Datasheet
System Lens Drivers
μ-step System Lens Driver
for Digital Still Cameras
BU24026GU
●General Description
BU24026GU is a system Lens Driver that uses μ-step
driving to make the configuration of the sophisticated,
high precision and low noise lens driver system possible.
This IC has a built-in driver for both DC motor and voice
coil motor and a μ-step controller that decreases CPU
power. Therefore, multifunctional lens can be applied.
●Key Specifications
Digital Power Supply Voltage:
Driver Power Supply Voltage:
Output Current (1ch-7ch):
Input Clock Frequency:
FET ON Resistance (1ch-6ch):
FET ON Resistance (7ch):
Operating Temperature Range:
●Features
Built-in 7 channels Driver block
1ch-6ch: Voltage control type H-bridge
7ch: Current control type H-bridge
Built-in 2 channels PI driving circuit
Built-in 3 channels Waveforming circuit
●Package
VCSP85H3
2.7V to 3.6V
2.7V to 5.5V
±500mA(Max)
1MHz to 27.5MHz
1.5Ω(Typ)
0.9Ω(Typ)
-20℃ to +85℃
3.80mm x 3.80mm x 1.00mm
●Applications
Digital still cameras
●Typical Application Circuit
Example1
DVDD
VDDAMP
SI3
SI2
SO3
SI1
SO2
SO1
PIOUT2
PIOUT1
Photo interrupter
MVCC12
MVCC34
DVSS
MVCC56
MGND7
OUT5A
M
OUT5B
5ch
Driver
MGND12
MGND34
OUT6A
OUT6B
MGND56
6ch
Driver
Logic
OUT1A
1ch
Driver
SENSE6
2ch
Driver
OUT1B
M
OUT2A
OUT2B
RNF6
OUT3A
3ch
Driver
OUT6A
7ch
Driver
OUT3B
M
IN56
IN7
STATE3
STATE2
STATE1
SOUT
SDATA
SCLK
FCLK
OUT4A
CSB
OUT6B
4ch
Driver
OUT4B
Main Host
○Product structure:Silicon monolithic integrated circuit
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TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Pin Configuration
(Bottom view)
G
VDDAMP
OUT6B
MGND56
OUT6A
MVCC56
OUT5A
OUT5B
F
SENSE
VDDAMP
SO1
STATE2
STATE3
OUT5B
OUT4B
E
OUT7A
DVSS
PIOUT1
STATE1
SI1
DVDD
OUT4A
D
RNF
PIOUT2
CSB
IN56
SO3
MGND34
C
OUT7B
FCLK
SO2
IN7
SI3
OUT3B
B
MGND7
MVCC12
SCLK
SI2
SOUT
MVCC34
OUT3A
A
MVCC12
OUT1A
OUT1B
MGND12
OUT2A
OUT2B
MVCC34
1
2
3
4
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Datasheet
BU24026GU
●Pin Description
Land
Matrix
No.
Pin Name
Power
Supply
Land
Matrix
No.
Pin Name
Power
Supply
E6
DVDD
-
Digital power supply
A3
OUT1B
MVCC12
1-channel driver B output
E2
DVSS
-
Ground
A5
OUT2A
MVCC12
2-channel driver A output
C2
FCLK
DVDD
main clock logic input
A6
OUT2B
MVCC12
2-channel driver B output
D4
CSB
DVDD
Serial control chip select
input
A7, B6(*)
MVCC34
-
3-4channel
driver power supply
B3
SCLK
DVDD
Serial control clock input
D7
MGND34
-
3-4channel
driver ground
D3
SDATA
DVDD
Serial control data input
B7
OUT3A
MVCC34
3-channel
driver A output
B5
SOUT
DVDD
Serial control data output
C7
OUT3B
MVCC34
3-channel
driver B output
E4
STATE1
DVDD
STATE1 1ch,2ch
condition logic output
E7
OUT4A
MVCC34
4-channel
driver A output
F4
STATE2
DVDD
STATE2 3ch,4ch
condition logic output
F7
OUT4B
MVCC34
4-channel
driver B output
F5
STATE3
DVDD
STATE 3 5ch,6ch
condition logic output/
5ch,6ch control logic input
G5
MVCC56
-
5-6channel
driver power supply
D5
IN56
DVDD
5ch,6ch control logic input
G3
MGND56
-
5-6channel
driver ground
C5
IN7
DVDD
7ch control logic input
G6
OUT5A
MVCC56
5-channel
driver A output
E3
PIOUT1
DVDD
PI driving output1
F6,G7(*)
OUT5B
MVCC56
5-channel
driver B output
D2
PIOUT2
DVDD
PI driving output2
G4
OUT6A
MVCC56
6-channel
driver A output
E5
SI1
DVDD
1ch
