BRCA016GWZ-WE2

Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCA016GWZ-W (16Kbit) General Description BRCA016GWZ-W series is a serial EEPROM of I2C BUS Interface Method. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Completely conforming to the world standard I2C BUS. All controls available by 2 ports of serial clock (SCL) and serial data (SDA) Other devices than EEPROM can be connected to the same port, saving microcontroller port. 1.7V to 3.6V Single Power Source Operation most suitable for battery use. Possible FAST MODE 400KHz operation Page Write Mode useful for initial value write at factory shipment. Self-timed Programming Cycle Low Current Consumption ¾ At Write Operation (5V) : 0.5mA (Typ) ¾ At Read Operation (5V) : 0.2mA (Typ) ¾ At Standby Operation (5V) : 0.1μA (Typ) Prevention of Write Mistake ¾ Write (write protect) function added ¾ Prevention of write mistake at low voltage UCSP30L1 Compact Package ¾ W(Typ) x D(Typ) x H(Max) :1.30mm x 0.77mm x 0.35mm More than 1 million write cycles More than 40 years data retention Noise Filter Built in SCL / SDA terminal Initial Delivery State FFh BRCA016GWZ-W Capacity Bit Format Type Power Source Voltage Package 16Kbit 2K×8 BRCA016GWZ-W 1.7V to 3.6V UCSP30L1   Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limit Unit Supply Voltage VCC -0.3 to +6.5 V Permissible Dissipation Pd 220 mW Storage Temperature Tstg -65 to +125 °C Operating Temperature Topr -40 to +85 °C - -0.3 to Vcc+1.0 V Input Voltage/ Output Voltage Remark Derate by 2.2mW/°C when operating above Ta=25°C   Memory Cell Characteristics (Ta=25°C, Vcc=1.7V to 3.6V) Parameter Write Cycles (1) Data Retention (1) Limit Unit Min Typ Max 100,000 - - Times 40 - - Years (1) Not 100% TESTED ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Recommended Operating Ratings Parameter Symbol Limit Unit Power Source Voltage Vcc 1.7 to 3.6 Input Voltage VIN 0 to Vcc V DC Characteristics (Unless otherwise specified, Ta=-40°C to +85°C, Vcc=1.7V to 3.6V) Limit Parameter Symbol Min Typ Max Unit Conditions Input High Voltage1 VIH1 0.7Vcc - Vcc+1.0 V Input Low Voltage1 VIL1 -0.3 - +0.3Vcc V Output Low Voltage1 VOL1 - - 0.4 V IOL=3.0mA , 2.5V≦Vcc≦3.6V (SDA) Output Low Voltage2 VOL2 - - 0.2 V IOL=0.7mA , 1.7V≦Vcc≦2.5V (SDA) Input Leakage Current ILI -1 - +1 μA VIN=0 to Vcc Output Leakage Current ILO -1 - +1 μA VOUT=0 to Vcc (SDA) Supply Current (Write) ICC1 - - 2.0 mA Supply Current (Read) ICC2 - - 0.5 mA Standby Current ISB - - 2.0 μA Vcc=3.6V , fSCL =400kHz, tWR=5ms Byte Write, Page Write Vcc=3.6V , fSCL =400kHz Random Read, Current Read, Sequential Read Vcc=3.6V , SDA・SCL=Vcc A0, A1, A2=GND, WP=GND AC Characteristics (Unless otherwise specified, Ta=-40°C to +85°C, Vcc=1.7V to 3.6V) Parameter Symbol Limit Min Typ Max Unit Clock Frequency fSCL - - 400 kHz Data Clock High Period tHIGH 0.6 - - μs Data Clock Low Period tLOW 1.2 - - μs SDA, SCL Rise Time (1) tR - - 0.3 μs (1) tF - - 0.3 μs Start Condition Hold Time tHD:STA 0.6 - - μs Start Condition Setup Time tSU:STA 0.6 - - μs Input Data Hold Time tHD:DAT 0 - - ns Input Data Setup Time tSU:DAT 100 - - ns tPD 0.1 - 0.9 μs SDA, SCL Fall Time Output Data Delay Time tDH 0.1 - - μs tSU:STO 0.6 - - μs Bus Free Time tBUF 1.2 - - μs Write Cycle Time tWR - - 5 ms tI - - 0.1 μs WP Hold Time tHD:WP 1.0 - - μs WP Setup Time tSU:WP 0.1 - - μs WP High Period tHIGH:WP 1.0 - - μs Output Data Hold Time Stop Condition Setup Time Noise Spike Width(SDA,SCL terminal) (1) Not 100% TESTED www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Serial Input / Output Timing tR tF tHIGH SCL SCL tSU:DAT tHD:STA tLOW DATA(1) tHD:DAT SDA SDA D1 D0 DATA(n) ACK ACK (Input) (入力) tPD tBUF ｔWR tDH Stop condition ストップコンディション WP SDA (Output) (出力) ｔHD：WP tSU：WP ○Input read at the rise edge of SCL ○Data output in sync with the fall of SCL Figure 1-(a). Serial Input / Output Timing Figure 1-(d). WP Timing at Write Execution SCL SCL tSU:STA tHD:STA tSU:STO DATA(n) DATA(1) SDA SDA D1 D0 ACK ACK tHIGH:WP START BIT STOP BIT Figure 1-(b). Start - Stop Bit Timing SCL tWR WP ○At write execution, in the area from the D0 taken clock rise of the first DATA(1), to tWR, set WP= 