M30624FGMGP#U5

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April 1, 2003 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description The M16C/62M group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, low voltage (2.2V to 3.6V), they are capable of executing instructions at high speed. They also feature a built-in multiplier and DMAC, making them ideal for controlling office, communications, industrial equipment, and other high-speed processing applications. The M16C/62M group includes a wide range of products with different internal memory types and sizes and various package types. Features • Memory capacity .................................. ROM (See Figure 1.1.4. ROM Expansion) RAM 10K to 20K bytes • Shortest instruction execution time ...... 100ns (f(XIN)=10MHZ, VCC=2.7V to 3.6V) 142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V with software one-wait) • Supply voltage ..................................... 2.7V to 3.6V (f(XIN)=10MHZ, without software wait) 2.4V to 2.7V (f(XIN)=7MHZ, without software wait) 2.2V to 2.4V (f(XIN)=7MHZ with software one-wait) • Low power consumption ...................... 28.5mW (VCC = 3V, f(XIN)=10MHZ, without software wait) • Interrupts .............................................. 25 internal and 8 external interrupt sources, 4 software interrupt sources; 7 levels (including key input interrupt) • Multifunction 16-bit timer ...................... 5 output timers + 6 input timers • Serial I/O .............................................. 5 channels (3 for UART or clock synchronous, 2 for clock synchronous) • DMAC .................................................. 2 channels (trigger: 24 sources) • A-D converter ....................................... 10 bits X 8 channels (Expandable up to 10 channels) • D-A converter ....................................... 8 bits X 2 channels • CRC calculation circuit ......................... 1 circuit • Watchdog timer .................................... 1 line • Programmable I/O ............................... 87 lines _______ • Input port .............................................. 1 line (P85 shared with NMI pin) • Memory expansion .............................. Available (to a maximum of 1M bytes) • Chip select output ................................ 4 lines • Clock generating circuit ....................... 2 built-in clock generation circuits (built-in feedback resistor, and external ceramic or quartz oscillator) Applications Audio, cameras, office equipment, communications equipment, portable equipment 1 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Pin Configuration Figures 1.1.1 and 1.1.2 show the pin configurations (top view). P10/D8 P11/D9 P12/D10 P13/D11 P14/D12 P15/D13/INT3 P16/D14/INT4 P17/D15/INT5 P20/A0(/D0/-) P21/A1(/D1/D0) P22/A2(/D2/D1) P23/A3(/D3/D2) P24/A4(/D4/D3) P25/A5(/D5/D4) P26/A6(/D6/D5) P27/A7(/D7/D6) Vss P30/A8(/-/D7) Vcc P31/A9 P32/A10 P33/A11 P34/A12 P35/A13 P36/A14 P37/A15 P40/A16 P41/A17 P42/A18 P43/A19 PIN CONFIGURATION (top view) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P07/D7 P06/D6 P05/D5 P04/D4 P03/D3 P02/D2 P01/D1 P00/D0 P107/AN7/KI3 P106/AN6/KI2 P105/AN5/KI1 P104/AN4/KI0 P103/AN3 P102/AN2 P101/AN1 AVSS P100/AN0 VREF AVcc P97/ADTRG/SIN4 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 M16C/62M group (Low voltage version) 100 2 3 4 5 P44/CS0 P45/CS1 P46/CS2 P47/CS3 P50/WRL/WR P51/WRH/BHE P52/RD P53/BCLK P54/HLDA P55/HOLD P56/ALE P57/RDY/CLKOUT P60/CTS0/RTS0 P61/CLK0 P62/RxD0 P63/TXD0 P64/CTS1/RTS1/CLKS1 P65/CLK1 P66/RxD1 P67/TXD1 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 P96/ANEX1/SOUT4 P95/ANEX0/CLK4 P94/DA1/TB4IN P93/DA0/TB3IN P92/TB2IN/SOUT3 P91/TB1IN/SIN3 P90/TB0IN/CLK3 BYTE CNVss P87/XCIN P86/XCOUT RESET XOUT VSS XIN VCC P85/NMI P84/INT2 P83/INT1 P82/INT0 P81/TA4IN/U P80/TA4OUT/U P77/TA3IN P76/TA3OUT P75/TA2IN/W P74/TA2OUT/W P73/CTS2/RTS2/TA1IN/V P72/CLK2/TA1OUT/V P71/RxD2/SCL/TA0IN/TB5IN P70/TXD2/SDA/TA0OUT 1 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 Package: 100P6S-A Figure 1.1.1. Pin configuration (top view) 2 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER P13/D11 P14/D12 P15/D13/INT3 P16/D14/INT4 P17/D15/INT5 P20/A0(/D0/-) P21/A1(/D1/D0) P22/A2(/D2/D1) P23/A3(/D3/D2) P24/A4(/D4/D3) P25/A5(/D5/D4) P26/A6(/D6/D5) P27/A7(/D7/D6) Vss P30/A8(/-/D7) Vcc P31/A9 P32/A10 P33/A11 P34/A12 P35/A13 P36/A14 P37/A15 P40/A16 P41/A17 PIN CONFIGURATION (top view) 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P12/D10 P11/D9 P10/D8 P07/D7 P06/D6 P05/D5 P04/D4 P03/D3 P02/D2 P01/D1 P00/D0 P107/AN7/KI3 P106/AN6/KI2 P105/AN5/KI1 P104/AN4/KI0 P103/AN3 P102/AN2 P101/AN1 AVSS P100/AN0 VREF AVcc P97/ADTRG/SIN4 P96/ANEX1/SOUT4 P95/ANEX0/CLK4 76 77 78 79 80 50 49 48 47 46 45 44 81 82 83 84 85 86 M16C/62M group (Low voltage version) 87 88 89 90 91 92 93 94 95 96 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 97 98 99 100 28 27 26 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 P94/DA1/TB4IN P93/DA0/TB3IN P92/TB2IN/SOUT3 P91/TB1IN/SIN3 P90/TB0IN/CLK3 BYTE CNVss P87/XCIN P86/XCOUT RESET XOUT VSS XIN VCC P85/NMI P84/INT2 P83/INT1 P82/INT0 P81/TA4IN/U P80/TA4OUT/U P77/TA3IN P76/TA3OUT P75/TA2IN/W P74/TA2OUT/W P73/CTS2/RTS2/TA1IN/V 1 2 P42/A18 P43/A19 P44/CS0 P45/CS1 P46/CS2 P47/CS3 P50/WRL/WR P51/WRH/BHE P52/RD P53/BCLK P54/HLDA P55/HOLD P56/ALE P57/RDY/CLKOUT P60/CTS0/RTS0 P61/CLK0 P62/RxD0 P63/TXD0 P64/CTS1/RTS1/CLKS1 P65/CLK1 P66/RxD1 P67/TXD1 P70/TXD2/SDA/TA0OUT P71/RxD2/SCL/TA0IN/TB5IN P72/CLK2/TA1OUT/V Package: 100P6Q-A Figure 1.1.2. Pin configuration (top view) 3 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Block Diagram Figure 1.1.3 is a block diagram of the M16C/62M group. 