Datasheet
2.7V to 5.5V Input, 3A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
For Automotive
BD9S300MUF-C
General Description
Key Specifications
BD9S300MUF-C is a synchronous buck DC/DC
Converter with built-in low On Resistance power
MOSFETs. It is capable of providing current up to 3A.
The SLLMTM control provides excellent efficiency
characteristics in light-load conditions which make the
product ideal for reducing standby power consumption of
equipment. Small inductor is applicable due to high
switching frequency of 2.2MHz. It is a current mode
control DC/DC Converter and features high-speed
transient response. Phase compensation can also be set
easily.
It can also be synchronized to external pulse.
Input Voltage:
2.7V to 5.5V
Output Voltage Setting:
0.8V to VPVIN x 0.8V
Output Current:
3A(Max)
Switching Frequency:
2.2MHz(Typ)
High Side MOSFET ON Resistance: 35mΩ (Typ)
Low Side MOSFET ON Resistance: 35mΩ (Typ)
Shutdown Circuit Current:
0μA (Typ)
Operating Temperature:
-40°C to +125°C
Package
VQFN16FV3030
W(Typ) x D(Typ) x H(Max)
3.00mm x 3.00mm x 1.00mm
Features
SLLMTM (Simple Light Load Mode) Control
AEC-Q100 Qualified(Note 1)
Single Synchronous Buck DC/DC Converter
Adjustable Soft Start Function
Power Good Output
Input Under Voltage Lockout Protection
Short Circuit Protection
Output Over Voltage Protection
Over Current Protection
Thermal Shutdown Protection
Wettable Flank QFN Package
Enlarged View
VQFN16FV3030
Wettable Flank Package
(Note 1) Grade 1
Applications
Automotive Equipment
(Cluster Panel, Infotainment Systems)
Other Electronic Equipment
Typical Application Circuit
VIN
CIN1
CIN2
VMODE/SYNC
VEN
PVIN
PGD
AVIN
BOOT
C1
MODE/SYNC
SW
EN
VOUT
L1
SS
COUT
ITH
R1
R3
PGND
FB
AGND
C3
R2
C2
Figure 1. Application Circuit
SLLMTM is a trademark of ROHM Co., Ltd.
〇Product structure : Silicon monolithic integrated circuit
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PVIN
1
PVIN
2
AVIN
EN
PGD
BOOT
Pin Configuration
16
15
14
13
12 SW
11 SW
EXP-PAD
PGND
4
9
AGND
5
6
7
8
MODE
/SYNC
10 SW
ITH
3
FB
PGND
SS
(TOP VIEW)
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
Function
1, 2
PVIN
Power supply pins for the DC/DC Converter.
Connecting a 10µF ceramic capacitor is recommended.
3, 4
PGND
Ground pins for the DC/DC Converter.
5
AGND
Ground pin.
6
FB
7
ITH
VOUT voltage feedback pin. An inverting input node for the gm error amplifier. Connect output
voltage divider to this pin to set the output voltage. See page 17 on how to compute for the
resistor values.
An output pin of the gm error amplifier and the input of PWM comparator.
Connect phase compensation components to this pin. See page 20 on calculate the resistance
and capacitance of phase compensation.
8
MODE
/SYNC
Pin for selecting the SLLMTM control mode and the Forced PWM mode. Turning this pin signal
Low forces the device to operate in the Forced PWM mode. Turning this pin signal High enables
the SLLMTM control and the mode is automatically switched between the SLLMTM control and
PWM mode according to the load current. In addition, external synchronization operation is
started by inputting synchronous pulse signal to this pin.
9
SS
Pin for setting the soft start time. The rise time of the output voltage can be specified by
connecting a capacitor to this pin. See page 19 on calculate the capacitance.
10, 11, 12
SW
Switch pin. These pins are connected to the source of the High Side MOSFET and drain of the
Low Side MOSFET. Connect a bootstrap capacitor of 0.1µF between these pins and the BOOT
pin.
13
BOOT
14
PGD
Power Good pin, an open drain output. Use of pull up resistor is needed. See page 12 on setting
the resistance.
15
EN
Pin for controlling the device. Turning this pin signal Low forces the device to enter the shutdown
mode. Turning this pin signal High enables the device.
16
AVIN
Power supply input pin of the analog circuitry. Connect this pin to PVIN. Connecting a 0.1µF
ceramic capacitor is recommended.
-
EXP-PAD
A backside heat dissipation pad. Connecting to the internal PCB ground plane by using via
provides excellent heat dissipation characteristics.
Connect a bootstrap capacitor of 0.1µF between this pin and the SW pins.
The voltage of this capacitor is the gate drive voltage of the High Side MOSFET.
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Block Diagram
VIN
VIN
AVIN
PVIN
16
1
2
Slope
EN
15
VREF
PWM
Comparator
Error
Amplifier
FB
BOOT
R
6
13
Q
S
REF_OCP
Driver
Logic
SS
9
SW
OSC
Soft
Start
10
VOUT
PVIN
AVIN
11
UVLO
12
SCP
ITH
PGND
3
7
OVP
4
Power
Good
TSD
AGND
5
14
PGD
8
MODE/
SYNC
Figure 3. Block Diagram
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Description of Blocks
1. VREF
The VREF block generates the internal reference voltage.
2. UVLO (Under Voltage Lockout)
The UVLO block is for under voltage lockout protection. It will shutdown the device when the VIN falls to 2.45V(Typ) or
lower. The threshold voltage has a hysteresis of 100mV(Typ).
3. SCP (Short Circuit Protection)
This is the short circuit protection circuit. After soft start is judged to be completed, if the FB pin voltage falls to 0.56V(Typ)
or less and remain in that state for 1ms(Typ), output MOSFET will turn OFF for 14ms(Typ) and then restart the operation.
4. OVP (Over Voltage Protection)
This is the output over voltage protection circuit. When the FB pin voltage becomes 0.880V(Typ) or more, it turns the
output MOSFET OFF. After output voltage falls 0.856V(Typ) or less, the output MOSFET returns to normal operation.
5. TSD (Thermal Shutdown)
This is the thermal shutdown circuit. It will shutdown the device when the junction temperature (Tj) reaches to 175°C(Typ)
or more. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation with
hysteresis of 25°C(Typ).
6. OCP (Over Current Protection)
The Over Current Protection function operates by limiting the current that flows through High Side MOSFET at each cycle
of the switching frequency.
7. Soft Start
The Soft Start circuit slows down the rise of output voltage during startup, which allows the prevention of output voltage
overshoot. The soft start time of the output voltage can be specified by connecting a capacitor to the SS pin. See page 19
on calculate the capacitance. A built-in soft start function is provided and a soft start is initiated in 1ms(Typ) when the SS
pin is open.
8. Error Amplifier
The Error Amplifier block is an error amplifier and its inputs are the reference voltage 0.8V(Typ) and the FB pin voltage.
Phase compensation can be set by connecting a resistor and a capacitor to the ITH pin. See page 20 on calculate the
resistance and capacitance of phase compensation.
9. PWM Comparator
The PWM Comparator block compares the output voltage of the Error Amplifier and the Slope signal to determine the
switching duty.
10. OSC (Oscillator)
This block generates the oscillating frequency.
11. Driver Logic
This block controls switching operation and various protection functions.
