BD3010AFV-M

Power Management ICs for Automotive Body Control Regulator with Voltage Detector and Watchdog Timer BD3010AFV-M No.10039EAT09 ●Description BD3010AFV-M is a regulator IC with integrated WDT (Watch Dog Timer), high output voltage accuracy ±2.0% and 80µA (Typ.) low circuit current consumption. BD3010AFV-M supports usage of low ESR ceramic capacitor for output stability. Also integrated is an automatic WDT ON/OFF feature using output current detection and an output clamping circuit to prevent output overshoot caused by current flow. The reset detection voltage can be adjusted by connecting resistors on the RADJ terminal. BD3010AFV-M can be a stable power supply for any applications while detecting malfunction of microcontrollers. ●Features 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) Vcc Max Voltage・・・50V High Output Voltage Accuracy・・・±2.0%(Ta=-40 ~ 125℃) Low Circuit Current ・・・80µA (Typ.) Output Circuit・・・Pch DMOS Supports Low ESR Ceramic Capacitor Integrated Over Current Protection and Thermal Shut Down Integrated WDT Reset Circuit (Adjustable Detection Voltage through RADJ pin) Integrated Automatic WDT ON/OFF Function through Output Current Detection WDT Can be Switched ON/OFF by Using INH Pin Integrated Output Voltage Clamping Circuit Package・・・SSOP-B20 ●Applications Any application using a microcontroller or a DSP such as automotive (body control), display, server, DVD, phone, etc www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/21 2010.11- Rev.A BD3010AFV-M ●Absolute Maximum Ratings (Ta=25℃) Parameter Supply voltage VADJ set pin voltage Regulator output pin voltage INH pin voltage Reset output pin voltage Watchdog input pin voltage Watchdog time set pin voltage Watchdog operation current set pin voltage Power dissipation Operating temperature range Storage temperature range Maximum junction temperature *1 *2 *2 *1 Technical Note Symbol Vcc VADJ VOUT VINH VRo VCLK VCT VWADJ Pd Topr Tstg Tjmax Ratings -0.3 ~ +50 -0.3 ~ +7 -0.3 ~ +7 -0.3 ~ +15 -0.3 ~ +7 -0.3 ~ +15 -0.3 ~ +7 -0.3 ~ +7 1.25 -40 ~ +125 -55 ~ +150 150 Unit V V V V V V V V W ℃ ℃ ℃ Not to exceed Pd. Reduced by 10.0mW/℃ over Ta=25℃, when mounted on 70mm×70mm×1.6mm glass epoxy board: ●Operating Conditions(Ta=-40 ~ +125℃) Parameter Supply Voltage Supply Voltage Output current *3 Symbol Vcc Vcc Io Min. 5.6 6.0 0 Max. 36.0 36.0 200 Unit V V mA *4 *3 For the output voltage, consider the voltage drop (dropout voltage) due to the output current. *4 Operating condition for automatic WDT ON/OFF. NOTE: This product is not designed for protection against radioactive rays. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/21 2010.11- Rev.A BD3010AFV-M Technical Note ●Electrical characteristics(Unless otherwise specified, Ta=-40 ~ +125℃, Vcc=13.5V, INH=5V, CLK=GND, Io=0mA) Parameter [Entire Device] Circuit current 1 Circuit current 2 [Regulator] Output voltage Line regulation Load regulation Dropout voltage Ripple rejection WADJ mirror current ratio Output voltage clamp (Comparator) [Reset] Detection voltage Hysteresis width Output delay time L→H (Power On Reset) Low output voltage Min. operating voltage [Watchdog Timer] Upper switching threshold voltage Lower switching threshold voltage WDT charge current WDT discharge current WDT watch time WDT reset time WDT operating current [INH] WDT OFF threshold voltage WDT ON threshold voltage INH input current [CLK] CLK OFF threshold voltage CLK ON