Datasheet
2.55V/0.4A 1.8V/0.3A Output 2ch
Synchronous Buck Converter
Integrated FET
BD91501MUV
●Key Specifications
Input voltage range:
Output volatage:
Output voltage accuracy
Switching frequency:
Low Voltage Detection:
Maximum on duty:
Operating temperature range:
●Description
ROHM’s buck converter BD91501MUV is a 2ch output
power supply designed to produce a low voltage
including 2.55V/0.4A and 1.8V/0.3A from 3.3V power
supply line. Offers high efficiency with our original
pulse skip control technology and synchronous rectifier.
Employs a current mode control system to provide
faster transient response to sudden change in load.
●Package
VQFN016V3030:
●Features
Offers fast transient response with current mode
PWM control system.
Offers highly efficiency for all load range with
TM
synchronous rectifier (Pch/Nch FET) and SLLM
(Simple Light Load Mode)
Incorporates soft start function
Incorporates thermal protection and UVLO function
Incorporates short-current protection with timer
latch
Incorporates shutdown function Icc=0µA (Typ.)
Full 100% Duty function
2ch output power supply (2.55V, 1.8V)
2ch output ON/OFF individual control
Employs small surface mount package:
VQFN016V3030
2.55V to 5.5V
1.8V,2.55V
±1.5%
1.65MHz±20%
50%(Typ.)
100%
-30℃ to +105℃
(Typ.)
(Typ.)
(Max.)
3.00mm × 3.00 × 1.00mm
VQFN016V3030
●Typical Application Circuit
●Usage
Power supply for LSI including DSP, DDR(RAM), Micro
computer and ASIC
VIN
L1
AVCC
SW1
PVCC1
FB1
PVCC2
BD91501MUV
VOUT1
L2
SW2
VOUT2
FB2
Enable1
EN1
Enable2
EN2
Figure.1
○Product structure：Silicon monolithic integrated circuit
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Typical Application Circuit
○This product is not designed protection against radioactive rays.
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Datasheet
BD91501MUV
●Pin ConFigureuration(TOP VIEW)
AGND N.C.
12
11
N.C.
10
AVCC
9
ITH2
13
8
ITH1
FB2
14
7
FB1
EN2
15
6
EN1
SW2
16
5
SW1
1
PGND2
2
3
4
PVCC2 PVCC1 PGND1
Figure.2 Pin ConFigureuration
●Pin Description
Pin
No.
Pin
name
1
PGND2
2
Pin
No.
Pin
name
Ch2 Low side source pin
9
AVCC
PVcc2
Ch2 High side source pin
10
N.C.
Non connection (Please connect to AGND)
3
PVcc1
Ch1 High side source pin
11
N.C.
Non connection (Please connect to AGND)
4
PGND1
Ch1 Low side source pin
12
AGND
5
SW1
Ch1 Pch/Nch FET drain output pin
13
ITH2
6
EN1
Ch1 Enable pin (High Active)
14
FB2
Ch2 Output voltage detect pin
7
FB1
Ch1 Output voltage detect pin
15
EN2
Ch2 Enable pin (High Active)
8
ITH1
16
SW2
Ch2 Pch/Nch FET drain output pin
Pin Function
Ch1 gm amplifier output pin
/Connected phase compensation capacitor
Pin Function
Analog VCC pin
Analog GND pin
Ch2 gm amplifier output pin
/Connected phase compensation capacitor
●Block Diagram
gm Amp
gm Amp
AGND
Figure.3 Block Diagram
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Datasheet
BD91501MUV
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Power Supply Voltage
EN Voltage
SW Voltage
Power Dissipation
Operating temperature range
Storage temperature range
Maximum junction temperature
Symbol
Rating
Unit
VCC
VEN1
VEN2
Vsw1
Vsw2
Pd1
Pd2
Pd3
Pd4
Topr
Tstg
Tj
-0.3 to +7 *1
-0.3 to +7
-0.3 to +7
-0.3 to +7
-0.3 to +7
0.27 *2
0.62 *3
1.77 *4
2.66 *5
-30 to +105
-55 to +150
+150
V
V
V
V
V
W
W
W
W
℃
℃
℃
*1 Pd, ASO and Tj=150℃ should not be exceeded.