12. Power Good
When the FB pin voltage reaches 0.8V(Typ) within ±7%, the built-in Nch MOSFET turns OFF and the PGD output turns
high. In addition, the PGD output turns low when the FB pin voltage reaches outside ±10% of 0.8V(Typ).
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Input Voltage
Symbol
Rating
Unit
VPVIN, VAVIN
-0.3 to +7
V
EN Voltage
MODE / SYNC Voltage
VEN
-0.3 to VAVIN
V
VMODE/SYNC
-0.3 to VAVIN
V
VPGD
-0.3 to +7
V
PGD Voltage
BOOT Voltage
VBOOT
-0.3 to +14
V
ΔVBOOT
-0.3 to +7
V
VFB, VITH, VSS
-0.3 to VAVIN
V
Tjmax
150
°C
Tstg
-55 to +150
°C
Voltage from SW to BOOT
FB ITH SS Voltage
Maximum Junction Temperature
Storage Temperature Range
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
189.0
57.5
°C/W
ΨJT
23
10
°C/W
VQFN16FV3030
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Thermal Via(Note 5)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
Pitch
1.20mm
2 Internal Layers
Diameter
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions
Parameter
Input Voltage
Operating Temperature
Symbol
Min
Max
Unit
VPVIN, VAVIN
2.7
5.5
V
Topr
-40
+125
°C
Output Current
IOUT
-
3
A
Output Voltage Setting
VOUT
0.8(Note 1)
VPVIN x 0.8
V
SW Minimum ON Time
tON_MIN
-
95
ns
External Clock Frequency
fSYNC
1.8
2.4
MHz
Synchronous Operation Input Duty
DSYNC
25
75
%
(Note 1) Although the output voltage is configurable at 0.8V and higher, it may be limited by the SW min ON pulse width. For the configurable range,
please refer to the Output Voltage Setting in Selection of Components Externally Connected.
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Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, AVIN=PVIN=5V, EN=5V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Shutdown Circuit Current
ISDN
-
0
10
µA
Circuit Current
ICC
400
650
900
µA
VUVLO1
VUVLO2
VUVLO-HYS
2.30
2.40
50
2.45
2.55
100
2.60
2.70
125
V
V
mV
VEN=0V, Ta=25°C
IOUT=0mA
Non-switching, Ta=25°C
VAVIN Falling
VAVIN Rising
Ta=25°C
VENH
VENL
IEN
2.0
GND
2
5
VIN
0.8
8
V
V
µA
VEN=5V, Ta=25°C
MODE/SYNC Threshold Voltage High
VMODESYNCH
2.0
-
VIN
V
MODE/SYNC Threshold Voltage Low
VMODESYNCL
GND
-
0.8
V
IMODESYNC
4
10
16
µA
VFB
IFB
IITHSI
IITHSO
0.788
12
-25
0.8
0
19
-19
0.812
0.2
25
-12
V
µA
µA
µA
0.5
1.0
2.0
ms
0.6
1.2
2.4
ms
ISS
-2.34
-1.8
-1.26
µA
fSW
2.0
2.2
2.4
MHz
VFB
x 0.87
VFB
x 0.90
VFB
x 1.07
VFB
x 1.04
10
0.01
VFB
x 0.90
VFB
x 0.93
VFB
x 1.10
VFB
x 1.07
0
30
0.03
VFB
x 0.93
VFB
x 0.96
VFB
x 1.13
VFB
x 1.10
2
60
0.06
10
35
15
38
10
AVIN
UVLO Detection Voltage
UVLO Release Voltage
UVLO Hysteresis Voltage
ENABLE
EN Threshold Voltage High
EN Threshold Voltage Low
EN Input Current
MODE/SYNC
MODE/SYNC Input Current
VMODESYNC=5V, Ta=25°C
Reference Voltage, Error Amplifier
FB Pin Voltage
FB Input Current
ITH Sink Current
ITH Source Current
Soft Start Time
SS Charge Current
tSS
VFB=0.8V, Ta=25°C
VFB=0.9V, Ta=25°C
VFB=0.7V, Ta=25°C
VAVIN=5V,
The SS Pin OPEN
VAVIN=3.3V,
The SS Pin OPEN
Switching Frequency
Switching Frequency
Power Good
PGD Falling (Fault) Voltage
VPGDTH_FF
PGD Rising (Good) Voltage
VPGDTH_RG
PGD Rising (Fault) Voltage
VPGDTH_RF
PGD Falling (Good) Voltage
VPGDTH_FG
PGD Output Leakage Current
PGD FET ON Resistance
PGD Output Low Level Voltage
ILEAKPGD
RPGD
VPGDL
V
VFB Falling
V
VFB Rising
V
VFB Rising
V
VFB Falling
µA
Ω
V
VPGD=5V, Ta=25°C
60
mΩ
VPVIN=5V
65
mΩ
VPVIN=3.3V
35
60
mΩ
VPVIN=5V
15
38
65
mΩ
VPVIN=3.3V
VPVIN=5.5V, VSW=0V
Ta=25˚C
VPVIN=5.5V, VSW=5.5V
Ta=25˚C
IPGD=1mA
Switch MOSFET
High Side FET ON Resistance
RONH
Low Side FET ON Resistance
RONL
High Side FET Leakage Current
ILEAKSWH
-
0
5
µA
Low Side FET Leakage Current
ILEAKSWL
-
0
5
µA
IOCP
3.6
5.0
6.6
A
VSCP
0.45
0.56
0.67
V
VOVP
0.856
0.880
0.904
V
SW Current of Over Current
Protection(Note1)
SCP, OVP
Short Circuit Protection Detection
Voltage
Output Over Voltage Protection
Detection Voltage
(Note 1) This is design value. Not production tested.
