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BD6941FM-E2

BD6941FM-E2

  • 厂商:

    ROHM(罗姆)

  • 封装:

    SOP36

  • 描述:

    IC MOTOR DRIVER 8V-16V 36HSOP

  • 数据手册
  • 价格&库存
BD6941FM-E2 数据手册
Power Management IC Series for Automotive Body Control Motor Driver No.09039EAT02 BD6941FM ●Description BD6941FM is the reversible motor driver for output 1.25A (1Motor), and can control a DC motor in four modes (Forward, Reverse, Standby, Brake) corresponding to two control logic inputs. ●Features 1) 1ch DMOS H bridge output 2) Four output states ( Forward,Reverse,Standby,Brake ) by two control logic 3) Built-in surge-absorbing diodes 4) Low standby current 5) Output overcurrent protection with timer. 6) Over voltage detection switch off 7) TSD detects junction temperature and circuitry switches off the outputs at high temperature. 8) Built-in protection monitor pin (PO) ●Applications Onboard devices(Vehicle equipment etc) ●Absolute Maximum Ratings(Ta=25℃) PARAMETER SUPPLY VOLTAGE INPUT VOLTAGE SYMBOL LIMIT UNIT Vcc 50 V VINP, VINN -0.3~20 V OUTPUT CURRENT IO 1.25 (*1) A POWER DISSIPATION Pd 2.8 (*2) W OPERATING TEMPERATURE Topr -40~105 ℃ STORAGE TEMPERATURE Tstg -55~150 ℃ JUNCTION TEMPERATURE Tjmax 150 ℃ *1 Not to exceed Pd and ASO. *2 Mounted on a glass epoxy PCB (70mm×70mm×1.6mm). To use at temperature above Ta=25℃ reduce 22.4mW/℃. ●Operating Range PARAMETER SUPPLY VOLTAGE www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. SYMBOL LIMIT UNIT Vcc 8.0~16.0 V 1/8 2009.06 - Rev.A Technical Note BD6941FM ●Electrical Characteristics(Unless otherwise specified, Vcc=8V~16V, Ta=-40℃~105℃) LIMIT PARAMETER SYMBOL UNIT CONDITIONS MIN. TYP. MAX Circuit current 1 Icc1 0 10 μA Standby mode Circuit current 2 Icc2 3 8 mA Forward or reverse mode Circuit current 3 Icc3 3 8 mA Brake mode Input Voltage “H” level VIH 3.0 V Input Voltage “L” level VIL 1.0 V “H” level input current IIH 50 100 μA VIN=5.0V, flowing in current “L” level input current IIL 0 10 μA VIN=0V, flowing out current Output on voltage 1 VON1 0.84 1.5 V Vcc=12V, Iout =0.5A, total drop Vcc=8~16V, Iout=0.5A, Output on voltage 2 VON2 1.7 V total drop Output leakage current “H” ILH 0 10 μA VOUT=0V Output leakage current “L” ILL 0 10 μA VOUT=Vcc Upper free-wheeling VFH 0.3 1.0 1.5 V IF=0.6A diode forward voltage Lower free-wheeling VFL 0.3 1.0 1.5 V IF=0.6A diode forward voltage Protection monitor voltage VLPO 0.6 V IPO=3mA Protection monitor ILPO 0 10 μA VPO=Vcc leakage current Over current protection switch IOCP 1.5 3.5 A on current Over Voltage Lockout VOVP 25 30 35 V lockout switch on voltage ●Heat Reduction Curve Pd(W) 3.0 2.8 2.0 1.0 0 50 100 105 75 125 150 Ta(℃) Mounted on a glass epoxy PCB (70mm×70mm×1.6mm) To use at temperature above Ta=25℃ reduce 22.4mW/℃. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/8 2009.06 - Rev.A Technical Note BD6941FM ●Reference Data 8 6 150 15 4 Ta=-40℃ 10 IIN [ μA] Ta=25℃ Ta=105℃ Ta=105℃ Ta=105℃ VOUT [V] Icc[ mA] 200 20 Ta=25℃ Ta=25℃ 100 Ta=-40℃ Ta=-40℃ 50 5 2 0 0 0 8 10 12 14 0 16 1 2 3 0 4 4 8 12 16 Vcc[V] VIN[V] VIN [V] Fig.1 Circuit current (Forward・Reverse・Brake) Fig.2 Input voltage vs. Output voltage Fig.3 Input H current 1.2 3 1.2 Ta=105℃ 2.5 Ta=25℃ 0.9 0.9 Ta=105℃ 1.5 Ta=-40℃ Ta=105℃ V FL[V ] V FH [V ] V ON [V ] 2 Ta=25℃ Ta=-40℃ 0.6 0.6 Ta=25℃ Ta=-40℃ 1 0.3 0.3 0.5 0.0 0 0 0.4 0.8 1.2 0.0 0.0 1.6 0.4 1.2 1.6 0.0 Fig.4 Output on voltage(Vcc=12V) 35 Iocp[A] 0.08 Ta=-40℃ VOV[V] 3 Ta=25℃ 2 1 0.04 3 -40 4 -10 29 20 50 25 -40 80 Fig.9 Over Voltage Lockout 15 300 15 VOUT[V] 20 TOFF[μs] TON[μs] lockout switch on voltage 400 200 0 0 -40 0 40 80 Ta[℃] Fig.10 Over current protection monitor on time