threshold voltage CLK input pulse width VLCLK VHCLK TWCLK 0 OUT ×0.8 500 － － － OUT ×0.3 OUT － V V ns VHINH VLINH IINH OUT ×0.8 0 － － － 15 OUT OUT ×0.3 30 V V µA Pulled down inside the IC when INH=open INH=5V VthH VthL Ictc Ictd TWH TWL IOA 1.08 0.13 3.5 0.8 6.4 1.6 0.3 1.15 0.15 5.0 1.3 8.0 2.0 1.7 1.25 0.17 6.5 1.7 9.6 2.4 4.0 V V µA µA ms ms mA WDT ON, INH=Open WDT ON, INH=Open WDT ON, INH=Open, CT=0V WDT ON, INH=Open, CT=1.3V WDT ON, INH=Open, CT=0.01µF(Ceramic Cap) ※Characteristics of ceramic cap not considered. Symbol Min. Typ. Max. Unit Conditions Icc1 Icc2 － － 80 110 140 170 µA µA Io=50mA(Ta=25℃) OUT Line.Reg Load.Reg ΔVd R.R. ΔI Vclp 4.90 － － － 45 0.002 5.2 5.00 5 20 0.25 55 0.010 5.5 5.10 30 60 0.50 － 0.025 5.8 V mV mV V dB － V Vcc=5.6 ~ 36V Io=5 ~ 150mA Vcc=4.75V, Io=150mA f=120Hz, ein=1Vrms, Io=100mA Io=50mA(output) Io=20mA(input) Vdet VHS TdLH VRST VOPL 4.12 35 1.8 － 1.5 4.25 70 2.3 0.1 － 4.38 150 2.8 0.4 － V mV ms V V RADJ=Open OUT=Vdet±0.5V, CT=0.01µF OUT=4.0V WDT ON, INH open, 5kΩ resistor is placedbetween WADJ and OUT pins. ※Characteristics of external resistor not considered. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/21 2010.11- Rev.A BD3010AFV-M ●Reference Data (Unless otherwise specified, Ta=25℃, Vcc=13.5V, INH=5V, CLK=GND, Io=0mA) 180 0.5 Technical Note 6 CIRCUIT CURRENT: Icc1 [uA] CIRCUIT CURRENT: Icc2 [mA] 150 OUTPUT VOLTAGE: OUT [V] Ta=125℃ 120 90 60 0.4 5 4 3 0.3 Ta=25℃ 0.2 Ta=-40℃ 2 1 0 Ta=25℃ 30 0 0 5 10 15 20 Ta=25℃ Ta=125℃ Ta=-40℃ 0.1 0 25 30 35 0 50 100 150 200 0 5 10 15 20 25 30 35 SUPPLY VOLTAGE: Vcc [V] OUTPUT CURRENT: Io[mA] SUPPLY VOLTAGE: Vcc [V] Fig.1 Circuit Current 1 Fig.2 Circuit Current 2 Fig.3 Input Stability 6 0.6 80 DROPOUT VOLTAGE: ΔVd [V] 5 4 3 0.5 0.4 0.3 Ta=25℃ 0.2 0.1 Ta=-40℃ 0 0 50 100 150 200 RIPPLE REJECTION: R.R. [dB] OUTPUT VOLTAGE: OUT[V] 60 Ta=125℃ Ta=25℃ Ta=25℃ Ta=125℃ Ta=-40℃ 2 1 0 0 100 200 300 400 Ta=125℃ 40 Ta=-40℃ 20 0 10 100 1000 10000 100000 1E+06 500 600 700 OUTPUT CURRENT: Io [mA] OUTPUT CURRENT: Io[mA] FREQUENCY : f [Hz] Fig.4 Load Stability Fig.5 I/O Voltage Difference (Vcc=4.75V) Fig.6 Ripple Rejection 5.10 6 OUTPUT VOLTAGE: OUT [V] OUTPUT VOLTAGE: OUT [V] 5 4 3 5.05 5.00 150℃ 2 1 0 170℃ 4.95 4.90 -40 0 40 80 120 100 120 140 160 180 200 AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃] Fig.7 Output Voltage vs. Temperature Fig.8 Thermal Shutdown Circuit Characteristics www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/21 2010.11- Rev.A BD3010AFV-M ●Reference Data (Unless otherwise specified, Ta=25℃, Vcc=13.5V, INH=5V, CLK=GND, Io=0mA) 5 4.5 Technical Note CT PIN CURRENT: Ictc,Ictd [uA] RESET OUTPUT: Ro [V] 4 1.0 0.0 -1.0 -2.0 -3.0 -4.0 -5.0 0 0.3 0.6 0.9 1.2 1.5 RESET DET VOLTAGE : Vdet [V] 2.0 4.4 3 Ta=125℃ Ta=-40℃ Ta=25℃ 4.3 VHS 2 Ta=125℃ 1 Ta=25℃ Ta=-40℃ 0 1 2 3 4 5 4.2 Vdet 4.1 0 4 -40 0 40 80 120 OUTPUT VOLTAGE: OUT [V] CT PIN VOLTAGE: VCT [V] AMBIENT TEMPERATURE: Ta [ ℃] Fig.9 Voltage detection (RADJ=Open) Fig.10 CT Pin Charge / Discharge Current (Vcc=5V) Fig.11 Reset Detection Voltage vs. Temperature 9 8 7 0.8 0.7 0.6 Watch time Ta=125℃ Ta=25℃ 20 18 16 14 12 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 2 4 Ta=-40℃ Ta=25℃ WDT : TWL,H [ms] IRESET[mA] 6 5 4 3 2 1 0 -40 0 IINH[uA] 0.5 0.4 0.3 0.2 0.1 0 Ta=125℃ Ta=-40℃ Reset time 40 80 120 AMBIENT TEMPERATURE: Ta [℃] VRESET[V] VINH[V] Fig.12 WDT Time vs. Temperature (CT=0. 