MK1714-02RLFTR

DATASHEET MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK Description Features The MK1714-02 is a low cost, high performance clock synthesizer with selectable multipliers and percentages of spread designed to generate high frequency clocks with low EMI. Using analog/digital Phase Locked Loop (PLL) techniques, the device accepts an inexpensive, fundamental mode, parallel resonant crystal or clock input to produce a spread or dithered output. This reduces the EMI amplitude peaks at the odd harmonics by several dB. The OE pin puts both outputs into a high impedance state for board level testing. The PD pin powers down the entire chip and the outputs are held low. • • • • • • • • • • • • Packaged in 20-pin tiny SSOP Pb (lead) free package Operating voltage of 3.3 V or 5 V Multiplier modes of x1, x2, x3, x4, x5, and x6 Inexpensive 10 - 25 MHz crystal or clock input OE pin tri-states the outputs for board testing Power down pin stops the outputs low Selectable frequency spread Spread can be turned on or off Advanced, low power CMOS process Duty cycle of 40/60 Industrial temperature range available Block Diagram V DD 2 S4:0 5 PD P LL Clock M ultiplier and Spread S pectrum Circuitry Low E M I E nable Input Crystal or Clock Clock O ut X1 Crystal O scillator RE F X2 4 X SE L IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK O E (both outputs) G ND 1 MK1714-02 REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG Pin Assignment X2 1 20 REF X1/ICLK 2 19 OE VDD 3 18 PD VDD 4 17 GND S4 5 16 S0 S3 6 15 NC GND 7 14 S1 GND 8 13 GND S2 9 12 LEE 10 11 XSEL CLK 20 pin (150 mil) SSOP (QSOP) Pin Descriptions Pin Number Pin Name Pin Type Pin Description 1 X2 XO Crystal connection. Connect to parallel mode crystal. Leave open for clock. Crystal connection. Connect to parallel mode crystal or clock. 2 X1 XI 3 VDD Power Connect to VDD. Must be same value as other VDD. 4 VDD Power Connect to VDD. Must be same value as other VDD. 5 S4 Input Select pin 4. Determines multiplier and spread amount per table on following page. Internal pull-down. 6 S3 Input Select pin 3. Determines multiplier and spread amount per table on following page. Internal pull-up. 7 GND Power Connect to ground. 8 GND Power Connect to ground. 9 S2 Input Select pin 2. Determines multiplier and spread amount per table on following page. Internal pull-up. 10 CLK 11 XSEL Input Connect to VDD for crystal input, or GND for CLK input. Internal pull-down. 12 LEE Input Low EMI Enable. Turns on spread spectrum on CLK when high. Internal pull-up. 13 GND Power Connect to ground. 14 S1 Input Select pin 1. Determines multiplier and spread amount per table on following page. Internal pull-up. 17 GND Power Connect to ground. 18 PD Input Power down. Turns off chip when low. Outputs stop low. Leave open or connected to VDD if power down is not required. Input Output enable. Tri-states all outputs when low. Internal pull-up. 19 OE 20 REF Output Clock output dependent on input, multiplier, and spread amount per table on following page. Output Reference clock output from crystal oscillator. This clock is not spread. Note: When changing the input frequency, the LEE pin must be set low for minimum of 10µs to allow the PLL to lock to the new frequency. Alternatively, the PD pin may be set low while changing frequencies. IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK 2 MK1714-02 REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG Clock Output Select Table (MHz) S4 S3 S2 S1 S0 Input Range Multiplier Output Range Direction Amount (%) 3.3/5V 0 0 0 0 0 40 - 80 x1 40 - 80 C ±0.75 Both 0 0 0 0 1 60 - 120 x1 60 -120 DC +0.25, -0.75 Both 0 0 0 1 0 