8 I/O ports Port P0 8 8 Port P1 Port P2 8 Port P3 Port P4 Port P5 UART/clock synchronous SI/O Clock synchronous SI/O (8 bits X 3 channels) (8 bits X 2 channels) Registers (15 bits) (2 channels) (8 bits X 2 channels) Note 1: ROM size depends on MCU type. Note 2: RAM size depends on MCU type. Figure 1.1.3. Block diagram of M16C/62M group ISP USP Flag register FLG Multiplier 8 SB INTB Stack pointer RAM (Note 2) Port P10 D-A converter PC Vector table ROM (Note 1) 8 DMAC Program counter Memory Port P9 Watchdog timer R0H R0L R0H R0L R1H R1L R1H R1L R2 R2 R3 R3 A0 A0 A1 A1 FB FB AAAAAA AAAAAA AAAAAA AAAAAA AAAAAA AAAA AAAA Port P85 M16C/60 series16-bit CPU core 7 XIN-XOUT XCIN-XCOUT 8 Expandable up to 10 channels) Port P8 System clock generator (10 bits X 8 channels Port P6 Port P7 A-D converter Timer CRC arithmetic circuit (CCITT ) (Polynomial : X16+X12+X5+1) 8 8 Internal peripheral functions Timer TA0 (16 bits) Timer TA1 (16 bits) Timer TA2 (16 bits) Timer TA3 (16 bits) Timer TA4 (16 bits) Timer TB0 (16 bits) Timer TB1 (16 bits) Timer TB2 (16 bits) Timer TB3 (16 bits) Timer TB4 (16 bits) Timer TB5 (16 bits) 4 8 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Performance Outline Table 1.1.1 is a performance outline of M16C/62M group. Table 1.1.1. Performance outline of M16C/62M group Item Number of basic instructions Shortest instruction execution time Performance 91 instructions 100ns(f(XIN)=10MHZ, VCC=2.7V to 3.6V) 142.9ns (f(XIN)=7MHZ, VCC=2.2V to 3.6V with software one-wait) Memory ROM (See the figure 1.1.4. ROM Expansion) capacity RAM 10K to 20K bytes I/O port P0 to P10 (except P85) 8 bits x 10, 7 bits x 1 Input port P85 1 bit x 1 Multifunction TA0, TA1, TA2, TA3, TA4 16 bits x 5 timer TB0, TB1, TB2, TB3, TB4, TB5 16 bits x 6 Serial I/O UART0, UART1, UART2 (UART or clock synchronous) x 3 SI/O3, SI/O4 (Clock synchronous) x 2 A-D converter D-A converter DMAC CRC calculation circuit Watchdog timer Interrupt Clock generating circuit Supply voltage Power consumption I/O I/O withstand voltage characteristics Output current Memory expansion Device configuration Package 10 bits x (8 + 2) channels 8 bits x 2 2 channels (trigger: 24 sources) CRC-CCITT 15 bits x 1 (with prescaler) 25 internal and 8 external sources, 4 software sources, 7 levels 2 built-in clock generation circuits (built-in feedback resistor, and external ceramic or quartz oscillator) 2.7V to 3.6V (f(XIN)=10MHZ, without software wait) 2.4V to 2.7V (f(XIN)=7MHZ, without software wait) 2.2V to 2.4V (f(XIN)=7MHZ with software one-wait) 28.5mW (f(XIN) =10MHZ, VCC=3V without software wait) 3V 1mA Available (to a maximum of 1M bytes) CMOS high performance silicon gate 100-pin plastic mold QFP 5 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Mitsubishi plans to release the following products in the M16C/62M group: (1) Support for mask ROM version and Flash memory version (2) ROM capacity (3) Package 100P6S-A : Plastic molded QFP (mask ROM and flash memory versions) 100P6Q-A : Plastic molded QFP (mask ROM and flash memory versions) ROM Size (Byte) External ROM 256K M30624MGM-XXXFP/GP M30624FGMFP/GP 128K M30620MCM-XXXFP/GP M30620FCMFP/GP 96K 64K 32K Mask ROM version Flash memory version Figure 1.1.4. ROM expansion The M16C/62M group products currently supported are listed in Table 1.1.2. Table 1.1.2. M16C/62M group Type No M30620MCM-XXXFP M30620MCM-XXXGP M30624MGM-XXXFP M30624MGM-XXXGP M30620FCMFP M30620FCMGP June, 2001 ROM capacity RAM capacity 128K byte 10K byte 256K byte 20K byte 128K byte 10K byte 6 100P6S-A 100P6Q-A 100P6S-A mask ROM version 100P6Q-A 100P6Q-A 100P6S-A 256K byte Remarks 100P6S-A M30624FGMFP M30624FGMGP Package type 20K byte 100P6Q-A Flash memory 3V version Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Type No. M 3 0 6 2 0 M C M – X X X F P Package type: FP : Package GP : 100P6S-A 100P6Q-A ROM No. Omitted for blank flash memory version ROM capacity: C : 128K bytes G : 256K bytes Memory type: M : Mask ROM version F : Flash memory version Shows RAM capacity, pin count, etc (The value itself has no specific meaning) M16C/62 Group M16C Family Figure 1.1.5. Type No., memory size, and package 7 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Electrical characteristics SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.26.1. Absolute