BD9528MUV-E2

Hi-performance Regulator IC Series for PCs Main Power Supply ICs for Note PC (Linear Regulator Integrated) BD9528MUV No.10030EAT26 ●Description BD9528MUV is a 2ch switching regulator controller with high output current which can achieve low output voltage (1.0V～ 5.5V) from a wide input voltage range (5.5V～28V). High efficiency for the switching regulator can be realized by utilizing an external N-MOSFET power transistor. A new technology called H3RegTM(High speed, High efficiency, High performance) is a Rohm proprietary control method to realize ultra high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, 2ch LDO (5V/100mA, 3.3V/100mA), the soft start function, variable frequency function, short circuit protection function with timer latch, over voltage protection, and Power good function are all built in. This switching regulator is specially designed for Main Power Supply of laptop PC. ●Features 1) 2ch H3REGTM DC/DC Converter controller 2) Adjustable Simple Light Load Mode (SLLM), Quiet Light Load Mode (QLLM) and Forced continuous Mode 3) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Over Current Protection (OCP), Over Voltage Protection (OVP), Short circuit protection with 0.75ms timer-latch (SCP) 4) Soft start function to minimize rush current during startup 5) Switching Frequency Variable (f=200kHz～500kHz) 6) Built-in Power good circuit 7) Built-in 2ch Linear regulator (5V/100mA,3.3V/100mA) 8) Built in reference voltage(0.7V) 9) VQFN032V5050 package 10) Built-in BOOT-Di 11) Built-in output discharge ●Applications Laptop PC, Desktop PC, LCD-TV, Digital Components www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/33 2010.03 - Rev.A BD9528MUV ●Absolute maximum ratings (Ta=25℃) Parameter Symbol VIN, CTL,SW1,SW2 EN1, EN2, PGOOD1, PGOOD2 Vo1, Vo2, MCTL1, MCTL2 FS1, FS2, FB1, FB2, ILIM1, ILIM2, SS1, SS2, LG1, LG2, REF,REG2 BOOT1, BOOT2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 HG1 HG2 PGND1, PGND2 Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limits 30 *1*2 6 *1*2 REG1+0.3 *1 35 *1*2 7 *1*2 BOOT1+0.3 *1*2 BOOT2+0.3 *1*2 AGND±0.3 *1*2 0.38 *3 0.88 *4 3.26 *5 6 4.56 * -20～+100 -55～+150 +150 Technical Note Unit V V V V V V V V W W W W ℃ ℃ ℃ Terminal Voltage Power Dissipation1 Power Dissipation2 Power Dissipation3 Power Dissipation4 Operating temperature Range Storage temperature Range Junction Temperature *1 Do not however exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board ) *4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB which has 1 layer. (Copper foil area : 20.2mm2) *5 Reduced by 26.1mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB which has 4 layers. (1st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2) *6 Reduced by 36.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 74.2mm×74.2mm×1.6mm Glass-epoxy PCB which has 4 layers. (All copper foil area : 5505mm2) ●Operating conditions(Ta=25℃) Parameter Symbol VIN CTL EN1, EN2, MCTL1, MCTL2 BOOT1, BOOT2 SW1, SW2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 Vo1, Vo2, PGOOD1, PGOOD2 TONmin MIN. 5.5 -0.3 -0.3 4.5 -0.3 -0.3 -0.3 MAX. 28 28 5.5 33 28 5.5 5.5 150 Unit V V V V V V V nsec Terminal Voltage MIN ON TIME ★ This product should not be used in a radioactive environment. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristics (unless otherwise noted, Ta=25℃ VIN=12V, CTL=OPEN, EN1=EN2=5V, FS1=FS2=51kΩ) Standard Value Parameter VIN standby current VIN bias current VIN shut down mode current CTL Low Voltage CTL High Voltage CTL bias current EN Low Voltage EN High Voltage EN bias current [5V linear regulator](VIN) REG1 output voltage Maximum current Line Regulation Load Regulation [3.3V linear regulator] REG2 output voltage Maximum current Line Regulation Load Regulation [5V linear regulator](Vo1) Input threshold voltage Input delay time Switch resistance [Under Voltage lock out block] REG1 threshold voltage Hysteresis voltage [Output voltage sense block] Feedback voltage1 FB1 bias current Output discharge resistance1 Feedback voltage2 FB2 bias current Output discharge resistance2 VFB1 IFB1 RDISOUT1 VFB2 IFB2 RDISOUT2 0.693 50 0.693 50 0.700 0 100 0.700 0 100 0.707 1 200 0.707 1 200 V μA Ω V μA Ω REG1_UVLO dV_UVLO 3.9 50 4.2 100 4.5 200 V mV REG1th TREG1 RREG1 4.1 1.5 4.4 3.0 1.0 4.7 6.0 3.0 V ms Ω VREG2 IREG2 Reg.l2 Reg.L2 3.27 100 3.30 3.33 20 30 V mA mV mV VREG1 IREG1 Reg.l1 Reg.L1 4.90 100 5.00 90 30 5.10 180 50 V mA mV mV Symbol MIN. ISTB IIN ISHD VCTLL VCTLH ICTL VENL VENH IEN 70 60 6 -0.3 2.3 -18 -0.3 2.3 TYP. 150 130 12 -12 3 MAX. 250 230 18 0.8 28 -6 0.8 5.5 6 μA μA μA V V μA V V μA Unit Technical Note Condition CTL=5V, EN1=EN2=0V Vo1=5V CTL=0V CTL=0V EN=3V IREG1=1mA IREG2=0mA VIN=5.5 to 25V IREG1=0 to 30mA IREG2=1mA IREG1=0mA VIN=5.5 to 25V IREG2=0 to 30mA Vo1: Sweep up REG1: Sweep up REG1, Sweep down FB1=REF FB2=REF www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristics – Continued (unless otherwise noted, Ta=25℃ VIN=12V, CTL=OPEN, EN1=EN2=5V, FS1=FS2=51kΩ) Standard Value Parameter [H3REG block] Ontime1 Ontime2 Maximum On time 1 Maximum On time 2 Minimum Off time [FET driver block] HG higher side ON resistor HG lower side ON resistor LG higher side ON resistor LG lower side ON resistor [Over voltage protection block] OVP threshold voltage OVP Hysteresis [Short circuit protection block] SCP threshold voltage Delay time [Current limit protection block] Offset voltage [Power good block] Power good low threshold Power good low voltage