01µF) (Vcc=5V) Fig. 13 VRESET_IRESET (OUT=1.5V,Ro=0.5V) Fig. 14 VINH_IINH 6.0 DET OUTPUT CURRENT : IOA [mA] 5.9 2.0 DET OUTPUT CURRENT: IOA [%] 20 15 10 5 0 -5 -10 -15 -20 -40 -20 0 20 40 60 80 100 120 6 16 26 36 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 SAT DETECTION: [V] 5.8 5.7 5.6 5.5 5.4 -40 -20 0 20 40 60 80 100 120 Ta=25℃ AMBIENT TEMPERATURE: Ta [℃] AMBIENT TEMPERATURE: Ta [℃] Vcc[V] Fig.15 SAT detection vs. Temperature Fig.16 WDT Current Detection vs. Temperature (WADJ-OUT = 5kΩ) Fig.17 WDT Current Detection vs. Vcc (WADJ-OUT = 5kΩ) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/21 2010.11- Rev.A BD3010AFV-M ●Measurement Circuit for Electrical Data OUT OUT GND GND GND GND GND WADJ RADJ Ro Io Technical Note Vcc N.C GND GND GND GND A GND CLK INH CT Vcc N.C GND GND GND GND GND CLK INH CT OUT OUT GND GND GND GND GND WADJ RADJ Ro V Vcc N.C GND GND GND GND GND CLK INH CT OUT OUT GND GND GND GND GND WADJ RADJ Ro V A Measurement Circuit of Fig.1 and Fig.2 V Vcc N.C GND GND GND GND GND CLK INH CT OUT OUT GND GND GND GND GND WADJ RADJ Ro Io V ~ Measurement Circuit of Fig.3 and Fig.7 and Fig.8 Vcc N.C GND GND GND GND OUT OUT GND GND GND GND GND WADJ RADJ Ro 100ｍA Measurement Circuit of Fig.4 Vcc N.C GND GND GND V ~ GND GND CLK INH CT OUT OUT GND GND GND GND GND WADJ RADJ Ro V ~ GND CLK INH CT Measurement Circuit of Fig.5 Vcc N.C GND GND GND GND GND CLK INH A Measurement Circuit of Fig.6 Vcc N.C GND GND GND GND GND CLK INH CT 0.01μF Measurement Circuit of Fig.9 and Fig.11 OUT OUT GND GND GND GND GND WADJ RADJ Ro A OUT OUT GND GND GND GND GND WADJ RADJ Ro OUT OUT GND GND GND GND GND WADJ RADJ Ro Oscilloscope Vcc N.C GND GND GND ND GND CLK INH CT CT Measurement Circuit of Fig.10 Measurement Circuit of Fig.12 Measurement Circuit of Fig.13 Vcc N.C GND GND GND GND GND CLK INH A OUT OUT GND GND GND GND GND WADJ RADJ Ro Vcc N.C GND GND GND GND GND CLK INH CT OUT OUT GND GND GND GND GND WADJ RADJ Ro Oscilloscope Vcc N.C GND GND GND GND GND CLK INH CT OUT OUT GND GND GND GND GND WADJ RADJ Ro Oscilloscope CT Measurement Circuit of Fig.14 Measurement Circuit of Fig.15 Measurement Circuit of Fig.16 and Fig.17 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/21 2010.11- Rev.A BD3010AFV-M ●Block Diagram Vcc N.C. GND GND GND GND GND Edge OUT Vcc VCLP Technical Note OUT OCP PREREG VREF TSD Forced Monitor Stand-by OUT GND GND GND GND GND CLK WADJ VREF_R INH CT ON/OFF Circuit VREF_R RADJ Ro WDT VthH VthL Fig.18 Pin No. Pin Name 1 2 3 4 5 6 7 8 9 10 Vcc N.C. GND GND GND GND GND CLK INH CT Clock input from microcontroller WDT ON/OFF function pin External capacitance for reset output delay time, WDT monitor time setting connection pin GND Function Power supply Pin － Pin No. Pin Name 11 12 13 14 15 16 17 18 19 20 Ro RADJ WADJ GND GND GND GND GND OUT OUT Voltage output pin GND Function Reset output pin Reset detection voltage set pin WDT operating current set pin ●Top View (Package dimension) SSOP-B20 6.5 ± 0.2 20 11 6.4 ± 0.3 4.4 ± 0.2 1 10 0.15 ± 0.1 1.15 ± 0.1 0.1± 0.1 0.1 0.65 0.22 ± 0.1 SSOP-B20 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 0.3Min. (Unit : mm) 7/21 2010.11- Rev.A BD3010AFV-M ●I/O Equivalent Circuits (Resistance value is Typ. value) Vcc Vcc Technical Note OUT Vcc OUT IC 3750 kΩ 1250 kΩ 673 kΩ 200 kΩ CLK OUT WADJ OUT 140kΩ External R for detection WADJ CLK 10kΩ 330kΩ Ro OUT INH OUT 470kΩ Ro INH 1kΩ 10k Ω 300kΩ RADJ OUT OUT OUT CT OUT VREF OUT OUT 815 kΩ RADJ CT 1 kΩ 100Ω 1 kΩ 330 kΩ 1k Ω 10pF