System Motor Driver ICs for CD/DVD Players
1ch Spindle
Motor Driver ICs
BA6859AFP-Y,BA6664FM,BD6671FM
No.10011EAT03
●Description
ROHM’s spindle motor drivers incorporate the 3-phase full-wave pseudo-linear drive system(BA6859AFP-Y, BA6664FM)
and 180 ° electrifying direct PWM drive system(BD6671FM).Smooth rotation characteristic performance is ensured.
Besides, high torque is provided in a wide output range because the output stage incorporates low-saturation voltage NPN
transistors (BA6859AFP-Y, BA6664FM) and low-power consumption MOSFET (BA6671FM).
●Features
1) 3-phase full-wave pseudo-linear system (BA6859AFP-Y, BA6664FM)
2) 180° electrifying direct drive PWM system (BD6671FM)
3) Power saving, TSD (thermal shutdown) functions built in
4) Current limiting, Hall bias circuit built in
5) FG output built in
6) 3-phase component FG output built in (BA6664FM, BD6671FM)
7) Circuit direction detection function built in (BA6859AFP-Y, BA6664FM)
8) Reverse rotation prevention circuit built in
9) Short brake pin built in (BA6859AFP-Y, BA6664FM)
10) Brake mode selection pin built in (BA6859AFP-Y, BD6671FM)
11) Supports DSP 3.3 V
●Applications
Used for car, CD and DVD players incorporating changer function
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
BA6859AFP-Y
BA6664FM
BD6671FM
Unit
Applied voltage
VCC
7
7
7
V
Applied voltage
VM
15
15
15
V
Applied voltage
VG
-
Power dissipation
1
20
2
V
2
Pd
1450*
2200*
2200*
mW
Operating temperature
Topr
-40～+85
-40～+85
-40～+85
℃
Storage temperature
Tstg
-55～+150
-55～+150
-55～+150
℃
Output current
Iout
1300
1300
2500
mA
Tjmax
150
150
150
℃
Junction temperature
*1 Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
*2 Reduced by 17.6 mW/℃ over 25℃, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
●Line up matrix
Parameter
Symbol
Power supply voltage
VG pin voltage
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
Ratings
Unit
BA6859AFP-Y
BA6664FM
BD6671FM
VCC
4.5～5.5
4.5～5.5
4.5～5.5
V
VM
3.0～14
3.0～14
4.0～13.2
V
VG
-
-
8.5～19
V
1/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●Electrical characteristics
1) BA6859AFP-Y (Unless otherwise specified, Ta=25℃, VCC=5.0V, VM=12V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Circuit current 1
ICC1
－
0
0.2
Circuit current 2
ICC2
－
5.0
7.5
ON voltage range
VPSON
－
－
1.0
OFF voltage range
VPSOFF
2.5
－
－
Hall bias voltage
VHB
0.5
0.9
1.5
Input bias current
IHA
－
0.7
3.0
Same phase input voltage range
VHAR
1.0
－
4.0
Mini. input level
VINH
50
－
－
H3 hysteresis level
VHYS
5
20
40
Input voltage range
EC, ECR
0
－
5
Offset voltage ECOFF-80
-50
-20
Offset voltage +
ECOFF+
20
50
80
Input bias current
ECIN
-3
－
3
I/O gain
GEC
0.56
0.70
0.84
FG output high-level voltage
VFGH
4.5
4.8
－
FG output low-level voltage
VFGL
－
0.25
0.4
Duty (reference values)
DU
－
50
－
FR output high-level voltage
VFRH
4.1
4.4
－
FR output low-level voltage
VFRL
－
0.25
0.4
Output saturation high level voltage
VOH
－
1.0
1.4
Output saturation low level voltage
VOL
－
0.4
0.7
Pre-drive current
IVML
－
35
70
Output limit current
ITL
560
700
840
ON voltage range
VSBON
