TRST_N JTAG_TCK JTAG_TDO JTAG_TDI EJTAG / JTAG Signals GPIO[15:0] General Purpose I/O 4 16 32 4 SDO SDI SCK Serial I/O 2 VccCore VccI/O Vss VccPLL VssPLL 2 Power/Ground Figure 1 RC32365 Logic Diagram 12 of 44 October 5, 2005 RC32365 AC Timing Definitions Below are examples of the AC timing characteristics used throughout this document. Tlow Tper Thigh clock Tdo Tdo Tzd Tdz Tjitter Trise Tfall Output signal 1 Output signal 2 Tsu Thld Input Signal 1 Tpw Signal 1 Signal 2 Tskew Signal 3 Figure 2 AC Timing Definitions Waveform Symbol Definition Tper Clock period. Tlow Clock low. Amount of time the clock is low in one clock period. Thigh Clock high. Amount of time the clock is high in one clock period. Trise Rise time. Low to high transition time. Tfall Fall time. High to low transition time. Tjitter Jitter. Amount of time the reference clock (or signal) edge can vary on either the rising or falling edges. Tdo Data out. Amount of time after the reference clock edge that the output will become valid. The minimum time represents the data output hold. The maximum time represents the earliest time the designer can use the data. Tzd Z state to data valid. Amount of time after the reference clock edge that the tri-stated output takes to become valid. Tdz Data valid to Z state. Amount of time after the reference clock edge that the valid output takes to become tri-stated. Tsu Input set-up. Amount of time before the reference clock edge that the input must be valid. Thld Input hold. Amount of time after the reference clock edge that the input must remain valid. Tpw Pulse width. Amount of time the input or output is active for asynchronous signals. Tslew Slew rate. The rise or fall rate for a signal to go from a high to low, or low to high. X(clock) Timing value. This notation represents a value of ‘X’ multiplied by the clock time period of the specified clock. Using 5(CLK) as an example: X = 5 and the oscillator clock (CLK) = 25MHz, then the timing value is 200. Tskew Skew. The amount of time two signal edges deviate from one another. Table 4 AC Timing Definitions 13 of 44 October 5, 2005 RC32365 Clock Parameters 15. The values given below are based on systems running at recommended supply voltages and operating temperatures, as shown in Tables 14 and Parameter Symbol 150MHz Reference Edge Min Max Units Timing Diagram Reference See Figure 3 PCLK1 Frequency none 100 150 MHz CLK2,3 Frequency none 50 75 MHz Tper_5a 13.3 20 ns Thigh_5a, Tlow_5a 40 60 % of Tper_5a Trise_5a, Tfall_5a — 3.0 ns Tjitter_5a — ± 250 ps Table 5 RC32365 Clock Parameters 1. The CPU pipeline clock (PCLK) speed is selected during cold reset by the boot configuration vector (see Table 3). 