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RJK0366DPA-02#J0B

RJK0366DPA-02#J0B

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    WFDFN8

  • 描述:

    MOSFET N-CH 30V 25A 8WPAK

  • 数据手册
  • 价格&库存
RJK0366DPA-02#J0B 数据手册
Preliminary Datasheet RJK0366DPA-02 30V, 25A, 10.0m max. N Channel Power MOS FET High Speed Power Switching R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 Features        High speed switching Capable of 4.5 V gate drive Low drive current High density mounting Low on-resistance Pb-free Halogen-free Outline RENESAS Package code: PWSN0008DE-A (Package name: WPAK(3F)) 5 6 7 8 D D D D 5 6 7 8 4 3 2 1 1, 2, 3 Source 4 Gate 5, 6, 7, 8 Drain 4 G S S S 1 2 3 Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel to case thermal resistance Channel temperature Storage temperature Symbol VDSS VGSS ID ID(pulse)Note1 IDR IAP Note 2 EAR Note 2 Pch Note3 ch-c Note3 Tch Tstg Ratings 30 ±20 25 100 25 11 12.1 30 4.17 150 –55 to +150 Unit V V A A A A mJ W C/W C C Notes: 1. PW  10 s, duty cycle  1% 2. Value at Tch = 25C, Rg  50  3. Tc = 25C R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 Page 1 of 6 RJK0366DPA-02 Preliminary Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Gate Resistance Total gate charge Gate to source charge Gate to drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body–drain diode forward voltage Body–drain diode reverse recovery time Symbol V(BR)DSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDF trr Min 30 — — 1.2 — — — — — — — — — — — — — Typ — — — — 7.4 10.9 50 1010 190 75 1.1 6.8 2.5 1.5 5.0 3.6 33 Max — ± 0.1 1 2.5 10.0 15.7 — — — — — — — — — — — Unit V A A V m m S pF pF pF  nC nC nC ns ns ns — — — 4.2 0.89 20 — 1.16 — ns V ns Test Conditions ID = 10 mA, VGS = 0 VGS = ±20 V, VDS = 0 VDS = 30 V, VGS = 0 VDS = 10 V, I D = 1 mA ID = 12.5 A, VGS = 10 V Note4 ID = 12.5 A, VGS = 4.5 V Note4 ID = 12.5 A, VDS = 10 V Note4 VDS = 10 V VGS = 0 f = 1 MHz VDD = 10 V VGS = 4.5 V ID = 12.5 A VGS = 10 V, ID = 12.5 A VDD  10 V RL = 0.8  Rg = 4.7  IF = 25 A, VGS = 0 Note4 IF =25 A, VGS = 0 diF/ dt = 100 A/ s Notes: 4. Pulse test R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 Page 2 of 6 RJK0366DPA-02 Preliminary Main Characteristics Maximum Safe Operation Area Power vs. Temperature Derating ID (A) 1000 40 1 s 10 PW = 10 ms 1 50 100 150 Case Temperature 0.1 1 shot Pulse 0.1 1 200 VDS (V) 20 4.5 V 10 V ID (A) Pulse Test 3.2 V 16 3.0 V 12 16 8 2.8 V 4 8 4 VGS = 2.6 V 2 4 6 Drain to Source Voltage VDS = 10 V Pulse Test 12 Drain Current ID (A) 100 Typical Transfer Characteristics 20 0 10 Drain to Source Voltage Tc (°C) Typical Output Characteristics Drain Current ion at Operation in this area is limited by RDS(on) Tc = 25°C 0 8 25°C Tc = 75°C –25°C 10 0 1 2 3 4 Gate to Source Voltage VDS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage Drain to Source Saturation Voltage VDS (on) (mV) m er 20 100 Op Drain Current 60 DC Channel Dissipation Pch (W) 80 5 VGS (V) Static Drain to