*2 IC only
2
*3 1-layer. mounted on a 74.2mm×74.2mm×1.6mm Glass-epoxy PCB,( Copper foil area:Surface 6.28mm
*4 4-layer. mounted on a 74.2mm×74.2mm×1.6mm Glass-epoxy PCB,( Copper foil area:Surface and bottom layer 6.28mm2,2nd and 3rd layer 5505mm2)
*5 4-layer. mounted on a 74.2mm×74.2mm×1.6mm Glass-epoxy PCB,(Copper foil area:all layers 5505mm2)
●Recommended Operating Ratings (Ta=-30 to +105℃)
Parameter
Symbol
AVCC
PVcc
VEN1
VEN2
Power Supply Voltage
EN Voltage
ISW1
SW average output current
ISW2
* Pd and ASO should not be exceeded.
Limits
Min.
Typ.
Max.
2.55
2.55
0
0
-
3.3
3.3
-
5.5
5.5
AVCC
AVCC
400*
6
300*
6
Unit
V
V
V
V
mA
mA
6
●Electrical Characteristics (Ta=25℃ AVCC=PVCC=3.3V, EN1=EN2=AVCC, unless otherwise specified. )
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Standby Current
ISTB
ICC
VENL
VENH
IEN
FOSC
Bias Current
EN Low Voltage
EN High Voltage
EN Input Current
Oscillation Frequency
RONP1
Pch FET ON Resistor
RONP2
RONN1
Nch FET ON Resistor
RONN2
FB1
FB2
Output Voltage
UVLO Threshold Voltage
UVLO Release Voltage
Soft Start Time
Timer Latch Time
Output Short circuit
Threshold Voltage
VUVLO1
VUVLO2
TSS
TLATCH
VSCP1
VSCP2
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2.0
1.32
2.512
1.773
2.20
2.22
0.45
0.62
-
0
500
GND
Vcc
1
1.65
0.85
0.85
0.65
0.65
2.55
1.8
2.30
2.35
0.9
1.24
1.275
0.9
3/22
10
800
0.8
10
1.98
1.56
1.56
1.3
1.3
2.588
1.827
2.40
2.50
1.8
2.48
1.77
1.26
µA
µA
V
V
µA
MHz
Ω
Ω
Ω
Ω
V
V
V
V
ms
ms
V
V
Conditions
EN1=EN2=0V
In stand-by mode
In active mode
VEN1=VEN2=2V
VCC=3.3V
VCC=3.3V
VCC=3.3V
VCC=3.3V
±1.5%
±1.5%
VCC=5V→0V
VCC=0V→5V
SCP/TSD ON
FB1=2.55→0V
FB2=1.8→0V
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Datasheet
BD91501MUV
●Characteristics data（Reference data）
（Ta=25℃,VCC=3.3V,VEN=3.3V,Unless Otherwise specified）
2.5
2.5
2.5
2.5
Ta=25℃
Io=0.3A
22
OUTPUT VOLTAGE[V]
OUTPUT VOLTAGE[V]
OUTPUT VOLTAGE[V]
33
OUTPUT VOLTAGE[V]
33
1.5
1.5
[VOUT1=2.55V]
[VOUT2=1.8V setting]
11
VCC=3.3V
Ta=25℃
Io=0A
22
1.5
1.5
11
[VOUT1=2.55V]
[VOUT2=1.8V setting]
0.5
0.5
0.5
0.5
00
00
1
0
0
2
1
3
2
3
4
11
0.5
0.5
00
4
1.5
1.5
3
3
3.5
3.5
Figure.5 VEN-VOUT
Figure.4 VCC-VOUT
3.5
3.5
2.65
2.6
O U T P U T V O L T A G E [V
33
2.5
2.5
OUTPUT VOLTAGE[V]
OUTPUT VOLTAGE[V]
2.5
2.5
EN[V]
EN[V]
VCC[V]
VCC[V]
OUTPUT VOLTAGE[V]
2
2
22
1.5
1.5
[VOUT1=2.55V]
[VOUT2=1.8V setting]
11
0.5
0.5
00
00
200
200
400
400
600
600
800
800
1000
1000
Io[m
A]
IO[mA]
[VOUT1=2.55V]
2.55
2.5
2.5
2.45
VCC=3.3V
Io=0A
2.45
2.4
2.4
2.35
2.35
2.3
-40
-40
-20
-20
0
0
20
20
40
40
60
60
Ta[℃]
80
80
100
100
Ta[℃]
Figure.6 IOUT-VOUT
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2.6
2.55
Figure.7 Ta-VOUT1
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Datasheet
BD91501MUV
1.85
1.86
100
100
1.82
1.83
80
80
70
70
1.79
1.8
VCC=3.3V
Io=0A
1.76
1.77
[VOUT1=2.55V]
[VOUT2=1.8V setting]