Delay time Power good leakage current [Soft start block] Charge current Standby voltage [Mode control block] MCTL Low voltage MCTL High voltage MCTL bias current VMCTL_L VMCTL_H IMCTL -0.3 2.3 8 16 0.3 REG1 +0.3 24 V V μA ISS VSS_STB 1.5 2.3 3.1 50 μA mV VPGTHL VPGL TPGOOD ILEAKPG 0.525 (-25%) 0.4 -2 0.595 (-15%) 0.1 0.75 0 0.665 (-5%) 0.2 1.5 2 V V ms μA dVSMAX 80 100 120 mV VSCP TSCP 0.42 (-40%) 0.4 0.49 (-30%) 0.75 0.56 (-20%) 1.5 V ms VOVP dV_OVP 0.77 (+10%) 50 0.84 (+20%) 150 0.91 (+30%) 300 V mV HGHON HGLON LGHON LGLON 3.0 2.0 2.0 0.5 6.0 4.0 4.0 1.0 Ω Ω Ω Ω TON1 TON2 TONMAX1 TONMAX2 TOFFMIN 0.760 0.470 2.5 1.65 0.910 0.620 5 3.3 0.2 1.060 0.770 10 6.6 0.4 μs μs μs μs μs Symbol MIN. TYP. MAX. Unit Technical Note Condition Vo1=5V Vo2=3.3V Vo1=5V Vo2=33V ILIM=100kΩ IPGOOD=1mA VPGOOD=5V MCTL=5V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/33 2010.03 - Rev.A BD9528MUV ●Output condition table Input EN1 Low Low High High Low Low High High Output REG2(3.3V) DC/DC1 OFF OFF OFF OFF OFF OFF OFF OFF ON OFF ON OFF ON ON ON ON Technical Note CTL Low Low Low Low High High High High EN2 Low High Low High Low High Low High REG1(5V) OFF OFF OFF OFF ON ON ON ON DC/DC2 OFF OFF OFF OFF OFF ON OFF ON ※ CTL pin is connected to VIN pin with 1MΩ resistor(pull up) internal IC. ※ EN pin is connected to AGND pin with 1MΩ resistor(pull down) internal IC. ●Block Diagram, Application circuit Vo2 Adjustable Vo1 Adjustable BOOT2 VIN BOOT1 VIN PGND2 3 2 1 31 REG1 32 REG1 22 23 24 26 PGND1 25 SW2 SW1 HG2 HG1 LG2 REG1 REG1 LG1 AGND Short through Protection Circuit SLLMTM Block CL1 SCP1 OVP1 CL2 SCP2 OVP2 13 Short through Protection Circuit SLLMTM Block FS2 10 Short Circuit Protect SCP2 REG1 MCTL MCTL FS1 15 SCP1 RFS1 Short Circuit Protect 5 PGOOD2 20 PGOOD1 Power Good Over Voltage Protect OVP2 Timer Timer Timer Power Good FS2 FS1 EN2 TSD EN1 FB2 REF UVLO Timer H3RegTM Controller Block H3RegTM Controller Block Over Voltage Protect OVP1 FB1 REF Thermal Protection 11 6 SS2 Over Current Protect CL2 14 REF 12 SS1 19 Over Current Protect CL1 ILIM2 REF ILIM1 17 PGND1 SW1 8 SW2 PGND2 MCTL EN2 4 Vo1 5V Reg 3.3V Reg SLLM Mode Control Reference Block REG1 EN1 21 MCTL1 MCTL2 Vo2 VIN CTL REG1 1uF 5.5～28V REG1 VIN REG2 REG2 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3.3V 5V Vo1 7 9 30 29 28 18 16 27 5/33 2010.03 - Rev.A REG1 BD9528MUV ●Pin Configuration PGOOD1 BOOT1 MCTL1 ILIM1 SW1 HG1 EN1 SS1 Technical Note 24 PGND1 LG1 Vo1 REG2 REG1 VIN LG2 PGND2 25 26 27 28 29 30 31 32 1 SW2 23 22 21 20 19 18 17 16 15 14 MCTL2 FS1 FB1 AGND Input MCTL1 Low Low High High MCTL2 Low High Low High Control Mode SLLM QLLM Forced Continuous Mode Forced Continuous Mode FIN 13 12 REF 11 10 9 2 HG2 3 BOOT2 4 EN2 5 PGOOD2 6 SS2 7 Vo2 8 ILIM2 FB2 FS2 CTL ※MCTL pin is connected to AGND pin with 500kΩ resistor ( pull down) internal IC ●Pin Function Table PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 reverse PIN name SW2 HG2 BOOT2 EN2 PGOOD2 SS2 Vo2 ILIM2 CTL FS2 FB2 REF AGND FB1 FS1 MCTL2 ILIM1 MCTL1 SS1 PGOOD1 EN1 BOOT1 HG1 SW1 PGND1 LG1 Vo1 REG2 REG1 VIN LG2 PGND2 FIN PIN Function Highside FET source pin 2 Highside FET gate drive pin 2 HG Driver power supply pin 2 Vo2 ON/OFF pin (High=ON, Low,OPEN=OFF) Vo2 Power Good Open Drain Output pin Vo2 Soft start pin Vo2 Output voltage sense pin OCP setting pin 2 Linear regulator ON/OFF pin (High,OPEN=ON, Low=OFF) Input pin for setting Vo2 frequency Vo2 output voltage feedback pin Output voltage setting pin Input pin Ground Vo1 output voltage feedback pin Input pin for setting Vo1 frequency Mode switch pin 2 ( OPEN = L ) OCP setting pin 1 Mode switch pin 1 ( OPEN = L ) Vo1 Soft start pin Vo1 Power Good Open Drain Output pin Vo1 ON/OFF pin (High=ON, Low,OPEN=OFF) HG Driver power supply pin Highside FET gate drive pin 1 Highside FET source pin 1 Lowside FET source pin 1 Lowside FET gate drive pin 1 Vo1 Output voltage sense pin 3.3V Linear regulator output pin 5V Linear regulator output pin Power supply input pin Lowside FET gate drive pin 2 Lowside FET source pin 2 Exposed Pad1, connect to GND www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristic curves (Reference data) Technical Note HG 10V/div SW 10V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div LG 5V/div LG 5V/div 2us Fig.1 Switching Waveform (Vo=5V, PWM, Io=0A) 2us Fig.2 Switching Waveform (Vo=5V, PWM, Io=8A) 10us Fig.3 Switching Waveform (Vo=5V, QLLM, Io=0A) LG 5V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div 10us Fig.4 Switching Waveform (Vo=5V, SLLM, Io=0A) LG 5V/div 2us Fig.5 Switching Waveform (Vo=3.3V, PWM, Io=0A) LG 5V/div 2us Fig.6 Switching Waveform (Vo=3.3V, PWM, Io=8A) LG 5V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div 10us Fig.7 Switching Waveform (Vo=3.3V, QLLM, Io=0A) LG 5V/div 10us Fig.8 Switching Waveform (Vo=3.3V, SLLM, Io=0A) LG 5V/div 2us Fig.9 Switching Waveform (Vo=1V, PWM, Io=0A) LG 5V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div HG 10V/div SW 10V/div 2us Fig.10 Switching Waveform (Vo=1V, PWM, Io=8A) LG 5V/div 10us Fig.11 Switching Waveform (Vo=1V, QLLM, Io=0A) LG 5V/div 10us Fig.12 Switching Waveform (Vo=1V, SLLM, Io=0A) LG 5V/div www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristic curves (Reference data) – Continued 100 80 60 40 20 0 1 10 100 Io[mA] 1000 10000 Technical Note 100 80 100 80 7V η[%] η[%] 7V 12V 21V 40 20 0 1 10 21V η[%] 7V 12V 60 12V 60 40 20 0 1 10 21V 100 Io[mA] 1000 10000 100 Io[mA] 1000 10000 Fig.13 Efficiency (Vo=5V, PWM) Fig.14 