Datasheet
CMOS LDO Regulators for Automotive
1ch 200mA
CMOS LDO Regulators
BUxxJA2DG-C series
General Description
Key Specifications
BUxxJA2DG-C series are high-performance CMOS LDO
regulators with output current ability of up to 200mA. The
SSOP5 package can contribute to the downsizing of the
set. These devices have excellent noise and load
response characteristics despite of its low circuit current
consumption of 33µA. They are most appropriate for
various applications such as power supplies for radar
modules and camera modules.
Input Power Supply Voltage Range:
1.7V to 6.0V
Output Current Range:
0 to 200mA
Operating Temperature Range:
-40°C to +125°C
Output Voltage Lineup:
1.0V to 3.3V
Output Voltage Accuracy:
±2.0%
Circuit Current:
33µA(Typ)
Standby Current:
0μA (Typ)
Package
Features
SSOP5
AEC-Q100 qualified(Note 1)
High Output Voltage Accuracy: 2.0%
(In all recommended conditions)
High Ripple Rejection: 68 dB (Typ, 1kHz)
Compatible with small ceramic capacitor
(Cin=Cout=0.47µF)
Low Current Consumption: 33µA
Output Voltage ON/OFF control
Output Discharge
Built-in Over Current Protection Circuit (OCP)
Built-in Thermal Shutdown Circuit (TSD)
Package SSOP5 is similar to SOT23-5(JEDEC)
W(Typ) x D(Typ) x H(Max)
2.90mm x 2.80mm x 1.25mm
(Note1:Grade1)
Applications
Automotive (Radar modules, Camera modules, etc.)
Typical Application Circuit
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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Ordering Information
B
U
Part
Number
X
X
J
Output Voltage
10 : 1.0V
12 : 1.2V
1C : 1.25V
15 : 1.5V
18 : 1.8V
25 : 2.5V
28 : 2.8V
2J : 2.85V
30 : 3.0V
33 : 3.3V
A
2
D
Series name
Maximum Output Current : 200mA
Maximum Power Supply Voltage Range : 6.5V
G
-
Package
G : SSOP5
C
T
R
Product Rank
Packaging and forming specification
C : for Automotive Embossed tape and reel
TR : The pin number 1 is the upper right
Pin Descriptions
Pin Configurations
SSOP5(Top view)
Pin No.
Symbol
Function
1
VIN
Input Pin
2
GND
GND Pin
3
STBY
Output Control Pin
(High:ON, Low:OFF)
4
N.C.
No Connect
5
VOUT
Output Pin
VOUT
N.C.
VIN GND STBY
Block Diagram
1 VIN
STBY 3
STBY
VREF
AMP
+
OCP
5 VOUT
TSD
N.C. 4
2 GND
Figure 2. Block diagram
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Description of Blocks
Block
Function
Description
STBY
Control Standby mode
VREF
Internal Reference Voltage
AMP
Error AMP
OCP
Over Current Protection
TSD
Thermal Shutdown
STBY controls internal block active and standby state
VREF generates reference voltage.
AMP amplifies electric signal and drives output power transistor.
When output current exceeds current ability, OCP restricts Output
Current.
When Junction temperature rise and exceed Maximum junction
temperature, TSD turns off Output power transistor.
Absolute Maximum Ratings
Parameter
Symbol
Maximum Power Supply Voltage Range
Rating
Unit
-0.3 to +6.5(Note1)
VIN
V
STBY Voltage
VSTBY
-0.3 to +6.5
V
Maximum Junction Temperature
Tjmax
+150
°C
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
(Note1) Not to exceed Tjmax
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Recommended Operating Ratings(Ta=-40°C to +125°C)
Parameter
Symbol
Limit
Unit
VIN
1.7 to 6.0
V
STBY voltage
VSTBY
1.7 to 6.0
V
Maximum Output Current
IOMAX
0 to 200
mA
Input Power Supply Voltage Range
Recommended Operating Conditions
Parameter
Symbol
Input capacitor
Output capacitor
Rating
Unit
Conditions
100
µF
A ceramic capacitor is recommended.
100
µF
A ceramic capacitor is recommended.
Min
Typ
Max
Cin
0.47(Note1)
1.0
Cout
0.47(Note1)
1.0
(Note1) Set the value of the capacitor so that it does not fall below the minimum value.
Take into consideration the temperature characteristics, DC device characteristics and degradation with time.
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Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
SSOP5
Junction to Ambient
θJA
376.5
185.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
40
30
°C/W
(Note 1)Based on JESD51-2A(Still-Air).