60
60
効 率 [% ]
Efficiency[%]
OUTPUT VOLTAGE[V]
O U T P U T V O L T A G E [V
90
90
[VOUT2=1.8V setting]
50
50
VCC=3.3V
Ta=25℃
40
40
30
30
1.73
1.74
20
20
10
10
1.71
1.7
-40
-40
-20
-20
0
0
20
20
40
40
60
60
80
80
0
0
100
100
10
100
100
10
Ta[℃]
1000
1000
Io[m A]
Ta[℃]
Io[mA]
Figure.9 Efficiency
Figure.8 Ta-VOUT2
22
1.8
1.8
1.91.9
1.7
1.7
f[MHz]
1.71.7
f [M H z ]
f[MHz]
1.81.8
VCC=3.3V
1.61.6
1.6
1.6
Ta=25℃
1.5
1.5
1.51.5
1.4
1.4
1.41.4
1.31.3
-40
-40
-20
-20
00
20
20
40
40
60
60
8080
1.3
1.3
2.55
2.55
100
100
Ta「℃]
Ta[℃]
3.55
3.55
4.05
4.05
4.55
4.55
5.05
5.05
5.50
Vcc[V]
Figure.11 VCC-Fosc
Figure.10 Ta-Fosc
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3.05
3.05
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Datasheet
BD91501MUV
1.2
1.2
22
PMOS Io=0.3A
1.8
1.8
11
1.6
1.6
1.4
1.4
0.8
0.8
NMOS Io=0.3A
0.4
0.4
E N [V ]
0.6
0.6
EN[V]
Ron[Ω]
R o n [Ω ]
1.2
1.2
11
0.8
0.8
VCC=3.3V
0.6
0.6
0.4
0.4
VCC=3.3V
0.2
0.2
0.2
0.2
00
-40
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
Ta[℃]
00
-40
-40
-20
-20
0
0
Ta[℃]
20
20
40
40
Ta[℃]
60
60
80
80
100
100
Ta[℃]
Figure.12 Ta-RONN, RONP
Figure.13 Ta-VEN1, VEN2
600
600
500
500
Ip v c c a v c c [u A ]
Iccact[µA]
VCC=3.3V, Ta=25℃
EN1=EN2
[2V/div]
400
400
300
300
VOUT1
[1V/div]
200
200
Vout1=2.55V
Vout2=1.8V
100
100
VOUT2
[1V/div]
0
-40
-40
-20
-20
0
0
20
20
40
40
60
60
80
80
100
100
time
[400µsec/div]
Ta[℃]
Ta[℃]
Figure.14 Ta-ICC
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Figure.15 Soft start waveform
（Io=0mA）
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Datasheet
BD91501MUV
SW1
[2V/div]
EN1=EN2
[2V/div]
VCC=3.3V, Ta=25℃
VCC=3.3V, Ta=25℃
VOUT1
[1V/div]
Vout1=2.55V
Vout2=1.8V
VOUT2
[1V/div]
time
VOUT1
[50mV/div]
time
[400µsec/div]
[400nsec/div]
Figure.17 SW waveform 1
(Io=0mA)
Figure.16 Soft start waveform
（Io=0.3A）
SW1
[2V/div]
SW2
[2V/div]
VCC=3.3V, Ta=25℃
VCC=3.3V, Ta=25℃
VOUT2
[50mV/div]
VOUT1
[50mV/div]
time
time
[400nsec/div]
Figure.19 SW waveform 2
(Io=0mA)
Figure.18 SW waveform 1
(Io=0.25A)
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[400nsec/div]
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Datasheet
BD91501MUV
SW2
[2V/div]
VOUT1
[50mV/div]
VCC=3.3V, Ta=25℃
VCC=3.3V, Ta=25℃
VOUT2
[50mV/div]
Io
[100mA/div]
time
[400nsec/div]
time
Figure.20 SW waveform 2
(Io=0.25A)
VOUT1
[50mV/div]
[10µsec/div]
Figure.21 VOUT1 Transient response
(Io=10mA→0.25A)
VOUT2
[50mV/div]
VCC=3.3V, Ta=25℃
VCC=3.3V, Ta=25℃
Io
[100mA/div]
Io
[100mA/div]
time
[10µsec/div]
time
Figure.23 VOUT2 Transient response
(Io=10mA→0.25A)
Figure.22 VOUT1 Transient response
(Io=0.25A→10mA)
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[10µsec/div]
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Datasheet
BD91501MUV
VOUT2
[50mV/div]
VCC=3.3V, Ta=25℃
Io
[100mA/div]
time
[10µsec/div]
