＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x SERIES
Low Voltage 300mA LDO REGULATOR
NO.EA-116-130530
OUTLINE
The R1131x Series are CMOS-based low voltage regulator ICs with output voltage range from 0.8V to 3.3V.
The minimum operating voltage is 1.4V. Each of these voltage regulator ICs consists of a voltage reference unit,
an error amplifier, resistors for setting output voltage, a current limit circuit, and a chip enable circuit.
To prevent the destruction by over current, current limit circuit is included. Standby mode realizes ultra small
consumption current.
The output voltage of these ICs is internally fixed with high accuracy. Since the packages for these ICs are
SOT-23-5, SON-6, and HSON-6, high density mounting of the ICs on boards is possible.
FEATURES
• Supply Current ..................................................Typ. 80μA (VOUT < 1.8V)
Typ. 60μA (VOUT ≥ 1.8V)
• Standby Mode ...................................................Typ. 0.1μA
• Dropout Voltage ................................................Typ. 0.48V(IOUT=300mA Output Voltage=1.0V Type)
Typ. 0.31V(IOUT=300mA Output Voltage=1.5V Type)
Typ. 0.23V(IOUT=300mA Output Voltage=3.0V Type)
• Ripple Rejection................................................Typ. 65dB(f=1kHz)
• Temperature-Drift Coefficient of Output Voltage........Typ. ±100ppm/°C
• Line Regulation .................................................Typ. 0.01%/V
• Output Voltage Accuracy...................................±2.0%
• Output Voltage Range.......................................0.8V to 3.3V (0.1V steps)
(For other voltages, please refer to MARK INFORMATIONS.)
• Input Voltage Range .........................................1.4V to 6.0V
• Packages .........................................................SOT-23-5, SON-6, HSON-6
• Built-in fold-back protection circuit ....................Typ. 50mA (Current at short mode)
• External Capacitors...........................................CIN=COUT=Tantalum 1.0μF (VOUT < 1.0V)
CIN=COUT=Ceramic 1.0μF (VOUT ≥ 1.0V)
APPLICATIONS
• Precision Voltage References.
• Power source for electrical appliances such as cameras, VCRs and hand-held communication equipment.
• Power source for battery-powered equipment.
1
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
BLOCK DIAGRAM
R1131xxxxA
R1131xxxxB
VOUT
VDD
Vref
Vref
Current Limit
CE
Current Limit
GND
R1131xxxxD
VOUT
VDD
Vref
Current Limit
CE
2
VOUT
VDD
GND
CE
GND
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
SELECTION GUIDE
The output voltage, CE pin polarity, auto discharge function, package, etc. for the ICs can be selected at the
user’s request.
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
R1131Nxx1∗-TR-FE
SOT-23-5
3,000 pcs
Yes
Yes
R1131Dxx1∗-TR-FE
SON-6
3,000 pcs
Yes
Yes
R1131Dxx2∗-TR-FE
HSON-6
3,000 pcs
Yes
Yes
xx : The output voltage can be designated in the range from 0.8V(08) to 3.3V(33) in 0.1V steps.
(For other voltages, please refer to MARK INFORMATIONS.)
∗ : CE pin polarity and auto discharge function at off state are options as follows.
(A) "L" active, without auto discharge function at off state
(B) "H" active, without auto discharge function at off state
(D) "H" active, with auto discharge function at off state
3
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
PIN CONFIGURATIONS
z SOT-23-5
5
4
z SON-6
Top View
6 5 4
z HSON-6
Bottom View
4 5 6
∗
∗
Top View
6
5
4
2
4
5
∗
1 2 3
3
3 2 1
1
2
3
∗
3
2
PIN DESCRIPTIONS
•
•
SOT-23-5
Pin No
Symbol
Pin Description
1
VDD
2
GND
3
CE or CE
Chip Enable Pin
4
NC
No Connection
5
VOUT
Output pin
Input Pin
Ground Pin
SON-6, HSON-6
Pin No
Symbol
Pin Description
1
VDD
Input Pin
2
NC
No Connection
3
VOUT
Output pin
4
NC
No Connection
5
GND
6
CE or CE
Ground Pin
Chip Enable Pin
∗) Tab and tab suspension leads are GND level. (They are connected to the reverse side of this IC.)
