ISL3178AEMBZ

DATASHEET NOT RECOMMENDED FOR NEW DESIGNS NO RECOMMENDED REPLACEMENT contact our Technical Support Center at 1-888-INTERSIL or www.intersil.com/tsc ISL3178AE FN6887 Rev 3.00 October 30, 2014 ±15kV ESD Protected, 3.3V, Full Fail-Safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers The Intersil ISL3178AE is ±15kV IEC61000 ESD protected, 3.3V-powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. This device has very low bus currents (+125µA/-100µA), which presents a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an RS-485 network, so the high allowed node count minimizes the number of repeaters required. Features • IEC61000 ESD protection on RS-485 I/O pins . . . . . . . ±15kV - Class 3 ESD level on all other pins. . . . . . . . . . . .>7kV HBM • Full fail-safe (open, short, terminated/floating) receivers • Hot plug - Tx and Rx outputs remain three-state during Power-up • True 1/8 unit load allows up to 256 devices on the bus • Single 3.3V supply • High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . . up to 10Mbps Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. • Low quiescent supply current. . . . . . . . . . . . . . . 800µA (max) - Ultra low shutdown supply current. . . . . . . . . . . . . . . . 10nA Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. • -7V to +12V common mode input/output voltage range The ISL3178AE is a half duplex version. It multiplexes the Rx inputs and Tx outputs to allow transceivers with output disable functions in an 8 Ld package. • Three state Rx and Tx outputs available Related Literature • Half duplex pinouts • Current limiting for driver overload protection • Pb-free (RoHS compliant) Applications • AN1475, “High Temperature Behavior of ISL3178AE” • Automated utility meter reading systems • High node count systems • Field bus networks • Security camera networks • Building environmental control/ lighting systems • Industrial/process control networks TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3178AEM HALF/FULL DUPLEX DATA RATE (Mbps) SLEW-RATE LIMITED? HOT PLUG? # DEVICES ON BUS RX/TX ENABLE? QUIESCENT ICC (µA) LOW POWER SHUTDOWN? PIN COUNT HALF 10 NO YES 256 YES 510 YES 8 FN6887 Rev 3.00 October 30, 2014 Page 1 of 14 ISL3178AE Ordering Information PART NUMBER (Notes 1, 2, 3) ISL3178AEMBZ TEMP. RANGE (°C) PART MARKING 3178A EMBZ -55 to +125 PACKAGE (Pb-Free) 8 Ld SOIC PKG. DWG. # M8.15 NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL3178AE. For more information on MSL, please see tech brief TB363 Pin Configuration ISL3178AE (8 LD SOIC) TOP VIEW RO 1 R RE 2 DE 3 DI 4 D 8 VCC 7 B/Z 6 A/Y 5 GND Pin Descriptions PIN # PIN NAME FUNCTION 1 RO Receiver output: If A-B  -50mV, RO is high; If A-B  -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. 2 RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND. 3 DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable function isn’t required, connect DE to VCC through a 1kΩ to 3kΩ resistor. 4 DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. 5 GND Ground connection. 6 A/Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. 7 B/Z ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. 