maximum ratings Symbol Vcc AVcc Parameter Condition - 0.3 to 4.6 V Analog supply voltage VCC=AVCC - 0.3 to 4.6 V - 0.3 to Vcc + 0.3 V - 0.3 to 4.6 V - 0.3 to Vcc + 0.3 V - 0.3 to 4.6 300 - 20 to 85 / -40 to 85 (Note) V mW C - 65 to 150 C VI RESET, CNVSS, BYTE, P00 to P07, P10 to P17, P20 to P27, P30 to P37,P40 to P47, P50 to P57, P60 to P67, P72 to P77, P80 to P87, P90 to P97, P100 to P107, VREF, XIN P70, P71 Output voltage Pd P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P72 to P77, P80 to P84, P86, P87, P90 to P97, P100 to P107, XOUT P70, P71 Power dissipation Operating ambient temperature Topr Storage temperature Tstg Note : Specify a product of -40°C to 85°C to use it. 8 Unit VCC=AVCC Input voltage VO Rated value Supply voltage Topr=25 C Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Electrical characteristics SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.26.2. Recommended operating conditions (referenced to VCC = 2.2V to 3.6V at Topr = –20°C to 85oC / – 40°C to 85oC (Note 3) unless otherwise specified) Parameter Symbol Min. Supply voltage Analog supply voltage Supply voltage Analog supply voltage Vcc AVcc Vss AVss HIGH input voltage Standard Typ. 2.2 P31 to P37, P40 to P47, P50 to P57, P60 to P67, P72 to P77, P80 to P87, P90 to P97, P100 to P107, XIN, RESET, CNVSS, BYTE P70, P71 P00 to P07, P10 to P17, P20 to P27, P30 (during single-chip mode) P00 to P07, P10 to P17, P20 to P27, P30 3.0 Vcc Max. 3.6 Unit V 0 V V 0 V 0.8Vcc Vcc V 0.8Vcc 4.6 Vcc V 0.8Vcc 0.5Vcc Vcc V 0 0.2Vcc V 0 0.2Vcc V 0 0.16Vcc V HIGH peak output I OH (peak) current - 10.0 mA I OH (avg) - 5.0 mA 10.0 mA 5.0 mA 0 10 MHz 0 10 X Vcc - 17 17.5 X Vcc - 35 10 MHz VIH (data input function during memory expansion and microprocessor modes) LOW input voltage VIL P31 to P37, P40 to P47, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P97, P100 to P107, XIN, RESET, CNVSS, BYTE P00 to P07, P10 to P17, P20 to P27, P30 (during single-chip mode) P00 to P07, P10 to P17, P20 to P27, P30 (data input function during memory expansion and microprocessor modes) I OL (peak) I OL (avg) P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P72 to P77, P80 to P84, P86, P87, P90 to P97, P100 to P107 HIGH average output P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P72 to P77, current P80 to P84, P86, P87, P90 to P97, P100 to P107 P00 to P07, P10 to P17, P20 to P27, P30 to P37, LOW peak output P40 to P47, P50 to P57, P60 to P67, P70 to P77, current P80 to P84, P86, P87, P90 to P97, P100 to P107 P00 to P07, P10 to P17, P20 to P27, P30 to P37, LOW average P40 to P47, P50 to P57, P60 to P67, P70 to P77, output current P80 to P84, P86, P87, P90 to P97, P100 to P107 Vcc=2.7V to 3.6V No wait f (XIN) Main clock input oscillation frequency f (XcIN) Vcc=2.4V to 2.7V with wait Vcc=2.2V to 2.4V 0 Vcc=2.7V to 3.6V 0 Vcc=2.2V to 2.7V 0 6 X Vcc - 6.2 Subclock oscillation frequency 32.768 50 V MHz MHz MHz kHz Note 1: The mean output current is the mean value within 100ms. Note 2: The total IOL (peak) for ports P0, P1, P2, P86, P87, P9, and P10 must be 80mA max. The total IOH (peak) for ports P0, P1, P2, P86, P87, P9, and P10 must be 80mA max. The total IOL (peak) for ports P3, P4, P5, P6, P7, and P80 to P84 must be 80mA max. The total IOH (peak) for ports P3, P4, P5, P6, P72 to P77, and P80 to P84 must be 80mA max. Note 3: Specify a product of -40°C to 85°C to use it. Note 4: Relationship between main clock oscillation frequency and supply voltage. 10.0 7.0 AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA 10 X VCC –17MHZ 17.5 X VCC –35MHZ 3.5 0.0 2.2 2.4 2.7 Supply voltage[V] (BCLK: no division) 3.6 Main clock input oscillation frequency (With wait) Operating maximum frequency [MHZ] Operating maximum frequency [MHZ] Main clock input oscillation frequency (No wait) 10.0 7.0 0.0 AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA AAAAAAA Flash memory version program voltage and read operation voltage characteristics 6 X VCC –6.2MHZ 2.2 2.4 2.7 Flash program voltage Flash read operation voltage VCC=2.7V to 3.6V VCC=2.4V to 3.6V VCC=2.7V to 3.4V VCC=2.2V to 2.4V 3.6 Supply voltage[V] (BCLK: no division) Note 5: Execute case without wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 6.25 MHz. Execute case with wait, program / erase of flash memory by VCC=2.7V to 3.6V and f(BCLK) ≤ 10.0 MHz. 9 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Electrical characteristics SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.26.3. Electrical characteristics (referenced to VCC = 2.7V to 3.6V, VSS = 0V at Topr = – 20oC to 85oC / – 40oC to 85oC (Note 1), f(XIN) = 10MHZ without wait unless otherwise specified) VOH VOH VOL VOL Measuring condition Parameter Symbol HIGH output voltage P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P72 to P77, P80 to P84, P86,P87, P90 to P97, P100 to P107 HIGH output voltage XOUT HIGH output voltage XCOUT 2.5 HIGHPOWER IOH=–0.1mA 2.5 LOWPOWER IOH=–50µA 2.5 HIGHPOWER With no load applied 3.0 LOWPOWER