Datasheet
Isolation Voltage 2500Vrms
1ch Gate Driver Providing Galvanic Isolation
BM6105AFW-LBZ
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market. As these applications, it is the best
product when used.
The BM6105AFW-LBZ is a gate driver with isolation
voltage 2500Vrms, I/O delay time of 120ns, and
minimum input pulse width of 60ns. The miller clamp
function, fault signal output functions, ready signal output
function, under voltage lockout (UVLO) function, and
desaturation protection (DESAT) function are built-in.
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Package
2500Vrms
20V
120ns (Max)
60ns (Max)
W(Typ) x D(Typ) x H(Max)
10.34mm x 10.31mm x 2.64mm
SOP16WM
Features
Long Time Support Product for Industrial Applications.
Providing Galvanic Isolation 1ch
Miller Clamp Function
Fault Signal Output Function
Ready Signal Output Function
Under Voltage Lockout Function
Desaturation Protection Function
Supporting Negative VEE2
SOP16WM
Applications
Driving IGBT Gate for Industrial Equipment
Driving MOSFET Gate for Industrial Equipment
Typical Application Circuit
GND1
LOGIC
VEE2
RDY
INA
CLAMP
-
INB
UVLO
RDY
FLT
+ 2V
OUT
(VEE2)
VCC2
LOGIC
FLT
NC
XRST
GND2
S
Q
VCC1
R
-
+
9V
DESAT
UVLO
GND1
VEE2
Pin 1
Figure 1. Typical Application Circuit
〇Product structure : Silicon integrated circuit
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package...................... .................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Recommended Range of External Constants ................................................................................................................................. 3
Pin Configurations .......................................................................................................................................................................... 3
Pin Descriptions .............................................................................................................................................................................. 3
Description of Functions and Examples of Constant Setting .......................................................................................................... 5
Absolute Maximum Ratings ............................................................................................................................................................ 7
Thermal Resistance ........................................................................................................................................................................ 7
Recommended Operating Conditions ............................................................................................................................................. 8
Insulation Related Characteristics .................................................................................................................................................. 8
Electrical Characteristics................................................................................................................................................................. 9
Typical Performance Curves ......................................................................................................................................................... 10
I/O Equivalence Circuits................................................................................................................................................................ 21
Operational Notes ......................................................................................................................................................................... 23
Ordering Information ..................................................................................................................................................................... 25
Marking Diagram .......................................................................................................................................................................... 25
Physical Dimension Tape and Reel Information ............................................................................................................................ 26
Revision History ............................................................................................................................................................................ 27
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Recommended Range of External Constants
Pin Name
Symbol
VCC1
VCC2
Recommended Value
Unit
Min
Typ
Max
CVCC1
0.1
1.0
-
μF
CVCC2
0.33
-
-
μF
Pin Configurations
(TOP VIEW)
VEE2 1
16 GND1
DESAT 2
15 VCC1
GND2 3
14 XRST
NC 4
13 FLT
VCC2 5
12 RDY
OUT 6
11 INB
CLAMP 7
10 INA
VEE2 8
9
GND1
Figure 2. Pin Configuration
Pin Descriptions
Pin No.
Pin Name
1
VEE2
Function
2
DESAT
Desaturation detection pin
3
GND2
Output-side ground pin
4
NC
5
VCC2
Output-side positive power supply pin
6
OUT
Output pin
7
CLAMP
Output-side negative power supply pin
Non-connection
Miller clamp pin
8
VEE2
Output-side negative power supply pin
9
GND1
Input-side ground pin
10
INA
Control input pin A
11
INB
Control input pin B
12
RDY
Ready output pin
13
FLT
Fault output pin
14
XRST
Reset input pin
15
VCC1
Input-side power supply pin
16
GND1
Input-side ground pin
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Pin Descriptions - continued
1.
VCC1 (Input-side power supply pin)
The VCC1 pin is a power supply pin on the input side. To reduce voltage fluctuations due to the current to drive internal
transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.
2.
GND1 (Input-side ground pin)
The GND1 pin is a ground pin on the input side.
3.
VCC2 (Output-side positive power supply pin)
The VCC2 pin is a positive power supply pin on the output side. To reduce voltage fluctuations due to the OUT pin
output current and due to the current to drive internal transformers, connect a bypass capacitor between the VCC2 and
the GND2 pins.
