DATASHEET
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
FN6307
Rev.6.01
Nov 7, 2019
±15kV ESD Protected, 3.3V, Full Fail-Safe, Low Power, High Speed or Slew Rate
Limited, RS-485/RS-422 Transceivers
The Renesas ISL317xE are ±15kV IEC61000 ESD
protected, 3.3V powered single transceivers that meet both
the RS-485 and RS-422 standards for balanced
communication. These devices have very low bus currents
(+125µA/-100µA), so they present a true “1/8 unit load” to
the RS-485 bus. This allows up to 256 transceivers on the
network without violating the RS-485 specification’s 32 unit
load maximum, and without using repeaters. For example, in
a remote utility meter reading system, individual meter
readings are routed to a concentrator using an RS-485
network, so the high allowed node count minimizes the
number of repeaters required.
Features
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven.
• Low quiescent supply current. . . . . . . . . . . . .800µA (Max)
- Ultra low shutdown supply current . . . . . . . . . . . . .10nA
Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state while the power supply stabilizes.
• Half and full duplex pinouts
The ISL3170E through ISL3175E utilize slew rate limited
drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications. Slew rate
limited versions also include receiver input filtering to
enhance noise immunity in the presence of slow input signals.
• IEC61000 ESD protection on RS-485 I/O pins . . . . ±15kV
- Class 3 ESD level on all other pins . . . . . . . >7kV HBM
• Full fail-safe (open, short, terminated/floating) receivers
• Hot plug - Tx and Rx outputs remain three-state during
power-up (only versions with output enable pins)
• True 1/8 unit load allows up to 256 devices on the bus
• Single 3.3V supply
• High data rates . . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
• -7V to +12V common-mode input/output voltage range
• Three state Rx and Tx outputs available
• Current limiting and thermal shutdown for driver overload
protection
• Tiny MSOP packages consume 50% less board space
• Pb-free (RoHS compliant)
The ISL3170E, ISL3171E, ISL3173E, ISL3174E, ISL3176E,
and ISL3177E are configured for full duplex (separate Rx
input and Tx output pins) applications. The half duplex
versions multiplex the Rx inputs and Tx outputs to allow
transceivers with output disable functions in 8 Ld packages.
Applications
Related Literature
• Security camera networks
• For a full list of related documents, visit our website
- ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E,
ISL3175E, ISL3176E, ISL3177E, ISL3178E product pages
• Building environmental control/lighting systems
• Automated utility meter reading systems
• High node count systems
• Field bus networks
• Industrial/process control networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
# DEVICES
ON BUS
RX/TX
ENABLE?
QUIESCENT
ICC (µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL3170E
Full
0.25
Yes
Yes
256
Yes
510
Yes
10, 14
ISL3171E
Full
0.25
Yes
No
256
No
510
No
8
ISL3172E
Half
0.25
Yes
Yes
256
Yes
510
Yes
8
ISL3173E
Full
0.5
Yes
Yes
256
Yes
510
Yes
10, 14
ISL3174E
Full
0.5
Yes
No
256
No
510
No
8
ISL3175E
Half
0.5
Yes
Yes
256
Yes
510
Yes
8
ISL3176E
Full
20
No
Yes
256
Yes
510
Yes
10, 14
ISL3177E
Full
20
No
No
256
No
510
No
8
ISL3178E
Half
20
No
Yes
256
Yes
510
Yes
8
FN6307 Rev.6.01
Nov 7, 2019
Page 1 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Ordering Information
PART NUMBER (Notes 3, 4)
PART MARKING
TEMP. RANGE (°C)
PACKAGE (RoHS Compliant)
PKG. DWG. #
ISL3170EIBZ (Notes 1, 2)
3170EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3170EIUZ (Note 1)
3170Z
-40 to +85
10 Ld MSOP
M10.118
ISL3171EIBZ (Notes 1, 2)
3171 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3171EIUZ (Note 1)
3171Z
-40 to +85
8 Ld MSOP
M8.118
ISL3172EIBZ (Notes 1, 2)
3172 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3172EIUZ (Note 1)
3172Z
-40 to +85
8 Ld MSOP
M8.118
ISL3173EIBZ (Note 1)
3173EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3173EIUZ (Note 1)
3173Z
-40 to +85
10 Ld MSOP
M10.118
ISL3174EIBZ (Note 1) No longer
available, recommended
replacement: ISL3177EIBZ
3174 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3174EIUZ (Note 1)
3174Z
-40 to +85
8 Ld MSOP
M8.118
ISL3175EIBZ (Note 1)
3175 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3175EIUZ (Note 1)
3175Z
-40 to +85
8 Ld MSOP
M8.118
ISL3176EIBZ (Note 1)
3176EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3176EIUZ (Notes 1, 2)
3176Z
-40 to +85
10 Ld MSOP
M10.118
ISL3177EIBZ (Note 1)
3177 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3177EIUZ (Note 1)
3177Z
-40 to +85
8 Ld MSOP
M8.118
ISL3178EIBZ (Notes 1, 2)
3178 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3178EIUZ (Note 1)
3178Z
-40 to +85
8 Ld MSOP
M8.118
NOTES:
