Datasheet
Single-Output LDO Regulators
35V Voltage Resistance
1A LDO Regulators
BDxxC0A-C series
BDxxC0AW-C series
General Description
The BDxxC0A-C series and the BDxxC0AW-C series are
low-saturation regulators. This series feature variable and
fixed voltage output with selectable Shutdown switch
(referred to as SW); Vout-3.3V, 5.0V, 8.0V and 9.0V.Five
conventional PKGs; TO252-3/5, HRP5 and TO263-3(F)/5
are available. This series has a built-in over-current
protection circuit that prevents the destruction of the IC due
to output short circuits and a thermal Shutdown circuit that
protects the IC from thermal damage due to overloading.
Packages
Features
1) Output current capability: 1A
2) Output voltage: Variable, 3.3V, 5.0V, 8.0V and 9.0V
3) High output voltage accuracy
(Ta=25°C, TO252-3/5, HRP5): ±1%
4) Low saturation with PDMOS output
5) Built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits
6) Built-in thermal Shutdown circuit for protecting the IC
from thermal damage due to overloading
7) Low ESR Capacitor
8) TO252-3/5, HRP5, TO263-3(F)/5 package
9) AEC-Q100 Qualified (Note 1)
(Note 1: Grade 1)
Key Specifications
・Supply Voltage(Vo ≥ 3.0V):
Vo+1.0V to 26.5V
・Supply Voltage(Vo < 3.0V):
4.0V to 26.5V
・Output Voltage(BD00C0AW):
1.0V to 15.0V
・Output Current:
1A
・Output Voltage Precision
(Ta=25°C): ±1% (TO252-3/5, HRP5)
(-40°C ≤ Ta ≤ +125°C):
±3%
・Operating Temperature Range: -40°C ≤ Ta ≤ +125°C
W(Typ) x D(Typ) x H(Max)
TO252-5
6.50mm x 9.50mm x 2.50mm
TO252-3
6.50mm x 9.50mm x 2.50mm
HRP5
9.395mm x 10.540mm x 2.005mm
TO263-5
10.16mm x 15.10mm x 4.70mm
TO263-3(F)
10.16mm x 15.10mm x 4.70mm
Applications
Automotive
(body, audio system, navigation system, etc.)
Ordering part number
B
D
x
Output voltage
00: Variable
33: 3.3V
50: 5.0V
80: 8.0V
90: 9.0V
x
C
0
Current
capacity
C0A: 1A
○Product structure：Silicon monolithic integrated circuit
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TSZ22111・14・001
A
W
SW
W: With SW
None: Without SW
x
x
x
Package
FP: TO252-3/5
HFP: HRP5
FP2: TO263-3(F)/5
-
C
x
x
Packaging and forming specification
E2: Embossed tape and reel
(TO252-3/5, TO263-3(F)/5)
TR: Embossed tape and reel
(HRP5)
○This product is not designed protection against radioactive rays.
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BDxxC0A-C series
BDxxC0AW-C series
Lineup
Articles
Variable
3.3
5.0
8.0
9.0
Package
BDxxC0AWFP-CE2
○
○
○
○
○
TO252-5
Reel of 2000
BDxxC0AFP-CE2
-
○
○
○
○
TO252-3
Reel of 2000
BDxxC0AWHFP-CTR
○
○
○
○
○
HRP5
Reel of 2000
BDxxC0AHFP-CTR
-
○
○
○
○
HRP5
Reel of 2000
BDxxC0AWFP2-CE2
○
○
○
○
○
TO263-5
Reel of 500
BDxxC0AFP2-CE2
-
○
○
○
○
TO263-3(F)
Reel of 500
Typical Application Circuits
〈Output Voltage Variable Type (With SW)〉
Vcc
Vo
R2
Vcc
Cin
CTL
Cout
ADJ
GND
R1
Figure 1. Typical Application Circuit
Output Voltage Variable Type (With SW)
〈Output Voltage Fixation Type (With SW)〉
Vcc
Vcc
Vo
CTL
N.C.
Cin
Cout
GND
Figure 2. Typical Application Circuit
Output Voltage Fixation Type (With SW)
〈Output Voltage Fixation Type (Without SW)〉
Vcc
Vcc
Vo
Cin
Cout
GND
Figure 3. Typical Application Circuit
Output Voltage Fixation Type (Without SW)
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Pin Configurations/Pin Descriptions
〈With SW (TO252-5/HRP5/TO263-5)〉
TO252-5
(TOP VIEW)
TO263-5
(TOP VIEW)
HRP5
(TOP VIEW)
FIN
FIN
1 2
1 2
3 4 5
3
4 5
1 2 3 4 5
HRP5
TO252-5
TO263-5
Figure 4. Pin Configurations (With SW)
Pin No.
Pin Name
Function
1
CTL
Output Control Pin
2
Vcc
Power Supply Pin
3
N.C. (Note 1)
GND
N.C. Pin (TO252-5)
GND (HRP5/TO263-5)
4
Vo
Output Pin
5
ADJ
N.C. (Note 1)
Variable Pin (BD00C0AW)
N.C. Pin (BD33/50/80/90C0AW)
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
〈Without SW (TO252-3/TO263-3(F))〉
TO263-3(F)
(TOP VIEW)
TO252-3
(TOP VIEW)
FIN
1
2
3
1 2 3
TO263-3(F)
TO252-3
Figure 5. Pin Descriptions (Without SW)
Pin No.