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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Electrical Characteristics
(Unless otherwise noted, Ta=-40 to 125°C, VIN=VOUT+1.0V(Note 1), VSTBY=1.5V, Cin=1μF, Cout=1μF.
The Typical value is defined at Ta=25°C)
Parameter
Symbol
MIN
Limit
TYP
MAX
Unit
Conditions
Load Regulation1
VDLO1
-
0.5
5
mV
IOUT=0mA to 200mA
VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V
VOUT≦2.5V, VIN=3.0 to 6.0V
IOUT=10mA
VOUT≦2.5V, VIN=3.0 to 6.0V
IOUT=10mA
VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V
IOUT=1mA to 100mA
Load Regulation2
VDLO2
-
1
10
mV
IOUT=1mA to 200mA
-
160
315
mV
VOUT=1.8V, IOUT=100mA
Dropout Voltage
VDROP
100
190
mV
VOUT=2.5V, IOUT=100mA
-
85
155
mV
VOUT≧2.8V, IOUT=100mA
Maximum Output Current
IOMAX
200
-
-
mA
VIN=VOUT+1.0V (Note 1)
Limit Current
ILMAX
250
400
-
mA
applied VOUT×0.98 for VOUT Pin, Ta=25°C
Short Current
ISHORT
-
100
200
mA
VOUT=0V, Ta=25°C
Circuit Current
IGND
-
33
80
µA
IOUT=0mA
Circuit Current (STBY)
ICCST
-
-
2.0
µA
Ripple Rejection Ratio
R.R.
-
68
-
dB
Load Transient Response
VLOT
-
±65
-
mV
Line Transient Response
VLIT
-
±5
-
mV
VSTBY=0V
VRR=-20dBv, fRR=1kHz
IOUT=10mA, Ta=25°C
IOUT=1mA to 150mA, Trise=Tfall=1µs
VIN=VOUT+1.0V, Ta=25°C
VIN=VOUT+0.5 to VOUT+1.0V
Trise=Tfall =10µs, Ta=25°C
Bandwidth 10 to 100kHz, Ta=25°C
Output Voltage
VOUT
Line Regulation
VDLI
Output Noise Voltage
VOUT
×0.98
VOUT
VOUT
×1.02
V
-
4
15
mV
-
6
20
mV
VNOIS
-
30
-
µVrms
Startup Time(Note 2)
TST
-
100
300
µs
Discharge Resistor
RDSC
20
50
80
Ω
ON
VSTBH
1.1
-
6.0
V
OFF
VSTBL
0
-
0.5
V
ISTBY
-
-
4.0
µA
STBY Control
Voltage
STBY Pin Current
Ta=25°C
VIN=4.0V, VSTBY=0V,
VOUT=4.0V, Ta=25°C
(Note 1) VIN=3.0V for VOUT＜2.5V.
(Note 2) Startup time=time from EN assertion to VOUT×0.98
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Reference data BU18JA2DG-C (Unless otherwise specified, Ta=25°C)
1.83
2.0
1.8
1.82
Output Voltage VOUT (V)
OUT
OutputVoltage
(V)
VoltageVVOUT
Output
(V)
1.6
1.4
1.2
IOUT=0mA
IOUT=50mA
IOUT=200mA
1.0
0.8
0.6
Ta=25°C
VIN=VSTBY
0.4
0.0
1.0
2.0
3.0
4.0
Input
(V)
Input Voltage
Voltage V
VIN
IN (V)
5.0
IOUT =0mA
1.80
IOUT =50mA
IOUT =200mA
1.79
Ta=25°C
VIN=VSTBY
1.78
0.2
0.0
1.81
1.77
3.00
6.0
Figure 3. Output Voltage vs. Input Voltage
4.00
4.50
5.00
Input Voltage VIN (V)
5.50
6.00
Figure 4. Line Regulation
60
1.85
Ta=125℃
1.84
VOUT
Voltage
Output
Output
VOUT
(V)(V)
Voltage
50
Circuit Current IGND (μA)
Circuit Current IGND (μA)
3.50
Ta=25℃
40
Ta=-40℃
30
20
1.82
Ta=-40℃
1.81
1.80
1.79
1.78
1.77
VIN=VSTBY
IOUT=0mA
10
Ta=25℃
Ta=125℃
1.83
VIN=3.5V
VSTBY=1.5V
1.76
1.75
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
50
100
150
200
Output
Current
IOUT
(mA)
Output
Current
IOUT
(mA)
InputVoltage
VoltageVIN
VIN(V)
(V)
Input
Figure 6. Load Regulation
Figure 5. Circuit Current vs. Input Voltage
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Reference data BU18JA2DG-C (Unless otherwise specified, Ta=25°C)
120
2.00
1.80
Ta=125℃
1.60
Ta=25℃
80
OUT
Output
OutputVoltage
(V)
VoltageVVOUT (V)
Circuit Current IGND (μA)
Circuit Current IGND (μA)
100
Ta=-40℃
60
40
VIN=6.0V
VIN=3.5V
VIN=3.0V
1.40
1.20
1.00
0.80