1. Add “-T” suffix for 2.5k tape and reel options. Refer to TB347 for details on reel specifications.
2. Add “-T7A” suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications.
3. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), see the product information page for the ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E,
ISL3176E, ISL3177E, ISL3178E. For more information on MSL refer to TB363.
FN6307 Rev.6.01
Nov 7, 2019
Page 2 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Pinouts
ISL3171E, ISL3174E, ISL3177E
(8 LD MSOP, SOIC)
TOP VIEW
ISL3172E, ISL3175E, ISL3178E
(8 LD MSOP, SOIC)
TOP VIEW
RO 1
8
VCC
VCC 1
RE 2
7
B/Z
DE 3
6
A/Y
R
D
DI 4
GND
5
RE 2
R
DE 3
DI 4
D
GND 5
A
RO 2
7
B
DI 3
6
Z
5
Y
GND 4
D
ISL3170E, ISL3173E, ISL3176E
(14 LD SOIC)
TOP VIEW
ISL3170E, ISL3173E, ISL3176E
(10 LD MSOP)
TOP VIEW
RO 1
8
R
10 VCC
NC 1
9 A
RO 2
8 B
RE 3
7 Z
DE 4
6 Y
DI 5
14 VCC
13 NC
R
12 A
11 B
D
10 Z
GND 6
9 Y
GND 7
8 NC
Truth Tables
TRANSMITTING
INPUTS
OUTPUTS
RE
DE
DI
Z
Y
X
1
1
0
1
X
1
0
1
0
0
0
X
High-Z
High-Z
1
0
X
High-Z*
High-Z*
NOTE: *Shutdown Mode (see Note 11 on page 9), except for the
ISL3171E, ISL3174E, ISL3177E.
RECEIVING
INPUTS
RE
DE
DE
Half Duplex Full Duplex
OUTPUT
A-B
RO
VAB ≥ -0.05V
1
0
0
X
0
0
X
0
0
X
VAB ≤ -0.2V
0
0
X
Inputs Open/Shorted
1
1
0
X
X
High-Z*
1
1
X
X
High-Z
-0.05V > VAB > -0.2V Undetermined
0
NOTE: *Shutdown Mode (see Note 11), except for the ISL3171E,
ISL3174E, ISL3177E.
FN6307 Rev.6.01
Nov 7, 2019
Page 3 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; if A and B are unconnected (floating) or shorted, RO = High.
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function is not required,
connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable
function is not required, connect DE to VCC through a 1kΩ to 3kΩ resistor.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND Ground connection.
A/Y
±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin
is an output if DE = 1.
B/Z
±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an
output if DE = 1.
A
±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input.
B
±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input.
Y
±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output.
Z
±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output.
VCC System power supply input (3.0V to 3.6V).
NC
No Connection.
