Datasheet
Operational Amplifier
Low Noise Operational Amplifier
BA15532F
General Description
BA15532F is a low noise operational amplifier of high
voltage gain. It excels especially in input referred noise
voltage (0.7μVrms), total harmonic distortion ratio
(0.0015%) and operating voltage range (±3.0V to
±20.0V) and it is the most suitable operational amplifier
for audio equipments.
Key Specification
Operating Supply Voltage (Split Supply):
±3.0V to ±20.0V
Slew Rate:
8V/µs(Typ)
Input Referred Noise Voltage:
0.7μVrms(Typ)
Total Harmonic Distortion:
0.0015%(Typ)
Temperature Range:
-20°C to +75°C
Features
High Voltage Gain
Low Input Referred Noise Voltage
Low Total Harmonic Distortion
Wide Operating Supply Voltage
Packages
SOP8
W(Typ) xD(Typ) xH(Max)
5.00mm x 6.20mm x 1.71mm
Application
General Purpose
Audio Application
Active Filter
Simplified Schematic
VCC
OUT
-IN
+IN
VEE
Figure 1. Simplified Schematic (1channel only)
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BA15532F
Pin Configuration
BA15532F : SOP8
2
+IN1
3
VEE
4
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
8 VCC
OUT1 1
-IN1
Pin No.
CH1
- +
CH2
7
OUT2
6
-IN2
+ -
5 +IN2
Package
SOP8
BA15532F
Ordering Information
B
A
1
5
5
3
Part Number
BA15532F
2
F
-
E
Package
F:
SOP8
2
Packaging and forming specification
E2: Embossed tape and reel
(SOP8)
Lineup
Topr
Operating
Supply Voltage
(split supply)
Supply
Current
(Typ)
Slew Rate
(Typ)
-20°C to +75°C
±3.0V to ±20.0V
8mA
8V/µs
Package
SOP8
Reel of 2500
Orderable
Part Number
BA15532F-E2
Absolute Maximum Ratings (TA=25°C)
Parameter
Symbol
Supply Voltage
Power Dissipation
VCC-VEE
PD
SOP8
Rating
Unit
+42
V
0.62(Note 1,2)
W
Differential Input Voltage (Note 3)
VID
±0.5(Note 4)
V
Input Common-mode Voltage Range
VICM
VEE to VCC
V
II
±10
mA
Operating Supply Voltage
Vopr
±3 to ±20 (+6 to +40)
V
Operating Temperature
Topr
-20 to +75
°C
Storage Temperature
Tstg
-55 to +125
°C
Output Short Time (Note 6)
Ts
unlimited
sec
TJmax
+125
°C
Input Current
(Note 5)
Maximum Junction Temperature
(Note 1) To use at temperature above TA=25°C reduce 6.2mW/°C.
(Note 2) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%).
(Note 3) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 4) Don’t over input current ±10mA. Built-in resistor for protection because of over current with differential input voltage above 0.5.
(Note 5) An excessive input current will flow when input voltages (of more than VEE+0.6V or less VCC-0.6V) are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
(Note 6) Limit within PD.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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Datasheet
BA15532F
Electrical Characteristics
○BA15532F (Unless otherwise specified VCC=+15V, VEE=-15V, TA=25°C)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Input Offset Voltage (Note 7)
VIO
-
0.5
4.0
mV
RS=50Ω, RL≧10kΩ
Input Offset Current (Note 7)
IIO
-
10
150
nA
RL≧10kΩ
Input Bias Current (Note 7,8)
IB
-
200
800
nA
RL≧10kΩ
Large Signal Voltage Gain
AV
80
94
-
dB
RL≧600Ω, Vo=±10V
VICM
±12
±13
-
V
RL≧10kΩ
Common-mode Rejection Ratio
CMRR
70
100
-
dB
RL≧10kΩ
Power Supply Rejection Ratio
PSRR
80
100
-
dB
RS=50Ω, RL≧10kΩ
ICC
-
8.0
16.0
mA
RL=∞, All Op-Amps
VOH
±12
±13
-
V
RL≧600Ω
VOL
±15
±16
-
V
RL≧600Ω
VCC=+18V, VEE=-18V
Output Short Current (Note 9)
lOS
-
38
-
mA
Slew Rate
SR
-
8.0
-
V/μs
AV=0, RL=600Ω, CL=100pF
GBW
-
20
-
MHz
f=10kHz, RL=600Ω
CL=100pF
-
0.7
1.5
μVrms
AV=40dB, RIAA, RS=100Ω
20Hz~30kHz
-
5
-
nV/ Hz
AV=40dB, RS=100Ω, f=1kHz
THD+N
-
0.0015
-
%
AV=20dB, OUT=5Vrms
f=1kHz, 80kHz-LPF
CS
-
110
-
dB
OUT=0.5Vrms, f=1kHz
AV=40dB, Input referred
Input Common-mode Voltage Range
Supply Current
Maximum Output Voltage
Gain Band Width
Input Referred Noise Voltage
Total Harmonic Distortion + Noise
Channel Separation
VN
-
(Note 7) Absolute value
(Note 8) Current direction: Since first input stage is composed with NPN transistor, input bias current flows in the IC.