With no load applied 1.6 P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P70 to P77, P80 to P84, P86,P87, P90 to P97, P100 to P107 LOW output voltage XOUT Hysteresis VT+–VT– XCOUT Standard Unit Typ. Max. IOH=–1mA LOW output voltage LOW output voltage Min V V V IOL=1mA 0 .5 HIGHPOWER IOL=0.1mA 0 .5 LOWPOWER IOL=50µA HIGHPOWER With no load applied 0 LOWPOWER With no load applied 0 0 .5 V V V HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN, INT0 to INT5, NMI, ADTRG, CTS0 to CTS2, SCL, SDA, CLK0 to CLK4, TA2OUT to TA4OUT, KI0 to KI3, RxD0 to RxD2, SIN3, SIN4 0.2 0 .8 V 0.2 1 .8 V VT+–VT– Hysteresis RESET IIH HIGH input current P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P97, P100 to P107, XIN, RESET, CNVss, BYTE VI=3V 4 .0 µA IIL LOW input current P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P70 to P77, P80 to P87, P90 to P97, P100 to P107, XIN, RESET, CNVss, BYTE VI=0V –4.0 µA RPULLUP Pull-up resistance 330 kΩ P00 to P07, P10 to P17, P20 to P27, P30 to P37, P40 to P47, P50 to P57, P60 to P67, P72 to P77, P80 to P84, P86,P87, P90 to P97, P100 to P107 VI=0V 20 75 RfXIN Feedback resistance XIN 3 .0 MΩ RfXCIN Feedback resistance XCIN 10.0 MΩ VRAM RAM retention voltage When clock is stopped Mask ROM version In single-chip mode, the output pins are open and other pins are VSS Flash memory 3V version program ICC Power supply current Flash memory 3V version erase V f(XIN)=10MHz Square wave, no division 9 .5 21.25 mA 12.0 21.25 mA f(XIN)=10MHz Square wave, no division Mask ROM version, f(XCIN)=32kHz flash memory Square wave 3V version Flash memory 3V version 2.0 45.0 µA 14.0 mA 17.0 mA 2 .8 µA 0 .9 µA f(XIN)=10MHz Square wave, division by 2 f(XIN)=10MHz Square wave, division by 2 Mask ROM version, f(XCIN)=32kHz When a WAIT instruction flash memory is executed. 3V version Oscillation capacity High (Note 2) f(XCIN)=32kHz When a WAIT instruction is executed. Oscillation capacity Low (Note 2) When clock is stopped Topr=25°C 1.0 µA When clock is stopped Topr=85°C Note 1: Specify a product of -40°C to 85°C to use it. Note 2: With one timer operated using fC32. 10 20.0 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Electrical characteristics SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Table 1.26.4. A-D conversion characteristics (referenced to VCC = AVCC = VREF = 2.4V to 3.6V, VSS = AVSS = 0V, at Topr = – 20oC to 85oC / – 40oC to 85oC (Note 2), f(XIN)=10MHZ unless otherwise specified) Standard Symbol Parameter Measuring condition Unit Min. Typ. Max – Resolution – Absolute accuracy Sample & hold function not available (8 bit) RLADDER tCONV Ladder resistance Conversion time(8bit) VREF Reference voltage VIA Analog input voltage VREF =VCC 10 Bits VREF =VCC=3V, fAD=fAD/2 ±2 LSB 40 kΩ VREF =VCC 10 µs 9.8 2.4 VCC V 0 VREF V Note 1: Connect AVCC pin to VCC pin and apply the same electric potential. Note 2: Specify a product of –40°C to 85°C to use it. Table 1.26.5. D-A conversion characteristics (referenced to VCC = 2.4V to 3.6V, VSS = AVSS = 0V, VREF=3V, at Topr = – 20oC to 85oC / – 40oC to 85oC (Note 2), f(XIN)=10MHZ unless otherwise specified) Standard Parameter Measuring condition Unit Min. Typ. Max Symbol – – tsu RO IVREF Resolution Absolute accuracy Setup time 4 Output resistance Reference power supply input current 10 (Note1) 8 1.0 3 20 Bits % µs kΩ 1.0 mA Note 1: This applies when using one D-A converter, with the D-A register for the unused D-A converter set to “0016”. The A-D converter's ladder resistance is not included. Also, when D-A register contents are not “0016”, the current IVREF always flows even though Vref may have been set to be “unconnected” by the A-D control register. Note 2: Specify a product of –40°C to 85°C to use it. Table 1.26.6. Flash memory version electrical characteristics (referenced to VCC = 2.7V to 3.6V, at Topr = 0oC to 60oC unless otherwise specified) Standard Parameter Min. Typ. Max Page program time 6 Block erase time Erase all unlocked blocks time Lock bit program time Unit 120 ms 50 600 ms 50 X n (Note) 600 X n (Note) ms 120 ms 6 Note : n denotes the number of block erases. Table 1.26.7. Flash memory version program voltage and read operation voltage characteristics (Topr = 0oC to 60oC) Flash program voltage Flash read operation voltage VCC=2.7V to 3.6V VCC=2.4V to 3.6V VCC=2.7V to 3.4V VCC=2.2V to 2.4V 11 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timing requirements (referenced to VCC = 3V, VSS = 0V, at Topr = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of -40°C to 85°C to use it. Table 1.26.8. External clock input Standard Parameter Symbol tc External clock input cycle time External clock input HIGH pulse width External clock input LOW pulse width tw(H) tw(L) tr Min. Unit ns 100 40 ns 40 ns External clock rise time External clock fall time tf Max. 18 ns 18 ns Table 1.26.9. Memory expansion and microprocessor modes Symbol tac1(RD-DB) tac2(RD-DB) tac3(RD-DB) tsu(DB-RD) tsu(RDY-BCLK ) tsu(HOLD-BCLK ) th(RD-DB) th(BCLK -RDY) th(BCLK-HOLD ) td(BCLK-HLDA) Parameter Data input access time (no wait) (Note) Data input access time (with wait) Data input access time (when accessing multiplex bus area) Data input setup time RDY input setup time HOLD input setup time Data input hold time RDY input hold time HOLD input hold time HLDA output delay time (Note) Note: Calculated according to the BCLK frequency as follows: tac1(RD – DB) = 10 9 – 90 f(BCLK) X 2 tac2(RD – DB) = 3 X 10 – 90 f(BCLK) X 2 [ns] tac3(RD – DB) = 3 X 10 9 – 90 f(BCLK) X 2 [ns] [ns] 9 12 Standard Min. Max. (Note) 80 60 Unit ns ns ns ns ns ns 80 0 ns ns 0 0 ns 100 ns Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timing requirements (referenced to VCC = 3V, VSS = 0V, at Topr = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of –40°C to 85°C to use it. Table 1.26.10. Timer A input (counter input in event counter mode) Symbol Parameter tc(TA) TAiIN input cycle time tw(TAH) tw(TAL) TAiIN input HIGH pulse width TAiIN input LOW pulse width Standard Min. 150 Max. Unit ns 60 60 ns ns Table 1.26.11. Timer A input (gating input in timer mode) Standard Symbol Parameter Min. Max. Unit tc(TA) TAiIN input cycle time 600 ns tw(TAH) tw(TAL) TAiIN input HIGH pulse width TAiIN input LOW pulse width 300 300 ns ns Table 1.26.12. Timer A input (external trigger input in one-shot timer mode) Symbol Parameter Standard Min. Max. Unit tc(TA) TAiIN input cycle time 300 ns tw(TAH) tw(TAL) TAiIN input HIGH pulse width TAiIN input LOW pulse width 150 150 ns ns Table 1.26.13. Timer A input (external trigger input in pulse width modulation mode) Symbol Parameter tw(TAH) TAiIN input HIGH pulse width tw(TAL) TAiIN input LOW pulse width Standard Min. Max. 150 150 Unit ns ns Table 1.26.14. Timer A input (up/down input in event counter mode) Symbol Parameter Standard Max. Unit tc(UP) TAiOUT input cycle time Min. 3000 tw(UPH) TAiOUT input HIGH pulse width 1500 ns tw(UPL) TAiOUT input LOW pulse width 1500 ns tsu(UP-TIN) TAiOUT input setup time 600 ns th(TIN-UP) TAiOUT input hold time 600 ns ns 13 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Timing requirements (referenced to VCC = 3V, VSS = 0V, at Topr = – 20oC to 85oC / – 40oC to 85oC (*) unless otherwise specified) * : Specify a product of –40°C to 85°C to use it. Table 1.26.15. Timer B input (counter input in event counter mode) Parameter Symbol tc(TB) tw(TBH) TBiIN input cycle time (counted on one edge) TBiIN input HIGH pulse width (counted on one edge) Standard Max. Min. Unit 150 60 ns ns 60 ns TBiIN input HIGH pulse width (counted on both edges) 300 160 ns ns TBiIN input LOW pulse width (counted on both edges) 160 ns tw(TBL) TBiIN input LOW pulse width (counted on one edge) tc(TB) tw(TBH) TBiIN input cycle time (counted on both edges) tw(TBL) Table 1.26.16. Timer B input (pulse period measurement mode) Parameter Symbol Standard Unit tc(TB) TBiIN input cycle time Min. 600 tw(TBH) TBiIN input HIGH pulse width 300 ns tw(TBL) TBiIN input LOW pulse width 300 ns Standard Min. Max. Unit Max. ns Table 1.26.17. Timer B input (pulse width measurement mode) Parameter Symbol tc(TB) TBiIN input cycle time 600 ns tw(TBH) tw(TBL) TBiIN input HIGH pulse width TBiIN input LOW pulse width 300 300 ns ns Standard Min. Max. Unit 1500 200 ns ns Table 1.26.18. A-D trigger input Symbol tc(AD) tw(ADL) Parameter ADTRG input cycle time (trigger able minimum) ADTRG input LOW pulse width Table 1.26.19. Serial I/O Symbol Parameter tc(CK) tw(CKH) CLKi input cycle time CLKi input HIGH pulse width tw(CKL) td(C-Q) CLKi input LOW pulse width TxDi output delay time th(C-Q) TxDi hold time tsu(D-C) th(C-D) RxDi input setup time RxDi input hold time Standard Min. 300 150 Max. Unit ns ns 150 160 ns ns 0 ns 50 90 ns ns _______ Table 1.26.20. External interrupt INTi inputs Symbol 14 Parameter Standard tw(INH) INTi input HIGH pulse width Min. 380 tw(INL) INTi input LOW pulse width 380 Max. Unit ns ns Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Switching characteristics (referenced to VCC = 3V, VSS = 0V at Topr = – 20oC to 85oC / – 40oC to 85oC (Note 3), CM15 = “1” unless otherwise specified) Table 1.26.21. Memory expansion and microprocessor modes (with no wait) Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) Measuring condition Parameter Address output delay time Address output hold time (BCLK standard) Address output hold time (RD standard) Address output hold time (WR standard) Chip select output delay time Chip select output hold time (BCLK standard) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (BCLK standard) Data output hold time (BCLK standard) Data output delay time (WR standard) Data output hold time (WR standard)(Note2) Figure 1.26.1 Standard Min. Max. 60 4 0 0 60 4 60 –4 60 0 60 0 80 4 (Note1) 0 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 1: Calculated according to the BCLK frequency as follows: td(DB – WR) = 10 9 f(BCLK) X 2 – 80 [ns] Note 2: This is standard value shows the timing when the output is off, and doesn't