0.60
Ta=25°C
VSTBY=1.5V
0.40
20
0.20
0
0
50
100
150
0.00
200
0
Output
Current
IOUT(mA)
(mA)
Outut
Current
IOUT
100
1.85
100
1.84
90
1.83
80
1.82
1.81
1.80
1.79
1.78
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
1.77
500
Figure 8. OCP Threshold
CircuitCurrent
Current IIGND
Circuit
(μA)
GND (μA)
OutputVoltage
VOUT
Voltage V
OUT (V)
Output
(V)
Figure 7. Circuit Current vs. Output Current
200
300
400
OutputCurrent
CurrentIIOUT
OUT (mA)
Output
(mA)
70
60
50
40
30
VIN=3.5V
VSTBY=1.5V
IOUT=0.1mA
20
10
1.76
0
1.75
-40
-20
0
20 40 60 80
Temperature
a (℃)
Temperature TaT(°C)
-40
100 120
Figure 9. Output Voltage vs. Temperature
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-20
0
20 40 60 80
Temperature
Ta (℃)
Temperature Ta (°C)
100 120
Figure 10. Circuit Current vs. Temperature
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BUxxJA2DG-C series
Reference data BU18JA2DG-C (Unless otherwise specified, Ta=25°C)
100
1.8
90
Ta=125℃
1.6
Output Voltage VOUT (V)
Output Voltage VOUT (V)
(nA)
STBY IICCST
Current
Circuit
Circuit
Currentat(STBY)
CCST (nA)
2.0
Ta=-40℃
1.4
Ta=25℃
1.2
1.0
0.8
0.6
0.4
VIN=3.5V
IOUT=0.1mA
0.2
70
60
50
40
30
VIN=6.0V
VSTBY=0V
20
10
0
0.0
0.00
0.25
0.50
0.75
1.00
1.25
STBY
Voltage
VSTBY(V)
(mA)
STBY
PinPin
Voltage
VSTBY
-40 -25 -10 5
1.50
Figure 11. STBY Threshold
2.0
450
1.8
400
Dropout Voltage VDROP (mV)
1.4
1.2
1.0
Ta=125℃
Ta=25℃
Ta=-40℃
0.8
20 35 50 65 80 95 110 125
Temperature Ta (°C)
Figure 12. Circuit Current (STBY) vs. Temperature
1.6
STBY ピン電流ISTBY
(μA)
Pin Current ISTBY
(μA)
STBY
80
0.6
0.4
VIN=0.98×VOUT
VSTBY=1.5V
350
300
250
200
Ta=125℃
150
Ta=25℃
100
Ta=-40℃
0.2
50
0.0
0.0
1.0
2.0
3.0
4.0
5.0
STBY電圧 VSTBY (V)
STBY Pin Voltage VSTBY (V)
6.0
0
50
100
150
200
Output Current IOUT(mA)
Figure 14. Dropout Voltage vs. Output Current
Figure 13. STBY Pin Current vs. STBY Pin Voltage
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BUxxJA2DG-C series
Reference data BU18JA2DG-C (Unless otherwise specified, Ta=25°C)
100
Ripple Rejection Ratio R.R. (dB)
90
80
70
60
50
Ta=25°C
VIN=3.5V
VRR=-20dBv
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
40
30
20
10
0
100
1000
10000
Frequency (Hz)
100000
Figure 15. Ripple Rejection Ratio vs. Frequency
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BUxxJA2DG-C series
Reference data BU18JA2DG-C (Unless otherwise specified, Ta=25°C)
VIN =3.5V VSTBY=1.5V
Trise ＝Tfall=1 µs
Cin=Cout=1 µF
1mA
100mA/div
Trise ＝Tfall=1 µs
Cin=Cout=1 µF
150mA
100
100mA
IOUT
VIN =3.5V VSTBY=1.5V
200
0
100
IOUT
1mA
100mA/div
20µ s/div
1.90
VOUT
VOUT
1.80
1.80
100mV/div
100mV/div
1.70
1.70
Figure 16. Load Response
(1mA to 100mA)
Figure 17. Load Response
(1mA to 150mA)
2.0V/div
VIN =VSTBY
3.0V
3.5V
VIN =VSTBY
6.0
6.0V
2.0V/div
4.0
Slew Rate＝1V/µs
1.82
1.81
6.0
4.0
3.0V
2.0
0.0
1ms/div
Slew Rate＝1V/µs
2.0
0.0
1.82
1ms/div
1.81
1.80
1.78
0
20µ s/div
1.90
1.79
200
1.80
VOUT
10mV/div
IOUT=10mA
Cout=1.0 µF
1.79
1.78
Figure 18. Line Transient Response
(3.0 to 3.5V)
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VOUT
10mV/div
IOUT=10mA
Cout=1.0 µF
Figure 19. Line Transient Response
(3.0V to 6.0V)