The tab is better to be connected to the GND, but leaving it open is also acceptable.
The tab suspension leads do not be connect to other wires or land patterns.
4
6
∗
(mark side)
1
Bottom View
1
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
VIN
Input Voltage
VCE
Input Voltage( CE /CE Pin)
VOUT
Output Voltage
IOUT
Output Current
Power Dissipation (SOT-23-5)
PD
Power Dissipation (SON-6)
∗
∗
Power Dissipation (HSON-6)
Rating
Unit
6.5
V
−0.3 to 6.5
V
−0.3 to VIN+0.3
V
350
mA
420
500
∗
mW
900
Topt
Operating Temperature Range
−40 to 85
°C
Tstg
Storage Temperature Range
−55 to 125
°C
∗) For Power Dissipation please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field.
The functional operation at or over these absolute maximum ratings is not assured.
5
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
ELECTRICAL CHARACTERISTICS
•
R1131xxxxA
Symbol
Topt=25°C
Item
Conditions
VOUT
Output Voltage
VIN= Set VOUT+1V
1μA ≤ IOUT ≤ 30mA
IOUT
Output Current
VIN −VOUT=1.0V
Load Regulation
VIN=Set VOUT+1V,
1mA ≤ IOUT ≤ 300mA
ΔVOUT/
ΔIOUT
VDIF
ISS1
Dropout Voltage
Supply Current
Min.
Typ.
Max.
Unit
VOUT >1.5V
×0.98
×1.02
V
VOUT ≤ 1.5V
−30
+30
mV
300
mA
40
70
VOUT=0.8V
620
850
VOUT=0.9V
550
780
1.0V ≤ VOUT < 1.5V
480
700
1.5V ≤ VOUT < 2.6V
310
450
2.6V ≤ VOUT ≤ 3.3V
230
350
VIN=Set VOUT+1V, VOUT < 1.8V
80
111
μA
VIN=Set VOUT+1V, VOUT ≥ 1.8V
60
90
μA
IOUT=300mA
mV
mV
Istandby
Standby Current
VIN=VCE=Set VOUT+1V
0.1
1.0
μA
ΔVOUT/
ΔVIN
Line Regulation
IOUT=30mA
VOUT+0.5V ≤ VIN ≤ 6.0V (VOUT > 0.9V)
1.4V ≤ VIN ≤ 6.0V (VOUT ≤ 0.9V)
0.01
0.15
%/V
RR
Ripple Rejection
f=1kHz, Ripple 0.2Vp-p
VIN=Set VOUT+1V, IOUT=30mA
VIN
Input Voltage
ΔVOUT/
ΔTopt
65
1.4
Output Voltage
Temperature Coefficient
IOUT=30mA
−40°C ≤ Topt ≤ 85°C
ISC
Short Current Limit
VOUT=0V
RPU
CE Pull-up Resistance
1.87
VCEH
CE Input Voltage “H”
VCEL
CE Input Voltage “L”
en
Output Noise
BW=10Hz to 100kHz
dB
6.0
V
±100
ppm
/°C
50
mA
5.0
12.0
MΩ
1.0
6.0
V
0
0.3
V
30
μVrms
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
6
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
•
R1131xxxxB/D
Symbol
Topt=25°C
Item
Conditions
VOUT
Output Voltage
VIN=Set VOUT+1V
1μA ≤ IOUT ≤ 30mA
IOUT
Output Current
VIN−VOUT=1.0V
Load Regulation
VIN=Set VOUT+1V
1mA ≤ IOUT ≤ 300mA
ΔVOUT/
ΔIOUT
VDIF
ISS1
Dropout Voltage
Supply Current
Min.
Typ.
Max.
