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MR44V064BMAZAATL

MR44V064BMAZAATL

  • 厂商:

    ROHM(罗姆)

  • 封装:

    SOP8_150MIL

  • 描述:

    IC FRAM 64KBIT I2C 3.4MHZ 8SOP

  • 数据手册
  • 价格&库存
MR44V064BMAZAATL 数据手册
Dear customer LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1st day of October, 2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which LAPIS established a new company, LAPIS Technology Co., Ltd. (“LAPIS Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business. Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor" and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd." Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc. Thank you for your understanding. LAPIS Technology Co., Ltd. October 1, 2020 FEDR44V064B-02 Issue Date: Sep. 07, 2017 MR44V064B 64k Bit(8,192-Word × 8-Bit) FeRAM (Ferroelectric Random Access Memory) I2C GENERAL DESCRIPTION The MR44V064B is a nonvolatile 8,192-word x 8-bit ferroelectric random access memory (FeRAM) developed in the ferroelectric process and silicon-gate CMOS technology. The MR44V064B is accessed using Two-wire Serial Interface ( I2C BUS ).Unlike SRAMs, this device, whose cells are nonvolatile, eliminates battery backup required to hold data. This device has no mechanisms of erasing and programming memory cells and blocks, such as those used for various EEPROMs. Therefore, the write cycle time can be equal to the read cycle time and the power consumption during a write can be reduced significantly. The MR44V064B can be used in various applications, because the device is guaranteed for the write/read tolerance of 1012 cycles per bit and the rewrite count can be extended significantly. FEATURES • 8,192-word × 8-bit configuration I2C BUS Interface • A single 3.3 V typ (1.8V to 3.6V) power supply • Operating frequency: 3.4MHz(Max) HS-mode 1MHz(Max) F/S-mode Plus • Read/write tolerance 1012 cycles/bit • Data retention 10 years • Guaranteed operating temperature range −40 to 85°C • Package options: 8-pin plastic SOP (P-SOP8-200-1.27-T2K) • RoHS (Restriction of hazardous substances) compliant 1/16 FEDR44V064B-02 MR44V064B PIN CONFIGURATION 8-pin plastic SOP 1 A1 2 A2 3 VSS 4 MR44V064B A0 8 VCC 7 WP 6 SCL 5 SDA PIN DESCRIPTIONS Pin Name A0 – A2 Description Address ( input ) Address pin indicates device address. When Address value is match the device address code from SDA, the device will be selected. The address pins are pulled down internally. Serial data input serial data output ( input / output ) SDA SDA is a bi-directional line for I2C interface. The output driver is open-drain. A pull-up resistor is required. Serial Clock ( input ) SCL Serial Clock is the clock input pin for setting for serial data timing. Inputs are latched on the rising edge and outputs occur on the falling edge. Write protect ( input ) WP VCC, VSS Write Protect pin controls write-operation to the memory. When WP is high, all address in the memory will be protected. When WP is low, all address in the memory will be written. WP pin is pulled down internally. Power supply Apply the specified voltage to VCC. Connect VSS to ground. 2/16 FEDR44V064B-02 MR44V064B I2C BUS The MR44V064B employs a bi-directional two-wire I2C BUS interface, works as a slave device. An example of I2C interface system with MR44V064B Pull-up resistor SCL SDA SCL SDA I2C BUS master SCL SDA SCL SDA MR44V064B MR44V064B (slave) (slave) A2 A1 A0 A2 A1 A0 000 001 I2C BUS COMUNICATION I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, acknowledge is always required after each byte. I2C BUS carries out data transmission with plural devices connected by 2 communication lines of serial data ( SDA ) and serial clock ( SCL ). 1-7 SCL 8 9 1-7 8 9 1-7 8 9 SDA ADDRESS START condition R/W ACK DATA ACK DATA ACK STOP condition START CONDITION Before executing each command, start condition ( start bit ) where SDA goes from “HIGH” down to “LOW” when SCL is “HIGH” is necessary. MR44V064B always detects whether SDA and SCL are in start condition ( start bit ) or not, therefore, unless this condition is satisfied, any command is executed. STOP CONDITION Each command can be ended by SDA rising from “LOW” to “HIGH” when stop condition ( stop bit ), namely,SCL is “HIGH”. 