2.5
－
－
OFF voltage range
VSBOFF
－
－
1.0
ON voltage range
VBRON
2.5
－
－
OFF voltage range
VBROFF
－
－
1.0
Unit
mA
mA
Conditions
PS=L
PS=H
V
V
Internal circuit OFF
Internal circuit ON
V
IHB=10mA
µA
V
mVpp
mV
V
mV
mV
µA
A/V
One side input level
Linear range:0.5～3.3V
ECR=1.9V
ECR=1.9V
EC=ECR
EC=1.2, 1.7V
V
V
%
IFG=-20µA
IFG=3.0mA
V
V
IFR=-20µA
IFR=3.0mA
V
V
mA
mA
IO=-600mA
IO=600mA
EC=0V output open
V
V
BR=0V
BR=0V
V
V
EC>ECR, SB=Open
EC>ECR, SB=Open
●Reference: Data
1.5
8
-40℃
6
4
25℃
85℃
2
0
1.5
85℃
1.0
Output L voltage :VOL [V]
Output H voltage:V OH [V]
Circuit current :Icc2 [mA]
10
25℃
-40℃
0.5
5
5.5
6
6.5
7
Supply voltage :Vcc[v]
Fig.1 Circuit Current 2
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
25℃
0.5
-40℃
0.0
0.0
4.5
85℃
1.0
0
0.3
0.6
0.9
1.2
1.5
Output Current :IOH[v]
Fig.2 Output Saturation Voltage
at High Level
2/17
0
0.3
0.6
0.9
1.2
1.5
Output Current :IOL [A]
Fig.3 Output Saturation Voltage
at Low Level
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
2) BA6664FM(Unless otherwise specified, Ta=25℃, VCC=5.0V, VM=12V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Circuit current 1
ICC1
－
0
0.2
mA
PS=L, GSW=Open
Circuit current 2
ICC2
－
6.2
9.1
mA
PS=H, GSW=Open
ON voltage range
VPSON
－
－
1.0
V
Internal current circuit OFF
OFF voltage range
VPSOFF
2.5
－
－
V
Internal current circuit ON
VHB
0.5
0.9
1.5
V
IHB=10mA
IHA
－
0.7
3.0
µA
VHAR
1.0
－
4.0
V
Mini. input level
VINH
50
－
－
mVpp
H3 hysteresis level
VHYS
5
20
40
mV
EC, ECR
0
－
5
V
Offset voltage -
ECOFF-
-75
-45
-15
mV
ECR=1.65V, GSW=L
Offset voltage +
ECOFF+
15
45
75
mV
ECR=1.65V, GSW=L
ECIN
-3
－
3
µA
EC=ECR
Hall bias voltage
Input bias current
Same phase input voltage range
One side input level
Input voltage range
Input bias current
Linear range:0.5～3.3V
I/O gain low-level
GECL
0.52
0.65
0.78
A/V
GSW=L,RNF=0.5Ω
I/O gain medium-level
GECM
1.04
1.3
1.56
A/V
GSW=OPEN,RNF=0.5Ω
I/O gain high-level
GECH
2.24
2.8
3.36
A/V
GSW=H,RNF=0.5Ω
FG output high-level voltage
VFGH
4.5
4.8
－
V
IFG=-20µA
FG output low-level voltage
VFGL
－
0.2
0.4
V
IFG=3.0mA
FG output high-level voltage
VFG2H
4.6
4.9
－
V
IFG2=-20µA
FG output low-level voltage
VFG2L
－
0.2
0.4
V
IFG2=3mA
FR output high-level voltage
VFRH
4.1
4.4
－
V
IFR=-20µA
FR output low-level voltage
VFRL
－
0.2
0.4
V
IFR=3.0mA
Output saturation high-level voltage
VOH
－
1.0
1.35
V
IOUT=-600mA
Output saturation low-level voltage
VOL
－
0.4
0.65
V
IOUT=600mA
Pre-drive current
IVML
－
35
70
mA
ITL
560
700
840
mA
ON voltage range
VSBON
2.5
－
－
V
BR=0V
OFF voltage range
VSBOFF
－
－
1.0
V
BR=0V
ON voltage range
VBRON
2.5
－
－
V
EC>ECR, SB=Open
OFF voltage range
VBROFF
－
－
1.0
V
EC>ECR, SB=Open
VGSWL
－
－
1.0
V
High voltage range
VGSWH
3.0
－
－
V
OPEN voltage
VGSWOP
－
2.0
－
V
Output limit current
EC=0V output open
Low voltage range
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
3/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
3) BD6671FM (Unless otherwise specified, Ta=25℃, VCC=5.0V, VM=12V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Circuit current 1
ICC1
－
100
200
µA
PS=L, GSW=Open
Circuit current 2