show hold time of data bus. Hold time of data bus is different by capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = –CR X ln (1 – VOL / VCC) by a circuit of the right figure. For example, when VOL = 0.2VCC, C = 30pF, R = 1kΩ, hold time of output “L” level is t = – 30pF X 1kΩ X ln (1 – 0.2VCC / VCC) = 6.7ns. R DBi C Note 3: Specify a product of –40°C to 85°C to use it. P0 P1 P2 30pF P3 P4 P5 P6 P7 P8 P9 P10 Figure 1.26.1. Port P0 to P10 measurement circuit 15 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Switching characteristics (referenced to VCC = 3V, VSS = 0V at Topr = – 20oC to 85oC / – 40oC to 85oC (Note 3), CM15 = “1” unless otherwise specified) Table 1.26.22. Memory expansion and microprocessor modes (when accessing external memory area with wait) Symbol Measuring condition Parameter td(BCLK-AD) th(BCLK-AD) th(RD-AD) Address output delay time Address output hold time (BCLK standard) Address output hold time (RD standard) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) Address output hold time (WR standard) Chip select output delay time Chip select output hold time (BCLK standard) ALE signal output delay time th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (BCLK standard) Data output hold time (BCLK standard) Data output delay time (WR standard) th(WR-DB) Data output hold time (WR standard)(Note2) Figure 1.31.1 Standard Min. Max. 60 4 0 0 60 4 60 –4 60 0 60 0 80 4 (Note1) 0 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 1: Calculated according to the BCLK frequency as follows: 9 td(DB – WR) = 10 f(BCLK) – 80 [ns] Note 2: This is standard value shows the timing when the output is off, and doesn't show hold time of data bus. Hold time of data bus is different by capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = –CR X ln (1 – VOL / VCC) by a circuit of the right figure. For example, when VOL = 0.2VCC, C = 30pF, R = 1kΩ, hold time of output “L” level is t = – 30pF X 1kΩ X ln (1 – 0.2VCC / VCC) = 6.7ns. Note 3: Specify a product of –40°C to 85°C to use it. 16 R DBi C Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Switching characteristics (referenced to VCC = 3V, VSS = 0V at Topr = – 20oC to 85oC / – 40oC to 85oC (Note 2), CM15 = “1” unless otherwise specified) Table 1.26.23. Memory expansion and microprocessor modes (when accessing external memory area with wait, and select multiplexed bus) Measuring condition Symbol Parameter td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) th(RD-CS) th(WR-CS) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-ALE) th(BCLK-ALE) td(AD-ALE) th(ALE-AD) td(AD-RD) td(AD-WR) tdZ(RD-AD) Address output delay time Address output hold time (BCLK standard) Address output hold time (RD standard) Address output hold time (WR standard) Chip select output delay time Chip select output hold time (BCLK standard) Chip select output hold time (RD standard) Chip select output hold time (WR standard) RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (BCLK standard) Data output hold time (BCLK standard) Data output delay time (WR standard) Data output hold time (WR standard) ALE signal output delay time (BCLK standard) ALE signal output hold time (BCLK standard) ALE signal output delay time (Address standard) ALE signal output hold time(Address standard) Post-address RD signal output delay time Post-address WR signal output delay time Address output floating start time Figure 1.26.1 Standard Min. Max. 60 4 (Note 1) (Note 1) 60 4 (Note 1) (Note 1) 60 0 60 0 80 4 (Note 1) (Note 1) 60 –4 (Note 1) 40 0 0 8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 1: Calculated according to the BCLK frequency as follows: th(RD – AD) = 10 9 [ns] f(BCLK) X 2 th(WR – AD) = th(RD – CS) = 10 9 [ns] f(BCLK) X 2 10 9 [ns] f(BCLK) X 2 th(WR – CS) = td(DB – WR) = 10 9 [ns] f(BCLK) X 2 10 9 X3 – 80 f(BCLK) X 2 th(WR – DB) = td(AD – ALE) = 10 9 [ns] f(BCLK) X 2 10 [ns] 9 f(BCLK) X 2 – 45 [ns] Note 2: Specify a product of –40°C to 85°C to use it. 17 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V tc(TA) tw(TAH) TAiIN input tw(TAL) tc(UP) tw(UPH) TAiOUT input tw(UPL) TAiOUT input (Up/down input) During event counter mode TAiIN input (When count on falling edge is selected) TAiIN input (When count on rising edge is selected) tsu(UP–TIN) th(TIN–UP) tc(TB) tw(TBH) TBiIN input tw(TBL) tc(AD) tw(ADL) ADTRG input tc(CK) tw(CKH) CLKi tw(CKL) th(C–Q) TxDi td(C–Q) tsu(D–C) RxDi tw(INL) INTi input Figure 1.26.2. VCC=3V timing diagram (1) 18 tw(INH) th(C–D) Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Memory Expansion Mode and Microprocessor Mode (Valid only with wait) BCLK RD (Separate bus) WR, WRL, WRH (Separate bus) RD (Multiplexed bus) WR, WRL, WRH (Multiplexed bus) RDY input th(BCLK–RDY) tsu(RDY–BCLK) (Valid with or without wait) BCLK tsu(HOLD–BCLK) th(BCLK–HOLD) HOLD input HLDA output td(BCLK–HLDA) td(BCLK–HLDA) P0, P1, P2, P3, P4, P50 to P52 Hi–Z Note: The above pins are set to high-impedance regardless of the input level of the BYTE