Datasheet
1 Channel High Side Switch ICs
1.5A Current Limit High Side Switch ICs
BD82000FVJ-LB
BD82001FVJ-LB
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market.
Single channel high side switch IC for USB port is a
high side switch having over-current protection used in
power supply line of universal serial bus (USB).
N-channel power MOSFET of low on resistance and
low supply current are realized in this IC.
And, over-current detection circuit, thermal shutdown
circuit, under-voltage lockout and soft start circuit are
built in.
Input voltage range:
2.7V to 5.5V
ON resistance :
70mΩ(Typ.)
Over current threshold:
1.0A min., 2.0A max.
Number of channels:
1ch
Standby current:
0.01μA (Typ.)
Operating temperature range:
-40℃ to +85℃
Package
W(Typ.)
SOP-J8
D(Typ.) H (Max.)
3.00mm x 4.90mm x 1.10mm
Features
Long time support a product for Industrial
applications.
Low On-Resistance 70mΩ MOSFET Switch
Current limit threshold 1.5A
Control Input Logic
¾ Active “Low” Control Logic: BD82000FVJ
¾ Active “High” Control Logic: BD82001FVJ
Soft-Start Circuit
Over-Current Protection
Thermal Shutdown
Under-Voltage Lockout
Open-Drain Error Flag Output
TTL Enable Input
0.8ms Typical Rise Time
TSSOP-B8J
Applications
Industrial Equipment, PC, PC peripheral equipment,
USB hub in consumer appliances, Car accessory,
and so forth
Typical Application Circuit
5V(typ.)
CIN
GND
OUT
IN
OUT
IN
OUT
VBUS
D+
+
CL -
DGND
EN(/EN) /OC
Lineup
Min.
1.0A
1.0A
Over current detection
Typ.
Max.
1.5A
2.0A
1.5A
2.0A
○Product structure：Silicon monolithic integrated circuit
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Control input
logic
Low
TSSOP-B8J
Reel of 2500
BD82000FVJ-LBE2
High
TSSOP-B8J
Reel of 2500
BD82001FVJ-LBE2
Package
Orderable Part Number
○This product has no designed protection against radioactive rays
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Block Diagram
GND
OUT
IN
Charge
Pump
UVLO
IN
OCD
OUT
OUT
Gate
Logic
/OC
EN
/EN
TSD
Pin Configurations
BD82000FVJ
(TOP VIEW)
BD82001FVJ
(TOP VIEW)
1
GND
OUT
8
1
GND
OUT
8
2
IN
OUT
7
2
IN
OUT
7
3
IN
OUT
6
3
IN
OUT
6
4
/EN
/OC
5
4
EN
/OC
5
Pin Description
Pin No.
Symbol
I/O
Pin function
1
GND
-
Ground.
2, 3
IN
-
Power supply input.
Input terminal to the power switch and power supply input terminal of the internal circuit.
At use, connect each pin outside.
4
EN , /EN
I
Enable input.
Power switch on at Low level.(BD82000FVJ)
Power switch on at High level.(BD82001FVJ)
High level input > 2.0V, Low level input < 0.8V.
5
/OC
O
Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
6, 7, 8
OUT
O
Power switch output.
At use, connect each pin outside.
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Absolute Maximum Ratings (Ta=25℃)
Symbol
Ratings
Unit
Supply voltage
Parameter
VIN
-0.3 to 6.0
V
Enable input voltage
VEN
-0.3 to 6.0
V
/OC voltage
V/OC
-0.3 to 6.0
V
/OC sink current
IS/OC
below 5
mA
OUT voltage
VOUT
-0.3 to 6.0
V
Storage temperature
TSTG
-55 to 150
℃
Pd
587.5*1
mW
Power dissipation
*1
Mounted on 70mm*70mm*1.6mm glass-epoxy PCB.
Derating : 4.7mW/℃ above Ta=25 ℃.
Recommended Operating Ratings
Parameter
Operating voltage
Operating temperature
Symbol
Ratings
Unit
Min.
Typ.
Max.