Pin Name
Function
1
Vcc
Power Supply Pin
2
N.C. (Note 1)
GND
N.C. Pin (TO252-3)
GND (TO263-3(F))
3
Vo
Output Pin
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
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BDxxC0A-C series
BDxxC0AW-C series
〈Without SW (HRP5)〉
HRP5
(TOP VIEW)
FIN
1 2
3
4 5
HRP5
Figure 6. Pin Descriptions (Without SW) (HRP5)
Pin No.
Pin Name
Function
1
Vcc
Power Supply Pin
2
N.C.
(Note 1)
N.C. Pin
3
GND
GND
4
N.C.
N.C. Pin
5
Vo
Output Pin
FIN
GND
GND
(Note 1) N.C.Pin can be open. Because it isn't connect it inside of IC.
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Block Diagrams
〈BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW) 〉
■TO252-5/HRP5/TO263-5
FIN
GND
VREF
OCP
TSD
Driver
:Bandgap Reference
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
CTL
Vcc
3
N.C.(TO252-5）
GND(HRP5/TO263-5）
4
5
Vo
ADJ
Figure 7. Block diagram
BD00C0AWFP/WHFP/WFP2-C (Output Voltage Variable Type, With SW)
〈BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW) 〉
■TO252-5/HRP5/TO263-5
FIN
GND
VREF
OCP
TSD
Driver
:Bandgap Reference
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
CTL
Vcc
3
N.C.(TO252-5）
GND(HRP5/TO263-5)
4
5
Vo
N.C.
Figure 8. Block diagram
BDxxC0AWFP/WHFP/WFP2-C (Output Voltage Fixation Type, With SW)
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
〈BDxxC0AFP/HFP/FP2-C (Output Voltage Fixation Type, Without SW) 〉
■TO252-3/TO263-3(F)
FIN
GND
VREF
OCP
TSD
Driver
VREF
:Bandgap Reference
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
Driver
OCP
TSD
1
2
Vcc
3
Vo
N.C.(TO252-3）
GND(TO263-3(F)）
Figure 9. Block diagram
BDxxC0AFP/FP2-C (Output Voltage Fixation Type, Without SW)
■HRP5
FIN
GND
VREF
OCP
TSD
Driver
:Bandgap Reference
:Over Current Protection Circuit
:Thermal Shut Down Circuit
:Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
3
4
5
Vcc
N.C.
GND
N.C.
Vo
Figure 10. Block diagram
BDxxC0AHFP-C (Output Voltage Fixation Type, Without SW)
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BDxxC0A-C series
BDxxC0AW-C series
Absolute Maximum Ratings (Ta= 25°C)
Parameter
Symbol
Supply Voltage (Note 1)
Vcc
Output Control Voltage (With SW) (Note 2) VCTL
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
Maximum Junction Temperature
Tjmax
Ratings
-0.3 to +35.0
-0.3 to +35.0
-40 to +125
-55 to +150
150
Unit
V
V
°C
°C
°C
(Note 1) Do not exceed Pd (Please refer to Power Dissipation in P.27-29).
(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within
the range of the operation power-supply voltage ahead.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage
can either be a short circuit between pins or an open circuit between pins and the internal circuitry.
Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (-40°C ≤ Ta ≤ +125°C)
Parameter
Symbol
Min
Supply Voltage (Vo ≥ 3.0V)
Vcc
Vo+1
Supply Voltage (Vo < 3.0V)
Vcc
4.0
Startup Voltage (Io=0mA)
Vcc
Output Control Voltage (With SW)
VCTL
0
Output Current
Io
0
Output Voltage (BD00C0AW) (Note 1)
Vo
1.0
Max.
26.5
26.5
3.8
26.5
1.0
15.0
Unit
V
V
V
V
A
V
(Note 1) Please refer to Notes15 for use when you use BD00C0AW by output voltage 1.0V ≤ Vo < 3.0V.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
136
23
°C/W
ΨJT
17
3
°C/W
θJA
120
22
°C/W
ΨJT
8
3
°C/W
θJA
81
21
°C/W
ΨJT
8
2
°C/W
TO252-3, TO252-5
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
HRP5
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
TO263-3(F), TO263-5
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1)Based on JESD51-2A (Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Thermal Via(Note 5)
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Electrical Characteristics
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, Io=0mA, VCTL=5.0V (With SW)
The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ (BD00C0AW)
Guaranteed Limit
Parameter
Symbol
Unit
Min.
Typ.
Max.
Conditions
Shutdown Current (With SW)
Isd
-
0
5
µA
Circuit Current
ADJ Terminal Voltage
(BD00C0AWFP/WHFP)
ADJ Terminal Voltage (BD00C0AW)
Output Voltage
(BD33/50C0A(W9FP/(W)HFP)
Output Voltage (BD33/50C0A(W))
Output Voltage
(BD80/90C0A(W)FP/(W)HFP)
Output Voltage (BD80/90C0A(W))
Dropout Voltage
(BD00/50/80/90C0A(W))
Ib
-
0.5
2.5
mA
VADJ
0.742
0.750
0.758
V
Io=50mA, Ta=25°C
VADJ
0.727
0.750
0.773
V
Io=50mA
Vo
Vo×0.99
Vo
Vo×1.01
V
Io=200mA, Ta=25°C
Vo
Vo×0.97
Vo
Vo×1.03
V
Io=200mA
Vo
Vo×0.99
Vo
Vo×1.01
V
Io=500mA, Ta=25°C
Vo
Vo×0.97
Vo
Vo×1.03
V
Io=500mA
ΔVd
-
0.3
0.5
V
Vcc=Vo×0.95,Io=500mA
Ripple Rejection (BD00/33/50C0A(W))
R.R.