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10
900
9
850
8
800
Circuit Current : ICC[µA]
Shutdown Circuit Current : ISDN[µA]
Typical Performance Curves
7
6
5
4
VIN = 5.0V
3
VIN = 3.3V
750
700
650
600
2
500
1
450
0
400
-50
-25
0
25
50
75
100
125
VIN = 5.0V
550
VIN = 3.3V
-50
-25
0
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 4. Shutdown Circuit Current vs Temperature
Figure 5. Circuit Current vs Temperature
2.40
0.812
2.35
VIN = 5.0V
FB Pin Voltage : VFB[V]
Switching Frequency : fSW [MHz]
25
2.30
2.25
2.20
2.15
VIN = 3.3V
0.808
VIN = 5.0V
0.804
0.800
0.796
VIN = 3.3V
2.10
0.792
2.05
0.788
2.00
-50
-25
0
25
50
75
100
-50
125
0
25
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 6. Switching Frequency vs Temperature
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Figure 7. FB Pin Voltage vs Temperature
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30
-10
28
-12
26
ITH Source Current : IITHSO[µA]
ITH Sink Current : IITHSI[µA]
Typical Performance Curves – continued
VIN = 5.0V
24
22
20
18
VIN = 2.7V
16
14
12
VIN = 2.7V
-14
-16
-18
-20
-22
VIN = 5.0V
-24
-26
-28
10
-30
-50
-25
0
25
50
75
100
125
-50
-25
Temperature[°C]
25
50
75
100
125
Temperature[°C]
Figure 8. ITH Sink Current vs Temperature
Figure 9. ITH Source Current vs Temperature
20
2.0
VIN = 5.0V
MODE/SYNC Input Current : IMODE/SYNC[µA]
MODE/SYNC Threshold Voltage : VMODE/SYNCTH[V]
0
VMODESYNCH
1.8
1.6
1.4
VMODESYNCL
1.2
1.0
0.8
-50
-25
0
25
50
75
100 125
16
VMODE/SYNC = 5.0V
14
12
10
8
6
4
VMODE/SYNC = 3.3V
2
0
-50
-25
0
25
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 10. MODE/SYNC Threshold Voltage vs Temperature
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Figure 11. MODE/SYNC Input Current vs Temperature
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Typical Performance Curves – continued
-1.26
2.0
CSS = OPEN
-1.44
SS Charge Current : ISS[µA]
Soft Start Time : tSS[ms]
VIN = 3.3V
VIN = 3.3V
1.5
1.0
VIN = 5.0V
0.5
-1.80
-1.98
VIN = 5.0V
-2.16
-2.34
0.0
-50
-25
0
25
50
75
100
-50
125
-25
0
25
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 12. Soft Start Time vs Temperature
Figure 13. SS Charge Current vs Temperature
65
65
60
60
55
Low Side FET ON Resistance : RONL[mΩ]
High Side FET ON Resistance : RONH[mΩ]
-1.62
VIN = 3.3V
50
45
40
35
VIN = 5.0V
30
25
20
15
10
-50
-25
0
25
50
75
100
125
VIN = 3.3V
50
45
40
35
30
VIN = 5.0V
25
20
15
10
-50
-25
0
25
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 14. High Side FET ON Resistance vs Temperature
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Figure 15. Low Side FET ON Resistance vs Temperature
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Typical Performance Curves – continued
60
VIN = 5.0V
VIN = 5.0V
0.88
55
PGD FET ON Resistance : RPGD[Ω]
PGD Threshold Voltage : VPGDTH[V]
0.90
0.86
0.84
Falling Good
0.82
Rising Fault
0.80
0.78
Falling Fault
0.76
Rising Good
0.74
0.72
0.70
50
45
40
35
30
25
20
15
10
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 16. PGD Threshold Voltage vs Temperature
Figure 17. PGD FET ON Resistance vs Temperature
2.0
2.70
VIN = 5.0V
1.8
VUVLO2
2.60
EN Threshold Voltage : VENTH [V]
UVLO Voltage : VUVLO[V]
2.65
2.55
2.50
2.45
2.40
VUVLO1
2.35
VENH
1.6
1.4
1.2
VENL
1.0
0.8
2.30
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature[°C]
Temperature[°C]
Figure 18. UVLO Voltage vs Temperature
Figure 19. EN Threshold Voltage vs Temperature
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Typical Performance Curves – continued
10
SW Current of Over Current Protection : IOCP[A]
6.6
EN Input Current : IEN[µA]
9
8
7
VEN = 5.0V
6
5
4
3
2
VEN = 3.3V
1
0
-50
-25
0
25
50
75
100
125
6.1
5.6
5.1
4.6
4.1
3.6
-50
-25
Temperature[°C]
0.615
0.560
Detection
0.505
0.450
25
50
75
100
125
75
100
125
0.904
0.896
0.888
0.88
0.872
0.864
0.856
-50
-25
0
25
50
75
100
125
Temperature[℃]
Temperature[℃]
Figure 22. Short Circuit Protection Detection Voltage
vs Temperature
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Output Over Voltage Protection Detection Voltage : VOVP[V]
Short Circuit Protection Detection Voltage : VSCP[V]
Release
0
50
Figure 21 SW Current of Over Current Protection
vs Temperature
0.670
-25
25
Temperature[°C]
Figure 20. EN Input Current vs Temperature
-50
0
Figure 23. Output Over Voltage Protection Detection Voltage
vs Temperature
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Function Explanations
1.
Enable Control
The device shutdown can be controlled by the voltage applied to the EN pin. When VEN becomes 2.0V or more, the
internal circuit is activated and the device starts up with soft start. When VEN becomes 0.8V or less, the device will be
shutdown.
VIN
0
t
VEN
VENH
VENL
0
t
VOUT
VOUT×0.93(Typ)
0
t
tSS
t_wait
200µs(Typ)
Figure 24. Enable ON/OFF Timing Chart
2.
Power Good Function
When the FB pin voltage reaches 0.8V(Typ) within ±7%, the PGD pin open drain MOSFET turns OFF and the output
turns high. In addition, when the FB pin voltage reaches outside ±10% of 0.8V(Typ), the PGD pin open drain MOSFET
turns ON and the PGD pin is pulled down with impedance of 30Ω(Typ). It is recommended to use a pull-up resistor of
about 10kΩ to 100kΩ for the power source.
+10%(Typ)
+7%(Typ)
VOUT
-7%(Typ)
-10%(Typ)
PGD
Figure 25. Power Good Timing Chart
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Function Explanations – continued
3.
External Synchronization Function
By inputting synchronous pulse signal to the MODE/SYNC pin, the switching frequency can be synchronized to
external synchronous pulse signal. When pulse signal is applied at a frequency of 1.8MHz or higher, the external
synchronization operation is started after the falls of the synchronous pulse are detected 7 times.
Input the signal with the synchronization frequency range between 1.8MHz and 2.4MHz and the duty range between
25% and 75%.
Please note that the output voltage fluctuates by about 2% for a moment when switching between the synchronized
operation to external signal and internal CLK frequency.
MODE/SYNC
1
2
3
4
5
6
7
SW
Internal CLK operation
Synchronizing operation
Figure 26. External Synchronization Function Timing Chart
When using the external synchronization function, connect a capacitor of 10pF in parallel to the phase compensation
components (resistor and capacitor) connected to the ITH pin, as a countermeasure against the interference to the
ITH pin of the Error Amplifier output.
7
10pF
ITH
8
MODE/
SYNC
RITH
CITH
Figure 27. Recommended Circuit When Using External Synchronization Function
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Function Explanations – continued
4.
SLLMTM Control and Forced PWM Control
SLLM TM(Simple Light Load Mode) is a technology that enables the OFF control of switching pulses while operating
with Pulse Width Modulation(PWM) control loop under light load condition. Therefore, it allows the linear operation
without excessive voltage drop or deterioration in transient response during the switching from light load to heavy load
or vice versa.
By utilizing this technology, BD9S300MUF-C operates in PWM mode switching under heavy load condition and
automatically switches to SLLMTM control under light load condition in order to improve the efficiency. By keeping the
MODE/SYNC pin voltage level 0.8V or less, it forces the device to operate with Forced PWM mode. And, by applying
2.0V or more to MODE/SYNC pin, it allows the device to operate with SLLMTM control. As for the Forced PWM mode, it
has lower efficiency compared to SLLMTM control under light load condition. However, since the device operates with a
constant switching frequency under varying load conditions, the countermeasure against noise is relatively easier.
Please note that SLLMTM does not operate adequately when the switching Duty is 50% or more.
