RCJ081N20
Datasheet
Nch 200V 8.0A Power MOSFET
lOutline
VDSS
200V
RDS(on) (Max.)
770mW
ID
8.0A
PD
40W
lFeatures
(2)
LPT(S)
(SC-83)
(1)
(3)
lInner circuit
1) Low on-resistance.
(1) Gate
(2) Drain
(3) Source
2) Fast switching speed.
3) Drive circuits can be simple.
4) Parallel use is easy.
*1 BODY DIODE
5) Pb-free lead plating ; RoHS compliant
6) 100% Avalanche tested
lPackaging specifications
Packaging
lApplication
Switching Power Supply
Type
Taping
Reel size (mm)
330
Tape width (mm)
24
Automotive Motor Drive
Quantity (pcs)
Automotive Solenoid Drive
Taping code
1,000
TL
Marking
RCJ081N20
lAbsolute maximum ratings(Ta = 25°C)
Parameter
Symbol
Value
Unit
VDSS
200
V
Tc = 25°C
ID *1
8.0
A
Tc = 100°C
ID *1
4.3
A
32
A
Drain - Source voltage
Continuous drain current
Pulsed drain current
ID,pulse
*2
Gate - Source voltage
VGSS
30
V
Avalanche energy, single pulse
EAS *3
5.17
mJ
Avalanche current
IAR *3
4.0
A
Tc = 25°C
PD
40
W
Ta = 25°C *4
PD
1.56
W
Tj
150
°C
Tstg
-55 to +150
°C
Power dissipation
Junction temperature
Range of storage temperature
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1/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lThermal resistance
Values
Parameter
Symbol
Unit
Min.
Typ.
Max.
Thermal resistance, junction - case
RthJC
-
-
3.125
°C/W
Thermal resistance, junction - ambient *4
RthJA
-
-
80
°C/W
Soldering temperature, wavesoldering for 10s
Tsold
-
-
265
°C
lElectrical characteristics(Ta = 25°C)
Values
Parameter
Drain - Source breakdown voltage
Symbol
V(BR)DSS
Conditions
VGS = 0V, ID = 1mA
Unit
Min.
Typ.
Max.
200
-
-
-
-
10
V
VDS = 200V, VGS = 0V
Zero gate voltage drain current
IDSS
Tj = 25°C
mA
VDS = 200V, VGS = 0V
-
-
100
Tj = 125°C
Gate - Source leakage current
Gate threshold voltage
Static drain - source
on - state resistance
IGSS
VGS = 30V, VDS = 0V
-
-
100
nA
VGS (th)
VDS = 10V, ID = 1mA
3.25
-
5.25
V
VGS = 10V, ID = 4.0A
-
550
770
-
1100
1540
1.0
2.0
-
RDS(on) *5 VGS = 10V, ID = 4.0A
mW
Tj = 125°C
Forward transfer admittance
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gfs
VDS = 10V, ID = 4.0A
2/12
S
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristics(Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Input capacitance
Ciss
VGS = 0V
-
330
-
Output capacitance
Coss
VDS = 25V
-
33
-
Reverse transfer capacitance
Crss
f = 1MHz
-
15
-
VDD ⋍ 100V, VGS = 10V
-
13
-
tr *5
ID = 4.0A
-
20
-
td(off) *5
RL = 25W
-
18
-
tf *5
RG = 10W
-
8
-
Turn - on delay time
Rise time
Turn - off delay time
Fall time
td(on) *5
pF
ns
lGate Charge characteristics(Ta = 25°C)
Values
Parameter
Symbol
Conditions
Unit
Min.
Typ.
Max.
Total gate charge
Qg *5
VDD ⋍ 100V
-
8.5
-
Gate - Source charge
Qgs *5
ID = 8.0A
-
3.4
-
Gate - Drain charge
Qgd
VGS = 10V
-
3.4
-
VDD ⋍ 100V, ID = 8.0A
-
7.9
-
Gate plateau voltage
*5
V(plateau)
nC
V
lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)
Values
Parameter
Continuous source current
Symbol
IS *1
Pulsed source current
ISM *2
Forward voltage
VSD *5
Reverse recovery time
trr *5
Reverse recovery charge
Qrr *5
Conditions
Unit
Min.