Figure.24 VOUT2 Transient response
(Io=0.25A→10mA)
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Datasheet
BD91501MUV
●Operation
BD91501MUV is a synchronous Buck Converter that achieves faster transient response by employing current mode PWM
control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes
TM
SLLM (Simple Light Load Mode) operation for lighter load to improve efficiency.
○Synchronous rectifier
It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC, and
its P.N junction shoot-through protection circuit limits the shoot-through current during operation, by which the power
dissipation of the set is reduced.
○Current mode PWM control
Synthesizes a PWM control signal with the inductor current feedback loop added to the voltage feedback. Offers fast
transient response with current mode control system. Improves output voltage drop of load rapid change.
Load response IO=10mA→250mA
Vo
0.5[V/DIV]
Transient response IO=250mA→10mA
Vo
0.5[V/DIV]
Io
100[mA/DIV]
Io
100[mA/DIV]
Figure.25 Transient response
・PWM (Pulse Width Modulation) control
The oscillation frequency for PWM is 1.65 MHz. SET signal form OSC turns ON a highside MOS FET (while a lowside
MOS FET is turned OFF), and an inductor current IL increases. The current comparator (Current Comp) receives two
signals, a current feedback control signal (SENSE: Voltage converted from IL) and a voltage feedback control signal (FB),
and issues a RESET signal if both input signals are identical to each other, and turns OFF the highside MOS FET (while a
lowside MOS FET is turned ON) for the rest of the fixed period. The PWM control repeat this operation.
TM
Efficiency η[%]
・SLLM (Simple Light Load Mode) control
When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching pulse is
designed to turn OFF with the device held operated in normal PWM control loop, which allows linear operation without
voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa.
Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current Comp,
it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching is tuned
OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces the switching
dissipation and improves the efficiency.
100
SLLM
①
50
PWM
①Improvements by
SLLM control
0
0.001
0.01
0.1
1
Output current Io[A]
Figure.26 Efficiency characteristics
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Datasheet
BD91501MUV
・100% Duty control
Maximum Duty is 100% (Pch MOSFET is always ON). If output voltage cannot keep steady because of input voltage
drop for normal PWM control, oscillation frequency gets low, and becomes 100% Duty finally. Output voltage value is the
dropped value of Pch MOSFET’s ON voltage so that even low input voltage can keep output voltage.
SENSE
Current
Comparator
RESET
VOUT
Level
Shift
R Q
FB
SET
IL
S
Driver
Logic
gm Amp.
