BD6722FS-E2

Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6722FS ●General description BD6722FS is a half pre-driver that controls the source side motor drive part composed of the power transistors. Moreover, it corresponds to 800mA motor, because the driving current and the composition parts are optimized. ●Package SSOP-A16 ●Features „ Half pre-driver including power NDMOS FET „ Speed controllable by DC / direct PWM input „ PWM soft switching „ Quick start „ Current limit „ Lock protection and automatic restart „ Rotation speed pulse signal (FG) output „ Lock alarm signal (AL) output W (Typ.) x D (Typ.) x H (Max.) 6.60mm x 6.20mm x 1.71mm SSOP-A16 ●Application „ Fan motors for general consumer equipment of desktop PC, and Server, etc. ●Absolute maximum ratings Parameter Supply voltage Power dissipation Operating temperature range Storage temperature range High side output voltage Low side output voltage Low side output current Rotation speed pulse signal (FG) output voltage Rotation speed pulse signal (FG) output current Lock alarm signal (AL) output voltage Lock alarm signal (AL) output current Reference voltage (REF) output current Input voltage (TH) Junction temperature *1 *2 Symbol Vcc Pd Topr Tstg Voh Vol Iol Vfg Ifg Val Ial Iref Vin Tj Limit 20 812.5 *1 –40 to +100 –55 to +150 34 34 1.5 *2 20 10 20 10 8 15 150 Unit V mW °C °C V V A V mA V mA mA V °C Reduce by 6.5mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. ●Recommended operating conditions Parameter Operating supply voltage range Operating input voltage range (H+, H–, MIN) (more than Vcc=9V) Operating input voltage range (H+, H–, MIN) (less than Vcc=9V) ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Symbol Vcc Limit 4.5 to 17.0 Unit V 0 to 7 V 0 to Vcc–2 V Vin ○This product is not designed protection against radioactive rays 1/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Pin description ●Pin configuration (TOP VIEW) P/No. 1 T/Name GND GND 1 16 AL 2 OSC OSC 2 15 FG MIN 3 14 REF TH 4 13 H– 3 4 5 6 7 MIN TH Vcc A1H A1L Vcc 5 12 H+ 8 RNF 9 10 11 12 13 14 15 16 A2L A2H CS H+ H– REF FG AL A1H 6 11 CS A1L 7 10 A2H RNF 8 9 A2L Fig.1 Pin configuration Function Ground terminal (signal ground) Oscillating capacitor connecting terminal Minimum output duty setting terminal Output duty controllable input terminal Power supply terminal High side output terminal 1 Low side output terminal 1 Output current detecting resistor connecting terminal (motor ground) Low side output terminal 2 High side output terminal 2 Output current detection terminal Hall + input terminal Hall – input terminal Reference voltage output terminal Speed pulse signal output terminal Lock alarm signal output terminal ●Block diagram 1 2 3 4 GND OSC PWM SOFT SWITCHING TSD OSC PWM COMP TH 6 Vcc 8 SIGNAL OUTPUT FG REF CONTROL LOGIC REF 16 15 14 HALL AMP H– 13 HALL COMP QUICK START LOCK PROTECT A1H H+ 12 Vcl CS PREDRIVER 7 AL PWM COMP MIN Vcc 5 SIGNAL OUTPUT CURRENT LIMIT COMP 11 A2H A1L 10 RNF A2L 9 Fig.2 Block diagram ●I/O truth table Hall input H+ H– H L L H A1H Hi-Z L A1L L Hi-Z Driver output A2H L Hi-Z A2L Hi-Z L FG Hi-Z L H; High, L; Low, Hi-Z; High impedance FG output is open-drain type. Motor state Rotating Locking AL L Hi-Z L; Low, Hi-Z; High impedance AL output is open-drain type. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Electrical characteristics(Unless otherwise specified Ta=25°C, Vcc=12V) Circuit current Hall input hysteresis voltage High side output current High side output leak current Low side output low voltage Lock detection ON time Lock detection OFF time FG output low voltage FG output leak current AL output low voltage AL output leak current OSC high voltage OSC low voltage OSC charge current OSC discharge current Icc Vhys Ioh Iohl Voll Ton Toff Vfgl Ifgl Vall Iall Vosch Voscl Icosc Idosc Min. 5 ±5 5 018 3.6 2.24 0.8 –50 26 Limit Typ. 8 ±10 10 0.30 0.30 6.0 0.15 0.15 2.44 1.0 –32 32 Output ON duty 1 Poh1 75 80 85 % Output ON duty 2 Poh2 45 50 55 % Output ON duty 3 Poh3 15 20 25 % Reference voltage Current limit setting voltage TH input bias current MIN input bias current Vref Vcl Ith Imin 2.8 320 - 3.0 350 - 3.2 380 –0.2 –0.2 V mV µA µA Parameter Symbol Max. 11 ±15 15 10 0.45 0.42 8.4 0.30 10 0.30 10 2.64 1.2 –26 50 Unit mA mV mA µA V s s V µA V µA V V µA µA Ref. data Conditions Voh=12V Voh=34V Iol=600mA Ifg=5mA Vfg=17V Ial=5mA Val=17V Vth=Vref x 0.429 Pull up resistance 1kΩ, OSC=470pF Vth=Vref x 0.573 Pull up resistance 1kΩ, OSC=470pF Vth=Vref x 0.717 