ICC2
8
14
20
mA
PS=H, GSW=Open
ON voltage range
VPSON
－
－
1.0
V
Internal current circuit OFF
OFF voltage range
VPSOFF
2.5
－
－
V
Internal current circuit ON
VHB
0.7
1.0
1.3
V
IHB=10mA
Same phase input voltage range
VHAR
1.4
－
3.6
V
Mini. input level
VINH
100
－
－
mVpp
Hall bias voltage
Both side input level
Hall hysteresis level +
VHYS+
5
20
40
mV
Hall hysteresis level -
VHYS-
-40
-20
-5
mV
Low voltage range
VGSWL
－
－
0.6
V
High voltage range
VGSWH
2.0
－
－
V
OPEN voltage range
VGSWOP
－
1.3
－
V
Input voltage range
EC, ECR
0
－
5
V
Offset voltage +
ECOFF+
5
50
100
mV
GSW=M
Offset voltage -
ECOFF-
-100
-50
5
mV
GSW=M
Linear range: 0.5～3.0V
Input current
ECIN
-11
-2.5
0
µA
EC=ECR=1.65V
I/O gain low-level
GECL
0.28
0.35
0.42
A/V
GSW=L
I/O gain medium-level
GECM
0.56
0.70
0.84
A/V
GSW=M
I/O gain high-level
GECH
1.12
1.40
1.68
A/V
GSW=H
Output ON resistance
RON
－
1.0
1.35
Ω
IOUT=±600mA
(upper + lower side)
Output limit current low-level
ITLL
340
400
460
mA
GSW=L
Output limit current medium-level
ITLM
680
800
920
mA
GSW=M
Output limit current high-level
ITLH
1020
1200
1380
mA
GSW=H
High level voltage
VFGH
4.6
－
－
V
IFG=-100µA
Low level voltage
VFGL
－
－
0.4
V
IFG=+100µA
VPUMP
12.5
17
19
V
VCC= 5V,VM=12V
CP1=CP2=0.1µF
Upper side saturation voltage
VCP1H
0.25
0.45
0.65
V
ICP1=-4mA
Lower side saturation voltage
VCP1L
0.2
0.4
0.6
V
ICP1=+4mA
Charge pump output voltage
Upper side saturation voltage
VCP2H
0.4
0.6
0.8
V
ICP2=-4mA
Lower side saturation voltage
VCP2L
0.15
0.35
0.55
V
ICP2=+4mA
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
4/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●Block Diagram, application Circuit Diagram and Pin Function
1) BA6859AFP-Y
Fig.4 BA6859AFP-Y Block Diagram
Pd (W)
2.0
1.45
1.0
0
25
50
75 85 100
125
150
Ta(℃)
Fig.5 Power Dissipation Reduction (BA6859AFP-Y)
* Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy
board (70 mm x 70 mm x 1.6 mm).
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
5/17
BA6859AFP-Y Pin Function Table
Pin No. Pin name
Function
1
N.C.
N.C.
2
N.C.
N.C.
3
N.C.
N.C.
4
A3
Output pin
5
A2
Output pin
6
A1
Output pin
7
GND
GND pin
8
H1+
Hall signal input pin
9
H1Hall signal input pin
10
H2+
Hall signal input pin
11
H2Hall signal input pin
12
H3+
Hall signal input pin
13
H3Hall signal input pin
14
VH
Hall bias input pin
15
BR
Brake mode selection pin
Capacitor connection pin for phase
16
CNF
compensation
17
SB
Short brake pin
18
FR
Rotation detection pin
19
ECR
Output voltage control reference pin
20
EC
Output voltage control pin
21
PS
Power-saving pin
22
FG
FG signal output pin
23
VCC
Power supply pin
24
VM
Motor power supply pin
Resistance connection pin for output
25
RNF
current detection
FIN
FIN
GND
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
2) BA6664FM
Torque limit current and I/O gain settings are made by
the RNF resistance value.
Resistance of 0.4 to 1.0Ω is recommended.
Output to the motor will be opened at a chip tempe
175°C (Typ.). Do not use the IC in excess of a chip
rature of temperature of 150°C.
RNF
0.5Ω
Capacitor for noise level mitigation.