Efficiency (Vo=5V, QLLM) Fig.15 Efficiency (Vo=5V, SLLM) 100 100 100 80 5V 80 80 7V 60 η[%] 40 20 0 1 10 100 Io[mA] 7V 12V η[%] 12V η[%] 60 40 20 0 7V 60 12V 40 20 0 21V 21V 21V 1000 10000 1 10 100 Io[mA] 1000 10000 1 10 100 Io[mA] 1000 10000 Fig.16 Efficiency (Vo=3.3V, PWM) Fig.17 Efficiency (Vo=3.3V, QLLM) Fig.18 Efficiency (Vo=3.3V, SLLM) 100 80 60 η[%] 40 20 0 1 10 100 Io[mA] 1000 10000 100 100 7V 12V 21V η[%] 80 60 40 20 0 1 7V 12V 21V η[%] 80 60 40 20 0 7V 12V 21V 10 100 Io[mA] 1000 10000 1 10 100 Io[mA] 1000 10000 Fig.19 Efficiency (Vo=1V, PWM) 20us Vo 100mV/div Fig.20 Efficiency (Vo=1V, QLLM) 20us Vo 100mV/div Fig.21 Efficiency (Vo=1V, SLLM) 20us Vo 100mV/div IL 5A/div Io 5A/div IL 5A/div Io 5A/div IL 5A/div Io 5A/div Fig.22 Transient Response (Vo=5V, PWM, Io=0→8A) Fig.23 Transient Response (Vo=5V, PWM, Io=8→0A) Fig.24 Transient Response (Vo=3.3V, PWM, Io=0→8A) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristic curves (Reference data) – Continued 20us Vo 100mV/div Technical Note 20us Vo 100mV/div 20us Vo 100mV/div IL 5A/div Io 5A/div IL 5A/div Io 5A/div Fig.25 Transient Response (Vo=3.3V, PWM, Io=8→0A) Fig.26 Transient Response (Vo=1V, PWM, Io=0→8A) Fig.27 Transient Response (Vo=1V, PWM, Io=8→0A) IL 5A/div Io 5A/div Vo 50mV/div Vo 50mV/div Vo 50mV/div 2us Fig.28 Output Voltage (Vo=5V, PWM, Io=0A) 2us Fig.29 Output Voltage (Vo=5V, PWM, Io=8A) 10us Fig.30 Output Voltage (Vo=5V, QLLM, Io=0A) Vo 50mV/div Vo 50mV/div Vo 50mV/div 2us Fig.31 Output Voltage (Vo=5V, SLLM, Io=0A) 2us Fig.32 Output Voltage (Vo=3.3V, PWM, Io=0A) 2us Fig.33 Output Voltage (Vo=3.3V, PWM, Io=8A) Vo 50mV/div Vo 50mV/div Vo 50mV/div 10us Fig.34 Output Voltage (Vo=3.3V, QLLM, Io=0A) 2us Fig.35 Output Voltage (Vo=3.3V, SLLM, Io=0A) 2us Fig.36 Output Voltage (Vo=1V, PWM, Io=0A) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristic curves (Reference data) – Continued Technical Note Vo 50mV/div Vo 50mV/div Vo 50mV/div 2us Fig.37 Output Voltage (Vo=1V, PWM, Io=8A) 10us Fig.38 Output Voltage (Vo=1V, QLLM, Io=0A) 2us Fig.39 Output Voltage (Vo=1V, SLLM, Io=0A) EN1 5V/div Vo1 2V/div EN2 5V/div Vo2 2V/div EN1 5V/div Vo1 2V/div EN2 5V/div Vo2 2V/div EN1 5V/div Vo1 2V/div EN2 5V/div Vo2 2V/div Fig.40 Wake up waveform (EN1=EN2) Fig.41 Wake up waveform (EN2→EN1) Fig.42Wake up waveform (EN1→EN2) IOUT-frequency (VOUT=5V, R(FS)=68kΩ) IOUT-frequency (VOUT=5V, R(FS)=68kΩ) 500 EN1 5V/div frequency [kHz] 500 400 VIN=7.5V VIN=12V VIN=18V frequency [kHz] PGOOD1 2V/div EN2 5V/div PGOOD2 2V/div 450 450 400 VIN=7.5V VIN=12V VIN=18V 350 350 300 0 1 2 3 4 5 6 7 IOUT [A] 300 0 1 2 3 4 5 6 7 IOUT [A] Fig.43Wake up waveform (EN1/2→PGOOD1/2) Fig.44 Io-frequency (Vo=5V, PWM, RFS=68kΩ) Fig.45 Io-frequency (Vo=3.3V, PWM, RFS=68kΩ) 2.5 VOUT=5V VOUT=3.3V 700 600 VOUT=5V 500 frequency [kHz] 400 300 200 VOUT=3.3V VOUT [V] 5.500 5.000 2 ONTIME [usec] 4.500 4.000 3.500 3.000 2.500 2.000 1.500 1.000 0.500 VIN=7.5V(-5℃） VIN=21V（-5℃） VIN=7.5V(75℃） VIN=21V（75℃） 1.5 1 0.5 100 0 0 50 RFS [kΩ] 100 150 0 0 50 RFS [kΩ] 100 150 0.000 0 2 4 6 8 IOUT [A] 10 12 14 16 Fig.46 FS-ONTIME Fig.47 FS-frequency Fig.48 Ta-IOCP (Vo=5V) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/33 2010.03 - Rev.A BD9528MUV ●Electrical characteristic curves (Reference data) – Continued IOUT - REG1 voltage 3.500 Technical Note IOUT - REG2 voltage 3.4 3.3 REG2 voltage [V] 3.2 3.1 3 2.9 2.8 5.1 5 VIN=7.5V(-5℃） 3.000 REG1 voltage [V] 2.500 VIN=21V（-5℃） VIN=7.5V(75℃） VIN=21V（75℃） 4.9 4.8 4.7 4.6 VOUT [V] 2.000 1.500 1.000 0.500 4.5 0 .000 0 2 4 6 8 IOUT [A] 10 12 14 16 0 50 100 150 200 250 0 50 100 150 200 250 IOUT [mA] IOUT [mA] Fig.49 Ta-IOCP (Vo=3.3V) Fig.50 IREG1-REG1 Fig.51 IREG2-REG2 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/33 2010.03 - Rev.A BD9528MUV ●Pin Descriptions Technical Note ・VIN (30 pin) This is the main power supply pin. The input supply voltage range is 5.5V to 25V. The duty cycle of BD9528MUV is determined by input voltage and control output voltage. Therefore, when VIN voltage fluctuated, the output voltage also becomes unstable. Since VIN line is also the input voltage of switching regulator, stability depends on the impedance of the voltage supply. It is recommended to establish bypass capacitor and CR filter suitable for the actual application. ・CTL (9 pin) When CTL pin voltage is at least 2.3V, the status of the linear regulator output becomes active (REG1=5V, REG2=3.3V). Conversely, the status switches off when CTL pin voltage goes lower than 0.8V. The switching regulator doesn’t become active when the status of CTL pin is low, if the status of EN pin is high. (※CTL pin is connected to VIN pin with 1MΩ resistor(pull up) internal IC) ・EN1, 2 (21 pin, 4 pin) When EN pin voltage is at least 2.3V, the status of the switching regulator becomes active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V. (※EN pin is connected to AGND pin with 1MΩ resistor(pull down) internal IC) ・REG1 (29 pin) This is the output pin for 5V linear regulator and also active in power supply for driver and control circuit of the inside. The standby function for REG1 is determined by CTL pin. The voltage is 5V, with 100mA current ability. It is recommended that a 10μF capacitor (X5R or X7R) be established between REG1 and GND. ・REG2 (28 pin) This is the output pin for 3.3V linear regulator. The standby function for REG2 is determined by CTL. The voltage is 3.3V, with 50mA current ability. It is recommended that a 10μF capacitor (X5R or X7R) be established between