Efficiency [%]
① SLLMTM Control
② Forced PWM Control
Output Current IOUT [A]
Figure 28. Efficiency (SLLMTM Control and Forced PWM Control)
① SLLMTM Control
②
VOUT =50mV/div
Forced PWM Control
VOUT =50mV/div
Time=2µs/div
Time=2µs/div
SW=2V/div
SW=2V/div
Figure 29. SW Waveform (SLLMTM Control)
(VIN=5.0V, VOUT=1.8V, IOUT=50mA)
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Figure 30. SW Waveform (Forced PWM Control)
(VIN=5.0V, VOUT=1.8V, IOUT=1A)
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Protection
Short Circuit Protection (SCP)
The Short Circuit Protection block compares the FB pin voltage with the internal reference voltage VREF. When the
FB pin voltage has fallen to 0.56V(Typ) or less and remained there for 1ms(Typ), SCP stops the operation for
14ms(Typ) and subsequently initiates a restart. This protection circuit is effective in preventing damage due to sudden
and unexpected incidents. However, the device should not be used in applications characterized by continuous
operation of the protection circuit (e.g. when a load that significantly exceeds the output current capability of the chip is
connected).
1.
The EN Pin
Short Circuit
Protection
The FB Pin
≤0.56V(Typ)
2.0V or higher
ON
Enabled
≥0.60V(Typ)
0.8V or lower
Short Circuit
Protection Operation
OFF
Disabled
-
OFF
Soft Start
VOUT
SCP Delay Time
1ms (Typ)
0.8V
FB
SCP Delay Time
1ms (Typ)
VSCP : 0.56V(Typ)
SCP OFF
SW
LOW
IOCP
Inductor Current
(Output Load
Current)
Internal
HICCUP
Delay Signal
14ms (Typ)
SCP Reset
Figure 31. Short Circuit Protection (SCP) Timing Chart
2.
Over Current Protection (OCP)
The Over Current Protection function operates by limiting the current that flows through High Side MOSFET at each
cycle of the switching frequency. This protection circuit is effective in preventing damage due to sudden and
unexpected incidents. However, the device should not be used in applications characterized by continuous operation
of the protection circuit (e.g. when a load that significantly exceeds the output current capability of the chip is
connected).
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Protection – continued
Under Voltage Lockout Protection (UVLO)
It will shutdown the device when the AVIN pin falls to 2.45V(Typ) or lower.
The threshold voltage has a hysteresis of 100mV(Typ).
3.
VIN
VUVLO-HYS
VUVLO2
VUVLO1
0V
t_wait
VOUT
SoftSstart
FB
SW
Normal operation
UVLO
Normal operation
Figure 32. UVLO Timing Chart
4.
Thermal Shutdown
This is the thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within
the IC’s power dissipation rating. However, if the rating is exceeded for a continued period, the junction temperature
(Tj) will rise which will activate the TSD circuit[Tj ≥175°C (Typ)] that will turn OFF output MOSFET. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit
operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the
TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage.
5.
Over Voltage Protection (OVP)
The device incorporates an over voltage protection circuit to minimize the output voltage overshoot when recovering
from strong load transients or output fault conditions. If the FB pin voltage exceeds Output Over Voltage Protection
Detection Voltage at 0.880V(Typ), the MOSFET on the output stage is turned OFF to prevent the increase in the
output voltage. After the detection, the switching operation resumes if the output decreases and the over voltage state
is released. Output Over Voltage Protection Detection Voltage and release voltage have a hysteresis of 3%.
VOUT
VOVP : 0.880V(Typ)
hys
FB
OVP Release
Threshold
SW
Internal OVP
Signal
Figure 33. OVP Timing Chart
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BD9S300MUF-C
Selection of Components Externally Connected
Contact us if not use the recommended constant in the application circuit.
Necessary parameters in designing the power supply are as follows:
Table 1. Application Specification
Parameter
Input Voltage
Output Voltage
Switching Frequency
Inductor Ripple Current
Output Capacitor
Soft Start Time
Maximum Output Current
Symbol
VIN
VOUT
fSW
ΔIL
COUT
tSS
IOUTMAX
Example Value
5.0V
1.2V
2.2MHz(Typ)
0.4A
44μF
4.5ms(Typ)
3A
Application Example
R4
VIN
CIN1
CIN2
Enable
PVIN
PGD
AVIN
BOOT
PGD
MODE/SYNC
EN
C1
SW
VOUT
L1
SS
R100
ITH
R1
R3
COUT2
PGND
FB
AGND
R2
C2
C3
COUT1
Figure 34. Typical Application
1.
Switching Frequency
The switching frequency fSW is fixed at 2.2MHz(Typ) inside the IC.
2.
Selection of Output Voltage Setting
The output voltage value can be set by the feedback resistance ratio.
𝑉𝑂𝑈𝑇 =
VOUT
𝑅1 +𝑅2
𝑅2
× 0.8 [V]
R1
FB
R2
SW Minimum ON Time that BD9S300MUF-C can output
stably in the entire load range is 95ns.
Use this value to calculate the input and output conditions
that satisfy the following equation
0.8V(Typ)
95 [ns] ≤
𝑉𝑂𝑈𝑇
𝑉𝐼𝑁 × 𝑓𝑂𝑆𝐶
Figure 35. Feedback Resistor Circuit
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Selection of Components Externally Connected – continued
3.
Selection of Input Capacitor
The input capacitor requires a large capacitor value for CIN1 and a small capacitor value for CIN2. Please use ceramic
type capacitor for these capacitors. CIN1 is used to suppress the ripple noise, and CIN2 is used to suppress the switching
noise. These ceramic capacitors are effective by being placed as close as possible to the PVIN pin and the AVIN pin.
Capacitor with value 4.7μF or more for CIN1, and 0.06μF or more for CIN2 are necessary. In addition, the voltage rating for
both capacitors has to be twice the typical input voltage. Set the capacitor value so that it does not fall to its minimum
required value against the capacitor value variances, temperature characteristics, DC bias characteristics, aging
characteristics, and etc. Please use components which are comparatively same with the components used in
“Application Example” on page 22. Moreover, factors like the PCB layout and the position of the capacitor may lead to IC
malfunction. Please refer to “Notes on the PCB layout Design” on page 34 and 35.
4.
Selection of Output LC Filter
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the output
voltage. When an inductor with a higher inductance value is selected, the ripple current flowing through the inductor ΔIL
and the ripple voltage generated in the output voltage are reduced. However, the load transient response characteristic
becomes slow. If an inductor with a lower inductance value is selected, its transient response characteristic is faster.
However, the ripple current flowing through the inductor becomes larger and the ripple voltage in the output voltage
becomes larger, causing a trade-off between the response characteristic and the ripple current and voltage. Here, the
inductance value is selected so that the ripple current component is in the range between 200mA and 1000mA.
VIN
IL
Inductor Saturation Current > IOUTMAX + ∆IL/2
∆IL
Driver
L1
VOUT
Maximum Output Current IOUTMAX
COUT
t
Figure 36. Waveform of Current Through Inductor
Figure 37. Output LC Filter Circuit
Inductor ripple current ΔIL can be represented by the following equation.
∆𝐼𝐿 = 𝑉𝑂𝑈𝑇 × (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇 ) × 𝑉
1
𝐼𝑁 ×𝑓𝑆𝑊 ×𝐿1
= 414 [mA]
where
𝑉𝐼𝑁
𝑉𝑂𝑈𝑇
𝐿1
𝑓𝑆𝑊
is the 5.0V
is the 1.2V
is the 1.0µH
is the 2.2MHz (Switching Frequency)
The rated current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor
ripple current ΔIL. The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor C OUT
must satisfy the required ripple voltage characteristics.