VIN
2.7
-
5.5
V
TOPR
-40
-
85
℃
Electrical Characteristics
○BD82000FVJ
(Unless otherwise specified VIN = 5.0V, Ta = 25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating current
IDD
-
110
160
μA
V/EN = 0V , OUT=OPEN
Standby current
ISTB
-
0.01
1
μA
V/EN = 5V , OUT=OPEN
/EN input voltage
/EN input current
V/EN
2.0
-
-
V
High input
V/EN
-
-
0.8
V
Low input
I/EN
-1.0
0.01
1.0
μA
V/EN = 0V or V/EN = 5V
/OC output low voltage
V/OCL
-
-
0.5
V
I/OC = 0.5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
T/OC
10
15
20
ms
On-resistance
RON
-
70
110
mΩ
IOUT = 500mA
Switch leak current
ILSW
-
-
1.0
μA
V/EN = 5V, VOUT = 0V
Current limit threshold
ITH
1.0
1.5
2.0
A
Short circuit current
ISC
0.7
1.0
1.4
A
TON1
-
0.8
10
ms
VOUT = 0V
CL = 47μF (RMS)
RL = 10Ω
Output rise time
Output turn-on time
TON2
-
1.1
20
ms
RL = 10Ω
Output fall time
TOFF1
-
5
20
μs
RL = 10Ω
Output turn-off time
T OFF2
-
10
40
μs
RL = 10Ω
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
UVLO threshold
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Datasheet
BD82001FVJ-LB
Electrical Characteristics - continued
○BD82001FVJ
(Unless otherwise specified VIN = 5.0V, Ta = 25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating current
IDD
-
110
160
μA
VEN = 5V , OUT=OPEN
Standby current
ISTB
-
0.01
1
μA
VEN = 0V , OUT=OPEN
VEN
2.0
-
-
V
High input
VEN
-
-
0.8
V
Low input
EN input voltage
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 5V
/OC output low voltage
V/OCL
-
-
0.5
V
I/OC = 0.5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
T/OC
10
15
20
ms
On-resistance
RON
-
70
110
mΩ
IOUT = 500mA
Switch leak current
VEN = 0V, VOUT = 0V
EN input current
ILSW
-
-
1.0
μA
Current limit threshold
ITH
1.0
1.5
2.0
A
Short circuit current
ISC
0.7
1.0
1.4
A
TON1
-
0.8
10
ms
VOUT = 0V
CL = 47μF (RMS)
RL = 10Ω
Output rise time
Output turn-on time
TON2
-
1.1
20
ms
RL = 10Ω
Output fall time
TOFF1
-
5
20
μs
RL = 10Ω
Output turn-off time
T OFF2
-
10
40
μs
RL = 10Ω
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVHL
2.0
2.2
2.4
V
Decreasing VIN
UVLO threshold
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Datasheet
BD82001FVJ-LB
Measurement Circuit
VIN
VIN
A
1µF
10kΩ
1µF
GND
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
EN(/EN)
RL
CL
/OC
EN(/EN)
/OC
VEN(V/EN)
A.
VIN
A
VEN(V/EN)
Operating current Inrush current
VIN
B.
EN, /EN input voltage, Output rise, fall time
VIN
VIN
VIN
10kΩ
I/OC
1µF
1µF
GND
OUT
IN
OUT
IN
OUT
EN(/EN)
A
CL
IOUT
/OC
GND
OUT
IN
OUT
IN
OUT
EN(/EN)
VEN(V/EN)
/OC
VEN(V/EN)
C. On-resistance Over-current detection
D. /OC output low voltage
Figure 1. Measurement circuit
Timing Diagram
TOFF1
TOFF1
TON1
TON1
90%
90%
90%
VOUT
90%
VOUT
10%
10%
TOFF2
TOFF2
TON2
TON2
V/EN
VEN
50%
50%
50%
Figure 2. Timing diagram (BD82000FVJ)
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50%
Figure 3. Timing diagram (BD82001FVJ)
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Datasheet
BD82001FVJ-LB
Typical Performance Curves
(Reference data)
140
140
VIN=5.0V
120
Operating Current : I DD[μA]
Operating Current : I DD[μA]
Ta=25°C
100
80
60
40
20
0
120
100
80
60
40
20
0
2
3
4
5
Supply Voltage : VIN[V]
6
-50
0
100
Ambient Temperature : Ta[℃]
Figure 5. Operating current
EN,/EN enable
Figure 4. Operating current
EN,/EN enable
1.0
1.0
VIN=5.0V
STANDBY Current : I STB[μA]
Ta=25°C
STANDBY Current : I STB [μA]
50
0.8
0.6
0.4
0.2
0.0
0.8
0.6
0.4
0.2
0.0
2
3
4
5
6
-50
0
50
SUPPLY VOLTAGE : VIN[V]
Ambient Temperature : Ta[℃]
Figure 6. Standby current
EN,/EN disable
Figure 7. Standby current
EN,/EN disable
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Datasheet
BD82001FVJ-LB
Typical Performance Curves - continued
2.0
1.5
VIN=5.0V
[V]