pin and bit (PM06) of processor mode register 0 selects the function of ports P40 to P43. Measuring conditions : • VCC=3V • Input timing voltage : Determined with VIL=0.6V, VIH=2.4V • Output timing voltage : Determined with VOL=1.5V, VOH=1.5V Figure 1.26.3. VCC=3V timing diagram (2) 19 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Memory Expansion Mode and Microprocessor Mode (With no wait) Read timing BCLK th(BCLK–CS) td(BCLK–CS) 4ns.min 60ns.max CSi th(RD–CS) 0ns.min tcyc td(BCLK–AD) ADi BHE ALE th(BCLK–AD) 60ns.max 4ns.min th(RD–AD) 0ns.min td(BCLK–ALE) th(BCLK–ALE) –4ns.min 60ns.max th(BCLK–RD) td(BCLK–RD) 60ns.max 0ns.min RD tac1(RD–DB) Hi–Z DB th(RD–DB) tSU(DB–RD) 0ns.min 80ns.min Write timing BCLK td(BCLK–CS) th(BCLK–CS) 4ns.min 60ns.max CSi th(WR–CS) tcyc 0ns.min td(BCLK–AD) th(BCLK–AD) 60ns.max ADi BHE ALE td(BCLK–ALE) th(BCLK–ALE) td(BCLK–WR) 60ns.max td(BCLK–DB) 80ns.max Hi–Z td(DB–WR) (tcyc/2–80)ns.min Figure 1.26.4. VCC=3V timing diagram (3) 20 th(WR–AD) 0ns.min –4ns.min 60ns.max WR,WRL, WRH DB 4ns.min th(BCLK–WR) 0ns.min th(BCLK–DB) 4ns.min th(WR–DB) 0ns.min Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Memory Expansion Mode and Microprocessor Mode (When accessing external memory area with wait) Read timing BCLK th(BCLK–CS) td(BCLK–CS) 4ns.min 60ns.max CSi th(RD–CS) tcyc 0ns.min th(BCLK–AD) td(BCLK–AD) ADi BHE 4ns.min 60ns.max td(BCLK–ALE) th(RD–AD) 60ns.max th(BCLK–ALE) 0ns.min –4ns.min ALE td(BCLK–RD) th(BCLK–RD) 60ns.max 0ns.min RD tac2(RD–DB) Hi–Z DB th(RD–DB) tSU(DB–RD) 0ns.min 80ns.min Write timing BCLK th(BCLK–CS) td(BCLK–CS) 4ns.min 60ns.max CSi th(WR–CS) tcyc 0ns.min td(BCLK–AD) ADi BHE th(BCLK–AD) 60ns.max 4ns.min th(WR–AD) td(BCLK–ALE) 0ns.min 60ns.max th(BCLK–ALE) –4ns.min ALE td(BCLK–WR) 60ns.max WR,WRL, WRH th(BCLK–WR) 0ns.min th(BCLK–DB) td(BCLK–DB) 4ns.min 80ns.max DBi th(WR–DB) td(DB–WR) 0ns.min (tcyc–80)ns.min Measuring conditions : • VCC=3V • Input timing voltage : Determined with VIL=0.48V, VIH=1.5V • Output timing voltage : Determined with VOL=1.5V, VOH=1.5V Figure 1.26.5. VCC=3V timing diagram (4) 21 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) Timing SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER VCC = 3V Memory Expansion Mode and Microprocessor Mode (When accessing external memory area with wait, and select multiplexed bus) Read timing BCLK th(BCLK–CS) tcyc td(BCLK–CS) th(RD–CS) 60ns.max CSi td(AD–ALE) (tcyc/2–45)ns.min ADi /DBi tdz(RD–AD) 8ns.max Address th(ALE–AD) Data input Address th(RD–DB) tac3(RD–DB) 40ns.min tSU(DB–RD) td(AD–RD) 0ns.min 80ns.min 0ns.min td(BCLK–AD) th(BCLK–AD) 60ns.max ADi BHE 4ns.min th(BCLK–ALE) td(BCLK–ALE) th(RD–AD) (tcyc/2)ns.min –4ns.min ALE 4ns.min (tcyc/2)ns.min 60ns.max th(BCLK–RD) td(BCLK–RD) 0ns.min 60ns.max RD Write timing BCLK td(BCLK–CS) th(BCLK–CS) tcyc 4ns.min th(WR–CS) 60ns.max (tcyc/2)ns.min CSi th(BCLK–DB) td(BCLK–DB) 4ns.min 80ns.max ADi /DBi Address td(AD–ALE) (tcyc/2–60)ns.min Address Data output td(DB–WR) (tcyc*3/2–80)ns.min th(WR–DB) (tcyc/2)ns.min th(BCLK–AD) td(BCLK–AD) ADi BHE ALE 4ns.min 60ns.max td(BCLK–ALE) th(BCLK–ALE) 60ns.max –4ns.min td(AD–WR) 0ns.min td(BCLK–WR) 60ns.max WR,WRL, WRH th(WR–AD) (tcyc/2)ns.min th(BCLK–WR) 0ns.min Measuring conditions : • VCC=3V • Input timing voltage : Determined with VIL=0.48V,VIH=1.5V • Output timing voltage : Determined with VOL=1.5V,VOH=1.5V Figure 1.26.6. VCC=3V timing diagram (5) 22 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-95B Mask ROM number Date : Receipt MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30620MCM-XXXFP/GP MASK ROM CONFIRMATION FORM Section head signature Supervisor signature Company name ❈ Customer Date issued TEL ( Issuance signature Note : Please complete all items marked ❈ . ) Date : Submitted by Supervisor ❈1. Check sheet Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that there is any discrepancy between the contents of these mask files and the ROM data to be burned into products we produce. Check thoroughly the contents of the mask files you give in. Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk. Microcomputer type No. : M30620MCM-XXXFP M30620MCM-XXXGP File code : (hex) Mask file name : .MSK (alpha-numeric 8-digit) ❈2. Mark specification The mark specification differs according to the type of package. After entering the mark specification on the separate mark specification sheet (for each package), attach that sheet to this masking check sheet for submission to Mitsubishi. For the M30620MCM-XXXFP, submit the 100P6S mark specification sheet. For the M30620MCM-XXXGP, submit the 100P6Q mark specification sheet. ❈3. Usage Conditions For our reference when of testing our products, please reply to the following questions about the usage of the products you ordered. (1) Which kind of XIN-XOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XIN) = MHZ 23 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-95B Mask ROM number MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30620MCM-XXXFP/GP