The output ripple voltage can be represented by the following equation.
1
∆𝑉𝑅𝑃𝐿 = ∆𝐼𝐿 × (𝑅𝐸𝑆𝑅 + 8×𝐶
𝑂𝑈𝑇 ×𝑓𝑆𝑊
) [V]
Where
𝑅𝐸𝑆𝑅
is the Equivalent Series Resistance (ESR) of the output capacitor
The output ripple voltage ΔVRPL can be represented by the following equation.
1
∆𝑉𝑅𝑃𝐿 = 0.414 × (10 + 8×44×2.2) = 4.67 [mV]
where
𝐶𝑂𝑈𝑇
𝑅𝐸𝑆𝑅
is the 44µF
is the 10mΩ
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Selection of Components Externally Connected – continued
In addition, for the total value of capacitance in the output line COUT(Max), choose a capacitance value less than the
value obtained by the following equation:
𝐶𝑂𝑈𝑇(𝑀𝑎𝑥) <
(𝑡𝑆𝑆(𝑀𝑖𝑛) −200[µs])×(𝐼𝑂𝐶𝑃(𝑀𝑖𝑛) −𝐼𝑆𝑊𝑆𝑇𝐴𝑅𝑇 )
𝑉𝑂𝑈𝑇
[F]
Where:
𝐼𝑆𝑊𝑆𝑇𝐴𝑅𝑇
𝐼𝑂𝐶𝑃(𝑀𝑖𝑛)
𝑡𝑆𝑆(𝑀𝑖𝑛)
𝑉𝑂𝑈𝑇
is the maximum output current during startup
is the minimum OCP operation SW current 3.6A
is the minimum Soft Start Time
is the output voltage
Startup failure may happen if the limits from the above-mentioned are exceeded. Especially if the capacitance value is
extremely large, over current protection may be activated by the inrush current at startup and prevented to turn on the
output. Please confirm this on the actual application. Stable transient response and the loop is dependent to COUT.
Please select after confirming the setting of the phase compensation circuit.
Also, in case of large changing input voltage and output current, select the capacitance accordingly by verifying that the
actual application setup meets the required specification.
5.
Selection of Soft Start Capacitor
Turning the EN pin signal high activates the soft start function. This causes the output voltage to rise gradually while the
current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush current. The
rise time tSS_EXT depends on the value of the capacitor connected to the SS pin. The capacitance value should be set to
0.22μF or less.
VEN
𝑡𝑆𝑆_𝐸𝑋𝑇 =
(𝐶3 ×𝑉𝐹𝐵 )
𝐼𝑆𝑆
[s]
VENH
VENL
0
t
where
𝑡𝑆𝑆_𝐸𝑋𝑇
𝐶3
𝑉𝐹𝐵
𝐼𝑆𝑆
is the Soft Start Time
VOUT
is the Capacitor connected to the SS pin
is the FB pin Voltage 0.8V(Typ)
is the SS Charge Current 1.8µA(Typ)
0
With C3=0.01μF
𝑡𝑆𝑆_𝐸𝑋𝑇 =
t
tSS_EXT
t_wait
200µs(Typ)
(0.010×0.8)
1.8
= 4.44 [ms]
Figure 38. Soft Start Timing chart
Turning the EN pin High without connecting capacitor to the SS pin and keeping the SS pin either OPEN condition or
about 10kΩ to 100kΩ pull up condition to power source, the output will rise in 1ms(Typ).
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Selection of Components Externally Connected – continued
6.
Selection of Phase Compensation Components
A current mode control buck DC/DC converter is two-pole, one-zero system. Two poles are formed by an error amplifier
and load, and the one zero point is added by phase compensation. The phase compensation resistor R 3 determines the
crossover frequency fCRS that the total loop gain of the DC/DC converter is 0dB.The crossover frequency should be set
20kHz to 100kHz. A high value fCRS provides a good load transient response characteristic but instability. Conversely, a
low value fCRS greatly stabilizes the characteristics but the load transient response characteristic is impaired.
(1) Selection of Phase Compensation Resistor R3
The Phase Compensation Resistance R3 can be determined by using the following equation.
𝑅3 =
2𝜋×𝑉𝑂𝑈𝑇 ×𝑓𝐶𝑅𝑆 ×𝐶𝑂𝑈𝑇
𝑉𝐹𝐵 ×𝐺𝑀𝑃 ×𝐺𝑀𝐴
[Ω]
where
𝑉𝑂𝑈𝑇
𝑓𝐶𝑅𝑆
𝐶𝑂𝑈𝑇
𝑉𝐹𝐵
𝐺𝑀𝑃
𝐺𝑀𝐴
is the Output Voltage
is the Crossover Frequency
is the Output Capacitance
is the Feedback Reference Voltage 0.8V(Typ)
is the Current Sense Gain 14.3A/V(Typ)
is the Error Amplifier Trans conductance 260µA/V(Typ)
(2) Selection of Phase Compensation Capacitance C2
For stable operations of DC/DC converter, the zero point (phase lead) to cancel the phase lag formed by loads is
determined with C2.
C2 can be calculated with the following equation.
𝐶2 =
1
2𝜋×𝑓𝐶𝑅𝑆 ×
1
×𝑉𝑂𝑈𝑇
0.003
[F]
(3) Loop Stability
Actually, characteristics will vary depending on PCB layout, arrangement of wiring, kinds of parts used and use
conditions (temperature, etc.). Be sure to check stability and responsiveness with actual apparatus. Phase margin of at
least 45° in the worst conditions is recommended. Gain Phase Analyzer or Frequency Response Analyzer FRA is used
to check frequency characteristics with actual apparatus. Contact the measurement apparatus manufacturer for
measurement method. When these measurement apparatuses are not available, there is a method of assuming Phase
margin by load response. Monitor variation of output when the apparatus shifts from no load state to maximum load. And
it can be said that responsiveness is low if variation amount is large, and phase margin is small if ringing occurs
frequently (twice or more as a guide) after variation.
However, confirmation of quantitative phase margin is not possible.
Maximum load
Load
IOUT
Inadequate phase margin
Output voltage
VOUT
Adequate phase margin
0
t
Figure 39. Load Response
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Selection of Components Externally Connected – continued
7.
Input Voltage Startup
VIN
VIN ×0.8 ≥ VOUT
VOUT
UVLO release
Figure 40. Input Voltage Startup Time
The soft start function starts up the device according to the specified soft start time. After UVLO is released, the voltage
range that can be outputted during the soft start operation is 80% or less of the input voltage. Note that the input voltage
during the startup with soft start should satisfy the following expression
𝑉𝐼𝑁 ≥
8.
𝑉𝑂𝑈𝑇
0.8
[V]
Bootstrap Capacitor
Bootstrap capacitor C1 shall be 0.1μF. Connect a bootstrap capacitor between the SW pin and the BOOT pin.
For capacitance of bootstrap capacitor, take temperature characteristics, DC bias characteristics and etc. into
consideration to set minimum value to no less than 0.047μF.
Recommended Parts Manufacturer List
Shown below is the list of the recommended parts manufacturers for reference.
