BD9882FV-E2

1/4 STRUCTURE Silicon Monolithic Integrated Circuit NAME OF PRODUCT DC-AC Inverter Control IC TYPE ＢＤ９８８２Ｆ, ＢＤ９８８２ＦＶ FUNCTION ・1ch control with Push-Pull ・Lamp current and voltage sense feed back control ・Sequencing easily achieved with Soft Start Control ・Short circuit protection with Timer Latch ・Under Voltage Lock Out ・Short circuit protection with over voltage ・Mode-selectable the operating or stand-by mode by stand-by pin ・Synchronous operating the other BD9882F or BD9882FV IC’s ・BURST mode controlled by PWM and DC input ○Absolute Maximum Ratings（Ta = 25℃） Parameter Supply Voltage Operating Temperature Range Storage Temperature Range Power Dissipation Maximum Junction Temperature *1 *2 Symbol VCC Topr Tstg Pd Tjmax Limits 15 -40～+95 -55～+125 550*1(BD9882F) 650*2(BD9882FV) +125 Unit V ℃ ℃ mW ℃ Pd derate at 5.5mW/℃ for temperature above Ta = 25℃ (When mounted on a PCB 70.0mm×70.0mm×1.6mm) Pd derate at 6.5mW/℃ for temperature above Ta = 25℃ (When mounted on a PCB 70.0mm×70.0mm×1.6mm) 〇Recommended operating condition Parameter Supply voltage CT oscillation frequency BCT oscillation frequency Symbol Vcc fCT fBCT Status of this document The Japanese language version of this document shall be the official specification. Any translation of this document shall be for reference only. REV. A Limits 5.0～14.0 20～150 0.10～0.50 Unit V kHz kHz 2/4 ○Electric Characteristics（Ta=25℃，VCC=7V） Parameter （（WHOLE DEVICE） ） Operating current Stand-by current （（OVER VOLTAGE DETECT）） FB over voltage detect voltage （（STAND-BY CONTROL）） Stand-by voltage H Stand-by voltage L （（TIMER LATCH）） Timer Latch voltage Timer Latch current （（OSC BLOCK）） OSC constant current MIN. Limits TYP. MAX. Icc1 Icc2 － － 8 2 16 10 mA μA Vovf 2.20 2.40 2.60 V VstH VstL 1.8 -0.3 － － VCC 0.8 V V Vcp Icp 1.9 0.5 2.0 1.0 2.1 1.5 V μA Symbol Unit Conditions CT=0.5V System ＯＮ System ＯＦＦ ICT 1.35/RT 1.5/RT 1.65/RT A OSC Max voltage VoscH 1.8 2.0 2.2 V fCT=60kHz OSC Min voltage MAX DUTY VoscL MAXDUTY 0.3 44 0.5 46.5 0.7 49 V % fCT=60kHz fCT=60kHz Iss 1.0 2.0 3.0 μA Visc Vss RSRT 0.45 2.0 － 0.50 2.2 200 0.55 2.4 400 V V Ω VuvloH VuvloL 4.000 3.800 4.200 4.000 4.400 4.200 V V IS threshold voltage Vis 1.225 1.250 1.275 V VS threshold voltage IS source current 1 IS source current 2 VS source current （（Output BLOCK） ） Output voltage Ｈ Output voltage L Output sink resistance Output source resistance Drive output frequency （（BURST MODE）） BOSC Max voltage BOSC Min Voltage BOSC constant current BOSC frequency （（REG BLOCK）） REG output voltage REG source current （（COMP BLOCK）） Over voltage detect Under voltage detect （（FAIL PIN）） Normal output voltage Protect output voltage Protect cancel voltage detect Vvs 1.220 1.250 1.280 V Iis1 Iis2 Ivs － 13.0 － － 20.0 － 1.5 27.0 1.0 μA μA μA VoutNH VoutNL RsinkN RsourceN FN VCC-0.3 － － － 58.5 VCC-0.1 0.1 8 10 60.0 － 0.3 16 20 61.5 V V Ω Ω kHz VburH VburL Iburosc FBOSC 1.94 0.4 1.35/BRT 261 2.0 0.5 1.5/BRT 275 2.06 0.6 1.65/BRT 289 V V A Hz VREG IREG 3.038 5.0 3.100 － 3.162 － V mA VCOMPH VCOMPL 2.20 0.590 2.5 0.640 2.80 0.690 V V VPH VPL VFAIL 0.45 2.9 0.36 0.5 3.1 0.40 0.55 3.3 0.44 V V V Soft start current IS COMP detect Voltage SS COMP detect voltage SRT ON resistance （（UVLO BLOCK）） Operating voltage Shut down voltage （（FEED BACK BLOCK）） （This product is not designed for normal operation with in a radio active environment.） REV. A DUTY=2.0V DUTY=0V、IS=0.5V Isink = 10mA Isource = 10mA RT=18kΩ CT=400pF fBCT=0.2kHz fBCT=0.2kHz BRT=33kΩ BCT=0.051μF 3/4 〇Package Dimensions Device Mark (Include BURR 12.85) BD9882F BD9882FV １ Lot No. SSOP-B20 (Unit:mm) SOP20 (Unit:mm) 〇Block Diagram 〇Pin Description SS CT RT BRT BCT DUTY VCC + OSC STB STB BLOCK PWM BLOCK LOGIC BLOCK + VCC - - OUTPUT BLOCK N1 N2 UVLO VCC REG Reg BLOCK VS IS PROTECT BLOCK GND COMP 1 DUTY 2 BRT 3 BCT 4 RT 5 SRT 6 CT External resistor from BRT to GND for adjusting the BURST triangle oscillator External capacitor from BCT to GND for adjusting the BURST triangle oscillator External resistor from SRT to RT for adjusting the triangle oscillator External resistor from SRT to RT for adjusting the triangle oscillator External capacitor from CT to GND for adjusting the triangle oscillator 7 GND GROUND 8 FB Error amplifier output FAIL + + Pin Name PGND F/B BLOCK VS - SYSTEM ON/OFF FB IS BOSC Pin No. SCP SRT Control PWM mode and BURST mode 9 IS Error amplifier input① 10 VS Error amplifier input② 11 STB Stand-by switch 12 COMP Under, over voltage detect 13 REG 14 SS 15 SCP Internal regulator output External capacitor from SS to GND for Soft Start Control External capacitor from SCP1 to GND for Timer Latch 16 N2 FET driver 17 PGND Ground for FET drivers FET driver 18 N1 19 FAIL Protect clock output Vcc Supply voltage input 20 REV. A Function 4/4 〇NOTE FOR USE １． When designing the external circuit, including adequate margins for variation between external devices and the IC.Use adequate margins for steady state and transient characteristics. ２． Recommended Operating Range The circuit functionality is guaranteed within of ambient temperature operation range as long as it is within recommended operating range. The standard electrical characteristic values cannot be guaranteed at other voltages in the operating ranges, however, the variation will be small. ３． Mounting failures, such as misdirection or miscounts, may harm the device. ４． A strong electromagnetic field may cause the IC to malfunction. ５. The GND pin should be the location within ±0.3V compared with the PGND pin ６． The BD9882F and BD9882FV incorporate a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of the thermal shutdown circuit is assumed. ７． Absolute maximum ratings are those values that, if exceeded, may cause the life of a device to become significantly shortened. Moreover, the exact failure mode caused by short or open is not defined. Physical countermeasures, such as a fuse, need to be considered when using a device beyond its maximum ratings. ８．About the external FET, the parasitic Capacitor may cause the gate voltage to change, when the drain voltage is switching. Make sure to leave adequate margin for this IC variation. ９． On operating Slow Start Control (SS is less than 2.2V), It does not operate Timer Latch. １０． By STB voltage, BD9882F and BD9882FV are changed to 2 states. Therefore, do not input STB pin voltage between one state and the other state (0.8～1.8V). １１．The pin connected a connector need to connect to the resistor for electrical surge destruction. １２．This IC is a monolithic IC which (as shown is Fig-1)has P+ substrate and between the various pins. A P-N junction is formed from this P layer of each pin. For example, the relation between each potential is as follows, ○(When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.) ○(When PinB > GND > PinA, the P-N junction operates as a parasitic transistor.) Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits as well as operation faults and physical damage. Accordingly you must not use methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin. Transistor (NPN) Resistance (PinA) (PinB) B E C Ｃ GND P P＋ N P＋ N Ｎ N Ｎ P substrate GND Parasitic diode N P substrate GND Parasitic diode (PinB) (PinA) B Parasitic diode CＣ Ｂ EＥ GND GND Other adjacent components Parasitic diode Fig-1 Simplified structure of a Bipolar IC REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 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