BD7931F-E2

Datasheet 0.5 Amp or Less Reversible Motor Drivers (Single Motor) BH6578FVM BD7931F General Description Key Specifications  The BH6578FVM and BD7931F are reversible motor drivers with a wide output dynamic range, with power MOS used for the output transistor. The motor drivers can be set to four output modes 1) forward (normal) rotation, 2) reverse rotation, 3) stop (idling or OFF) and 4) brake using 2 logic inputs.    Features    Wide dynamic range loading driver with MOS output, RON = 1.0Ω (Top + Bottom) With loading driver voltage setting terminal Built-in Thermal Shutdown Circuit (TSD) Supply Voltage Range: BH6578FVM BD7931F Standby Current: BH6578FVM BD7931F ON-Resistance(Top + Bottom): Operating Temperature Range: BH6578FVM BD7931F Packages 0.4mA (Typ) 0µA (Typ) 1.0Ω (Typ) -35°C to +85°C -40°C to +85°C W(Typ) x D(Typ) x H(Max) fo r Applications 4.5V to 5.5V 4.5V to 14V R N eco ew m D me es n ig de ns d Tray loading of CD/DVD, applications using DC motors MSOP8 (BH6578FVM) 2.90mm x 4.00mm x 0.90mm N ot SOP8 (BD7931F) 5.00mm x 6.20mm x 1.71mm Typical Application Circuit, Block Diagram, Pin Configuration and Pin Descriptions BH6578FVM, BD7931F (in common) TOP VIEW FWD IN LDCONT PREGND REV IN Pin No. 8 F 6 7 5 PRE GND R Control Logic LDCONT + TSD POW CMOS H-Bridge POW GND 1 2 3 Pin Name Function 1 VCC Supply voltage 2 OUT+ FWD output 3 OUT- REV output 4 GND Power ground 5 GND_S Signal ground 6 LDCONT 7 INREV REV input 8 INFWD FWD input Loading driver voltage setting pin 4 M VCC 0.1μF Bypass capacitor POWGND ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Supply Voltage Power Dissipation Rating BH6578FVM BD7931F VCC 7 15 Pd (Note 1) 0.55 V (Note 2) W -40 to +85 °C 0.69 Operating Temperature Topr Storage Temperature Tstg -55 to +150 °C IOUT 500 mA Tjmax 150 °C Output Current Junction Temperature -35 to +85 Unit (Note 1) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. When used at Ta=25°C or higher, derated at 4.4 mW/°C. (Note 2) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. When used at Ta=25°C or higher, derated at 5.5 mW/°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions BH6578FVM Parameter Symbol Supply Voltage V CC BD7931F Min Typ Max Min Typ Max 4.5 5 5.5 4.5 8 14 単位 V Truth Table BH6578FVM, BD7931F INPUT OUTPUT INFWD INREV OUT+ OUT- L L Hi-Z Hi-Z Function High Impedance L H L H REV mode H L H L FWD mode H H L L Brake mode Hi-Z : Hi-impedance www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Electrical Characteristics BH6578FVM (Unless otherwise specified, Ta=25°C, VCC=5V) Parameter Symbol Limit Unit Conditions Min Typ Max ICC - 0.4 0.8 mA No load Output Offset Voltage VOFSL -15 0 +15 mV Brake mode Input Voltage H Level VIH 2.0 － VCC V Input Voltage L Level VIL GND － 0.5 V ON-Resistance RON － 1.0 1.8 Ω Voltage Gain GVLD 4.5 6.0 7.5 dB ΔGVLD -2.0 0 +2.0 dB Input Bias Current IINL － 86 120 µA VFIN=5V,VRIN=5V LDCONT Bias Current ILDC － － 300 nA VCONT=2V Standby Current (Loading Driver) Voltage Gain Difference IOUT=500mA,Top + Bottom (Note 1) (Note 1) Let VO1 denote output-to-output voltage when VCONT=1V and VO2 denote output-to-output Voltage when VCONT=3.5V, voltage gain can be expressed by the following equation: GVLD=20log| (VO2-VO1)/2.5| BD7931F (Unless