45
55
-
dB
Ripple Rejection (BD80/90C0A(W))
R.R.
40
50
-
dB
Line Regulation
Reg.I
-
Reg.L
-
CTL ON Mode Voltage (With SW)
VthH
2.0
80
Vo
×0.020
－
mV
Load Regulation
20
Vo
×0.010
－
CTL OFF Mode Voltage (With SW)
VthL
－
－
0.8
CTL Bias Current (With SW)
ICTL
－
25
50
μA
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VCTL=0V
f=120Hz,
Input Voltage Ripple =1Vms,
Io=100mA
f=120Hz,
Input Voltage Ripple =1Vms,
Io=100mA
Vo+1.0V ≤ VCC ≤ 26.5V
V
5mA ≤ Io ≤1A
V
ACTIVE MODE
V
OFF MODE
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data
■BD00C0AW-C series(Vo=5.0V)
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V, Io=0mA, Vo=5.0V
(The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ)
18
1.0
0.8
0.6
0.4
Ta=-40℃
0.2
Shutdown Current:Isd [μA]
Circuit Current:Ib+IFEEDBACK_R [mA]
Ta=-40℃
15
Ta=25℃
Ta=125℃
12
9
6
3
Ta=25℃
Ta=125℃
0
0.0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 11. Circuit Current
(IFEEDBACK_R(Note 1) ≈ 75µA)
Figure 12. Shutdown Current
(VCTL=0V)
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
(Note 1) IFEEDBACK_R is the current flowing into
external feedback resistance.
4
3
2
4
3
2
Ta=-40℃
Ta=-40℃
Ta=25℃
1
Ta=25℃
1
Ta=125℃
Ta=125℃
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
Supply Voltage:Vcc [V]
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 14. Line Regulation
(Io=500mA)
Figure 13. Line Regulation
(Io=0mA)
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
1,000
6
Ta=-40℃
900
Dropout Voltage : ΔVd [mV]
Output Voltage:Vo [V]
5
4
3
2
Ta=-40℃
1
Ta=25℃
Ta=25℃
800
Ta=125℃
700
600
500
400
300
200
100
Ta=125℃
0
0
0
400
800
1200
1600
2000
0
2400
200
400
600
800
Output Current:Io [mA]
Output Current:Io [mA]
Figure 15. Load Regulation
Figure 16. Dropout Voltage
(Vcc=Vo×0.95=4.75V)
1000
5.15
80
Ta=-40℃
Ta=25℃
60
5.10
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
70
Ta=125℃
50
40
30
5.05
5.00
4.95
20
4.90
10
0
10
100
1000
10000
100000 1000000
Frequency: f [Hz]
-40
-20
0
20
40
60
80
100
120
Ambient Temperature: [℃]
Figure 18. Output Voltage
Temperature Characteristic
Figure 17. Ripple Rejection
(lo=100mA)
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
180
1.0
CTL Bias Current:ICTL [μA]
Circuit Current:Ib+IFEEDBACK_R [mA]
160
0.8
0.6
0.4
Ta=-40℃
0.2
Ta=25℃
140
120
100
80
60
Ta=-40℃
40
Ta=25℃
Ta=125℃
20
Ta=125℃
0.0
0
200
400
600
800
0
1000
0
Output Current:Io [mA]
2
4
6
8 10 12 14 16 18 20 22 24 26
Control Voltage: V CTL[V]
Figure 20. CTL Current vs CTL Voltage
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
Figure 19. Circuit Current
(0mA ≤ Io ≤ 1000mA, IFEEDBACK_R ≈ 75µA)
4
3
2
4
3
2
Ta=-40℃
1
1
Ta=25℃
Ta=125℃
0
0
0
2
4
6
130
8 10 12 14 16 18 20 22 24 26
150
160
170
180
190
Figure 22. Thermal Shutdown
Circuit Characteristic
Figure 21. Output Voltage vs CTL Voltage
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TSZ22111・15・001
140
Ambient Temperature:Ta [℃]
Control Voltage: VCTL[V]
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Measurement setup for reference data
■BD00C0AW-C series (Vo=5.0V)
Vcc
Vo
Vcc
Vcc
Vo
Vo
56.7kΩ
1µF
1µF
56.7kΩ
CTL
ADJ
1µF
56.7kΩ
CTL
1µF
ADJ
GND
CTL
1µF
5V
ADJ
GND
GND
10kΩ
1µF
10kΩ
5V
10kΩ
FEEDBACK _R
Measurement setup for Figure 11
Vcc
Measurement setup for Figure 12
Vcc
Vo
Vo
Vcc
56.7kΩ
1µF
1µF
CTL
ADJ
GND
1µF
CTL
13.5V
1µF
ADJ
GND
500mA
10kΩ
5V
1µF
CTL
4.75V
Measurement setup for Figure 14
1µF
10kΩ
5V
Measurement setup for Figure 15
Vcc
Vo
Measurement setup for Figure 16
Vcc
Vo
Vo
56.7kΩ
56.7kΩ
56.7kΩ
1Vrms
ADJ
GND
10kΩ
5V
Vcc
Vo
56.7kΩ
56.7kΩ
1µF
1µF
1µF
CTL
13.5V
V
ADJ
GND
CTL
13.5V
1µF
100mA
10kΩ
CTL
13.5V
ADJ
GND
1µF
ADJ
10kΩ
GND
1µF
10kΩ
5V
FEEDBACK _R
5V
5V
Measurement setup for Figure 17
Vcc
Measurement setup for Figure 18
Vcc
Vo
Measurement setup for Figure 19
Vcc
Vo
56.7kΩ
1µF
1µF
1µF
CTL
ADJ
GND
Vo
56.7kΩ
56.7kΩ
13.5V
Measurement setup for Figure 13
1µF
10kΩ
13.5V
CTL
ADJ
GND
1µF
CTL
13.5V
ADJ
GND
10kΩ
1µF
10kΩ
5V
Measurement setup for Figure 20
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Measurement setup for Figure 21
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Measurement setup for Figure 22
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data
■BD33C0A-C/ BD33C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
1.0
18
0.8
Shutdown Current:Isd [μA]
Circuit Current:Ib [mA]
Ta=-40℃
0.6
0.4
Ta=-40℃
0.2
Ta=25℃
15
Ta=25℃
Ta=125℃
12
9
6
3
Ta=125℃
0.0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
0
Supply Voltage:Vcc [V]
2
4
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
Figure 24. Shutdown Current
(VCTL=0V)
6
4
3
2
Ta=-40℃
4
3
2
Ta=-40℃
Ta=25℃
Ta=25℃
1
Ta=125℃
Ta=125℃