waveforming input(With
adjustment function of
threshold voltage)
G2
OUT6B
MVCC56
6-channel
driver B output
B4
SI2
DVDD
2ch waveforming input
D1
RNF
-
7-channel
driver power supply
C6
SI3
DVDD
3ch waveforming input
B1
MGND7
-
7-channel driver ground
F3
SO1
DVDD
1ch waveforming output
F2,G1(*)
VDDAMP
-
Power supply of constant
current driver control
C4
SO2
DVDD
2ch waveforming output
F1
SENSE
VDDAMP
D6
SO3
DVDD
3ch waveforming output
E1
OUT7A
RNF
7-channel
driver A output
A1, B2(*)
MVCC12
-
1-2channel
driver power supply
C1
OUT7B
RNF
7-channel
driver B output
A4
MGND12
-
1-2channel driver ground
C3
INDEX
-
A2
OUT1A
MVCC12
1-channel driver A output
Function
Function
Negative input for constant
current driver control
Index pin
(*)It is not possible to use corner pin only. (Corner pins are A1, A7, G1, and G7.)
Please use A1-B2, A7-B6, F2-G1, F6-G7 pair respectively or using B2, B6, F2, F6 only.
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Datasheet
BU24026GU
●Block Diagram
DVDD
DVDD
DVDD
POR
TSD
DVDD
DVDD
DVDD
DVSS
MVCC56
MVCC56
OUT5A
OUT5B
PREDRIVER
DVDD
DVDD
MVCC12
MVCC12
PREDRIVER
OUT1A
OUT1B
MGND12
MVCC12
MVCC12
PREDRIVER
OUT2A
OUT2B
MGND56
MVCC56
MVCC56
MGND12
Logic
PREDRIVER
OUT6A
OUT6B
MVCC34
MVCC34
PREDRIVER
OUT3A
OUT3B
MGND56
MGND34
VDDAMP
SENSE
RNF
MVCC34
MVCC34
DVDD
DAC
PREDRIVER
OUT7A
OUT7B
MGND7
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OUT4A
OUT4B
MGND34
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Datasheet
BU24026GU
●Description of Blocks
Stepping Motor Driver (1ch-6ch Driver)
Built-in stepping motor driver of PWM driving type.
Maximum 3 stepping motor can be driven independently.
Built-in voltage feedback circuit of D-class type.
(1) Control
(ⅰ)Autonomous Control
The stepping motor is rotated by setting the registers for the stepping motor control.
The state of rotation command (executing:1, finished:0), Cache register and motor position are the output from the
serial output (SOUT pin). Also, the signal (MO output) which is synchronized with the motor rotation is the output from
STATE pin.
It is possible to select the mode of stepping motor control from μ-step (1024 portion), 1-2 phase excitation and
2 phase excitation.
Built-in Cache registers.
Cache registers enable the setting of the subsequent process while the motor is in operation. Through these registers,
operations are done continuously.
ON/OFF
Direction
Speed
Torque
Amount
Host
3
CSB
SCLK
SDATA
State
SOUT
Position
STATE
SIF
H.B.
STM
Control
Logic
SIN wave
Control
Logic
PWM
Control
Logic
STM
H.B.
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Datasheet
BU24026GU
●Description of Blocks
Current Driver (7ch Driver)
Built-in constant current driver.
The voltage of RNF pin and the external resistor (RRNF) determine the amount of output current. The internal
high-precision amplifier (CMOS gate input) is used for constant current control. If any resistance component exists in
the wirings of RNF pin and the external resistor (RRNF), the precision can be reduced. To avoid this, pay utmost
attention to the wirings.
(1) Control
(ⅰ)External Pin Control
The constant current drive is executed by the output current value and current direction which are controlled by the
register setting. Constant current driving ON/OFF is controlled by IN7 pin.