Unit
VOUT >1.5V
×0.98
×1.02
V
VOUT ≤ 1.5V
−30
+30
mV
300
mA
40
70
VOUT=0.8V
620
850
VOUT=0.9V
550
780
1.0V ≤ VOUT < 1.5V
480
700
1.5V ≤ VOUT < 2.6V
310
450
2.6V ≤ VOUT ≤ 3.3V
230
350
VIN=Set VOUT+1V, VOUT < 1.8V
80
111
μA
VIN=Set VOUT+1V, VOUT ≥ 1.8V
60
90
μA
IOUT=300mA
mV
mV
Istandby
Standby Current
VIN=Set VOUT+1V, VCE=GND
0.1
1.0
μA
ΔVOUT/
ΔVIN
Line Regulation
IOUT=30mA
VOUT+0.5V ≤ VIN ≤ 6.0V(VOUT > 0.9V)
1.4V ≤ VIN ≤ 6.0V(VOUT ≤ 0.9V)
0.01
0.15
%/V
RR
Ripple Rejection
f=1kHz, Ripple 0.2Vp-p
VIN=Set VOUT+1V, IOUT=30mA
VIN
Input Voltage
ΔVOUT/
ΔTopt
65
1.4
Output Voltage
Temperature Coefficient
IOUT=30mA
−40°C ≤ Topt ≤ 85°C
ISC
Short Current Limit
VOUT=0V
RPD
CE Pull-down Resistance
1.87
VCEH
VCEL
CE Input Voltage “H”
CE Input Voltage “L”
1.0
0
en
RLOW
Output Noise
BW=10Hz to 100kHz
Nch On Resistance for auto
VCE=0V
discharge (D version only)
dB
6.0
V
±100
ppm
/°C
50
mA
5.0
12.0
6.0
0.3
MΩ
V
V
30
μVrms
60
Ω
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
7
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
TYPICAL APPLICATION
IN
VDD
C1
OUT
OUT
OUT
OUT
R1131x
Series
C2
GND
CE ⋅ CE
C2 1.0μF CM05X5R105K06AB (Kyocera)
C2 1.0μF C1005JBOJ105K (TDK)
C2 1.0μF GRM155B30J105KE18B (Murata)
Output Capacitor; 1.0μF or more capacity ceramic Type
(If VOUT < 1.0V, Tantalum Type is recommended)
Input Capacitor, 1.0μF or more capacity ceramic Type
TECHNICAL NOTES
When using these ICs, consider the following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, be sure to use a 1.0μF or more capacitor COUT with good frequency characteristics and ESR
(Equivalent Series Resistance).
(Note: If a tantalum capacitor is connected to the Output pin for phase compensation, if the ESR value of the
capacitor is too large, the operation might be unstable. Because of this, test these ICs with as same external
components as ones to be used on the PCB.)
Chip capacitor characteristics of Bias dependence and Temperature characteristics may vary depending on its
size, manufacturer, and part number.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, pick-up the noise or unstable operation may
result. Connect a capacitor with as much as 1.0μF capacitor between VDD and GND pin as close as possible.
Set external components, especially the output capacitor, as close as possible to the ICs, and make wiring as
short as possible.
8
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
TEST CIRCUIT
VDD
OUT
A
R1131x
Series
C1
VDD
ISS
C2
IOUT
GND
R1131x
Series
C1
VOUT
C2
CE ⋅ CE
∗ C1=C2= Tantalum1.0μF (VOUT
= 1.0V)
∗ C1=C2=Tantalum1.0μF (VOUT
= 1.0V)
Standard Test Circuit
VDD
Supply Current Test Circuit
VDD
OUT
R1131x
Series
P.G
OUT
GND
V
CE ⋅ CE
Pulse
Generator
OUT
C2
IOUT
C1
OUT
R1131x
Series
C2
GND
GND
IOUTa
CE ⋅ CE
CE ⋅ CE
∗ C2=Tantalum1.0μF (VOUT
= 1.0V)
Ripple Rejection, Line Transient Response
Test Circuit
VDD
C1
IOUTb
∗ C1=C2=Tantalum1.0μF (VOUT
= 1.0V)
Load Transient Response Test Circuit
OUT
R1131x
Series
C2
IOUT
GND
Pulse
Generator
CE ⋅ CE
∗ Input signal waveform
to CE pin is shown below.