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Reference data BU18JA2DG-C (Unless otherwise specified, Ta=25°C)
2.0
2.0
1.5V
1.0V/div
VSTBY
VSTBY
1.0
VOUT
VIN =3.5V
0.0
0V
100 s/div
µ
1.0V/div
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
2.0
20µ s/div
2.0
1.0V/div
1.0
0.0
VIN =3.5V
Figure 21. Startup Time
(ROUT=9Ω)
2.0
1.5V
VSTBY
0V
VSTBY
0.0
1.0
1.0V/div
0.0
0V
20µs/div
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
1.0V/div
2.0
1.5V
1.0
1.0V/div
1.0
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
VOUT
Figure 20. Startup Time
(ROUT=open)
2.0 VOUT
1.0
1.0V/div
1.5V
0.0
0V
0.0
1.0
0.0
20µ s/div
2.0
1.0 VOUT
0.0
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF 1.0V/div
VIN =3.5V
VIN =3.5V
Figure 22. Discharge Time
(ROUT=open)
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Figure 23. Discharge Time
(ROUT=9Ω)
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BUxxJA2DG-C series
3.0
2.83
2.5
2.82
Output Voltage VOUT (V)
Output Voltage VOUT (V)
Reference data BU28JA2DG-C (Unless otherwise specified, Ta=25°C)
2.0
1.5
Ta=25℃
VIN=VSTBY
1.0
Ta=0mA
0.5
2.81
Ta=50mA
Ta=0mA
2.80
Ta=200mA
2.79
Ta=25°C
VIN=VSTBY
2.78
Ta=50mA
Ta=200mA
2.77
0.0
0.0
1.0
2.0
3.0
4.0
5.0
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 6.0
6.0
Input Voltage VIN (V)
Input Voltage VIN (V)
Figure 25. Line Regulation
Figure 24. Output Voltage vs. Input Voltage
2.84
60
2.83
50
40
Output Voltage VOUT (V)
Circuit Current IGND (μA)
Ta=125℃
Ta=25℃
30
Ta=-40℃
20
2.81
2.80
Ta=25℃
2.79
Ta=-40℃
2.78
Ta=125℃
VIN= VSTBY
IOUT=0mA
10
2.82
VIN=3.8V
VSTBY=1.5V
2.77
2.76
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
50
100
150
200
Output Current IOUT(mA)
Input Voltage VIN (V)
Figure 26. Circuit Current vs. Input Voltage
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Figure 27. Load Regulation
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BUxxJA2DG-C series
Reference data BU28JA2DG-C (Unless otherwise specified, Ta=25°C)
3.2
120
2.8
Ta=125℃
100
Output Voltage VOUT (V)
Circuit Current IGND (μA)
Ta=25℃
Ta=-40℃
80
60
40
2.4
2.0
VIN=3.8V
1.6
VIN=4.3V
1.2
VIN=6.0V
0.8
VIN=3.8V
VSTBY=1.5V
20
Ta=25℃
VSTBY=1.5V
0.4
0.0
0
0
50
100
150
0
200
100
200
300
400
500
Output Current IOUT(mA)
Output Current IOUT(mA)
Figure 28. Circuit Current vs. Output Current
Figure 29. OCP Threshold
100
2.85
90
2.84
Circuit Current IGND (μA)
Output Voltage VOUT (V)
80
2.83
2.82
2.81
2.80
2.79
VIN=3.8V
VSTBY=1.5V
IOUT=0.1mA
2.78
70
60
50
40
30
VIN=3.8V
VSTBY=1.5V
IOUT=0.1mA
20
10
0
2.77
-40
-20
0
20
40
60
80
-40
100 120
0
20
40
60
80
100 120
Temperature Ta (°C)
Temperature Ta (°C)
Figure 31. Circuit Current vs. Temperature
Figure 30. Output Voltage vs. Temperature
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BUxxJA2DG-C series
Reference data BU28JA2DG-C (Unless otherwise specified, Ta=25°C)
3.0
160
140
Circuit Current (STBY) ICCST (nA)
Ta=125℃
2.5
Output Voltage VOUT (V)
Ta=25℃
Ta=-40℃
2.0
1.5
1.0
0.5
0.0
0.00
VIN=3.8V
IOUT=0.1mA
120
100
80
60
VIN=6.0V
VSTBY=0V
40
20
0
0.25
0.50
0.75
1.00
1.25
-40
1.50
250
1.8
225
1.6
200
Dropout Voltage VDROP (mV)
STBY Pin Current ISTBY (μA)
2.0
Ta=125℃
Ta=25℃
1.0
20
40
60
80
100 120