Pull up resistance 1kΩ, OSC=470pF Iref=–2mA Vth=0V Vmin=0V Fig.3 Fig.4 Fig.5 Fig.6 Fig.7, 8 Fig.9 Fig.10 Fig.11, 12 Fig.13 Fig.11, 12 Fig.13 Fig.14 Fig.14 Fig.15 Fig.15 - - Fig.16, 17 Fig.18 Fig.19 Fig.20 About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Typical performance curves(Reference data) 10 25°C –40°C 100°C 8 Circuit current: Icc[mA] Hall input hysteresis voltage: Vhys[mV] 20 6 4 2 Operating range 100°C 25°C 10 –40°C 0 Operating range –40°C 25°C 100°C -10 -20 0 0 5 10 15 0 20 5 15 20 Supply voltage: Vcc[V] Supply voltage: Vcc[V] Fig.3 Circuit current Fig.4 Hall input hysteresis voltage 8 High side output leak current: Iohl[uA] 17 High side output current: Ioh[mA] 10 14 25°C –40°C 100°C 11 8 5 Operating range 2 6 4 2 100°C 25°C –40°C 0 Operating range -2 0 5 10 15 20 Supply voltage: Vcc[V] 10 20 30 40 Supply voltage: Voh[V] Fig.5 High side output current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.6 High side output leak current 4/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Typical performance curves(Reference data) 1.0 1.0 5V Low side output low voltage: Vol[V] Low side output low voltage: Vol[V] 100°C 0.8 25°C 0.6 –40°C 0.4 0.2 0.0 17V 0.8 12V 0.6 0.4 0.2 0.0 0.0 0.3 0.6 0.9 1.2 1.5 0.0 0.3 0.6 Output sink current: Io[A] 1.2 1.5 Output sink current: Io[A] Fig.7 Low side output low voltage (Vcc=12V) Fig.8 Low side output low voltage (Ta=25°C) 8.0 0.35 Lock detection OFF time: Toff[s] 0.40 Lock detection ON time: Ton[s] 0.9 100°C –40°C 25°C 0.30 0.25 7.0 100°C –40°C 25°C 6.0 5.0 Operating range Operating range 0.20 4.0 0 5 10 15 20 Supply voltage: Vcc[V] 5 10 15 20 Supply voltage: Vcc[V] Fig.9 Lock detection ON time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.10 Lock detection OFF time 5/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Typical performance curves(Reference data) 0.8 FG/AL output low voltage: Vfgl/Vall[V] FG/AL output low voltage: Vfgl/Vall[V] 0.8 0.6 0.4 100°C 25°C –40°C 0.2 0.0 0.6 0.4 5V 12V 17V 0.2 0.0 0 2 4 6 8 10 0 Output sink current: Ifg/Ial[mA] 4 6 8 10 Output sink current: Ifg/Ial[mA] Fig.11 FG/AL output low voltage (Vcc=12V) Fig.12 FG/AL output low voltage (Ta=25°C) 3.0 OSC high/low voltage: Vosch/Voscl [V] 8 FG/AL output leak current: Ifgl/Iall[uA] 2 6 4 2 100°C 25°C –40°C 0 Operating range -2 100°C 25°C –40°C 2.5 2.0 Operating range 1.5 100°C 25°C –40°C 1.0 0.5 0 5 10 15 20 Supply voltage: Vcc[V] 5 10 15 20 Supply voltage: Vcc[V] Fig.13 FG/AL output leak current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.14 OSC high/low voltage 6/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Typical performance curves(Reference data) 3.2 40 –40°C 25°C 100°C 20 Reference voltage: Vref[V] OSC charge/discharge current: Icosc/Idosc [uA] 60 0 Operating range -20 100°C 25°C –40°C -40 3.1 3.0 100°C 25°C –40°C 2.9 Operating range -60 2.8 0 5 10 15 20 0 5 Supply voltage: Vcc[V] 15 20 Supply voltage: Vcc[V] Fig.15 OSC charge/discharge current Fig.16 Reference voltage 3.2 380 3.1 3.0 100°C 25°C 2.9 –40°C Current limit setting voltage: Vcl[mV] Reference voltage: Vref[V] 10 365 100°C 25°C 350 –40°C 335 Operating range 320 2.8 0 2 4 6 0 8 10 15 20 Supply voltage: Vcc[V] Output source current: Iref[mA] Fig.17 Reference voltage current ability (Vcc=12V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 Fig.18 Current limit setting voltage 7/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Typical performance curves(Reference data) 0.05 0.05 0.00 100°C 25°C –40°C MIN bias current: Imin[uA] TH bias current: Ith[uA] 0.00 -0.05 -0.10 -0.15 100°C 25°C -0.05 –40°C -0.10 -0.15 Operating range Operating range -0.20 -0.20 0 5 10 15 20 Supply voltage: Vcc[V] 5 10 15 20 Supply voltage: Vcc[V] Fig.19 TH bias current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Fig.20 MIN bias current 8/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Application circuit example(Constant values are for reference) Output PWM frequency setting 1 GND PWM SOFT SWITCHING TSD SIGNAL OUTPUT AL SIGNAL OUTPUT FG Protection of FG open-drain 16 Minimum output duty setting 330pF to 1000pF 2 Circuit that converts PWM duty into DC voltage 3 4 PWM OSC MIN PWM COMP TH PWM COMP CONTROL LOGIC Vcc 14 H– 13 7 Maximum output voltage and current are 34V and 1.5A. 8 Hall bias is set according to the amplitude of hall element output and hall input voltage range. H HALL COMP QUICK START LOCK PROTECT H+ 12 Noise measures of substrate Vcl CS A1H PREDRIVER So bypass capacitor, arrangement near to Vcc terminal