REG2 and GND. ・REF (12 pin) This is the setting pin for output voltage of switching regulator. This IC controls the voltage in the status of REF≒FB. ・FB 1, 2 (14 pin, 11 pin) This is the feedback pin from the output of switching regulator. This IC controls the voltage in the status of REF≒FB. ・Vo1 (27 pin) This is the output discharge pin, and output voltage feedback pin for frequency setting. When the voltage is beyond 4.4V from the external power supply during operation, it supplies REG1. ・Vo2 (7 pin) This is the output discharge pin, and output voltage feedback pin for frequency setting. ・SS1, 2 (19 pin, 6 pin) This is the setting pin for soft start. The rising time is determined by the capacitor connected between SS and GND, and the fixed current inside IC after it is the status of low in standby mode. It controls the output voltage till SS voltage catch up the REF pin to become the SS terminal voltage. ・FS1, 2 (15 pin, 10 pin) This is the input pin for setting the frequency. It is available to set it in frequency range is 200KHz to 500kHz. ・ILIM1, 2 (17 pin, 8 pin) BD9528MUV detects voltage differential between SW and PGND, and set OCP. OCP setting current value is determined by the resistance value of ILIM pin. FET of various Ron is available. ・PGOOD 1, 2 (20 pin, 5 pin) This is the open drain pin for deciding the output of switching regulator. ・MCTL1, 2 (18 pin, 16 pin) This is the switching shift pin for SLLM (Simple Light Load Mode). MCTL pin is at low level when it goes lower than 0.8V, and at high level when it goes higher than 2.3V. (※MCTL pin is connected to AGND pin with 500kΩ resistor(pull down) internal IC) ・AGND (13 pin) This is the ground pin. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/33 2010.03 - Rev.A BD9528MUV Technical Note ・BOOT1, 2 (22 pin, 3 pin) This is the power supply pin for high side FET driver. The maximum voltage range to GND pin is to 35V, to SW pin is to 7V. In switching operations, the voltage swings from (VIN+REG1) to REG1 by BOOT pin operation. ・HG1, 2 (23 pin, 2 pin) This is the highside FET gate drive pin. It is operated in switching between BOOT to SW. In case the output MOS is 3ohm /the status of Hi, 2ohm/the status of Low, it is operated hi-side FET gate in high speed. ・SW1, 2 (24 pin, 1 pin) This is the ground pin for high side FET drive. The maximum voltage range to GND pin is to 30V. Switching operation swings from the status of BOOT to the status of GND. ・LG1, 2 (26 pin, 31 pin) This is the lowside FET gate drive pin. It is operated in switching between REG1 to PGND. In case the output MOS is 2ohm /the status of Hi, 0.5ohm/the status of Low, it is operated low-side FET gate in high speed. ・PGND1, 2 (25 pin, 32 pin) This is the ground pin for low side FET drive. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/33 2010.03 - Rev.A BD9528MUV Technical Note ●Explanation of Operation 3 The BD9528MUV is a 2ch synchronous buck regulator controller incorporating ROHM’s proprietary H REG CONTROLLA control system. Because controlling of output voltage by a comparator, high response is realized with not relying on the switching frequency. And, when VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency. H3RegTM control Comparator for output voltage control FB Vout/Vin Circuit VIN HG SW LG VOU T A B Driver Internal reference voltage REF Transient Circuit (Normal operation) FB REF HG When FB falls to a reference voltage (REF), the drop is detected, activating the H3REG CONTROLLA system. （ tON= ） VOUT × 1 [sec]・・・(1) VIN f HG output is determined by the formula above. After the status of HG is OFF, LG go on outputting until output voltage become FB=REF. LG (VOUT drops due to a rapid load change) FB REF Io HG LG tON +α When VOUT drops due to a rapid load change, and the voltage remains below reference voltage after the programmed tON time interval has elapsed (Output of a comparator for output voltage control =H), the system quickly restores VOUT by extending the tON time, improving the transient response. After VOUT restores (FB=REF), HG turns to be OFF, and it goes back to a normal operation. (when VIN drops) VIN tON1 tON2 tON3 tON4 H3RegTM tON4+ α HG tOFF1 t OFF2 t OFF3 tOFF4=tOFF3 tOFF4=t OFF3 LG FB REF Output voltage drops FB=REF If VIN voltage drops because of the battery voltage fall, ontime tON and offtime tOFF is determined by the following formula: tON=VOUT/VIN×I/f and tOFF=(VIN-VOUT)/VIN×f so that tON lengthen and tOFF shorten to keep output voltage constant. However, if VIN still drops and tOFF equals to tminoff (tminoff：Minimum OFF time, regulated inside IC) , because tOFF cannot shorten any 3 TM more, as a result output voltage drops. In H Reg system, lengthening tON time than regulated tON (lengthen tON time until FB＞REF) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/33 2010.03 - Rev.A BD9528MUV Technical Note enables to operate stable not to drop the output voltage even if VIN turns to be low. With the reason above, it is suitable for 2-cell battery. Light Load Control (SLLM) FB REF HG In SLLM, when the status of LG is OFF and the coil current is within 0A (it flows to SW from VOUT.), SLLM function is operated to prevent output next HG. The status of HG is ON, when FB falls below reference voltage again. LG 0A (QLLM) REF HG FB In QLLM, when the status of LG is OFF and the coil current is within 0A (it flows to SW from VOUT.), QLLM function is operated to prevent output next HG. Then, FB falls below the output programmed voltage within the programmed time (typ=40μs), the status of HG is ON. In case FB doesn’t fall in the programmed time, the status of LG is ON forcedly and VOUT falls. As a result, he status of next HG is ON. LG 0A MCTL1 L L H MCTL2 L H X Control mode SLLM QLLM PWM Running PWM PWM PWM The BD9528MUV operates in PWM mode until SS pin reaches cramp voltage (2.5V), regardless of the control mode setting, in order to operate stable during the operation. . ＊Attention: H Reg CONTROLLA monitors the supplying current from capacitor to load, using the ESR of output capacitor, and realize the rapid response. Bypass capacitor used at each load (Ex. Ceramic capacitor) exercises the effect with connecting to each load side. Do not put a ceramic capacitor on COUT side of power supply. 