Typ.
Max.
-
-
8.0
A
-
-
32
A
VGS = 0V, IS = 8.0A
-
-
1.5
V
IS = 4.0A
di/dt = 100A/ms
-
75
-
ns
-
210
-
nC
Tc = 25°C
*1 Limited only by maximum temperature allowed.
*2 Pw 10ms, Duty cycle 1%
*3 L ⋍ 500mH, VDD = 50V, Rg = 25W, starting Tj = 25°C
*4 Mounted on a epoxy PCB FR4 (25mm × 27mm × 0.8mm)
*5 Pulsed
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3/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig.2 Maximum Safe Operating Area
Fig.1 Power Dissipation Derating Curve
100
PW = 100ms
100
10
Drain Current : ID [A]
Power Dissipation : PD/PD max. [%]
120
80
60
40
PW = 1ms
1
Operation in this
area is limited
by RDS(on)
0.1
20
Ta=25ºC
Single Pulse
0
PW = 10ms
0.01
0
25
50
75
100
125
150
175
0.1
1
10
100
1000
Drain - Source Voltage : VDS [V]
Junction Temperature : Tj [°C]
Normalized Transient Thermal Resistance : r(t)
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
10
Ta=25ºC
Single Pulse
Rth(j-c)(t) = r(t)×Rth(ch-c)
Rth(j-c) = 80ºC/W
1
0.1
0.01
0.0001
top D = 1
D = 0.5
D = 0.1
D = 0.05
D = 0.01
D = Single
0.01
1
100
Pulse Width : PW [s]
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2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig.5 Avalanche Energy Derating Curve
vs Junction Temperature
Fig.4 Avalanche Current vs Inductive Load
120
VDD=50V,RG=25W
VGF=10V,VGR=0V
Starting Tch=25ºC
Avalanche Energy : EAS / EAS max. [%]
Avalanche Current : IAS [A]
100
10
1
0.1
0.01
0.1
1
10
100
80
60
40
20
0
0
100
Coil Inductance : L [mH]
50
75
100
125
150
175
Junction Temperature : Tj [°C]
Fig.7 Typical Output Characteristics(II)
Fig.6 Typical Output Characteristics(I)
2
8
Ta=25ºC
Pulsed
1.5
VGS=10.0V
Ta=25ºC
Pulsed
7
VGS=8.0V
VGS=10.0V
6
VGS=7.0V
Drain Current : ID [A]
Drain Current : ID [A]
25
1
VGS=6.0V
0.5
VGS=8.0V
5
4
VGS=7.0V
3
2
VGS=6.0V
1
VGS=5.0V
0
0
0
0.2
0.4
0.6
0.8
1
0
4
6
8
10
Drain - Source Voltage : VDS [V]
Drain - Source Voltage : VDS [V]
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2
5/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig.9 Typical Transfer Characteristics
10
280
VDS= 10V
VGS = 0V
ID = 1mA
270
260
1
250
Drain Current : ID [A]
Normarize Drain - Source Breakdown Voltage
: V(BR)DSS [V]
Fig.8 Breakdown Voltage
vs. Junction Temperature
240
230
220
210
200
Ta= 125ºC
Ta= 75ºC
Ta= 25ºC
Ta= -25ºC
0.1
0.01
190
0.001
180
-50
0
50
100
0
150
Junction Temperature : Tj [°C]
6
8
10
Fig.11 Transconductance vs. Drain Current
10
5.5
VDS= 10V
VDS = 10V
ID = 1mA
Transconductance : gfs [S]
Gate Threshold Voltage : VGS(th) [V]
4
Gate - Source Voltage : VGS [V]
Fig.10 Gate Threshold Voltage
vs. Junction Temperature
5.0
2
4.5
4.0
3.5
3.0
2.5
-50 -25
0
25
50
75
Ta= -25ºC
Ta=25ºC
Ta=75ºC
Ta=125ºC
0.1
0.01
0.01
100 125 150
Junction Temperature : Tj [°C]
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1
0.1
1
10
Drain Current : ID [A]
6/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
10000
Ta=25ºC
4500
4000
ID = 4.0A
3500
ID = 8.0A
3000
2500
2000
1500
1000
500
0
0
10
20
Static Drain - Source On-State Resistance
: RDS(on) [mW]
5000
Static Drain - Source On-State Resistance
: RDS(on) [mW]
Fig.13 Static Drain - Source On - State
Resistance vs. Drain Current(I)
Gate - Source Voltage : VGS [V]
Ta=25ºC
VGS = 10V
1000
100
0.01
0.1
1
10
Drain Current : ID [A]