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
0
Supply Voltage:Vcc [V]
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 26. Line Regulation
(Io=500mA)
Figure 25. Line Regulation
(Io=0mA)
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 23. Circuit Current
1
6
13/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
6
80
Ta=-40℃
5
70
Ta=25℃
Ripple Rejection:R.R. [dB]
Output Voltage:Vo [V]
Ta=-40℃
Ta=125℃
4
3
2
1
Ta=25℃
60
Ta=125℃
50
40
30
20
10
0
0
0
400
800
1200
1600
2000
2400
10
100
Output Current:Io [mA]
1000
10000
100000 1000000
Frequency: f [Hz]
Figure 27. Load Regulation
Figure 28. Ripple Rejection
(lo=100mA)
3.38
1.0
0.8
3.34
Circuit Current:Ib [mA]
Output Voltage: Vo [V]
3.36
3.32
3.30
3.28
3.26
0.6
0.4
Ta=-40℃
0.2
Ta=25℃
3.24
Ta=125℃
3.22
-40
-20
0
20
40
60
80
100
0.0
120
0
Ambient Temperature: [℃]
400
600
800
1000
Output Current:Io [mA]
Figure 29. Output Voltage Temperature Characteristic
www.rohm.com
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TSZ22111・15・001
200
14/43
Figure 30. Circuit Current
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
180
6
5
140
Output Voltage:Vo [V]
CTL Bias Current:ICTL [μA]
160
120
100
80
60
Ta=-40℃
40
3
2
Ta=-40℃
Ta=25℃
20
4
1
Ta=25℃
Ta=125℃
Ta=125℃
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
Control Voltage: V CTL[V]
2
4
6
8 10 12 14 16 18 20 22 24 26
Control Voltage: VCTL[V]
Figure 31. CTL Current vs CTL Voltage
Figure 32. Output Voltage vs CTL Voltage
6
Output Voltage:Vo [V]
5
4
3
2
1
0
130
140
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 33. Thermal Shutdown Circuit Characteristic
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TSZ22111・15・001
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TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data
■BD50C0A-C/ BD50C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
18
Ta=-40℃
Shutdown Current:Isd [μA]
Circuit Current:Ib [mA]
1.0
0.8
0.6
0.4
Ta=-40℃
0.2
Ta=25℃
15
Ta=25℃
Ta=125℃
12
9
6
3
Ta=125℃
0.0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 34. Circuit Current
Figure 35. Shutdown Current
(VCTL=0V)
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
0
4
3
2
Ta=-40℃
Ta=25℃
1
4
3
2
Ta=-40℃
Ta=25℃
1
Ta=125℃
Ta=125℃
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 36. Line Regulation
(Io=0mA)
Figure 37. Line Regulation
(Io=500mA)
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TSZ22111・15・001
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TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
6
1,000
Ta=-40℃
900
Dropout Voltage : ΔVd [mV]
Output Voltage:Vo [V]
5
4
3
2
Ta=-40℃
1
Ta=25℃
Ta=25℃
800
Ta=125℃
700
600
500
400
300
200
100
Ta=125℃
0
0
0
400
800
1200
1600
2000
2400
0
200
Output Current:Io [mA]
400
600
800
1000
Output Current:Io [mA]
Figure 38. Load Regulation
Figure 39. Dropout Voltage
(Vcc=Vo×0.95V=4.75V)
80
5.15
Ta=-40℃
Ta=25℃
60
5.10
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
70
Ta=125℃
50
40
30
5.05
5.00
4.95
20
4.90
10
4.85
0
10
100
1000
10000
100000 1000000
-20
0
20
40
60
80
100
120
Ambient Temperature: [℃]
Frequency: f [Hz]
Figure 41. Output Voltage
Temperature Characteristic
Figure 40. Ripple Rejection
(lo=100mA)
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TSZ22111・15・001
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17/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
1.0
180
CTL Bias Current:ICTL [μA]
160
Circuit Current:Ib [mA]
0.8
0.6
0.4
Ta=-40℃
0.2
120
100
80
60
Ta=-40℃
40
Ta=25℃
Ta=25℃
20
Ta=125℃
Ta=125℃
0
0.0
0
200
400
600
800
1000
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Output Current:Io [mA]
Control Voltage: V CTL[V]
Figure 42. Circuit Current
Figure 43. CTL Current vs CTL Voltage
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
140
4
3
2
4
3
2
Ta=-40℃
1
Ta=25℃
1
Ta=125℃
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
130
Control Voltage: VCTL[V]
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 45. Thermal Shutdown Circuit Characteristic
Figure 44. Output Voltage vs CTL Voltage
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TSZ22111・15・001
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18/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data
■BD80C0A-C/ BD80C0AW-C series
Unless otherwise specified, -40°C ≤ Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
18
1.2
1.0
Shutdown Current:Isd [μA]
Circuit Current:Ib [mA]
Ta=-40℃
0.8
0.6
0.4
Ta=-40℃
0.2
15
Ta=25℃
Ta=125℃
12
9
6
3
Ta=25℃
Ta=125℃
0
0.0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 46. Circuit Current
Figure 47. Shutdown Current
(VCTL=0V)
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