www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/21 2010.11- Rev.A BD3010AFV-M ●Detection Voltage Adjustment (Resistance Value is TYP. value) Technical Note OUT OUT OUT R4 R2=815kΩ 470kΩ Ro 1kΩ RADJ 100Ω R3 R1=330kΩ + － RADJ≒1.23V ～～ IC Internal Block Diagram When typical detection voltage is 4.25V Vdet ≒ RADJ × (R1+R2) / R1 ・Vdet : Reset detection voltage ・RADJ : Internal reference voltage (MOS input) ・R1,R2 : IC internal resistor (Voltage detection precision is tightened up to ±3% by laser-trimming the R1 and R2) RADJ will fluctuate 1.23V±6.0% Insert pull down resistor R3 (lower resistance than R1) in between RADJ-GND, and pull down resistor R4 (lower resistance than R2) in between RADJ-OUT to adjust the detection voltage. By doing so, the detection voltage can be adjusted by the calculation below. Vdet=RADJ×[{R2×R4/(R2+R4)}+{R1×R3/(R1+R3)}]/{R1×R3/(R1+R3)} When the output resistance value is as small enough to ignore the IC internal resistance, you can find the detection voltage by the calculation below. Vdet ≒ RADJ × (R3+R4) / R3 Adjust the resistance value by application as the circuit current will increase due to the added resistor. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/21 2010.11- Rev.A BD3010AFV-M ●WDT Voltage Detection (Resistance Value is TYP. value) Technical Note － + PowTr OUT 140kΩ WADJ LOW － + W DT ON HIGH WDT OFF WADJ-R (External R) WDT can be automatically switched ON/OFF by the output load current. To detect the output load current, add a resistor between OUT-WADJ. Current detection is adjustable by selecting 1 kΩ ~ 15kΩ resistance. Calculation: 1 Io(Desired load current value) x ΔI(WADJ current mirror ratio)x(external R/140kΩ※ ) ※2 ≧100mV ※1 is IC internal resistance between WADJ-OUT (tolerance approx ±30%, temperature coefficient approx 2000ppm) ※2 is an offset of detection comparator (tolerance approx 100mV±10%) IC Internal Block Diagram When there is no resistance between WADJ-OUT, Io=70µA can be detected by the calculation below Io(Desired load current value) x ΔI (WADJ current mirror ratio) x 140kΩ≧100mV ※If the OUT-WADJ resistance value is not same as the condition on the electrical characteristics table, i.e., 5KΩ, choose the resistance value in ratio referring to the above equation. ＜Timing Chart＞ 13.5V Timing Chart from the no load condition (Stand-by Mode) Vcc 0V OUT 5V 0V INH 0V 1.25V 1.15V 0.15V 0V CT pull up voltage Vth H Vth L CT CLK 5V 0V Ro OUT 0V Stand-by mode IoA Io 5mA 0mA www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/21 2010.11- Rev.A BD3010AFV-M ●Power ON Reset Power ON reset (output delay time) is adjustable by CT pin capacitor. TdLH(S) ≒(1.15V×CT capacitance(µF) / Ictc(µA)(TYP.) ・TdLH : Output delay time( power ON reset) ・1.15V : Upper switching threshold voltage(TYP.) ・CT capacitance : Capacitor connected to CT pin ・Ictc : WDT charge current ＜Calculation example＞with 0.01µF CT pin capacitor TdLH(S) = 1.15V×0.01µF / 5.0µA ≒ 2.3msec Technical Note ※If the CT capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01µF, choose the capacitance value in ratio referring to the above equation. ＜Timing Chart＞ ※Watchdog Timer OFF(INH ON) 13.5V Vcc 3V 0V 4.0V 4.32V OUT 5V 4.25V VHS 70mV 0V 4.0V 5V INH 0V 4.0V 1.25V CT pull up voltage CT 0V CLK 0V OUT Voltage Reset on Power on reset Ro 0V Reset on Io 0mA Power on reset Reset on www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/21 2010.11- Rev.A BD3010AFV-M ●Watchdog Timer