3/16 FEDR44V064B-02 MR44V064B ACKNOWLEDGE ( ACK ) SIGNAL This acknowledge ( ACK ) signal is a software rule to show whether data transfer has been made normally or not. In master and slave, the device (μ-COM at slave address input of write command, read command, and this IC at data output of read command) at the transmitter (sending) side releases the bus after output of 8bit data. The device (this IC at slave address input of write command, read command, and μ-COM at data output of read command) at the receiver (receiving) side sets SDA “LOW” during 9 clock cycles, and outputs acknowledge signal ( ACK signal) showing that it has received the 8bit data. This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal ( ACK signal) “LOW”. Each write action outputs acknowledge signal ( ACK signal ) “LOW”, at receiving 8bit data ( word address and write data ). Each read action outputs 8bit data ( read data ), and detects acknowledge signal ( ACK signal ) “LOW”. When acknowledge signal ( ACK signal ) is detect, and stop condition is not sent from the master (μ-COM) side, this IC continues data output. When acknowledge signal ( ACK signal ) is not detected, this IC stops data transfer, and recognizes stop condition ( stop bit ), and ends read action. And this IC gets in status. SLAVE ADDRESS Output slave address after start condition from master. The significant 4 bits of slave address are used for recognizing a device type. The device code of this IC is fixed to “1010”. Next slave addresses (A2 A1 A0 … device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. The most insignificant bit (R/W…READ/WRITE) of slave address is used for designating write or read action, and is as shown below. Setting R/W to 0 Setting R/W to 1 SCL SDA START condition write (setting 0 to word address setting of random read) read 1 2 3 4 5 1 0 1 0 A2 6 A1 7 A0 8 9 1 2 R/W ACK WRITE PROTECT When WP terminal is set Vcc(H level), data rewrite of all addresses is prohibited. When it is set Vss(L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or Vss, or control it to H level or L level. Because this terminal is pulled down internally, in the case of Open the terminal will be recognized as L level During write cycle WP terminal must be always “L” level. WP terminal must be fixed from start condition to stop condition. 4/16 FEDR44V064B-02 MR44V064B COMMAND BYTE WRITE CYCLE Arbitrary data is written to FeRAM. When to write only 1 byte, byte write is normally used. start condition slave address with LSB is 0 (write) 1st and 2nd word address byte of write data. stop condition S T A R T Slave address W R I T E st 1 WORD address 1 0 1 0 A2 A1 A0 0 0 0 W A 12 2 W A 8 A C K nd WORD address W A 7 S T O P Write data W A 0 A C K D 7 D 0 A C K A C K PAGE WRITE CYCLE When to write continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. The address reaches the final address, the address will be rolled over to the first address. By page write cycle, up to 8,192 bytes data can be written. When data above the maximum bytes are sent, data from the first byte will be overwritten. S T A R T Slave address W R I T E st 1 WORD address 1 0 1 0 A2 A1 A0 0 0 0 W A 12 2 W A 8 A C K nd WORD address W A 7 Write data W A 0 A C K D 7 S T O P Write data D 0 A C K D 7 D 0 A C K A C K BYTE WRITE CYCLE ( HS-MODE ) The MR44V064B support a maximum 3.4MHz high speed mode. When HS-mode operation is needed, the HS-mode command is required before any command. After the HS-mode command is issued, MR44V064B will be the HS-mode, until stop condition is issued. S T A R T S T A R T HS-mode command 0 0 0 0 1 X X X Slave address W R I T E st 1 WORD address 1 0 1 0 A2 A1 A0 N A C K 0 0 0 A C K W A 12 2 W A 8 W A 7 A C K nd WORD address S T O P Write data W A 0 D 7 A C K D 0 A C K 5/16 FEDR44V064B-02 MR44V064B RANDOM