0
7
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=125℃
0
7
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=125℃
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 48. Line Regulation
(Io=0mA)
Figure 49. Line Regulation
(Io=500mA)
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TSZ22111・15・001
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TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
9
900
8
800
Dropout Voltage : ΔVd [mV]
1,000
Output Voltage:Vo [V]
10
7
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
800
1200
1600
2000
Ta=125℃
700
600
500
400
300
200
0
400
Ta=25℃
100
Ta=125℃
0
Ta=-40℃
0
2400
0
200
Output Current:Io [mA]
600
800
1000
Figure 51. Dropout Voltage
(Vcc=Vo×0.95V=7.6V)
Figure 50. Load Regulation
8.20
80
Ta=-40℃
8.15
70
Ta=25℃
60
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
400
Output Current:Io [mA]
Ta=125℃
50
40
30
8.10
8.05
8.00
7.95
20
7.90
10
7.85
7.80
0
10
100
1000
10000
100000
1000000
-20
0
20
40
60
80
100
120
Ambient Temperature: [℃]
Frequency: f [Hz]
Figure 52. Ripple Rejection
(lo=100mA)
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TSZ22111・15・001
-40
Figure 53. Output Voltage Temperature Characteristic
20/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
180
1.0
CTL Bias Current:ICTL [μA]
160
Circuit Current:Ib [mA]
0.8
0.6
0.4
Ta=-40℃
0.2
140
120
100
80
60
Ta=25℃
Ta=25℃
20
Ta=125℃
Ta=125℃
0
0.0
0
200
400
600
800
1000
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Output Current:Io [mA]
Control Voltage: VCTL[V]
Figure 54. Circuit Current
Figure 55. CTL Current vs CTL Voltage
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
Ta=-40℃
40
7
6
5
4
3
Ta=-40℃
2
6
5
4
3
2
Ta=25℃
1
7
1
Ta=125℃
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
130
140
150
160
170
180
190
Control Voltage: VCTL[V]
Ambient Temperature:Ta [℃]
Figure 56. Output Voltage vs CTL Voltage
Figure 57. Thermal Shutdown Circuit Characteristic
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TSZ22111・15・001
21/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data
■BD90C0A-C/ BD90C0AW-C series
Unless otherwise specified, -40°C ≤Ta ≤ +125°C, Vcc=13.5V, VCTL=5.0V (With SW), Io=0mA
18
1.2
Ta=-40℃
Shutdown Current:Isd [μA]
Circuit Current:Ib[mA]
1.0
0.8
0.6
0.4
Ta=-40℃
0.2
15
Ta=25℃
Ta=125℃
12
9
6
3
Ta=25℃
Ta=125℃
0.0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 58. Circuit Current
Figure 59. Shutdown Current
(VCTL=0V)
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
0
7
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=125℃
0
7
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=125℃
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
Figure 60. Line Regulation
(Io=0mA)
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 61. Line Regulation
(Io=500mA)
22/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
9
900
8
800
Dropout Voltage : ΔVd [mV]
1,000
Output Voltage:Vo [V]
10
7
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
800
1200
1600
2000
Ta=125℃
700
600
500
400
300
200
0
400
Ta=25℃
100
Ta=125℃
0
Ta=-40℃
0
2400
0
200
400
600
800
Output Current:Io [mA]
Output Current:Io [mA]
Figure 62. Load Regulation
Figure 63. Dropout Voltage
(Vcc=Vo×0.95V=8.55V)
1000
9.20
80
Ta=-40℃
70
9.15
60
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
Ta=25℃
Ta=125℃
50
40
30
9.10
9.05
9.00
8.95
20
8.90
10
8.85
0
8.80
10
100
1000
10000
100000 1000000
-40
-20
0
20
40
60
80
Frequency: f [Hz]
Ambient Temperature: [℃]
Figure 64. Ripple Rejection
(Io =100mA)
Figure 65. Output Voltage
Temperature Characteristic
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100
120
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Reference Data - continued
180
1.0
CTL Bias Current:ICTL [μA]
Circuit Current:Ib [mA]
160
0.8
0.6
0.4
Ta=-40℃
0.2
140
120
100
80
60
Ta=-40℃
40
Ta=25℃
Ta=25℃
20
Ta=125℃
Ta=125℃
0
0.0
0
200
400
600
800
0
1000
2
4
6
Output Current:Io [mA]
Control Voltage: V CTL[V]
Figure 66. Circuit Current
Figure 67. CTL Current vs CTL Voltage
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
8 10 12 14 16 18 20 22 24 26
7
6
5
4
3
7
6
5
4
3
Ta=-40℃
2
2
Ta=25℃
1
1
Ta=125℃
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
130
Control Voltage: VCTL[V]
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 69. Thermal Shutdown
Circuit Characteristic
Figure 68. Output Voltage vs CTL Voltage
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TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Measurement setup for reference data
■BDxxC0AW-C series(Output Voltage Fixation Type)
Vcc
Vcc
Vo
(1.0µF)
2.2µF
(1.0µF)
2.2µF
1µF
CTL
Vo
1µF
CTL
N.C.