'LOW'. ○By setting WP "HIGH" in the area, write can be cancelled. When it is set WP = 'HIGH' during tWR, write is forcibly ended, and data of address under access is not guaranteed, therefore write it once again. Figure 1-(e). WP Timing at Write Cancel SDA D0 ACK WRITE DATA(n) tWR STOP CONDITION START CONDITION Figure 1-(c). Write Cycle Timing www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Block Diagram Vｃｃ VCC 16Kｂｉｔ ＥＥＰＲＯＭ ARRAY GND 8bit 11bit ADDRESS DECODER SLAVE, WORD ADDRESS REGISTER 11bit START TEST DATA REGISTER WP STOP SCL CONTOROL LOGIC ACK HIGH VOLT GEN SDA Vcc LEVEL DETECT Pin Configuration (BOTTOM VIEW) B ○ ○ ○ GND TEST SDA A ○ ○ ○ SCL VCC WP B1 B2 B3 A1 A2 A3 1 2 3 Pin Descriptions Land No. Pin Name I/O B3 TEST Input B2 GND - B1 SDA Input, Output A3 VCC - Power supply A2 WP Input Write protect A1 SCL Input Serial clock input www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Descriptions TEST terminal, connect to GND Ground (0V) Slave word address Serial data input Serial data output 4/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Input High Voltage1: VIH 1(V) Input Low Voltage1: VIL1 (V) Typical Performance Curves Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 3. Input Low Voltage1 vs Supply Voltage (SCL,SDA,WP) Output Low Voltage1: VOL1 (V) Output Low Voltage2: VOL2 (V) Figure 2. Input High Voltage1 vs Supply Voltage (SCL,SDA,WP) Output Low Current: IOL (mA) Output Low Current: IOL (mA) Figure 4. Output Low Voltage1 vs Output Low Current (VCC=2.5V) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 5. Output Low Voltage2 vs Output Low Current (VCC=1.7V) 5/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Input Leakage Current: ILI(µA) Output Leakage Current: ILO(µA) Typical Performance Curves – Continued Supply Voltage : VCC(V) Figure 6. Input Leakage Current vs Supply Voltage (SCL, WP) Figure 7. Output Leakage Current vs Supply Voltage (SDA) Supply Current (Write): ICC1 (mA) Supply Current (Read): ICC2 (mA) Supply Voltage : VCC(V) Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 8. Supply Current (Write) vs Supply Voltage (fSCL=400kHz) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 9. Supply Current (Read) vs Supply Voltage (fSCL=400kHz) 6/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Clock Frequency: fSCL(kHz) Standby Current: ISB(µA) Typical Performance Curves – Continued Supply Voltage : VCC(V) Figure 10. Standby Current vs Supply Voltage Figure 11. Clock Frequency vs Supply Voltage Data Clock High Period: tHIGH(µA) Data Clock Low Period: tLOW(µs) Supply Voltage : VCC(V) Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 13. Data Clock Low Period vs Supply Voltage Figure 12. Data Clock High Period vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Ta=85℃ 7/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Start Condition Hold Time: tHD:STA(µs) Start Condition Setup Time: tSU:STA(µA) Typical Performance Curves – Continued Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 14. Start Condition Hold Time vs Supply Voltage Input Data Hold Time: tHD:DAT(ns) Input Data Setup Time: tSU:DAT(ns) Figure 15. Start Condition Setup Time vs Supply Voltage Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 16. Input Data Hold Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 17. Input Data Setup Time vs Supply Voltage 8/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 18. Output Data Delay Time vs Supply Voltage (LOW) Figure 19. Output Data Delay Time vs Supply Voltage (HIGH) Write Cycle Time: tWR(ms) Bus Free Time: tBUF(µs) Output Data Delay Time: tPD(µs) Output Data Delay Time: tPD(µs) Typical Performance Curves – Continued Ta=85℃ Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 21. Write Cycle Time vs Supply Voltage Figure 20. Bus Free Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Ta=85℃ 9/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) EFFECTIVE Noise Spike Width(SCL HIGH): tl(µs) EFFECTIVE Noise Spike Width(SDA HIGH): tl(µs) Typical Performance Curves – Continued Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 22. Noise Spike Width vs Supply Voltage (SCL HIGH) WP Setup Time: tSU:WP(µs) WP