The recommended value is 0.47 µF to 10 µF.
28
DRIVER
A3
27
TSD
GAIN
SWITCH
2
A2
4
CURRENT
SENSE AMP
TL
7
8
H1+
9
Hall1
H1
+
-
SERVO
SIGNAL
22
The motor torque current is controllable.
ECR
If the ECR voltage is set between 1.6 and 2.2V, the
maximum torque limit current will be obtained.
FR
20
VCC
The detection of motor rotation direction is possible.
FG2
R
D Q
－
CK Q
19
SB
SHORT BRAKE
The short brake is operated regardless of brake mode settings.
18
CNF
-
17
+
-
H3-
The power saving mode is turned ON by low-level voltage,
and the circuit current and motor output will stop.
-
12
13
PS
21
+
+
H3+
Speed detection is attained by FG signal output.
EC
+
11
H2-
1µF
23
VCC
H2+
Hall1
TORQUE
SENSE AMP
-
I/O gain
+
-
FG
-
-
10
Hall1
+
+ 1µF
-
VM
VCC
VCC
PS
+
GSW
26
24
HALL AMP
GND
RNF
25
GAIN
CONTROL
A1
VM
14
BRAKE MODE
16
Hall Bias
15
FIN
Connect a capacitor for phase compensation.
The recommended value is 0.1µF.
0.1µF
BR
VH
Short brake and reversed brake settings are possible.
500Ω
500Ω
Resistor for setting Hall input level .
The recommended value is 200 Ω to 1k Ω.
Output will be open when the reverse rotation of the motor is
detected.
Fig.6 BA6664FM Block Diagram
BA6664FM Pin Function Table
Pin No. Pin name
Function
1
N.C.
N.C.
2
A3
Output pin
3
N.C.
N.C.
4
A2
Output pin
5
N.C
N.C.
6
N.C.
N.C.
7
A1
Output pin
Pd[W]
8
GND
GND pin
9
H1+
Hall signal input pin
10
H1Hall signal input pin
11
H2+
Hall signal input pin
2.2
12
H2Hall signal input pin
2.0
13
H3+
Hall signal input pin
14
H3Hall bias input pin
15
VH
Hall bias input pin
16
BR
Brake mode pin
Capacitor connection pin for phase
17
CNF
compensation
18
SB
Short brake pin
1.0
19
FG2
FG 3-phase component output pin
20
FR
Rotation detection pin
21
ECR
Output voltage control reference pin
0
25
50
75 85 100
125
150
22
EC
Output voltage control pin
Ta(℃)
23
PS
Power-saving pin
Fig.7 Power Dissipation Reduction (BA6664FM、BD6671FM)
24
FG
FG signal output pin
25
VCC
Power supply pin
* Reduced by 11.6 mW/℃ over 25℃, when mounted on a glass epoxy board
26
GSW
Gain switching pin
(70 mm x 70 mm x 1.6 mm).
27
VM
Motor power supply pin
Resistance connection pin for output
28
RNF
current detection
FIN
FIN
GND
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
6/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
3)BD6671FM
200Ω
EXOR
H1+ Hall comp
H1
H1-
1000pF
FG3
＋
+
-
＋
－
H2+ Hall Amp
H2
H2-
1000pF
200Ω
Vcc
H3GSW
FIN
A1
RNF
U-Pre
Driver
FIN
Driver
OSC
L -Pre
Driver
GND
RNF1
A3
CP1
0.1 µ F
CP2
Charge
Pump
RNF2
UVLO
VG
CNF
Curre nt Limit Comp
MODE
Vcc
Torque
AMP ＋
－
＋
Matrix
－
－
Vcc
EC
servo
ECR signal
VM
Current
Sense AMP
10µF
CL
D
CK
1.65V
100 µ F
Q
QB
0.01µF
PS
＋
0.047µF
10kΩ
PS
0.1 µF
Vcc
0.5Ω
A2
Matrix
Gain
control
※2
TSD
+
-
＋
－
VH
VM
+
-
H3+
H3
FG
Hall
bias
＋
－
1000pF
PWM
Comp
※1
REVERSE
DETECT
※ 1 Set capacitor between VM and GND, close as possible to the IC.
※2 To prevent from concentration of current routes, make the wiring
impedance values from the power supply equal as possible.