READ CYCLE Random read cycle is a command to read data by designating address. start condition slave address with LSB is 0 (write) 1st and 2nd word address start condition slave address with LSB is 1 (read) read out byte of data. ACK to “H” stop condition S T A R T Slave address W R I T E st 1 WORD address 1 0 1 0 A2 A1 A0 0 0 0 W A 12 2 W A 8 A C K nd S T A R T WORD address W A 7 W A 0 A C K Slave address R E A D Read data 1 0 1 0 A2 A1 A0 D 7 A C K S T O P D 0 A C K N A C K SEQUENTIAL READ CYCLE When ACK signal “L” after D0 is detected, and stop condition is not sent from master side, the next address data can be read in succession. The address reaches the final address, the address will be rolled over to the first address. S T A R T Slave address W R I T E st 1 WORD address 1 0 1 0 A2 A1 A0 0 0 0 W A 12 2 W A 8 A C K nd S T A R T WORD address W A 7 W A 0 A C K Slave address R E A D Read data 1 0 1 0 A2 A1 A0 D 7 D 0 A C K A C K S T O P A C K D 0 N D A C 7 K CURRENT READ CYCLE Current read cycle is a command to read data of internal address register without designating address. When the last read or write address is (n)-th address just before current read cycle, the current read command outputs data of (n+1)-th address. The previous read or write sequence should be complete up to stop condition. Just after POWER ON, the internal address resister is unstable. S T A R T Slave address R E A D S T O P Read data 1 0 1 0 A2 A1 A0 D7 D0 A C K N A C K CURRENT ADDRESS READ CYCLE ( HS-MODE ) The MR44V064B support a maximum 3.4MHz high speed mode. When HS-mode operation is needed, the HS-mode command is required before any command. After the HS-mode command is issued, MR44V064B will be the HS-mode, until stop condition is issued. S T A R T S T A R T HS-mode command 0 0 0 0 1 X X X Slave address R E A D Read data 1 0 1 0 A2 A1 A0 N A C K S T O P D7 A C K D0 N A C K 6/16 FEDR44V064B-02 MR44V064B ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS The application of stress (voltage, current, or temperature) that exceeds the absolute maximum rating may damage the device. Therefore, do not allow actual characteristics to exceed any one parameter ratings PIN VOLTAGES Parameter Symbol Rating Min. Max. Unit Pin Voltage (Input Signal) VIN –0.5 VCC + 0.5 V Pin Voltage (Input/Output Voltage) VINQ, VOUTQ –0.5 VCC + 0.5 V VCC –0.5 4.0 V Power Supply Voltage Note TEMPERATURE RANGE Parameter Symbol Rating Min. Max. Unit Storage Temperature Tstg –55 125 °C Operating Temperature Topr –40 85 °C Note OTHERS Parameter Power Dissipation Symbol Rating Note PD 1,000mW Ta=25°C 7/16 FEDR44V064B-02 MR44V064B RECOMMENDED OPERATING CONDITIONS POWER SUPPLY VOLTAGE Symbol Min. Typ. Max. Unit Power Supply Voltage VCC 1.8 3.3 3.6 V Ground Voltage VSS 0 0 0 V Parameter Note DC INPUT VOLTAGE Symbol Min. Max. Unit Input High Voltage VIH VCC x 0.7 VCC+0.3 V Input Low Voltage VIL –0.3 VCC x 0.3 V Parameter Note 8/16 FEDR44V064B-02 MR44V064B DC CHARACTERISTICS DC INPUT/OUTPUT CHARACTERISTICS Symbol Condition Min. Max. Unit VOL IOL =3mA ― 0.4 V Input Leakage Current ILI ― –10 10 µA Output Leakage Current ILO ― –10 10 µA Parameter Output Low Voltage Note POWER SUPPLY CURRENT VCC=Max.to Min, Ta=Topr Parameter Symbol Power Supply Current (Standby) ICCS Power Supply Current (Operating) ICCA Condition SCL,SDA= VCC, A2,A1,A0,WP= VCC or VSS fSCL=3.4MHz fSCL=1MHz Max. Unit 10 µA 1 300 mA uA Note 9/16 FEDR44V064B-02 MR44V064B AC CHARACTERISTICS VCC=Max. to Min., Ta=Topr. F/S-mode Parameter Symbol F/S-mode Plus HS-mode Min. Max. Min. Max. Min. Max. 400 D.C. 1000 DC 3400 Unit Clock frequency fSCL D.C. Clock Low time tLOW 1300 500 160 ns Clock High time tHIGH 600 300 60 ns Output Data delay time BUS release time before transfer start tAA 900 450 130 Note KHz ns tBUF 1300 500 300 ns Start condition hold time tHD:STA 600 250 160 ns Start condition setup time tSU:STA 600 250 160 ns Input data hold time tHD:DAT 0 0 0 ns Input data setup time tSU:DAT 100 100 10 ns SDA, SCL rise time tR 300 300 80 ns 1 SDA, SCL fall