2. Ethernet clock (MIIxRXCLK and MIIxTXCLK) frequency must 3. be less than or equal to 1/2 CLK frequency. PCI clock (PCICLK) frequency must be less than or equal to two times CLK. Thigh_5a Tper_5a Tlow_5a CLK Tjitter_5a Tjitter_5a Trise_5a Tfall_5a Figure 3 Clock Parameters Waveform 14 of 44 October 5, 2005 RC32365 AC Timing Characteristics The values given below are based on systems running at recommended operating supply voltages and temperatures as shown in Tables 14 and 15. Signal 150MHz Symbol Reference Edge Min Max Tpw_6a1 none 110 Unit Conditions — ms Cold reset — 5.0 ns Cold reset CLK rising 2.0 9.0 ns Cold reset none 2(CLK) — ns Cold reset COLDRSTN rising 3.0 — ns Cold reset Timing Diagram Reference Reset and System COLDRSTN Trise_6a 2 Tdo_6b RSTN2 1 RSTN (output) (input) MDATA[15:0] Boot Configuration Vector Tpw_6c Thld_6d Tdz_6d1 COLDRSTN falling — 2(CLK) ns Cold reset Tdz_6d1 RSTN falling — 2(CLK) ns Warm reset Tzd_6d1 RSTN rising 3.0 — ns Warm reset See Figures 4 and 5 Table 6 Reset and System AC Timing Characteristics 1. The values for this symbol were determined by calculation, not by testing. 2. RSTN is a bidirectional signal. It is treated as an asynchronous input. 15 of 44 October 5, 2005 RC32365 2 1 3 4 5 6 7 8 CLK SDCLKOUT Trise_6a COLDRSTN Thld_6d Tdo_6b RSTN Tdz_6d FFFF_FFFF BOOT VECTOR MDATA[31:0] BDIRN BOEN[1:0] >= 100 ms >=10ms >= 4096 CLK clock cycles >= 4096 CLK clock cycles (RSTN sampled) (RSTN ignored during this period to allow pull-up to drive signal high) Tpw_6a 1. COLDRSTN asserted by external logic. 2. RC32365 asserts RSTN, asserts BOEN[0] low, drives BDIRN low, and tri-states the data bus in response. 3. External logic begins driving valid boot configuration vector on the data bus, and the RC32365 starts sampling it. 4. External logic negates COLDRSTN and tri-states the boot configuration vector on MDATA[15:0]. The boot configuration vector must not be tri-stated before COLDRSTN is deasserted. The RC32365 stops sampling the boot configuration vector. 5. The RC32365 starts driving the data bus, MDATA[31:0], deasserts BOEN[0] high, and drives BDIRN high. 6. SYSCLK may be held constant after this point if Hold SYSCLK Constant is selected in the boot configuration vector. 7. RSTN negated by the RC32365. 8. CPU begins executing by taking MIPS reset exception, and the RC32365 starts sampling RSTN as a warm reset input. Figure 4 Cold Reset AC Timing Waveform 1 2 3 4 5 CLK COLDRSTN Tdz_6d Tzd_6d RSTN FFFF_FFFF MDATA[31:0] Mem Control Signals Active Deasserted >= 4096 CLK clock cycles Active >= 4096 CLK clock cycles (RSTN sampled) (RSTN ignored during this period to allow pull-up to drive signal high) 1. Warm reset condition caused by either RSTN asserted, write to reset register, or bus transaction timer time-out. The RC32365 asserts RSTN output low in response. 