ISL95810UIU8

DATASHEET ISL95810 FN8090 Rev 2.00 September 19, 2006 Single Digitally Controlled Potentiometer (XDCP™) Low Noise, Low Power I2C Bus, 256 Taps The ISL95810 integrates a digitally controlled potentiometer (XDCP) on a monolithic CMOS integrated circuit. Features The digitally controlled potentiometer is implemented with a combination of resistor elements and CMOS switches. The position of the wiper is controlled by the user through the I2C bus interface. The potentiometer has an associated volatile Wiper Register (WR) and a non-volatile Initial Value Register (IVR), that can be directly written to and read by the user. The content of the WR controls the position of the wiper. At power-up the device recalls the contents of the DCP’s IVR to the WR. • I2C serial interface The DCP can be used as three-terminal potentiometer or as two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. TEMP PART RTOTAL (k) RANGE (°C) MARKING ISL95810WIU8* AIU ISL95810WIU8Z (Note) APN ISL95810WIRT8Z* (Note) APO ISL95810UIU8* AIT ISL95810UIU8Z* (Note) • Wiper resistance: 70 typical @ 3.3V • Non-volatile storage of wiper position • Standby current 5µA max • Power supply: 2.7V to 5.5V • 50k, 10k total resistance • High reliability - Endurance: 200,000 data changes per bit per register - Register data retention: 50 years @ T  +75°C • 8 Ld MSOP and 8 Ld TDFN packaging • Pb-free plus anneal available (RoHS compliant) Ordering Information PART NUMBER • 256 resistor taps - 0.4% resolution 10 -40 to +85 8 Ld MSOP -40 to +85 8 Ld MSOP (Pb-free) -40 to +85 50 PACKAGE 8 Ld 3 x 3 TDFN (Pb-free) -40 to +85 8 Ld MSOP AOK -40 to +85 8 Ld MSOP (Pb-free) ISL95810UIRT8 AIT -40 to +85 8 Ld 3 x 3 TDFN ISL95810UIRT8Z* (Note) APP -40 to +85 8 Ld 3 x 3 TDFN (Pb-free) Pinouts ISL95810 (8 LD MSOP) TOP VIEW WP 1 8 VCC SCL 2 7 RH SDA 3 6 RL GND 4 5 RW ISL95810 (8 LD TDFN) TOP VIEW *Add “-T” suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. FN8090 Rev 2.00 September 19, 2006 WP 1 8 VCC SCL 2 7 RH SDA 3 6 RL GND 4 5 RW Page 1 of 13 ISL95810 Block Diagram VCC RH SDA WIPER REGISTER I2C AND SCL RW CONTROL NON-VOLATILE WP REGISTER RL GND Pin Descriptions TSSOP PIN SYMBOL 1 WP Hardware write protection. Active low. Prevents any “Write” operation of the I2C interface. 2 SCL I2C interface clock 3 SDA Serial data I/O for the I2C interface 4 GND Ground 5 RW “Wiper” terminal of the DCP 6 RL “Low” terminal of the DCP 7 RH “High” terminal of the DCP 8 VCC Power supply FN8090 Rev 2.00 September 19, 2006 DESCRIPTION Page 2 of 13 ISL95810 Absolute Maximum Ratings Recommended Operating Conditions Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage at Any Digital Interface Pin with Respect to VSS . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3 VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V Voltage at Any DCP Pin with Respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Power Rating of Each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW Wiper Current of Each DCP. . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Analog Specifications SYMBOL RTOTAL Over recommended operating conditions unless otherwise stated. PARAMETER RH to RL Resistance TEST CONDITIONS MIN W, U versions respectively CH/CL/CW ILkgDCP Wiper Resistance UNIT k -20 VCC = 3.3V @ +25°C Wiper current = VCC/RTOTAL 70 Potentiometer Capacitance (Note 13) Leakage on DCP Pins (Note 13) MAX 10, 50 RH to RL Resistance Tolerance RW TYP (Note 1) +20 % 200  10/10/25 Voltage at pin from GND to VCC 0.1 pF 1 µA VOLTAGE DIVIDER MODE (0V @ RL; VCC @ RH; measured at RW, unloaded) INL (Note 6) Integral Non-Linearity DNL (Note 5) Differential Non-Linearity -1 Monotonic over all tap positions W option -0.75 LSB (Note 2) LSB (Note 2) -0.5 LSB (Note 2) 0 1 7 LSB (Note 2) U option 0 0.5 2 W option -7 -1 0 -2 -0.5 0 U option ZSerror (Note 3) Zero-Scale Error W option FSerror (Note 4) Full-Scale Error U option TCV (Note 7, 13) Ratiometric Temperature Coefficient 1 -0.75 -0.5 DCP Register set to 80 hex LSB (Note 2) ±4 ppm/°C RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected) RINL (Note 11) Integral Non-Linearity DCP register set between 20 hex and FF hex. Monotonic over all tap positions RDNL (Note 5) Differential Non-Linearity DCP register set between 20 hex W option -0.75 and FF hex. Monotonic over all tap U option -0.5 positions Roffset (Note 9) TCR (Note 12, 13) Offset -1 W option 0 U option 0 Resistance Temperature Coefficient DCP register set between 20 hex and FF hex 1 MI (Note 8) -0.75 MI (Note 8) -0.5 MI (Note 8) 1 7 MI (Note 8) 0.5 2 MI (Note 8) ±45 ppm/°C Operating Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS MIN TYP (Note 1) MAX UNITS fSCL = 400kHz; SDA = Open; (for I2C, Active, 1 mA ICC1 (Note 15) VCC Supply Current (Volatile write/read) Read and Volatile Write States only) ICC2 (Note 15) VCC Supply Current (Nonvolatile Write) fSCL = 400kHz; SDA = Open; (for I2C, Active, Nonvolatile Write State only) 3 mA VCC Current (Standby) VCC = +5.5V, I2C Interface in Standby State 5 µA VCC = +3.6V, I2C Interface in Standby State 2 µA ISB (Note 15) FN8090 Rev 2.00 September 19, 2006 Page 3 of 13 ISL95810 Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL ILkgDig tDCP (Note 13) Vpor PARAMETER TEST CONDITIONS Leakage Current, at Pins SDA, SCL, Voltage at pin from GND to VCC and WP Pins DCP Wiper Response Time SCL falling edge of last bit of DCP Data Byte to wiper change Power-On Recall Voltage Minimum VCC at which memory recall occurs VCCRamp VCC Ramp Rate tD (Note 13) Power-Up Delay MIN -10 1.8 TYP (Note 1) MAX UNITS 10 µA 1 µs 2.6 0.2 VCC above Vpor, to DCP Initial Value Register recall completed, and I2C Interface in standby state V V/ms 3 ms EEPROM SPECIFICATIONS EEPROM Endurance EEPROM Retention Temperature 75°C 200,000 Cycles 50 Years SERIAL INTERFACE SPECIFICATIONS VIL WP, SDA, and SCL Input Buffer LOW Voltage VIH WP, SDA, and SCL Input Buffer HIGH Voltage Hysteresis (Note 13) SDA and SCL Input Buffer Hysteresis VOL (Note 13) SDA Output Buffer LOW Voltage, Sinking 4mA Cpin (Note 13) WP, SDA, and SCL Pin Capacitance -0.3 0.3*VCC V 0.7*VCC VCC+0.3 V 0.4 V 10 pF 0.05*VCC 0 400 kHz tIN (Note 13) Pulse Width Suppression Time at SDA and SCL Inputs Any pulse narrower than the max spec is suppressed. 50 ns tAA (Note 13) SCL Falling Edge to SDA Output Data Valid SCL falling edge crossing 30% of VCC, until SDA exits the 30% to 70% of VCC window. 900 ns Time the Bus Must be Free Before the Start of a New Transmission SDA crossing 70% of VCC during a STOP condition, to SDA crossing 70% of VCC during the following START condition. 1300 fSCL tBUF (Note 13) SCL Frequency V ns tLOW Clock LOW Time Measured at the 30% of VCC crossing. 1300 ns tHIGH Clock HIGH Time Measured at the 70% of VCC crossing. 600 ns tSU:STA START Condition Setup Time SCL rising edge to SDA falling edge. Both crossing 70% of VCC. 600 ns tHD:STA START Condition Hold Time From SDA falling edge crossing 30% of VCC to SCL falling edge crossing 70% of VCC. 600 ns tSU:DAT Input Data Setup Time From SDA exiting the 30% to 70% of VCC window, to SCL rising edge crossing 30% of VCC 100 ns tHD:DAT Input Data Hold Time From SCL rising edge crossing 70% of VCC to SDA entering the 30% to 70% of VCC window. 