8 VCC System power supply input (3.0V to 3.6V). FN6887 Rev 3.00 October 30, 2014 Page 2 of 14 ISL3178AE ISL3178AE +3.3V +3.3V + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 RO 1 FIGURE 1. TYPICAL APPLICATION CIRCUIT Truth Tables (continued) Truth Tables RECEIVING TRANSMITTING INPUTS INPUTS OUTPUTS OUTPUT RE DE Half Duplex DE Full Duplex A-B RO 0 0 0 X  -0.05V 1 High-Z High-Z 0 0 X  -0.2V 0 High-Z * High-Z * 0 0 X Inputs Open/Shorted 1 1 0 0 X High-Z * 1 1 1 X High-Z RE DE DI Z Y X 1 1 0 1 X 1 0 1 0 0 X 1 0 X NOTE: *Shutdown Mode (see Note 12) NOTE: *Shutdown Mode (see Note 12) FN6887 Rev 3.00 October 30, 2014 Page 3 of 14 ISL3178AE Absolute Maximum Ratings Thermal Information VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . See “ESD PERFORMANCE” on page 5 Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 8 Ld SOIC Package (Notes 4, 5) . . . . . . . . . 120 56 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For JC, the “case temp” location is taken at the package top center. Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 7). TEMP (°C) MIN (Note 6) TYP MAX (Note 6) UNITS RL = 100Ω (RS-422) (Note 2A), (Note 16) Full 2 2.3 - V RL = 54Ω (RS-485) (Figure 2A) Full 1.5 2 VCC V - - VCC RL = 60Ω, -7V  VCM  12V (Figure 2B) Full 1.5 2.2 - V VOD RL = 54Ω or 100Ω (Figure 2A) Full - 0.01 0.2 V Driver Common-mode VOUT VOC RL = 54Ω or 100Ω (Figure 2A) Full - 2 3 V Change in Magnitude of Driver Common-mode VOUT for Complementary Output States VOC RL = 54Ω or 100Ω (Figure 2A) Full - 0.01 0.2 V PARAMETER SYMBOL TEST CONDITIONS DC CHARACTERISTICS Driver Differential VOUT VOD No Load Change in Magnitude of Driver Differential VOUT for Complementary Output States Logic Input High Voltage VIH DI, DE, RE Full 2 - - V Logic Input Low Voltage VIL DI, DE, RE Full - - 0.8 V VHYS DE, RE (Note 17) 25 - 100 - mV Logic Input Current IIN1 DI = DE = RE = 0V or VCC (Note 18) Full -2 - 2 µA Input Current (A/Y, B/Z) IIN2 DE = 0V, VCC = 0V or 3.6V VIN = 12V Full - 80 125 µA VIN = -7V Full -100 -50 - µA DE = VCC, -7V  VY or VZ  12V (Note 9) Full - - 250 mA -7V  VCM  12V (Note 17) Full -200 -125 -50 mV Logic Input Hysteresis Driver Short-circuit Current, VO = High or Low Receiver Differential Threshold Voltage IOSD1 V TH Receiver Input Hysteresis V TH VCM = 0V 25 - 15 - mV Receiver Output High Voltage VOH IO = -4mA, VID = -50mV Full VCC - 0.6 - - V Receiver Output Low Voltage VOL IO = -4mA, VID = -200mV Full - 0.17 0.4 V Three-state (High Impedance) Receiver Output Current IOZR 0.4V  VO  2.4V Full -1 0.015 1 µA Receiver Input Resistance RIN -7V  VCM  12V Full 96 150 - kΩ Receiver Short-Circuit Current IOSR 0V  VO  VCC Full ±7 30 ±60 mA FN6887 Rev 3.00 October 30, 2014 Page 4 of 14 ISL3178AE Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 7). PARAMETER TEMP (°C) MIN (Note 6) TYP MAX (Note 6) UNITS DE = VCC, RE = 0V or VCC Full - 510 800 µA DE = 0V, RE = 0V Full - 480 700 µA DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.01 12 µA IEC61000-4-2, Air-gap Discharge Method 25 - ±15 - kV IEC61000-4-2, Contact Discharge Method 25 - ±8 - kV Human Body Model, From Bus Pins to GND 25 - ±15 - kV HBM, per MIL-STD-883 Method 3015 25 - ±7 - kV Machine Model 25 - 200 - V SYMBOL TEST CONDITIONS SUPPLY CURRENT No-load Supply Current (Note 8) Shutdown Supply Current ICC ISHDN DI = 0V or VCC ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) All Pins DRIVER SWITCHING CHARACTERISTICS (ISL3178AE) Maximum Data Rate fMAX VOD = ±1.5V, CD = 350pF (Figure 5) (Note 17) Full - 10 - Mbps Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 3) Full - 27 40 ns Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 3) Full - 1 3 ns Driver Output Skew, Part-to-Part tDSKEW RDIFF = 54Ω, CD = 50pF (Figure 3) (Notes 15, 17) Full - - 11 ns tR, tF RDIFF = 54Ω, CD = 50pF (Figure 3) Full - 9 15 