Watch Dog Timer ( WDT watch time, reset time) is adjustable by the CT pin capacitor TWH(S) ≒(1.00V×CT capacitance (µF))/Ictd(µA) (Typ.) TWL(S) ≒(1.00V×CT capacitance (µF))/Ictc(µA) (Typ.) ・TWH : WDT watch time (delay time to turn the reset ON) ・TWL : WDT reset time (time the reset is ON) ・1.00V : Upper switching threshold voltage - lower switching threshold voltage ・CT capacitance : CT pin capacitor ※Shared with power ON reset ・Ictc : WDT charge current ・Ictd : WDT discharge current ※WDT time’s accuracy is ±20% by trimming ＜Calculation example＞with 0.01µF CT pin capacitor TWH(S) ≒ 1.00V×0.01µF/1.3µA ≒ 8.0msec TWL(S) ≒ 1.00V×0.01µF/5.0µA ≒ 2.0msec Technical Note (Typ.) (Typ.) ※If the CT capacitance is not the same as the condition on the electrical characteristics table, choose the capacitance value in ratio referring to the above equation. ＜Timing Chart＞ Vcc 13.5V 0V OUT 5V 0V WDT OFF(INH=ON) 5V INH 0V Watch time CT 1.25V 1.15V 0.15V 0V CLK 5V 0V CLK＜500nsec Out Voltage Ro 0V Stand-by mode Reset time Io IoA 5mA 0mA Watch dog on www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/21 2010.11- Rev.A BD3010AFV-M ●WDT timer ON/OFF switch INH (Resistance value is Typ. value) BD3010AFV-M has a switch INH to turn the WDT ON/OFF VREF_R(TYP≒1.25V) Technical Note LOW WDT ON 10kΩ HIGH 300kΩ WDT OFF ON/OFF Current ～～ CT External Capacitor INH IC Internal Block Diagram By using INH ON, CT potential can be pulled up to internal voltage VREF_R (invalid with power ON reset) ＜Timing Chart＞ 13.5V Vcc 0V OUT 5V 0V INH 5V 0V 1.25V 1.15V 0.15V 0V CT CT pull up voltage Vth H Vth L CLK 5V 0V Ro Out Voltage 0V Io IoA 5mA 0mA www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/21 2010.11- Rev.A BD3010AFV-M ●Forced Watch Mode Technical Note By detecting an input voltage (battery voltage) called output SAT detection, WDT can be forced to be operated. Vcc 8750kΩ LOW ＆RESET cancel 2500kΩ + － VREF WDT forced ON HIGH&RESET cancel Stand-by mode WDT will be forced ON from reset cancellation voltage to Vcc≒5.7V (WDT can be turned OFF by INH) 64kΩ IC Internal Block Diagram ＜Timing Chart including Forced Watch Mode＞ Forced watch mode ※No CLK signal Input Forced watch mode 6V Stand-by mode Vcc 5V 3V 5.7V 4.32V OUT 0V 4.25V VHS 70mV INH 0V 1.25V Power on reset CT 1.15V 0.15V 0V Reset time watch time CLK 0V Ro 0V Reset “L” Reset “L” Io 0V Forced watch mode 6V Stand-by mode Forced watch mode Vcc 5V 3V 5.7V 0V OUT 0V 4.32V 4.25V VHS 70mV INH 0V 1.25V 1.15V 0.15V 0V Power on reset CT Reset time Watch time CLK 0V OUT Voltage Ro 0V Reset “L” Reset “L” Io 0V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/21 2010.11- Rev.A BD3010AFV-M ＜Timing Chart including Forced Watch Mode＞ Forced watch mode Technical Note ※With CLK signal Input 5.7V 6V Stand-by mode Forced watch Vcc 5V 3V OUT 0V 4.32V 4.25V VHS 70mV INH 0V 1.25V CT 1.15V 0.15V 0V CLK 0V Power on reset Reset “L” Reset “L” Ro OUT 0V Io 0V Forced watch mode 5.7V 6V Stand-by mode Forced watch mode Vcc 5V 3V OUT 0V 4.32V 4.25V VHS 70mV INH 0V 1.25V 1.15V 0.15V 0V CT CLK 0V Power on reset Reset “L” Reset “L” Ro OUT Voltage 0V Io 0V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/21 2010.11- Rev.A BD3010AFV-M ＜Entire Timing Chart＞ Technical Note Forced watch mode Forced watch mode 13.5V Forced watch mode Vcc 5.5V 5V 3V 0V 4.0V 4.32V OUT 5V 0V 4.25V VHS 70mV 4.0V WDT OFF(INH=ON) INH 5V 0V Watch time CT 1.25V 1.15V 0.15V 0V CLK 0V Power on reset OUT Voltage