Set VOUT
+1.0V
0V
∗ C1=C2=Tantalum1.0μF (VOUT
= 1.0V)
Turn on Speed with CE pin Test Circuit
9
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
TYPICAL CHARACTERISTICS
1) Output Voltage vs. Output Current
R1131x08xx
R1131x15xx
1.0
1.6
VIN =2.8V
0.8
0.7
Output Voltage VOUT(V)
Output Voltage VOUT(V)
0.9
1.45V
0.6
0.5
0.4
0.3
0.2
1.4
3.5V
1.2
2.5V
1.0
0.8
2.0V
0.6
VIN =1.8V
0.4
0.2
0.1
0
0
0
100
200
300 400 500
Output Current lOUT(mA)
600
0
100
200
300 400 500
Output Current lOUT(mA)
R1131x26xx
R1131x33xx
3.5
3.0
Output Voltage VOUT(V)
Output Voltage VOUT(V)
3.5
4.6V
2.5
2.0
3.6V
1.5
VIN =2.9V
1.0
3.1V
0.5
0
600
0
100
200
300
400
500
3.0
5.3V
2.5
3.8V
1.5
VIN =3.6V
1.0
0.5
0
600
4.3V
2.0
0
100
Output Current lOUT(mA)
200
300
400
500
600
Output Current lOUT(mA)
2) Output Voltage vs. Input Voltage
R1131x15xx
1.8
0.9
1.6
Output Voltage VOUT(V)
Output Voltage VOUT(V)
R1131x08xx
1.0
0.8
0.7
0.6
0.5
0.4
IOUT= 1mA
0.3
IOUT=30mA
0.2
IOUT=50mA
1.2
1.0
IOUT= 1mA
0.8
IOUT=30mA
0.6
IOUT=50mA
0.4
0.2
0.1
0
0
0
10
1.4
1
2
3
4
Input Voltage VIN(V)
5
6
0
1
2
3
4
Input Voltage VIN(V)
5
6
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x33xx
3.5
4.0
3.0
3.5
Output Voltage VOUT(V)
Output Voltage VOUT(V)
R1131x26xx
2.5
2.0
IOUT= 1mA
1.5
IOUT=30mA
1.0
IOUT=50mA
0.5
0
0
1
2
3
4
Input Voltage VIN(V)
5
3.0
2.5
2.0
IOUT= 1mA
1.5
IOUT=30mA
1.0
IOUT=50mA
0.5
0
6
0
1
2
3
4
Input Voltage VIN(V)
5
6
5
6
5
6
3) Supply Current vs. Input Voltage
R1131x15xx
90
90
80
Supply Current ISS(μA)
Supply Current ISS(μA)
R1131x08xx
100
80
70
60
50
40
30
20
60
50
40
30
20
10
10
0
70
0
1
2
3
4
Input Voltage VIN(V)
5
0
6
0
1
R1131x33xx
90
90
80
80
Supply Current ISS(μA)
Supply Current ISS(μA)
R1131x26xx
70
60
50
40
30
20
70
60
50
40
30
20
10
10
0
2
3
4
Input Voltage VIN(V)
0
1
2
3
4
Input Voltage VIN(V)
5
6
0
0
1
2
3
4
Input Voltage VIN(V)
11
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
4) Output Voltage vs. Temperature
R1131x15xx
1.53
0.83
1.52
Output Voltage VOUT(V)
Output Voltage VOUT(V)
R1131x08xx
0.84
0.82
0.81
0.80
0.79
0.78
0.77
-40 -25
0
25
50
1.51
1.50
1.49
1.48
1.47
1.46
-40 -25
75 85
Temperature Topt(°C)
3.37
2.63
3.35
2.62
2.61
2.60
2.59
2.58
2.57
-40 -25
0
25
50
Temperature Topt(°C)
75 85
R1131x33xx
2.64
Output Voltage VOUT(V)
Output Voltage VOUT(V)
R1131x26xx
0
25
50
Temperature Topt(°C)
3.33
3.31
3.29
3.27
3.25
3.23
-40 -25
75 85
0
25
50
75 85
Temperature Topt(°C)
5) Supply Current vs. Temperature
12
R1131x15xx
80
70
Supply Current ISS(μA)
Supply Current ISS(μA)
R1131x08xx
110
100
90
80
70
60
50
40
30
20
10
0
-40 -25
60
50
40
30
20
10
0
25
50
Temperature Topt(°C)
75 85
0
-40 -25
0
25
50
Temperature Topt(°C)
75 85
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x33xx
80
70
70
Supply Current ISS(μA)