ns Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 4), (Note 10) Full - 17 50 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 4), (Note 10) Full - 16 40 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 4) Full - 25 40 ns tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 4), Full - 28 50 ns (Notes 12, 17) Full 50 200 600 ns Driver Differential Rise or Fall Time Driver Disable from Output Low Time to Shutdown tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 4), (Notes 12, 13) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 4), (Notes 12, 13) Full - 90 700 ns VID = ±1.5V (Note 17) Full - 10 - Mbps RECEIVER SWITCHING CHARACTERISTICS (ISL3178AE) Maximum Data Rate fMAX Receiver Input to Output Delay tPLH, tPHL (Figure 6) Full 25 33 65 ns Receiver Skew | tPLH - tPHL | tSKD (Figure 6) Full - 1.5 10 ns tRSKEW (Figure 6), (Notes 15, 17) Full - - 15 ns Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 7), (Note 11) Full 5 11 17 ns Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7), (Note 11) Full 5 11 17 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 7), Full 4 7 15 ns tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7), Full 4 7 15 ns (Notes 12, 17) Full 50 180 600 ns Receiver Skew, Part-to-Part Receiver Disable from Output Low Time to Shutdown FN6887 Rev 3.00 October 30, 2014 tSHDN Page 5 of 14 ISL3178AE Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 7). PARAMETER SYMBOL Receiver Enable from Shutdown to Output High tZH(SHDN) Receiver Enable from Shutdown to Output Low tZL(SHDN) TEMP (°C) MIN (Note 6) TYP MAX (Note 6) UNITS RL = 1kΩ, CL = 15pF, SW = GND (Figure 7), (Notes 12, 14) Full - 240 500 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 7), (Notes 12, 14) Full - 240 500 ns TEST CONDITIONS NOTES: 6. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Supply current specification is valid for loaded drivers when DE = 0V. 9. Applies to peak current. See “Typical Performance Curves” starting on page 10 for more information. 10. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 11. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 14. Set the RE signal high time >600ns to ensure that the device enters SHDN. 15. tSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). 16. VCC 3.15V 17. Limits established by characterization and are not production tested. 18. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 2) through a 1kΩ to 3kΩ resistor. Test Circuits and Waveforms VCC RL/2 DE DI VCC Z Z DI VOD D 375Ω DE Y Y RL/2 FIGURE 2A. VOD AND VOC VOD D VOC RL = 60Ω VCM -7V TO +12V 375Ω FIGURE 2B. VOD WITH COMMON MODE LOAD FIGURE 2. DC DRIVER TEST CIRCUITS FN6887 Rev 3.00 October 30, 2014 Page 6 of 14 ISL3178AE Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPHL tPLH DE VCC Z DI RDIFF D OUT (Z) VOH OUT (Y) VOL CD Y SIGNAL GENERATOR 90% DIFF OUT (Y to Z) +VOD 90% 10% 10% tR -VOD tF SKEW = |tPLH - tPHL| FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 500Ω VCC D SIGNAL GENERATOR SW Y GND 50pF 3V DE Note 12 1.5V 1.5V 0V tZH, tZH(SHDN) OUTPUT HIGH Note 12 PARAMETER OUTPUT RE DI SW tHZ Y/Z X 1/0 GND tLZ Y/Z X 0/1 VCC tZH Y/Z 0 (Note 10) 1/0 GND tZL Y/Z 0 (Note 10) 0/1 VCC tZH(SHDN) Y/Z 1 (Note 13) 1/0 GND tZL(SHDN) Y/Z 1 (Note 13) 0/1 VCC tHZ VOH - 0.25V 50% OUT (Y, Z) VOH 0V tZL, tZL(SHDN) Note 12 tLZ VCC OUT (Y, Z) 50% OUTPUT LOW FIGURE 4A. TEST CIRCUIT VOL + 0.25V V OL FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER ENABLE AND DISABLE TIMES VCC 3V DE + Z DI 54Ω D Y SIGNAL GENERATOR CD DI 0V