2. The RC32365 tri-states the data bus, MDATA[31:0], and deasserts all memory control signals, such as RASN, CASN, RWN, OEN, etc. 3. The RC32365 deasserts RSTN. 4. The RC32365 starts driving the data bus, MDATA[31:0], again, but does not sample the RSTN input. 5. CPU begins executing by taking a MIPS soft reset exception and also starts sampling the RSTN input again. Figure 5 Warm Reset AC Timing Waveform 16 of 44 October 5, 2005 RC32365 Signal Symbol Reference Edge 150MHz Unit Min Max 1.0 — ns 1.7 — ns 1.2 6.0 ns 1.2 7.0 ns 1.2 8.0 ns Conditions Timing Diagram Reference Memory and Peripheral Bus - SDRAM Access MDATA[31:0] Tsu_7a Thld_7a Tdo_7a 1 Tdz_7a SDCLKINP rising SDCLKOUT rising Tzd_7a1 MADDR[20:2] Tdo_7b SDCLKOUT rising 1.2 6.0 ns RASN Tdo_7c SDCLKOUT rising 1.2 6.0 ns CASN Tdo_7d SDCLKOUT rising 1.2 6.0 ns SDWEN Tdo_7e SDCLKOUT rising 1.2 6.0 ns SDCSN[1:0] Tdo_7f SDCLKOUT rising 1.2 6.0 ns BDIRN Tdo_7g SDCLKOUT rising 1.2 6.0 ns BOEN[1:0] Tdo_7h SDCLKOUT rising 1.2 6.0 ns BWEN[3:0] Tdo_7i SDCLKOUT rising 1.2 6.0 ns SDCLKINP Tdelay_7k SDCLKOUT rising 0.0 2.5 ns SDCKENP Tdo_7l SDCLKOUT rising 2.0 6.0 ns See Figures 6 and 7 See Figures 6 and 8 Table 7 Memory and Peripheral Bus AC Timing Characteristics 1. The values for this symbol were determined by calculation, not by testing. 17 of 44 October 5, 2005 RC32365 CLK SDCLKOUT Tdo_7b MADDR[21:0] SDRAM CAS Latency Tdelay_7k Addr Tdo_7i BWEN[3:0] 1111 BE's 1111 Tdo_7c, 7d, and 7e CMD[2:0]* NOP READ NOP Tdo_7f SDCSN[1:0] 11 Chip-Sel 11 Tdo_7g Tdo_7g BDIRN Tdo_7h BOEN[1:0] 11 Tdo_7h Buffer Enables Tdz_7a 11 Tsu_7a Thld_7a Tzd_7a Data MDATA[31:0] RC32365 samples read data SDCLKINP * NOTE: CMD[2:0] = {RASN, CASN, SDWEN} Figure 6 Memory and Peripheral Bus AC Timing Waveform - SDRAM Read Access 18 of 44 October 5, 2005 RC32365 CLK SDCLKOUT SDRAM samples write data Tdo_7b Addr MADDR[21:0] Tdo_7i BWEN[3:0] 1111 BE's 1111 Tdo_7c, 7d, and 7e CMD[2:0]* NOP SDCSN[1:0] 11 WRITE NOP Chip-Sel 11 Tdo_7f Tdo_7g BDIRN Tdo_7h BOEN[1:0] 11 Buff Enable 11 Tdo_7a MDATA[31:0] Data * NOTE: CMD[2:0] = {RASN, CASN, SDWEN} Figure 7 Memory and Peripheral Bus AC Timing Waveform - SDRAM Write Access 19 of 44 October 5, 2005 RC32365 Vcc pull-up SDCLKOUT RSTN Tdelay_7k COLDRSTN RC32365 CLK SDCLKINP Memory Bus external buffer SRAM, SDRAM EPROM, etc. Figure 8 SDCLKOUT - SDCLKINP Relationship Signal Symbol Reference Edge 150MHz Unit Min Max 2.5 — ns Thld_8a 