Fig.8 BD6671FM Block Diagram
BD6671FM Pin Function
Pin No Pin name
Function
Pin No Pin name
Function
1
H1+
Hall signal input pin
15
VM
2
H1-
Hall signal input pin
16
ECR
3
H2+
Hall signal input pin
17
EC
Output voltage control pin
4
H2-
Hall signal input pin
18
PS
5
H3+
Hall signal input pin
19
RNF2
6
H3-
Hall signal input pin
20
A3
7
GSW
Gain switching pin
21
RNF1
8
GND
22
A2
9
CP1
23
RNF1
10
CP2
24
A1
Output pin
11
VG
25
VM
Motor power supply pin
12
CNF
26
VH
Hall bias pin
13
MODE
GND
Charge pump capacity connection
pin 1
Charge pump capacity connection
pin 2
Charge pump output pin
Capacitor connection pin for phase
compensation
Brake mode switching pin
Power-saving pin
Resistance connection pin for output
current detection
Output pin
Resistance connection pin for output
current detection
Output pin
Resistance connection for output
current
27
FG
FG Output pin
14
VCC
28
FG3
FG3 Output pin
FIN
FIN
GND
Power supply pin
Motor power supply pin
Output voltage control reference pin
*Heat radiation FIN: GND
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
7/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●I/O logic
1) BA6859AFP-Y
Output conditions
Input conditions
Pin. No
Forward rotation
Reverse rotation
8
9
10
11
12
13
6
5
4
6
5
4
H1
+
H1
-
H2
+
H2
-
H3
+
H3
-
A1
A2
A3
A1
A2
A3
1
L
M
H
M
M
M
H
L
L
L
H
H
2
H
M
L
M
M
M
L
H
H
H
L
L
3
M
M
L
M
H
M
L
H
L
H
L
H
4
M
M
H
M
L
M
H
L
H
L
H
L
5
H
M
M
M
L
M
L
L
H
H
H
L
6
L
M
M
M
H
M
H
H
L
L
L
H
Input voltage
Hi=2.6V
Mid=2.5V
Low=2.4V
Note: Forward rotation ECECR
2) BA6664FM
Output conditions
Input conditions
Pin. No
Forward rotation
Reverse rotation
7
4
2
7
4
2
A1
A2
A3
A1
A2
A3
9
H1
+
10
H1
-
11
H2
+
12
H2
-
13
H3
+
14
H3
-
1
L
M
H
M
M
M
H
L
L
L
H
H
2
H
M
L
M
M
M
L
H
H
H
L
L
3
M
M
L
M
H
M
L
H
L
H
L
H
4
M
M
H
M
L
M
H
L
H
L
H
L
5
H
M
M
M
L
M
L
L
H
H
H
L
6
L
M
M
M
H
M
H
H
L
L
L
H
Input voltage
Hi=2.6V
Mid=2.5V
Low=2.4V
Note: Forward rotation ECECR
3)BD6671FM
Output conditions
Input conditions
Pin. No
Forward rotation
1
H1
+
2
H1
-
3
H2
+
4
H2
-
5
H3
+
6
H3
-
1
L
M
H
M
M
2
H
M
L
M
3
M
M
L
4
M
M
5
H
6
L
Reverse rotation Reverse rotation
(MODE=L)
(MODE=H)
24
22
20
24
22
20
24
22
20
A1
A2
A3
A1
A2
A3
A1
A2
A3
M
H
L
L
L
H
H
L
L
L
M
M
L
H
H
H
L
L
L
L
L
M
H
M
L
H
L
H
L
H
L
L
L
H
M
L
M
H
L
H
L
H
L
L
L
L
M
M
M
L
M
L
L
H
H
H
L
L
L
L
M
M
M
H
M
H
H
L
L
L
H
L
L
L
Input voltage
Hi=2.6V
Mid=2.5V
Low=2.4V
Note: Forward rotation ECECR
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
8/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●I/O Timing Chart
1) BA6859AFP-Y, BA6664FM
H1+
H 2+
H 3+
A1
30°
Output current
H1 - + H2+
A1
Output current
A2
Output current