Typical Operating Circuits
+3.3V
+3.3V
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
2 RE
B/Z
7
3 DE
A/Y
6
4 DI
RT
RT
DI 4
7
B/Z
DE 3
6
A/Y
RE 2
RO 1
R
D
GND
GND
5
5
FIGURE 1. ISL3172E, ISL3175E, ISL3178E
+3.3V
+3.3V
+
1
0.1µF
0.1µF
+
1
VCC
A 8
2 RO
3 DI
VCC
R
RT
B 7
RT
Z 6
Y 5
D
5
Y
6
Z
D
7 B
R
8 A
GND
GND
4
4
DI 3
RO 2
FIGURE 2. ISL3171E, ISL3174E, ISL3177E
FN6307 Rev.6.01
Nov 7, 2019
Page 4 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Typical Operating Circuits (Continued)
(PIN NUMBERS FOR SOIC)
+3.3V
+
14
VCC
2 RO
R
A 12
0.1µF
+3.3V
0.1µF
RT
+
14
VCC
9 Y
B 11
D
10 Z
3 RE
DE 4
RE 3
4 DE
5 DI
DI 5
RT
Z 10
Y 9
D
11 B
R
12 A
GND
RO 2
GND
6, 7
6, 7
FIGURE 3. ISL3170E, ISL3173E, ISL3176E
FN6307 Rev.6.01
Nov 7, 2019
Page 5 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Absolute Maximum Ratings
Thermal Information
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
DE, RE (Note 21) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . See Electrical Specifications Table
Thermal Resistance (Typical, Note 5)
θJA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
140
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
190
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
128
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
5. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. Refer to TB379 for details.
Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; unless otherwise specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 6)
PARAMETER
MAX
(Note 20) UNITS
TEMP
(°C)
MIN
(Note 20)
TYP
RL = 100Ω (RS-422) (Figure 4A, Note 17)
Full
2
2.3
-
V
RL = 54Ω (RS-485) (Figure 4A)
Full
1.5
2
VCC
V
-
-
VCC
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B)
Full
1.5
2.2
-
V
ΔVOD
RL = 54Ω or 100Ω (Figure 4A)
Full
-
0.01
0.2
V
VOC
RL = 54Ω or 100Ω (Figure 4A)
Full
-
2
3
V
ΔVOC
RL = 54Ω or 100Ω (Figure 4A)
Full
-
0.01
0.2
V
SYMBOL
TEST CONDITIONS
DC CHARACTERISTICS
Driver Differential VOUT
VOD
No Load
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
Logic Input High Voltage
VIH
DI, DE, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DI, DE, RE
Full
-
-
0.8
V
DE, RE (Note 16)
25
-
100
-
mV
Logic Input Hysteresis
VHYS
Logic Input Current
IIN1
DI = DE = RE = 0V or VCC (Note 19)
Full
-2
-
2
µA
Input Current (A, B, A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V or VIN = 12V
3.6V
VIN = -7V
Full
-
80
125
µA
Full
-100
-50
-
µA
RE = 0V, DE = 0V,
VCC = 0V or 3.6V
VIN = 12V
Full
-
10
40
µA
VIN = -7V
Full
-40
-10
-
µA
RE = VCC, DE = 0V,
VCC = 0V or 3.6V
VIN = 12V
Full
-
10
40
µA
VIN = -7V
Full
-40
-10
-
µA
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 8)
Full
-
-
±250
mA
-7V ≤ VCM ≤ 12V
Full
-200
-125
-50
mV
VCM = 0V
25
-
15
-
mV
Output Leakage Current (Y, Z) (Full
Duplex Versions Only, Note 14)
IIN3
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex,
Note 14)
IIN4
Driver Short-Circuit Current,
VO = High or Low
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
FN6307 Rev.6.01
Nov 7, 2019
IOSD1
VTH
ΔVTH
Page 6 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; unless otherwise specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 6)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 20)
TYP
MAX
(Note 20) UNITS
Receiver Output High Voltage
VOH
IO = -4mA, VID = -50mV
Full
VCC - 0.6
-
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = -200mV
Full
-
0.17
0.4
V
Three-State (high impedance)
Receiver Output Current (Note 14)
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-1
0.015
1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
96
150
-
kΩ
0V ≤ VO ≤ VCC
Full
±7
30
±60
mA
Full
-
150
-
°C
DE = VCC,
RE = 0V or VCC
Full
-
510
800
µA
DE = 0V, RE = 0V
Full
-
480
700
µA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.01
12
µA
IEC61000-4-2, Air-Gap Discharge Method
25
-
±15
-
kV
IEC61000-4-2, Contact Discharge Method
25
-
±8
-
kV
Human Body Model, from bus pins to GND
25
-
±15
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±7
-
kV
Machine Model
25
-
200
-
V
VOD = ±1.5V, CD = 820pF (Figure 7, Note 18)
Full
250
800
-
kbps
Receiver Short-Circuit Current
IOSR
Thermal Shutdown Threshold
TSD
SUPPLY CURRENT
No-Load Supply Current (Note 7)
Shutdown Supply Current
(Note 14)
ICC
ISHDN
DI = 0V or VCC
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z)
All Pins
DRIVER SWITCHING CHARACTERISTICS (ISL3170E, ISL3171E, ISL3172E, 250kbps)
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