1.0 — ns Tdo_8a 2.0 6.5 ns Tdz_8a2 2.0 9.5 ns Tzd_8a2 2.0 10.5 ns Conditions Timing Diagram Reference Memory and Peripheral Bus1 — Device Access MDATA[31:0] Tsu_8a CLK rising MADDR[21:0] Tdo_8b CLK rising 2.0 6.5 ns MADDR[25:22] Tdo_8c CLK rising 3.0 7.5 ns CSN[5:0] Tdo_8d CLK rising 2.0 6.5 ns RWN Tdo_8e CLK rising 2.0 6.5 ns OEN Tdo_8f CLK rising 2.0 6.5 ns BWEN[1:0] Tdo_8g CLK rising 2.0 6.5 ns BDIRN Tdo_8h CLK rising 2.0 6.5 ns BOEN[1:0] Tdo_8i CLK rising 2.0 6.5 ns WAITACKN3 Tsu_8j CLK rising 2.0 — ns 0.5 — ns 2(CLK) — ns Thld_8j Tpw_8j2 none See Figures 9 and 10 Table 8 Memory and Peripheral Bus AC Timing Characteristics — Device Access (Part 1 of 2) 20 of 44 October 5, 2005 RC32365 150MHz Symbol Reference Edge Min Max CEN14, CEN24 Tdo_8k CLK rising 3.0 7.5 ns 4 REGN Tdo_8l CLK rising 3.0 7.5 ns IORDN4 Tdo_8m CLK rising 3.0 7.5 ns IOWRN4 Tdo_8n CLK rising 3.0 7.5 ns Signal Unit Conditions Timing Diagram Reference See Figures 9 and 10 (cont.) Table 8 Memory and Peripheral Bus AC Timing Characteristics — Device Access (Part 2 of 2) 1. The RC32365 provides bus turnaround cycles to prevent bus contention when going from a read to write and write to read. For example, there are no cycles where an external device and the RC32365 are both driving. See Chapter 6, Device Controller, in the RC32365 User Reference Manual. 2. The values for this symbol were determined by calculation, not by testing. 3. WAITACKN must meet the setup and hold times if it is synchronous or the minimum pulse width if it is asynchronous. 4. CEN1, CEN2, REGN, IORDN, and IOWRN are alternate functions of GPIO[12:8]. CLK Tdo_8b Addr[21:0] MADDR[21:0] Tdo_8c MADDR[25:22] Addr[25:22] RWN Tdo_8d Tdo_8d CSN[5:0] 1111 BWEN[3:0] Tdo_8f Tdo_8f OEN Thld_8a Tsu_8a Tdz_8a Tzd_8a Data MDATA[31:0] RC32365 samples read data Tdo_8h BDIRN Tdo_8i Tdo_8h Tdo_8i BOEN[1:0] WAITACKN Figure 9 Memory and Peripheral Bus AC Timing Waveform - Device Read Access 21 of 44 October 5, 2005 RC32365 CLK Tdo_8b Addr[21:0] MADDR[21:0] Tdo_8c Addr[25:22] MADDR[25:22] Tdo_8e RWN Tdo_8d CSN[5:0] Tdo_8g BWEN[3:0] 1111 Byte Enables 1111 OEN Tdo_8a Data MDATA[31:0] BDIRN Tdo_8i BOEN[1:0] WAITACKN Figure 10 Memory AC and Peripheral Bus Timing Waveform - Device Write Access 22 of 44 October 5, 2005 RC32365 Signal 150MHz Symbol Reference Edge Min Max Tper_9a None 53.3 — ns 23.0 — ns 10.0 — ns 1.0 — ns Unit Conditions Timing Diagram Reference Ethernet1 MIIMDC Thigh_9a, Tlow_9a MIIMDIO Tsu_9b MIIMDC rising Thld_9b Tdo_9b MIIxRXCLK, MIIxTXCLK2 MIIxRXCLK, MIIxTXCLK2 MIIxRXD[3:0], MIIxRXDV, MIIxRXER MIIxTXD[3:0], MIIxTXENP, MIIxTXER 1(ICLK) 3(ICLK) ns 399.96 400.4 ns