Supply Current ISS(μA)
R1131x26xx
80
60
50
40
30
20
60
50
40
30
20
10
10
0
-40 -25
0
25
50
Temperature Topt(°C)
0
-40 -25
75 85
0
25
50
Temperature Topt(°C)
75 85
6) Dropout Voltage vs. Output Current
R1131x09xx
0.8
0.7
0.7
85°C
0.6
25°C
0.5
-40°C
Dropout Voltage VDIF(V)
Dropout Voltage VDIF(V)
R1131x08xx
0.8
0.6
0.5
0.4
0.3
85°C
0.2
25°C
0.1
-40°C
0
0
50
100
150 200 250
Output Current IOUT(mA)
0.4
0.3
0.2
0.1
0
300
0
50
R1131x10xx
0.40
0.7
85°C
0.6
25°C
0.5
-40°C
Dropout Voltage VDIF(V)
Dropout Voltage VDIF(V)
300
R1131x15xx
0.8
0.4
0.3
0.2
0.1
0
100
150 200 250
Output Current IOUT(mA)
0
50
100
150 200 250
Output Current IOUT(mA)
300
0.35
85°C
0.30
25°C
0.25
-40°C
0.20
0.15
0.10
0.05
0
0
50
100
150 200 250
Output Current IOUT(mA)
300
13
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x26xx
R1131x33xx
0.40
0.35
85°C
0.30
25°C
0.25
-40°C
Dropout Voltage VDIF(V)
Dropout Voltage VDIF(V)
0.40
0.20
0.15
0.10
85°C
0.30
25°C
0.25
-40°C
0.20
0.15
0.10
0.05
0.05
0
0.35
0
50
100
150 200 250
Output Current IOUT(mA)
0
300
0
50
100
150 200 250
Output Current IOUT(mA)
300
7) Dropout Voltage vs. Set Output Voltage (Topt=25°C)
R1131xxx1x
Dropout Voltage VDIF(V)
0.80
IOUT=10mA
30mA
50mA
100mA
200mA
300mA
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
0.5
1
1.5
2
2.5
3
Set Output Voltage VREG(V)
3.5
8) Ripple Rejection vs. Input Bias (Topt=25°C CIN=none, COUT=Ceramic 1.0μF Ripple 0.2VP-P)
70
70
60
50
40
30
f = 400Hz
f = 1kHz
f = 10kHz
f = 100kHz
20
10
0
2.6
14
R1131x26xx (IOUT=30mA)
80
Ripple Rejection RR(dB)
Ripple Rejection RR(dB)
R1131x26xx (IOUT=1mA)
80
2.7
2.8
2.9
3.0
Input Voltage VIN(V)
3.1
3.2
60
50
40
30
f = 400Hz
f = 1kHz
f = 10kHz
f = 100kHz
20
10
0
2.6
2.7
2.8
2.9
3.0
Input Voltage VIN(V)
3.1
3.2
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x26xx (IOUT=50mA)
Ripple Rejection RR(dB)
80
70
60
50
40
30
f = 400Hz
f = 1kHz
f = 10kHz
f = 100kHz
20
10
0
2.6
2.7
2.8
2.9
3.0
Input Voltage VIN(V)
3.1
3.2
9) Ripple Rejection vs. Frequency (CIN=none)
R1131x08xx
R1131x08xx
VIN=1.8VDC+0.2Vp-p,
COUT=Tantalum 2.2μF
100
100
90
90
Ripple Rejection RR(dB)
Ripple Rejection RR(dB)
VIN=1.8VDC+0.2Vp-p,
COUT=Tantalum 1.0μF
80
70
60
50
40
30
20
10
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
80
70
60
50
40
30
20
10
0
0.1
100
R1131x10xx
100
90
90
Ripple Rejection RR(dB)
Ripple Rejection RR(dB)
100
80
70
60
50
30
20
10
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
100
R1131x10xx
VIN=2.0VDC+0.2Vp-p,
COUT=Ceramic 1.0μF
40
IOUT = 1mA
80
70
60
50
40
30
20
10
100
VIN=2.0VDC+0.2Vp-p,
COUT=Ceramic 2.2μF
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
100
15
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x15xx
R1131x15xx
VIN=2.5VDC+0.2Vp-p,
COUT=Ceramic 2.2μF
100