Figure 33. Circuit Current (STBY) vs. Temperature
Figure 32. STBY Threshold
1.2
0
Temperature Ta (°C)
STBY Pin Voltage VSTBY(V)
1.4
-20
Ta=-40℃
0.8
0.6
VIN=0.98×VOUT
VSTBY=1.5V
175
150
125
100
Ta=125℃
75
0.4
50
0.2
25
Ta=25℃
Ta=-40℃
0.0
0.00
0
1.00
2.00
3.00
4.00
5.00
6.00
STBY Pin Voltage VSTBY(V)
50
100
150
200
Output Current IOUT(mA)
Figure 35. Dropout Voltage vs. Output Current
Figure 34. STBY Pin Current vs. STBY Pin Voltage
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BUxxJA2DG-C series
Reference data BU28JA2DG-C (Unless otherwise specified, Ta=25°C)
100
Ripple Rejection Ratio R.R. (dB)
90
80
70
60
50
Ta=25°C
VIN=3.8V
VRR=-20dBv
VSTBY=1.5V
IOUT=10mA
Cin=Cout=1μF
40
30
20
10
0
100
1000
10000
100000
Frequency (Hz)
Figure 36. Ripple Rejection Ratio vs. Frequency
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BUxxJA2DG-C series
Reference data BU28JA2DG-C (Unless otherwise specified, Ta=25°C)
VIN =3.8V VSTBY=1.5V
Trise ＝Tfall=1 µs
Cin=Cout=1 µF
1mA
100mA/div
Trise ＝Tfall=1 µs
Cin=Cout=1 µF
150mA
100
100mA
IOUT
VIN =3.8V VSTBY=1.5V
200
0
100
IOUT
1mA
0
100mA/div
20µ s/div
20µ s/div
2.90
2.80
2.90
VOUT
2.80
100mV/div
2.70
VOUT
100mV/div
2.70
Figure 37. Load Response
(1mA to 100mA)
Figure 38. Load Response
(1mA to 150mA)
VIN =VSTBY
3.8V
1ms/div
2.81
10mV/div
2.80
2.78
4.0
0.0
Slew Rate＝1V/µs
3.3V
2.0
2.82
2.0V/div
6.0
2.0V/div
Slew Rate＝1V/µs
3.3V
6.0V
VIN =VSTBY
6.0
2.79
200
4.0
2.0
2.82
0.0
1ms/div
10mV/div
2.81
2.80
VOUT
IOUT=10mA
Cout=1.0 µF
2.79
2.78
IOUT=10mA
Cout=1.0 µF
Figure 40. Line Transient Response
(3.3V to 6.0V)
Figure 39. Line Transient Response
(3.3V to 3.8V)
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VOUT
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BUxxJA2DG-C series
Reference data BU28JA2DG-C (Unless otherwise specified, Ta=25°C)
2.0
1.5V
1.0V/div
VSTBY
2.0
1.0
VSTBY
0.0
0V
1.0V/div
1.5V
0.0
0V
20µ s/div
3.0
3.0
1.0V/div
2.0
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
1.0
0.0
20µ s/div
1.0V/div
1.0V/div
2.0
1.0
VOUT
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
1.0
0.0
VIN =3.8V
=4.3V
VOUT
VIN =3.8V
Figure 41. Startup Time
(ROUT=open)
Figure 42. Startup Time
(ROUT=14Ω)
2.0
VSTBY
0V
3.0
2.0 VOUT
1.0
0.0
VSTBY
1.0
1.0V/div
2.0
1.5V
1.5V
1.0
1.0V/div
0.0
0V
100μs/di
v
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
1.0V/div
3.0
2.0 VOUT
1.0
0.0
VIN =3.8V
0.0
2 0µs/div
Cout=0.47 µF
Cout=1.0 µF
Cout=2.2 µF
1.0V/div
VIN =3.8V
Figure 43. Discharge Time
(ROUT=open)
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Figure 44. Discharge Time
(ROUT=14Ω)
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BUxxJA2DG-C series
Input/Output Capacitor
It is recommended that a capacitor is placed close to pin between input pin and GND as well as output pin and GND. The
input capacitor becomes more necessary when the power supply impedance is high or when the PCB trace has significant
length. Moreover, the higher the capacitance of the output capacitor the more stable the output will be, even with load and
line voltage variations. However, please check the actual functionality by mounting on a board for the actual application.