Ta=25°
Low to High
Enable Input Voltage : V
Enable Input Voltage : V EN [V]0
2.0
High to Low
1.0
0.5
0.0
Low to High
1.5
High to Low
1.0
0.5
0.0
2
3
4
5
Supply Voltage : VIN[V]
6
-50
0
100
Ambient Temperature : Ta[℃]
Figure 8. EN,/EN input voltage
Figure 9. EN,/EN input voltage
200
200
VIN=5.0V
ON Resistance : R ON [mΩ]
Ta=25°C
ON Resistance : R ON [mΩ]
50
150
100
50
0
150
100
50
0
2
3
Supply Voltage : VIN[V]
4
0
50
Ambient Temperature : Ta[℃]
Figure 10. On-resistance
Figure 11. On-resistance
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6
-50
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Typical Performance Curves - continued
2.0
2.0
VIN=5.0V
Current Limit Threshold : I TH [A]
Current Limit Threshold : I TH [A]
Ta=25°C
1.8
1.6
1.4
1.2
1.0
1.8
1.6
1.4
1.2
1.0
2
3
4
5
Supply Voltage : VIN[V]
6
-50
0
50
Ambient Temperature : Ta[℃]
Figure 13. Current limit threshold
Figure 12. Current limit threshold
1.4
1.4
VIN=5.0V
Short-Circuit Current : I SC [A]
[A]
Ta=25°C
Short-Circuit Current : I
100
1.2
1.0
0.8
0.6
0.4
1.2
1.0
0.8
0.6
0.4
2
3
4
5
6
-50
0
50
Supply Voltage : VIN[V]
Ambient Temperature : Ta[℃]
Figure 14. Short circuit current
Figure 15. Short circuit current
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Datasheet
BD82001FVJ-LB
Typical Performance Curves - continued
100
VIN=5.0V
/OC[mV]
Ta=25°C
80
60
/OC Output Low Voltage :V
/OC Output Low Voltage : V /OC [mV]
100
40
20
0
2
3
4
5
Supply Voltage : VIN[V]
80
60
40
20
0
-50
6
50
100
Ambient Temperature : Ta[℃]
Figure 16. /OC output low voltage
Figure 17. /OC output low voltage
2.5
1.0
2.4
0.8
UVLO Hysteresis Voltage : V
UVLO Threshold : V TUVH,VTUVL[V]
0
2.3
VTUVH
2.2
VTUVL
2.1
2.0
0.6
0.4
0.2
0.0
-50
0
50
Ambient Temperature : Ta[℃]
100
-50
50
100
Ambient Temperature : Ta[℃]
Figure 18. UVLO threshold voltage
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Figure 19. UVLO hysteresis voltage
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Datasheet
BD82001FVJ-LB
Typical Performance Curves - continued
5.0
5.0
Ta=25°C
VIN=5.0V
4.0
Rise Time : TON1[ms]
Rise Time : TON1[ms]
4.0
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
2
3
4
5
6
-50
50
Supply Voltage : VIN[V]
Figure 20. Output rise time
Figure 21. Output rise time
5.0
100
5.0
Ta=25°C
VIN=5.0V
4.0
Turn ON Time : TON2[ms]
Turn ON Time : TON2[ms]
0
Ambient Temperature : Ta[℃]
3.0
2.0
1.0
0.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
Supply Voltage : VIN[V]
6
-50
100
Figure 23. Output turn-on time
Figure 22. Output turn-on time
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0
50
Ambient Temperature : Ta[℃]
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Datasheet
BD82001FVJ-LB
Typical Performance Curves - continued
5.0
Ta=25°C
Fall Time : TOFF1[μs]
4.0
3.0
2.0
1.0
0.0
2
3
4
5
Supply Voltage: VIN[V]
6
Figure 24. Output fall time
Figure 25. Output fall time
10
10
VIN=5.0V
8
Turn OFF Time : TOFF2[μs]
Turn OFF Time : TOFF2[μs]
Ta=25
Ta=25°C
°C
6
4
2
0
8
6
4
2
0
2
3
4
5
6
-50
50
100
Ambient Temperature : Ta[℃]
Supply Voltage : VIN[V]
Figure 27. Output turn-off time
Figure 26. Output turn-off time
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Datasheet
BD82001FVJ-LB
Typical Performance Curves - continued
20
20
VIN=5.0V
18
/OC Delay Time : T/OC[ms]
/OC Delay Time : T /OC[ms]
Ta=25°C
16
14
12
18
16
14
12
10
10
2
3
4
5
Supply Voltage : VIN[V]
-50
6
Figure 28. /OC delay time
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0
50
Ambient Temperature : Ta[℃ ]
100
Figure 29. /OC delay time
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Datasheet
BD82001FVJ-LB
Typical Wave Forms
(BD82001FVJ)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IIN
(0.5A/div.)