100
90
90
Ripple Rejection RR(dB)
Ripple Rejection RR(dB)
VIN=2.5VDC+0.2Vp-p,
COUT=Ceramic 1.0μF
80
70
60
50
40
30
20
10
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
80
70
60
50
40
30
20
10
0
0.1
100
R1131x26xx
90
Ripple Rejection RR(dB)
Ripple Rejection RR(dB)
100
90
80
70
60
50
20
10
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
60
50
40
30
20
10
0
0.1
100
90
16
Ripple Rejection RR(dB)
Ripple Rejection RR(dB)
90
80
70
60
50
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
100
VIN=4.3VDC+0.2Vp-p,
COUT=Ceramic 2.2μF
100
10
IOUT = 1mA
R1131x33xx
100
20
100
70
VIN=4.3VDC+0.2Vp-p,
COUT=Ceramic 1.0μF
30
1
10
Frequency f(kHz)
80
R1131x33xx
40
IOUT = 50mA
VIN=3.6VDC+0.2Vp-p,
COUT=Ceramic 2.2μF
100
30
IOUT = 30mA
R1131x26xx
VIN=3.6VDC+0.2Vp-p,
COUT=Ceramic 1.0μF
40
IOUT = 1mA
80
70
60
50
40
30
20
10
100
0
0.1
IOUT = 1mA
IOUT = 30mA
IOUT = 50mA
1
10
Frequency f(kHz)
100
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
10) Input Transient Response (CIN=none, tr=tf=5μs)
R1131x10x
4
4
3
3
2
1
0.82
0.80
Output Voltage
0.78
Output Voltage VOUT(V)
Input Voltage
IOUT=30mA,
COUT=Ceramic 1.0μF
Input Voltage VIN(V)
Output Voltage VOUT(V)
IOUT=30mA,
COUT=Tantalum 1.0μF
Input Voltage
2
1
1.02
1.00
Output Voltage
Input Voltage VIN(V)
R1131x08xx
0.98
0.96
0.76
0
0
10 20 30 40 50 60 70 80 90 100
Time t(μs)
10 20 30 40 50 60 70 80 90 100
Time t(μs)
R1131x26xx
5
4
Input Voltage
3
2.62
2.60
Output Voltage
Input Voltage VIN(V)
Output Voltage VOUT(V)
IOUT=30mA,
COUT=Ceramic 1.0μF
2.58
2.56
0
10 20 30 40 50 60 70 80 90 100
Time t(μs)
11) Load Transient Response (tr=tf=0.5μs)
R1131x08xx
R1131x08xx
60
100
30
Output Current
50
0
0.9
0.8
Output Voltage
0.7
0.6
Output Voltage VOUT(V)
150
Output Current
0
0.9
0.8
Output Voltage
0.7
Output Current IOUT(mA)
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 2.2μF
Output Current IOUT(mA)
Output Voltage VOUT(V)
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
0.6
0
5
10
15 20 25
Time t(μs)
30
35
40
0
5
10
15 20 25
Time t(μs)
30
35
40
17
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x10xx
VIN=2.0V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
VIN=2.0V CIN=Ceramic 1.0μF,
COUT=Ceramic 2.2μF
100
Output Current
50
0
1.0
Output Voltage
0.9
0.8
10
15 20 25
Time t(μs)
30
35
50
0
1.1
1.0
Output Voltage
0.9
5
10
15 20 25
Time t(μs)
30
35
40
R1131x10xx
R1131x10xx
VIN=2.0V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
VIN=2.0V CIN=Ceramic 1.0μF,
COUT=Ceramic 2.2μF
60
30
Output Current
0
1.1
1.0
Output Voltage
0.9
60
30
Output Current
0
1.1
1.0
Output Voltage
0.9
0.8
15 20 25
Time t(μs)
30
35
0
40
5
10
15 20 25
Time t(μs)
30
35
40
R1131x26xx
R1131x26xx
VIN=3.6V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