CTL
N.C.
GND
GND
GND
5V
Measurement setup for
Figure 23, 34, 46 and 58
Vcc
Measurement setup for
Figure 24, 35, 47 and 59
Measurement setup for
Figure 25, 36, 48 and 60
Vo
(1.0µF)
2.2µF
1µF
CTL
Vcc
Vo
CTL
N.C.
(1.0µF)
2.2µF
N.C.
GND
500mA
Vcc
Vo
CTL
N.C.
(1.0µF)
2.2µF
GND
Vcc
Vo
CTL
N.C.
(1.0µF)
2.2µF
V
Measurement setup for
Figure 39, 51 and 63
Measurement setup for
Figure 28, 40, 52 and 64
GND
GND
Vcc
Vo
CTL
N.C.
(1.0µF)
2.2µF
1µF
N.C.
N.C.
5V
Measurement setup for
Figure 29, 41, 53 and 65
Vo
CTL
CTL
1µF
13.5V
5V
(1.0µF)
2.2µF
Vo
GND
100mA
5V
Vcc
Vcc
(1.0µF)
2.2µF
1µF
13.5V
N.C.
5V
Measurement setup for
Figure 27, 38, 50 and 62
1µF
CTL
GND
5V
Measurement setup for
Figure 26, 37, 49 and 61
Vo
1µF
Vo×
0.95V
GND
Vcc
(1.0µF)
2.2µF
1µF
13.5V
5V
13.5V
Vo
1µF
N.C.
5V
13.5V
Vcc
(1.0µF)
2.2µF
13.5V
Measurement setup for
Figure 30, 42, 54 and 66
Vcc
Vo
CTL
N.C.
(1.0µF)
2.2µF
1µF
1µF
13.5V
GND
GND
5V
Measurement setup for
Figure 31, 43, 55 and 67
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TSZ22111・15・001
Measurement setup for
Figure 32, 44, 56 and 68
25/43
Measurement setup for
Figure 33, 45, 57 and 69
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Application Examples
・Applying positive surge to the Vcc pin
If the possibility exists that surges higher than 35.0V will be applied to the Vcc pin, a zenar diode should be placed
between the Vcc pin and GND pin as shown in the Figure below.
Vcc
GND
Figure 70
・Applying negative surge to the Vcc pin
If the possibility exists that negative surges lower than the GND are applied to the Vcc pin, a schottky diode should be
place between the Vcc pin and GND pin as shown in the Figure below.
Vcc
GND
Figure 71
・Implementing a protection diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and Shutdown, a protection diode should be placed as shown in the Figure below.
Vo
Figure 72
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TSZ02201-G1G0AN00640-1-2
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BDxxC0A-C series
BDxxC0AW-C series
Thermal Design
■TO252-3
10.0
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
②5.43 W
6.0
②
4.0
2.0
①0.92 W
0.0
0
25
50
75
100
125
150
Ambient Temperature: Ta [ C]
Figure 73. TO252-3 Package Data
: 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 81 C / W, ΨJT (top center) = 8 °C / W
Condition②: θJA = 21 C / W, ΨJT (top center) = 2 °C / W
■TO252-5
10.0
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
6.0
②5.43 W
4.0
2.0
①0.92 W
0.0
0
25
50
75
100
125
Ambient Temperature: Ta [ C]
Figure 74. TO252-5 Package Data
150
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 136 C / W, ΨJT (top center) = 17 °C / W
Condition②: θJA = 23 °C / W, ΨJT (top center) = 3 °C / W
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BDxxC0A-C series
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Thermal Design – continued
■HRP5
10.0
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
6.0
②5.68 W
②
4.0
2.0
①1.04 W
0.0
0
25
50
75
100
125
Ambient Temperature: Ta [ C]
Figure 75. HRP5 Package Data
150
: 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 120 C / W, ΨJT (top center) = 8 °C / W
Condition②: θJA = 22 C / W, ΨJT (top center) = 3 °C / W
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BDxxC0A-C series
BDxxC0AW-C series
Thermal Design – continued
■TO263-3(F)
10.0
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
②5.95 W
6.0
②
4.0
①1.54 W
2.0
0.0
0
25
50
75
100
125
150
Ambient Temperature: Ta [ C]
Figure 76. TO263-3 Package Data
: 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 81 C / W, ΨJT (top center) = 8 °C / W
Condition②: θJA = 21 C / W, ΨJT (top center) = 2 °C / W
■TO263-5
10.0
IC mounted on ROHM standard board based on JEDEC.
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
8.0
②5.95 W
6.0
②
4.0
①1.54 W
2.0
0.0
0
25
50
75
100
125
Ambient Temperature: Ta [ C]
Figure 77. TO263-5 Package Data
150
: 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 81 C / W, ΨJT (top center) = 8 °C / W
Condition②: θJA = 21 C / W, ΨJT (top center) = 2 °C / W
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BDxxC0AW-C series
When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure 73
to 77.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure. 73 to 77 shows the acceptable power dissipation characteristic curves of the TO252-3/5, HRP5 and TO263-3(F)/5
packages. Even when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be
quite high so please operate the IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows
Pc=(Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd ≥ Pc
Vcc
Vo
Io
Ib
Solving this for load current Io in order to operate within the acceptable loss
Io ≤
Pd－Vcc×Ib
Vcc－Vo
(Please refer to 19, 30, 42, 54 and 66 about Ib.)