Table 2.
Device
Type
Manufacturer
C
Ceramic capacitors
Murata
www.murata.com
C
Ceramic capacitors
TDK
product.tdk.com
L
Inductors
Coilcraft
www.coilcraft.com
L
Inductors
Cyntec
www.cyntec.com
L
Inductors
Murata
www.murata.com
L
Inductors
Sumida
www.sumida.com
L
Inductors
TDK
R
Resisters
ROHM
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Application Example 1
Table 3. Specification Example 1
Parameter
Product Name
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Symbol
IC
VIN
VOUT
tSS
IOUTMAX
Topr
Example Value
BD9S300MUF-C
3.3V
1.0V
1.0ms(Typ)
3.0A
-40°C to +125°C
R4
VIN
CIN1
PVIN
PGD
AVIN
BOOT
PGD
MODE/SYNC
CIN2
Enable
EN
C1
SW
VOUT
L1
SS
R100
ITH
C4
PGND
R3
COUT1
COUT2
FB
AGND
R2
C2
C3
R1
Figure 41. Reference Circuit 1
Table 4. Parts List 1
No
Package
L1
Parameters
Part Name(Series)
Type
Manufacturer
1.0μH
CLF5030NIT-1R0N-D
Inductor
TDK
COUT1
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT2
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
CIN1
2012
10μF, X7R, 10V
GCM21BR71A106K
Ceramic Capacitor
Murata
CIN2
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
R100
-
SHORT
-
-
-
R1
1005
7.5kΩ, 1%, 1/16W
MCR01MZPF7501
Chip Resistor
ROHM
R2
1005
30kΩ, 1%, 1/16W
MCR01MZPF3002
Chip Resistor
ROHM
R3
1005
8.2kΩ, 1%, 1/16W
MCR01MZPF8201
Chip Resistor
ROHM
R4
1005
100kΩ, 1%, 1/16W
MCR01MZPF1003
Chip Resistor
ROHM
C1
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
C2
1005
4700pF, X7R, 50V
GCM155R71H472K
Ceramic Capacitor
Murata
C3
-
-
-
-
-
C4
-
-
-
-
-
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Characteristic Data (Application Examples 1)
100
90
80
180
60
135
40
90
20
45
0
0
60
Gain[dB]
Efficiency [%]
70
50
40
-20
-45
30
Gain
-40
20
Phase[deg]
80
-90
Phase
-60
10
0
0.0
0.5
1.0
1.5
2.0
Output Current [A]
2.5
-135
-80
3.0
0.1
Figure 42. Efficiency vs Output Current
1
10
100
Frequency[kHz]
-180
1000
Figure 43. Frequency Characteristics
(IOUT=2A)
Time: 500ns/div
Time: 100μs/div
VOUT: 20mV/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 44. Load Transient Response
(IOUT=0A↔2A)
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Figure 45. Output Ripple Voltage
(IOUT=2A)
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Application Example 2
Table 5. Specification Example 2
Parameter
Product Name
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Output Capacitor
Symbol
IC
VIN
VOUT
tSS
IOUTMAX
Topr
COUT
Example Value
BD9S300MUF-C
3.3V
1.0V
1.0ms(Typ)
3.0A
-40°C to +125°C
88μF
R4
VIN
CIN1
PVIN
PGD
AVIN
BOOT
MODE/SYNC
CIN2
Enable
EN
PGD
C1
SW
VOUT
L1
SS
R100
COUT1 COUT2 COUT3 COUT4
ITH
C4
PGND
R3
FB
AGND
R2
C2
C3
R1
Figure 46. Reference Circuit 2
Table 6. Parts List 2
No
Package
L1
Parameters
Part Name(Series)
Type
Manufacturer
0.47μH
XEL4030-471ME
Inductor
Coilcraft
COUT1
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT2
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT3
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT4
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
CIN1
2012
10μF, X7R, 10V
GCM21BR71A106K
Ceramic Capacitor
Murata
CIN2
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
R100
-
SHORT
-
-
-
R1
1005
7.5kΩ, 1%, 1/16W
MCR01MZPF7501
Chip Resistor
ROHM
R2
1005
30kΩ, 1%, 1/16W
MCR01MZPF3002
Chip Resistor
ROHM
R3
1005
30kΩ, 1%, 1/16W
MCR01MZPF3002
Chip Resistor
ROHM
R4
1005
100kΩ, 1%, 1/16W
MCR01MZPF1003
Chip Resistor
ROHM
C1
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
C2
1005
1000pF, X7R, 50V
GCM155R71H102K
Ceramic Capacitor
Murata
C3
-
-
-
-
-
C4
-
-
-
-
-
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Characteristic Data (Application Examples 2)
100
80
180
90
60
135
40
90
20
45
0
0
80
50
40
-20
Phase[deg]
60
Gain[dB]
Efficiency [%]
70
-45
30
Gain
-40
-90
Phase
20
-60
10
-135
-80
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.1
Output Current [A]
Figure 47. Efficiency vs Output Current
1
10
100
Frequency[kHz]
-180
1000
Figure 48. Frequency Characteristic
(IOUT=2A)
Time: 500ns/div
Time: 100μs/div
VOUT: 20mV/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 49. Load Transient Response
(IOUT=0A↔2A)
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Figure 50. Output Ripple Voltage
(IOUT=2A)
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Application Example 3
Table 7. Specification Example 3
Parameter
Product Name
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Symbol
IC
VIN
VOUT
tSS
IOUTMAX
Topr
Example Value
BD9S300MUF-C
5.0V
1.2V
1.0ms(Typ)
3.0A
-40°C to +125°C
R4
VIN
CIN1
PVIN
PGD
AVIN
BOOT
PGD
MODE/SYNC
CIN2
Enable
EN
C1
SW
VOUT
L1
SS
R100
ITH
C4
PGND
R3
COUT1
COUT2
FB
AGND
R2
C2
C3
R1
Figure 51. Reference Circuit 3
Table 8. Parts List 3
No
Package
Parameters
Part Name(Series)
Type
Manufacturer
L1
COUT1
1.0μH
CLF5030NIT-1R0N-D
Inductor
TDK
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT2
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
CIN1
2012
10μF, X7R, 10V
GCM21BR71A106K
Ceramic Capacitor
Murata
Murata
CIN2
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
R100
-
SHORT
-
-
-
R1
1005
10kΩ, 1%, 1/16W
MCR01MZPF1002
Chip Resistor
ROHM
R2
1005
20kΩ, 1%, 1/16W
MCR01MZPF2002
Chip Resistor
ROHM
R3
1005
8.2kΩ, 1%, 1/16W
MCR01MZPF8201
Chip Resistor
ROHM
R4
1005
100kΩ, 1%, 1/16W
MCR01MZPF1003
Chip Resistor
ROHM
Murata
C1
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
C2
1005
4700pF, X7R, 50V
GCM155R71H472K
Ceramic Capacitor
Murata
C3
-
-
-
-
-
C4
-
-
-
-
-
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Characteristic Data (Application Examples 3)
100
90
80
180
60
135
40
90
20
45
Efficiency [%]
70
Gain[dB]
60
50
40
0
0
-20
-45
30
Gain
-40
20
Phase[deg]
80
-90
Phase
-60
10
0
0.0
0.5
1.0
1.5
2.0
2.5
-135
-80
3.0
0.1
1.0
Output Current [A]
Figure 52. Efficiency vs Output Current
10.0
100.0
Frequency[kHz]
-180
1000.0
Figure 53. Frequency Characteristics
(IOUT=2A)
Time: 500ns/div
Time: 100μs/div
VOUT: 20mV/div
VOUT: 100mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 54. Load Transient Response
(IOUT=0A↔2A)
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Figure 55. Output Ripple Voltage
(IOUT=2A)
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Application Example 4
Table 9. Specification Example 4
Parameter
Product Name
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Symbol
IC
VIN
VOUT
tSS
IOUTMAX
Topr
Example Value
BD9S300MUF-C
5.0V
1.5V
1.0ms(Typ)
3.0A
-40°C to +125°C
R4
VIN
CIN1
PVIN
PGD