3 TM COUT Load ● Timing Chart • Soft Start Function EN TSS SS Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and (3) below. Soft start time Tss= REF×Css [sec] ・・・(2) 2.3μA(typ) VOUT Incoming current IIN IIN= Co×VOUT Tss [A] ・・・(3) (Css: Soft start capacitor; Co: Output capacitor) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/33 2010.03 - Rev.A BD9528MUV Technical Note Notes when waking up with CTL pin or VIN pin If EN pin is High or short (or pull up resistor) to REG1 pin, IC starts up by switching CTL pin, the IC might fail to start up (SCP function) with the reason below, please be careful of SS pin and REF pin capacitor capacity. REG1 REG2 VIN FB CTL Inner reference circuit BG SCP circuit Delay SCP REF SCP_REF 1ms(typ.) SCP SS PWM (Switching control signal) CTL (VIN) REG1 REG2 REG1, REG2 REG1 UVLO cancellation BG 0.49V(typ) SCP_REF (REF start-up time＜SS start-up time) SCP function masked SCP mask cancellation REF SS FB FB starts up as SS reference SS FB (REF start-up time＞SS start-up time) REF FB SS SCP mask SCP mask cancellation FB starts up as REF reference After the end of SS wake-up, within SCP delay time (1ms), if REF voltage does not reach SCP_REF(0.49V), SCP turns ON and shut down. SCP function is masked until SS pin reaches cramp voltage (2.5V). www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 16/33 2010.03 - Rev.A BD9528MUV ●Output Discharge Technical Note VIN,CTL EN It will be available to use if connecting VOUT pin to DC/DC output. (Total about 100Ω) . Discharge function operates when ①EN=’L’ ②UVLO=ON(If input voltage is low) ③SCP Latch time ④TSD=ON. The function at output discharge time is shown as left. (1)during EN=’H’→‘L’ If EN pin voltage is below than EN threshold voltage, output discharge function is operated, and discharge output capacitor charge. VOUT VIN, CTL REG1 VOUT The efficiency of VIN voltage drop Output Discharge Output Hi-Z UVLO ON (2) during VIIN=CTL=H→0V ① IC is in normal operation until REG1 voltage becomes lower than UVLO voltage. However, because VIN voltage also becomes low, output voltage will drop, too. ② If REG1 voltage reaches the UVLO voltage, output discharge function is operated, and discharge output capacitor charge. ③ In addition, if REG1 voltage drops, inner IC logic cannot operate, so that output discharge function does not work, and becomes output Hi-z. （In case, FB has resistor against GND, discharge at the resistor.） www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/33 2010.03 - Rev.A BD9528MUV Technical Note ・Timer Latch Type Short Circuit Protection FB REF×0.7 Short protection kicks in when output falls to or below REF X 0.7. When the programmed time period elapses, output is latched OFF to prevent destruction of the IC. (HG=Low, LG=Low) Output voltage can be restored either by reconnecting the EN pin or disabling UVLO. SCP 1ms(typ) EN / UVLO ・Over Voltage Protection FB REF×1.2 When output rise to or above REF×1.2 (typ), output over voltage protection is exercised, and low side FET goes up maximum for reducing output.(LG=High, HG=Low).When output falls, output voltage can be restored., and go back to the normal operation. HG LG Switching ・Over current protection circuit tON HG tON tON tON LG During the normal operation, when FB becomes less than REF, HG becomes High during the time tON, and after HG becomes OFF, it output LG. However, when inductor current exceeds ILIMIT threshold, next HG pulse doesn’t pulsate until it is lower than ILIMIT level. IL www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/33 2010.03 - Rev.A BD9528MUV ● External Component Selection 1. Inductor (L) selection Technical Note ΔIL VIN IL VOUT L Co The inductor value is a major influence on the output ripple current. As formula (4) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. (VIN-VOUT)×VOUT [A]・・・(4) ΔIL= L×VIN×f The proper output ripple current setting is about 30% of maximum output current. ΔIL=0.3×IOUTmax. [A]・・・(5) (VIN-VOUT)×VOUT L= ΔIL×VIN×f [H]・・・(6) (ΔIL: output ripple current; f: switch frequency) Output ripple current ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2.Output Capacitor (CO) Selection VIN VOUT L ESR Co When determining the proper output capacitor, be sure to factor in the equivalent series resistance required to smooth out ripple volume and maintain a stable output voltage range. Output ripple voltage is determined as in formula (7) below. ΔVOUT=ΔIL×ESR+ESL×ΔIL/TON・・・(7) (ΔIL: Output ripple current; ESR: CO equivalent series resistance) ※ In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. Output Capacitor Please give due consideration to the conditions in formula (8) below for output capacity, bear in mind that