4.
VEE2 (Output-side negative power supply pin)
The VEE2 pin is a negative power supply pin on the output side. To reduce voltage fluctuations due to the OUT pin output
current and due to the current to drive internal transformers, connect a bypass capacitor between the VEE2 and the GND2
pins. To use no negative power supply, connect the VEE2 pin to the GND2 pin.
5.
GND2 (Output-side ground pin)
The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter/source of a power device.
6.
INA, INB and XRST (Control input pin and Reset input pin)
The INA, INB and XRST pins are used to determine output logic.
XRST
INB
INA
L
X
X
H
H
X
H
L
L
H
L
H
OUT
L
L
L
H
7.
FLT (Fault output pin)
The FLT pin is an open drain pin used to output a fault signal when desaturation function is activated, and will be cleared
at the rising edge of XRST.
Status
FLT
While in normal operation
H
When desaturation function is activated
L
8.
RDY (Ready output pin)
The RDY pin shows the status of three internal protection features which are VCC1 UVLO, VCC2 UVLO, and output
state feedback (OSFB). ‘output state feedback’ is a function to compare output logic with input logic, and outputs L
when it does not match.
Status
RDY
While in normal operation
H
VCC1 UVLO or VCC2 UVLO or Output state feedback (disaccord)
L
9.
OUT (Output pin)
The OUT pin is a pin used to drive the gate of a power device.
10. CLAMP (Miller clamp pin)
The CLAMP pin is a pin for preventing increase in gate voltage due to the miller current of the power device connected
to OUT pin. Connect the CLAMP pin to the VEE2 pin when miller clamp function is not used.
11. DESAT (Desaturation detection pin)
This is a detection pin for DESAT protection. When the DESAT pin voltage is VDESAT or more, DESAT function will be
activated. This may cause the IC to malfunction in an open state. To avoid such trouble, short circuit the DESAT pin to
the GND2 pin when the desaturation protection is not used. In order to prevent the wrong detection due to noise, the
noise filter time tDESATFIL is set.
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Description of Functions and Examples of Constant Setting
1.
Miller Clamp Function
If OUT=L and the CLAMP pin voltage < VCLPON, the internal MOSFET of the CLAMP pin turns on.
OUT
L
L
H
CLAMP
Less than VCLPON
VCLPON or more
X
Internal MOSFET of the CLAMP pin
ON
OFF
OFF
tPOFF
tPON
INA
OUT
CLAMP
(Monitoring the gate voltage)
VCLPON
Figure 3. Timing Chart of Miller Clamp Function
2.
Fault Status Output
This function is used to output a fault signal from the FLT pin when the desaturation protection function is activated and
hold the Fault signal until rising edge of XRST is put in.
3.
Under Voltage Lockout (UVLO) Function
The BM6105AFW-LBZ incorporates the Under Voltage Lockout (UVLO) function both on the input and the output sides.
When the power supply voltage drops to VUVLO1L or VUVLO2L, the OUT pin and the RDY pin both will output the “L” signal.
When the power supply voltage rises to VUVLO1H or VUVLO2H, these pins will be reset. To prevent malfunctions due to
noises, mask time tUVLO1MSK and tUVLO2MSK are set on both input and output sides.
H
L
IN
VUVLO1H
VUVLO1L
VCC1
Hi-Z
L
H
L
RDY
OUT
Figure 4. Input-side UVLO Function Operation Timing Chart
H
L
IN
VUVLO2H
VUVLO2L
VCC2
Hi-Z
L
H
Hi-Z
L
RDY
OUT
Figure 5. Output-side UVLO Operation Timing Chart
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Description of Functions and Examples of Constant Setting - continued
4.
Desaturation Protection Function (DESAT)
When the DESAT pin voltage is VDESAT or more, the DESAT function will be activated. When the DESAT function is
activated, the OUT pin voltage will be set to the “L” level, and then the FLT pin voltage to the “L” level. When the rising
edge is put in the XRST pin, the DESAT function will be released.
H
L
INA
tDESATLEB
VDESAT
DESAT
H
L
H
OUT
FLT
L
H
L
XRST
tDESATFIL
tDESATOUT
tDESATFLT
> tXRSTMIN
Figure 6. DESAT Operation Timing Chart
5.