0 ns tSU:STO STOP Condition Setup Time From SCL rising edge crossing 70% of VCC, to SDA rising edge crossing 30% of VCC. 600 ns tHD:STO STOP Condition Hold Time for Read, From SDA rising edge to SCL falling edge. Both or Volatile Only Write crossing 70% of VCC. 600 ns tHD:STO:NV STOP Condition Hold Time for Non- From SDA rising edge to SCL falling edge. Both Volatile Write crossing 70% of VCC. 2 µs Output Data Hold Time From SCL falling edge crossing 30% of VCC, until SDA enters the 30% to 70% of VCC window. 0 ns tR (Note 13) SDA and SCL Rise Time From 30% to 70% of VCC 20 + 0.1 * Cb 250 ns tF (Note 13) SDA and SCL Fall Time From 70% to 30% of VCC 20 + 0.1 * Cb 250 ns Cb (Note 13) Capacitive Loading of SDA or SCL Total on-chip and off-chip 10 400 pF tDH (Note 13) FN8090 Rev 2.00 September 19, 2006 Page 4 of 13 ISL95810 Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL PARAMETER Rpu (Note 13) TEST CONDITIONS MIN TYP (Note 1) MAX UNITS 1 SDA and SCL Bus Pull-Up Resistor Maximum is determined by tR and tF. Off-Chip For Cb = 400pF, max is about 2~2.5k. For Cb = 40pF, max is about 15~20k k tWP (Notes 13, 14) Non-Volatile Write Cycle Time 12 20 ms tSU:WP WP Setup Time Before START condition 600 ns tHD:WP WP Hold Time After STOP condition 600 ns SDA vs SCL Timing tHIGH tF SCL tLOW tR tSU:DAT tSU:STA SDA (INPUT TIMING) tHD:DAT tHD:STA tSU:STO tAA tDH tBUF SDA (OUTPUT TIMING) WP Pin Timing STOP START SCL tHD:STO tHD:STO:NV CLK 1 SDA IN tSU:WP tHD:WP WP NOTES: 1. Typical values are for TA = +25°C and 3.3V supply voltage. 2. LSB: [V(RW)255 – V(RW)0]/255. V(RW)255 and V(RW)0 are V(RW) for the DCP register set to FF hex and 00 hex respectively. LSB is the incremental voltage when changing from one tap to an adjacent tap. 3. ZS error = V(RW)0/LSB. 4. FS error = [V(RW)255 – VCC]/LSB. 5. DNL = [V(RW)i – V(RW)i-1]/LSB-1, for i = 1 to 255. i is the DCP register setting. 6. INL = [V(RW)i – (i • LSB – V(RW)0)]/LSB for i = 1 to 255. Max  V  RW  i  – Min  V  RW  i  10 6 7. TC V = ----------------------------------------------------------------------------------------------  ----------------- for i = 16 to 240 decimal, T = -40°C to +85°C. Max( ) is the maximum value of the wiper  Max  V  RW  i  + Min  V  RW  i    2 125°C voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range. 8. MI = |R255 – R0|/255. R255 and R0 are the measured resistances for the DCP register set to FF hex and 00 hex respectively. Roffset = R0/MI, when measuring between RW and RL. 9. Roffset = R255/MI, when measuring between RW and RH. 10. RDNL = (Ri – Ri-1)/MI, for i = 32 to 255. 11. RINL = [Ri – (MI • i) – R0]/MI, for i = 32 to 255. 6  Max  Ri  – Min  Ri   10 12. TC R = ----------------------------------------------------------------  ----------------- for i = 32 to 255, T = -40°C to +85°C. Max( ) is the maximum value of the resistance and Min ( ) is the  Max  Ri  + Min  Ri    2 125°C minimum value of the resistance over the temperature range. 13. This parameter is not 100% tested. 14. tWC is the minimum cycle time to be allowed for any non-volatile Write by the user, unless Acknowledge Polling is used. It is the time from a valid STOP condition at the end of a Write sequence of a I2C serial interface Write operation, to the end of the self-timed internal non-volatile write cycle. 