www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 10 5 100 0 80 Fig.8 Over current protection 20 5 40 Ta[℃] switch on current 10 0 Ta[℃] IPO[mA] Fig.7 Protection monitor voltage 31 27 0 0 2 1.6 33 Ta=105℃ 1 1.2 Fig.6 Upper free-wheeling diode forward voltage L 4 0 0.8 IOUT[A ] Fig.5 Upper free-wheeling diode forward voltage H 0.16 0.12 0.4 IOUT[A ] IOUT[A ] VPO[V] 0.8 -40 0 40 80 Ta[℃] Fig.11 Over current protection monitor off time 3/8 0 50 100 150 200 Ta[℃] Fig.12 TSD temperature 2009.06 - Rev.A Technical Note BD6941FM ●Block Diagram ●Terminal Function Table M PIN No. Terminal Name Function 1-6 N.C. N.C. 7 SGND Signal GND Pin 8 MN Motor Output Pin 9 MN Motor Output Pin 31 PGND FIN FIN FIN 30 PGND 10 Vcc Power Supply Pin 11 Vcc Power Supply Pin 12-16 N.C. N.C. 17 SGND Signal GND Pin 18 PO N.C. 1 36 N.C. N.C. 2 35 N.C. N.C. 3 34 N.C. 33 N.C. N.C. 4 OVER N.C. 5 VOLTAGE N.C. 6 PROTECTION 32 N.C. SGND 7 MN 8 29 OVER MN 9 MP 28 MP CURRENT PROTECTION Vcc 10 CONTROL Vcc 11 N.C. 12 27 N.C. 26 N.C.. LOGIC TSD 25 N.C. N.C. 13 24 N.C. N.C. 14 23 N.C. N.C. 15 PROTECTION N.C. 16 MONITOR 22 N.C. 21 SGND SGND 17 PO 20 18 19 INN INP Protection Monitor Pin(Open drain) 19 INP Logic Input Pin 20 INN Logic Input Pin 21 SGND Signal GND Pin 22-27 N.C. N.C. FIN FIN FIN 28 MP Motor Output Pin 29 MP Motor Output Pin 30 PGND Power GND Pin 31 PGND Power GND Pin 32-36 N.C. N.C. ●Package Max 18.75 (include BURR) BD6941FM 1 PIN mark Lot No. HSOP-M36(Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/8 2009.06 - Rev.A Technical Note BD6941FM ●Signal Table Input/Output Truth Table IN OUT MODE INP INN MP MN H H L L BRAKE H L H L FORWARD L H L H REVERSE L L Open Open STANDBY Output Condition IN OUT PO INP INN MODE H H BRAKE LOAD NORMAL H L *2 SHORT H/L FORWARD/ NORMAL REVERSE SHORT STANDBY - H L/H L L L *2 H *2 refer to timing chart ●PO Output Timing Chart normal over current detection normal IOCP Output current 0 Active MP/MN Open PO TOFF TON ≒ 10μsec TON TOFF ≒ 290μsec www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/8 2009.06 - Rev.A Technical Note BD6941FM ●I/O Circuit Diagram 1) INP, INN 2) Vcc PO Vcc INP PO INN 100K SGND 3) SGND MP, MN Vcc MP, MN PGND ●Operating Notes 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measuresuch as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) GND potential Ensure a minimum GND pin potential in all operating conditions. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin short and mistake mounting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC.Shorts between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. Ensure a minimum GND pin potential in all operating conditions. 5) Actions in strong magnetic field Keep in mind that the IC may malfunction in strong magnetic fields. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/8 2009.06 - Rev.A Technical Note BD6941FM 7) IC terminal input voltage This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when the resistors and transistors are connected to the pins as shown in the following figure, The P/N junction functions as a parasitic diode when GND > Pin A for the resistor or GND > Pin B for the transistor(NPN). Similarly, when GND > Pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of other adjacent elements to operate as a parasitic NPN transistor. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage to input pins. Transistor (NPN) (Pin A) Resistor B (Pin B) C (Pin B) E B C N P P+ P+ N N P P P+ N N Parasitic elements GND P+ N Parasitic elements or N P substrate (Pin A) GND GND Parasitic elements or Transistors Parasitic elements 8) Input terminals Do not apply the voltage to input pin when the Vcc is not applied. And when the Vcc is applied, the voltage of input pin must not exceed Vcc. It is feared that output get malfunction, as input voltage is sweeped slowly near the H, L threshold voltage. Please pay attention to input slew rate. 9) Back electro motive force (BEMF) There is a possibility that the BEMF is changed by use of the operating condition, environment and the individual characteristics of motor. Please make sure there is no problem of operating the IC although the BEMF is occurred. 10) The note of pattern design at printed circuit This IC flows large current between power supply for motor division and GND. So, it is feared that get undesirable result malfunction, oscillation and so on, as input lines is affected by large output current. Please consider pattern design at printed circuit doesn’t have common impedance on output large current lines-input lines. Please consider to keep low impedance of power supply for fear of oscillation from power supply high impedance, also. 11) Rash current This IC doesn’t have current limit circuit for rash current. Therefore physical security countermeasure, like current limit resistor is to be given. 12) Thermal shutdown circuit This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits , the attendant rise in the junction temperature (Tj) will trigger the TSD circuit to turn off all output power elements. The circuit automatically resets once the junction temperature (Tj) drops. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit. 13) Over voltage lock out function This IC has the function of turning off the output when detecting the over voltage. More than 30V(typ.) triggers this function. But in the standby mode, this function does not work. Although this IC has over voltage lockout function, the voltage that exceeds absolute maximum ratings might destroy the IC. Please do not exceed the absolute maximum ratings. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/8 2009.06 - Rev.A Technical Note BD6941FM 14)Over current protection This IC has the function of turning off the output when detecting the over current. More than 2.25A(typ.) triggers this function. When detecting the over current for 10μsec(typ.), this function turns off the output(output terminals become Hi-impedance) for 290μsec(typ.). After the period of turning off time (290μsec) , the output current recovers. But if the over current is still detected, this function will work again.This function is for protecting IC because of the output short etc. but the continuing detection of over current might cause the extreme heat and damage the IC. It is recommended to change the IC’s state to standby mode by the application. And please pay attention to the power dissipation. ●Ordering part number B D 6 Part No. 9 4 1 F Part No. M - E Package FM : HSOP-M36 2 Packaging and forming specification E2: Embossed tape and reel HSOP-M36 18.5±0.1 (MAX 18.75 include BURR) +6 4 –4 2.77±0.1 0.1 ± 0.05 2.2 ± 0.05 9 Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 18 10 +0.05 0.37 –0.04 1500pcs 19 +0.055 0.27 –0.045 1PIN MARK 0.8 Embossed carrier tape (with dry pack) Quantity 1.2 ± 0.2 27 0.5 ± 0.15 1 0.85 2.4MAX 28 7.5 ± 0.1 9.9 ± 0.2 36 Tape 0.08 S 0.08 M 1pin Reel (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.06 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001
BD6941FM-E2 价格&库存

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BD6941FM-E2
    •  国内价格 香港价格
    • 1+13.626561+1.64836
    • 10+13.2539010+1.60328
    • 50+13.0027550+1.57290
    • 100+12.75971100+1.54350
    • 500+12.69490500+1.53566
    • 1000+12.670601000+1.53272

    库存:50