I/O Condition Table
No.
Input
Status
Output
VCC1
VCC2
DESAT
XRST
INB
INA
CLAMP
OUT
CLAMP
FLT
RDY
UVLO
X
X
X
X
X
H
L
Hi-Z
H
L
UVLO
X
X
X
X
X
L
L
L
H
L
○
UVLO
L
X
X
X
H
L
Hi-Z
H
L
○
UVLO
L
X
X
X
L
L
L
H
L
○
UVLO
H
X
X
X
H
L
Hi-Z
L
L
○
UVLO
H
X
X
X
L
L
L
L
L
○
○
H
X
X
X
H
L
Hi-Z
L
H
○
○
H
X
X
X
L
L
L
L
H
○
○
L
L
X
X
H
L
Hi-Z
H
H
10
○
○
L
L
X
X
L
L
L
H
H
11
○
○
L
H
H
X
H
L
Hi-Z
H
H
○
○
L
H
H
X
L
L
L
H
H
○
○
L
H
L
L
H
L
Hi-Z
H
H
14
○
○
L
H
L
L
L
L
L
H
H
15
○
○
L
H
L
H
X
H
Hi-Z
H
H
1
2
VCC1
UVLO
3
4
5
VCC2
UVLO
6
7
DESAT
8
9
XRST
12
13
Normal
operation
○: VCC1 or VCC2 > UVLO, X:Don't care
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Absolute Maximum Ratings
Parameter
Input-side Supply Voltage
Output-side Positive Supply Voltage
Symbol
Limits
Unit
VCC1
-0.3 to +7.0(Note 1)
V
VCC2
+24.0(Note 2)
V
+0.3(Note 3)
V
-0.3 to
Output-side Negative Supply Voltage
VEE2
-15.0 to
Maximum Difference Voltage
between Output-side Positive and Negative Supply Voltages
VMAX2
30.0
V
INA, INB, XRST Pin Input Voltage
VIN
-0.3 to +VCC1+0.3 or 7.0(Note 1)
V
RDY, FLT Pin Input Voltage
VFLT
-0.3 to +VCC1+0.3 or 7.0(Note 1)
V
DESAT Pin Input Voltage
VDESATIN
OUT Pin Output Current (10μs)
IOUTPEAK
5.0
A
OUT, CLAMP Pin Voltage
VOUT
VEE2-0.3 to VCC2+0.3
V
RDY, FLT Output Current
IFLT
10
mA
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Maximum Junction Temperature
-0.3 to
VCC2+0.3(Note 2)
V
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Relative to GND1.
(Note 2) Relative to GND2.
(Note 3) Must not exceed Tjmax=150C.
Thermal Resistance(Note 4)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 6)
2s2p(Note 7)
Unit
SOP16WM
Junction to Ambient
θJA
104.1
66.2
°C/W
Junction to Top Characterization Parameter(Note 5)
ΨJT
34
32
°C/W
(Note 4) Based on JESD51-2A (Still-Air).
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Input-side Supply Voltage
VCC1(Note 8)
4.5
5.0
5.5
V
Output-side Positive Supply Voltage
VCC2(Note 9)
13.3
15.0
20.0
V
-12
-
0
V
Output-side Negative Supply Voltage
VEE2
(Note 9)
Maximum Difference Voltage
between Output-side Positive and Negative Supply Voltages
VMAX2
-
-
28.0
V
Operating Temperature
Topr
-40
+25
+105
°C
(Note 8) Relative to GND1.
(Note 9) Relative to GND2.