Current value
Direction
3
CSB
SCLK
SDATA
SIF
Host
ON/OFF
Control
Logic
Current control
DAC
C.C.
VCM
IN7
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Datasheet
BU24026GU
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Limit
Unit
DVDD
-0.3 to +4.5
V
MVCC
-0.3 to +7.0
V
VDDAMP
-0.3 to +7.0
V
Input Voltage
VIN
-0.3 to supply voltage+0.3
V
±500
mA
Driver block (by MVCC pin)
Input / Output Current
IIN
+100
mA
by PIOUT pin
Power Supply Voltage
Storage Temperature Range
TSTG
-55 to +125
℃
Operating Temperature Range
TOPE
-20 to +85
℃
PD
1370
mW
Symbol
Limit
Unit
Digital Power Supply Voltage
DVDD
2.7 to 3.6
V
Driver Power Supply Voltage
MVCC
2.7 to 5.5
V
VDDAMP
2.7 to 5.5
V
FCLK
1 to 27.5
MHz
Permissible Dissipation *1
*1
Remark
To use at a temperature higher than Ta=25 °C, derate 13.7mW per 1 °C
(At mounting 50mm x 58mm x 1.75mm glass epoxy board.)
●Recommended Operating Rating (Ta=25℃)
Parameter
Constant Current Control
Amplifier Power Supply Voltage
Clock Operating Frequency
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Remark
DVDD≦MVCC
Reference clock
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Electrical Characteristics
(Unless otherwise specified, Ta=25°C, DVDD=3.0V, MVCC=5.0V, VDDAMP=5.0V, DVSS=MGND=0.0V)
Limit
Parameter
Symbol
Unit
Conditions
MIN
TYP
MAX
(DVDD)
ISSD
-
30
100
μA CMD_RS=0
(MVCC)
ISSVM
-
0
10
μA
(DVDD)
IDDD
-
8.5
15.0
Low-level Input Voltage
VIL
DVSS
-
0.3DVDD
V
High-level Input Voltage
VIH
0.7DVDD
-
DVDD
V
Low-level Input Current
IIL
0
-
10
μA VIL=DVSS
High-level Input Current
IIH
0
-
10
μA VIH=DVDD
Low-level Output Voltage
VOL
DVSS
-
0.2DVDD
V
IOL=1.0mA
High-level Output Voltage
VOH
0.8DVDD
-
DVDD
V
IOH=1.0mA
PIVO
-
0.28
0.50
V
IIH=50mA
Vth
0.5
-
2.5
V
SI1
V
1/2DVDD-0.1
1/2DVDD
1/2DVDD+0.1
V
Waveforming Vth = 20h setting
High-level Threshold Voltage
VthH1
-
-
1.9
V
SI2,SI3(DVDD=3.25V)
Hys ON
Low-level Threshold Voltage
VthL1
0.6
-
-
V
SI2,SI3(DVDD=3.25V)
Hys ON
Hysteresis Width
HYS
0.2
-
0.6
V
SI2,SI3(DVDD=3.25V)
Hys ON
Threshold Voltage
VthH2
1.0
-
1.85
V
SI2,SI3(DVDD=3.25V)
Hys OFF
ON-resistance
Ron
-
1.5
2.0
Ω
IO=±100mA
(the sum of high and low
sides)
OFF-leak Current
IOZ
-10
0
+10
μA Output Hiz setting
Turn-ON Time
tON
-
0.15
1.0
μS
Turn-OFF Time
tOFF
-
0.1
0.5
μS
Average Voltage Accuracy
between different Output Pins
Vdiff
-5
-
+5
%
Vdiff = 2.0V setting.