output rise time must be established within the soft start time frame. Capacitor for bypass capacitor is connected to Load side which connect to output in output capacitor capacity (CEXT, figure above). Please set the soft start time or over current detecting value, regarding these capacities. Co≦ Tss×(Limit-IOUT) VOUT ・・・(8) Tss: Soft start time Limit: Over current detection Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection VIN Cin The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (9) below. VOUT L IRMS=IOUT× √ IN(VIN-VOUT) V VIN [A]・・・(9) IOUT 2 Co Where VIN=2×VOUT, IRMS= Input Capacitor A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 19/33 2010.03 - Rev.A BD9528MUV 4. MOSFET Selection Technical Note MOSFET may cause the loss as below, so please select proper FET for each. VIN main switch ＜Loss on the main MOSFET＞ Pmain=PRON+PGATE+PTRAN = VOUT VOUT VIN ×RON×IOUT2+Ciss×f×VDD+ 2 VIN ×Crss×IOUT×f IDRIVE ・・・(10) L Co (Ron: On-resistance of FET; Ciss: FET gate capacitance; f: Switching frequency Crss: FET inverse transfer function; IDRIVE: Gate peak current) ＜Loss on the synchronous MOSFET＞ Psyn=PRON+PGATE = VIN-VOUT VIN ×RON×IOUT2+Ciss×f×VDD ・・・(11) synchronous switch 5. Setting output voltage This IC is operated that output voltage is REF≒FB. And it is operated that output voltage is feed back to FB pin. R2 ⊿V OUT  ⊿I Ripple  ESR V OUT  (R1  R2)  REF(0.7V)  (⊿VOUT:Output ripple voltage) ⊿V OUT (⊿Iripple: ripple current of coil, ESR: ESR of output capacitor) 2 (L:inductance[H] f:switching frequency[Hz]) 1 ⊿I Ripple  (V IN  V OUT )  V OUT (L  V IN  f) ※(Notice) Please set ⊿VOUT more than 20mV Ex. VIN=20V,VOUT=5V,f=300kHz,L=2.5uH,ESR=20mΩ,R1=56KΩ,R2=9.1kΩ -6 3 ⊿Iripple=(20V-5V)×5V/(2.5×10 H×20V×300×10 Hz)=5[A] -3 ⊿VOUT=5A×20×10 Ω=0.1[V] VOUT=(51kΩ+9.1kΩ)/9.1kΩ+1/2×0.1V=5.057[V] Select (R1 + R2) under 100KΩ(recommend) VIN VIN H3REG CONTROLLA R S Q SLLM Driver SLLM Circuit Output voltage FB VIN R1 R2 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 20/33 2010.03 - Rev.A BD9528MUV 6. Setting over current protection VIN Technical Note L VOUT SW Co PGND Detecting the ON resistance (between SW and PGND voltage) of MOSFET at low side, it set the over current voltage protection. Over current reference voltage (ILIM_ref) is determined as in formula(12) below. 10×103 ILIM_REF = RILIM[KΩ]×RON[mΩ] [A]・・・(12) RILIM (RILIM: Resistance for setting of over current voltage protection value[kΩ] RON: Low side ON resistance value of FET[mΩ]) However, the value, which set the over current protection actually, is determined by the formula (13) below. 1 △IL Iocp= ILIM_ref + 2 1 I × Vo ・・・(13) × VIN - Vo × = ILIM_ref + VIN f 2 L (△IL：Coil ripple current[A], VIN：Input voltage[V], Vo：Output voltage[V] ｆ：Switching frequency[HZ], L：Coil inductance[H]) Coil current Iocp ILIM_ref (Example) If load current 5A want to be realized with VIN=6～19V, VOUT=5V, ｆ=400kHZ, L=2.5uH, RON=20mΩ, the formula would be below. 10k 1 I × Vo ＞ 5 × VIN - Vo × + Iocp= RILIM[kΩ] ×RON[mΩ] VIN 2 f L When VIN=6V, Iocp will be minimum(this is because the ripple current is also minimum) so that if each condition is input, the formula will be the following: RILIM＜109.1[kΩ]. ※To design the actual board, please consider enough margin for FET ON resistor dispersion, Coil inductor dispersion, IC over current reference value dispersion, frequency dispersion. 7. Relation between output voltage and TON time The BD9528MUV, both 1ch and 2ch, are high efficiency synchronous regulator controller with frequency variable. TON time varies with Input voltage [VIN], output voltage [VOUT], and RFS of FS pin resistance. TON time is calculated with the following formula: VOUT・RFS TON =k VIN From TON time above, frequency on application condition is following: [kHz]・・・(15) VIN Ton However, real-life considerations (such as the external MOSFET gate capacitor and switching speed) must be factored in as they affect the overall switching rise and fall time, so please confirm in reality by the instrument. Frequency = VOUT × 1 [nsec]・・・(14) 3.5 3 2.5 ontime[us] 2 1.5 1 0.5 0 0 20 40 60 RFS[kΩ] 80 100 120 VIN=7V VIN=12V VIN=21V 2.5 VIN=7V 1 0.9 0.8 0.7 ontime[us] 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 RFS[kΩ] 80 100 120 0 20 40 60 RFS[kΩ] 80 100 120 VIN=7V VIN=12V VIN=21V VIN=12V VIN=21V 2 ontime[us] 1.5 1 0.5 0 RFS – ontime(VOUT=5V) RFS – ontime(VOUT=3.3V) RFS – ontime(VOUT=1V) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 21/33 2010.03 - Rev.A BD9528MUV Technical Note 8. Relation between output voltage and frequency Because the BD9528MUV is TON time focused regulator controller, if output current is up, switching loss of Coil, MOSFET and output capacitor will increase, and frequency will be fast. Loss of each Coil, MOSFET and output capacitor are below. ① Coil loss 2 = IOUT × DCR VOUT ② MOSFET(High Side) loss ③ MOSFET(Low Side) loss = IOUT × Ronh × = IOUT × Ronl × (12 2 VIN VOUT VIN ) (Ronh : ON resistance of high side MOSFET, Ronl : ON resistance of low side MOSFET, ESR : Output capacitor equivalent cascade resistance) Regarding those loss above and frequency formula, it is determined below. VIN × IOUT × TON VOUT × IOUT + ① + ② + ③ However, real-life considerations (such as parasitic resistance element of Layout pattern) must be factored in as they affect the loss, please confirm in reality by the instrument. T (=1/Freq) = ・・・(16) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 22/33 2010.03 - Rev.A BD9528MUV ●I/O Equivalent