40 - 80 x1 40 - 80 C ±1.25 Both 0 0 0 1 1 80 - 150 x1 80 - 150 C ±0.75 Both 0 0 1 0 0 10 - 30 x2 20 - 60 C ±0.75 Both 0 0 1 0 1 20 - 60 x2 40 - 120 C ±0.5 Both 0 0 1 1 0 10 - 25 x2 20 - 50 DC +0.25, -1.5 Both 0 0 1 1 1 20 - 60 x2 40 - 120 DC +0.5, -1 Both 0 1 0 0 0 20 - 30 x3 60 - 90 C ±0.5 Both 0 1 0 0 1 40 - 75 x2 80 - 150 C ±0.75 Both 0 1 0 1 0 40 - 100 x1 40 - 100 DC +0.25, -1.5 Both 0 1 0 1 1 40 - 75 x2 80 - 150 DC +0.25, -1.5 Both 0 1 1 0 0 20 - 40 x1 20 - 40 DC +0.5, -2.0 3.3V 0 1 1 0 1 20 - 60 x1 20 - 60 DC +0.25, -1.5 Both 0 1 1 1 0 10 - 20 x1 10 - 20 DC +0.5, -2.0 Both 0 1 1 1 1 10 - 30 x1 10 - 30 DC +0.25, -1.5 Both 1 0 0 0 0 20 - 37.5 x4 80 - 150 DC +0.25, -1.25 Both 1 0 0 0 1 20 - 40 x3 60 - 120 DC +0.25, -1.5 Both 1 0 0 1 0 10 - 30 x1 10 - 30 C ±0.75 Both 1 0 0 1 1 20 - 30 x1 20 - 30 D -0.5 Both 1 0 1 0 0 5 - 20 x2 10 - 40 DC +0.25, -2.25 3.3V 1 0 1 0 1 20 - 50 x3 60 - 150 D -0.25, -2.25 Both 1 0 1 1 0 20 - 37.5 x4 80 - 150 C ±0.75 Both 1 0 1 1 1 80 - 150 x1 80 - 150 DC +0.25, -1.25 Both 1 1 0 0 0 10 - 25 x4 40 - 100 C ±0.75 Both 1 1 0 0 1 10 - 20 x5 50 - 100 C ±0.75 Both 1 1 0 1 0 10 - 20 x6 60 - 120 C ±0.75 Both 1 1 0 1 1 20 - 50 x1 20 - 50 C ±0.75 Both 1 1 1 0 0 10 - 25 x4 40 - 100 DC +0.25, -1.5 Both 1 1 1 0 1 10 - 20 x5 50 - 100 DC +0.25, -1.25 Both 1 1 1 1 0 10 - 20 x6 60 - 120 D -1.5 Both 1 1 1 1 1 10 - 30 x1 10 - 30 C ±0.75 Both For S4:S0, 0 = connect to GND, 1 = connect to VDD. Direction: C = center spread, D = down spread, DC = down + center spread. Amount = spread amount. For example, for a 40 MHz output clock spread down 1%, the lowest frequency is 39.60 MHz. Contact IDT with your exact output frequency for details on spread direction and amount. IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK 3 MK1714-02 REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG External Components the component side of the board as close to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical. The MK1714-02 requires a minimum number of external components for proper operation. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD and GND, as close to these pins as possible. For optimum device performance, the decoupling capacitor should be mounted on the component side of the PCB. Avoid the use of vias in the decoupling circuit. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead they should be separated and away from other traces. Series Termination Resistor 3) To minimize EMI the 33Ω series termination resistor, if needed, should be placed close to the clock output. When the PCB trace between the clock outputs and the loads are over 1 inch, series termination should be used. To series terminate a 50Ω trace (a commonly used trace impedance) place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. Crystal Tuning Load Capacitors 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers (the ferrite bead and bulk decoupling capacitor can be mounted on the back). Other signal traces should be routed away from the MK1714-02. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. Crystal Load Capacitors Powerup Considerations The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) between the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. To insure proper operation of the spread spectrum generation circuit, some precautions must be taken in the implementation of the MK1714-02. 1) An input signal should not be applied to ICLK until VDD is stable (within 10% of its final value). This requirement can be easily met by operating the MK1714-02 and the ICLK source from the same power supply. 