Insulation Related Characteristics
Parameter
Symbol
Characteristic
Unit
RS
>109
Ω
Insulation Withstand Voltage (1min)
VISO
2500
Vrms
Insulation Test Voltage (1s)
VISO
3000
Vrms
Insulation Resistance (VIO=500V)
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Electrical Characteristics
(Unless otherwise specified Ta=-40°C to +105°C, VCC1=4.5V to 5.5V, VCC2=13.3V to 20V, VEE2=-12V to 0V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
General
Input-side Circuit Current 1
ICC11
0.16
0.32
0.48
mA
Input-side Circuit Current 2
ICC12
0.21
0.42
0.63
mA
INA=10kHz, Duty=50%
Input-side Circuit Current 3
ICC13
0.26
0.52
0.78
mA
INA=20kHz, Duty=50%
Output-side Circuit Current 1
ICC21
0.9
1.8
2.7
mA
OUT=L
Output-side Circuit Current 2
ICC22
0.8
1.7
2.5
mA
OUT=H
VINH
2.0
-
VCC1
V
INA, INB, XRST
Logic
Logic High Level Input Voltage
Logic Low Level Input Voltage
VINL
0
-
0.8
V
INA, INB, XRST
Logic Pull-down Resistance
RIND
25
50
100
kΩ
INA
Logic Pull-up Resistance
RINU
25
50
100
kΩ
INB, XRST, RDY, FLT
INA, INB
Logic Minimum Pulse Width
tINMSK
-
-
60
ns
tXRSTMIN
-
-
800
ns
OUT ON Resistance (Source)
RONH
0.3
0.8
1.5
Ω
IOUT=-40mA
OUT ON Resistance (Sink)
RONL
0.2
0.5
0.9
Ω
IOUT=40mA
OUT Maximum Current
IOUTMAX
3.0
4.5
-
A
Guaranteed by design
CLAMP ON Resistance
RONCLP
0.2
0.5
0.9
Ω
ICLAMP=40mA
Low level CLAMP Current
ICLAMPL
3.0
4.5
-
A
Guaranteed by design
tPON
50
80
120
ns
XRST Input Mask Time
Output
Turn ON Time
Turn OFF Time
tPOFF
50
80
120
ns
Propagation Distortion
tPDIST
-20
0
+20
ns
tPOFF - tPON
Rise Time
tRISE
-
50
100
ns
10Ω, 10nF between OUT to VEE2
tFALL
-
50
100
ns
Guaranteed by design
VCLPON
1.8
2
2.2
V
Relative to VEE2
CM
100
-
-
kV/μs
VCC1 UVLO OFF Voltage
VUVLO1H
3.35
3.50
3.65
V
VCC1 UVLO ON Voltage
VUVLO1L
3.25
3.40
3.55
V
VCC1 UVLO Mask Time
tUVLO1MSK
0.8
2.5
5.0
μs
VCC2 UVLO OFF Voltage
VUVLO2H
11.3
12.3
13.3
V
VCC2 UVLO ON Voltage
VUVLO2L
10.3
11.3
12.3
V
VCC2 UVLO Mask Time
tUVLO2MSK
3.8
7.7
14
μs
DESAT Charging Current
IDESATC
450
500
550
μA
DESAT Threshold Voltage
VDESAT
8.5
9.0
9.5
V
DESAT Filter Time
tDESATFIL
0.16
0.25
0.34
μs
DESAT Delay Time (OUT)
tDESATOUT
0.31
0.38
0.45
μs
DESAT Delay Time (FLT)
tDESATFLT
0.34
0.42
0.50
μs
Fall Time
CLAMP ON Threshold Voltage
Common Mode Transient Immunity
Guaranteed by design
Protection functions
DESAT Low Voltage
VDESATL
-
0.1
0.22
V
IDESAT=1mA
Leading Edge Blanking
tDESATLEB
0.28
0.4
0.52
μs
Guaranteed by design
OSFB Output Filtering Time
tOSFBFIL
μs
2
RDY Output Low Voltage
VRDYL
-
0.08
0.15
V
IRDY=5mA
FLT Output Low Voltage
VFLTL
-
0.08
0.15
V
IFLT=5mA
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Typical Performance Curves
0.48
Input-side Circuit Current 1 : ICC11[mA]
Input-side Circuit Current 1 : ICC11[mA]
0.48
Ta=+105°C
0.40
Ta=+25°C
0.32
Ta=-40°C
0.24
VCC1=5.5V
0.40
VCC1=5.0V
0.32
VCC1=4.5V
0.24
0.16
0.16
4.5
4.75
5
5.25
-40
5.5
-20
Input-side Supply Voltage : VCC1[V]
Figure 7. Input-side Circuit Current 1 vs
Input-side Supply Voltage
80
100
Figure 8. Input-side Circuit Current 1 vs
Temperature
0.61
Input-side Circuit Current 2 : ICC12[mA]
0.61
Input-side Circuit Current 2 : ICC12[mA]
0
20
40
60
Temperature : Ta[°
