RF3196

RF3196 QUAD-BAND GSM850/GSM900/DCS/PCS POWER AMP MODULE RoHS Compliant and Pb-Free Product Package Style: Module, 6mm x6mm Features Reduced Current into Mismatch Ultra-Small 6mmx6mm Package Size Integrated VREG Complete Power Control Solution Automatic VBATT Tracking Circuit No External Components or Routing DCS/PCS 1 RFIN BAND SELECT 2 TX ENABLE 3 VBATT 4 GND 5 VRAMP 6 GSM 7 RF IN 8 GSM RFOUT 9 DCS/PCS RFOUT Applications 3 V Quad-Band GSM Handsets Commercial and Consumer Systems Portable Battery-Powered Equipment GSM850/EGSM900/DCS/PC S Products GPRS Class 8 Power StarTM Module Functional Block Diagram Product Description The RF3196 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The device is a self-contained 6mmx6mm module with 50 Ω input and output terminals. The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands. The RF3196 incorporates RFMD’s latest VBATT tracking circuit, which monitors battery voltage and prevents the power control loop from reaching saturation. The RF3196 also has a power flattening circuit that reduces power variation and max current draw into mismatch. The RF3196 requires no external routing or external components, simplifying layout and reducing board space. Ordering Information RF3196 RF3196 SB RF3196PCBA-41X Quad-Band GSM850/GSM900/DCS/PCS Power Amp Module Power Amp Module 5-Piece Sample Pack Fully Assembled Evaluation Board Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. Rev A2 DS071207 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 16 RF3196 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (VRAMP) Input RF Power Max Duty Cycle Output Load VSWR Operating Case Temperature Storage Temperature Rating -0.3 to +6.0 -0.3 to +2.2 +10 50 10:1 -20 to +85 -55 to +150 Unit VDC V dBm % °C °C Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Operating Conditions Parameter Overall Power Control VRAMP Power Control “ON” Power Control “OFF” VRAMP Input Capacitance VRAMP Input Current TX Enable “ON” TX Enable “OFF” GSM Band Enable DCS/PCS Band Enable 1.5 3.0 3.5 1 150 4.5 1.5 0.5 0.5 0.26 2 20 30 2.1 V V pF μA V V V V V μA mA V V μA V V μA Operating limits PIN 1.8V TX_Enable Vramp starts 2us after Tx_Enable 0.26 to 2.1 V Vramp ends 2us before Tx_Enable VRAMP Power On Sequence: Apply VBATT Apply Band Select Apply RF drive Apply TX_Enable & VRAMP in unison The Power Down sequence is in opposite order of the Power On Sequence Figure 4. RF3196 Timing Diagram As described in the above figure, VBATT is applied first to provide bias to the silicon control chip. Then the RF drive is applied. Finally, when TX_ENABLE is high, the VRAMP signal is held at constant 0.26V, and 2uS later, VRAMP begins to ramp up. The shape of VRAMP is important for maintaining the switching transients. The basic shape of the ramping function should be the first 90° of a raised sine function. This is shown in Equation 1 where A is the desired peak power in mW, B is the minimum output power of the power amplifier in mW, K determines the duration of the ramp, and t is time. The down-ramp function uses the same equation except a cosine function is used in the place of the sine function. The exponent “n” determines the steepness of the ramp and is typically set to 5. P OUT ( mW ) = ( A – B ) ⋅ ( sin ( Kt ) ) + B The value of K is calculated using Equation 2. n (Eq. 1) π K = ------------------2 ⋅ t ramp (Eq. 2) The Ramp synthesis tool provided by RFMD generates the ramp profiles automatically. It will generate ramps for all power levels and output the waveform for 8, 10, and 12 bit DACs in decimal, voltage, or hex formats. Rev A2 DS071207 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 13 of 16 RF3196 The spectrum is maintained at all power levels. The following figures show power ramping at max and backed off power. Figure 5. Full Power Ramping Figure 6. Low Power Ramping Summary The RF3196 is the next generation of PowerStar® Power Amplifiers. The type of power control used in the RF3196 is a closed loop method that regulates the collector voltage of the amplifier while the stages are held at a constant bias. The VBATT tracking circuit monitors VBATT levels so that the transient spectrum never degrades and the new power flattening circuit reduces power and current variation in high current situations. 14 of 16 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A2 DS071207 RF3196 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3 μinch to 8 μinch gold over 180 μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 0.40 Sq. Typ. B = 0.80 x 0.40 Typ. C = 0.40 x 0.80 0.37 0.93 4.47 5.20 5.60 Dimensions in mm. A = 0.55 x 0.95 B = 0.55 Sq. Typ. C = 0.95 x 0.55 Typ. D = 1.80 x 4.62 E = 0.60 Sq. Typ. 5.20 TYP 4.10 3.30 2.50 1.60 Pin 1 Pin 1 5.20 4.10 3.30 2.50 1.80 1.40 0.80 0.00 C A A B B 5.60 5.40 4.90 A B B C B B B D E E E E E E E E E E E E E E E C B B B B B B B 5.40 4.62 3.85 3.07 2.76 2.30 1.52 0.75 A A A 0.60 0.20 0.80 0.00 0.00 0.50 4.90 5.40 0.00 1.95 3.40 4.25 Metal Land Pattern Solder Mask Pattern Figure 1. PCB Metal Land and Solder Mask Patterns (Top View) PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. Thermal Pad and Via Design Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Rev A2 DS071207 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5.40 15 of 16 RF3196 Material Declaration RoHS* Banned Material Content RoHS Compliant: Compliance Date Code: Bill of Materials Revision: Pb Free Category: Yes N/A 3196E4.9 Rev.B e4 Parts Per Million (PPM) Pb 1000 0 335 0 0 0 0 0 Cd 0 0 0 0 0 0 0 0 Hg 0 0 0 0 0 0 0 0 Cr VI 0 0 0 0 0 0 0 0 PBB 0 0 0 0 0 0 0 0 PBDE 0 0 0 0 0 0 0 0 Package total weight in grams (g): 0.117 Bill of Materials Permissible Concentration Limits per EU Decision 2005/618/EC Substrate Passive Components Die Molding Compound Die Attach Epoxy Wire Solder Plating This RoHS banned material content declaration was prepared solely on information, including analytical data, provided to RFMD by its suppliers, and applies to the Bill of Materials (BOM) revision noted above. * DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Pb noted in this material declaration is used in glass or ceramics in electronic components which is an allowed exemption from the RoHS regulations, see Annex to Directive 2002/95/EC and amendment 2005/747/EC. 16 of 16 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A2 DS071207