VOUT
SW
Load
ITH
OSC
Figure.27 Current mode PWM control block diagram
PVCC
Current
Comparator
SET
PVCC
SENSE
Current
SENSE
Comparator
FB
FB
GND
SET
GND
RESET
GND
RESET
GND
SW
GND
SW
IL
GND
IL(AVE)
IL
0A
VOUT
VOUT
VOUT(AVE)
VOUT(AVE)
No switching
Figure.29 SLLMTM Switching timing chart
Figure.28 PWM Switching timing chart
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Datasheet
BD91501MUV
・Soft-start function
EN terminal shifted to “High” activates a soft-starter to gradually establish the output voltage with the current limited during
startup, by which it is possible to prevent an overshoot of output voltage and an inrush current.
・Shutdown function
With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference voltage
circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0μA (Typ.).
・UVLO function
Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied. And the hysteresis width
of 50mV (Typ.) is provided to prevent output chattering.
Hysteresis 50mV
VCC
EN1,2
VOUT1, VOUT2
Tss
Tss
Tss
Soft start
Standby mode
Operating mode
Standby
mode
Operating mode
UVLO
UVLO
Standby
mode
Operating mode
EN
Standby mode
UVLO
Figure.30 Soft start, Shut down, UVLO Timing chart
・Short-current protection circuit with time delay function
Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for
the fixed time(TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking
UVLO.
EN1＝EN2
Output Short circuit
Threshold Voltage
VOUT1
Output OFF
Latch
VOUT2
IL Limit
IL1
IL2
t1 IRMS(max.)
IOUT
When VCC=2×VOUTIRMS=
Figure.35 Input capacitor
2
Example) for BD91501MUV, if VCC=3.3V, VOUT=2.55V, IOUTmax.=0.3A,
2.55(3.3 - 2.55)
0.3
0.126(A RMS)
3.3
A low ESR 22µF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency.
4. Determination of RITH, CITH that works as a phase compensator
As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area
due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high
frequency area due to the output capacitor and its ESR. So, the phases are easily compensated by adding a zero to the
power amplifier output with C and R as described below to cancel a pole at the power amplifier.
fp(Min.)
A
Gain
[dB]
0
fz(ESR)
IOUTMin.
Phase
[deg]
1
2π×RO×CO
1
fz(ESR)=
2π×ESR×CO
fp=
fp(Max.)
IOUTMax.
Pole at power amplifier
When the output current decreases, the load resistance Ro
increases and the pole frequency lowers.
0
-90
fp(Min.)=
1
[Hz]←with lighter load
2π×ROMax.×CO
fp(Max.)=
1
2π×ROMin.×CO
Figure.36 Open loop gain characteristics
A
fz(Amp.)
[Hz] ←with heavier load
Zero at power amplifier
Gain
[dB]
Increasing capacitance of the output capacitor lowers the
pole frequency while the zero frequency does not
change. (This is because when the capacitance is
doubled, the capacitor ESR reduces to half.)
0
0
Phase
[deg]
-90
fz(Amp.)=
1
2π×RITH×CITH
Figure.37 Error Amp phase compensation characteristics
Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load
resistance with CR zero correction by the error amplifier.
fz(Amp.)= fp(Min.)
1
2π×RITH×CITH
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=
1
2π×ROMax.×CO
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Datasheet
BD91501MUV
●Application Example
Vcc
CITH1
RITH1
L1
ITH1
FB1
EN1
AVcc
SW1
VOUT1
COUT1
PGND1
CIN1
N.C.
PVcc1
N.C.
PVcc2
AGND
PGND2
CIN2
COUT2
ITH2
FB2
EN2
SW2
VOUT2
RITH2
L2
CITH2
Figure.38 Application Example
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●Evaluation
Top Silk
Top layer
Bottom Silk
Bottom Layer
Figure.39 Layout Diagram
①
②
Layout the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the
pin PGND.
Layout CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring.
※VQFN016V3030 (BD91501MUV) has thermal PAD on the reverse of the package.
The package thermal performance may be enhanced by bonding the PAD to GND plane which take a large area of
PCB.