time tF 300 100 80 ns 1 Stop condition setup time tSU:STO 600 250 160 ns Output data hold time tDH 0 0 0 ns Noise removal time (SDA, SCL) tSP 50 50 5 ns Note: 1. Not 100% tested Equivalent AC Load Circuit 3.3V 1.1kΩ Output 100pF 10/16 FEDR44V064B-02 MR44V064B TIMING 1/fSCL tR tF SCL VIL tF SDA (input) VIH VIL SDA (input) tSU:DAT tSP VIH VIH VIH VIL VIL VIL tLOW tR tSP VIH VIL VIL tHD:DAT VIH VIH VIL VIL tBUF SDA (output) SCL tHIGH VIH VIH tAA VIH VIH tSU:STA tHD:STA tDH VIH VIH VIL VIL VIH tSU:STO VIH VIL START BIT VIL STOP BIT 11/16 FEDR44V064B-02 MR44V064B •POWER-ON AND POWER-OFF CHARACTERISTICS Parameter Power-On SCL,SDA High Hold Time Power-Off SCL, SDA High Hold Time Power-On Interval Time VCC Power-On ramp rate VCC Power-Off ramp rate Symbol tVHEL tEHVL tVLVH tr tf (Under recommended operating conditions) Min. 100 0 0 30 30 Max. ⎯ ⎯ ⎯ Unit ns ns μs μs/V μs/V Note 1, 2 1 2 Notes: 1. To prevent an erroneous operation, be sure to maintain SCL=SDA="H", and set the FeRAM in an inactive state (standby mode) before and after power-on and power-off. 2. Powering on at the intermediate voltage level will cause an erroneous operation; thus, be sure to power up from 0 V. 3. Enter all signals at the same time as power-on or enter all signals after power-on. •Power-On and Power-Off Sequences tEHVL tVHEL VCC VCC VCC Min. VIH Min. VCC Min. tf tr VIH Min. tVLVH VIL Max. SCL,SDA 0V VIL Max. SCL,SDA 0V •After Power-Off, terminal state When MR44V064B only goes power-off while the other IC’s on I2C bus are active, all the input pins including I/O pin of MR44V064B must be GND level. 12/16 FEDR44V064B-02 MR44V064B READ/WRITE CYCLES AND DATA RETENTION (Under recommended operating conditions) Parameter Min. 12 10 10 Read/Write Cycle Data Retention Max. ⎯ ⎯ Unit Cycle Year Note CAPACITANCE Vcc=3.3V, VIN = VOUT = GND, f = 1MHz, and Ta = 25°C Signal Input Capacitance Input/Output Capacitance Symbol CIN COUT Min. ⎯ ⎯ Max. 10 10 Unit pF pF Note 1 1 Note: 1. Sampling value. 13/16 FEDR44V064B-02 MR44V064B PACKAGE DIMENSIONS (Unit: mm) Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact a ROHM sales office for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 14/16 FEDR44V064B-02 MR44V064B REVISION HISTORY Page Document No. FEDR44V064B-01 FEDR44V064B-02 Date Previous Edition Current Edition Description Jan. 08, 2016 – – Final edition 1 Sep. 07,2017 – 9 11 12 – 9 11 12 Corrected a vague description. Corrected a condition of power supply current Added VIH/VIL Added “After Power-Off, terminal state” 15/16 FEDR44V064B-02 MR44V064B Notes 1) The information contained herein is subject to change without notice. 2) Although LAPIS Semiconductor is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. LAPIS Semiconductor shall have no responsibility for any damages arising out of the use of our Products beyond the rating specified by LAPIS Semiconductor. 3) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 4) The technical information specified herein is intended only to show the typical functions of the Products and examples of application circuits for the Products. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information. 5) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. 6) The Products specified in this document are not designed to be radiation tolerant. 7) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 8) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 9) LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. 10) LAPIS Semiconductor has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS Semiconductor does not warrant that such information is error-free and LAPIS Semiconductor shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. 11) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 12) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Semiconductor. Copyright 2017 LAPIS Semiconductor Co., Ltd. 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan http://www.lapis-semi.com/en/ 16/16
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