Circuit Technical Note 1, 24pin (SW2, SW1) BOOT 2, 23pin (HG2, HG1) BOOT HG BOOT 3, 22pin (BOOT2, BOOT1) HG SW SW 4, 21pin (EN2, EN1) 5, 20pin (PGOOD2, PGOOD1) 6, 19pin (SS2, SS1) REG1 12pin (REF) REG1 11, 14pin (FB2, FB1) 10, 15pin (FS2, FS1) 16, 18pin (MCTL2, MCTL1) 9pin (CTL) VIN 26, 31pin (LG1, LG2) REG1 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 23/33 2010.03 - Rev.A BD9528MUV ●I/O Equivalent Circuit 7, 27pin (Vo2, Vo1) 28pin (REG2) REG1 VIN Technical Note 29pin (REG1) VIN 30pin (VIN) 8, 17pin (ILIM2, ILIM1) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 24/33 2010.03 - Rev.A BD9528MUV ●Evaluation Board Circuit (Vo1=5V/8A f1=300kHz Vo2=3.3V/8A f2=300kHz) VIN 7V～28V 1 R 30 VIN CTL REG1 EN1 REG1 EN2 R4 4 REG1 5V C2 REG2 3.3V C3 R18 12 C4 19 R3 21 EN2 R2 9 EN1 CTL C1 Technical Note BD9528MUV VIN BOOT1 CTL HG1 EN1 EN2 REG1 PGND1 28 25 23 24 22 R9 VIN VIN C9 R10 C7 Q2 SW1 C10 VO1 L1 C13 R17 C23 C14 C15 C16 C17 SW1 D1 LG1 26 R11 Q1 29 REG2 FB1 14 C24 REF Vo1 27 VIN VIN SS1 BOOT2 3 R12 C8 Q4 C11 SW2 C12 VO2 L2 C18 R14 C19 C20 C21 C22 6 C5 C6 SS2 R13 HG2 17 2 ILIM1 SW2 LG2 1 R5 31 32 11 8 R6 15 R7 Q3 D2 R19 C25 ILIM2 PGND2 FB2 FS1 Vo2 7 REG1 R15 PGOOD1 C26 R20 10 R8 FS2 PGOOD1 20 REG1 PGOOD2 MCTL1 18 R28 MCTL1 R16 PGOOD2 MCTL2 16 R27 5 MCTL2 AGND 13 DESIGNATION R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R27 R28 C1 C2 C3 C4 C5 C6 RATING 0Ω 0Ω 0Ω 68kΩ 68kΩ 75kΩ 75kΩ 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 100kΩ 100kΩ 91kΩ 15kΩ 30kΩ 8.2kΩ 0Ω 0Ω 10uF(25V) 10uF(6.3V) 10uF(6.3V) 0.1uF(6.3V) 2200pF(50V) 2200pF(50V) PART No. MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 CM32X7R106M25A GRM21BB10J106KD GRM21BB10J106KD GRM21BB10J104KD GRM188B11H102KD GRM188B11H102KD COMPANY ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM KYOCERA MURATA MURATA MURATA MURATA MURATA DESIGNATION C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 D1 D2 L1 L2 Q1 Q2 Q3 Q4 U1 RATING 0.47uF(10V) 0.47uF(10V) 10uF(25V) 10uF(25V) 330uF 330uF Diode Diode 2.5uH 2.5uH FET FET FET FET - PART No. GRM188B11A474KD GRM188B11A474KD CM32XR7106M25A CM32XR7106M25A 6TPE330MI 6TPE330MI RSX501L-20 RSX501L-20 CDEP105NP-2R5MC-32 CDEP105NP-2R5MC-32 uPA2709 uPA2709 uPA2709 uPA2709 BD9528MUV COMPANY MURATA MURATA KYOCERA KYOCERA SANYO SANYO ROHM ROHM Sumida Sumida NEC NEC NEC NEC ROHM www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 25/33 2010.03 - Rev.A BD9528MUV ●Evaluation Board Circuit for Low input voltage(Vo1=5V/8A f1=300kHz Vo2=3.3V/8A f2=300kHz) VIN 6V～28V 1 R 30 VIN CTL REG1 EN1 REG1 EN2 R4 4 REG1 5V C2 REG2 3.3V C3 R18 12 C4 19 R3 21 EN2 R2 9 EN1 CTL C1 Technical Note BD9528MUV VIN BOOT1 CTL HG1 EN1 EN2 REG1 PGND1 28 25 23 24 22 R9 VIN VIN C9 R10 C7 Q2 SW1 C10 VO1 L1 C13 R17 C23 C14 C15 C16 C17 SW1 D1 LG1 26 R11 Q1 29 REG2 FB1 14 C24 REF Vo1 27 VIN VIN SS1 BOOT2 3 R12 C8 Q4 C11 SW2 C12 VO2 L2 C18 R14 C19 C20 C21 C22 6 C5 C6 SS2 R13 HG2 17 2 ILIM1 SW2 LG2 1 R5 31 32 11 8 R6 15 R7 Q3 D2 R19 C25 ILIM2 PGND2 FB2 FS1 Vo2 7 REG1 R15 PGOOD1 C26 R20 10 R8 FS2 PGOOD1 20 REG1 PGOOD2 MCTL1 18 R28 MCTL1 R16 PGOOD2 MCTL2 16 R27 5 MCTL2 AGND 13 DESIGNATION R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R27 R28 C1 C2 C3 C4 C5 C6 RATING 0Ω 0Ω 0Ω 68kΩ 68kΩ 75kΩ 75kΩ 0Ω 10Ω 10Ω 0Ω 10Ω 10Ω 100kΩ 100kΩ 56kΩ 9.1kΩ 30kΩ 8.2kΩ 0Ω 0Ω 10uF(25V) 10uF(6.3V) 10uF(6.3V) 0.1uF(6.3V) 2200pF(50V) 2200pF(50V) PART No. MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 MCR03 CM32X7R106M25A GRM21BB10J106KD GRM21BB10J106KD GRM21BB10J104KD GRM188B11H102KD GRM188B11H102KD COMPANY ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM ROHM KYOCERA MURATA MURATA MURATA MURATA MURATA DESIGNATION C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 D1 D2 L1 L2 Q1 Q2 Q3 Q4 U1 RATING 0.47uF(10V) 0.47uF(10V) 10uF(25V) 10uF(25V) 330uF 330uF 10pF(50V) Diode Diode 2.5uH 2.5uH FET FET FET FET - PART No. GRM188B11A474KD GRM188B11A474KD CM32XR7106M25A CM32XR7106M25A 6TPB330ML 6TPE330MI RSX501L-20 RSX501L-20 CDEP105NP-2R5MC-32 CDEP105NP-2R5MC-32 uPA2709 uPA2709 uPA2709 uPA2709 BD9528MUV COMPANY MURATA MURATA KYOCERA KYOCERA SANYO SANYO ROHM ROHM Sumida Sumida NEC NEC NEC NEC ROHM www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 26/33 2010.03 - Rev.A BD9528MUV ●Handling method of unused pin during using only DC/DC 1ch Technical Note If using only 1ch DC/DC and 2ch pin is set to be off at all times, please manage the unused pin as diagram below. PIN No, 1 2 3 4 5 6 7 8 10 11 31 PIN name SW2 HG2 BOOT2 EN2 PGOOD2 SS2 Vo2 ILIM1 FB2 FS2 LG2 Management GND Open Open GND GND GND GND GND GND GND Open VIN 12V BD9528MUV R1 30 VIN VIN VIN BOOT1 22 VIN CTL REG1 EN1 R3 R2 CTL C1 9 R9 C9 C10 CTL HG1 23 24 R10 C7 Q2 SW1 L1 C13 R17 Q1 C23 C14 C15 C16 C17 VO1 EN1 21 EN1 EN2 REG1 SW1 D1 4 REG1 5V C2 REG2 3.3V C3 R18 12 C4 19 LG1 PGND1 26 R11 29 25 28 REG2 FB1 14 C24 REF Vo1 27 SS1 BOOT2 3 6 C5 SS2 HG2 2 17 R5 8 ILIM1 SW2 LG2 1 ILIM2 PGND2 FB2 32 10 15 R7 FS1 Vo2 7 REG1 R15 PGOOD1 10 FS2 PGOOD1 20 MCTL1 18 R28 MCTL1 PGOOD2 5 MCTL2 16 R27 MCTL2 AGND 13 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 27/33 2010.03 - Rev.A BD9528MUV ●Example of PCB layout Technical Note L Co L-FET (CH1) Vo1 ③ ⑥ ⑤ ‘Silent’GND High current GND C Cin BOOT1 SS1 SW1 HG1 EN1 PGOOD1 MCTL1 ILMI1 C Cin SW2 HG2 EN2 SS2 Vo2 ILIM2 PGND2 PGOOD2 BOOT2 R R H-FET (CH2) High current GND C ③ L-FET (CH2) ①Because high pulse current rush into power loop, consisted of input capacitor Cin, Output inductor L, and Output capacitor Co, this part layout