15. VIL = 0V, VIH = VCC FN8090 Rev 2.00 September 19, 2006 Page 5 of 13 ISL95810 Typical Performance Curves 160 140 VCC = 2.7, T = -40°C 1.6 VCC = 2.7, T = 25°C 1.4 120 100 80 60 40 20 0 1.2 STANDBY ICC (µA) WIPER RESISTANCE () 1.8 VCC = 2.7, T = 85°C VCC = 5.5, T = -40°C 0 50 1.0 0.8 150 200 85°C 0.6 0.4 VCC = 5.5, T = 85°C VCC = 5.5, T = 25°C 100 -40°C 0.2 25°C 0.0 2.7 250 3.2 3.7 0.3 0.15 VCC = 5.5, T = -40°C 4.7 5.2 FIGURE 2. STANDBY ICC vs VCC FIGURE 1. WIPER RESISTANCE vs TAP POSITION [ I(RW) = VCC / RTOTAL ] for 50k (U) 0.2 4.2 VCC (V) TAP POSITION (DECIMAL) VCC = 2.7, T = -40°C VCC = 5.5, T = -40°C VCC = 2.7, T = -40°C VCC = 2.7, T = 25°C 0.2 VCC = 5.5, T = 85°C 0.1 0.05 INL (LSB) DNL (LSB) 0.1 0 -0.05 -0.1 -0.15 -0.2 0 VCC = 5.5, T = 25°C VCC = 2.7, T = 85°C VCC = 5.5, T = 85°C 50 100 150 200 0 VCC = 2.7, T = 25°C VCC = 2.7, T = 85°C -0.1 VCC = 5.5, T = 25°C -0.2 -0.3 250 0 50 100 150 200 250 TAP POSITION (DECIMAL) TAP POSITION (DECIMAL) FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10k (W) FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10k (W) 0 0.4 -0.1 -0.2 0.35 VCC = 5.5V FSerror (LSB) ZSerror (LSB) -0.3 0.3 2.7V 0.25 0.2 -0.4 VCC = 2.7V -0.5 -0.6 -0.7 -0.8 5.5V -0.9 0.15 -40 -20 0 20 40 60 TEMPERATURE (°C) FIGURE 5. ZSerror vs TEMPERATURE FN8090 Rev 2.00 September 19, 2006 80 -1 -40 -20 0 20 40 60 TEMPERATURE (°C) FIGURE 6. FSerror vs TEMPERATURE Page 6 of 13 80 ISL95810 Typical Performance Curves (Continued) 0.3 0.5 VCC = 2.7, T = 25°C VCC = 5.5, T = 25°C 0.2 0.4 INL (LSB) DNL (LSB) VCC = 5.5, T = -40°C 0.2 0.1 0 -0.1 0.1 VCC = 5.5, T = 85°C 0 -0.1 -0.2 VCC = 5.5, T = 85°C -0.3 VCC = 2.7, T = 85°C VCC = 2.7, T = -40°C VCC = 5.5, T = -40°C -0.2 -0.3 32 82 132 182 TAP POSITION (DECIMAL) -0.4 VCC = 2.7, T = 85°C VCC = 5.5, T = 25°C -0.5 32 82 132 232 VCC = 2.7, T = -40°C 182 232 TAP POSITION (DECIMAL) FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR 50k (U) FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR 50k (U) 1.50 20 1.00 10 0.50 2.7V TC (ppm/°C) END TO END RTOTAL CHANGE (%) VCC = 2.7, T = 25°C 0.3 5.5V 0.00 -0.50 0 -10 -1.00 -1.50 -40 -20 0 20 40 60 80 TEMPERATURE (°C) -20 32 82 132 182 232 TAP POSITION (DECIMAL) FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm FIGURE 9. END TO END RTOTAL % CHANGE vs TEMPERATURE 35 25 INPUT TC (ppm/°C) 15 5 OUTPUT -5 -15 -25 32 Tap Position = Mid Point RTOTAL = 9.4K 57 82 107 132 157 182 207 232 TAP POSITION (DECIMAL) FIGURE 11. TC FOR RHEOSTAT MODE IN ppm FN8090 Rev 2.00 September 19, 2006 FIGURE 12. FREQUENCY RESPONSE (2.2MHz) Page 7 of 13 ISL95810 Typical Performance Curves (Continued) SCL Signal at Wiper (Wiper Unloaded) Signal at Wiper (Wiper Unloaded Movement From ffh to 00h) Wiper Movement Mid Point From 80h to 7fh FIGURE 13. MIDSCALE GLITCH, CODE 80h to 7Fh (WIPER 0) FIGURE 14. LARGE SIGNAL SETTLING TIME Principles of Operation Memory Description The ISL95810 is an integrated circuit incorporating one DCP with its associated registers, non-volatile memory, and a I2C serial interface providing direct communication between a host and the potentiometer and memory. The ISL95810 volatile and non-volatile registers are accessed by I2C interface operations at addresses 0 and 2 decimal. The non-volatile byte at addresses 0 contains the initial value loaded at power-up into the volatile Wiper Register (WR) of the DCP. The byte at address 1 is reserved; the user should not write to it, and its value should be ignored if read. DCP Description The DCP is implemented with a combination of resistor elements and CMOS switches. The