AVIN
BOOT
PGD
MODE/SYNC
CIN2
Enable
EN
C1
SW
VOUT
L1
SS
R100
ITH
C4
PGND
R3
COUT1
COUT2
FB
AGND
R2
C2
C3
R1
Figure 56. Reference Circuit 4
Table 10. Parts List 4
No
Package
L1
Parameters
Part Name(Series)
Type
Manufacturer
1.0μH
CLF5030NIT-1R0N-D
Inductor
TDK
COUT1
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT2
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
CIN1
2012
10μF, X7R, 10V
GCM21BR71A106K
Ceramic Capacitor
Murata
CIN2
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
R100
-
SHORT
-
-
-
R1
1005
16kΩ, 1%, 1/16W
MCR01MZPF1602
Chip Resistor
ROHM
R2
1005
18kΩ, 1%, 1/16W
MCR01MZPF1802
Chip Resistor
ROHM
R3
1005
12kΩ, 1%, 1/16W
MCR01MZPF1202
Chip Resistor
ROHM
R4
1005
100kΩ, 1%, 1/16W
MCR01MZPF1003
Chip Resistor
ROHM
C1
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
C2
1005
3300pF, X7R, 50V
GCM155R71H332K
Ceramic Capacitor
Murata
C3
-
-
-
-
-
C4
-
-
-
-
-
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Characteristic Data (Application Examples 4)
100
80
180
90
60
135
40
90
20
45
0
0
80
50
40
-20
Phase[deg]
60
Gain[dB]
Efficiency [%]
70
-45
30
Gain
-40
20
-90
Phase
-60
10
0
0.0
0.5
1.0
1.5
2.0
Output Current(A)
2.5
-135
-80
3.0
0.1
1
10
100
-180
1000
Frequency[kHz]
Figure 57. Efficiency vs Output Current
Figure 58. Frequency Characteristics
(IOUT =2A)
Time: 100μs/div
Time: 500ns/div
VOUT: 100mV/div
VOUT: 20mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 59. Load Transient Response
(IOUT = 0A↔2A)
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Figure 60. Output Ripple Voltage
(IOUT=2A)
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Application Example 5
Table 11. Specification Example 5
Parameter
Product Name
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Symbol
IC
VIN
VOUT
tSS
IOUTMAX
Topr
Example Value
BD9S300MUF-C
5.0V
1.8V
1.0ms(Typ)
3.0A
-40°C to +125°C
R4
VIN
CIN1
PVIN
PGD
AVIN
BOOT
PGD
MODE/SYNC
CIN2
Enable
EN
C1
SW
VOUT
L1
SS
R100
ITH
C4
PGND
R3
COUT1
COUT2
FB
AGND
R2
C2
C3
R1
Figure 61. Reference Circuit 5
Table 12. Parts List 5
No
Package
L1
Parameters
Part Name(Series)
Type
Manufacturer
1.0μH
CLF5030NIT-1R0N-D
Inductor
TDK
COUT1
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT2
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
CIN1
2012
10μF, X7R, 10V
GCM21BR71A106K
Ceramic Capacitor
Murata
CIN2
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
R100
-
SHORT
-
-
-
R1
1005
30kΩ, 1%, 1/16W
MCR01MZPF3002
Chip Resistor
ROHM
R2
1005
24kΩ, 1%, 1/16W
MCR01MZPF2402
Chip Resistor
ROHM
R3
1005
13kΩ, 1%, 1/16W
MCR01MZPF1302
Chip Resistor
ROHM
R4
1005
100kΩ, 1%, 1/16W
MCR01MZPF1003
Chip Resistor
ROHM
C1
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
C2
1005
3300pF, X7R, 50V
GCM155R71H332K
Ceramic Capacitor
Murata
C3
-
-
-
-
-
C4
-
-
-
-
-
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Characteristic Data (Application Examples 5)
100
90
80
180
60
135
40
90
20
45
0
0
60
Gain[dB]
Efficiency [%]
70
50
40
-20
-45
30
Phase[deg]
80
Gain
-40
20
10
-90
Phase
-60
0
0.0
0.5
1.0
1.5
2.0
2.5
-135
-80
3.0
0.1
1
Output Current (A)
Figure 62. Efficiency vs Output Current
10
100
Frequency[kHz]
-180
1000
Figure 63. Frequency Characteristics
(IOUT=2A)
Time: 100μs/div
Time: 500ns/div
VOUT: 100mV/div
VOUT: 20mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 64. Load Transient Response
(IOUT=0A↔2A)
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Figure 65. Output Ripple Voltage
(IOUT=2A)
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Application Example 6
Table 13. Specification Example 6
Parameter
Product Name
Supply Voltage
Output Voltage
Soft Start Time
Maximum Output Current
Operation Temperature Range
Symbol
IC
VIN
VOUT
tSS
IOUTMAX
Topr
Example Value
BD9S300MUF-C
5.0V
3.3V
1.0ms(Typ)
3.0A
-40°C to +125°C
R4
VIN
CIN1
PVIN
PGD
AVIN
BOOT
PGD
MODE/SYNC
CIN2
Enable
EN
C1
SW
VOUT
L1
SS
R100
ITH
C4
PGND
R3
COUT1
COUT2
FB
AGND
R2
C2
C3
R1
Figure 66. Reference Circuit 6
Table 14. Parts List 6
No
Package
Parameters
Part Name(Series)
Type
Manufacturer
L1
COUT1
1.0μH
CLF5030NIT-1R0N-D
Inductor
TDK
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
COUT2
3216
22μF, X7R, 6.3V
GCM31CR70J226K
Ceramic Capacitor
Murata
CIN1
2012
10μF, X7R, 10V
GCM21BR71A106K
Ceramic Capacitor
Murata
CIN2
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
R100
-
SHORT
-
-
-
R1
1005
75kΩ, 1%, 1/16W
MCR01MZPF7502
Chip Resistor
ROHM
R2
1005
24kΩ, 1%, 1/16W
MCR01MZPF2402
Chip Resistor
ROHM
R3
1005
20kΩ, 1%, 1/16W
MCR01MZPF2002
Chip Resistor
ROHM
R4
1005
100kΩ, 1%, 1/16W
MCR01MZPF1003
Chip Resistor
ROHM
C1
1005
0.1μF, X7R, 16V
GCM155R71C104K
Ceramic Capacitor
Murata
C2
1005
2200pF, X7R, 50V
GCM155R71H222K
Ceramic Capacitor
Murata
C3
-
-
-
-
-
C4
-
-
-
-
-
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Characteristic Data (Application Examples 6)
100
90
80
180
60
135
40
90
20
45
0
0
60
Gain[dB]
Efficiency [%]
70
50
40
-20
-45
30
Gain
-40
-90
Phase
20
-60
10
0
-135
-80
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Phase[deg]
80
0.1
1
10
100
-180
1000
Frequency[kHz]
Output Current [A]
Figure 67. Efficiency vs Output Current
Figure 68. Frequency Characteristics
(IOUT=2A)
Time: 100μs/div
Time: 500ns/div
VOUT: 100mV/div
VOUT: 20mV/div
IOUT: 500mA/div
IOUT: 1A/div
Figure 69. Load Transient Response
(IOUT=0A↔2A)
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Figure 70. Output Ripple Voltage
(IOUT=2A)
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PCB Layout Design
PCB layout design for DC/DC converter is as important as the circuit design. Appropriate layout can avoid various problems
concerning power supply circuit. Figure 71-a to 71-c show the current path in a buck DC/DC converter circuit. The Loop 1 in
Figure 71-a is a current path when H-side switch is ON and L-side switch is OFF, the Loop 2 in Figure 71-b is when H-side
switch is OFF and L-side switch is ON. The thick line in Figure 71-c shows the difference between Loop1 and Loop2. The
current in thick line change sharply each time the switching element H-side and L-side switch change from OFF to ON, and
vice versa. These sharp changes induce a waveform with harmonics in this loop. Therefore, the loop area of thick line that is
consisted by input capacitor and IC should be as small as possible to minimize noise. For more details, refer to application
note of switching regulator series “PCB Layout Techniques of Buck Converter”.