Also, ceramic capacitors usually have different thermal and equivalent series resistance characteristics and may degrade
gradually over continued use.
For additional details, please check with the manufacturer and select the best ceramic capacitor for your application.
10
0
Rated Voltage:10V
B1 characteristics
Capacitance Change [%]
-10
Rated Voltage:10V
B characteristics
-20
-30
Rated Voltage:6.3V
B characteristics
-40
Rated Voltage:4V
X6S characteristics
-50
-60
Rated Voltage:10V
F characteristics
-70
-80
-90
-100
0
1
2
DC Bias Voltage [V]
3
4
Figure 45. Ceramic Capacitor Capacitance Value vs. DC Bias Characteristics
(Characteristics Example)
To prevent oscillation, please attach a capacitor between VOUT
and GND. Generally, capacitors have ESR (Equivalent Series
Resistance) and is different for each type- ceramic, tantalum,
electrolytic type etc. Please use the stable operating region
graph on the right as reference then confirm capacitor’s ESR to
ensure that the actual application evaluation is within the stable
operating range.
100
Unstable region
10
ESR[Ω]
Equivalent Series Resistance (ESR) of a Ceramic Capacitor
Stable region
Stable region (Ta=-40°C to 125°C)
Cin=Cout=0.47μF Ta=-40 to 105℃
1
Stable region
0.1
0.01
0
50
100
IOUT[mA]
150
200
Figure 46. Stability area characteristics
(Cin=0.47µF, Cout=0.47µF VIN=1.7V to 6.0V)
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BUxxJA2DG-C series
Power Dissipation
■SSOP5
1
Power Dissipation: Pd [W]
0.8
IC mounted on ROHM standard board based on JEDEC.
① : 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
②0.67 W
0.6
0.4
①0.33W
②
0.2
0
0
25
50
75
100
125
Ambient Temperature: Ta [°C]
Figure 47. Power Dissipation
(Reference Data)
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150
: 4-layer PCB
(2 inner layers copper foil area of PCB, copper foil area on the
reverse side of PCB: 74.2 mm × 74.2 mm)
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.6 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm × 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm × 74.2 mm, 2 oz. copper.
Condition①: θJA = 376.5 °C/W, ΨJT (top center) = 40 °C/W
Condition②: θJA = 185.4 °C/W, ΨJT (top center) = 30 °C/W
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BUxxJA2DG-C series
Thermal Design
Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current.
Refer to power dissipation curves illustrated in Figure 47 when using the IC in an environment of Ta ≥ 25 °C. Even if the
ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be
very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase
of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on
recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in
the thermal design by the following method is used to calculate the junction temperature Tj.
Tj can be calculated by either of the two following methods.
1.
The following method is used to calculate the junction temperature Tj.
Tj = Ta + PC × θJA
Where:
Tj
Ta
PC
θJA
: Junction Temperature
: Ambient Temperature
: Power Consumption
: Thermal Impedance
(Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj.
Tj = TT + PC × ΨJT
Where:
Tj
TT
PC
ΨJT
: Junction Temperature
: Top Center of Case’s (mold) Temperature
: Power consumption
: Thermal Impedance
(Junction to Top Center of Case)
The following method is used to calculate the power consumption Pc (W).