physical ends of the DCP are equivalent to the fixed terminals of a mechanical potentiometer (RH and RL pins). The RW pin of the DCP is connected to intermediate nodes, and is equivalent to the wiper terminal of a mechanical potentiometer. The position of the wiper terminal within the DCP is controlled by an 8-bit volatile Wiper Register (WR). The DCP has its own WR. When the WR of the DCP contains all zeroes (WR: 00h), its wiper terminal (RW) is closest to its “Low” terminal (RL). When the WR of the DCP contains all ones (WR: FFh), its wiper terminal (RW) is closest to its “High” terminal (RH). As the value of the WR increases from all zeroes (00h) to all ones (255 decimal), the wiper moves monotonically from the position closest to RL to the closest to RH. At the same time, the resistance between RW and RL increases monotonically, while the resistance between RH and RW decreases monotonically. While the ISL95810 is being powered up, The WR is reset to 80h (128 decimal), which locates RW roughly at the center between RL and RH. Soon after the power supply voltage becomes large enough for reliable non-volatile memory reading, the ISL95810 reads the value stored in non-volatile Initial Value Registers (IVRs) and loads it into the WR. The WR and IVR can be read or written directly using the I2C serial interface as described in the following sections. FN8090 Rev 2.00 September 19, 2006 The volatile WR, and the non-volatile Initial Value Register (IVR) of the DCP are accessed with the same Address Byte, set to 00 hex in both cases. A volatile byte at address 2 decimal, controls what byte is read or written when accessing DCP registers: the WR, the IVR, or both. When the byte at address 2 is all zeroes, which is the default at power-up: • A read operation to addresses 0 outputs the value of the non-volatile IVR. • A write operation to addresses 0 writes the same value to the WR and IVR of the corresponding DCP. When the byte at address 2 is 80h (128 decimal): • A read operation to addresses 0 outputs the value of the volatile WR. • A write operation to addresses 0 only writes to the corresponding volatile WR. It is not possible to write to an IVR without writing the same value to its corresponding WR. 00h and 80h are the only values that should be written to address 2. All other values are reserved and must not be written to address 2. Page 8 of 13 ISL95810 respond to any command until this condition is met (See Figure 15). A START condition is ignored during the powerup sequence and during internal non-volatile write cycles. The ISL95810 is pre-programed with 80h in the IVR. TABLE 1. MEMORY MAP ADDRESS NON-VOLATILE VOLATILE 2 - Access Control 1 Reserved 0 IVR WR WR: Wiper Register, IVR: Initial value Register. I2C Serial Interface The ISL95810 supports a bidirectional bus oriented protocol. The protocol defines any device that sends data onto the bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master always initiates data transfers and provides the clock for both transmit and receive operations. Therefore, the ISL95810 operates as a slave device in all applications. All communication over the I2C interface is conducted by sending the MSB of each byte of data first. Protocol Conventions Data states on the SDA line can change only during SCL LOW periods. SDA state changes during SCL HIGH are reserved for indicating START and STOP conditions (See Figure 15). On power-up of the ISL95810 the SDA pin is in the input mode. All I2C interface operations must begin with a