otherwise specified, Ta=25°C, VCC=8V) Parameter Symbol Limit Min Typ Max Unit Conditions Standby Current ICC1 - 0 5 µA Supply Current 1 ICC2 - 1.1 2.2 mA VFIN=5V,VRIN=0V Supply Current 2 ICC3 - 0.8 1.6 mA VFIN=VRIN=5V Output Offset Voltage VOFSL -35 0 +35 mV Brake mode Input Voltage H Level VIH 2.0 － VCC V Input Voltage L Level VIL GND － 0.5 V ON-Resistance RON － 1.0 1.8 Ω Voltage Gain GVLD 4.0 6.0 8.0 dB (Loading Driver) IOUT=500mA,Top+Bottom (Note 2) ΔGVLD -2.0 0 +2.0 dB Input Bias Current IINL － 165 250 µA VFIN=5V,VRIN=5V LDCONT Bias Current ILDC － － 300 nA VCONT=5V Voltage Gain Difference (Note 2) Let VO1 denote output-to-output voltage when VCONT=1V and VO2 denote output-to-output voltage when VCONT=3.5V, voltage gain can be expressed by the following equation: GVLD=20log|(VO2-VO1)/2.5| www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Typical Performance Curves 0.4 85°C 25°C -35°C Output Loss Voltage L [V] Output Loss Voltage L [V] 0.4 0.3 0.2 0.1 0.0 85°C 25°C -35°C 0.3 0.2 0.1 0.0 0 100 200 300 400 500 0 100 300 400 500 Load Current [mA] Load Current [mA] Figure 2. Output Loss Voltage L vs Load Current (BH6578FVM) VCC=5V, LDCONT=OPEN REV Mode Figure 1. Output Loss Voltage L vs Load Current (BH6578FVM) VCC=5V, LDCONT=OPEN FWD Mode 5 Output Loss Voltage H [V] 0.0 4 Output Voltage [V] 200 3 2 -35°C 25°C 85°C 1 0 -0.1 -0.2 -35°C 25°C 85°C -0.3 -0.4 0 1 2 3 4 5 0 LDCONT [V] Figure 3. Output Voltage vs Input Voltage (Voltage Gain (BH6578FVM)) VCC=5V, LDCONT=SWEEP RL=8Ω+47µH www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 200 300 400 Load Current [mA] 500 Figure 4. Output Voltage H vs Load Current (BH6578FVM) VCC=5V, LDCONT=OPEN FWD Mode 4/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Typical Performance Curves – continued 0 85℃ 25℃ -35℃ -1 -0.1 Output Voltage [V] Output Loss Voltage H [V] 0.0 -0.2 -35℃ 25℃ 85℃ -0.3 -2 -3 -4 -0.4 -5 0 100 200 300 400 500 0 1 2 3 LDCONT [V] Load Current [mA] Figure 5. Output Loss Voltage H vs Load Current (BH6578FVM) VCC=5V, LDCONT=OPEN REV Mode REV mode 5 Figure 6. Output Voltage vs Input Voltage (Voltage Gain (BH6578FVM)) VCC=5V, LDCONT=SWEEP RL=8Ω +47µH 0.4 0.4 85℃ 25℃ -40℃ Output Loss Voltage L [V] Output Loss Voltage L [V] 4 0.3 0.2 0.1 85℃ 25℃ -40℃ 0.3 0.2 0.1 0.0 0.0 0 100 200 300 400 0 500 200 300 400 500 Load Current [mA] Load Current [mA] Figure 7. Output Loss Voltage L vs Load Current (BD7931F) VCC=8V, LDCONT=OPEN FWD Mode www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 Figure 8. Output Loss Voltage L vs Load Current (BD7931F) VCC=8V, LDCONT=OPEN REV Mode 5/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Typical Performance Curves – continued 0.0 Output Loss Voltage H [V] Output Voltage [V] 10 8 -40℃ 25℃ 85℃ 6 4 2 0 -0.1 -0.2 -40°C 25°C 85°C -0.3 -0.4 0 1 2 3 4 5 0 100 LDCONT [V] 300 400 500 Load Current [mA] Figure 9. Output Voltage vs Input Voltage (Voltage Gain (BD7931F)) VCC=8V, LDCONT=SWEEP RL=20Ω +47µH Figure 10. Output Loss Voltage H vs Load Current (BD7931F) VCC=8V, LDCONT=OPEN FWD Mode 0 0.0 85°C 25°C -40°C -2 -0.1 Output Voltage [V] Output Loss Voltage H [V] 200 -0.2 -0.3 -40℃ 25℃ 85℃ -4 -6 -8 -10 -0.4 0 100 200 300 400 0 500 2 3 4 5 LDCONT [V] Load Current [mA] Figure 11. Output Loss Voltage H vs Load Current (BD7931F) VCC=8V, LDCONT=OPEN REV Mode www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 Figure 12. Output Voltage vs Input Voltage (Voltage Gain (BD7931F)) VCC=8V, LDCONT=SWEEP RL=20Ω +47µH 6/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Power Dissipation BH6578FVM BD7931F 0.8 Power Dissipation : Pd [W] Power Dissipation : Pd [W] 0.8 0.6 0.4 0.2 0 0 25 75 85 100 125 150 50 Ambient Temperature : Ta [°C] 175 0.6 0.4 0.2 0 0 25 75 85 100 50 125 150 175 Ambient Temperature : Ta [°C] (Note) When 70 mm x 70 mm x 1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. I/O Equivalent Circuits BH6578FVM BD7931F LDCONT LDCONT VCC 10KΩ 10KΩ 6 6 39KΩ OUT+/OUT- 49.6KΩ OUT+/OUT- INFWD/INREV VCC VCC INFWD/INREV VCC VCC VCC 200KΩ 200KΩ 7 2 3 8 7 50KΩ 2 3 8 50KΩ 50KΩ 50KΩ 50KΩ 50KΩ Control and Operation 1. OUTPUT MODE CONTROL AND OPERATION Control and operation of each output mode is described as follows: When INFWD is “HIGH” and INREV is “LOW”, the output is at normal rotation mode. In normal rotation mode, current flows from OUT+ to OUT-. When both INFWD and INREV are “HIGH”, the output is at brake mode. In brake mode, the top-side transistor is OFF to stop the supply of motor drive current while the bottom-side transistor is ON to absorb the reverse EMF of motor and apply brake to the motor. When both INFWD and INREV are “LOW”, OUT+ and OUTbecome high-impedance and the motor stops. 2. OUTPUT VOLTAGE CONTROL Controlling the output voltage can vary the voltage applied to the motor and thus control motor speed. The output HIGH voltage can be controlled (gain 6dB Typ), using the voltage applied to the CONT terminal. The output voltage never exceeds the power supply voltage even if the voltage applied to CONT terminal exceeds (VCC Max). www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 13. Example of monolithic IC structure 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. BH6578FVM, BD7931F TSD ON temperature [°C] (typ) 175 Hysteresis temperature [°C] (typ) 25 15. Capacitor Across Output and GND In the event a large capacitor is connected across output and GND, when VCC and IN are short-circuited with 0V or GND for some reason, the charge stored in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 0.1 µF between output and GND. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Ordering Information B H 6 5 7 8 D V M Package FVM : MSOP8 Part number B F 7 9 3 1 Part number F - Package F : SOP8 - TR Packaging and forming specification TR: Embossed tape and reel E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams MSOP8 (TOP VIEW) SOP8 (TOP VIEW) Part Number Marking H 7 6 Part Number Marking 5 8 7 LOT Number 1PIN MARK www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9 3 1 LOT Number 1PIN MARK 10/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Physical Dimension, Tape and Reel Information MSOP8 N ot R e N co ew m m D e es n d ig e ns d fo r Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Physical Dimension, Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 BH6578FVM BD7931F Revision History Date Revision 04.Nov.2015 001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/13 TSZ02201-0H5H0BK01500-1-2 04.Nov.2015 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001