VOD - +VOD DIFF OUT (Y to Z) -VOD 0V FIGURE 5B. MEASUREMENT POINTS FIGURE 5A. TEST CIRCUIT FIGURE 5. DRIVER DATA RATE FN6887 Rev 3.00 October 30, 2014 Page 7 of 14 ISL3178AE Test Circuits and Waveforms (Continued) +1.5V RE GND A 15pF B R A 0V 0V RO -1.5V tPLH tPHL VCC SIGNAL GENERATOR 1.5V RO 1.5V 0V FIGURE 6B. MEASUREMENT POINTS FIGURE 6A. TEST CIRCUIT FIGURE 6. RECEIVER PROPAGATION DELAY RE GND B A R Note 12 1kΩ RO VCC SW SIGNAL GENERATOR GND 3V RE 1.5V 1.5V 15pF 0V tZH, tZH(SHDN) Note 12 PARAMETER DE A SW tHZ X +1.5V GND tLZ X -1.5V VCC tZH (Note 11) 0 +1.5V GND tZL (Note 11) 0 -1.5V VCC tZH(SHDN) (Note 14) 0 +1.5V GND tZL(SHDN) (Note 14) 0 -1.5V VCC FIGURE 7A. TEST CIRCUIT OUTPUT HIGH tHZ V VOH - 0.25V OH 1.5V RO 0V tZL, tZL(SHDN) Note 12 RO tLZ VCC 1.5V VOL + 0.25V V OUTPUT LOW OL FIGURE 7B. MEASUREMENT POINTS FIGURE 7. RECEIVER ENABLE AND DISABLE TIMES Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for long runs, thus the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Receiver Features Receiver input resistance of 96kΩ surpasses the RS-422 spec of 4kΩ and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “oneeighth UL” transceivers and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages and ground potential differences are realistic concerns. All the receivers include a “Full Fail-Safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or shorted. Fail-safe with shorted inputs is achieved by setting the Rx upper switching point to -50mV, thereby ensuring that the Rx sees 0V differential as a high input level. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are tri-statable via the active low RE input. This device utilizes a differential input receiver for maximum noise immunity and common mode rejection. The Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. FN6887 Rev 3.00 October 30, 2014 Page 8 of 14 ISL3178AE Driver Features AIR-GAP DISCHARGE TEST METHOD The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. The ISL3178AE RS-485 pins withstand ±15kV air-gap discharges. The drivers is tri-statable via the active high DE input. Outputs of the ISL3178AE drivers are not limited, so faster output transition times allow data rates of at least 10Mbps. CONTACT DISCHARGE TEST METHOD Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3178AE versions with output enable pins incorporate a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. ESD Protection All pins on this device includes class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM and ±15kV IEC61000. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. FN6887 Rev 3.00 October 30, 2014 During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. The ISL3178AE survives ±8kV contact discharges on the RS-485 pins. Data Rate, Cables, and Terminations The RS-485/422 are intended for network lengths up to 4000, but the maximum system data rate decreases as the transmission length increases. The device operates at 10Mbps are limited to lengths less than 100. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multireceiver applications, stubs connecting receiver to the main cable should be kept as short as possible. Multipoint (multidriver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. Built-In Driver Overload Protection As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limit circuitry. The driver output stages incorporate short circuit current limiting circuitry, which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. Page 9 of 14 ISL3178AE Low Power Shutdown Mode This CMOS transceiver all uses a fraction of the power required by its bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. This device enters shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the Typical Performance Curves receiver for less than 50ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 10 through 14, at the end of the “Electrical Specification table” on page 6, for more information. VCC = 3.3V, TA = +25°C; Unless Otherwise Specified. DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 120 100 80 60 40 20 0 0 0.5 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.9 2.7 2.5 2.3 RDIFF = 120Ω 2.1 1.9 RDIFF = 54Ω 1.7 1.5 -60 3.5 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 600 200 550 Y OR Z = LOW ICC DE-VCC 100 500 50 ICC (µA) OUTPUT CURRENT (mA) 150 0 450 -50 ICC DE-GND Y OR Z = HIGH 400 -100 -150 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FN6887 Rev 3.00 October 30, 2014 12 350 -60 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 FIGURE 11. SUPPLY CURRENT vs TEMPERATURE Page 10 of 14 ISL3178AE Typical Performance Curves VCC = 3.3V, TA = +25°C; Unless Otherwise Specified. (Continued) 1.6 40 PROPAGATION DELAY (ns) 35 TPHL 1.5 TPLH 1.4 30 SKEW (ns) 25 20 15 1.3 1.2 10 1.1 5 0 15 30 45 60 75 1 -60 -45 -30 -15 90 105 120 TEMPERATURE (°C) 0 5 RO 0 RECEIVER OUTPUT (V) 5 DRIVER INPUT (V) 3.0 2.5 DRIVER OUTPUT (V) RECEIVER OUTPUT (V) DRIVER OUTPUT (V) DI B/Z 2.0 1.5 1.0 15 30 45 60 TEMPERATURE (°C) 75 90 105 120 FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE) RDIFF = 54Ω, CD = 50pF 0 A/Y 0.5 0 RDIFF = 54Ω, CD = 50pF DI 0 5 RO 0 3.0 2.5 A/Y 2.0 1.5 B/Z 1.0 0.5 0 TIME (10ns/DIV) TIME (10ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS, HIGH-TO-LOW FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, LOW-TO-HIGH RECEIVER OUTPUT CURRENT (mA) 35 VOL, +25°C 30 25 VOL, +85°C VOH, +25°C 20 15 VOH, +85°C 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 RECEIVER OUTPUT VOLTAGE (V) FIGURE 16. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE FN6887 Rev 3.00 October 30, 2014 5 Page 11 of 14 DRIVER INPUT (V) 0 -60 -45 -30 -15 ISL3178AE Die Characteristics Additional Information DIE DIMENSIONS WORST CASE CURRENT DENSITY Thickness: 14 mils 1295µm x 1350µm Interface Materials GLASSIVATION Sandwich TEOS & Nitride TOP METALLIZATION: Type: Al with 0.5% Cu Thickness: 28kA SUBSTRATE N/A BACKSIDE FINISH N/A PROCESS Si GateBiCMOS TRANSISTOR COUNT 535 PAD OPENING SIZE 90µm x 90µm WAFER SIZE 200mm (~8 inch) TRANSISTOR COUNT 535 Silicon/Polysilicon/Oxide Assembly Related Information SUBSTRATE POTENTIAL GND (powered up) FN6887 Rev 3.00 October 30, 2014 Page 12 of 14 ISL3178AE Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION October 30, 2014 FN6887.3 CHANGE Applied Intersil’s new datasheet template. On page 1: Changed “+125mA/-100mA” to “+125µA/-100µA”. Added AN1475, “High Temperature Behavior of ISL3178AE”. In Features" section, 3rd bullet, removed "(only versions . . .)" Remove 2nd entry in Table 1. On page 2, removed ISL3178AEMW from the Ordering Information table. On page 6, removed Note 19. On page 12, removed Table 2. Added revision history and About Intersil verbiage. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support © Copyright Intersil Americas LLC 2009-2014. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6887 Rev 3.00 October 30, 2014 Page 13 of 14 ISL3178AE Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN6887 Rev 3.00 October 30, 2014 Page 14 of 14