H2 - + H3+
A2
Output current
A3
Output current
H3 - + H1+
A3
Output current
Fig. 9
2) BD6671FM
H1+
H2+
H3+
A1 Output current
30°
A1 Output voltage
A2 Output voltage
A2 Output current
Fig. 10
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
9/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●I/O Circuit
1) BA6859AFP-Y
(1) Power saving (pin 21)
(6) FG output (pin 22)
VCC
15KΩ
21
10KΩ
10kΩ
22
(2) Torque command input (pin 19, pin 20)
(7) FR output (pin 18)
20
1kΩ
1kΩ
19
30kΩ
18
(3) Coil output (A1: pin 6, A2: pin 5, A3: pin 4)
VM
External RNF Register
RNF
6
(8) Short brake (17 pin)
10kΩ
5
500Ω
500Ω
13kΩ
4
1kΩ
GND
5kΩ
17
12kΩ
(4) Hall input (H1+ : 8 pin, H1- : 9 pin, H2+ : 10 pin,
H2- : 11 pin, H3+ : 12 pin, H3- : 13 pin)
1KΩ
1KΩ
(9) Brake mode (15 pin)
15kΩ
15
(5) Hall bias(14 pin)
14
10kΩ
100KΩ
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
2) BA6664FM
(1) Power saving (23 pin)
(7) FG output (19 pin)
VCC
15KΩ
23
5kΩ
10KΩ
19
(2) Torque command input (21 pin, 22 pin)
(8) FR output (20 pin)
22
1kΩ
VCC
1kΩ
21
30kΩ
20
(3) Coil output (A1 : 7 pin, A2 : 4 pin, A3 : 2 pin)
VM
External RNFRegister
RNF
7
4
(9) Short Brake mode (18 pin)
2
10kΩ
500Ω
500Ω
1kΩ
5kΩ
(4) Hall input (H1+ : 9 pin, H1- : 10 pin, H2+ : 11 pin,
H2- : 12 pin, H3+ : 13 pin, H3- : 14 pin)
1KΩ
13kΩ
18
12kΩ
1KΩ
(10)Brake mode (16 pin)
(5) Hall bias (15 pin)
15
16
15kΩ
10kΩ
(11) Gain switch (26 pin)
100KΩ
100KΩ
(6) FG output (24 pin)
26
VCC
5KΩ
1KΩ
30KΩ
5KΩ
10kΩ
56KΩ
24
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
11/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
3) BD6671FM
(1) Hall input (H1 : 1 pin, H1-: 2 pin, H2+ : 3 pin,
H2- : 4 pin, H3+ : 5 pin, H3- : 6 pin)
VCC
(6) Brake mode selection pin (13 pin)
VCC
VCC
30KΩ
13
+
-
Hn
Hn
1KΩ
20KΩ
1KΩ
1KΩ
1KΩ
25KΩ
(2) Gain switch (7pin)
VCC
(7) Torque amp (ECR : 16 pin, EC : 17 pin)
VCC
VCC
100KΩ
1KΩ 75KΩ 10KΩ
7
16,17
10KΩ
1KΩ
25KΩ
(3)CP1 output (9pin)
VCC
(8) Power saving (18 pin)
(9)RNF2(19 pin)
VCC
VCC
VCC
50Ω
30KΩ
18
9
710Ω
1KΩ
19
20KΩ
(4) CP2 / VG output (CP2 : 10 pin, VG : 11 pin)
50Ω
11
50Ω
10
(10) Output pin (A1 : 24 pin, A2 : 22 pin, A3 : 20 pin)
VM
VM
24
22
20
RNF1
(5) CNF pin (12 pin)
(11) Hall bias (26 pin)
VCC
12
(12) FG / FG3 output (FG : 27 pin, FG3 : 28 pin)
VCC
VCC
VCC
50Ω
26
2KΩ
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
50Ω
27,28
100KΩ
12/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●Operation Explanation
●Torque Command
Rotation direction
ECECR
Reverse*
*Stops after detecting reverse rotation
RNF
[V]
Forward
The I/O gain GEC from the EC pin to the RNF pin (output current) is determined
by the RNF detection resistor.