START condition, which is a HIGH to LOW transition of SDA while SCL is HIGH. The ISL95810 continuously monitors the SDA and SCL lines for the START condition and does not All I2C interface operations must be terminated by a STOP condition, which is a LOW to HIGH transition of SDA while SCL is HIGH (See Figure 15). A STOP condition at the end of a read operation, or at the end of a write operation to volatile bytes only places the device in its standby mode. A STOP condition during a write operation to a non-volatile byte, initiates an internal non-volatile write cycle. The device enters its standby state when the internal non-volatile write cycle is completed. An ACK, Acknowledge, is a software convention used to indicate a successful data transfer. The transmitting device, either master or slave, releases the SDA bus after transmitting eight bits. During the ninth clock cycle, the receiver pulls the SDA line LOW to acknowledge the reception of the eight bits of data (See Figure 16). The ISL95810 responds with an ACK after recognition of a START condition followed by a valid Identification Byte, and once again after successful receipt of an Address Byte. The ISL95810 also responds with an ACK after receiving a Data Byte of a write operation. The master must respond with an ACK after receiving a Data Byte of a read operation. A valid Identification Byte contains 0101000 as the seven MSBs. The LSB in the Read/Write bit. Its value is “1” for a Read operation, and “0” for a Write operation (See Table 2). TABLE 2. IDENTIFICATION BYTE FORMAT 0 1 0 1 0 (MSB) 0 0 R/W (LSB) SCL SDA START DATA STABLE DATA CHANGE DATA STABLE STOP FIGURE 15. VALID DATA CHANGES, START, AND STOP CONDITIONS FN8090 Rev 2.00 September 19, 2006 Page 9 of 13 ISL95810 SCL FROM MASTER 1 8 9 SDA OUTPUT FROM TRANSMITTER HIGH IMPEDANCE HIGH IMPEDANCE SDA OUTPUT FROM RECEIVER START ACK FIGURE 16. ACKNOWLEDGE RESPONSE FROM RECEIVER WRITE SIGNALS FROM THE MASTER SIGNAL AT SDA S T A R T IDENTIFICATION BYTE ADDRESS BYTE 0 1 0 1 0 0 0 0 0 0 0 0 0 0 SIGNALS FROM THE ISL95810 S T O P DATA BYTE A C K A C K A C K FIGURE 17. BYTE WRITE SEQUENCE SIGNALS FROM THE MASTER S T A R T SIGNAL AT SDA IDENTIFICATION BYTE WITH R/W=0 ADDRESS BYTE 0 1 0 1 0 0 0 0 SIGNALS FROM THE SLAVE S T A IDENTIFICATION R BYTE WITH T R/W=1 S T O P A C K 0 1 0 1 0 0 0 1 0 0 0 0 0 0 A C K A C K A C K A C K FIRST READ DATA BYTE LAST READ DATA BYTE FIGURE 18. READ SEQUENCE FN8090 Rev 2.00 September 19, 2006 Page 10 of 13 ISL95810 Write Operation Read Operation A Write operation requires a START condition, followed by a valid Identification Byte, a valid Address Byte, a Data Byte, and a STOP condition. After each of the three bytes, the ISL95810 responds with an ACK. At this time, if the Data Byte is to be written only to volatile registers, then the device enters its standby state. If the Data Byte is to be written also to nonvolatile memory, the ISL95810 begins its internal write cycle to non-volatile memory. During the internal non-volatile write cycle, the device ignores transitions at the SDA and SCL pins, and the SDA output is at a high impedance state. When the internal non-volatile write cycle is completed, the ISL95810 enters its standby state (See Figure 17). A Read operation consist of a three byte instruction followed by one or more Data Bytes (See Figure 18). The master initiates the operation issuing the following sequence: a START, the Identification byte with the R/W bit set to “0”, an Address Byte, a second START, and a second