C]
Ta=+105°C
0.51
Ta=+25°C
0.41
0.31
Ta=-40°C
4.75
5
5.25
5.5
Input-side Supply Voltage : VCC1[V]
Figure 9. Input-side Circuit Current 2 vs Input-side
Supply Voltage (INA=10kHz, Duty=50%)
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VCC1=5.0V
0.41
VCC1=4.5V
0.31
0.21
-40
0.21
4.5
VCC1=5.5V
0.51
-20
0
20
40
60
Temperature : Ta[°
C]
80
100
Figure 10. Input-side Circuit Current 2 vs
Temperature (INA=10kHz, Duty=50%)
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Typical Performance Curves - continued
0.76
Input-side Circuit Current 3 : ICC13[mA]
Input-side Circuit Current 3 : ICC13[mA}
0.76
0.66
Ta=+105°C
Ta=+25°C
0.56
0.46
Ta=-40°C
0.36
4.75
5
5.25
Input-side Supply Voltage : VCC1[V]
VCC1=5.5V
5.5
0.46
VCC1=4.5V
0.36
2.7
2.5
2.5
Output-side Circuit Current 1 : ICC21[mA]
Output-side Circuit Current 1 : ICC21[mA]
2.7
Ta=+105°C
2.1
1.9
1.7
1.5
Ta=+25°C
1.3
Ta=-40°C
1.1
-20
0
20
40
60
80
Temperature : Ta[°C]
100
Figure 12. Input-side Circuit Current 3 vs
Temperature (INA=20kHz, Duty=50%)
Figure 11. Input-side Circuit Current 3 vs Input-side
Supply Voltage (INA=20kHz, Duty=50%)
2.3
VCC1=5.0V
0.56
0.26
-40
0.26
4.5
0.66
2.3
VCC2=20.0V
2.1
1.9
1.7
VCC2=15.0V
1.5
VCC2=13.3V
1.3
1.1
0.9
0.9
13.3
-40
15.3
17.3
19.3
-20
0
20
40
60
Temperature : Ta[°
C]
80
100
Outpit-side Positive Supply Voltage : VCC2[V]
Figure 13. Output-side Circuit Current 1 vs Output-side
Positive Supply Voltage (VEE2=0V, OUT=L)
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Figure 14. Output-side Circuit Current 1 vs
Temperature (VEE2=0V, OUT=L)
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2.7
2.7
2.5
2.5
2.3
Output-side Circuit Current 1 : ICC21[mA]
Output-side Circuit Current 1 : ICC21[mA]
Typical Performance Curves - continued
Ta=+105°C
2.1
1.9
1.7
1.5
Ta=+25°C
1.3
Ta=-40°C
1.1
0.9
13.3
15.3
17.3
2.3
VCC2=20.0V
2.1
1.9
1.7
VCC2=15.0V
1.5
VCC2=13.3V
1.3
1.1
0.9
-40
19.3
-20
Output-side Positive Supply Voltage : VCC2[V]
20
40
60
Temperature : Ta[°C]
80
100
Figure 16. Output-side Circuit Current 1 vs
Temperature (VEE2=-8V, OUT=L)
Figure 15. Output-side Circuit Current 1 vs
Output-side Positive Supply Voltage
(VEE2=-8V, OUT=L)
2.7
Output-side Circuit Current 1 : ICC21[mA]
2.7
Output-side Circuit Current 1 : ICC21[mA]
0
2.5
2.3
Ta=+105°C
2.1
1.9
1.7
Ta=+25°C
1.5
Ta=-40°C
1.3
2.5
2.3
VCC2=16.0V
2.1
1.9
1.7
VCC2=15.0V
1.5
VCC2=13.3V
1.3
1.1
1.1
0.9
0.9
13.3
-40
13.8
14.3
14.8
15.3
15.8
-20
0
20
40
60
Temperature : Ta[°
C]
80
100
Output-side Positive Supply Voltage : VCC2[V]
Figure 17. Output-side Circuit Current 1 vs
Output-side Positive Supply Voltage
(VEE2=-12V, OUT=L)
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TSZ22111 • 15 • 001
Figure 18. Output-side Circuit Current 1 vs
Temperature (VEE2=-12V, OUT=L)
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Typical Performance Curves - continued
2.4
Output-side Circuit Current 2 : ICC22[mA]
Output-side Circuit Current 2 : ICC22[mA]
2.4
2.2
2.0
Ta=+105°C
1.8
1.6
1.4
Ta=+25°C
1.2
Ta=-40°C
1.0
2.2
2.0
VCC2=20.0V
1.8
1.6
1.4
VCC2=15.0V
VCC2=13.3V
1.2
1.0
0.8
0.8
13.3
15.3
17.3
-40
19.3
-20
0
Figure 19. Output-side Circuit Current 2 vs