: Input voltage
: Output voltage
: Load current
: Circuit current
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example) When TO252-3 / TO252-5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V
Io ≤
2.824－13.5×Ib
8.5
Io ≤ 331.3mA (Ib：0.6mA)
Figure 73, 74 ②θja=23°C /W → -43.5mW/°C
25°C = 5.43W → 85°C =2.824W
Calculation Example) When HRP5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V
2.954－13.5×Ib
8.5
Io ≤ 346.6mA (Ib: 0.6mA)
Io ≤
Figure 75 ②θja=22°C /W →-45.5mW/°C
25°C =5.68W → 85°C =2.954W
Calculation Example) When TO263-3(F) / TO263-5, 4-layer PCB, Ta=85°C, Vcc=13.5V, Vo=5.0V
3.094－13.5×Ib
8.5
Io ≤ 363mA (Ib: 0.6mA)
Io ≤
Figure 76, 77 ②θja=21°C /W →-47.6mW/°C
25°C =5.95W → 85°C =3.094W
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature
ranges.
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BDxxC0AW-C series
I/O equivalence circuit
Vcc Terminal
CTL Terminal
(With SW)
200kΩ
(Typ)
Vcc
1kΩ
(Typ)
CTL
200kΩ
(Typ)
IC
Vo Terminal BD33/50/80/90C0A(W)
Vcc
R1 (kΩ)
(Typ)
R3
Vo
R2
BD33C0A(W)
BD50C0A(W)
BD80C0A(W)
BD90C0A(W)
10
5
R2 (kΩ)
(Typ)
34
56.6
48.3
55
R3 (kΩ)
(Typ)
15
20
R1
BD00C0AW
Vo Terminal
ADJ Terminal
Vcc
1kΩ
(Typ)
Vo
15kΩ
(Typ)
ADJ
Vo
20kΩ
(Typ)
1kΩ
(Typ)
Figure 78
Output Voltage Configuration Method (BD00C0AW)
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 79.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are
large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R1.
Vo
R2
ADJ ≈ 0.75V
(Typ)
IC
ADJ
pin
R1
Vo ≈ ADJ × (R1+R2) / R1
The circuit current dependents on the resistance value of R1 and R2.
Please determine the constant considering the actual application.
Figure 79
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. Power dissipation in the Thermal Design is the value when the IC is mounted
on a 114.3mm x 76.2mm x 1.57mm/1.6mm glass epoxy board. And in case this exceeds, take the measures like
enlarge the size of board; make copper foil area for heat dissipation big; and do not exceed the power dissipation.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
avoided.
11.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. Vcc Pin
Insert a capacitor (Vo ≥ 5.0V:capacitor ≥ 1µF, 1.0 ≤ Vo < 5.0V:capacitor ≥ 2.2µF) between the Vcc and GND pins.
Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the
capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We
recommend using a capacitor with excellent voltage and temperature characteristics.
Electric capacitor
IC
Ceramic capacitor, Low ESR capacitor
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Operational Notes – continued
15. Output Pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1μF(3.0V ≤ Vo ≤ 15.0V). Electrolytic, tantalum and ceramic capacitors can
be used. We recommend a capacitor with a capacitance of more than 4.7μF(1.0V ≤ Vo < 3.0V). Ceramic capacitors
can be used. If electrolytic and tantalum capacitors of more than 4.7uF with a high ESR characteristic are used(1.0V ≤
Vo < 3.0V), 10 µF ceramic capacitor needs to be connected in parallel. When selecting the capacitor ensure that the
capacitance of more than 1μF(3.0V ≤ Vo ≤ 15.0V) or more than 4.7μF(1.0V ≤ Vo < 3.0V) is maintained at the intended
applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly
resulting in oscillation. For selection of the capacitor refer to the Cout_ESR vs Io data. The stable operation range
given in the reference data is based on the standalone IC and resistive load. For actual applications the stable
operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore
verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification.