Identification byte with the R/W bit set to “1”. After each of the three bytes, the ISL95810 responds with an ACK. Then the ISL95810 then transmits the Data Byte. The master then terminates the read operation (issuing a STOP condition) following the last bit of the Data Byte (See Figure 18). The byte at address 02h determines if the Data Byte is to be written to volatile and/or non-volatile memory (See “Memory Description” on page 8). The byte at address 02h determines if the Data Bytes being read are from volatile or non-volatile memory (See “Memory Description” on page 8.) Data Protection The WP pin has to be at logic HIGH to perform any Write operation to the device. When the WP is active (LOW) the device ignores Data Bytes of a Write Operation, does not respond to the Data Bytes with an ACK, and instead, goes to its standby state waiting for a new START condition. A STOP condition also acts as a protection of non-volatile memory. A valid Identification Byte, Address Byte, and total number of SCL pulses act as a protection of both volatile and non-volatile registers. During a Write sequence, the Data Byte is loaded into an internal shift register as it is received. If the Address Byte is 0 or 2, the Data Byte is transferred to the Wiper Register (WR) or to the Access Control Register respectively, at the falling edge of the SCL pulse that loads the last bit (LSB) of the Data Byte. If the Address Byte is 0, and the Access Control Register is all zeros (default), then the STOP condition initiates the internal write cycle to non-volatile memory. © Copyright Intersil Americas LLC 2005-2006. All Rights Reserved. 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For information regarding Intersil Corporation and its products, see www.intersil.com FN8090 Rev 2.00 September 19, 2006 Page 11 of 13 ISL95810 Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 INCHES E -B- INDEX AREA 1 2 0.20 (0.008) A B C TOP VIEW 4X  0.25 (0.010) R1 R GAUGE PLANE SEATING PLANE -CA 4X  A2 A1 b -H- 0.10 (0.004) L1 SEATING PLANE C D 0.20 (0.008) C a CL E1 0.20 (0.008) C D MAX MIN MAX NOTES 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 0.026 BSC -B- 0.65 BSC - E 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 0.037 REF N C SIDE VIEW MIN A L1 -A- e SYMBOL e L MILLIMETERS 0.95 REF 8 R 0.003 R1 0  - 8 - 0.07 0.003 - 5o 15o 0o 6o 7 - - 0.07 - - 5o 15o - 0o 6o Rev. 2 01/03 END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. FN8090 Rev 2.00 September 19, 2006 Page 12 of 13 ISL95810 Thin Dual Flat No-Lead Plastic Package (TDFN) 2X L8.3x3B 0.15 C A A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE D 2X MILLIMETERS 0.15 C B E SYMBOL MIN 0.70 0.75 0.80 - - - 0.05 - 0.38 5, 8 2.40 7, 8 1.60 7, 8 0.20 REF 0.23 D D2 B SIDE VIEW A3 D2 (DATUM B) 6 INDEX AREA 0.08 C 7 2.30 - 1.50 - 0.65 BSC - k 0.20 - - - L 0.20 0.30 0.40 8 N 8 Nd 4 2 3 8 Rev. 0 6/04 NOTES: D2/2 1 - 3.00 BSC 1.35 e A C SEATING PLANE 0.10 C E2 0.30 3.00 BSC 2.15 E // NOTES A b TOP VIEW MAX A1 A3 6 INDEX AREA NOMINAL 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2 2. N is the number of terminals. NX k 3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. (DATUM A) E2 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. E2/2 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N N-1 NX b e 8 5 (Nd-1)Xe REF. 0.10 M C A B BOTTOM VIEW 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. CL NX (b) (A1) L 5 SECTION "C-C" C C e TERMINAL TIP FOR EVEN TERMINAL/SIDE FN8090 Rev 2.00 September 19, 2006 Page 13 of 13