ON-resistance
Ron
-
0.9
1.5
Ω
IO=±100mA
(the sum of high and low
sides)
OFF-leak Current
IOZ
-10
0
+10
μA Output Hiz setting
Output Voltage
VO
188
200
212
mV
Turn-ON Time
tON
-
0.15
1.0
μS
Turn-OFF Time
tOFF
-
0.1
0.5
μS
Quiescence
Operation
mA CMD_RS=1
Output Voltage
Detective Voltage Range
Detective Voltage Error
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DAC setting : A7h
RRNF=1Ω
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Typical Performance Curves
(Unless otherwise specified, Ta=25°C, DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
80
80
Static Current [uA]
100
Static Current [uA]
100
60
40
40
20
20
0
0
2.0
2.5
3.0
3.5
-50
4.0
-25
0
25
50
75
DVDD [ V]
Am bient Tem perature [℃]
Figure 1. DVDD Static Current
Voltage Dependency
Figure 2. DVDD Static Current
Temperature Dependency
10
10
8
8
Static Current [uA]
Static Current [uA]
60
6
4
100
6
4
2
2
0
0
2.0
3.0
4.0
5.0
-50
6.0
0
25
50
75
100
Am bient Tem perature [℃]
MVCC [ V]
Figure 3. MVCC Static Current
Voltage Dependency
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Figure 4. MVCC Static Current
Temperature Dependency
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Datasheet
BU24026GU
●Typical Performance Curves
(Unless otherwise specified, Ta=25°C, DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
5
5
4
4
IO=±100mA
3
Ron [Ω]
Ron [Ω]
IO=±100mA
2
3
2
1
1
0
0
2.0
3.0
4.0
5.0
6.0
-50
-25
0
25
Am bient Tem perature [℃ ]
Figure 5. Output ON-Resistance
MVCC Dependency
(Voltage driver block)
Figure 6. Output ON-Resistance
Temperature Dependency
(Voltage driver block)
5
4
4
Ron [Ω]
3
2
3
2
1
1
0
0
3.0
4.0
5.0
6.0
-50
-25
0
25
50
75
MVCC [ V]
Am bient Tem perature [℃ ]
Figure 7. Output ON-Resistance
MVCC Dependency
(Current driver block)
Figure 8. Output ON-Resistance
Temperature Dependency
(Current driver block)
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100
IO=±100mA
IO=±100mA
Ron [Ω]
75
MVCC [V]
5
2.0
50
10/19
100
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18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Typical Performance Curves
(Unless otherwise specified, Ta=25°C, DVDD=3.0V, MVCC=5.0V, DVSS=MGND=0.0V)
400
5
4
Output Current [mA ]
Output Voltage [V]
300
3
2
200
100
1
0
0
0
32
64
96
32
128
64
96
128
160
192
224
256
Serial s etting code
Serial setting code
Figure 10. Output Current
(Current driver block, RRNF = 1.0Ω, RL = 5.0Ω)
Figure 9. Average Voltage Accuracy
between different output pins
(Voltage driver block)
0.20
1600
1370mW
1400
Power Dissipation [mW]
PIOUT [ V]
0.15
0.10
IIH=30mA
0.05
1200
1000
800
548mW
600
400
200
85℃
0.00
0
2.0
2.5
3.0
3.5
4.0
0
50
75
100
125
150
Ambient Temperature [℃]
DVDD [ V]
Figure 11. Output Voltage
DVDD Dependency
(PI driving circuit)
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Figure 12. Power Dissipation Curve
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Datasheet
BU24026GU
●Timing Chart
(Unless otherwise specified, Ta=25°C, DVDD=3.0V)
Parameter
Symbol
SCLK input cycle
SCLK L-level input time
SCLK H-level input time
SDATA setup time
SDATA hold time
CSB H-level input time
CSB setup time
CSB hold time
SOUT output delay time
FCLK input cycle
FCLK L-level input time
FCLK H-level input time
tSCLK
tSCLKL
tSCLKH
tsSDATA
thSDATA
tCSBH
tsCSB
thCSB
tdSOUT
tFCLK
tFCLKL
tFCLKH
Specification
more than 125 nsec
more than 50 nsec
more than 50 nsec
more than 50 nsec
more than 50 nsec
more than 800 nsec
more than 50 nsec
more than 50 nsec
more than 50 nsec
more than 36 nsec
more than 18 nsec
more than 18 nsec
0.7DVDD
0.3DVDD
CSB
tSCLK
thCSB
tSCLKH
tsCSB
tCSBH
tSCLKL thCSB
tsCSB
0.7DVDD
0.3DVDD
SCLK
tsSDATA
thSDATA
0.7DVDD
0.3DVDD
SDATA
tdSOUT
0.8DVDD
0.2DVDD
SOUT
tFCLKL
tFCLK
tFCLKH
0.7DVDD
0.3DVDD
FCLK
(note1) FCLK is asynchronous with SCLK.
(note2) Duty of FCLK, SCLK are free.