2) LEE should not be enabled (taken high) until after the power supplies and input clock are stable. This requirement can be met by direct control of LEE by system logic; for example, a “power good” signal. Another solution is to leave LEE unconnected to anything but a 0.01µF capacitor to ground. The pull-up resistor on LEE will charge the capacitor and provide approximately a 700µs delay until spread spectrum is enabled. The value (in pF) of these crystal caps should equal (CL-6)*2. In this equation, CL= crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be [16 - 6]*2 = 20 pF. PCB Layout Recommendations 3) If the input frequency is changed during operation, disable spread spectrum until the input clock stabilizes at the new frequency. For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) The 0.01µF decoupling capacitor should be mounted on IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK 4 MK1714-02 REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK1714-02. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5V to VDD+0.5V Ambient Operating Temperature -40 to +85° C Storage Temperature -65 to +150° C Junction Temperature 175° C Soldering Temperature 260° C Recommended Operation Conditions Parameter Min. Max. Units 0 +70 °C +3.0 +5.5 V Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) Typ. DC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V or 5 V, Ambient Temperature -40 to +85° C Parameter Symbol Conditions Min. Typ. Units 5.5 V Operating Voltage VDD Supply Current IDD No load, at 3.3 V 26 mA IDD No load, at 5 V 40 mA Input High Voltage VIH Select inputs, OE, PD Input Low Voltage VIL Select inputs, OE, PD Output High Voltage VOH IOH = -8 mA Output Low Voltage VOL IOL = 8 mA Short Circuit Current IOS Each output ±50 mA On Chip Pull-up Resistor, inputs RPU Except X1 500 kΩ On-Chip Pull-down Resistor, outputs RPD S4 pin only 500 kΩ 7 pF Input Capacitance IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK 3.0 Max. Except X1, X2 5 2 V 0.8 VDD-0.4 V V 0.4 MK1714-02 V REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V or 5 V, Ambient Temperature -40 to +85° C Parameter Symbol Conditions Min. Typ. Max. Units Input Crystal Frequency 10 25 MHz Input Clock Frequency 10 150 MHz Output Rise Time tOR 0.8 to 2.0 V 1.5 ns Output Fall Time tOF 2.0 to 0.8 V 1.5 ns One Sigma Jitter CLK 40 Absolute Jitter CLK ±160 Output Clock Duty Cycle at VDD/2 Output Frequency 40 50 2 Output Frequency Synthesis Error ps 60 % 200 MHz 1 ppm Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK Symbol Conditions Min. Typ. Max. Units θ JA Still air 135 ° C/W θ JA 1 m/s air flow 93 ° C/W θ JA 3 m/s air flow 78 ° C/W 60 ° C/W θ JC 6 MK1714-02 REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG Package Outline and Package Dimensions (20 pin SSOP, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95 20 Millimeters Symbol E1 A A1 A2 b C D E E1 e L α E INDEX AREA 1 2 D A 2 Min Inches Max Min 1.35 1.75 0.10 0.25 -1.50 0.20 0.30 0.18 0.25 8.55 8.75 5.80 6.20 3.80 4.00 0.635 Basic 0.40 1.27 0° 8° Max .053 .069 .0040 .010 -.059 0.008 0.012 .007 .010 .337 .344 .228 .244 .150 .157 0.025 Basic .016 .050 0° 8° A A 1 c -Ce b SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature MK1714-02RLF MK1714-01RLFTR MK1714-02RILF MK1714-02RILFTR MK1714-02RL MK1714-02RL MK171402RIL MK171402RIL Tubes Tape and Reel Tubes Tape and Reel 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 0 to +70° C 0 to +70° C -40 to 85 ° C -40 to 85 ° C "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ SPREAD SPECTRUM MULTIPLIER CLOCK 7 MK1714-02 REV K 051310 MK1714-02 SPREAD SPECTRUM MULTIPLIER CLOCK SSCG Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. 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