BD4142HFV-TR

Datasheet Free Delay Time Setting CMOS Voltage Detector IC BD4142HFV ●General Description BD4142HFV is 1ch voltage detector IC for monitoring an input voltage line. The default detected voltage is 0.5V and is adjustable via external resistors. When monitoring an input voltage supply, the IC outputs a HIGH signal via a PGOOD pin when the supply rises above the threshold and is LOW when below. ●Key Specifications  Input voltage range: 3.0V to 5.5V  Detected voltage: 500mV(Typ)  PGOOD output ON resistance: 100Ω(Typ)  Bias current: 7.5μA (Typ)  Operating temperature range (Ta): -10℃ to +100℃ ●Package HVSOF5 ●Features  Open Drain Output  Built in Under Voltage LockOut (UVLO) Circuit  Delay Time Controlled by External Capacitor  Very small and low height package  PGOOD HIGH Output 1.60mm x 1.60mm x 0.60mm ●Applications Laptop PC, Desktop PC, LCD-TV, Printer, STB, Digital Appliances, and more. HVSOF5 ●Typical Application Circuit R1 U1 BD4142HFV VCC 3 PGOOD VCC CVCC DLY 1 PGOOD 5 CEXT GND 2 GND VMON R2 IN 4 R3 Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays 1/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Pin Configuration (TOP VIEW) PGOOD 1 GND 2 VCC 3 5 DLY 4 IN Figure 2. Pin configuration ●Pin Description Pin No. Symbol Function 1 PGOOD 2 GND Ground Pin 3 VCC Power Supply Input Pin 4 IN 5 DLY Bottom E-Pad Reset Output Pin (Power Good Signal) Monitoring Voltage Input Pin Capacitor Connected Pin for Setting Delay Time Substrate. Connect the substrate to GND. ●Block Diagram VCC 3 UVLO R2 VCC PGOOD IN R1 1 4 DELAY R3 0.5V DLY 5 CEXT 2 GND Figure 3. Block Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Limits Unit VCC, VIN, VDLY, VPGOOD 6 *1 V Pd 0.67 *2 W IPGOOD 5 mA Operating temperature range Topr -10 to +100 ℃ Storage temperature range Tstg -55 to +150 ℃ Tjmax +150 ℃ Terminal voltage Power Dissipation PGOOD Capacity Current Junction Temperature *1 *2 No need to exceed Pd. Reduced by θja= 186.6℃/W when used over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 1 layer. (copper foil density :2%)) ●Recommended Operating Ratings (Ta=25℃) Parameter Limits Symbol Unit Min Max VCC 3.0 5.5 V VIN -0.3 VCC - 2 V VPGOOD -0.3 5.5 V VDLY -0.3 VCC V Terminal voltage ●Electrical Characteristics (Unless otherwise noted, Ta=25℃, VCC=5V) Limits Parameter Symbol Min Typ Max Bias Current Unit Conditions ICC - 7.5 20 μA Detected Voltage VDET 491 500 509 mV IN sweep up Hysteresis Voltage VHYS - 10 - mV IN sweep down Delay Current IDLY 150 250 350 nA IN=0.6V PGOOD Output ON Resistance ROUT - 100 200 Ω IN=0V PGOOD Output Leak Current IOUT - 0 5 μA IN=0.6V www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Typical Performance Curves (Unless otherwise noted, Ta=25℃, VCC=5V) 10 12 9 10 Bias Current : I CC [µA] Bias Current : I CC [µA] 8 7 6 5 4 3 2 8 6 4 2 1 0 0 0 1 2 3 4 5 6 -10 10 Supply Voltage : VCC [V] 540 540 530 530 Detected Voltage : VDET[mV] Detected Voltage : VDET[mV] 550 520 510 500 490 480 470 510 500 490 480 470 460 450 450 4.5 5 5.5 -10 Supply Voltage : VCC [V] 10 30 50 70 90 Temperature : Ta[℃] Figure 6. Supply Voltage - Detected Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 90 520 460 4 70 Figure 5. Temperature - Bias Current 550 3.5 50 Temperature : Ta[℃] Figure 4. Supply Voltage - Bias Current 3 30 Figure 7. Temperature - Detected Voltage 4/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Typical Performance Curves (Unless otherwise noted, Ta=25℃, VCC=5V) 300 - continued 320 290 300 Delay Current : IDLY [nA] Delay Current : IDLY [nA] 280 270 260 250 240 230 220 280 260 240 220 210 200 200 3 3.5 4 4.5 5 5.5 -10 Supply Voltage : VCC [V] 10 30 50 70 90 Temperature : Ta[℃] Figure 8. Supply Voltage - Delay Current Figure 9. Temperature - Delay Current 25 Delay Time : TDELAY [ms] 20 15 10 5 0 0 2000 4000 6000 8000 10000 External Capacitance : CEXT[pF] Figure 10. External Capacitance - Delay Time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Basic Operation BD4142HFV is a 1ch voltage detector IC with an independent supply voltage (VCC). VCC voltage must be supplied before inputting the monitoring voltage (IN). (VCC=5V) PGOOD [V] 5 0 0.5 IN [V] Figure 11. Input-Output Voltage Characteristic ●Timing Chart IN [V] Detected Delay Time (TDELAY) Setting TDELAY is calculated as below. HYS=10mV(Typ) 