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Datasheet
BU24026GU
●Serial interface
Control commands are framed by a 16-bit serial input (MSB first) and are sent through the CSB, SCLK, and SDATA pins.
The 4 higher-order bits specify addresses, while the remaining 12 bits specify data. Data of every bit is sent through SDATA
pin, which is retrieved during the rising edge of SCLK. Data becomes valid when CSB is Low and is registered during the
rising edge of CSB. (as shown in “Note 5,6”) Furthermore, the interface will be synchronized with the falling edges of SCLK
to output the SOUT data of the 12 bits.
CSB
SCLK
SDATA
x D15 D14 D13 D12 D11 D10 D9
D8
D7
D6
Address
SOUT
D5
D4
D3
D2
D1
D0
D5
D4
D3
D2
D1
D0
x
Data
x
D11 D10 D9
D8
D7
D6
Hiz
Hiz
<Register map>
Address[3:0]
0
14 13
0
0
12
0
0
0
0
1
0
0
0
0
0
1
1
1
0
0
1
0
0
1
0
1
0
0
1
1
1
0
1
1
0
0
1
0
1
0
0
1
1
1
1
0
0
1
1
1
0
0
1
0
1
1
1
1
0
1
1
0
Data[11:0]
11
10
ModeA[1:0]
0
0
0
0
1
1
EnA
RtA
Ach status[1:0]
ModeB[1:0]
0
0
0
0
1
1
EnB
RtB
Bch status[1:0]
ModeC[1:0]
0
0
0
0
1
0
1
1
1
1
EnC
RtC
Cch status[1:0]
0
0
0
0
0
0
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
0
0
0
1
9
8
SelA[1:0]
0
1
1
0
0
0
SelB[1:0]
0
1
1
7
0
4
3
2
1
0
Ach_different_output_voltage[6:0]
Ach_Cycle[7:0]
Ach_Cycle[15:8]
0
APOS[1:0]
0
0
0
ASTOP
Ach_Pulse[9:0]
Ach operation pulse number[9:0]
Bch different output voltage[6:0]
Bch Cycle[7:0]
Bch Cycle[15:8]
0
BPOS[1:0]
0
0
0
BSTOP
Bch_Pulse[9:0]
Bch operation pulse number[9:0]
Cch different output voltage[6:0]
Cch_Cycle[7:0]
Cch_Cycle[15:8]
5ch_different_output voltage[6:0]
6ch_different_output voltage[6:0]
0
C_POS[1:0]
0
0
0
CSTOP
Cch_Pulse[9:0]
Cch operation pulse number[9:0]
SEL56[2:0]
P_CTRL
CLK_DIV[2:0]
PI_CTRL1 PI_CTRL2
0
0
0
0
0
0
0
0
0
0
0
SelC[1:0]
0
1
1
0
1
0
0
0
5_PWM_Ct[1:0]
6_PWM_Ct[1:0]
0
0
Chopping[1:0]
0
0
1
0
0
0
0
1
1
0
0
0
0
1
1
0
1
1
0
0
0
1
1
0
1
1
0
0
0
0
CacheM
0
0
5_PULSE_CNT
5
5_PULSE_BASE[1:0]
0
6_PULSE_CNT
6_PULSE_BASE[1:0]
5_PULSE_COUNT[7:0]
6_PULSE_COUNT[7:0]
0
0
1
1
1
0
0
0
0
0
1
0
1
0
0
0
0
1
1
0
0
0
Addresses other
than those above
6
EXT_EN
0
EXT_PAT1
EXT_PAT3
EXT_PAT5
EXT_PAT7
EXT_PAT9
EXT_PAT11
EXT_PAT13
EXT_PAT15
EXT_RT
EXT_NUM[3:0]
EXT_PAT0
EXT_PAT2
EXT_PAT4
EXT_PAT6
EXT_PAT8
EXT_PAT10
EXT_PAT12
EXT_PAT14
Constant current driver reference voltage adjustment 8bit DAC[7:0]
0
0
0
0
0
7_CTRL[1:0]
0
Wavefoming circuit 1 Vthh[5:0]
0
Wavefoming circuit 1 Vthl[5:0]
0
0
0
0
0
HYS3
HYS2
0
0
0
0
0
0
CMD_RS
Setting prohibited
(Note 1) The notations A, B, C in the register map corresponds to Ach, Bch and Cch respectively.