(Note 9) Consider the power dissipation of IC when selecting the output current.
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Datasheet
BA15532F
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC terminal and VEE terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(5) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(6) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(7) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR = (Change of power supply voltage)/(Input offset fluctuation)
(8) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(9) Maximum Output Voltage (VOM)
Indicates the voltage range of the output under specified load condition.
(10) Output Short Current(lOS)
Indicates the current when OUT is connected to VCC or VEE.
(11) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(12) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(13) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(14) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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Datasheet
BA15532F
1.0
20
0.8
16
0.6
Supply Current [mA]
Power Dissipation [W]
Typical Performance Curves
○BA15532F
BA15532F
0.4
-20°C
12
8
0.2
4
0.0
0
0
25
50
75
100
75°C
0
125
5
10
15
20
25
30
Ambient Temperature [°C]
Supply Voltage [V]
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 3.
Supply Current vs Supply Voltage
35
40
30
Maximum Output Voltage Swing [VP-P]
20
16
Supply Current [mA]
25°C
±20V
12
±15 V
8
±2 V
4
25
20
15
10
5
0
0
-25
0
25
50
75
100
0.1
Ambient Temperature [°C]
Figure 4.
Supply Current vs Ambient Temperature
1
Load Resistance [kΩ]
10
Figure 5.
Maximum Output Voltage Swing
vs Load Resistance
(VCC/VEE=+15V/-15V, TA=25°C)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA15532F
Typical Performance Curves - continued
○BA15532F
20
20
15
15
10
Maximum Output Voltage [V]
Maximum Output Voltage[V]
VOH
10
VOH
5
0
-5
VOL
-10
5
0
-5
-10
VOL
-15
-15
-20
-20
0.1
1
Load Resistance [kΩ]
±0
10
±4
20
20
15
15
Maximum Output Voltage [V]
Maximum Output Voltage [V]
±20
±24
Figure 7.
Maximum Output Voltage
vs Supply Voltage
(RL=600Ω, TA=25°C)
Figure 6.
Maximum Output Voltage
vs Load Resistance
(VCC/VEE=+15V/-15V, TA=25°C)
10
VOH
5
0
-5
VOL
-10
-15
-20
-50
±8
±12
±16
Supply Voltage [V]
10
VOH
5
0
-5
VOL
-10
-15
-20
-25
0
25
50
75
100
0
5
10
15
20
Ambient Temperature [°C]
Output Current [mA]
Figure 8.
Maximum Output Voltage
vs Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
Figure 9.
Maximum Output Voltage
vs Output Current
(VCC/VEE=+15V/-15V, TA=25°C)
25
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA15532F
6
6
4
4
Input Offset Voltage [mV]
Input Offset Voltage [mV]
Typical Performance Curves - continued
○BA15532F
2
-20°C
0
-2
25°C
2
±15V
0
±20V
-2
75°C
-4
-4
-6
-6
±0
±4
±8
±12
±16
Supply Voltage [V]
±20
±24
-50
800
800
700
700
Input Bias Current [nA]
-20°C
600
25°C
500
400
300
75°C
300
100
0
0
±20
±15V
400
100
±8
±12
±16
Supply Voltage [V]
100
±20V
500
200
±4
0
25
50
75
Ambient Temperature [°C]
600
200
±0
-25
Figure 11.
Input Offset Voltage - Ambient Temperature
(VICM=0V, Ek=0V)
Figure 10.
Input Offset Voltage - Supply Voltage
(VICM=0V, Ek=0V)
Input Bias Current [nA]
±3V
±3V
-50
±24
Figure 12.
Input Bias Current - Supply Voltage
(VICM=0V, Ek=0V)
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 13.
Input Bias Current - Ambient Temperature
(VICM=0V, Ek=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA15532F
Typical Performance Curves - continued
○BA15532F
30
30
20
20
25°C
Input Offset Current [nA]
Input Offset Current [nA]
-20°C
10
0
75°C
-10
±3V
10
0
±20V
-10
-20
-20
-30
-30
±0
±4
±8
±12
±16
Supply Voltage [V]
±20
-50
±24
-25
Figure 14.