250
1100
1500
ns
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
-
6
100
ns
tR, tF
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
350
960
1600
ns
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Notes 9, 14)
Full
-
26
600
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Notes 9, 14)
Full
-
200
600
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Note 14)
Full
-
28
55
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Note 14)
Full
-
30
55
ns
(Notes 11, 14)
Full
50
200
600
ns
Driver Differential Rise or Fall Time
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Notes 11, 12, 14)
Full
-
180
700
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Notes 11, 12, 14)
Full
-
100
700
ns
VOD = ±1.5V, CD = 820pF (Figure 7, Note 18)
Full
500
1600
-
kbps
180
350
800
ns
DRIVER SWITCHING CHARACTERISTICS (ISL3173E, ISL3174E, ISL3175E, 500kbps)
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
-
1
30
ns
tR, tF
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
200
380
800
ns
Driver Differential Rise or Fall Time
FN6307 Rev.6.01
Nov 7, 2019
Page 7 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; unless otherwise specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 6)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 20)
TYP
MAX
(Note 20) UNITS
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Notes 9, 14)
Full
-
26
350
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Notes 9, 14)
Full
-
100
350
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Note 14)
Full
-
28
55
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Note 14)
Full
-
30
55
ns
(Notes 11, 14)
Full
50
200
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Notes 11, 12, 14)
Full
-
180
700
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Notes 11, 12, 14)
Full
-
100
700
ns
VOD = ±1.5V, CD = 350pF
(Figure 7, Note 18)
Full
20
28
-
Mbps
DRIVER SWITCHING CHARACTERISTICS (ISL3176E, ISL3177E, ISL3178E, 20Mbps)
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
-
27
40
ns
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
-
1
3
ns
RDIFF = 54Ω, CD = 50pF (Figure 5, Note 15)
Full
-
-
11
ns
tR, tF
RDIFF = 54Ω, CD = 50pF (Figure 5)
Full
-
9
15
ns
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Notes 9, 14)
Full
-
17
50
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Notes 9, 14)
Full
-
16
40
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Note 14)
Full
-
25
40
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Note 14)
Full
-
28
50
ns
(Notes 11, 14)
Full
50
200
600
ns
Driver Output Skew, Part-to-Part
Driver Differential Rise or Fall Time
Time to Shutdown
ΔtDSKEW
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND
(Figure 6, Notes 11, 12, 14)
Full
-
180
700
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC
(Figure 6, Notes 11, 12, 14)
Full
-
90
700
ns
VID = ±1.5V (Note 18) ISL3170E-75E
Full
12
20
-
Mbps
ISL3176E-78E
Full
20
35
-
Mbps
ISL3170E-75E
Full
25
70
120
ns
ISL3176E-78E
Full
25
33
60
ns
(Figure 8)
Full
-
1.5
4
ns
(Figure 8, Note 15)
Full
-
-
15
ns
RECEIVER SWITCHING CHARACTERISTICS (All Versions)
Maximum Data Rate
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
Receiver Skew, Part-to-Part
Receiver Enable to Output High
Receiver Enable to Output Low
FN6307 Rev.6.01
Nov 7, 2019
fMAX
tPLH, tPHL (Figure 8)
tSKD
ΔtRSKEW
tZH
tZL
RL = 1kΩ, CL = 15pF,
SW = GND (Figure 9,
Notes 10, 14)
ISL3170E-75E
Full
5
15
20
ns
ISL3176E-78E
Full
5
11
17
ns
RL = 1kΩ, CL = 15pF,
SW = VCC (Figure 9,
Notes 10, 14)
ISL3170E-75E
Full
5
15
20
ns
ISL3176E-78E
Full
5
11
17
ns
Page 8 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; unless otherwise specified. Typicals are at VCC = 3.3V, TA = +25°C,
(Note 6)
PARAMETER
SYMBOL
Receiver Disable from Output High
tHZ
Receiver Disable from Output Low
tLZ
Time to Shutdown
tSHDN
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 20)
TYP
MAX
(Note 20) UNITS
RL = 1kΩ, CL = 15pF,
SW = GND (Figure 9,
Note 14)
ISL3170E-75E
Full
5
12
20
ns
ISL3176E-78E
Full
4
7
15
ns
RL = 1kΩ, CL = 15pF,
SW = VCC (Figure 9,
Note 14)
ISL3170E-75E
Full
5
13
20
ns
ISL3176E-78E
Full
4
7
15
ns
Full
50
180
600
ns
(Notes 11, 14)
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Notes 11, 13, 14)
Full
-
240
500
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Notes 11, 13, 14)
Full
-
240
500
ns
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” starting on page 14 for more information.
9. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN.
10. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN.
13. Set the RE signal high time >600ns to ensure that the device enters SHDN.
14. Does not apply to the ISL3171E, ISL3174E, or ISL3177E.
15. ΔtSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
temperature, etc.). Applies only to the ISL3176E through ISL3178E.
16. ISL3170E through ISL3175E only.
17. VCC ≥ 3.15V.
18. Limits established by characterization and are not production tested.
19. If the Tx or Rx enable function is not needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 4) through a 1kΩ
to 3kΩ resistor.
20. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
21. If the DE or RE input voltage exceeds the VCC voltage by more than 500mV, then current will flow into the logic pin. The current is limited by a
340Ω resistor (so ≈ 13mA with VIN = 5V and VCC = 0V) so no damage will occur if VCC ≤ VIN ≤ 7V for short periods of time.
FN6307 Rev.6.01
Nov 7, 2019
Page 9 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Test Circuits and Waveforms
VCC
RL/2
DE
VCC
Z
DI
Z
DI
VOD
D
375Ω
DE
VOD
D
Y
VCM
RL = 60Ω
-7V to +12V
Y
VOC
RL/2
375Ω
FIGURE 4B. VOD WITH COMMON MODE LOAD
FIGURE 4A. VOD AND VOC
FIGURE 4. DC DRIVER TEST CIRCUITS
3V
DI
1.5V
1.5V
0V
VCC
tPHL
tPLH
DE
Z
DI
RDIFF
D
OUT (Z)
VOH
OUT (Y)
VOL
CD
Y
SIGNAL
GENERATOR
90%
DIFF OUT (Y to Z)
+VOD
90%
10%
10%
tR
-VOD
tF
SKEW = |tPLH - tPHL|
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
500Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
GND
50pF
PARAMETER
OUTPUT
RE
DI
SW
tHZ
Y/Z
X
1/0
GND
tLZ
Y/Z
X
0/1
VCC
tZH
Y/Z
0 (Note 9)
1/0
GND
tZL
Y/Z
0 (Note 9)
0/1
VCC
tZH(SHDN)
Y/Z
1 (Note 12)
1/0
GND
tZL(SHDN)
Y/Z
1 (Note 12)
0/1
VCC
FIGURE 6A. TEST CIRCUIT
3V
DE
Note 11
1.5V
1.5V
0V
tZH, tZH(SHDN)
NOTE 11
OUTPUT HIGH
tHZ
VOH - 0.25V
50%
OUT (Y, Z)
VOH
0V
tZL, tZL(SHDN)
Note 11
OUT (Y, Z)
tLZ
VCC
50%
OUTPUT LOW
VOL + 0.25V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E)
FN6307 Rev.6.01
Nov 7, 2019
Page 10 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Test Circuits and Waveforms (Continued)
VCC
DE
3V
+
Z
DI
VOD
CD
54Ω
D
DI
Y
0V
-
SIGNAL
GENERATOR
+VOD
DIFF OUT (Y to Z)
-VOD
FIGURE 7A. TEST CIRCUIT
0V
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7. DRIVER DATA RATE
+1.5V
RE
GND
A
15pF
B
R
A
0V
0V
RO
-1.5V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
1.5V
RO
1.5V
0V
FIGURE 8B. MEASUREMENT POINTS
FIGURE 8A. TEST CIRCUIT
FIGURE 8. RECEIVER PROPAGATION DELAY
RE
B
GND
A
R
1kΩ
RO
VCC
SW
SIGNAL
GENERATOR
GND
NOTE 11
3V
15pF
RE
1.5V
1.5V
0V
PARAMETER
DE
A
SW
tHZ
X
+1.5V
GND
tLZ
X
-1.5V
VCC
tZH (Note 10)
0
+1.5V
GND
tZL (Note 10)
0
-1.5V
VCC
tZH(SHDN) (Note 13)
0
+1.5V
GND
tZL(SHDN) (Note 13)
0
-1.5V
VCC
FIGURE 9A. TEST CIRCUIT
tZH, tZH(SHDN)
OUTPUT HIGH
Note 11
tHZ
V
VOH - 0.25V OH
1.5V
RO
0V
tZL, tZL(SHDN)
Note 11
RO
tLZ
VCC
1.5V
VOL + 0.25V V
OUTPUT LOW
OL
FIGURE 9B. MEASUREMENT POINTS
FIGURE 9. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E)
FN6307 Rev.6.01
Nov 7, 2019
Page 11 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only
one driver and up to 10 receivers on each bus, assuming
one unit load devices.. RS-485 is a true multipoint standard,
which allows up to 32 one-unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 specification requires
that drivers must handle bus contention without sustaining
any damage.