Output-side Positive Supply Voltage
(VEE2=0V, OUT=H)
40
60
80
100
Figure 20. Output-side Circuit Current 2 vs
Temperature (VEE2=0V, OUT=H)
2.4
Output-side Circuit Current 2 : ICC22[mA]
2.4
Output-side Circuit Current 2 : ICC22[mA]
20
Temperature : Ta[°
C]
Output-side Positive Supply Voltage : VCC2[V]
2.2
Ta=+105°C
2.0
1.8
1.6
1.4
Ta=+25°C
1.2
Ta=-40°C
1.0
2.2
2.0
VCC2=20.0V
1.8
1.6
1.4
VCC2=15.0V
VCC2=13.3V
1.2
1.0
0.8
0.8
13.3
15.3
17.3
-40
19.3
0
20
40
60
80
100
Temperature : Ta[°
C]
Output-side Positive Supply Voltage : VCC2[V]
Figure 22. Output-side Circuit Current 2 vs
Temperature (VEE2=-8V, OUT=H)
Figure 21. Output-side Circuit Current 2 vs
Output-side Positive Supply Voltage
(VEE2=-8V, OUT=H)
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-20
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Typical Performance Curves - continued
2.4
Output-side Circuit Current 2 : ICC22[mA]
Output-side Circuit Current 2 : ICC22[mA]
2.4
2.2
Ta=+105°C
2.0
1.8
1.6
1.4
Ta=+25°C
1.2
Ta=-40°C
1.0
2.2
2
VCC2=20.0V
1.8
1.6
VCC2=15.0V
1.4
VCC2=13.3V
1.2
1
0.8
0.8
13.3
13.8
14.3
14.8
15.3
-40
15.8
0
20
40
60
80
100
Figure 24. Output-side Circuit Current 2 vs
Temperature (VEE2=-12V, OUT=H)
5.0
Logic Low Level Input Voltage : VINL[V]
Logic High Level Input Voltage : VINH[V]
Figure 23. Output-side Circuit Current 2 vs
Output-side Positive Supply Voltage
(VEE2=-12V, OUT=H)
4.0
Ta=-40°C
Ta=+25°C
Ta=+105°C
3.0
-20
Temperature : Ta[°
C]
Output-side Positive Supply Voltage : VCC2[V]
2.0
1.0
5.0
4.0
3.0
Ta=-40°C
Ta=+25°C
Ta=+105°C
2.0
1.0
0.0
0.0
4.5
4.75
5
5.25
4.5
5.5
5
5.25
5.5
Input-side Supply Voltage : VCC1[V]
Input-side Supply Voltage : VCC1[V]
Figure 26. Logic Low Level Input Voltage vs
Input-side Supply Voltage
Figure 25. Logic High Level Input Voltage vs
Input-side Supply Voltage
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4.75
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Typical Performance Curves - continued
100
Logic Pull-up Resistance : RINU[kΩ]
Logic Pull-down Resistance : R IND[kΩ]
100
75
Ta=-40°C
Ta=+25°C
50
75
50
Ta=+105°C
Ta=+105°C
25
25
4.5
4.75
5
5.25
5.5
4.5
Input-side Supply Voltage : VCC1[V]
4.75
5
5.25
5.5
Input-side Supply Voltage : VCC1[V]
Figure 28. Logic Pull-up Resistance vs
Input-side Supply Voltage
Figure 27. Logic Pull-down Resistance vs
Input-side Supply Voltage
800
XRST Input Mask Time : tXRSTMIN[ns]
60
Logic Minimum Pulse Width : tINMSK[ns]
Ta=-40°C
Ta=+25°C
50
Ta=+105°C
Ta=+25°C
Ta=-40°C
40
30
20
10
0
Ta=+105°C
Ta=+25°C
Ta=-40°C
700
600
500
400
300
200
100
0
4.5
4.75
5
5.25
5.5
4.5
Input-side Supply Voltage : VCC1[V]
5
5.25
5.5
Input-side Supply Voltage : VCC1[V]
Figure 29. Logic Minimum Pulse Width vs
Input-side Supply Voltage
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4.75
Figure 30. XRST Input Mask Time vs
Input-side Supply Voltage
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Typical Performance Curves - continued
1.3
OUT ON Resistance (Sink) : RONL[Ω]
OUT ON Resistance (Source) : R ONH[Ω]
1.5
Ta=+105°C
1.1
Ta=+25°C
0.9
0.7
Ta=-40°C
0.5
Ta=+105°C
0.8
Ta=+25°C
0.6
0.4
Ta=-40°C
0.2
0.3
13.3
15.3
17.3
13.3
19.3
15.3
17.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