Pc = (VIN - VOUT) × IOUT + VIN × IGND
Where:
PC
VIN
VOUT
IOUT
IGND
: Power Consumption
: Input Voltage
: Output Voltage
: Load Current
: Circuit Current
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BUxxJA2DG-C series
・Calculation Example (SSOP5)
If VIN = 3.0 V, VOUT = 1.8 V, IOUT = 50 mA, IGND = 33 μA, the power consumption Pc can be calculated as follows:
PC = (VIN - VOUT) × IOUT + VIN × IGND
= (3.0 V – 1.8 V) × 50 mA + 3.0 V × 33 μA
= 0.06 W
At the ambient temperature Tamax = 125°C, the thermal Impedance (Junction to Ambient)θJA = 185.4 °C / W ( 4-layer PCB ),
Tj = Tamax + PC × θJA
= 125 °C + 0.06 W × 185.4 °C / W
= 136.1 °C
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 40 °C / W (1-layer PCB),
Tj = TT + PC × ΨJT
= 100 °C + 0.06 W × 40 °C / W
= 102.4 °C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
I/O Equivalence Circuits
1pin (VIN)
3pin (STBY)
5pin (VOUT)
VIN
VIN
VIN
2.6MΩ
(Typ)
IC
STBY
VOUT
R1
55kΩ
(Typ)
25Ω
(Typ)
R2
xx
Output Voltage
[V]
(Typ)
R1 [kΩ]
(Typ)
R2 [kΩ]
(Typ)
10
12
1C
15
18
25
28
2J
30
33
1.0
1.2
1.25
1.5
1.8
2.5
2.8
2.85
3.0
3.3
173
241
260
352
463
710
821
829
889
1001
185
185
185
185
185
185
185
185
185
185
Figure 48. Input / Output equivalent circuit
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Linear Regulators Surge Voltage Protection
The following provides instructions on surge voltage overs absolute maximum ratings polarity protection for ICs.
1. Applying positive surge to the input
If the possibility exists that surges higher than absolute maximum ratings 6.5 V will be applied to the input, a Zener
Diode should be placed to protect the device in between the VIN and the GND as shown in the figure 49.
IN
VIN
D1
OUT
GND
CIN
VOUT
COUT
Figure 49. Surges Higher than 6.5 V will be Applied to the Input
2. Applying negative surge to the input
If the possibility exists that surges lower than absolute maximum ratings -0.3 V will be applied to the input, a Schottky
Diode should be place to protect the device in between the VIN and the GND as shown in the figure 50.
IN
VIN
D1
OUT
GND
CIN
VOUT
COUT
Figure 50. Surges Lower than -0.3 V will be Applied to the Input
Linear Regulators Reverse Voltage Protection
A linear regulator integrated circuit (IC) requires that the input voltage is always higher than the regulated voltage. Output
voltage, however, may become higher than the input voltage under specific situations or circuit configurations, and that
reverse voltage and current may cause damage to the IC. A reverse polarity connection or certain inductor components can
also cause a polarity reversal between the input and output pins. The following provides instructions on reversed voltage
polarity protection for ICs.
1. about Input /Output Voltage Reversal
In an MOS linear regulator, a parasitic element exists as a body diode in the drain-source junction portion of its power
MOSFET. Reverse input/output voltage triggers the current flow from the output to the input through the body diode. The
inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the parasitic
body diode is usually disregarded for the regulator behavior (Figure 51).
IR
VOUT
VIN
Error
AMP.
VREF
Figure 51. Reverse Current Path in an MOS Linear Regulator
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An effective solution to this is an external bypass diode connected in-between the input and output to prevent the
reverse current flow inside the IC (see Figure 52). Note that the bypass diode must be turned on before the internal
circuit of the IC. Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage V F. Some
ICs are configured with current-limit thresholds to shut down high reverse current even when the output is off, allowing
large leakage current from the diode to flow from the input to the output; therefore, it is necessary to choose one that
has a small reverse current. Specifically, select a diode with a rated peak inverse voltage greater than the input to output
voltage differential and rated forward current greater than the reverse current during use.
D1
IN
VIN
OUT
VOUT
GND
CIN
COUT
Figure 52. Bypass Diode for Reverse Current Diversion
The lower forward voltage (VF) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the
main drawback is found in the level of their reverse current (I R), which is relatively high. So, one with a low reverse
current is recommended when choosing a Schottky diode. The VR-IR characteristics versus temperatures show
increases at higher temperatures.
If VIN is open in a circuit as shown in the following Figure 53 with its input/output voltage being reversed, the only current
that flows in the reverse current path is the bias current of the IC. Because the amperage is too low to damage or
destroy the parasitic element, a reverse current bypass diode is not required for this type of circuit.