High Period: tHIGH:WP(µs) Figure 23. Noise Spike Width vs Supply Voltage (SDA HIGH) Supply Voltage : VCC(V) Supply Voltage : VCC(V) Figure 25. WP High Period vs Supply Voltage Figure 24. WP Setup Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Timing Chart 1. I2C BUS Data Communication I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, 2 and acknowledge is always required after each byte. I C BUS data communication with several devices is possible by connecting with 2 communication lines: serial data (SDA) and serial clock (SCL). Among the devices, there should be a “master” that generates clock and control communication start and end. The rest become “slave” which are controlled by an address peculiar to each device, like this EEPROM. The device that outputs data to the bus during data communication is called “transmitter”, and the device that receives data is called “receiver”. SDA 1-7 SCL S START ADDRESS condition 8 9 R/W ACK 1-7 DATA 8 9 ACK 1-7 DATA 8 9 ACK P STOP condition Figure 26. Data Transfer Timing 2. Start Condition (Start Bit Recognition) (1) Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is 'HIGH' is necessary. (2) This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this condition is satisfied, any command cannot be executed. 3. Stop Condition (Stop Bit Recognition) (1) Each command can be ended by a stop condition (stop bit) where SDA goes from 'LOW' to 'HIGH' while SCL is 'HIGH' 4. Acknowledge (ACK) Signal (1) The acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In a master-slave communication, the device (Ex. µ-COM sends slave address input for write or read command, to this IC ) at the transmitter (sending) side releases the bus after output of 8bit data. (2) The device (Ex. This IC receives the slave address input for write or read command from the µ-COM) at the receiver (receiving) side sets SDA 'LOW' during the 9th clock cycle, and outputs acknowledge signal (ACK signal) showing that it has received the 8bit data. (3) This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'. (4) After receiving 8bit data (word address and write data) during each write operation, this IC outputs acknowledge signal (ACK signal) 'LOW'.. (5) During read operation, this IC outputs 8bit data (read data) and detects acknowledge signal (ACK signal) 'LOW'. When acknowledge signal (ACK signal) is detected, and stop condition is not sent from the master (µ-COM) side, this IC continues to output data. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer, recognizes stop condition (stop bit), and ends read operation. Then this IC becomes ready for another transmission. 5. Device Addressing (1) Slave address comes after start condition from master. (2) The significant 4 bits of slave address are used for recognizing a device type. The device code of this IC is fixed to '1010'. (3) Next slave addresses (P2 P1 P0) are upper 3bit of word address, put these and word address ( WA0 to WA7 ) together, 11bit word address ( 2048byte ) of the device specified. (4) The most insignificant bit ( R / W --- READ / WRITE) of slave address is used for designating write or read operation, and is as shown below. Setting R / W to 0 ------- write (setting 0 to word address setting of random read) Setting R / W to 1 ------- read Type BRCA016GWZ-W Maximum Number of Connected Buses Slave address 1 0 1 0 P2 P1 P0 R/W 1 P0 to P2 are page select bits (Upper 3bit of word address). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Write Command 1. Write Cycle (1) Arbitrary data can be written to this EEPROM. When writing only 1 byte, Byte Write is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by Page Write cycle. The maximum number of bytes is specified per device of each capacity. Up to 16 arbitrary bytes can be written. S T A R T SDA LINE W R I T E SLAVE ADDRESS WORD ADDRESS WA 7 1 0 1 0 P2 P1 P0 S T O P DATA WA 0 D7 D0 A C K R A / C W K A C K Figure 27. Byte Write Cycle S T A R T SDA L IN E SLAVE ADDRESS W R I T E WA 7 2A 1A 0 1 0 1 0 AP2P1P0 注) W ORD A D D R E S S (n ) R A / C W K D A TA (n +1 5 ) D A TA (n) WA 0 D7 A C K S T O P D0 D0 A C K A C K Figure 28. Page Write Cycle (2) (3) (4) (5) Data is written to the address designated by word address (n-th address) By issuing stop bit after 8bit data input, internal write to memory cell starts. When internal write is started, command is not accepted for tWR (5ms at maximum). Using page write cycle, writing in bulk is done as follows: When data of more than 16bytes is sent, the byte in excess overwrites the data already sent first. (Refer to "Internal Address Increment" in Page 13.) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) 2. Notes on Write Cycle Continuous Input At SP (stop bit), write starts. S T A R T SDA LINE W R I T E SLAVE ADDRESS WORD ADDRESS（ｎ） WA 0 WA 7 1 0 1 0 P2P1P0 DATA (n) R A / C W K D7 S T O P DATA (n+15) D0 A C K D0 1 0 1 0 A C K A C K S T A R T Next command tWR (maximum : 5ms) Command is not accepted for this period. Figure 29. Page Write Cycle 3. Notes on Page Write Cycle List of numbers of page write Number of Pages 16Byte Product Number BRCA016GWZ-W The above numbers are maximum bytes for respective types. Any bytes below these can be written. In the case BRCA016GWZ-W, 1 page=16bytes, but the page write cycle write time is 5ms at maximum for 16byte bulk write. It does not stand 5ms at maximum × 16byte=80ms (Max) 4. Internal Address Increment Page Write Mode WA7 ----0 ----0 ----0 ----- WA4 0 0 0 WA3 0 0 0 WA2 0 0 0 ------------- WA0 0 1 0 Increment --------- --------- 0Eh 0 0 0 WA1 0 0 1 0 0 0 1 1 0 1 1 0 For example, when it is started from address 0Eh, then, increment is made as below, 1 1 0 0Eh → 0Fh → 00h → 01h ---, please take note. 0 1 0 * 0Eh･･･0E in hexadecimal, therefore, 00001110 becomes a binary number. Significant bit is fixed. No digit up 5. Write Protect (WP) Terminal Write Protect (WP) Function When WP terminal is set at Vcc (H level), data rewrite of all addresses is prohibited. When it is set at GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not leave it open. At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', write error can be prevented. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Read Command 1. Read Cycle Read cycle is when data of EEPROM is read. Read cycle could be random read cycle or current read cycle. Random read cycle is a command to read data by designating a specific address, and is used generally. Current read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available where the next address data can be read in succession. S T A R T SDA LINE W R I T E SLAVE ADDRESS S T A R T WORD ADDRESS(n) WA 7 1 0 1 0 P2P1P0 WA 0 R A *1 / C WK R E A D SLAVE ADDRESS DATA(n) 1 0 1 0 A2A1A0 A C K S T O P It is necessary to input 'H' to the last ACK. D0 D7 A C K R A / C WK Figure 30. Random Read Cycle S T A R T SDA LINE R E A D SLAVE ADDRESS 1 0 1 0 P2P1P0 S T O P DATA(n) D7 It is necessary to input 'H' to the last ACK. D0 A C K R A / C WK Figure 31. Current Read Cycle S T A R T SDA LINE SLAVE ADDRESS R E A D 1 0 1 0 P2 P1P0 DATA(n) D7 R A / C W K S T O P DATA(n+x) D0 D7 A C K D0 A C K A C K Figure 32. Sequential Read Cycle (in the case of Current Read Cycle) (1) In Random Read Cycle, data of designated word address can be read. (2) When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th, i.e., data of the (n+1)-th address is output. (3) When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (μ-COM) side, the next address data can be read in succession. (4) Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal goes from ‘L’ to ‘H’ while SCL signal is 'H' . (5) When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output. Therefore, read command cycle cannot be ended. To end the read command cycle, be sure to input 'H' to ACK signal after D0, and the stop condition where SDA goes from ‘L’ to ‘H’ while SCL signal is 'H'. (6) Sequential read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is asserted from ‘L’ to ‘H’ while SCL signal is 'H'. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Software Reset Software reset is executed to avoid malfunction after power on and during command input. Software reset has several kinds and 3 kinds of them are shown in the figure below. (Refer to Figure 33(a), Figure 33(b), and Figure 33(c).) Within the dummy clock input area, the SDA bus is released ('H' by pull up) and ACK output and read data '0' (both 'L' level) may be output from EEPROM. Therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Start×2 Dummy clock×14 SCL 1 2 13 Normal command 14 SDA Normal command Figure 33-(a) The case of 14 dummy clock +START+START+ command input SCL Start Dummy clock×9 Start 1 2 8 9 Normal command SDA Normal command Figure 33-(b) The case of START +9 dummy clocks +START+ command input Start×9 SCL 1 2 3 8 7 9 Normal command SDA Normal command Figure 33-(c) START×9+ command input ※ タ Acknowledge Polling Start command from START input. ト During internal write execution, all input commands are ignored, therefore ACK is not returned. During internal automatic write execution after write cycle input, next command (slave address) is sent. If the first ACK signal sends back 'L', then it means end of write operation, else 'H' is returned, which means writing is still in progress. By the use of acknowledge polling, next command can be executed without waiting for tWR = 5ms. To write continuously, R / W = 0, then to carry out current read cycle after write, slave address with R / W = 1 is sent. If ACK signal sends back 'L', and then execute word address input and data output and so forth. During internal write, ACK = HIGH is returned. First write command S T A R T Write command S T O P S T Slave A R Address T A C K H tWR S T Slave A R Address T A C K H Second Write Command … S T Slave A R Address T A C K H S T Slave A R Address T A C Word K Address L A C K L Data A C K L S T O P tWR After completion of internal write, ACK=LOW is sent back, so input next word address and data in succession. Figure 34. Case of Continuous Write by Acknowledge Polling www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) WP Valid Timing (Write Cancel) WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP valid timing. During write cycle execution, in cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of data(in page write cycle, the first byte data) is cancel invalid area. WP input in this area becomes Don't care. Set the setup time to rise of D0 taken SCL 100ns or more. The area from the rise of SCL to take in D0 to input the stop condition is cancel valid area. And, after execution of forced end by WP, standby status gets in. ・Rise of SDA ・Rise of D0 taken clock SCL SDA SCL D1 D0 ACK SDA Enlarged view SDA S T Slave A R Address T A C Word K Address L D0 ACK Enlarged view A C D7 D6 D5 D4 D3 D2 D1 D0 K L WP Cancel invalid area A C K L Data A C K L S T O P WP Cancel valid area tWR WP Cancel invalid area WP Data is not written. Figure 35. WP Valid Timing Command Cancel by Start Condition and Stop Condition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Figure 36) However, within ACK output area and during data read, SDA bus may output 'L'. In this case, start condition and stop condition cannot be input, so reset is not available. Therefore, execute software reset. When command is cancelled by start-stop condition during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined. Therefore, it is not possible to carry out current read cycle in succession. To carry out read cycle in succession, carry out random read cycle. SCL SDA 1 0 1 0 Start condition Stop condition Figure 36. Case of Cancel by Start, Stop Condition during Slave Address Input www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) I/O Peripheral Circuit 1. Pull Up Resistance of SDA terminal SDA is NMOS open drain, so it requires a pull up resistor. As for this resistance value (RPU), select an appropriate value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, operating frequency is limited. The smaller the RPU, the larger is the supply current (Read). 