IIN
(0.5A/div.)
VIN=5V
RL=10Ω
CL=100μF
VIN=5V
RL=10Ω
CL=100μF
TIME (1ms/div.)
TIME (1ms/div.)
Figure 30. Output rise characteristic
Figure 31. Output rise characteristic
VOUT
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
CL=147µF
CL=100µF
IOUT
(0.5A/div.)
CL=47µF
IIN
(0.5A/div.)
VIN=5V
RL=10Ω
VIN=5V
CL=100μF
TIME (10ms/div.)
TIME (1ms/div.)
Figure 33. Over-current response
ramped load
Figure 32. Inrush current response
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Datasheet
BD82001FVJ-LB
Typical Wave Forms - continued
VOUT
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
CL=100μF
VIN=5V
CL=100μF
TIME (2ms/div.)
TIME (5ms/div.)
Figure 34. Over-current response
ramped load
Figure 35. Over-current response
enable to shortcircuit
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
Thermal Shutdown
IOUT
(1.0A/div.)
IOUT
(1.0A/div.)
VIN=5V
CL=100μF
VIN=5V
CL=100μF
TIME (5ms/div.)
TIME (200ms/div.)
Figure 36. Over-current response
1Ωload connected at enable
Figure 37. Thermal shutdown
1Ωload connected at enable
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Typical Wave Forms - continued
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
IOUT
(0.5A/div.)
IOUT (0.5A/div.)
RL=10Ω
CL=100μF
RL=10Ω
CL=100μF
TIME (10ms/div.)
TIME (10ms/div.)
Figure 38. UVLO response
increasing VIN
Figure 39. UVLO response
decreasing VIN
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Typical Application Circuit
5V(typ.)
IN
Regulator
OUT
USB
Controller
10k to
100kΩ
CIN
GND
OUT
IN
OUT
IN
OUT
EN(/EN) /OC
VBUS
+
CL -
D+
DGND
Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and
GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up value which satisfies the application as CL.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
Functional Descriptions
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN, /EN control input, IN terminal and OUT terminal are connected by a 70mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
2. Thermal shutdown circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 170°C (typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power
switch turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 150°C (typ.),
power switch is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN, /EN signal is active).
3. Over-current detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN, /EN signal is active).
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Datasheet
BD82001FVJ-LB
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status
soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V (Typ.). If the VIN drops below 2.2V (Typ.)
while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV (Typ.).
Under-voltage lockout circuit works when the switch is on (EN, /EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
V/EN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Figure 40. Over-current detection, thermal shutdown timing
(BD82000FVJ)
VEN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Figure 41. Over-current detection, thermal shutdown timing
(BD82001FVJ)
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Datasheet
BD82001FVJ-LB
Power Dissipation
(TSSOP-B8J)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Figure 42. Power dissipation curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Pin No
EN(/EN)
4
/OC
5
OUT
6,7,8
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Equivalence circuit
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Ordering Information
B D 8 2 0 0 0
Part Number
F
V
J
-
Package
FVJ : TSSOP-B8J
B D 8 2 0 0 1
Part Number
F
V
J
LBE2
Product class
LB for Industrial applications
Packaging and forming specification
E2: Embossed tape and reel
-
Package
FVJ : TSSOP-B8J
LBE2
Product class
LB for Industrial applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BD82000FVJ
D82000
BD82001FVJ
D82001
1PIN MARK
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Datasheet
BD82001FVJ-LB
Physical Dimension Tape and Reel Information
Package Name
TSSOP-B8J
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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BD82000FVJ-LB
Datasheet
BD82001FVJ-LB
Revision History
Date
Revision
13.Mar.2013
001
21.Feb.2014
002
Changes
New Release
Delete sentence “and log life cycle” in General Description and Futures (page 1).
Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1).
Applied new style (“title” and “Ordering Information”).
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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