①(BA6859AFP-Y)
GEC=0.35/RNF [A/V] ･････(1)
②(BA6664FM)
GECL=0.325/RNF [A/V] (GSW=L)
GECM=0.60/RNF [A/V] (GSW=OPEN)
GECH=1.4/RNF [A/V] (GSW=H)
③(BD6671FM)
GECL=0.175/RNF [A/V] (GSW=L)
GECM=0.35/RNF [A/V] (GSW=M)
GECH=0.70/RNF [A/V] (GSW=H)
④The following torque limit current ITL is obtained (BA6859AFP-Y, BA6664FM)
ITL=0.35/RNF [A]･･･････････････････(2)
⑤(BD6671FM)
ITLL=0.2/RNF [A] (GSW=L)
ITLM=0.4/RNF [A] (GSW=M)
ITLH=0.6/RNF [A] (GSW=H)
The value will become smaller than the computed value due to the wiring
capacity and other factors, if the RNF resistance is 0.5Ω or below.
Offset voltage Offset voltage +
3mV
1.65(ECR)
EC[V]
Fig.11
●Set-up of Motor Rotation Direction and Voltage Range of Torque Control Reference Terminal.
The motor rotation direction determined by the torque control terminal voltage EC and the torque control reference terminal
voltage ECR
Torque control input voltage
Rotation direction
ECECR
Reverse torque
Io
Forward torque
Reverse torque
ITL
0.5
2.5 3.3
Fig.12
5.0
EC[V]
The relation between the input gain and torque limit current expressed as (1) and (2) discussed previously is only valid
when EC and ECR are within a range from 0.5V to 3.3V. Depending on how the torque control reference terminal voltage,
ECR is specified, there may be a case when the output current for the motor does not go up to the torque limit value.
Please be aware of this voltage range when specifying the ECR voltage.
For BA6859AFP-Y, BA6664FM and BD6671FM, 1.6V～2.2V is recommended.
If above conditions are understood, the voltage input range to the EC and ECR terminals can be from 0V to VCC.
●Power Saving
The input circuit specified in I/O circuit 1) BA6859AFP-Y (1) is used for power saving input.
The power saving pin has a temperature characteristic of approximately –5 mV/℃ and also the built-in resistors has a dispersion of 30%.
Keep the input voltage range in mind.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
13/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●Reverse Rotation Detection Function
Actual motor rotation at reverse detection
D-FF
H2+
H2-
+
-
D
H3+
H3-
+
-
CK
EC < ECR: Forward torque (forward rotation)
Q
EC > ECR: Deceleration (forward rotation)
H:OUTPUT.OPEN
(HIGH-IMPEDANCE)
+
-
EC
ECR
When the motor rotates in the reverse direction, the reverse rotation
detection function will operate and the output will be in an open state.
Fig.13
The motor rotates in a reverse direction with inertial force.
Fig. 13 shows the construction of the reverse rotation detection circuit.
Stop
・Forward rotation (ECECR)
The phase relation of the H2+ and H3+ signals are opposite to that when the motor is rotating in the forward direction.
Therefore, the reverse rotation detection circuit operates, and the output is turned off and open.
●FR Signal Output (BA6859AFP-Y, BA6664FM)
FR output signal pin outputs the FR signal of low(L) or high(H) after detecting the motor rotation direction.
Motor rotation direction
FR signal output
Forward
“H”
Reverse
“L”
●Brake Mode Change (BA6664FM, BD6671FM)
By applying high-level voltage to the BR pin, the brake mode for the following condition can be changed: EC > ECR.
ECECR
L
BR
Forward rotation
Reverse rotation brake
H
Forward rotation
Short brake
When the BR pin is set to high level and used in short-brake mode, open the SB pin.
The BR pin has a temperature characteristics of approximately -5 mV/℃. Use the BR pin within the permissible input range.
●Short Brake (BA6859AFP-Y, BA6664FM)
OFF
OFF
OFF
ON
A ON
O
A ON
When the short-brake pin is set to high level, as shown in Fig.18, the output
transistor (3-phase) on the high side will be turned off and the output transistor
(3-phase) on the low side will be turned on. The short brake pin has a
temperature characteristic of approximately -5 mV/℃. Keep the input voltage
range (see Fig12) in mind.
A
MOTOR
Fig.14
●Hall Input
The Hall element allows both serial and parallel connections.
VCC
VCC
H1
H3
H2
Set the Hall input voltage between 1.0 and 4.0 V. Compute the
resistance between the VH and VCC pins in consideration of the
flowing current of the Hall device.