Another important advantage of RS-485 is the extended
common-mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000ft, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
Receiver Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is better than ±200mV, as required by the RS-422 and RS-485
specifications.
Receiver input resistance of 96kΩ surpasses the RS-422
specification of 4kΩ and is eight times the RS-485 “Unit Load
(UL)” requirement of 12kΩ minimum. Thus, these products
are known as “one-eighth UL” transceivers and there can be
up to 256 of these devices on a network while still complying
with the RS-485 loading specification.
Receiver inputs function with common-mode voltages as
great as +9V/-7V outside the power supplies (that is, +12V
and -7V), making them ideal for long networks where induced
voltages and ground potential differences are realistic
concerns.
All the receivers include a “Full Fail-Safe” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating) or shorted. Fail-safe with shorted
inputs is achieved by setting the Rx upper switching point to
-50mV, thereby ensuring that the Rx sees 0V differential as a
high input level.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs (except on the
ISL3171E, ISL3174E, and ISL3177E) are tri-statable using
the active low RE input.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485) and at
least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width and to
minimize EMI.
FN6307 Rev.6.01
Nov 7, 2019
All drivers are tri-statable through the active high DE input,
except on the ISL3171E, ISL3174E, and ISL3177E.
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL3176E through ISL3178E drivers are not limited, so
faster output transition times allow data rates of at least
20Mbps.
Hot Plug Function
When a piece of equipment powers up, a period of time
occurs in which the processor or ASIC driving the RS-485
control lines (DE, RE) is unable to ensure that the RS-485
Tx and Rx outputs are kept disabled. If the equipment is
connected to the bus, a driver activating prematurely during
power up may crash the bus. To avoid this scenario, the
ISL317XE versions with output enable pins incorporate a
“Hot Plug” function. During power up, circuitry monitoring VCC
ensures that the Tx and Rx outputs remain disabled for a period
of time, regardless of the state of DE and RE. This gives the
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.
ESD Protection
All pins on these devices include Class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
incorporate advanced structures allowing them to survive
ESD events in excess of ±15kV HBM and ±15kV
IEC61000. The RS-485 pins are particularly vulnerable to
ESD damage because they typically connect to an exposed
port on the exterior of the finished product. Simply touching
the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether or not it is powered
up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection
eliminates the need for board level protection structures
(for example, transient suppression diodes), and the
associated, undesirable capacitive load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-485 pins allows the design of equipment
meeting Level 4 criteria without the need for additional board
level protection on the RS-485 port.
Page 12 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
AIR-GAP DISCHARGE TEST METHOD
Built-In Driver Overload Protection
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The ISL317XE RS-485 pins withstand
±15kV air-gap discharges.
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These
devices meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. The ISL317XE survive ±8kV contact
discharges on the RS-485 pins.
Data Rate, Cables, and Terminations
RS-485/422 are intended for network lengths up to 4000ft,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100ft, while the 250kbps
versions can operate at full data rates with lengths of several
thousand feet.
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Proper termination is imperative when using the 20Mbps
devices to minimize reflections. Short networks using the
250kbps versions do not need to be terminated, but
terminations are recommended unless power dissipation is
an overriding concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, keep stubs
connecting receivers to the main cable as short as possible.
Multipoint (multi-driver) systems require that the main cable
be terminated in its characteristic impedance at both ends.
Keep stubs connecting a transceiver to the main cable as
short as possible.