4.0V ≤ Vcc ≤ 26.5V
3.0V ≤ Vo ≤ 15.0V
-40 C ≤ Ta ≤ +125 C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
Cin=2.2µF ≤ Cin ≤ 100µF
1µF ≤ Cout ≤ 100µF
6.0V ≤ Vcc ≤ 26.5V
5.0V ≤ Vo ≤ 15.0V
-40 C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
4.0V ≤ Vcc ≤ 26.5V
3.0V ≤ Vo ≤ 15.0V
-40 C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
100
100
100
Unstable operating region
Stable operating region
0.1
0.01
Cin（µF）
1
Cin（μF）
Cout_ESR(Ω ）
10
Stable operating region
10
10
Stable operating region
2.2
Unstable
operating region
0.001
1
1
0
200
400
600
800
1000
1
10
Io(mA)
4.0V ≤ Vcc ≤ 26.5V
1.5V ≤ Vo < 3.0V
-40 C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
100
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
-40 C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
100
100
Unstable operating region
10
1
0.5
0.1
Stable operating region
0.01
1
Cin（μF）
Cout_ ESR( Ω ）
Unstable operating region
Stable operating region
0.1
0.01
0.001
200
400
600
800
1000
2.2
1
0
200
Io(mA)
400
600
800
1000
1
4.7
Io(mA)
10
100
Cout（μF）
Cout_ESR vs Io
1.0V ≤ Vo < 3.0V
(Reference data)
Cin vs Cout
1.0V ≤ Vo < 3.0V
(Reference data)
Vcc
VCC
(4.0V to 26.5V)
Stable
operating region
Stable
operating region
Unstable
operating region
10
0.001
0
100
Cout(µF)
Cin vs Cout
3.0V ≤ Vo ≤ 15.0V
(Reference data)
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 1.5V
-40 C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
10
10
Cout（μF）
Cout_ESR vs Io
3.0V ≤ Vo ≤ 15.0V
(Reference data)
Cout_ ESR( Ω ）
1
100
Vo
Cin
(1µF or higher)
R2
CTL
Cout
(1µF or higher)
Io
(Rout)
ADJ
GND
VCTL
(5.0V)
R1
(5k to 10kΩ)
ESR
(0.001Ω
or higher)
Operation Note 15 Measurement circuit (BD00C0AW)
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Operational Notes – continued
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-40°C ≤ Ta ≤ +125°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00C0AW)
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-40°C ≤ Ta ≤ +125°C
5kΩ ≤ R1 ≤ 10kΩ (BD00C0AW)
2.2µF ≤ Cin ≤ 100µF
1µF ≤ Cout ≤ 100µF
100
100
発振領域
1
Cin（μF）
Cout_ESR(Ω ）
10
安定領域
0.1
0.01
安定領域
10
2.2
発振領域
1
0.001
0
200
400
600
800
1
1000
10
100
Cout（μF）
Io(mA)
Cin vs Cout
1.0V ≤ Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
Cout_ESR vs Io
1.0V ≤ Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
Vcc
VCC
(4.0V to 26.5V)
Vo
Cin
(1µF or higher)
R2
CTL
ADJ
Cout
(1µF
or higher)
10µF
GND
R1
(5k to 10kΩ)
VCTL
(5.0V)
ESR
(0.001Ω
or higher)
出力負荷
Io(Rout)
Operation Note 15 Measurement circuit (BD00C0AW)
16. CTL Pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
17. Rapid variation in Vcc Voltage and load Current CTL Pin
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output
current and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
18. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
19. In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a
capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a
bypass between all pins and the Vcc pin.
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BDxxC0A-C series
BDxxC0AW-C series
Physical Dimension, Tape and Reel Information
Package Name
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Physical Dimension, Tape and Reel Information
Package Name
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Physical Dimension, Tape and Reel Information
Package Name
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Package Name
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BDxxC0A-C series
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Package Name
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BDxxC0A-C series
BDxxC0AW-C series
Marking Diagrams (TOP VIEW)
TO252-3
TO252-3
(TOP VIEW)
Part Number Marking
Output
Voltage(V)
Part Number
Marking
3.3
33C0AC
5.0
50C0AC
8.0
80C0AC
9.0
90C0AC
LOT Number
TO252-5
TO252-5
(TOP VIEW)
Part Number Marking
Output
Voltage(V)
Part Number
Marking
Variable
00C0AWC
3.3
33C0AWC
5.0
50C0AWC
8.0
80C0AWC
9.0
90C0AWC
LOT Number
HRP5
HRP5 (TOP VIEW)
Part Number Marking
Output
Voltage(V)
Output Control Pin
Part Number
Marking
Variable
With SW
00C0AWHFPC
With SW
33C0AWHFPC
LOT Number
3.3
5.0
8.0
1PIN MARK
9.0
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
41/43
Without SW
33C0AHFPC
With SW
50C0AWHFPC
Without SW
50C0AHFPC
With SW
80C0AWHFPC
Without SW
80C0AHFPC
With SW
90C0AWHFPC
Without SW
90C0AHFPC
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
TO263-3(F)
TO263-3(F) (TOP VIEW)
Part Number Marking
LOT Number
Output
Voltage(V)
Part Number
Marking
3.3
33C0AC
5.0
50C0AC
8.0
80C0AC
9.0
90C0AC
1PIN
TO263-5
TO263-5 (TOP VIEW)
Part Number Marking
LOT Number
Output
Voltage(V)
Part Number
Marking
Variable
00C0AWC
3.3
33C0AWC
5.0
50C0AWC
8.0
80C0AWC
9.0
90C0AWC
1PIN
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
42/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
BDxxC0A-C series
BDxxC0AW-C series
Revision History
Date
Revision
16.Nov.2012
001
New Release
07.Mar.2013
002
The condition of output pin is changed on Operational Note 11.
The mention of “Status of this document” is removed.
2.Sep.2013
003
・ Error in writing were corrected
・ New release TO263-3F, TO263-5F, packages.
・ Thermal Resistance and Power Dissipation are changed to be compliant with JEDEC
standard.
・ All characters were conformed to the Chicago manual.
・ The sign in the annotation part was changed from “※n” into “(Note n).”
・ NOTE under the absolute maximum rating of P.2 was deleted because it had
overlapped with P.1.
・ Sentences of "Power consumption Pc of IC when short-circuited" that exists in P.30 are
deleted.
・ “Operational Notes” were updated.
11.Oct.2013
004
27.Jan.2017
005
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Changes
・ Page. 31 Error in writing were corrected
・
・
・
・
・
・
TO263-3 and TO263-5 were added.
The description method of thermal Resistance was changed to unify.
AEC-Q100 (Note1:Grade1) was appended.
Drop voltage figure was corrected. (P.12, 25)
Figure 78 I/O equivalent was corrected. (P.31)
Error in direction of feed was corrected. (P.39, 40)
43/43
TSZ02201-G1G0AN00640-1-2
27.Jan.2017 Rev.005
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD90C0AFP2-C - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD90C0AFP2-C
TO263-3F
500
500
Taping
inquiry
Yes
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