ON→OFF
IBIAS
VIN
IN
VOUT
OUT
GND
CIN
COUT
Figure 53. Open VIN
2. Protection against Input Reverse Voltage
Accidental reverse polarity at the input connection flows a large current to the diode for electrostatic breakdown
protection between the input pin of the IC and the GND pin, which may destroy the IC (see Figure 54).
A Schottky barrier diode or rectifier diode connected in series with the power supply as shown in Figure 55 is the
simplest solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by
batteries because there is a power loss calculated as VF × IOUT, as the forward voltage VF of the diode drops in a
correct connection. The lower VF of a Schottky barrier diode than that of a rectifier diode gives a slightly smaller
power loss. Because diodes generate heat, care must be taken to select a diode that has enough allowance in
power dissipation. A reverse connection allows a negligible reverse current to flow in the diode.
VIN
IN
OUT
VOUT
D1
-
VIN
CIN
GND
COUT
CIN
+
GND
OUT
GND
VOUT
COUT
GND
Figure 54. Current Path in Reverse Input Connection
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Figure 55. Protection against Reverse Polarity 1
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BUxxJA2DG-C series
Figure 56 shows a circuit in which a P-channel MOSFET is connected in series with the power. The diode located
in the drain-source junction portion of the MOSFET is a body diode (parasitic element). The voltage drop in a
correct connection is calculated by multiplying the resistance of the MOSFET being turned on by the output
current IOUT, therefore it is smaller than the voltage drop by the diode (see Figure 55) and results in less of a
power loss. No current flows in a reverse connection where the MOSFET remains off.
If the voltage taking account of derating is greater than the voltage rating of MOSFET gate-source junction, lower
the gate-source junction voltage by connecting voltage dividing resistors as shown in Figure 57.
Q1
VIN
Q1
VIN
IN
CIN
OUT
GND
VOUT
VOUT
IN
R1
COUT
R2
CIN
OUT
GND
COUT
Figure 57. Protection against Reverse Polarity 3
Figure 56. Protection against Reverse Polarity 2
3. Protection against Output Reverse Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground upon
the output voltage turning off. In-between the IC output and ground pins is a diode for preventing electrostatic
breakdown, in which a large current flows that could destroy the IC. To prevent this from happening, connect a
Schottky barrier diode in parallel with the diode (see Figure 58).
Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the
waveform on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is needed
for a motor load that is affected by its counter electromotive force, as it produces an electrical current in a similar
way.
VIN
IN
VOUT
OUT
GND
CIN
COUT
GND
D1
XLL
GND
Figure 58. Current Path in Inductive Load (Output: Off)
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Operational Notes
1) Absolute maximum ratings
This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute
maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open
circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is
operated in a special mode exceeding the absolute maximum ratings.
2) GND Potential
GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a
voltage below the ground pin at any time, even during transient condition.
3) Setting of Heat
Carry out the heat design that have adequate margin considering Pd of actual working states.
4) Pin Short and Mistake Fitting
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC
may be burned up.
5) Mutual Impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible.
Use a capacitor to keep ripple to a minimum.
6) STBY Pin Voltage
To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more.
Setting STBY to a voltage over 0.5V and under 1.1 V may cause malfunction and should be avoided. Keep transition
time
between high and low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit,
causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present,
overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always
be completely discharged before turning the IC on.
7) Over Current Protection Circuit
Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short
circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid
applications to where the over current protection circuit operates continuously.
8) Thermal Shutdown
This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175°C(typ), the
output is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is
not recommended that you design application where TSD will work in normal condition.
9) Output capacitor
To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 46. It
operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and
characteristic of output load fluctuation is also improved.
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Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
Lot Number
Part Number
BU10JA2DG-C
BU12JA2DG-C
BU1CJA2DG-C
BU15JA2DG-C
BU18JA2DG-C
BU25JA2DG-C
BU28JA2DG-C
BU2JJA2DG-C
BU30JA2DG-C
BU33JA2DG-C
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Output Voltage [V]
1.0
1.2
1.25
1.5
1.8
2.5
2.8
2.85
3.0
3.3
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Part Number Marking
91
92
93
94
XV
95
XW
96
97
98
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BUxxJA2DG-C series
Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
27.Feb.2017
001
30.Mar.2017
002
10.Nov.2017
003
Changes
New Release
p.21 The circuit of 5pin(VOUT) is modified in “I/O Equivalence Circuits”.
p.26 Marking of BU28JA2DG-C is revised.
Others, correction of errors.
Lineup is added.
p.25 An expression method of “Marking Diagram” is changed.
p.27 Figure of “Packing Information” is updated.
Others, correction of errors.
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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