Thigh_9c, Tlow_9c 140 260 ns Trise_9c, Tfall_9c — 3.0 ns 39.9 40.0 ns Thigh_9d, Tlow_9d 14.0 26.0 ns Trise_9d, Tfall_9d — 2.0 ns MIIxRXCLK rising 3.0 — ns 2.0 — ns MIIxTXCLK rising 5.0 13 ns Tper_9c Tper_9d Tsu_9e Thld_9e Tdo_9f None None See Figure 11 10 Mbps 100 Mbps Table 9 Ethernet AC Timing Characteristics 1. There are two MII interfaces and the timing is the same for each. “x” represents interface 0 or 1 (For example, MIIxRXCLK can be either MII0RXCLK or MII1RXCLK). 2. The ethernet clock (MIIxRXCLK and MIIxTXCLK) frequency must be equal to or less than 1/2 CLK (MIIxRXCLK and MIIxTXCLK 0.6(VccI/O) +26.7(VOUT) mA 0.6(VccI/O) > VOUT > 0.1(VccI/O) LOW Drive Output with Schmitt Trigger Input (STI) HIGH Drive Output with Standard Input Clock Drive Output PCI IOL(AC) Switching — +38(VccI/O) mA VOUT = 0.18(VccI/O) VIL -0.3 0.3(VccI/O) V — VIH 0.5(VccI/O) 5.5 V — CIN — 10 pF — I/OLEAK — 20 μA — Capacitance Leakage Table 16 DC Electrical Characteristics Power Consumption Parameter Power Dissipation Unit Typical Max. 60 80 mA Normal mode 710 750 mA Standby mode1 620 660 mA Normal mode 2.07 2.2 W Standby mode1 1.8 2.0 W IccI/O IccCore 150MHz Conditions CL = 25pF (affects I/O) Ta = 25oC Maximum values use the maximum voltages listed in Table 14. Typical values use the typical voltages listed in Table 14. Table 17 RC32365 Power Consumption 1. RISCore 32300 CPU core enters Standby mode by executing WAIT instructions; however, other logic continues to function. Standby mode reduces power consumption by 0.6 mA per MHz of the CPU pipeline clock, PCLK. 35 of 44 October 5, 2005 RC32365 Power Curve The following graph contains a power curve that shows power consumption at various bus frequencies. Typical Power Curve Power (W @ 3.3v IO & 2.5v core) 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2.0 1.9 1.8 70 75 80 85 90 95 100 System Bus Speed (MHz) Figure 25 Typical Power Usage Absolute Maximum Ratings Symbol Parameter Min1 Max1 Unit VCCI/O I/O Supply Voltage -0.6 4.0 V VCCCore Core Supply Voltage -0.3 3.0 V VCCPLL PLL Supply Voltage -0.3 3.0 V Vimin Input Voltage - undershoot -0.6 — V Vi I/O Input Voltage Gnd VCCI/O+0.6 V Ta, Industrial Ambient Operating Temperature -40 +85 °C Ta, Commercial Ambient Operating Temperature 0 +70 °C Tstg Storage Temperature -40 +125 °C Table 18 Absolute Maximum Ratings 1. Functional and tested operating conditions are given in Table 14. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 36 of 44 October 5, 2005 RC32365 Package Pin-out — 256-Pin CABGA The following table lists the pin numbers and signal names for the RC32365. Pin Function Alt Pin Function A1 MII0RXD[0] E1 GPIO[15] A2 MII0RXDV E2 A3 MII0RXER A4 Alt 1 Pin Function Alt Pin Function J1 PCIGNTN[1] N1 PCIAD[4] JTAG_TRST_N J2 PCIDEVSELN N2 PCIAD[20] E3 JTAG_TDO J3 PCIGNTN[0] N3 PCIAD[19] MII0TXCLK E4 JTAG_TDI J4 PCIFRAMEN N4 PCIAD[11] A5 MII0TXD[2] E5 VccCORE J5 VccI/O N5 PCIAD[13] A6 MII0CRS E6 VccI/O J6 Vss N6 PCIAD[15] A7 VssPLL E7 VccI/O J7 Vss N7 BOEN[0] A8 MII1RXCLK E8 VccI/O J8 Vss N8 CSN[2] A9 MII1TXD[2] E9 VccI/O J9 Vss N9 CSN[3] A10 MII1CL E10 VccI/O J10 Vss N10 RWN A11 JTAG_TCK E11 VccI/O J11 Vss N11 MDATA[1] A12 GPIO[9] 1 E12 VccCORE J12 VccI/O N12 MDATA[3] A13 GPIO[5] 1 E13 MADDR[5] J13 SDWEN N13 MDATA[12] A14 GPIO[3] 1 E14 MADDR[16] J14 SDCLKINP N14 MDATA[30] A15 GPIO[1] 1 E15 MADDR[17] J15 BWEN[2] N15 MDATA[11] A16 MADDR[10] E16 MADDR[6] J16 BWEN[3] N16 MDATA[27] B1 MII0RXD[3] F1 GPIO[14] 1 K1 PCICBEN[1] P1 PCIAD[5] B2 MII0RXD[1] F2 GPIO[13] 1 K2 PCICBEN[2] P2 PCIAD[21] B3 MII0RXCLK F3 PCITRDYN K3 PCICBEN[0] P3 PCIAD[23] B4 MII0TXER F4 PCISTOPN K4 PCICLK P4 PCIAD[10] B5 MII0TXD[3] F5 VccCORE K5 VccI/O P5 PCIAD[28] B6 MII0CL F6 VccI/O K6 Vss P6 PCIAD[30] B7 VccPLL F7 Vss K7 Vss P7 BDIRN B8 MII1RXDV F8 Vss K8 Vss P8 CSN[1] B9 MII1TXD[3] F9 Vss K9 Vss P9 CSN[4] B10 MII1CRS F10 Vss K10 Vss P10 WAITACKN B11 GPIO[12] 1 F11 VccI/O K11 Vss P11 MDATA[17] B12 GPIO[8] 1 F12 VccCORE K12 VccCORE P12 MDATA[19] B13 GPIO[4] 1 F13 MADDR[3] K13 BWEN[1] P13 MDATA[5] B14 GPIO[2] 1 F14 MADDR[14] K14 RASN P14 MDATA[9] B15 MADDR[21] F15 MADDR[15] K15 CASN P15 MDATA[10] B16 MADDR[20] F16 MADDR[4] K16 BWEN[0] P16 MDATA[26] C1 MIIMDC G1 PCIRSTN L1 PCIAD[16] R1 PCIAD[6] C2 MIIMDIO G2 PCISERRN L2 PCIAD[1] R2 PCIAD[7] Alt Table 19: 256-pin CABGA Package Pin-Out (Part 1 of 2) 37 of 44 October 5, 2005 RC32365 Pin Function Alt Pin Function Alt Pin Function Alt Pin Function C3 MII0RXD[2] G3 PCIPERRN L3 PCIAD[0] R3 PCIAD[24] C4 MII0TXENP G4 PCIREQN[0] L4 PCICBEN[3] R4 PCIAD[25] C5 MII0TXD[1] G5 VccCORE L5 VccCORE R5 PCIAD[27] C6 MII1RXD[3] G6 Vss L6 VccI/O R6 PCIAD[29] C7 MII1RXD[0] G7 Vss L7 Vss R7 PCIAD[31] C8 MII1RXER G8 Vss L8 Vss R8 BOEN[1] C9 MII1TXENP G9 Vss L9 Vss R9 OEN C10 MII1TXD[0] G10 Vss L10 Vss R10 MDATA[16] C11 EJTAG_TMS G11 Vss L11 VccI/O R11 MDATA[18] C12 GPIO[10] 1 G12 VccI/O L12 VccCORE R12 MDATA[20] C13 GPIO[6] 1 G13 MADDR[1] L13 CLK R13 MDATA[21] C14 GPIO[0] 1 G14 MADDR[12] L14 SDCLKOUT R14 MDATA[7] C15 MADDR[9] G15 MADDR[13] L15 MDATA[15] R15 MDATA[24] C16 MADDR[19] G16 MADDR[2] L16 MDATA[31] R16 MDATA[25] D1 SDI H1 PCIPAR M1 PCIAD[18] T1 PCIAD[22] D2 COLDRSTN H2 PCIREQN[1] M2 PCIAD[3] T2 PCIAD[8] D3 SDO H3 PCILOCKN M3 PCIAD[2] T3 PCIAD[9] D4 SCK H4 PCIRDYN M4 PCIAD[17] T4 PCIAD[26] D5 MII0TXD[0] H5 VccI/O M5 VccCORE