FN6307 Rev.6.01
Nov 7, 2019
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common-mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
In the event of a major short circuit condition, devices use a
thermal shutdown feature that disables the drivers whenever
the die temperature becomes excessive. This eliminates the
power dissipation, allowing the die to cool. The drivers
automatically re-enable after the die temperature drops about
15°. If the contention persists, the thermal shutdown/re-enable
cycle repeats until the fault is cleared. Receivers stay
operational during thermal shutdown.
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but some also include
a shutdown feature that reduces the already low quiescent
ICC to a 10nA trickle. These devices enter shutdown
whenever the receiver and driver are simultaneously
disabled (RE = VCC and DE = GND) for a period of at least
600ns. Disabling both the driver and the receiver for less
than 50ns guarantees that the transceiver will not enter
shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 9 through
13 at the end of the “Electrical Specifications table” on page 9,
for more information.
Page 13 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Typical Performance Curves
VCC = 3.3V, TA = +25°C, unless otherwise specified
2.35
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
120
100
80
60
40
20
0
0
0.5
1.0
1.5
2.0
2.5
3.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
2.30
2.25
2.15
2.10
2.05
2.00
RDIFF = 54Ω
1.95
1.90
1.85
-40
3.5
RDIFF = 100Ω
2.20
-25
50
25
75
85
TEMPERATURE (°C)
FIGURE 10. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 11. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
0.52
200
ISL3172E/75E/78E, DE = VCC, RE = X
ISL3176E/77E/78E
150
0.51
Y OR Z = LOW
100
ISL3170E THRU ISL3175E
0.50
50
ICC (mA)
OUTPUT CURRENT (mA)
0
ISL3170E/73E/76E, DE = X, RE = 0V; ISL3171E/74E/77E
0.49
0
0.48
-50
Y OR Z = HIGH
-100
-150
0.47
ISL3172E/75E/78E, DE = 0V, RE = 0V
ISL317XE
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
0.46
-40
12
-25
0
50
25
75
85
TEMPERATURE (°C)
FIGURE 13. SUPPLY CURRENT vs TEMPERATURE
FIGURE 12. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
8.0
1220
1200
1180
SKEW (ns)
PROPAGATION DELAY (ns)
7.5
1160
1140
1120
tPHL
7.0
6.5
6.0
1100
|CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑|
tPLH
1080
-40
5.5
-25
0
25
TEMPERATURE (°C)
50
75
85
FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3170E, ISL3171E,
ISL3172E)
FN6307 Rev.6.01
Nov 7, 2019
-40
-25
0
25
TEMPERATURE (°C)
50
75
85
FIGURE 15. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3170E, ISL3171E, ISL3172E)
Page 14 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
VCC = 3.3V, TA = +25°C, unless otherwise specified (Continued)
370
1.4
365
1.2
360
1.0
SKEW (ns)
PROPAGATION DELAY (ns)
Typical Performance Curves
355
350
0.6
tPHL
0.4
345
340
0.8
tPLH
-40
0
-25
25
TEMPERATURE (°C)
50
0.2
-40
85
75
FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3173E, ISL3174E,
ISL3175E)
|CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑|
-25
0
25
TEMPERATURE (°C)
50
85
75
FIGURE 17. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3173E, ISL3174E, ISL3175E)
32
0.95
31
0.90
29
0.85
28
SKEW (ns)
27
tPHL
26
tPLH
25
0.70
0.65
|CROSS POINT OF Y↑ AND Z↓ − CROSS POINT OF Y↓ AND Z↑|
-40
-25
0
25
TEMPERATURE (°C)
50
85
75
DI
5
0
5
RO
0
DRIVER INPUT (V)
FIGURE 18. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3176E, ISL3177E, ISL3178E)
RDIFF = 54Ω, CD = 50pF
B/Z
2.0
1.5
1.0
A/Y
0.5
0
TIME (400ns/DIV)
FIGURE 20. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3170E, ISL3171E, ISL3172E)
FN6307 Rev.6.01
Nov 7, 2019
-25
0
25
TEMPERATURE (°C)
50
85
75
FIGURE 19. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3176E, ISL3177E, ISL3178E)
DRIVER OUTPUT (V)
3.0
2.5
0.60
-40
RECEIVER OUTPUT (V)
22
RECEIVER OUTPUT (V)
0.75
24
23
DRIVER OUTPUT (V)
0.80
RDIFF = 54Ω, CD = 50pF
DI
5
0
5
RO
0
DRIVER INPUT (V)
PROPAGATION DELAY (ns)
30
3.0
2.5
A/Y
2.0
1.5
1.0
B/Z
0.5
0
TIME (400ns/DIV)