2. Maximum Value of RPU The maximum value of RPU is determined by the following factors. (1)SDA rise time to be determined by the capacitance (CBUS) of bus line of RPU and SDA should be tR or lower. Furthermore, AC timing should be satisfied even when SDA rise time is slow. (2)The bus’ electric potential A to be determined by the input current leak total (IL) of the device connected to the bus with output of 'H' to the SDA line and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including recommended noise margin of 0.2Vcc. VCC - ILRPU － 0.2Vcc ≧ VIH BRCA016GWZ-W Microcontroller ∴ RPU ≦ 0.8Vcc－VIH RPU IL SDA Terminal A Ex. ) When VCC =3V, IL=10μA, VIH=0.7 VCC, From (2) RPU ≦ IL 0.8×3－0.7×3 Bus Line Capacity CBUS -6 10×10 ≦ 300 [kΩ] 3. IL Figure 37. I/O Circuit Diagram Minimum Value of RPU The minimum value of RPU is determined by the following factors. (1)When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA. VCC－VOL RPU ≦ IOL ∴ RPU ≧ VCC－VOL IOL (2)VOLMAX=0.4V should secure the input 'L' level (VIL) of microcontroller and EEPROM including the recommended noise margin 0.1 of Vcc. VOLMAX ≦ VIL-0.1 VCC Ex.) When VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc From (1) 3－0.4 RPU ≧ ≧ 3×10 -3 867 [Ω] And VOL = 0.4 [V] VIL = 0.3×3 = 0.9 [V] Therefore, the condition (2) is satisfied. 4. Pull-up Resistance of SCL Terminal When SCL control is made at the CMOS output port, there is no need for a pull up resistor. But when there is a time where SCL becomes 'Hi-Z', add a pull up resistor. As for the pull up resistor value, one of several kΩ to several ten kΩ is recommended in consideration of drive performance of output port of microcontroller. 5. Process of WP Terminal WP terminal is the terminal that prohibits and permits write in hardware manner. In 'H' status, only READ is available and WRITE of all address is prohibited. In case of 'L', both are available. If using as an ROM, it is recommended to connect it to pull up or Vcc. If using both READ and WRITE, control WP terminal or connect it to pull down or GND. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Cautions on Microcontroller Connection 1. RS In I2C BUS, it is recommended that SDA port is of open drain input/output. However, when using CMOS input / output of tri state to SDA port, insert a series resistance RS between the pull up resistor RPU and the SDA terminal of EEPROM. This is to control over current that may occur when PMOS of the microcontroller and NMOS of EEPROM are turned ON simultaneously. RS also plays the role of protection the SDA terminal against surge. Therefore, even when SDA port is open drain input/output, RS can be used. ACK RPU SCL RS SDA 'H' output of microcontroller 'L' output of EEPROM Microcontroller EEPROM Over current flows to SDA line by 'H' output of microcontroller and 'L' output of EEPROM. Figure 39. Input / Output Collision Timing Figure 38. I/O Circuit Diagram 2. Maximum Value of RS The maximum value of RS is determined by the following relations: (1)SDA rise time to be determined by the capacitance (CBUS) of bus line and RPU of SDA should be tR or lower. Furthermore, AC timing should be satisfied even when SDA rise time is slow. A to be determined by RPU and RS the moment when EEPROM outputs 'L' to SDA bus (2)The bus electric potential ○ should sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin of 0.1Vcc. (VCC－VOL)×RS RPU+RS VCC RPU RS A ∴ RS ≦ VOL + VOL+0.1VCC≦VIL VIL－VOL－0.1VCC 1.1VCC－VIL × RPU IOL Example）When VCC=3V,　VIL=0.3VCC,　VOL=0.4V,　RPU=20kΩ, Bus line capacity CBUS VIL from (2), EEPROM Microcontroller RS ≦ 0.3×3－0.4－0.1×3 × 1.1×3－0.3×3 20×10 3 ≦ 1.67 [kΩ] Figure 40. I/O Circuit Diagram 3. Minimum Value of RS The minimum value of RS is determined by over current at bus collision. When over current flows, noises in power source line and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of the impedance of power source line in set and so forth. Set the over current to EEPROM at 10mA or lower. VCC ≦ RS RPU 'L' output RS ∴ RS ≧ Over currentⅠ I VCC I Example） When VCC=3V, I=10mA 'H' output RS Microcontroller EEPROM 3 -3 10×10 ≧ 300[Ω] Figure 41. I/O Circuit Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ≧ 18/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) I/O Equivalence Circuit 1. Input (SCL, WP) Figure 42. Input Pin Circuit Diagram 2. Input / Output (SDA) Figure 43. Input / Output Pin Circuit Diagram Power-Up / Down Conditions At power on, the IC’s internal circuits may go through unstable low voltage area as the Vcc rises, making