Reset time Minimum reset Movement voltage Stand-by mode IoA Reset on Watch dog ON Reset on Power on reset Ro 0V Reset on Io 5mA 0mA www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/21 2010.11- Rev.A BD3010AFV-M ●Thermal Dissipation Curve ROHM standard board Board size:70mm×70mm×1.6mm θja=100(℃/W) ROHM standard board Board size:70mm×70mm×1.6mm Technical Note 3.0 Power Dissipation : Pd [W] 3.0 ④2.60W Power Dissipation : Pd [W] ③2.10W 2.0 ②1.60W ①1.25W 1.0 2.0 ①θja=100.0℃/W ②θja=78.1℃/W ③θja=59.5℃/W ④θja=48.1℃/W Power Dissipation : Pd [W] ①1-layer board ②2-layer board(back surface copper foil area:15mm×15mm ③2-layer board(back surface copper foil area:70mm×70mm ④4-layer board(back surface copper foil area:70mm×70mm 3.0 ④3.03W ROHM standard board ROHM standard board Board size:70mm×70mm×1.6mm PKG GND short to board thermal via ①1-layer board ②2-layer board(back surface copper foil area:15mm×15mm ③2-layer board(back surface copper foil area:70mm×70mm ④4-layer board(back surface copper foil area:70mm×70mm ③2.13W 2.0 ②1.66W ①1.40W 1.0 ①θja=89.4℃/W ②θja=75.4℃/W ③θja=58.6℃/W ④θja=41.3℃/W ①1.25W 1.0 0.0 0 25 50 75 100 125 150 Ambient Temperature: Ta [℃] 0.0 0 25 50 75 100 125 150 Ambient Temperature: Ta [℃] 0.0 0 25 50 75 100 125 150 Ambient Temperature: Ta [℃] Fig.19 ※Reduced by 10.0mW/℃ over Ta=25℃, when mounted on 70mm×70mm×1.6mm glass epoxy board Fig.20 (Reference Data) Fig.21 (Reference Data) Refer to Fig.19 ~ 21 thermal dissipation characteristics for usage above Ta=25℃. The IC’s characteristics are affected heavily by the temperature, and if is exceeds its max junction temperature (Tjmax), the chip may degrade or destruct. Thermal design is critical in terms of avoiding Instantaneous destruction and reliability in long term usage. The IC needs to be operated below its max junction temperature (Tjmax) to avoid thermal destruction. Refer to Fig. 19 ~ 21 for SSOP-B20 package thermal dissipation characteristics. Operate the IC within power dissipation (Pd) when using this IC. Power consumption Pc(W) calculation will be as below (for Fig.21④) Pc=(Vcc－OUT)×Io+Vcc×Icc2 Power dissipation Pd≧Pc Vcc OUT Io Icc2 : Input Voltage : Output Voltage : Load Current : Circuit Current If load current Io is calculated to operate within power dissipation, it will be as below, where you can find the max load current IoMax for the applied voltage Vcc of the thermal design. Io ≦ Pd－Vcc×Icc2 Vcc－OUT (Refer to Fig2 for Icc2) Example) at Ta=85℃, Vcc=12V, OUT=5V Io ≦ 1.578－12×Icc2 12－5 Fig.21④:θja=41.3℃/W→-24.2mW/℃ 25℃=3.03W→85℃=1.578W Io ≦ 200mA (Icc2=110µA) Refer to above and adjust the thermal design so it will be within power dissipation within the entire operation temperature range. Below is the power consumption Pc calculation when (OUT-GND short) Pc=Vcc×(Icc2+Ishort) (Ishort: short current) (Refer to Fig.4 for I short) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/21 2010.11- Rev.A BD3010AFV-M ●Pin Settings / Precautions 1. Technical Note Vcc pin Insert a 0.33 ~ 1000µF capacitor between the Vcc and GND pins. The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels. Output pins It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable capacitance values range from 0.1µF ~ 1000µF. Abrupt fluctuations in input voltage and load conditions may affect the output voltage. Output capacitance values should be determined only through sufficient testing of the actual application. Vcc=5.6V～36V Ta=-40℃～+125℃ Cin=0.33µF～100µF Cout=0.1µF～100µF 100 2. Vcc N.C GND GND OUT OUT GND GND GND GND GND WADJ RADJ Ro ESR (0.001Ω～) Cout (0.1µF～100µF) Io(ROUT) 10 出力コンデンサESR(Ω） Cout_ESR(Ω) 1 Stable operating region Vcc (5.6V～36V) Cin (0.33µF ～100µF) GND GND GND CLK INH 0.1 0.01 0.001 0 50 100 150 200 CT 出力負荷Io(mA) Io(mA) Cout_ESR vs Io(reference data) ※ Pin Settings / Precautions 2 Measurement circuit 3. CT pin Connecting a capacitance of 0.01µF ~ 1µF on the CT pin is recommended. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/21 2010.11- Rev.A BD3010AFV-M ●Notes for use Technical Note 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4. Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6. Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Thermal consideration Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc) Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, OUT : Output Voltage, Io : Load, Icc2 : Bias Current 2 Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja Power dissipation : Pc (W)=(Vcc－OUT)×Io+Vcc×Icc2 9. Output voltage clamp To prevent rises in the output voltage in response to current surges through the load, the IC incorporates an output voltage clamp circuit. This circuit helps prevent damage to the microcontroller due to output voltage overshoot. However, this circuit is only effective for circuit paths with instantaneous peak currents and therefore does not support DC operation. 10. For an infinitesimal fluctuations of output voltage. At the use of the application that infinitesimal fluctuations of output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert the filter, etc.). 11. Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 12. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 19/21 2010.11- Rev.A BD3010AFV-M Technical Note 13. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass diodes between Vcc and each pin. Back current prevention diode Bypass diode Vcc GND OUT Output Capacitor 14. Positive voltage surges on VCC pin A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50V on the VCC pin. Vcc GND 15. Negative voltage surges on VCC pin A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin. Vcc GND 16. Output protection diode Loads with large inductance components may cause reverse current flow during startup or shutdown. In such cases, a protection diode should be inserted on the output to protect the IC. 17. Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): ○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode ○When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor (Pin A) (Pin B) Transistor (NPN) B C E (Pin B) B C E GND N P+ N N P N Parasitic elements GND Parasitic elements or transistors N N P substrate GND N (Pin A) Parasitic elements P P+ P+ P P+ Example of Simple Monolithic IC Architecture www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 20/21 2010.11- Rev.A BD3010AFV-M ●Ordering part number Technical Note B D 3 Part No. 0 1 0 A F V - M E 2 Part No. Package FV: SSOP-B20 Packaging and forming specification E2: Embossed tape and reel SSOP-B20 6.5 ± 0.2 20 11 Tape Quantity 0.3Min. Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.4 ± 0.3 4.4 ± 0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 10 0.15 ± 0.1 1.15 ± 0.1 0.1± 0.1 0.1 0.65 0.22 ± 0.1 1pin (Unit : mm) Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 21/21 2010.11- Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A