Fig.14 Static Drain - Source On - State
Resistance vs. Junction Temperature
Static Drain - Source On-State Resistance
: RDS(on) [mW]
1200
VGS = 10V
ID = 4.0A
1100
1000
900
800
700
600
500
400
300
-50
0
50
100
150
Junction Temperature : Tj [ºC]
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7/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Fig.16 Drain Current Derating Curve
120
VGS= 10V
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
100
Drain Current Dissipation
: ID/ID max. (%)
Static Drain - Source On-State Resistance
: RDS(on) [mW]
10000
1000
100
10
80
60
40
20
0
0.01
0.1
1
10
0
Drain Current : ID [A]
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25
50
75
100
125
150
175
Junction Temperature : Tj [ºC]
8/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig.17 Typical Capacitance
vs. Drain - Source Voltage
Fig.18 Switching Characteristics
10000
10000
Ta = 25ºC
f = 1MHz
VGS = 0V
1000
Ciss
Switching Time : t [ns]
Capacitance : C [pF]
1000
Ta=25ºC
VDD= 100V
VGS= 10V
RG=10W
tf
100
Coss
10
td(off)
100
td(on)
10
Crss
tr
1
1
0.01
0.1
1
10
100
1000
0.01
Drain - Source Voltage : VDS [V]
0.1
1
10
Drain Current : ID [A]
Fig.19 Dynamic Input Characteristics
20
Ta=25ºC
VDD= 100V
ID= 8.0A
RG=10W
Gate - Source Voltage : VGS [V]
18
16
14
12
10
8
6
4
2
0
0
2
4
6
8
10
12
14
16
Total Gate Charge : Qg [nC]
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9/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lElectrical characteristic curves
Fig21 Reverse Recovery Time
vs.Source Current
Fig.20 Source Current
vs. Source - Drain Voltage
1000
10
Reverse Recovery Time : trr [ns]
Source Current : IS [A]
VGS=0V
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
1
0.1
Ta=25ºC
di / dt = 100A / ms
VGS = 0V
100
10
0.01
0.0
0.5
1.0
0.1
1.5
10
Source Current : IS [A]
Source-Drain Voltage : VSD [V]
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1
10/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lMeasurement circuits
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
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11/12
2019.05 - Rev.B
Data Sheet
RCJ081N20
lDimensions (Unit : mm)
D
A2
A
B
L2
c1
E
L3
LPTS
H
A1
L4
Lp
b2
e
b
L1
L
b3
x
c
A3
B A
l3
l1
e
b6
b5
l2
Patterm of terminal position areas
DIM
A1
A2
A3
b
b2
b3
c
c1
D
E
e
HE
L
L1
L2
L3
L4
Lp
x
DIM
b5
b6
l1
l2
l3
MILIMETERS
MIN
MAX
0.00
0.30
4.30
4.70
0.25
0.68
0.98
8.90
1.14
1.44
0.30
0.60
1.10
1.50
9.80
10.40
8.80
9.20
2.54
12.80
13.40
2.70
3.30
0.90
1.50
1.10
7.25
1.00
0.90
1.50
0.25
MILIMETERS
MIN
MAX
1.23
10.40
2.10
7.55
13.40
INCHES
MIN
0
0.169
MAX
0.012
0.185
0.01
0.027
0.039
0.35
0.045
0.012
0.043
0.386
0.346
0.057
0.024
0.059
0.409
0.362
0.10
0.504
0.106
0.035
0.528
0.13
0.059
0.043
0.285
0.039
0.035
-
0.059
0.01
INCHES
MIN
-
MAX
0.049
0.409
0.083
0.297
0.528
Dimension in mm/inches
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12/12
2019.05 - Rev.B
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
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1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
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Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
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Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001