T5 PCIAD[12] D6 MII1RXD[2] H6 Vss M6 VccI/O T6 PCIAD[14] D7 MII1RXD[1] H7 Vss M7 VccI/O T7 RSTN D8 MII1TXER H8 Vss M8 VccI/O T8 CSN[0] D9 MII1TXCLK H9 Vss M9 VccI/O T9 CSN[5] D10 MII1TXD[1] H10 Vss M10 VccI/O T10 MDATA[0] D11 JTAG_TMS H11 Vss M11 VccI/O T11 MDATA[2] D12 GPIO[11] 1 H12 VccI/O M12 VccCORE T12 MDATA[4] D13 GPIO[7] 1 H13 SDCSN[0] M13 MDATA[14] T13 MDATA[6] D14 MADDR[7] H14 SDCSN[1] M14 MDATA[13] T14 MDATA[22] D15 MADDR[18] H15 MADDR[11] M15 MDATA[28] T15 MDATA[23] D16 MADDR[8] H16 MADDR[0] M16 MDATA[29] T16 MDATA[8] Alt Table 19: 256-pin CABGA Package Pin-Out (Part 2 of 2) 38 of 44 October 5, 2005 RC32365 RC32365 Power Pins VccI/O VccI/O VccCore VccPLL E6 J5 E5 B7 E7 J12 E12 E8 K5 F5 E9 L6 F12 E10 L11 G5 E11 M6 K12 F6 M7 L5 F11 M8 L12 G12 M9 M5 H5 M10 M12 H12 M11 Table 20 RC32365 Power Pins RC32365 Ground Pins Vss Vss Vss VssPLL F7 H7 K6 A7 F8 H8 K7 F9 H9 K8 F10 H10 K9 G6 H11 K10 G7 J6 K11 G8 J7 L7 G9 J8 L8 G10 J9 L9 G11 J10 L10 H6 J11 Table 21 RC32365 Ground Pins 39 of 44 October 5, 2005 RC32365 Alternate Pin Functions Pin Primary Alt #1 C14 GPIO[0] U0SOUT A15 GPIO[1] U0SINP B14 GPIO[2] MADDR[22] A14 GPIO[3] MADDR[23] B13 GPIO[4] MADDR[24] A13 GPIO[5] MADDR[25] C13 GPIO[6] N/A D13 GPIO[7] SDCKENP B12 GPIO[8] CEN1 A12 GPIO[9] CEN2 C12 GPIO[10] REGN D12 GPIO[11] IORDN B11 GPIO[12] IOWRN F2 GPIO[13] PCIREQN[2] F1 GPIO[14] PCIGNTN[2] E1 GPIO[15] PCIMUNITN Table 22 Alternate Pin Functions 40 of 44 October 5, 2005 RC32365 RC32365 Pinout — Top View 1 2 3 A 4 5 6 7 8 9 10 11 12 13 14 15 16 VssPLL B VccPLL C D E F G H J K L M N P R T Vss (Ground) VccI/O (Power) VccCore (Power) 41 of 44 October 5, 2005 RC32365 Package Drawing - 256-pin CABGA 42 of 44 October 5, 2005 RC32365 Package Drawing - page two 43 of 44 October 5, 2005 RC32365 Ordering Information 79RCXX Product Type YY Operating Voltage XXXX 999 Device Type Speed A A Package Temp range/ Process Blank Commercial Temperature (0°C to +70°C Ambient) I Industrial Temperature (-40° C to +85° C Ambient) BC BCG 256-pin CABGA 256-pin Green CABGA 150 150 MHz Pipeline Clk 365 Integrated Core Processor T 2.5V +/-5% Core Voltage 79RC32 32-bit Embedded Microprocessor Valid Combinations 79RC32T365 - 150BC 256-pin CABGA package, Commercial Temperature 79RC32T365 - 150BCG 256-pin CABGA package, Commercial Temperature (Green) 79RC32T365 - 150BCI 256-pin CABGA package, Industrial Temperature 79RC32T365 - 150BCGI 256-pin CABGA package, Industrial Temperature (Green) CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 44 of 44 for Tech Support: email: rischelp@idt.com phone: 408-284-8208 October 5, 2005
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