H2
H1
H3
15-pin (Hall Bias)
Parallel Connection
15-pin (Hall Bias)
Serial Connection
Fig.15
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
14/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●FG Signal Output / FG2 Signal Output
The FG signal output/FG2 signal output terminals are for detecting the motor rotation speed. The output frequency of FG2
signal is three times higher than the FG frequency signal output. So, it is suitable for the slow speed rotation detection.
However, due to the Hall device variation and other reasons, the duty cycle may not reach 50% in some instances.
H1+
H1-
+
-
H2+
H2-
+
-
H3+
H3-
+
-
H1
H2
FG2
H3
FG
Fig. 16
H1 waveform
H2 waveform
H3 waveform
FG waveform
FG2 waveform
Fig. 17
●Notes for use
(1) Absolute maximum ratings
This product is subject to a strict quality management regime during its manufacture. However, damage may result if
absolute maximum ratings such as applied voltage and operating temperature range are exceeded. Assumptions should
not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety
measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum
ratings may be exceeded is anticipated.
(2) Connecting the power supply connector backward
Connecting the power supply connector backwards may result in damage to the IC. Insert external diodes between the
power supply and the IC's power supply pins as well as the motor coil to protect against damage from backward
connections.
(3) Power supply lines
As return of current regenerated by back electromotive force of motor happens, take steps such as putting capacitor
between power source and GND as an electric pathway for the regenerated current. Be sure that there is no problem with
each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If
the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the
voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the
absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage
clamp diode between the power supply and GND pins.
(4) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(5) Setting of heat
Take the power dissipation Pd) into account for practical application and make thermal design with sufficiently margined.
(6) Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result
in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by
the presence of a foreign object may result in damage to the IC.
(7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
15/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit (TSD)
This IC incorporates a TSD circuit. If the chip becomes the following temperature, coil output to the motor will be open.
The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the
IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of the TSD circuit is assumed.
TSD ON temperature [℃] (typ.)
Hysteresis temperature [℃] (typ.)
BA6859AFP-Y
175
25
BA6664FM
175
15
BD6671FM
170
25
(10) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of
parasitic elements.
For example, when the resistors and transistors are connected to the pins as shown in Fig. 18,
○the P/N junction functions as a parasitic diode
when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN).
○Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines
with the N layer of other adjacent elements to operate as a parasitic NPN transistor.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result
of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will
trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate)
voltage to input pins.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
Pin A
N
P+
N
P+
P
N
P substrate
Parasitic element
GND
E
N
P+
B
N
Parasitic
element
P+
P
N
C
E
P substrate
Parasitic element
GND
GND
GND
Parasitic
element
Other adjacent
elements
Fig.18 Example of IC structure
(11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure,
and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to
or removing it from a jig or fixture during the inspection process.
(12) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external parts, either.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
16/17
2010.06 - Rev.A
Technical Note
BA6859AFP-Y,BA6664FM,BD6671FM
●Ordering part number
B
A
6
Part No.
BA
6
6
4
F
Part No.
6859A
6664
6671
BD
M
-
Package
FP-Y : HSOP25
FM : HSOP-M28
E
2
Packaging and forming specification
E2: Embossed tape and reel
HSOP25
13.6 ± 0.2
(MAX 13.95 include BURR)
2.75 ± 0.1
2000pcs
Direction
of feed
0.3Min.
1
13
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.25 ± 0.1
1.95 ± 0.1
1.9 ± 0.1
Embossed carrier tape
Quantity
14
5.4 ± 0.2
7.8 ± 0.3
25
Tape
0.11
S
0.1 S
0.8
0.36 ± 0.1
12.0 ± 0.2
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
HSOP-M28
18.5 ± 0.2
(MAX 18.85 include BURR)
+6°
4°−4°
1.25
1500pcs
1.2±0.15
0.5±0.2
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
14
1
5.15 ± 0.1
+0.1
0.27 −0.05
S
0.11
2.2±0.1
Embossed carrier tape
Quantity
15
7.5±0.2
9.9±0.3
28
Tape
0.8
0.37 ± 0.1
0.1 S
1pin
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.06 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
ROHM Semiconductor:
BD6671FM-E2 BA6664FM-E2 BA6859AFP-YE2
工商网监
湘ICP备2023018690号