VIN=3.6V CIN=Ceramic 1.0μF,
COUT=Ceramic 2.2μF
150
100
Output Current
50
0
2.7
2.6
Output Voltage
2.5
2.4
150
100
Output Current
50
0
2.7
2.6
Output Voltage
2.5
2.4
0
5
10
15 20 25
Time t(μs)
30
35
40
0
5
10
15 20 25
Time t(μs)
30
35
40
Output Current IOUT(mA)
10
Output Voltage VOUT(V)
5
Output Current IOUT(mA)
0
Output Voltage VOUT(V)
Output Current
0
0.8
18
100
0.8
40
Output Voltage VOUT(V)
5
Output Current IOUT(mA)
Output Voltage VOUT(V)
0
150
Output Current IOUT(mA)
1.1
Output Voltage VOUT(V)
150
Output Current IOUT(mA)
R1131x10xx
Output Current IOUT(mA)
Output Voltage VOUT(V)
R1131x
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x26xx
VIN=3.6V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
VIN=3.6V CIN=Ceramic 1.0μF,
COUT=Ceramic 2.2μF
60
30
30
0
2.7
2.6
Output Voltage
2.5
Output Voltage VOUT(V)
Output Current
60
Output Current
0
2.7
2.6
Output Voltage
2.5
Output Current IOUT(mA)
R1131x26xx
Output Current IOUT(mA)
Output Voltage VOUT(V)
R1131x
2.4
2.4
0
5
10
15 20 25
Time t(μs)
30
35
0
40
5
10
15 20 25
Time t(μs)
30
35
40
12) Turn on speed with CE pin
R1131x08xx
R1131x08xx
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
2.7
2.7
1.0
Output Voltage
0.5
IOUT=0mA
0
0
0
1.8
0V→1.8V
0.9
1.0
Output Voltage
0.5
IOUT=30mA
0
10 20 30 40 50 60 70
Time t(μs)
0
R1131x33xx
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
VIN=4.3V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
2.7
CE Input Voltage
0.9
1.0
Output Voltage
0.5
IOUT=300mA
0
10 20 30 40 50 60 70
Time t(μs)
0
Output Voltage VOUT(V)
0V→1.8V
CE Input Voltage VCE(V)
Output Voltage VOUT(V)
CE Input Voltage
0
10 20 30 40 50 60 70
Time t(μs)
R1131x08xx
1.8
0
0V→4.3V
6
4
2
4
Output Voltage
3
IOUT=0mA
2
1
0
0
0
CE Input Voltage VCE(V)
0.9
Output Voltage VOUT(V)
1.8
0V→1.8V
CE Input Voltage VCE(V)
Output Voltage VOUT(V)
CE Input Voltage
CE Input Voltage VCE(V)
CE Input Voltage
20 40 60 80 100 120 140
Time t(μs)
19
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x33xx (ECO=H)
R1131x33xx (ECO=L)
6
2
4
0
Output Voltage
3
IOUT=30mA
2
1
0
0
4
Output Voltage VOUT(V)
4
0V→4.3V
6
CE Input Voltage
CE Input Voltage VCE(V)
CE Input Voltage
Output Voltage VOUT(V)
VIN=4.3V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
0V→4.3V
4
2
0
Output Voltage
3
IOUT=300mA
2
1
0
20 40 60 80 100 120 140
Time t(μs)
0
CE Input Voltage VCE(V)
VIN=4.3V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
20 40 60 80 100 120 140
Time t(μs)
13) Turn-off Speed with CE
R1131x08xD
R1131x08xD
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
1.0
0.6
0
Output Voltage
IOUT=0mA
0.5
0
0
1.2
CE Input Voltage
1.8V→0V
1.0
0.6
0
Output Voltage
IOUT=30mA
0.5
0
0.2 0.4 0.6 0.8 1.0 1.2
Time t(ms)
0
R1131x08xD
R1131x33xD
0.2 0.4 0.6 0.8 1.0 1.2
Time t(ms)