0.5 t DLY [V] 0 TDELAY CEXT [F] × 500 [mV] 250 [nA] = CEXT [F] × 2  10 6 [s] = CEXT [F] = TDELAY [s] / (2  10 6 ) 0.5 t (Example) When using a 4700pF capacitor, TDELAY = 4700 [pF]  2  10 6 ‐6 =9400  10 = 9.4 [ms] PGOOD [V] TDELAY t (Example) When setting a 2ms delay, CEXT = 2 [ms] / (2  10 6 ) 2  10 ‐3 = 2  10 6 ‐9 = 1  10 Figure 12. Timing Chart = 1000 [pF] www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Limit of Detected Delay Time Operation (Ta=25℃, VCC =5V, CEXT=4700pF) When the input pulse width (IN) is shorter than 50µs (Typ) (20µs (Min)), PGOOD goes LOW and come back to HIGH without any delay time setup by capacitor of DLY terminal. The behavior depends on the VCC voltage and the CEXT capacitance. IN [V] 50µs (Typ) t PGOOD [V] No delay inserted t Figure 13. Input low pulse is shorter than 50µs (Typ) (Ta=25℃, VCC =5V, CEXT=4700pF) ●Limit of Reaction Time If the input pulse (IN) is shorter than 1µs (Typ), PGOOD does not react (PGOOD keeps HIGH). IN [V] 1µs (Typ) PGOOD [V] t t Figure 14. Input low pulse is shorter than 1µs www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●VCC Operation ① When VCC is below the minimum operation voltage, PGOOD pin will become HIGH. (The meaning of the minimum operation voltage is : When the starting of VCC, PGOOD output voltage become within 10% of VCC voltage, and the value will be around 0.8V (Typ). Note that this value is reference.) ② When VCC value exceeds the minimum operation voltage, PGOOD output become LOW until the VCC reached UVLO released voltage (2.5V (Typ)). ③ When VCC exceeds UVLO released voltage, PGOOD pin will become HIGH if the input voltage of IN pin is over the detected voltage (0.5V (Typ)), and PGOOD pin will become LOW if the input voltage of IN pin is below the detected voltage. UVLO Release Voltage VCC [V] 5 2.5 RPGOOD VCC VCC 0.8 t PGOOD 0 PGOOD [V] IN DLY GND t ① ② Figure 16. VCC Operation ③ IN [V] IN Detected Voltage (0.5V Typ) t Figure 15. IN > Detected Voltage VCC [V] 5 0.8 t PGOOD [V] 0 IN [V] t Detected Voltage (0.5V Typ) IN t Figure 17. IN < Detected Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Application Example R1 VCC U1 BD4142HFV R4 3 VCC PGOOD PGOOD 1 C1 (Capacitor for noise filtering) C4 DLY 5 VMON C2 GND 2 GND R2 IN 4 R3 C3 (Capacitor for noise filtering) Figure 18. Application Circuit Table 1. Recommended Component Values Ref Des Value Description U1 BD4142HFV C1 C2 4700pF GRM18 series, 50V, 1608 C3 C4 0.01µF GRM18 series, 50V, 1608 R1 100kΩ MCR03 series, 1608 R2 Short R3 R4 Short - Type Ceramic Capacitor Ceramic Capacitor Chip Resistor - Manufacturer ROHM MURATA MURATA ROHM - ・R1 (Pull-up Resistor) R1 should be set not to be affected by output leak current (5µA (Max)) and capacity current (5mA). ・R2, R3 The detected voltage is adjustable via external resistors (R2, R3). The recommended total resistance value for R2 and R3 is within total 300kΩ. ・C2 (Capacitor for Detected Delay Time Setting) Please set C2 value with double of minimum delay time for application. Please refer to Page. 6 regarding Detected Delay Time Setting. The maximum value of C2 is 4.7µF. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Power Dissipation ◎HVSOF5 1 PCB size：70mm×70mm×1.6mm ①board：1 layer board（copper foil density : 2%） Power Dissipation [W] 0.8 ①0.67W 0.6 0.4 0.2 0 25 50 75 100 125 150 Ambient Temperature [℃] ●I/O Equivalence Circuit 1. PGOOD 4. IN 5. DLY www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 19. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. ●Ordering Information B D 4 1 4 Part Number 2 H F V Package HFV: HVSOF5 TR Packaging and forming specification TR: Embossed tape and reel ●Marking Diagram HVSOF5 (TOP VIEW) AQ Part Number Marking LOT Number www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV ●Physical Dimension, Tape and Reel Information Package Name HVSOF5 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ∗ Order quantity needs to be multiple of the minimum quantity. 13/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet BD4142HFV Revision History Date Revision Changes 29. Jan. 2013. 001 New Release 21. Aug. 2015 002 Add Application Example www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/14 TSZ02201-0333AAZ00350-1-2 21.Aug.2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001