Data Sheet
10V Drive Nch MOSFET
RCX160N20
Structure Silicon N-channel MOSFET Dimensions (Unit : mm)
TO-220FM
10.0
φ3.2
4.5 2.8
Features 1) Low on-resistance. 2) Low input capacitance. 3) High ESD.
15.0
12.0
8.0
14.0
2.5
1.3
1.2
0.8 2.54
(1) (2) (3)
2.54
0.75
2.6
Application Switching
Packaging specifications Package Type Code Basic ordering unit (pieces) RCX160N20 Bulk 500
Inner circuit
∗1
Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Avalanche current Avalanche energy Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 L 500H, VDD=50V, RG=25 , T ch=25°C
(1) Gate (2) Drain (3) Source
(1)
(2)
(3)
1 BODY DIODE
Limits 200 30 16 64 16 64 8 20.7 40 150 55 to 150
Unit V V A A A A A mJ W C C
VDSS Continuous Pulsed Continuous Pulsed VGSS ID *3 IDP IS ISP
*1
*1
IAS *2 EAS *2 PD Tch Tstg
*4
*3 Limited only by maximum channel temperature allowed. *4 TC=25°C
Thermal resistance Parameter Channel to Case
* T C=25°C * Limited only by maximum channel temperature allowed.
Symbol * Rth (ch-c)
Limits 3.125
Unit C / W
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2011.08 - Rev.A 1/6
RCX160N20
Electrical characteristics (Ta = 25 C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Symbol IGSS IDSS VGS (th) * RDS (on) l Yfs l * Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd * Min. 200 3.25 4 Typ. 135 8 1370 95 50 27 47 42 17 26 10 11 Max. 100 10 5.25 180 Unit nA V A V Conditions VGS=30V, VDS=0V ID=1mA, VGS=0V VDS=200V, VGS=0V VDS=10V, ID=1mA
Data Sheet
Drain-source breakdown voltage V(BR)DSS
m ID=8A, VGS=10V S pF pF pF ns ns ns ns nC nC nC VDS=10V, ID=8A VDS=25V VGS=0V f=1MHz VDD 100V, ID=8A VGS=10V RL=12.5 RG=10 VDD 100V, ID=16A VGS=10V
Body diode characteristics (Source-Drain) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.5
Conditions Unit V Is=16A, VGS=0V
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2/6
2011.08 - Rev.A
RCX160N20
Electrical characteristic curves (Ta=25C)
Fig.1 Typical Output Characteristics (Ⅰ) 8 Ta=25°C Pulsed VGS=10.0V 6 Drain Current : ID [A] VGS=9.0V
Data Sheet
Fig.2 Typical Output Characteristics ( Ⅱ) 16 14 12 Drain Current : ID [A] 10 8 6 4 2 VGS=7.0V Ta=25°C Pulsed
VGS=10.0V VGS=9.0V VGS=8.0V
VGS=8.0V
4 VGS=7.0V
2
VGS=6.0V 0 0 0.2 0.4 0.6 0.8 1 Drain-Source Voltage : VDS [V] 0 0 2 4 6
VGS=6.0V 8 10
Drain-Source Voltage : VDS [V]
Fig.3 Typical Transfer Characteristics 100 VDS=10V pulsed Gate Threshold Voltage : VGS(th) [V] 10 4 5
Fig.4 Gate Threshold Voltage vs. Channel Temperature
VDS=10V ID=1mA pulsed
Drain Currnt : ID [A]
1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
3
0.1
2
0.01
1
0.001 0 1 2 3 4 5 6 7 8 9 10 Gate-Source Voltage : VGS [V]
0 -50 -25 0 25 50 75 100 125 150 Channel Temperature : Tch [℃]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current 10 VGS=10V pulsed Static Drain-Source On-State Resistance RDS(on) [W ] Static Drain-Source On-State Resistance RDS(on) [W ]
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature 0.5 VGS=10V pulsed 0.4 ID=16A 0.3
1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.2
ID=8A
0.1
0.1
0.01 0.1 1 10 100 Drain Current : ID [A]
0 -50 -25 0 25 50 75 100 125 150 Channel Temperature : Tch [℃]
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3/6
2011.08 - Rev.A
RCX160N20
Data Sheet
Fig.7 Forward Transfer Admittance vs. Drain Current 100 VDS=10V pulsed 100
Fig.8 Source Current vs. Source-Drain Voltage
VGS=0V pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Forward Transfer Admittance Yfs [S]
10 Source Current : Is [A] 1 Drain Current : ID [A] 10 100 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
10
1
1
0.1
0.1
0.01 0.01
0.01 0.1 0 0.5 1 1.5 Source-Drain Voltage : VSD [V]
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 0.5 Ta=25°C Pulsed Static Drain-Source On-State Resistance RDS(on) [W ] 0.4 1000 ID=8A 0.3 ID=16A Switching Time : t [ns] 10000
Fig.10 Switching Characteristics
VDD≒100V VGS=10V RG=10Ω Ta=25°C Pulsed tf
100
td(on)
td(off)
0.2
10 0.1
tr
0 0 2 4 6 8 10 12 14 16 18 20 Gate-Source Voltage : VGS [V]
1 0.01 0.1 1 Drain Current : ID [A] 10
Fig.11 Dynamic Input Characteristics 15 Ta=25°C VDD=100V ID=16A Pulsed Gate-Source Voltage : VGS [V] Capacitance : C [pF] 10 10000
Fig.12 Typical Capacitance vs. Drain-Source Voltage
1000 Ciss
100
Coss
5
10 Ta=25°C f=1MHz VGS=0V 0 0 5 10 15 20 25 30 35 Total Gate Charge : Qg [nC] 1 0.01 0.1 1 10 100
Crss
1000
Drain-Source Voltage : VDS [V]
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4/6
2011.08 - Rev.A
RCX160N20
Data Sheet
Fig.13 Maximum Safe Operating Area 100 Normalized Transient Thermal Resistance : r(t)
Fig.14 Normalized Transient Thermal Resistance v.s. Pulse Width
10
Ta=25°C Single Pulse
10 Drain Current : ID [ A ] PW = 100μs 1 Operation in this area is limited by RDS(on) (VGS = 10V) PW = 1ms 0.1 PW = 10ms Ta=25°C Single Pulse 0.01 0.1 1 10 100 1000 Drain-Source Voltage : VDS [ V ]
1
0.1
0.01
Rth(ch-a)=55.3°C/W Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse width : Pw (s)
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5/6
2011.08 - Rev.A
RCX160N20
Measurement circuits
Data Sheet
Pulse width
VGS ID RL D.U.T. RG VDD VDS
VGS VDS
50% 10% 10% 90% td(on) ton tr
90%
50% 10% 90%
td(off) toff
tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
VGS ID RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
VGS
IAS L
VDS
V(BR)DSS IAS VDD EAS = 1 2 L IAS
2
D.U.T. RG
VDD
V(BR)DSS V(BR)DSS - VDD
Fig.3-1 Avalanche Measurement Circuit
Fig.3-2 Avalanche Waveform
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6/6
2011.08 - Rev.A
Notice
Notes
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