the IC’s internal logic circuit not completely reset, hence, malfunction may occur. To prevent this, the IC is equipped with POR circuit and LVCC circuit. To assure the operation, observe the following conditions at power on. 1. Set SDA = 'H' and SCL ='L' or 'H' 2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit. tR VCC Recommended conditions of tR , tOFF , Vbot tOFF Vbot 0 tR tOFF Vbot 10ms or below 10ms or longer 0.3V or below 100ms or below 10ms or longer 0.2V or below Figure 44. Rise Waveform Diagram 3. Set SDA and SCL so as not to become 'Hi-Z'. When the above conditions 1 and 2 cannot be observed, take the following countermeasures. (1) In the case when the above condition 1 cannot be observed such that SDA becomes 'L' at power on. →Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'. VCC tLOW SCL SDA After Vcc becomes stable After Vcc becomes stable tDH tSU:DAT Figure 45. When SCL= 'H' and SDA= 'L' tSU:DAT Figure 46. When SCL='H' and SDA='L' (2) In the case when the above condition 2 cannot be observed. →After power source becomes stable, execute software reset(Page 15). (3) In the case when the above conditions 1 and 2 cannot be observed. →Carry out (1), and then carry out (2). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Low Voltage Malfunction Prevention Function LVCC circuit prevents data rewrite operation at low power and prevents write error. At LVCC voltage (Typ =1.2V) or below, data rewrite is prevented. Noise Countermeasures 1. Bypass Capacitor When noise or surge gets in the power source line, malfunction may occur, therefore, it is recommended to connect a bypass capacitor (0.1μF) between the IC’s Vcc and GND pins. Connect the capacitor as close to the IC as possible. In addition, it is also recommended to attach a bypass capacitor between the board’s Vcc and GND. Operational Notes 1. Described numeric values and data are design representative values only and the values are not guaranteed. 2. We believe that the application circuit examples in this document are recommendable. However, in actual use, confirm characteristics further sufficiently. If changing the fixed number of external parts is desired, make your decision with sufficient margin in consideration of static characteristics, transient characteristics, and fluctuations of external parts and our LSI. 3. Absolute maximum ratings If the absolute maximum ratings such as supply voltage, operating temperature range and so on are exceeded, LSI may be destroyed. Do not supply voltage or subject the IC to temperatures exceeding the absolute maximum ratings. In the case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding the absolute maximum ratings should not be supplied to the LSI. 4. GND electric potential Set the voltage of GND terminal lowest at any operating condition. Make sure that each terminal voltage is not lower than that of GND terminal. 5. Thermal design Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. 6. Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7. Operating the IC in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Part Numbering B R C A 0 1 G W 6 Part Number Z - W E2 Package GWZ: UCSP30L1(BRCA016GWZ-W) Packaging and Forming Specification E2: Embossed tape and reel Physical Dimension Tape and Reel Information UCSP30L1 (BRCA016GWZ-W) UCSP30L1 (BRCA016GWZ-W) 6-φ0.20±0.05 0.05 A B A B B A 1 0.25±0.05 2 0.35MAX 0.185±0.05 0.06 S S 0.4 1.30±0.05 0.08±0.05 0.77±0.05 1PIN MARK 3 P=0.4×2 (Unit : mm) Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ) ∗ Order quantity needs to be multiple of the minimum quantity. Marking Diagram UCSP30L1 (BRCA016GWZ-W) (TOP VIEW) 1PIN MARK Part Number Marking A B 3 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 LOT Number 21/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet BRCA016GWZ-W (16Kbit) Revision History Date Revision 5.Sep.2012 25.Feb.2013 001 002 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release Update some English words, sentences’ descriptions, grammar and formatting. Update Figure 35. WP Valid Timing. 22/22 TSZ02201-0R2R0G100510-1-2 25.Feb.2013 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001