(Note 2) The Ach is defined as 1ch and 2ch driver output, the Bch as 3ch and 4ch driver output, and the Cch as 5ch and 6ch driver output.
(Note 3) After reset (Power ON reset, and CMD_RS), “initial setting” is saved in all registers.
(Note 4) The addresses 4’b0011, 4’b0111, and 4’b1011 have data (status [1:0], operation pulse number [9:0]), which are internal register values and
output from the SOUT pin.
(Note 5) For Mode, different output voltage, Cycle, En, and Rt registers, data that are written before the access to the Pulse register becomes valid, and
determines the rising edge of CSB after the access to the Pulse register. (The Mode, different output voltage, Cycle, En, Rt, and Pulse registers
contain Cache registers. Any registers other than those do not contain Cache registers.)
(Note 6) For POS, STOP, PWM_Ct, and different output voltage registers, data are determined at the rising edge of CSB. For any registers other than those,
data are determined at the rising edge of 16th SCLK.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/19
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Application Example
1ch/2ch
μ-step
7ch
C.C.
5ch/6ch
μ-STEP
3ch/4ch
μ-step
STM
STM
STM
VCM
Auto Focus
Zoom
Iris
Shutter
5ch
PWM
6ch
PWM
7ch
C.C.
STM
VCM
VCM
VCM
Zoom
Iris
Iris
Shutter
3ch/4ch
μ-step
1ch/2ch
μ-step
STM
Auto Focus
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●I/O Equivalence Circuit
Pin
Equivalent Circuit Diagram
FCLK
CSB
SCLK
SDATA
IN56
IN7
SI2
SI3
Pin
SENSE
DVDD
DVDD
P
Equivalent Circuit Diagram
VDDAMP
VDDAMP
+
-
P
* SI2,SI3 are the
Schmitt inputs.
SOUT
STATE1
STATE2
SO1
SO2
SO3
PIOUT1
PIOUT2
DVDD DVDD
DVDD
P
OUT1A
OUT1B
OUT2A
OUT2B
P
OUT3A
OUT3B
OUT4A
OUT4B
MVCC12
P
P
OUT5A
OUT5B
OUT6A
OUT6B
P
STATE3
P RNF
P
P
DVDD
P
OUT7A
OUT7B
RNF
MVCC56
P
MVCC34
P
SI1
DVDD
DVDD
P
DVDD
P
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/19
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Operational Notes
1) Absolute maximum ratings
If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be
damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you expect that any
voltage or temperature could be exceeding the absolute maximum ratings, take physical safety measures such as
fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI.
2)
GND potential
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Thermal design
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (PD) in
actual operating conditions.
4)
Short circuit between pins and malfunctions
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
5)
Operation in strong magnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
6)
Power ON sequence
To turn ON the DVDD, be sure to reset at CMD_RS register.
7)
Thermal shutdown
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its
operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this
function will always be activated.
8)
PI drive circuit
The output voltage of PIOUT should not exceed the voltage of the power supply voltage DVDD.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/19
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Ordering Information
B
U
2
4
0
2
6
G
Part Number
U
-
Package
GU
:
VCSP85H3
E2
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VCSP85H3
(TOP VIEW)
1PIN MARK
Part Number Marking
U24026
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
LOT Number
17/19
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Physical Dimension Tape and Reel Information
Package Name
VCSP85H3
1PIN MARK
3.8±0.05
Lot. No.
U24026
1.0MAX
0.25±0.1
3.8±0.05
S
(φ0.15) INDEX POST
0.4±0.05
48-φ0.30±0.05
0.05 A B
S
A
G
F
E
D
C
B
A
B
P=0.5×6
0.06
1 2 3 4 5 6 7
0.4±0.05
P=0.5×6
Tape
Embossed carriertape
Quantity
2,500pcs/Real
Direction of feed
E2
(The direction is 1pin product is at the upper left
when you hold reel on the hand and you pull out
the tape on the right hand)
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/19
1234
1234
Reel
1234
1234
1pin
1234
1234
Direction of f eed
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
BU24026GU
●Revision History
Date
Revision
Changes
26.Sep.2012
001
New Release
18.Apr.2013
002
Update some English words, sentences, descriptions, grammar and formatting.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/19
TSZ02201-0M2M0BC12050-1-2
18.Apr.2013 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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