MASK ROM CONFIRMATION FORM (2) Which kind of XCIN-XCOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XCIN) = kHZ (3) Which operation mode do you use? Single-chip mode Memory expansion mode Microprocessor mode (4) Which operating supply voltage do you use? (Circle the operating voltage range of use) 2.2 2.4 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 (V) (5) Which operating ambient temperature do you use? (Circle the operating temperature range of use) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 (°C) (6) Do you use I2C (Inter IC) bus function? Not use Use (7) Do you use IE (Inter Equipment) bus function? Not use Use Thank you cooperation. ❈4. Special item (Indicate none if there is not specified item) 24 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-48B Mask ROM number Date : Receipt MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30624MGM-XXXFP/GP MASK ROM CONFIRMATION FORM Section head signature Supervisor signature Company name ❈ Customer Date issued TEL ( Issuance signature Note : Please complete all items marked ❈ . ) Date : Submitted by Supervisor ❈1. Check sheet Mitsubishi processes the mask files generated by the mask file generation utilities out of those held on the floppy disks you give in to us, and forms them into masks. Hence, we assume liability provided that there is any discrepancy between the contents of these mask files and the ROM data to be burned into products we produce. Check thoroughly the contents of the mask files you give in. Prepare 3.5 inches 2HD (IBM format) floppy disks. And store only one mask file in a floppy disk. Microcomputer type No. : M30624MGM-XXXFP M30624MGM-XXXGP File code : (hex) Mask file name : .MSK (alpha-numeric 8-digit) ❈2. Mark specification The mark specification differs according to the type of package. After entering the mark specification on the separate mark specification sheet (for each package), attach that sheet to this masking check sheet for submission to Mitsubishi. For the M30624MGM-XXXFP, submit the 100P6S mark specification sheet. For the M30624MGMXXXGP, submit the 100P6Q mark specification sheet. ❈3. Usage Conditions For our reference when of testing our products, please reply to the following questions about the usage of the products you ordered. (1) Which kind of XIN-XOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XIN) = MHZ 25 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER GZZ-SH13-48B Mask ROM number MITSUBISHI ELECTRIC-CHIP 16-BIT MICROCOMPUTER M30624MGM-XXXFP/GP MASK ROM CONFIRMATION FORM (2) Which kind of XCIN-XCOUT oscillation circuit is used? Ceramic resonator Quartz-crystal oscillator External clock input Other ( ) What frequency do not use? f(XCIN) = kHZ (3) Which operation mode do you use? Single-chip mode Memory expansion mode Microprocessor mode (4) Which operating supply voltage do you use? (Circle the operating voltage range of use) 2.2 2.4 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 (V) (5) Which operating ambient temperature do you use? (Circle the operating temperature range of use) -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 (°C) (6) Do you use I2C (Inter IC) bus function? Not use Use (7) Do you use IE (Inter Equipment) bus function? Not use Use Thank you cooperation. ❈4. Special item (Indicate none if there is not specified item) 26 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Differences between M16C/62M (Low voltage version) and M30624FGLFP/GP Item M16C/62M (Low voltage version) M30624FGLFP/GP Memory area 1 Mbyte fixed Memory expansion 1.2 Mbytes mode 4 Mbytes mode Serial I/O No CTS/RTS separate function CTS/RTS separate function IIC bus mode Analog or digital delay is selected as SDA delay Only analog delay is selected as SDA delay Memory version Mask ROM version Flash memory version Flash memory version only Standard serial I/O mode (Flash memory version) Clock synchronized Clock asynchronized Clock synchronized only 27 Mitsubishi microcomputers M16C / 62M Group (Low voltage version) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Version REV. B1 Contents for change Page 8-17 All symbols of Ta are revised to Topr. Revision history 28 M16C/62M Group data sheet Revision date 01.6.22 Keep safety first in your circuit designs! ● Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials ● ● ● ● ● ● ● ● These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http:// www.mitsubishichips.com). When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semicon ductor product distributor for further details on these materials or the products con tained therein. MITSUBISHI SEMICONDUCTORS M16C/62M Group (Low voltage version) Data Sheet REV.B1 June First Edition 2001 Edition by Committee of editing of Mitsubishi Semiconductor Published by Mitsubishi Electric Corp., Kitaitami Works This book, or parts thereof, may not be reproduced in any form without permission of Mitsubishi Electric Corporation. ©2001 MITSUBISHI ELECTRIC CORPORATION