Output-side Positive Supply Voltage : VCC2[V]
Figure 32. OUT ON Resistance (Sink) vs
Output-side Positive Supply Voltage
(IOUT=40mA)
Figure 31. OUT ON Resistance (Source) vs
Output-side Positive Supply Voltage
(IOUT=-40mA)
120
110
Turn ON Time : tPON[ns]
CLAMP ON Resistance : R ONPRO[Ω]
Ta=+105°C
0.8
Ta=+25°C
0.6
0.4
100
Ta=+105°C
Ta=+25°C
Ta=-40°C
90
80
70
Ta=-40°C
60
0.2
13.3
15.3
17.3
50
13.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
17.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
Figure 33. CLAMP ON Resistance vs
Output-side Positive Supply Voltage
(ICLAMP=40mA)
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15.3
Figure 34. Turn ON Time vs
Output-side Positive Supply Voltage
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Typical Performance Curves - continued
120
20
Propagation Distortion : tPDIST[ns]
Turn OFF Time : tPOFF[ns]
110
100
Ta=+105°C
Ta=-40°C
Ta=+25°C
90
80
70
60
50
13.3
15.3
17.3
Ta=-40°C
Ta=+25°C
Ta=+105°C
10
0
-10
-20
13.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
Figure 35. Turn OFF Time vs
Output-side Positive Supply Voltage
17.3
19.3
Figure 36. Propagation Distortion vs
Output-side Positive Supply Voltage
2.2
3.65
VCC1 UVLO OFF Voltage : VUVLO1H[V]
CLAMP ON Threshold Voltage : VCLPON[V]
15.3
Output-side Positive Supply Voltage : VCC2[V]
Ta=+105°C
Ta=+25°C
Ta=-40°C
2.1
2.0
1.9
3.55
3.45
3.35
1.8
13.3
15.3
17.3
-40
19.3
0
20
40
60
80
100
Temperature : Ta[°
C]
Output-side Positive Supply Voltage : VCC2[V]
Figure 37. CLAMP ON Threshold Voltage vs
Output-side Positive Supply Voltage
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-20
Figure 38. VCC1 UVLO OFF Voltage vs Temperature
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Typical Performance Curves - continued
5.0
VCC1 UVLO Mask Time : VUVLO1MSK[μs]
VCC1 UVLO ON Voltage : VUVLO1L[V]
3.55
3.45
3.35
3.0
2.0
1.0
3.25
-40
-20
0
20
40
60
Temperature : Ta[°
C]
80
-40
100
-20
0
20
40
60
80
100
Temperature : Ta[°
C]
Figure 40. VCC1 UVLO Mask Time vs Temperature
Figure 39. VCC1 UVLO ON Voltage vs Temperature
12.3
VCC2 UVLO ON Voltage : VUVLO2L[V]
13.3
VCC2 UVLO OFF Voltage : VUVLO2H[V]
4.0
VEE2=-8V
VEE2=-12V
VEE2=0V
12.8
12.3
11.8
-40
-20
0
20
40
60
Temperature : Ta[°
C]
80
100
10.8
-20
0
20
40
60
Temperature : Ta[°
C]
80
100
Figure 42. VCC2 UVLO ON Voltage vs Temperature
Figure 41. VCC2 UVLO OFF Voltage vs Temperature
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TSZ22111 • 15 • 001
11.3
10.3
-40
11.3
VEE2=0V
VEE2=-8V
VEE2=-12V
11.8
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Typical Performance Curves - continued
550
DESAT Charging Current : IDESATC[μA]
VCC2 UVLO Mask Time : tUVLO2MSK[μs]
13.8
11.8
9.8
VEE2=-12V
VEE2=-8V
VEE2=0V
7.8
5.8
3.8
-40
-20
0
20
40
60
Temperature : Ta[°
C]
80
530
490
Ta=-40°C
470
450
13.3
100
Ta=+105°C
Ta=+25°C
510
15.3
17.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
Figure 43. VCC2 UVLO Mask Time vs Temperature
Figure 44. DESAT Charging Current vs
Output-side Positive Supply Voltage
9.5
0.34
9.3
9.1
8.9
8.7
DESAT Filter Time : tDESATFIL[μs]
DESAT Threshold Voltage : VDESAT[V]
0.32
Ta=+105°C