as much as possible Stabilization of REF voltage 0.1µF to HALL AMP 1µF to 6 SIG 15 0Ω to REF REF Vcc 5 Reverse-connected prevention of the FAN connector OSC CURRENT LIMIT COMP 100pF to 0.1µF 11 200Ω to 20kΩ A2H A1L 10 RNF A2L Low-pass filter for RNF voltage smoothing 9 Drive the PMOS FET gate by constant current flowing to IC ＋ 470Ω to 1kΩ Reverse-connected prevention of the FAN connector So bypass capacitor, arrangement near to FETs as much as possible 1µF to 0Ω to 2kΩ Adjustment the PMOS FET slew rate M 0.24Ω to To limit motor current, the current is detected. Note the power consumption of detection resistance. － Fig.21 PWM controllable 4 wires type (FG) motor application circuit Substrate design note a) Motor power and ground lines are made as fat as possible. b) IC power line is made as fat as possible. c) IC ground line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to (–) land. d) The bypass capacitors (Vcc side and Vm side) are arrangement near to Vcc terminal and FETs, respectively. e) H+ and H– lines are arranged side by side and made from the hall element to IC as shorter as possible, because it is easy for the noise to influence the hall lines. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Power dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.22 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja = (Tj – Ta) / P [°C/W] Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value measured at a specified condition. Fig.23 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board 70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance θjc from IC chip joint part to the package surface part of mounting the above-mentioned same substrate is shown in the following as a reference value. θjc = 43 [°C/W] (reference value) Pd[mW] θja = (Tj – Ta) / P [°C/W] θjc = (Tj – Tc) / P [°C/W] 812.5 750 θja=153.8 [°C/W] Ambient temperature Ta[°C] Package surface temperature Tc[°C] 500 250 0 25 50 75 100 125 150 Ta[°C] ＊Reduce by 6.5mW/°C over 25°C (On 70.0mm x 70.0mm x 1.6mm glass epoxy board) Chip surface temperature Tj[°C] Power consumption P[W] Fig.22 Thermal resistance Fig.23 Thermal de-rating curve ●I/O equivalence circuit(Resistance values are typical) 1) Power supply terminal, and Ground terminal 2) Hall input terminals, 3) Minimum output duty setting Output duty controllable input terminal terminal, and Output current detection terminal Vcc 4) High side output 1, 2 terminals, Speed pulse signal output terminal, and Lock alarm signal output terminal Vcc Vcc MIN H+ H– TH CS 1kΩ 30Ω 1kΩ 20Ω A1H A2H FG AL GND 5) Low side output 1, 2 terminals, and Output current detecting resistor connecting terminal 6) Reference voltage output terminal A1L A2L Vcc Vcc Vcc Vcc REF RNF 1kΩ 31kΩ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7) Oscillating capacitor connecting terminal 1kΩ OSC 10/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Operational Notes 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (When applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) GND potential It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. 9) Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 11) GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 12) Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100µF. 13) IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. 14) In use We are sure that the example of application circuit is preferable, but please check the character further more in application to a part that requires high precision. In using the unit with external circuit constant changed, consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining. ●Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet BD6722FS ●Physical dimension tape and reel information SSOP-A16 6.6 ± 0.2 (MAX 6.95 include BURR) Tape Embossed carrier tape Quantity 2500pcs 9 Direction of feed 0.3MIN 4.4±0.2 6.2±0.3 16 15 14 13 12 11 10 1 2 3 4 6 5 7 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 8 0.11 1.5±0.1 0.15 ± 0.1 0.1 0.8 0.36 ± 0.1 Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking diagram SSOP-A16 (TOP VIEW) B D 6 7 2 2 F Part Number LOT Number 1PIN Mark ●Revision history Date Revision 07.JUL.2012 28.JUL.2012 001 002 Comments New Release Color appearance change (There is no change in the content.) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/12 TSZ02201-0H1H0B100180-1-2 28.JUL.2012 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. 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