Loop1
VIN
H-side Switch
VOUT
L
CIN
COUT
L-side Switch
GND
GND
Figure 71-a. Current Path when H-side Switch = ON, L-side Switch = OFF
VIN
VOUT
L
H-side Switch
CIN
COUT
Loop2
L-side Switch
GND
GND
Figure 71-b. Current Path when H-side Switch = OFF, L-side Switch = ON
VIN
VOUT
L
CIN
COUT
H-side FET
L-side FET
GND
GND
Figure 71-c. Difference of Current and Critical Area in Layout
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PCB Layout Design – continued
When designing the PCB layout, please pay extra attention to the following points:
• Connect the input capacitor as close as possible to the PVIN pin on the same plane as the IC.
• Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the inductor pattern as
thick and as short as possible.
• R1 and R2 shall be located as close as possible to the FB pin and the wiring between R1 and R2 to the FB pin shall be as
short as possible.
• Provide lines connected to FB and ITH far from the SW nodes.
• When using the external synchronization function, there is concern that the ITH node might be affected by noise.
Therefore, place the ITH node as far as possible from the external clock input node.
• Influence from the switching noise can be minimized, by isolating Power (Input and Output Capacitor) GND and
Reference (FB, ITH) GND.
• R100 is provided for the measurement of feedback frequency characteristics (optional). By inserting a resistor into R100, it
is possible to measure the frequency characteristics of feedback (phase margin) using FRA etc. R100 is short-circuited
for normal use.
C1
L1
CIN1
CIN2
IC
C3
COU T1
R2
R1
C4
R3
COU T2
C2
R100
Example of Evaluation Board Layout (Top View)
Example of Evaluation Board Layout (Bottom View)
Figure 72. Example of Evaluation Board Layout
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Power Dissipation
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)
1.
2.
The ambient temperature Ta is to be 125 °C or less.
The chip junction temperature Tj is to be 150 °C or less.
The chip junction temperature Tj can be considered in the following two patterns:
1.
To obtain Tj from the package surface center temperature Tt in actual use
𝑇𝑗 = 𝑇𝑡 + 𝜓𝐽𝑇 × 𝑊 [°C]
2.
To obtain Tj from the ambient temperature Ta
𝑇𝑗 = 𝑇𝑎 + 𝜃𝐽𝐴 × 𝑊 [°C]
Where:
𝜓𝐽𝑇
𝜃𝐽𝐴
is junction to top characterization parameter (Refer to page 5)
is junction to ambient (Refer to page 5)
The heat loss W of the IC can be obtained by the formula shown below:
𝑉𝑂𝑈𝑇
𝑉𝑂𝑈𝑇
+ 𝑅𝑂𝑁𝐿 × 𝐼𝑂𝑈𝑇 2 (1 −
)
𝑉𝐼𝑁
𝑉𝐼𝑁
1
+𝑉𝐼𝑁 × 𝐼𝐶𝐶 + 2 × (𝑡𝑟 + 𝑡𝑓) × 𝑉𝐼𝑁 × 𝐼𝑂𝑈𝑇 × 𝑓𝑆𝑊 [W]
𝑊 = 𝑅𝑂𝑁𝐻 × 𝐼𝑂𝑈𝑇 2 ×
Where:
𝑅𝑂𝑁𝐻
𝑅𝑂𝑁𝐿
𝐼𝑂𝑈𝑇
𝑉𝑂𝑈𝑇
𝑉𝐼𝑁
𝐼𝐶𝐶
𝑡𝑟
𝑡𝑓
𝑓𝑆𝑊
is the High Side FET ON Resistance (Refer to page 6) [Ω]
is the Low Side FET ON Resistance (Refer to page 6) [Ω]
is the Output Current [A]
is the Output Voltage [V]
is the Input Voltage [V]
is the Circuit Current (Refer to page 6) [A]
is the Switching Rise Time [s] (Typ:6ns)
is the Switching Fall Time [s] (Typ:6ns)
is the Switching Frequency (Refer to page 6) [Hz]
1.
𝑅𝑂𝑁𝐻 × 𝐼𝑂𝑈𝑇 2
2.
𝑅𝑂𝑁𝐿 × 𝐼𝑂𝑈𝑇 2
3.
1
2
× (𝑡𝑟 + 𝑡𝑓) × 𝑉𝐼𝑁 × 𝐼𝑂 × 𝑓𝑆𝑊
Figure 73. SW Waveform
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I/O Equivalent Circuits
6. FB
7. ITH
20kΩ
10kΩ
FB
AVIN
AGND
10kΩ
ITH
AGND
40Ω
5kΩ
10kΩ
10kΩ
AGND
8. MODE/SYNC
AGND
AGND
9. SS
20kΩ
150kΩ
MODE /
SYNC
AVIN
AGND
SS
1kΩ
350kΩ
80kΩ
1kΩ
10kΩ
AGND
AGND
AGND
AGND
10.11.12. SW, 13. BOOT
AGND
AGND
14. PGD
PVIN
BOOT
PGD
PVIN
25Ω
SW
PVIN
AGND
AGND
PGND
15. EN
EN
430kΩ
10kΩ
570kΩ
AGND
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AGND
AGND
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 74. Example of monolithic IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B
D
9
S
3
Part Number
0
0
M
U
F
Package
VQFN16FV3030
-
CE2
Product class
C for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN16FV3030 (TOP VIEW)
Part Number Marking
D9S
LOT Number
3 0 0
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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VQFN16FV3030
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BD9S300MUF-C
Revision History
Date
Revision
27.Nov.2017
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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