Ta=+25°C
Ta=-40°C
0.30
0.28
0.26
Ta=+105°C
Ta=-40°C
0.24
0.22
0.20
Ta=+25°C
0.18
8.5
13.3
15.3
17.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
0.16
13.3
15.3
17.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
Figure 45. DESAT Threshold Voltage vs
Output-side Positive Supply Voltage
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TSZ22111 • 15 • 001
Figure 46. DESAT Filter Time vs
Output-side Positive Supply Voltage
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Typical Performance Curves - continued
0.50
DESAT Delay Time (FLT) : tDESATFLT[μs]
DESAT Delay Time (OUT) : tDESATOUT[μs]
0.45
0.43
0.41
Ta=-40°C
0.39
0.37
0.35
Ta=+25°C
Ta=+105°C
0.33
0.48
0.46
0.44
Ta=-40°C
0.42
0.40
0.38
Ta=+25°C
Ta=+105°C
0.36
0.34
0.31
13.3
15.3
17.3
13.3
15.3
17.3
19.3
Output-side Positive Supply Voltage : VCC2[V]
19.3
Output-side Positive Supply Voltage : VCC2[V]
Figure 47. DESAT Delay Time (OUT) vs
Output-side Positive Supply Voltage
Figure 48. DESAT Delay Time (FLT) vs
Output-side Positive Supply Voltage
RDY/FLT Output Low Voltage : VRDYL/VFLTL [V]
0.15
DESAT Low Voltage : VDESATL[V]
0.20
0.16
0.12
Ta=+105°C
Ta=+25°C
0.08
0.04
Ta=-40°C
0.00
13.3
15.3
17.3
0.10
Ta=+25°C
Ta=-40°C
0.05
0.00
4.5
19.3
Output-side Positive Supply Voltage : VCC2[V]
Figure 49. DESAT Low Voltage vs
Output-side Positive Supply Voltage
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TSZ22111 • 15 • 001
Ta=+105°C
4.75
5
5.25
Input-side Supply Voltage : VCC1[V]
5.5
Figure 50. RDY/FLT Output Low Voltage vs
Input-side Supply Voltage
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BM6105AFW-LBZ
I/O Equivalence Circuits
Name
Pin No.
I/O equivalence circuits
Function
VCC2
DESAT
2
DESAT
Desaturation detection pin
GND2
VCC2
OUT
6
OUT
Output pin
VEE2
VCC2
CLAMP
CLAMP
7
Miller clamp pin
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VEE2
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I/O Equivalence Circuits - continued
Name
Pin No.
I/O equivalence circuits
Function
VCC1
INA
10
INA
Control input pin A
GND1
INB
VCC1
11
Control input pin B
INB/XRST
XRST
14
Reset input pin
GND1
VCC1
RDY
12
Ready output pin
RDY/FLT
FLT
13
Fault output pin
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GND1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 51. Example of IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
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Ordering Information
B
M
6
1
0
5
A
F
W
-
Package
FW: SOP16WM
Part Number
L B
Z E 2
Product class
LB: Industrial applications
Z: Manufacturing code
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP16WM (TOP VIEW)
Part Number Marking
BM6105A
LOT Number
Pin 1 Mark
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TSZ22111 • 15 • 001
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Physical Dimension and Packing Information
Package Name
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TSZ22111 • 15 • 001
SOP16WM
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BM6105AFW-LBZ
Revision History
Date
Revision
07.Jun.2018
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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