Input Offset Current vs Supply
Voltage
(VICM=0V, Ek=0V)
0
25
50
Ambient Temperature [°C]
75
100
Figure 15.
Input Offset Current vs Ambient
Temperature
(VICM=0V, Ek=0V)
6
175
Common Mode Rejection Ratio [dB]
4
Input Offset Voltage [mV]
±15V
75°C
2
25°C
-20°C
0
-2
-4
150
125
100
75
50
-6
0
2
4
Supply Voltage [V]
6
-50
8
Figure 16.
Input Offset Voltage
vs Common Mode Input Voltage
(VCC=8V, Ek=-4V)
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 17.
Common Mode Rejection Ratio
vs Ambient Temperature
(VCC/VEE=+15V/-15V, VICM=-12V to +12V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA15532F
Typical Performance Curves - continued
○BA15532F
12
10
125
Slew Rate [V/µs]
Power Supply Rejection Ratio [dB]
150
100
75
50
8
6
4
2
25
0
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
±2
±6
±14
±18
±22
Supply Voltage [V]
Figure 18.
Power Supply Rejection Ratio
vs Ambient Temperature
(VCC/VEE=+3V/-3V to +15V/-15V)
Figure 19.
Slew Rate vs Supply Voltage
(CL=100pF, RL=2kΩ, TA=25°C)
80
1
Total Harmonic Distortion [%]
Input Referred Noise Voltage [nV/√Hz]
±10
60
40
20
0.1
0.01
20kHz
1kHz
0.001
20Hz
0
0.0001
10
100
1000
FREQUENCY [Hz]
10000
0.1
1
10
Output Voltage [Vrms]
Figure 20.
Input Referred Noise Voltage vs Frequency
(VCC/VEE=+15V/-15V, RS=100Ω, TA=25°C)
Figure 21.
Total Harmonic Distortion vs Output Voltage
(VCC/VEE=+15V/-15V, Av=20dB
RL=600Ω, 80kHz-LPF, TA=25°C)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA15532F
60
25
50
20
40
15
10
5
100
-60
GAIN
-90
20
-120
10
-150
0
10
-30
30
0
1
0
PHASE
1000
3
10
1.E+03
Frequency [Hz]
Figure 22.
Maximum Output Voltage Swing vs Frequency
(VCC/VEE=+15V/-15V, RL=600Ω, TA=25°C)
4
10
1.E+04
5
10
1.E+05
6
10
1.E+06
Frequency [Hz]
7
10
1.E+07
8
-180
10
1.E+08
Figure 23.
Voltage Gain, Phase vs Frequency
(VCC/VEE=+15V/-15V, Av=40dB, RL=2kΩ, TA=25°C)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Phase [deg]
30
Voltage Gain [dB]
Maximum Output Voltage Swing [VP-P ]
Typical Performance Curves - continued
○BA15532F
Datasheet
BA15532F
Application Information
NULL method condition for Test circuit1
VCC,VEE,EK,VICM Unit: V
Parameter
VF
S1
S2
S3
VCC
VEE
EK
Input Offset Voltage
VF1
ON
ON
OFF
15
-15
0
0
1
Input Offset Current
VF2
OFF
OFF
OFF
15
-15
0
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
15
-15
0
0
3
ON
ON
ON
ON
ON
OFF
ON
ON
OFF
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF8
VF9
Power Supply Rejection Ratio
VF10
- Calculation 1. Input Offset Voltage (VIO)
VIO =
2. Input Offset Current (IIO)
IIO =
3. Input Bias Current (IB)
IB =
4. Large Signal Voltage Gain (AV)
Av = 20Log
5. Common-mode Rejection Ration (CMRR)
CMRR = 20Log
6. Power Supply Rejection Ratio (PSRR)
PSRR = 20Log
|VF1|
VICM Calculation
15
-15
-10
0
15
-15
10
0
3
-27
12
0
27
-3
-12
0
3
-3
0
0
20
-20
0
0
4
5
6
[V]
1 + RF/RS
|VF2 - VF1|
RI x (1 + RF/RS)
[A]
|VF4 - VF3|
2 x RI x (1 + RF/RS)
[A]
ΔEK × (1+RF/RS)
|VF6 - VF5|
[dB]
ΔVICM × (1+RF/RS)
|VF8 - VF7|
ΔVCC × (1+ RF/RS)
|VF10 - VF9|
[dB]
[dB]
RF=50kΩ
SW1
EK
RS=50Ω
0.1µF
500kΩ
VCC
15V
VO
RI=10kΩ
500kΩ
0.1µF
0.1µF
DUT
NULL
SW3
RS=50Ω
RI=10kΩ
VICM
50kΩ
1000pF
RL
VEE
VF
-15V
Figure 24. Test Circuit1 (One Channel Only)
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BA15532F
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4
SW5
SW6
SW7
SW8
SW9 SW10 SW11 SW12
Supply Current
OFF
OFF OFF
ON
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
Maximum Output Voltage
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
ON
OFF
OFF
ON
Slew Rate
OFF
OFF OFF
ON
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
Gain Bandwidth
OFF
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
ON
OFF
Input Referred Noise Voltage
ON
OFF OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
ON
OFF
Input voltage
SW4
VH
R2
SW5
VCC
VL
－
SW1
RS
SW2
SW6
R1
Output voltage
＋
SW3
SW7
SW8
SW9
SW10
SW11
SW12
90%
VH
VEE
t
Input wave
SR＝ΔV/Δt
ΔV
RL
-IN
CL
+IN
VL
10%
Δt
t
Output wave
Figure 26. Slew Rate Input Waveform
Figure 25. Test Circuit 2 (each Op-Amp)
R2=100kΩ
R2=100kΩ
VCC
R1=1kΩ
VCC
R1=1kΩ
－
－
＋
VIN
R1//R2
V
VEE
～
OUT1
=0.5Vrms
＋
R1//R2
V
CS = 20Log
Figure 27. Test Circuit 3(Channel Separation)
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OUT2
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Datasheet