VIN=4.3V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
VIN=1.8V CIN=Tantalum 1.0μF,
COUT=Tantalum 1.0μF
5
1.2
CE Input Voltage
1.8V→0V
1.0
0
Output Voltage
IOUT=300mA
0.5
0
3
CE Input Voltage
4.3V→0V
4
2
1
0.2 0.4 0.6 0.8 1.0 1.2
Time t(ms)
2
1
0
3
Output Voltage
IOUT=0mA
0
0
20
0.6
4
Output Voltage VOUT(V)
1.8
CE Input Voltage VCE(V)
Output Voltage VOUT(V)
2.4
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Time t(ms)
CE Input Voltage VCE(V)
1.8V→0V
1.8
CE Input Voltage VCE(V)
1.2
CE Input Voltage
Output Voltage VOUT(V)
1.8
2.4
CE Input Voltage VCE(V)
Output Voltage VOUT(V)
2.4
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x33xD
R1131x33xD
5
4
4
3
CE Input Voltage
4.3V→0V
4
1
1
0
3
2
2
Output Voltage
IOUT=30mA
0
Output Voltage VOUT(V)
5
3
CE Input Voltage
4.3V→0V
4
1
1
0
3
2
2
Output Voltage
IOUT=300mA
CE Input Voltage VCE(V)
VIN=4.3V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
CE Input Voltage VCE(V)
Output Voltage VOUT(V)
VIN=4.3V CIN=Ceramic 1.0μF,
COUT=Ceramic 1.0μF
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Time t(ms)
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Time t(ms)
21
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
ESR vs. Output Current
When using these ICs, consider the following points:
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, be sure to use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series
Resistance) of which is in the range described as follows:
The relations between IOUT (Output Current) and ESR of Output Capacitor are shown below.
The conditions when the white noise level is under 40μV(Avg.) are marked as the hatched area in the graph.
(1) Frequency band: 10Hz to 2MHz
(2) Temperature: 25°C
R1131x08xx
R1131x10xx
VIN=1.4V to 6.0V,
CIN=Ceramic 1.0VμF COUT=Ceramic 1.0μF
100
100
10
10
ESR (Ω)
ESR (Ω)
VIN=1.4V to 6.0V,
CIN=Ceramic 1.0VμF COUT=Ceramic 1.0μF
1
0.1
0.1
0.01
1
0
50
100
150 200 250
Output Current lOUT (mA)
0.01
300
0
50
R1131x26xx
VIN=2.0V to 6.0V,
CIN=Ceramic 1.0VμF COUT=Ceramic 1.0μF
100
10
10
ESR (Ω)
ESR (Ω)
100
1
1
0.1
0.1
22
300
R1131x15xx
VIN=3.0V to 6.0V,
CIN=Ceramic 1.0VμF COUT=Ceramic 1.0μF
0.01
100
150 200 250
Output Current lOUT (mA)
0
50
100
150 200 250
Output Current lOUT (mA)
300
0.01
0
50
100
150 200 250
Output Current lOUT (mA)
300
＊R1131Dxx2 (HSON-6) is the discontinued product. As of June in 2016.
R1131x
R1131x33xx
VIN=3.6V to 6.0V,
CIN=Ceramic 1.0VμF COUT=Ceramic 1.0μF
100
ESR (Ω)
10
1
0.1
0.01
0
50
100
150 200 250
Output Current lOUT (mA)
300
23
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
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Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
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