should be built, including GND pattern, at parts side (upper side). Also ,please avoid to draw via formation in power loop line. (The reason is that it will be a factor of noise because via oneself holds some nH parasitic inductance) ②FB pin has comparatively high impedance, so floating capacity should be minimum as possible. And feedback wiring from output should be taken properly, and put on shield, not going through around L (because of magnetic). Please be careful in drawing) ③Trace from SW node pin to inductor should be cut short . And both inductor element pattern should be kept away. (Closer wiring has SW node noise influence Vo by parasitic capacity between wiring ). This layout example shows that SW node is outside, but if the application board will be like that , SW node should be shielding, and consider the influence to other circuit. ④Input capacitor Cin should be placed cloase to IC with low inductance and low impedance . If that is difficult, please place a capacitor for high frequency removal with PKG size small like 0.1uF (ESL small). ⑤2 layer and 3 layer are plain GND, so connect from parts side GND to plain GND by low impedance with many via as possible. Inner GND is only for shielding, so that not to form loop for high current . ⑥Please take GND pattern space widely, and design layout to be able to increase radiation efficiency. ⑦FS pin nad ILIM pin has high impedance. External resistor should be connected to “Silent GND”. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. H-FET (CH1) ④ ① ② R R R R C PGND1 LG1 Vo1 MCTL2 FS1 FB1 AGND REF FB2 FS2 CTL VIN REG2 REG1 VIN LG2 R ② ⑤ ‘Silent’GND C ⑥ Co L Vo2 28/33 2010.03 - Rev.A BD9528MUV Technical Note Input current A Input current B V in DC/DC H3Reg controller SW pin voltage Inductor current Vout Feed back line GND Power GND Analog GND Output current GND Output current GND Power GND This part is shortened. Vin current Charger current current Current leveled By capacitor Pulsed current flows by ON/OFF of the switch Cin t t Input current A Input current B Noise output !! This part is shortened. SW Voltage L The noise has decreased by LC filter Vout current Inductor ripple current Vin Cout Output current t SW pin voltage Inductor current t 0V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 29/33 2010.03 - Rev.A BD9528MUV Technical Note The influence of inductor is noted The impedance of the output is low = It may be long SW L Vout FB Cout The impedance of this line is high This distance is shorted as much as possible The impedance of FB pin is higher www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 30/33 2010.03 - Rev.A BD9528MUV Technical Note ●Notes for use 1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P+ isolation in the P substrate and between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction depending on the relation between each potential, as follows:  When GND＞ element A＞ element B, the P-N junction is a diode.  When element B＞GND element A, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Resistor Pin A Pin A N N P + Transistor (NPN) Pin B C B E B P P + Pin B N P P + N Parasitic element P+ N N C E P substrate Parasitic element GND P substrate Parasitic element GND GND GND Parasitic Other adjacent elements 2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between the various pins and the VCC is recommended. Bypass diode Counter current prevention diode VCC Pin 3. Absolute maximum rating Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating limits is to be implemented. 4.GND potential Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode. 5. Thermal design In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in actual operation. 6. Short-circuits between pins and incorrect mounting position When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and may damage the IC. 7. Operation in strong electromagnetic fields Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 31/33 2010.03 - Rev.A BD9528MUV Technical Note 8. Thermal shutdown circuit This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature reaches 175℃ (standard value), and has a hysteresis range of -15℃ (standard value). When the IC chip temperature rises to the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or subsequent operation once the TSD is activated. 9. Capacitor between output and GND When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a capacitor larger than 1000uF between the output and GND. 10. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 11. GND wiring pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. ●Thermal Derating Curve ◎ VQFN032V5050 [mW] 1000 880mW 800 74.2mm×74.2mm×1.6mm θj-a=142.0℃/W Glass-epoxy PCB Power Dissipation [Pd] 600 IC Only θj-a=328.9℃/W 400 380mW 200 0 25 50 75 100 125 150 [℃] Ambient Temperature [Ta] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 32/33 2010.03 - Rev.A BD9528MUV ●Ordering part number Technical Note B D 9 Part No. 5 2 8 M U V - E 2 Part No. Package MUV: VQFN032V5050 Packaging and forming specification E2: Embossed tape and reel VQFN032V5050 5.0 ± 0.1 5.0 ± 0.1 Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 1PIN MARK 1.0MAX S +0.03 0.02 -0.02 (0.22) ( reel on the left hand and you pull out the tape on the right hand ) 0.08 S C0.2 0.4 ± 0.1 32 3.4 ± 0.1 1 8 9 25 24 17 16 0.75 0.5 3.4 ± 0.1 +0.05 0.25 -0.04 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 33/33 2010.03 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A