BA15532F
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 28. (a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (Ta), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax - Ta) / PD
°C /W
The Derating curve in Figure 28. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 28. (c) shows an example of the derating curve for BA15532F.
Power Disspation of IC [W]
PDmax
θJA ( TJmax - TA) / PD °C/W
P2
θJA2 < θJA1
Ambient temperature TA [ °C ]
P1
θJA2
TJmax
θJA1
Chip surface temperature
0
TJ [°C]
50
25
75
100
125
Ambient TemperatureTA[C]
(a) Thermal Resistance
(b) Derating Curve
Power Dissipation [W] .
0.8
0.6
BA15532F
0.4
0.2
0
0
25
50
75
100
125
Ambient Temperature [℃] .
(c)BA15532F
6.2
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (copper foil area less than 3%) is mounted.
Figure 28. Thermal Resistance and Derating Curve
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Datasheet
BA15532F
Examples of Circuit
○Voltage Follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is
configured to be equal to the input voltage (IN). This
circuit also stabilizes the output voltage (OUT) due to
high input impedance and low output impedance.
Computation for output voltage (OUT) is shown below.
OUT=IN
VCC
OUT
IN
VEE
Figure 29. Voltage Follower Circuit
○Inverting amplifier
R2
VCC
IN
R1
OUT
R1//R2
For inverting amplifier, input voltage (IN) is amplified by a
voltage gain and depends on the ratio of R1 and R2. The
out-of-phase output voltage is shown in the next
expression
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
VEE
Figure 30. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
VCC
OUT
For non-inverting amplifier, input voltage (IN) is amplified by
a voltage gain, which depends on the ratio of R1 and R2.
The output voltage (OUT) is in-phase with the input voltage
(IN) and is shown in the next expression.
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
IN
VEE
Figure 31. Non-inverting Amplifier Circuit
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BA15532F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure 32):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
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Datasheet
BA15532F
Operational Notes – continued
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 32. Example of monolithic IC structure
12.
Unused circuits
When there are unused op-amps, it is recommended that they are
connected as in Figure 33, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (VICM).
VDD
Keep this potential
in VICM
VICM
13.
Input Voltage
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless
of the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the
input voltage is within the common mode input voltage range of the
electric characteristics.
+
VSS
Figure 33. Example of Application Circuit
for Unused Op-amp
14.
Power supply(single/dual)
The op-amp operates when the voltage supplied is between VCC and
VEE. Therefore, the single supply op-amp can be used as dual supply
op-amp as well.
15.
Output capacitor
If a large capacitor is connected between the output pin and VEE pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1uF between output pin and VEE pin.
16.
Oscillation by output capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
17.
Short-circuit of Output Terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output current may flow under some
conditions, and heating may destroy IC. It is necessary to connect a resistor as shown in Figure 34. , thereby
protecting against load shorting.
VCC
protection
resistor
VEE
Figure 34. The Example of Output Short Protection
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Datasheet
BA15532F
Physical Dimensions Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Datasheet
BA15532F
Marking Diagrams
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Product Name
Package Type
Marking
BA15532F
SOP8
15532
Land Pattern Data
PKG
Land pitch
e
Land space
MIE
SOP8
1.27
4.60
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
1.10
0.76
SOP8
b2
e
MIE
ℓ2
Revision History
Date
Revision
13.Sep.2013
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
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