●Recommended components Lists on above application
Symbol
L1,2
Type
Inductor
Value
2.2µH
Manufacturer
TOKO
Part Number
DE2818C 1072AS-2R2M
CIN1,CIN2
Ceramic capacitor
22µF
Murata
GRM32EB11A226KE20
Cout1,Cout2
Ceramic capacitor
22µF
Murata
GRM31CB30J226KE18
CITH1
Ceramic capacitor
330pF
Murata
CRM18 Series
RITH1
Resistor
91kΩ
Rohm
MCR03 Series
CITH2
Ceramic capacitor
330pF
Murata
GRM18 Series
RITH2
Resistor
75kΩ
Rohm
MCR03 Series
※ The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit
characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to
accommodate variations between external devices and this IC when employing the depicted circuit with other circuit
constants modified. Both static and transient characteristics should be considered in establishing these margins. When
switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC
pins, and a schottky barrier diode or snubber established between the SW and PGND pins.
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●I/O equivalence circuit
・EN1,EN2 pin
EN1,EN2
・SW1,SW2 pin
88K
PVCC
PVCC
PVCC
10K
SW1/SW2
1120K
300K/250K
・FB1,FB2 pin
・ITH1,ITH2 pin
AVCC
850K/500K
FB1/FB2
43.75
ITH1,ITH2
400K/400K
10K
Figure.40 I/O equivalence circuit
●Operational Notes
1. Absolute Maximum Ratings
While utmost care is taken to quality control of this product, any application that may exceed some of the absolute
maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken,
short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed
the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of
fuses.
2. Electrical potential at GND
GND must be designed to have the lowest electrical potential In any operating conditions.
3. Short-circuiting between terminals, and mismounting
When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so
may result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between
output and power supply or GND may also cause breakdown.
4. Thermal shutdown protection circuit
Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to
protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not be
used thereafter for any operation originally intended.
5. Inspection with the IC set to a pc board
If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the
capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper
grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the
inspection process, be sure to turn OFF the power supply before it is connected and removed.
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6. Input to IC terminals
This is a monolithic IC with P+ isolation between P-substrate and each element as illustrated below.
N-layer of each element form a P-N junction, and various parasitic element are formed.
This P-layer and the
If a resistor is joined to a transistor terminal as shown in Figure 41.
○P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or
GND>Terminal B (at transistor side); and
○if GND>Terminal B (at NPN transistor side),
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.
The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in
activation of parasitic elements.
Resistor
Transistor (NPN)
Pin A
Pin B
C
B
Pin B
E
Pin A
N
N
P
N
+
P
P
+
N
GND
Parasitic element
P
Parasitic
element
P substrate
B
N
P+
P
C
+
N
E
P substrate
GND
Parasitic element
GND
GND
Parasitic
element
Other adjacent elements
Figure.41 Simplified structure of monoclinic IC
7. Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from
the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring
pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention
not to cause fluctuations in the GND wiring pattern of external parts as well.
8 . Selection of inductor
It is recommended to use an inductor with a series resistance element (DCR) 0.1Ω or less. Especially, note that use of a
high DCR inductor will cause an inductor loss, resulting in decreased output voltage. Should this condition continue for a
specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched
OFF. When using an inductor over 0.1Ω, be careful to ensure adequate margins for variation between external devices and
this IC, including transient as well as static characteristics. Furthermore, in any case, it is recommended to start up the
output with EN after supply voltage is within operation range.
●Ordering Information
B
D
9
1
5
0
Part Number
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M U
―
V
E
2
Package
Packaging and forming specification
MUV : VQFN016V3030
E2 : Embossed taping and reel
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Datasheet
BD91501MUV
●Physical Dimension Tape and Reel Information
VQFN016V3030
3.0±0.1
3.0±0.1
0.5
5
13
0.75
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
16
8
12
E2
9
1.4±0.1
0.4±0.1
1
3000pcs
(0.22)
1.4±0.1
+0.03
0.02 −0.02
1.0MAX
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
+0.05
0.25 −0.04
1pin
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram (TOP VIEW)
VQFN016V3030
Product Name
D 9 1
LOT Number
5 0 1
1PIN MARK
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●Revision History
Date
31.Aug.2012
Revision
001
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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