Source On State Resistance vs. Drain Current 100 200 Pulse Test Pulse Test 150 30 100 10 VGS = 4.5 V ID = 10 A 10 V 50 5A 3 2A 0 4 8 12 Gate to Source Voltage R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 16 20 VGS (V) 1 1 3 10 30 Drain Current 100 ID 300 1000 (A) Page 3 of 6 RJK0366DPA-02 Preliminary Static Drain to Source On State Resistance vs. Temperature Typical Capacitance vs. Drain to Source Voltage 25 10000 Pulse Test 3000 Capacitance C (pF) 20 ID = 2 A, 5 A, 10 A 15 VGS = 4.5 V 10 2 A, 5 A, 10 A 10 V 5 0 –25 0 Ciss 1000 300 Coss 100 30 25 50 75 10 0 100 125 150 Case Temperature Tc (°C) 12 VDS 20 8 10 4 VDD = 25 V 10 V 0 0 0 10 20 Gate Charge 30 40 20 30 50 Qg (nc) 50 Reverse Drain Current IDR (A) 16 VDD = 25 V 10 V VGS (V) 20 VGS 40 30 10 Reverse Drain Current vs. Source to Drain Voltage Gate to Source Voltage VDS (V) Drain to Source Voltage ID = 25 A VGS = 0 f = 1 MHz Drain to Source Voltage VDS (V) Dynamic Input Characteristics 50 Crss Pulse Test 10 V 40 5V 30 20 VGS = 0, –5 V 10 0 0.4 0.8 1.2 1.6 2.0 Source to Drain Voltage VSD (V) Repetitive Avalanche Energy EAR (mJ) Maximum Avalanche Energy vs. Channel Temperature Derating 20 16 12 8 4 0 25 50 75 100 125 150 Channel Temperature Tch (°C) R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 Page 4 of 6 RJK0366DPA-02 Preliminary 3 Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 0.1 5 0.0 θch – c (t) = γ s (t) • θch – c θch – c = 4.17°C/W, Tc = 25°C 02 D= ul PDM PW T ho tp 01 0. se 0. 0.03 1s Normalized Transient Thermal Impedance γs (t) Normalized Transient Thermal Impedance vs. Pulse Width 0.01 10 μ PW T 100 μ 10 m 1m 100 m 1 10 Pulse Width PW (s) Avalanche Test Circuit Avalanche Waveform EAR = L VDS Monitor 1 L • IAP2 • 2 VDSS VDSS – VDD IAP Monitor V(BR)DSS IAP Rg VDS VDD D. U. T ID Vin 15 V 50 Ω 0 VDD Switching Time Test Circuit Switching Time Waveform Vout Monitor Vin Monitor 90% D.U.T. Rg RL Vin Vout Vin 10 V 10% 10% VDS = 10 V 90% td(on) R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 10% tr 90% td(off) tf Page 5 of 6 RJK0366DPA-02 Preliminary Package Dimensions JEITA Package Code ⎯ 5.1 ± 0.2 RENESAS Code PWSN0008DE-A Previous Code WPAK(3F)V MASS[Typ.] 0.075g Unit: mm 0.5 ± 0.15 Package Name WPAK(3F) 0.85Max 4.23Typ 1.27Typ +0.1 -0.2 1.27Typ 0.5 ± 0.15 5.9 +0.1 -0.3 6.1 0.05Max 0Min Stand-off 0.545Typ 3.6 ± 0.2 3.92 ± 0.22 0.21Typ 0.42 ± 0.08 4.90 ± 0.1 (Sn plating) Notice:The reverse pattern of die-pad support lead described above exists. Ordering Information Orderable Part Number RJK0366DPA-02-J0B Note: Quantity 2500 pcs Shipping Container Taping The symbol of 2nd "-" is occasionally presented as "#". R07DS0920EJ0300 Rev.3.00 Mar 21, 2013 Page 6 of 6 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics 3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or 5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". 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RJK0366DPA-02#J0B 价格&库存

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