FIGURE 21. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL3170E, ISL3171E, ISL3172E)
Page 15 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
0
RO
0
3.0
2.5
B/Z
2.0
1.5
A/Y
1.0
0.5
0
DI
0
5
RO
0
3
2.5
A/Y
2
1.5
1
B/Z
0.5
0
TIME (200ns/DIV)
TIME (200ns/DIV)
0
RO
0
3.0
2.5
B/Z
2.0
1.5
A/Y
1.0
RECEIVER OUTPUT (V)
DI
5
DRIVER INPUT (V)
RDIFF = 54Ω, CD = 50pF
FIGURE 23. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL3173E, ISL3174E, ISL3175E)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
FIGURE 22. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3173E, ISL3174E, ISL3175E)
5
0.5
0
RDIFF = 54Ω, CD = 50pF
DI
5
RO
0
3.0
2.5
A/Y
2.0
1.5
1.0
B/Z
0.5
0
TIME (10ns/DIV)
FIGURE 24. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3176E, ISL3177E, ISL3178E)
FIGURE 25. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL3176E, ISL3177E, ISL3178E)
RECEIVER OUTPUT CURRENT (mA)
35
Die Characteristics
VOL, +25°C
SUBSTRATE POTENTIAL (POWERED UP):
25
GND
VOL, +85°C
VOH, +25°C
20
15
TRANSISTOR COUNT:
535
VOH, +85°C
PROCESS:
10
Si Gate BiCMOS
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 26. RECEIVER OUTPUT CURRENT vs RECEIVER
OUTPUT VOLTAGE
FN6307 Rev.6.01
Nov 7, 2019
5
0
TIME (10ns/DIV)
30
5
DRIVER INPUT (V)
5
RDIFF = 54Ω, CD = 50pF
DRIVER INPUT (V)
5
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
DI
DRIVER INPUT (V)
VCC = 3.3V, TA = +25°C, unless otherwise specified (Continued)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
Page 16 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make
sure you have the latest revision.
DATE
REVISION
Nov 7, 2019
FN6307.6.01
Aug 31, 2017
FN6307.6
FN6307 Rev.6.01
Nov 7, 2019
CHANGE
Changed (+125mA/-100mA) to (+125µA/-100µA) in the first paragraph on page 1.
Removed About Intersil section.
Updated disclaimer
Applied new header/footer.
Added Related Literature on page 1.
Added Note 2 to Ordering Information table on page 2.
Updated the Receiving Truth table on page 3.
Updated POD M10.118 on page 20 from rev 0 to rev 1. Changes:
Updated to new POD template. Added land pattern
Added Revision History and About Intersil sections.
Page 17 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawings
For the most recent package outline drawing, see M8.118.
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.25 - 0.36
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
(0.65)
(0.40)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
FN6307 Rev.6.01
Nov 7, 2019
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
Page 18 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
For the most recent package outline drawing, see M8.15.
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN6307 Rev.6.01
Nov 7, 2019
Page 19 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
For the most recent package outline drawing, see M10.118.
M10.118
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 4/12
5
3.0±0.05
A
DETAIL "X"
D
10
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
0.50 BSC
B
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.18 - 0.27
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-BA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.50)
(0.29)
(1.40)
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN6307 Rev.6.01
Nov 7, 2019
Page 20 of 22
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
For the most recent package outline drawing, see M14.15.
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
8.65
A 3
4
0.10 C A-B 2X
6
14
DETAIL"A"
8
0.22±0.03
D
6.0
3.9
4
0.10 C D 2X
0.20 C 2X
7
PIN NO.1
ID MARK
5
0.31-0.51
B 3
(0.35) x 45°
4° ± 4°
6
0.25 M C A-B D
TOP VIEW
0.10 C
1.75 MAX
H
1.25 MIN
0.25
GAUGE PLANE C
SEATING PLANE
0.10 C
0.10-0.25
1.27
SIDE VIEW
(1.27)
DETAIL "A"
(0.6)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
(5.40)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 indentifier may be either a mold or mark feature.
(1.50)
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
7. Reference to JEDEC MS-012-AB.
TYPICAL RECOMMENDED LAND PATTERN
FN6307 Rev.6.01
Nov 7, 2019
Page 21 of 22
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